Cooling structure for electronic circuit boards

Abstract

In a structure that cools multiple electronic circuit boards using a heat sink, the objective is to effectively cool each of the multiple electronic circuit boards while minimizing the increase in the space required for the refrigerant to pass through. [Solution] Heat sinks 12A-12C are provided one for each of the multiple electronic substrates 11A-11C. Each heat sink includes a casing 21A-21C and multiple heat dissipation protrusions 22A-22D. The heat dissipation protrusions are arranged on the outer surfaces 21a, 21b of the casing with gaps G1 between them. The electronic substrates are thermally connected to the casing inside the corresponding casing. In each heat sink, the outer surfaces 21a, 21b of the casing on which the heat dissipation protrusions are formed are arranged facing each other. The heat dissipation protrusions of one opposing casing are inserted into the gaps G1 between the heat dissipation protrusions of the other casing, so that adjacent heat dissipation protrusions are spaced apart from each other.

Description

Technical Field

[0005]

[0001] The technology disclosed in this specification relates to a cooling structure for electronic substrates that cools a plurality of electronic substrates using a heat sink.

Background Art

[0002] Conventionally, as this type of technology, for example, the technology "power module" described in Patent Document 1 below is known. Patent Document 1 (Embodiment 5) discloses a heat dissipation structure (cooling structure) for cooling one power module substrate (electronic substrate), which is a double-sided mounting substrate with circuit patterns mounted on both sides. This cooling structure is provided with a plurality of heat dissipation protrusions on both the upper and lower outer surfaces of a housing (casing) that houses the electronic substrate to enhance heat dissipation and improve the cooling effect of the electronic substrate.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

[0006] To achieve the above objective, the technology described in claim 1 provides a cooling structure for electronic substrates configured to cool a plurality of electronic substrates using heat sinks, wherein one heat sink is provided corresponding to each of the plurality of electronic substrates, the heat sink includes a casing and a plurality of heat dissipation protrusions integrally formed on the outer surface of the casing, the plurality of heat dissipation protrusions are arranged on the outer surface of the casing with gaps between them, the plurality of electronic substrates are each provided inside the corresponding casing and are thermally connected to the casing, the plurality of heat sinks are arranged such that the outer surfaces of the casings on which the heat dissipation protrusions are formed face each other, the plurality of heat dissipation protrusions of one casing whose outer surfaces face each other are inserted into the gaps between the plurality of heat dissipation protrusions of the other casing, and adjacent heat dissipation protrusions of one casing and the other are spaced apart.

[0007] According to the above technology configuration, each of the multiple electronic circuit boards is mounted on a corresponding heat sink. The multiple electronic circuit boards are each housed inside a corresponding casing and are thermally connected to the casing. Multiple heat dissipation protrusions are integrally formed on the outer surface of the casing. Therefore, the heat generated by each electronic circuit board is released to the outside from the casing through the heat dissipation protrusions. Furthermore, the multiple heat dissipation protrusions of one casing facing the other are inserted into the gaps between the multiple heat dissipation protrusions of the other casing, and adjacent heat dissipation protrusions are spaced apart. Therefore, the multiple heat dissipation protrusions of one casing facing the other do not interfere with each other, and are contained within the space between the opposing casings, not exposed to the outside of the cooling structure.

[0008] To achieve the above objective, the technology described in claim 2 is intended to be such that, in the technology described in claim 1, the shape and size of the gaps between the plurality of heat dissipation protrusions of the other casing are formed to match the number or shape and size of the plurality of heat dissipation protrusions of the one casing that are inserted into the gap.

[0009] According to the configuration of the above technology, in addition to the operation of the technology described in claim 1, the shape and size of the gaps between the multiple heat dissipation protrusions of the other casing are matched to the number, shape, and size of the multiple heat dissipation protrusions of the first casing that are inserted into those gaps. Therefore, the number, shape, and arrangement of the heat dissipation protrusions can be changed to match the differences in the heat distribution of the electronic substrate.

[0010] To achieve the above objective, the technology described in claim 3 is characterized in that, in the technology described in claim 1, a plurality of electronic substrates are electrically connected to each other by wiring, and the wiring is connected to the corresponding electronic substrate on an outer surface different from the outer surface on which heat dissipation protrusions are formed on the casing of each heat sink.

[0011] According to the configuration of the above technology, in addition to the operation of the technology described in claim 1, the wiring is connected to the corresponding electronic substrate via an outer surface on each casing where no heat dissipation protrusions are formed. Therefore, the wiring does not interfere with the heat dissipation protrusions.

[0012] To achieve the above objective, the technology described in claim 4 is characterized in that, in the technology described in claim 1, the tips of the multiple heat dissipation protrusions of one casing that are inserted into the gap between the multiple heat dissipation protrusions of the other casing are spaced apart from the outer surface of the opposing other casing.

[0013] According to the configuration of the above technology, in addition to the operation of the technology described in claim 1, the tips of the multiple heat dissipation protrusions of one casing, which are inserted into the gaps between the multiple heat dissipation protrusions of the other casing, are spaced apart from the outer surface of the other casing. Therefore, the heat from one heat sink is not transferred to the other heat sink before it is released to the outside.

[0014] To achieve the above objective, the technology described in claim 5 is an electric vehicle equipped with an electronic module having a cooling structure for an electronic substrate as described in any one of claims 1 to 4, wherein the vehicle comprises a drive wheel, a motor for rotating the drive wheel, a battery for supplying power to the motor, and a power control unit for controlling the power supplied from the battery to the motor, and the electronic module is provided in the power control unit.

[0015] According to the configuration of the above technology, in addition to the operation of the technology described in any one of claims 1 to 4, an electronic module having a cooling structure for an electronic substrate is provided in the power control unit and mounted in an electric vehicle. Therefore, since an electronic module that minimizes the increase in the space through which the refrigerant passes is provided in the power control unit, the power control unit can be miniaturized. [Effects of the Invention]

[0016] According to the technology described in claim 1, in a cooling structure for cooling multiple electronic substrates using a heat sink, it is possible to suppress the increase in the space through which the refrigerant passes in the cooling structure, and to effectively cool each of the multiple electronic substrates.

[0017] According to the technology described in claim 2, in addition to the effects of the technology described in claim 1, multiple heat dissipation protrusions can be designed according to the differences in heat distribution in individual electronic substrates.

[0018] According to the technology described in claim 3, in addition to the effects of the technology described in claim 1, it is possible to prevent the wiring from obstructing the heat dissipation function of the heat dissipation protrusions.

[0019] According to the technology described in claim 4, in addition to the effects of the technology described in claim 1, the cooling function of each heat sink can be ensured, and the cooling function of the entire cooling structure can be improved.

[0020] According to the technology described in claim 5, in addition to the effects of the technology described in any one of claims 1 to 4, the mountability of the power control unit for an electric vehicle can be improved.

Brief Description of Drawings

[0021] [Figure 1] Cross-sectional view showing the electronic module cut in the vertical direction according to the first embodiment. [Figure 2] Cross-sectional view taken along line A-A of FIG. 1 showing the electronic module according to the first embodiment. [Figure 3] Schematic view showing an electric vehicle using the electronic module according to the first embodiment. [Figure 4] Cross-sectional view showing the electronic module according to the comparative example of the first embodiment. [Figure 5] Cross-sectional view corresponding to FIG. 1 showing the electronic module according to the second embodiment.

Modes for Carrying Out the Invention

[0022] <First Embodiment> Hereinafter, a first embodiment in which the "cooling structure of an electronic substrate" is embodied in an electronic module mounted on an electric vehicle will be described in detail with reference to the drawings.

[0023] [Configuration of Electronic Module] FIG. 1 shows a cross-sectional view of the electronic module 1 of this embodiment cut in the vertical direction. FIG. 2 shows a cross-sectional view of the electronic module 1 taken along line A-A of FIG. 1.

[0024] This electronic module 1 is configured to cool three electronic circuit boards 11A, 11B, and 11C using three heat sinks 12A, 12B, and 12C. Each of the three electronic circuit boards 11A to 11C is equipped with power semiconductors and the like. Each of the heat sinks 12A to 12C is provided corresponding to one of the three electronic circuit boards 11A to 11C. That is, the first heat sink 12A is provided corresponding to the first electronic circuit board 11A. The second heat sink 12B is provided corresponding to the second electronic circuit board 11B. The third heat sink 12C is provided corresponding to the third electronic circuit board 11C. The first to third heat sinks 12A to 12C are stacked vertically and connected together by a single connecting frame 13.

[0025] Each heat sink 12A to 12C includes a box-shaped casing 21A, 21B, 21C and a plurality of heat dissipation protrusions 22A, 22B, 22C, 22D integrally formed on the lower outer surface 21a and upper outer surface 21b of each casing 21A to 21C. As shown in Figures 1 and 2, the plurality of heat dissipation protrusions 22A to 22D are arranged on the lower outer surface 21a and upper outer surface 21b of each casing 21A to 21C with gaps G1 between them. Specifically, the first heat sink 12A has a plurality of heat dissipation protrusions 22A integrally formed on the lower outer surface 21a of its casing 21A. The second heat sink 12B has a plurality of heat dissipation protrusions 22B, 22C integrally formed on the upper outer surface 21b and lower outer surface 21a of its casing 21B. The third heat sink 12C has a plurality of heat dissipation protrusions 22D integrally formed on the upper outer surface 21b of its casing 21C. In this embodiment, each of the heat dissipation protrusions 22A to 22D has a cylindrical shape with the same diameter and height.

[0026] The three electronic circuit boards 11A to 11C are each provided inside the corresponding casings 21A to 21C and are thermally connected to the casings 21A to 21C. In this embodiment, each electronic circuit board 11A to 11C is thermally connected to the inner surface of the corresponding casing 21A to 21C via a heat dissipation sheet 23. Specifically, in the casing 21A of the first heat sink 12A, the first electronic circuit board 11A is fixed via a heat dissipation sheet 23 to the inner surface corresponding to the lower outer surface 21a on which the heat dissipation protrusions 22A are formed. In the casing 21B of the second heat sink 12B, the second electronic circuit board 11B is fixed via two heat dissipation sheets 23 to the inner surfaces corresponding to the upper outer surface 21b and lower outer surface 21a on which the heat dissipation protrusions 22B and 22C are formed. In the casing 21C of the third heat sink 12C, the third electronic circuit board 11C is fixed via a heat dissipation sheet 23 to the inner surface corresponding to the upper outer surface 21b on which the heat dissipation protrusions 22D are formed.

[0027] The three heat sinks 12A to 12C are arranged so that the outer surfaces 21b and 21a of the casings 21A to 21C, on which the heat dissipation protrusions 22A to 22D are formed, face each other. The multiple heat dissipation protrusions 22A and 22C of one casing 21A or 21B, whose outer surfaces 21b and 21a face each other, are inserted into the gap G1 between the multiple heat dissipation protrusions 22B and 22D of the other casing 21B or 21C, so that adjacent heat dissipation protrusions 22A and 21C and heat dissipation protrusions 22B and 22D of the other casing are positioned adjacent to and spaced apart from each other. With this arrangement of the heat dissipation protrusions 22A to 22D, the heat dissipation protrusions 22A to 22D of each heat sink 12A to 12C do not come into contact with the outside of the electronic module 1, but are instead housed inside the electronic module 1. In this way, the space in which one heat dissipation protrusion 22A, 21C and the other heat dissipation protrusion 22B, 22D are arranged adjacent to and separated from each other becomes the space through which the refrigerant in the electronic module 1 (cooling structure) passes.

[0028] In this embodiment, as shown in Figures 1 and 2, the shape and size of the gap G1 between the multiple heat dissipation protrusions 22B and 22D of the other casing 21B and 21C are formed to match the number, shape, and size of the multiple heat dissipation protrusions 22A and 22C of the other casing 21A and 21B that are inserted into the gap G1. In this embodiment, the gap G1 is a space in which cylindrical heat dissipation protrusions 22A and 22C of the same size can be inserted at an equidistant distance D1 (see Figure 2) from other adjacent heat dissipation protrusions 22B and 22D.

[0029] In this embodiment, as shown in Figure 1, the three electronic substrates 11A to 11C are electrically connected to each other by wiring 15. This wiring 15 is connected to the casings 21A to 21C of each heat sink 12A to 12C via a side outer surface 21c that is different from the lower outer surface 21a and upper outer surface 21b, on which heat dissipation protrusions 22A to 22D are formed.

[0030] In this embodiment, as shown in Figure 1, the tips of the multiple heat dissipation protrusions 22A, 22C of one casing 21A, 21B, which are inserted into the gap G1 between the multiple heat dissipation protrusions 22B, 22D of the other casing 21B, 21C, are spaced apart from the upper outer surfaces 21b, 21b of the opposing other casing 21B, 21C.

[0031] [Examples of electronic module usage] Here, we will explain an example of the use of the electronic module 1 described above. Figure 3 shows a schematic diagram of an electric vehicle 4 that utilizes the electronic module 1. As shown in Figure 3, in this example, the electronic module 1 is mounted on the electric vehicle 4. The electric vehicle 4 is equipped with a pair of left and right front drive wheels 5 and a pair of left and right rear drive wheels 6. The electric vehicle 4 is equipped with a first motor 7 and a second motor 8 for rotating each drive wheel 5 and 6, a battery 9 for supplying power to each motor 7 and 8, and a power control unit 10 for controlling the power supplied from the battery 9 to each motor 7 and 8. The electronic module 1 described above is installed in the power control unit 10.

[0032] [Function and Effects of Electronic Modules] According to the configuration of the electronic module 1 of this embodiment described above, each of the three electronic substrates 11A to 11C is provided on a corresponding heat sink 12A to 12C. The three electronic substrates 11A to 11C are each provided inside the corresponding casings 21A to 21C and are thermally connected to the casings 21A to 21C. Multiple heat dissipation protrusions 22A to 22D are integrally formed on the outer surface of each casing 21A to 21C. Therefore, the heat generated by each electronic substrate 11A to 11C is released to the outside from each casing 21A to 21C via the multiple heat dissipation protrusions 22A to 22D. The released heat exchanges with the coolant flowing through the gap G1 around each heat dissipation protrusion 22A to 22D.

[0033] Furthermore, the multiple heat dissipation protrusions 22A and 22C of one casing 21A and 21B, whose outer surfaces 21a and 21b face each other, are inserted into the gap G1 between the multiple heat dissipation protrusions 22B and 22D of the other casing 21B and 21C, so that adjacent heat dissipation protrusions 22A and 22C and the other heat dissipation protrusions 22B and 22D are spaced apart. Therefore, the multiple heat dissipation protrusions 22A and 22C of one casing 21A and 21B, whose outer surfaces 21a and 21b face each other, and the multiple heat dissipation protrusions 22B and 22D of the other casing 21B and 21C do not interfere with each other, fit into the space between the opposing casings 21A and 21C, and are not exposed to the outside of the electronic module 1 (cooling structure).

[0034] Therefore, according to the configuration of this embodiment, in a cooling structure that cools three electronic substrates 11A to 11C using three heat sinks 12A to 12C, it is possible to suppress the increase in the space through which the refrigerant passes in the cooling structure, and each of the three electronic substrates 11A to 11C can be effectively cooled.

[0035] According to the configuration of this embodiment, the shape and size of the gap G1 between the multiple heat dissipation protrusions 22B, 22D of the other casing 21B, 21C are matched to the number, shape, and size of the multiple heat dissipation protrusions 22A, 22C of the one casing 21A, 21B that is inserted into the gap G1. Therefore, the number, shape, and arrangement of the heat dissipation protrusions 22A to 22D can be changed to match the differences in heat distribution of the electronic substrates 11A to 11C. As a result, multiple heat dissipation protrusions 22A to 22D can be designed according to the differences in heat distribution of each electronic substrate 11A to 11C.

[0036] According to the configuration of this embodiment, as shown in Figure 1, the wiring 15 is connected to the corresponding electronic substrates 11A to 11C of each casing 21A to 21C via a side outer surface 21c that is different from the lower outer surface 21a and upper outer surface 21b on which the heat dissipation protrusions 22A to 22D are formed. Therefore, the wiring 15 does not interfere with the heat dissipation protrusions 22A to 22D. As a result, it is possible to prevent the wiring 15 from hindering the heat dissipation function of the heat dissipation protrusions 22A to 22D.

[0037] According to the configuration of this embodiment, the tips of the multiple heat dissipation protrusions 22A, 22C of one casing 21A, 21B, which are inserted into the gap G1 between the multiple heat dissipation protrusions 22B, 22D of the other casing 21B, 21C, are spaced apart from the upper outer surfaces 21b, 21b of the other casing 21B, 21C. Therefore, the heat from one opposing heat sink 12A, 12B is not transferred to the other heat sink 12B, 12C before it is released to the outside. As a result, the cooling function of each heat sink 12A to 12C can be ensured, and the cooling function of the entire electronic module 1 (cooling structure) can be improved.

[0038] According to the configuration of this embodiment, the electronic module 1 is provided in the power control unit 10 and mounted in the electric vehicle 4. Therefore, since the electronic module 1, which minimizes the increase in the space through which the refrigerant passes, is provided in the power control unit 10, the power control unit 10 can be miniaturized. This improves the mountability of the power control unit 10 in the electric vehicle 4.

[0039] [Comparison with proportionality] Here, the electronic module 1 of this embodiment will be described in comparison with a proportionally coupled electronic module. Figure 4 shows a cross-sectional view of the proportionally coupled electronic module 41. In this proportionally coupled electronic module 41, three electronic substrates 42A, 42B, and 42C are fixed inside a single heat sink 43. This heat sink 43 comprises a casing 44 and an upper heat dissipation projection 45A and a lower heat dissipation projection 45B integrally formed on the upper and lower outer surfaces 44a and 44b of the casing 44, respectively.

[0040] Three electronic circuit boards 42A to 42C are stacked inside the casing 44. The upper electronic circuit board 42A is thermally connected to the upper inner surface of the casing 44 via a heat dissipation sheet 46. The lower electronic circuit board 42C is thermally connected to the lower inner surface of the casing 44 via a heat dissipation sheet 46. The middle electronic circuit board 42B is connected to the upper electronic circuit board 42A and the lower electronic circuit board 42C via a connector (wiring) 47.

[0041] In the above proportionally arranged electronic module 41, the upper electronic board 42A and the lower electronic board 42C are thermally connected to the inner surfaces of the casing 44 corresponding to the upper and lower heat dissipation protrusions 45A and 45B via the heat dissipation sheet 46. However, the intermediate electronic board 42B is not thermally connected to the inner surfaces of the casing 44 corresponding to the heat dissipation protrusions 45A and 45B. Therefore, the heat generated by the intermediate electronic board 42B cannot be directly transferred from the casing 44 to the respective heat dissipation protrusions 45A and 45B. Consequently, it is difficult to say that each of the three electronic boards 42A to 42C can be effectively cooled.

[0042] In contrast, in the electronic module 1 of this embodiment, each of the three electronic substrates 11A to 11C is provided on a corresponding heat sink 12A to 12C. The heat generated by each electronic substrate 11A to 11C is then transferred to a coolant from the heat dissipation protrusions 22A to 22D of the corresponding heat sink 12A to 12C. In this sense, it is clear that the electronic module 1 of this embodiment can cool each of the three electronic substrates 11A to 11C more effectively than the proportionally cooled electronic module 41.

[0043] Furthermore, in the case of proportionality, heat dissipation protrusions 45A and 45B protrude from both the upper and lower outer surfaces 44b and 44a of the casing 44. As a result, the space for the refrigerant to pass through the electronic module 41 increases, and the size of the electronic module 41 itself tends to increase.

[0044] In contrast, in the electronic module 1 of this embodiment, the heat dissipation protrusions 22A to 22D of each heat sink 12A to 12C are not exposed to the outside of the electronic module 1, but are housed inside the electronic module 1. In this sense, the electronic module 1 of this embodiment can suppress the increase in the space through which the refrigerant passes in the electronic module 1 compared to the proportional electronic module 41, and it is possible to reduce the size of the electronic module 1 itself.

[0045] <Second Embodiment> Next, a second embodiment in which the cooling structure for the electronic circuit board is implemented in an electronic module will be described in detail with reference to the drawings. In the following description, components equivalent to those in the first embodiment will be denoted by the same reference numerals and their descriptions will be omitted, while differences will be explained.

[0046] Figure 5 shows an electronic module 2 of this embodiment in a cross-sectional view similar to that of Figure 1. This electronic module 2 is configured to cool two electronic substrates 11A and 11C using two heat sinks 12A and 12C. In other words, this electronic module 2 is constructed by removing the second heat sink 12B and the second electronic substrate 11B from the electronic module 1 of the first embodiment. Furthermore, the multiple heat dissipation protrusions 22A of the first heat sink 12A are inserted into the gap G1 between the multiple heat dissipation protrusions 22D of the third heat sink 12C and combined, and connected by a connecting frame 13. In addition, the first electronic substrate 11A and the third electronic substrate 11C are connected by wiring 15. The electronic module 2 of this embodiment basically has the same technical features as the first embodiment.

[0047] Therefore, although the number of electronic substrates and heat sinks differs in this embodiment, the electronic module 2 can achieve the same operation and effects as the first embodiment.

[0048] Furthermore, this disclosed technology is not limited to the embodiments described above, and can be implemented by appropriately modifying parts of the configuration without departing from the spirit of the disclosed technology.

[0049] (1) In each of the above embodiments, the cooling structure for the electronic substrate is embodied in an electronic module 1 or 2, which consists of three or two electronic substrates and two heat sinks, respectively. Alternatively, it can be embodied in an electronic module consisting of four or more electronic substrates and heat sinks.

[0050] (2) In each embodiment, an electronic module 1 or 2 is provided in the power control unit 10 of the electric vehicle 4, but an electronic module (cooling structure for an electronic circuit board) can also be provided in a power control unit other than that of an electric vehicle.

[0051] (3) In each embodiment, each electronic circuit board 11A to 11C is thermally connected to the corresponding heat sink 12A to 12C via a heat dissipation sheet 23. Alternatively, the electronic circuit board can be directly connected to the corresponding heat sink without using a heat dissipation sheet. [Industrial applicability]

[0052] This disclosed technology can be used, for example, in the power control unit of an electric vehicle. [Explanation of Symbols]

[0053] 1. Electronic Module 2 Electronic Modules 4 Electric vehicles 5 drive wheels 6 drive wheels 7. First motor 8. Second motor 9 batteries 10 Power Control Unit 11A 1st electronic board 11B 2nd electronic board 11C 3rd electronic board 12A First Heatsink 12B Second Heatsink 12C Third Heatsink 15 Wiring 21A Casing 21B Casing 21C Casing 21a Lower outer surface 21b Upper outer surface 21c Side outer surface 22A heat dissipation protrusion 22B Heat dissipation protrusion 22C heat dissipation protrusion 22D heat dissipation protrusion G1 Gap

Claims

1. In a cooling structure for electronic circuit boards configured to cool multiple electronic circuit boards using a heat sink, The heat sink is provided one for each of the multiple electronic circuit boards. The heat sink includes a casing and a plurality of heat dissipation protrusions integrally formed on the outer surface of the casing. The multiple heat dissipation protrusions are arranged on the outer surface of the casing with gaps between them. Each of the multiple electronic circuit boards is provided inside the corresponding casing and is thermally connected to the casing. Multiple heat sinks are arranged such that the outer surfaces of the casings on which the heat dissipation protrusions are formed face each other. The multiple heat dissipation protrusions of one casing whose outer surfaces face each other are inserted into the gap between the multiple heat dissipation protrusions of the other casing, so that adjacent heat dissipation protrusions on one casing are spaced apart from each other. A cooling structure for an electronic circuit board characterized by the following features.

2. In the cooling structure for an electronic substrate described in claim 1, The shape and size of the gaps between the multiple heat dissipation protrusions of the other casing are formed to match the number, shape, and size of the multiple heat dissipation protrusions of the first casing that are inserted into the gaps. A cooling structure for an electronic circuit board characterized by the following features.

3. In the cooling structure for an electronic substrate described in claim 1, Multiple electronic circuit boards are electrically connected to each other by wiring. The wiring is connected to the corresponding electronic substrate via an outer surface different from the outer surface on which the heat dissipation protrusions are formed, relative to the casing of each heat sink. A cooling structure for an electronic circuit board characterized by the following features.

4. In the cooling structure for an electronic substrate described in claim 1, The tips of the multiple heat dissipation protrusions of one casing, which are inserted into the gaps between the multiple heat dissipation protrusions of the other casing, are spaced apart from the outer surface of the other casing. A cooling structure for an electronic circuit board characterized by the following features.

5. An electric vehicle equipped with an electronic module having a cooling structure for an electronic substrate as described in any one of claims 1 to 4, Drive wheels and A motor for rotating the aforementioned drive wheel, A battery for supplying power to the motor, A power control unit for controlling the power supplied from the battery to the motor, and Equipped with, The electronic module is provided in the power control unit. An electric vehicle characterized by the following features.

Images