Air-cooled cooling suit

Abstract

The present invention discloses an air-cooled cooling suit, which includes a suit structure and a semiconductor cooling device, the semiconductor cooling device being detachably attached to the suit structure via a storage bag, the semiconductor cooling device including a semiconductor cooler, a first heat exchanger, a second heat exchanger, a heat exchange fan, and a case, both of which are provided with heat exchange passages, and the exhaust port of the heat exchange fan is provided facing the intake end of the heat exchange passage, the case is provided with an intake port, a cooling outlet, and a heat dissipation outlet, the cooling outlet and heat dissipation outlet being located on two different sides of the case, the cooling outlet facing the inside of the suit structure, and the heat dissipation outlet facing the outside of the suit structure. The air-cooled cooling suit proposed in this embodiment employs air cooling technology to exchange heat generated by the human body with the surrounding environment through a heat exchange fan, thereby achieving the purpose of cooling the human body, effectively improving the cooling effect of the cooling suit, and meeting the user's needs.

Description

[Technical Field]

[0001] The present invention relates to the technical field of cooling suits, and more particularly to air-cooled cooling suits. [Background technology]

[0002] Based on the relationship between ambient temperature and the body's thermal equilibrium, living environments above 35°C and work environments above 32°C are generally considered high-temperature environments. In high-temperature environments, abnormal changes are observed in human physiological functions, particularly thermoregulation, water and salt metabolism, and blood circulation. For example, excessive sweating increases the burden on the cardiovascular system. If the temperature exceeds the body's tolerance, mild cases may affect attention and reduce work efficiency, severe cases may cause heatstroke, and even more severe cases may lead to sudden death, endangering the safety of workers and resulting in unnecessary economic losses.

[0003] People who work outdoors in environments without air conditioning, especially in high-temperature conditions, such as police officers on watch duty in the hot summer weather, construction workers working in the blazing sun, or maintenance personnel performing related maintenance work in the air outdoors, often have to endure various discomforts caused by the high temperatures and continue working for extended periods. When working in high-temperature conditions while wearing normal clothing, people sweat, and the sweat moves to the surface of the clothing through diffusion and transport, carrying away some heat through evaporation. However, the source of evaporation provided by the evaporation of sweat is limited, and therefore the amount of heat carried away is also limited. In particular, when working in high-temperature environments for extended periods, normal clothing cannot play a cooling role for even a short time.

[0004] To solve the above problem, the Chinese utility model patent, disclosure number CN216453469U, proposes a water-cooled semiconductor cooling air conditioner that uses semiconductor cooling as its core and transmits cooling energy to the cooling garment through devices such as a liquid circulation pump and fluid pipes using a cooling water system, thereby achieving the purpose of regulating the body temperature through heat exchange with the body via the cooling garment. On the other hand, due to limitations such as portability, the low cooling capacity and conversion efficiency of semiconductor cooling, and battery weight, the overall cooling power of the system is small, resulting in a poor temperature regulation experience.

[0005] The Chinese utility model patent with the publication number CN209898330U proposes an air-conditioning suit based on semiconductor refrigeration technology that adopts air-cooling technology and achieves the purpose of cooling the human body by exchanging the heat generated by the human body with the surrounding environment through a fan. This structure is simple and practical, but it adopts a heat exchange method only by a fan and there is no generation of cooling and heating capacity. Therefore, in a high-temperature environment, it is difficult for the temperature regulation effect of the human body to meet the requirements.

Summary of the Invention

Problems to be Solved by the Invention

[0006] The object of the present invention is to adopt air-cooling technology, achieve the purpose of cooling the human body by exchanging the heat generated by the human body with the surrounding environment through a heat exchange fan, effectively improve the cooling effect of the cooling suit, meet the usage needs of users, and have a simple and reasonable structure, easy and quick to install, and effectively overcome the disadvantages in the prior art, and propose an air-cooled cooling suit.

Means for Solving the Problems

[0007] To achieve this object, the present invention adopts the following technical solutions.

[0008] An air-cooled cooling suit, including a garment body structure and a semiconductor refrigeration device, wherein a storage pocket is provided in the garment body structure, and a plurality of ventilation holes are opened in the storage pocket, and the semiconductor refrigeration device is detachably attached to the garment body structure through the storage pocket. The semiconductor refrigeration device includes a semiconductor refrigerator, a first heat exchanger, a second heat exchanger, a heat exchange fan and a case, and the semiconductor refrigerator, the first heat exchanger, the second heat exchanger and the heat exchange fan are all installed inside the case. The semiconductor cooler is provided with a first end face and a second end face facing each other. The first heat exchanger is connected to the first end face, and the second heat exchanger is connected to the second end face. Heat exchange passages are provided in both the first heat exchanger and the second heat exchanger, and the exhaust port of the heat exchange fan is provided facing the intake end of the heat exchange passage. An intake port, a cooling outlet, and a heat dissipation outlet are formed in the case. The first end face is the cold end face of the semiconductor cooler, and the second end face is the warm end face of the semiconductor cooler. The intake port of the heat exchange fan is provided close to the intake port. The exhaust end of the heat exchange passage of the first heat exchanger is provided close to the cooling outlet. The exhaust end of the heat exchange passage of the second heat exchanger is provided close to the heat dissipation outlet. The cooling outlet and the heat dissipation outlet are located on two different side faces of the case, and the cooling outlet faces the inside of the clothing body structure, and the heat dissipation outlet faces the outside of the clothing body structure.

[0009] Preferably, the intake port and the cooling outlet are located on the same side face of the case and both face the inside of the clothing body structure.

[0010] Preferably, the intake port is located below the cooling outlet.

[0011] Preferably, the storage bag is located on the back of the clothing body structure.

[0012] Preferably, the semiconductor cooling device is provided close to or covering the human heart acupoint and / or lung acupoint.

[0013] Preferably, at least one of the storage bag and the semiconductor cooling device is provided.

[0014] Preferably, it further includes a ventilation fan for transporting gas inside the clothing body structure, which is attached to the back of the clothing body structure.

[0015] Preferably, the ventilation fan is located below the semiconductor cooling device.

[0016] Preferably, at least one ventilation fan is provided.

[0017] Preferably, the semiconductor cooling device further includes a power supply module for supplying power to the semiconductor cooling device.

[0018] Preferably, the power module is connected to the ventilation fan via connecting wires and used to supply power to the ventilation fan.

[0019] Preferably, the opening positions of the ventilation holes correspond to the installation positions of the air intake, the cooling outlet, and the heat dissipation outlet. [Effects of the Invention]

[0020] The technical proposal according to the embodiment of the present invention may include the following beneficial effects.

[0021] 1. The garment structure includes a storage pouch for attaching a semiconductor cooling device. When the user has a cooling need, the semiconductor cooling device can be placed in the storage pouch, thereby transforming it into an air-cooled cooling garment. When the user does not have a cooling need, the semiconductor cooling device can be removed from the garment structure, and the garment can be worn as regular outdoor wear, thereby improving the user experience.

[0022] 2. A heat exchange fan is provided at the cooling inlet of the semiconductor cooler, which is advantageous in further compressing the volume of the semiconductor cooling system and allows for the development of a smaller and more portable structure.

[0023] 3. A guide plate is added between the semiconductor cooler and the heat exchange fan to distribute the heat exchange amounts between the first and second heat exchangers. The total exhaust volume of the heat exchange fan is distributed according to the first and second heat exchangers, ensuring that the heat exchange amount of the hot end heat exchanger is greater than that of the cold end heat exchanger. This achieves a match between the heat exchange amount and the cooling (heating) amount, thereby improving the cooling capacity of the semiconductor cooling system.

[0024] 4. The cooling outlet and heat dissipation outlet are provided on two different sides of the case, that is, on two adjacent sides or two opposing sides of the case, which is advantageous in reducing interference between the heat dissipation airflow and the cooling airflow, achieving separation of the refrigerant field and the heat transfer fluid field, improving the cooling effect in local areas, and thereby avoiding the cooling airflow and heat dissipation airflow intersecting and short-circuiting with each other. [Brief explanation of the drawing]

[0025] [Figure 1] This is a schematic diagram of the internal structure of the back of the air-cooled cooling suit of the present invention. [Figure 2] This is a schematic diagram of the side structure of the air-cooled cooling suit of the present invention. [Figure 3] This is a schematic diagram of the outer structure of the back of the first embodiment of the air-cooled cooling suit of the present invention. [Figure 4] This is a schematic diagram of the outer structure of the back of a second embodiment of the air-cooled cooling suit of the present invention. [Figure 5] This is a schematic diagram of the structure of the semiconductor cooling device in the air-cooled cooling suit of the present invention. [Figure 6] This is a schematic diagram of the structure of the semiconductor cooler, first heat exchanger, second heat exchanger, and heat exchange fan in the air-cooled cooling suit of the present invention. [Figure 7] This is an exploded view of the structure of Embodiment 1 of the semiconductor cooling device in the air-cooled cooling suit of the present invention. [Figure 8] This is a schematic diagram of the structure of Embodiment 2 of the semiconductor cooling device in the air-cooled cooling suit of the present invention. [Figure 9] This is an exploded view of the structure of Embodiment 2 of the semiconductor cooling device in the air-cooled cooling suit of the present invention. [Figure 10] This is an exploded view of the structure of Embodiment 3 of the semiconductor cooling device in the air-cooled cooling suit of the present invention. [Figure 11] This is a schematic diagram of the structure of Embodiment 4 of the semiconductor cooling device in the air-cooled cooling suit of the present invention. [Figure 12] This is an exploded view of the structure of Embodiment 4 of the semiconductor cooling device in the air-cooled cooling suit of the present invention. [Figure 13] This is a schematic diagram of the structure of the semiconductor cooler, first heat exchanger, second heat exchanger, heat exchange fan, and air guide plate in the air-cooled cooling suit of the present invention. [Figure 14] This is a schematic diagram of the layer structure of one embodiment of the semiconductor cooler, first heat exchanger, and second heat exchanger in the air-cooled cooling suit of the present invention. [Figure 15] This is a schematic diagram of the layer structure of another embodiment of the semiconductor cooler, first heat exchanger, and second heat exchanger in the air-cooled cooling suit of the present invention. [Modes for carrying out the invention]

[0026] The embodiments of the present invention will now be described in detail. Examples of the embodiments are shown in the drawings, and the same or similar reference numerals from beginning to end represent the same or similar elements, or elements having the same or similar function. The embodiments described below with reference to the drawings are illustrative and used solely to illustrate the present invention and should not be understood as limitations on the present invention.

[0027] This technical proposal provides an air-cooled cooling suit, which includes a suit structure 8 and a semiconductor cooling device, wherein the suit structure 8 is provided with a storage bag 81, and the storage bag 81 has a plurality of ventilation holes, and the semiconductor cooling device is detachably attached to the suit structure 8 via the storage bag 81. The semiconductor cooling system includes a semiconductor cooler 1, a first heat exchanger 2, a second heat exchanger 3, a heat exchange fan 4, and a case 6, wherein the semiconductor cooler 1, the first heat exchanger 2, the second heat exchanger 3, and the heat exchange fan 4 are all mounted inside the case 6. The semiconductor cooler 1 is provided with opposing first and second end faces, the first heat exchanger 2 is connected to the first end face, the second heat exchanger 3 is connected to the second end face, both the first heat exchanger 2 and the second heat exchanger 3 are provided with heat exchange passages, and the exhaust port of the heat exchange fan 4 is provided facing the intake end of the heat exchange passage. The case 6 has an air intake 61, a cooling outlet 62, and a heat dissipation outlet 63, the first end face is the cold end face of the semiconductor cooler 1, the second end face is the hot end face of the semiconductor cooler 1, the air intake of the heat exchange fan 4 is provided close to the air intake 61, the exhaust end of the heat exchange passage of the first heat exchanger 2 is provided close to the cooling outlet 62, and the exhaust end of the heat exchange passage of the second heat exchanger 3 is provided close to the heat dissipation outlet 63. The cooling outlet 62 and the heat dissipation outlet 63 are located on two different sides of the case 6, with the cooling outlet 62 facing the inside of the garment structure 8 and the heat dissipation outlet 63 facing the outside of the garment structure 8.

[0028] To meet the user needs, particularly those of workers in high-temperature outdoor conditions, this application further provides a cooling suit including a suit structure 8 and a semiconductor cooling device, as shown in Figure 1-15, by transporting the cooling airflow generated by the semiconductor cooling device into the suit structure 8 via a cooling outlet 62, the cooling air output from the cooling outlet 62 removes some of the heat generated by the human body, thereby achieving continuous circulating cooling and cooling of the cooling suit and improving the user experience.

[0029] Specifically, the garment structure 8 of this embodiment is provided with a storage bag 81 having multiple ventilation holes (not shown), and when the user has a cooling need, the semiconductor cooling device of this embodiment can be placed in the storage bag 81, thereby transforming it into an air-cooled cooling garment. When the user does not have a cooling need, the semiconductor cooling device can be removed from the garment structure 8 and the garment can be worn as ordinary outdoor wear, which is advantageous in that it improves the user experience.

[0030] Furthermore, since cooling suits are typically used outdoors, the overall structure of semiconductor cooling devices tends to be optimized and reduced in size to improve their overall portability. However, as the structure is compressed, the cooling effect of the device is also compressed, resulting in the problem of low cooling efficiency. Based on this, this proposed technology further improves the structure of the semiconductor cooling device, and as shown in Figure 5-15, it can effectively solve the problem of low cooling efficiency in conventional semiconductor cooling systems, and also has the advantages of a rational structure and high cooling efficiency.

[0031] Specifically, as shown in Figure 5-6, the semiconductor cooling device proposed in this embodiment includes a first heat exchanger 2, a semiconductor cooler 1, a second heat exchanger 3, and a heat exchange fan 4, which are connected in order. To explain further, the semiconductor cooler 1 in this embodiment is manufactured using the Peltier effect, which refers to the phenomenon in which, when a direct current passes through an electrode made of two types of semiconductor materials, one end of the electrode absorbs heat and the other end releases heat. In other words, the semiconductor cooler 1 is manufactured using two types of semiconductor materials, forming a hot end and a cold end. The cold end achieves cooling by continuously absorbing heat, and the hot end achieves heat dissipation by continuously releasing heat.

[0032] Furthermore, in conventional semiconductor cooling systems, in order to improve the cooling effect of the semiconductor cooler 1, a cooling fan is usually provided at the cooling end of the semiconductor cooler 1, and a heat dissipation fan is usually provided at the heat dissipation end, thus requiring the cooling system to have at least two fans. In order to avoid mutual influence between the cooling airflow and the heat dissipation airflow, it is usually necessary to separate the two fans, which is a significant disadvantage in developing cooling systems to be smaller, more compact, and more portable.

[0033] Therefore, in order to further reduce the volume of the semiconductor cooling device and to develop its structure in a direction toward miniaturization and portability, in this embodiment, a heat exchange fan 4 is provided at the cooling inlet of the semiconductor cooling device 1, and specifically, the heat exchange fan 4 may be an axial fan, a centrifugal fan, or a butterfly fan.

[0034] For the sake of explanation, the first end face will be described as the cold end face of the semiconductor cooler 1. That is, during the operation of the semiconductor cooler system in this embodiment, the heat exchange fan 4 transports the heat exchange gas, and the exhaust port of the heat exchange fan 4 is provided facing the intake end of the heat exchange passage of the first heat exchanger 2 and the second heat exchanger 3. Therefore, the heat exchange gas is separated into two heat exchange airflows at the exhaust port of the heat exchange fan 4.

[0035] As the first end face is cooled, the first heat exchanger 2 and the first end face are connected, and heat conduction occurs between them, so the amount of cold energy generated at the first end face is conducted to the first heat exchanger 2. When one of the heat exchange airflows enters the heat exchange passage of the first heat exchanger 2, it carries away the amount of cold energy from the first heat exchanger 2, and a cooling airflow is generated.

[0036] As the second end face generates heat, the second heat exchanger 3 and the second end face become connected, and heat conduction occurs between them, so the amount of heat generated at the second end face is conducted to the second heat exchanger 3. When the heat exchange airflow from the other side enters the heat exchange passage of the second heat exchanger 3, it carries away the amount of heat from the second heat exchanger 3, and a heat-dissipating airflow is generated.

[0037] It should be explained that, in this embodiment, the heat exchange fan 4 is installed at the cooling inlet of the semiconductor cooler 1. Therefore, its number and spatial arrangement are more flexible than fans installed at the cooling outlet of the semiconductor cooler 1. It can be selected according to the actual usage scenario of the semiconductor cooler, such as by comprehensively considering two angles: cooling amount and volume.

[0038] More specifically, in order to avoid the cooling airflow and heat dissipation airflow generated in this invention intersecting and short-circuiting with each other, and to enable the cooling airflow generated by the semiconductor cooling device to go directly to the required cooling area with minimal attenuation, in this invention, the cooling outlet 62 and heat dissipation outlet 63 are provided on two different sides of the case 6, that is, they are located on two adjacent sides or two opposing sides of the case 6, thereby reducing interference of the heat dissipation airflow with the cooling airflow, achieving separation of the refrigerant field and the heat transfer medium field, and improving the cooling effect in local areas.

[0039] To further explain, the air intake 61 and the cooling outlet 62 are located on the same side of the case 6 and both face inward towards the body structure 8.

[0040] Furthermore, in order to improve the cooling effect of the semiconductor cooling device, in this application, as shown in Figure 1-2, it is preferable that the intake port 61 and the cooling outlet port 62 are mounted on the same side of the case 6. This is advantageous because the cooling airflow output from the cooling outlet port 62 can easily re-enter the semiconductor cooling device through the intake port 61, forming a circulating refrigerant field, achieving circulation of the cooling airflow in the space on one side of the cooling device, and improving the cooling effect in localized areas.

[0041] Since the semiconductor cooling device of this embodiment is attached to the user via the body structure 8, a small circulating refrigerant field is formed on the side of the case 6 that is close to the user's body surface while the semiconductor cooling device is operating. As a result, the cooling airflow output from the cooling outlet 62 can be directed perpendicular to the user's body surface to achieve rapid cooling. Furthermore, the cooling airflow output from the cooling outlet 62 can re-enter the semiconductor cooling device through the air intake 61, thereby achieving the objective of improving the cooling effect. Thus, the semiconductor cooling device of this embodiment can be transformed into a "handheld mini air conditioner".

[0042] To further explain, the air intake 61 is located below the air outlet 62.

[0043] In one preferred example of the above embodiment, the intake port 61 is further provided below the cooling outlet 62 in order to reduce the motion resistance of the airflow inside and outside the semiconductor cooling device, to further stabilize the use of the cooling device, and to improve reliability.

[0044] To further explain, the storage bag 81 is located on the back of the garment structure 8.

[0045] Furthermore, in order to improve the cooling effect of the cooling suit and meet the user's needs under limited electrical input power, in this embodiment, the storage bag 81 is located on the back of the suit structure 8, thereby enhancing the temperature regulating effect of the cooling suit on the human body.

[0046] To further explain, the semiconductor cooling device is installed in close proximity to or covering the Xinshu and / or Feishu acupoints of the human body.

[0047] Furthermore, since the Xinshu and Feishu acupoints on the human body have the most significant temperature regulating effect on the entire body, in this embodiment, the semiconductor cooling device is further provided in close proximity to or covering the Xinshu and / or Feishu acupoints on the human body, thereby sufficiently cooling the corresponding acupoints and increasing the cooling effect and comfort level for the human body.

[0048] To further explain, at least one of each of the storage bag 81 and the semiconductor cooling device is provided.

[0049] In this embodiment, neither the number of storage bags 81 for the air-cooled cooling suit nor the number of semiconductor cooling devices is particularly limited.

[0050] If the air-cooled cooling suit is provided with multiple storage bags 81, but only one semiconductor cooling device is installed, the user can arbitrarily select the installation location of the semiconductor cooling device according to their cooling needs, thereby achieving their specific cooling requirements.

[0051] If multiple storage bags 81 and semiconductor cooling units are provided in the air-cooled cooling suit, and the numbers match, the user can turn on multiple semiconductor cooling units simultaneously, thereby meeting the user's rapid cooling needs.

[0052] To further explain, the system further includes a ventilation fan 9 attached to the back of the garment structure 8 for transporting gas into the interior of the garment structure 8.

[0053] In the refrigerant field formed in this invention, there is airflow circulation. If some of the gas escapes from the refrigerant field, a negative pressure is formed in the refrigerant field region, causing the back portion of the garment structure to adhere more closely to the back of the body. This increases the circulation resistance of the refrigerant field and reduces the cooling sensation on the back of the body. To solve this problem, in this embodiment, a ventilation fan 9 is added to the garment structure 8. As shown in Figure 2, the ventilation fan 9 is used to replenish air from the outside and introduce it into the garment structure 8, and to form a positive pressure air field.

[0054] This positive pressure air field has two roles. Firstly, by constantly transporting air into the body structure 8, it creates a flowing airflow space between the human body and the body structure 8, achieving separation between the body structure 8 and the human body. The gas flow and circulation in the airflow space removes some of the heat from the human body, making the human body feel comfortable. Secondly, by forming a complementary effect with the refrigerant field circulation, the refrigerant field is surrounded by a positive pressure air flow field supplied from the outside, preventing the refrigerant field from diffusing to the outside, thereby achieving the maximum cooling effect for a human body with a small amount of cooling energy.

[0055] To further explain, the ventilation fan 9 is located below the semiconductor cooling device.

[0056] A preferred example of the above embodiment is that by limiting the installation position of the ventilation fan 9, it is advantageous to make full use of the surplus space in the garment structure 8, and is also advantageous in ensuring separation between the garment structure 8 and the human body, further enhancing the user's comfort.

[0057] To further explain, at least one ventilation fan 9 is provided.

[0058] In this embodiment, the number of ventilation fans 9 is not particularly limited.

[0059] In the first embodiment of this design, as shown in Figure 3, one ventilation fan 9 is provided and is located directly below the semiconductor cooling device. In the second embodiment of this design, as shown in Figure 4, two ventilation fans 9 are provided, and the two ventilation fans 9 are located on both sides below the semiconductor cooling device.

[0060] To further explain, the semiconductor cooling device further includes a power supply module 7 for supplying power to the semiconductor cooling device.

[0061] It should be explained that the power supply module in this embodiment includes a battery assembly and / or an adapter assembly, and both the battery assembly and the adapter assembly can be used to supply power to a semiconductor cooling system that includes, but is not limited to, a semiconductor cooler 1, a heat exchange fan 4, and sensors for achieving various detection functions.

[0062] In this embodiment, the semiconductor cooling device can be powered using a DC power supply or an AC power supply. To further improve the portability of the semiconductor cooling device, in this embodiment, it is preferable that the battery assembly powers the semiconductor cooling device, thereby achieving portability. It should be noted that the battery assembly in this embodiment may be a dry cell battery or a lithium battery, and is not limited thereto.

[0063] Preferably, the battery assembly is either a dry cell or a rechargeable battery, and the semiconductor cooling device in this invention may be powered by a disposable battery or a rechargeable battery, providing a variety of power supply methods and improving the flexibility of the semiconductor cooling device.

[0064] If the battery assembly is a rechargeable battery, the power module further includes a DC electrical input socket (not shown), which is connected to an adapter and used to charge the battery assembly, thereby achieving repeated use of the battery assembly and achieving environmental protection.

[0065] To further explain, the power module 7 is connected to the ventilation fan 9 via a connecting wire and is used to supply power to the ventilation fan 9.

[0066] In one preferred example of the above embodiment, the power module 7 of this embodiment may further supply power to the ventilation fan 9 through a connecting wire (not shown), thereby eliminating the need for a separate power supply for the ventilation fan 9, which in turn reduces the weight of the cooling suit and makes it easier to wear.

[0067] To further explain, the opening positions of the ventilation holes correspond to the installation positions of the air intake 61, the cooling outlet 62, and the heat dissipation outlet 63.

[0068] Furthermore, in order to ensure the efficient transport of each airflow in the semiconductor cooling device and to ensure the structural strength of the suit structure 8, thereby improving the durability of the cooling suit, in this embodiment, the opening positions of the ventilation holes in the storage bag 81 are aligned with the installation positions of the air intake 61, the cooling outlet 62, and the heat dissipation outlet 63, respectively.

[0069] Preferably, the heat dissipation outlet 63 is located at the top of the case 6.

[0070] In another preferred example of the above embodiment, the heat dissipation outlet 63 is further provided at the top of the case 6 in order to reduce the motion resistance of the internal and external airflow of the semiconductor cooling device and to make the use of the cooling device more stable and reliable.

[0071] Preferably, at least one of each of the intake port 61, the cooling outlet 62, and the heat dissipation outlet 63 is provided.

[0072] In this embodiment, the number of air intakes 61, cooling outlets 62, and heat dissipation outlets 63 is not limited, and can be selected according to the actual usage scenario of the semiconductor cooling device, such as by comprehensively considering two factors: cooling effect and structural strength.

[0073] It should be explained that the intake port 61, cooling outlet 62, and heat dissipation outlet 63 of this embodiment may each include a plurality of corresponding small intake holes, small cooling holes, and small heat dissipation holes in order to ensure timely intake and discharge of airflow inside and outside the cooling unit.

[0074] In Embodiment 1 of this design, as shown in Figure 7, there is one cooling outlet 62 and one heat dissipation outlet 63, both located on two opposing sides of the case 6, and the arrows shown in the figure indicate the direction of airflow inside and outside the semiconductor cooling device in this embodiment.

[0075] In Embodiment 2 of this design, as shown in Figure 8-9, there is one cooling outlet 62 and one heat dissipation outlet 63, both located on two adjacent sides of the case 6, and the arrows shown in the figure indicate the direction of airflow inside and outside the semiconductor cooling device in this embodiment.

[0076] In Embodiment 3 of this design, as shown in Figure 10, there are two cooling outlets 62 and one heat dissipation outlet 63. The heat dissipation outlet 63 and one of the cooling outlets 62 are located on two opposing sides of the case 6, while the heat dissipation outlet 63 and the other cooling outlet 62 are located on two adjacent sides of the case 6. The arrows shown in the figure indicate the direction of airflow inside and outside the semiconductor cooling device in this embodiment.

[0077] In Embodiment 4 of this design, as shown in Figure 11-12, there are two heat dissipation outlets 63 and one cooling outlet 62. The cooling outlet 62 and one of the heat dissipation outlets 63 are located on two opposing sides of the case 6, while the cooling outlet 62 and the other heat dissipation outlet 63 are located on two adjacent sides of the case 6. The arrows shown in the figure indicate the direction of airflow inside and outside the semiconductor cooling device in this embodiment.

[0078] Preferably, the semiconductor cooling device further includes a temperature sensor attached to the air intake port 61.

[0079] Furthermore, since a heat exchange fan 4 is added to the semiconductor cooling device in this embodiment, this semiconductor cooling device has not only the function of a "small air conditioner" but also the function of a "small fan," and by reversing the direction in which the current is supplied to the semiconductor cooler 1, it can be given the function of a "small hot air fan."

[0080] In order for the semiconductor cooling device to switch between two functions, or even three functions, such as a "small air conditioner" and a "small fan," in this embodiment, a temperature sensor (not shown) for detecting the temperature of the heat exchange gas is further provided at the air intake 61. This allows the user to switch the relevant function based on the temperature sensor's detection result, or the processor of the semiconductor cooling device to switch the relevant function based on the temperature sensor's detection result.

[0081] Preferably, the temperature sensor is electrically connected to the semiconductor cooler 1.

[0082] In one preferred example of the above embodiment, the temperature sensor can be electrically connected to the semiconductor cooler 1, and the semiconductor cooler 1 can improve the degree of intelligence of the semiconductor cooler by adjusting its operating parameters based on the detection results of the temperature sensor, including but not limited to the on / off state of the semiconductor cooler 1 and the operating voltage of the semiconductor cooler 1.

[0083] Preferably, the temperature sensor is electrically connected to the semiconductor cooler 1 and the heat exchange fan 4.

[0084] In another preferred example of the above embodiment, the temperature sensor can be electrically connected to the semiconductor cooler 1 and the heat exchange fan 4, and the semiconductor cooler 1 and the heat exchange fan 4 can improve the degree of intelligence of the semiconductor cooler by adjusting their operating parameters based on the detection results of the temperature sensor, including but not limited to the on / off state of the semiconductor cooler 1 and the heat exchange fan 4 and the operating voltage of the semiconductor cooler 1 and the heat exchange fan 4.

[0085] Preferably, the semiconductor cooling device further includes a humidity sensor attached to the cooling outlet 62 or the heat exchange passage of the first heat exchanger 2.

[0086] Furthermore, during operation of the semiconductor cooling system in this embodiment, condensed water accumulates on the surface of the first heat exchanger 2, which is attached to the cold end surface of the semiconductor cooler 1. In order to avoid the effect of the falling condensed water on the normal operation of other components in the cooling system, in this embodiment, the heat exchange fan 4 can also blow directly onto the first heat exchanger 2 after the cooling operation has finished, thereby blowing away the condensed water from the surface of the first heat exchanger 2 or drying the condensed water on the surface of the first heat exchanger 2.

[0087] Furthermore, in order to improve the controllability of the semiconductor cooling system, in this embodiment, a humidity sensor (not shown) may be installed in the cooling outlet 62 or the heat exchange passage of the first heat exchanger 2, thereby allowing the user to control the on / off status of the heat exchange fan based on the detection result of the humidity sensor, or the processor of the semiconductor cooling system to control the on / off status of the heat exchange fan based on the detection result of the humidity sensor.

[0088] Preferably, the humidity sensor is electrically connected to the heat exchange fan 4.

[0089] In one preferred example of the above embodiment, the humidity sensor can be electrically connected to the heat exchange fan 4, and the heat exchange fan 4 can improve the degree of intelligence of the semiconductor cooling device by adjusting its operating parameters based on the detection results of the humidity sensor, including but not limited to the on / off state of the heat exchange fan 4 and the operating voltage of the heat exchange fan 4.

[0090] Preferably, the semiconductor cooling device further includes a usage status detection sensor electrically connected to the power supply module for detecting whether the semiconductor cooling device is in use or idle.

[0091] When a semiconductor cooling system uses a DC power supply, in order to improve the effective operating range of the power supply, and when a semiconductor cooling system uses an AC power supply, in order to conserve energy and avoid unnecessary energy consumption by the cooling system when it is not in use, in this embodiment, a usage status detection sensor (not shown) is further added to the semiconductor cooling system to detect whether the semiconductor cooling system is in use or idle, thereby achieving the objectives of energy conservation and environmental protection.

[0092] Preferably, the usage state detection sensor is an infrared sensor and is located on the same side as the cooling outlet 62 and the case 6.

[0093] A preferred example of the above embodiment is that the usage status detection sensor is an infrared sensor, which has a simple structure and is easy to install.

[0094] Preferably, the usage state detection sensor is a posture sensor.

[0095] Another preferred example of the above embodiment is to use a state detection sensor as an attitude sensor, which provides high detection accuracy.

[0096] Preferably, at least one heat exchange fan 4 is provided.

[0097] In order to further reduce the volume of the semiconductor cooling device and make it lighter, it is preferable that the number of heat exchange fans 4 be one in this embodiment.

[0098] Preferably, the system further includes an air guide plate 5 provided between the semiconductor cooler 1 and the heat exchange fan 4.

[0099] For semiconductor coolers, the cooling capacity Q c Heat generation Q h and electrical input power P i Q h =Q c +P i=(1 + 1 / cop)Q c satisfies the condition, where cop is the coefficient of performance, i.e., cop = Q c / P i is. Due to the low conversion efficiency of the semiconductor cooler, when cop = 0.5, Q h = 3Q c is, that is, as the temperature difference between the cold end and the warm end of the cooler increases, the cop value decreases, and vice versa. From this, it can be seen that the heat exchange amount Q h at the warm end of the semiconductor cooler is much higher than the heat exchange amount Q c at the cold end.

[0100] Therefore, in one embodiment, when the first heat exchanger 2 and the second heat exchanger 3 of this aspect share the same heat exchange fan 4, in order to achieve an optimal cooling effect, the heat exchange amount at the warm end must be higher than the heat exchange amount at the cold end. To meet the above conditions, in this aspect, as shown in FIG. 13, further, between the semiconductor cooler 1 and the heat exchange fan 4, a wind guide plate 5 for distributing the heat exchange amounts of the first heat exchanger 2 and the second heat exchanger 3 is added, and the total exhaust air volume of the heat exchange fan 4 is distributed corresponding to the first heat exchanger 2 and the second heat exchanger 3, ensuring that the heat exchange amount of the heat exchanger at the warm end is greater than the heat exchange amount of the heat exchanger at the cold end, thereby realizing the matching of the heat exchange amount and the cooling (heating) amount, and achieving the purpose of improving the cooling amount of the semiconductor cooling device.

[0101] It should be noted that in this application, the inclination angle, area, and structural shape of the wind guide plate 5 are not limited, and it can be selected according to the actual use scenario of the semiconductor cooling device, such as comprehensively considering the two angles of the cooling amount and the volume.

[0102] Preferably, the wind guide plate 5 is provided with a hinge end 51, and the hinge end 51 is provided close to the semiconductor cooler 1, and the wind guide plate 5 swings around the hinge end 51 as an axis.

[0103] In one preferred example of this embodiment, the air guide plate is designed as a swingable plate-like structure, which makes it easier to match the first heat exchanger 2 and the second heat exchanger 3 with heat exchange fans 4 of different exhaust volumes during the production process of the cooling system, thereby improving the applicability of the assembly process. Furthermore, during the use of the semiconductor cooling system, the user can adjust the heat exchange volume of the first heat exchanger 2 and the second heat exchanger 3 according to their own usage needs, thereby meeting their individual needs.

[0104] Preferably, the hinge end 51 is connected to the semiconductor cooler 1.

[0105] In some embodiments, the hinge end 51 of the air guide plate 5 is further connected to the semiconductor cooler 1 to effectively separate the two heat exchange airflows of the heat exchange fan 4 and improve the accuracy of adjusting the amount of cooling (heating)

[0106] Preferably, the first heat exchanger 2 and the second heat exchanger 3 have the same structure and are provided symmetrically with respect to the semiconductor cooler 1.

[0107] Furthermore, in order to avoid the generation of stress inside the semiconductor cooling device during production or use due to the asymmetry of its mechanical structure, which could affect the stability of the product's operation, this embodiment further employs a heat exchanger structure that is symmetrical to the first heat exchanger 2 and the second heat exchanger 3, thereby further improving the stability and reliability of the semiconductor cooling device 1's operation.

[0108] Preferably, both the first heat exchanger 2 and the second heat exchange plate 3 include a heat exchange plate 21 and a heat exchange fin 22. The heat exchange plate 21 of the first heat exchanger 2 is connected to the first end face, and the heat exchange plate 21 of the second heat exchanger 3 is connected to the second end face. Multiple heat exchange fins 22 are provided, and the multiple heat exchange fins 22 are attached to the outer wall of the heat exchange plate 21 with gaps between them, and a heat exchange passage is provided between two adjacent heat exchange fins 22.

[0109] Furthermore, both the first heat exchanger 2 and the second heat exchanger 3 in this embodiment employ a structural form that combines a heat exchange plate 21 and heat exchange fins 22 to achieve cooling and heat dissipation of the heat exchange gas, resulting in a simple structure and reliable performance. Multiple heat exchange fins 22 are attached at intervals to the outer wall of the heat exchange plate 21, forming a through-hole heat exchange channel to guide the air, increasing the contact area between the heat exchange airflow and the heat exchangers (2, 3), accelerating heat exchange between the surrounding environment and the heat exchangers (2, 3), thereby improving the cooling speed of the semiconductor cooler.

[0110] Preferably, the heat exchange plate 21 and the heat exchange fins 22 both extend along the vertical direction, and the heat exchange fan 4 is attached to the bottom of the semiconductor cooler 1.

[0111] Furthermore, based on semiconductor cooling theory, the cooling capacity Q of semiconductor cooler 1 c The following applies:

[0112] Q c =N(α p -α n )IT c -K(T h -T c )-0.5I 2 R i , N, α p , α n I, K, T h , T c , R i These are the number of PN couple crystal grains, the Seebeck coefficient of the p-type material, the Seebeck coefficient of the n-type material, the operating current, the thermal conductivity of the cooler, the hot-end temperature, the cold-end temperature, and the internal resistance of the semiconductor cooler 1, respectively, and the cooling coefficient (also called conversion efficiency) is cop = Q c / P i And P i This is the electrical input power of the semiconductor cooler 1. From this, both the cooling amount and cooling efficiency of the semiconductor cooler 1 are equal to the hot edge temperature T of the semiconductor cooler 1. h It correlates with, and if other parameters are relatively fixed, T h The smaller the value, the lower the hot-end temperature of the semiconductor cooler 1, and the cooling amount Q.c It can be seen that the larger the cop, the higher the cooling effect. Therefore, one solution to increase the cooling capacity of the cooling device is to increase the hot edge temperature T of the semiconductor cooler 1. h This is to reduce the hot edge temperature T h The most direct way to reduce the temperature is to improve the heat dissipation effect of the semiconductor cooler 1. Therefore, in order to improve the heat dissipation effect of the semiconductor cooler 1, in this embodiment the cooling effect of the semiconductor cooler 1 is improved by further optimizing the extension direction of the heat exchange plate 21 and the heat exchange fins 22 and accelerating heat dissipation.

[0113] Preferably, the first heat exchanger 2 is welded or bonded to the first end face, and the second heat exchanger 3 is welded or bonded to the second end face.

[0114] Compared to the mechanical connection structure of conventional technology, this embodiment employs a welding or adhesive joining structure between the semiconductor cooler 1 and the heat exchangers (2, 3) at both ends, thereby ensuring effective joining between the semiconductor cooler 1 and the heat exchangers, and further ensuring that the amount of cooling and heating generated in the semiconductor cooler 1 can be output directly and effectively, avoiding the loss of cooling and heating in mechanical connection structures, solving the problem of low cooling efficiency in conventional semiconductor cooling devices, and offering the advantages of a rational structure and high cooling efficiency.

[0115] Furthermore, omitting the mechanical connection structure further reduces the risk of thermal short circuits caused by the mechanical connection structure between the cold end and the hot end of the semiconductor cooler 1, improving the cooling capacity and conversion efficiency of the semiconductor cooler, as well as improving the consistency and stability of product quality.

[0116] It should be explained that in this embodiment, a welded connection means a semiconductor cooling assembly that can be integrated between the semiconductor cooler 1 and the two heat exchangers by ordinary solder welding, and an adhesive connection means a semiconductor cooling assembly that can be integrated between the semiconductor cooler 1 and the two heat exchangers by curing with an ordinary thermally conductive adhesive.

[0117] Preferably, the semiconductor cooler 1 includes a first substrate, PN pair crystal grains 11 and a second substrate connected in order, and the outer surface of the first substrate is the first end face, and the outer surface of the second substrate is the second end face. Both the first substrate and the second substrate are either a metal substrate 12 or a ceramic substrate 13.

[0118] Furthermore, the semiconductor cooler 1 in this embodiment includes a first substrate, PN couple crystal grains 11, and a second substrate connected in order, and to facilitate a more detailed explanation, the first substrate is designated as the cooling end and the second substrate as the heat dissipation end.

[0119] During the operation of the semiconductor cooler 1 in this embodiment, an electric current is passed through the PN couple crystal grains 11. When an electric current is passed through the PN couple crystal grains 11, the amount of heat generated by the current is transferred from the first substrate to the second substrate. As a result, the first substrate begins to cool, and the second substrate begins to dissipate heat. During the cooling process of the first substrate, the amount of cooling heat generated by the first substrate is gradually conducted to the first heat exchanger 2, thereby achieving the cooling effect.

[0120] In one preferred embodiment of this technology, both the first and second substrates may be either a metal substrate 12 or a ceramic substrate 13. That is, both the first and second substrates may be either a metal substrate 12 or a ceramic substrate 13. Furthermore, if the first substrate is a metal substrate 12, the second substrate may be a ceramic substrate 13, and if the first substrate is a ceramic substrate 13, the second substrate may be a metal substrate 12. It should be noted that the specific selection of the first and second substrates can be made according to the actual usage scenario of the semiconductor cooling device, taking into account both thermal conductivity matching and cost performance.

[0121] Preferably, the metal substrate 12 includes an insulating layer 121 and a metal substrate layer 122 arranged in order from the inside to the outside, and the metal substrate layer 122 is a copper layer or an aluminum layer.

[0122] As shown in Figure 14, the metal substrate 12 used in this embodiment preferably includes at least a two-layer structure, and the material of the metal substrate layer 122 is preferably copper or aluminum.

[0123] Preferably, the ceramic substrate 13 includes a ceramic substrate layer 131 and a metal coating layer 132 arranged in order from the inside to the outside, and the metal coating layer 132 is a copper layer or a molybdenum manganese alloy layer.

[0124] As shown in Figure 15, the ceramic substrate 13 used in this embodiment preferably includes at least a two-layer structure, and the material of the metal coating layer 132 is preferably copper or a molybdenum-manganese alloy.

[0125] Preferably, the ceramic substrate layer 131 includes a plurality of ceramic base plates, the plurality of ceramic base plates are spliced ​​together to form the ceramic substrate layer 131, and stress gaps remain between the ceramic base plates.

[0126] The cooling capacity of the semiconductor cooler 1 is directly proportional to the number of pairs of PN couple crystal grains 11, and is simultaneously limited by the thermal conductivity coefficient of the ceramic substrate, the density of the heat medium at the hot edge of the semiconductor cooler 1, and the integration process level of the PN couple crystal grains. Because there is a certain limit to the degree of integration of PN couple crystal grains 11 in the semiconductor cooler 1, there is a positive correlation between the cooling capacity of the semiconductor cooler 1 and the substrate area; that is, the larger the cooling capacity of the semiconductor cooler 1, the larger the substrate area. On the other hand, welding a large-area substrate to a heat exchanger generates large stresses inside the semiconductor cooler 1.

[0127] Since the ceramic substrate layer 131 is highly brittle and difficult to achieve like the tough metal substrate layer 122, the influence of the internal pressure of the semiconductor cooler 1 on product stability can be effectively reduced. Therefore, in order to effectively release the internal stress of the ceramic substrate 13 and improve the stability and reliability of the semiconductor cooler 1 during operation, in this embodiment, the ceramic substrate layer 131 in the ceramic substrate 13 is spliced ​​with a plurality of ceramic base plates, and a stress gap (not shown) is left between the ceramic base plates to release internal stress, and a metal coating layer 132 is coated on its outer surface, thereby obtaining a complete ceramic substrate 13.

[0128] It should be explained that the more ceramic base plates there are per unit area, the lower the internal stress in the ceramic substrate 13, and the greater the stability and reliability of the semiconductor cooler 1 during operation. However, the selection of the number of ceramic base plates in the ceramic substrate 13 must be made according to the actual usage scenario of the semiconductor cooler, taking into account both the magnitude of the internal stress and the circuit layout in the semiconductor cooler 1.

[0129] Preferably, the ceramic base plate and the hot end of the PN coupler crystal grain 11 are bonded together.

[0130] Since condensation may accumulate at the cold end of the semiconductor cooler 1 during operation, in order to avoid the effect of condensation accumulation on the normal operation of the PN couple crystal grains 11, it is preferable in this embodiment to further improve the stability and reliability of the operation of the semiconductor cooler 1 by using the stress structure of the ceramic substrate 13 at the hot end of the PN couple crystal grains 11.

[0131] Preferably, the area of ​​the ceramic base plate is ≥ 300 cm². 2 That is the case.

[0132] In one more preferred embodiment of this technology, the minimum area of ​​a single ceramic base plate is optimized to achieve both ease of production and reliability for the semiconductor cooler 1.

[0133] Preferably, multiple pairs of PN couple crystal grains 11 are provided, and the occupied area of ​​each pair of PN couple crystal grains 11 is 0.05 to 0.1 mm². 2 That is the case.

[0134] In another, more preferred embodiment of this technology, the degree of integration of the PN pair crystal grains 11 is further optimized to achieve both the cooling capacity and integration difficulty of the semiconductor cooler 1.

[0135] Preferably, the semiconductor cooler 1 is located in the center of the hot-end heat exchanger, and the hot-end heat exchanger is either the first heat exchanger 2 or the second heat exchanger 3.

[0136] Based on semiconductor cooling theory, the cooling capacity Q of semiconductor cooler 1 c The following applies:

[0137] Q c =N(α p -α n )IT c -K(T h -T c )-0.5I 2 R i , N, α p , α n I, K, Th , T c , R i These are the number of PN couple crystal grains, the Seebeck coefficient of the p-type material, the Seebeck coefficient of the n-type material, the operating current, the thermal conductivity of the cooler, the hot-end temperature, the cold-end temperature, and the internal resistance of the semiconductor cooler 1, respectively, and the cooling coefficient (also called conversion efficiency) is cop = Q c / P i And P i This is the electrical input power of the semiconductor cooler 1. From this, both the cooling amount and cooling efficiency of the semiconductor cooler 1 are equal to the hot edge temperature T of the semiconductor cooler 1. h It correlates with, and if other parameters are relatively fixed, T h The smaller the value, the lower the hot-end temperature of the semiconductor cooler 1, and the cooling amount Q. c It can be seen that the larger the cop, the higher the cooling effect. Therefore, one solution to increase the cooling capacity of the cooling device is to increase the hot edge temperature T of the semiconductor cooler 1. h This is to reduce the hot edge temperature T h The most direct way to reduce the temperature is to improve the heat dissipation effect of the semiconductor cooler 1. Therefore, in order to improve the heat dissipation effect of the semiconductor cooler 1, in this embodiment the semiconductor cooler 1 is further attached to the center of the heat exchanger at the hot end.

[0138] Preferably, the shape of the heat exchange plate 21 of the hot end heat exchanger is one of a circle, square, ellipse, or rectangle, and the hot end heat exchanger is either the first heat exchanger 2 or the second heat exchanger 3.

[0139] Furthermore, in order to ensure the heat dissipation effect of the semiconductor cooler 1, this embodiment further optimizes the shape of the heat exchange plate 21 of the hot end heat exchanger to achieve both the heat dissipation effect and the difficulty of processing the heat exchanger. In some embodiments, in this embodiment, it is more preferable that the shape of the heat exchange plate 21 of the hot end heat exchanger is circular or square.

[0140] Preferably, the shape of the heat exchange plate 21 of the hot end heat exchanger is rectangular, and its length is L and its width is D, L / D ≤ ​​2.

[0141] In another embodiment, if the shape of the heat exchange plate 21 of the hot-end heat exchanger must be manufactured as a rectangle due to limitations in processing conditions or mounting position, the aspect ratio of the heat exchange plate 21 may be optimized to overcome minute defects caused by the shape of the heat exchange plate 21.

[0142] Furthermore, the terms used herein are not intended to limit the exemplary embodiments of this application, but are used solely to describe specific embodiments. As used herein, the singular form is also intended to include the plural form unless the context specifically indicates otherwise, and it should be understood that when the terms “includes” and / or “equipment” are used herein, it also indicates the presence of features, steps, operations, devices, assemblies, and / or combinations thereof.

[0143] Unless otherwise specified, the relative arrangement of components and steps, numerical formulas, and numerical values ​​described in these embodiments do not limit the scope of the invention. Furthermore, for the sake of clarity, it should be understood that the dimensions of each part shown in the drawings are not based on actual proportional relationships. While techniques, methods, and apparatus known to those skilled in the art may not be discussed in detail, where appropriate, such techniques, methods, and apparatus should be considered part of the patented specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as illustrative only, not as limitations. Therefore, other examples of the exemplary embodiments may have different values. However, since similar symbols and letters represent similar terms in subsequent drawings, once a term is defined in a drawing, it does not need to be discussed further in subsequent drawings.

[0144] In the description of this invention, the directional terms, such as "front, back, up, down, left, right," "side, up, vertical, horizontal," and "top, bottom," etc., refer to directional or positional relationships that are typically based on drawings and are solely for the purpose of explaining and simplifying the invention. Unless otherwise stated, these directional terms do not indicate or imply that the device or element they refer to must be constructed and operate in a specific direction or orientation, and therefore should not be understood as limiting the scope of protection of this invention. The directional terms "inside" and "outside" refer to the inside and outside relative to the contour of each component itself.

[0145] For the sake of clarity, spatial relative terms such as "above," "above," "on top," and "above" can be used here to describe the spatial positional relationship between one device or feature and another device or feature, as shown in the diagram. It should be understood that spatial relative terms are intended to include different orientations in use or operation of a device other than the orientation described in the diagram. For example, if the device in the drawing is upside down, a device described as "above another device or structure" or "on top of another device or structure" would later be positioned as "below another device or structure" or "below another device or structure." Therefore, the exemplary term "above" could include two orientations: "above" and "below." This device could also be positioned in other different ways (90-degree rotation or other orientations), which would appropriately explain the spatial relative descriptions used here.

[0146] Furthermore, using terms such as "first" and "second" to specify the parts is solely for the purpose of making it easier to distinguish between corresponding parts, and unless otherwise explained, these terms have no special meaning and cannot be understood as limiting the scope of protection of the present invention.

[0147] Furthermore, the terms "First," "Second," etc., used in the specification, claims, and drawings of this application are for distinguishing similar objects and are not necessary to describe a specific order or priority. It should be understood that the data used in this manner are interchangeable where appropriate so that the embodiments of this application described herein can be carried out in an order other than those illustrated or described herein.

[0148] The technical principles of the present invention have been described above in relation to specific embodiments. These descriptions are for the sole purpose of understanding the principles of the present invention and should not be interpreted in any way as limiting the scope of protection of the present invention. Based on the interpretation herein, those skilled in the art can conceive of other specific embodiments of the present invention without any creative work, and these embodiments fall within the scope of protection of the present invention. [Explanation of symbols]

[0149] Semiconductor cooler 1, PN couple crystal grains 11, metal substrate 12, insulating layer 121, metal substrate layer 122, ceramic substrate 13, ceramic substrate layer 131, metal coating layer 132, first heat exchanger 2, heat exchange plate 21, heat exchange fins 22, second heat exchanger 3, heat exchange fan 4, air guide plate 5, hinge end 51, case 6, air intake 61, cooling outlet 62, heat dissipation outlet 63, power module 7, body structure 8, storage bag 81, ventilation fan 9.

Claims

1. An air-cooled cooling suit comprising a suit structure and a semiconductor cooling device, wherein the suit structure is provided with a storage bag, and the storage bag has a plurality of ventilation holes, and the semiconductor cooling device is detachably attached to the suit structure via the storage bag. The semiconductor cooling system includes a semiconductor cooler, a first heat exchanger, a second heat exchanger, a heat exchange fan, and a case, wherein the semiconductor cooler, the first heat exchanger, the second heat exchanger, and the heat exchange fan are all mounted inside the case. The semiconductor cooler is provided with opposing first and second end faces, the first heat exchanger is connected to the first end face, the second heat exchanger is connected to the second end face, both the first and second heat exchangers are provided with heat exchange passages, and the exhaust port of the heat exchange fan is provided facing the intake end of the heat exchange passage. The case has an air intake, a cooling outlet, and a heat dissipation outlet, the first end face is the cold end face of the semiconductor cooler, the second end face is the hot end face of the semiconductor cooler, the air intake of the heat exchange fan is provided close to the air intake, the exhaust end of the heat exchange passage of the first heat exchanger is provided close to the cooling outlet, and the exhaust end of the heat exchange passage of the second heat exchanger is provided close to the heat dissipation outlet. An air-cooled cooling suit characterized in that the cooling outlet and the heat dissipation outlet are located on two different sides of the case, the cooling outlet faces the inside of the suit structure, and the heat dissipation outlet faces the outside of the suit structure.

2. The air-cooled cooling suit according to claim 1, characterized in that the air intake and the cooling outlet are located on the same side of the case and both face inward towards the interior of the suit structure.

3. The air-cooled cooling suit according to claim 2, characterized in that the air intake is located below the cooling outlet.

4. The air-cooled cooling suit according to claim 1, characterized in that the storage bag is located on the back of the suit structure.

5. The air-cooled cooling suit according to claim 4, characterized in that the semiconductor cooling device is installed in close proximity to or covering the Xinshu and / or Lengshu acupoints of the human body.

6. The air-cooled cooling suit according to claim 1, characterized in that at least one of the storage bag and the semiconductor cooling device is provided.

7. The air-cooled cooling suit according to claim 1, further comprising a ventilation fan attached to the back of the suit structure for transporting gas into the interior of the suit structure.

8. The air-cooled cooling suit according to claim 7, characterized in that the ventilation fan is located below the semiconductor cooling device.

9. The air-cooled cooling suit according to claim 7, characterized in that at least one ventilation fan is provided.

10. The air-cooled cooling suit according to claim 7, wherein the semiconductor cooling device further includes a power supply module for supplying power to the semiconductor cooling device.

11. The air-cooled cooling suit according to claim 10, characterized in that the power module is connected to the ventilation fan via a connecting wire and used to supply power to the ventilation fan.

12. The air-cooled cooling suit according to claim 1, characterized in that the opening positions of the ventilation holes correspond to the installation positions of the air intake, the cooling outlet, and the heat dissipation outlet.

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