Material processing machine, method for manufacturing multilayer materials, and multilayer materials

Abstract

A sheet material processing machine (10) for manufacturing a multilayer material (26) comprises a substrate (22) and a hybrid coating layer (38) applied on the substrate (22), wherein the hybrid coating layer (38) includes at least two coating layer components selected from the group consisting of silicon oxide applied by capacitive PECVD, silicon oxide applied by inductive PECVD, and aluminum oxide. The sheet material processing machine (10) comprises a first coating unit (14) for applying a coating layer component containing silicon oxide onto the substrate (22) and a second coating unit (16) for applying a coating layer component containing aluminum oxide onto the substrate, wherein the first coating unit (14) and the second coating unit (16) are arranged along a handling path for the substrate (22).

Description

Technical Field

[0001] The present invention relates to a material processing machine for manufacturing a multilayer material, a method for manufacturing a multilayer material, and a multilayer material.

Background Art

[0002] Multilayer materials are used in the packaging industry, particularly for packaging products such as food, medical products, pharmaceutical products, industrial products, and personal care products. In these applications, usually, at least one of the layers of the multilayer material is used as a so-called "barrier layer" that protects the packaged product from environmental moisture, ambient air, and / or non-ambient gases (e.g., in modified atmosphere packaging (MAP) applications). The generally called barrier layer is used to prevent the exchange of gases and vapors through the multilayer material. Further, this may also serve as an aroma barrier, a flavor barrier, and / or a light barrier.

[0003] Known multilayer materials include a substrate made of, for example, a synthetic polymer, on which a barrier layer is applied. As the barrier layer, a thin metal layer of aluminum can be used. However, efforts have been made to avoid metallized packaging materials in order to change recyclability and reduce the ecological footprint of the materials and / or packages made from the materials.

[0004] At the same time, there is a need to provide optically transparent packaging materials that still provide a high-quality barrier layer.

[0005] In this regard, barrier layers containing, for example, silicon oxide or aluminum oxide are known. This coating can be performed by a chemical vapor deposition (CVD) or physical vapor deposition (PVD) process, particularly plasma-enhanced chemical vapor deposition (PECVD). In PECVD, reactive chemical species are injected into the chamber and ionized or electronically excited by a plasma discharge to generate free electrons or excited species.

[0006] Of particular interest are the transparent silicon oxide layers produced by capacitively coupled PECVD (CC-PECVD), which exhibit unique thin-film properties unattainable by other CVD processes. Other alternative methods include, for example, magnetic strengthening processes or inductively coupled processes. These unique thin-film properties include high barrier performance, mechanical flexibility, and wet adhesion properties, making them suitable for demanding thermal processing, including high-temperature and / or high-pressure retort applications.

[0007] However, the dynamic deposition rate of silicon oxide layers applied by large-scale industrial CC PECVD is limited to 100 to 150 m / min or less, even with processing machines equipped with multiple drum coaters, when applying layer thicknesses suitable for food packaging barrier applications. Therefore, increasing the deposition rate requires the installation of additional process steps or processing modules, making the entire process uneconomical and increasing the total space or area required by the sheet processing machine.

[0008] From U.S. Publication No. 2018 / 170 017 A1, a flexible multilayer packaging film having one or more barrier layers is known, each comprising an organic layer and an inorganic layer which is aluminum oxide or silicon oxide. The inorganic layer is coated by electron beam physical vacuum deposition. However, silicon oxide layers formed by electron beam physical vacuum deposition do not exhibit, or at least do not exhibit, the characteristic thin-film properties of silicon oxide layers formed by CC-PECVD. In addition, electron beam physical vacuum deposition imposes high thermal stress on the substrate being coated, making this process unsuitable for heat-sensitive substrates. Furthermore, the equipment for electron beam vacuum deposition has a considerably higher investment cost compared to processing equipment that relies on PECVD. [Prior art documents] [Patent Documents]

[0009] [Patent Document 1] US Release No. 2018 / 170 017 [Overview of the Initiative] [Problems that the invention aims to solve]

[0010] Therefore, an object of the present invention is to provide a cost-effective material processing machine that provides a barrier layer having excellent thin-film properties while achieving a high deposition rate. A further object of the present invention is to provide a cost-effective multilayer material having good moisture retention and gas barrier properties, and a method for preparing such a material. [Means for solving the problem]

[0011] The object of the present invention is solved by a material processing machine for producing a multilayer material comprising a substrate and a hybrid coating layer applied thereon, wherein the hybrid coating layer comprises at least two coating layer components selected from the group consisting of silicon oxide applied by capacitive PECVD, silicon oxide applied by inductive PECVD, and aluminum oxide and aluminum. The material processing machine comprises a first coating unit for applying a coating layer component containing silicon oxide onto the substrate and a second coating unit for applying a coating layer component containing aluminum oxide onto the substrate, wherein the first and second coating units are arranged along a handling path for the substrate.

[0012] Furthermore, the first coating unit comprises at least one first subunit for capacitively coupled PECVD and at least one second subunit for inductively coupled PECVD. Thus, the first and second subunits can be used to produce each type of silicon oxide coating at technology-specific deposition rates.

[0013] Preferably, all of the first and second subunits are associated with the same drum of the first coating unit for moving the substrate along the handling path; that is, a single drum is used for the first coating unit. Thus, the overall cost and required space of the first coating unit can be minimized. The total number of the first and second subunits will depend on the specific design of the first coating unit. For example, the total number of the first and second subunits can range from 2 to 8.

[0014] In one variation, the first subunit(s) and the second subunit(s) are arranged alternately along the substrate handling path. Such arrangement allows for particularly uniform dispersion of the coating layer components when both the first subunit(s) and the second subunit(s) are used to prepare the hybrid coating layer.

[0015] Each subunit can be arranged as a module having two or more subunits of the same type. For example, two first subunits can form a first subunit module, and two second subunits can form a second subunit module. In this case, the expression "arranged alternately" means that each module is arranged alternately.

[0016] Here, the term "capacitance-coupled PECVD" refers to capacitively coupled plasma-excited chemical vapor deposition, also known as "CC-PECVD," while the term "inductively coupled PECVD" refers to inductively coupled plasma-excited chemical vapor deposition, also known as "IC-PECVD."

[0017] CC-PECVD and IC-PECVD differ in the mode in which the plasma for the chemical deposition process is generated, the density of the generated plasma, and the resulting thin film properties of the layers coated by each CVD process. European Publication No. 0299754 describes plasma-excited silicon oxide deposition. Thus, this so-called CC-PECVD provides silicon oxide films with the best performance characteristics but with a low deposition rate, while IC-PECVD allows for a higher deposition rate than CC-PECVD but provides a greater plasma density (where plasma density is the number of charged species per unit volume) through a higher level of ionization, resulting in performance characteristics below the range achievable with silicon oxide films coated by CC-PECVD.

[0018] Generally, during IC-PECVD, the plasma is maintained by inductive coupling from a power source, such as an antenna, to the plasma.

[0019] In contrast, during CC-PECVD, the capacitive plasma is maintained by the voltage difference between the AC or DC power supply and the counter electrode. The generated plasma can be magnetically confined using a permanent magnet or electromagnet.

[0020] The terms "silicon oxide" and "aluminum oxide" refer to oxides of silicon and aluminum, and can also be written as "SiOx" and "AlOx," respectively. The term "aluminum oxide" refers to an oxide of aluminum, which can also be written as "AlOx," and in particular, aluminum oxide is AlOx with a x value of 0.1 ≤ x ≤ 1.5.

[0021] The term "silicon oxide" refers to an oxide of silicon, which can also be written as "SiOx," and in particular, silicon oxide is SiOx with 1 ≤ x ≤ 4, and may further contain other additive elements such as carbon, hydrogen and / or nitrogen, though not limited to these.

[0022] The "silicon oxide" to be deposited is not necessarily pure silicon and oxygen. The SiOx used according to the present invention can be an amorphous mixture of silicon, oxygen, carbon, hydrogen (and possibly others).

[0023] In fact, nitrogen or a more carbon-rich silicon oxide product may improve the performance of SiOx.

[0024] In particular, the silicon oxide is SiOx where 1 ≦ x ≦ 2, and / or the aluminum oxide is AlOx where 0.1 ≦ x ≦ 1.5.

[0025] The present invention is based on the idea of providing a combination of different coating methods in a single sheet processing machine that results in a hybrid coating layer combining at least two components, with at least one of the components primarily serving to provide a high deposition rate, thereby minimizing the overall cost of the sheet processing machine and its use, and at least one of the components primarily serving to provide the desired performance and properties of the hybrid coating layer.

[0026] For example, a material processing machine can be used to produce a hybrid coating layer that includes silicon oxide deposited by CC-PECVD to impart desired thin film properties such as high barrier performance and high mechanical flexibility to the hybrid coating layer, and aluminum oxide deposited by a physical vapor deposition (PVD) process such as reactive PVD to increase the overall deposition rate of the hybrid coating layer to a desired value. The aluminum oxide by reactive PVD can be deposited at a processing speed of 600 m / min or more, resulting in a dynamic deposition rate of up to 40,000 nm·m / min, that is, several times the deposition rate of silicon oxide by CC PECVD which is typically in the range of 1000 to 1500 nm·m / min.

[0027] In this way, the substrate is moved along the same handling path, passing through the first and second coating units, so that the desired hybrid coating layer can be easily provided at the lowest overall cost.

[0028] The material processing machine of the present invention requires less space and fewer coating units compared to known material processing machines, while achieving equivalent or higher target deposition rates and performance levels for the multilayer materials produced. Alternatively, it can achieve higher productivity and improvements within the same space and cost requirements.

[0029] Generally, aluminum oxide can be applied by some suitable process. For example, aluminum oxide can be applied by resistance heating reactive PVD, electron beam PVD, or atomic layer deposition (ALD).

[0030] Aluminum can be coated, for example, by resistance heating PVD.

[0031] In one variation, the hybrid coating layer comprises at least two coating layer components selected from the group consisting of silicon oxide coated by capacitively coupled PECVD, silicon oxide coated by inductively coupled PECVD, and aluminum oxide. In another variation, the hybrid coating layer comprises at least two coating layer components selected from the group consisting of silicon dioxide coated by capacitive PECVD, silicon dioxide coated by inductive PECVD, and aluminum.

[0032] The hybrid coating layer may include coating layer components selected from the group consisting of silicon oxide coated by capacitive PECVD, silicon oxide coated by inductive PECVD, and aluminum oxide, in particular coating layer components selected from the group consisting of silicon oxide coated by capacitive PECVD, silicon oxide coated by inductive PECVD, and aluminum oxide coated by resistance heating reactive PVD.

[0033] The order in which the first and second coating units are arranged along the handling path is not particularly limited and depends on the desired layer structure of the multilayer material manufactured by the material processing machine. Therefore, the first coating unit can be placed before or after the second coating unit along the handling path.

[0034] The first coating unit and / or the second coating unit may be equipped with a drum for moving the substrate along a handling path, and the drum is cooled. In this way, the thermal stress on the substrate on which the hybrid coating layer is applied is reduced. Therefore, even heat-sensitive substrates can be processed with the material processing machine according to the present invention.

[0035] Alternatively, the first coating unit and / or the second coating unit may be configured to guide the substrate in a free-span manner along a handling path. In such a design of the first and / or second coating unit, the substrate is held in an unsupported configuration between support rollers while each layer of material is deposited on the substrate. A material processing machine using a free-span configuration is described, for example, in International Publication No. 2022 / 090337.

[0036] In another modification, the first coating unit comprises at least two first subunits and at least two second subunits, all of which are located in a first path area of ​​the handling path, and all of which are located in a second path area of ​​the handling path, with the second path area following the first path area along the substrate handling path. This modification reduces the complexity in the arrangement of the first and second subunits. In particular, interference between the first and second subunits can be avoided or at least minimized when the first and second subunits are used in the same hybrid coating layer application process.

[0037] Of course, it is also possible that at least two second subunits are located in the first route area of ​​the handling route, and at least two first subunits are located in the second route area of ​​the handling route.

[0038] The object of the present invention is further solved by a material processing machine for producing a multilayer material comprising a substrate and a hybrid coating layer applied thereon, wherein the hybrid coating layer comprises at least two coating layer components selected from the group consisting of silicon oxide applied by capacitive PECVD, silicon oxide applied by inductive PECVD, aluminum, and aluminum oxide, and the material processing machine comprises a first coating unit for applying a coating layer component containing silicon oxide onto the substrate and a second coating unit for applying a coating layer component containing aluminum oxide onto the substrate, wherein the first and second coating units are arranged along a handling path for the substrate, and the first coating unit providing silicon is located upstream of the second coating unit providing aluminum.

[0039] The object of the present invention is further solved by a method for producing a multilayer material comprising a substrate and a hybrid coating layer applied thereon, wherein the hybrid coating layer comprises at least two coating layer components selected from the group consisting of silicon oxide applied by capacitive PECVD, silicon oxide applied by inductive PECVD, aluminum, and aluminum oxide, and the method comprises the steps of providing a material processing machine as described above and moving the substrate along a handling path at a predetermined processing speed, thereby applying the hybrid coating layer onto the substrate.

[0040] According to the method of the present invention, it is possible to produce a coating layer (i.e., a hybrid coating layer) that has superior mechanical flexibility, high water retention and gas barrier properties, and better recyclability compared to barrier coatings produced by CC PECVD alone, while achieving a much higher processing speed.

[0041] Preferably, the predetermined processing speeds of the first coating unit and the second coating unit are the same.

[0042] In particular, the predetermined processing speed is 225 m / min or more, preferably 300 m / min or more. Therefore, the predetermined processing speed is greater than twice the processing speed of the conventional CC-PECVD process, which is typically limited to a processing speed of 75 to 100 m / min for useful layer thicknesses, especially those that provide barrier performance commonly used in the food packaging industry.

[0043] The maximum predetermined processing speed of the method according to the present invention is limited only by i) the maximum processing speed of the coating layer component used in the hybrid coating layer having the highest processing speed, and ii) the minimum amount of the coating layer component used in the hybrid coating layer having the lowest processing speed, where the minimum amount is defined as the amount of each coating layer component required to obtain the desired properties of the hybrid coating layer.

[0044] According to another object of the present invention, a material processing machine is provided for producing a multilayer material comprising a substrate and a hybrid coating layer applied on the substrate, wherein the hybrid coating layer comprises at least two coating layer components selected from the group consisting of silicon oxide applied by capacitive PECVD, silicon oxide applied by inductive PECVD, aluminum, and aluminum oxide, and the material processing machine comprises a first coating unit for applying a coating layer component containing silicon oxide onto the substrate and a second coating unit for applying a coating layer component containing aluminum oxide onto the substrate, wherein the first and second coating units (16) are arranged along a handling path for the substrate, and the hybrid coating layer is applied to the substrate at a deposition rate of 20 nm / s or more, preferably 35 nm / s or more.

[0045] The deposition rate of the hybrid coating layer indicates the total amount of the hybrid coating layer applied to the substrate, that is, the average deposition rate of the coating layer components that form the hybrid coating layer.

[0046] The object of the present invention can also be solved by a multilayer material comprising a substrate and a hybrid coating layer applied thereon, wherein the hybrid coating layer comprises at least two coating layer components selected from the group consisting of silicon dioxide applied by capacitive PECVD, silicon dioxide applied by inductive PECVD, aluminum, and aluminum oxide.

[0047] The multilayer material is preferably, for example, a multilayer packaging material for storing food, medical products, pharmaceutical products, industrial products, or cosmetics.

[0048] The multilayer material is preferably obtained by the method described above.

[0049] In one variation, the hybrid coating layer has a thickness ranging from 1 to 30 nm, preferably 5 to 20 nm, and particularly preferably 8 to 15 nm. A hybrid coating layer thicker than 20 nm may result in excessive material consumption without substantially improving the properties of the hybrid coating layer.

[0050] Preferably, the multilayer material has a density of 2.0 g / (m²) at a relative humidity of 90% and a temperature of 37.8°C. 2 It has a water vapor permeability of less than ×24h.

[0051] Water vapor permeability can be measured as WVTR (water vapor transmission rate) according to ASTM F 1249 or ISO 15106-3. The multilayer material to be measured is clamped to a fixture, and the multilayer material is positioned so that the fixture divides the fixture into a measurement chamber and a test chamber. The multilayer material is clamped so that the substrate faces the test chamber. For WVTR measurement, a specified test gas is introduced into the test chamber. The test gas has a specified humidity, temperature, and oxygen content. The measurement chamber contains various sensors to measure the atmospheric composition within the measurement chamber.

[0052] Furthermore, preferably, the multilayer material is subjected to a 2.0 cm³ reaction at a relative humidity of 50%, a temperature of 23.0°C, and a pressure of 1 bar. 3 / (m 2 It has an oxygen permeability of less than ×24h.

[0053] Oxygen permeability can be measured as OTR (Oxygen Transmittance Rate) according to the ASTM F 1972 standard. Similar to WVTR measurement, the side of the substrate should be oriented towards the test gas.

[0054] The base material can be a continuous web or a discontinuous sheet.

[0055] The substrate may contain or be composed of polymers selected from the group consisting of polyolefins, polyethylene terephthalate (PET), polylactic acid (PLA), polyhydroxyalkanoate (PHA), poly-3-hydroxybutyrate (PHB), cellophane, polyvinyl alcohol (PVOH), and ethylene vinyl alcohol (EVOH).

[0056] Preferably, the base material comprises polyolefin, preferably polypropylene and / or polyethylene. For example, the base material may include or be composed of CPP (cast polypropylene), OPP (oriented polypropylene), or BOPP (biaxially oriented polypropylene). Since polyolefins are easily recyclable, they provide excellent retortability to the entire multilayer material, including the base material and the hybrid coating layer.

[0057] In another variation, the substrate includes cellulose-based materials, such as paper.

[0058] To reduce the ecological footprint of multilayer materials, the substrate may include or be composed of materials derived from renewable resources. For example, such materials include polylactic acid (PLA), polyhydroxyalkanoate (PHA), poly-3-hydroxybutyrate (PHB), cellophane, and / or polyvinyl alcohol (PVOH).

[0059] In addition to the hybrid coating layer, the substrate may have additional coating layers on either the same side of the substrate to which the hybrid coating layer is applied or on the other side of the substrate. For example, the substrate may have additional primer coatings or co-extruded skin layers to adjust the overall property profile of the multilayer material.

[0060] Further features and advantages of the present invention will become apparent from the following detailed description and drawings of preferred embodiments, which should not be understood in a limited sense. [Brief explanation of the drawing]

[0061] [Figure 1] A schematic diagram shows a material processing machine according to the present invention, equipped with a first coating unit according to the first embodiment. [Figure 2] Figure 1 shows a second embodiment of the first coating unit. [Figure 3] Figure 1 shows a third embodiment of the first coating unit. [Figure 4] Figure 1 shows a fourth embodiment of the first coating unit. [Figure 5] Figure 1 shows a fourth embodiment of the first coating unit. [Figure 6] The first coating unit in Figure 4 is shown in more detail. [Figure 7] A schematic representation of the multilayer material according to the present invention, which can be obtained using the material processing machine shown in Figure 1, is provided. [Modes for carrying out the invention]

[0062] Figure 1 schematically shows a material processing machine 10 according to the present invention.

[0063] Figure 1 shows a stacked arrangement, but according to another preferred embodiment, it can also be beneficial to arrange the material processing machines according to the present invention in a linear fashion.

[0064] The material processing machine 10 according to this embodiment comprises a supply unit 12, a first coating unit 14, and a second coating unit 16, which are surrounded by a housing 18 of the material processing machine 10.

[0065] The supply unit 12 is accessible to the operator of the material processing machine 10 in order to position the unwinding roll 20 in the supply unit 12, and the unwinding roll 20 contains the base material 22 wound on the unwinding reel 24.

[0066] Within the material processing machine 10, the base material 22 is unwound from the unwinding reel 24 and moved along a handling path from the supply unit 12 to the first coating unit 14, the second coating unit 16, and back to the supply unit 12. Within the supply unit 12, the processed base material, which is now a multilayer material 26, is wound onto the winding reel 28 to obtain a winding roll 30. In other words, the material processing machine 10 shown in Figure 1 is a roll-to-roll processing machine. The base material 22 can be, for example, a continuous sheet with a total length of 100 km.

[0067] The winding roll 30 can be removed from the supply unit 12 by the operator of the material processing machine 10, or by a reel exchange mechanism, which may be an automatic reel exchange mechanism. The direction of the handling path is indicated by arrows in Figure 1. Overall, in the illustrated embodiment, the material processing machine 10 operates "roll to roll".

[0068] In the illustrated embodiment, the unwinding roll 20 and the rewinding roll 30 are geometrically positioned above the first coating unit 14 and the second coating unit 16. Of course, the arrangement of the unwinding roll 20 and the rewinding roll 30 can vary. For example, the unwinding roll 20 and / or the rewinding roll 30 can be positioned at ground level, i.e., at essentially the same level as the first coating unit 14 and the second coating unit 16.

[0069] The movement of the substrate 22 along the handling path is achieved and guided by a number of guide rollers 32, which also play a role in obtaining the desired web tension of the flexible substrate 22 during processing. In Figure 1, all guide rollers 32 throughout the material processing machine 10 are shown to be the same size and shape, but it will be clear that at least some of the guide rollers 32 may be of a different size and / or shape than the others. Of course, the number of guide rollers 32 may differ from that shown in Figure 1.

[0070] In addition to the guide rollers 32, the substrate 22 is moved and supported along the handling path by drums 34 and 36, and each of the first coating unit 14 and the second coating unit 16 comprises a single drum 34 and 36, respectively. The drums 34 and 36 are cooled so that the substrate 22 is cooled when the substrate 22 is in contact with or near the drums 34 and 36, thereby reducing thermal stress on the substrate 22 in the first coating unit 14 and the second coating unit 16.

[0071] The diameters of drums 34 and 36 can be selected according to the space required for each coating technique. For example, drums 34 and / or 36 can have diameters ranging from 400 to 1000 mm.

[0072] The first coating unit 14 and the second coating unit 16 are used to apply a hybrid coating layer 38 onto the substrate 22, thereby forming a multilayer material 26 (see Figure 7).

[0073] The hybrid coating layer 38 includes at least two coating layer components selected from the group consisting of silicon dioxide coated by capacitive PECVD, silicon dioxide coated by inductive PECVD, aluminum, and aluminum oxide.

[0074] The first coating unit 14 is configured to provide all silicon dioxide-based coating layer components, while the second coating unit 16 is configured to provide aluminum or aluminum oxide as a coating layer component.

[0075] This order can also be reversed; for example, the first coating unit is configured to provide aluminum or aluminum oxide as a coating layer component, while the second coating unit is configured to provide all coating layer components based on silicon oxide.

[0076] More specifically, the first coating unit 14 comprises a first vacuum chamber 42 surrounded by a first vacuum chamber housing 44. Therefore, the total volume for which a vacuum needs to be created is limited to the total volume of air within the first vacuum chamber housing 44.

[0077] Within the first vacuum chamber 42, the first coating unit 14 has a first subunit 46 for capacitively coupled PECVD (CC-PECVD) and a second subunit 48 for inductively coupled PECVD (IC-PECVD). Thus, the first subunit 46 is used to coat silicon oxide onto the substrate 22 by CC-PECVD, and the second subunit 48 is used to coat silicon oxide onto the substrate 22 by IC-PECVD.

[0078] Furthermore, the first vacuum chamber and the first coating unit may also have units for capacitively coupled PECVD (CC-PECVD) or inductively coupled PECVD (IC-PECVD).

[0079] In the embodiment, the first subunit 46 and the second subunit 48 are arranged alternately along the handling path of the substrate 22 such that each of the first subunits 46 is followed by the second subunit 46, and vice versa.

[0080] Therefore, within the first coating unit 14, silicon dioxide can be applied to the substrate 22 by CC-PECVD, IC-PECVD, or both, before the substrate 22 is transferred to the second coating unit 16.

[0081] Each of the first subunit 46 and the second subunit 48 is equipped with an antenna 50 facing the drum 34. During the operation of the first coating unit 14, when each of the first subunit 46 and the second subunit 48 is used to coat silicon oxide onto the substrate 22, plasma is generated between the antenna 50 and the drum 34, while reactive gases, particularly hexamethyldisiloxane (HMDSO) and oxygen, and optionally further process gases such as helium, are injected by the injection system 51 (see Figure 6), thereby supplying these gases into the first vacuum chamber 42.

[0082] To generate the plasma for CC-PECVD, the drum 34 is maintained at a potential difference on a counter electrode (not shown), for example, a voltage of 40 kHz. For IC-PECVD, an antenna (50) is used as the plasma source. Of course, since they are in the same vacuum chamber, the CC-PECVD and IC-PECVD plasmas are expected to interact. For example, the potential difference between the drum (34) and the counter electrode may provide a bias voltage to the IC-PECVD plasma. This voltage will increase the energy of ion bombardments on the deposited surface, which is understood to be beneficial for the performance of the deposited multi-material layer. The bias voltage can be adjusted as long as it can produce a stable plasma for all desired application methods used in a given production process.

[0083] The combination of the first subunit 46 for CC-PECVD and the second subunit 48 for IC-PECVD allows for easy selection and combination of different methods for producing the silicon dioxide component of the hybrid coating layer 38.

[0084] In Figure 1, a total of eight first subunits 46 and second subunits 48 are used, with equal numbers of each subunit 46 and 48. Of course, the total number and / or distribution of the first subunits 46 and second subunits 48 may differ from the embodiment shown in Figure 1.

[0085] The second coating unit 16 is configured to apply an aluminum species, i.e., aluminum or aluminum oxide, onto the substrate 22. More specifically, aluminum or aluminum oxide can be applied by the second coating unit 16 onto the substrate 22 on which at least one type of silicon oxide has already been deposited by the first coating unit 14.

[0086] Within the second coating unit 16, a second vacuum chamber 52 is formed within the second vacuum chamber housing 54. Therefore, the total volume for which a vacuum needs to be created within the second coating unit 16 is limited to the total volume of air within the second vacuum chamber housing 54.

[0087] A physical vapor deposition (PVD) unit 56 is located inside the second vacuum chamber 52. The PVD unit 56 includes a heating element 58, such as a resistance heating element, configured to heat an aluminum tank 60 for evaporating aluminum.

[0088] Furthermore, during the operation of the second coating unit 16, a gas mixture containing oxygen species is supplied into the second vacuum chamber 52 by an injection system (not shown) so that the second coating unit 16 can deposit aluminum oxide on the substrate 22. Thus, the second coating unit 16 is a unit for reactive PVD.

[0089] When supplying aluminum onto the substrate 22 within the second coating unit 16, the same mechanism can be used, but it is not necessary to supply oxygen species into the second vacuum chamber 52.

[0090] The combination of the first coating unit 14 and the second coating unit 16 allows the illustrated material processing machine 10 to be used to produce hybrid coating layers 38 of different compositions, thereby enabling the manufacture of a adapted multilayer material 26.

[0091] For example, in the first coating unit 14, silicon oxide can be applied only by CC-PECVD, i.e., by the first subunit 46, and in the second coating unit 16, aluminum oxide is supplied as an additional coating layer component of the hybrid coating layer 38. Thus, the resulting multilayer material 26 collected on the winding roll 30 has a very good property profile due to the silicon oxide applied by CC-PECVD, but the application of aluminum oxide in the second coating unit 16 allows the overall deposition rate of the hybrid coating layer 38 to be sufficiently high.

[0092] Alternatively, in the first coating unit 14, silicon dioxide can be applied only by IC PECVD, i.e., by the first subunit 46, and in the second coating unit 16, aluminum dioxide is supplied as an additional coating layer component of the hybrid coating layer 38.

[0093] Furthermore, it is possible to apply silicon oxide by both CC-PECVD and IC-PECVD, regardless of whether or not aluminum oxide is additionally applied in the second coating unit 16.

[0094] Therefore, the material processing machine 10 according to the present invention is compact overall, yet enables highly flexible and cost-effective manufacturing of multilayer materials.

[0095] Of course, the material processing machine 10 may include further processing modules, such as an extrusion module for applying an additional coating layer onto the hybrid coating layer 38, and / or a printing module for applying ink onto the substrate 22 or multilayer material 26.

[0096] In the embodiment shown in Figure 1, both the first coating unit 14 and the second coating unit 16 comprise drums 34 and 36, respectively, on which the substrate 22 is supported as it moves along the handling path. However, the first coating unit 14 and / or the second coating unit 16 may also be configured to guide the substrate 22 in a free-span manner along the handling path.

[0097] Further embodiments of the material processing machine 10 having different first coating units 14 are described below. The further embodiments will basically correspond to the first embodiment, with only the differences being described. The same reference numerals indicate the same or functionally identical components and refer to the above description.

[0098] Figure 2 shows selected elements of a second embodiment of the sheet processing machine 10, where the first subunit 46 and the second subunit 48 are arranged differently from those in the first embodiment.

[0099] More specifically, the first subunit 46 is arranged as a first module 62 comprising two first subunits 46, each arranged adjacent to one another along a handling path for the substrate 22, and the second subunit 48 is arranged as a second module 64 comprising two second subunits 48, each arranged adjacent to one another along a handling path for the substrate 22.

[0100] In this case as well, the first module 62 and the second module 64 are arranged alternately along the handling path of the substrate 22.

[0101] The modular arrangement can reduce the degree of interference between the different types of subunits 46 and 48 used in the first coating unit 14, particularly the plasma-to-plasma interference that occurs between the subunits 46 and 48 and the drum 34. It is also possible to design each of the submodules 62 and 64 in a basically curved arrangement, while still using an antenna 50 that is basically a rectangular profile, so that the antenna 50 is positioned more closely along the circumference of the drum 34.

[0102] Figure 3 shows selected elements of a third embodiment of the sheet processing machine 10, in which the first subunit 46 and the second subunit 48 are arranged differently compared to the first and second embodiments.

[0103] In the third embodiment, all of the first subunit 46 is located in the first half of the circumference of the drum 34, i.e., in the first half of the area of ​​the handling path defined by the drum 34. All of the second subunit 48 is located in the second half of the circumference of the drum 34.

[0104] This arrangement further simplifies the design of the first subunit 46 and the second subunit 48, and further minimizes interference between the CC-PECVD performed by the first subunit 46 and the IC-PECVD performed by the second subunit 48.

[0105] Figures 4 and 5 show selected elements of a fourth embodiment of the sheet processing machine 10.

[0106] In the fourth embodiment, the drum 34 of the first coating unit 14 is replaceable, and the drum 34 and the first subunits 46 and 48 associated with the drum 34 can be replaced during the production process of the material processing machine 10.

[0107] For example, as shown in Figures 4 and 5, in the first operating mode of the material processing machine 10, all subunits associated with the drum 34 used by the first coating unit 14 are the first subunits 46 for coating silicon oxide by CC PECVD (Figure 4), and in the second operating mode of the material processing machine 10, all subunits associated with the drum 34 used by the first coating unit 14 are the second subunits 48 for coating silicon oxide by IC-PECVD.

[0108] In this way, the overall deposition rate of individual coating layer components applied by the currently used types of subunits can be increased without making further changes to other components of the sheet processing machine 10. Furthermore, the design of each first coating unit 14 is simplified, with no possibility of interference between different types of subunits.

[0109] The drum 34 and its associated subunits can be replaced by a handling system, in which case the drum 34 can be handled, for example, by a drum reel 66.

[0110] Figure 6 shows the selected elements of the first coating unit 14 in Figure 4 in more detail.

[0111] From this depiction, it can be seen that the first subunit 46 is attached to the rack element 68. The rack element 68 provides fixed mounting positions for each of the first subunits 46.

[0112] Preferably, the sizes of the first subunit 46 and the second subunit 48 are standardized, such that they can be mounted on the same rack element 68. Thus, individual or all of the current subunits used in the first coating unit 14 can be easily replaced.

[0113] Reactive chemical species can be supplied to the region between the antenna 50 and the drum 34 by the injection system 51. The reactive chemical species may be, for example, hexamethyldisiloxane (HDMSO) and oxygen. Further process gases, such as helium, can also be added by the injection system 51.

[0114] Overall, the material processing machine 10 according to the present invention provides highly flexible manufacturing of multilayer materials having optimized properties and cost profiles. [Explanation of symbols]

[0115] 10 Sheet material processing machine 14. First coating unit 16. Second coating unit 22 Base material 26 Multilayer materials 38 Hybrid coating layer

Claims

1. A material processing machine (10) for manufacturing a multilayer material (26) comprising a base material (22) and a hybrid coating layer (38) applied on the base material (22), The hybrid coating layer (38) comprises at least two coating layer components selected from the group consisting of silicon dioxide coated by capacitive PECVD, silicon dioxide coated by inductive PECVD, aluminum, and aluminum oxide. The material processing machine (10) comprises a first coating unit (14) for applying the coating layer component containing silicon oxide onto the substrate (22), and a second coating unit (16) for applying the coating layer component containing aluminum oxide onto the substrate. The first coating unit (14) and the second coating unit (16) are arranged along the handling path of the substrate (22), The first coating unit (14) comprises at least one first subunit (46) for capacitively coupled PECVD and at least one second subunit (48) for inductively coupled PECVD. A material processing machine (10) in which the first subunit (or more) (46) and the second subunit (or more) (48) are arranged alternately along the handling path of the substrate (22).

2. The material processing machine (10) according to claim 1, wherein the first coating unit (14) and / or the second coating unit (16) comprises drums (34, 36) for moving the substrate (22) along the handling path, and the drums (34, 36) are cooled.

3. The material processing machine (10) according to claim 1 or 2, wherein the first coating unit (14) and / or the second coating unit (16) are configured to guide the substrate (22) along the handling path in a free-span manner.

4. The material processing machine (10) according to any one of claims 1 to 3, wherein the first coating unit (14) comprises at least two first subunits (46) and at least two second subunits (48), all of which the first subunits (46) are located in a first path area of ​​the handling path, and all of which the second subunits (48) are located in a second path area of ​​the handling path, the second path area continuing from the first path area along the handling path of the substrate (22).

5. A material processing machine (10) for manufacturing a multilayer material (26) comprising a base material (22) and a hybrid coating layer (38) applied on the base material (22), The hybrid coating layer (38) comprises at least two coating layer components selected from the group consisting of silicon dioxide coated by capacitive PECVD, silicon dioxide coated by inductive PECVD, aluminum, and aluminum oxide. The material processing machine (10) comprises a first coating unit (14) for applying the coating layer component containing silicon oxide onto the substrate (22), and a second coating unit (16) for applying the coating layer component containing aluminum oxide onto the substrate. The first coating unit (14) and the second coating unit (16) are arranged along the handling path of the substrate (22), The hybrid coating layer (38) is applied to the substrate (22) at a deposition rate of 20 nm / s or more, preferably 35 nm / s or more, using a material processing machine (10).

6. A material processing machine (10) for manufacturing a multilayer material (26) comprising a base material (22) and a hybrid coating layer (38) applied on the base material (22), The hybrid coating layer (38) comprises at least two coating layer components selected from the group consisting of silicon dioxide coated by capacitive PECVD, silicon dioxide coated by inductive PECVD, aluminum, and aluminum oxide. The material processing machine (10) comprises a first coating unit (14) for applying the coating layer component containing silicon oxide onto the substrate (22), and a second coating unit (16) for applying the coating layer component containing aluminum oxide onto the substrate. The first coating unit (14) and the second coating unit (16) are arranged along the handling path of the substrate (22), A material processing machine (10) wherein the first coating unit that provides silicon is located upstream of the second coating unit that provides aluminum.

7. A method for producing a multilayer material (26) comprising a base material (22) and a hybrid coating layer (38) applied on the base material (22), The hybrid coating layer (38) comprises at least two coating layer components selected from the group consisting of silicon dioxide coated by capacitive PECVD, silicon dioxide coated by inductive PECVD, aluminum, and aluminum oxide, and the method is A step of providing a material processing machine (10) according to any one of claims 1 to 6, The steps include moving the substrate (22) along the handling path at a predetermined processing speed, thereby applying the hybrid coating layer (38) onto the substrate (22), Includes, The hybrid coating layer (38) is applied to the substrate (22) at a deposition rate of 20 nm / s or more, preferably 35 nm / s or more.

8. The method according to claim 7, wherein the predetermined processing speed is 225 m / min or more, preferably 300 m / min or more.

9. A multilayer material (26) comprising a base material (22) and a hybrid coating layer (38) applied on the base material (22), The hybrid coating layer (38) is a multilayer material (26) comprising at least two coating layer components selected from the group consisting of silicon oxide coated by capacitive PECVD, silicon oxide coated by inductive PECVD, aluminum, and aluminum oxide.

10. The multilayer material (26) is the multilayer material (26) according to claim 9, obtained by the method described in either claim 7 or 8.

11. The multilayer material (26) according to claim 9 or 10, wherein the hybrid coating layer (38) has a thickness in the range of 1 to 30 nm, preferably 5 to 20 nm, and particularly preferably 8 to 15 nm.

12. The multilayer material (26) has a density of 2.0 g / (m²) at a relative humidity of 90% and a temperature of 37.8°C. 2 A multilayer material (26) according to any one of claims 10 to 12, having a water vapor permeability of less than ×24h.

13. At a relative humidity of 50% and a temperature of 23.0°C, 2.0 cm 3 / (m 2 A multilayer material (26) according to any one of claims 9 to 12, having an oxygen permeability of less than ×24h.

14. The multilayer material (26) according to any one of claims 9 to 13, wherein the substrate (22) is a continuous web or a discontinuous sheet.

15. The multilayer material (26) according to any one of claims 9 to 14, wherein the substrate (22) comprises a polymer selected from the group consisting of polyolefin, polyethylene terephthalate (PET), polylactic acid (PLA), polyhydroxyalkanoate (PHA), poly-3-hydroxybutyrate (PHB), cellophane, polyvinyl alcohol (PVOH) and / or ethylene vinyl alcohol (EVOH) and / or cellulose-based materials and / or polyolefin, preferably polypropylene and / or polyethylene.

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