electronic machinery

Abstract

To provide electronic equipment that can efficiently cool electronic modules. [Solution] The electronic device comprises a housing having vertical walls with ventilation holes formed therein, a circuit board provided inside the housing and on which a connector is mounted, a card-type electronic module connected to the connector, and a sheet metal part that holds the electronic module, wherein the sheet metal part has a support portion supported by the circuit board or the housing, a pressing portion that is thermally connected to the electronic module and holds the electronic module, and a heat dissipation portion that extends from the pressing portion and is provided with a plurality of fins that are arranged facing the ventilation holes.

Description

Technical Field

[0001] The present invention relates to an electronic device.

Background Art

[0002] In an electronic device such as a tablet PC or a notebook PC, a connector is mounted on a substrate on which a CPU or the like is mounted, and an electronic module such as an SSD is connected to the connector (see, for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Since the heat generation amount of the above-described electronic module increases with an increase in capacity and speed, efficient cooling is required. However, there is a strong demand for thinning of the housing of the electronic device. For this reason, in this type of electronic device, it may be difficult to use a thermal module for cooling the CPU or the like for cooling the electronic module.

[0005] The present invention has been made in consideration of the above problems of the prior art, and an object thereof is to provide an electronic device capable of efficiently cooling an electronic module.

Means for Solving the Problems

[0006] An electronic device according to one aspect of the present invention comprises a housing having a vertical wall with a ventilation opening formed therein, a circuit board provided inside the housing and on which a connector is mounted, a card-type electronic module connected to the connector, and a sheet metal part that holds the electronic module, wherein the sheet metal part has a support portion supported by the circuit board or the housing, a pressing portion that is thermally connected to the electronic module and holds the electronic module, and a heat dissipation portion that extends from the pressing portion and is provided with a plurality of fins that are arranged facing the ventilation opening. [Effects of the Invention]

[0007] According to the above embodiment of the present invention, the electronic module can be cooled efficiently. [Brief explanation of the drawing]

[0008] [Figure 1] Figure 1 is a schematic plan view of an electronic device according to one embodiment. [Figure 2] Figure 2 is a schematic plan view showing the internal structure of the electronic device shown in Figure 1. [Figure 3A] Figure 3A is a schematic exploded perspective view of the electronic module and sheet metal components. [Figure 3B] Figure 3B is a perspective view of the electronic module shown in Figure 3A, held in place by sheet metal parts. [Figure 4] Figure 4 is a schematic perspective cross-sectional view of the housing around the electronic module. [Figure 5] Figure 5 is a schematic side cross-sectional view of the electronic module and the electronic equipment surrounding it. [Modes for carrying out the invention]

[0009] Hereinafter, preferred embodiments of the electronic device according to the present invention will be described in detail with reference to the attached drawings.

[0010] Figure 1 is a schematic plan view of an electronic device 10 according to one embodiment. Figure 2 is a schematic plan view showing the internal structure of the electronic device 10 shown in Figure 1. In this embodiment, a tablet PC (tablet terminal) is used as an example of the electronic device 10. The electronic device 10 may be other than a tablet PC, for example, a desktop PC, a notebook PC, a smartphone, a mobile phone, or an electronic organizer.

[0011] As shown in Figures 1 and 2, the electronic device 10 comprises a housing 12 and a display 14. The housing 12 has, for example, a rectangular parallelepiped shape. Hereinafter, the housing 12 and each component mounted thereon will be described by referring to the longitudinal direction of the housing 12 as the X direction, the short direction as the Y direction, and the thickness direction as the Z direction. The X direction may also be divided into left and right and referred to as the X1 and X2 directions, and similarly the Y and Z directions may be referred to as the Y1, Y2, Z1, and Z2 directions. These directions are defined for the convenience of explanation and may naturally change depending on the usage state or installation orientation of the electronic device 10.

[0012] The housing 12 is a flat box-shaped body. Various electronic and mechanical components are housed in the internal space of the housing 12. The housing 12 has a housing member 16 that covers the electronic device 10 from the back to the outer peripheral side. The housing member 16 may consist of a cover plate 16A and vertical walls 16B. The cover plate 16A is a plate-shaped member that forms the back of the electronic device 10. The vertical walls 16B are side wall members that rise in the Z1 direction from the outer peripheral edge of the cover plate 16A. The vertical walls 16B may be integrally molded with the cover plate 16A. The vertical walls 16B may be formed separately from the cover plate 16A and configured to be detachable from each other. The housing member 16 can be made of, for example, a thin sheet of resin or metal.

[0013] The front surface (Z1 side) of the housing member 16 is open. The display 14 is supported by the upper end (Z1 side end) of the vertical wall 16B, closing the front opening of the housing member 16. The display 14 can be made of, for example, a touch-operable organic EL display panel or a liquid crystal display panel. The display 14 may be surrounded by a bezel member 18. The housing member 16 may, for example, have a frame member directly below the display 14 to support a substrate 20, etc., which will be described later, and a cover plate 16A may be detachably attached to this frame member.

[0014] As shown in Figure 2, the housing 12 houses, for example, a circuit board 20, a thermal module 22, an electronic module 24 and sheet metal parts 25, and a battery device 26. The battery device 26 is a rechargeable battery that powers the electronic device 10. The housing 12 may also house various other electronic components such as memory, an antenna, and a speaker.

[0015] The circuit board 20 is a printed circuit board that serves as the motherboard for the electronic device 10. The circuit board 20 is positioned, for example, near the center of the enclosure 12 and fixed to the inner surface of the cover plate 16A. The circuit board 20 has a CPU (Central Processing Unit) 28 and a connector 30 mounted on it. The CPU 28 is an arithmetic processing unit that performs calculations related to the main control and processing of the electronic device 10. The connector 30 conforms to a predetermined connection standard, such as the M.2 standard. An electronic module 24 is connected to the connector 30. Various electronic components such as an arithmetic processing unit (GPU), memory, and communication modules are further mounted on the circuit board 20. For example, the Z1 side surface of the circuit board 20 is the mounting surface 20a for the CPU 28 and connector 30. Needless to say, the shape, arrangement, and mounted components of the circuit board 20 are not limited to those described above.

[0016] The thermal module 22 can absorb the heat generated by the CPU 28 and dissipate it outside the chassis 12. The thermal module 22 may also include a metal plate 32, a heat pipe 33, a heat sink 34, and a fan 35.

[0017] The metal plate 32 is a thin plate-shaped member made of a metal with high thermal conductivity such as copper or aluminum. The metal plate 32 of this embodiment is a copper plate. The metal plate 32 may be composed of a plate-shaped member (vapor chamber) in which a working fluid is enclosed in a sealed space formed between two metal plates. The metal plate 32 is installed so as to cover a part of the mounting surface 20a of the substrate 20 from the Z1 side together with the CPU 28. Thereby, the metal plate 32 can absorb and diffuse the heat generated by the CPU 28 and its peripheral components.

[0018] The heat pipe 33 is a pipe-type heat transport member. The heat pipe 33 is formed, for example, by flattening a copper pipe thinly into an elliptical cross-sectional shape and enclosing a working fluid in the inner sealed space. The heat pipe 33 is thermally connected to the CPU 28 via the metal plate 32 at one end and thermally connected to the heat sink 34 at the other end, for example. Thereby, the heat pipe 33 can transport the heat of the CPU 28 to the heat sink 34 with high efficiency.

[0019] The heat sink 34 has a structure in which thin metal fins made of, for example, copper or aluminum are arranged at equal intervals in the Y direction. Each fin stands in the Z direction and extends in the X direction. A gap through which air discharged from the fan 35 passes is formed between adjacent fins.

[0020] The fan 35 has a fan housing 35a, a suction port 35b, and a discharge port 35c. The suction port 35b is an opening formed on one or both surfaces in the thickness direction (Z direction) of the fan housing 35a. The discharge port 35c is an opening formed on the side surface of the fan housing 35a. The heat sink 34 faces the discharge port 35c in proximity. The fan 35 can be composed of a centrifugal fan that rotates an impeller housed inside the fan housing 35a by a motor. The fan 35 can discharge the air sucked from the suction port 35b from the discharge port 35c.

[0021] Vent holes 38 and 39 may be formed on the side surface of the housing 12. The vent holes 38 and 39 are formed, for example, in the left and right vertical walls 16B extending in the Y direction, respectively. The vent holes 38 and 39 can be formed by a plurality of small window-shaped openings arranged along the longitudinal direction of the vertical wall 16B (see also FIG. 4). The vent hole 38 on the X1 side faces the discharge port 35c of the fan 35 with the heat sink 34 interposed therebetween. Thus, the vent hole 38 functions as an exhaust port for discharging the air discharged from the fan 35 to the outside of the housing 12. The vent hole 39 on the X2 side functions as an intake port for introducing the air outside the housing 12 into the housing 12. The outside air introduced through the vent hole 39 is introduced from the intake port 35b into the fan housing 35a. The arrow indicated by the dashed line in FIG. 2 schematically shows the air flow.

[0022] In such a thermal module 22, the heat of the CPU 28 is diffused by the metal plate 32 and transported to the heat sink 34 by the heat pipe 33. The fan 35 takes in the outside air through the vent hole 39 into the intake port 35b and discharges it from the discharge port 35c. This air cools the heat sink 34 while passing through it and is discharged to the outside of the housing 12 through the vent hole 38.

[0023] Next, the configuration of the electronic module 24 and the sheet metal parts 25 and their peripheral parts will be described.

[0024] FIG. 3A is a schematic exploded perspective view of the electronic module 24 and the sheet metal parts 25. FIG. 3B is a perspective view of the state in which the electronic module 24 shown in FIG. 3A is pressed by the sheet metal parts 25. FIG. 4 is a schematic perspective cross-sectional view of the housing 12 at the electronic module 24 and its peripheral parts. FIG. 5 is a schematic side cross-sectional view of the electronic device 10 at the electronic module 24 and its peripheral parts.

[0025] The electronic module 24 is a card-type module component that can be connected to a connector 30 compliant with the M.2 standard, for example. The electronic module 24 is, for example, a storage device. In this embodiment, the electronic module 24 is an SSD (Solid State Drive). The connection standard of the connector 30 may be other standards. The electronic module 24 may also be, for example, a communication module compatible with WWAN (Wireless Wide Area Network). As shown in Figures 2 and 4, the electronic module 24 is positioned, for example, near the vertical wall 16B on the X2 side in the X direction, with its longitudinal direction aligned with the Y direction. The arrangement and orientation of the electronic module 24 may, of course, be other than those shown.

[0026] As shown in Figures 3A to 4, the electronic module 24 comprises a module substrate 24a and a semiconductor chip 24b mounted on the module substrate 24a. The module substrate 24a is a printed circuit board. The module substrate 24a has a connection terminal for the connector 30 at one end (the Y2 side end). In the case of an SSD electronic module 24, the semiconductor chip 24b can be exemplified by a controller, NAND flash memory, and DRAM (Dynamic Random Access Memory).

[0027] As shown in Figures 2 to 5, the sheet metal part 25 is a component that holds the electronic module 24 in place against the substrate 20 and housing member 16. The sheet metal part 25 also serves to cool the electronic module 24.

[0028] The sheet metal part 25 is preferably made of a metal with high thermal conductivity, such as copper or aluminum. In this embodiment, the sheet metal part 25 is made of copper. The sheet metal part 25 can be integrally formed, for example, by bending a punched part made of a thin copper plate. The fins 46b, which will be described later, can be formed by joining them to this punched part by soldering or the like. Of course, other methods are also acceptable for forming the sheet metal part 25.

[0029] The sheet metal part 25 is extremely thin, for example, about 0.1 mm to 0.4 mm thick. In this embodiment, the sheet metal part 25, for example, the support part 40, the pressing part 42, the elastic support part 44, the extension part 46a, and the fin 46b, which will be described later, all have a thickness of 0.2 mm. The metal plate 32 that constitutes the thermal module 22 has a thickness of about 0.8 mm to 1.2 mm. In other words, the sheet metal part 25 is significantly thinner than the metal plate 32.

[0030] The sheet metal part 25 may have a pair of support parts 40, 40, a pressing part 42, a pair of elastic support parts 44, 44, and a heat dissipation part 46.

[0031] The support portion 40 is a part for fixing the sheet metal part 25 to the housing 12 (housing member 16). The support portion 40 is formed, for example, by a tongue-shaped plate piece protruding from the center of a semicircular ring-shaped elastic support portion 44 toward the pressing portion 42. The pair of support portions 40, 40 are provided so as to straddle the electronic module 24 in the longitudinal direction (Y direction) and face each other. One of the pair of support portions 40 may be fixed to the substrate 20 and the other to the inner surface of the cover plate 16A. One or more support portions 40 may be provided.

[0032] The support portion 40 may be fastened to the housing member 16 or the substrate 20 fixed to the housing member 16 with a screw 40a (see Figure 2). The support portion 40 has a hole 40b for inserting the screw 40a. The screw 40a is not shown in Figures 3A to 4. A stud portion (boss portion) for tightening the screw 40a may be provided on the inner surface of the cover plate 16A or the mounting surface 20a of the substrate 20. The stud portion is a cylindrical member with a screw hole into which the screw 40a can be tightened. For example, one of the pair of support portions 40, 40 may be configured as a claw portion that can engage with and disengage from a hook formed on the substrate 20 or the cover plate 16A.

[0033] The retaining portion 42 is a plate portion that holds the electronic module 24 from above (Z1 side). The retaining portion 42 is thermally connected to the electronic module 24 and also acts as a heat-absorbing portion that absorbs the heat generated by the electronic module 24. In plan view, the retaining portion 42 has an outer shape that is the same as or slightly smaller than the electronic module 24. The retaining portion 42 may have an outer shape that is larger than the electronic module 24. As shown in Figures 2 to 4, the retaining portion 42 is preferably positioned between a pair of support portions 40, 40. This allows the sheet metal part 25 to hold the electronic module 24 more stably.

[0034] It is preferable to sandwich a heat conductive member 48 between the pressing portion 42 and the surface of the electronic module 24 (see Figures 4 and 5). The heat conductive member 48 can be formed from a material called TIM (Thermal Interface Material), for example. The heat conductive member 48 is a sheet-like or pad-like material in which a heat conductive filler is filled into a resin such as silicone or epoxy, and has high thermal conductivity.

[0035] The elastic support portion 44 is provided between each support portion 40 and the pressing portion 42, and elastically supports the pressing portion 42 relative to the support portion 40 in the Z direction. The elastic support portion 44 has, for example, a narrow semicircular ring shape. The elastic support portion 44 supports the pressing portion 42 so that it can be elastically displaced in the Z direction relative to the support portion 40 which is fixed to the substrate 20 (housing member 16). This allows the pressing portion 42 to easily adapt to differences in thickness due to the type and individual differences of the electronic module 24 and the heat conductive member 48. Furthermore, the pressing portion 42 is pressed against the electronic module 24 by the elastic support portion 44. As a result, the sheet metal part 25 has improved holding stability of the electronic module 24 and improved heat absorption efficiency from the electronic module 24.

[0036] The heat dissipation section 46 is a part for efficiently dissipating the heat absorbed by the pressing section 42 from the electronic module 24. The heat dissipation section 46 may have an extension section 46a and a plurality of fins 46b.

[0037] The heat dissipation section 46 of this embodiment can dissipate heat from the electronic module 24 while dissipating it to the vent 39 located close to the electronic module 24. The extension section 46a is an extension plate for positioning the fins 46b opposite the vent 39. The extension section 46A protrudes approximately in the X2 direction from the X2 side edge of the retaining section 42 facing the vent 39. More specifically, in the plan view shown in Figure 2, the extension section 46a extends from the retaining section 42 toward the vent 39 toward the X2 side while inclined toward the Y1 side. Needless to say, the shape of the extension section 46a is not limited to the shape shown in Figure 2, etc., and may, for example, extend in a straight line.

[0038] A bent piece 46c may be provided on one or both edges of the extension 46a in the width direction. The bent piece 46c is a plate piece formed by bending the edge of the extension 46a toward the Z2 side. The thickness of the extension 46a is extremely thin, for example, 0.2 mm. The bent piece 46c increases the rigidity of the extension 46a. Depending on the length and shape of the extension 46a, the bent piece 46c may be omitted.

[0039] Furthermore, the pressing portion 42 may also be provided with a bending piece 42a similar to the bending piece 46c (see Figures 4 and 5). The bending piece 42a is a plate piece in which the edge opposite to the extension portion 46a side in the width direction (X direction) of the pressing portion 42 is bent toward the X2 side. The bending piece 42a increases the rigidity of the pressing portion 42.

[0040] Each fin 46b has a structure in which thin copper fins are arranged at equal intervals in the Y direction. Each fin 46b may be formed from a copper plate of the same thickness as other parts of the sheet metal part 25, such as the retaining portion 42 or the extension portion 46a. Each fin 46b rises in the Z2 direction from the Z2 side surface of the extension portion 46a, for example, and extends in the X direction. Gaps are formed between adjacent fins 46b, 46b. As a result, the surface area of ​​the heat dissipation portion 46 is increased, promoting heat dissipation from the fins 46b, and also allowing outside air that has passed through the vents 39 to come into contact with each fin 46b.

[0041] As shown in Figure 5, in the electronic device 10 of this embodiment, the height h1 of the vertical wall 16B is, for example, 8 mm, and the height h2 of the internal space of the housing 12 is, for example, 5.4 mm. The height of the inner wall surface 16B1 of the vertical wall 16B is the same as the height h2. On the other hand, the height h3 of the ventilation opening 39 is, for example, 3.5 mm. Therefore, the inner wall surface 16B1 can only secure a margin of, for example, about 0.9 mm above and below the ventilation opening 39. For this reason, it is difficult to attach a mesh member or the like to the inner wall surface 16B1 to prevent foreign matter such as dust from entering from the ventilation opening 39.

[0042] The thickness t1 of the electronic module 24 is, for example, 2.4 mm, and the thickness t2 of the electronic module 24 including the heat conductive member 48 is, for example, 3.2 mm. In other words, the thickness of the heat conductive member 48 is, for example, 0.8 mm. In the sheet metal part 25, the plate thickness t3 of the retaining portion 42 and the extension portion 46a is, for example, 0.2 mm, and the height h4 of the fin 46b is, for example, 3.7 mm.

[0043] Thus, the electronic device 10 has an extremely thin housing 12, and the thickness of the components housed inside is also thin. For this reason, the electronic device 10 has a structure that makes it difficult to cool the electronic module 24 with the thermal module 22 due to space constraints within the housing 12.

[0044] Therefore, in the electronic device 10 of this embodiment, the sheet metal part 25 that holds the electronic module 24 includes a heat dissipation part 46 together with the support part 40 and the holding part 42. The heat dissipation part 46 has a plurality of fins 46b that extend from the holding part 42 and are arranged facing the ventilation opening 39.

[0045] Therefore, the electronic device 10 can use the sheet metal part 25 for holding the electronic module 24 for cooling the electronic module 24 as well. That is, the sheet metal part 25 can dissipate the heat received by the retaining part 42, which is thermally connected to the electronic module 24, through the heat dissipation part 46. When the fan 35 is stopped or when the electronic device 10 is configured without a fan 35, the heat dissipation part 46 can passively dissipate the heat from the electronic module 24 from the fins 46b to the vents 39. When the fan 35 is running, the heat dissipation part 46 can actively dissipate the heat from the electronic module 24 through the vents 39 using outside air flowing around the fins 46b.

[0046] Furthermore, the fins 46b are positioned facing the ventilation opening 39. As a result, the fins 46b also function as a protective barrier to prevent dust and other foreign matter from entering the housing 12 through the ventilation opening 39. As described above, the height h1 of the vertical wall 16B of the electronic device 10 is very low. Therefore, it is difficult to install a mesh member or the like on the inner wall surface 16B1 of the vertical wall 16B to prevent foreign matter from entering through the ventilation opening 39. In this respect, the electronic device 10 can use the heat dissipation fins 46b as a substitute for a mesh member. As a result, the electronic device 10 can reduce the number of parts, and manufacturing costs such as parts costs and assembly work can also be reduced. In particular, the electronic device 10 of this embodiment is equipped with a fan 35. As a result, by positioning the fins 46b facing the ventilation opening 39, which is an air intake, the electronic device 10 can suppress dust from entering the housing 12 and also suppress malfunctions of the fan 35.

[0047] The fins 46b are integrally formed with the sheet metal part 25 that holds the electronic module 24 in place. Therefore, even if dust accumulates on the fins 46b, it can be easily cleaned by simply removing the sheet metal part 25, resulting in high maintainability.

[0048] As shown in Figure 5, the distance L between the fin 46b and the vent 39 is not particularly limited as long as it is a distance that can prevent foreign matter from entering through the vent 39. The distance L may be zero or negative, for example, meaning that a part of the fin 46b may be inserted into the vent 39. However, it is preferable that the distance L be a few millimeters, specifically about 5 mm to 10 mm. This improves the workability when assembling the sheet metal part 25. It also makes it easier to remove the sheet metal part 25 during maintenance or when replacing the SSD.

[0049] Preferably, a pair of support parts 40 are provided so as to straddle the electronic module 24 in the longitudinal direction. The retaining part 42 is preferably positioned between the pair of support parts 40, 40. The heat dissipation part 46 is preferably projected from the retaining part 42 in a direction intersecting the longitudinal direction of the electronic module 24. This improves the installation stability of the retaining part 42 and the heat dissipation part 46.

[0050] The electronic device 10 may include a CPU 28, which is a processing unit mounted on a circuit board 20, and a metal plate 32 for absorbing and dissipating heat from the CPU 28. In this case, it is preferable that the thickness of the retaining portion 42 is thinner than the thickness of the metal plate 32. That is, the sheet metal part 25 is not intended to cool the CPU 28, which generates an extremely large amount of heat like the metal plate 32. Therefore, if the sheet metal part 25, including the retaining portion 42, is made of sheet metal thinner than the metal plate 32, it becomes less likely to cause problems with installation space within the thin housing 12.

[0051] The enclosure 12 may have another vent 38 formed in a different location from the vent 39 in the vertical wall 16B. The discharge port 35c of the fan 35 and the heatsink 34 are preferably positioned opposite each other in the vent 38. A heat pipe 33, which is a heat transport member that transports the heat from the CPU 28 and other components received by the metal plate 32, may be connected to the heatsink 34. In this case, the vent 38 becomes an exhaust port, and the vent 39 becomes an intake port into the enclosure 12. Therefore, the fins 46b can effectively suppress the intrusion of foreign matter from the intake port 39. Note that the heat generated by the electronic module 24 is sufficiently small compared to the heat generated by the CPU 28 and other components that the metal plate 32 cools. Therefore, even if the fins 46b are installed in the vent 39, the ambient temperature introduced into the enclosure 12 will not become excessively high.

[0052] The electronic device 10 described above is an example of a tablet PC in the shape of a single sheet of metal. The electronic device 10 may also be configured such that two or more housings are connected so as to be rotatable relative to each other. In this configuration, the display 14 may be a dual display type mounted individually on each housing, or a flexible display type extending across each housing. In such an electronic device, for example, an electronic module 24 may be housed in a predetermined housing, and sheet metal parts 25 can be attached to this electronic module 24 for cooling.

[0053] It should be noted that the present invention is not limited to the embodiments described above, and can be freely modified without departing from the spirit of the invention. [Explanation of Symbols]

[0054] 10 Electronic equipment 12 cabinets 14 displays 16 Housing components 16B Standing wall 20 circuit boards 22 Thermal Modules 24 Electronic Modules 25 Sheet metal parts 28 CPU 30 connectors 32 Metal Plates 35 Fans 38,39 Ventilation holes 40 Support part 42 Pressing part 44 Elastic support section 46 Heat radiation part 46a Extension 46b Fin

Claims

1. It is an electronic device, A housing having vertical walls with ventilation openings formed there A circuit board is provided inside the aforementioned housing and has a connector mounted on it, A card-shaped electronic module connected to the aforementioned connector, A sheet metal part that holds the aforementioned electronic module, Equipped with, The aforementioned sheet metal part is A support portion supported by the aforementioned substrate or housing, A pressing portion that is thermally connected to the aforementioned electronic module and holds the aforementioned electronic module in place, A heat dissipation section is provided with a plurality of fins that extend from the aforementioned retaining portion and are arranged facing the aforementioned vent, has An electronic device characterized by the following features.

2. The electronic device according to claim 1, The sheet metal part has an elastic support portion provided between the support portion and the pressing portion, which elastically supports the pressing portion relative to the support portion. An electronic device characterized by the following features.

3. The electronic device according to claim 1 or 2, The support portions are provided in pairs so as to straddle the electronic module in the longitudinal direction between them. The pressing portion is positioned between the pair of support portions. The heat dissipation portion protrudes from the retaining portion in a direction intersecting the longitudinal direction of the electronic module. An electronic device characterized by the following features.

4. The electronic device according to claim 1 or 2, The arithmetic processing unit mounted on the aforementioned substrate, A metal plate is provided together with the arithmetic processing unit so as to cover a part of the substrate, and is capable of absorbing and dissipating heat from the arithmetic processing unit, Equipped with, The thickness of the pressing portion is thinner than the thickness of the metal plate. An electronic device characterized by the following features.

5. The electronic device according to claim 4, The aforementioned vertical wall has a second ventilation opening formed at a different location from the aforementioned ventilation opening. The electronic device further, A fan with an outlet positioned facing the second ventilation opening, A heat sink is disposed between the discharge port of the aforementioned fan and the second ventilation port, A heat transport member that thermally connects the metal plate and the heat sink, Equipped with, The aforementioned vent is an air intake that allows air to be introduced into the housing. An electronic device characterized by the following features.

Images