Enclosure structure, enclosure, electronic device, and method for manufacturing the enclosure structure

Abstract

This application discloses a housing structure, a housing, an electronic device, and a method for manufacturing a housing structure. The housing structure may include a first region and a second region. The first and second regions are integrally formed structures. Therefore, the housing structure has good mechanical properties. The second region includes glass ceramic and metal clusters. The metal clusters are used as crystal nuclei for the glass ceramic, aiding in the formation of the glass ceramic, and as a result, the second region may have high crystallinity. Crystallinity is inversely proportional to transmittance. The second region has high crystallinity and, correspondingly, low transmittance. The second region, having low transmittance, can block the propagation of interference signals to some extent and reduce interference signals.

Description

[Technical Field]

[0001] This application claims priority to Chinese Patent Application No. 202310201364.5, titled "ENCLOSURE STRUCTURE, ENCLOSURE, ELECTRONIC DEVICE, AND ENCLOSURE STRUCTURE PREPARATION METHOD," filed with the China National Intellectual Property Administration on 22 February 2023, which is incorporated herein by reference in its entirety.

[0002] Technical field This application relates to the technical field of housing structures for electronic devices, and more particularly to housing structures, housings, electronic devices, and methods for manufacturing housing structures. [Background technology]

[0003] An electronic device may include a housing and an optical sensor located inside the housing. An optical sensor (optosensor), commonly used in electronic devices, may include one or more optical components. These optical components may be configured to emit or monitor optical signals within a specific wavelength range. The housing includes at least one housing structure. For example, the housing structure may include a frame, a cover plate, and a bottom plate.

[0004] An electronic device may implement several functions by processing an optical signal detected by an optical sensor. The process by which an electronic device implements several functions by using an optical signal detected by an optical sensor is as follows: A light emitter emits an optical signal; the optical signal is transmitted through a housing structure and incident on a target object; the optical signal absorbed, reflected, or refracted by the target object may be transmitted through the housing structure and returned to an optical receiver. The optical signal absorbed, reflected, or refracted by the target object is related to the characteristics of the target object. Therefore, the optical receiver may detect an optical signal related to the target object.

[0005] Generally, transparent materials are used for the housing structure. A portion of the optical signal emitted by the light emitter may be transmitted to the optical receiver through a transition region. The transition region may be defined as the region in the housing structure where the projection of the light emitter is located and the region in the housing structure where the projection of the receiver is located. The optical signal transmitted through the transition region is a typical interference signal. The presence of interference signals can degrade the accuracy of the optical receiver's monitoring results. [Overview of the project] [Problems that the invention aims to solve]

[0006] This application discloses a housing structure, a housing, an electronic device, and a method for manufacturing a housing structure. The housing structure includes a first region and a second region, the second region including a metal cluster. The metal cluster included in the second region allows the second region to have low transmittance, and as a result, the second region can block interference signals. [Means for solving the problem]

[0007] A first aspect of this application discloses a housing structure including a first region and a second region, wherein the first and second regions are integrally formed, the transmittance of the first region is greater than the transmittance of the second region, and the second region includes glass ceramic and metal clusters.

[0008] In this implementation, the enclosure structure may include a first region and a second region. The first and second regions are integrally formed structures. Therefore, the enclosure structure has good mechanical properties. The second region includes glass ceramic and metal clusters. The metal clusters are used as crystal nuclei for the glass ceramic, aiding in the formation of the glass ceramic, and as a result, the second region may have high crystallinity. Crystallinity is inversely proportional to transmittance. The second region has high crystallinity, and correspondingly, the second region has low transmittance. The second region, with its low transmittance, can block the propagation of interference signals within the enclosure structure to some extent, thereby reducing interference signals.

[0009] In relation to the first implementation of the first embodiment, the metal cluster includes one or a combination of Ag clusters, Cu clusters, and Au clusters.

[0010] In relation to the second implementation of the first embodiment, the raw materials used in the housing structure include a photosensitive material, the photosensitive material includes a nucleating metal, the photosensitive material converts the nucleating metal, which exists in compound form, into an atomic state of nucleating metal under the action of a light signal, and the atomic state of nucleating metal is used to form a metal cluster.

[0011] In this implementation, under irradiation with an optical signal, the photosensitive material can convert nucleating metals present in compound form within the material into atomic nucleating metals, which can then aggregate after heating to form metal clusters. Therefore, a partial exposure + heating method using an optical signal may be employed, resulting in the reduction of nucleating metals present in compound form in the exposed region to an atomic state, forming metal clusters. In the subsequent overall heat treatment process, the portions containing the metal clusters crystallize more easily, forming a second region with low transmittance, resulting in integrally formed first and second regions.

[0012] In relation to a third implementation of the first embodiment, the photosensitive material further comprises a photosensitive compound which emits electrons under the action of a light signal.

[0013] In this implementation, the photosensitive material further includes a photosensitive compound. The photosensitive compound emits electrons under the action of a light signal. The electrons reduce the nucleated metal, which exists in the form of the compound, to free-state metal atoms. In this way, a second region containing metal clusters can be obtained using a partial exposure + heating method.

[0014] In relation to the fourth implementation of the first embodiment, the photosensitive material further comprises anions, the anions and nucleating metals form a photosensitive compound, and the nucleating metals in an atomic state precipitate from the photosensitive compound under the action of a light signal.

[0015] In this implementation, the nucleation metal in the atomic state precipitates from the photosensitive compound under the action of the optical signal. Thus, a second region containing metal clusters can be obtained by the partial exposure + heating method.

[0016] Regarding the fifth implementation of the first aspect, the raw material used for the housing structure contains halogen elements.

[0017] In this implementation, the halogen element in the high-temperature environment may provide an acidic / oxidizing gas atmosphere, prevent the nucleation metal in the raw material from precipitating in atomic form, and avoid the formation of metal clusters in the melting process. The amount / density of metal clusters in the non-exposed region can be reduced, and the crystallinity of the non-exposed region can be reduced. The first region formed by the non-exposed region has a large transmittance, ensuring that the loss is small in the process of transmitting the effective optical signal and the emitted optical signal through the first region.

[0018] Regarding the sixth implementation of the first aspect, the first region contains glass ceramic or ordinary glass.

[0019] Regarding the seventh implementation of the first aspect, the second region penetrates the housing structure.

[0020] In this implementation, the second region penetrates the housing structure, and the second region can block a large amount of interference signals.

[0021] Regarding the eighth implementation of the first aspect, the surface of the housing structure includes a plane, a curved surface, a convex part, and / or a concave part.

[0022] Regarding the ninth implementation of the first aspect, a light-shielding layer is arranged in the concave part of the surface of the second region, and the transmittance of the light-shielding layer is smaller than that of the second region.

[0023] In this implementation, the light-shielding layer is positioned within a recess on the surface of the second region. The light-shielding layer and the second region are located between adjacent first regions. Since the transmittance of the light-shielding layer is lower than that of the second region, the light-shielding layer can block a large amount of interference signals. Therefore, the housing structure disclosed in this embodiment can block a large amount of interference signals.

[0024] In relation to the tenth implementation of the first embodiment, the convex and concave portions form a Fresnel pattern.

[0025] In this implementation, the Fresnel pattern formed by the surface irregularities of the housing structure can play a focusing role, and by designing the Fresnel pattern, the signal-to-noise ratio of the effective optical signal can be improved.

[0026] The Fresnel pattern is designed on the surface of the enclosure structure, and as a result, the Fresnel pattern can be implemented without using additional films, thereby reducing the stacking size of the enclosure structure.

[0027] In this implementation, the Fresnel pattern is formed by the surface irregularities of the housing structure, and the Fresnel pattern and the first / second region are formed integrally. Thus, there is no processing interface for adhesive bonding, joining, or fusion bonding between the first / second region and the Fresnel pattern. In this way, the housing structure has better integration and better mechanical performance.

[0028] In relation to the eleventh implementation of the first embodiment, the housing structure includes a compressive stress layer and a tensile stress layer, wherein the compressive stress layer is located on the surface of the tensile stress layer.

[0029] The enclosure structure disclosed in this implementation includes a compressive stress layer and a tensile stress layer, the compressive stress layer being located on the surface of the tensile stress layer. Specifically, the compressive stress layer located on the outer surface is subjected to compressive stress, and the tensile stress layer located on the inner surface is subjected to tensile stress. The presence of the compressive stress layer can block / eliminate the generation and elongation of microprints on the surface of the enclosure structure, thereby improving the mechanical performance of the enclosure structure.

[0030] In relation to the twelfth implementation of the first embodiment, the second region includes a plurality of adjacent subregions, the adjacent subregions having different transmittances.

[0031] In this implementation, two adjacent sub-regions have different transmittances, and a refractive / reflective interface can be formed between the two sub-regions. When an interference signal propagates through the refractive / reflective interface, refraction / reflection occurs, reducing the interference signal transmitted through the second region.

[0032] In relation to the 13th implementation of the first embodiment, the width of the second region is greater than or equal to a specified value.

[0033] A larger width in the second region indicates a greater blocking effect of the second region against interfering signals. In this implementation, the width of the second region is greater than or equal to the specified value, and as a result, it can be guaranteed that the second region has a good blocking effect against interfering signals.

[0034] In relation to the 14th implementation of the first embodiment, the first region does not contain metal clusters, or the density of metal clusters in the first region is less than the density of metal clusters in the second region.

[0035] In this implementation, the first region either contains no metal clusters or the density of metal clusters in the first region is less than the density of metal clusters in the second region. The metal clusters help in the formation of glass ceramics. Thus, a first region with low / zero crystallinity and a second region with high crystallinity can be obtained by a whole-body heat treatment method, and the warping between the first and second regions is small. Crystallinity is inversely proportional to transmittance. Because the first region has low crystallinity, it has high transmittance, ensuring that the loss in the process of transmitting the effective optical signal through the first region is small. The second region has high crystallinity and, correspondingly, low transmittance. The second region with low transmittance can block the propagation of interference signals within the housing structure to some extent, thereby reducing interference signals.

[0036] In relation to the 15th implementation of the first embodiment, if the housing structure includes a plurality of second regions, the transmittance of any two second regions may be the same, or the transmittance of any two second regions may be different.

[0037] A second aspect of this application discloses a method for manufacturing a housing structure, the method comprising: exposing a portion of a glass plate; performing a nucleation heat treatment on the exposed glass plate to form metal clusters in the exposed region of the glass plate, wherein the raw material used for the glass plate includes a photosensitive material, the photosensitive material includes a nucleating metal, the photosensitive material, under the action of a light signal, converts the nucleating metal, which exists in the form of a compound within the photosensitive material, into an atomic state of nucleating metal, which is used to form metal clusters; and performing a crystallization heat treatment on the glass plate on which the nucleation treatment has been performed to obtain a housing structure, wherein the housing structure includes a first region and a second region, the second region being obtained by crystallizing the exposed region of the glass plate, the first region being obtained by crystallizing the unexposed region of the glass plate, and the second region including glass ceramics and metal clusters.

[0038] In this implementation, a glass plate is used to form a housing structure, and the glass plate contains a photosensitive material. Under the action of an optical signal, nucleating metals present in the form of compounds within the photosensitive material are converted to atomic nucleating metals, and these atomic nucleating metals can aggregate to form metal clusters. Thus, a partial exposure method using an optical signal may be used, resulting in the formation of metal clusters in the exposed region. In a subsequent heat treatment step, the exposed region having the metal clusters is easily crystallized to form a second region with low transmittance, and this second region with low transmittance can reduce interference signals by blocking the propagation of interference signals within the housing structure to some extent. According to the manufacturing method disclosed in this implementation, a first region with low / zero crystallinity and a second region with high crystallinity can be obtained by a whole heat treatment method, and the warping between the first and second regions in the manufactured glass plate is small.

[0039] In relation to the first implementation of the second embodiment, the step of exposing a portion of a glass plate includes: placing a mask reticle on the side of the glass plate, the mask reticle including a window; and illuminating the portion of the glass plate through the window of the mask reticle with an optical signal.

[0040] In this implementation, partial exposure of the glass plate is achieved by using a mask reticle. The final shape / size of the second region is determined by the shape / size of the mask reticle's window. The shape / size of the second region can be flexibly configured by using mask reticles with windows of different shapes / sizes.

[0041] In relation to the second implementation of the second embodiment, the step of exposing a portion of the glass plate specifically includes the step of irradiating a portion of the glass plate with a laser.

[0042] In this implementation, the size and shape of the exposure area can be controlled by controlling the laser path. Since this process does not require the assistance of a mask reticle, the cost of the housing structure can be reduced to some extent.

[0043] In relation to the third implementation of the second embodiment, the energy flow density of the optical signal used during exposure is below the glass plate damage threshold.

[0044] In this implementation, the energy flow density of the optical signal is below the damage threshold of the glass plate, and as a result, the internal structure of the exposed area is not damaged during the partial exposure stage.

[0045] In relation to the fourth implementation of the second embodiment, after the step of performing a heat treatment on an exposed glass plate to obtain a housing structure, the manufacturing method further includes the step of chemically strengthening the housing structure, thereby generating a compressive stress layer on the surface of the housing structure, the compressive stress layer being located on the surface of the tensile stress layer.

[0046] In this implementation, there is a volume difference between the surface of the enclosure structure before chemical strengthening and the surface of the enclosure structure after chemical strengthening. This volume difference forms a compressive stress layer within a specific depth range of the enclosure structure. The presence of this compressive stress layer can block / eliminate the generation and elongation of microprints on the surface of the enclosure structure, thereby improving the mechanical performance of the enclosure structure.

[0047] A third aspect of this application discloses a housing, which comprises at least one housing structure as disclosed in the first aspect.

[0048] A fourth aspect of this application discloses an electronic device comprising a light emitter, an optical receiver, and a housing structure disclosed in the first aspect. The housing structure comprises a first region and a second region. The light emitter is configured to emit an optical signal transmitted through the first region, and the optical receiver is configured to receive an optical signal transmitted through the first region. The second region is located between a projection of the light emitter in the first region and a projection of the optical receiver in the first region.

[0049] In relation to the first implementation of the fourth embodiment, the electronic device further comprises a cover bottom layer, the cover bottom layer is positioned on the inner surface of the housing structure, and the cover bottom layer is positioned to avoid the protrusions of the optical receiver / light emitter on the first region. [Brief explanation of the drawing]

[0050] [Figure 1] This figure shows an example of a physical diagram of a wearable device.

[0051] [Figure 2] This is a diagram illustrating application scenarios for wearable devices.

[0052] [Figure 3] This is a diagram illustrating application scenarios for the enclosure structure disclosed in related technologies.

[0053] [Figure 4] This is a diagram of the enclosure structure disclosed in a feasible implementation.

[0054] [Figure 5] This is a diagram of the enclosure structure disclosed in a feasible implementation.

[0055] [Figure 6] This is a diagram of the enclosure structure disclosed in a feasible implementation.

[0056] [Figure 7] This is a diagram of the enclosure structure disclosed in a feasible implementation.

[0057] [Figure 8] This is a diagram of the enclosure structure disclosed in a feasible implementation.

[0058] [Figure 9] This is a diagram of the enclosure structure disclosed in a feasible implementation.

[0059] [Figure 10] This is a flowchart of the method for manufacturing the enclosure structure disclosed in a feasible implementation.

[0060] [Figure 11] This is a process flowchart of the enclosure structure disclosed in a feasible implementation.

[0061] [Figure 12] This is a process flowchart of the enclosure structure disclosed in a feasible implementation. [Modes for carrying out the invention]

[0062] Herein, we will refer specifically to the representative implementation shown in the attached drawings. It should be understood that the following description is not intended to limit the implementations to any particular preferred implementation. Rather, the implementations are intended to cover alternative, modified, and equivalent forms that may be included in this disclosure, as well as the content and scope defined by the attached claims.

[0063] The concepts in the embodiments of this application will be explained first.

[0064] Crystallinity may be denoted by R, and is defined as the proportion of crystals within a region (first region / second region). This proportion may include both mass and volume proportions.

[0065] For example, the calculation may be performed using the following formula: R=Mcrystal / (Mcrystal+Mamorphous)×100%

[0066] Mcrystal represents the mass of crystals contained within the region, while Mamorphous represents the mass of amorphous materials contained within the region.

[0067] Transmittance is often denoted by T, and is defined as the ratio of the radiated energy of the light signal transmitted through a region to the total radiated energy of the light signal projected onto the region, in the process of a light signal entering the region from its inner surface and exiting from its outer surface.

[0068] The loss of an optical signal during propagation in a given region is related to the transmittance of that region. A higher transmittance in a region indicates less loss of the optical signal during propagation. A lower transmittance in a region indicates greater loss of the optical signal during propagation.

[0069] The density of a metal cluster is defined as the amount of metal clusters contained in a region (the first or second region) per unit volume.

[0070] The electronic devices in embodiments of this application may include, but are not limited to, wearable devices (e.g., electronic bands), notebook computing devices (e.g., notebook computers or laptop computers), tablet computing devices (e.g., tablet computers), and portable electronic devices such as mobile phones (e.g., cell phones). Alternatively, the electronic devices may be desktop computer systems, computer components, input devices, devices, or in fact any other type of electronic product or device component.

[0071] An electronic device may include a housing and electronic components disposed inside the housing. The housing may include one or more housing structures, and the housing has a cavity configured to house the electronic components. For example, the housing structure may include a cover, a frame, and a bottom plate.

[0072] In feasible implementations, multiple enclosure structures can be connected to each other by means of bonding, fusion bonding, joining, etc., to form an enclosure.

[0073] In feasible implementations, multiple enclosure structures may be integrally formed structures.

[0074] Electronic components may include sensor components, processors, and the like. In the embodiments of this application, sensor components may be abbreviated as sensors.

[0075] A processor (central processing unit, CPU) is a data processing device that processes signals detected by sensors, thereby enabling the electronic device to implement corresponding functions. These functions may include, but are not limited to, health management, sports measurement, social interaction, leisure games, and media entertainment.

[0076] A sensor (transducer / sensor) is a monitoring device that can sense measured information and convert that sensed information into electrical signals or other required forms of information that follow specific rules for output. Measured information may include, but is not limited to, optical signals, electrical signals, etc.

[0077] Sensors may include, but are not limited to, proximity sensors, light sensors (e.g., health monitoring sensors), biorecognition sensors (e.g., facial recognition sensors or fingerprint recognition sensors), depth sensors or imaging sensors, audio sensing devices, touch sensors, force sensors, accelerometers, gyroscopes, magnetometers, or similar types of position / orientation sensing devices.

[0078] As a sensor commonly used in electronic devices, an optical sensor may include one or more optical components. In the embodiments of this application, the optical components are configured to emit or monitor optical signals within a specified wavelength range.

[0079] Some optical components may include one or more light-emitting elements. An optical device including a light-emitting element may also be referred to as a light-emitting body in the embodiments of this application.

[0080] A light-emitting element is defined as an element capable of emitting an optical signal. Examples of light-emitting elements include, but are not limited to, light-emitting diodes (LEDs), micro light-emitting diodes, lasers, and mini light-emitting diodes. Optical signals may include, but are not limited to, visible light, infrared rays, and ultraviolet light.

[0081] Some optical components may include one or more photodetectors. An optical device including photodetectors may also be referred to as an optical receiver in the embodiments of this application.

[0082] The photodetector may be configured to monitor optical signals within a specified wavelength range. For example, the photodetector may include, but is not limited to, a photoelectric diode (PD), a charge-coupled device (CCD), etc.

[0083] The processor in an electronic device can process optical signals detected by an optical sensor to implement several functions.

[0084] The process by which an electronic device implements several functions using an optical signal detected by an optical sensor is as follows: A light emitter emits an optical signal; the optical signal is transmitted through the housing structure and incident on a target object; the optical signal incident on the target object can be transmitted through the housing structure and returned to the optical receiver after being absorbed, reflected, or refracted by the target object.

[0085] Light signals absorbed, reflected, or refracted by a target object are related to the characteristics of the target object. Therefore, an optical receiver can detect light signals associated with the target object.

[0086] Photoplethysmography (PPG) is a detection technique commonly used in electronic devices. Electronic devices can implement health management functions by detecting optical signals related to vital sign data based on PPG via optical sensors. Vital sign data may include, but is not limited to, heart rate and blood pressure.

[0087] The implementation process for the health management function will be explained below, with reference to the attached diagrams.

[0088] Please refer to Figures 1 and 2. Figure 1 is an example of a physical diagram of a wearable device, and Figure 2 is a diagram of an application scenario for a wearable device.

[0089] The wearable device may include a housing 10 and an optical sensor 20 located within the housing. In some feasible implementations, the wearable device may further include a wrist strap 30. The wrist strap 30 is connected to the housing 10 and configured to attach the wearable device to a target object (e.g., a wrist).

[0090] In some feasible implementations, there may be one or two wrist straps 30. When there is one wrist strap, the two opposing ends of the wrist strap are each connected to two opposing ends of the housing 10, so that the wrist strap 30 and the housing 10 form a wearable slot and are attached to the target object. When there are two wrist straps, the two wrist straps 30 are each connected to two opposing ends of the housing 10, and the ends of the two wrist straps that are furthest from the housing are fastened with buckles, so that the wrist straps and the frame form a wearable slot and are attached to the target object.

[0091] The housing 10 may include two housing structures, namely a glass bottom plate 101 and a frame 102.

[0092] The frame 102 is positioned around the glass base plate 101. The glass base plate 101 and the frame 102 form a cavity configured to house the optical sensor 20.

[0093] The light sensor 20 may include at least one light-emitting element 201 configured to emit an optical signal, and at least one light receiver 202 configured to receive the optical signal.

[0094] As shown in Figure 2, during wear, the outer surface of the glass base plate 101 of the wearable device is positioned closer to the human body 40, and the light signal A(1) emitted by the light emitter 201 reaches the human body 40 via the glass base plate 101(1). After the light signal is reflected by the human blood and tissue 401, a reflected light signal A(2) is obtained. The reflected light signal A(2) can pass through the glass base plate 101(2) and be returned to the optical receiver 202. Based on the different intensities of the reflected light signal, the optical receiver 202 can record changes in vascular volume during the cardiac cycle to obtain a pulse wave waveform and calculate the heart rate based on the obtained pulse wave waveform.

[0095] Generally, the optical signal detected by the optical receiver 202 may include both a valid signal and an interference signal.

[0096] The effective signal is defined as the light signal absorbed, reflected, or refracted by the target object, and the effective signal is related to the characteristics of the target object. When applied specifically to the application scenario in Figure 2, the effective signal refers to the reflected light signal A(2) reflected by human blood and tissue 401.

[0097] The interference signal may include light signals that are not absorbed, reflected, or refracted by the target object. The interference signal is independent of the characteristics of the target object. When applied specifically to the application scenario in Figure 2, the invalid signal includes the reflected light signal A(3) reflected by the skin 402 and the light signal A(4) propagating through the interior of the glass base plate 101(3).

[0098] Generally, the enclosure structure is made of transparent material. A portion of the optical signal emitted by the light emitter can be transmitted to the optical receiver through a transition region.

[0099] The transition region may be defined as the region between the region in the housing structure where the protrusion of the light-emitting element is located and the region in the housing structure where the protrusion of the optical receiver is located. In this embodiment of the present application, the region in the housing structure where the protrusion of the light-emitting element is located may also be called the region corresponding to the light-emitting element within the housing structure. Furthermore, the region in the housing structure where the protrusion of the optical receiver is located may also be called the region corresponding to the optical receiver within the housing structure.

[0100] Optical signals that pass through the transition region are typical interference signals. The presence of interference signals can reduce the accuracy of the monitoring results of an optical receiver.

[0101] To improve the accuracy of the monitoring results of the optical receiver 202, the housing structure of the electronic device has been further improved in related technologies. See Figure 3 for details. Figure 3 is a diagram of application scenarios for the electronic device disclosed in the prior art.

[0102] The housing structure 10 in Figure 3 is formed by joining multiple glass plates 31. The glass plates 31 are positioned corresponding to the light emission path of the light emitter 201 and the light receiving path of the light receiver 202. An opaque material 32 is placed between adjacent glass plates 31. In other words, the opaque material 32 is placed within the transition region.

[0103] In the related technology disclosed in Figure 3, the opaque material 32 can block interference signals to some extent. However, the housing structure 10 disclosed in Figure 3 needs to be formed by joining multiple glass plates 31. This joining method increases the difficulty of manufacturing the housing structure 10. This joining method requires controlling the manufacturing tolerances between the glass plates 31. Compared to a housing structure formed integrally, the housing structure 10 of the related technology disclosed in Figure 3 may have the problem of high manufacturing costs, and there may be reliability risks in the joints of the housing structure 10.

[0104] The process for manufacturing the integrally formed housing structure is further disclosed in the related technologies.

[0105] Specifically, ion exchange is performed on glass of different thicknesses to change the glass composition at a certain thickness, and then the glass is thinned to obtain glass of the same thickness but with different partial compositions. Finally, because different crystallization tendencies arise due to the differences in glass composition, after heat treatment at an appropriate temperature, crystallization occurs in some areas and not in others, forming a composite housing structure with transparent and opaque regions.

[0106] The aforementioned related technologies sometimes utilize opaque regions to block interference signals. However, the fabrication process for these related technologies requires the pre-formation of glass plates of different thicknesses, followed by further thinning of the glass plates. The fabrication process is complex. In addition, these technologies require ion exchange, a process that takes a long time.

[0107] Specifically, the glass plate is partially heated, or the entire glass plate is heated but partially shielded from heat, and as a result, the crystallization rate in the heated region 51 of the glass plate is greater than the crystallization rate in the unheated region of the glass plate.

[0108] The transmittance of the crystallized heated region is greater than that of the crystallized unheated region.

[0109] The related technologies described above require the use of a partial heating method, resulting in different transmittances between the heated and unheated regions. The second region generated by the heated region has low transmittance, and as a result, the second region can block interference signals to some extent. However, the partial heating method may lead to problems such as warping and deformation of the housing structure due to uneven heating.

[0110] In conclusion, the performance of enclosure structures disclosed in conventional technologies has several drawbacks.

[0111] To compensate for the shortcomings of related technologies, embodiments of this application disclose a housing structure. As shown in Figures 4 to 9, the housing structure may include a first region 1 and a second region 2. The first region 1 and the second region 2 are integrally formed structures. Therefore, the housing structure has good mechanical performance. The second region 2 includes glass ceramic and metal clusters. The metal clusters are used as crystal nuclei for the glass ceramic, and since the metal clusters help in the formation of the glass ceramic, the second region 2 can have high crystallinity. Crystallinity is inversely proportional to transmittance. The second region 2 has high crystallinity, and accordingly, the second region 2 has low transmittance. Furthermore, the second region 2, having low transmittance, can block the propagation of interference signals within the housing structure to some extent and reduce interference signals.

[0112] The following provides a further explanation of the enclosure structure.

[0113] First, let's describe the raw materials used in the enclosure structure. In the embodiments of this application, unless otherwise specified, raw materials refer to the raw materials used in the enclosure structure.

[0114] In this embodiment of the present application, the raw materials of the housing structure may include a glass substrate.

[0115] The components of the glass substrate are not particularly limited in the embodiments of the present invention.

[0116] For example, the glass substrate may include, but is not limited to, at least one of silicate glass, aluminosilicate glass, phosphate glass, aluminophosphate glass, borate glass, and aluminate glass.

[0117] For example, the glass substrate may include, but is not limited to, Na-Al-Si glass, Li-Al-Si glass, and Na-Zn-Al-Si glass.

[0118] For example, the glass substrate may contain silicon dioxide (SiO2), aluminum trioxide (Al2O3), zinc oxide (ZnO), lithium oxide (Li2O), sodium oxide (Na2O), potassium oxide (K2O), zirconium oxide (ZrO2), and bismuth oxide (Sb2O3).

[0119] In this embodiment of the present application, only some components of the glass substrate are described as examples, and these components constitute a specific limitation.

[0120] In this embodiment of the present application, the raw materials may further include a photosensitive material, the photosensitive material including a nucleating metal.

[0121] In this embodiment of the present application, a photosensitive material is defined as one in which, under the action of a light signal, nucleating metals present within the photosensitive material in the form of compounds are transformed into metals in an atomic state. These metals in an atomic state may be referred to as metal atoms in this embodiment of the present application.

[0122] Relatively stable micro or submicro aggregates are formed by metal atoms through physical or chemical bonding forces. These stable micro or submicro aggregates may be referred to as metal clusters in this embodiment of the present application. For example, metal clusters may include Cu clusters, Ag clusters, and Au clusters.

[0123] In this embodiment of the present application, a nucleating metal is defined as a metal that has good reducing properties and readily precipitates from a compound to form free atoms. For example, nucleating metals may include, but are not limited to, copper (Cu), silver (Ag), and gold (Au).

[0124] In this embodiment of the present application, the raw material further comprises a photosensitive material. The photosensitive material can convert nucleating metals present in compound form within the photosensitive material into atomic nucleating metals under irradiation with an optical signal, and aggregate these atomic nucleating metals to form metal clusters. Thus, a partial exposure method may be used, and as a result, nucleating metals present in compound form in the exposed area are reduced to atomic nucleating metals to form metal clusters. In a subsequent whole heat treatment step, the portion having the metal clusters is more readily crystallized to form a second region having low transmittance, and a first and second region having different transmittances is obtained integrally. In the process of producing the housing structure disclosed in this implementation, a whole heat treatment method may be used, and as a result, the warpage between the first and second regions is small.

[0125] In feasible implementations, the photosensitive material may include a photosensitive compound.

[0126] Photosensitive compounds absorb light signals and, under the action of the light signal, release electrons (e - ) is defined as something that can emit, where e - It can bond with nucleating metals that exist in the form of compounds, and as a result, the nucleating metals that exist in the form of compounds return to a free metal atom state.

[0127] For example, photosensitive compounds may include, but are not limited to, cerium oxide (CeO2) and cerium trioxide (Ce2O3).

[0128] In feasible implementations, the photosensitive material may contain anions, and the anions and nucleating metals may form photosensitive compounds.

[0129] Photosensitive compounds are defined as compounds that can precipitate metal atoms under the action of a light signal.

[0130] For example, photosensitive compounds may be, but are not limited to, silver bromide (AgBr), silver chloride (AgCl), and silver iodide (AgBr).

[0131] In this embodiment of the present application, only a few photosensitive compounds are described as examples, but it should be noted that these photosensitive compounds do not constitute a particular limitation.

[0132] Below, we will explain the formation of Ag clusters using an example where the photosensitive compound contains AgBr.

[0133] AgBr can generate silver atoms (Ag) and bromide vapor (Br2) under the action of a light signal. Br2 exists in gaseous form and easily escapes, leaving behind Ag. Ag can form Ag clusters through physical or chemical bonding forces.

[0134] In this embodiment of the present application, only a few photosensitive materials are described as examples, but it should be noted that these photosensitive materials do not constitute a specific limitation. Any material capable of depositing nucleating metal atoms under the action of a light signal may be used as the photosensitive material and may be applied to the embodiments of the present application.

[0135] In the process from raw materials to enclosure structure, the raw materials need to undergo treatments such as melting, partial exposure, and crystallization / heat treatment. These treatments, such as melting, partial exposure, and crystallization / heat treatment, will be further explained in the subsequent manufacturing methods.

[0136] For the sake of explanation, the structure before the housing structure is formed will be referred to as the glass plate / raw material. The glass plate / raw material is divided into an exposed region and an unexposed region. The unexposed region may ultimately be converted into the first region of the housing structure, and the exposed region may ultimately be converted into the second region of the housing structure.

[0137] In feasible implementations, all nucleated metals in unexposed regions exist in compound form. In other words, unexposed regions do not contain metal clusters.

[0138] In implementations where all nucleating metals in the unexposed regions exist in compound form, if the raw materials do not contain compound nucleating agents (oxides, fluorides, etc., applicable to the following scenarios), the unexposed regions may not crystallize during the crystallization heat treatment process. The unexposed regions still exist in the form of ordinary glass. In other words, the first region contains ordinary glass. The exposed regions can crystallize by using metal clusters as crystal nuclei to produce a second region, which contains glass ceramics and metal clusters.

[0139] In a design where all nucleating metals in the unexposed regions exist in compound form, if the raw materials contain a compound nucleating agent, the unexposed regions can be crystallized during the crystallization heat treatment process to form a first region. In this case, the first region includes glass ceramic. The exposed regions can then be crystallized to produce a second region, which includes glass ceramic and metal clusters.

[0140] In feasible implementations, the nucleating metal in the unexposed region is affected by several unavoidable factors. As a result, nucleating metal atoms precipitate from some of the nucleating metal in the unexposed region, and therefore the unexposed region contains metal clusters.

[0141] In a mounting where the unexposed region contains metal clusters, the unexposed region can be crystallized in the crystallization heat treatment process by using the metal clusters as crystal nuclei to form a first region. The first region may contain glass ceramic and metal clusters. The exposed region can be crystallized to generate a second region, which contains glass ceramic and metal clusters.

[0142] In implementations where the unexposed region contains metal clusters, the optical signal aids in the formation of these clusters. Therefore, the density of metal clusters in the exposed region is greater than that in the unexposed region. Crystallinity is positively correlated with the density of metal clusters. Therefore, the crystallinity of the exposed region is greater than that of the unexposed region. The transmittance of the second region formed by the exposed region is less than that of the first region formed by the unexposed region. The second region, with its low transmittance, can block the propagation of interference optical signals to some extent. The first region has high transmittance, ensuring low loss in the process of transmitting the active optical signal and the emitted optical signal to the first region.

[0143] In feasible implementations, the raw materials may contain halogen elements. A melting process is required in the process of forming the enclosure structure.

[0144] In this embodiment of the present application, melting is carried out in a high-temperature environment, the raw materials are converted to a molten state in the high-temperature environment, and as a result the raw materials are uniformly mixed.

[0145] In this implementation, the raw materials may contain halogen elements. Halogen elements in a high-temperature environment may provide an acidic / oxidizing gas atmosphere, which prevents nucleating metals in the raw materials from precipitating in atomic form and avoids the formation of metal clusters during the melting process. The amount / density of metal clusters in the unexposed regions can be reduced, and the crystallinity of the unexposed regions can be reduced. As a result, the first region formed by the unexposed regions has high transmittance, ensuring low loss in the process of transmitting the active optical signal and synchrotron radiation signal through the first region.

[0146] The above explains the raw materials used in the enclosure structure.

[0147] The structure of the enclosure will be described below. The shape of the enclosure is not particularly limited in the embodiments of this application. For example, as shown in Figure 4, in a feasible implementation, the enclosure may have a planar structure. As shown in Figure 5, in a feasible implementation, the enclosure may have a curved structure.

[0148] Although only two enclosure structures are illustrated as examples in Figures 4 and 5, these structures do not constitute a specific limitation. In actual application processes, the enclosure structure may be, but is not limited to, the two methods described above.

[0149] Please refer further to Figures 4 and 5. The housing structure may include a first region 1 and a second region 2. The first region 1 and the second region 2 are formed integrally, and as a result, there is no processing interface between the first region 1 and the second region 2 for adhesive bonding, joining, and fusion bonding. In this way, the housing structure has better integration and mechanical performance.

[0150] In this embodiment of the present application, the first region 1 penetrates the housing structure, and as a result, in the process of propagating the synchrotron radiation signal / effective optical signal on both sides of the housing structure, the synchrotron radiation signal / effective optical signal can be transmitted only through the first region 1, and the loss of the synchrotron radiation signal / effective optical signal is small.

[0151] The shape of the first region 1 is not particularly limited in the embodiments of this application.

[0152] For example, as shown in Figures 4 and 5, the first region 1 may be in the shape of a column.

[0153] For example, as shown in Figure 6, the first region 1 may be in the shape of a staircase.

[0154] For example, as shown in Figure 7, the first region 1 may be spherical.

[0155] In Figures 4, 5, 6, and 7, only some shapes of the first region are illustrated as examples, and it should be noted that the shape of the first region does not constitute a particular limitation. In the actual application process, the shape of the first region may be designed based on the actual requirements. This is not an overlimiting limitation in the embodiments of this application.

[0156] The number of first regions is not particularly limited in the embodiments of this application. For example, the number of first regions may be 1, 2, 3, 4, or 5, but is not limited to these.

[0157] As described above, in some feasible implementations, the first region 1 may include ordinary glass. In some feasible implementations, the first region 1 may alternatively include glass ceramic.

[0158] In implementations where the first region includes glass-ceramic materials, the first region may also include metal clusters.

[0159] In implementations where the first region contains metal clusters, the density of metal clusters in the first region is lower than the density of metal clusters in the second region. The crystallinity of the first region is lower than that of the second region. The first region has high transmittance, resulting in low losses in the process of transmitting optical signals / effective optical signals emitted through the first region.

[0160] In this embodiment of the present application, the housing structure further includes at least one second region, which has low transmittance and is used to prevent interference signals from propagating inside the housing structure.

[0161] See Figures 4, 5, and 6 for further reference. In feasible implementations, the second region 2 may penetrate the enclosure structure, and as a result, the second region can block a large amount of interference signals.

[0162] In an implementation where the second region penetrates the housing structure, the second region 2 is positioned between adjacent first regions 1, and the second region has low transmittance. As a result, the second region prevents optical signals from crosstalking between different first regions, thereby blocking interference signals.

[0163] In an implementation where the second region 2 penetrates the housing structure, the shape 1 of the second region is not particularly limited in this embodiment of the present application.

[0164] For example, as shown in Figures 4 and 5, in feasible implementations, the second region may be columnar in shape.

[0165] For example, as shown in Figure 6, in a feasible implementation, the second region may have a staircase shape.

[0166] See Figure 7 for further reference. In a feasible implementation, the second region 2 may be located inside the first region 1. In other words, the second region 2 does not penetrate the enclosure structure / the second region 2 is enclosed by the first region 1.

[0167] In an implementation where the second region is located inside the first region, the shape of the second region is not particularly limited in the embodiments of the present invention.

[0168] For example, as shown in Figure 7, in a feasible implementation, the second region may be spherical. Because the first region 1 and the second region 2 have different transmittances, refraction occurs when the interference signal propagates through the large contact interface between the second region and the first region, blocking the propagation of the interference signal. A larger contact interface between the second region and the first region exhibits a greater blocking effect against interference signals. A spherical second region has a larger contact interface with the first region, and therefore, a housing structure including a spherical second region can have a greater blocking effect against interference signals.

[0169] In Figures 4, 5, 6, and 7, some shapes of the first region are illustrated as examples, and it should be noted that the shape of the second region does not constitute a particular limitation. In the actual application process, the shape of the second region may be designed based on requirements. This is not overly limited in the embodiments of this application.

[0170] The number of second regions is not particularly limited in the embodiments of this application. For example, the number of second regions may be 1, 2, 3, 4, or 5, but is not limited to these.

[0171] In feasible implementations, in an implementation where the enclosure structure includes multiple second regions, any two second regions may have the same transmittance.

[0172] In feasible implementations, in an implementation where the enclosure structure includes multiple second regions, any two second regions may have different transmittances.

[0173] As shown in Figure 8, in a feasible implementation, the housing structure includes a compressive stress layer 6 and a tensile stress layer 7. The compressive stress layer 6 is located on the surface of the tensile stress layer 7.

[0174] The enclosure structure disclosed in this implementation includes a compressive stress layer and a tensile stress layer, the compressive stress layer being located on the surface of the tensile stress layer. Specifically, the compressive stress layer located on the outer surface is subjected to compressive stress, and the tensile stress layer located on the inner surface is subjected to tensile stress. The presence of the compressive stress layer can block / eliminate the generation and elongation of microprints on the surface of the enclosure structure, thereby improving the mechanical performance of the enclosure structure.

[0175] As shown in Figure 9, in order to further improve the shielding effect of the housing structure against interference signals, in a feasible implementation, the second region 2 may include at least two sub-regions 21 that are in contact with each other, and the two adjacent sub-regions 21 have different transmittances.

[0176] In this implementation, two adjacent sub-regions 21 have different transmittances, and a refraction / reflection interface 22 can be formed between the two sub-regions 21. When an interference signal propagates through the refraction / reflection interface 22, refraction / reflection occurs, resulting in a reduction of the interference signal transmitted through the second region and thus blocking the interference signal.

[0177] The number of sub-regions 21 included in each second region is not particularly limited in the embodiments of this application. For example, the number of sub-regions included in each second region may be 1, 2, 3, 4, or 5, but is not limited to these.

[0178] The shape of the sub-region 21 is not particularly limited in this embodiment of the present application. For example, the shape of the sub-region may be, but is not limited to, a columnar shape, a stepped shape, or a sphere.

[0179] A wider second region indicates a greater blocking effect against interference signals. To ensure that the enclosure structure has a greater blocking effect against interference signals, the width of the second region is greater than or equal to a specified value in feasible implementations.

[0180] The specified value is not particularly limited in the embodiments of the present invention. For example, the specified value may be 1 μm or 2 μm.

[0181] See Figure 4 for further reference. In feasible implementations, the protrusions 3 and / or recesses 4 may be formed on the surface of the housing structure.

[0182] The shape and size of the protrusions or recesses are not particularly limited in the embodiments of this application, and the shape and size of the protrusions or recesses may be determined based on requirements.

[0183] In feasible implementations, the protrusions 3 and recesses 4 may cover the entire surface of the housing structure. In feasible implementations, the protrusions 3 and recesses 4 may cover only a portion of the surface of the housing structure.

[0184] For example, in a feasible implementation, the convex portion 3 / concave portion 4 may cover only the surface of the first region.

[0185] For example, in a feasible implementation, the convex portion 3 / concave portion 4 may cover only the surface of the second region.

[0186] For example, in a feasible implementation, the convex portion 3 / concave portion 4 may cover the surfaces of the first and second regions.

[0187] See Figure 4 for further reference. To block more interference signals, in implementations where the second region penetrates the housing structure, the light-shielding layer 5 may be placed in the recess on the surface of the second region.

[0188] In this embodiment of the present application, the light-shielding layer 5 is defined as a material layer whose transmittance is less than that of the second region, and may be, but is not limited to, a light-shielding ink or a material layer containing polyvinyl chloride.

[0189] In this implementation, the light-shielding layer 5 is positioned in a recess on the surface of the second region. The light-shielding layer 5 and the second region 2 are contained between the adjacent first region. Since the transmittance of the light-shielding layer 5 is lower than that of the second region, the light-shielding layer 5 can block a large amount of interference signals. Therefore, the housing structure disclosed in this implementation can block a large amount of interference signals.

[0190] In implementations that form protrusions / recesses on the surface of the enclosure structure, the protrusions and recesses form a Fresnel pattern in feasible implementations.

[0191] In this embodiment of the present application, a Fresnel pattern is defined as comprising a series of sawtooth-like recesses on a surface and an elliptical arc in the central portion. Each recess has a different angle from adjacent recesses, but each recess can concentrate the optical signal to one location to form a central focal point.

[0192] In this implementation, a Fresnel pattern formed by convex / concave areas on the surface of the housing structure can serve as a focusing mechanism. The Fresnel pattern may be designed such that the central focal point formed on the Fresnel pattern is located on the photodetector, improving the signal-to-noise ratio of the effective optical signal.

[0193] The Fresnel pattern is designed on the surface of the housing structure, and as a result, the Fresnel pattern can be implemented without using additional polyethylene glycol terephthalate (PET) film, thereby reducing the stack size of the housing structure.

[0194] In this implementation, the Fresnel pattern is formed by irregularities on the surface of the housing structure, and the Fresnel pattern and the first / second region are integrally formed. Thus, there is no processing interface for adhesive bonding, joining, or fusion bonding between the first / second region and the Fresnel pattern. In this way, the housing structure has better integration and better mechanical performance.

[0195] Embodiments of this application further disclose a method for manufacturing a housing structure. As shown in Figure 10, the manufacturing method may include the following steps.

[0196] S101: Expose a portion of the glass plate to light.

[0197] In this embodiment of the present application, the raw material used for the glass plate includes a photosensitive material, the photosensitive material includes a nucleating metal, the photosensitive material converts the nucleating metal, which is present in the form of a compound within the photosensitive material, into an atomic state of nucleating metal, and the atomic state of nucleating metal is used to form a metal cluster.

[0198] In feasible implementations, glass plates can be obtained by melting raw materials. A melting method common in the art may be used. This is not particularly limited to the embodiments of this application.

[0199] For example, processes such as continuous melting, drawing, casting, molding, and cutting may be performed sequentially on the raw material. Finally, a glass plate of the required size is obtained.

[0200] There are multiple implementations for partially exposing a glass plate.

[0201] In feasible implementations, the glass plate may be partially exposed using an optical signal irradiation method.

[0202] The process of exposing a portion of a glass plate using an optical signal irradiation method may be as follows: a mask reticle is placed on the side of the glass plate, provided that the mask reticle has a transparent window; and a portion of the glass plate is illuminated through the window of the mask reticle with an optical signal. In this way, partial exposure of the glass plate is implemented.

[0203] In this implementation, partial exposure of the glass plate is achieved by using a mask reticle. The final shape / size of the second region is determined by the shape / size of the mask reticle's window. The shape / size of the second region can be flexibly configured by using mask reticles with windows of different shapes / sizes.

[0204] In feasible implementations, a portion of the glass plate may be irradiated with a laser. The specific implementation process is as follows: The size and shape of the exposure area may be controlled by controlling the laser path. This process does not require the assistance of a mask reticle, and as a result, the cost of the housing structure can be reduced to some extent.

[0205] In this embodiment of the present application, only two implementations of partial exposure of a glass plate are described as examples, and these implementations do not constitute any particular limitation.

[0206] The bandwidth of the optical signal used for partial exposure is not particularly limited in the embodiments of this application. For example, the bandwidth of the optical signal may be 390 nm to 780 nm, greater than 780 nm, or less than 390 nm.

[0207] The intensity of the optical signal is not particularly limited in the embodiments of this application, and the intensity of the optical signal may be selected based on requirements.

[0208] Generally, the intensity of an optical signal can be expressed by an energy flow density constant, which is defined as the energy or power generated by the optical signal within a unit space.

[0209] In a feasible implementation, the energy flow density of the optical signal is below the damage threshold of the glass plate, and as a result, the internal structure of the exposed area is not damaged during the partial exposure stage.

[0210] The exposure time is not particularly limited in the embodiments of this application, and an appropriate exposure time may be selected based on the requirements. Within a certain range, the amount of metal atoms in the exposed region is positively correlated with the exposure time, and the amount of metal atoms in the exposed region is inversely correlated with the transmittance of the resulting second region. Implementations that extend the exposure time may be used to allow the second region to have low transmittance.

[0211] The shape and size of the exposure area are not particularly limited in the embodiments of this application. In implementations in which partial exposure is implemented by using a mask reticle, the shape / size of the exposure area can be adjusted by adjusting the shape / size of the window of the mask reticle.

[0212] In implementations where partial exposure is performed via a laser, the shape / size of the exposure area can be adjusted by adjusting the laser path.

[0213] In feasible implementations, patterned exposure areas can be achieved by selecting an appropriate laser (time, intensity, laser spot size, or optical signal bandwidth).

[0214] For information on photosensitive materials, please refer to the previous explanation of photosensitive materials. Further details will not be provided here.

[0215] S102: A nucleation heat treatment is performed on the exposed glass plate, and as a result, metal clusters are formed in the exposed region of the glass plate.

[0216] In this embodiment of the present application, the nucleation heat treatment step includes a metal cluster growth step. The nucleation heat treatment step is sometimes abbreviated as the nucleation step.

[0217] The nucleation heat treatment temperature is not particularly limited to the embodiments of this application. For example, the nucleation heat treatment temperature may be 480°C, 490°C, 500°C, 510°C, 520°C, or 530°C.

[0218] The adiabatic duration of the nucleation heat treatment is not particularly limited to the embodiments of this application. For example, the adiabatic duration of the nucleation heat treatment may be 0.5h, 1h, 1.5h, 3h, 4h, or 8h.

[0219] In feasible implementations, metal clusters may not form within the non-exposed area during the nucleation heat treatment process.

[0220] In feasible implementations, metal clusters may form within the non-exposed areas during the nucleation heat treatment process.

[0221] In implementations where metal clusters are formed within unexposed areas, the density of metal atoms in the exposed areas is greater than that in the unexposed areas because the optical signal assists in the formation of the metal clusters.

[0222] The following describes the process of forming a metal using examples in which the photosensitive material includes CeO2, Ce2O3, and Ag2O.

[0223] The valencies of cerium in CeO2 and Ce2O3 are +4 and +3, respectively. Cerium with a valency of +4 is Ce 4+It may be represented as follows. Cerium having a valence of +3 is Ce 3+ It may be represented as follows. Ce 3+ can strongly absorb ultraviolet rays. After absorbing ultraviolet rays, Ce 3+ releases e - e - can be adsorbed near Ce 4+ .

[0224] In the nucleation heat treatment step, silver (Ag + ) in Ag2O diffuses and can combine with e 4+ near Ce, and convert Ag - into atomic silver (Ag). +

[0225] When the temperature further rises, Ag atoms continue to absorb Ag + and e - , and Ag can form stable Ag clusters by physical or chemical bonding forces.

[0226] S103: Perform crystallization heat treatment on the glass plate subjected to nucleation treatment to obtain a housing structure.

[0227] In this embodiment of the present application, the housing structure includes a first region and a second region. The second region is obtained by crystallizing the exposed region of the glass plate, the first region is obtained by crystallizing the non-exposed region of the glass plate, and the second region includes a glass ceramic and metal clusters.

[0228] In this embodiment of the present application, the crystallization heat treatment stage is a glass-ceramic growth stage. In this embodiment of the present application, the crystallization heat treatment stage may be abbreviated and sometimes called a crystallization stage.

[0229] ​In an implementation where, after the nucleation stage, all nucleating metals in the unexposed region exist in compound form, if the raw materials do not contain compound nucleating agents, the unexposed region still exists in the form of ordinary glass. In other words, the first region contains ordinary glass. The exposed region can be crystallized by using metal clusters as crystal nuclei to produce a second region, the second region containing glass ceramics and metal clusters.

[0230] In an implementation where, after the nucleation stage, all nucleated metals in the unexposed region exist in compound form, if the raw material contains a nucleating agent, then in the crystallization stage, the unexposed region can be crystallized by using the nucleating agent as a crystal nucleus to form a first region, which contains glass ceramics. The exposed region can then be crystallized to produce a second region, which contains glass ceramics and metal clusters.

[0231] In an implementation where the unexposed region contains metal clusters after the nucleation stage, the unexposed region can crystallize during the crystallization stage to form a first region, which contains glass-ceramic and metal clusters. The exposed region can crystallize to generate a second region, which also contains glass-ceramic and metal clusters.

[0232] Optical signals facilitate the formation of metal clusters. Therefore, the density of metal clusters in the exposed region is greater than the density of metal clusters in the unexposed region. Crystallinity is positively correlated with the density of metal clusters. Therefore, the crystallinity of the exposed region is greater than that of the unexposed region. The transmittance of the second region formed by the exposed region is less than that of the first region formed by the unexposed region.

[0233] The processing temperature in the crystallization stage is not particularly limited in the embodiments of this application. For example, the heat treatment temperature in the crystallization stage may be 580°C, 590°C, 600°C, 610°C, 620°C, or 630°C.

[0234] The adiabatic time in the crystallization stage is not particularly limited to the embodiments of this application. For example, the adiabatic time in the crystallization stage may be 0.5h, 1h, 1.5h, 3h, 4h, or 8h.

[0235] In this implementation, a glass plate is used to form a housing structure, and the glass plate contains a photosensitive material. Under the action of an optical signal, nucleating metals existing in the form of compounds within the photosensitive material are converted to atomic nucleating metals, and these atomic nucleating metals can aggregate to form metal clusters. Thus, a partial exposure method using an optical signal may be used, and as a result, metal clusters are formed in the exposed region. In the subsequent whole heat treatment process, the exposed region with the metal clusters is easily crystallized to form a second region with low transmittance, and this second region with low transmittance can reduce interference signals by blocking the propagation of interference signals within the housing structure to some extent. According to the manufacturing method disclosed in this implementation, a first region with low / zero crystallinity and a second region with high crystallinity can be obtained by a whole heat treatment method, and the warping between the first and second regions in the manufactured glass plate is small.

[0236] In one implementation, this manufacturing method further includes the following steps.

[0237] S104: The enclosure structure is chemically strengthened, and as a result, the enclosure structure includes compressive stress layers.

[0238] The compressive stress layer is located on the surface of the tensile stress layer.

[0239] A chemical strengthening method commonly used in this field is used so that the enclosure structure may include compressive stress layers. In feasible implementations, the enclosure structure may also be chemically strengthened by an ion exchange method.

[0240] For example, the housing structure may be placed in molten potassium nitrate or potassium nitrate solution / molten mixture of sodium nitrate and sodium nitrate or mixed solution of potassium nitrate and sodium nitrate, where ion exchange occurs. Sodium ions (Na) on the surface of the housing structure + ) is a potassium ion (K) in potassium nitrate. + ) may be replaced with this. In this way, the Na on the surface of the housing structure + However, K has a larger ionic radius. + It is replaced by this to implement chemical strengthening.

[0241] There is a volume difference between the surface of the enclosure structure before chemical strengthening and the surface of the enclosure structure after chemical strengthening. This volume difference forms a compressive stress layer within a specific depth range of the enclosure structure. The presence of this compressive stress layer can block / eliminate the generation and elongation of microprints on the surface of the enclosure structure, thereby improving the mechanical performance of the enclosure structure.

[0242] The heat treatment temperature in the ion exchange process is not particularly limited in the embodiments of this application. For example, the heat treatment temperature in the ion exchange process may be 350°C or 400°C.

[0243] The heat treatment time for the ion exchange step is not particularly limited in the embodiments of this application. The heat treatment time for the ion exchange step is 0.5h, 1h, 1.5h, 3h, 4h, or 8h.

[0244] In a feasible implementation, a second region containing multiple sub-regions may be formed through multiple exposure and heat treatments, where two adjacent sub-regions have different transmittances, and as a result, a refractive / reflective interface may be formed between these two sub-regions. Interference signals propagate to the refractive / reflective interface, causing refraction / reflection, and consequently reducing the interference signals transmitted through the second region.

[0245] In feasible implementations, protrusions / recesses may be formed on the surface of the housing structure.

[0246] The mounting method for forming the protrusions / recesses is not particularly limited in the embodiments of this application. For example, in a feasible mounting, the protrusions / recesses may be formed on the surface of the housing structure by a dry etching method. In a feasible mounting, the protrusions / recesses may be formed on the surface of the housing structure by a wet etching method. The etching solution used in the wet etching method may include, but is not limited to, hydrofluoric acid (HF).

[0247] The manufacturing process disclosed in the embodiments of this application will be described below with reference to specific examples.

[0248] Embodiment 1 (1) Melting: See Figure 11(1). The raw materials are measured (by mass fraction wt): SiO2 (77.18%), Al2O3 (5%), ZnO (1.5%), Li2CO3 (9%), Na2CO3 (2.5%), K2CO3 (4%), ZrO2 (0.5%), Sb2O3 (0.2%), Ag2O (0.1%), and CeO2 (0.02%). The raw materials are melted, and the melting may include processing methods such as continuous melting, drawing, casting, molding, and cutting in order to obtain a glass plate 111 of an appropriate size.

[0249] (2) As shown in Figure 11(2), the mask reticle B is placed on the side surface of the glass plate 111.

[0250] (3) Partial exposure: The glass plate 111 is partially exposed by using ultraviolet A in the 290 nm to 330 nm band and mask reticle B. As shown in Figure 11(3), an exposed region 111(1) and an unexposed region 111(2) are formed on the glass plate. Metal atoms (not shown) are deposited in the exposed region 111(1).

[0251] (4) Nucleation: The glass plate obtained in (3) is heated to approximately 500°C, kept at that temperature, and then annealed. The metal atoms in the exposed region 111(1) bond together to form metal clusters.

[0252] (5) Crystallization: The glass plate obtained in (4) is heated to approximately 675°C, kept warm, and then cooled in a furnace. By using metal clusters as crystal nuclei, the exposed region 111(1) is crystallized, while the unexposed region 111(2) remains unchanged. Refer to Figure 11(4) for the structure of the resulting housing structure. The housing structure may include a first region 1 and a second region 2.

[0253] (6) Polish the casing structure.

[0254] (7) The enclosure structure is chemically strengthened at 450°C in molten potassium nitrate or potassium nitrate solution. Refer to Figure 11(5) for the structure of the chemically strengthened enclosure structure. The chemically strengthened enclosure structure includes a compressive stress layer 6 and a tensile stress layer 7.

[0255] (8) The chemically reinforced housing structure is subjected to coating or other treatments.

[0256] Embodiment 2 (1) Melting: Refer to Figure 12(1). Measure the composition of the raw materials (wt): SiO2 (76%), Al2O3 (5%), ZnO (1.7%), Li2CO3 (9%), Na2CO3 (3.5%), K2CO3 (4%), ZrO2 (0.5%), Sb2O3 (0.2%), Ag2O (0.08%), and CeO2 (0.02%). Melt the raw materials to obtain glass plate 121.

[0257] (2) Partial exposure: As shown in Figure 12(2), a portion of the glass plate 121 is irradiated with the laser D, and an exposed region 121(1) and an unexposed region 121(2) are formed on the glass plate. Metal atoms (not shown) are deposited in the exposed region 121(1).

[0258] (3) Nucleation: The glass plate obtained in (2) is heated to approximately 500°C, kept at that temperature, and then annealed. Metal atoms in the exposed region 121(1) bond together to form metal clusters.

[0259] (4) Crystallization: The glass plate obtained in (3) is heated to approximately 675°C, kept warm, and then cooled in a furnace. By using metal clusters as crystal nuclei, the exposed region 121(1) is crystallized, while the unexposed region 121(2) remains unchanged. For the structure of the resulting housing structure, please refer to Figure 12(3). The housing structure may include a first region 1 and a second region 2.

[0260] (5) Polish the casing structure.

[0261] (6) The enclosure structure is chemically strengthened at 360°C in a mixture of 90% molten potassium nitrate and 10% molten sodium nitrate to obtain a chemically strengthened enclosure structure. Refer to Figure 12(4) for the structure of the chemically strengthened enclosure structure. The chemically strengthened enclosure structure includes a compressive stress layer 6 and a tensile stress layer 7.

[0262] Embodiment 3 (1) Melting: Refer to Figure 12(1). Measure the composition of the raw materials (wt): SiO2 (70%), Al2O3 (10.5%), ZnO (1%), Li2CO3 (9%), Na2CO3 (3.5%), NaF (1%), K2CO3 (2%), ZrO2 (1%), AgCl (1%), and CeO2 (1%). Melt the raw materials to obtain glass plate 121.

[0263] (2) Partial exposure: As shown in Figure 12(2), a portion of the glass plate 121 is irradiated with the laser D, and an exposed region 121(1) and an unexposed region 121(2) are formed on the glass plate. Metal atoms (not shown) are deposited in the exposed region 121(1).

[0264] (3) Nucleation: The glass plate obtained in (2) is heated to approximately 500°C, kept at that temperature, and then annealed. Metal atoms in the exposed region 121(1) bond together to form metal clusters.

[0265] (4) Crystallization: The glass plate obtained in (3) is heated to approximately 675°C, kept warm, and then cooled in a furnace. By using metal clusters as crystal nuclei, the exposed region 121(1) is crystallized, while the unexposed region 121(2) remains unchanged. In this way, the housing structure is obtained. For the structure of the obtained housing structure, please refer to Figure 12(3). The housing structure may include a first region 1 and a second region 2.

[0266] (5) The enclosure structure is chemically strengthened at 350°C in a mixture of 80% molten potassium nitrate and 20% molten sodium nitrate to obtain a chemically strengthened enclosure structure. Refer to Figure 12(4) for the structure of the enclosure structure. The chemically strengthened enclosure structure includes a compressive stress layer and a tensile stress layer.

[0267] (6) The enclosure structure obtained in (5) is subjected to coating or other treatments.

[0268] The housing structures in the embodiments of this application may be manufactured according to the methods in the following embodiments of this application, or according to other methods. The manufacturing methods in the embodiments of this application are merely one or more methods for manufacturing the housing structures in this application and should not be construed as limitations on the housing structures disclosed in the embodiments of this application.

[0269] Embodiments of this application further disclose a housing, which includes at least one housing structure disclosed in the embodiments of this application.

[0270] In feasible implementations, multiple enclosure structures are separate structures, and these multiple enclosure structures can be connected together by methods such as bonding, fusion bonding, or joining.

[0271] In feasible implementations, multiple enclosure structures may be integrated into a single structure.

[0272] In feasible implementations, the enclosure may further include a cover bottom layer, which is located on the surface of the enclosure structure.

[0273] In this embodiment of the present application, the cover bottom layer may be obtained by photocuring or thermal curing of an ink having at least one of light-reflecting and light-absorbing functions. For example, the cover bottom layer may be obtained by photocuring or thermal curing of black ink or white ink.

[0274] In implementations where the bottom cover layer is located within the enclosure structure, if the second region penetrates the enclosure structure, the bottom cover layer is positioned to avoid the first region of the enclosure structure.

[0275] For a detailed description of the features that are the same in this embodiment as in the previously described embodiment, please refer to the previously described embodiment. Further details will not be described again here.

[0276] Embodiments of this application further disclose an electronic device. The electronic device may include a housing structure disclosed in embodiments of this application, a light emitter, and an optical receiver. The light emitter is located on the side of the housing structure and is positioned near a first region. A projection of the light emitter in the housing structure coincides with the first region. The light emitter is configured to emit an optical signal into the first region. The optical receiver is located on the same side of the housing structure as the light emitter and is positioned near the first region. A projection of the optical receiver in the housing structure coincides with the first region. The optical receiver is configured to receive an optical signal (effective optical signal) transmitted through the first region and reflected back to the first region.

[0277] In this embodiment of the present application, the coincidence of a projection of the light-emitting element in the housing structure with the first region may be understood as meaning that an optical signal emitted by the light-emitting element can enter the first region and at least partially pass through the first region. Similarly, in this embodiment of the present application, the coincidence of a projection of the optical receiver in the housing structure with the first region may be understood as meaning that the optical receiver can receive an optical signal emitted by the light-emitting element and reflected to the first region.

[0278] In an implementation where the second region is located inside the first region, the second region is located between the protrusion of the light emitter and the protrusion of the optical receiver in the first region.

[0279] In an implementation where the second region penetrates the housing structure, the second region is located between adjacent first regions.

[0280] In an implementation where the inner surface of the housing structure includes a Fresnel pattern, in a feasible implementation, a focusing effect may be implemented by using the Fresnel pattern. As a result, the beam angle of the optical signal emitted by the light emitter becomes smaller, the optical signal emitted by the light emitter is more focused, and more optical signals can reach the target object.

[0281] In a feasible implementation, a focusing effect may be implemented by using the Fresnel pattern, the beam angle of the effective signal is narrowed, and as a result, the optical receiver can receive a more effective signal.

[0282] In a feasible implementation, the electronic device may further include a cover bottom layer, and the cover bottom layer is disposed on the surface of the housing structure.

[0283] In an implementation where the bottom cover layer is disposed inside the housing structure, when the second region penetrates the housing structure, the bottom cover layer is disposed avoiding the first region of the housing structure.

[0284] For a detailed description of the parts of the features that are the same as those in this embodiment and the above embodiments, please refer to the above embodiments. Details will not be described again here.

[0285] Hereinafter, the electronic device disclosed in this embodiment of the present application will be described while referring to specific data.

[0286] Table 1 shows the data generated by the electronic device disclosed in a feasible implementation.

Table 1

[0287] The PPG signal contains both a direct current (DC) component and an alternating current (AC) component. The DC component reflects the characteristics of non-pulsating tissues such as epithelial tissue, bone, venous blood, and non-pulsating arterial blood. The AC component is generated by pulsating arterial blood. The ratio of AC to DC in the PPG signal at a particular wavelength is also called the perfusion index (PI) for the corresponding wavelength.

[0288] (1) From the light leakage data in Table 1, it can be seen that the light leakage (IR, R, and G) phenomena in Embodiments 4, 5, and 6 are mitigated compared to the comparative embodiment.

[0289] (2) A comparison of the light leakage data (IR, R, and G) in Embodiment 4 and Embodiment 5 shows that increasing the width of the second region reduces light leakage and improves the interference signal blocking effect.

[0290] (3) Reducing the width of the second region can increase light leakage and decrease the perfusion index, thereby mitigating the deterioration of power consumption to some extent. Therefore, the width of the second region may be appropriately selected based on the requirements.

[0291] (4) Embodiments 4 and 5 use the same housing structure, but they differ in that the transmittance of the second region is different. A comparison of the light leakage data (IR, R, and G) of Embodiments 4 and 5 shows that transmittance has a significant effect on the infrared light leakage phenomenon.

[0292] (5) A comparison of the leak light data (IR, R, and G) and PI in Embodiments 4, 5, and 6 shows that PI is related to transmittance. A smaller transmittance in the second region indicates a larger PI value (absolute value) for the electronic device.

[0293] The terms “embodiments” or “implementations” as used in this application mean that certain features, structures, or characteristics described in relation to an embodiment may be included in at least one embodiment of this application. Terms used in various parts of this specification do not necessarily refer to the same embodiment, nor are they exclusive, independent, or arbitrary embodiments from another embodiment. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described in this application may be combined with other embodiments. Furthermore, it should be understood that the features, structures, or characteristics described in the embodiments of this application may be combined randomly to form another embodiment, provided they are not inconsistent, without departing from the spirit and scope of the technical solution of this application.

[0294] Finally, it should be noted that the aforementioned implementations are intended merely to illustrate the technical solutions of this application and not to limit them. Although this application is described in detail with reference to exemplary implementations, those skilled in the art will understand that any modifications or equivalent substitutions made to the technical solutions of this application will not depart from the spirit and scope of the technical solutions of this application.

Claims

1. A housing structure including a first region and a second region, The first region and the second region are formed integrally, and the transmittance of the first region is greater than the transmittance of the second region. The second region includes glass ceramics and metal clusters. Enclosure structure.

2. The first region does not contain metal clusters, or the density of metal clusters in the first region is less than the density of metal clusters in the second region. The housing structure according to claim 1.

3. The metal cluster includes one of Ag clusters, Cu clusters, and Au clusters, or a mixture of clusters. The housing structure according to claim 1 or 2.

4. The raw materials used in the housing structure include a photosensitive material, the photosensitive material includes a nucleating metal, the photosensitive material converts the nucleating metal, which exists in the form of a compound within the photosensitive material, into an atomic state of nucleating metal under the action of a light signal, and the atomic state of nucleating metal is used to form the metal cluster. The housing structure according to any one of claims 1 to 3.

5. The photosensitive material further comprises a photosensitive compound, the photosensitive compound comprising a compound that emits electrons under the action of the light signal. The housing structure according to claim 4.

6. The photosensitive material further comprises anion, the anion and the nucleating metal form a photosensitive compound, and the photosensitive compound comprises a compound in which the nucleating metal in its atomic state precipitates under the action of the light signal. The housing structure according to claim 5.

7. The raw materials used in the aforementioned housing structure include halogen elements. The housing structure according to any one of claims 1 to 6.

8. The first region includes the glass ceramic or ordinary glass, The housing structure according to any one of claims 1 to 7.

9. The aforementioned second region penetrates the housing structure, The housing structure according to any one of claims 1 to 8.

10. The surface of the housing structure includes flat surfaces, curved surfaces, convex or concave parts, The housing structure according to any one of claims 1 to 9.

11. A light-shielding layer is placed in a recess on the surface of the second region, and the transmittance of the light-shielding layer is less than the transmittance of the second region. The housing structure according to claim 10.

12. The convex portion and the concave portion form a Fresnel pattern. The housing structure according to claim 11.

13. The housing structure includes a compressive stress layer and a tensile stress layer, The compressive stress layer is disposed on the surface of the tensile stress layer. The housing structure according to any one of claims 1 to 12.

14. The second region includes a plurality of adjacent sub-regions, and the adjacent sub-regions have different transmittances. The housing structure according to any one of claims 1 to 13.

15. The width of the second region is greater than or equal to the specified value. The housing structure according to any one of claims 1 to 14.

16. The housing structure includes N second regions, where N is 2 or more, and any two second regions have the same transmittance, or any two second regions have different transmittances. The housing structure according to any one of claims 1 to 15.

17. A method for manufacturing an enclosure structure, A step of exposing a portion of a glass plate, wherein the raw material used for the glass plate includes a photosensitive material, the photosensitive material includes a nucleating metal, the photosensitive material, under the action of a light signal, converts the nucleating metal, which exists within the photosensitive material in the form of a compound, into an atomic state of nucleating metal, and the atomic state of nucleating metal is used to form the metal cluster, The steps include performing a nucleation heat treatment on the exposed glass plate to form the metal cluster in the exposed region of the glass plate, A step of obtaining a housing structure by performing a crystallization heat treatment on the glass plate on which a nucleation treatment has been performed, wherein the housing structure includes a first region and a second region, the second region being obtained by crystallizing the exposed region of the glass plate, the first region being obtained by crystallizing the unexposed region of the glass plate, and the second region including glass ceramics and the metal cluster, A method of production including the following.

18. The step of exposing the portion of the glass plate is, A step of placing a mask reticle on the side surface of the glass plate, wherein the mask reticle includes a window, The steps include illuminating the portion of the glass plate through the window of the mask reticle with an optical signal, The manufacturing method according to claim 17, including the method described in claim 17.

19. The step of exposing the portion of the glass plate to light is, specifically, A step of irradiating the aforementioned portion of the glass plate with a laser, The manufacturing method according to claim 17, including the method described in claim 17.

20. The energy flow density of the optical signal used during exposure is below the damage threshold of the glass plate. The method of manufacture according to any one of claims 17 to 19.

21. After the step of performing heat treatment on the exposed glass plate to obtain the housing structure, the manufacturing method is as follows: The method further includes the step of chemically strengthening the housing structure, thereby generating a compressive stress layer on the surface of the housing structure, wherein the compressive stress layer is disposed on the surface of the tensile stress layer. The method of manufacture according to any one of claims 17 to 20.

22. A housing comprising at least one housing structure according to any one of claims 1 to 16.

23. An electronic device comprising a light-emitting element, an optical receiver, and a housing structure according to any one of claims 1 to 16, wherein the housing structure includes a first region and a second region, the light-emitting element is configured to emit an optical signal transmitted through the first region, and the optical receiver is configured to receive the optical signal transmitted through the first region. The second region is located between the protrusion of the optical receiver in the first region and the protrusion of the light-emitting element in the first region. Electronic devices.

24. The electronic device further comprises a cover bottom layer, the cover bottom layer is arranged on the inner surface of the housing structure, and the cover bottom layer is arranged to avoid the protrusions of the optical receiver / light-emitting body on the first region. The electronic device according to claim 23.

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