Coil components
The coil component's innovative groove design addresses miniaturization and adhesion challenges by using varying groove depths to enhance bonding, enabling reliable miniaturized coil patterns in electronic devices.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- SAMSUNG ELECTRO MECHANICS CO LTD
- Filing Date
- 2025-11-17
- Publication Date
- 2026-06-19
AI Technical Summary
The challenge of miniaturizing coil patterns in electronic devices while ensuring adequate adhesion to the support member is addressed by forming grooves of varying depths on the support member's surface to enhance bonding.
A coil component design featuring grooves of differing depths on the support member's surface, with deeper grooves under the coil and shallower grooves elsewhere, enhances adhesion by minimizing residue formation and maximizing anchoring effects.
This design allows for miniaturization of coil patterns while maintaining strong adhesion to the support member, preventing coil floating defects and ensuring reliable electrical performance.
Smart Images
Figure 2026100802000001_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to coil components.
Background Art
[0002] An inductor, which is one of the coil components, is a typical passive electronic component used in electronic devices together with a resistor and a capacitor.
[0003] With the development of IT technology, miniaturization and thinning of various electronic devices have been accelerating, so miniaturization and thinning are also required for thin-film inductors used in such electronic devices.
[0004] As the size of the power inductor becomes thinner, in order to achieve miniaturization of the product without characteristic losses of the chip such as inductance and Rdc, research and development have been carried out to increase the number of turns (fine patterning) of the coil pattern and increase the height of the coil pattern.
[0005] On the other hand, as the coil pattern becomes finer, the adhesion between the coil pattern and the substrate may decrease, and there is a possibility of occurrence of coil floating defects.
Summary of the Invention
Problems to be Solved by the Invention
[0006] An object of the present invention is to provide a coil component capable of miniaturizing a coil pattern and ensuring adhesion to a support member.
Means for Solving the Problems
[0007] According to one aspect of the present invention, a coil component is provided that includes a body containing a magnetic material, a support member disposed within the body and having a plurality of grooves formed on one surface, and a coil disposed on one surface of the support member and forming at least one turn, wherein the plurality of grooves include a plurality of first grooves formed in one region of the surface of the support member where the coil is disposed, and a plurality of second grooves formed in the other region of the surface of the support member where the coil is not disposed, and the average depth of the plurality of first grooves is greater than the average depth of the plurality of second grooves. [Effects of the Invention]
[0008] According to the present invention, it is possible to miniaturize the coil pattern while ensuring adhesion with the support member. [Brief explanation of the drawing]
[0009] [Figure 1] This diagram schematically shows a coil component according to one embodiment of the present invention. [Figure 2] This figure shows a cross-section along the line I-I' in Figure 1. [Figure 3] This figure shows a cross-section along the line II-II' in Figure 1. [Figure 4] This is a magnified view of A in Figure 2. [Figure 5] This figure shows the roughness curve of the groove in Figure 4. [Figure 6] This diagram schematically shows the manufacturing process of the coil component according to this embodiment. [Modes for carrying out the invention]
[0010] The terminology used in this application is used solely to describe specific embodiments and is not intended to limit the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, terms such as “includes” or “having” are intended to specify the existence of features, figures, stages, actions, components, parts, or combinations thereof described in the specification, and should be understood not to preemptively exclude the possibility of the existence or addition of one or more other features, figures, stages, actions, components, parts, or combinations thereof. Throughout the specification, “above” means located above or below the part in question, and does not necessarily mean located above the direction of gravity.
[0011] Furthermore, the term "connection" shall not refer only to cases where each component is in direct physical contact with another component, but shall also encompass cases where another component is interposed between the components, and each component is in contact with that other component.
[0012] The dimensions and thicknesses of each component shown in the drawings are arbitrary for illustrative purposes, and therefore the present invention is not necessarily limited to those shown.
[0013] In drawings, the X direction can be defined as the first direction or length direction, the Y direction as the second direction or width direction, and the Z direction as the third direction or thickness direction.
[0014] Hereinafter, coil components according to embodiments of the present invention will be described in detail with reference to the attached drawings. In this description with reference to the attached drawings, the same drawing number will be assigned to identical or corresponding components, and redundant explanations will be omitted.
[0015] Electronic devices utilize various types of electronic components, and various types of coil components can be appropriately used between these electronic components for purposes such as noise reduction.
[0016] That is, in an electronic device, coil components can be used for power inductors, high-frequency inductors, general beads, GHz beads, common mode filters, etc.
[0017] FIG. 1 is a diagram schematically showing a coil component according to an embodiment of the present invention, FIG. 2 is a diagram showing a cross section taken along the line I-I' of FIG. 1, FIG. 3 is a diagram showing a cross section taken along the line II-II' of FIG. 1, and FIG. 4 is a diagram showing an enlarged view of A in FIG. 2.
[0018] Referring to FIGS. 1 to 4, a coil component 1000 according to an embodiment of the present invention includes a main body 100, a support member 200, and a coil 300, and may further include external electrodes 400, 500, and an insulating film IF.
[0019] The main body 100 forms the overall appearance of the coil component 1000 according to the present embodiment, and the support member 200 and the coil 300 are embedded therein.
[0020] The main body 100 can be formed in an overall hexahedron shape.
[0021] Based on FIGS. 1 to 3, the main body 100 includes a first surface 101 and a second surface 102 that face each other in the length direction X, a third surface 103 and a fourth surface 104 that face each other in the width direction Y, and a fifth surface 105 and a sixth surface 106 that face each other in the thickness direction Z. Each of the first to fourth surfaces 101, 102, 103, 104 of the main body 100 corresponds to a side surface of the main body 100 that connects the fifth surface 105 and the sixth surface 106 of the main body 100.
[0022] The main body 100 may be formed such that the coil component 1000 according to the present embodiment, on which external electrodes 400 and 500 to be described later are formed, has a length of 0.8 mm, a width of 0.65 mm, and a thickness of 0.45 mm, but is not limited thereto. However, the size of the coil component 1000 according to the above-described present embodiment is merely exemplary, and a case where it is formed with a size other than the above-described size is not excluded from the scope of the present invention.
[0023] The main body 100 can contain a magnetic powder and an insulating resin. Specifically, the main body 100 can be formed by laminating one or more magnetic composite sheets including an insulating resin and magnetic powder dispersed in the insulating resin and then curing the magnetic composite sheets. However, the main body 100 can also have other structures than a structure in which magnetic powder is dispersed in an insulating resin. For example, the main body 100 may be made of a magnetic material such as ferrite.
[0024] The magnetic powder may be, for example, ferrite or metal magnetic powder.
[0025] The ferrite powder may be at least one or more of, for example, spinel-type ferrites such as Mg-Zn, Mn-Zn, Mn-Mg, Cu-Zn, Mg-Mn-Sr, Ni-Zn systems; hexagonal ferrites such as Ba-Zn, Ba-Mg, Ba-Ni, Ba-Co, Ba-Ni-Co systems; garnet-type ferrites such as Y system; and Li system ferrites.
[0026] The metallic magnetic powder may contain one or more elements selected from the group consisting of iron (Fe), silicon (Si), chromium (Cr), cobalt (Co), molybdenum (Mo), aluminum (Al), niobium (Nb), copper (Cu), and nickel (Ni). For example, the metallic magnetic powder may be at least one of the following: pure iron powder, Fe-Si alloy powder, Fe-Si-Al alloy powder, Fe-Ni alloy powder, Fe-Ni-Mo alloy powder, Fe-Ni-Mo-Cu alloy powder, Fe-Co alloy powder, Fe-Ni-Co alloy powder, Fe-Cr alloy powder, Fe-Cr-Si alloy powder, Fe-Si-Cu-Nb alloy powder, Fe-Ni-Cr alloy powder, or Fe-Cr-Al alloy powder.
[0027] The metallic magnetic powder may be amorphous or crystalline. For example, the metallic magnetic powder may be an Fe-Si-B-Cr amorphous alloy powder, but is not necessarily limited to this.
[0028] The ferrite and metallic magnetic powders may each have an average diameter of approximately 0.1 μm to 30 μm, but are not limited to this.
[0029] The main body 100 may contain two or more types of magnetic powder dispersed in an insulating resin. Here, "different types of magnetic powder" means that the magnetic powder dispersed in the insulating resin is distinguished from one another by any one of the following: diameter, composition, crystallinity, and shape. For example, the main body 100 may contain two or more magnetic powders with different diameters.
[0030] The insulating resin may contain, but is not limited to, epoxy, polyimide, liquid crystal polymer, etc., either alone or in combination.
[0031] The main body 100 includes a core 110 that penetrates the support member 200 and the coil 300, which will be described later. The core 110 can be formed in the process of laminating and curing the magnetic composite sheet by filling the through-hole of the coil 300 with at least a portion of the magnetic composite sheet, but is not limited to this.
[0032] The support member 200 has one surface and another surface opposite to it, and is embedded in the main body 100 together with the coil 300, which will be described later. The support member 200 is configured to support the coil 300. In this embodiment, for the sake of explanation, only one surface of the support member 200 has been described, but it is not limited to this, and the description of one surface of the support member 200 can be similarly applied to the other surface of the support member 200.
[0033] The support member 200 may be formed from an insulating material including a thermosetting insulating resin such as epoxy resin, a thermoplastic insulating resin such as polyimide, or a photosensitive insulating resin, or from an insulating material in which such an insulating resin is impregnated with a reinforcing material such as glass fiber or inorganic filler. For example, the support member 200 may be formed from insulating materials such as copper clad laminate (CCL), prepreg, ABF (Ajinomoto Build-up Film), FR-4, BT (Bismaleimide Triazine) film, or PID (Photo Imageable Dielectric) film, but is not limited thereto.
[0034] As inorganic fillers, at least one selected from the group consisting of silica (SiO2), alumina (Al2O3), silicon carbide (SiC), barium sulfate (BaSO4), talc, mud, mica powder, aluminum hydroxide (Al(OH)3), magnesium hydroxide (Mg(OH)2), calcium carbonate (CaCO3), magnesium carbonate (MgCO3), magnesium oxide (MgO), boron nitride (BN), aluminum borate (AlBO3), barium titanate (BaTiO3), and calcium zirconate (CaZrO3) can be used.
[0035] If the support member 200 is formed of an insulating material containing reinforcing material, the support member 200 can provide better rigidity. If the support member 200 is formed of an insulating material that does not contain glass fibers, the support member 200 is advantageous for reducing the overall thickness of the coil 300. If the support member 200 is formed of an insulating material containing a photosensitive insulating resin, the number of steps required to form the coil 300 is reduced, which is advantageous for reducing production costs and allows for the formation of fine vias.
[0036] Referring to Figures 2 to 4, the support member 200 can include a plurality of grooves G formed on one surface.
[0037] The groove G can have a form that is recessed inward from one surface of the support member 200. As shown in Figure 4, multiple grooves G can be formed along one surface of the support member 200, and the multiple grooves G can be spaced apart from each other. The grooves G can be formed by processes such as a desmear process or a plasma treatment process of the support member 200.
[0038] Referring to Figure 4, one surface of the support member 200 can be divided into one region Z1 and the other region Z2. The coil 300 may be placed on top of region Z1, but the coil 300 may not be placed in the other region Z2.
[0039] Other region Z2 may include the area between adjacent turns of the coil 300 on one surface of the support member 200.
[0040] Multiple first grooves G1 may be formed in one region Z1. Multiple second grooves G2 may be formed in the other region Z2. In this embodiment, the coil component can be formed by dividing one surface of the support member 200 into one region Z1 and the other region Z2, and varying the depth of the grooves G.
[0041] The first groove G1 can be formed in a region Z1 on one surface of the support member where the coil is arranged. Referring to Figure 4, multiple first grooves G1 are formed at the bottom of the coil pattern 310. Two first grooves G1 are shown at the bottom of one turn of the coil, but this is not limited to that. Any one turn may have three or more first grooves G1, and the number of first grooves G1 may differ from that of the remaining turns.
[0042] The second groove G2 can be formed in a region Z2 on one surface of the support member where no coil is placed. The second groove G2 can also be formed in the region between adjacent turns of the coil. Multiple second grooves G2 may be formed.
[0043] Generally, coil components can have their adhesion to the support member improved by forming grooves on one surface of the support member through a desmear or plasma etching process. However, when this process is applied to the entire surface, residues such as DFR may unintentionally form in the grooves of the support member. If these residues are located below where the coil is positioned, the adhesion between the coil and the support member may actually decrease.
[0044] Therefore, the coil component according to this embodiment can selectively improve the roughness of a region Z1 on one surface of the support member where the coil is arranged. Specifically, the average depth of the plurality of first grooves G1 may be greater than the average depth of the plurality of second grooves G2.
[0045] If only the relatively shallow second groove G2 is formed on the entire surface of the support member 200, the adhesion force between the coil 300 and the support member 200 may decrease. Also, if only the relatively deep first groove G1 is formed on the entire surface of the support member 200, DFR residue may remain on the support member 200, potentially weakening the adhesion force between the coil 300 and the support member 200.
[0046] In this embodiment, the coil component has a first groove G1 formed in a region Z1 where the coil is arranged. Since the first groove G1 is formed after the DFR is laminated and patterned, there is a possibility that no DFR residue will remain in the first groove G1. Therefore, the adhesion force between the coil 300 and the support member 200 can be completely improved.
[0047] One surface of the support member 200 of the coil component according to this embodiment can be made rough. That is, roughness can be formed on one surface of the support member 200 by a plurality of grooves G formed on one surface of the support member 200. The roughness formed in one region Z1 on the surface of the support member where the coil is arranged can be called the first roughness, and the roughness formed in the other region Z2 on the surface of the support member where the coil is not arranged can be called the second roughness.
[0048] The first roughness may be greater than the second roughness. Specifically, the Rz value of the first roughness may be greater than the Rz value of the second roughness. Here, Rz represents the ten-point average roughness. The criterion for measuring roughness is not limited to Rz; it can also be measured using centerline average roughness (Ra), maximum height roughness (Ry), etc.
[0049] When the Rz value of the first roughness is a and the Rz value of the second roughness is b, then ab can satisfy the condition of being between 1 μm and 5 μm.
[0050] If the above ab exceeds 5 μm, the groove may be formed excessively deep, potentially weakening the rigidity of the support member 200. If the above ab is less than 1 μm, it may not be possible to sufficiently improve the bonding force between the coil 300 and the support member 200.
[0051] Figure 5 shows the cross-sectional curves (roughness curves) of one region Z1 and another region Z2 of the support member.
[0052] Referring to Figure 5, in each groove of the region Z1 described above, the depth of each groove G1 can be measured by determining the difference between the maximum elevation P and the minimum elevation V from the reference line. Since multiple first grooves G1 can be formed, the depth can be measured for multiple first grooves, and the average depth of multiple first grooves can be determined by calculating the arithmetic mean of the depths.
[0053] Similarly, in each groove of the other region Z2, the depth of each groove G2 can be determined by calculating the difference between the maximum elevation P and the minimum elevation V from the reference line. Since multiple second grooves G2 can be formed, the depths of multiple second grooves can be measured, and the average depth of multiple second grooves can be determined by calculating the arithmetic mean of the depths.
[0054] Furthermore, the ten-point mean roughness (Rz) can be measured in the following way.
[0055] Referring to Figure 5, the elevations from the baseline to the five highest peaks in the above-mentioned region Z1 within the reference length can be denoted as Z1_P1 to Z1_P5. Similarly, the elevations from the baseline to the five lowest valley bottoms in the above-mentioned region Z1 within the reference length can be denoted as Z1_V1 to Z1_V5.
[0056] The ten-point mean roughness (Rz) of a region Z1 can be the value obtained by subtracting the arithmetic mean of Z1_V1 to Z1_V5 from the arithmetic mean of Z1_P1 to Z1_P5.
[0057] Similarly, by measuring the elevations of the peaks (Z2_P1~Z2_P5) and valley bottoms (Z2_V1~Z2_V5) in the other region Z2, the ten-point average roughness (Rz) of the other region Z2 can be determined.
[0058] On the other hand, the coil component according to this embodiment can have multiple grooves G formed on the other surface of the support member 200, thereby creating a rough surface. The description of the multiple grooves and rough surface on the other surface may overlap with the description of the one surface described above, so it will be omitted.
[0059] Figure 6 is a schematic diagram showing the manufacturing process of the coil component according to this embodiment.
[0060] Referring to Figure 6(a), a seed layer 311 (first metal layer) can be formed on a support member 200 on which a second groove G2 has been formed on one surface by desmearing or the like.
[0061] Next, referring to Figure 6(b), the DFR(R) can be placed on the support member to form a pattern.
[0062] Next, referring to Figure 6(c), etching can be performed in the space between the patterned DFRs using a plasma process or the like. The roughness can be selectively improved using the patterned DFRs. The etching process described above allows the first groove G1 to be formed relatively deeper, and unintended DFR residue can be removed.
[0063] Next, referring to Figures 6(d) and 6(e), a coil plating layer 312 (second metal layer) can be formed on the first groove G1, and the DFR can be peeled off to obtain a support member with the coil formed on it.
[0064] The coil 300 is positioned on one surface of the support member 200 and can form multiple turns to exhibit the characteristics of a coil component. For example, when the coil component 1000 of this embodiment is used as a power inductor, the coil 300 can stabilize the power supply of electronic equipment by storing the electric field in a magnetic field and maintaining the output voltage.
[0065] The coil 300 may include a first coil pattern 310 arranged on one side of the support member 200 and a second coil pattern 320 arranged on the other side of the support member 200, as will be described below. The following description will be based on the first coil pattern 310.
[0066] The coil 300 of the coil component according to this embodiment can cover a plurality of first grooves G1. Referring to Figure 4, the first coil pattern 310 can include anchor portions 310A arranged in the plurality of first grooves G1, and a pattern portion 310P that protrudes from one surface of the support member 200.
[0067] The anchor portion 310A may be positioned inside a plurality of first grooves G1. Since the anchor portion 310A is located at a level lower than one surface of the support member 200 and is positioned inside the first grooves G1, it can ensure close contact with the support member 200 through the anchoring effect.
[0068] Referring to Figure 4, any one of the multiple turns of the coil 300 includes multiple anchor portions 310A, and the multiple anchor portions 310A can be spaced apart from each other. As described above, by including multiple anchor portions in one turn, the anchoring effect with the support member 200 can be maximized.
[0069] The pattern portion 310P is positioned on the anchor portion 310A and can protrude from one surface of the support member 200. The pattern portion 310P is located at a higher level than one surface of the support member 200 and can form one or more turns to form the capacity of the coil component.
[0070] The line width of the anchor portion 310A may be smaller than the line width of the pattern portion 310P. Here, line width can mean the length along the first direction (X direction) in the cross-section of any one turn of the first coil pattern 310 in the X-Z direction.
[0071] The coil 300 may have a multilayer structure of a first metal layer and a second metal layer. Referring to Figure 4, the first coil pattern 310 may include a first metal layer 311 in which at least a portion is in contact with the surfaces of a plurality of first grooves G1, and a second metal layer 312 disposed on the first metal layer.
[0072] The first metal layer 311 may be disposed on the surface of at least a portion of the first grooves G1. The first metal layer 311 does not need to cover at least a portion of the surface of the first grooves G1. As described above, since the first grooves G1 are formed by plasma processing or the like after the first metal layer 311 is formed, it is possible that the first metal layer 311 may not be disposed on at least a portion of the surface of the first grooves G1.
[0073] Referring to Figure 4, the first metal layer 311 can be shown in a shape such that a portion of it is floating without contacting the support member 200. At least a portion of the first metal layer 311 can be separated from the surface of the first groove G1, and the second metal layer 312 can be arranged in the space separated. The second metal layer 312 is arranged inside the plurality of first grooves G1 via the space separated and can be in contact with the support member 200.
[0074] The first metal layer 311 can be located at a level between one surface of the support member 200 and the bottommost surface of the plurality of second grooves. On the other hand, the first metal layer 311 does not have to be located at a level between the bottommost surface of the plurality of second grooves G2 and the bottommost surface of the plurality of first grooves G1. As described above, since the first metal layer 311 can be formed on the surface of the support member 200 on which the second grooves G2 are formed by a desmear process or the like, the first metal layer 311 can be located at the same level as or higher than the bottommost surface of the second grooves G2. Also, since the first grooves G1 are formed with the first metal layer 311 in place, the first metal layer 311 may not be formed at a level lower than the bottommost surface of the second grooves G2. However, it is not limited to this. Here, "same level" includes cases where the levels are substantially identical. That is, it includes not only those that are exactly the same level, but also those that can be considered identical by an ordinary technician even if there are minute differences within the range of tolerances due to manufacturing process tolerances or material properties.
[0075] The first metal layer 311 can be formed by a thin-film process such as sputtering or by an electroless plating process. The first metal layer 311 contains at least one of copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), chromium (Cr), molybdenum (Mo), or an alloy thereof, and can be formed in at least one layer.
[0076] The second metal layer 312 is placed on the first metal layer 311, and at least a portion of it can be placed in the first groove G1 of the support member. The second metal layer 312 can be formed by electroplating using the seed layer 310 as a seed, and can contain at least one of copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), platinum (Pt), titanium (Ti), chromium (Cr), or an alloy thereof, and can be formed in at least one layer.
[0077] The coil 300 may include a first coil pattern 310, a second coil pattern 320, and vias 330. Based on the directions in Figures 1, 2, and 3, the first coil pattern 310 can be arranged on one surface of the support member 200 facing the sixth surface 106 of the main body 100, and the second coil pattern 320 can be arranged on the other surface of the support member 200 facing that surface.
[0078] The second coil pattern 320 is positioned on the other side of the support member 200 and can cover a plurality of first grooves formed on the other side of the support member 200. The description of the second coil pattern 320 may overlap with the description of the first coil pattern 310, so it will be omitted below.
[0079] Referring to Figures 1 to 3, the via 330 penetrates the support member 200 and is connected in contact with the first coil pattern 310 located on one side of the support member 200, and with the second coil pattern 320 located on the other side of the support member 200. As a result, the coil 300 can function as a single coil that forms one or more turns around the core 110.
[0080] The via 330 may include at least one plating layer. For example, if the via 330 is formed by electroplating, the via 330 may include a seed layer formed on the inner wall of a via hole penetrating the support member 200, and an electroplating layer filling the via hole on which the seed layer is formed. The seed layer of the via 330 and the seed layer for forming the coil 300 may be formed together in the same process and integrally formed with respect to each other, or they may be formed in different processes and a boundary may be formed between them. The via 330 may include conductive materials such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), chromium (Cr), molybdenum (Mo), or alloys thereof.
[0081] The ends of the coil 300 are connected to the first external electrode 400 and the second external electrode 500, which will be described later. Referring to Figures 1 and 2, the end of the first coil pattern 310 is exposed on the first surface 101 of the main body 100 and connected to the first external electrode 400, and the end of the second coil pattern 320 is exposed on the second surface 102 of the main body 100 and connected to the second external electrode 500.
[0082] The first external electrode 400 and the second external electrode 500 may be arranged on the first surface 101 and the second surface 102 of the main body 100, respectively. The first external electrode 400 may be arranged on the first surface 101 of the main body 100 and connected to the end of the first coil pattern 310. The second external electrode 500 may be arranged on the second surface 102 of the main body 100 and connected to the end of the second coil pattern 320.
[0083] The first external electrode 400 and the second external electrode 500 can be formed in a single-layer or multi-layer structure. For example, the first external electrode 400 may consist of a first layer containing copper (Cu), a second layer containing nickel (Ni) placed on the first layer, and a third layer containing tin (Sn) placed on the second layer. Here, the first to third layers can each be formed by plating, but are not limited to this. As another example, the first external electrode 400 may include a resin electrode containing conductive powder such as silver (Ag) and resin, and a nickel (Ni) / tin (Sn) plating layer plated on the resin electrode.
[0084] The first external electrode 400 and the second external electrode 500 may be formed from a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or alloys thereof, but are not limited thereto.
[0085] Referring to Figures 2 to 4, the insulating film IF can be arranged along the surface of the coil 300.
[0086] The insulating film IF insulates the coil 300 from the main body 100. The insulating film IF covers the outer surface of the coil 300, insulating the coil 300 from the main body 100. The insulating film IF can be positioned between adjacent turns of the coil and can cover at least one of the multiple second grooves G2.
[0087] The insulating film IF can be formed in the form of a conformal film along the outer surface of the coil 300.
[0088] The insulating film IF may include, but is not limited to, known insulating materials such as parylene. As another example, the insulating film IF may include an insulating material such as epoxy resin instead of parylene. The insulating film IF can be formed by, but is not limited to, vapor deposition. As another example, the insulating film IF can also be formed by laminating and curing insulating films for forming the insulating film IF on both sides of the support member 200 on which the coil 300 is formed, or by applying and curing insulating paste for forming the insulating film IF on both sides of the support member 200 on which the coil 300 is formed.
[0089] On the other hand, in the present invention, the insulating film IF is an optional configuration, and the insulating film IF may be omitted if the main body 100 can ensure sufficient electrical resistance under the operating conditions of the coil component 1000 according to this embodiment.
[0090] Although one embodiment of the present invention has been described above, any person with ordinary skill in the art can modify and change the present invention in various ways, such as by adding, changing, or deleting components, without departing from the spirit of the invention as described in the claims, and this can also be said to be within the scope of the rights of the present invention. [Explanation of Symbols]
[0091] 100: Main unit 110: Core 200: Support member G1, G2: First groove and second groove 300: Coil 310A: Anchor section 310P: Pattern section 311: 1st metal layer 312: 2nd metal layer 310, 320: First coil pattern and second coil pattern 330: Beer IF: Insulated film 400, 500: External electrode Z1, Z2: First and second regions 1000: Coil parts
Claims
1. The main body contains magnetic material, A support member disposed within the main body and including a plurality of grooves formed on one surface, The support member includes a coil disposed on one surface of the support member and forming at least one turn, The plurality of grooves include a plurality of first grooves formed in one region of one surface of the support member where the coil is arranged, and a plurality of second grooves formed in another region of one surface of the support member where the coil is not arranged. A coil component in which the average depth of the plurality of first grooves is greater than the average depth of the plurality of second grooves.
2. The coil component according to claim 1, wherein the coil includes a first metal layer in which at least a portion is in contact with the surface of the plurality of first grooves, and a second metal layer disposed on the first metal layer.
3. The first metal layer is separated from the surfaces of the plurality of first grooves, at least a portion of it The coil component according to claim 2, wherein the second metal layer is disposed in the space in which the first metal layer is separated from the surfaces of the plurality of first grooves.
4. The coil component according to claim 2, wherein the second metal layer is disposed inside the plurality of first grooves and in contact with the support member.
5. The coil component according to claim 2, wherein the first metal layer is located at the same level as or higher than the bottom surface of the plurality of second grooves.
6. The coil component according to claim 1, wherein the other region of the support member includes the region between adjacent turns of the coil on one surface of the support member.
7. The coil component according to claim 1, wherein the coil includes anchor portions arranged in the plurality of first grooves and pattern portions protruding from one surface of the support member.
8. The coil component according to claim 7, wherein at least one turn of the coil includes a plurality of anchor portions, and the plurality of anchor portions are spaced apart from each other.
9. The coil component according to any one of claims 1 to 8, wherein the coil includes a first coil pattern disposed on one surface of the support member, a second coil pattern disposed on the other surface of the support member facing the one surface, and vias that penetrate the support member and connect the first coil pattern and the second coil pattern.
10. The coil component according to claim 9, wherein the plurality of first grooves and the plurality of second grooves are also formed on the other surface of the support member.
11. The coil component according to any one of claims 1 to 8, further comprising an insulating film disposed along the surface of the coil.
12. The coil component according to claim 11, wherein the insulating film is arranged between adjacent turns of the coil and covers at least one of the plurality of second grooves.
13. The main body contains magnetic material, A support member is disposed within the main body, and roughness is formed on one surface and on the other surface facing the aforementioned surface, The support member includes a coil disposed on one surface of the support member and forming at least one turn, When the roughness formed on one surface of the support member in the region where the coil is arranged is called the first roughness, and the roughness formed on the other surface of the support member in the region where the coil is not arranged is called the second roughness, A coil component in which the ten-point average roughness (Rz) of the first roughness is greater than the ten-point average roughness (Rz) of the second roughness.
14. Let the ten-point average roughness (Rz) of the first roughness be a, and the ten-point average roughness (Rz) of the second roughness be b. The coil component according to claim 13, wherein a-b satisfies the condition of being 1 μm or more and 5 μm or less.
15. The coil component according to claim 13 or 14, wherein the other region of the support member includes the region between adjacent turns of the coil on one surface of the support member.