Interface assembly and method for manufacturing the interface assembly

Abstract

Disclosed herein is an interface assembly (100) comprising a functional multi-layer structure comprising a first substrate (22, 28), a molding material layer (26) on a first side of the first substrate (22, 28), and a sensor arrangement (30) comprising at least one sensor (32, 32A, 32B), the sensor arrangement (30) being disposed at least partially embedded in the molding material layer (26). The assembly (100) further comprises a movable member (40) movable relative to the functional multi-layer structure (20), the movable member (40) comprising at least one detection portion (42), the sensor arrangement (30) and the at least one detection portion (42) being disposed relative to one another such that a position or change in position of the movable member (40) is detectable by the sensor arrangement (30) based on a position or change in position of the at least one detection portion (42) relative to the sensor arrangement (30). Also disclosed is a method of manufacturing the interface assembly (100).

Description

[Technical Field]

[0001] The present invention relates generally to functional integrated structures such as electronic (multilayer) assemblies and methods for their manufacture, and in particular, but not exclusively, to interface assemblies including electronics and layers of molded, optionally injection molded, material such as plastic material, and methods for manufacturing the interface assemblies. [Background technology]

[0002] Various stacked assemblies and structures exist in connection with electronics and electronic products. The motivations behind the integration of electronics and related products can be as diverse as the relevant use contexts. Size reduction, weight reduction, cost reduction, or simply efficient integration of components is relatively often required when the resulting solution ultimately exhibits multiple layers. Relevant use scenarios can then relate to product packaging or casings, visual design of device housings, wearable electronics, personal electronic devices, displays, detectors or sensors, vehicle interiors, antennas, labels, vehicle electronics, and the like.

[0003] Electronics, such as electronic components (passive or active), ICs (integrated circuits), and conductors, can generally be provided on substrate elements by several different technologies. For example, prefabricated electronics, such as various surface-mounted devices (SMDs), can be mounted on substrate surfaces that ultimately form the inner or outer interface layers of a multilayer structure. Furthermore, technologies that fall under the term "printed electronics" may be applied to actually fabricate electronics directly and additively on the associated substrate. The term "printed" in this context refers to various printing techniques that can produce electronic / electrical elements from printed matter through a substantially additive printing process, including, but not limited to, screen printing, flexographic printing, and inkjet printing. The substrates used may be flexible, and the printed materials may be organic, but this is not necessarily the case.

[0004] Furthermore, the concept of injection-molded structural electronics (IMSE) involves building functional devices and their components in the form of multilayer structures, which encapsulate electronic functions as seamlessly as possible. Another characteristic of IMSE is that electronics are typically manufactured in true 3D (non-planar) form according to a 3D model of the target product, component, or generally the entire design. To achieve the desired 3D layout of electronics on a 3D substrate and within the associated final product, the electronics may still initially be provided on a planar substrate (e.g., a film) using two-dimensional (2D) methods of electronics assembly, and then the substrate already housing the electronics may be formed into the desired three-dimensional (i.e., 3D) shape and subjected to overmolding. This may be done, for example, with a suitable plastic material that covers and embeds the underlying elements (e.g., electronics), thus protecting and potentially hiding them from the environment.

[0005] In a typical solution, electrical circuits are fabricated on a printed circuit board (PCB) or substrate film, which are then overmolded with a plastic material. However, known structures and methods still have several drawbacks depending on the associated usage scenario. To create an electronic assembly with one or more functions, typically, fairly complex electrical circuits for achieving these functions must be fabricated on the substrate by printing and / or utilizing SMDs, and then overmolded with a plastic material. Therefore, both the direct provision of functional or specifically electrical elements, such as associated components, on a larger host substrate and the preparation of aggregate subassemblies for subsequent mounting have their own drawbacks, for example, in terms of electronics fragility, structural and installation complexity, and thermal management. As a result, there remains room for improvement in the associated improved or alternative manufacturing techniques and resulting final structures.

[0006] This is particularly problematic for structures with moving elements, such as interface devices. For example, overmolding knobs, buttons, or other (user) interface elements renders them unusable because the molding compound eventually solidifies and locks the interface element in place. However, it is desirable to use IMSE structures to provide an interface for the user to control the entire structure and / or the host device. This is often accomplished with passive sensing elements, such as those based on capacitive sensing, which do not require movement during use. However, it is often advantageous to provide feedback to the user in the form of a tangible movement when touching and operating an interface element, such as a button. Therefore, there remains a need for development of structures and methods related to both IMSE technology and integrated electronics in general, as well as the interface assemblies used therein. As an example, document US2010 / 253653A1 discloses a magnetically attached virtual knob interface with multiple touch sensors that detect when the virtual knob is manipulated by a user. US 2022 / 195760 A1 presents an electronic sensor module for a steering wheel which includes a sensor unit with a fixed sensor element and a movable sensor element which is activated by pressure. US10194526B1 discloses an electrical node comprising a first substrate film that can be obtained by thermal shaping. Summary of the Invention [Problem to be solved by the invention]

[0007] It is an object of the present invention to alleviate at least one or more of the above-mentioned drawbacks associated with known solutions in the context of integrated structures that include functional elements such as electronics and utilize molded or cast material layers or structures. Another object is to provide an interface durability assembly with a high level of integration and adaptable to different use cases, and a method that facilitates its efficient manufacture. [Means for solving the problem]

[0008] The object of the invention is achieved by an interface assembly and a method for manufacturing an interface assembly as defined by the respective independent claims.

[0009] According to a first aspect, there is provided an interface assembly, the interface assembly comprising a functional multi-layer structure and a movable member movable relative to the functional multi-layer structure.

[0010] The functional multi-layer structure comprises a first substrate, a molding material layer on a first side of the first substrate, and a sensor arrangement comprising at least one sensor, the sensor arrangement being disposed at least partially embedded in the molding material layer.

[0011] The movable member comprises at least one sensing portion, but often there are multiple such portions.

[0012] Further, the sensor arrangement and the at least one detection portion (or portions) are arranged relative to one another such that a position or change in position (e.g., optionally, velocity, acceleration, jerk, and direction of velocity, acceleration, jerk) of the movable member is detectable by the sensor arrangement based on a position or change in position of the at least one detection portion relative to the sensor arrangement.

[0013] In some embodiments, the movable member and the functional multi-layer structure may be movably attached to one another. Thus, the movable member and the functional multi-layer structure preferably are not completely separate and freely movable relative to one another, but there is at least some attachment mechanism, such as a force, element, and / or structure, that prevents or at least resists complete disengagement of the two when attached to one another by the attachment mechanism. Often, the attachment mechanism may limit, but not necessarily completely prevent, movement of the movable member relative to the functional multi-layer structure in one, multiple, or all directions, or rotation of the member about an axis of rotation, and may at least resist movement in those directions. The attachment mechanism may be positioned so that the movable member can move within some limits in one or more directions without resistance or restriction by the attachment mechanism, but beyond those limits, the attachment mechanism resists or even prevents movement, such as by mechanically blocking.

[0014] In some embodiments, the movable attachment includes a magnetic attachment arrangement comprising a first attachment portion on the functional multi-layer structure and a second attachment portion on the movable member, the magnetic attachment arrangement being arranged to exert an attractive magnetic force between the first attachment portion and the second attachment portion, which may be considered a detachment-resistant attachment mechanism.

[0015] Alternatively or additionally, the movable attachment can include a mechanical attachment arrangement configured to prevent, or at least hinder or resist, detachment of the movable member from the functional multi-layer structure. For example, the mechanical attachment arrangement may comprise a frame adapted to at least partially confine the movable member between the frame and the functional multi-layer structure such that the movable member is movable within a space between the frame and the functional multi-layer structure.

[0016] In various embodiments, the functional multi-layer structure may include a groove, hole, or through-hole, and a portion of the movable member including at least one detection portion may be adapted to extend within the groove, hole, or through-hole and configured to be movable within the groove, hole, or through-hole. Optionally, the interface assembly may further include a shape-interlocking configuration between the portion of the groove, hole, or through-hole and the movable member to prevent, or at least impede, or resist, detachment of the movable member from the functional multi-layer structure. The groove or hole may, for example, define a concave shape in the multi-layer structure.

[0017] In some embodiments, the movable member may be movable in a translational manner, such as linearly or non-linearly, relative to the functional multi-layer structure, optionally within a groove, hole, or through-hole.

[0018] Alternatively or additionally, the movable member may be rotationally movable relative to the functional multi-layer structure, optionally within a groove, hole or through-hole.

[0019] In some embodiments, the functional multi-layer structure may include protrusions, pins, or other features extending outward from a surface of the multi-layer structure, and the movable member may be movable, such as rotatable, relative to the protrusions, pins, or other features. The protrusions, pins, or other features may define, for example, a convex or dome-like shape in the multi-layer structure.

[0020] Additionally, the at least one sensor may be at least one optical sensor configured to transmit an optical detection signal for detecting a position or a change in position of the at least one detection portion.

[0021] In some embodiments, at least one detection portion may comprise one or more magnets and / or ferromagnetic elements, and the sensor arrangement comprises a magnetometer or Hall effect sensor comprising a coil or the like for detecting the position or change in position of the one or more magnets.

[0022] Alternatively or additionally, the sensor arrangement may comprise a capacitive sensing element for detecting the position or change in position of the at least one sensing portion.

[0023] In some embodiments, the rotational movement of the movable member may be detected by a magnetometer or Hall Effect sensor and its linear movement may be detected by a capacitive sensing element, or vice versa.

[0024] Furthermore, the movable member may be mechanically coupled to the functional multi-layer structure via a spring. In some embodiments, the central portion of the spring may have a through-hole through which the movable member extends toward the functional multi-layer structure. Alternatively or in addition to the through-hole, the spring may have the shape of a segmented dome, where an edge portion or edges of the segmented dome contact one of the functional multi-layer structure and the movable member when the spring is not fully compressed, and the central portion of the segmented dome is spaced apart from the other of the functional multi-layer structure and the movable member.

[0025] In some embodiments, the spring may be a planar spring, such as a quadrature planar spring. Optionally, the spring may be a plastic material, such as a thermoformable plastic film.

[0026] In various embodiments, the movable member may be attached and configured to move in a hinged manner relative to the functional multi-layer structure, for example, the movable member may be attached to the functional multi-layer structure from one end thereof by a hinge mechanism.

[0027] The sensor configuration may comprise a plurality of sensors including at least two different types of sensors for detecting the position or change in position of at least one sensing moiety, the sensor types being selected from the group consisting of optical, capacitive, inductive, resistive, magnetic, galvanic, acoustic, or a combination thereof.

[0028] In various embodiments, the interface assembly may include a second substrate on an opposite side of the molding material layer from the first substrate.

[0029] The sensor arrangement may be provided on a surface of the first substrate and / or the second substrate.

[0030] Either the first substrate or the second substrate, or both, may be a thermoformable substrate film, optionally having, at least locally, a non-planar three-dimensional shape.

[0031] According to a second aspect, a method for manufacturing an interface assembly is provided. The method includes obtaining or fabricating a first substrate, such as a thermoformable substrate film, and obtaining at least one sensor configured to detect a position or change in position of at least one detection moiety. The method further includes molding a molding material on one side of the first substrate to at least partially embed a sensor configuration including the at least one sensor in the molding material layer, thereby obtaining a functional multi-layer structure. The method also includes obtaining or fabricating a movable member including at least one detection moiety, and arranging the sensor configuration and the at least one detection moiety relative to each other so that a position or change in position of the movable member is detectable by the sensor configuration based on the position or change in position of the at least one detection moiety relative to the sensor configuration.

[0032] In various embodiments, the method includes thermoforming the first substrate to have at least a portion having a non-planar three-dimensional shape prior to forming. In some embodiments, thermoforming can include stretching the first substrate at least locally under high pressure to create the non-planar three-dimensional shape.

[0033] Additionally, the method may include providing grooves, holes, perforations; or protrusions, pins, or other shapes extending outward from the surface of the functional multi-layer structure during thermoforming.

[0034] Additionally or alternatively, the method may further include movably attaching the movable member and the functional multi-layer structure to one another.

[0035] The present invention provides an interface assembly and a method for manufacturing the interface assembly. The present invention offers advantages over known solutions in that it allows for the creation of a robust interface assembly that provides tactile feedback to a user when a movable member, such as a button or switch, is moved. Furthermore, by embedding the sensor configuration in a material layer provided by molding, such as injection molding, the interface assembly can be made durable, not only for the movable member but also for the functional multi-layer structure. The resulting structure is structurally durable and simple, saves material, and is functionally robust and stable. In various embodiments, the movable member can be substantially passive, resulting in a highly robust and durable device.

[0036] Various other advantages will become apparent to those skilled in the art based on the following detailed description.

[0037] The term "some" as used herein can refer to any positive integer starting from 1, i.e., 1, at least 1, or more than one.

[0038] The term "plurality" can refer to any positive integer starting with 2, i.e., 2, at least 2, or greater than 2.

[0039] Terms such as "first," "second," and the like are used herein to distinguish one element from another, and do not imply any particular priority or ordering therebetween, unless expressly stated otherwise.

[0040] The exemplary embodiments of the present invention presented herein should not be construed as imposing limitations on the applicability of the appended claims. The verb "comprise" is used herein as an open limitation that does not exclude the presence of unrecited features. Features recited in dependent claims may be freely combined with each other unless expressly stated otherwise.

[0041] The novel features which are believed characteristic of the invention are set forth with particularity in the appended claims. The invention itself, however, both as to its organization and its method of operation, together with further objects and advantages thereof, will best be understood from the following description of specific embodiments when read in connection with the accompanying drawings.

[0042] The invention will now be explained in more detail with reference to exemplary embodiments according to the accompanying drawings, in which: [Brief explanation of the drawings]

[0043] [Figure 1] 1 shows an interface assembly. [Figure 2] 1 shows an interface assembly. [Figure 3] 1 shows an interface assembly. [Figure 4] 1 shows an interface assembly with an attachment mechanism. [Figure 5] 1 shows an interface assembly with an attachment mechanism. [Figure 6] 1 shows an interface assembly with an attachment mechanism. [Figure 7] 1 shows an interface assembly. [Figure 8A] 1 shows an interface assembly. [Figure 8B] 1 shows an interface assembly. [Figure 8C] 1 shows an interface assembly. [Figure 9] 1 shows an interface assembly. [Figure 10]1 shows an interface assembly. [Figure 11A] 1 shows an interface assembly. [Figure 11B] 1 shows an interface assembly. [Figure 11C] 1 shows an interface assembly. [Figure 12A] 1 shows an interface assembly. [Figure 12B] 1 shows an interface assembly. [Figure 13] 1 shows a spring having a segmented dome shape. [Figure 14A] 1 shows an interface assembly. [Figure 14B] 1 shows an interface assembly. [Figure 14C] 1 shows an interface assembly. [Figure 15A] 1 shows an interface assembly. [Figure 15B] 1 shows an interface assembly. [Figure 16A] 1 shows an interface assembly. [Figure 16B] 1 shows an interface assembly. [Figure 17A] 1 shows an interface assembly of a host structure. [Figure 17B] 1 shows an interface assembly of a host structure. [Figure 17C] 1 shows the interface assembly and steering wheel of the host structure. [Figure 18A] 1 shows an interface assembly. [Figure 18B] 1 shows an interface assembly. [Figure 19A] 1 illustrates several method steps for manufacturing an interface assembly. [Figure 19B] 1 illustrates several method steps for manufacturing an interface assembly. [Figure 19C]1 illustrates several method steps for manufacturing an interface assembly. [Figure 19D] 1 illustrates several method steps for manufacturing an interface assembly. [Figure 20] 1 shows a flow diagram of a method for manufacturing an interface assembly. DETAILED DESCRIPTION OF THE INVENTION

[0044] In the various drawings, the same or corresponding parts are represented by the same reference numerals, and in most cases the description in the text is omitted as well.

[0045] According to numerous embodiments described herein, an interface assembly is provided. The interface assembly includes a functional multi-layer structure. The functional multi-layer structure includes a first substrate, such as a substrate film (e.g., made of plastic), a molding material layer on a first side of the first substrate, and a sensor arrangement including at least one sensor, the sensor arrangement being at least partially embedded in the molding material layer. Preferably, the interface assembly further includes a movable member movable relative to the functional multi-layer structure, the movable member including at least one detection portion. The sensor arrangement and the at least one detection portion are positioned relative to each other, or at least arrangable, such as structurally adapted to each other, such that a position or change in position of the movable member is detectable by the sensor arrangement based on a position or change in position of the at least one detection portion relative to the sensor arrangement.

[0046] A substrate, such as a substrate film, may preferably be, but not necessarily be, a thermoformable material. If the substrate is a thermoformable material, the substrate can be thermoformed into a shape different from its original shape. For example, a planar substrate or substrate film (which is flexible and on a roll, but is also considered planar when unwound from the roll to define a film piece having a planar or "two-dimensional" shape) can be thermoformed into a shape other than a planar shape, for example, by forming at least one shape locally having dimensions in all three dimensions, making the substrate non-planar.

[0047] Thermoforming can be performed under at least elevator pressure, and optionally also at elevator temperature, and can be performed on the substrate before or after providing the conductive traces on the substrate. The temperature can be such that the substrate (film) is heated to a temperature at which it does not melt but softens and can be molded without breaking the substrate. For example, for plastic materials, this can be called the glass transition temperature.

[0048] Alternatively or additionally, thermoforming may be performed before, or preferably after, providing portions of the sensor configuration and / or electronic components, if any, on the substrate. Thus, the substrate may be thermoformed, for example, after providing conductive traces but before providing sensor components and / or electronic components on the substrate. In other examples, the substrate may be thermoformed before providing traces, sensor(s), and electronic components. Alternatively, the substrate may be thermoformed after providing traces, sensor(s), and electronic components.

[0049] Thermoforming of a substrate, as used herein, refers to the technique of forming, at least locally, an existing substrate from one shape to another shape, typically having significantly larger dimensions in two lateral directions at least locally perpendicular to the thickness direction of the substrate. Thus, thermoforming of a substrate, as used herein, does not refer to creating a substrate (planar or non-planar) from a liquid or liquid-like material and feeding it into a mold and waiting for it to solidify, as is done in casting or molding.

[0050] In various embodiments, the molding material layer may be molded, such as by injection molding, onto the first side of the substrate after providing the conductive traces (if any) and sensor configuration (at least one sensor) on the substrate, thereby at least partially embedding or covering them in the molding material layer. The thermoforming preferably occurs before or simultaneously with providing the molding material layer. Of course, after attaching the sensors, if any, the substrate may be post-processed, such as by cutting, drilling, sanding, varnishing, etc.

[0051] In various embodiments, the substrate(s) may be, for example, a substrate film of a flexible, 3D-formable (3D-formable) material, such as a thermoformable (plastic) material. As will be readily understood by those skilled in the art, instead of a single, optionally monolithic film, the substrate film may be, for example, multi-layered and / or multi-sectioned, having at least in places layers that are different from one another. The structure may further include a substrate (film).

[0052] The substrate film and / or further substrate film(s) or generally material layer(s) included in the multilayer structure may comprise at least one material selected from the group consisting of polymers, thermoplastic materials, electrically insulating materials, polymethyl methacrylate (PMMA), polycarbonate (PC), flame retardant (FR) PC film, FR700 type PC, copolyester, copolyester resin, polyimide, copolymer of methyl methacrylate and styrene (MS resin), glass, polyethylene terephthalate (PET), carbon fiber, organic materials, biomaterials, leather, wood, textiles, fabrics, metals, organic natural materials, solid wood, veneer, plywood, bark, tree bark, birch bark, cork, natural leather, natural fiber or fabric materials, naturally grown materials, cotton, wool, linen, silk, and any combination.

[0053] The thickness of the substrate film and optional additional films or layers may vary depending on the embodiment: it may be, for example, only tens or hundreds of millimeters, or it may be much thicker, on the order of one or several millimeters.

[0054] The thickness of the molding material layer may also be selected on an as-needed basis, but may be as thick as several millimeters (e.g., about 3-5 millimeters). In some embodiments, a thickness of only about 2 millimeters may be sufficient, if not optimal, while in some other embodiments the thickness may be significantly thicker, e.g., about 1 cm or more in at least some places. The thickness may, in fact, vary locally. In addition to housing various elements (e.g., electronic or optical elements), the molding material layer may optionally include recesses or internal cavities, e.g., for light guiding, processing, and / or thermal management purposes.

[0055] FIG. 1 schematically illustrates an interface assembly 100 according to some embodiments. As can be seen, the assembly 100 includes a functional multi-layer structure 20. The functional multi-layer structure 20 includes at least one substrate 22, 28, such as a substrate film, and is optionally flexible and / or thermoformable. Additionally, the assembly 100 includes a sensor arrangement 30 including at least one sensor 32, which is disposed at least partially embedded in a molding material layer 26, such as an injection-molded plastic material layer. Additionally, the interface assembly 100 may include a movable member 40 movable relative to the functional multi-layer structure 20, the movable member 40 including at least one sensing portion 42. The movable member 40 may preferably include a body 41 or frame portion 41.

[0056] As shown by the solid arrow in Figure 1, the movable member 40 may be movable in a translational manner, such as linearly or non-linearly, relative to the functional multi-layer structure 20. The multi-layer structure 20 may optionally be configured with a groove, hole, or through-hole, etc., adapted for movement of the movable member 40, or at least the detection portion 42 thereof. Alternatively, the multi-layer structure 20 may optionally include a protrusion, pin, or other shape extending outward from the surface of the multi-layer structure 20. The movable member 40 may then include a groove, hole, or through-hole, etc., into which the protrusion, pin, or other shape may extend.

[0057] Alternatively or additionally, the movable member 40 may be rotationally movable relative to the functional multi-layer structure 20. One option is shown in Figure 1, i.e. the axis of rotation is approximately perpendicular to the lateral direction of the functional multi-layer structure 20. Said movement may also occur around grooves, holes, or through-holes in the functional multi-layer structure 20, or around protrusions, pins or other shapes extending outward from the surface of the multi-layer structure.

[0058] With respect to sensor configuration 30, sensor(s) 32 may, but need not necessarily, be disposed on (a surface of) at least one substrate 22, 28. Sensor(s) 32 may also be disposed within molding material layer 26 or may be spaced apart from at least one substrate 22, 28. In some embodiments, configuration 30 may comprise, in addition to at least one sensor(s) 32, a body or frame within which sensor(s) 32 reside, e.g., not shown in FIGS. 1-3 .

[0059] Furthermore, in some embodiments including multiple sensors 32 in configuration 30, some of the sensors 32 may be disposed on (a surface of) at least one of the substrates 22, 28, while other of the sensors 32 may be spaced apart from at least one of the substrates 22, 28. In some cases, some of the sensors 32 may even be completely outside of the molding material layer 26. In one embodiment, one sensor 32 may be on one substrate 22, while another sensor may be on another substrate 28, preferably disposed on both sides of the molding material layer 26.

[0060] Additionally, in various embodiments, the movable member 40 and the functional multi-layer structure 20 may be movably attached to one another, as shown diagrammatically in Figure 1 by the long, double-headed, vertical arrow drawn in dashed lines and extending through the substrates 22, 28 above the molding material layer 26.

[0061] Thus, the movable member 40 and the functional multi-layer structure 20 are preferably not completely separate and freely movable relative to one another without limit. Rather, there may be at least some attachment mechanism, such as a force, element, and / or structure, that prevents or at least resists complete disengagement of the two when attached to one another by the attachment mechanism. In many cases, the attachment mechanism may limit or at least resist movement of the movable member 40 relative to the functional multi-layer structure 20 in one, several, or all directions. Movement between the two entities may be relatively free, for example, within a range of 0 to 10 centimeters, depending on the embodiment. The attachment mechanism may be positioned such that the movable member 40 can move within some limits in one or several directions without resistance or restriction by the attachment mechanism, but beyond those limits, the attachment mechanism resists or even prevents movement, such as by mechanically blocking.

[0062] FIG. 1 also shows any other electronic components 102, such as those based on surface mounted devices (SMD), and conductive traces 101, such as printed ones, that may be included in one or more electrical circuits of the assembly 100 or one or more electrical circuits of a host structure for the assembly 100.

[0063] 2 illustrates an interface assembly 100 according to some embodiments. In FIG. 2, a movable member 40, such as a slider or slide member, is arranged for translational movement horizontally or parallel to the lateral direction of the functional multi-layer structure 20, or perpendicular to the thickness direction of the functional multi-layer structure 20. As can be further seen, there can be multiple sensors 32A, 32B in the sensor arrangement 30. The movable member 40 may preferably include a body 41 or frame portion 41.

[0064] Further, as shown in FIG. 2, but also applicable to FIGS. 1 and 3, for example, the sensor configuration 100 may include the same type of sensor or at least two different types of sensors 32, 32A, 32B, 33 for detecting the position or change in position of at least one detection portion 42, 44. In FIG. 2, the sensors 32A, 32B are preferably optical sensors, but may also be sensors that measure, for example, a magnetic field or changes therein. Additionally, there is a second sensor 33, in this case a capacitive sensor. The type of sensor 32, 32A, 32B, 33 may be selected from the group consisting of optical, capacitive, inductive, resistive, magnetic, galvanic, acoustic, or a combination thereof. Furthermore, it should be appreciated that the movable member 40, and in particular at least one or two detection portions 42, 44, include portions corresponding to the type of sensor 32, 32A, 32B, 33.

[0065] For example, an optical sensor, such as one comprising a transmitting portion and a receiving portion, may operate such that an optical signal is cut off or passes past or through the movable member 40 when the movable member 40 is moved. The assembly 100 may also include additional magnetic or capacitive sensors and corresponding detection portions 42, 44. Thus, detection of the position of the movable member 40 or changes therein may be more reliably achieved by using different techniques, such as those based on optical and capacitive sensing.

[0066] In preferred embodiments, the sensing portions 42, 44 within the movable member 40 correspond by their operational characteristics to the sensor(s) 32, 32A, 32B, 33 (as described above) and are passive in the sense that they do not require additional power or control signals. Furthermore, in these embodiments, the sensors 32, 32A, 32B, 33 are provided with the necessary power and control circuitry and connections, such as provided on the substrate 22, 28.

[0067] Figure 3 shows an interface assembly 100 according to some embodiments. In Figure 3, the movable member 40 is positioned to move rotationally relative to at least the functional multi-layer structure, optionally within a groove, hole, or through-hole. Alternatively, there may be protrusions, pins, or other features extending outward from the surface of the multi-layer structure 20 about which the movable member 40 may rotate.

[0068] Alternatively or additionally, the movable member 40 may be moved translationally, in this case perpendicular or parallel to the thickness direction of the functional multi-layer structure 20. As can be further seen here, there can be multiple sensors 32A, 32B in the sensor arrangement 30. The movable member 40 may preferably comprise a body 41 or frame portion 41.

[0069] Furthermore, the movable member 40 may be arranged to move in the thickness direction of the functional multi-layer structure 20, i.e., to act essentially as a push button. In these cases, the movable member 40 may not rotate or translate at all.

[0070] FIG. 3 illustrates that at least a portion of the movable member 40 may be positioned to extend, penetrate, or protrude into the substrate 22, 28, such as into a groove, hole, or through-hole in the substrate 22, 28.

[0071] 3 also illustrates that the sensing moieties 42 may preferably be on portions of the movable member 40 that extend into, penetrate, or protrude into the substrate 22, 28. However, as shown in FIG. 2, the sensing moieties 42 may preferably be positioned at least to be operative with the sensor configuration 30 such that the movable member 40 is detectable by the sensor configuration 30 based on the position or change in position of at least one sensing moiety 42 relative to the sensor configuration 30.

[0072] Alternatively, the detection portion 42 may be located on a portion of the movable member 40 that may or may not extend into, penetrate, or protrude into the substrate 22, 28. This option is also shown in FIG.

[0073] As contemplated above, FIGS. 1-3 also illustrate the sensing portion 42 of the movable member 40. The sensing portion 42 may simply be a portion of the movable member 40, such as (a part of) its body. For example, if the movable member 40 is made of a plastic material, the sensing portion 42 may be a portion of the movable member 40 adapted to exist and / or move such that the sensor configuration 100 can detect its position or change. In some embodiments, the sensing portion 42 may be a light-reflecting or light-absorbing material and / or a transparent, translucent, or opaque material. In other embodiments, the sensing portion 42 may be a conductive material and / or a ferromagnetic material. The sensing portion 42 may comprise, for example, a permanent magnet or multiple permanent magnets. Alternatively, in some embodiments, the sensing portion 42 may be or comprise an electromagnet, a light-emitting and / or detecting device, and / or a sensing coil or electrodes connected to a processing unit and / or a power supply unit, etc. Thus, the sensing portion 42 may include at least an active component, in which case the movable member 40 preferably also comprises means for actuating and / or controlling the active component.

[0074] With respect to the sensor arrangement 30, the at least one sensor 42 may be at least one optical sensor 32A arranged to transmit an optical detection signal for detecting the position or change in position of the at least one detection portion 42.

[0075] Alternatively, at least one sensor 32 may be one or more magnets and / or ferromagnetic elements, and sensor arrangement 30 may include a magnetometer, such as one with a coil, or a Hall effect sensor for detecting the position or change in position of one or more magnets.

[0076] Further alternatively or additionally, the sensor arrangement 30 may include a capacitive sensing element as the sensor 32 for detecting the position or change in position of the at least one sensing portion 42. In such an embodiment, the sensing portion 42 may or may not include a separate capacitive element. Alternatively, the movable member 40 may affect a field that is measured or monitored by the sensor arrangement 30.

[0077] Figure 4 shows an interface assembly 100 with an attachment mechanism 60. In Figure 4, the movable member 40 and functional multi-layer structure 20 may be similar or identical to those shown in and described in connection with Figure 2, for example, although the following also applies to various other embodiments, such as those of Figure 3 or similar. Figure 4 shows an example of an attachment mechanism 60. As mentioned above, the attachment mechanism 60 is preferably arranged to provide a movable attachment of the movable member 40 to the functional multi-layer structure 20.

[0078] FIG. 4 illustrates that the attachment mechanism 60 is a mechanical attachment arrangement comprising a frame 61 adapted to at least partially confine the movable member 40 between the frame 61 and the functional multi-layer structure 20 such that the movable member 40 is movable within the space between the frame 61 and the functional multi-layer structure 20. As can be seen, the frame 61 may be disposed on the substrate 22, 28, or directly on the molding material layer 26. The frame 61 is preferably at least removably attached to the multi-layer structure 20. Alternatively or additionally, the attachment mechanism 60 may comprise a groove, hole, or through-hole in the functional multi-layer structure 20 into which the movable member 40 at least partially extends, or even fully resides. As will be appreciated, the shape, size, material(s) used, etc. of the frame 61 may vary between embodiments. The most important aspect of the mechanical attachment arrangement is to prevent, or at least impede, or resist, detachment of the movable member 40 from the functional multi-layer structure 20.

[0079] Figure 5 shows an interface assembly 100 with an alternative attachment mechanism 60. Again, the movable member 40 and functional multi-layer structure 20 may be similar or identical to those shown in and described with reference to Figure 2, for example, although the following also applies to various other embodiments, such as that of Figure 3 or similar. In Figure 5, the movable attachment includes a magnetic attachment arrangement comprising a first attachment portion 62 on the functional multi-layer structure 20 and a second attachment portion 63 on the movable member 40, the magnetic attachment arrangement being arranged to exert an attractive magnetic force between the first attachment portion 62 and the second attachment portion 63.

[0080] In some embodiments, interface assembly 100 may include one or more mechanical attachment arrangements and one or more magnetic attachment arrangements.

[0081] 6 shows an interface assembly 100 with yet another attachment mechanism 60. The assembly 100 may include a shape-interlocking arrangement between a portion of the functional multi-layer structure 20 and the movable member 40, such as a groove, hole, or through-hole, to prevent or at least impede detachment of the movable member 40 from the functional multi-layer structure 20.

[0082] In FIG. 6 , the functional multi-layer structure 20, i.e., the through-hole, has protruding element(s) 65 on its wall, with corresponding recess(es) 64 for the portion of the movable member 40 that extends into the through-hole. Of course, this could also be the other way around, with the protruding element(s) 65 within the movable member 40. Thus, the movable member 40 could be provided within the through-hole, and by pushing hard enough, for example, the protrusions 65 would slide into the recesses 64, thereby movably locking the movable member 40 relative to the multi-layer structure 20. As will be appreciated, the interlocking shapes / joints must be such as to allow movement of the movable member 40. In FIG. 6 , rotational movement of the movable member 40 is clearly possible, but movement away from or towards the structure 20 is limited unless a substantial force is applied.

[0083] Additionally, various embodiments may utilize any of the attachment configurations shown in and described in connection with Figures 4-6, or any combination thereof. The mechanical, magnetic, and interlocking shapes / joints may vary in shape, size, associated materials, etc. Additionally, multi-layer structure 100 may have grooves, recesses, protrusions, holes, or through-holes, or the attachment configuration may be entirely separate, such as a frame that is disposed over at least a portion of movable member 40 after movable member 40 is positioned for movably maneuvering in conjunction with structure 20.

[0084] Figure 7 shows another interface assembly 100. In Figure 7, the movable member 40 may be arranged to move rotationally and / or vertically. In this case, as previously described herein, the sensor arrangement 100, which includes at least one sensor 32, e.g., a rotary switch or a microswitch, further includes a body 34 or frame 34 that defines a cavity containing a space or volume in which the sensor 32 is disposed. The body 34 may be, for example, a substrate (material) such as a piece of printed circuit board (PCB).

[0085] As shown by the horizontal dashed line in FIG. 7 , the body 34 may be a single piece body 34, such as a U-shaped PCB strip, with a cavity formed in the PCB strip by methods such as carving, drilling, or milling. Alternatively, the body 34 may be provided in multiple sections, for example, as shown in FIG. 7 , having a horizontally or laterally extending portion that receives the sensor 32, followed by a vertically extending sidewall(s) (e.g., PCB or plastic material) that extends from the first substrate 22 or laterally extending portion to the second substrate 28, thereby surrounding the sensor 32 to prevent it from being overmolded into the molding material layer 26. In some embodiments, the sidewall(s) may be circular or ring-shaped to surround the sensor 32. Thus, when the molding material layer 26 is provided on a first side of the first substrate 22, 28, the sensor configuration 100 becomes at least partially embedded in the molding material layer 26 when the molding material surrounds and contacts the body 34 on the opposite side of the cavity.

[0086] In embodiments in which the body 34, e.g., at least a horizontally or laterally extending portion thereof, is a PCB or similar substrate, the body 34 may be used to provide electrical connection to the sensor 32. The body 34 may include connection portion(s) 39 for providing electrical connection to the sensor configuration 100 from outside the sensor configuration 100, such as the first substrate 22. The connection portion 39 may be located on the opposite side of the horizontally or laterally extending portion relative to the sensor 32 and / or the molding material layer 26, or on a side or sidewall(s) of the horizontally or laterally extending portion. FIG. 7 illustrates an example in which the connection portion 39 is located on a side of the horizontally or laterally extending portion. The connection portion 39 may be, for example, a castellated hole cut in half or a plated semi-hole. Thus, electrical connection may be provided from the conductive trace 24 to the connection portion 39, for example, by using a solder material. FIG. 7 also illustrates an adhesive 29, such as an electrically insulating structural adhesive, disposed to attach the body 34 to the first substrate 22.

[0087] 8A-8C show an interface assembly 100 including, in this case, a mechanical button or the like that is movable toward and away from the functional multi-layer structure 20. FIG. 8C shows the interface assembly 100 in a perspective view from the side, with at least a portion of the movable member 40 visible. FIG. 8C also shows cross sections AA and BB. FIG. 8A shows the AA cross section, and FIG. 8B shows the BB cross section, even though they are shown as being perpendicular to each other.

[0088] 8A shows that at least one sensor 32 is embedded in the molding material layer 26. The sensor 32 may be, for example, a Hall sensor, a reed switch, or a sensing coil for sensing changes in a magnetic field. Thus, when the movable member 40 is pushed toward the multi-layer structure 20, the sensor 32 detects a change in the magnetic field. The same applies when the movable member 40 is moved away from the structure 20. Therefore, the sensing portion 42 is preferably a permanent magnet or multiple permanent magnets.

[0089] FIG. 8B , which shows cross section BB at a different position from cross section AA, also shows a first permanent magnet 51 provided on the movable member 40. The first permanent magnet 51 is positioned to interact with a second permanent magnet 52 in the functional multi-layer structure 20. The first permanent magnet 51 and the second permanent magnet 52 are positioned so that a repulsive force is generated between them. That is, when the movable member 40 is pressed down and released, the repulsive force between the first permanent magnet 51 and the second permanent magnet 52 causes the movable member 40 to move away from the structure 20. In a preferred embodiment, the magnets of the detection portion 42 and the first permanent magnet 51 may be identical, and may be arranged, for example, alternately around the vertical central axis of the movable member 40 or in other patterns. On the other hand, while the first permanent magnet 51 is in the state shown in FIG. 8B , the detection portion 42, if any, may be located in a portion extending into the hole of the structure 20.

[0090] 9 shows an interface assembly 100. The movable member 40, or "slider," of FIG. 9 comprises a permanent magnet as a sensing portion 42. Furthermore, the functional multi-layer structure 20 comprises a coil assembly, and the sensor 32 is a coil and is included in the coil assembly. Furthermore, the coil assembly may comprise a magnetic core 35 around which the coil is wound, for example around its teeth. The coil may further be connected to a sensing unit (not shown), for example comprising a sensing circuit and a processing unit.

[0091] In addition to measuring the position of movable member 40 or changes thereto, the coils may also be utilized to vibrate movable member 40. This may be done by injecting an appropriate current pattern into the coils, thereby generating a preferably varying magnetic field that, when interacting with the magnets of movable member 40, vibrates movable member 40. In this manner, tactile feedback, such as vibrotactile sensations, may be generated by interface assembly 100.

[0092] FIG. 10 shows an interface assembly 100. The operating principle is generally the same as in the embodiment according to FIG. 9, but the coil is provided on a substrate, such as a multi-layer PCB. As such, the coil may be provided using etching. In other embodiments, the conductive traces forming the coil may be printed on a substrate, such as a multi-layer substrate, using printed electronics techniques. Examples of such techniques include screen printing, flexographic printing, inkjet printing, or 3D printing, which are essentially additive printing processes (e.g., compared to etching).

[0093] In various embodiments, the electrically and / or thermally conductive elements (traces, pads, connection elements, electrodes, etc.) may comprise at least one material selected from the group consisting of conductive ink, conductive nanoparticle ink, copper, steel, iron, tin, aluminum, silver, gold, platinum, conductive adhesive, carbon fiber, graphene, alloys, silver alloys, zinc, brass, titanium, solder, and any components thereof. The conductive material used may be optically opaque, translucent, and / or transparent at a desired wavelength (e.g., at least a portion of visible light), for example, to mask or reflect radiation (e.g., visible light) therefrom, absorb it therein, or allow it to pass. As a practical example of a possible conductive material, for example, DuPont™ ME602 or ME603 conductive ink may be utilized.

[0094] 11A to 11C show interface assembly 100. Fig. 11A is a cross-sectional side view of interface assembly 100, Fig. 11B is a perspective view, and Fig. 11C is a top view, i.e., a side view of assembly 100 where movable member 40 is present.

[0095] The movable member 40 in Figures 11A-11C is a rotatable movable member 40. In this case, it is movably attached to the functional multi-layer structure 20 by an attachment mechanism 60, i.e., by a mechanical attachment arrangement comprising a rotating axle or shaft. Figure 11A shows that in this case, the attachment mechanism 60 limits lateral and upward movement by a flange on the upper end of the rotating axle or shaft.

[0096] Attachment mechanism 60 may be a separate shaft that is attached to a surface of structure 20. Alternatively, attachment mechanism 60 may be at least partially an integral part of structure 20, such as substrate 22, 28 or its molding material layer 26. Thus, attachment mechanism 60 may be a protrusion, pin, or other shape that extends outward from structure 20. Movable member 40 may be arranged to move, such as by rotating, around the protrusion, pin, or other shape.

[0097] Alternatively or additionally, as shown in FIG. 11A, the movable member 40 may be movable vertically (through the thickness of the structure 20 or in the direction normal to the surface of the structure 20) and / or horizontally (laterally across the structure 20) as previously described herein with respect to other figures.

[0098] 11B shows that the body 41 of the movable member 40 is U-shaped in this case, although other shapes are also possible. There are multiple detection portions 42, which are pieces of magnetic material, such as permanent magnets or ferromagnetic materials, arranged around the rotating axis or shaft. In this case, the magnets are arranged on the outer periphery of the body 41, but they could also be arranged closer to the rotating axis or shaft. Alternatively or additionally, the detection portions 42 may be magnetic materials, such as ferromagnetic materials. For example, the detection portions 42 can comprise a material, such as iron or an iron alloy, that has magnetic properties that can be detected, for example, by a magnetometer.

[0099] Furthermore, as can be seen, the permanent magnets may be arranged so that the magnetic poles of every other magnet face in a different direction than the adjacent magnets, i.e., the polarity alternates, so that moving from one magnet to another causes the magnetic field to alternate in direction.

[0100] The operating principle of the interface assembly 100 according to Figures 11A-11C can be best understood by looking at Figure 11C. Figure 11C shows that the interface assembly 100 includes at least two sensors 32 in the sensor configuration 30. The sensors 32 are positioned within the functional multi-layer structure 20 at locations that correspond to the circular rotation paths of the permanent magnets. In this particular embodiment, the sensors 32 are positioned such that when one is aligned with one of the magnets, the other sensor 32 is located between the two adjacent magnets. The placement of the sensors 32 and / or the detection portion 42, which are permanent magnets, may also differ from that described herein.

[0101] Thus, rotation of the movable member 40 causes the sensors 32 adapted to measure magnetic fields or changes therein to alternately measure the changing magnetic fields. Thus, the sensor arrangement 30 can be positioned to determine the speed and direction associated with the rotation of the movable member 40.

[0102] 11A-11C further show an optional first permanent magnet 51. Although not shown, a second permanent magnet 52 may also be provided in the multi-layer structure 20, as in FIG. 8B. Alternatively, a coil (see FIGS. 9 and 10) may be provided below the first permanent magnet 51 to provide tactile feedback to the movable member 40.

[0103] 11A-11C, when the movable member 20 rotates, the sensor(s) 32 detect changes in the magnetic field as the magnets 42 pass by the sensors 32. When magnets 42 have alternating polarity as shown, the sensors 32 are able to detect changes including polarity (or magnetic field direction) because every other magnet 42 causes a change of opposite polarity compared to the previous one. Thus, the sensors 32 generate sensed signals representative of or indicative of the movement of the movable member 40.

[0104] In various embodiments, the interface assembly 100 may include a spring arranged to interact with the movable member 40. For example, the movable member 40 may be mechanically coupled to the functional multi-layer structure 20 via the spring. Alternatively, the movable member 40 may not be in contact with the spring in one position but may come into contact with the spring as it moves. The spring may be, for example, a coil spring or a leaf spring, which is arranged to compress or extend / strain from its rest position when the movable member 40 is moved translationally, vertically, or horizontally / laterally. In some embodiments, the central portion of the spring may include a through-hole through which the movable member 40 extends toward the functional multi-layer structure 20.

[0105] 12A and 12B show an interface assembly 100. In this case, the movable member 40 may be moved by rotating and / or pushing downward. However, the interface assembly 100 further includes a spring 70. In FIG. 12A, the spring 70 is in a rest position or at most in a partially compressed state. In FIG. 12B, the spring 70 is essentially fully compressed. The spring 70 in FIGS. 12A and 12B is a dome-shaped spring. When the spring 70 is not fully compressed, an edge portion or portions of the dome contact one of the functional multi-layer structure 20 (such as the first substrate 22 or the second substrate 28, or the molding material layer 26) and the movable member 40, and the central portion of the dome is spaced apart from the other of the functional multi-layer structure 20 and the movable member 40. FIGS. 12A and 12B show that the edge portion contacts the functional multi-layer structure 20. 12A and 12B may be made of plastic, such as a thermoformable plastic film, or may be made of metal. The central portion of the spring 70 may include a through-hole through which the movable member 40 can extend toward the functional multi-layer structure 20. In some embodiments, movement of the movable member 40 may cause the spring 70 to bend.

[0106] The interface assembly 100 of FIGS. 12A and 12B operates as if there is a clear path between sensors 32A and 32B in the case of FIG. 12A. For example, sensor 32A may emit light waves, such as light or infrared light, toward sensor 32B, which can be used to record or detect the emitted light waves. In FIG. 12B, the movable member 40 is depressed, causing a portion of it, i.e., the detection portion 42, to block the path. This can be detected by sensor 32B, which no longer receives the emitted light waves. Of course, alternatively, the movable member 40 may block the path in a first position corresponding to FIG. 12A and allow the emitted light waves to reach sensor 32B in a second position corresponding to FIG. 12B. The detection portion 42 of the movable member 40 may, for example, include a through-hole or a portion including a material transparent to the emitted light waves. Sensor 32B may, for example, be a reflective surface positioned to reflect the emitted light waves back to sensor 32A and detect the reflected signal.

[0107] FIG. 13 shows a spring 70 having a particularly advantageous segmented dome shape. The small arrow in the figure indicates that the central portion is spaced apart from the level of the edge portion or portions. The spring 70 operates in essentially the same manner as described above for the dome-shaped spring. When the segmented dome-shaped spring is not fully compressed, the edge portion or portions of the segmented dome are in contact with one of the functional multi-layer structure 20 (such as the first substrate 22 or the second substrate 28, or the molding material layer 26) and the movable member 40, while the central portion of the dome is spaced apart from the other of the functional multi-layer structure 20 and the movable member 40. FIG. 13 shows the edge portion in contact with the functional multi-layer structure 20. The dome-shaped spring 70 of FIG. 13 may preferably be made of a plastic material, such as a thermoformable plastic film. The central portion of the segmented dome-shaped spring may have a through-hole through which the movable member 40 can extend toward the functional multi-layer structure 20.

[0108] Alternatively, spring 70 may be a planar spring, such as an orthogonal planar spring. It may also be a plastic material, such as a thermoformable plastic film. In the case of a planar spring, functional multi-layer structure 20 may include, for example, a hole, recess, or cavity through which the planar spring can extend when movable member 40 is moved toward structure 20. Alternatively, the planar spring may extend into such a hole, recess, or cavity in movable member 40, or both structure 20 and movable member 40 may have such a hole, recess, or cavity. Alternatively, a support frame, such as a support ring, may be utilized to provide space for the planar spring to move.

[0109] When spring 70 is compressed, it may slide on the surfaces of structure 20 and movable member 40. Meanwhile, Figure 13 also illustrates a spring support member 80 or protrusion, such as a pin, for supporting spring 70 laterally in the figure. Spring support member 80 or members 80 may be positioned on structure 20 or movable member 40, depending on the embodiment, to align with a groove or hole or other counter element in spring 70. Preferably, support member(s) 80 may support spring 70 such that when spring 70 is compressed, it contacts support member 80 in a direction perpendicular to the direction of movement of movable member 40.

[0110] Alternatively, spring element 70 may be disposed within a hole or cavity, or other structure such as a ring, that defines an outer wall that spring element 70 can contact when compressed or at essentially all positions.

[0111] 14A-14C illustrate interface assembly 100. For clarity, FIG. 14A illustrates only the movable member 40 and sensors 32A, 32B. The movable member 40 may include a through-hole 49 or channel 49 within or as its sensing portion 42, extending laterally through the movable member 40. The purpose of the through-hole 49 or channel 49 is to allow light waves, such as light, to pass through when the movable member 40 is in a first position relative to the functional multi-layer structure 20. Operation of assembly 100 is described in more detail with reference to FIGS. 14B and 14C.

[0112] FIG. 14B shows the movable member 40 in a first position. As can be seen, the signal emitted by sensor 32A passes through channel 49 and is received by sensor 32B. Meanwhile, FIG. 14C shows the movable member 40 in a second position. The movable member 40 is depressed, and channel 49 is no longer aligned with sensors 32A, 32B. Thus, detection of the position of the movable member 40 and / or changes thereto can occur. As can be seen in FIGS. 14B and 14C, the assembly 100 may optionally include a spring 70. In various embodiments, the movable member 40 may be rotatable.

[0113] 14B and 14C also show an alternative embodiment in which the channel 49 is located in a portion of the movable member 40 near the surface, i.e., the outer surface, along which the movable member 40 is manipulated, as shown. In such an embodiment, the sensors 32, 32A, 32B may be provided on the substrate 22, 28 near the outer surface, as shown. In such a case, there may or may not be another substrate 22 on the opposite side of the molding material layer 26 that at least partially embeds the sensor arrangement 30.

[0114] 15A and 15B show the interface assembly 100. The movable member 40 includes a sensing portion 42, which may be a permanent magnet or a set of permanent magnets, or another material that influences the surrounding magnetic field. Meanwhile, the functional multi-layer structure 20 includes at least one sensor 32, which may be a coil. The coil may be similar to a speaker's voice coil, i.e., it includes a support ring around which the coil is wound. Therefore, when the movable member 40, particularly a magnet or magnetic object, moves toward the coil, a current is induced in the coil, which can be used to detect the movement of the movable member 40. As seen in FIGS. 15A and 15B, a spring 70 may be disposed between the movable member 40, which is translationally (vertically) movable and optionally rotatable, and the multi-layer structure 20. In various embodiments, the movable member 40 may also be rotatable, as indicated by the dashed double-headed arrow.

[0115] 15A and 15B, a coil may be utilized to impart motion to the movable member 40. By injecting a current into the coil, the magnetic field generated by the injected current interacts with the sensing portion 42 of the movable member 40, thereby enabling movement of the movable member 40. This may be used, for example, to produce at least a vibration, but may even be used to produce sound.

[0116] In some embodiments, the movable member 40 may be essentially like the spring 70 shown in FIG. 13 , but the central portion is a solid material and does not include a through hole. Optionally, the central portion may comprise a ferromagnetic material that can be moved by changing the magnetic field around it. Furthermore, such a movable member 40 may comprise a support member 80 that secures an edge portion of the movable member 40 relative to the functional multi-layer structure 20. Furthermore, the material of such a movable member 40 may be flexible, at least with respect to its edge portion or portions, thus allowing movement of the movable member 40 relative to the structure 20.

[0117] 16A and 16B show an interface assembly 100. In Fig. 16A, the interface assembly 100 comprises a movable member 40 arranged for hinged movement relative to the functional multi-layer structure 20. Thus, when the movable member 40 has a longitudinal shape as shown in Fig. 16A, it may rotate about a pivot point that is preferably, but not necessarily, located at an end of the movable member 40. The movable member 40 may be, for example, a switch.

[0118] 16A and 16B may include a hinge 66 or multiple hinges 66. Optionally, the movable member 40 may be positioned away from the functional multi-layer structure 20 when in a standby position where it is not being manipulated or touched. For example, there may be a spring that keeps the movable member 40 in the standby position. In some embodiments, the hinge 66 may be an at least partially integrated part of the functional multi-layer structure 20, such as a protrusion in the substrate 22, 28 and / or the molding material layer 26. Alternatively, the hinge 66 may be a separate structure that is attached to the functional multi-layer structure 20. Alternatively, the standby position may be when the movable member 40 is closer to the structure 20.

[0119] 16B shows another interface assembly 100 in which the movable member 40 is hingedly disposed. In these embodiments, the movable member 40 is not attached to the functional multi-layer structure 20, but rather is attached to a host structure 90. Preferably, the host structure 90, such as a substrate or other support structure, may be secured relative to the multi-layer structure 20 by a securing mechanism 92 when installed for use. The securing mechanism 92 may be, for example, a separate substrate or support member on which both the host structure 90 and the functional multi-layer structure 20 are disposed. Of course, the functional multi-layer structure 20 may also be attached directly to the host structure 90.

[0120] Furthermore, the movable member 40 may comprise, for example, a magnet, a metallic material such as a magnetic metallic material, or an optically reflective material, or a capacitive detection element. The functional multi-layer structure 20, and in particular its sensor arrangement 30, may comprise a magnetic sensor for measuring a magnetic field or its changes, an inductive sensor such as including a coil or multiple coils, a capacitive sensor, or an optical sensor such as comprising a transmitter and a receiver. Thus, the position of the movable member 40 and / or its changes may be determined or detected based on the sensor arrangement 30.

[0121] 17A-17C show an interface assembly 100 within a host structure 90 and a steering wheel 200. Fig. 17A shows an interface assembly 100 having a movable member 40 arranged for hinged movement relative to a functional multi-layer structure 20. The movable member 40 is attached to the functional multi-layer structure 20 by a hinge 66 or hinge arrangement 66.

[0122] 17B shows an interface assembly 100 having a movable member 40 arranged for hinged movement relative to the functional multi-layer structure 20. The movable member 40 is attached to a host structure 90 by a hinge 66 or hinge arrangement 66. The host structure 90 is preferably fixed relative to the functional multi-layer structure 20.

[0123] FIG. 17C shows a perspective view of the interface assembly 100 shown in FIG. 17B. As can be seen, the interface assembly 100 is disposed on a host structure 90, in this case a steering wheel 200. The steering wheel 200 includes a steering wheel body defining a handle portion(s) and a central portion. The axis of rotation of the steering wheel 200 is indicated by a dashed line. The interface assembly 100 is disposed in the middle portion of the steering wheel, which is located between the central portion and the handle portion(s). As can be seen, the movable member 40 is hingedly disposed and attached to the rear side of the central portion of the steering wheel 200. Alternatively, the movable member 40 could be hingedly disposed and attached to the rear side of the middle portion of the steering wheel 200. Thus, a user can easily operate the movable member 40 by hand while gripping the handle portion of the steering wheel 200.

[0124] 18A and 18B show interface assembly 100. Figures 18A and 18B show interface assembly 100 in cross-sectional side views. Interface assembly 100 comprises a movable member 40 defined by a portion of substrate 22, 28, preferably a flexible and / or formable, e.g., thermoformable, substrate film, and a detection portion 42, preferably a planar element, on a surface of said substrate 22, 28.

[0125] Thus, the movable member 40 may be an integral part of the functional multi-layer structure 20, while still being movable relative to the structure 20. In one embodiment, the movable member 40 may advantageously comprise a portion of the substrate 22, 28.

[0126] In a preferred embodiment, the sensing portion 42 is a first contact pad or strip or region of a conductive material, such as a metal (copper, aluminum, silver, etc., or a metal alloy thereof), provided on the surface of the substrate 22, 28, preferably a formable substrate film. The first contact pad, first strip, or first region may be used as a capacitive sensing element region.

[0127] The sensing portion 42 may further be connected to an electrical circuit, such as on the same substrate 22, 28, another substrate, or another host device. The interface assembly 100 also includes a void or empty space 82 between the substrate 22, 28 and the functional multi-layer structure 20, preferably at a location corresponding to the sensing portion 42. Thus, application of a force, such as by pressing against the outer surface or "dome" of the movable member 40, can move the sensing portion 42 toward the functional multi-layer structure 20.

[0128] Thus, the functional multi-layer structure 20 may comprise a sensor 32, such as a second contact pad, a second strip, or a second region of a conductive material (such as copper, aluminum, silver, etc., or a metal alloy thereof), provided on the surface of the substrate 22, 28, which is preferably a formable substrate film, on the opposite side of the molding material layer 26, and the sensor 32 is at least partially embedded in the molding material layer 26 or is covered on at least one side by the molding material layer 26. The second contact pad, second strip, or second region interacts with the first contact pad, first strip, or first region and may be used as a capacitive sensing element to provide a capacitive sensing device including TX (transmitter) and RX (receiver) electrodes in the form of first and second contact pads, etc.

[0129] In a preferred embodiment, the first and / or second contact pads, etc. may be fabricated by printing onto the corresponding substrate 22, 28. Substantially any additive printing technique may be utilized, such as screen printing, flexographic printing, and inkjet printing.

[0130] In various embodiments, the functional multi-layer structure 20 may include ventilation channels 89 connecting the empty space 82 with the ambient environment of the interface assembly 100, preferably via channel portions extending through the functional multi-layer structure 20. Thus, when the movable member 40 is moved toward the structure 20, the pressure in the empty space may be controlled to not increase too much and / or to not encounter too much resistance to said movement.

[0131] In some embodiments, the functional multi-layer structure 20 may include a support material layer 80. The surface of the support material layer 80 facing the substrate 22, 28 preferably does not adhere too strongly to the substrate, or at least does not adhere more strongly than the molding material layer 26.

[0132] 18B, an adhesive 29, such as an electrically insulating structural adhesive, may be used between the support material layer 80 and the substrates 22, 28 on which the detection moieties 42 reside. The adhesive 29 is preferably positioned to adhere the portion(s) of the substrates 22, 28 to the support material layer 80 that surrounds the portion defining the movable member 40.

[0133] 19A-19D illustrate several method steps for manufacturing interface assembly 100. Fig. 19A illustrates a multi-layer structure including at least one substrate 22, 28, the surface of which is provided with a first contact pad or the like (designated by reference numeral 42). Additionally, molding material layer 26 may be molded onto the side surface of substrate 22, 28, or molding material layer 26 may be provided after substrate 22, 28 has been molded to include a shape that functions as movable member 40.

[0134] Although in FIG. 19A the contact pads are located on the same side of the substrates 22, 28 as the molding material layer 26, the contact pads could alternatively be located on the opposite side, i.e., the outer surface of the interface assembly 100 being manufactured.

[0135] Additionally, the multilayer structure includes second contact pads, etc. (designated 32), at least partially embedded in or covered by the molding material layer 26. FIG. 19A shows an optional mold 84 positioned on the structure in a location corresponding to the first contact pads. As can be seen, the mold 84 may be utilized to apply a force, such as suction 86, negative pressure 86, or possibly high pressure 86 (via ventilation channels 89, if present), to the surface of the substrate 22, 28 in a location corresponding to the first contact pads. The mold 84 includes a recess, which in this case is dome-shaped, although other shapes could easily be used. For example, the shape could be longitudinal, such as to provide a slider interface.

[0136] During a molding process, such as a thermoforming process utilizing high temperature and pressure (such as relative to room temperature and ambient temperature), the substrates 22, 28 may detach from the underlying structure, if any, such as against the molding material layer 26 or the support material layer 80, resulting in a void or empty space 82 between the first contact pad, which is the detection portion 42, and the multi-layer structure, which is the functional multi-layer structure 20.

[0137] 19C and 19D illustrate substantially similar steps to those in FIGS. 19A and 19B, but in perspective. In FIG. 19C, the substrates 22, 28 are in contact with the underlying structure and assume an essentially planar shape, at least locally at the first contact pads. Next, in FIG. 19D, the substrates 22, 28 are thermoformed or otherwise formed, at least locally at the first contact pads, to create a dome-shaped movable member 40 and a void or empty space 82 below the movable member 40 through which the movable member 40 can move. While the sensing portion 42 moves within the empty space 82, which is optionally ventilated (with ventilation channels 89) to ambient pressure, a sensor 32, such as a capacitive sensing element or electrode, can be embedded within the molding material layer 26 or between the molding material layer 26 and another substrate 28, thereby advantageously sealing the sensor 32 from ambient conditions (humidity, temperature, pressure, etc.).

[0138] The first substrate 22 and / or second substrate 28, such as the base film(s), or generally the material layer(s) included in the multilayer structure 20, may comprise at least one material selected from the group consisting of polymers, thermoplastic materials, electrically insulating materials, polymethyl methacrylate (PMMA), polycarbonate (PC), flame-retardant (FR) PC film, FR700 type PC, copolyester, copolyester resin, polyimide, copolymer of methyl methacrylate and styrene (MS resin), glass, polyethylene terephthalate (PET), carbon fiber, organic materials, biomaterials, leather, wood, textiles, fabrics, metals, organic natural materials, solid wood, veneer, plywood, bark, tree bark, birch bark, cork, natural leather, natural fiber or fabric materials, naturally grown materials, cotton, wool, linen, silk, and any combination.

[0139] The molding material layer 26 may generally comprise at least one material selected from the group consisting of, for example, a polymer, an organic material, a biomaterial, a composite material, a thermoplastic material, a thermoset material, an elastomeric resin, PC, PMMA, ABS, PET, a copolyester, a copolyester resin, nylon or polyamide (PA), polypropylene (PP), a thermoplastic polyurethane (TPU), polystyrene (GPPS), TPSiV (thermoplastic silicone vulcanizate), and an MS resin. The molding material layer may be transparent, translucent, or opaque.

[0140] In various embodiments, the substrate 22, 28 (or both) may be a printed circuit board (PCB), a ceramic substrate, a flexible printed circuit, an FR-4 substrate, or the like. Even a metal substrate may be used in various embodiments. The metal substrate may or may not have an insulating coating on one or both major surfaces.

[0141] Depending on the embodiment in question, substrate 22, 28 and / or additional film(s) or layer(s) potentially included in structure 20 may comprise or be optically substantially transparent or at least translucent materials, considering the wavelengths of interest (e.g., visible light), for example, having an associated light transmittance of about 80%, 90%, 95%, or more. This may be particularly true when the substrate is configured within structure 20 to effectively transmit or pass light emitted by the light source. However, in some embodiments, substrates 22, 28 used may be substantially opaque, black, and / or otherwise dark in color to block incident light from passing therethrough (masking function).

[0142] When substrates 22, 28 are substrate films, the thickness of the film and optionally the thickness of additional films or layers included in structure 20 may vary depending on the embodiment and may be, for example, only tens or hundreds of millimeters, or may be much thicker, on the order of one or several millimeters.

[0143] The thickness may in fact vary locally and / or may optionally comprise recesses or internal cavities, in addition to housing various elements (e.g., electronic or optical elements), for example, light guiding, processing, and / or thermal management purposes.

[0144] The substrate film, as well as further layers of the structure (e.g., films, coatings), can be essentially planar (width and length greater than thickness, e.g., by an order of magnitude). The same generally applies to the entire structure as illustrated in the figures, although other non-planar shapes are entirely feasible.

[0145] In various embodiments, possible additional layers or features in general may be added to the multilayer structure 20 by molding, laminating, or suitable coating (e.g., vapor deposition) procedures, without neglecting other possible positioning or fastening techniques. Layers may be of protective, instructional, and / or aesthetic value (e.g., graphics, colors, shapes, text, numerical data, etc.) and may contain, for example, textile, leather, or rubber materials instead of or in addition to additional plastics. Additional elements (e.g., electronics, modules, module interiors or components, and / or optical components) may be attached and fastened, for example, to the outer surface of the structure (e.g., the outer surface of an included film or molding material layer, depending on the embodiment). The necessary materials may be molded / cut. For example, a diffuser may be made from a light conductor material that locally irradiates the laser. If a connector is provided, the connector of the multilayer structure 20 may be connected to a desired external connection element (e.g., an external connector of an external device, system, or structure, such as a host device). For example, these two connectors may together form a plug-and-socket type connection and interface. As used herein, the multi-layer structure 20 may also be generally positioned and attached to a larger ensemble, such as an electronic device, such as a personal communication device, a computer, a home device, an industrial device, or a vehicle in embodiments where the multi-layer structure forms part of the vehicle exterior or interior, such as a dashboard.

[0146] Additionally, structure 20 may be any of an electronic component, an electromechanical component, an electro-optical component, a radiation emitting component, a light emitting component, an LED (light emitting diode), an OLED (organic LED), a side shooting LED or other light source, a top shooting LED or other light source, a bottom shooting LED or other light source, a radiation detecting component, a light detecting or photosensitive component, a photodiode, a phototransistor, a photovoltaic device, a sensor, a micromechanical component, a switch, a touch switch, a touch panel, a proximity switch, a touch sensor, an air sensor, a temperature sensor, a pressure sensor, a moisture sensor, a gas sensor, a proximity sensor, a capacitive switch, a capacitive sensor, a projected capacitive sensor or switch, a single electrode capacitive switch or sensor, a capacitance ... The electronic components may include, for example, on the substrate film 22, 28, an electrical circuit comprising at least one component or element selected from the group consisting of a capacitive button, a multi-electrode capacitive switch or sensor, a self-capacitance sensor, a mutual-capacitance sensor, an inductive sensor, a sensor electrode, a micromechanical component, a UI element, a user input element, a vibration element, a sound-generating element, a communication element, a transmitter, a receiver, a transceiver, an antenna, an infrared (IR) receiver or transmitter, a wireless communication element, a wireless tag, a tag reader, a data processing element, a microprocessor, a microcontroller, a digital signal processor, a signal processor, a programmable logic chip, an ASIC (application-specific integrated circuit), a data storage element, and an electronic subassembly. In various embodiments, the circuit may be at least partially embedded in the molding material layer 26.

[0147] FIG. 20 shows a flow diagram of a method for manufacturing the interface assembly 100.

[0148] Step or item 300 refers to the start-up stage of the method, where suitable equipment and components are obtained and the system is assembled and configured for operation.

[0149] At the beginning of the method, a start-up phase 300 may be performed. During start-up, necessary tasks may be performed (e.g., material, component, and tool selection, acquisition, calibration, and other configuration tasks). Particular care must be taken to ensure that the individual elements and material selection work together to withstand the selected manufacturing and installation process. This is, of course, preferably checked in advance, for example, based on the manufacturing process specifications and component data sheets, or by inspecting and testing fabricated prototypes. Accordingly, the equipment used (e.g., molding, IMD (in-mold decoration), laminating, bonding, (thermo)forming, electronics assembly, cutting, drilling, printing, and / or equipment providing measurements such as desired optical measurements, among others) may be brought up to an operational state at this stage.

[0150] Step or item 310 refers to obtaining or manufacturing a first substrate 22, 28 (e.g., first substrate 22 and / or second substrate 28), such as a thermoformable, preferably flexible, substrate film. The substrate 22, 28 may be a pre-fabricated substrate or substrate film, preferably a planar substrate (film), including a substrate film on a roll. The substrate 22, 28 may be at least primarily an electrically substantially insulating material(s). In some embodiments, the substrate 22, 28 itself may be fabricated in-house by first shaping selected starting material(s) using a mold or forming device or other method. Optionally, the substrate film may be further processed at this stage. For example, holes, notches, recesses, cuts, etc. may be provided.

[0151] Step or item 320 refers to obtaining at least one sensor 32 configured to detect the position or change in position of at least one sensing portion 42 .

[0152] In various embodiments, several electrically conductive and / or thermally conductive elements, e.g., defining various conductor lines (traces), sensing elements (e.g., electrodes), and / or contact areas (e.g., pads) to construct the electrical circuit design, are provided on one or both sides of the substrate(s), or advantageously one or more of the substrate film(s), preferably by one or more additive techniques, e.g., printed electronics technology or 3D printing. For example, screen printing, inkjet printing, flexographic printing, gravure printing, or offset lithography printing may be applied by a suitable printing device or devices. In some cases, subtractive or semi-additive processes may also be utilized. For example, further actions to develop the substrate film(s) may be performed here, including printing or generally providing graphics, visual indicators, optical elements, etc.

[0153] In various embodiments, the electrically and / or thermally conductive elements (traces, pads, connection elements, electrodes, etc.) may comprise at least one material selected from the group consisting of conductive ink, conductive nanoparticle ink, copper, steel, iron, tin, aluminum, silver, gold, platinum, conductive adhesive, carbon fiber, graphene, alloys, silver alloys, zinc, brass, titanium, solder, and any components thereof. The conductive material used may be optically opaque, translucent, and / or transparent at a desired wavelength (e.g., at least a portion of visible light), for example, to mask or reflect radiation (e.g., visible light) therefrom, absorb it therein, or allow it to pass. As a practical example of a possible conductive material, for example, Dupont™ ME602 or ME603 conductive ink may be utilized.

[0154] At least a portion of the electronics and / or other elements of the final multi-layer structure may be conveniently provided to the substrate 22, 28, such as the substrate film(s), via a fully or partially prefabricated module or subassembly. Optionally, the module or subassembly may be at least partially overmolded with a protective plastic layer before attachment to the substrate 22, 28.

[0155] For example, adhesives, pressure, and / or heat may be used to mechanically bond the module or subassembly to the primary (receiving) substrate. Solder, traces, and conductive inks are examples of applicable options for providing electrical and / or thermal connections between the elements of the module or subassembly and with the remaining electrical and / or thermal elements on the primary substrate.

[0156] Step or item 330 refers to molding a material onto one side of the first substrate 22, 28 to at least partially embed a sensor configuration 30 including at least one sensor 32 in the molding material layer 26, thereby obtaining a functional multi-layer structure 20.

[0157] Step or item 340 refers to obtaining or creating a movable member 40 including at least one detection moiety 42. It should be noted that obtaining or creating a movable member 40 may occur at any stage relative to other stages of the method. For example, the movable member 40 may be created or obtained before obtaining the substrate 22, 28. In some embodiments, as previously described herein with reference to FIGS. 18A-19D, the movable member 40 may be created during any step of thermoforming the substrate 22, 28, preferably a substrate film (described below). As a further example, the movable member 40 may be created or obtained after the multilayer structure 20 is fabricated. In FIG. 20, item 340 is depicted as having parallel branches in the flow diagram.

[0158] Step or item 350 refers to positioning the sensor configuration 30 and the at least one detection portion 42 relative to one another such that a position or change in position of the movable member 40 is detectable by the sensor configuration 30 based on a position or change in position of the at least one detection portion 42 relative to the sensor configuration 30.

[0159] Execution of the method may end at step or item 399.

[0160] Additionally, the method may include thermoforming the first substrate 22, 28 to have at least a portion having a non-planar three-dimensional shape prior to forming 330. Preferably, thermoforming includes stretching the first substrate 22, 28 at least locally under high pressure to generate the non-planar three-dimensional shape. Thermoforming preferably occurs after providing conductive traces and electrical circuitry, such as those including sensors 32, 32A, 32B and other electronic components, but prior to the forming 330 step.

[0161] In some embodiments, grooves, holes, or through-holes extending outward from the surface of multi-layer structure 20, or alternatively, protrusions, pins, or other shapes as described above, may be provided by thermoforming substrate 28.

[0162] Alternatively or additionally, the method includes movably attaching the movable member 40 and the functional multi-layer structure 20 to one another.

[0163] Furthermore, in various embodiments, the movable member 40 and the functional multi-layer structure 20 are adapted to one another such that a shape-interlocking arrangement exists between the movable member 40, such as between a portion of a groove, hole, or through-hole in the structure 20 and the movable member 40, to prevent or at least impede detachment of the movable member 40 from the functional multi-layer structure 20. An example of a shape-interlocking arrangement is shown in and will be described in connection with Figure 6. As will be appreciated by those skilled in the art, the shape-interlocking arrangement, with respect to details such as its shape, can be provided in a number of different ways.

[0164] Still with respect to molding material layer 26, the light transmittance of, for example, a translucent material selected for molding material layer 26 may be about 25% to about 90% or more at a selected wavelength (e.g., at least some of the visible wavelengths) considering, for example, a material sample about 2 mm or 3 mm thick. The associated half-power angle may be about 5 to about 75 degrees (on an intensity basis), for example, about 5, 10, 20, 30, 40, 50, 60, or 70 degrees. In different use scenarios, the desired transmittance and scattering characteristics may, of course, further vary.

[0165] Thus, molding material layer 26 may comprise an optically at least translucent (optionally substantially transparent) material, and the light transmittance of the entire thermoplastic layer may preferably be at least 50% in some use scenarios, although the desired transmittance may in practice vary radically among all possible use scenarios. In some embodiments, a transmittance of at least about 80% or 90% may be preferred to maximize light output from the structure, while in some other embodiments, 10%, 20%, or 30% may be entirely sufficient, if not advantageous, for example, if problems related to light leakage are to be minimized. The transmittance may be measured or defined in a selected direction, e.g., the primary direction of light propagation and / or transverse to the surface of the substrate film at the location of the lighting module on the substrate film, taking into account selected wavelengths of light emitted by the at least one light source (optionally including visible wavelengths).

[0166] Considering, for example, scattering / diffusion or other optical properties, molding material layer 26 may generally include at least one material selected from the group consisting of, for example, polymers, organic materials, biomaterials, composite materials, thermoplastic materials, thermosetting materials, elastomeric resins, PC, PMMA, ABS, PET, copolyesters, copolyester resins, nylon (PA, polyamide), polypropylene (PP), thermoplastic polyurethanes (TPU), polystyrene (GPPS), thermoplastic silicone vulcanizates (TPSiV), and MS resins.

[0167] An example of a suitable polycarbonate-based material is Makrolon™, which is available in various grades, e.g., exhibiting different colors / shades (e.g., white / whitish and black / blackish or dark), transparency, and scattering properties.

[0168] In various embodiments, assembly 100 may also include one or more electrical circuits associated with sensing arrangement 30 and / or movable member 40. The electrical circuit(s) may include several light sources and, for example, associated drivers, conductive traces, or contact pads, optionally printed on substrate 22, 28 and / or other material layers of assembly 100 using printed electronics technology. The traces may be configured for the transfer of power and / or data (e.g., signaling data or other data) between elements (e.g., light sources and associated drivers, or generally, a controller and / or power supply, etc.). Additionally, the circuitry may include one or more electrodes, electrical connectors, electronic components, and / or integrated circuits (ICs) (e.g., control circuitry or data transfer circuitry). Such circuitry may be fabricated directly for assembly 100 by a selected method, for example, by a selected printed electronics technology (optionally screen printing) or using a selected coating technique. Additionally or alternatively, the circuitry may include several packaged components (e.g., surface-mounted devices (SMDs)). Thus, non-conductive and / or conductive adhesives may be utilized to secure the components onto the carrier, and in some embodiments, the mechanical securement is performed or at least enhanced by a non-conductive adhesive material, while solder or other electrically highly conductive (but less adhesive-type) materials are used for the electrical connections.

[0169] Optionally, for example, if capacitive sensing of additional touchless gestures on assembly 100 is to be implemented, the sensing electrodes of the circuitry may be configured (dimensioned, positioned, etc.) such that, for example, their sensing areas or volumes defined by the associated electric or electromagnetic fields are positioned as needed to cover, for example, selected sidewall and / or top areas of the structure, and / or other areas that are to be sensitive to touch (and / or in some embodiments, touchless gestures) or other sensing targets. This type of configuration may be achieved or performed, for example, by utilizing necessary simulations or measurements.

[0170] Additionally, the circuit may comprise and / or the multilayer structure may comprise at least one component or element selected from the group consisting of: electronic components, electromechanical components, electro-optical components, radiation emitting components, light emitting components, LEDs (light emitting diodes), OLEDs (organic LEDs), side shooting LEDs or other light sources, top shooting LEDs or other light sources, bottom shooting LEDs or other light sources, radiation detecting components, light detecting or photosensitive components, photodiodes, phototransistors, photovoltaic devices, sensors, micromechanical components, switches, touch switches, touch panels, proximity switches, touch sensors, air sensors, temperature sensors, pressure sensors, moisture sensors, gas sensors, proximity sensors, capacitive switches, capacitance sensors, projected capacitive sensors or sensors. switches, single-electrode capacitive switches or sensors, capacitive buttons, multi-electrode capacitive switches or sensors, self-capacitance sensors, mutual-capacitance sensors, inductive sensors, sensor electrodes, micromechanical components, UI elements, user input elements, vibration elements, sound generating elements, communication elements, transmitters, receivers, transceivers, antennas, infrared (IR) receivers or transmitters, wireless communication elements, wireless tags, radio tags, tag readers, data processing elements, microprocessors, microcontrollers, digital signal processors, signal processors, programmable logic chips, ASICs (application specific integrated circuits), data storage elements, and electronic subassemblies.

[0171] The assembly 100 may be, or in many use scenarios may be connected to, an external system or device, such as a receiving device or receiving structure for the assembly 100; the connection may be made by a connector, e.g., an electrical connector, or a connector cable, which may be attached to the assembly 100 or the structure 20 and its elements (e.g., circuitry) in a selected manner (e.g., for communication and / or power). Attachment points may be on the side or bottom of the structure, for example, provided via through-holes in the substrates 22, 28.

[0172] The scope of the present invention is determined by the appended claims and their equivalents. Those skilled in the art will understand that the disclosed embodiments have been constructed for illustrative purposes only, and that other configurations applying many of the principles described above can be readily created to best suit each potential use scenario.

Claims

1. An interface assembly (100) comprising: A functional multilayer structure (20), comprising: a first substrate (22, 28); a molding material layer (26) on a first side of the first substrate (22, 28); a sensor arrangement (30) including at least one sensor (32, 32A, 32B), the sensor arrangement (30) being disposed at least partially embedded in the molding material layer (26); A functional multilayer structure (20) comprising: a movable member (40) movable relative to said functional multi-layer structure (20), said movable member (40) comprising at least one detection portion (42); Equipped with the sensor arrangement (30) and the at least one detection portion (42) are arranged relative to one another such that a position or change in position of the movable member (40) is detectable by the sensor arrangement (30) based on a position or change in position of the at least one detection portion (42) relative to the sensor arrangement (30); An interface assembly (100).

2. The interface assembly (100) of claim 1, wherein the movable member (40) and the functional multi-layer structure (20) are movably attached to one another.

3. 3. The interface assembly (100) of claim 2, wherein the movable attachment includes a magnetic attachment arrangement comprising a first attachment portion (62) on the functional multi-layer structure (20) and a second attachment portion (63) on the movable member (40), the magnetic attachment arrangement being arranged to exert an attractive magnetic force between the first attachment portion (62) and the second attachment portion (63).

4. 4. The interface assembly (100) of claim 2 or 3, wherein the movable attachment includes a mechanical attachment arrangement, the mechanical attachment arrangement being arranged to prevent or at least hinder detachment of the movable member (40) from the functional multi-layer structure (20).

5. 3. The interface assembly (100) of claim 2, wherein the mechanical mounting configuration comprises a frame (61) adapted to at least partially confine the movable member (40) between the frame (61) and the functional multi-layer structure (20) such that the movable member (40) is movable within a space between the frame (61) and the functional multi-layer structure (20).

6. 6. An interface assembly (100) according to any one of claims 1 to 5, wherein the functional multi-layer structure (20) comprises a groove, a hole, or a through-hole, and a portion of the movable member (40) comprising the at least one detection portion (42) is adapted to extend within the groove, the hole, or the through-hole and is movably disposed within the groove, the hole, or the through-hole.

7. 7. The interface assembly (100) of claim 6, further comprising a shape interlocking configuration between the groove, the hole or a portion of the through-hole and the movable member (40) to prevent or at least hinder detachment of the movable member (40) from the functional multi-layer structure (20).

8. 8. An interface assembly (100) according to any one of claims 1 to 7, wherein the movable member (40) is movable in a translational manner, such as linearly or non-linearly, relative to the functional multi-layer structure (20), optionally within the groove, the hole, or the through-hole.

9. An interface assembly (100) according to any one of claims 1 to 8, wherein the movable member (40) is rotatably movable relative to the functional multi-layer structure (20), optionally within the groove, the hole, or the through-hole.

10. 10. An interface assembly (100) according to any one of claims 1 to 9, wherein the functional multi-layer structure (20) comprises a protrusion, pin, or other shape extending outward from a surface of the multi-layer structure (20), and the movable member (40) is movable, such as rotatable around, the protrusion, pin, or other shape.

11. 11. The interface assembly (100) of claim 1, wherein the at least one sensor (32, 32A, 32B) is at least one optical sensor configured to transmit an optical detection signal to detect a position or a change in position of the at least one detection portion (42).

12. 12. The interface assembly (100) of any one of claims 1 to 11, wherein the at least one detection portion (42) comprises one or several magnets and / or ferromagnetic elements, and the sensor arrangement (30) comprises a magnetometer, a coil, or a Hall effect sensor for detecting a position or a change in position of the one or more magnets.

13. The interface assembly (100) of any preceding claim, wherein the sensor arrangement (30) comprises a capacitive sensing element for detecting the position or a change in the position of the at least one detection portion (42).

14. The interface assembly (100) of any of claims 1 to 13, wherein the movable member (40) is mechanically coupled to the functional multi-layer structure (20) via a spring (70).

15. 15. The interface assembly (100) of claim 14, wherein a central portion of the spring (70) comprises a through hole through which the movable member (40) extends toward the functional multi-layer structure (20).

16. 16. An interface assembly (100) as described in claim 14 or 15, wherein the spring (70) has a shape of a segmented dome, and when the spring (70) is not fully compressed, an edge portion or multiple edge portions of the segmented dome contact one of the functional multi-layer structure (20) and the movable member (40), and a central portion of the segmented dome is spaced apart from the other of the functional multi-layer structure (20) and the movable member (40).

17. 16. The interface assembly (100) of claim 14 or 15, wherein the spring (70) is a planar spring, such as an orthogonal planar spring.

18. 18. The interface assembly (100) of claim 17, wherein the spring (70) is a plastic material, such as a thermoformable plastic film.

19. An interface assembly (100) according to any preceding claim, wherein the movable member (40) is mounted and arranged for hinged movement relative to the functional multi-layer structure (20).

20. 20. The interface assembly (100) of any of claims 1 to 19, wherein the sensor arrangement (30) comprises a plurality of sensors (32, 32A, 32B) including at least two different types of sensors for detecting the position or a change in the position of the at least one detection portion, the sensor types being selected from the group consisting of optical, capacitive, inductive, resistive, magnetic, galvanic, acoustic, or a combination thereof.

21. An interface assembly (100) according to any preceding claim, comprising a second substrate (28) on an opposite side of the molding material layer (26) from the first substrate (22).

22. The interface assembly (100) of any one of claims 1 to 21, wherein the sensor arrangement (30) is provided on a surface of the first substrate (22) and / or the second substrate (28).

23. 23. The interface assembly (100) of any one of claims 1 to 22, wherein one or both of the first substrate (22) or the second substrate (28) is a thermoformable substrate film, optionally having a non-planar three-dimensional shape.

24. A method of manufacturing an interface assembly (100), comprising: Obtaining or creating (310) a first substrate (22, 28), such as a thermoformable substrate film; obtaining (320) at least one sensor (32, 32A, 32B) configured to detect a position or a change in position of at least one detection portion (42); molding (330) a material onto one side of the first substrate (22, 28) so as to at least partially embed a sensor arrangement (30) including the at least one sensor (32, 32A, 32B) in the molding material layer (26), thereby obtaining a functional multi-layer structure (20); Obtaining or manufacturing (340) a movable member (40) comprising said at least one detection portion (42); and positioning (350) the sensor configuration (30) and the at least one detection portion (42) relative to each other such that a position or change in position of the movable member (40) is detectable by the sensor configuration (30) based on a position or change in position of the at least one detection portion (42) relative to the sensor configuration (30).

25. 25. The method of claim 24, including thermoforming the first substrate (22, 28) to have at least a portion having a non-planar three-dimensional shape prior to said forming (330).

26. 26. The method of claim 25, wherein said thermoforming comprises stretching said first substrate (22, 28) under at least localized high pressure to produce a non-planar three-dimensional shape.

27. A method according to any one of claims 24 to 26, comprising movably attaching said movable member (40) and said functional multi-layer structure (20) to each other.

28. 28. The method according to any one of claims 25 to 27, comprising providing grooves, holes or through-holes, or protrusions, pins or other shapes extending outward from the surface of the functional multi-layer structure (20) during said thermoforming.

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