Power Converter

Abstract

The present application provides a power converter. The power converter includes a housing and a power conversion circuit. A plurality of mutually separated accommodating cavities are provided in the housing, and the plurality of mutually separated accommodating cavities include a first accommodating cavity, a second accommodating cavity, and a third accommodating cavity. The power conversion circuit includes a first electromagnetic compatibility module, a bus capacitor, and a second electromagnetic compatibility module. The first accommodating cavity is configured to accommodate the first electromagnetic compatibility module, the second accommodating cavity is configured to accommodate the bus capacitor, and the third accommodating cavity is configured to accommodate the second electromagnetic compatibility module. The first accommodating cavity and the third accommodating cavity are located on opposite sides of the second accommodating cavity. The present application is implemented to improve EMC of the power converter.

Description

[Technical Field]

[0001]

[0001] This application claims priority to Chinese Patent Application No. 202211711200.9 entitled "Power Converter", filed with the State Intellectual Property Office of China on December 29, 2022, and Chinese Patent Application No. 202311139670.7 entitled "Power Converter", filed with the State Intellectual Property Office of China on September 5, 2023, the entire contents of both applications being incorporated herein by reference.

[0002]

[0002] Technical field This application relates to the technical field of power supplies, and more particularly to power converters. [Background technology]

[0003]

[0003] Power converters can convert one type of current into another and are widely used in power supply systems. Power converters can be used commercially only if they meet electromagnetic compatibility (EMC) standards. As the switching frequency of a power converter increases and the output power of the power converter increases, the electromagnetic susceptibility (EMS) of the power converter to other electronic devices decreases. In addition, the electromagnetic signals generated by the power converter cause serious electromagnetic interference to other electronic devices, that is, the electromagnetic interference (EMI) of the power converter increases. In general, as the switching frequency of a power converter increases and the output power of a power converter increases, higher requirements for EMC are imposed on the power converter. Therefore, how to improve the EMC of a power converter is an important research topic. Summary of the Invention

[0004]

[0004] The present application provides a power converter for improving the EMC of the power converter.

[0005] According to a first aspect, an embodiment of the present application provides a power converter. The power converter includes a housing and a power conversion circuit. A plurality of accommodating cavities separated from each other are provided in the housing, and the plurality of accommodating cavities separated from each other include a first accommodating cavity, a second accommodating cavity, and a third accommodating cavity.

[0006]

[0006] The power conversion circuit includes a first electromagnetic compatibility module, a bus capacitor, and a second electromagnetic compatibility module. The first housing cavity is configured to house the first electromagnetic compatibility module, the second housing cavity is configured to house the bus capacitor, and the third housing cavity is configured to house the second electromagnetic compatibility module. The first housing cavity and the third housing cavity are located on opposite sides of the second housing cavity.

[0007]

[0007] In this embodiment of the present application, the current flows in one direction, which results in reduced crosstalk between the currents, which improves the EMC impact of the power converter.

[0008]

[0008] Regarding the first aspect, in a first possible implementation, the first accommodating cavity and the third accommodating cavity are symmetrically distributed with respect to the second accommodating cavity. The implementation of this embodiment of the present application is helpful to further improve the EMC effect of the power converter and further improve the power density of the power converter.

[0009]

[0009] Regarding the first aspect or the first possible implementation of the first aspect, in a second possible implementation, the plurality of separated accommodating cavities further include a fourth accommodating cavity, and the power conversion circuit further includes a first power inductor module. The fourth accommodating cavity is configured to accommodate the first power inductor module. The fourth accommodating cavity and the first accommodating cavity are located on the same side of the second accommodating cavity.

[0010]

[0010] In this embodiment of the present application, a first power inductor module is added to the power converter, so that it can filter interference from the input side of the power converter. Furthermore, the first power inductor module is disposed on the same side of the first housing cavity that houses the first electromagnetic compatibility module, and the current still flows in one direction, for example, clockwise, so that the EMC effect of the power converter can be further improved.

[0011]

[0011] Regarding the second possible implementation of the first aspect, in a third possible implementation, the power converter further includes a printed circuit board disposed within the housing. The printed circuit board is configured to support the first electromagnetic compatibility module and the bus capacitor. A shielding plate is provided on a side of the first power inductor module facing the printed circuit. The first power inductor module establishes electrical connection to the first electromagnetic compatibility module and the bus capacitor on the printed circuit by using screws.

[0012]

[0012] Regarding the first aspect or any one of the aforementioned possible implementations of the first aspect, in a fourth possible implementation, the plurality of separated accommodating cavities further includes a fifth accommodating cavity, and the power conversion circuit further includes a second power inductor module. The fifth accommodating cavity is configured to accommodate the second power inductor module. The fifth accommodating cavity and the third accommodating cavity are located on the same side of the second accommodating cavity.

[0013]

[0013] In this embodiment of the present application, a second power inductor module is added to the power converter, so that it can filter interference from the output side of the power converter. Furthermore, the second power inductor module is disposed on the same side of the third accommodating cavity that accommodates the second electromagnetic compatibility module, and the current still flows in one direction, for example, clockwise, so that it can further improve the EMC effect of the power converter.

[0014]

[0014] Regarding the fourth possible implementation of the first aspect, in a fifth possible implementation, the power converter further includes a printed circuit board disposed within the housing. The printed circuit board is configured to support the bus capacitor and the second electromagnetic compatibility module. A shielding plate is provided on one side of the second power inductor module facing the printed circuit. The second power inductor module establishes electrical connection to the bus capacitor and the second electromagnetic compatibility module on the printed circuit by using screws.

[0015]

[0015] In a sixth possible implementation of the first aspect or any one of the aforementioned possible implementations of the first aspect, the housing includes a bottom plate, a housing sidewall, and a cover plate, wherein the bottom plate, the housing sidewall, and the cover plate define a plurality of storage cavities separated from one another.

[0016]

[0016] In a seventh possible implementation of the first aspect, a first conductive connecting piece is provided on a surface of the housing side wall facing the cover plate. A second conductive connecting piece is correspondingly provided on a surface of the cover plate facing the housing side wall. The first conductive connecting piece is coupled to the second conductive connecting piece.

[0017]

[0017] When this embodiment of the present application is implemented and the first conductive connecting piece is attached to the second conductive connecting piece, the housing side wall and the cover plate can form a closed conductive cavity to prevent the electromagnetic interference generated by the power converter from leaking out, which further improves the EMC effect of the power converter.

[0018]

[0018] Regarding the first aspect or any one of the aforementioned possible implementations of the first aspect, in an eighth possible implementation, the power converter further includes a printed circuit board disposed within the housing. The printed circuit board is configured to support the first electromagnetic compatibility module, the bus capacitor, and the second electromagnetic compatibility module. The first electromagnetic compatibility module, the bus capacitor, and the second electromagnetic compatibility module are disposed on a surface of the printed circuit board facing the bottom plate of the housing.

[0019]

[0019] With respect to the eighth possible implementation of the first aspect, in a ninth possible implementation, a third conductive connecting piece is provided on a surface of a side wall of any one of the plurality of mutually separated receiving cavities, the surface facing the printed circuit board. A fourth conductive connecting piece is correspondingly provided on a surface of the printed circuit board, the surface facing the cavity side wall. The third conductive connecting piece is coupled to the fourth conductive connecting piece.

[0020]

[0020] In this embodiment of the present application, the third conductive connecting piece is attached to the fourth conductive connecting piece. The cavity sidewall of any one of the cavities and the printed circuit board can form a closed or partially closed conductive cavity, reducing the electromagnetic interference between the accommodating cavities and avoiding the superposition of electromagnetic interference. This further improves the EMC effect of the power converter.

[0021]

[0021] Regarding the first aspect or any one of the aforementioned possible implementations of the first aspect, in a tenth possible implementation, the first accommodating cavity has an input port. The input port is configured to establish a connection between the first electromagnetic compatibility module and a DC power source. The third accommodating cavity has an output terminal. The output terminal is configured to establish a connection between the second electromagnetic compatibility module and an AC load.

[0022]

[0022] The power conversion circuit further includes a first DC / AC module configured to: convert a first direct current output by the first electromagnetic compatibility module into a first alternating current, and transmit the first alternating current to the second electromagnetic compatibility module.

[0023]

[0023] Regarding a tenth possible implementation of the first aspect, in an eleventh possible implementation, the first electromagnetic compatibility module includes at least one first inductor and at least one first capacitor. The first inductor and the first capacitor are configured to form a first low-pass filter circuit. The first low-pass filter circuit can be configured to filter high-frequency interference generated by a DC power source. The second electromagnetic compatibility module includes at least one second inductor and at least one second capacitor. The second inductor and the second capacitor are configured to form a second low-pass filter circuit. The second low-pass filter circuit can be configured to filter high-frequency interference generated by a power converter.

[0024]

[0024] Regarding the tenth possible implementation of the first aspect or the eleventh possible implementation of the first aspect, in a twelfth possible implementation, the first DC / AC module includes a first switch unit and a second switch unit. The plurality of accommodating cavities separated from each other include a sixth accommodating cavity and a seventh accommodating cavity. The sixth accommodating cavity is configured to accommodate the first switch unit. The seventh accommodating cavity is configured to accommodate the second switch unit. The sixth accommodating cavity and the seventh accommodating cavity are located on both sides of the second accommodating cavity.

[0025]

[0025] In this embodiment of the present application, the first DC / AC module of the power conversion circuit is divided into two parts, and the two parts are respectively arranged on two sides of the second receiving cavity, to avoid overcrowding between the switching transistors in the first DC / AC module, which can promote heat dissipation of the first DC / AC module and improve the safety and reliability of the power converter.

[0026]

[0026] Regarding the twelfth possible implementation of the first aspect, in a thirteenth possible implementation, the power converter further includes a first heat sink and a second heat sink. The first heat sink is disposed in the sixth accommodating cavity and configured to dissipate heat for the first switch unit. The second heat sink is disposed in the seventh accommodating cavity and configured to dissipate heat for the second switch unit.

[0027]

[0027] Regarding the twelfth possible implementation of the first aspect, in a fourteenth possible implementation, the power converter further includes a printed circuit board disposed within the housing. The printed circuit board is configured to support the first switch unit and the second switch unit. The first switch unit and the second switch unit are disposed on a surface of the printed circuit board facing the bottom plate of the housing.

[0028]

[0028] With respect to the first aspect or the first possible implementation of the first aspect through the ninth possible implementation of the first aspect, in a fifteenth possible implementation, the first accommodating cavity has an input port. The input port is configured to establish a connection between the first electromagnetic compatibility module and an AC power source. The third accommodating cavity has an output terminal. The output terminal is configured to establish a connection between the second electromagnetic compatibility module and an AC load.

[0029]

[0029] The power conversion circuit further includes an AC / DC module and a second DC / AC module, wherein the AC / DC module is configured to: convert the second alternating current output by the first electromagnetic compatibility module into a second direct current, and transmit the second direct current to the second DC / AC module.

[0030]

[0030] The second DC / AC module is configured to: convert the second direct current into a third alternating current and transmit the third alternating current to the second electromagnetic compatibility module.

[0031]

[0031] Regarding the fifteenth possible implementation of the first aspect, in a sixteenth possible implementation, the first electromagnetic compatibility module includes at least one third inductor and at least one third capacitor. The third inductor and the third capacitor are configured to form a third low-pass filter circuit. The third low-pass filter circuit is capable of filtering high-frequency interference generated by the AC power source.

[0032]

[0032] The second electromagnetic compatibility module includes at least one fourth inductor and at least one fourth capacitor, the fourth inductor and the fourth capacitor configured to form a fourth low pass filter circuit, the fourth low pass filter circuit configured to filter high frequency interference generated by the power converter.

[0033]

[0033] Regarding the 15th possible implementation of the first aspect, in a 17th possible implementation, the AC / DC module includes a third switch unit, and the second DC / AC module includes a fourth switch unit. The plurality of accommodating cavities separated from each other include a sixth accommodating cavity and a seventh accommodating cavity. The sixth accommodating cavity is configured to accommodate the third switch unit. The seventh accommodating cavity is configured to accommodate the fourth switch unit. The sixth accommodating cavity and the seventh accommodating cavity are located on both sides of the second accommodating cavity.

[0034]

[0034] Regarding the 17th possible implementation of the first aspect, in an 18th possible implementation, the power converter further includes a first heat sink and a second heat sink. The first heat sink is disposed in the sixth accommodating cavity and configured to dissipate heat for the third switch unit. The second heat sink is disposed in the seventh accommodating cavity and configured to dissipate heat for the fourth switch unit.

[0035]

[0035] Regarding the 17th possible implementation of the first aspect, in a 19th possible implementation, the power converter further includes a printed circuit board disposed within the housing. The printed circuit board is configured to support a third switch unit and a fourth switch unit. The third switch unit and the fourth switch unit are disposed on a surface of the printed circuit board facing the bottom plate of the housing.

[0036]

[0036] Regarding an eighteenth possible implementation of the first aspect, in a twentieth possible implementation, the printed circuit board includes an EMC conductive coating. The EMC conductive coating on the printed circuit board is closely coupled to a side wall of any one of the plurality of mutually separated accommodating cavities. In a direction perpendicular to the printed circuit board, a projection of the EMC conductive coating on the printed circuit board overlaps with a projection of a side wall of any one of the plurality of mutually separated accommodating cavities.

[0037]

[0037] The exposed metal conductive parts on the printed circuit board are directly connected to the cavity sidewalls, so that the accommodating cavity can form a closed or partially closed EMC isolation cavity. The isolation cavity can absorb or reflect interference signals multiple times. This causes energy loss, so that the interference signals reaching the isolation cavity are greatly weakened, and the EMC isolation effect is achieved.

[0038]

[0038] Regarding a twentieth possible implementation of the first aspect, in a twenty-first possible implementation, the housing has a threaded hole provided beside a cavity sidewall of any one of the plurality of accommodating cavities separated from one another. A threaded through hole is provided in the printed circuit board. In a direction perpendicular to the printed circuit board, a projection of the threaded hole overlaps a projection of the through hole. The threaded hole and the through hole are configured to fasten a connection between a cavity sidewall of any one of the plurality of accommodating cavities separated from one another and an EMC conductive coating on the printed circuit board.

[0039]

[0039] The screw holes are arranged close to the housing side wall, so that the electrical connection between the housing side wall and the printed circuit board can be more reliable. Even if the power conversion device vibrates due to installation, movement, or the like of the device, the housing side wall and the printed circuit board can still be tightly connected, so that the reliability of the EMC insulation effect is ensured. [Brief explanation of the drawings]

[0040] [Figure 1] FIG. 1 is a schematic diagram of a three-dimensional structure of a power converter according to an embodiment of the present application. [Figure 2]

[0041] FIG. 2 is a block diagram of a circuit of a power converter according to an embodiment of the present application. [Figure 3]

[0042] FIG. 3 is a schematic diagram of another three-dimensional structure of a power converter according to an embodiment of the present application. [Figure 4]

[0043] 4 to 6 are schematic diagrams of further three-dimensional structures of power converters according to embodiments of the present application. [Figure 5] 4 to 6 are schematic diagrams of further three-dimensional structures of power converters according to embodiments of the present application. [Figure 6]4 to 6 are schematic diagrams of further three-dimensional structures of power converters according to embodiments of the present application. [Figure 7]

[0044] FIG. 7 is a schematic diagram of yet another three-dimensional structure of a power converter according to an embodiment of the present application. [Figure 8]

[0045] FIG. 8 is a block diagram of another circuit of a power converter according to an embodiment of the present application. [Figure 9]

[0046] FIG. 9 is a schematic diagram of yet another three-dimensional structure of a power converter according to an embodiment of the present application. [Figure 10]

[0047] FIG. 10 is a block diagram of yet another circuit of a power converter according to an embodiment of the present application. [Figure 11]

[0048] FIG. 11 is a block diagram of the structure of a power inductor module according to an embodiment of the present application. [Figure 12]

[0049] FIG. 12 is a block diagram of yet another circuit of a power converter according to an embodiment of the present application. [Figure 13]

[0050] FIG. 13 is a block diagram of a further three-dimensional structure of a power converter according to an embodiment of the present application. DETAILED DESCRIPTION OF THE INVENTION

[0041]

[0051] Hereinafter, the technical solutions in the embodiments of the present application will be clearly and fully described with reference to the accompanying drawings in the embodiments of the present application. It is obvious that the described embodiments are only a part of the embodiments of the present application, but not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of the present application without creative efforts shall fall within the protection scope of the present application.

[0042]

[0052] Hereinafter, the implementation of the technical solution of the present application will be described in further detail with reference to the accompanying drawings.

[0043]

[0053] 1 and 2. An embodiment of the present application provides a power converter. The power converter includes a housing 101 and a power conversion circuit 102.

[0044]

[0054] A plurality of accommodating cavities, such as a first accommodating cavity 1011, a second accommodating cavity 1012, and a third accommodating cavity 1013, are arranged in the housing 101. The first accommodating cavity 1011 and the third accommodating cavity 1013 are located on either side of the second accommodating cavity 1012.

[0045]

[0055] The power conversion circuit 102 includes a first electromagnetic compatibility module 1021, a second electromagnetic compatibility module 1022, and a bus capacitor 1023. In a specific implementation, the connection relationship of the power conversion circuit 102 may be as follows: The positive input terminal Vin+ and the positive output terminal Vout+ of the power conversion circuit 102 are connected to the positive bus. The negative input terminal Vin- and the negative output terminal Vout- of the power conversion circuit 102 are connected to the negative bus. A bus capacitor 1023 is connected in parallel between the positive and negative buses.

[0046]

[0056] The first electromagnetic compatibility module 1021 is adjacent to the positive input terminal Vin+ and the negative input terminal Vin- of the power conversion circuit 102, and may be connected in series to the positive bus, in series to the negative bus, or in parallel between the positive bus and the negative bus to suppress electromagnetic interference caused by the positive input terminal Vin+ and the negative input terminal Vin-. That is, the first electromagnetic compatibility module 1021 can improve the electromagnetic susceptibility (EMS) of the power converter. For example, When the first electromagnetic compatibility module 1021 is connected to a DC power source, the first electromagnetic compatibility module 1021 includes at least one first inductor and at least one first capacitor. The first inductor and the first capacitor form a first low-pass filter circuit. The first low-pass filter circuit can filter out high-frequency interference caused by the DC power source. Alternatively, When the first electromagnetic compatibility module 1021 is connected to an AC power source, the first electromagnetic compatibility module 1021 includes at least one third inductor and at least one third capacitor. The third inductor and the third capacitor form a third low-pass filter circuit. The third low-pass filter circuit can filter out high-frequency interference caused by the AC power source.

[0047]

[0057] The second electromagnetic compatibility module 1022 is adjacent to the positive output terminal Vout+ and the negative output terminal Vout- of the power conversion circuit 102. It may be connected in series with the positive bus, in series with the negative bus, or in parallel between the positive and negative buses to reduce the power converter's electromagnetic interference (EMI) with other electronic devices. The second electromagnetic compatibility module 1022 includes at least one second inductor and at least one second capacitor. The second inductor and the second capacitor form a second low-pass filter circuit. The second low-pass filter circuit can filter out high-frequency interference generated by the power converter.

[0048]

[0058] Optionally, in some possible implementations, the specific circuit implementations of the first electromagnetic compatibility module 1021 and the second electromagnetic compatibility module 1022 may be the same or different.

[0049]

[0059] See Figures 3 and 4. In a possible embodiment, the housing 101 includes a bottom plate 1018, a housing side wall 1019, and a cover plate 1010. The bottom plate 1018, the housing side wall 1019, and the cover plate 1010 surround each other to form a plurality of accommodating cavities separated from each other, for example, a first accommodating cavity 1011, a second accommodating cavity 1012, and a third accommodating cavity 1013. For example, the accommodating cavities may be separated from each other by using an isolation plate, or may be obtained during manufacturing by using an integral die casting process.

[0050]

[0060] It should be understood that the die-casting material of the housing 101 includes aluminum or an aluminum alloy doped with a different element. The material is a metallic conductive material. The power converter further includes a printed circuit board (PCB) 103. If an electrical connection exists between the power converter's printed circuit board and the housing, each of the power converter's accommodating cavities and the PCB can potentially form multiple fully or partially closed EMC isolation cavities. When an interference signal reaches outside the isolation cavity, it is absorbed, reflected, or reflected several times through the isolation cavity. This causes energy loss, and the interference signal at the interface inside the isolation cavity is significantly weakened. As a result, electrical components located between the multiple EMC isolation cavities are not affected or only slightly affected by the interference signal outside the isolation cavity.

[0051]

[0061] It is preferable that the isolation cavity be completely enclosed. However, in actual application scenarios, due to various reasons such as PCB cable routing and structure, the isolation cavity cannot be completely enclosed, and gaps, lead holes, and the like may exist within the isolation cavity. Such incomplete shielding will affect the shielding effect to some extent, but ultimately, it is only necessary to meet the application requirements of the product. The material also has very high thermal conductivity. When the power converter operates, the heat generated by the device during operation can be quickly transferred to the heat sink connected to the power converter, ensuring that the power converter is always at an appropriate operating temperature.

[0052]

[0062] The printed circuit board 103 is provided with a first electromagnetic compatibility module 1021, a second electromagnetic compatibility module 1022, and a bus capacitor 1023. In a particular implementation, the printed circuit board 103 is disposed within the housing 101. The first electromagnetic compatibility module 1021, the second electromagnetic compatibility module 1022, and the bus capacitor 1023 are disposed on a surface of the printed circuit board 103 that faces the bottom plate 1018. When the printed circuit board 103 covers the housing 101, the first electromagnetic compatibility module 1021 may be disposed within the first accommodating cavity 1011, the second electromagnetic compatibility module 1022 may be disposed within the third accommodating cavity 1013, and the bus capacitor 1023 may be disposed within the second accommodating cavity 1012.

[0053]

[0063] In some possible implementations, the depth of the first accommodating cavity 1011 may be set based on the height of the device within the first electromagnetic compatibility module 1021. Similarly, the depth of the second accommodating cavity 1012 may be set based on the height of the bus capacitor 1023. The depth of the third accommodating cavity 1013 may be set based on the height of the device within the second electromagnetic compatibility module 1022. In other words, the depths of the first accommodating cavity 1011, the second accommodating cavity 1012, and the third accommodating cavity 1013 may be different.

[0054]

[0064] 1 and 2 again, the first accommodating cavity 1011 has an input port 1014. The input port 1014 includes a first input port 10141 and a second input port 10142. When the first input port 10141 is connected to the positive input terminal Vin+ of the power conversion circuit 102 and the first input port 10141 is the positive input port, the second input port 10142 is connected to the negative input terminal Vin− of the power conversion circuit 102 and the second input port 10142 is the negative input port.

[0055]

[0065] The third accommodating cavity 1013 has output terminals 1015. The output terminals 1015 include a first output terminal 10151 and a second output terminal 10152. When the first output terminal 10151 is connected to the positive output terminal Vout+ of the power conversion circuit 102 and is the positive output terminal, the second output terminal 10152 is connected to the negative output terminal Vout- of the power conversion circuit 102 and is the negative output terminal.

[0056]

[0066] In this case, in the power converter, current is input from the input port 1014, passes sequentially through the first electromagnetic compatibility module 1021 in the first accommodating cavity 1011, the bus capacitor 1023 in the second accommodating cavity 1012, and the second electromagnetic compatibility module 1022 in the third accommodating cavity 1013, and then is output from the output terminal 1015.

[0057]

[0067] Optionally, in some possible implementations, both the input and output terminals may be ports, or both the input and output terminals may be terminals, or the input terminals are terminals and the output terminals are ports. In other words, the input port 1014 and the output terminal 1015 in Figure 1 can be understood as an example and not a limitation, and the ports or terminals can be set based on a specific product application.

[0058]

[0068] In this embodiment of the present application, the current flows in one direction, for example clockwise, which can reduce crosstalk between the currents, thereby improving the EMC performance of the power converter.

[0059]

[0069] Furthermore, the bus capacitor is generally a large-capacity electrolytic capacitor, which is heavy. When the first and third housing cavities are located on either side of the second housing cavity, the heavy electrolytic capacitor can be positioned in the center of the housing. The first and second electromagnetic compatibility modules, which have approximately the same weight, are positioned on either side, so that the gravity of each part of the housing is balanced. This is convenient for transportation. In particular, in scenarios where the power converter is used in a suspended configuration, the gravity of each part of the housing is balanced. This facilitates suspended installation in all directions (in any position). Furthermore, electrolytic capacitors are large in volume. Therefore, the electrolytic capacitor is positioned in the central second housing cavity. This promotes compact placement of other devices in the power converter and improves space utilization efficiency.

[0060]

[0070] In addition, the depths of the first accommodating cavity, the second accommodating cavity, and the third accommodating cavity may be set based on the heights of the devices accommodated by the first accommodating cavity, the second accommodating cavity, and the third accommodating cavity, thereby improving the power density of the power converter.

[0061]

[0071] See FIG. 5. In some possible implementations of the power converter shown in FIG. 4, the housing side wall and the cover plate shown in FIG. 5 are provided with conductive connection pieces. In a specific implementation, a first conductive connection piece 50191 is provided on the surface of the housing side wall 5019 facing the cover plate 5010. A second conductive connection piece 50101 is correspondingly provided on the surface of the cover plate 5010 facing the housing side wall 5019. The first conductive connection piece 50191 is attached to the second conductive connection piece 50101. The first conductive connection piece 50191 and the second conductive connection piece 50101 can be made of a conductive material. When the first conductive connection piece 50191 is attached to the second conductive connection piece 50101, the housing side wall 5019 and the cover plate 5010 form a closed conductive cavity to prevent external leakage of electromagnetic interference generated by the power converter. This further improves the EMC performance of the power converter.

[0062]

[0072] It should be understood that the conductive connection piece described in this application is designed to realize an electrical connection between the housing and the printed circuit board. The conductive connection piece may be a specially designed conductive structure. This structure may be independent of the housing and the printed circuit board, or may be a partial structure of the housing or the printed circuit board. For example, if the conductive connection piece is located on the printed circuit board, the conductive connection piece may be a conductive coating used by the printed circuit board to electrically connect to the housing. The conductive coating includes copper coating, nickel coating, and the like. If the conductive connection piece is located on the housing, the conductive connection piece is part of the cavity sidewall forming the receiving cavity, which contacts the conductive coating.

[0063]

[0073] See Fig. 6. In some possible implementations, a third conductive connecting piece 6011 is provided on a surface of a cavity side wall of any one of the plurality of separated receiving cavities, the surface facing the printed circuit board. A fourth conductive connecting piece 6012 is correspondingly provided on a surface of the printed circuit board, the surface facing the cavity side wall. The third conductive connecting piece 6011 is attached to the fourth conductive connecting piece 6012.

[0064]

[0074] For example, a third conductive connecting piece 60111 is provided on the surface of the cavity side wall of the first receiving cavity facing the printed circuit board. A fourth conductive connecting piece 60121 is correspondingly provided on the surface of the printed circuit board facing the cavity side wall. The third conductive connecting piece 60111 is attached to the fourth conductive connecting piece 60121. In a specific embodiment, the third conductive connecting piece 60111 can be made of a conductive material. The fourth conductive connecting piece 60121 can also be made of a conductive material, or can be specifically implemented as a conductive wire etched on the surface of the printed circuit board facing the cavity side wall. In some possible embodiments, the fourth conductive connecting piece 60121 shown in FIG. 6 is an example. The surface of the printed circuit board facing the cavity side wall needs to be provided corresponding to the first electromagnetic compatibility module. Therefore, in certain embodiments, the fourth conductive connecting piece may be part of the fourth conductive connecting piece 60121 shown in FIG.

[0065]

[0075] Similarly, a third conductive connecting piece 60112 is provided on the surface of the cavity side wall of the third receiving cavity, facing the printed circuit board. A fourth conductive connecting piece 60122 is correspondingly provided on the surface of the printed circuit board, facing the cavity side wall. The third conductive connecting piece 60112 is attached to the fourth conductive connecting piece 60122. In a specific embodiment, the third conductive connecting member 60112 can also be made of a conductive material. The fourth conductive connecting piece can be made of a conductive material or can be specifically implemented as a conductive wire etched on the surface of the printed circuit board, facing the cavity side wall. In some possible embodiments, the fourth conductive connecting piece 60122 shown in FIG. 6 is an example. The surface of the printed circuit board, facing the cavity side wall, needs to be provided corresponding to the second electromagnetic compatibility module. Thus, in certain embodiments, the fourth conductive connecting piece may be part of the fourth conductive connecting piece 60122 shown in FIG.

[0066]

[0076] In this embodiment of the present application, the third conductive connecting piece is attached to the fourth conductive connecting piece. The cavity sidewall of any one cavity and the printed circuit board can form a closed or partially closed conductive cavity to reduce electromagnetic interference between the accommodating cavities and avoid superposition of electromagnetic interference, which may improve the EMC effect of the power converter.

[0067]

[0077] See FIG. 7. In some possible implementations, an embodiment of the present application provides a power converter. Unlike the power converters described above with reference to FIGS. 1 to 6, in this embodiment of the present application, the internal structure of the housing 701 is different from the internal structure of the housing 101. As shown in FIG. 7, a first accommodating cavity 7011, a second accommodating cavity 7012, and a third accommodating cavity 7013 are disposed in the housing 701. The first accommodating cavity 7011 and the third accommodating cavity 7013 are symmetrically distributed with respect to the second accommodating cavity 7012. Implementation of this embodiment of the present application helps to further improve the EMC effect of the power converter and further improve the power density of the power converter.

[0068]

[0078] 1 and 8. In some possible implementations, in addition to the first electromagnetic compatibility module 8021, the second electromagnetic compatibility module 8022, and the bus capacitor 8023, the power conversion circuit 802 further includes a switch unit 8024 and a switch unit 8025. In this case, the switch unit 8024 may be disposed in the sixth accommodating cavity 1016, and the switch unit 8025 is disposed in the seventh accommodating cavity 1017. The sixth accommodating cavity 1016 and the seventh accommodating cavity 1017 are located on opposite sides of the second accommodating cavity 1012. The sixth accommodating cavity 1016 and the first accommodating cavity 1011 are located on the same side of the second accommodating cavity 1012. The seventh accommodating cavity 1017 and the third accommodating cavity 1013 are located on the same side of the second accommodating cavity 1012 .

[0069]

[0079] In this embodiment of the present application, the switch unit of the power conversion circuit is divided into two parts, and the two parts are respectively arranged on two sides of the second receiving cavity, to avoid overcrowding of the switching transistors of the switch unit, which can promote heat dissipation of the switch unit and improve the safety and reliability of the power converter.

[0070]

[0080] Furthermore, the first electromagnetic compatibility module 8021, the second electromagnetic compatibility module 8022, the bus capacitor 8023, the switch unit 8024, and the switch unit 8025 are located on the same side of the printed circuit board. Therefore, in the manufacturing process, the first electromagnetic compatibility module, the bus capacitor, the second electromagnetic compatibility module, and the two switch units can be first welded to one side of the printed circuit board. The side of the printed circuit board that is welded to the module faces the bottom plate. In this case, the printed circuit board is covered in the opening of the housing, and a cover plate is further provided on the surface of the printed circuit board that is far from the bottom plate, thereby completing the installation of the power converter.

[0071]

[0081] The difference between this power converter and existing power converters is that the switch unit, the first electromagnetic compatibility module, the bus capacitor, and the second electromagnetic compatibility module are separately arranged on two sides of the printed circuit board. During the manufacturing process, the first electromagnetic compatibility module, the bus capacitor, and the second electromagnetic compatibility module are first welded onto the main body of the printed circuit board. The surface of the printed circuit board on which the first electromagnetic compatibility module, the bus capacitor, and the second electromagnetic compatibility module are provided is covered by the opening of the housing. After being fixed, the welding process is resumed. The switch unit is welded to the surface of the printed circuit board that is farther from the bottom plate. The manufacturing process is complicated. Therefore, implementing this embodiment of the present application can reduce the installation process, simplify the production process, and improve production efficiency.

[0072]

[0082] Optionally, a first heat sink 10161 is disposed in the cavity of the sixth accommodating cavity 1016. The first heat sink 10161 is configured to heat the switch unit 8024The switch unit 8024 can be tightly attached to the first heat sink 10161 by using screws.

[0073]

[0083] A second heat sink 10171 may be disposed within the cavity of the seventh accommodating cavity 1017. The second heat sink 10171 may be disposed within the cavity of the switch unit 1017. 8025 Similarly, the switch unit 8025 can be tightly attached to the second heat sink 10171 by using screws.

[0074]

[0084] The first heat sink 10161 and the second heat sink 10171 may include one or more heat dissipation modules. The specific implementation of the heat sinks is not limited to this embodiment of the present application.

[0075]

[0085] 9 and 10. In some possible implementations, in addition to the first electromagnetic compatibility module 9021, the second electromagnetic compatibility module 9022, the bus capacitor 9023, the switch unit 9024, and the switch unit 9025, the power conversion circuit 902 further includes a first power inductor module 9026. The first power inductor module 9026 may be configured to perform filtering.

[0076]

[0086] The housing 901 further includes a fourth accommodating cavity 9014. The fourth accommodating cavity 9014 and the first accommodating cavity are located on the same side of the second accommodating cavity. The fourth accommodating cavity 9014 is capable of accommodating a first power inductor module 9026.

[0077]

[0087] In this embodiment of the present application, a first power inductor module is added to the power converter, so that it can filter interference from the input side of the power converter. Furthermore, the first power inductor module is disposed on the same side of the first housing cavity that houses the first electromagnetic compatibility module, and the current still flows in one direction, for example, clockwise, so that the EMC effect of the power converter can be further improved.

[0078]

[0088] Optionally, see Figure 11. In some possible implementations, a shielding plate 90261 is provided on one side of the first power inductor module 9026 that faces the printed circuit board. In this case, the first power inductor module 9026 establishes electrical connection to the first electromagnetic compatibility module 9021 and bus capacitor 9023 on the printed circuit board by using screws 90262.

[0079]

[0089] Optionally, in some possible implementations, the power converter further includes a second power inductor module 9027. The second power inductor module 9027 may be configured to perform filtering.

[0080]

[0090] The housing 901 further includes a fifth accommodating cavity 9015. The fifth accommodating cavity 9015 and the third accommodating cavity are located on the same side of the second accommodating cavity. The fifth accommodating cavity 9015 can accommodate a second power inductor module 9027.

[0081]

[0091] In this embodiment of the present application, a second power inductor module is added to the power converter, so that it can filter interference from the output side of the power converter. Furthermore, the second power inductor module is disposed on the same side of the third housing cavity that houses the second electromagnetic compatibility module, and the current still flows in one direction, for example, clockwise, so that the EMC effect of the power converter can be further improved.

[0092] Optionally, in some possible implementations, the specific implementation of the second power inductor module 9027 may be the same as the specific implementation of the first power inductor module 9026. For example, a shielding plate may be provided on the side facing the printed circuit board. In this case, the second power inductor module establishes electrical connection to the second electromagnetic compatibility module 9022 and the bus capacitor 9023 on the printed circuit board by using screws.

[0082]

[0093] In some possible implementations, when the power converter described above with reference to FIGS. 1 to 12 is specifically used as an inverter, the inverter may be used in a scenario in which direct current is converted into alternating current, such as a solar power generation scenario or a wind power generation scenario. In this case, the power conversion circuit specifically includes a first DC / AC module. The input end of the first DC / AC module is connected to a first electromagnetic compatibility module or a first power inductor module. The output end of the first DC / AC module is connected to a second power inductor module or a second electromagnetic compatibility module. The first DC / AC module can convert the first direct current output by the first electromagnetic compatibility module or the first power inductor module into a first alternating current and transmit the first alternating current to the second electromagnetic compatibility module.

[0083]

[0094] For example, the first DC / AC module includes a first switch unit and a second switch unit. For example, the first switch unit may be an upper bridge arm in a three-phase bridge arm, and the second switch unit may be a lower bridge arm in the three-phase bridge arm. In this case, the first switch unit may be correspondingly disposed in the accommodating cavity of switch unit 8024. In other words, the first switch unit may be disposed in the sixth accommodating cavity. The second switch unit may be correspondingly disposed in the accommodating cavity of switch unit 8025. In other words, the second switch unit may be disposed in the seventh accommodating cavity.

[0084]

[0095] Optionally, in some possible implementations, when the power converter described above with reference to FIGS. 1 to 12 may be specifically used as an uninterruptible power supply, the power conversion circuit further includes an AC / DC module and a second DC / AC module. The input end of the AC / DC module is connected to the first electromagnetic compatibility module or the first power inductor module. The output end of the AC / DC module is connected to the input end of the DC / AC module. The output end of the DC / AC module is connected to the second power inductor module or the second electromagnetic compatibility module. In this case, the AC / DC module is configured to convert the second AC output by the first electromagnetic compatibility module into a second DC and transmit the second DC to the second DC / AC module. The DC / AC module is configured to convert the second DC into a third AC and transmit the third AC to the second electromagnetic compatibility module.

[0085]

[0096] For example, the AC / DC module includes a third switch unit, and the second DC / AC module includes a fourth switch unit. In this case, the third switch unit may be correspondingly disposed in the accommodating cavity of switch unit 8024. In other words, the third switch unit may be disposed in the sixth accommodating cavity. The fourth switch unit may be correspondingly disposed in the accommodating cavity of switch unit 8025. In other words, the fourth switch unit may be disposed in the seventh accommodating cavity.

[0086]

[0097] 13 is a block diagram of another three-dimensional structure of a power converter according to an embodiment of the present application. The power converter includes an EMC conductive coating 13012 located on a printed circuit board, a partial cavity sidewall 13011 located on a housing to form a receiving cavity, and a screw hole 1302 configured to fasten the printed circuit board and the housing. The EMC conductive coating 13012 is located on one side of the printed circuit board facing the housing. The EMC conductive coating 13012 includes a first coating 130121, a second coating 130122, and a third coating 130123. The partial cavity sidewall 13011 includes a first retaining wall 130111, a second retaining wall 130112, and a third retaining wall 130113. After the installation is completed, the EMC conductive coating 13012 is tightly fastened to the partial cavity sidewall 13011. In the direction perpendicular to the printed circuit board, The projection of the first coating 130121 overlaps with the projection of the first retaining wall 130111; The projection of the second coating 130122 overlaps with the projection of the second retaining wall 130112; The projection of the third coating 130123 overlaps with the projection of the third retaining wall 130113. The screw hole 1302 is disposed adjacent to the partial cavity side wall 13011 and emc conductiveThe conductive coating 13012 strengthens the connection between the two, ensuring that the two are always electrically connected. The conductive coating may be a copper coating, nickel coating, or similar. The conductive coating and the cavity sidewalls form a number of closed or partially closed EMC isolation cavities.

[0087]

[0098] It should be noted that the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance.

[0088]

[0099] Furthermore, in this specification, positional terms such as "top" and "bottom" are defined relative to the location of structures in the accompanying drawings. It should be understood that these positional terms are relative concepts used for relative description and clarity, and may change accordingly as the location of the structures changes.

[0089]

[0100] The above description is merely a specific implementation of the present invention and is not intended to limit the scope of protection of the present invention. Any modifications or substitutions that can be easily devised by those skilled in the art within the technical scope disclosed in the present invention shall fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be subject to the scope of protection of the claims.

Claims

1. A power converter including a housing and a power conversion circuit, wherein a plurality of separated accommodating cavities are provided within the housing, the plurality of separated accommodating cavities including a first accommodating cavity, a second accommodating cavity, and a third accommodating cavity; the power conversion circuit includes a first electromagnetic compatibility module, a bus capacitor, and a second electromagnetic compatibility module; and a first accommodating cavity configured to accommodate the first electromagnetic compatibility module, a second accommodating cavity configured to accommodate the bus capacitor, and a third accommodating cavity configured to accommodate the second electromagnetic compatibility module, the first accommodating cavity and the third accommodating cavity being located on opposite sides of the second accommodating cavity;

2. 2. The power converter of claim 1, wherein the first accommodating cavity and the third accommodating cavity are symmetrically distributed with respect to the second accommodating cavity.

3. 3. The power converter of claim 1, wherein the plurality of separated accommodating cavities further includes a fourth accommodating cavity, and the power conversion circuit further includes a first power inductor module; and a fourth accommodating cavity configured to accommodate the first power inductor module, the fourth accommodating cavity and the first accommodating cavity being located on the same side of the second accommodating cavity;

4. 4. The power converter of claim 3, further comprising a printed circuit board disposed within the housing, the printed circuit board configured to support the first electromagnetic compatibility module and the bus capacitor; and a shielding plate provided on a side of the first power inductor module facing the printed circuit board, and the first power inductor module establishes electrical connection to the first electromagnetic compatibility module and the bus capacitor on the printed circuit board using screws.

5. 5. The power converter according to claim 1, wherein the plurality of separated accommodating cavities further includes a fifth accommodating cavity, and the power conversion circuit further includes a second power inductor module; and a fifth accommodating cavity configured to accommodate the second power inductor module, the fifth accommodating cavity and the third accommodating cavity being located on the same side of the second accommodating cavity;

6. 6. The power converter of claim 5, further comprising a printed circuit board disposed within the housing, the printed circuit board configured to support the bus capacitor and the second electromagnetic compatibility module; and a shielding plate is provided on a side of the second power inductor module facing the printed circuit board, and the second power inductor module establishes electrical connection to the bus capacitor and the second electromagnetic compatibility module on the printed circuit board using screws.

7. 7. The power converter according to claim 1, wherein the housing includes a bottom plate, a housing side wall, and a cover plate, and the bottom plate, the housing side wall, and the cover plate define the plurality of mutually separated accommodating cavities.

8. 8. The power converter according to claim 7, wherein a first electrically conductive connecting piece is provided on a surface of the housing side wall facing the cover plate, and a second electrically conductive connecting piece is correspondingly provided on a surface of the cover plate facing the housing side wall; and The first conductive connecting piece is coupled to the second conductive connecting piece.

9. 9. The power converter of claim 1, further comprising: a printed circuit board disposed within the housing, the printed circuit board configured to support the first electromagnetic compatibility module, the bus capacitor, and the second electromagnetic compatibility module; and The power converter, wherein the first electromagnetic compatibility module, the bus capacitor, and the second electromagnetic compatibility module are disposed on a surface of the printed circuit board facing a bottom plate of the housing.

10. 10. The power converter according to claim 9, wherein a third conductive connection piece is provided on a surface of a side wall of any one of the plurality of separated receiving cavities, the surface facing the printed circuit board, and a fourth conductive connection piece is correspondingly provided on a surface of the printed circuit board, the surface facing the cavity side wall; and The third conductive connecting piece is coupled to the fourth conductive connecting piece.

11. 11. The power converter of claim 1, wherein the first accommodating cavity has an input port, the input port configured to establish a connection between the first electromagnetic compatibility module and a DC power source; the third receiving cavity having an output terminal, the output terminal configured to establish a connection between the second electromagnetic compatibility module and an AC load; and The power conversion circuit further includes a first DC / AC module configured to: convert a first direct current output by the first electromagnetic compatibility module into a first alternating current; and transmit the first alternating current to the second electromagnetic compatibility module.

12. 12. The power converter of claim 11, wherein the first electromagnetic compatibility module includes at least one first inductor and at least one first capacitor, the first inductor and the first capacitor configured to form a first low pass filter circuit, the first low pass filter circuit configured to filter high frequency interference generated by the DC power source; and a power converter, wherein the second electromagnetic compatibility module includes at least one second inductor and at least one second capacitor, the second inductor and the second capacitor configured to form a second low pass filter circuit, the second low pass filter circuit configured to filter high frequency interference generated by the power converter.

13. 13. The power converter of claim 11, wherein the first DC / AC module includes a first switch unit and a second switch unit; and the plurality of mutually separated accommodating cavities include a sixth accommodating cavity and a seventh accommodating cavity, the sixth accommodating cavity configured to accommodate the first switch unit, the seventh accommodating cavity configured to accommodate the second switch unit, and the sixth accommodating cavity and the seventh accommodating cavity located on opposite sides of the second accommodating cavity.

14. 14. The power converter of claim 13, wherein the power converter further comprises a first heat sink and a second heat sink; the first heat sink is disposed within the sixth accommodating cavity and configured to dissipate heat for the first switch unit; the second heat sink is disposed within the seventh accommodating cavity and configured to dissipate heat for the second switch unit; the power converter further includes a printed circuit board disposed within the housing, the printed circuit board configured to support the first switch unit and the second switch unit; and The power conversion circuit, wherein the first switch unit and the second switch unit are disposed on a surface of the printed circuit board facing a bottom plate of the housing.

15. 11. The power converter of claim 1, wherein the first receiving cavity has an input port, the input port configured to establish a connection between the first electromagnetic compatibility module and an AC power source; the third receiving cavity having an output terminal, the output terminal configured to establish a connection between the second electromagnetic compatibility module and an AC load; and The power conversion circuit further includes an AC / DC module and a second DC / AC module, the AC / DC module configured to: convert a second alternating current output by the first electromagnetic compatibility module into a second direct current and transmit the second direct current to the second DC / AC module; The second DC / AC module is configured to: convert the second direct current to a third alternating current; and transmit the third alternating current to the second electromagnetic compatibility module.

16. 16. The power converter of claim 15, wherein the first electromagnetic compatibility module includes at least one third inductor and at least one third capacitor, the third inductor and the third capacitor configured to form a third low pass filter circuit, the third low pass filter circuit configured to filter high frequency interference generated by the AC power source; and a power converter, wherein the second electromagnetic compatibility module includes at least one fourth inductor and at least one fourth capacitor, the fourth inductor and the fourth capacitor configured to form a fourth low pass filter circuit, and the fourth low pass filter circuit configured to filter high frequency interference generated by the power converter.

17. 16. The power converter of claim 15, wherein the AC / DC module includes a third switch unit and the second DC / AC module includes a fourth switch unit; and the plurality of mutually separated accommodating cavities include a sixth accommodating cavity and a seventh accommodating cavity, the sixth accommodating cavity configured to accommodate the third switch unit, the seventh accommodating cavity configured to accommodate the fourth switch unit, and the sixth accommodating cavity and the seventh accommodating cavity located on opposite sides of the second accommodating cavity.

18. 18. The power converter of claim 17, wherein the power converter further comprises a first heat sink and a second heat sink; the first heat sink is disposed within the sixth accommodating cavity and configured to dissipate heat for the third switch unit; the second heat sink is disposed within the seventh accommodating cavity and configured to dissipate heat for the fourth switch unit; the power converter further includes a printed circuit board disposed within the housing, the printed circuit board configured to support the third switch unit and the fourth switch unit; and The power conversion circuit, wherein the third switch unit and the fourth switch unit are disposed on a surface of the printed circuit board facing a bottom plate of the housing.

19. 10. The power converter of claim 9, wherein the printed circuit board includes an EMC conductive coating, the EMC conductive coating on the printed circuit board is closely coupled to a cavity sidewall of any one of the plurality of mutually separated accommodating cavities, and a projection of the EMC conductive coating on the printed circuit board overlaps with a projection of a cavity sidewall of any one of the plurality of mutually separated accommodating cavities in a direction perpendicular to the printed circuit board.

20. 11. The power converter according to claim 10, wherein the housing has a screw hole provided beside a cavity sidewall of any one of the plurality of accommodating cavities separated from one another, and a screw through-hole is provided in the printed circuit board, a projection of the screw hole overlaps a projection of the screw through-hole in a direction perpendicular to the printed circuit board, and the screw hole and the screw through-hole are configured to fasten a connection between a cavity sidewall of any one of the plurality of accommodating cavities separated from one another and an EMC conductive coating on the printed circuit board.

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