Determination device, determination method, and lithography device

Abstract

To provide a judgment device that is advantageous in terms of throughput. [Solution] The device comprises a substrate holding unit for holding a substrate, a detection unit for detecting the surface position of the substrate held by the substrate holding unit, an imaging unit for photographing a first position on the substrate holding unit, and a determination unit for determining whether there is an abnormality in the first position based on the results of the imaging unit, wherein the first position is a position based on the detection result of the detection unit.

Description

Technical Field

[0001] The present invention relates to a determination device, a determination method, and a lithography device.

Background Art

[0002] In the manufacturing process of semiconductor devices, liquid crystal display devices, etc., a method for determining abnormalities caused by foreign matter or the like may be used. Patent Document 1 discloses a method for detecting an abnormality caused by foreign matter by detecting the surface position of a substrate held by a substrate holding unit.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, only based on the detection result of the surface position of the substrate, unnecessary foreign matter removal work may be carried out, resulting in a decrease in throughput.

[0005] Therefore, an object of the present invention is to provide a determination device that is advantageous in terms of throughput.

Means for Solving the Problems

[0006] In order to achieve the above object, a determination device according to one aspect of the present invention includes a substrate holding unit that holds a substrate, a detection unit that detects the surface position of the substrate held by the substrate holding unit, an imaging unit that images a first position on the substrate holding unit, and a determination unit that determines an abnormality at the first position based on the result imaged by the imaging unit, wherein the first position is a position based on the detection result of the detection unit.

[0007] Further objects or other aspects of the present invention will be revealed by embodiments described below with reference to the drawings. [Effects of the Invention]

[0008] According to the present invention, a determination device that is advantageous in terms of throughput can be provided. [Brief explanation of the drawing]

[0009] [Figure 1] This is a schematic diagram showing the configuration of the substrate processing apparatus in the first embodiment. [Figure 2] This diagram shows a flowchart of the determination method in the first embodiment. [Figure 3] This figure shows the color difference information and template data obtained from the results of imaging captured using an off-axis alignment scope. [Figure 4] This is an example where the result of the photograph is brightness information. [Figure 5] This figure shows a flowchart of the method for manufacturing an article in the second embodiment. [Modes for carrying out the invention]

[0010] Embodiments of the present invention will be described below with reference to the drawings. Note that the following embodiments do not limit the invention as defined in the claims. While multiple features are described in the embodiments, not all of these features are necessarily essential to the invention, and the embodiments may be combined in any way. Furthermore, in the drawings, identical or similar configurations are given the same reference numerals, and redundant descriptions are omitted.

[0011] Furthermore, in this specification and its drawings, directions are generally indicated using an XYZ coordinate system in which the vertical direction is the Z-axis direction and the horizontal plane perpendicular to the vertical direction is the XY plane, with each axis being orthogonal to the others. However, if an XYZ coordinate system is indicated in a drawing, that coordinate system takes precedence.

[0012] The specific configurations for each embodiment will be described below.

[0013] <First Embodiment> Figure 1 is a schematic diagram showing the configuration of the substrate processing apparatus 1 in this embodiment. In this embodiment, the substrate processing apparatus 1 is a projection exposure apparatus that exposes the pattern of the master plate (mask, reticle) onto the substrate via a projection optical system using a step-and-repeat method or a step-and-scan method.

[0014] The substrate processing apparatus 1 includes an illumination optical system 2 for irradiating light, a projection optical system 3, a reticle stage 4a for holding a reticle 4, a substrate chuck (substrate holding unit) 6 for holding a substrate 5, a stage 7 on which the substrate chuck 6 is mounted and which is movable in the XY direction, and a control unit 8. The substrate processing apparatus 1 further includes a focus sensor (detection unit) 9 for detecting the surface position of the substrate 5 held by the substrate chuck 6, and an off-axis alignment scope (imaging unit) 10 for detecting (imaging) alignment marks on the substrate 5.

[0015] The reticle 4 is, for example, a master plate on which the pattern to be transferred (e.g., a circuit pattern) is formed with chromium on the surface of a quartz glass. The substrate 5 is, for example, single-crystal silicon, and when the substrate processing apparatus 1 is an exposure apparatus, the substrate 5 transported to the substrate processing apparatus 1 has a photosensitive material (resist) coated on its surface. The control unit 8 controls each part of the substrate processing apparatus 1.

[0016] In the substrate processing apparatus 1, exposure light from a light source (not shown) illuminates the reticle 4 held on the reticle stage 4a via the illumination optical system 2. The light transmitted through the reticle 4 is irradiated onto the substrate 5 via the projection optical system 3. At this time, the light from the pattern formed on the reticle 4 is imaged onto the surface of the substrate 5, and the shot areas of the substrate 5 (photosensitive material on the substrate 5) are exposed by the pattern image. The substrate processing apparatus 1 exposes the shot areas on the substrate 5 in this manner, and similarly exposes each of the multiple shot areas.

[0017] During exposure, the control unit 8 controls the stage 7 to adjust the height of the substrate 5 (photosensitive material on the substrate 5) so that the image plane of the projection optical system 3 and the substrate 5 are at the same height. Specifically, the control unit 8 controls the stage 7 based on the result of detecting the surface position of the substrate 5 by the focus sensor 9. The focus sensor 9 includes a light-emitting unit and a light-receiving unit. Light obliquely incident from the light-emitting unit onto the substrate 5 is reflected by the substrate 5, and the sensor in the light-receiving unit detects this reflected light to detect the surface position (surface height) of the substrate 5.

[0018] Furthermore, during exposure, the control unit 8 controls the stage 7 to adjust the position of the substrate 5 in the XY plane. This control is performed based on the results of detecting (imaging) alignment marks on the substrate 5 using the off-axis alignment scope 10.

[0019] The control unit 8 includes a processing unit, a bus, a ROM, a RAM, and a storage device, and each component functions according to a program. The program includes a program for causing a computer to execute the determination method described later. The processing unit is a processing device that performs calculations for control according to a program and controls each component connected to the bus. This processing unit can be constituted by a CPU, a PLD such as an FPGA, an ASIC, a computer in which a program is incorporated, or a combination of all or part of these. The ROM is a memory dedicated to data reading, and stores programs and data. The RAM is a memory for data reading and writing, and is used for storing programs and data. The RAM is used for temporarily storing data such as the results of calculations by the CPU. The storage device is also used for storing programs and data. The storage device is also used as a temporary storage area for the operating system (OS) program and data of the control unit 8. Although the input / output of data is slower than that of the RAM, the storage device can store a large amount of data. It is desirable that the storage device be a non-volatile storage device that can store the data to be stored as permanent data so that the stored data can be referenced over a long period of time. The storage device is mainly constituted by a magnetic storage device (HDD), but may be a device that loads an external medium such as a CD, a DVD, or a memory card to read and write data.

[0020] Here, in the present embodiment, the control unit 8 is a determination unit (determination device) that determines the abnormality described later. Note that the control unit 8 may be configured integrally with other parts of the substrate processing apparatus 1 (in a common housing), or may be configured separately from other parts of the substrate processing apparatus 1 (in a separate housing).

[0021] The substrate processing apparatus 1 further has an input unit and a display unit (not shown). The input unit is a device for inputting characters and data into the substrate processing apparatus 1, and various keyboards, mice, touch panels, etc. are applicable. The display unit is a device for displaying information necessary for the operation of the substrate processing apparatus 1, processing results, etc., and a CRT or a liquid crystal monitor, etc. are applicable. The communication unit (communication device) is connected to a network to perform data communication according to a communication protocol such as TCP / IP and is used when mutually communicating with other information processing apparatuses.Here, the input unit and the display unit may be outside the substrate processing apparatus 1. Also, the input device and the display unit may be a mobile communication terminal or the like.

[0022] Here, when foreign matter adheres to the substrate 5, an abnormality occurs in the result of detecting the surface position of the substrate by the focus sensor 9 during substrate processing. When the cause of the abnormality is foreign matter adhering to the substrate chuck 6, it is effective to perform an operation (cleaning) for removing the foreign matter on the substrate chuck 6.

[0023] However, there are cases where the type of abnormality cannot be correctly determined only from the detection result of the surface position of the substrate 5. When using an abnormality determination method based only on the detection result of the surface position of the substrate 5, there are cases where a foreign matter removal operation is performed even though the abnormality does not require a foreign matter removal operation. For example, when the cause of the abnormality in the detection result of the focus sensor 9 is a chip in the substrate chuck 6, performing a foreign matter removal operation will not eliminate the cause of the abnormality. Also, when the substrate 5 is removed from the substrate chuck 6 and carried out, there are cases where the foreign matter that was the cause of the abnormality remains attached to the carried-out substrate 5 and is removed, but in such cases as well, a foreign matter removal operation is unnecessary. Therefore, when determining an abnormality based only on the detection result of the focus sensor 9, it is impossible to distinguish between cases where the above-described foreign matter removal operation is unnecessary and cases where a foreign matter removal operation is necessary, and in some cases, an unnecessary foreign matter removal operation is performed. By performing such an unnecessary foreign matter removal operation, the throughput decreases. [[ID=拾]]

[0024] Therefore, in this embodiment, the first position on the substrate holding part, determined based on the detection result of the substrate surface position by the focus sensor 9, is photographed by the off-axis alignment scope 10, and the control unit 8 determines whether there is an abnormality at the first position based on the photographed result. This makes it possible to determine whether there is an abnormality in the substrate chuck 6 when the substrate 5 is removed from the substrate chuck 6 using the off-axis alignment scope 10. Although it is also conceivable to inspect the entire surface of the substrate chuck 6 with the off-axis alignment scope 10, the photographable area of ​​the off-axis alignment scope 10 is very small, so it would take a very long time to photograph the entire substrate chuck 6. In this embodiment, the position where an abnormality may occur on the substrate chuck 6 is estimated in advance by the focus sensor 9, and the off-axis alignment scope 10 takes a photograph of that position. Therefore, this embodiment is advantageous compared to the case in which an abnormality is determined using the off-axis alignment scope 10 alone. Furthermore, since the detection of the surface position of the substrate 5 by the focus sensor 9 is always performed during the exposure process, this embodiment utilizes this detection result and eliminates the need for separate detection by the focus sensor 9 for determining abnormalities, which is advantageous in terms of throughput.

[0025] Figure 2 is a flowchart of the determination method in this embodiment. First, a detection step and an exposure step are performed (S101). In the detection step, the stage 7 is moved in the XY plane direction while the focus sensor 9 detects the surface position of the substrate 5 held in the substrate chuck 6. Then, based on the detection result of the focus sensor 9, the height position of the stage 7 is adjusted sequentially, and exposure is performed on the position on the substrate 5 whose height position has been adjusted. This detection step and exposure step may be performed in parallel. For example, the focus sensor 9 first detects the surface position of position A (the position to be detected) on the substrate 5, and based on the detection result, the height position of the substrate 5 is adjusted for position A. Then, while the focus sensor 9 is detecting the surface position of position B (the position to be detected) on the substrate 5, exposure is performed on position A (the position to be exposed). Note that the focus sensor 9 may also detect the amount of tilt of the substrate 5 in addition to detecting the height position of the substrate 5, and the control unit 8 may control the height position and tilt of the substrate 5 based on the detection result of the focus sensor 9 during exposure.

[0026] After exposure of the substrate 5 is complete, the substrate 5, which was held in the substrate chuck 6, is removed from the substrate chuck 6 (S102). Next, the control unit (determination unit) 8 determines whether or not there is an abnormality in the detection result of the focus sensor 9 acquired in step S101 (S103). This determination determines an abnormality, for example, if the detection result exceeds a predetermined threshold. If it is determined in step S103 that there is no abnormality, the process ends. If it is determined in step S103 that there is an abnormality, the control unit 8 identifies the location where the abnormality is presumed to be (S104). Specifically, it identifies the first location, which is the location on the substrate chuck 6 directly below the second location, that corresponds to the second location of the focus detection result on the substrate 5. This identified first location may be stored in the memory unit.

[0027] After identifying the position in step S104, the off-axis alignment scope 10 is used to take an image of the identified first position (imaging process, S105). Since the foreign object may move, the imaging range of the off-axis alignment scope 10 may be wider than the identified position. The imaging method at this time will be described in detail later.

[0028] Next, the control unit 8 determines whether there is an abnormality at the first position on the substrate chuck 6 identified in step S105 based on the results captured (determination step, S106). The determination in step S106 determines not only whether there is an abnormality but also the type of abnormality. The type of abnormality is at least one of, for example, an abnormality caused by chipping of the substrate chuck 6 and an abnormality caused by foreign matter adhering to the substrate chuck 6. The determination method at this time will be described in detail later. The determination result in step S106 may be notified to the user (operator) by being displayed on the display unit. At this time, for example, the display control unit (not shown) controls the display unit so that the presence or absence of an abnormality, the type of abnormality, and the location on the substrate chuck 6 where the abnormality has occurred are displayed in correspondence. Alternatively, the display control unit (not shown) controls the display unit so that only the presence or absence of an abnormality and the type of abnormality are displayed. This display may be in a format in which the communication unit transmits the determination result to an external information processing device (terminal), and the determination result is displayed on the external information processing device (terminal). In addition, the determination result in step S106 may be notified to the user by light or sound.

[0029] If no abnormality is detected in step S106, the process terminates. If an abnormality is detected in step S106, the control unit 8 determines whether or not to perform maintenance (S107). For example, if the setting prioritizes processing boards up to a predetermined boundary board, the control unit 8 will determine not to perform maintenance unless the processing of boards up to the boundary board has been completed. A boundary board is, for example, a board processing unit such as one lot. Alternatively, maintenance may be performed at a timing determined by the user, rather than being automatically determined. Alternatively, the control unit 8 may determine whether or not to perform maintenance depending on the type of abnormality. For example, if the abnormality is caused by a foreign object, it may be determined that maintenance should be performed because it can be easily resolved, while maintenance that requires significant effort, such as replacing the board chuck 6, may be determined not to be performed. Alternatively, if the detection result of the focus sensor 9 or the image capture result of the off-axis alignment scope 10 indicates that the abnormality is minor and below a threshold (for example, if the size of the foreign object is small), the control unit 8 may determine not to perform maintenance.

[0030] If it is determined in step S107 that maintenance is not required, the process ends. If it is determined in step S107 that maintenance is required, the maintenance is performed (S108). This maintenance involves, for example, if the abnormality is caused by foreign matter, removing the foreign matter by blowing air onto the area with the abnormality or by rubbing a cleaning plate against the substrate chuck 6. If the abnormality is caused by a chip in the substrate chuck 6, the substrate chuck 6 is replaced with a non-abnormal substrate chuck by a robot or operator that automatically replaces the substrate chuck 6. After the maintenance is performed, the off-axis alignment scope 10 may be used to take another image of the area in question to confirm whether the abnormality has been resolved. Furthermore, the determination method of this embodiment is also applicable when multiple abnormalities are detected in the detection results of the focus sensor 9. In this case, the off-axis alignment scope 10 takes an image of each area where an abnormality is presumed to have occurred, and the control unit 8 makes an abnormality determination for each area.

[0031] Next, we will explain imaging using the off-axis alignment scope 10. Imaging with the off-axis alignment scope 10 allows for selection between static imaging, performed with the stage 7 stationary, and scanning imaging, performed while the stage 7 is moving. Static imaging offers high accuracy in detecting anomalies, while scanning imaging reduces imaging time. These methods can be arbitrarily set by the user according to their purpose.

[0032] First, let's explain still imaging. First, stage 7 moves so that the identified first position is within the field of view of the off-axis alignment scope 10. At this time, it is preferable that stage 7 moves so that the first position is located near the center of the field of view of the off-axis alignment scope 10. Then, with stage 7 stationary, the off-axis alignment scope 10 images the area including the first position. If the first position is wide and exceeds the field of view, or if there are multiple first positions, the off-axis alignment scope 10 sequentially changes the target area for imaging and images each of them. The data obtained from this imaging includes, for example, at least one of the following: image information, RGB information obtained from the image information, luminance information obtained from the image information, and color difference information obtained from the image information. Color difference information includes information such as hue difference (difference between two colors), saturation difference (difference in vividness of colors), and brightness difference (difference in brightness). Figure 3 is a diagram showing the color difference information and template data obtained from the results of imaging by the off-axis alignment scope 10. Data 101 is color difference information obtained from the results of imaging captured by the off-axis alignment scope 10, and data 102 is template data. Comparing data 101 and data 102, it can be seen that the color difference information in the central part of data 101 is different from that of data 102. If this difference is greater than or equal to a threshold, it is determined that there is an abnormality in the area of ​​the image captured in data 101.

[0033] Next, scanning imaging will be explained. First, the stage 7 is moved to a predetermined position so that the area including the first position of the target is within the imaging field of the off-axis alignment scope 10. Then, the area including the first position is imaged using the off-axis alignment scope 10. The data obtained from this imaging includes at least one of the following: continuous image information or video information, RGB information obtained from image information or video information, luminance information obtained from image information or video information, or color difference information obtained from image information or video information. Color difference information includes information such as hue difference (difference between two colors), saturation difference (difference in vividness of colors), and brightness difference (difference in brightness). Figure 4 shows an example where the result of imaging is luminance information. The horizontal axis is the position of the object to be imaged, and the vertical axis is the luminance information. Data 201 shows the result of imaging, and data 202 shows the template data. Comparing the result of imaging with the template data, it can be seen that the luminance of some parts of data 201 is lower than that of data 202. If this difference exceeds a threshold, it is determined that there is an abnormality in the target location (position) of data 201.

[0034] Next, the determination by the control unit 8 will be explained. The control unit 8 determines whether there is an abnormality at the first position based on the information obtained from the off-axis alignment scope 10 (the result of the image capture). This determination is made by comparing the data with template data (reference data), which is data of a state without abnormalities, and if the difference is greater than or equal to a threshold, it is determined that there is an abnormality at the first position. Furthermore, the magnitude of the abnormality (for example, the amount of chipping in the substrate chuck 6, the size of the foreign object) can be determined from the magnitude of this difference. It is also possible to determine the type of abnormality based on the trend of the difference. For example, if the image capture result is brightness information, information regarding the trend of change in brightness information when chipping occurs in the substrate chuck 6 can be acquired in advance, and the control unit 8 determines the type of abnormality based on the information regarding the trend of change. Also, for example, the type of abnormality can be determined from image information or image capture information, and the type of foreign object can be determined by comparing the image of the chipping of the substrate chuck 6 or the image of foreign object attached to the substrate chuck 6 with the acquired image capture result. In this embodiment, the control unit 8 determined the type of abnormality, but the image capture result may be displayed on the display unit and the operator may determine the type of abnormality.

[0035] Furthermore, the template data may be updated using machine learning. The template data is updated, for example, based on the results of the image taken when the control unit 8 determines that there is no abnormality.

[0036] In this embodiment, an example in which the substrate processing apparatus 1 is a projection exposure apparatus has been described, but the substrate processing apparatus 1 is not limited to a projection exposure apparatus. For example, the substrate processing apparatus 1 may be a drawing apparatus that draws on a substrate using an electron beam or an ion beam to form a pattern on the substrate. Alternatively, the substrate processing apparatus 1 may be another lithography apparatus (substrate exposure apparatus), such as an imprint apparatus that forms a pattern on a substrate by shaping an imprint material on the substrate using a mold. Or, the substrate processing apparatus 1 may be other apparatus that processes substrates such as semiconductor wafers or glass plates, such as an ion implantation apparatus, a developing apparatus, an etching apparatus, a film deposition apparatus, an annealing apparatus, a sputtering apparatus, or a vapor deposition apparatus. Furthermore, the substrate processing apparatus 1 may be a planarization apparatus that planarizes a composition on a substrate using a flat plate.

[0037] <Second Embodiment> This embodiment relates to a method for manufacturing an article, characterized by manufacturing the article using the determination method described above.

[0038] Figure 5 is a flowchart showing the method of manufacturing an article in this embodiment. First, a detection step (S201) is performed to detect the surface position of a first substrate held in a substrate chuck 6. Next, an imaging step (S202) is performed to photograph the first position on the substrate chuck 6 determined based on the detection result of the detection step. Next, a determination step (S203) is performed to determine whether there is an abnormality in the first position based on the result of the imaging step. Next, a maintenance step (S204) is performed to perform maintenance based on the determination result of the determination step. After the maintenance step, a holding step (S205) is performed to hold a second substrate, different from the first substrate, in the substrate chuck 6. Then, a forming step (S206) is performed to form a pattern on the second substrate held in the holding step, and a processing step (S207) is performed to process the second substrate on which the pattern was formed in the forming step.

[0039] The products manufactured using this method include, for example, semiconductor IC elements, liquid crystal display elements, color filters, MEMS, and the like.

[0040] The formation process involves, for example, exposing a substrate (such as a silicon wafer or glass plate) coated with a photosensitive material to an exposure device (lithography device) to form a pattern on the substrate.

[0041] The processing steps include, for example, developing a patterned substrate (photosensitive material), etching and resist removal from the developed substrate, dicing, bonding, and packaging. This manufacturing method allows for the production of articles at a higher throughput than conventional methods.

[0042] The disclosures herein include the following determination devices, determination methods, and lithography devices.

[0043] (Item 1) A substrate holding section that holds the substrate, A detection unit for detecting the surface position of the substrate held in the substrate holding unit, A camera unit for photographing the first position on the substrate holding portion, The system includes a determination unit that determines whether there is an abnormality in the first position based on the results captured by the imaging unit, The first position is a position based on the detection result of the detection unit. A determination device characterized by the following features.

[0044] (Item 2) The determination device according to item 1, characterized in that the determination unit determines whether or not there is an abnormality in the first position.

[0045] (Item 3) The determination device according to item 1 or 2, characterized in that the determination unit determines the type of abnormality of the first position.

[0046] (Item 4) The determination device according to any one of items 1 to 3, characterized in that the detection result of the detection unit for determining the first position is the result of detecting the target position in parallel with an exposure process for a position different from the target position of the detection unit.

[0047] (Item 5) The system further comprises a movable stage on which the substrate holding portion is mounted, The determination device according to any one of items 1 to 4, characterized in that the imaging unit images the first position when the stage is stopped.

[0048] (Item 6) The system further comprises a movable stage on which the substrate holding portion is mounted, The determination device according to any one of items 1 to 4, characterized in that the imaging unit captures the first position when the stage is moving.

[0049] (Item 7) The determination device according to any one of items 1 to 6, characterized in that the captured result includes at least one of image information, video information, and information obtained from the image information or video information.

[0050] (Item 8) The determination device according to any one of items 1 to 7, characterized in that the imaging unit photographs alignment marks formed on the substrate.

[0051] (Item 9) A determination device according to any one of items 1 to 8, characterized in that maintenance is not performed even if an abnormality is determined based on the determination result of the determination unit or the settings related to maintenance.

[0052] (Item 10) A determination device according to any one of items 1 to 9, characterized in that it performs machine learning on the reference data used for determination in the determination unit.

[0053] (Item 11) The determination device according to item 3, characterized in that the type of abnormality is at least one of an abnormality caused by chipping of the substrate holding part and an abnormality caused by foreign matter adhering to the substrate holding part.

[0054] (Item 12) The determination device according to any one of items 1 to 11, further comprising a display control unit that controls the determination unit to display the determination result on a display unit.

[0055] (Item 13) The determination device according to any one of items 1 to 12, further comprising a communication unit that transmits the determination result determined by the determination unit to an external information processing device.

[0056] (Item 14) The determination device according to any one of items 1 to 13, characterized in that the first position is a position on the substrate holding part that corresponds to a second position on the substrate that is determined to be abnormal in the detection result of the detection part.

[0057] (Item 15) A determination device described in any one of items 1 to 14, A lithography apparatus characterized by having an illumination optical system for irradiating a substrate with light.

[0058] (Item 16) A detection step for detecting the surface position of the substrate held in the substrate holding section, A photographing step of photographing the first position on the substrate holding portion, The process includes a determination step of determining an abnormality in the first position based on the results of the aforementioned imaging step, The first position is a position based on the detection result in the detection step. A determination method characterized by the above.

[0059] (Item 17) The process further includes a removal step in which the substrate is removed from the substrate holding portion after the detection step, The determination method according to item 16, characterized in that the aforementioned imaging step is performed after the aforementioned removal step.

[0060] (Item 18) A program that causes a computer to execute the determination method described in item 16 or 17.

[0061] (Item 19) A detection step for detecting the surface position of the first substrate held in the substrate holding section, A photography step in which the first position on the substrate holding portion determined based on the detection result of the above detection step is photographed, A determination step for determining an abnormality in the first position based on the results of the aforementioned imaging step, A maintenance process which involves performing maintenance based on the determination result of the aforementioned determination process, After the maintenance step, a holding step is performed in which a second substrate, different from the first substrate, is held in the substrate holding section. A forming step of forming a pattern on the second substrate held in the holding step, A processing step for processing the second substrate on which the pattern has been formed in the forming step, A method for manufacturing an article, characterized by having the following:

[0062] The invention is not limited to the embodiments described above, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, claims are attached to disclose the scope of the invention.

Claims

1. A substrate holding section that holds the substrate, A detection unit for detecting the surface position of the substrate held in the substrate holding unit, A camera unit for photographing the first position on the substrate holding portion, The system includes a determination unit that determines whether there is an abnormality in the first position based on the results captured by the imaging unit, The first position is a position based on the detection result of the detection unit. A determination device characterized by the following features.

2. The determination device according to claim 1, characterized in that the determination unit determines whether or not there is an abnormality in the first position.

3. The determination device according to claim 1, characterized in that the determination unit determines the type of abnormality of the first position.

4. The determination device according to claim 1, characterized in that the detection result of the detection unit for determining the first position is the result of detecting the target position in parallel with an exposure process for a position different from the target position of the detection unit.

5. The system further comprises a movable stage on which the substrate holding portion is mounted, The determination device according to claim 1, characterized in that the imaging unit captures the first position when the stage is stopped.

6. The system further comprises a movable stage on which the substrate holding portion is mounted, The determination device according to claim 1, characterized in that the imaging unit captures the first position when the stage is moving.

7. The determination device according to claim 1, characterized in that the captured results include at least one of image information, video information, and information obtained from the image information or video information.

8. The determination device according to claim 1, characterized in that the imaging unit photographs alignment marks formed on the substrate.

9. The determination device according to claim 1, characterized in that maintenance is not performed even if an abnormality is determined based on the determination result of the determination unit or the settings related to maintenance.

10. The determination device according to claim 1, characterized in that it performs machine learning on the reference data used for determination in the determination unit.

11. The determination device according to claim 3, characterized in that the type of abnormality is at least one of an abnormality caused by chipping of the substrate holding portion and an abnormality caused by foreign matter adhering to the substrate holding portion.

12. The determination device according to claim 1, further comprising a display control unit that controls the determination unit to display the determination result determined by the determination unit on a display unit.

13. The determination device according to claim 1, further comprising a communication unit for transmitting the determination result determined by the determination unit to an external information processing device.

14. The determination device according to claim 1, characterized in that the first position is a position on the substrate holding portion that corresponds to a second position on the substrate where an abnormality is determined in the detection result of the detection portion.

15. A determination device according to any one of claims 1 to 14, A lithography apparatus characterized by having an illumination optical system for irradiating a substrate with light.

16. A detection step for detecting the surface position of the substrate held in the substrate holding section, A photographing step of photographing the first position on the substrate holding portion, The process includes a determination step of determining an abnormality in the first position based on the results of the aforementioned imaging step, The first position is a position based on the detection result in the detection step. A determination method characterized by the above.

17. The process further includes a removal step in which the substrate is removed from the substrate holding portion after the detection step, The determination method according to claim 16, characterized in that the aforementioned photographic step is performed after the aforementioned removal step.

18. A program for causing a computer to execute the determination method described in claim 16 or 17.

19. A detection step for detecting the surface position of the first substrate held in the substrate holding section, A photography step in which the first position on the substrate holding portion determined based on the detection result of the above detection step is photographed, A determination step for determining an abnormality in the first position based on the results of the aforementioned imaging step, A maintenance process which involves performing maintenance based on the determination result of the aforementioned determination process, After the maintenance step, a holding step is performed in which a second substrate, different from the first substrate, is held in the substrate holding section. A forming step of forming a pattern on the second substrate held in the holding step, A processing step for processing the second substrate on which the pattern has been formed in the forming step, A method for manufacturing an article, characterized by having the following:

Images