Copper alloy plastically deformed materials, and components for electronic and electrical equipment.

Abstract

The present invention provides a copper alloy plastic deformation material that exhibits excellent conductivity and hardness, and can suppress deformation even when a load is applied at high temperatures, without requiring the addition of large amounts of elements other than Fe and P. [Solution] The material has a composition in which the Fe content is in the range of 0.08% by mass or more and 0.17% by mass or less, the P content is in the range of 0.025% by mass or more and 0.06% by mass or less, and the remainder is Cu and unavoidable impurities, the conductivity is 75% IACS or higher, the surface Vickers hardness at room temperature is 130 HV or higher, and the surface Vickers hardness at 400°C is 40 HV or higher.

Description

[Technical Field]

[0001] The present invention relates to a copper alloy plastically formed material suitable for use as a material for electric vehicles (EVs), aircraft (EVTOL, electric vertical take-off and landing aircraft, etc.), home appliances, semiconductor components such as lead frames, printed circuit boards, heat sinks, switchgear components, busbars, connectors, and other electrical and electronic equipment components, as well as electrical and electronic equipment components made from this copper alloy plastically formed material. [Background technology]

[0002] Conventionally, copper materials with high conductivity and thermal conductivity have been used for electronic and electrical equipment components such as terminals, busbars, lead frames, and heat dissipation members, because they require both electrical conductivity and heat dissipation characteristics. Specifically, if the conductivity is 75% IACS or higher, it will exhibit sufficient current-conducting and heat-dissipating characteristics. Furthermore, in recent years, due to the increased performance and miniaturization of electronic and electrical equipment components, they are molded into complex shapes and require high dimensional accuracy. For this reason, high mechanical properties and a uniform structure are also required; for example, in the case of hardness, a Vickers hardness of 130 HV or higher is required. In addition, the manufacturing process of these electronic and electrical equipment components involves bonding processes that apply heat and load, such as die bonding and wire bonding. If the copper material cannot withstand the heat and load of the bonding process, it will deform and its operational reliability will decrease. For this reason, high heat resistance is also required for copper materials. Note that if it exhibits high heat resistance at a heating temperature of 400°C, deformation can be sufficiently suppressed.

[0003] For the various copper alloy applications mentioned above, Cu-Fe-P alloys containing Fe and P have been commonly used. Cu-Fe-P alloys are precipitation-strengthened alloys in which intermetallic compounds such as Fe or Fe-P are deposited in a copper matrix. They are widely used in various applications due to their excellent strength, electrical conductivity, and thermal conductivity. However, within this range of composition, there were limitations to the mechanical properties, and forcibly improving the mechanical properties reduced the heat resistance, thus creating a problem where there were limits to both mechanical properties and heat resistance.

[0004] Therefore, techniques for improving mechanical properties and heat resistance by adding elements other than Fe and P have been proposed. For example, Patent Document 1 discloses a technique of adding Co, Ni, and Mg in addition to Fe and P, and Patent Document 2 discloses a technique of adding Sn, Co, Al, Cr, Mg, Mn, Ca, Pb, Ni, Ti, Zr, Si, and Ag in addition to Fe and P. Patent Document 3 discloses a technique of adding Co and Ni in addition to Fe and P.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Patent Document 2

Patent Document 3

Summary of the Invention

Problems to be Solved by the Invention

[0006] By the way, in Patent Documents 1 to 3, if the elements added in addition to Fe and P are added excessively, there is a risk that the conductivity will decrease significantly. In addition, there is a problem that the manufacturing cost increases by adding elements other than Fe and P. In Patent Documents 1 and 3, as an evaluation of heat resistance, the hardness is evaluated at room temperature after heating at 400°C. However, in the bonding process of actual parts for electronic and electrical equipment, deformation will occur under the state of applying both heat and load. This is because, unlike applying a load at room temperature, when a load is applied during heating, dynamic recovery and recrystallization occur. Therefore, it is necessary to evaluate the heat resistance that can withstand bonding during heating.

[0007] Furthermore, when the hardness is high, there is a problem that deformation occurs during complex forming processes. In conventional manufacturing processes, dislocations introduced in the rolling process performed before the final heat treatment process are not uniformly removed in the final heat treatment process, and subsequent final rolling processes result in non-uniform mechanical properties within the material. Specifically, there are differences in hardness between the surface layer and the interior of the material, and the greater the rolling ratio in the final rolling process, the greater this difference becomes, leading to deformation during forming processes.

[0008] The present invention has been made in view of the above circumstances, and an object thereof is to provide a copper alloy wrought material that is excellent in conductivity and hardness, and can suppress deformation even when a load is applied at a high temperature, without adding a large amount of elements other than Fe and P, and a component for an electric / electronic device made of this copper alloy wrought material.

Means for Solving the Problems

[0009] In order to solve the above problems, the copper alloy wrought material according to Aspect 1 of the present invention has a composition in which the content of Fe is in the range of 0.08% by mass or more and 0.17% by mass or less, the content of P is in the range of 0.025% by mass or more and 0.06% by mass or less, and the balance is Cu and unavoidable impurities, the conductivity is 75% IACS or more, the Vickers hardness of the surface at room temperature is 130 HV or more, and the Vickers hardness of the surface at 400 °C is 40 HV or more.

[0010] According to the copper alloy wrought material of Aspect 1 of the present invention, since it has a composition in which the content of Fe is in the range of 0.08% by mass or more and 0.17% by mass or less, the content of P is in the range of 0.025% by mass or more and 0.06% by mass or less, and the balance is Cu and unavoidable impurities, by precipitating intermetallic compounds such as Fe or Fe-P in the copper matrix phase, the strength can be improved while maintaining excellent conductivity and thermal conductivity.

[0011] Specifically, since the conductivity is 75% IACS or more, it is sufficiently excellent in conductivity and heat conductivity. Further, since the Vickers hardness of the surface at room temperature is 130 HV or more, deformation during processing can be suppressed, and processing can be performed with good dimensional accuracy. And since the Vickers hardness of the surface at 400 °C is 40 HV or more, deformation can be suppressed even when a load is applied in a high-temperature state.

[0012] The copper alloy wrought product of Aspect 2 of the present invention is characterized in that, in the copper alloy wrought product of Aspect 1 of the present invention, Zn is further contained in the range of 0.005 mass% or more and 0.1 mass% or less. According to the copper alloy wrought product of Aspect 2 of the present invention, since Zn is further contained in the range of 0.005 mass% or more and 0.1 mass% or less, the solder heat-resistant peelability can be improved.

[0013] The copper alloy wrought product of Aspect 3 of the present invention is such that, in the copper alloy wrought product of Aspect 1 or Aspect 2 of the present invention, the Vickers hardness H S of the surface layer and the Vickers hardness H I of the interior in the cross section are both 130 HV or more, and the ratio H S of the Vickers hardness H of the surface layer and the Vickers hardness H I of the interior, H S / H I is 0.95 or more. According to the copper alloy wrought product of Aspect 3 of the present invention, the Vickers hardness H S of the surface layer and the Vickers hardness H I of the interior in the cross section are both 130 HV or more, and the ratio H S of the Vickers hardness H of the surface layer and the Vickers hardness H I of the interior, H S / H I is 0.95 or more, so it is sufficiently hard and has a uniform hardness throughout, and deformation during processing can be further suppressed, and stable processing can be performed with good dimensional accuracy.

[0014] ​​​​The copper alloy plastic processed material of aspect 4 of the present invention is characterized in that it is a rolled sheet having a thickness in the range of 0.1 mm to 10 mm, in any one of the copper alloy plastic processed materials of aspects 1 to 3 of the present invention. According to the copper alloy plastically formed material of embodiment 4 of the present invention, since it is a rolled sheet with a thickness in the range of 0.1 mm to 10 mm, various shapes of parts can be formed with high dimensional accuracy by, for example, punching.

[0015] The copper alloy plastic workpiece according to aspect 5 of the present invention is characterized in that it has a metal plating layer on its surface, in addition to being a copper alloy plastic workpiece according to any one of aspects 1 to 4 of the present invention. According to the copper alloy plastically formed material of embodiment 5 of the present invention, since it has a metal plating layer on its surface, it is particularly suitable as a material for electronic and electrical equipment components such as terminals, busbars, lead frames, and heat dissipation members.

[0016] The component for electronic and electrical equipment according to aspect 6 of the present invention is characterized by being made of a copper alloy plastically processed material according to any one of aspects 1 to 5 of the present invention. According to the component for electronic and electrical equipment of aspect 6 of the present invention, since it is manufactured using the above-mentioned copper alloy plastic processed material, it can exhibit excellent properties as a terminal, busbar, lead frame, heat dissipation member, etc. [Effects of the Invention]

[0017] This makes it possible to provide a copper alloy plastically formed material that has excellent conductivity and hardness, and can suppress deformation even when a load is applied at high temperatures, without adding large amounts of elements other than Fe and P, as well as electrical and electronic equipment components made from this copper alloy plastically formed material. [Brief explanation of the drawing]

[0018] [Figure 1] This is a flowchart of the manufacturing method for the copper alloy plastically deformed material according to this embodiment. [Modes for carrying out the invention]

[0019] The following describes a copper alloy plastically deformed material and a component for electrical and electronic equipment, which are embodiments of one embodiment of the present invention. The copper alloy plastically deformed material in this embodiment has a composition in which the Fe content is in the range of 0.08% by mass or more and 0.17% by mass or less, the P content is in the range of 0.025% by mass or more and 0.06% by mass or less, and the remainder is Cu and unavoidable impurities. Furthermore, the copper alloy plastically deformed material in this embodiment may also contain Zn in an amount of 0.005% by mass or more and 0.1% by mass or less.

[0020] Furthermore, in the plastically deformed copper alloy material of this embodiment, the electrical conductivity is set to 75% IACS or higher, and the surface Vickers hardness at room temperature is set to 130 HV or higher. Furthermore, in the plastically deformed copper alloy material of this embodiment, the surface Vickers hardness at 400°C is set to 40HV or higher.

[0021] In this embodiment, the Vickers hardness H of the surface layer in the cross-section of the copper alloy plastically deformed material is S and internal Vickers hardness H I Preferably, all of these values ​​are 130 HV or higher.

[0022] Furthermore, in the copper alloy plastically deformed material of this embodiment, the Vickers hardness of the surface layer H S and internal Vickers hardness H I H S / H I It is preferable that the value is 0.95 or higher.

[0023] Furthermore, in the copper alloy plastically deformed material of this embodiment, it is preferable that the material is a rolled sheet with a thickness in the range of 0.1 mm to 10 mm.

[0024] Furthermore, in the copper alloy plastically deformed material of this embodiment, it is preferable to have a metal plating layer on the surface.

[0025] The reasons for specifying the component composition and various properties of the copper alloy plastically deformed material of this embodiment as described above are explained below.

[0026] (Fe) Fe dissolves in the copper matrix and generates Fe or Fe-P precipitate particles. These Fe or Fe-P precipitate particles 12 are dispersed in the matrix 11, improving strength, hardness, and heat resistance without reducing electrical conductivity. Here, if the Fe content is less than 0.08 mass%, the strength, hardness, and heat resistance cannot be sufficiently improved. On the other hand, if the Fe content exceeds 0.17 mass%, the electrical conductivity and thermal conductivity decrease. Therefore, in this embodiment, the Fe content is set to a range of 0.08% by mass or more and 0.17% by mass or less.

[0027] Furthermore, in order to ensure that the above-mentioned effects are reliably achieved, it is preferable that the lower limit of the Fe content be 0.09% by mass or more, and more preferably 0.10% by mass or more. In addition, in order to further suppress the decrease in electrical conductivity and thermal conductivity, it is preferable that the upper limit of the Fe content be 0.16% by mass or less, and more preferably 0.15% by mass or less.

[0028] (P) P is an element with deoxidizing properties. Furthermore, as mentioned above, together with Fe, it forms Fe-P precipitate particles, improving strength, hardness, and heat resistance without reducing electrical conductivity. Here, if the P content is less than 0.025 mass%, the strength, hardness, and heat resistance cannot be sufficiently improved. On the other hand, if the P content exceeds 0.06 mass%, the electrical conductivity and thermal conductivity decrease. Therefore, in this embodiment, the P content is set within the range of 0.025% by mass or more and 0.06% by mass or less.

[0029] Furthermore, in order to ensure that the above-mentioned effects are reliably achieved, it is preferable that the lower limit of the P content be 0.030% by mass or more, and more preferably 0.035% by mass or more. In addition, in order to further suppress the decrease in electrical conductivity and thermal conductivity, it is preferable that the upper limit of the P content be 0.055% by mass or less, and more preferably 0.050% by mass or less.

[0030] (Zn) In the copper alloy plastically deformed material of this embodiment, Zn may be added in addition to Fe and P. Adding Zn can improve the solder heat release properties. Here, it is preferable that the Zn content be 0.005% by mass or more. On the other hand, by setting the Zn content to 0.1% by mass or less, the decrease in electrical conductivity and thermal conductivity can be further suppressed. Therefore, in this embodiment, when Zn is added to improve solder heat peelability, it is preferable that the Zn content be within the range of 0.005% by mass or more and 0.1% by mass or less.

[0031] Furthermore, in order to ensure that the above-mentioned effects are reliably achieved, it is even more preferable to set the lower limit of the Zn content to 0.008% by mass or more, and more preferably to 0.01% by mass or more. In addition, in order to further suppress the decrease in electrical conductivity and thermal conductivity, it is even more preferable to set the upper limit of the Zn content to 0.08% by mass or less, and more preferably to 0.05% by mass or less. Furthermore, if Zn is not intentionally added, the Zn content may be less than 0.005% by mass.

[0032] (Unavoidable impurities: Co, Al, Cr, Mg, Mn, Ca, Pb, Ni, Ti, Zr, Si, As, Sn) Co, Al, Cr, Mg, Mn, Ca, Pb, Ni, Ti, Zr, Si, As, and Sn are unavoidable impurities present in the aforementioned copper alloy plastic deformation materials. High levels of these unavoidable impurities may lead to a decrease in electrical and thermal conductivity. Furthermore, intentionally adding these elements would increase manufacturing costs.

[0033] Therefore, in this embodiment, it is preferable to limit the total content of unavoidable impurities such as Co, Al, Cr, Mg, Mn, Ca, Pb, Ni, Ti, Zr, Si, As, and Sn to 0.1% by mass or less. Furthermore, the total content of unavoidable impurities such as Co, Al, Cr, Mg, Mn, Ca, Pb, Ni, Ti, Zr, Si, As, and Sn is more preferably 0.09% by mass or less, and more preferably 0.08% by mass or less.

[0034] (Other unavoidable impurities) In addition to the Fe, P, Zn and Co, Al, Cr, Mg, Mn, Ca, Pb, Ni, Ti, Zr, Si, As, and Sn mentioned above, other unavoidable impurities include, for example, Sr, Ba, rare earth elements, Be, H, Li, B, N, O, F, Na, S, Cl, K, Ga, Ge, Se, Br, Rb, Tc, Ru, Rh, Pd, Ag, Cd, In, Sb, Te, I, Cs, Hf, Ta, Re, Os, Ir, Pt, Au, Hg, Tl, and Bi. These unavoidable impurities may be present in amounts that do not affect the properties. These unavoidable impurities may reduce conductivity, so it is preferable that their total amount be 0.1% by mass or less, more preferably 0.05% by mass or less, even more preferably 0.03% by mass or less, and even more preferably 0.01% by mass or less.

[0035] (conductivity) In this embodiment of the plastically deformed copper alloy material, the conductivity is 75% IACS or higher, making it particularly suitable as a material for electrical and electronic equipment components such as busbars. Furthermore, the electrical conductivity of the plastically deformed copper alloy material in this embodiment is preferably 78% IACS or higher, and more preferably 80% IACS or higher.

[0036] (Vickers hardness of the surface at room temperature) In this embodiment of the plastically deformed copper alloy material, the surface Vickers hardness at room temperature is 130 HV or higher. This allows for suppression of deformation of the plastically deformed copper alloy material even when processed under load, enabling processing with high dimensional accuracy. Furthermore, the Vickers hardness of the surface of the plastically deformed copper alloy material in this embodiment is preferably 135 HV or higher at room temperature, and more preferably 140 HV or higher.

[0037] (Vickers hardness of the surface at 400°C) In this embodiment of the plastically deformed copper alloy material, the surface Vickers hardness at 400°C is set to 40HV or higher. That is, in this embodiment of the plastically deformed copper alloy material, the Vickers hardness is evaluated while the material is heated and held at 400°C. Thus, in this embodiment of the plastically deformed copper alloy material, sufficient hardness is ensured at 400°C, so deformation of the plastically deformed copper alloy material can be suppressed even when a load is applied at high temperatures. Therefore, for example, this plastically deformed copper alloy material can be joined successfully under high-temperature conditions. Furthermore, the Vickers hardness of the surface of the plastically deformed copper alloy material in this embodiment at 400°C is preferably 43 HV or higher, and more preferably 45 HV or higher.

[0038] (Vickers hardness H of the surface layer in cross-section) S and internal Vickers hardness H I ) In this embodiment of the plastically deformed copper alloy material, the Vickers hardness H of the surface layer in the cross-section S and internal Vickers hardness H I It is preferable that the Vickers hardness of the surface layer be 130HV or higher. Sand internal Vickers hardness H I H S / H I It is preferable that the value is 0.95 or higher. In this embodiment, the "surface layer" refers to the region from the surface of the plastically deformed copper alloy material up to 25% of its thickness, and the "interior" refers to the region of 25% of the thickness centered on the thickness center of the plastically deformed copper alloy material.

[0039] In this embodiment of the plastically deformed copper alloy material, the Vickers hardness H of the surface layer in the cross-section S and internal Vickers hardness H I If the Vickers hardness of the surface layer is 130HV or higher, sufficient hardness is ensured throughout the entire plastically deformed copper alloy material. Even when processed under load, deformation of the plastically deformed copper alloy material can be further suppressed, and processing can be performed with even greater dimensional accuracy. S and internal Vickers hardness H I H S / H I When the value is 0.95 or higher, there is no significant difference in hardness between the surface and the interior, resulting in a uniform structure, and it becomes possible to process copper alloy plastically deformed materials more stably.

[0040] Furthermore, the Vickers hardness H of the surface layer in the cross-section S and internal Vickers hardness H I It is more preferably 135HV or higher, and even more preferably 140HV or higher. Also, the surface Vickers hardness H S and internal Vickers hardness H I H S / H I It is more preferably 0.97 or higher, and even more preferably 0.98 or higher. S and internal Vickers hardness H I H S / H I The upper limit will effectively be 1.05 or less.

[0041] (Thickness of rolled plate) In this embodiment of the plastically deformed copper alloy material, it is preferable that the material is a rolled sheet with a thickness in the range of 0.1 mm to 10 mm. By performing press processing, punching, and other processes on rolled sheets with a thickness of 0.1 mm to 10 mm, various shapes of electronic and electrical equipment components can be manufactured. Furthermore, the lower limit of the thickness of the copper alloy plastically processed material (rolled sheet) in this embodiment is more preferably 0.12 mm or more, and more preferably 0.15 mm or more.

[0042] (Metal plating layer) In the copper alloy plastically deformed material of this embodiment, it is preferable that a metal plating layer is formed on the surface. The presence of a metal plating layer on the surface improves bonding properties with other materials, making it particularly suitable as a material for electronic and electrical equipment components. For example, the metal plating layer can be silver plating, silver alloy plating, tungsten plating, tungsten alloy plating, etc.

[0043] Next, an example of a method for manufacturing a copper alloy plastically deformed material according to this embodiment will be described with reference to the flow chart shown in Figure 1.

[0044] In this embodiment of the method for manufacturing a copper alloy plastically deformed material, as shown in Figure 1, the process includes a melting and casting step S01, a homogenization / solution treatment step S02, an oxide film removal step S03, a rough machining step S04, an intermediate heat treatment step S05, a precipitation heat treatment step S06, a finishing step S07, and a strain removal step S08.

[0045] (Melting and casting process S01) First, the molten copper obtained by melting copper raw materials is modified by adding the aforementioned elements to produce a molten copper alloy. Individual elements or master alloys can be used for the addition of various elements. Alternatively, raw materials containing the aforementioned elements may be melted together with the copper raw materials. Recycled and scrap materials of this alloy may also be used. Here, the molten copper is preferably so-called 4NCu with a purity of 99.99% by mass or higher, or so-called 5NCu with a purity of 99.999% by mass or higher. Then, the modified molten copper alloy is poured into a mold to produce an ingot. For mass production, it is preferable to use a continuous casting method or a semi-continuous casting method.

[0046] (Homogenization / solution treatment step S02) Next, the obtained ingot is subjected to heat treatment to homogenize it. It is preferable to heat the ingot to a temperature of 400°C to 1050°C. There are no particular restrictions on the holding time in the homogenization step S02, but it is preferable to hold it for 1 hour to 24 hours. It is preferable to carry out this homogenization / solution treatment step S02 in a non-oxidizing or reducing atmosphere. Furthermore, in order to improve the efficiency of rough rolling and to homogenize the structure, as described later, hot working may be performed after the homogenization / solution treatment process S02 described above. In this case, there are no particular limitations on the processing method, and for example, rolling, drawing, extrusion, groove rolling, forging, pressing, etc., can be used. In addition, the hot working temperature is preferably in the range of 400°C to 1080°C.

[0047] (Oxide film removal process S03) Next, the oxide film present on the surface after the homogenization / solution treatment step S02 is removed. Surface grinding is preferred to remove the oxide film. There are no particular restrictions on the amount of grinding; it is sufficient as long as the oxide film is adequately removed.

[0048] (Rough machining process S04) After the oxide film removal step S03, rough machining is performed to process the material into a predetermined shape. There are no particular limitations on the temperature conditions in this rough machining step, but in order to suppress recrystallization or to improve dimensional accuracy, it is preferable to use a temperature range of -200°C to 200°C, which is the range of cold or warm rolling, and room temperature is particularly preferred. The processing rate is preferably 20% or more, and more preferably 30% or more. Furthermore, there are no particular limitations on the processing method; for example, rolling, drawing, extrusion, groove rolling, forging, pressing, etc., can be used. In this embodiment, however, rolling is performed.

[0049] (Intermediate heat treatment process S05) After the rough machining process S04, an intermediate heat treatment is performed to soften the material for improved machinability or to create a recrystallized structure. In this intermediate heat treatment step S05, it is preferable that the heat treatment temperature be within the range of 500°C to 800°C, and the holding time at the heat treatment temperature be within the range of 20 seconds to 300 seconds. Furthermore, if a processing step follows the intermediate heat treatment step S05, the introduced dislocations will not be uniformly removed in the precipitation heat treatment step S06 described later, resulting in uneven mechanical properties within the material during the finishing process S07, and deformation will occur during molding. This may result in the surface Vickers hardness at 400°C being less than 40HV.

[0050] (Precipitation heat treatment process S06) After the intermediate heat treatment step S05, a precipitation heat treatment is performed to precipitate intermetallic compound particles such as Fe or Fe-P in the copper matrix. If the heat treatment temperature in the deposition heat treatment step S06 is below 400°C, intermetallic compound particles such as Fe or Fe-P may not be sufficiently deposited, potentially resulting in low electrical conductivity. On the other hand, if the heat treatment temperature in the deposition heat treatment step S07 exceeds 450°C, the heat resistance may become insufficient, potentially resulting in low Vickers hardness at 400°C. Therefore, it is preferable that the heat treatment temperature in the precipitation heat treatment step S06 be within the range of 400°C to 450°C, and the holding time at the heat treatment temperature be within the range of more than 1 hour to 24 hours.

[0051] This deposition heat treatment step S06 improves conductivity. The heating rate and cooling rate can be set as appropriate, but it is preferable that the heating rate be 1°C / min or more and the cooling rate be 0.1°C / min or more up to 300°C.

[0052] (Finishing process S07) Finishing is performed to process the copper material after the deposition heat treatment process S06 into a predetermined shape. If the processing rate in finishing step S08 is less than 50%, the Vickers hardness of the surface at room temperature may be low. On the other hand, if the processing rate in finishing step S07 exceeds 95%, the heat resistance may be insufficient, and the Vickers hardness at 400°C may be low. Therefore, it is preferable that the processing rate in the finishing process S07 be within the range of 50% to 95%.

[0053] In addition, there are no particular limitations on the temperature conditions in this finishing process S07, but it is preferable to set the temperature within the range of -200°C to 200°C, which is used for cold or warm rolling in order to suppress recrystallization or softening, and room temperature is particularly preferred. Furthermore, there are no particular limitations on the processing method; for example, rolling, wire drawing, extrusion, groove rolling, forging, pressing, etc., can be employed. In this embodiment, however, rolling is performed.

[0054] (Stress Removal Heat Treatment Process S08) If necessary, a heat treatment to remove residual strain generated in the finishing process S07 may be performed. In the strain removal heat treatment step S08, the heat treatment temperature is preferably within the range of 200°C to 700°C, and the holding time at the heat treatment temperature is preferably within the range of 1 second to 24 hours. It is preferable to shorten the holding time when heat treatment is performed at a high temperature, and to lengthen the holding time when heat treatment is performed at a low temperature.

[0055] Through the above steps, the copper alloy plastically deformed material of this embodiment is produced. A plating process to form a metal plating layer may also be performed. Furthermore, the electronic and electrical equipment components of this embodiment are manufactured by applying processes such as press working, punching, and bending to the aforementioned copper alloy plastic processed material.

[0056] According to the copper alloy plastic processed material of this embodiment, which has the above configuration, the composition is such that the Fe content is in the range of 0.08 mass% to 0.17 mass%, the P content is in the range of 0.025 mass% to 0.06 mass%, and the remainder is Cu and unavoidable impurities. Therefore, by precipitating intermetallic compounds such as Fe or Fe-P in the copper matrix in the deposition heat treatment step S06, it is possible to improve strength while maintaining excellent electrical and thermal conductivity.

[0057] Furthermore, since its conductivity is rated at 75% IACS or higher, it has excellent electrical and thermal conductivity. Furthermore, since the surface Vickers hardness at room temperature is 130 HV or higher, deformation during processing can be suppressed, allowing for processing with high dimensional accuracy. Furthermore, since the surface Vickers hardness at 400°C is 40HV or higher, deformation can be suppressed even when a load is applied at high temperatures.

[0058] In the copper alloy plastically deformed material of this embodiment, if Zn is further included in a range of 0.005% by mass or more and 0.1% by mass or less, the Zn solid-solves in the copper matrix, improving the solder heat-resistant peelability.

[0059] In this embodiment of the plastically deformed copper alloy material, the Vickers hardness H of the surface layer in the cross-section S and internal Vickers hardness H I The Vickers hardness of the surface layer is 130HV or higher. S and internal Vickers hardness H I HS / H I When the value is 0.95 or higher, the entire copper alloy plastically deformed material is sufficiently hard and has a uniform hardness, which further suppresses deformation during processing and allows for stable processing with good dimensional accuracy.

[0060] In this embodiment of the plastically formed copper alloy material, if the rolled sheet has a thickness of 0.1 mm to 10 mm, various shapes of parts can be formed with high dimensional accuracy by processes such as press working or punching.

[0061] In this embodiment of the plastically formed copper alloy material, when a metal plating layer is present on the surface, it can connect well with other components and is particularly suitable as a material for electronic and electrical equipment components such as terminals, busbars, lead frames, and heat dissipation members.

[0062] According to this embodiment of electronic and electrical equipment components, since they are manufactured using the copper alloy plastic processed material of this embodiment, they can exhibit excellent properties as terminals, busbars, lead frames, heat dissipation members, etc.

[0063] Although embodiments of the present invention, namely a plastically deformed copper alloy material and a component for electronic and electrical equipment, have been described above, the present invention is not limited thereto and can be modified as appropriate without departing from the technical spirit of the invention. For example, although the above embodiment describes an example of a method for manufacturing a copper alloy plastically deformed material, the method for manufacturing a copper alloy plastically deformed material is not limited to this embodiment, and existing manufacturing methods may be appropriately selected and used. [Examples]

[0064] The results of the verification experiments conducted to confirm the effects of the present invention are described below.

[0065] In the melting and casting process, a copper raw material consisting of oxygen-free copper with a purity of 99.99% by mass or higher was prepared, charged into an alumina crucible, and melted in a high-frequency melting furnace under an Ar gas atmosphere. Fe and P were added to the resulting molten copper. Zn was also added as needed. These elements were added using a Cu mother alloy. This produced a molten copper alloy with the component composition shown in Table 1, which was then poured into a carbon mold to produce an ingot. The ingot size was approximately 25 mm thick x 70 mm wide x 100 mm long.

[0066] Next, as part of the homogenization and hot rolling processes, the obtained ingot was heated at 900°C for 1 hour in an Ar gas atmosphere, and then surface-machined to remove the oxide film. Next, after the rough rolling process, an intermediate heat treatment process was carried out at the temperatures and times listed in Table 1. Furthermore, as a precipitation heat treatment process, the material was held at the heat treatment temperature listed in Table 1 for a predetermined time between 2 and 24 hours. After the heat treatment, it was furnace-cooled to 300°C, followed by air cooling or water cooling. Subsequently, polishing was performed to remove the oxide film formed on the surface after the heat treatment. As a finishing process, cold rolling was performed until the thickness shown in Table 1 was achieved, and the resulting samples were prepared for evaluation and measurement.

[0067] The following measurements were taken for the copper alloy plastic deformation materials of the present invention example and comparative example: electrical conductivity, surface Vickers hardness at room temperature, surface Vickers hardness at 400°C, and surface and interior Vickers hardness in cross-section.

[0068] (composition) The content of various elements was measured using inductively coupled plasma atomic emission spectroscopy. The measurement results are shown in Table 1.

[0069] (conductivity) A test specimen measuring 10 mm wide x 60 mm long was taken from the evaluation sample, and its electrical resistance was determined using the four-terminal method. The dimensions of the test specimen were measured using a micrometer, and its volume was calculated. Then, the conductivity was determined from the measured electrical resistivity and the calculated volume. The test specimens were taken so that their longitudinal direction was parallel to the rolling direction. The measurement results are shown in Table 2.

[0070] (Vickers hardness of the surface) The Vickers hardness was measured with a test load of 0.98 N, in accordance with the micro-Vickers hardness test method specified in JIS Z 2244. The measurement surface was the surface (rolled surface). The evaluation results are shown in Table 2.

[0071] (Vickers hardness of the surface at 400°C) The Vickers hardness was measured under a test load of 0.98 N while the sample was heated and held at 400°C, in accordance with the micro-Vickers hardness test method specified in JIS Z 2255. The measurement surface was the surface (rolled surface). The evaluation results are shown in Table 2.

[0072] (Vickers hardness of the cross-section) The Vickers hardness of the sample used for evaluation measurement was measured in a cross-section parallel to the rolling direction, in accordance with the micro-Vickers hardness test method specified in JIS Z 2244, with a test load of 0.98 N. "Vickers hardness of the surface layer H S "The Vickers hardness of the interior is measured in the area from the surface up to 25% of the thickness." I The measurement was taken in a region representing 25% of the thickness, centered on the thickness center. The measurement results are shown in Table 2.

[0073] [Table 1]

[0074] [Table 2]

[0075] [Table 3]

[0076] [Table 4]

[0077] In Comparative Example 1, no Fe or P was added, and the surface Vickers hardness at room temperature was less than 130 HV, while the surface Vickers hardness at 400°C was less than 40 HV. In Comparative Example 2, the Fe content was less than 0.08% by mass, the conductivity was less than 75%IACS, and the surface Vickers hardness at 400°C was less than 40HV. In Comparative Example 3, the Fe content exceeded 0.17% by mass, the conductivity was less than 75%IACS, and the surface Vickers hardness at 400°C was less than 40HV. In Comparative Example 4, the P content was less than 0.025% by mass, the conductivity was less than 75%IACS, and the surface Vickers hardness at 400°C was less than 40HV. In Comparative Example 5, the P content exceeded 0.06% by mass, resulting in an electrical conductivity of less than 75% IACS.

[0078] In Comparative Example 6, the conductivity was less than 75% IACS when the precipitation heat treatment was performed at a temperature of less than 400°C. In Comparative Example 7, the precipitation heat treatment exceeded 450°C, resulting in a surface Vickers hardness of less than 40 HV at 400°C. In Comparative Example 8, the finishing process accounted for less than 50% of the total surface area, resulting in a Vickers hardness of less than 130 HV at room temperature and a Vickers hardness of less than 40 HV at 400°C. In Comparative Example 9, the finishing process accounted for over 95% of the total processing time, resulting in a surface Vickers hardness of less than 40 HV at 400°C. In Comparative Example 10, the surface Vickers hardness at room temperature was less than 130 HV, and the surface Vickers hardness at 400°C was less than 40 HV. In Comparative Example 11, the surface Vickers hardness at 400°C was less than 40 HV.

[0079] In contrast, in Examples 1 to 15 of the present invention, the conductivity was 75% IACS or higher, the surface Vickers hardness at room temperature was 130 HV or higher, and the surface Vickers hardness at 400°C was 40 HV or higher.

[0080] As described above, it has been confirmed that, according to the present invention, it is possible to provide a copper alloy plastic processed material that has excellent conductivity and hardness, and can suppress deformation even when a load is applied at high temperatures, without adding large amounts of elements other than Fe and P, and electrical and electronic equipment components made from this copper alloy plastic processed material.

Claims

1. The composition has an Fe content in the range of 0.08% by mass or more and 0.17% by mass or less, a P content in the range of 0.025% by mass or more and 0.06% by mass or less, and the remainder being Cu and unavoidable impurities. The conductivity is specified as 75% IACS or higher, and the surface Vickers hardness at room temperature is specified as 130 HV or higher. A copper alloy plastically deformed material characterized by having a surface Vickers hardness of 40 HV or higher at 400°C.

2. The copper alloy plastic workpiece according to claim 1, further characterized by containing Zn in a range of 0.005% by mass or more and 0.1% by mass or less.

3. Vickers hardness H of the surface layer in cross-section Ｓ and internal Vickers hardness H Ｉ All of them are 130HV or higher, Vickers hardness H of the surface layer Ｓ and internal Vickers hardness H Ｉ Ratio H Ｓ / H Ｉ The copper alloy plastically deformed material according to claim 1, characterized in that the ratio is 0.95 or higher.

4. The copper alloy plastically deformed material according to claim 1, characterized in that it is a rolled plate with a thickness in the range of 0.1 mm to 10 mm.

5. The copper alloy plastic workpiece according to claim 1, characterized in that it has a metal plating layer on its surface.

6. A component for electronic and electrical equipment, characterized by being made of a copper alloy plastically processed material as described in any one of claims 1 to 5.

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