Multi-component connector

Abstract

This disclosure provides a multi-component connector assembly and a method for forming such an assembly. For example, the multi-component connector assembly includes a multi-component connector having a first support member and a second support member, and also includes a plurality of components disposed between the first support member and the second support member. At least one of the plurality of components may be a heat sink component configured to conduct heat from the first region to the second region. Additionally or alternatively, the plurality of components may include capacitors, resistors, varistors, inductors, and the like. In at least some connectors, a plurality of slots are defined, and at least one component is disposed between the first support member and the second support member in one of the slots of the plurality.

Description

[Technical Field]

[0001] Related applications This application claims priority to U.S. Provisional Patent Application No. 63 / 487,065, filed on 27 February 2023, which is incorporated herein by reference. [Background technology]

[0002] The popularity of high-frequency radio signals is growing. For example, the demand for faster data transmission speeds in wireless smartphone connections is driving the demand for high-frequency components, including those configured to operate in the 5G spectral frequencies. The trend towards miniaturization is also increasing the desirability of small passive components for handling such high-frequency signals. Miniaturization is also increasing the difficulty of surface-mounting small passive components suitable for operation in the 5G frequency spectrum. For example, connectors that place two or more components in the same footprint to reduce mounting space and / or improve power handling would be welcome in this art. [Overview of the Initiative] [Means for solving the problem]

[0003] According to one embodiment of the present invention, a multi-component connector assembly may include a multi-component connector having a first support member and a second support member spaced apart from the first support member. The multi-component connector assembly may also include a plurality of components disposed between the first support member and the second support member of the multi-component connector. At least one of the plurality of components may be a heat sink component having a body made of a non-conductive thermally conductive material such that the heat sink component is configured to conduct heat from a first region to a second region.

[0004] According to another embodiment of the present invention, a multi-component connector assembly may include a multi-component connector having a first support member, a second support member spaced apart from the first support member, and a plurality of slots. At least one component may be positioned between the first and second support members of the multi-component connector, and at least one component may be positioned in each of the plurality of slots.

[0005] A complete and effective disclosure of the present invention, including its best mode, directed to those skilled in the art, is described more specifically in the remainder of this specification with reference to the accompanying figures below. [Brief explanation of the drawing]

[0006] [Figure 1] This is a perspective view of a multi-component connector assembly, which includes a multi-component connector mounted on a mounting surface, wherein multiple components are arranged within the multi-component connector and space is defined between adjacent components, according to an aspect of the present disclosure. [Figure 2] Figure 1 is a perspective view of a multi-component connector assembly, in which additional components are positioned within the space defined between adjacent components. [Figure 3] This is a perspective view of a multi-component connector assembly, which includes a multi-component connector mounted on a mounting surface, wherein multiple components are arranged within the multi-component connector, according to an aspect of the present disclosure. [Figure 4] This is a top view of a multi-component connector according to an aspect of the present disclosure, having a plurality of ribs defining a plurality of slots, and having components disposed within each slot on each end of the connector. [Figure 5] This is a perspective view of a multi-component connector assembly, according to an aspect of the present disclosure, which includes a multi-component connector mounted on a mounting surface and comprising a first retaining member at a first end and a second retaining member at a second end. [Figure 6] This is a top view of a multi-component connector having a plurality of cross members extending between opposing support members of the multi-component connector according to an aspect of the present disclosure. [Figure 7] This flowchart shows a method for forming a multi-component connector assembly according to an aspect of the present disclosure. [Modes for carrying out the invention]

[0007] The repeated use of reference numerals in this specification and drawings is intended to represent the same or similar features or elements of the present invention.

[0008] This discussion is for illustrative purposes only and is not intended to limit broader embodiments of the invention, which should be understood by those skilled in the art to be embodied in the exemplary configurations.

[0009] Generally speaking, the present invention is directed toward multi-component connector assemblies for mounting multiple components on a mounting surface within a single footprint. For example, a multi-component connector assembly may include a multi-component connector having a first support member and a second support member spaced apart from the first support member, and multiple components may be arranged between the first and second support members of the multi-component connector. The multiple components may include at least one of heat sink components, capacitors, resistors, varistors, and / or inductors.

[0010] A multi-component connector assembly can enable the connection of multiple components in parallel. Multiple parallel components can be used to change values ​​and improve power handling for a single component. For example, the inventors have found that components can be laid out or arranged within a connector to reduce heat, improve power handling, obtain customized values, and have values ​​that can be changed on the fly, using a pre-built connector having defined slots and components that fit into a defined footprint, such as those described herein. Multiple types of components can also be combined within the same footprint, for example, in parallel LC (parallel inductor-capacitor), parallel RC (parallel resistor-capacitor), etc.

[0011] In some embodiments, at least one of a plurality of components may be a heat sink component having a body made of a non-conductive thermally conductive material such that the heat sink component is configured to conduct heat from a first region to a second region. For example, a heat sink component may include at least one heat source terminal and at least one heat sink terminal. The heat source terminal may be configured to contact one or more respective electrical devices or components and conduct heat from the electrical devices or components to the heat sink component. The heat sink terminal may be configured to conduct heat away from the heat sink component. For example, one or more heat sink terminals may connect the heat sink component to the heat sink in order to conduct heat from one or more respective electrical devices or components to the heat sink through the heat sink component.

[0012] The body of a heatsink component generally has a low thermal resistivity (for example, approximately 6.67 × 10⁻¹⁰). -3 (less than m·℃ / W) and generally high electrical resistivity (e.g., about 10 14 It may include any suitable material having a density (greater than Ω·cm). 6.67 × 10 -3A thermal resistivity of m·℃ / W is equivalent to a thermal conductivity of approximately 150 W / m·℃. In other words, materials suitable for the body of a heat sink component can generally have high thermal conductivity, exceeding approximately 150 W / m·℃.

[0013] For example, in some embodiments, the body of the heat sink component may be made from a material having a thermal conductivity between approximately 100 W / m·°C and approximately 2200 W / m·°C at approximately 22°C. In other embodiments, the body of the heat sink component may be made from a material having a thermal conductivity between approximately 125 W / m·°C and approximately 250 W / m·°C at approximately 22°C. In other embodiments, the body of the heat sink component may be made from a material having a thermal conductivity between approximately 150 W / m·°C and approximately 200 W / m·°C at approximately 22°C. In other embodiments, the body of the heat sink component may be made from a material having a thermal conductivity between approximately 150 W / m·°C and approximately 2000 W / m·°C at approximately 22°C. In other embodiments, the body of the heat sink component may be made from a material having a thermal conductivity between approximately 250 W / m·°C and approximately 1500 W / m·°C at approximately 22°C. In other embodiments, the body of the heat sink component may be made from a material having a thermal conductivity between approximately 300 W / m·°C and approximately 1000 W / m·°C at approximately 22°C. In other embodiments, the body of the heat sink component may be made from a material having a thermal conductivity between approximately 350 W / m·°C and approximately 750 W / m·°C at approximately 22°C.

[0014] In some embodiments, the body of the heat sink component may include aluminum nitride, beryllium oxide, aluminum oxide, boron nitride, silicon nitride, magnesium oxide, zinc oxide, silicon carbide, any suitable ceramic material, and mixtures thereof.

[0015] In some embodiments, the body of the heat sink component may contain aluminum nitride. For example, in some embodiments, the body of the heat sink component may be made from any suitable composition containing aluminum nitride. In some embodiments, the body of the heat sink component may be made primarily from aluminum nitride. For example, the body of the heat sink component may contain additives or impurities. In other embodiments, the body of the heat sink component contains beryllium oxide. For example, in some embodiments, the body of the heat sink component may be made from any suitable composition containing beryllium oxide. In some embodiments, the body of the heat sink component may be made primarily from beryllium oxide. For example, the body of the heat sink component may contain additives or impurities.

[0016] In some embodiments, the first support member of the multi-component connector includes a first flange, and the second support member of the multi-component connector includes a second flange. In other embodiments, only one of the first or second support members may include a flange, i.e., the multi-component connector may include only one of the first or second flange. At least one of the first or second flange may be configured to mount the multi-component connector to the mounting surface.

[0017] In some embodiments, a multi-component connector may define a plurality of slots, each slot configured to receive one respective component of the plurality of components such that, for example, each component can be "slotted in" to the multi-component connector. For example, the multi-component connector may include a plurality of ribs defining individual slots for receiving components, as further described elsewhere in this specification. As another example, a plurality of single types of components, such as a plurality of heat sink components, may be "pre-slotted" into the multi-component connector such that the multi-component connector in a "standard" or "basic" configuration includes a plurality of the same type of components. The plurality of the same type of components can define one or more slots in which other components can be placed or "slotted in".

[0018] For example, a first heat sink component may be disposed within the multi-component connector at a first end of the multi-component connector, and a second heat sink component may be disposed within the multi-component connector at a second end of the multi-component connector, the first end being longitudinally spaced from the second end. The first heat sink component and the second heat sink component may be "pre-slotted" into the multi-component connector, and one or more spaces for receiving at least one of a capacitor, a resistor, a varistor, or an inductor are defined between the first heat sink component and the second heat sink component (such that, for example, at least one of a capacitor, a resistor, a varistor, or an inductor is disposed within the multi-component connector between the first heat sink component and the second heat sink component).

[0019] In some embodiments, a third heat sink component may also be “pre-slot-in” into the multi-component connector. For example, the third heat sink component may be disposed substantially midway between the first heat sink component and the second heat sink component. At least one space or slot may be defined between the first heat sink component and the third heat sink component, and at least one of a capacitor, a resistor, a varistor, or an inductor may be “slotted in” or “disposed” within the multi-component connector between the first heat sink component and the third heat sink component. Similarly, at least one space or slot may be defined between the third heat sink component and the second heat sink component, and at least one of a capacitor, a resistor, a varistor, or an inductor may be “slotted in” or “disposed” within the multi-component connector between the third heat sink component and the second heat sink component.

[0020] Such “pre-slot-in” embodiments are merely examples. In other embodiments, other types, numbers, and / or configurations of components may be “slotted in” to the multi-component connector in a “standard” or “base” configuration. In still other embodiments, the “standard” or “base” configuration of the multi-component connector is only the first and second support members, and components may not be inserted therein. For example, one or more components (e.g., heat sink components, capacitors, resistors, varistors, inductors, etc.) may be slotted in or added to the multi-component connector, for example, at the time of mounting to a mounting surface.

[0021] In some embodiments, for example, at the first end of a multi-component connector, a first retaining member extends from a first support member to a second support member, and at the second end of the multi-component connector, a second retaining member extends from the first support member to a second support member. The second end may be located on the opposite side of the longitudinal direction from the first end. Rather than pre-slotted components, the first and / or second retaining members can help define the size and / or shape of the multi-component connector, for example, by holding the first and second support members in a predetermined position relative to each other. The first and / or second retaining members can also help hold components within the multi-component connector.

[0022] In some embodiments, at least one of the first or second support members may include a plurality of ribs defining a plurality of slots, each of which may be configured to receive one of a plurality of components. For example, the first support member may include a plurality of ribs projecting laterally from the first support member toward the second support member. In some embodiments, in addition to, or instead of, the ribs defined by the first support member, the second support member may include a plurality of ribs projecting laterally from the second support member toward the first support member. The ribs projecting from each support member may not reach or contact the support member on the opposite side.

[0023] Furthermore, if both the first and second support members include ribs, pairs of ribs may be defined along the longitudinal direction or along the length of the multi-component connector. For example, each pair of ribs may include a first rib defined by the first support member and a second rib defined by the second support member, and the first and second ribs of each pair of ribs may be aligned with each other along the transverse direction. The first and second ribs of each pair of ribs may be defined at the same height along the height direction, or at different heights along the height direction. Furthermore, the first support member and / or the second support member may define two or more ribs at the same longitudinal and transverse positions, but at different heights, for example, the first pair of ribs may be defined at a first height and the second pair of ribs may be defined at a second height different from the first height, such that the first pair of ribs and the second pair of ribs are generally aligned in the longitudinal, transverse, and height directions, but spaced apart from each other along the height direction.

[0024] In some embodiments, at least one cross member extends from a first support member to a second support member. For example, one, two, three, or more cross members may extend laterally from the first support member to the second support member. One or more cross members can hold the first and second support members in place relative to each other, for example, to define the shape and size of a multi-component connector and / or provide stability and / or rigidity to the multi-component connector, which can help prevent damage to one or more components located within the multi-component connector (e.g., due to deflection) and / or help mount the multi-component connector on a device such as a printed circuit board (PCB).

[0025] In some embodiments, the multi-component connector includes at least one fastener for securing the multi-component connector to the mounting surface of a device (such as the mounting surface of a PCB). For example, the fastener may be a mechanical fastener such as a screw, or the multi-component connector may be secured to the mounting surface by soldering, one or more chemical binders, etc. In some embodiments, a first support member defines a first opening, and at least one fastener includes a first fastener extending through the first opening to secure the multi-component connector to the mounting surface. In further embodiments, a second support member defines a second opening, and at least one fastener includes a second fastener extending through the second opening to secure the multi-component connector to the mounting surface.

[0026] In some embodiments, a space is defined between at least two adjacent components of a plurality of components. For example, the space may have a length approximately equal to the length of one of the components of the plurality of components. In other embodiments, the space may have a length shorter than the length of one of the components of the plurality of components. In further embodiments, at least one of the first or second support members includes a plurality of ribs defining a plurality of slots, and the space is at least one of the slots of the plurality of slots.

[0027] The multiple components accepted within a multi-component connector may include one or more thin-film components. One or more thin-film components may include resistors, varistors, capacitors, inductors, and / or combinations thereof, such as thin-film filters. Thin-film components may include one or more layers of conductive materials, dielectric materials, resistive materials, inductive materials, or other materials precisely formed using “thin-film” technology.

[0028] As an example, the multiple components arranged within a multi-component connector may include thin-film varistors. The varistors may include barium titanate, zinc oxide, or any other suitable dielectric material. For example, various additives that generate or enhance the voltage-dependent resistance of the dielectric material may be included in the dielectric material. For example, in some embodiments, the additives may include cobalt oxide, bismuth oxide, manganese oxide, or a combination thereof. In some embodiments, the additives may include gallium oxide, aluminum oxide, antimony oxide, chromium oxide, titanium oxide, lead oxide, barium oxide, nickel oxide, vanadium oxide, tin oxide, or a combination thereof. The dielectric material may be doped with additives in the range of about 0.5 mol percent to about 3 mol percent, and in some embodiments, in the range of about 1 mol percent to about 2 mol percent. The average particle size of the dielectric material may contribute to the nonlinear properties of the dielectric material. In some embodiments, the average particle size may be in the range of about 1 micron to 100 microns, and in some embodiments, in the range of about 2 microns to 80 microns.

[0029] As another example, a thin-film component may include a thin-film resistor comprising one or more resistive layers. For example, the resistive layers may include tantalum nitride (TaN), nickel-chromium (NiCr), tantalum aluminide, chromium silicon, titanium nitride, titanium tungsten, tantalum tungsten, oxides and / or nitrides of such materials, and / or any other suitable thin-film resistive material. The resistive layers may have any suitable thickness.

[0030] As another example, a thin-film component may include a thin-film capacitor comprising one or more dielectric layers. For example, the dielectric layers may comprise one or more suitable ceramic materials. Exemplary suitable materials include alumina (Al2O3), aluminum nitride (AlN), beryllium oxide (BeO), aluminum oxide (Al2O3), boron nitride (BN), silicon (Si), silicon carbide (SiC), silica (SiO2), silicon nitride (Si3N4), gallium arsenide (GaAs), gallium nitride (GaN), zirconium dioxide (ZrO2), oxides and / or nitrides of such materials, or any other suitable ceramic material. Additional exemplary ceramic materials include ceramics comprising barium titanate (BaTiO3), calcium titanate (CaTiO3), zinc oxide (ZnO), low-fire glass, or other glass bonding materials. Dielectric materials such as diamond and cubic boron arsenide may also be used.

[0031] The thin film component may include one or more layers having thicknesses ranging from about 0.001 μm to about 1000 μm, in some embodiments from about 0.01 μm to about 100 μm, in some embodiments from about 0.1 μm to about 50 μm, and in some embodiments from about 0.5 μm to about 20 μm. Each layer of the material forming the thin film component may be applied using etching, photolithography, PECVD (Plasma Enhanced Chemical Vapor Deposition) processing, or special techniques based on other techniques.

[0032] Referring here to the figures, Figure 1 provides a perspective view of a multi-component connector assembly 100. The multi-component connector assembly 100 shown in Figure 1 is mounted on the mounting surface 10 of a device 20. The device 20 may be, for example, a circuit board (such as a printed circuit board or PCB), a multilayer ceramic component, or another suitable electrical device.

[0033] The multi-component connector assembly 100 includes a multi-component connector 110 and a plurality of components 150 arranged therein. The multi-component connector 110 includes a first support member 112 and a second support member 114 spaced apart from the first support member 112 along the lateral direction Y. As shown in Figure 1, each component of the plurality of components 150 is positioned between the first support member 112 and the second support member 114 of the multi-component connector 110.

[0034] The multiple components 150 arranged within the multi-component connector 110 can be of the same type, or at least one of the multiple components 150 can be different from the remaining components 150. For example, referring to Figures 2 and 3, one, some, or all of the multiple components 150 can be a heat sink component 152, a capacitor (such as a single-layer or multilayer capacitor), a resistor 156, a varistor 158, an inductor 160, or any other suitable component that can be mounted on a device such as device 20. For example, the multi-component connector assembly 100 may include at least one capacitor 154, at least one resistor 156, at least one varistor 158, and / or at least one inductor 160.

[0035] In some embodiments, two or more of the components 150 arranged within the multi-component connector 110 may be connected in parallel. For example, the multi-component connector 110 may include a parallel-connected inductor 160 and capacitor 154 (parallel LC), and / or the multi-component connector 110 may include a parallel-connected resistor 156 and capacitor 154 (parallel RC). Other combinations of components connected in various ways may also be used.

[0036] One or more of the multiple components 150 arranged within the multi-component connector 110 may be oriented perpendicular to the mounting surface 10. For example, if at least one of the multiple components 150 is a capacitor 154, the capacitor may include multiple electrode layers with dielectric material placed between them. The capacitor 154 may be oriented perpendicularly within the multi-component connector 110, and the electrode layers of the capacitor 154 extend along the height direction Z and are generally perpendicular to the mounting surface 10. In other embodiments, one or more of the multiple components 150 arranged within the multi-component connector 110 may be oriented horizontally with respect to the mounting surface 10. For example, the capacitor 154 may be oriented horizontally within the multi-component connector 110, and the electrode layers of the capacitor 154 are generally parallel to the mounting surface 10.

[0037] In some embodiments, as shown in the embodiment of Figure 2, heat sink components may be positioned on both sides of other types of components, such as capacitors 154 and resistors 156. That is, in Figure 2, heat sink components 152 are positioned at each of the first end 111 and second end 113 of the multi-component connector 110, with the first end 111 spaced apart from the second end 113 along the longitudinal direction X perpendicular to the lateral direction Y. Capacitor 154 is positioned adjacent to the first heat sink component 152 positioned at the first end 111, and resistor 156 is positioned adjacent to the second heat sink component 152 positioned at the second end 113. A third heat sink component 152 is positioned between capacitor 154 and resistor 156.

[0038] In at least some embodiments, the third heatsink component 152 may be positioned approximately midway between the first and second heatsink components 152 so that the three heatsink components 152 help define slots for the other components 150 and define the size (e.g., width in the lateral direction Y and / or length in the longitudinal direction X) and shape of the multi-component connector 110. Furthermore, a capacitor 154 positioned between the first and third heatsink components 152, and a resistor 156 positioned between the third and second heatsink components 152 are merely examples. It will be understood that at least one of the capacitor 154, resistor 156, varistor 158, inductor 160, and / or other component 150 may be placed between the first heat sink component 152 and the third heat sink component 152, and at least one of the capacitor 154, resistor 156, varistor 158, inductor 160, and / or other component 150 may be placed between the third heat sink component 152 and the second heat sink component 152.

[0039] In other embodiments, other combinations of components 150 may be arranged within the multi-component connector 110. For example, referring to Figure 3, a first capacitor 154 may be located at the first end 111, a varistor 158 may be located adjacent to the first capacitor 154, and a heat sink component 152 may be located adjacent to the varistor 158. Then, an inductor 160 may be located adjacent to the heat sink component 152, and a second capacitor 154 may be located adjacent to the inductor 160 at the second end 113 of the multi-component connector 110. Of course, other combinations of components 150 in different orders or positions may also be used. For example, the heat sink component 152 may be located at each of the first and second ends, with one or more other components 150 located between them.

[0040] As described herein, in various embodiments of the multi-component connector assembly 100, at least one of the multiple components 150 arranged within the multi-component connector 110 is a heat sink component 152, while in other embodiments, the multiple components 150 arranged within the connector 110 may not include a heat sink component 152. Each heat sink component 152 may have a body 162 (partially outlined by dashed lines in Figure 2) made of a non-conductive thermally conductive material, such that each heat sink component 152 is configured to conduct heat from a first region 164 (outlined by dashed lines in Figure 2) to a second region 166 (outlined by dashed lines in Figure 2). For example, the first region 164 may be a heat source terminal, and the second region 166 may be a heat sink terminal. The first region or heat source terminal 164 may be in contact with a heat source outside the heat sink component 152, and the second region or heat sink terminal 166 may be in contact with a heat sink outside the heat sink component 152. Thus, each heat sink component 152 may be configured to conduct heat from the heat source (via the first region or heat source terminal 164 in contact with the heat source) to the heat sink (via the second region or heat sink terminal 166 in contact with the heat sink). Such conduction of heat away from the heat source can help manage the temperature of a component or device that includes the heat source. For example, heat transfer from the heat source to the heat sink can help prevent overheating of a component or device that includes the heat source.

[0041] One or more heat source terminals 164 can be formed on at least one surface of the heat sink component 152. For example, the heat sink component 152 may have a rectangular parallelepiped shape and six faces, and one or more heat source terminals 164 can be formed on at least one of the six faces. Similarly, one or more heat sink terminals 166 can be formed on at least one surface of the heat sink component 152, such as one of the six faces of a rectangular parallelepiped heat sink component 152.

[0042] The heat source terminals 164 can be connected to one or more individual electrical devices or components and configured to conduct heat from the electrical devices or components to the heat sink component 152. The electrical devices or components may be, for example, one or more of the other components 150 located within the multi-component connector 110. The heat sink terminals 166 can be configured to connect to a heat sink (for example, a device such as a circuit board on which the heat sink component 152 is mounted using the multi-component connector 110, such as device 20).

[0043] For example, the heat source terminal 164 of the first heat sink component 152 shown in Figure 2 may be in contact with a capacitor 154 adjacent to the first heat sink component 152, and the heat sink terminal 166 of the first heat sink component 152 may be in contact with the device 20 on which the multi-component connector 110 is mounted. Thus, the first heat sink component 152 may be configured to conduct heat from the capacitor 154 to the device 20. Similarly, the second heat sink component 152 may be configured to conduct heat from the resistor 156 to the device 20 via the heat source terminal 164 of the second heat sink component 152 that is in contact with the resistor 156 and the heat sink terminal 166 of the second heat sink component 152 that is in contact with the device 20. The third heat sink component 152 may have a first heat source terminal 164 in contact with the capacitor 154 and a second heat source terminal 164 in contact with the resistor 156, in order to conduct heat away from the capacitor 154 and resistor 156 via heat sink terminals 166 in contact with the device 20. Of course, the heat sink component 152 of the embodiment in Figure 2 may have other configurations for conducting heat away from and / or to other electrical devices or components.

[0044] As further shown in Figures 1 to 3, the first support member 112 includes a first flange 116 configured to mount the multi-component connector 110 to the mounting surface 10. Similarly, the second support member 114 includes a second flange 118 configured to mount the multi-component connector 110 to the mounting surface 10. For example, each of the first flange 116 and the second flange 118 contacts the mounting surface 10 in a plane extending in the longitudinal direction X and the transverse direction Y. A first edge support portion 115 projects from the first flange 116 away from the mounting surface 10 along the height direction Z, and a second edge support portion 117 projects from the second flange 118 away from the mounting surface 10 along the height direction Z. The first edge support portion 115 and the second edge support portion 117 are approximately perpendicular to the mounting surface 10. The first edge support portion 115 and the first flange 116 together define the first support member 112, and the second edge support portion 117 and the second flange 118 together define the second support member 114.

[0045] In some embodiments, the first edge support portion 115 may contact the heat sink terminal 166 of the heat sink component 152 located within the multi-component connector 110, the first flange 116 may contact the heat sink of the device 20, and / or the second edge support portion 117 may contact the heat sink terminal 166 of the heat sink component 152 located within the multi-component connector 110, and the second flange 118 may contact the heat sink of the device 20. Thus, heat conducted from the heat source terminal 164 of each heat sink component 152 through the heat sink component 152 to the first flange 116 and / or second flange 118 which are thermally communicating with the respective heat sink terminal 166 (via the first and / or second edge support portions 115, 117) may be conducted away from the respective heat sink component 152 to the heat sink of the device 20, thereby conducting heat away from the heat source that is in contact with the respective heat source terminal 164.

[0046] In some embodiments, the multi-component connector 110 may include at least one fastener 120 (Figures 1 and 3) for securing the multi-component connector 110 to the mounting surface 10. For example, a first support member 112 may define an opening 122 (Figure 2), and at least one fastener 120 may include a first fastener 120 extending through the opening 122 defined in the first support member for securing the multi-component connector 110 to the mounting surface 10. Similarly, in some embodiments, a second support member 114 may define an opening 122, and at least one fastener 120 may include a second fastener 120 extending through the opening 122 defined in the second support member 114 for securing the multi-component connector 110 to the mounting surface 10.

[0047] The multi-component connector 110 may include one or more fasteners 120 in one or both of the first support member 112 and / or the second support member 114 to secure the multi-component connector 110 to the mounting surface 10 of the device 20. However, in other embodiments, the multi-component connector may be similarly secured to the mounting surface 10 by other means, such as soldering or via a chemical binder, and the opening 122 and fasteners 120 may be omitted, as shown in Figures 4 to 6.

[0048] Comparing Figure 1 and Figure 2, the multiple components 150 can be stacked closely together or spaced apart from one another. For example, each of the multiple components 150 can be slotted into or positioned within the multi-component connector 110 such that the components 150 are adjacent to each other closely as shown in Figure 2, for example, two or more of the multiple components may be in contact with each other or nearly in contact with each other. However, in other embodiments, as shown in Figure 1, a space 124 may be defined between one or more pairs of adjacent components. The space 124 may allow air to flow around the components, for example, to help cool the components.

[0049] In some embodiments, the space 124 may have a width approximately equal to the width of one of the plurality of components 150, but in other embodiments, the space 124 may be larger or smaller than the width of one of the plurality of components 150. For example, referring to FIG. 4, in some embodiments, one or both of the first support member 112 and / or the second support member 114 may include ribs 126 that define a plurality of slots 128 for each of the plurality of components 150, i.e., each of the plurality of slots 128 may be configured to receive one of the plurality of components 150. Each rib 126 projects into the space defined between the first support member 112 and the second support member 114 along the transverse direction Y. For example, as shown in FIG. 4, each rib 126 defined on the first support member 112 projects along the transverse direction Y toward the second support member 114, and each rib 126 defined on the second support member 114 projects along the Y direction toward the first support member 112.

[0050] When each one of the plurality of components 150 is disposed within each slot of a pair of adjacent slots 128, the components 150 in the pair of adjacent slots 128 are spaced apart from each other by only the thickness T of at least one rib 126 of the first support member 112 or the second support member 114 that defines the adjacent slots 128. rib In other embodiments, one or more empty slots 128 may be disposed between the components 150 such that adjacent components 150 are spaced apart from each other by only the thickness T of one or more ribs and the length L of one or more slots 128 in the longitudinal direction X. rib For example, as shown in FIG. 4, two components 150 disposed within the multi-component connector 110 are spaced apart from each other by the length L of three slots 128 slot and the thickness T of four ribs 126. slot rib rib

[0051] <0000 (This seems to be an incomplete tag. Please check and correct if needed) The length L of each slot 128 slotFor example, the length L of each component L of the multiple components 150 in the longitudinal direction X is such that each component 150 fits snugly into its respective slot 128. comp It will be understood that this can be made substantially equal. However, in some embodiments, the length L of one or more slots 128 slot For example, a larger length L comp The components 150 may be made somewhat longer than the length of one or more of the components 150 in order to accommodate the components 150 having, or so that the components 150 are not fitted tightly or snugly into the slot 128, but rather have some "play" or movement in the components 150 within the slot 128.

[0052] As shown in Figure 4, each of the first support member 112 and the second support member 114 may include a plurality of ribs 126 defining a plurality of slots 128. Each of the ribs 126 of the first support member 112 may be aligned with each of the ribs 126 of the second support member 114 along the lateral direction Y, as shown in Figure 4. In other embodiments, only one of the first support member 112 or the second support member 114 may include ribs 126 defining the slots 128.

[0053] Now, turning to Figure 5, in some embodiments, the multi-component connector 110 may include one or more retaining members 130. The retaining members 130 can help hold one or more components 150 (such as the heat sink components 152, capacitors 154, resistors 156, varistors 158, and / or inductors 160 as described herein) within the multi-component connector 110. For example, as shown in Figure 5, a first retaining member 130 may extend along the lateral Y direction from a first support member 112 to a second support member 114 at a first end 111 of the multi-component connector 110, while a second retaining member 130 may extend along the lateral Y direction from a first support member 112 to a second support member 114 at a second end 113 of the multi-component connector 110.

[0054] Referring to Figure 6, in some embodiments, at least one cross member 132 extends from a first support member 112 to a second support member 114. The cross member 132 can help hold the first support member 112 in place relative to the second support member 114 and / or can provide stability or rigidity to the multi-component connector 110 to prevent damage to one or more components 150 located within the multi-component connector 110 that may result from, for example, deflection of the device 20 and the mounting surface 10. The top view of the multi-component connector 110 shown in Figure 6 shows three cross members 132. More specifically, in Figure 6, the first cross member 132 extends from the first support member 112 to the second support member 114 at the first end 111, the second cross member 132 extends from the first support member 112 to the second support member 114 at the second end 113, and the third cross member 132 extends from the first support member 112 to the second support member 114 at a position approximately midway (or approximately equidistant) between the first end 111 and the second end 113 along the longitudinal direction X. Of course, different numbers of cross members 132 and / or different spacings between cross members 132 or positions of cross members 132 may be used, or in some embodiments, cross members 132 may be omitted entirely.

[0055] In embodiments including one or more cross members 132, the cross members 132 may be positioned at the same or different locations in the height direction Z. For example, in the embodiment shown in Figure 6 including three cross members 132, each cross member 132 may be positioned adjacent to the mounting surface 10, i.e., at the position closest to the mounting surface 10 along the height direction Z of the multi-component connector 110. In other embodiments, at least one of the three cross members 132 in the illustrated embodiment may be positioned at different locations in the height direction Z, for example, at an intermediate point between the position closest to the mounting surface 10 and the position furthest from the mounting surface along the height direction Z, and / or at the position furthest from the mounting surface 10 along the height direction Z.

[0056] Referring here to Figure 7, the Disclosure also provides a method for forming a multi-component connector assembly, such as a multi-component connector assembly 100. For example, as shown in (702) in Figure 7, a method 700 for forming a multi-component connector assembly 100 may include the steps of forming a first support member 112 and forming a second support member 114, as shown in (704). As described herein, the first support member 112 and the second support member 114 together constitute a multi-component connector 110. It will be understood that the steps for forming the first support member 112 and the second support member 114 may include the steps of forming one or more ribs 126 on each of the support members 112, 114, and / or the steps of forming one or more retaining members 130.

[0057] Method 700 may also include the step of separating the second support member 114 from the first support member 112 along the lateral direction Y, as shown in (706). As described herein, the step of separating the second support member 114 from the first support member 112 may include defining one or more cross members 132 extending from the first support member 112 to the second support member 114.

[0058] As shown in (708), method 700 may further include the step of positioning at least one component 150 between the first support member 112 and the second support member 114 of the multi-component connector 110. For example, the at least one component 150 could be a heat sink component 152, such that the heat sink component 152 is “pre-slotted” into the multi-component connector 110, as described elsewhere in this specification. As described above, one or more components 150 (such as one or more heat sink components 152, a capacitor 154, a resistor 156, a varistor 158, and / or an inductor 160) can be pre-slotted into the multi-component connector 110, for example, whether or not other components 150 are positioned or slotted into the multi-component connector 110, so that the multi-component connector 110 is ready to be mounted on the mounting surface 10. For example, three heat sink components 152 may be pre-slotted into the multi-component connector 110. For instance, one heat sink component 152 may be pre-slotted into each of the longitudinal ends 111, 113 of the connector 110, and a third heat sink component 152 may be pre-slotted approximately midway between the first end 111 and the second end 113. Of course, in some embodiments, the multi-component connector 110 may be provided without any components 150 yet placed inside it, and one or more components 150 may be placed inside the connector 110 before or after mounting the connector 110 to the mounting surface 10.

[0059] Purpose The various embodiments of the multi-component connector assemblies disclosed herein may have a variety of applications.

[0060] Exemplary applications include power processing systems and monolithic microwave integrated circuits (MMICs). For example, a multi-component connector assembly may include at least one heat sink component that can facilitate the flow of heat from the terminals of a device connected to the heat source terminals of the heat sink component. As an example, various embodiments of suitable electrical components can be connected to the terminals of the heat sink component. As an example, devices may include, for example, circuit boards (with components incorporated), power amplifiers, filters, synthesizers, computer components, power supplies, and / or diodes. Specific examples of power amplifier types include gallium nitride (GaN) power amplifiers, high-frequency amplifiers, and the like. As described herein, examples of diodes suitable for connection with thermal components may include, among other types of diodes, diodes particularly suited for use in lasers.

[0061] These and other modifications and variations of the present invention can be carried out by those skilled in the art without departing from the scope of the invention. In addition, it should be understood that the aspects of the various embodiments may be replaced in whole or in part. Furthermore, those skilled in the art will understand that the foregoing description is illustrative only and is not intended to limit the invention, which is further described in the appended claims. [Explanation of Symbols]

[0062] 10 Implementation aspects 20 devices 100 Multi-component Connector Assemblies 110 Multi-component connectors, connectors 111 First end, longitudinal end 112 First support member 113 Second end, longitudinal end 114 Second support member 115 First edge support 116 First flange 117 Second edge support 118 Second flange 120 Fasteners, first fastener, second fastener 124 Space 126 Ribs 128 slots 130 Retaining member, first retaining member, second retaining member 132 Cross member, first cross member, second cross member, third cross member 150 components 152 Heat sink components, first heat sink component, second heat sink component, third heat sink component 154 Capacitor, first capacitor, second capacitor 156 Resistor 158 Barista 160 Inductors 162 Body 164 First area, heat source terminal, first heat source terminal, second heat source terminal 166 Second area, heatsink terminals

Claims

1. The first support member and A second support member spaced apart from the first support member and A multi-component connector including, A plurality of components disposed between the first support member and the second support member of the multi-component connector A multi-component connector assembly comprising, At least one of the plurality of components is a heat sink component having a body containing a non-conductive thermally conductive material such that the heat sink component is configured to conduct heat from a first region to a second region. Multi-component connector assembly.

2. The multi-component connector assembly according to claim 1, wherein the first support member includes a first flange configured to mount the multi-component connector to the mounting surface.

3. The multi-component connector assembly according to claim 2, wherein the second support member includes a second flange configured to mount the multi-component connector to the mounting surface.

4. The multi-component connector assembly according to claim 1, wherein the heat sink component includes a heat source terminal and a heat sink terminal, the heat source terminal contacting the first region and the heat sink terminal contacting the second region.

5. The multi-component connector assembly according to claim 1, wherein the plurality of components include at least one of a capacitor, a resistor, a varistor, or an inductor.

6. The multi-component connector assembly according to claim 1, wherein the plurality of components include at least two components connected in parallel.

7. The multi-component connector assembly according to claim 1, wherein the first retaining member extends from the first support member to the second support member.

8. The multi-component connector assembly according to claim 7, wherein the first retaining member extends from the first support member to the second support member at the first end of the multi-component connector, and the second retaining member extends from the first support member to the second support member at the second end of the multi-component connector, the second end being on the opposite side of the longitudinal direction from the first end.

9. The multi-component connector assembly according to claim 1, wherein at least one of the first support member or the second support member includes a plurality of ribs defining a plurality of slots, and each of the plurality of slots is configured to receive one of the plurality of components.

10. The multi-component connector assembly according to claim 1, wherein at least one cross member extends from the first support member to the second support member.

11. The multi-component connector assembly according to claim 1, further comprising at least one fastener for securing the multi-component connector to a mounting surface.

12. The multi-component connector assembly according to claim 11, wherein the first support member defines a first opening, and the at least one fastener includes a first fastener, the first fastener extending through the first opening to secure the multi-component connector to the mounting surface.

13. The multi-component connector assembly according to claim 12, wherein the second support member defines a second opening, and the at least one fastener includes a second fastener, the second fastener extending through the second opening to secure the multi-component connector to the mounting surface.

14. The multi-component connector assembly according to claim 1, wherein a space is defined between at least two adjacent components among the plurality of components.

15. The multi-component connector assembly according to claim 14, wherein the space has a length substantially equal to the length of one of the multiple components.

16. The multi-component connector assembly according to claim 14, wherein the space has a length shorter than the length of one of the multiple components.

17. The multi-component connector assembly according to claim 14, wherein at least one of the first support member or the second support member includes a plurality of ribs defining a plurality of slots, and the space is a slot of at least one of the plurality of slots.

18. The multi-component connector assembly according to claim 1, wherein the second support member is spaced apart from the first support member along the lateral direction, the heat sink component is a first heat sink component, the plurality of components further include a second heat sink component, the multi-component connector has a first end spaced apart from a second end along a longitudinal direction perpendicular to the lateral direction, the first heat sink component is disposed within the multi-component connector at the first end, and the second heat sink component is disposed within the multi-component connector at the second end.

19. The multi-component connector assembly according to claim 18, wherein at least one of a capacitor, resistor, varistor, or inductor is disposed within the multi-component connector between the first heat sink component and the second heat sink component.

20. The multi-component connector assembly according to claim 18, wherein the plurality of components further comprises a third heat sink component, the third heat sink component being positioned substantially midway between the first heat sink component and the second heat sink component.

21. The multi-component connector assembly according to claim 20, wherein at least one of a capacitor, resistor, varistor, or inductor is disposed within the multi-component connector between the first heat sink component and the third heat sink component.

22. The multi-component connector assembly according to claim 21, wherein at least one of a capacitor, resistor, varistor, or inductor is disposed within the multi-component connector between the third heat sink component and the second heat sink component.

23. The first support member and A second support member spaced apart from the first support member, Multiple slots and A multi-component connector including, At least one component disposed between the first support member and the second support member of the multi-component connector, wherein the at least one component is disposed in one of the slots of the plurality of slots and A multi-component connector assembly comprising the above components.

24. The multi-component connector assembly according to claim 23, wherein at least one of the first support member or the second support member includes a plurality of ribs defining the plurality of slots.

25. The multi-component connector assembly according to claim 23, wherein the at least one component is at least one of a heat sink component, a capacitor, a resistor, a varistor, or an inductor.

26. A method for forming a multi-component connector assembly, wherein the method is The steps include forming a first support member, The steps include forming a second support member, The steps include moving the second support member apart from the first support member along the lateral direction, The steps include: arranging at least one heat sink component between the first support member and the second support member; Includes, The at least one heat sink component has a body containing a non-conductive thermally conductive material such that the heat sink component is configured to conduct heat from a first region to a second region. method.

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