Mold insert for injection molding system, carrier substrate for such mold insert, injection molding system having such mold insert, and injection molding method

Abstract

A mold insert (50) for an injection molding system (18) for manufacturing microstructures and / or nanostructures on a molded article, comprising: a structural element (7) having a surface profile (9) facing the cavity (20) of the injection molding system when installed in the injection molding system and having a surface profile (7) for forming microstructures and / or nanostructures on the article during the injection molding process; and a carrier substrate (3) to which the structural element (7) is directly or indirectly bonded, wherein the carrier substrate (3) and preferably the structural element (7) are configured such that the installed mold insert (50) is deformable in at least some areas, and in particular elastically deformable.

Description

Technical Field

[0001] The present invention relates to a mold insert for an injection molding system for forming microstructures and / or nanostructures on molded articles, particularly molded articles for use in the semiconductor industry, a carrier substrate, an injection molding system having such a mold insert, and an injection molding method.

Background Art

[0002] In the semiconductor industry, it is known to use the method of imprint lithography for forming structures in the micrometer or nanometer range. In recent years, this technology has become increasingly important, particularly with respect to photolithography. The advantage of imprint lithography is that it can eliminate the need for the manufacture of expensive templates and is not subject to the constraints of the diffraction limit. However, in imprint lithography, it is also necessary to create a so-called master stamp, which is costly and time-consuming. However, this master stamp is not directly used as a working stamp. Instead, a soft stamp, particularly a polymer-based one, is cast from the master stamp, and this soft stamp functions as a working stamp. When the soft stamp wears out, a new soft stamp can be cast from the master stamp.

[0003] These soft stamps are preferably used in an imprint apparatus. In the imprint apparatus, the soft stamp is fixed to a stamp holder, particularly by being fixed to a stamp carrier (backplane). The substrate is fixed to a substrate holder and coated with an imprint material. The stamp holder and the substrate holder are movable relative to each other. If the stamp is smaller than the substrate, the negative of the stamp structure can be imprinted on the substrate a plurality of times by a step-and-repeat process. If the size of the stamp is approximately equal to or the same as the size of the substrate, the imprint material on the substrate is imprinted in a single imprint step.

[0004] Such imprinting equipment provides high precision and repeatability of imprinted structures. However, the throughput of these technologies is low. Injection molding equipment for manufacturing parts in the injection molding process has been known industrially for decades. This technology was initially intended only for the manufacture of coarse parts, but it has also come to be used for manufacturing parts with smaller structural sizes. Notable examples include the injection molding of CDs and DVDs. Such equipment is known as a press machine. While press working can achieve high throughput, it has been shown to be extremely difficult to manufacture structures in the nanometer range while maintaining or improving yield. Special equipment, and especially method steps, are required to strictly control not only the injection molding process but also the demolding of the formed molded parts. In particular, demolding of cured imprinted materials with nanometer-range structures requires special equipment and method steps. [Overview of the Initiative] [Problems that the invention aims to solve]

[0005] Therefore, the object of the present invention is to provide an apparatus and method that can perform injection molding and demolding of a molded article or injection-molded article with high throughput and as few defects as possible, especially when the molded article has an embossed microstructure or nanostructure on its outer surface. [Means for solving the problem]

[0006] The present invention solves the problem by means of the mold insert described in claim 1, the carrier substrate described in claim 11, the injection molding system described in claim 12, and the method described in claim 13.

[0007] According to the first embodiment, a mold insert for an injection molding system is provided for forming microstructures and / or nanostructures on a molded article, wherein the mold insert, when installed in the injection molding system, has a surface profile facing the cavity of the injection molding system. - A structural element having the surface profile for forming the microstructure and / or nanostructure on the molded product during the injection molding process, - comprising a carrier substrate to which the structural elements are directly or indirectly joined, The carrier substrate and preferably the structural element are configured such that the mold insert, when mounted, is deformable in at least some areas, and in particular, elastically deformable.

[0008] In contrast to the prior art, the present invention provides a deformable mold insert comprising a carrier substrate and structural elements. By appropriately selecting the material and / or dimensions of the carrier substrate and preferably the structural elements, the mold insert can be advantageously made deformable at least locally and / or overall. For example, during demolding, more than 50%, preferably more than 70%, and most preferably more than 80% of the volume of the mold insert deforms, particularly elastically. In particular, in mold inserts provided for the formation of microstructures and / or nanostructures, it has been found that the corresponding deformation during the demolding process of the molded article is advantageous for simplifying demolding. This makes it possible to demold the fabricated molded article more quickly without concern for damage or destruction of the microstructures and / or nanostructures of the fabricated molded article.

[0009] A further advantage is the extremely good molding accuracy. Molding accuracy refers to the smallest structural dimension that can be manufactured without error during demolding. The molding accuracy is less than 1000 nm, preferably less than 500 nm, more preferably less than 100 nm, and most preferably less than 10 nm.

[0010] A further advantage is the ability to form structures with high aspect ratios. The aspect ratio is the ratio of the height to the lateral dimension (e.g., width) of a structure. Manufacturable aspect ratios are greater than 1:1, preferably greater than 5:1, more preferably greater than 10:1, and most preferably greater than 20:1.

[0011] The molded articles produced by the method and apparatus described herein are preferably made of the following materials: - PMMA - COC - COP - PS - PET - Contains one of the polyimides.

[0012] These materials are empirically known to be particularly suitable for manufacturing molded products. The structural elements are configured to form structures, which are microstructures and / or nanostructures, on the outer surface of the molded product within the injection molding material introduced into the cavity during the operation of the injection molding system, i.e., during the injection molding process. The microstructures and / or nanostructures are understood to be patterns in which the distance between two profile objects may be less than 50 μm, preferably less than 10 μm, more preferably less than 1 μm, most preferably less than 100 nm, and most preferably less than 10 nm.

[0013] In particular, mold inserts are understood to be inserts inserted as replaceable components within an injection molding system to realize patterns, especially surface patterns, on the molded product formed when a viscous fluid is injected into the cavity of the injection molding system during operation and the viscous fluid hardens within the cavity to form the molded product.

[0014] In particular, it is understood that the outer surface profile formed by a profile object on the outer surface of a molded product can be reproducibly realized through multiple injection molding processes, and for example, the spacing between two profile objects in the form of a ridge can be manufactured reproducibly with corresponding small dimensions.

[0015] The structural element preferably comprises at least one stamp carrier and one stamp. The stamp carrier can be any type of substrate on which the stamp can be fabricated and transported. The stamp preferably has a desired surface profile intended to emboss the outer surface of a molded article.

[0016] In one embodiment, the stamp carrier is a wafer, particularly a silicon wafer. However, a glass wafer is also conceivable. A glass wafer is particularly suitable when the stamp imprint material, i.e., the imprint material on which the stamp is formed, needs to be cured using visible or UV light via the stamp carrier. In this case, the electromagnetic radiation for curing can pass through the stamp carrier. This is particularly advantageous when the stamp of the imprint apparatus that models the working stamp is opaque, translucent, or transparent to this wavelength.

[0017] In another embodiment, the stamp carrier is a foil. The foil is preferably stretched over a frame. In semiconductor technology, such a foil and frame are used to transport substrates. Instead of transporting substrates, stamps are created on the corresponding foil.

[0018] Stamp carriers can generally be manufactured from metal, glass, polymer, or ceramic. If necessary, a binder may be used between the stamp carrier and the stamp to ensure better adhesion of the embossed stamp to the carrier.

[0019] In particular, structural elements, especially stamps, may include hard stamps or soft stamps. Specifically, it is assumed that structural elements, especially their stamps, are formed using, for example, a metal master sample manufactured by an imprint process. This makes it possible to provide structural elements that can realize surface profiles in the micrometer or nanometer range in molded articles.

[0020] The stamp of the structural element is preferably joined to the stamp carrier as described above, and in particular is made directly on the stamp carrier. These stamps are preferably soft stamps, i.e., they are preferably made from stamp embossing material. The stamp embossing material is preferably a polymer.

[0021] It is also envisaged that the stamp can be a hard stamp. In this case, the stamp can be used without a stamp carrier. However, it is also envisaged to fix the stamp on the stamp carrier. This is necessary when only the stamp carrier and not the stamp is compatible with the mold insert described below. In this case, the stamp carrier also serves as an adapter. Making the stamp as a hard stamp is more laborious and costly than casting a soft stamp from a master stamp.

[0022] The carrier substrate preferably determines the mechanical properties of the mold insert and is preferably assembled from a single component or a single layer, or from a plurality of components or a plurality of layers. When the carrier substrate is a composite of a plurality of layers, each layer having different physical properties, and a plurality of different properties are combined in one carrier substrate, this carrier substrate is called a hybrid carrier substrate. A mold insert having a hybrid carrier substrate is preferably a hybrid mold insert. The different layers are preferably made from different materials.

[0023] In particular, the molded article can be a component in the fields of optics, microfluidics or electronics, especially semiconductor technology. For example, the molded article is provided as an optical component or a component in the fields of bio- and microfluidics. As optical components, lenses, especially Fresnel lenses, are conceivable. Diffraction gratings or refractive gratings or optical elements for holography are also envisaged. The production of photonic crystals is also envisaged. Another possibility is the production of a complete microfluidic system having chambers, especially reaction chambers, channels, etc.

[0024] The bending resistance moment is an index of the degree to which a beam resists the generation of internal stress when the beam is subjected to a load. The greater the bending resistance moment, the greater the force that must act on the beam from the outside in order to cause the corresponding deflection of the beam. The bending resistance moment can be directly calculated from the cross-sectional profile. Those skilled in the art know that the bending resistance moment for a rectangle having a width B and a height H is calculated using the following formula when the beam is bent about an axis parallel to B.

[0025] W = B * H , ,

[0028] / 6 The bending resistance moment should be minimized to enable the mold insert to be bent as easily as possible for mold release. An exemplary calculation is performed and presented in tabular form. An embossing process is applied to a molded product with a substrate size of 200 mm. Therefore, the mold insert is also estimated as a group of square parts with a length of 200 mm and a width of 200 mm. The length is not included in the calculation of the bending resistance moment. The width is fixed at 200 mm. The height varies according to a set of parameters to calculate the corresponding bending resistance moment.

[0026] [Table 1]

[0027] In particular, the mold insert can have a bending resistance moment of less than 100000 mm 3 less than, preferably less than 80000 mm 3 less than, more preferably less than 40000 mm 3 less than, most preferably less than 1000 mm 3 less than. Similar considerations apply to mold inserts having different widths and / or heights.

[0028] In particular, the bending resistance moment is set so that a maximum local stroke displacement of a portion of the mold insert of, for example, up to 1 mm, preferably up to 1 cm, more preferably up to 2 cm, and most preferably up to 3 cm can be achieved or achieved during demolding. The stroke displacement should be understood in particular as the displacement in a direction perpendicular to the main extending plane with respect to the position or arrangement of the mold insert in its undeformed state.

[0029] Furthermore, the structural elements can be directly bonded to the carrier substrate and thus directly mounted on the carrier substrate. The carrier substrate is characterized in that it can be inserted into a corresponding holding or receiving device within an injection molding system, and in particular, can be fixed therein. The carrier substrate is dimensionally determined accordingly and includes at least one contact area that enables, for example, the fixing of a mold insert within a corresponding holding device within an injection molding system. For example, no structural elements are present in this contact area. For example, the extended area of ​​the carrier substrate in a plane extending parallel to the principal extending surface is larger than the extended area of ​​the structural elements.

[0030] Structural elements, particularly their stamps, act on the injection-molded material during the injection process, and thus exert an embossed effect on the formed molded product. In particular, the mold insert may be equipped with at least one heating element. This makes it possible to influence the injection-molded material in the cavity with each heat supply, especially as needed, for example, during the molding process or injection molding process and / or demolding of the molded product.

[0031] In particular, the heating element is a micro-heating element. The maximum dimensions of the micro-heating element are less than 1 cm, preferably less than 5 mm, more preferably less than 1 mm, more preferably less than 0.1 mm, and most preferably less than 0.01 mm. As the dimensions of the micro-heating element decrease, the achievable local temperature resolution increases.

[0032] One or more heating elements are envisioned to be configured to act locally, i.e., spatially restricted, at specific locations on the injection-molded material. In particular, the heating elements are, for example, microheating wires, which extend in a meandering pattern and / or include arched and / or circular portions. The heating elements, especially the microheating elements, can have any shape. For example, helical, meandering, circular, rectangular, or honeycomb-shaped microheating elements are envisioned.

[0033] In particular, at least one or more heating elements may be arranged to enable a spatially anisotropic or non-uniform heat distribution. This allows for targeted and localized action on the injection molding material and application-specific action for heat supply at specific locations on the molded article to be formed or on the formed article. In particular, it is envisioned that individual heating elements can be individually controlled to induce different heating times and / or different heat inputs for different regions of the molded article.

[0034] Ideally, each micro-heating element or heating element can be heated individually. In this embodiment, non-uniform and / or anisotropic heating profiles can be easily achieved by individual control or adjustment of the heating elements.

[0035] It is conceivable that multiple micro-heating elements can be grouped together and heated collectively. Micro-heating elements can be grouped to more optimally heat specific regions of space, particularly areas with high structural density in the stamp. In this sense, heating tailored to the stamp can be achieved not only through control but also through the design or grouping of the heating elements. The drawback in this case is that a new heating substrate needs to be fabricated for each stamp with a different surface profile. Therefore, non-uniform and / or anisotropic heating is advantageously achieved through appropriate control of the heating elements.

[0036] By specifically specifying a high density of micro-heating elements in regions with high punch structure density, it is possible to ensure that the temperature is high enough to secure sufficient viscosity for the injection molding material and that the stamp structure is completely filled. Furthermore, the ability to individually control the micro-heating elements ensures high-speed control based on low thermal mass. It is no longer necessary to heat the entire stamp to the temperature required for optimal filling of the high-density stamp structure. In particular, the micro-heating elements assist in the flow of injection molding material into the microstructure or nanostructure. It is also not necessary to temperature control the entire injection molding mold. Temperature control is performed directly at the stamp. This also reduces the required demolding temperature. Another advantage is that heat transfer from the micro-heating elements to the stamp and therefore to the injection molding material can be controlled more effectively. Furthermore, the amount of design guidelines for creating the stamp is reduced. In the prior art, it was common to include additional stamp structures that had no purpose other than assisting demolding. Due to the improved temperature control, these design guidelines can be reduced at least.

[0037] To provide the most uniform heating effect possible to the injection-molded material, heating elements may be formed across the entire surface. Micro-heating elements can be fabricated, for example, by deposition on a heating substrate. One possibility is to deposit a metal, particularly aluminum or copper, onto the heating substrate, and then structure the metal using coating and etching processes as well as photolithography. In another embodiment, heating elements are formed by doping directly onto the heating substrate. The heating substrate surface is masked as appropriate before doping. The heating substrate surface with micro-heating elements is referred to as the active heating substrate surface. The surface opposite to the active heating substrate surface is referred to as the passive heating substrate surface.

[0038] The heating substrate has at least one, preferably more than 10, more preferably more than 50, most preferably more than 100, or even more than 500 micro-heating elements on its active heating substrate surface. The micro-heating elements preferably generate heat by resistive heating.

[0039] In particular, at least one heating element is integrated into the carrier substrate or bonded to the outer surface of the carrier substrate, especially the outer surface facing the structural element. This is advantageous because, depending on the molded product being formed, the position of the integrated heating element can influence the heating effect on the injection-molded material.

[0040] In particular, the carrier substrate may have a multilayer structure. For this purpose, the carrier substrate comprises, for example, a first layer and a second layer. This advantageously allows for the incorporation of as diverse physical properties as possible, particularly the mechanical properties of the carrier substrate, and therefore the mechanical properties of the mold insert (e.g., with respect to bending resistance moment and / or thermal conductivity). Preferably, the first and second layers differ in terms of material and / or dimensions. In the simplest case, the mold insert is a single stamp substrate whose role is to receive a subsequent soft stamp or a soft stamp having its stamp carrier (backplane).

[0041] Furthermore, preferably, the structural elements are made from a first material and the carrier substrate from a second material, wherein the first material is different from the second material. Particularly preferably, the structural elements may be made from a material having a coefficient of thermal expansion equivalent to that of the injection-molded material of the molded article being manufactured. This has been demonstrated to be particularly advantageous in the demolding process.

[0042] Another aspect of the present invention is a carrier substrate for a mold insert according to the present invention. All the properties described with respect to the mold insert are equally applicable to the carrier substrate, and vice versa.

[0043] Another aspect of the present invention is an injection molding system comprising a cavity, wherein a deformation element for deforming an inserted mold insert, particularly a mold insert according to the present invention, and / or a device for influencing the amount of injection molding material flowing in, particularly in a feed section located just downstream of the cavity inlet opening. The injection molding material is preferably set temporally and / or spatially by the device for influencing it. For example, in this way, a time-varying cross-sectional profile of the incoming injection molding material can be set. The feed section is preferably a sprue device. All the advantages and features disclosed in relation to mold inserts are similarly applicable to injection molding systems and vice versa.

[0044] Preferably, the deformation of the mold insert, particularly elastic deformation, is achieved by a corresponding deformation element acting on the mold insert according to the present invention, which has been found to facilitate the injection molding process or the demolding of the molded product after the completion of the injection molding process. In particular, this has been found to be advantageous in the case of structures whose size is only a few micrometers or a few nanometers.

[0045] In particular, the deformation element may be a displaceable pin, which preferably passes through a corresponding opening or recess in a fixed element and can contact the mold insert, especially the carrier substrate, on the side of the mold insert opposite the structural element. This allows the pin to press against the mold insert, deform it, and in particular, deform it into a dome shape. However, the deformation element may also be based on a pressure principle, for example, where the side facing the structural element comes into contact with a pressurized fluid to produce the desired deformation.

[0046] In particular, the injection molding system includes a retaining device for the mold insert. The retaining device for the mold insert preferably includes a retaining device base, which preferably has access or openings that allow a deformation element to act on the mold insert. The mold insert is preferably held in a bendable manner. The mold insert is secured, for example, at its periphery by fasteners and fastening elements.

[0047] As an extension, multiple deformation elements can be used, which are spatially distributed to enable targeted local demolition. Furthermore, devices for influencing the amount of injection molding material flowing in are provided in the supply section, particularly directly downstream of the cavity inlet opening. It has been found that the injection molding process can be influenced by corresponding devices for influencing the amount of injection molding material. In particular, by placing them immediately before the cavity, i.e., downstream, individual flow velocity control of the cavity becomes possible. This is especially possible because the flow velocity control is performed directly in the cavity. For example, if a corresponding sensor in the cavity detects the presence of a particular favorable inflow and / or less favorable inflow, the inflow can be adjusted via a corresponding control loop. This makes it possible to directly intervene in the injection molding process before unusable molded parts are formed.

[0048] A sprue distributor (i.e., a runner) is a component or group of components that guides injection molding material into the injection molding mold space, preferably between mold inserts, through its injection molding material inlet. The sprue distributor, for example, has at least one sliding element that can change the cross-section of the injection molding material inlet. It is conceivable to use multiple sliding elements to locally decompose and change the cross-section of the injection molding material inlet. This allows for intentional control of the injection molding material dosage.

[0049] Another aspect of the present invention is a method for injection molding using an injection molding system according to the present invention, which involves deforming a mold insert and / or influencing the amount of injection molding material flowing in when demolding an injection-molded product. All the advantages and features described for the injection molding system are equally applicable to the method for injection molding, and vice versa.

[0050] In particular, during the demolding of a molded product, the outer region of the mold insert may be removed from the molded product in a first step, and the inner region of the mold insert may be removed in a second step. The second step is performed after the first step. Specifically, the separation is performed in stages, i.e., discontinuously. It has been found that an appropriate demolding method can reduce the defect rate of damaged molded products.

[0051] In particular, the cross-section of the supply section may change during the inflow of injection molding material. For example, the opening cross-section of the hose is changed by corresponding buckles, sliders, and / or pins to change the flow velocity of the injection molding material spatially and / or temporally. The hose is flexible, and the cross-section of the hose can be changed by applying external force or by components that can be placed inside the hose or pipe so that different cross-sections or cross-sectional profiles are realized. It is also conceivable that the supply piping forms a kind of distributor. In this case, preferably, the corresponding cross-sectional enlargement or cross-sectional change in the supply section may be used to realize spatial changes during the inflow of injection molding material. It is also conceivable that the supply section is configured as a distributor for injection molding material, supplying injection molding material to multiple cavities.

[0052] Further advantages, features, and details of the present invention will become apparent from the following description and drawings of preferred embodiments. [Brief explanation of the drawing]

[0053] [Figure 1] This figure shows a carrier substrate for a mold insert according to a first exemplary embodiment of the present invention. [Figure 2a] This figure shows a carrier substrate for a mold insert according to a second exemplary embodiment of the present invention. [Figure 2b] This figure shows a carrier substrate for a mold insert according to a third exemplary embodiment of the present invention. [Figure 3a] This figure shows a carrier substrate for a mold insert according to a fourth exemplary embodiment of the present invention. [Figure 3b] This figure shows a carrier substrate for a mold insert according to a fourth exemplary embodiment of the present invention. [Figure 3c] This figure shows a mold insert according to a first exemplary embodiment of the present invention. [Figure 4a] This figure shows a first operating state of a holding device equipped with a mold insert according to a first exemplary embodiment. [Figure 4b] This figure shows a second operating state of a retaining device equipped with a mold insert according to a first exemplary embodiment. [Figure 5] This is a top view of a mold insert according to a second exemplary embodiment of the present invention. [Figure 6a] This is a side view of an injection molding system according to a first exemplary embodiment of the present invention, in a first position. [Figure 6b] This is a side view of an injection molding system according to a first exemplary embodiment of the present invention, located in a second position. [Figure 7a] This is a front view of an injection molding system according to a first exemplary embodiment of the present invention, having a first runner. [Figure 7b] This is a front view of an injection molding system according to a second exemplary embodiment of the present invention, having a second runner. [Modes for carrying out the invention]

[0054] In drawings, identical components or components having the same function are given the same reference numeral. The following figures illustrate injection molding systems 18 in various embodiments of the present invention (see Figures 6a and 6b). Such injection molding systems 18 are provided for manufacturing molded articles from injection molding material by introducing the injection molding material into a correspondingly molded cavity 20 of the injection molding system 18 and curing it. Thereafter, the injection molding material is introduced into the cavity 20 via a supply unit, which is shown in detail in Figures 7a and 7b in exemplary embodiments. In particular, the present invention relates to a preferably replaceable mold insert 50 for such an injection molding system 18, the structure of which is illustrated exemplary in Figure 3c. In various exemplary embodiments, the mold insert 50 also comprises a structural element 8 in addition to the carrier substrate 3 shown in Figures 1 to 3b. When the mold insert 50 is installed, the structural element 8 faces the cavity 20 of the injection molding system 18. The structural element 8, in particular its stamp 7, by its surface profile 9, defines the outer surface profile of the molded article produced by injection molding. The mold insert 50 can preferably be mounted on a corresponding retaining device 12, as shown in Figures 4a and 4b. The retaining device 12 is preferably a component of an injection molding system 18.

[0055] Figure 1 shows a schematic, not-to-accurate, side view of a microheating substrate 1 comprising a microheating base substrate 2 having a microheating surface 2o, wherein at least one microheating element 11 (not shown) is disposed on or within the microheating surface 2o. Such a microheating substrate 1 may be a carrier substrate 3 or part of a carrier substrate 3 for a mold insert 50 according to an exemplary embodiment of the present invention.

[0056] Figure 2a shows a schematic, not-to-accurate, side view of a first embodiment of a carrier substrate 3 for a mold insert 50, the carrier substrate 3 comprising a single first layer 4. The carrier substrate 3 is used to directly fix the structure or stamp layer 7, or to fix a stamp carrier 6 on which the stamp 7 has been fabricated and attached.

[0057] Figure 2b shows a schematic, not precisely scaled, side view of a further embodiment of the carrier substrate 3 comprising a second layer 4' in addition to the first layer 4. The second layer 4' can play any physical role. It is assumed that it is made from a material having special thermal conductivity and / or special heat capacity and / or special mechanical stiffness tensor, etc. For clarity, further figures showing further layers are not shown. However, the number of layers is not limited to two. Therefore, each layer can play a very specific physical role or serve a specific purpose. The carrier substrate 3 plays either the role of directly fixing the stamp 7 or fixing the stamp carrier 6 on which the stamp 7 is fabricated and attached. The first layer 4 and the second layer 4' of the modified embodiments for the carrier substrate 3 in Figures 2a and 2b play a role in defining the mechanical properties of the carrier substrate 3, such as thermal conductivity and / or bending resistance moment, and thus can determine the mechanical properties of the mold insert 50. As a result, the first layer 4 and the second layer 4' can influence the mechanical properties of the carrier substrate 3, for example, depending on the selection of their materials and their selected thicknesses. Layers 4 and 4' may be bend-resistant substrates or foils. For example, by using metal foil or polymer foil, the thermal conductivity properties can be set very easily and optimally.

[0058] Figure 3a shows a schematic, not precisely scaled, side view of a first embodiment of a carrier substrate 3 comprising a microheating substrate 1 in addition to a first layer 4 provided to define the mechanical properties of the carrier substrate 3. The microheating substrate 1 and the first layer 4 are bonded together in a sandwich-like manner, and in a modification of the embodiment in Figure 3a, the microheating surface 2o is positioned between the microheating base substrate 2 and the first layer 4. This embodiment is characterized in that the active microheating surface 2o is directly bonded to the layer that determines the mechanical portion of the carrier substrate 3. As a result, the heat sources of individual microheating elements are located within the carrier substrate 3. This design achieves optimal thermal uniformity.

[0059] Figure 3b shows a schematic, not precisely scaled, side view of a second embodiment of a carrier substrate 3 comprising a first layer 4 and a microheating substrate 1. The second embodiment is characterized in that the passive microheating surface 2o is directly bonded to the first layer 4 such that the active microheating surface 2o faces outward. This makes it possible to utilize the thermal properties of the microheating base substrate 2.

[0060] The hybrid characteristics of the two embodiments shown in Figures 3a and 3b are demonstrated by the fact that the micro-heating element (not shown) of the micro-heating substrate 1 is controllable and adjustable, while the amount of the physical properties of the mold insert substrate 1 of the mechanical mold insert 50 cannot be changed.

[0061] Alternatively, another layer can be used to define the mechanical properties of the carrier substrate 3 instead of the first layer 4. In this case, the first layer 4 is assumed to be variable in terms of its properties, for example, as a microheating substrate, while the second layer 4' is assumed to be invariant in terms of its properties.

[0062] Figure 3c shows a hybrid carrier substrate 3 to which a structural element 8 is fixed. The structural element 8 comprises a stamp carrier 6 (backplane) and a stamp 7 fabricated on the stamp carrier 6. The stamp carrier 6 is then fixed by the hybrid carrier substrate 5. This makes it possible to fabricate the stamp 7 on the stamp carrier 6 independently of the hybrid carrier substrate 5, and then transport the stamp 7 using the stamp carrier 6. The stamp 7 is usually fabricated in an imprint apparatus. The stamp or stamp layer 7 is, in particular, a soft stamp formed from a master stamp in an imprint apparatus. The master stamp in the imprint apparatus is preferably a metal stamp. With the carrier substrate 3 and structural element 8 assembled, a mold insert 50 is provided, in particular in the form of a hybrid mold insert. This hybrid mold insert 50 here comprises three parts: a microheating substrate 1 responsible for heat application, a first layer and / or a second layer used to make the physical properties adjustable, and a stamp layer 7 responsible for forming the molded product during injection molding. Thus, the hybrid properties are extended to include the molding mode.

[0063] Figure 4a shows a hybrid mold insert 50 within a retaining device 12. The retaining device 12 has a fixture 13 used to hold the hybrid mold insert 50' in place at its periphery. The fixture 13 is advantageously removable and replaceable. The fixture 13 is fixed onto the retaining device base 15, for example, by a fixing element 14. The retaining device base 15 has an access 16 or opening or recess through which a deformation element 17 can reach the underside of the hybrid mold insert 50. The hybrid mold insert 50 is bendable by the deformation element 17. The deformation element 17 is preferably a pin. The deformation element 17 may also be a fluid outlet opening through which a fluid, preferably a gas, can press against the underside of the hybrid mold insert 50. The excess pressure thus generated causes the hybrid mold insert 5 to curve. Magnetic and / or electrical, particularly electrostatic devices may also be used to cause the curve of the hybrid mold insert 50. Therefore, the deformation element 17 should be interpreted as generally as possible.

[0064] Figure 4b shows the deformation state of the hybrid mold insert 50 caused by the deformation element 10. The deformation shown in the figure assists in the release of the molded product from the stamp 7, which is necessary after injection molding.

[0065] Figure 5 shows a top view of the stamp surface of a stamp 7 having multiple surface profiles 9. For clarity, the surface profiles 9 are greatly simplified. It can be seen that the surface profiles 9 are not uniformly distributed across the stamp surface, nor are they homogeneous in terms of density. This figure was chosen to show an example that is as abstract and general as possible. The density and distribution of the surface profiles 9 may, of course, be uniform. Four different zones Z1 to Z4 show four different micro-heating elements 11, particularly in the shape of fine heating wires. The micro-heating elements in zones Z1 and Z3 are located directly beneath the corresponding surface profiles 9. They may be formed differently depending on the density of the surface profiles 9, and / or may have different conductor densities and / or conductor thicknesses. Zone Z2 is a local zone below the open area. Zone Z4 is a global zone encompassing the entire stamp or the entire stamp layer 7. However, due to the shape of the micro-heating elements 11, only the outer edge of the stamp or stamp surface 7 is heated, not the entire surface. Any further zones can be created in the same manner.

[0066] Figure 6a shows a schematic side view of a complete injection molding system 18 in a first position, comprising at least two retaining devices 12 and, in particular, a sprue runner 19 shaped supply section. Preferably, at least one of the two retaining devices 12 has a deformation element 17 to allow for more efficient removal of the injection molded product after molding. The two retaining devices 12, together with the insert of the mold insert 50, form the boundary of the cavity, so-called injection molding cavity 20, which is filled with injection molding material during injection molding. The sprue runner 19 is located above the injection molding system 18 and is responsible for supplying the injection molding material. The sprue runner 19 has at least one slide element 21 on at least one side, preferably on both sides, which controls and / or adjusts the cross section of the injection molding material inlet 22 leading to the injection molding cavity 20. In the first position, at least one slide element 21 is fully retracted so that the cross section of the injection molding material inlet 22 is maximized.

[0067] Figure 6b shows a schematic side view of a complete injection molding system 18 in a second position, comprising at least two retaining devices 12 and a sprue runner 19. In the second position, at least one sliding element 21 is moved so as to reduce the cross-section of the injection molding material inlet 22. By specifically positioning at least one sliding element 21, it is possible to control and / or adjust the inflow of injection molding material through the injection molding material inlet 22.

[0068] Figure 7a shows a schematic front view of the rear side of the retaining device 12 of an injection molding system 18 having a first possible sprue runner 19. The rear side of the access 16 and the bending or deformation element 17 is visible. Furthermore, the shape of the sprue runner 19 is visible. Such a sprue runner 19 is referred to as a strap sprue runner. A single rectangular sliding element 21 is visible, which extends over almost the entire width of the sprue runner 19, and thus allows the cross-section of the injection molding material inlet 22 to be continuously changed over its entire width.

[0069] Figure 7b shows a schematic front view of the rear side of the retaining device 12 of the injection molding system 18 having a second possible sprue runner 19'. The rear side of the access 16 and bending element 17 is visible. In this embodiment, the sprue runner 19' has a plurality of sliding elements 21, which are individually insertable into the injection molding material inlet 22, thus enabling localized control of the flow rate of the injection molding material.

[0070] As an extension of the sprue runners 19 and 19' from the last two figures (not shown), it comprises sliding elements 21 having different cross-sections, such as a grid pattern, a grid pattern, and a different cross-section. [Explanation of Symbols]

[0071] 1…Micro heating substrate 2…Micro-heating base substrate 20... Micro heating surface 3…Carrier board 4…First layer 4’…Second layer 6…Stamp carrier 7…Stamp 8…Structural element 9…Surface profile 11…Micro heating element 12…Holding device 13…Fixture 14…Fixing element 15…Holding device base 16…Access 17…Deformation element 18…Injection molding system 19, 19’…Sprue runner 20…Injection molding cavity 21…Slide element 22…Injection molding material inflow 50…Mold insert

Claims

1. A mold insert (50) for an injection molding system (18) for manufacturing microstructures and / or nanostructures on a molded product, wherein the mold insert (50) has a surface profile (9) facing the cavity (20) of the injection molding system when installed in the injection molding system. A structural element (7) having the surface profile (7) for forming the microstructure and / or nanostructure on the molded product during the injection molding process, The structural element (7) is directly or indirectly joined to a carrier substrate (3), The carrier substrate (3) and preferably the structural element (7) are configured such that the mold insert (50), when attached, is deformable in at least a portion of its area, and in particular, elastically deformable.

2. The mold insert (50) is 100,000 mm ３ Less than 80,000 mm ３ Less than, more preferably 40,000 mm ３ Less than, more preferably 1000 mm ３ Less than 100 mm, most preferably 100 mm ３ A mold insert (50) according to claim 1, having a bending resistance moment of less than 1.

3. The mold insert (50) according to any one of claims 1 to 2, wherein the mold insert (50) includes at least one heating element (11).

4. The mold insert (50) according to claim 3, wherein the at least one heating element (11) or the plurality of heating elements (11) are arranged such that a spatially anisotropic and / or non-uniform heat distribution can be achieved.

5. The mold insert (50) according to any one of claims 1 to 4, wherein the at least one heating element (11) is integrated with the carrier substrate (3) or formed on the outer surface of the carrier substrate (3).

6. The mold insert (50) according to any one of claims 1 to 5, wherein the structural element (50) includes a stamp (7) and a stamp carrier (6).

7. The mold insert (50) according to any one of claims 1 to 6, wherein the structural element (7) includes a hard stamp or a soft stamp.

8. The mold insert (50) according to claim 5 or 6, wherein the stamp carrier (6) is transparent or translucent.

9. The mold insert (50) according to any one of claims 1 to 7, wherein the carrier substrate (3) includes at least a first layer (4) and a second layer (4').

10. The mold insert (50) according to any one of claims 1 to 9, wherein the structural element (7) is made from a first material and the carrier substrate (3) is made from a second material, and the first material is different from the second material.

11. A carrier substrate (3) for a mold insert (50) according to any one of claims 1 to 10.

12. An injection molding system (18) having a cavity (20), An inserted mold insert (50), a deformation element (17) for deforming the mold insert (50) according to any one of claims 1 to 10, and / or An injection molding system (18) comprising a device for influencing the amount of injection molding material flowing in, located particularly in a supply section, preferably in a runner (19, 19'), directly downstream of the inlet opening of the cavity (20).

13. A method for injection molding using the injection molding system (18) described in claim 12, wherein when demolding an injection-molded product, the mold insert (50) is deformed and / or the amount of injection molding material flowing in is affected.

14. The method according to claim 13, wherein in the demolding process, in a first step the molded product is removed from the outer region of the mold insert (50), and in a second step the molded product is removed from the inner region of the mold insert (50).

15. The method according to claim 13 or 14, wherein the cross-section of the supply section is changed during the inflow of the injection molding material.

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