Automatic pressure control system and method for a cleaner

Abstract

The cleaning apparatus includes at least one cleaning module 12 configured to process electronic substrates 18 and a conveyor system 16 configured to transport the electronic substrates through the at least one cleaning module. The at least one cleaning module includes a fluid management system 20 having a manifold coupled to a fluid source. The manifold includes at least one outlet. The at least one cleaning module further includes automated valves 30a-30g coupled to the at least one outlet and to conduits leading to one or more first spray nozzles, and pressure sensors 52a-52f coupled to the automated valves. The pressure sensors are configured to measure the pressure of the fluid flowing through the conduits. The automated valves are configured to adjust the flow of the fluid through the conduits based on the pressure measured by the pressure sensors.

Description

[Technical Field]

[0001] This application relates generally to apparatus for cleaning electronic substrates, including printed circuit boards and semiconductor product assemblies, and more particularly to a system and method for automatically controlling fluid pressure within a cleaning apparatus. [Background technology]

[0002] Various types of liquid cleaning devices, sometimes called cleaners, are used to clean electronic boards to remove contaminants such as flux residue, resins, etc. These contaminants remain on the electronic board from the soldering process.

[0003] Soldering processes have advanced in two major directions in recent years: the transition from tin-lead solders to lead-free materials, and the miniaturization of electronic boards and the resulting increased density of small, low-profile components. These new soldering materials require higher soldering temperatures and are typically formulated with higher flux content by weight. The combination of lead-free processes and new electronic board designs requires more time and effort to meet industry cleanliness standards. Summary of the Invention

[0004] Cleaners are used to clean electronic boards of unwanted materials left behind by the soldering process. Such cleaners include a cleaning module and a rinsing module for cleaning the electronic boards. Managing the cleaning fluid with the cleaning module and rinsing module is challenging, particularly managing the fluid pressure within each module. A typical fluid management approach involves manually operating pressure valves within the system.

[0005] One aspect of the present disclosure relates to a cleaning apparatus for cleaning electronic substrates, including printed circuit boards and semiconductor product assemblies. In one embodiment, the cleaning apparatus includes at least one cleaning module configured to process the electronic substrates and a conveyor system configured to transport the electronic substrates through the at least one cleaning module. The at least one cleaning module includes a fluid management system having a manifold coupled to a fluid source. The manifold includes at least one outlet. The at least one cleaning module further includes an automated valve coupled to the at least one outlet and to a conduit leading to one or more first spray nozzles, and a pressure sensor coupled to the automated valve. The pressure sensor is configured to measure the pressure of the fluid flowing through the conduit. The automated valve is configured to adjust the flow of the fluid through the conduit based on the pressure measured by the pressure sensor.

[0006] Embodiments of the cleaning apparatus may further include a controller coupled to the automatic valve and the pressure sensor. The manifold may include at least two outlets, a first outlet and a second outlet. The fluid management system may further include a first automatic valve coupled to the first outlet and a first conduit leading to one or more first spray nozzles, and a second automatic valve coupled to the second outlet and a second conduit leading to one or more second spray nozzles. The fluid management system may further include a first pressure sensor coupled to the first automatic valve and a second sensor coupled to the second automatic valve. The first pressure sensor may be configured to measure the pressure of the fluid flowing through the first conduit, and the second pressure sensor may be configured to measure the pressure of the fluid flowing through the second conduit. The controller may be configured to control the first automatic valve and the second automatic valve to account for a pressure drop detected by one of the first pressure sensor and the second pressure sensor. A pressure drop detected by the first pressure sensor may cause the second automatic valve to close or partially close.

[0007] Another aspect of the present disclosure relates to a cleaning apparatus for cleaning electronic substrates, including printed circuit boards and semiconductor product assemblies. In one embodiment, the cleaning apparatus includes at least one cleaning module configured to process the electronic substrates and a conveyor system configured to transport the electronic substrates through the at least one cleaning module. The at least one cleaning module includes a fluid management system having a manifold coupled to a fluid source. The manifold includes at least two outlets, a first outlet and a second outlet. The fluid management system further includes a first automated valve coupled to the first outlet and a first conduit leading to one or more first spray nozzles, and a second automated valve coupled to the second outlet and a second conduit leading to one or more second spray nozzles. The fluid management system further includes a first pressure sensor coupled to the first automated valve and a second sensor coupled to the second automated valve. The first pressure sensor is configured to measure a pressure of the fluid flowing through the first conduit, and the second pressure sensor is configured to measure a pressure of the fluid flowing through the second conduit, and at least one of the first automated valve and the second automated valve is configured to adjust the flow of the fluid through its respective conduit based on the pressure measured by one of the first pressure sensor and the second pressure sensor.

[0008] Embodiments of the cleaning apparatus can further include a controller coupled to the first and second automatic valves and the first and second pressure sensors. The controller can be configured to control the automatic valves to account for a pressure drop detected by one of the first and second pressure sensors. The pressure drop detected by the first pressure sensor can cause the second automatic valve to close or partially close.

[0009] Yet another aspect of the present disclosure relates to a method for cleaning electronic substrates using a cleaning apparatus. In one embodiment, the method includes transporting the electronic substrates through at least one cleaning module by a conveyor system, performing a cleaning operation using the at least one cleaning module, detecting a pressure drop in one of a first conduit and a second conduit, and adjusting one of at least two automated valves associated with the first conduit and the second conduit, respectively, to account for the pressure drop.

[0010] Another aspect of the present disclosure relates to a fluid management system of a cleaning module of a cleaning apparatus for cleaning electronic substrates, including printed circuit boards and semiconductor product assemblies. In one embodiment, the fluid management system includes a manifold coupled to a fluid supply. The manifold includes at least one outlet. The fluid management system further includes an automated valve coupled to the at least one outlet and to a conduit leading to one or more first spray nozzles, and a pressure sensor coupled to the automated valve. The pressure sensor is configured to measure the pressure of the fluid flowing through the conduit. The automated valve is configured to adjust the flow of the fluid through the conduit based on the pressure measured by the pressure sensor.

[0011] An embodiment of the fluid management system may further include coupling a controller to the automatic valves and pressure sensors. The manifold may include at least two outlets, a first outlet and a second outlet. The fluid management system may further include a first automatic valve coupled to the first outlet and a first conduit leading to one or more first spray nozzles, and a second automatic valve coupled to the second outlet and a second conduit leading to one or more second spray nozzles. The fluid management system may further include a first pressure sensor coupled to the first automatic valve and a second sensor coupled to the second automatic valve. The first pressure sensor may be configured to measure the pressure of the fluid flowing through the first conduit, and the second pressure sensor may be configured to measure the pressure of the fluid flowing through the second conduit. The controller may be configured to control the first automatic valve and the second automatic valve to account for a pressure drop detected by one of the first pressure sensor and the second pressure sensor. A pressure drop detected by the first pressure sensor may cause the second automatic valve to close or partially close. The fluid management system may further include an overflow valve for excluding fluid from the manifold in the event of an overflow situation.

[0012] The accompanying drawings are not intended to be drawn to scale. In the drawings, each identical or nearly identical component shown in various figures is represented by a like reference numeral. For clarity, not every component may be labeled in every drawing. [Brief explanation of the drawings]

[0013] [Figure 1] FIG. 2 is a perspective view of the electronic substrate cleaning device. [Figure 2] FIG. 1 is an elevation view of a portion of a fluid management system used to deliver fluid under pressure to spray nozzles associated with the system. [Figure 3] FIG. 3 is a perspective view of a portion of the fluid management system shown in FIG. 2. [Figure 4] FIG. 2 is an elevation view of another portion of the fluid management system. [Figure 5] FIG. 5 is a perspective view of the portion of the fluid management system shown in FIG. 4. [Figure 6] 5 is another perspective view of the portion of the fluid management system shown in FIG. 4. DETAILED DESCRIPTION OF THE INVENTION

[0014] Solder paste is routinely used in the assembly of electronic substrates, including printed circuit boards and semiconductor product assemblies, to join electronic components to the substrate. Solder paste contains a solder for joint formation and a flux for preparing the metal surface for solder attachment. Solder paste can be deposited onto metal surfaces (e.g., electronic pads) on electronic substrates using any number of application methods. In one example, a stencil printer may use a squeegee to extrude the solder paste through a metal stencil laid over the exposed surface of the electronic substrate. In another example, a dispenser may dispense the solder paste material onto specific areas of the electronic substrate. The leads of the electronic component are aligned and pressed into the solder deposit to form the assembly. In the reflow soldering process, the solder is heated to a temperature sufficient to melt and then cooled to permanently bond the electronic component to the electronic substrate electrically and mechanically. Solder typically comprises an alloy with a melting temperature lower than that of the metal surfaces being joined. The temperature must also be low enough to avoid damaging the electronic component. In certain embodiments, the solder may be a tin-lead alloy, although solders using lead-free materials may also be used. Another process for attaching components to electronic boards is the wave soldering process.

[0015] For soldering, flux typically contains a vehicle, solvent, activator, and other additives. The vehicle is a solid or nonvolatile liquid that coats the surfaces to be soldered and can include rosin, resin, glycol, polyglycol, polyglycol surfactant, and glycerin. The solvent, which evaporates during the preheating and soldering process, dissolves the vehicle activator and other additives. Typical examples of solvents include alcohol, glycol, glycol ester and / or glycol ether, and water. The activator promotes the removal of metal oxides from the surfaces to be soldered. Common activators include amine hydrochlorides, dicarboxylic acids such as adipic acid and succinic acid, and organic acids such as citric acid, malic acid, or abietic acid. Other flux additives include surfactants, viscosity modifiers, and additives to provide low slump or good tack to hold components in place before reflow.

[0016] As described above, the soldering process described herein leaves unwanted contaminants on the electronic boards, which must be cleaned before they are released for use. This application discloses an in-line cleaning process for removing unwanted contaminants from a manufacturing process. In one embodiment, a fluid management system is used to manage the fluids used to clean and rinse the electronic boards as they pass through each module of a cleaning apparatus. The fluid management system includes a primary manifold and a series of valves and transducers for managing the pressure of the fluids within the system. Unlike conventional approaches that require an operator to manually change the fluid pressure within the system, the fluid management system is configured with a closed-loop approach to automatically control pressure valves within the system to control the fluid pressure within the system. Unwanted pressure drops in one area of ​​the fluid management system can cause pressure increases in other parts of the system. The fluid management system is configured to provide closed-loop feedback of the pressure throughout the system to immediately address unwanted pressure drops.

[0017] It should be understood that the system and device embodiments discussed herein are not limited in application to the details of construction and the arrangement of components set forth in the following description or illustrated in the accompanying drawings. The systems and devices may be implemented in other embodiments and may be practiced or carried out in various ways. Examples of specific implementations are provided herein for purposes of illustration only and are not intended to be limiting. Additionally, the phraseology and terminology used herein are for purposes of description and should not be considered limiting. The use of "including," "comprising," "having," "containing," "accompanying," and variations thereof herein is intended to encompass the preceding listed items and equivalents thereof, as well as additional items. Terms described with "or" may be construed as inclusive, such that they may refer to a singular term, more than one term, and all of the described terms. References to front, back, left, right, top, bottom, above and below, and vertical and horizontal are for convenience of description and do not limit the present systems and methods or components thereof to any single positional or spatial orientation.

[0018] Referring now to the drawings, and more particularly to FIG. 1 , an electronic substrate cleaning apparatus is generally indicated at 10. As shown, the cleaning apparatus 10 is an elongated structure including several modules, each indicated at 12, for cleaning and processing electronic substrates. In one exemplary embodiment, the cleaning apparatus 10 includes one or more of the following modules: a pre-clean module, a cleaning module, a pre-rinse module, a rinse module, and a drying module. A control module with a user interface, together indicated at 14, provides an operator with the ability to program and monitor the cleaning apparatus 10.

[0019] The cleaning apparatus 10 further includes an elongated conveyor 16 configured to transport electronic boards, such as electronic boards 18, through the modules 12 of the cleaning apparatus. As mentioned above, the electronic boards 18 can include printed circuit boards and semiconductor product assemblies. The conveyor 16 is designed to securely hold the electronic boards 18 during the sometimes rigorous cleaning process. Trays may be used to support items being transported through the cleaning apparatus 10 for cleaning. Embodiments of the present disclosure relate to fluid management systems used to manage the cleaning and rinsing fluids used in the pre-wash, wash, pre-rinse, and rinse modules.

[0020] 2-6, and more particularly, FIGS. 2 and 3, cleaning apparatus 10 includes a fluid management system generally designated 20. As discussed above, each of the pre-wash module, wash module, pre-rinse module, and rinse module includes a fluid management system similar or identical to fluid management system 20 shown and described herein. Differences in fluid management systems 20 may include the layout of the fluid management system and the number of components used to assemble the fluid management system. For example, as described in more detail below, fluid management system 20 may include various manifolds, conduits, and spray nozzles used to spray fluids onto articles passing through the module. Fluid management systems 20 shown and described herein may be incorporated into module 12 of cleaning apparatus 10 with only minor modifications and design changes.

[0021] As shown, the fluid management system 20 includes a primary manifold, generally designated 22, which is connected to a fluid source, as described in more detail below. Specifically, the primary manifold 22 includes a manifold body 24 having a lower end opening 26 connected to the fluid source, and several ports or nipples, designated 28a, 28b, 28c, 28d, 28e, and 28f, for distributing the fluid. In the illustrated embodiment, the primary manifold 22 includes six ports 28a, 28b, 28c, 28d, 28e, and 28f located on different sides of the manifold body 24 along its length. In the illustrated example, port 28a is located on one side of the manifold body 24, ports 28b and 28c are located on an adjacent side of the manifold body, and ports 28d, 28e, and 28f are located on an opposite side of the manifold body. The number and location of the ports can be modified depending on the number of spray components provided as part of the fluid delivery system.

[0022] Fluid management system 20 further includes valves, designated 30a, 30b, 30c, 30d, 30e, 30f, and 30g, for controlling fluid flow. As shown, port 28a is connected to valves 30a and 30b by conduit 32; port 28b is connected to valve 30c; port 28c is connected to valve 30d; port 28d is connected to valve 30e; port 28e is connected to valve 30f; and port 28f is connected to valve 30g. Valves 30a, 30b, 30c, 30d, 30e, 30f, and 30g may each include a flow control valve designed to regulate the amount of fluid passing through the valve. The flow control valve may include an actuator and a positioner for regulating the amount of fluid passing through the valve. Examples of types of valves that may be used include globe valves, diaphragm valves, ball valves, and butterfly valves. The flow control valve may also be associated with a hydraulic actuator that opens and controls the valve in response to changes in pressure or flow rate.

[0023] Each valve is connected to a conduit, which in turn leads to one or more spray nozzles. Specifically, valve 30a is connected to conduit 34a, which is further connected to secondary manifold 36a. Two spray bars, each indicated at 38, are connected to secondary manifold 36a, and each spray bar includes a plurality of nozzles or openings for spraying fluid. Similarly, valve 30b is connected to conduit 34b, which is connected to secondary manifold 36b. Although not shown, the spray bars or nozzles can be configured to include spray bar 38, similar to secondary manifold 36a.

[0024] Valve 30c is connected to conduit 40a, which is connected to an elongated secondary manifold 42a. Connected to elongated secondary manifold 42a are several spray bars, each indicated at 44. As shown, there are eight spray bars 44, which are longer and contain more nozzles than spray bar 38. Similarly, valve 30d is connected to conduit 40b, which is connected to an elongated secondary manifold 42b. Connected to elongated secondary manifold 42b are several spray bars, each indicated at 44. Similar to secondary manifold 42a, there are eight spray bars 44 secured to secondary manifold 42b.

[0025] Valve 30e is connected to conduit 46a, which is connected to another secondary manifold 48. Like the other secondary manifolds, e.g., secondary manifolds 36a, 36b, 42a, and 42b, the secondary manifold is connected to a spray bar (not shown). Similarly, valve 30f is connected to conduit 46b, which is connected to a secondary manifold (not shown). Valve 30g is connected to conduit 50, which leads to an overflow reservoir (not shown). Valve 30g therefore functions as an overflow valve in the event of unwanted pressure in primary manifold 22.

[0026] Between each valve and its respective conduit is a pressure sensor, sometimes called a pressure transducer. A pressure sensor is a device for measuring the pressure of a liquid. As is well known, pressure is a representation of the force required to stop a fluid from expanding, usually defined as force per unit area. A typical pressure sensor acts as a transducer that generates a signal in response to the applied pressure. In one embodiment, the signal is an electrical signal or impulse. Pressure sensors are used to control and monitor the pressure of fluids within a fluid management system. In some embodiments, pressure sensors can be referred to as pressure transducers, pressure transmitters, pressure indicators, piezometers, and / or manometers. Some pressure sensors can be configured as pressure switches that turn on or off at a specific pressure. For example, a water pump associated with a fluid management system can be controlled by a pressure switch so that when water is released from the system, the water pump activates, reducing the pressure in the reservoir.

[0027] As shown, pressure sensor 52a is positioned next to valve 30a to measure the pressure of fluid flowing through valve 30a, pressure sensor 52b is positioned next to valve 30b to measure the pressure of fluid flowing through valve 30b, pressure sensor 52c is positioned next to valve 30c to measure the pressure of fluid flowing through valve 30c, pressure sensor 52d is positioned next to valve 30d to measure the pressure of fluid flowing through valve 30d, pressure sensor 52e is positioned next to valve 30e to measure the pressure of fluid flowing through valve 30e, and pressure sensor 52f is positioned next to valve 30f to measure the pressure of fluid flowing through valve 30f. Thus, a pressure drop within a valve can be quickly detected by the pressure sensor associated with that valve.

[0028] Pressure sensors 52a, 52b, 52c, 52d, 52e, and 52f are coupled, for example wirelessly, to control module 14 to monitor the pressure of fluid within fluid management system 20. Specifically, each pressure sensor 52a, 52b, 52c, 52d, 52e, and 52f is positioned to monitor the pressure in the conduit containing spray nozzles 38 and 44 associated with its respective valve. In one example, fluid management system 20 is configured to dispense fluid at a pressure between 0 psi and 120 psi. Pressure sensors 52a, 52b, 52c, 52d, 52e, and 52f enable fluid management system 20 to maintain a desired pressure throughout the fluid management system to control the pressure of fluid through spray nozzles 37 and 44.

[0029] Pressure sensors 52a, 52b, 52c, 52d, 52e, and 52f provide closed-loop feedback to control module 14 regarding the pressure of fluid within fluid management system 20. Thus, a pressure drop within one location in fluid management system 20, such as a pressure drop within secondary manifold 42a detected by pressure sensor 52c, can be immediately addressed by closing selected valves 30a, 30b, 30d, 30e, and 30f within the system to immediately increase pressure at the pressure sensor location. In the event of a pressure drop detected by pressure sensor 52c, valve 30c is not closed.

[0030] 4-6, as mentioned above, an overflow valve, such as valve 30g, is connected to a conduit 50, which in turn leads to a reservoir 54. Fluid is further supplied from reservoir 54 to primary manifold 22 by a pump 56 connected by a conduit 58 to a lower opening or inlet 26 of manifold body 24. In one embodiment, reservoir 54 is configured to hold water or heated water, such as deionized water, and certain chemicals.

[0031] In some embodiments, a method for cleaning electronic substrates using a cleaning apparatus is also provided. In one embodiment, the cleaning method includes transporting electronic substrates through at least one cleaning module of the cleaning apparatus via a conveyor system and performing a cleaning operation on the electronic substrates. As described above, the cleaning apparatus may include a pre-clean module, a cleaning module, a pre-rinse module, a rinse module, and a drying module. For each module that includes a cleaning function, such as the pre-clean module, the cleaning module, the pre-rinse module, and the rinse module, the method further includes detecting a pressure drop in a conduit of the fluid management system and adjusting one or more automated valves associated with the conduit to address the pressure drop. Specifically, a pressure sensor associated with each valve is configured to detect the pressure of the fluid flowing through the valve. In the event of a pressure drop in a particular valve, the control module of the cleaning apparatus is configured to operate the valve to eliminate the pressure drop. In one particular embodiment, the cleaning operation is controlled by the control module 14 of the cleaning apparatus 10.

[0032] It should be understood that the above description is intended only as an illustration and example, and is not intended to be limiting, and that variations and modifications are possible. For example, the cleaning apparatus 10 described above may be any type of cleaning machine used to clean electronic substrates. Accordingly, other embodiments are contemplated, and modifications and variations may be made without departing from the scope of the present application.

[0033] In one embodiment, the control module 14 of the cleaning apparatus 10 is configured with an operating system, for example, a Windows®-based operating system, that provides familiar pull-down menus and has data logging and barcode capabilities. The operating system is easily networked for recipe downloads and remote access to operating data. The user interface provides quick and easy views of system pressure, water level, pump and blower operation, temperature, and fill / drain operation.

[0034] In one embodiment, cleaning apparatus 10 is configured with multiple functional modules 12 designed to accomplish different tasks in contaminant removal. Some modules maximize flooding, while others maximize impact force for cleaning tight spaces. Cleaning apparatus 10 uses proprietary pump and nozzle technology throughout the system to optimize performance.

[0035] In one embodiment, the cleaning apparatus 10 can be configured with appropriately sized modules and strategic manifold placement to increase throughput while ensuring complete contaminant removal. The cleaning apparatus 10 can include perforated rails, curtain containment, and cabinets designed to manage cleaning solutions within the system to maximize conservation of expensive chemicals. The cleaning apparatus 10 can further include a wet chemical separation module powered by a recirculating rinse pump to ensure optimal pre-rinse and facilitate closed-loop recycling of the rinse section. Separation of exhausts between the cleaning and rinsing modules may be used to minimize chemical transfer through the system.

[0036] The cleaning apparatus 10 allows for efficient and thorough drying during the cleaning process and is configured to increase throughput, resulting in cost savings and return on investment.

[0037] The importance of cleaning electronic assemblies increases dramatically with lead-free soldering. Lead-free soldering requires higher temperatures, making wetting much more difficult. To improve "wetting," flux compositions may require higher activation. High solids flux formulations generally leave more unwanted residue and require cleaning.

[0038] For a cleaning system to be successful, it must be able to meet the stringent demands of lead-free processing. The cleaning device 10 disclosed herein can be configured with a unique cleaning nozzle that delivers unparalleled impact force to get under and around components and clean even the most challenging flux residues.

[0039] Many process parameters can be set through a computerized operator interface provided on the cleaning apparatus 10. System pressure, water level, and temperature are easily accessible. Data logging and bar coding capabilities are features that enhance and streamline the production process.

[0040] In some embodiments, the cleaning apparatus 10 can be configured with nozzles, including "jet" nozzles, to deliver maximum direct dynamic impingement to the product surface for challenging cleaning applications and effectively clean under low-standoff components. The nozzles can be configured to create larger water droplets to enhance the cleaning performance of the cleaning apparatus when operating at lower pressure rates. The nozzles can be configured to create a vibratory action to better clean and flush away flux residue in pre-cleaning to reduce foaming in recirculation cleaning.

[0041] In some embodiments, the cleaning apparatus 10 can be equipped with orbital welded stainless steel piping to eliminate pressure drops and leaks, and all sections can be replaced or upgraded in minutes to maximize uptime and process flexibility. Piping sections have quick-disconnect fittings for ease of maintenance.

[0042] In some embodiments, the cleaning apparatus 10 can be configured with an optional chemical separation (CI) module, which is a multi-section module that efficiently removes chemicals from the product prior to the rinse section, with the majority of the chemicals being removed in the first section and returned to the wash bath reservoir in a closed loop.

[0043] In some embodiments, cleaning apparatus 10 can be configured to include one or more drying modules integrated into the cleaning apparatus cabinet. Typical performance includes drying complex assemblies to within 0.1 grams of pre-wash dry weight. The modules reduce emissions requirements by 44% and use 15% less power when compared to conventional drying systems, providing a short-term return on investment.

[0044] In some embodiments, the cleaning apparatus 10 can include one or more rear panels that can be easily removed for maintenance, with the added benefit of requiring removal of a single door to access the wash and rinse tubs. A front door can also be provided to provide quick access to the electrical panel, computer, heater, float, and thermocouple. The cleaning apparatus 10 can include a hinged tempered glass window to provide optimal visibility and access.

[0045] Having thus described several aspects of at least one embodiment of this disclosure, it should be understood that various alterations, modifications, and improvements will readily occur to those skilled in the art. Such alterations, modifications, and improvements are intended to be part of this disclosure and are intended to be within the spirit and scope of this disclosure. Accordingly, the foregoing description and drawings are by way of example only.

Claims

1. 1. A cleaning apparatus for cleaning electronic substrates, including printed circuit boards and semiconductor product assemblies, comprising: at least one cleaning module configured to process electronic substrates; a conveyor system configured to transport the electronic substrate through the at least one cleaning module; Equipped with The at least one cleaning module includes a fluid management system, the fluid management system comprising: a manifold connected to a source of fluid, the manifold including at least one outlet; an automatic valve coupled to the at least one outlet and to a conduit leading to one or more first spray nozzles; a pressure sensor coupled to the automated valve, the pressure sensor configured to measure a pressure of a fluid flowing through the conduit; and the automatic valve is configured to regulate the flow of the fluid through the conduit based on the pressure measured by the pressure sensor. Cleaning equipment.

2. The cleaning device of claim 1 further comprising a controller coupled to the automatic valve and the pressure sensor.

3. 3. The cleaning apparatus of claim 2, wherein the manifold includes at least two outlets: a first outlet and a second outlet.

4. 4. The cleaning apparatus of claim 3, wherein the fluid management system further includes a first automatic valve coupled to the first outlet and to a first conduit leading to one or more first spray nozzles, and a second automatic valve coupled to the second outlet and to a second conduit leading to one or more second spray nozzles.

5. 5. The cleaning device of claim 4, wherein the fluid management system further includes a first pressure sensor coupled to the first automatic valve and a second pressure sensor coupled to the second automatic valve, the first pressure sensor configured to measure a pressure of fluid flowing through the first conduit and the second pressure sensor configured to measure a pressure of fluid flowing through the second conduit.

6. 6. The cleaning device of claim 5, wherein the controller is configured to control the first automatic valve and the second automatic valve to account for a pressure drop detected by one of the first pressure sensor and the second pressure sensor.

7. 7. The cleaning device of claim 6, wherein a pressure drop detected by the first pressure sensor causes the second automatic valve to close or partially close.

8. 1. A cleaning apparatus for cleaning electronic substrates, including printed circuit boards and semiconductor product assemblies, comprising: at least one cleaning module configured to process electronic substrates; a conveyor system configured to transport the electronic substrate through the at least one cleaning module; Equipped with The at least one cleaning module includes a fluid management system, the fluid management system comprising: a manifold connected to a source of fluid, the manifold including at least two outlets, a first outlet and a second outlet; a first automatic valve coupled to the first outlet and to a first conduit leading to one or more first spray nozzles; and a second automatic valve coupled to the second outlet and to a second conduit leading to one or more second spray nozzles. a first pressure sensor coupled to the first automated valve and a second pressure sensor coupled to the second automated valve, the first pressure sensor configured to measure a pressure of a fluid flowing through the first conduit and the second pressure sensor configured to measure a pressure of a fluid flowing through the second conduit; and and At least one of the first automated valve and the second automated valve is configured to regulate the flow of the fluid through a respective conduit based on the pressure measured by one of the first pressure sensor and the second pressure sensor. Cleaning equipment.

9. 9. The cleaning device of claim 8, further comprising a controller coupled to the first and second automatic valves and the first and second pressure sensors.

10. 10. The cleaning device of claim 9, wherein the controller is configured to control the automatic valve to account for a pressure drop detected by one of the first pressure sensor and the second pressure sensor.

11. 11. The cleaning device of claim 10, wherein a pressure drop detected by the first pressure sensor causes the second automatic valve to close or partially close.

12. A method for cleaning an electronic substrate with the cleaning device of claim 8, comprising: transporting electronic substrates through the at least one cleaning module by the conveyor system; performing a cleaning operation with the at least one cleaning module; detecting a pressure drop in one of the first conduit and the second conduit; adjusting one of at least two automated valves associated with the first conduit and the second conduit, respectively, to account for the pressure drop; A method comprising:

13. 1. A fluid management system for a cleaning module of a cleaning apparatus for cleaning electronic substrates, including printed circuit boards and semiconductor product assemblies, comprising: a manifold connected to a source of fluid, the manifold including at least one outlet; an automatic valve coupled to the at least one outlet and to a conduit leading to one or more first spray nozzles; a pressure sensor coupled to the automated valve, the pressure sensor configured to measure a pressure of a fluid flowing through the conduit; Equipped with the automatic valve is configured to regulate the flow of the fluid through the conduit based on the pressure measured by the pressure sensor. Fluid management systems.

14. The fluid management system of claim 13 , wherein a controller is coupled to the automated valve and the pressure sensor.

15. The fluid management system of claim 14 , wherein the manifold includes at least two outlets: a first outlet and a second outlet.

16. 16. The fluid management system of claim 15, further comprising: a first automatic valve coupled to the first outlet and to a first conduit leading to one or more first spray nozzles; and a second automatic valve coupled to the second outlet and to a second conduit leading to one or more second spray nozzles.

17. 17. The fluid management system of claim 16, further comprising a first pressure sensor coupled to the first automated valve and a second pressure sensor coupled to the second automated valve, the first pressure sensor configured to measure a pressure of fluid flowing through the first conduit and the second pressure sensor configured to measure a pressure of fluid flowing through the second conduit.

18. 20. The fluid management system of claim 17, wherein the controller is configured to control the first automated valve and the second automated valve to account for a pressure drop detected by one of the first pressure sensor and the second pressure sensor.

19. 20. The fluid management system of claim 18, wherein a pressure drop detected by the first pressure sensor causes the second automatic valve to close or partially close.

20. The fluid management system of claim 13 further comprising an overflow valve for removing fluid from the manifold in the event of an overflow situation.

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