Cooling system, polishing equipment, and polishing system for silicon heavy carbide wafer processing

Abstract

This application relates to a cooling system, polishing equipment, and polishing system for processing silicon heavy carbide wafers, wherein the cooling system includes a main unit (100), a liquid storage unit (200), a first cooling unit (300), a second cooling unit (400), a third cooling unit (500), and an electrical control unit (600).

Description

Technical Field

[0001] This application claims priority based on a Chinese patent application with application number 202410314144.8 filed with the China National Intellectual Property Administration on March 19, 2024, and all the contents of the said application are incorporated herein by reference.

[0002] This application relates to the technical field of semiconductor chip manufacturing, for example, cooling systems for silicon carbide wafer processing, polishing equipment, polishing systems, and polishing systems.

Background Art

[0003] In the technical field of chemical mechanical polishing, a wafer is clamped at the lower end of a rotating polishing head, a polishing pad is provided at the upper end of a rotating polishing disk, and a polishing liquid is arranged between the wafer and the polishing pad in the polishing head. Under the cooperation of chemical and mechanical actions, global planarization of the wafer is achieved.

[0004] Processing equipment and methods for chemical mechanical polishing of silicon carbide wafers in related technologies mainly include a first process route for performing single-sided polishing using batch-type polishing equipment for processing silicon wafers with a diameter of 8 inches or less, a second process route for simultaneously polishing both sides of a silicon carbide wafer using double-sided polishing equipment, and a third process route for clamping individual wafers and processing them at high pressure using chemical mechanical planarization (CMP) equipment similar to chip segments.

[0005] Regarding the above chemical mechanical polishing, the following situations exist.

[0006] 1. While Type 1 processing equipment is suitable for polishing silicon wafers, and its power structure and rigid structure are suitable for the silicon wafer polishing process and conditions, it cannot effectively meet the demands of long-duration, high-intensity polishing processes for silicon carbide wafers. When using such equipment to polish silicon carbide wafers, the polishing efficiency becomes too low, the polishing trajectory repeats too high, leading to a deterioration in polishing accuracy and excessively high polishing costs.

[0007] 2. While Type 2 processing equipment can process both sides of a wafer simultaneously and effectively achieve processing accuracy by generating a trajectory with lower repeatability through planetary movement, the efficiency of the double-sided polishing process is limited by the strength of the planetary gears. Therefore, it is not possible to improve polishing efficiency with high pressure and high strength in the double-sided polishing process of silicon carbide wafers. At the same time, double-sided polishing has the disadvantages of a high risk of fragmentation, high maintenance costs, and a large investment in equipment.

[0008] 3. The third type of processing equipment uses airbag pressurized CMP equipment to complete individual wafer polishing, and the processing pressure can reach 7 PSI, far exceeding the 3-4 PSI pressure commonly used for silicon wafer processing, thereby achieving efficient silicon carbide polishing. However, when applied to the polishing of silicon carbide wafers, the equipment investment cost is extremely high, far exceeding that of single-sided or double-sided polishing equipment in related technologies. Despite the short wafer polishing time, the polishing cycle time for individual silicon carbide wafers using this equipment is too long compared to batch-type polishing equipment, and the cost of using dedicated parts or auxiliary materials for this equipment is also very high, making it unsuitable for mass production of silicon carbide substrates.

[0009] Currently, existing polishing equipment in related technologies suffers from poor heat dissipation, resulting in excessively low polishing efficiency, high repetition of polishing trajectories, which degrades polishing accuracy and leads to excessively high polishing costs. However, no effective solutions have yet been proposed to address these issues. [Overview of the project] [Problems that the invention aims to solve]

[0010] The embodiments of this application provide a cooling system, polishing equipment, and polishing system for processing silicon heavy carbide wafers in order to avoid situations that occur in related technologies, such as excessively low polishing efficiency, excessively high repeatability of polishing trajectories leading to degraded polishing accuracy and excessively high polishing costs. [Means for solving the problem]

[0011] In its first aspect, the present application is: A main unit configured for attaching parts, A liquid storage unit provided in the main unit and configured to store polishing fluid and cooling fluid, A first cooling unit is provided on the polishing disc of the polishing equipment, is connected to the liquid storage unit, and is configured to cool the polishing disc. A second cooling unit is provided in a pipeline connecting the liquid storage unit and the polishing equipment, and is also connected to the liquid storage unit and configured to cool the polishing liquid, A third cooling unit is provided in the polishing equipment, is connected to an air compressor, and is configured to cool the polishing pad attached to the polishing disc. The present invention provides a cooling system for silicon heavy carbide wafer processing, which includes an electrical control unit provided in the main unit and connected to the first cooling unit, the second cooling unit, and the third cooling unit, respectively, and configured to control the first cooling unit, the second cooling unit, and the third cooling unit.

[0012] In a second aspect, the present application relates to a polishing machine for processing silicon heavy carbide wafers connected to the cooling system described in the first aspect, A housing unit configured for mounting components, A horizontal movement unit provided in the housing unit, A vertical movement unit is provided on the horizontal movement unit and is capable of reciprocating along the horizontal direction under the operation of the horizontal movement unit, The present invention provides a polishing apparatus for processing heavy silicon carbide wafers, comprising: a pressure disk unit provided on the vertical movement unit, which is capable of reciprocating along the vertical direction under the action of the vertical movement unit, and configured to apply pressure to a silicon carbide wafer placed on a polishing pad.

[0013] In a third aspect, a polishing system for processing silicon heavy carbide wafers is provided, comprising a first cooling device, a second cooling device, the cooling system described in the first aspect, and the polishing device described in the second aspect. [Brief explanation of the drawing]

[0014] [Figure 1] This is a schematic diagram of a cooling system according to an embodiment of the present invention. [Figure 2] This is a schematic diagram of a liquid storage unit in a cooling system according to an embodiment of the present invention. [Figure 3] This is a schematic diagram (1) of the first cooling unit in the cooling system according to an embodiment of the present invention. [Figure 4] This is a schematic diagram (1) of the second cooling unit in the cooling system according to an embodiment of the present invention. [Figure 5] This is a schematic diagram (1) of the third cooling unit in the cooling system according to an embodiment of the present invention. [Figure 6] This is a schematic diagram (2) of the third cooling unit in the cooling system according to the embodiment of the present application. [Figure 7] This is a schematic diagram (3) of the third cooling unit in the cooling system according to the embodiment of the present application. [Figure 8] This is a schematic diagram of a polishing machine according to an embodiment of the present invention. [Figure 9] This is a schematic diagram of a horizontal movement unit in a polishing machine according to an embodiment of the present invention. [Figure 10] This is a schematic diagram of a vertical movement unit in a polishing machine according to an embodiment of the present invention. [Figure 11]It is a schematic diagram of a pressure disk unit in a polishing device according to an embodiment of the present application. [Figure 12] It is a schematic diagram (1) of a polishing system according to an embodiment of the present application. [Figure 13] It is a schematic diagram (2) of a first cooling unit in a cooling system according to an embodiment of the present application. [Figure 14] It is a schematic diagram (2) of a second cooling unit in a cooling system according to an embodiment of the present application. [Figure 15] It is a schematic diagram (2) of a polishing system according to an embodiment of the present application. [Figure 16] It is a schematic diagram (3) of a polishing system according to an embodiment of the present application. [Figure 17] It is a schematic diagram of a cooling system according to another embodiment of the present application.

Description of Reference Numerals

[0015] 10 ··· Cooling system, 100 ··· Main body unit, 200 ··· Liquid storage unit, 210 ··· First liquid storage element, 220 ··· Second liquid storage element, 230 ··· First pump body element, 240 ··· Second pump body element, 250 ··· First cooling coil tube element, 260 ··· Heat exchange element, 270 ··· First communication pipeline element, 280 ··· Second communication pipeline element, 290 ··· First valve element, 300 ··· First cooling unit, 310 ··· First cooling element, 320 ··· Second cooling coil tube element, 330 ··· First cooling pipeline element, 340 ··· Second valve element, 400 ··· Second cooling unit, 410 ··· Second cooling element, 411 ··· First liquid supply port, 412 ··· First liquid discharge port, 413 ··· Second liquid supply port, 414 ··· Second liquid discharge port, 420 ··· Third cooling coil tube element, 430 ··· Second cooling pipeline element, 440 ··· Third valve element, 500 ··· Third cooling unit, 510 ··· Third cooling element, 511 ··· Air intake port, 512 ··· Exhaust port, 513 ··· Temperature reduction chamber, 520 ··· Gas nozzle element, 530 ··· Third cooling pipeline element, 600 ··· Electric control unit, 20...polishing equipment, 700... enclosure unit, 800... Horizontal movement unit, 810... Slide rail element, 820... Slider element, 830... Support element, 840... First drive element, 900... Vertical movement unit, 910... Telescopic connecting element, 920... Second drive element, 1000... Pressure disk unit, 1010... Pressure disk element, 1020... Pressure application element, 1100...1st cooling equipment, 1200...Second cooling equipment, 1300... Air compressor, 1400... polishing disc, 1410... polishing pad. [Modes for carrying out the invention]

[0016] Unless otherwise defined, the technical or scientific terms relating to this application have their ordinary meanings as understood by a person of general skill in the art to which this application pertains. Similar words relating to this application, such as “1,” “one,” “one kind,” and “the said,” do not indicate a limitation of quantity and may represent singular or plural. The terms “inclusive,” “including,” “having,” and any variations thereof relating to this application are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus comprising a series of steps or modules (units) may include, but is not limited to, any steps or units not listed, or any other steps or units specific to those processes, methods, products, or apparatus. Similar terms relating to this application, such as “connection,” “linking,” and “joining,” may include, but is not limited to, physical or mechanical connections, electrical connections, and may be direct or indirect. “Multiple” relating to this application means two or more. "And / or" describes the relationship between related objects and indicates that there may be three types of relationships. For example, "A and / or B" may indicate three situations: A existing alone, A and B existing simultaneously, and B existing alone. The letter " / " generally indicates that the preceding and succeeding related objects are in an "or" relationship. The terms "first," "second," "third," etc., in this application are merely for distinguishing similar objects and do not represent a specific order of objects.

[0017] As shown in Figures 1, 2, 3, 4, 5, 6, 7, 13, and 14, the silicon heavy carbide wafer processing cooling system 10 includes a main unit 100, a liquid storage unit 200, a first cooling unit 300, a second cooling unit 400, a third cooling unit 500, and an electrical control unit 600. Here, the main unit 100 is configured to mount components. The liquid storage unit 200 is provided in the main unit 100 and is configured to store polishing fluid and cooling fluid. The first cooling unit 300 is provided on the polishing disc 1400 of the polishing machine 20 and is connected to the liquid storage unit 200 and is configured to cool the polishing disc 1400. The second cooling unit 400 is provided in the conduit connecting the liquid storage unit 200 and the polishing machine 20 and is connected to the liquid storage unit 200 and is configured to cool the polishing fluid. The third cooling unit 500 is installed in the polishing equipment 20 and is connected to the air compressor 1300, and is configured to cool the polishing pad 1410 attached to the polishing disc 1400. The electrical control unit 600 is installed in the main unit 100 and is connected to the first cooling unit 300, the second cooling unit 400, and the third cooling unit 500, respectively, and is configured to control the first cooling unit 300, the second cooling unit 400, and the third cooling unit 500.

[0018] Furthermore, the electrical control unit 600 can supply power to the first cooling unit 300, the second cooling unit 400, and the third cooling unit 500, and can perform control operations over the first cooling unit 300, the second cooling unit 400, and the third cooling unit 500.

[0019] In some of these embodiments, the electrical control unit 600 includes, but is not limited to, an electrical control panel.

[0020] The main unit 100 includes a device body frame and a roller element. Here, the device body frame is manufactured from an acid- and base-resistant material and may be configured to attach multiple types of components. The roller element is provided at the bottom of the device body frame and is configured to enable movement of the device body frame.

[0021] The main frame of the equipment may be configured according to the actual mounting needs of the equipment, and there are no further restrictions here. Furthermore, the structure of the main frame of the equipment is a related technology and will not be explained repeatedly here.

[0022] The roller element is attached to the bottom of the equipment frame by methods such as welding, crimping, or bolting, and allows the equipment frame to move freely.

[0023] In some of these embodiments, the roller element includes, but is not limited to, a directional wheel.

[0024] The number of roller elements may be four, and each of the four roller elements may be attached to a corner at the bottom of the main frame of the device.

[0025] In some of these embodiments, the number of roller elements may be six, eight, or the like; in other words, the number of roller elements can be set according to the actual needs, and there are no further restrictions here.

[0026] As shown in Figure 2, the liquid storage unit 200 includes a first liquid storage element 210 and a second liquid storage element 220. Here, the first liquid storage element 210 is provided in the main unit 100 and is connected to the second cooling unit 400, and is configured to store polishing liquid and supply polishing liquid to the second cooling unit 400. The second liquid storage element 220 is provided in the main unit 100 and is connected to the first cooling unit 300 and the second cooling unit 400, respectively, and is configured to store coolant and supply coolant to the first cooling unit 300 and the second cooling unit 400, respectively.

[0027] The first liquid storage element 210 is formed in the main frame of the device. The second liquid storage element 220 is also formed in the main frame of the device, and the second liquid storage element 220 is provided in a rectangular housing structure.

[0028] In some of these embodiments, the first liquid storage element 210 is provided as a rectangular housing structure.

[0029] In some of these embodiments, the first liquid storage element 210 includes, but is not limited to, a liquid storage groove.

[0030] In some of these embodiments, the second liquid storage element 220 is provided in the form of a rectangular housing structure.

[0031] In some of these embodiments, the second liquid storage element 220 includes, but is not limited to, a liquid storage groove.

[0032] The liquid storage unit 200 further includes a first pump body element 230, which is connected to a first cooling unit 300 and configured to pump the polishing fluid.

[0033] Here, the first pump body element 230 may be provided inside the first liquid reservoir element 210. For example, the first pump body element 230 may be attached inside the first liquid reservoir element 210 by welding, crimping, or bolting, and the drain end of the first pump body element 230 may be connected to the second cooling unit 300 to enable pumping of the polishing fluid.

[0034] In some of these embodiments, the first pump body element 230 includes, but is not limited to, a liquid pump.

[0035] As shown in Figures 2 and 17, the liquid storage unit 200 further includes a second pump body element 240, a first communication pipe element 270, a first cooling coil tube element 250, a heat exchange element 260, a second communication pipe element 280, and a first valve element 290. Here, the second pump body element 240 is connected to the first cooling unit 300 and the second cooling unit 400, respectively, and is configured to pump the coolant. The first end of the first communication pipe element 270 is connected to the second pump body element 240. The first cooling coil tube element 250 is wound around the side wall of the first liquid storage element 210, and the first end of the first cooling coil tube element 250 is connected to the second end of the first communication pipe element 270. The heat exchange element 260 is provided in the main unit 100, and the heat exchange element 260 is connected to the second end of the first cooling coil tube element 250. The first end of the second connecting pipe element 280 is in communication with the heat exchange element 260, and the second end of the second connecting pipe element 280 is in communication with the second liquid storage element 220. The first valve element 290 is provided on the first connecting pipe element 270 and the second connecting pipe element 280 and is configured to control the flow of fluid through the first connecting pipe element 270 and the second connecting pipe element 280.

[0036] Here, the second pump body element 240 may be provided inside the second liquid reservoir element 220. For example, the second pump body element 240 may be attached inside the second liquid reservoir element 220 by welding, crimping, or bolting, and the drain end of the second pump body element 240 may be connected to the second cooling unit 400 to enable pumping of the coolant.

[0037] In some of these embodiments, the second pump body element 240 includes, but is not limited to, a liquid pump.

[0038] The first end of the first connecting pipe element 270 is connected to the drain end of the second pump body element 240 by a butt joint or similar structure, and the second end of the first connecting pipe element 270 is connected to the first cooling coil tube element 250 by a butt joint or similar structure. The first and second ends of the first connecting pipe element 270 are, respectively, both ends in the longitudinal direction.

[0039] In some of these embodiments, the first connecting conduit element 270 includes, but is not limited to, a stainless steel pipe.

[0040] The first end of the first cooling coil tube element 250 is connected to the second end of the first connecting pipe element 270 by a butt joint or similar structure, and the second end of the first cooling coil tube element 250 is connected to the liquid supply end of the heat exchange element 260 by a butt joint or similar structure. The first and second ends of the first cooling coil tube element 250 are, respectively, both ends in the longitudinal direction.

[0041] In some of these embodiments, the first cooling coil tube element 250 includes, but is not limited to, a stainless steel tube.

[0042] The first end of the second connecting pipe element 280 is connected to the drain end of the heat exchange element 260 by a butt joint or similar structure, and the second end of the second connecting pipe element 280 is connected to the second liquid storage element 220 by a butt joint or similar structure. The first and second ends of the second connecting pipe element 280 are, respectively, both ends in the longitudinal direction.

[0043] In some of these embodiments, the second communication conduit element 280 includes, but is not limited to, a stainless steel pipe.

[0044] The first valve element 290 includes a first diaphragm valve and a second diaphragm valve. Here, the first diaphragm valve is provided in the first communication conduit element 270 and is configured to control the flow through the first communication conduit element 270. The second diaphragm valve is provided in the second communication conduit element 280 and is configured to control the flow through the second communication conduit element 280.

[0045] As shown in Figures 3 and 13, the first cooling unit 300 includes a first cooling element 310, a first cooling conduit element 330, a second cooling coil element 320, and a second valve element 340. Here, the first cooling element 310 is provided at the bottom of the polishing disc 1400 and is connected to the polishing disc 1400 and configured to attach components. The first cooling conduit element 330 has its first end connected to the liquid storage unit 200 and is configured to transport the cooling liquid. The second cooling coil element 320 is provided on the first cooling element 310 and is connected to the second end of the first cooling conduit element 330 and is configured to cool the polishing disc 1400. The second valve element 340 is provided on the first cooling conduit element and is configured to control the flow of the first cooling conduit element 330.

[0046] The first cooling element 310 is connected to the polishing disc 1400 by methods such as welding, crimping, or bolting, and the first cooling element 310 is provided in the form of a circular seat structure.

[0047] The diameter of the first cooling element 310 matches the diameter of the polishing disc 1400. Please understand that the diameter of the first cooling element 310 is the same as the diameter of the polishing disc 1400.

[0048] In some of these embodiments, the first cooling element 310 includes, but is not limited to, a polishing disc water cooling seat.

[0049] The first cooling pipeline element 330 includes a first pipeline. The first end of the first pipeline is connected to the drain end of the second pump body element 240 by a structure such as a butt joint, and the second end of the first pipeline is connected to the first cooling element 310, configured to transport the coolant. The first end and the second end of the first pipeline are the two ends in the longitudinal direction of the pipeline.

[0050] In some of these embodiments, the first cooling pipe element 330 includes, but is not limited to, a stainless steel pipe.

[0051] The second cooling coil tube element 320 is wound in a curved manner along the circumferential direction of the first cooling element 310, and the second cooling coil tube element 320 is in communication with the first cooling element 310.

[0052] In some of these embodiments, the second cooling coil tube element 320 includes, but is not limited to, a stainless steel tube.

[0053] The second valve element 340 includes a third diaphragm valve. Here, the third diaphragm valve is provided in the first conduit and controls the flow in the first conduit.

[0054] As shown in Figures 4 and 14, the second cooling unit 400 includes a second cooling element 410, a third cooling coil tube element 420, a second cooling pipeline element 430, and a third valve element 440. Here, the second cooling element 410 is provided in a pipeline connecting the liquid storage unit 200 and the polishing equipment 20, and is connected to the first liquid storage element 210 of the liquid storage unit 200. The third cooling coil tube element 420 is wound inside the second cooling element 410 and is connected to the second liquid storage element 220 of the liquid storage unit 200, and is configured to cool the polishing liquid. The second cooling pipeline element 430 connects the third cooling coil tube element 420 to the second liquid storage element 220 in the liquid storage unit 200, and the third cooling pipeline element 430 connects the third cooling coil tube element 420 to the heat exchange element 260 in the liquid storage unit 200. The third valve element 440 is provided on the second cooling pipe element 430 and is configured to control the flow through the second cooling pipe element 430.

[0055] The second cooling element 410 is provided in the form of a hollow cylindrical tube, and its first end is connected to the first liquid storage element 210 by a conduit, while its second end is connected to the polishing equipment 20 by a conduit. The first and second ends of the second cooling element 410 are, respectively, its ends in the longitudinal direction.

[0056] In some of these embodiments, the second cooling element 410 includes, but is not limited to, a stainless steel cylinder.

[0057] The second cooling element 410 includes a first liquid inlet 411 (coolant inlet), a first drain port 412 (coolant drain port), a second liquid inlet 413 (polishing liquid inlet), and a second drain port 414 (polishing liquid drain port). Here, the first liquid inlet 411 is opened at the first end of the second cooling element 410 and is connected to the first liquid storage element 210 by a conduit. The first drain port 412 is opened in the side wall of the second end of the second cooling element 410 and is connected to the polishing equipment 20 by a conduit. The second liquid inlet 413 is opened in the side wall of the first end of the second cooling element 410 and is connected to the second liquid storage element 220 by a second cooling conduit element 430. The second drain port 414 is located in the side wall of the second end of the second cooling element 410 and is connected to the heat exchange element 260 of the liquid storage unit 200 by the second cooling pipeline element 430.

[0058] The first liquid inlet 411 is located at the center of the first end of the second cooling element 410 and is connected to the second liquid storage element 220 by the second cooling conduit 430.

[0059] The first drain port 412 is opened in the arc-shaped side wall of the second end of the second cooling element 410 and is connected to the heat exchange element 260 by the second cooling conduit 430.

[0060] The second liquid inlet 413 is opened in the arc-shaped side wall of the first end of the second cooling element 410, and the second liquid inlet 413 and the first liquid drain port 412 are located in the same straight line, and the second liquid inlet 413 is connected to the first liquid storage element 210 by a conduit.

[0061] The second drain port 414 is provided in the arc-shaped side wall of the second end of the second cooling element 410, and the second drain port 414 and the first drain port 412 are provided symmetrically. The second drain port 414 is connected to the polishing equipment 20 by a pipeline.

[0062] The third cooling coil tube element 420 is mounted inside the second cooling element 410, and the third cooling coil tube element 420 is wound along the axial direction of the second cooling element 410.

[0063] Furthermore, the first end of the third cooling coil tube element 420 is connected to the second liquid reservoir element 220 by the second cooling pipe element 430, and the second end of the third cooling coil tube element 420 is connected to the heat exchange element 260 by the second cooling pipe element 430. The first and second ends of the third cooling coil tube element 420 are, respectively, the two ends in the longitudinal direction.

[0064] In some of these embodiments, the third cooling coil tube element 420 includes, but is not limited to, a stainless steel tube.

[0065] The second cooling pipeline element 430 includes a second pipeline and a third pipeline. Here, the first end of the second pipeline is connected to the second pump body element 240, and the second end of the second pipeline is connected to the first liquid inlet 411. The first end of the third pipeline is connected to the first liquid outlet 412, and the second end of the third pipeline is connected to the heat exchange element 260.

[0066] Note that the first and second ends of the second pipeline are both ends in the longitudinal direction of the pipeline. The first and second ends of the third pipeline are both ends in the longitudinal direction of the pipeline.

[0067] In some of these embodiments, the second cooling pipe element 430 includes, but is not limited to, a stainless steel pipe.

[0068] The third valve element 440 includes a fourth diaphragm valve and a fifth diaphragm valve. Here, the fourth diaphragm valve is provided in the second conduit and is configured to control the flow in the second conduit. The fifth diaphragm valve is provided in the third conduit and is configured to control the flow in the third conduit.

[0069] As shown in Figures 5, 6, 7, and 16, the third cooling unit 500 includes at least one third cooling element 510, a plurality of gas nozzle elements 520, and a plurality of third cooling pipeline elements 530. Here, the third cooling element 510 is provided in the polishing equipment 20 and is configured to communicate with the air compressor 1300 and store compressed air. The plurality of gas nozzle elements 520 are configured to communicate with the third cooling element 510 and purge gas onto the polishing pad 1410. The plurality of third cooling pipeline elements 530 are configured to communicate the corresponding gas nozzle elements 520 with the third cooling element 510, and also to communicate the third cooling element 510 with the air compressor 1300 and transport gas.

[0070] The third cooling element 510 is provided as a hollow cylindrical structure, and is installed by grinding by methods such as welding, crimping, or bolting, and is connected to the air compressor 1300 and the gas nozzle element 520 by the third cooling pipe element 530.

[0071] In some of these embodiments, the third cooling element 510 includes, but is not limited to, a hollow cylindrical tube.

[0072] The number of third cooling elements 510 may be two, and the two third cooling elements 510 are provided at intervals in the polishing machine 20.

[0073] In some of these embodiments, the number of third cooling elements 510 may be one, three, or the like; in other words, the number of third cooling elements 510 may be set according to the actual needs, and is not limited further here.

[0074] The third cooling element 510 includes an intake port 511 and an exhaust port 512. The intake port 511 is located in the side wall of the third cooling element 510 and is connected to the air compressor 1300 by the third cooling conduit element 530. The exhaust port 512 is located at the bottom of the third cooling element 510 and is connected to the gas nozzle element 520 by the third cooling conduit element 530.

[0075] The air intake port 511 is located in the arc-shaped side wall of the middle part of the third cooling element 510, and the air intake port 511 is connected to the air compressor 1300 by the third cooling pipe element 530.

[0076] The exhaust port 512 is located at the bottom of the third cooling element 510, and the exhaust port 512 is connected to the gas nozzle element 520 by the third cooling pipe element 530.

[0077] Furthermore, a cooling chamber 513 is formed inside the third cooling element 510. Here, the cooling chamber 513 is formed inside the third cooling element 510 and is configured to cool the air compressed by the air compressor 1300.

[0078] The gas nozzle element 520 is connected to the third cooling element 510 by the third cooling pipe element 530, and the gas nozzle element 520 cools the polishing pad 1410 in the polishing machine 20 by blowing compressed air at room temperature onto the polishing pad 1410. In some of these embodiments, the third cooling element 510 includes, but is not limited to, a hollow cylindrical tube.

[0079] The number of gas nozzle elements 520 may be set according to actual needs, and there are no further restrictions here.

[0080] The third cooling pipe element 530 includes a fourth pipe and a fifth pipe. Here, the first end of the fourth pipe is connected to the air compressor 1300, and the second end of the fourth pipe is connected to the intake port 511. The first end of the fifth pipe is connected to the exhaust port 512, and the second end of the fifth pipe is connected to the gas nozzle element 520.

[0081] Note that the first and second ends of the fourth conduit are both ends in the longitudinal direction of the conduit. The first and second ends of the fifth conduit are both ends in the longitudinal direction of the conduit.

[0082] In some of these embodiments, the third cooling pipe element 530 includes, but is not limited to, a stainless steel pipe.

[0083] Furthermore, the number of fourth conduits matches the number of third cooling elements 510; that is, the number of fourth conduits is the same as the number of third cooling elements 510.

[0084] Furthermore, the number of fifth pipelines matches the number of gas nozzle elements 520; that is, the number of fifth pipelines is the same as the number of gas nozzle elements 520.

[0085] In this embodiment, the operation process of the cooling system is as follows:

[0086] In actual operation, the electrical control unit 600 activates the first pump body element 230, which pumps the polishing fluid in the first liquid reservoir element 210 to the polishing equipment 20 via a pipeline.

[0087] The electrical control unit 600 activates the second pump body element 240 to turn on the first diaphragm valve, and the second pump body element 240 pumps the coolant in the second liquid reservoir element 220 into the first cooling coil tube element 250 via the first connecting pipe element 270, thereby achieving cooling of the polishing fluid inside the first liquid reservoir element 210.

[0088] The electrical control unit 600 turns on the second diaphragm valve, connecting the heat exchange element 260 and the second liquid reservoir element 220 via the second connecting pipe 280. After heat exchange between the coolant in the first cooling coil tube element 250 and the polishing fluid inside the first liquid reservoir element 210, the coolant flows to the heat exchange element 260, lowering the temperature of the coolant. The coolant in the heat exchange element 260 then returns to the second liquid reservoir element 220 via the second connecting pipe 280, thereby enabling the circulation and reuse of the coolant.

[0089] The electrical control unit 600 turns on the third diaphragm valve, allowing the coolant to flow through the first conduit to the second cooling coil tube element 320, thereby enabling cooling of the polishing disc 1400.

[0090] The electrical control unit 600 turns on the fourth diaphragm valve, which enables communication between the second pipeline and the third cooling coil tube element 420. This allows the coolant to flow into the third cooling coil tube element 420, enabling heat exchange between the coolant and the polishing fluid inside the third cooling element 510, thereby achieving cooling of the polishing fluid.

[0091] The electrical control unit 600 turns on the fifth diaphragm valve, allowing the heat-exchanged coolant to flow to the heat exchange element 260 through the third pipe, thereby enabling the circulation and reuse of the coolant.

[0092] The electrical control unit 600 starts the air compressor 1300 and the gas nozzle element 520. The air compressor 1300 compresses ambient air and pumps it to the third cooling element 510 via the fourth conduit. The third cooling element 510 cools the compressed air and then pumps it to the gas nozzle element 520 via the fifth conduit. The gas nozzle element 520 blows out air, thereby cooling the polishing pad 1410.

[0093] In this embodiment, by providing a first cooling unit 300 in the polishing disc 1400 and connecting the first cooling unit 300 to the liquid storage unit 200, the polishing disc 1400 can be cooled, preventing the temperature from becoming too high during operation and affecting the polishing accuracy. By providing a second cooling unit 400 in the pipeline connecting the liquid storage unit 200 and the polishing device 20, the second cooling unit 400 can further cool the polishing fluid in the pipeline. By providing a third cooling unit 500 in the polishing device 20 and air-cooling the polishing pad 1410 with compressed air, the polishing accuracy of the operation of the polishing device 20 can be ensured.

[0094] As shown in Figure 8, the heavy silicon carbide wafer processing polishing machine 20 includes a housing unit 700, a horizontal movement unit 800, a vertical movement unit 900, and a pressure disc unit 1000. Here, the housing unit 700 is configured to mount components. The horizontal movement unit 800 is provided on the housing unit 700. The vertical movement unit 900 is provided on the horizontal movement unit 800 and reciprocates along the horizontal direction under the action of the horizontal movement unit 800. The pressure disc unit 1000 is provided on the vertical movement unit 900 and reciprocates along the vertical direction under the action of the vertical movement unit 900, and is configured to apply pressure to the silicon carbide wafer placed on the polishing pad 1410.

[0095] Note that the housing unit 700 is a related technology and will not be explained again here.

[0096] As shown in Figure 9, the horizontal movement unit 800 includes a slide rail element 810, a slider element 820, a support element 830, and a first drive element 840. Here, the slide rail element 810 is provided on the housing unit 700. The slider element 820 is provided on the slide rail element 810 and is slidably connected to the slide rail element 810. The support element 830 is provided on the top of the slider element 820 and is configured to mount the vertical movement unit 900 and the pressure disk unit 1000. The first drive element 840 is provided on the housing unit 700 and is connected to the support element 830 and is configured to drive the support element 830 to reciprocate on the slide rail element 810.

[0097] The slide rail element 810 is fixed to the top of the housing unit 700 by methods such as welding, crimping, or bolting, and the length of the slide rail element 810 is set to align with the length of the housing unit 700.

[0098] In some of these embodiments, the slide rail element 810 includes, but is not limited to, a guide rail.

[0099] There are two slide rail elements 810, and these two slide rail elements 810 are spaced apart along the width direction of the housing unit 700.

[0100] In some of these embodiments, the number of slide rail elements 810 may be one, three, or the like; in other words, the number of slide rail elements 810 may be set according to the actual needs, and is not limited further here.

[0101] The slider element 820 is slidably connected to the slide rail element 810, and the slider element 820 can reciprocate along the length of the slide rail element 810.

[0102] In some of these embodiments, the slider element 820 includes, but is not limited to, a stainless steel block.

[0103] Each slide rail element 810 has six slider elements 820, and these six slider elements 820 are spaced apart along the length of the slide rail element 810.

[0104] In some of these embodiments, the number of slider elements 820 provided in each slide rail element 810 may be four, eight, or the like; in other words, the number of slider elements 820 may be set according to the actual needs, and there are no further limitations here.

[0105] The support element 830 is attached to the slider element 820 by methods such as welding, crimping, or bolting, and the support element 830 is configured to attach the vertical movement unit 900 and the pressure disc unit 1000.

[0106] In some of these embodiments, the support element 830 includes, but is not limited to, a stainless steel plate.

[0107] There are two support elements 830, and each of the two support elements 830 is connected to a corresponding slider element 820.

[0108] In some of these embodiments, the number of support elements 830 may be one, three, or the like; in other words, the number of support elements 830 may be set according to the actual needs, and is not limited further here.

[0109] The first drive element 840 is attached to the top of the housing unit 700 by methods such as welding, crimping, or bolting, and the output terminal of the first drive element 840 is connected to the support element 830, thereby enabling driving of the support element 830.

[0110] In some of these embodiments, the first drive element 840 includes, but is not limited to, a drive motor.

[0111] As shown in Figure 10, the vertical movement unit 900 includes an expandable / contractible connecting element 910 and a second drive element 920. Here, the expandable / contractible connecting element 910 is provided vertically to the horizontal movement unit 800 and is connected to the pressure disk unit 1000. The second drive element 920 is provided on the horizontal movement unit 800 and is connected to the expandable / contractible connecting element 910, and is configured to drive the expandable / contractible connecting element 910 to reciprocate expansion and contraction.

[0112] The expandable joint element 910 is attached to the support element 830 by methods such as welding, crimping, or bolting, and the end of the expandable joint element 910 is connected to the pressure disc unit 1000.

[0113] In some of these embodiments, the telescopic connecting element 910 includes, but is not limited to, a telescopic rod member.

[0114] The second drive element 920 is attached to the expandable connector element 910 by methods such as welding, crimping, or bolting, and is configured to drive the expandable connector element 910 to expand and contract.

[0115] In some of these embodiments, the second drive element 920 includes, but is not limited to, a drive motor.

[0116] As shown in Figure 11, the pressure disk unit 1000 includes a pressure disk element 1010 and pressure-applying elements 1020. Here, the pressure disk element 1010 is provided at the end of the vertical movement unit 900 and is configured to reciprocate vertically under the action of the vertical movement unit 900 to mount components. Multiple pressure-applying elements 1020 are provided on the pressure disk element 1010 and are provided at intervals along the circumferential direction of the pressure disk element 1010 and are configured to apply pressure to the silicon carbide wafer placed on the polishing pad 1410.

[0117] The pressure disk element 1010 is provided in the form of a disc, and the center of the pressure disk element 1010 is connected to the end of the expansion joint element 910 by a method such as welding, crimping, or bolting.

[0118] In some of these embodiments, the pressure disk element 1010 includes, but is not limited to, a ceramic mounting disk.

[0119] The pressure-applying element 1020 is attached to the pressure disk element 1010 by methods such as crimping or bolting, and multiple pressure-applying elements 1020 are arranged to surround the pressure disk element 1010 in a ring-like structure.

[0120] In some of these embodiments, the pressure-applying element 1020 includes, but is not limited to, a gas nozzle.

[0121] The annular structure, consisting of multiple pressure-applying elements 1020, is provided in four locations on the pressure disk element 1010, and the four annular structures are spaced apart along the radial direction of the pressure disk element 1010.

[0122] In some of these embodiments, the number of annular structures that can be formed in the pressure disk element 1010 by the multiple pressure-applying elements 1020 may be three, five, or the like. In other words, the number of pressure-applying elements 1020 may be set according to the actual needs, and is not limited further here.

[0123] The operation process of the polishing device according to this embodiment is as follows:

[0124] In actual operation, the first drive element 840 is activated, and the first drive element 840 moves the slider element 820 back and forth on the slide rail element 810, causing the support element 830 to move back and forth on the slide rail element 810, and further, the pressure disk element 1010 can be aligned to a predetermined position on the polishing disk 1400.

[0125] The second drive element 920 is activated, and the second drive element 920 moves in conjunction with the expansion / contraction connection element 910, causing the pressure disk element 1010 to come into contact with the polishing disk 1400, thereby applying pressure to the silicon carbide wafer placed on the polishing disk 1400.

[0126] In this embodiment, by providing a horizontal movement unit and a vertical movement unit, the pressure disc unit can be moved within the housing unit, and by adjusting the position of the pressure disc unit relative to the polishing disc 1400 according to actual processing needs, convenience and versatility of function can be improved.

[0127] As shown in Figures 12, 15, and 16, the polishing system for processing heavy silicon carbide wafers includes the cooling system 10 and polishing equipment 20 described in the above embodiment.

[0128] The polishing system further includes a first cooling device 1100 and a second cooling device 1200. Here, the first cooling device 1100 is in communication with the cooling system 10 and is configured to cool the cooling system 10. The second cooling device 1200 is in communication with the polishing device 20 and is configured to cool the polishing device 20.

[0129] In some of these embodiments, the first cooling device 1100 and the second cooling device 1200 include, but are not limited to, refrigerators.

Claims

1. A main unit configured for attaching parts, A liquid storage unit provided in the main unit and configured to store polishing fluid and cooling fluid, A first cooling unit is provided on the polishing disc of the polishing machine, is connected to the liquid storage unit, and is configured to cool the polishing disc. A second cooling unit is provided in a pipeline connecting the liquid storage unit and the polishing equipment, and is also connected to the liquid storage unit and configured to cool the polishing liquid, A third cooling unit is provided in the polishing equipment, is connected to an air compressor, and is configured to cool the polishing pad attached to the polishing disc. The main unit includes an electrical control unit provided on the main unit and connected to the first cooling unit, the second cooling unit, and the third cooling unit, respectively, and configured to control the first cooling unit, the second cooling unit, and the third cooling unit, Cooling system for processing silicon heavy carbide wafers.

2. The aforementioned liquid storage unit is A first liquid storage element is provided in the main unit and is connected to the second cooling unit, and is configured to store the polishing liquid and supply the polishing liquid to the second cooling unit, The main unit includes a second liquid storage element provided in the main unit and connected to the first cooling unit and the second cooling unit, respectively, which is configured to store the coolant and supply the coolant to the first cooling unit and the second cooling unit, respectively. The cooling system according to claim 1.

3. The aforementioned liquid storage unit is A first pump body element is connected to the second cooling unit and configured to pump the polishing liquid, A second pump body element is connected to the first cooling unit and the second cooling unit, respectively, and configured to pump the coolant, A first communication conduit element, the first end of which is in communication with the second pump body element, A first cooling coil tube element, the first cooling coil tube element being wound around the side wall of the first liquid storage element and having its first end in communication with the second end of the first communication conduit element, A heat exchange element provided in the main unit and communicating with the second end of the first cooling coil tube element, A second connecting conduit element, wherein its first end is connected to the heat exchange element and its second end is connected to the second liquid storage element, The present invention further includes at least one of the following: a first connecting pipe element and a second connecting pipe element, which are provided in the first connecting pipe element and a first valve element configured to control the flow between the first connecting pipe element and the second connecting pipe element, The cooling system according to claim 2.

4. The first cooling unit is A first cooling element is provided at the bottom of the polishing disc and is connected to the polishing disc, and is configured to attach components. A first cooling pipeline element, wherein its first end is connected to the liquid storage unit and configured to transport the cooling liquid, A second cooling coil tube element is provided on the first cooling element and is connected to the second end of the first cooling pipe element, and is configured to cool the polishing disc. The first cooling pipeline element includes a second valve element provided in the first cooling pipeline element and configured to control the flow through the first cooling pipeline element, The cooling system according to claim 1.

5. The second cooling unit is A second cooling element is provided in the pipeline connecting the liquid storage unit and the polishing equipment, and is also connected to the liquid storage unit. A third cooling coil tube element is wound inside the second cooling device and is connected to the liquid storage unit, and is configured to cool the polishing liquid, The third cooling coil tube element and the second cooling pipe element, which are connected to the liquid storage unit, The second cooling pipe element includes a third valve element provided in the second cooling pipe element and configured to control the flow through the second cooling pipe element, The cooling system according to claim 1.

6. The third cooling unit is A polishing device is provided with at least one third cooling element configured to store compressed air and to communicate with the air compressor, A plurality of gas nozzle elements, each connected to the third cooling element and configured to purge the polishing pad with gas, The system includes a plurality of third cooling pipeline elements configured to connect the corresponding gas nozzle elements and the third cooling elements, and to connect the third cooling elements and the air compressor, thereby transporting gas. The cooling system according to claim 1.

7. Polishing equipment for processing silicon heavy carbide wafers connected to a cooling system according to any one of claims 1 to 6, A housing unit configured for mounting components, A horizontal movement unit provided in the housing unit, A vertical movement unit is provided on the horizontal movement unit and is capable of reciprocating along the horizontal direction under the operation of the horizontal movement unit, The system includes a pressure disk unit provided on the vertical movement unit, which is capable of reciprocating along the vertical direction under the action of the vertical movement unit and is configured to apply pressure to a silicon carbide wafer placed on a polishing pad, Polishing equipment for processing silicon heavy carbide wafers.

8. The horizontal movement unit includes a slide rail element provided on the housing unit, a slider element provided on the slide rail element and slidably connected to the slide rail element, a support element provided on the top of the slider element and configured to attach the vertical movement unit and the pressure disk unit, and a first drive element provided on the housing unit and connected to the support element, configured to drive the support element to reciprocate on the slide rail element, and The vertical movement unit includes at least one of the following: an expandable / contractible connecting element provided vertically to the horizontal movement unit and connected to the pressure disk unit; and a second drive element provided on the horizontal movement unit and connected to the expandable / contractible connecting element, configured to drive the expandable / contractible connecting element to reciprocate and expand / contract. The polishing apparatus according to claim 7.

9. The aforementioned pressure disk unit is A pressure disk element is provided at the end of the vertical movement unit, is capable of reciprocating along the vertical direction under the action of the vertical movement unit, and is configured to attach components; The system includes a plurality of pressure-applying elements provided on the pressure disk element and spaced apart along the circumferential direction of the pressure disk element, configured to apply pressure to the silicon carbide wafer placed on the polishing pad, The polishing apparatus according to claim 7 or 8.

10. A first cooling device, a second cooling device, a cooling system according to any one of claims 1 to 6, and a polishing device according to any one of claims 7 to 9, Polishing system for processing heavy silicon carbide wafers.

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