Heat exchanger for liquid coolants

Abstract

A heat exchanger for transferring heat from a first isolated coolant liquid to a second isolated coolant liquid, comprising: a first set of ports for receiving and outputting the first coolant liquid; a second set of ports for receiving and outputting the second coolant liquid; a third set of ports for receiving and outputting the second coolant liquid, wherein the second set of ports and the third set of ports are in communication within the exchanger to allow the flow of the second coolant liquid between them; a thermal interface for transferring heat between the first coolant liquid received by the first set of ports and the second coolant liquid received by the second set of ports and / or the third set of ports; and a flow limiter that is adjustable or selectively configured to limit the flow of the second coolant liquid to and / or from the thermal interface without limiting the flow of the second coolant liquid between the second set of ports and the third set of ports.

Description

Technical Field

[0001] Technical Field of the Disclosure The present disclosure relates to heat exchangers, modules for cooling electronic components comprising such heat exchangers, and methods for constructing heat exchangers.

[0002] Background of the Disclosure In computers, servers, or other devices used for data processing (referred to as IT: Information Technology), there are several electronic devices called integrated circuits (ICs). The electronic devices within the integrated circuit can include a central processing unit (CPU), an application specific integrated circuit (ASIC), a graphical processing unit (GPU), a random access memory (RAM), and the like. Each of these devices generates heat during use. In order to maintain the devices at an optimal temperature for proper operation, this heat needs to be dissipated from the devices. As the processing power of IT increases and thus the number of electronic devices within a computer, server, or other IT increases, the problem of adequately removing the heat generated by the electronic devices increases.

[0003] Electronic devices typically mounted on a printed circuit board (PCB) are usually housed or encapsulated within a case, housing, or chassis to form an electronic module. A computer server system often comprises a plurality of electronic modules that are mounted in a rack and interconnected to provide the required IT facilities. In order to maintain the electronic devices within the chassis at an appropriate temperature, a method for removing heat from each case or chassis is required.

[0004] It is common practice to cool electronic modules by circulating air over or inside each case or chassis. The airflow may be sufficient to remove some heat from within the enclosure to the surrounding environment. Until recently, this cooling method was used almost exclusively in mass-produced IT and server equipment. However, as the size of the technology decreases for the same computing performance, it has been found that the heat generated by electronic devices increases, even as the footprint decreases. Therefore, the peak performance of IT systems is limited or restricted by the limitations of cooling electronic modules with air cooling systems.

[0005] Therefore, more complex systems and methods have been proposed for cooling electronic modules. In some cases, liquid cooling is used, where a liquid coolant flows over or near a heatsink coupled to the electronic device. The heat can then be transferred away from the electronic device to a region or element that can remove the heat from the liquid coolant. Liquid cooling can, in some cases, provide a more efficient transfer of heat from the electronic device or component, and therefore can provide greater cooling power than air cooling systems. However, modern liquid cooling systems often use customized systems, which can be complex and expensive to install. Furthermore, improvements in cooling performance are always desired.

[0006] International Publication No. 2022 / 106582 (assigned in common with this disclosure) discusses a method in which immersion cooling based on a dielectric coolant can be combined with a cold plate supplied by a second liquid coolant, such as a water-based coolant. Heat can be transferred from the dielectric coolant to the second liquid coolant in a heat exchanger, which is advantageously located in the same chassis as the immersion coolant being cooled and the electronic equipment. The second liquid coolant is typically supplied from outside the chassis, for example, from the water supply system of a building or facility.

[0007] To support this method, a heat exchanger having six ports, such as a plate heat exchanger, is also disclosed. The ports are a combination of inlet and outlet ports. The heat exchanger may comprise a first chamber through which a first liquid coolant flows and a second chamber through which a second liquid coolant flows, and the first and second chambers are separated by a thermal conductive interface. Heat can pass through the thermal conductive interface from the first liquid coolant to the second liquid coolant, or from the second liquid coolant to the first liquid coolant, depending on the temperature gradient across the thermal conductive interface. The six ports may be arranged across each of the first and second chambers, and each of the first and second chambers has at least one inlet port and at least one outlet port.

[0008] One useful implementation of this heat exchanger is to provide a second chamber having at least two paths through which a second liquid coolant flows. A path can be thought of as a route or passage through a chamber having a specific starting point (input) and ending point (output). Different paths have different combinations of starting points (inputs) and ending points (outputs), although some of the individual inputs and outputs may be shared or common to different paths. Each chamber of the heat exchanger can be thought of as a region that is fluidically connected within the chamber but fluidly isolated from any other chamber. Different paths through a chamber are fluidically connected, but a particular pair of paths through the same chamber does not necessarily join or intersect at any point (they may instead be joined via another path within the same chamber).

[0009] For example, the second chamber may have two paths for the second liquid coolant to pass through: a first path from the first inlet port to the first outlet port, and a second path from the first inlet port to the second outlet port. A third path from the second inlet port to the second outlet port may also be provided. In other words, the second liquid coolant may flow into the heat exchanger through a thermally conductive interface and then out of the heat exchanger, or it may flow into and out of the heat exchanger without flowing through a thermally conductive interface.

[0010] In this regard, refer to Figure 1, which shows a top view of an exemplary module (server) having a 6-port heat exchanger similar to Figure 20A in International Publication No. 2022 / 106582. Referring to Figure 2, an isometric view of the module in Figure 1 is also shown. The module comprises a chassis 2, a heat exchanger 1, a cold plate 3, a pump 9, piping 8, and a dielectric (primary) coolant heat sink 21. Specifically, in this example, two cold plates 3 and two heat sinks 21 are shown. The heat exchanger 1 comprises three pairs of ports, namely a dielectric coolant input port 30, a dielectric coolant output port 31, a first secondary coolant input port 7, a first secondary coolant output port 9, a second secondary coolant output port 5, and a second secondary coolant input (return flow) port 12. The first secondary coolant input port 7 is also shown together with an external connector 10. The heat exchanger 1 is a plate heat exchanger having a heat transfer interface in the form of plates 4.

[0011] In the favorable operating mode, the dielectric coolant is received by the pump 9 and flows into the heat exchanger 1 via the dielectric coolant input port 30. It is cooled by the plate 4 and flows out to the dielectric coolant heat sink 21 from the dielectric coolant output port 31. The dielectric coolant heat sink 21 operates as described in International Publication No. 2019 / 048864. The dielectric coolant overflowing from the dielectric coolant heat sink 21 cools other heat-generating components and accumulates in the chassis before being pumped back into the heat exchanger 1. This forms a dielectric coolant loop.

[0012] The secondary coolant is received by the heat exchanger 1 via the first secondary coolant input port 7. A portion of this secondary coolant passes through the plate 4 (thus cooling the dielectric coolant) and then exits the heat exchanger 1 via the first secondary coolant output port 9. Another portion of the secondary coolant flows through the heat exchanger to the second secondary coolant output port 5, from where it flows through piping 8 to the cold plate 3. The return flow from the cold plate 3 enters the heat exchanger 1 via the second secondary coolant input port 12 and then exits the heat exchanger 1 via the secondary coolant output port 9. The secondary coolant exiting from the secondary coolant output port 9 may be directed to an external heat exchanger (not shown) where the coolant is cooled and then returned to the heat exchanger 1 via the first secondary coolant input port 7. This flow of secondary coolant can be described as a secondary coolant loop.

[0013] Therefore, this operating mode provides the ability to cool one or more cold plates 3 by directly introducing a low-temperature equipment coolant into the chassis 2 without the coolant needing to flow through the plate 4 and without heat being transferred from the dielectric side of the heat exchanger, thus preventing the coolant from being unnecessarily heated.

[0014] This is an efficient and effective cooling method. Improving it to handle a wider variety of applications and implementations remains a challenge.

[0015] Summary of Disclosure Against this backdrop, the heat exchanger described in claim 1 is provided. A module for cooling electronic components is also provided according to claim 9. Furthermore, a method for configuring a heat exchanger for transferring heat from a first coolant to a second coolant is provided according to claim 13. Other claims define advantageous features and / or more detailed features.

[0016] In one embodiment, a heat exchanger (or a method of configuring such a heat exchanger) having at least six ports is considered, wherein a first pair of ports is provided for a primary fluid (not necessarily, but typically a liquid coolant), and second and third pairs of ports are provided for a secondary fluid (likewise generally a liquid coolant). The heat exchanger has a thermal interface for transferring heat between the primary and secondary fluids, and at least some of the coolant flows between the second and / or third pairs of ports and the thermal interface, which is, for example, a heat transfer plate. Furthermore, the heat exchanger can allow some of the secondary fluid to pass between the second and third pairs of ports without flowing through the thermal interface. The flow of the secondary fluid to and / or from the thermal interface is then restricted without restricting the flow between the second and third pairs of ports. Flow restrictions are advantageous in that they are selective (in that they can be switched on or off) and / or adjustable (in that the magnitude of the restriction can consist of a continuous scale or a discrete set of choices).

[0017] Flow limiting can be achieved by a component configured to be located within one of the ports for the secondary fluid. The component may include an opening configuration to restrict the flow of the secondary fluid to and / or from the thermal interface. The opening configuration may be formed by one or more holes, slots, and / or meshes. In one implementation, the component may have two parts: an inner part having a first opening configuration and an outer part having a second opening configuration. The relative alignment of the two opening configurations sets the fluid flow through the component. The component may be interchangeable or alternatively integrated into the heat exchanger. Optionally, the flow limiting section may also filter the secondary fluid, for example, for particles exceeding a certain size.

[0018] A heat exchanger can form part of a module that houses and cools electronic components, such as those in a blade server. The module typically has a chassis containing the electronic components. In this case, the primary fluid is a liquid, typically a dielectric coolant, and the module can be operated to keep the primary fluid in the liquid phase. One, some, or all of the electronic components may be at least partially immersed in the dielectric coolant for their cooling. The secondary fluid is also generally a liquid, such as a water system, and the module can similarly operate to keep this in the liquid phase as well. The secondary fluid can supply one or more cold plates, each configured to cool one or more of the electronic components (for example, by mounting on it). The secondary fluid can pass through the heat exchanger to one or more cold plates and through thermal interfaces within the heat exchanger to allow heat transfer between the primary and secondary fluids.

[0019] Placing the heat exchanger within the chassis is advantageous for the cooling efficiency and portability of the module. Beneficially, the pump for the primary fluid can also be located within the chassis. The configuration of the heat exchanger allows for coupling to a second pair of ports outside the chassis, while the first and third pairs of ports are coupled from within the chassis.

[0020] During use, the limiter may be configured to set the flow rate of the secondary fluid based on the pressure drop of the secondary fluid flowing between the second pair of ports and the third pair of ports (i.e., bypassing the thermal interface and preferably flowing to one or more cold plates). For example, if the pressure drop increases, the flow rate can be increased accordingly to compensate. Additionally or alternatively, the ratio of the flow rate of the secondary fluid to the thermal interface to the flow rate of the secondary fluid between the second pair of ports and the third pair of ports may be set (or maintained) to a predetermined value. This can be achieved by setting the flow limiter accordingly.

[0021] Brief explanation of the drawing The present disclosure can be implemented in several ways, and here, preferred embodiments will be described by way of example with reference to the accompanying drawings.

Brief Description of the Drawings

[0022] [Figure 1] A top view of an exemplary module including a 6-port heat exchanger is shown. [Figure 2] An isometric view of the module of FIG. 1 is shown. [Figure 3] A cross-sectional view of a heat exchanger having a flow restriction according to a first embodiment of the present disclosure is shown. [Figure 4] An enlarged portion of FIG. 3 is shown for clarity. [Figure 5] An exploded view of the heat exchanger of FIG. 3 showing an adapter according to a first modification is shown. [Figure 6] An adapter for use with the heat exchanger of FIG. 3 according to a first modification is shown. [Figure 7] An adapter for use with the heat exchanger of FIG. 3 according to a second modification is shown. [Figure 8] An adapter for use with the heat exchanger of FIG. 3 according to a third modification is shown. [Figure 9] An adapter for use with the heat exchanger of FIG. 3 according to a fourth modification is shown. [Figure 10] An adapter for use with the heat exchanger of FIG. 3 according to a fifth modification is shown. [Figure 11] An exploded view of an adapter for use with the heat exchanger of FIG. 3 according to a sixth modification is shown. [Figure 12] An adapter of FIG. 11 in a first configuration is shown. [Figure 13] An adapter of FIG. 11 in a second configuration is shown. [Figure 14] An adapter for use with a second embodiment of a heat exchanger according to the present disclosure is shown. [Figure 15] An exploded view of a second embodiment of a heat exchanger according to the present disclosure having the adapter of FIG. 14 is shown.

Modes for Carrying Out the Invention

[0023] Detailed description of preferred embodiments The implementations of this disclosure are typically used with modules as shown in Figures 1 and 2. A key issue is identified in the operating mode in which some secondary coolant passes through the heat exchanger and some is used for heat transfer with the primary coolant. Specifically, the hydraulic pressure loss at the heat exchanger outlet port for the secondary coolant (specifically, the second secondary coolant output port 5 to the cold plate 3, as shown in Figures 1 and 2) can vary. For example, the bias of the secondary coolant passing through plate 4 may differ between implementations. Similarly, while the pressure drop across plate 4 may be fixed, the pressure drop of the coolant flowing directly to the cold plate 3 may vary depending, for example, the number of cold plates 3 in the system, the type of cold plate 3 (e.g., different internal fin / pin patterns and / or structures), and / or the length and diameter of the supply hose or supply pipe from heat exchanger 1 to the cold plate 3. As a result, each implementation may have different flow rates for plate 4 and / or each cold plate 3. The flow rates may be suboptimal.

[0024] To facilitate a more optimal flow rate to the cold plate 3, an adapter is proposed for insertion into the first secondary coolant input port 7 of the heat exchanger 1. The purpose of the adapter is to reduce the amount of coolant that can pass through plate 4 without limiting the amount of coolant that flows directly through the heat exchanger 1 from the first secondary coolant input port 7 to the second secondary coolant output port 5 (therefore supplied to the cold plate 3). The adapter may be removable and / or replaceable.

[0025] In a general sense, a heat exchanger can be conceivable for transferring heat from a first coolant to a second coolant while keeping the first and second liquid coolants isolated from each other. The heat exchanger comprises a first set of ports for receiving the first coolant in the heat exchanger and outputting the first coolant from the heat exchanger; a second set of ports for receiving the second coolant in the heat exchanger and outputting the second coolant from the heat exchanger; a third set of ports for receiving the second coolant in the heat exchanger and outputting the second coolant from the heat exchanger, wherein the second and third sets of ports are in communication within the heat exchanger to allow the flow of the second coolant; and a thermal interface configured to transfer heat between the first coolant received at the first set of ports and the second coolant received at the second set of ports and / or the third set of ports. Subsequently, a flow limiter is advantageously provided, configured (adjustably or selectively) to limit the flow of the second coolant to and / or from the thermal interface without limiting the flow of the second coolant between the second set of ports and the third set of ports.

[0026] Another embodiment can be found in a module for cooling electronic components, the module comprising: a chassis for housing electronic components and a first (dielectric) coolant liquid for at least partially immersing the electronic components (optionally, the electronic components and / or a first coolant are also provided); one or more cold plates configured to cool at least one of the electronic components, each of which is configured to receive a second coolant liquid; and a heat exchanger, as disclosed herein, configured to transfer heat from the first coolant liquid to the second coolant liquid. The electronic components may include one or more circuit boards, one or more integrated circuits, and one or more other electronic components (e.g., resistors, capacitors, inductors, transformers). The electronic components may form a computer server or other information technology (IT) device.

[0027] In yet another embodiment, a method for configuring the heat exchanger described herein for transferring heat from a first coolant to a second coolant while keeping the first and second liquid coolants isolated from each other may be considered. This method involves restricting (selectively or adjustablely) the flow of the second coolant to and / or from the thermal interface, which transfers heat from the first coolant received at the first set of ports to the second set of ports and / or the second coolant received at the third set of ports, without restricting the flow of the second coolant between the second set of ports and the third set of ports.

[0028] Several optional and / or particularly advantageous features are possible. These may be applied to any one or more of the embodiments considered herein. For example, according to one embodiment, the flow limiter comprises a component which may be configured to be located within at least one port from a second and / or third set of ports. The flow limiter may then comprise an opening configuration for restricting the flow of a second coolant liquid between at least one port and the thermal interface.

[0029] Beneficial in this regard, the flow limiter is replaceable. This allows for the reconfiguration of the flow limiter for different applications.

[0030] In a preferred configuration, the thermal interface comprises a plate heat exchanger. Preferably, the heat exchanger is located within (or integrated with) the chassis. Beneficially, a pump for a first coolant liquid is provided within the chassis. This allows the dielectric coolant to flow effectively around the corresponding coolant loop.

[0031] In the embodiment, first and second sets of ports of the heat exchanger are configured to receive coolant from the chassis and supply coolant into the chassis (the first set of ports is typically configured for the flow of a primary coolant, such as a dielectric liquid, and / or the second set of ports is generally configured for the flow of a secondary coolant to and from one or more cold plates). A third set of ports can then be configured to receive coolant from an external device, such as a secondary heat exchanger (which may include a heat removal unit), and supply coolant to the device.

[0032] Advantageously, restricting the flow of the second coolant (optionally, selectively, or adjustablely) may include setting the flow rate of the second coolant based on the pressure drop of the second coolant as it exits the heat exchanger after flowing between the second set of ports and the third set of ports. Additionally or alternatively, restricting the flow of the second coolant may include setting the ratio of the flow rate of the second coolant to the thermal interface to the flow rate of the second coolant between the second set of ports and the third set of ports to a predetermined value.

[0033] Further optional and / or advantageous features in a general sense are described below. Before that, additional details of specific embodiments are described again.

[0034] Referring here to Figure 3, a cross-section of the heat exchanger 1 having a flow limiter provided by the adapter 6 is shown. See also Figure 4, which shows an enlarged portion of Figure 3 for clarity. The same reference numerals are used when showing the same features as those shown in other drawings. From this figure, it can be seen that the heat exchanger comprises a heat exchanger plate 4, a first secondary coolant input port 7 with an external connector 10, a first secondary coolant output port 9, a second secondary coolant output port 5, and a second secondary coolant input port 12. The chassis 2 and piping 8 are also visible. The adapter 6 has a limiting hole 11.

[0035] In the examples of Figures 3 and 4, the adapter 6 has a nearly hollow, elongated tubular (or cylindrical) shape and is located inside the equipment coolant inlet side of the heat exchanger 1 between the external connector 10 of the first secondary coolant input port 7 and the second secondary coolant output port 5, bypassing the plate 4. The limiting hole 11 facilitates flow through the outlet port 5 and piping 8 directly, making it less desirable for the coolant to pass through the plate 4. As will be further described below, the hole 11 may include one or more of holes, slots, and / or other shapes based on the optimal shape for yielding one or more target (predetermined) flow rates. On the left side of the heat exchanger 1, a second secondary coolant input (return coolant flow) port 12 is shown, but in this example, there is no benefit for this coolant to bypass the plate 4, so it does not need to be limited.

[0036] The adapter 6 can be made from a variety of different materials, such as metal and / or plastic. Depending on the implementation, the adapter 6 can be custom-made to meet the flow limit required for a specific use case within the module (which can then be selectively disabled by switching or removing the adapter 6 if this changes), or it can be adjusted to allow the flow limit to be changed without having to disassemble the heat exchanger 1.

[0037] Different versions of adapter 6 can be used with different configurations and / or different types of cold plate 3. For example, adapter 6 may have different predetermined holes and / or slots suitable for different required flow rates. Several implementation forms are described below to illustrate the range of possible examples. It will be understood that combinations of features from these exemplary designs are also possible.

[0038] Next, referring to Figure 5, an exploded view of the heat exchanger of Figure 3 is shown, illustrating the adapter according to the first modification. As previously mentioned, the same features shown in the other drawings are identified using the same reference numerals. In this figure, the heat exchanger 1, the piping 8, the first secondary coolant input port 7, the adapter 6 with hole 11, the first external connector 10, the first secondary coolant output port 9, and the second external connector 29 are visible. This shows how the adapter 6 fits into the first secondary coolant input port 7 inside the first external connector 10.

[0039] Referring also to Figure 6, the adapter 6 according to the first modification is shown. Here, the limiting hole 11 can be seen more clearly.

[0040] Referring now to Figure 7, an adapter 6' for use with the heat exchanger of Figure 3, according to a second modification, is shown. Instead of holes, slots 11' are provided.

[0041] Referring now to Figure 8, an adapter 6'' for use with the heat exchanger of Figure 3, according to a third modification, is shown. Here, a slotted hole 11'' is provided.

[0042] Different types of adapters may use alternative structures. For example, referring to Figure 9, an adapter for use with the heat exchanger of Figure 3 is shown according to a fourth modification. Adapter 6''' comprises a mesh filter 13. This mesh filter 13 can act to remove harmful particles drawn into the heat exchanger 1 that could cause the system to stop working. The gauge of this mesh 13 can be (for example) 50 microns to 300 microns, depending on the specifications and / or the material used in the secondary coolant loop.

[0043] A strainer pattern, rather than a mesh, can also provide filtering, for example. Referring now to Figure 10, an adapter for use with the heat exchanger of Figure 3 according to a fifth modification is shown. Adapter 6'''' comprises a strainer 14. The strainer 14 can function as a filter, just like the mesh 13, and all the details of these options also apply to this implementation.

[0044] In these embodiments, flow rate limiting can be selectively implemented. In particular, the adapter 6 can be inserted into or removed from the heat exchanger depending on the desired flow rate.

[0045] As mentioned above, an adjustable version of the adapter (which allows the magnitude of the limit to be changed) may be beneficial. For example, this could be used when the items in the module for cooling may change, which means that the amount of flow bypassing the plate 4 of heat exchanger 1 can be changed without having to completely shut down heat exchanger 1.

[0046] Referring now to Figure 11, an exploded view of an adapter for use with the heat exchanger of Figure 3 according to a sixth modification is shown. The adapter 26 comprises an outer portion 18 having an outer slot 17 and an inner portion 16 having an inner opening 41. Both the outer portion 18 and the inner portion 16 have a hollow cylindrical shape, and the outer portion 18 is slightly larger than the inner portion 16 (in this case, the diameter, as the parts have a circular cross-section, but this shape is not essential) so that the inner portion 16 can be fitted into the outer portion 18. The inner opening 41 is formed in rows, with each row extending along the length of the inner portion 16, and different rows are located at different locations along the outer surface (circumference) of the inner portion 16. Each row has an opening 41 of a different shape and / or size. In the illustrated example, the number of openings 41 in each column is the same, but this is not mandatory, and the number may differ in some implementations (for example, slots similar to the outer slot 17 can be used in addition to or as a substitute for the hole-like openings, in which case one or more columns may have only a single opening).

[0047] The flow limit can be adjusted by aligning the inner opening 41 with the outer slot 17. The inner portion 16 is further provided with projections 15 corresponding to the notches 25 of the outer portion 18. This is an example of a system that can be used to allow the inner portion 16 of the adapter 26 to be twisted and fixed in a desired position relative to the outer portion 18.

[0048] Next, referring to Figure 12, the adapter of Figure 11 in the first configuration is shown. As can be seen, the inner portion 16 fits into the outer portion. The fit is quite tight so that the fluid does not easily bypass the inner opening 41 and flow through the outer slot 17. In the illustrated configuration, the inner opening 41, aligned with the outer slot 17, greatly restricts the flow of fluid through the outer slot 17. The position of the inner opening 41 is fixed by the position of the projection 15 in one of the slots 25. This achieves the desired flow restriction to the plate 4 of the heat exchanger 1.

[0049] Referring now to Figure 13, the adapter of Figure 11 in the second configuration is shown. Here, the inner opening 41, which aligns with the outer slot 17, is only a small hole. As a result, the flow limit in this configuration is even greater than the flow limit in the configuration of Figure 12. Conversely, the flow rate from the first secondary coolant input port 7 to the second secondary coolant output port 5 in this configuration is greater than the corresponding flow rate in the configuration of Figure 12.

[0050] Returning to the general meaning of this disclosure, additional optional and / or beneficial features can be described as described above. For example, the opening configuration of the flow limiting component may be advantageously formed by one or more of one or more holes (which may be arranged in the form of strainers in a particular configuration), one or more slots, and meshes.

[0051] In one implementation configuration, the flow limiter comprises an inner component having a first opening configuration and an outer component having a second opening configuration. Subsequently, the flow (amount and / or velocity) of the second coolant liquid between at least one port of the component and the thermal interface can be set by the relative alignment of the first and second opening configurations.

[0052] Optionally, the flow limiter may be further configured to filter the second coolant liquid. For example, filtering may be for particles exceeding a certain size. This is an additional possible advantage of flow limiting according to the present disclosure.

[0053] Here, we will again describe other specific embodiments. First, we will further mention the general meaning of this disclosure.

[0054] All adapter designs described so far are intended to be fitted into the first secondary coolant input port 7. However, this is not mandatory. For example, the adapter can be fitted into the second secondary coolant output port 5. Referring now to Figure 14, an adapter for use with a heat exchanger using this method is shown. The adapter 36 comprises a tubular portion 19 having an opening 11 and a threaded portion 20 at one end of the tubular portion 19. The threaded portion 20 is designed to connect to the second secondary coolant output port 5 to secure the adapter 36 in place and includes a hole 22 that allows coolant to flow through the second secondary coolant output port 5.

[0055] Finally, referring to Figure 15, an exploded view of the heat exchanger with the adapter in Figure 14 is shown. This shows how the adapter 36 fits into the second secondary coolant output port 5, as opposed to the inlet port (first secondary coolant input port 7).

[0056] By reference to the general meaning of this disclosure, other optional and / or beneficial features can be provided. For example, the flow limiter may be located in one of a second set of ports (preferably configured to allow coolant to flow into the heat exchanger), or it may be located in one of a third set of ports (preferably configured to allow coolant to flow out of the heat exchanger). In some embodiments, the flow limiter may be located in two or more ports, e.g., one of a second set of ports and one of a third set of ports (or three or more ports). In certain implementations, the flow limiter may be integrated with at least one port.

[0057] While specific embodiments have been described here, those skilled in the art will understand that a wide range of modifications and changes are possible. The arrangement of components, heat sinks, pumps, support structures, and other components can be modified, combined, or configured in a variety of different ways, the ones disclosed herein being merely examples. The configuration of the electronic device cooled by one or more heat sinks, one or more plates, and / or other electronic devices can vary considerably. The exact shape and / or size of the heat sinks and / or cold plates can also be changed. The structure of the heat sinks and / or cold plates may also be modified, for example, using other multi-part assemblies or as a single, integrated device.

[0058] While this disclosure is described with reference to a server module of a particular shape and size, this can be modified (for example, a vertical blade server could be used), and in fact, aspects of this disclosure may be applied to cooling other types of equipment. For example (as discussed in at least International Publication 2020 / 178579, which is jointly assigned with this disclosure), the cooling techniques provided by this disclosure can be used to cool a wide variety of different heat-generating (generally electrical and / or electronic) components, including IT equipment.

[0059] The primary and / or secondary coolant is typically a liquid and may be maintained in liquid form (single-phase coolant). However, this is not always necessary. Two-phase coolants (which can be alternating between gas and refrigerant phases) and / or refrigerant coolants can be used, particularly as the secondary coolant.

[0060] The shape and / or design of the adapter may differ from those described above. For example, the adapter does not need to be tubular or cylindrical in shape.

[0061] In the design described herein, the adapter is mated into either the first secondary coolant input port 7 or the second secondary coolant output port 5. However, depending on the application and implementation configuration, the adapter may be mated into both ports or into a different port.

[0062] In some embodiments, flow limiting can be integrated into the manufacturing of the heat exchanger 1. This approach can provide a permanent solution that is not modified after the manufacturing process, although in implementations the flow limiting can be controlled selectively or adjustably.

[0063] All features disclosed herein can be combined in any combination, except for any combination in which at least some of such features and / or steps are mutually exclusive. In particular, preferred features of the present invention are applicable to all aspects of the invention and can be used in any combination. Similarly, features described in non-essential combinations may be used separately (rather than in combination).

Claims

1. A heat exchanger for transferring heat from a first coolant liquid to a second coolant liquid while keeping the first and second coolant liquids isolated from each other, The heat exchanger has a first set of ports for receiving the first coolant liquid and outputting the first coolant liquid from the heat exchanger, The heat exchanger has a second set of ports for receiving the second coolant liquid and outputting the second coolant liquid from the heat exchanger, A third set of ports for receiving the second coolant liquid in the heat exchanger and outputting the second coolant liquid from the heat exchanger, wherein the second set of ports and the third set of ports are in communication within the heat exchanger to enable the flow of the second coolant liquid, A thermal interface configured to transfer heat between the first coolant liquid received at the first set of ports and the second coolant liquid received at the second set of ports and / or the third set of ports, A flow limiting unit that is adjustable or selectively configured to limit the flow of the second coolant to and / or from the thermal interface without restricting the flow of the second coolant between the second set of ports and the third set of ports, A heat exchanger equipped with [a specific feature].

2. The heat exchanger according to claim 1, wherein the flow limiting portion comprises a component configured to be located within at least one port from the second and / or third set of ports, and the flow limiting portion comprises an opening configuration for limiting the flow of the second coolant liquid between the at least one port and the thermal interface.

3. The heat exchanger according to claim 2, wherein the opening configuration is formed by one or more of one or more holes, one or more slots, and a mesh.

4. The heat exchanger according to claim 2 or 3, wherein the flow limiting portion comprises an inner component having a first opening configuration and an outer component having a second opening configuration, and the flow of the second coolant liquid between the at least one port and the thermal interface is set by the relative alignment of the first and second opening configurations.

5. The heat exchanger according to any one of claims 2 to 4, wherein the flow limiting portion is replaceable.

6. The heat exchanger according to any one of claims 2 to 4, wherein the flow limiting portion is integrated with the at least one port.

7. The heat exchanger according to any of the preceding claims, wherein the flow limiting section is further configured to filter the second coolant liquid.

8. The heat exchanger according to any of the preceding claims, wherein the thermal interface comprises a plate heat exchanger.

9. A module for cooling electronic components, A chassis for housing the electronic component and a first coolant liquid for at least partially immersing the electronic component, One or more cold plates for cooling at least one of the aforementioned electronic components, each of the one or more cold plates is configured to receive a second coolant liquid, A heat exchanger according to any of the preceding claims, configured to transfer heat from the first coolant liquid to the second coolant liquid, A module that includes this.

10. The module according to claim 9, wherein the heat exchanger is located within the chassis.

11. The module according to claim 9 or 10, further comprising a pump for the first coolant liquid in the chassis.

12. The module according to any one of claims 9 to 11, wherein the first and second sets of ports of the heat exchanger are configured to receive coolant from the chassis and supply coolant into the chassis, and the third set of ports are configured to receive coolant from an external device and supply coolant to an external device.

13. A method for configuring a heat exchanger for transferring heat from a first coolant liquid to a second coolant liquid while keeping the first and second coolant liquids isolated from each other, wherein the heat exchanger comprises: a first set of ports for receiving the first coolant liquid in the heat exchanger and outputting the first coolant liquid from the heat exchanger; a second set of ports for receiving the second coolant liquid in the heat exchanger and outputting the second coolant liquid from the heat exchanger; and a third set of ports for receiving the second coolant liquid in the heat exchanger and outputting the second coolant liquid from the heat exchanger, wherein the second set of ports and the third set of ports are in communication within the heat exchanger to allow the flow of the second coolant liquid, and the method is as follows: A method comprising restricting the flow of the second coolant to and / or from the thermal interface of the heat exchanger that transfers heat from the first coolant received at the first set of ports to the second set of ports and / or the second coolant received at the third set of ports, without restricting the flow of the second coolant between the second set of ports and the third set of ports.

14. The method according to claim 13, wherein restricting the flow of the second coolant liquid includes setting the flow rate of the second coolant liquid based on the pressure drop of the second coolant liquid after it has flowed between the second and third sets of ports and exited the heat exchanger.

15. The method according to claim 13 or 14, wherein restricting the flow of the second coolant liquid includes setting the ratio of the flow rate of the second coolant liquid to the thermal interface to the flow rate of the second coolant liquid between the second set of ports and the third set of ports to a predetermined value.

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