Apparatus and method for bonding a component to a substrate

Abstract

The present invention relates to an apparatus for bonding one or more components to one or more substrates, the apparatus comprising a bonding station and a transport device for transporting substrates along a track from one or more loading stations, through the bonding station, to one or more unloading stations for unloading the substrates.

Description

[Technical Field]

[0001] The present disclosure relates to an apparatus for bonding one or more components, such as NAND and DRAM memory dies, to one or more substrates, and to a method of using such an apparatus to bond one or more components to one or more substrates. [Background technology]

[0002] Different types of die bonder equipment are available to address various semiconductor market segments; for example, there are thin-die specific systems with highly specialized components such as die ejection systems, bond head tooling, and heater systems on the substrate handler.

[0003] Substrate handlers are typically based on the clamp feeder principle, where a substrate or strip is moved across the substrate handler to a process position by several feeder clamps. This requires the clamps to grip the substrates by their sides and pass them from one clamp to the next. This is the state-of-the-art solution that allows for parallel processing of more than one substrate on the same substrate handler.

[0004] Typically, substrates in today's manufacturing are pushed onto a substrate handler from a substrate input magazine, and roller drives are used to move them into a substrate output magazine.

[0005] Because the feeder concept allows for parallel handling of more than one substrate on the substrate handler and does not require die sorting functionality, a typical die bonder can have only one substrate handler and still achieve reasonable throughput.

[0006] For example, U.S. Patent Application Publication No. 2013 / 0008599(A1) discloses a semiconductor mounting apparatus having a supply station configured to supply an adhesive portion to a substrate location of a substrate, a bonding station configured to place a semiconductor chip at the substrate location, and a transport device configured to transport the substrate along a transport path.

[0007] For example, KR102106884(B1) discloses a device and method for transporting a substrate from a substrate housing of a loader unit to a transport lane, in which a bonding control unit of the device sends the substrate to the substrate housing of the unloader unit as a die-mounted substrate when bonding of all dies to the substrate by the bonding head is completed, and returns the substrate to the substrate housing of the loader unit as a die-mounting substrate when bonding of all dies to the substrate by the bonding head is not completed.

[0008] JP2022-013070(A) further discloses an article manufacturing apparatus, which includes a supply unit that supplies workpieces, a mounted component holding unit that can hold a plurality of mounted components, a mounted component grade information storage unit that stores grade information for each mounted component held in the mounted component holding unit, a storage unit that stores workpieces on which each mounted component is mounted, and a buffer unit that stores workpieces on which each mounted component is mounted in only a portion of the mounting area of ​​the workpiece.

[0009] Furthermore, WO 2022 / 097415(A1) discloses a system in which a supply member is transported from a rotor to a supply position, and the supply member loaded with a workpiece is then transported to an unloader. If the workpiece supply source runs out of workpieces of the same grade before the workpiece is loaded onto the supply member, the supply member is transported from the shuttle to a standby position. Another supply member is transported to the vacant supply position.

[0010] However, the common clamp feeder concept in current substrate handling systems is not suitable for substrates with stiffness below a certain value. With each clamping step, the risk of damaging the strip or the dies already attached in the previous step increases. Also, at each process position, the strip needs to be clamped before the process and released after the process. This is typically done using negative pressure, meaning a pressure lower than atmospheric pressure, and mechanical clamping tools, both of which induce physical impacts or shocks on the substrate that can damage the strip or the dies attached thereto.

[0011] In some conventional systems, the substrate is moved to or over the heating device more than once, resulting in multiple heating and cooling cycles for the substrate.

[0012] This is particularly relevant to systems that respond to a magazine-like buffer store that stores substrates for bonding different bins of die, subjecting the substrate to two or more heating and cooling cycles each time the substrate is loaded onto and unloaded from the carriage.

[0013] Each time a substrate is clamped, released, heated, cooled, or otherwise manipulated, its physical properties, such as surface flatness, can change, and beyond a certain level of change, there is an increased risk of damaging the substrate, for example, through collision with mechanical parts of the system or magazines.

[0014] Additionally, current substrate handling concepts require complex mechanical setups during product conversion or new recipe creation, and small material changes or slight misadjustments during setup often result in damaged or destroyed strips due to collisions against mechanical parts during loading, transport, guiding, holding, and unloading.

[0015] Current die bonders with thin die capability typically have a single substrate handler and therefore do not offer the possibility of sorting die from wafer to substrate based on their quality classification (bin). Bin sorting must be performed either separately by dedicated upstream equipment that sorts wafers with mixed bins into carriers each containing only die of one bin, or by a multi-pass process on one or more conventional die bonders, where only die of one bin are produced in each pass. Both solutions have significant drawbacks in terms of cost-effectiveness, the need for expensive cleanroom floor space, and an increased risk of damage due to the extra handling of materials.

[0016] Furthermore, typical current systems with a single strip handler do not allow for die sorting, requiring additional investment to provide this as an upstream process in a separate system.

[0017] Moreover, conventional substrate handlers require long and risky product setup and changeover due to the aforementioned complex mechanical setup.

[0018] Accordingly, the present invention aims to provide an apparatus and / or method for bonding a component to a substrate that allows relatively thin substrates (e.g., <100 μm) to be safely handled for the purpose of bonding a component, such as a semiconductor die, to the substrate.

[0019] It is a further object of the present invention to provide an apparatus and / or method for bonding components to substrates that allows for various bin sorting while achieving relatively high throughput.

[0020] It is yet another object of the present invention to provide an apparatus and / or method for bonding a component to a substrate that achieves a reduced cost of ownership.

[0021] It is yet another object of the present invention to provide an apparatus and / or method for bonding a component to a substrate in which a relatively long overall uptime is achieved. Summary of the Invention

[0022] In accordance with the present invention, there is provided an apparatus for bonding one or more components to one or more substrates, the apparatus comprising: a bonding station for bonding a component to a substrate, the component being bonded to the substrate at the bonding station; a transport device for transporting substrates along a track from one or more loading stations via a bonding station to one or more unloading stations each time, the transport device comprising: a carriage having a flat support surface for supporting a substrate; a carriage movement device for moving the carriage along the track; and a transfer device including a hold-down device for holding the substrate on the support surface; one or more loading stations for loading the substrate onto the carriage, the one or more loading stations including one or more retraction devices for retracting the substrate onto the support surface of the carriage; and one or more unloading stations for unloading the substrate after the components have been bonded at the bonding station, the unloading stations including one or more extraction devices for removing the substrate from the support surface of the carriage.

[0023] Because one or more substrates are retracted at the loading station and extracted at the unloading station rather than pushed or pushed out, and because the one or more substrates are moved along the entire track by a carriage, very thin substrates (e.g., having a thickness of <100 μm) can be handled without, or at least with a reduced risk of damaging the substrate.

[0024] Because the substrate is supported by the same carriage during loading and unloading, and each process step (e.g., cleaning, bonding, post-bonding inspection) is performed on that carriage, no physical stress is induced for steps such as reclamping the substrate or transferring it to another carrier. Also, no additional time is required to apply and remove the hold-down function at each process position, and substrate transport is significantly reduced.

[0025] Furthermore, systems that rely on buffer storage, such as magazines that store substrates for bonding different bins of die, subject the substrate to two or more heating and cooling cycles each time the substrate is loaded onto and unloaded from the carriage.

[0026] The reduced cost of a single transport device allows configurations of, for example, four or more transport devices per system to support multi-bin handling at high throughput, thus offering a competitive cost per bond.

[0027] Additionally, the above described apparatus allows for speed optimized point-to-line pick and place options over heavy and slow gantry alternatives.

[0028] One embodiment relates to the aforementioned apparatus, wherein the loading station includes one or more input magazines for storing substrates, and the retraction device is configured to retract the substrates from the input magazines onto the support surface of the carriage; and / or The unloading station includes one or more output magazines for storing the substrates after the components have been bonded at the bonding station, and the extraction device is configured to remove the substrates from the support surface of the carriage and place them in the output magazines.

[0029] As mentioned above, by pulling the often ultra-thin substrates from the input magazine directly onto the carriage and from the carriage directly into the output magazine, the risk of damaging the substrates is reduced, thus ensuring a relatively high yield. Typical loading and unloading modules are based on pusher rods or roller drives, which exhibit a higher rate of strip jamming problems.

[0030] One embodiment relates to the aforementioned apparatus, wherein the retraction device comprises: one or more retractable grippers (15) for gripping a front end (25) of the substrate (3), such as the end (26) facing the carriage (11), when viewed in the direction of movement (X) along the track; one or more retractable gripper movement devices (16) for moving the retractable grippers back and forth in a movement direction parallel to the track; and / or The extraction device (10) one or more pull-out grippers (27) for gripping the front end (25) of the substrate when viewed in the direction of movement along the track; and one or more pull-out gripper movement devices (28) for moving the pull-out grippers back and forth in a movement direction parallel to the track.

[0031] One or more sensors may be provided to detect successful loading and / or unloading.

[0032] Preferably, the retracting gripper is movable in the X direction along the track, more preferably at least as far / long as the maximum substrate / strip length. The retracting gripper is also preferably movable vertically, i.e., in the Z direction, to allow collision-free movement of the substrate / strip. Furthermore, the retracting gripper may have a load position and a standby position.

[0033] In one embodiment, related to the aforementioned apparatus, when the loading station includes an input magazine for storing substrates, the retractable gripper movement device is configured to move the retractable gripper back and forth in a movement direction parallel to a trajectory toward the input magazine and a trajectory away from the input magazine.

[0034] One embodiment relates to the aforementioned apparatus, wherein the retraction device comprises: -Includes a fixed frame The retractable gripper movement device a guide attached to the frame and extending in the direction of movement, the retraction gripper being mounted on the guide so that it is movable on the carriage during use; and a drive unit for moving the retractable gripper along the guide.

[0035] In one embodiment, the stationary frame extends over a track adjacent to the input magazine such that a carriage can be moved beneath the frame; The retractable gripper is suspended from guides so that it can move on the carriage when it is underneath the frame, which is a very robust way of positioning and moving the retractable gripper.

[0036] Similar to the pull-in gripper, the pull-out gripper is preferably movable in the X direction along the track, more preferably at least as far / long as the maximum substrate / strip length. The pull-out gripper is also preferably movable in the Z direction, allowing the substrate / strip to be subsequently moved while on the carriage without colliding with the pull-out gripper. Furthermore, the pull-out gripper may have a load position and a standby position.

[0037] In one embodiment, the unloading station includes an output magazine for storing substrates, and the extraction gripper movement device is configured to move the extraction gripper through the output magazine in a direction of movement parallel to the track, so that the substrates can be extracted through and stored in the output magazine without the extraction gripper movement device getting in the way, so to speak.

[0038] In one embodiment, the extraction device is related to the aforementioned apparatus, when the loading station includes an input magazine for storing the substrates: - a fixing frame on the side of the output magazine facing away from the bonding station, The pull-out gripper movement device - includes a guide attached to the frame and extending in the direction of movement.

[0039] One embodiment relates to the above-mentioned device, further comprising a heating device for applying heat to the substrate when supported by the support surface; Preferably, the heating device is configured to apply heat to the substrate via the support surface.

[0040] Such a heater function may provide a constant temperature, or may be programmable to follow a predetermined temperature profile, as may be required, for example, for a bonding process in which a die attach film (DAF) on the die must reach a specific temperature to melt and provide adhesion, thereby completing the bonding process.

[0041] Additionally, the heating device may consist of multiple heating zones allowing for individual temperature settings for each zone.

[0042] One embodiment relates to the above-mentioned device, The apparatus further includes one or more vertical movement devices that allow vertical movement of the input magazine relative to the support surface of the carriage, minimizing the risk of damage.

[0043] Thus, the substrate can then be smoothly pulled onto the support surface without risk of damaging the substrate. Preferably, the vertically movable input magazine allows the substrate to be flush with the support surface.

[0044] In one embodiment, the apparatus is related to the above-described apparatus, wherein the retraction gripper and / or the pull-out gripper are configured to mechanically grip the edge of the substrate or to grip the edge of the substrate using negative pressure.

[0045] One embodiment relates to the aforementioned apparatus, wherein the hold-down device includes a retaining member on the support surface, the retaining member being movable towards and away from the support surface and configured to engage at least a portion of one or more peripheral edges of the substrate in a lower retaining position and positioned a distance above or to the side of the support surface (in the case of lateral rotational movement) in an upper non-operative position.

[0046] The retaining member may include, for example, mechanical, electromechanical, magnetic, or hydraulic / pneumatic hold-down means.

[0047] One embodiment relates to the aforementioned apparatus, wherein the holding members include respective passages at opposite lateral edges of the carriage, the passages being configured, at least in the inoperative position of the holding members, to allow a retraction device to pass horizontally when retracting a substrate onto the support surface of the carriage and / or an extraction device to pass horizontally when removing a substrate from the support surface of the carriage.

[0048] In one embodiment, the retaining member is frame-shaped and has one or more retaining frame portions, each retaining frame portion positioned and configured to contact one or more respective edges of the substrate along at least a portion of the length of the edge.

[0049] In one embodiment, the retaining member has a plurality of retaining pins, each positioned on the retaining member to engage the substrate at an edge of the substrate in the retaining position. The pins may be spring biased.

[0050] One embodiment relates to the aforementioned apparatus, wherein the carriage movement device includes a linear guide and a drive for driving the carriage to move along the linear guide, the drive preferably including a belt drive.

[0051] Such an arrangement is relatively small, consumes relatively little space, and is relatively cost effective.

[0052] One embodiment relates to the apparatus described above, wherein the support surface is rectangular and configured to support the entire surface of the substrate.

[0053] One embodiment relates to the aforementioned apparatus, wherein the hold-down device is configured to use negative pressure to hold the substrate on the support surface.

[0054] The hold-down device may, for example, comprise boreholes or porous material for applying negative pressure or (over)pressurized air to the substrate, and air ducts connected to at least one negative pressure generator and / or pressurized air source, respectively. Such negative pressure contributes to effectively holding the substrate on the surface. For example, overpressure may be temporarily applied when the substrate is attached to or detached from the carriage to further reduce friction between the substrate and the support surface.

[0055] In one embodiment, the hold-down device relates to the aforementioned apparatus, and includes a channel disposed in the carriage, the channel configured to allow negative pressure to be applied through the channel to hold the substrate on the support surface.

[0056] Preferably, in use, the negative pressure acts first in the central region of the support surface and then propagates to the edges of the support surface to achieve a uniform "hold down", which increases yield.

[0057] One embodiment relates to the above-mentioned device, the component is of a type selected from the list consisting of a semiconductor chip, die, semiconductor package, integrated circuit, optical element, electronic element, electro-optical element, electro-mechanical element, or any combination thereof; and / or The substrate is preferably strip-shaped with a length to width ratio of 3:1 or 2:1.

[0058] One embodiment relates to an apparatus as described above, the apparatus comprising two or more of the above transport devices, with individual loading and unloading stations for each of the two or more transport devices.

[0059] Such equipment allows for optimal configuration of "lanes" according to the customer's production needs, with the number of lanes configured based on the number of quality grades (bin codes), ensuring superior throughput, improved cost of ownership, and minimal floor space.

[0060] One embodiment relates to the above apparatus, where the number of transport devices corresponds to the number of bins provided plus one.

[0061] Another aspect of the invention relates to a method of bonding one or more components to one or more substrates using the apparatus described above, the method comprising: - loading the substrate onto the carriage at a loading station by drawing the substrate onto a support surface of the carriage with a drawing device; - transferring the substrate each time from the loading station to the bonding station along a track by a transfer device; - bonding the component to the substrate at a bonding station; - after the components are bonded at the bonding station, the substrate is transported along the track from the bonding station to the unloading station by a transport device each time; unloading the substrate from the carriage at an unloading station by pulling the substrate away from the support surface of the carriage with an extraction device.

[0062] One embodiment relates to the method described above, wherein a pre-bonding inspection and / or pre-bonding cleaning, and / or a post-bonding inspection and / or post-bonding cleaning are performed before or after bonding at the bonding station, respectively.

[0063] The modules for pre-bonding and post-bonding inspection and / or cleaning are preferably arranged in the direction of movement (X) and are configured so that the substrate does not have to leave the support plate and the hold-down can remain activated.

[0064] Apparatus embodiments according to the invention can be applied in a similar manner to method embodiments according to the invention, and vice versa. Similarly, advantages of apparatus embodiments according to the invention can also be applied to corresponding method embodiments, and vice versa. [Brief explanation of the drawings]

[0065] The invention will now be explained in more detail with reference to exemplary embodiments shown in the drawings. [Figure 1a] 1 shows an example embodiment of an apparatus according to the invention with four transport devices. [Figure 1b] 1 illustrates an example embodiment of a loading station, such as the loading station shown in FIG. 1 a, where a substrate is loaded onto a support surface of a carriage from an input magazine by a retraction device. [Figure 1c] 1 illustrates an example embodiment of a loading station, such as the loading station shown in FIG. 1b, where a substrate is loaded onto a support surface of a carriage from an input magazine by a retraction device. [Figure 2a] 1 shows an example embodiment of an apparatus according to the present invention, such as the apparatus shown in FIG. 1 a, in which a substrate is moved along a track in the apparatus. [Figure 2b] 2a depicts an example embodiment of a loading station, such as the loading station shown in FIG. 2a, where the substrate is moved along a track after being loaded onto the support surface of the carriage from an input magazine by a retraction device. [Figure 3a] 2a depicts an example embodiment of an unloading station, such as the unloading station shown in FIG. 2a, where a substrate has been unloaded from a support surface of a carriage into an output magazine by an extraction device; [Figure 3b] 2a depicts an example embodiment of an unloading station, such as the unloading station shown in FIG. 2a, where a substrate has been unloaded from a support surface of a carriage into an output magazine by an extraction device; [Figure 3c] 2a, 3a and 3b illustrate an example embodiment of an unloading station, such as the unloading station illustrated in FIGS. 2a, 3a and 3b, where a substrate is unloaded from a support surface of a carriage into an output magazine by an extraction device. [Figure 4] 1 illustrates an example embodiment of a carriage movement device having a linear guide and a drive for driving the carriage to move the carriage along the linear guide. DETAILED DESCRIPTION OF THE INVENTION

[0066] 1a-4 are described in conjunction. As mentioned above, FIG. 1a illustrates an example embodiment of an apparatus 1, particularly a die bonder, according to the present invention, having four transport devices (or "transport lanes") 7. More specifically, FIG. 1a illustrates an apparatus 1 for bonding one or more components, such as NAND and DRAM memory dies, to one or more substrates (designated by reference numeral 3 in other figures, such as FIG. 1b). The apparatus 1 includes a bonding station 5 for bonding components (such as ultra-thin dies having a thickness of <15 μm) to the substrates, one or more of the components being bonded to each of a plurality of substrates at the bonding station 5. The transport device 7 may alternatively or additionally include an inspection station instead of the bonding station 5. The bonding station 5 may include, for example, a two-point-to-line pick-and-place system capable of performing a die sorting process without a significant loss of productivity when compared to currently available NAND die bonding equipment, or alternatively, capable of manufacturing without a die sorting process at a relatively high throughput. Post-bonding processes such as cleaning, inspection, or heating may also be optionally performed. After unloading the substrate 3 at the unloading station 6, the support surface 12 may also be cleaned or inspected. The apparatus 1 may further include advanced inspection features such as UVI, crack detection, airborne and stationary particle detection, a touch screen, etc.

[0067] Each transport device 7 is configured to transport one of the plurality of substrates each time along the track 8 from the loading station 4 via the bonding station 5 to the unloading station 6 in the movement direction X. Each transport device 7 includes a carriage 11 having a flat support surface 12 for supporting a substrate, a carriage movement device 13 for moving the carriage 11 along the track 8 (as shown more clearly in FIG. 4 ), and a hold-down device (denoted by reference numeral 14 in other figures such as FIG. 1 b) for holding the substrate on the support surface 12. The transport device 7 further includes a loading station 4 for loading a substrate onto the carriage 11, the loading station 4 including a retraction device 9 for retracting the one of the plurality of substrates onto the support surface 12 of the carriage 11, and an unloading station 6 for unloading the substrate after one or more of the components have been bonded at the bonding station 5, the unloading station 6 including a retraction device 10 for retracting the one of the plurality of substrates from the support surface 12 of the carriage 11. For example, the extraction of often ultra-thin substrates from an input magazine to an output magazine (as shown in other figures) is important to ensure a relatively high yield. Typical loading and unloading modules are based on pusher rod or roller drives that exhibit a relatively high rate of strip / substrate 3 jamming problems.

[0068] The main influencing parameters for the number of transport devices 7 used are the number of die quality classifications (bins / types) on the wafer and throughput targets. The support surface 12 is preferably designed to have a certain rigidity, such as being able to withstand at least 50 N, e.g., at least 100 N.

[0069] The loading station 4 may include an input magazine 20 for storing a plurality of the substrates 3, and the retraction device 9 is configured to retract the one of the plurality of substrates from the input magazine 20 directly onto the support surface 12 of the carriage. Similarly, the unloading station 6 may include an output magazine 21 for storing the plurality of substrates after one or more of the components have been bonded at the bonding station 5, and the extraction device 10 is configured to remove the one of the plurality of substrates from the support surface 12 of the carriage 11 and place it directly into the output magazine 21.

[0070] Although four transport devices 7 are shown in FIG. 1a, the apparatus 1 may generally comprise two or more of the transport devices 7, such as two to four such transport devices 7, with individual retraction devices 9 and extraction devices 10 for each of two or more of the transport devices 7. However, there is also the option of using retraction devices 9 for more than one input magazine 20 by introducing a Y-axis into the gripping device. The number of transport devices 7 may correspond to the number of supplied bin codes / qualities / types or the number of supplied bin types plus one. When three bin types are supplied, the number of transport devices 7 may be, for example, three or four. Preferably, each transport device / lane 7 handles a single bin type. Preferably, one bin type is used per substrate 3. Similarly, preferably, one bin type is used per loading station 4 and / or unloading station 6 (e.g., one bin type per input magazine 20 and / or output magazine 21). The bonding station 5 may include one or more die ejectors, a first (left) picker, a second (right) picker, a first (left) transfer table, a second (right) transfer table, a first (left) bond arm, and a second (right) bond arm (all not shown for clarity). For example, when three bins are provided, a first transport device / lane 7 may handle a first bin type, a second transport device / lane 7 may handle a second bin type, and a third transport device / lane 7 may handle a third bin type. A first substrate 3 associated with the first bin type may be located relatively "left" of the track 8 of the first transport device 7 (relatively closer to the loading station 4), while a second substrate 3 and a third substrate 3 associated with the second and third bin types, respectively, may advance further along the track 8 and thus be located relatively "right" of the track 8 (relatively closer to the unloading station 6).The die ejector may then supply the die having the first bin type to the first picker, the first transfer table, and the first bond arm, which then places the die having the first bin type on the associated substrate 3 of the first transport device 7. The die ejector may then supply the die having the second bin type and the die having the third bin type to the second picker, the second transfer table, and the second bond arm, which then places the die having the second bin type and the die having the third bin type on the associated substrate 3 of the second transport device 7 and the associated substrate 3 of the third transport device 7, respectively. Thus, an efficient multi-lane bonding process with relatively high throughput can be achieved.

[0071] FIG. 1b shows an example embodiment of a loading station 4, such as the loading station 4 shown in FIG. 1a, in which a substrate 3 has been loaded by a retraction device 9 from an input magazine 20 onto the support surface 12 of a carriage 11. As shown in FIG. 1b, the retraction device 9 may include a retraction gripper 15 for gripping a front end 25 of the substrate 3, i.e., the end 26 facing the carriage 11, when viewed in the direction of movement (X) along the track 8, and a retraction gripper movement device 16 for moving the retraction gripper 15 back and forth in a movement direction parallel to the track 8, in particular towards and away from the input magazine 20. The retraction gripper 15 may include a mechanical gripper and / or a suction tip. The input magazine 20 and / or the output magazine 21 may be movable / detachable from each transport device / lane 7, for example using a transfer robot.

[0072] The retraction device 9 may further include a fixed frame 17. The retraction gripper movement device 16 is mounted on the frame 17 and may include a guide 18 extending in the direction of movement (X), and the retraction gripper 15 is mounted on the guide 18 so that it is movable on the carriage 11 during use. A drive unit may also be provided (not shown) for moving the retraction gripper 15 along the guide 18. The retraction device 9 may include a sensor (e.g. a mass flow sensor or a distance sensor) for detecting successful engagement of the substrate 3.

[0073] The apparatus 1 may further comprise a heating device 23 for applying heat to the substrate 3 when supported by the support surface 12. The heating device 23 is preferably configured to apply heat to the substrate 3 via the support surface 12. The heating device 23 may comprise a heating wire, a temperature sensor, etc. embedded in the support surface or provided directly below the support surface. The heating device 23 may have dimensions of, for example, 300 mm (direction of movement) x 100 mm (lateral direction). The support surface 12 preferably also comprises a cooling function.

[0074] The apparatus 1 may also include a vertical movement device 32 (shown diagrammatically) for vertically moving the input magazine 20 so that the one of the plurality of substrates 3 pulled out of the input magazine 20 by the retraction device 9 is moved to a vertical level flush with the support surface 12 of the carriage 11.

[0075] The retraction gripper 15 (and / or the pull-out gripper 27, for example as shown in FIG. 3b) may be configured to grip the edge 25 of the substrate 3 mechanically, or may be configured to grip said edge 25 of the substrate 3 using negative pressure, such as a vacuum.

[0076] The hold-down device 14 may include a retaining member 22 on the support surface 12, movable toward and away from the support surface 12 and configured to engage at least a portion of one or more peripheral edges 33 of the substrate 3 in a lower retaining position and positioned a distance above the support surface in an upper inoperative position. The retaining member 22 may include respective passages 24a, 24b at opposite lateral edges 34 of the carriage 11, configured, at least in the inoperative position of the retaining member 22, to allow the retraction device 9 to pass horizontally when retracting the substrate 3 onto the support surface 12 of the carriage 11 and / or the extraction device 10 to pass horizontally when removing the substrate 3 from the support surface 12 of the carriage 11 (as shown in Figures 3b and 3c).

[0077] Preferably, the support surface 12 is rectangular and configured to support the entire surface of the substrate 3 .

[0078] The hold-down device 14 may be configured to hold the substrate 3 on the support surface 12 using negative pressure, such as vacuum. In that case, the hold-down device 14 may include a channel 35 provided in the carriage 11. The channel 35 is preferably configured so that negative pressure can be applied therethrough to hold the substrate 3 on the support surface 12, and so that, in use, the negative pressure acts first in a central region 36 of the support surface 12 and then propagates to an edge 37 of the support surface 12. In addition to the channel 35 connected to at least one pressurized air source, the support surface 12 may also include boreholes or porous material for applying underpressure air or overpressure air to the substrate 3 from below. Pressurized air may be needed to cool the support surface 12 and substrate 3 in the event of a production stop and / or to temporarily apply overpressure when retracting the substrate onto the support surface.

[0079] The apparatus 1 is preferably configured for bonding a component to a substrate 3 .

[0080] The component is of a type selected from the list consisting of a semiconductor chip, a die, a semiconductor package, an integrated circuit, an optical element, an electronic element, an electro-optical element, an electro-mechanical element, or any combination thereof, and / or the substrate 3 is strip-shaped, preferably having a length to width ratio of 3:1 or 2:1.

[0081] FIG. 1 c shows an example embodiment of a loading station 4 such as the loading station 4 shown in FIG. 1 b, in which a substrate 3 has been loaded onto a support surface 12 of a carriage 11 from an input magazine 20 by a retraction device 9 .

[0082] Figure 2a shows an example embodiment of an apparatus 1 according to the invention, such as the apparatus 1 shown in Figure 1a, with substrates 3 being moved along a track in the apparatus 1, as shown in the left part of Figure 2a. The right part of Figure 2a shows three substrates 3 waiting to be unloaded.

[0083] FIG. 2b shows an example embodiment of a loading station 4 such as the loading station 4 shown in FIG. 2a, in which the substrate 3 is moved along a track after being loaded by a retraction device 9 from an input magazine 20 onto the support surface 12 of a carriage 11.

[0084] 3a and 3b show an example embodiment of an unloading station 6, such as the unloading station 6 shown in FIG. 2a, in which a substrate 3 has been unloaded by an extraction device 10 from the support surface 12 of a carriage 11 into an output magazine 21.

[0085] Figure 3c shows an example embodiment of an unloading station 6, such as the unloading station 6 shown in Figures 2a, 3a, and 3b, where a substrate 3 has been unloaded by the extraction device 10 from the support surface 12 of the carriage 11 into the output magazine 21. Figure 3c more clearly shows that the extraction device 10 may include an extraction gripper 27 for gripping a front end 25 of the substrate 3 when viewed in the direction of movement along the track (X), and an extraction gripper movement device 28 for moving the extraction gripper 27 back and forth in a movement direction parallel to the track. As shown in Figure 3c, the extraction gripper movement device 28 is preferably configured to move the extraction gripper 27 through the output magazine 21 in the movement direction parallel to the track.

[0086] The extraction device 10 may further include a fixed frame 29 on the side of the output magazine 21 facing away from the bonding station 5. The extraction gripper movement device 28 may include a guide 18 attached to the frame 29 and extending in the movement direction (X). The extraction gripper movement device 28 may move on the guide 18 in the movement direction (X).

[0087] 4 shows an example embodiment of a carriage movement device 13 having a linear guide 30 and a drive 32 for driving the carriage 11 to move the carriage 11 along the linear guide 30. The drive 32 preferably includes a belt drive 38. The linear guide 30 preferably runs all the way from the loading station 4 to the unloading station 6 without interruption.

[0088] As mentioned above, another aspect of the present invention relates to a method of bonding a component to a substrate 3 using an apparatus 1 as shown in the figures, the method including: loading a substrate 3 onto a carriage 11 at a loading station 4 by directly drawing the one of the plurality of substrates 3 onto a support surface 12 of the carriage with a drawing device 9; transporting one of the plurality of substrates 3 from the loading station 4 to a bonding station 5 along a track 8 with a transport device 7 each time; bonding a component to the substrate 3 at the bonding station 5; and after one or more of the components have been bonded at the bonding station 5, transporting one of the plurality of substrates 3 from the bonding station to an unloading station 6 with the transport device 7 each time; and unloading the substrate 3 from the carriage 11 at the unloading station 6 by pulling the one of the plurality of substrates 3 away from the support surface 12 of the carriage 11 with a pulling device 10.

[0089] While the present disclosure has been described above with reference to exemplary embodiments, variations within the scope of the present disclosure will readily occur to those skilled in the art after reading the above description. Such variations fall within the scope of the independent and dependent claims. In addition, it should be understood that explicit claims are made to variations as set forth in the dependent claims. It should also be noted that the exemplary embodiments shown in the figures, or features thereof, may be combined to produce embodiments not explicitly shown in the figures. [Explanation of symbols]

[0090] 1. Equipment 2.- 3. Substrate 4.Loading Station 5. Bonding Station 6.Unloading Station 7.Transportation Device 8. Orbit 9. Retraction Device 10. Extraction device 11. Carriage 12. Flat support surface 13. Carriage moving device 14.Pressure device 15.Retractable Gripper 16. Retractable Gripper Movement Device 17. Still Frame (Pull-in) 18. Guide 19.- 20. Feeding magazine 21. Output magazine 22. Retaining member 23. Heating Device 24. Passages (24a, 24b) in the holding member 25. Front end of the board 26. Front edge of board facing the carriage 27. Pull-out gripper 28. Pull-out gripper movement device 29. Fixed frame (drawer) 30. Linear guide 31. Drive unit 32. Vertical movement device 33.Edge of the board 34. Lateral edge of carriage 35. Channel for providing negative pressure 36. Central area of ​​the support surface 37. Edge of support surface 38. Belt transmission device X.Moving direction

Claims

1. An apparatus (1) for bonding one or more components to one or more substrates (3), comprising: a bonding station (5) for bonding the component to the substrate, the component being bonded to the substrate at the bonding station; a transport device (7) for transporting the substrates each time along a track (8) from one or more loading stations (4) via the bonding station to one or more unloading stations (6), a carriage (11) having a flat support surface (12) for supporting the substrate; a carriage movement device (13) for moving the carriage along the track; and a transfer device (7) including a hold-down device (14) for holding the substrate on the support surface; one or more loading stations (4) for loading the substrate onto the carriage, the one or more loading stations (4) including one or more retraction devices (9) for retracting the substrate onto the support surface of the carriage; one or more unloading stations (6) for unloading the substrate after the components have been bonded at the bonding station, the unloading stations (6) including one or more extraction devices (10) for removing the substrate from the support surface of the carriage; An apparatus (1) comprising:

2. the loading station (4) comprises one or more input magazines (20) for storing the substrates (3), the retraction device (9) being configured to retract the substrates from the input magazines onto the support surface (12) of the carriage; and / or 2. The apparatus (1) of claim 1, wherein the unloading station (6) includes one or more output magazines (21) for storing the substrates after the components have been bonded at the bonding station (5), and the extraction device (10) is configured to remove the substrates from the support surface of the carriage (11) and place them in the output magazines.

3. The retraction device (9) one or more retractable grippers (15) for gripping a front end (25) of said substrate (3), such as an end (26) facing said carriage (11), when viewed in the direction of movement (X) along said track; one or more retractable gripper movement devices (16) for moving the retractable grippers back and forth in a movement direction parallel to the track; and / or The extraction device (10) comprises: one or more pull-out grippers (27) for gripping a leading edge (25) of the substrate when viewed in the direction of movement along the track; and one or more pull-off gripper movement devices (28) for moving said pull-off grippers back and forth in a movement direction parallel to said track.

4. When dependent on claim 2, 4. The apparatus (1) according to claim 3, wherein the extractor gripper movement device (28) is configured to move the extractor gripper (27) through the output magazine (21) in a movement direction parallel to the track.

5. a heating device (23) for applying heat to the substrate (3) when supported by the support surface (12); Apparatus (1) according to any one of claims 1 to 4, wherein the heating device is preferably configured to apply the heat to the substrate via the support surface.

6. When dependent on claim 2, 6. The apparatus (1) according to any one of claims 1 to 5, further comprising one or more vertical movement devices (32) enabling vertical movement of the input magazine (20) relative to the support surface (12) of the carriage (11).

7. When dependent on claim 3, 7. The apparatus (1) of claim 1, wherein the pull-in gripper (15) and / or the pull-out gripper (27) are configured to grip the edge (25) of the substrate mechanically or using negative pressure.

8. The presser device (14) includes a retaining member (22) on the support surface (12); 8. The apparatus (1) of claim 1, wherein the holding member is movable towards and away from the support surface and is configured to engage with at least a portion of one or more peripheral edges (33) of the substrate (3) in a holding position below the substrate (3) and is positioned at a distance above or to the side of the support surface in a non-operating position of the substrate (3).

9. the retaining member (22) includes respective passages (24a, b) at opposite lateral edges (34) of the carriage (11); 9. The apparatus (1) of claim 8, wherein the passages (24a, b) are configured, at least in the inoperative position of the holding member, to allow the retraction device (9) to pass horizontally when retracting the substrate (3) onto the support surface (12) of the carriage and / or the extraction device (10) to pass horizontally when removing the substrate from the support surface of the carriage.

10. 10. The apparatus (1) according to any one of claims 1 to 9, wherein the carriage movement device (13) comprises a linear guide (30) and a drive (32) for driving the carriage (11) to move along the linear guide.

11. The apparatus (1) according to any one of the preceding claims, wherein the hold-down device (14) is configured to hold the substrate (3) on the support surface (12) using negative pressure.

12. The hold-down device (14) includes a channel (35) provided in the carriage (11); 12. The apparatus (1) according to claim 11, wherein the channel is configured such that a negative pressure can be applied through the channel to hold the substrate (3) on the support surface (12).

13. 13. The device (1) according to claim 12, wherein, in use, the negative pressure acts first in a central region (36) of the support surface and then propagates to the edges (37) of the support surface.

14. the component is of a type selected from the list consisting of a semiconductor chip, die, semiconductor package, integrated circuit, optical element, electronic element, electro-optical element, electro-mechanical element, or any combination thereof; and / or 14. Apparatus (1) according to any one of the preceding claims, wherein the substrate is strip-shaped, preferably with a length to width ratio of 3:1 or 2:

1.

15. 15. The apparatus (1) according to any one of claims 1 to 14, comprising two or more of said transport devices (7), with respective said loading station (4) and said unloading station (6) for each of two or more of said transport devices.

16. 16. Apparatus (1) according to claim 15, wherein the number of conveying devices (7) corresponds to the number of supplied bins plus one.

17. A method for bonding one or more components to one or more substrates (3) using an apparatus (1) according to any one of claims 1 to 16, comprising: loading the substrate onto the carriage (11) at the loading station (4) by drawing the substrate onto a support surface (12) of the carriage with the drawing device (9); transferring the substrate each time from the loading station (4) to the bonding station (5) along a track (8) by the transfer device (7); bonding the component to the substrate at the bonding station; transporting the substrate from the bonding station to the unloading station (6) along a track (8) by the transport device (7) each time after the component has been bonded at the bonding station; unloading the substrate from the carriage at the unloading station by pulling the substrate away from a support surface of the carriage with the extraction device (10).

18. 18. The method of claim 17, wherein a pre-bonding inspection and / or pre-bonding cleaning, and / or a post-bonding inspection and / or post-bonding cleaning is performed before or after the bonding at the bonding station, respectively.

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