Method for manufacturing roll-shaped master discs and roll-shaped master discs
By forming a sacrificial layer pattern and using CMP to polish the transfer shape prototype to match the sacrificial layer pattern, the method addresses shape inaccuracies in roll-shaped master disks, achieving a ±5% shape accuracy for precise pattern reproduction.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
- Filing Date
- 2025-01-15
- Publication Date
- 2026-07-28
AI Technical Summary
Conventional methods for manufacturing roll-shaped master disks result in variations in the height of the convex pattern portions due to uneven plating growth rates and uncontrollable deposition rates, leading to shape inaccuracies.
A method involving the formation of a sacrificial layer pattern, followed by a transfer shape prototype, and polishing using chemical mechanical polishing (CMP) to match the height of the transfer shape prototype to the sacrificial layer pattern, thereby reducing height variations to within ±5% of the target shape.
The method achieves a roll-shaped master disk with a convex pattern portion that has a shape accuracy within ±5% of the target shape, ensuring precise reproduction of the desired pattern.
Smart Images
Figure 2026122331000001_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a method for manufacturing a roll-shaped master disk having a fine transfer pattern on the surface of a roll substrate, and to a roll-shaped master disk manufactured by this method.
Background Art
[0002] Conventionally, as a method for manufacturing a roll-shaped master disk having a precise transfer shape and being continuous in the circumferential direction, there is a manufacturing method in which a roll is placed in a plating bath (not shown) after forming a photoresist layer on the surface of the roll substrate, and a plating film made of a plating material M is grown on the exposed outer surface 3a of the workpiece 3 as shown in (b). After that, the photoresist layer 5 is removed with a cleaning liquid, and a pattern of the plating material M is formed as a convex pattern portion on the outer surface 3a of the workpiece 3 as shown in (c). (For example, see Patent Document 1.) FIGS. 4 and 5 are diagrams showing a conventional method for manufacturing a roll-shaped master disk using the resist removal process described in Patent Document 1.
[0003] In FIG. 4, after forming the photoresist layer 5 in (a), the roll is placed in a plating bath (not shown), and a plating film made of the plating material M is grown on the exposed outer surface 3a of the workpiece 3 as shown in (b). Then, by removing the photoresist layer 5 with a cleaning liquid, a pattern of the plating material M is formed as a convex pattern portion on the outer surface 3a of the workpiece 3 as shown in (c).
[0004] In FIG. 5, after forming the photoresist layer 5 in (a), the roll is placed in a vacuum chamber (not shown), and a film made of chromium 7 is formed by evaporation or sputtering on the exposed outer surface 3a of the workpiece 3 and the outer surface 5a of the photoresist layer 5 as shown in (b). Then, by removing the photoresist layer 5 with a cleaning liquid, a pattern of chromium 7 is formed as a convex pattern portion on the outer surface 3a of the workpiece 3 as shown in (c).
Prior Art Documents
Patent Documents
[0005]
Patent Document 1
Summary of the Invention
[0006] However, the conventional configuration described above has the problem that the height of the convex pattern portion varies from the height of the target shape. For example, in the plating method, the size of the outer surface 3a is distributed depending on the pattern shape, and the distance between the electrode and the outer surface 3a in the plating bath also differs, so the plating growth rate differs depending on the location on the outer surface 3a. In the vacuum deposition method, the distance between the metal source and the outer surface 3a in the vacuum chamber differs, and the deposition rate cannot be controlled with respect to the photoresist layer thickness.
[0007] The present invention aims to solve the aforementioned conventional problems and to provide a method for manufacturing a roll-shaped master disc and a roll-shaped master disc that reduces the error in the shape of the convex pattern portion relative to the height of the target shape. [Means for solving the problem]
[0008] To achieve the above objective, a method for manufacturing a roll-shaped master according to one aspect of the present invention is a method for manufacturing a roll-shaped master having a transfer shape portion on the surface of a roll substrate, A sacrificial layer pattern is formed on the surface of the roll substrate in accordance with the target shape. A transfer shape prototype is formed on the surface of the roll substrate other than the surface on which the sacrificial layer pattern portion is formed. The transfer shape prototype is polished by CMP so that its height matches the height of the sacrificial layer pattern. The sacrificial layer pattern portion is removed to produce a roll-shaped master disc having the transfer shape portion as a convex pattern portion.
[0009] To achieve the above objective, in a roll-shaped master according to another aspect of the present invention, the roll-shaped master is manufactured by the method for manufacturing a roll-shaped master described in the above aspect, such that the surface of the roll substrate has the transfer shape portion, The pattern spacing in the circumferential direction of the roll in the transfer shape portion is greater than 0 mm and 10 mm or less, and the variation in the height of the transfer shape portion relative to the height of the target shape is 5% or less. [Effects of the Invention]
[0010] As described above, according to the method for manufacturing a roll-shaped master disc according to the above-described aspect of the present invention, by performing CMP on the roll-shaped master disc to match the height of the transfer shape prototype portion to the height of the sacrificial layer pattern portion, it is possible to reduce the variation in the height of the pattern shape formed on the surface of the roll substrate from the height of the target shape, and it is possible to manufacture a roll-shaped master disc having a transfer shape portion as a convex pattern portion that has a shape accuracy with a small error relative to the height of the target shape, for example, within ±5% (i.e., a variation of 5% or less relative to the target height).
[0011] Furthermore, according to the roll-shaped master disc according to the above-described embodiment of the present invention, as an example, by performing CMP on the roll-shaped master disc to match the height of the transfer shape prototype portion to the height of the sacrificial layer pattern portion, it is possible to reduce the variation in the height of the pattern shape formed on the roll substrate surface from the height of the target shape, and a roll-shaped master disc can be provided having a transfer shape portion as a convex pattern portion that has a shape accuracy with a small error relative to the height of the target shape, for example, within ±5% (i.e., a variation of 5% or less relative to the target height), and the target shape can be reproduced well. [Brief explanation of the drawing]
[0012] [Figure 1] Figure of the method for manufacturing a roll-shaped master plate in Embodiment 1 of the present invention. [Figure 2] Figure of the method for manufacturing a roll-shaped master plate in Embodiment 2 of the present invention. [Figure 3] Projection view of a roll-shaped master disc from the side. [Figure 4] This figure shows a conventional method for manufacturing a roll-shaped master disc using the plating method described in Patent Document 1. [Figure 5]This figure shows a conventional method for manufacturing roll-shaped master discs using the vacuum deposition method described in Patent Document 1. [Modes for carrying out the invention]
[0013] Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0014] (Embodiment 1) Figure 1 is an overall process diagram of the method for manufacturing a roll-shaped master disc according to Embodiment 1 of the present invention. In Figure 1, the roll substrate 103 and the sacrificial layer pattern portion 105 correspond to the workpiece 3 and photoresist layer 5 in the conventional configuration, respectively.
[0015] The manufacturing method for a roll-shaped master disc in Embodiment 1 involves at least a sacrificial layer pattern formation step of patterning a photoresist to form a sacrificial layer pattern portion 105 on the roll substrate surface corresponding to a target shape; a transfer shape prototype portion formation step of forming a transfer shape prototype portion 101a within the sacrificial layer pattern portion 105; a CMP polishing step of performing CMP on the transfer shape prototype portion 101a so that the height of the transfer shape prototype portion 101a matches the height of the sacrificial layer pattern portion 105; and a removal step of removing the sacrificial layer pattern portion 105 after CMP polishing, thereby forming a transfer shape portion 101 as a convex pattern portion on the outer surface of the roll substrate 103 with little variation from the height of the target shape (i.e., target height). This will be described in detail below.
[0016] In FIG. 1, (a) shows a roll substrate 103 on which a sacrificial layer pattern portion 105 is formed on the surface. (b) shows a transfer shape prototype portion forming step of forming a transfer shape prototype portion 101a made of a metal material on the surface of the roll substrate 103 on which the sacrificial layer pattern portion 105 is formed. (c1) shows a CMP polishing step of performing CMP using a CMP polishing member 102. (d) shows a state in which the transfer shape prototype portion 101a is polished according to the pattern height of the sacrificial layer pattern portion 105 by the CMP polishing step, and the shape is shaped into a transfer shape portion 101 having the same height as the height of the sacrificial layer pattern portion 105. Further, (c2) shows a state of the CMP polishing step (c1) as viewed from the long axis direction of the roll. (e) shows a roll-shaped master disk on which a transfer shape portion 101 is formed on the roll substrate 103 after the removal step.
[0017] First, an example of a method for forming the sacrificial layer pattern portion 105 reaching the state of (a) in FIG. 1 will be described. A photoresist solution is applied onto a roll substrate 103 whose surface is fused silica using a die coater, and heated to volatilize the solvent from the photoresist solution, thereby forming a photoresist layer. The photoresist layer is subjected to gray scale exposure and developed to obtain the sacrificial layer pattern portion 105 in the state of (a) in FIG. 1 corresponding to the target shape.
[0018] Next, in the transfer shape prototype portion forming step, as an example, the roll on which the sacrificial layer pattern portion 105 is formed is placed in a vacuum chamber, and aluminum is used for sputtering on the surface of the roll substrate 103 and the surface of the sacrificial layer pattern portion 105 to form a film up to a thickness larger than the maximum thickness of the sacrificial layer pattern portion 105, thereby forming a roll cross-section as shown in (b) of FIG. 1. As a result, the sacrificial layer pattern portion 105 is entirely covered by the transfer shape prototype portion 101a.
[0019] Next, in the CMP polishing process, as shown in (c1) of FIG. 1, while rotating the roll substrate 103, the CMP polishing member 102 and a CMP slurry for aluminum (not shown) are used, and the CMP polishing member 102 is moved in one direction or reciprocally along the tangent plane formed on the upper surface of the sacrificial layer pattern portion 105 and along the roll axis direction, thereby performing CMP on the aluminum of the transferred shape prototype portion 101a. The transferred shape prototype portion 101a is polished until it has the same thickness as the adjacent sacrificial layer pattern portion 105. At this time, as an example, the roll substrate 103 was rotated at 6 rpm. By CMP, it is possible to form a transferred shape portion 101 shaped to a height within ±5% error from the target height as shown in (d) of FIG. 1.
[0020] Next, in the removal process, the sacrificial layer pattern portion 105 is removed using an organic solvent type resist stripper, thereby manufacturing a roll-shaped master disk having the transferred shape portion 101 formed on the roll substrate 103 as shown in (e) of FIG. 1.
[0021] According to the first embodiment, by performing CMP on the roll-shaped master disk to match the height of the transferred shape prototype portion 101a to the height of the sacrificial layer pattern portion 105, the variation in the height of the pattern shape formed on the roll substrate surface from the height of the target shape can be reduced, and a roll-shaped master disk having a transferred shape portion 101 with a shape accuracy having a small error with respect to the height of the target shape, for example, a shape accuracy within ±5%, as a convex pattern portion can be manufactured.
[0022] On the other hand, in the conventional manufacturing method, when the error in the height of the transferred shape portion becomes larger than 5%, the variation in the concave shape of the product manufactured using the roll-shaped master disk becomes large, and the desired optical characteristics, mechanical characteristics, or electrical characteristics cannot be obtained.
[0023] In the first embodiment, for example, a roll-shaped master disk having a roll diameter of 200 mm, a roll width of 250 mm, a width of the transferred shape portion 101 of 10 μm, and a gradient such that the height of the transferred shape portion 101 is 250 nm or more and 3 μm or less can be manufactured.
[0024] In this embodiment 1, grayscale exposure was used as the method for forming the sacrificial layer pattern portion 105. However, a method of 3D printing using a resin material, a method of film formation using a spray coater or bar coater followed by exposure and development with a laser direct writing device, or a method of patterning by applying a solution of self-assembling particles such as a block copolymer of polymethyl methacrylate and polystyrene may also be used.
[0025] Furthermore, although sputtering was used as the method for forming the transfer shape prototype part 101a, vacuum deposition or plating may also be used.
[0026] Although aluminum was used as the material, other metals that can be formed by sputtering, vacuum deposition, or plating and removed by CMP, such as copper, may also be used.
[0027] Alternatively, a hard material such as titanium or tungsten may be deposited on the sacrificial layer pattern portion 105 by sputtering or the like before forming the transfer shape prototype portion 101a.
[0028] (Embodiment 2) Figure 2 is an overall process diagram of the method for manufacturing a roll-shaped master plate in Embodiment 2 of the present invention. The main difference between Embodiment 2 and Embodiment 1 is the polishing member used in the CMP polishing process.
[0029] In Figure 2, (a) shows a roll substrate 103 with a sacrificial layer pattern portion 105 formed on its surface. (b) shows a transfer shape prototype portion formation step in which a transfer shape prototype portion 101a made of a metal material is formed on the surface of the roll substrate 103 with the sacrificial layer pattern portion 105 formed thereon. (c1) shows a CMP polishing step in which CMP is performed using a CMP polishing member 102. (d) shows the state in which the transfer shape prototype portion 101a has been polished to match the pattern height of the sacrificial layer pattern portion 105 by the CMP polishing step, and has been shaped into a transfer shape portion 101 with the same height as the sacrificial layer pattern portion 105. (c2) shows the CMP polishing step (c1) as viewed from the long axis direction of the roll. (e) shows a roll-shaped master disc with the transfer shape portion 101 formed on the roll substrate 103 after the removal step.
[0030] First, an example of a method for forming the sacrificial layer pattern portion 105 that reaches the state shown in Figure 2(a) will be described. A photoresist solution is applied to a roll substrate 103 whose surface is copper, and a photoresist layer is formed by heating to evaporate the solvent from the photoresist solution. The photoresist layer is exposed using a laser direct writing device and developed to obtain the sacrificial layer pattern portion 105 in the state shown in Figure 2(a) corresponding to the target shape. In an example of this second embodiment, for example, a 2.38% tetramethylammonium hydroxide aqueous solution is used as the developer, and since the pH of the developer is 13.6, a threshold pH of 11.6 is set so that the development rate ratio becomes 1 / 100, and the photoresist that decomposes under basic conditions of pH 11.6 or higher is patterned, and the pH of the stripping solution is also set to 11.6 or higher.
[0031] Next, in the transfer shape prototype formation step, as an example, a roll on which the sacrificial layer pattern portion 105 has been formed is placed in a copper sulfate plating bath, and copper is deposited by plating growth on the portion of the surface of the roll substrate 103 that is not covered by the sacrificial layer pattern portion 105 to a thickness greater than the maximum thickness of the sacrificial layer pattern portion 105, thereby forming a roll cross-section as shown in Figure 2(b). Since the resist used in this example of Embodiment 2 decomposes under basic conditions, the pH of the plating bath was set to 8.6 or less. As a result, the transfer shape prototype portion 101a is formed on the portion of the surface of the roll substrate 103 that is not covered by the sacrificial layer pattern portion 105 to a thickness greater than the thickness of the sacrificial layer pattern portion 105.
[0032] Next, in the CMP polishing process, as shown in Figure 2(c1), the copper of the transfer shape prototype 101a is treated with CMP by rotating the roll substrate 103 while using the CMP polishing member 102 and a copper CMP slurry (not shown) to move or reciprocate the CMP polishing member 102 in one direction along the tangent curved surface formed on the upper surface of the sacrificial layer pattern 105 and along the roll axis direction. The transfer shape prototype 101a is polished until it has the same thickness as the adjacent sacrificial layer pattern 105. This makes it possible to form a transfer shape 101 that is shaped to a height within ±5% error of the target height, as shown in Figure 2(d).
[0033] Next, in the removal process, the sacrificial layer pattern portion 105 is removed using an alkaline resist stripping solution, thereby producing a roll-shaped master disc on which the transfer shape portion 101 is formed on the roll substrate 103, as shown in Figure 2(e).
[0034] Here, in the CMP polishing process, as shown in Figure 2(c2), an elastic layer 102a is used on the CMP polishing member 102 to perform CMP in accordance with the curved surface of the roll substrate. At this time, it is preferable that the polishing pressure be 0 Pa or more and 1 MPa or less, and the abrasive particle concentration of the CMP slurry be 0 wt% or more and 10 wt% or less. In one example of this embodiment 2, a layer of foamed polyurethane is added to the top of the polishing layer 102b of the polishing member 102 as an example of a porous material for the polishing member elastic layer 102a so that the surface pressure is less than 1 MPa. In other words, the configuration is such that there is an elastic layer 102a between the polishing member mounting part 90 of the CMP apparatus (not shown) and the polishing layer 102b of the polishing member 102 so that the polishing pressure (i.e., surface pressure) applied from the polishing layer 102b to the transfer shape prototype part 101a and the sacrificial layer pattern part 105 is 0 Pa or more and 1 MPa or less. The polishing member elastic layer 102a may be a fibrous material in addition to a porous material, and polystyrene can be given as an example. If the polishing pressure exceeds 1 MPa, shear fracture of the resist occurs, causing the height of the sacrificial layer pattern portion 105 to become lower than the height of the target shape. As a result, the transfer shape prototype portion 101a is polished to match the height of the sacrificial layer pattern portion 105, which has become lower than the height of the target shape. Consequently, a transfer shape portion is formed that is less than 95% of the height of the target shape. Furthermore, if the abrasive grain concentration of the CMP slurry exceeds 10 wt%, the number of abrasive grains colliding with the resist of the sacrificial layer pattern portion 105 increases excessively, causing shear stress and resulting in the aforementioned shear fracture. In addition, the mechanical polishing action of the abrasive grains removes too much of the resist, causing excessive removal of the sacrificial layer pattern portion 105. As a result, the height of the sacrificial layer pattern portion 105 decreases, and the transfer shape prototype portion 101a is polished to match the height of the sacrificial layer pattern portion 105, which has become lower than the height of the target shape. Consequently, a transfer shape portion is formed that is less than 95% of the height of the target shape.
[0035] In contrast, in this second embodiment, as an example, with the aim of reducing the removal rate ratio of resist to copper in CMP to 0.01 or less, the polishing pressure is set to 0 Pa or more and 1 MPa or less, the abrasive particle size contained in the CMP slurry is set to 0 nm or more and 50 nm or less, and the abrasive particle concentration is set to 0 wt% or more and 10 wt% or less, preferably 3.5 wt% or less. Furthermore, in order to suppress the decomposition of the resist by the base, the pH of the CMP slurry is set to 8.6 or less.
[0036] In this second embodiment, for example, a roll-shaped master disc can be manufactured in which the roll diameter is 300 mm, the roll width is 1000 mm, the width of the transfer shape portion is 3 μm, the height of the transfer shape portion is 2 μm, the protrusions of the transfer shape portion 101 have intersections, and the maximum pattern spacing in the circumferential direction of the roll, as described later using Figure 3, is 1 mm.
[0037] Figure 3 is a projection view of the roll-shaped master disc in a side view. In other words, the transfer shape portion 101 in this figure means that the transfer shape portion 101 is formed at one or more points in the axial direction. The circumferential length of the area where the surface of the roll substrate 103 is exposed on the projection view is defined as the pattern spacing 311 in the roll circumferential direction, and the largest of the pattern spacings 311 in the roll circumferential direction is defined as the maximum pattern spacing in the roll circumferential direction.
[0038] In this embodiment 2, the maximum pattern spacing in the circumferential direction of the roll was set to 1 mm. However, a feature of this embodiment 2 is that for roll-shaped master discs with a maximum pattern spacing of 10 mm or less in the circumferential direction of the roll, the error in the height of the convex pattern portion relative to the target shape is reduced, for example, to within ±5%. A common method for manufacturing roll-shaped master discs involves creating a pattern shape on a thin metal plate, rolling the metal plate, and then welding the ends. However, in this welding method for manufacturing roll-shaped master discs, there is a region at the end of the metal plate where a transfer shape portion larger than 10 mm in the circumferential direction of the roll cannot be provided due to the welding allowance. Therefore, for roll-shaped master discs with a maximum pattern spacing greater than 0 mm and 10 mm or less in the circumferential direction of the roll, reducing the error in the height of the convex pattern portion relative to the target shape, for example, to within ±5% (i.e., the variation in the target height is 5% or less), is a problem solved by the above-described embodiment of the present invention.
[0039] According to the second embodiment described above, by performing CMP on a roll-shaped master using a polishing member 102 having an elastic layer 102a that can control the polishing pressure, and adjusting the height of the transfer shape prototype portion 101a to the height of the sacrificial layer pattern portion 105, it is possible to reduce the variation in the height of the pattern shape formed on the roll substrate surface from the height of the target shape, and it is possible to manufacture a roll-shaped master having a transfer shape portion 101 as a convex pattern portion with a shape accuracy that has a small error with respect to the height of the target shape, for example, a shape accuracy of ±5% or less.
[0040] In contrast, in the conventional manufacturing method described above, if the height error of the transfer shape portion 101 exceeds 5%, the variation in the shape of the recesses of the product manufactured using the roll-shaped master disc increases, making it impossible to obtain the desired optical, mechanical, or electrical properties.
[0041] In embodiments 1 and 2, the transfer shape portion 101a and the roll substrate 103 can be made of, for example, aluminum, copper, nickel, or chromium, and it is preferable that the transfer shape portion 101a and the roll substrate 103 are made of the same metal. If the transfer shape portion 101a and the roll substrate 103 are not made of the same metal but of different metals, there is a possibility of corrosion, and the crystalline bond at the interface may weaken, leading to delamination.
[0042] Furthermore, by appropriately combining any embodiment or modification from the various embodiments or modifications described above, the effects of each can be achieved. In addition, it is possible to combine embodiments with each other, or embodiments with each other, or embodiments with each other, as well as to combine features from different embodiments or embodiments.
[0043] (Note) Based on the above description of embodiments, the following technologies are disclosed.
[0044] (Technology 1) A method for manufacturing a roll-shaped master disc having a transfer shape portion on the surface of a roll substrate, A sacrificial layer pattern is formed on the surface of the roll substrate in accordance with the target shape. A transfer shape prototype is formed on the surface of the roll substrate other than the surface on which the sacrificial layer pattern portion is formed. The transfer shape prototype is polished by CMP so that its height matches the height of the sacrificial layer pattern. A method for manufacturing a roll-shaped master disc, comprising removing the sacrificial layer pattern portion to produce a roll-shaped master disc having the transfer shape portion as a convex pattern portion.
[0045] (Technology 2) The method for manufacturing a roll-shaped master disc according to Technology 1, wherein, in polishing by CMP, the CMP polishing member used for polishing has an elastic layer on the side opposite to the polishing side of the polishing layer, and polishing pressure is applied to the surface of the roll substrate from the elastic layer side via the elastic layer and the polishing layer.
[0046] (Technical 3) A method for manufacturing a roll-shaped master disc according to Technical 2, using the CMP polishing member having the porous or fibrous elastic layer such that the surface pressure during polishing in the CMP is 0 Pa or more and 1 MPa or less.
[0047] (Technology 4) A method for manufacturing a roll-shaped master disc according to any one of Technologies 1 to 3, wherein, during polishing by CMP, the abrasive particle size of the slurry is 0 nm or more and 50 nm or less, and the abrasive particle concentration is 0 wt% or more and 10 wt% or less.
[0048] (Technical 5) In forming the sacrificial layer pattern, a photoresist that decomposes at pH 11.6 or higher is patterned. In forming the transfer shape prototype, a plating process is performed using a plating solution with a pH of 8.6 or lower. In CMP polishing, a slurry with a pH of 8.6 or lower is used. Furthermore, when removing the sacrificial layer pattern, the stripping solution used to remove the resist from the sacrificial layer pattern should have a pH of 11.6 or higher. A method for manufacturing a roll-shaped master disc as described in any one of the technologies 1 to 4.
[0049] (Technology 6) A roll-shaped master disc manufactured by the method for manufacturing a roll-shaped master disc described in any one of Techniques 1 to 5, wherein the surface of the roll substrate has the transfer shape portion, A roll-shaped master disc in which the pattern spacing in the circumferential direction of the roll in the transfer shape portion is greater than 0 mm and 10 mm or less, and the variation in the height of the transfer shape portion with respect to the height of the target shape is 5% or less.
[0050] (Technical 7) The roll-shaped master disc according to Technical 6, wherein the transfer shape portion and the roll substrate are made of the same metal.
[0051] (Technical 8) The roll-shaped master disc according to Technical 6 or 7, wherein the metal constituting the transfer shape portion and the roll substrate is aluminum, copper, nickel, or chromium.
[0052] Therefore, according to the method for manufacturing a roll-shaped master disc according to the above technology, by performing CMP on the roll-shaped master disc to match the height of the transfer shape prototype portion to the height of the sacrificial layer pattern portion, it is possible to reduce the variation in the height of the pattern shape formed on the surface of the roll substrate from the height of the target shape, and it is possible to manufacture a roll-shaped master disc having a transfer shape portion as a convex pattern portion that has a shape accuracy with a small error relative to the height of the target shape, for example, within ±5% (i.e., a variation of 5% or less relative to the target height).
[0053] Furthermore, according to the roll-shaped master disc of the above technology, as an example, by manufacturing the roll-shaped master disc using a method that involves performing CMP on the roll-shaped master disc to adjust the height of the transfer shape prototype to the height of the sacrificial layer pattern, it is possible to reduce the variation in the height of the pattern shape formed on the surface of the roll substrate from the height of the target shape. This makes it possible to provide a roll-shaped master disc having a transfer shape portion as a convex pattern portion with a shape accuracy that has a small error with respect to the height of the target shape, for example, within ±5% (i.e., a variation of 5% or less with respect to the target height), and thus the target shape can be reproduced well. [Industrial applicability]
[0054] The method for manufacturing a roll-shaped master disc and the roll-shaped master disc according to the above-described aspect of the present invention provide a roll-shaped master disc having continuity such that the maximum pattern spacing in the circumferential direction of the roll is 10 mm or less, and the transfer shape portion has good reproducibility with respect to the target shape. By using such a roll-shaped master disc, it is possible to suppress the generation of unwanted diffracted light, stress concentration, or variations in in-plane electrical properties in optical components such as diffraction gratings or waveguides, or electrical components such as film antennas or conductive films, and to manufacture products larger than the roll surface area, while enabling mass production by imprint. [Explanation of Symbols]
[0055] 90 Polishing member mounting section 101a Transfer shape prototype part 101 Transfer shape section 102 CMP polishing member 102a CMP polishing member elastic layer 102b Polishing layer 103 Roll base material 105 Sacrificial layer pattern section 311 Pattern spacing in the circumferential direction of the roll
Claims
1. A method for manufacturing a roll-shaped master disc having a transfer shape portion on the surface of a roll substrate, A sacrificial layer pattern is formed on the surface of the roll substrate in accordance with the target shape. A transfer shape prototype is formed on the surface of the roll substrate other than the surface on which the sacrificial layer pattern portion is formed. The transfer shape prototype is polished by CMP so that its height matches the height of the sacrificial layer pattern. A method for manufacturing a roll-shaped master disc, comprising removing the sacrificial layer pattern portion to produce a roll-shaped master disc having the transfer shape portion as a convex pattern portion.
2. The method for manufacturing a roll-shaped master disc according to claim 1, wherein, in the polishing by CMP, the CMP polishing member used for polishing has an elastic layer on the side opposite to the polishing side of the polishing layer, and polishing pressure is applied to the surface of the roll substrate from the elastic layer side via the elastic layer and the polishing layer.
3. The method for manufacturing a roll-shaped master disc according to claim 2, wherein the CMP polishing member having the porous or fibrous elastic layer is used such that the surface pressure during polishing in the CMP is 0 Pa or more and 1 MPa or less.
4. A method for manufacturing a roll-shaped master disc according to any one of claims 1 to 3, wherein, during polishing by the CMP, the abrasive particle size of the slurry is 0 nm or more and 50 nm or less, and the abrasive particle concentration is 0 wt% or more and 10 wt% or less.
5. In forming the sacrificial layer pattern, a photoresist that decomposes at a pH of 11.6 or higher is patterned. In forming the transfer shape prototype, a plating process is performed using a plating solution with a pH of 8.6 or lower. In CMP polishing, a slurry with a pH of 8.6 or lower is used. Furthermore, in removing the sacrificial layer pattern, the stripping solution used to remove the resist from the sacrificial layer pattern should have a pH of 11.6 or higher. A method for manufacturing a roll-shaped master disc according to any one of claims 1 to 3.
6. A roll-shaped master disc manufactured by the method for manufacturing a roll-shaped master disc according to any one of claims 1 to 3, wherein the surface of the roll substrate has the transfer shape portion, A roll-shaped master disc in which the pattern spacing in the circumferential direction of the roll in the transfer shape portion is greater than 0 mm and 10 mm or less, and the variation in the height of the transfer shape portion with respect to the target height is 5% or less.
7. The roll-shaped master disc according to claim 6, wherein the transfer shape portion and the roll substrate are made of the same metal.
8. The roll-shaped master disc according to claim 6, wherein the metal constituting the transfer shape portion and the roll substrate is aluminum, copper, nickel, or chromium.