Method for returning a lift assembly for a substrate processing chamber to its fixed position, and related apparatus and components.

Abstract

This disclosure relates to a method for returning a lift assembly for a processing chamber to a fixed position, and related apparatus and components. In one or more embodiments, a non-transient computer-readable medium includes instructions for performing a number of steps. The steps include detecting a fault condition and determining a first position of a first support frame along a first range of movement. The steps include determining a second position of a second support frame along a second range of movement. The second range of movement overlaps with the first range of movement by an overlapping range. The steps include determining whether the first position is in an inward state or an outward state. An inward state is within the overlapping range, and an outward state is outside the overlapping range. The steps include moving the first support frame and the second support frame to a first retracted position and a second retracted position, respectively.

Description

Technical Field

[0001]

[0001] This disclosure relates to a method for returning a lift assembly for a substrate processing chamber to a fixed position, as well as related devices and components.

Background Art

[0002]

[0002] Semiconductor substrates are processed for various applications including the manufacture of integrated devices and micro-devices. However, processes (such as epitaxial deposition processes) can be time-consuming, expensive, inefficient, and may have limited capacity and throughput. Further, the hardware may involve relatively large dimensions that occupy a larger installation area within a manufacturing facility. For example, during the substrate transfer process, the movement of certain components may be restricted by other components. As an example, it may be infeasible to move two components simultaneously at a certain point. As another example, it may be impossible to move the first component without first moving the second component at a certain point. Such movement restrictions can cause unnecessary movement or movement delays and can affect processing time and throughput.

[0003]

[0003] Furthermore, the movement of components may be accompanied by collisions, damage, and / or component failures, which can result in chamber downtime, processing delays, and / or increased costs. For example, dimensions and installation area may increase the likelihood of collisions.

[0004]

[0004] Such obstacles may worsen in relatively complex processing steps such as batch epitaxial processing.

[0005]

[0005] Therefore, there is a need for improved devices and methods in semiconductor processing.

Summary of the Invention

[0006]

[0006] This disclosure relates to a method for returning a lift assembly for a substrate processing chamber to a fixed position, and related apparatus and components. In one or more embodiments, the lift assembly can be used to move one or more lift pins and one or more substrate supports independently.

[0007]

[0007] In one or more embodiments, a non-transient computer-readable medium includes instructions that, when executed, cause a plurality of steps to be performed. The steps include detecting a fault condition and determining a first position of a first support frame along a first range of movement. The steps include determining a second position of a second support frame along a second range of movement. The second range of movement overlaps with the first range of movement by an overlapping range. The steps include determining whether the first position is in an inward state or an outward state. An inward state is within the overlapping range, and an outward state is outside the overlapping range. The steps include moving the first support frame and the second support frame to a first retracted position and a second retracted position, respectively.

[0008]

[0008] In one or more embodiments, a lift assembly for placement in relation to a substrate processing chamber includes a first motor, a first drive assembly connected to the first motor, and a first support block connected to the first drive assembly. The first motor is configured to linearly move the first support block using the first drive assembly. The lift assembly includes a second motor, a second drive assembly connected to the second motor, and a second support block connected to the second drive assembly. The second motor is configured to linearly move the second support block using the second drive assembly. The second motor is configured to linearly move the second support block independently of the first motor which linearly moves the first support block. The lift assembly includes a controller communicating with the first motor and the second motor. The controller includes instructions that, when executed by a processor, perform a plurality of steps. The plurality of steps include detecting a fault condition and determining a first position of the first support block along a first range of movement. The process includes determining a second position of a second support block along a second range of movement. The second range of movement overlaps with the first range of movement by an overlapping range. The process includes determining whether the first position is in an inward state or an outward state. The inward state is within the overlapping range, and the outward state is outside the overlapping range. The process includes moving the first support block and the second support block to a first retracted position and a second retracted position, respectively.

[0009]

[0009] In one or more embodiments, the substrate transport method includes moving a first substrate into a chamber and raising a second support frame relative to a first support frame to engage with the first substrate. The first support frame includes a first shaft and a plurality of first arms, and the second support frame includes a second shaft and a plurality of second arms. The method includes lowering the second support frame relative to the first support frame to land the first substrate on the first substrate support. The method includes detecting a fault condition, determining a first position of the first support frame along a first range of movement, and determining a second position of the second support frame along a second range of movement. The second range of movement overlaps with the first range of movement by an overlapping range. The method includes determining whether the first position is in an inward state or an outward state. An inward state is within the overlapping range, and an outward state is outside the overlapping range. This method includes lowering the first support frame and the second support frame to a first retracted position and a second retracted position, respectively.

[0010]

[0010] In order to understand the features of the present disclosure described above in detail, the present disclosure summarized above will be described more specifically with reference to embodiments illustrated in part in the accompanying drawings. However, it should be noted that the accompanying drawings are merely illustrative embodiments and should not be considered limiting in scope, and the present disclosure may also permit other equally valid embodiments. [Brief explanation of the drawing]

[0011] [Figure 1] This is a schematic side cross-sectional view of a processing apparatus according to one or more embodiments. [Figure 2] This is a schematic side cross-sectional view of the processing apparatus shown in Figure 1, according to one or more embodiments. [Figure 3] This is a partial schematic perspective front view of the first side of a lift assembly according to one or more embodiments. [Figure 4]This is a partial schematic perspective rear view of the first side of the lift assembly shown in Figure 3, according to one or more embodiments. [Figure 5] These are partial schematic side cross-sectional views of the lift assembly shown in Figures 3 and 4 according to one or more embodiments. [Figure 6] This is a partially schematic, enlarged perspective front view of the second side of the lift assembly shown in Figures 3 to 5, according to one or more embodiments. [Figure 7A] This is a schematic block diagram of a substrate transfer method according to one or more embodiments. [Figure 7B] This is a schematic block diagram showing a continuation of the method shown in Figure 7A, according to one or more embodiments. [Figure 8A] This diagram shows (from a partially schematic side view) the process flow for transferring two substrates onto a cassette in a processing chamber, according to one or more embodiments. [Figure 8B] This diagram shows (from a partially schematic side view) the process flow for transferring two substrates onto a cassette in a processing chamber, according to one or more embodiments. [Figure 8C] This diagram shows (from a partially schematic side view) the process flow for transferring two substrates onto a cassette in a processing chamber, according to one or more embodiments. [Figure 8D] This diagram shows (from a partially schematic side view) the process flow for transferring two substrates onto a cassette in a processing chamber, according to one or more embodiments. [Figure 9] This is a schematic diagram of a method for returning a support frame to its fixed position according to one or more embodiments. [Modes for carrying out the invention]

[0012]

[0021] For ease of understanding, the same reference numerals are used to indicate identical elements common to the drawings whenever possible. Elements and features of one embodiment are considered to be usefully incorporated into other embodiments without further detail.

[0013]

[0022] This disclosure relates to a method for returning a lift assembly for a substrate processing chamber to a fixed position, as well as related apparatus and components. In one or more embodiments, the lift assembly can be used to move one or more lift pins and one or more substrate supports independently.

[0014]

[0023] This disclosure assumes that terms such as “joined, connected,” “joined, connected,” and “connected” may include, but are not limited to, fastening by welding, fusion, fusion bonding, interference fitting, and / or using bolts, screw connections, pins, and / or screws. This disclosure assumes that terms such as “joined, connected,” “joined, connected,” and “connected” may include, but are not limited to, integral formation. This disclosure assumes that terms such as “joined, connected,” “joined, connected,” and “connected” may include, but are not limited to, direct joining, connecting, and / or indirect joining, connecting, and / or connecting via components such as links, blocks, and / or frames.

[0015]

[0024] Figure 1 is a schematic side cross-sectional view of a processing apparatus 100 according to one or more embodiments. The side heat sources 118a and 118b shown in Figure 2 are not shown in Figure 1 for visual clarity. The processing apparatus 100 includes a processing chamber having a chamber body 130 that defines a processing area 124.

[0016]

[0025] The cassette 1030 is positioned within the processing region 124 and is at least partially supported by a substrate support assembly 119 (such as a pedestal assembly). The cassette 1030 is positioned inside the first shield plate 161. The cassette 1030 includes a first cassette plate 1032, a second cassette plate 1031 spaced apart from the first cassette plate 1032, and a plurality of levels for supporting a plurality of substrates 107 for simultaneous processing (such as epitaxial deposition). In the implementation shown in FIG. 1, the cassette 1030 supports 12 substrates. The cassette 1030 can support other numbers of substrates, including but not limited to 2 substrates 107, 3 substrates 107, 6 substrates 107, or 8 substrates 107.

[0017]

[0026] The processing apparatus 100 includes an upper window 116 such as a dome disposed between the lid 104 and the processing region 124. The processing apparatus 100 includes a lower window 115 disposed below the processing region 124. One or more upper heat sources 106 are disposed above the processing region 124 and the upper window 116. The one or more upper heat sources 106 may be radiation heat sources such as lamps, for example, halogen lamps. In one or more embodiments, the lamp is operable to emit infrared light and / or ultraviolet light. The one or more upper heat sources 106 are positioned between the upper window 116 and the lid 104. The upper heat source 106 is positioned to provide uniform heating of the substrate 107. One or more lower heat sources 138 are positioned below the processing region 124 and the lower window 115. The one or more lower heat sources 138 may be radiation heat sources such as lamps, for example, halogen lamps. In one or more embodiments, the lamp is operable to emit infrared light and / or ultraviolet light. The lower heat source 138 is disposed between the lower window 115 and the floor 134 of the processing region 124. The lower heat source 138 is positioned to provide uniform heating of the substrate 107.

[0018]

[0027] The present disclosure contemplates that other heat sources (in addition to, or instead of, the lamp) may be used for the various heat sources described herein. For example, for the various heat sources described herein, a resistance heater, a light emitting diode (LED), and / or a laser can be used.

[0019]

[0028] The upper window 116 and the lower window 115 may be transparent to infrared radiation, such as transmitting at least 95% of infrared radiation. The upper window 116 and the lower window 115 may be made of a quartz material (such as transparent quartz). In one or more embodiments, the upper window 116 includes an inner window 193 and an outer window support 194. The inner window 193 may be a thin quartz window that partially defines the processing region 124. The outer window support 194 supports the inner window 193 and is disposed at least partially within a support groove. In one or more embodiments, the lower window 115 includes an inner window 187 and an outer window support 188. The inner window 187 may be a thin quartz window that partially defines the processing region 124. The outer window support 188 supports the inner window 187.

[0020]

[0029] The substrate support assembly 119 is disposed within the processing region 124. One or more liners 120 are disposed within the processing region 124 and surround the substrate support assembly 119. The one or more liners 120 facilitate protecting the chamber body 130 from processing chemicals within the processing region 124. The chamber body 130 is disposed at least partially between the upper window 116 and the lower window 115. The one or more liners 120 are disposed between the processing region 124 and the chamber body 130.

[0021]

[0030] The processing apparatus 100 includes a plurality of gas injection passages 182 formed within the chamber body 130 and fluidly connected to the processing area 124, and one or more gas exhaust passages 172 (multiple shown in Figure 1) formed on the opposite side of the plurality of gas injection passages 182 within the chamber body 130. The one or more gas exhaust passages 172 are fluidly connected to the processing area 124. The plurality of gas injection passages 182 and the one or more gas exhaust passages 172 each penetrate one or more side walls of the chamber body 130 and penetrate one or more liners 120 that line the one or more side walls of the chamber body 130.

[0022]

[0031] Each gas injection passage 182 includes a gas channel 185 formed within the chamber body 130 and one or more gas openings 186 (two and three shown in Figure 1) formed within the liner 120. One or more supply conduit systems are fluidically connected to the gas injection passages 182. In Figure 1, an inner supply conduit system 121 and an outer supply conduit system 122 are fluidly connected to the gas injection passages 182. The inner supply conduit system 121 includes a plurality of inner gas boxes 123 attached to the chamber body 130 and fluidly connected to a series of inner gas injection passages 182. The outer supply conduit system 122 includes a plurality of outer gas boxes 117 attached to the chamber body 130 and fluidly connected to a series of outer gas injection passages 182. This disclosure assumes that various gas supply systems (e.g., one or more supply conduit systems, gas injection passages, and / or gas boxes different from those shown in Figure 1) may be used.

[0023]

[0032] The processing apparatus 100 includes a flow guide structure 150 positioned within the processing area 124. The flow guide structure 150 divides the processing area into a plurality of flow levels 153 (four flow levels are shown in Figure 1). In one or more embodiments, the flow guide structure 150 includes at least three flow path levels 153 and a plurality of flow sections 154 (two flow sections 154 are shown for each flow level 153 in Figure 1). A plurality of gas injection passages 182 are positioned as a plurality of injection levels, so that each gas injection passage 182 corresponds to one of the plurality of injection levels. Each injection level is aligned with its respective flow level 153. The processing apparatus 100 includes a heat shield structure 1060 positioned within the processing area 124. The heat shield structure 1060 includes a first shield plate 161 and a second shield plate 1062.

[0024]

[0033] The flow guide structure 150 includes a plurality of divided inlet openings 155 and a plurality of divided outlet openings 156 formed therein. The divided outlet openings 156 are on the opposite side of the divided inlet openings 155. The heat shield structure 1060 includes a plurality of shield inlet openings 165 and a plurality of shield outlet openings 166. The flow guide structure 150 and / or the heat shield structure 1060 are formed from one or more quartz (transparent quartz (e.g., clear quartz), opaque quartz (e.g., gray quartz and / or white quartz, and / or black quartz), silicon carbide (SiC), and / or SiC-coated graphite).

[0025]

[0034] The cassette 1030 is positioned inside the first shield plate 161. The preheating ring 111 is positioned outside the cassette 1030. The preheating ring 111 is connected to and / or at least partially supported by one or more liners 120. Part of the flow guide structure 150 may function as a preheating ring for the entire flow section 154 of each flow level 153. The preheating ring 111 may be part of the flow guide structure 150 (e.g., integrally formed).

[0026]

[0035] As described below, this disclosure assumes that the flow guide structure 150 and / or the heat shield structure 1060 may be omitted.

[0027]

[0036] During the process (e.g., during the epitaxial deposition process), one or more process gases P1 are supplied to the processing area 124 through an inner supply conduit system 121 and an outer supply conduit system 122, and through a plurality of gas injection passages 182. The one or more process gases P1 are supplied from one or more gas sources 196 that are fluidly connected to the plurality of gas injection passages 182. Each gas injection passage 182 is configured to direct the one or more process gases P1 generally radially inward toward the cassette 1030. Thus, in one or more embodiments, the gas injection passages 182 may be part of a cross-flow gas injector. The flow(s) of one or more process gases P1 can be divided into a plurality of flow levels 153.

[0028]

[0037] The processing apparatus 100 includes an exhaust conduit system 190. One or more process gases P1 can be exhausted through exhaust gas openings formed in one or more liners 120, exhaust gas channels formed in the chamber body 130, and then through an exhaust gas box 1091. From the exhaust gas box 1091, the one or more process gases P1 can flow to an optional common exhaust box 1092 and then exit through the conduit using one or more pumping devices 197 (e.g., one or more vacuum pumps).

[0029]

[0038] One or more processing gases P1 may include, for example, a purge gas, a washing gas, and / or a deposition gas. The deposition gas may include, for example, one or more reactive gases supported in one or more carrier gases. One or more reactive gases may include, for example, silicon and / or germanium-containing gases (silane (SiH4), disilane (Si2H6), dichlorosilane (SiH2Cl2), and / or germane (GeH4), etc.), chlorine-containing etching gases (hydrogen chloride (HCl), etc.), and / or dopant gases (phosphine (PH3) and / or diborane (B2H6), etc.). One or more purge gases may include, for example, one or more of argon (Ar), helium (He), nitrogen (N2), hydrogen chloride (HCl), and / or hydrogen (H2).

[0030]

[0039] The purge gas P2 supplied from the purge gas source 129 is introduced into the bottom region 105 of the processing region 124 through one or more purge gas inlets 184 formed in the side wall of the chamber body 130.

[0031]

[0040] One or more purge gas inlets 184 are positioned at a height below the gas injection passage 182. If one or more liners 120 are used, one section of one or more liners 120 may be positioned between the gas injection passage 182 and one or more purge gas inlets 184. One or more purge gas inlets 184 are configured to direct the purge gas P2 generally radially inward. One or more purge gas inlets 184 may be configured to direct the purge gas P2 upward. During the film formation process, the substrate support assembly 119 is positioned so that the purge gas P2 can easily flow along a channel that generally crosses the back side of the cassette 1030. The purge gas P2 exits from the bottom region 105 and is exhausted from the processing apparatus 100 through one or more purge gas exhaust passages 102 located opposite the one or more purge gas inlets 184 in the processing region 124.

[0032]

[0041] The substrate support assembly 119 includes a first support frame 199 and a second support frame 198 at least partially positioned around the first support frame 199. The first support frame 199 includes arms connected to the cassette 1030, so that the raising and lowering of the first support frame 199 causes the cassette 1030 to rise and fall. A number of lift pins 189 are suspended from the cassette 1030. As the cassette 1030 descends and / or the second support frame 198 rises, contact is initiated between the lift pins 189 and the arms of the second support frame 198. As the cassette 1030 continues to descend and / or the second support frame 198 continues to rise, the lift pins 189 begin to contact the substrate within the cassette 1030, causing the lift pins 189 to raise the substrate within the cassette 1030. The bottom region 105 of the processing unit 100 is defined between the floor 134 and the cassette 1030.

[0033]

[0042] The first shaft 126 of the first support frame 199, the second shaft 125 of the second support frame 198, and a section 151 of the lower window 115 extend through ports formed in the bottom 135 and floor 134 of the chamber body 130. As will be described later, each shaft 125, 126 is connected to one or more motors, which are configured to independently raise, lower, and / or rotate the cassette 1030 using the first support frame 199, and to independently raise and lower the lift pin 189 using the second support frame 198. The first support frame 199 includes the first shaft 126 and a plurality of first arms 1021 configured to support the cassette 1030, which includes one or more substrate supports 212. The second support frame 198 includes the second shaft 125 and a plurality of second arms 1022 configured to connect with and support the lift pin 189.

[0034]

[0043] An opening 136 (substrate transfer opening) is formed through one or more side walls of the chamber body 130. The opening 136 can be used to transfer the substrate 107 to or from the cassette 1030, for example, to or from the processing area 124. In one or more embodiments, the opening 136 includes a slit valve. In one or more embodiments, the opening 136 may be connected to any suitable valve that allows the substrate to pass through it. For visual clarity, the opening 136 is shown by a dotted line in Figures 1 and 2.

[0035]

[0044] The processing apparatus 100 may include one or more temperature sensors 191, 192, 282, such as optical pyrometers, for measuring the temperature inside the processing apparatus 100 (the surface of the upper window 116, and / or the substrate 107, the heat shield structure 1060, and / or one or more surfaces of the cassette 1030, etc.). One or more temperature sensors 191, 192 are located on the lid 104. One or more temperature sensors 282 (e.g., lower pyrometers) are located below the lower window 115. One or more temperature sensors 282 may be located adjacent to and / or on the bottom 135 of the chamber body 130.

[0036]

[0045] In one or more embodiments, the upper temperature sensors 191 and 192 are oriented toward the upper part of the cassette 1030 (e.g., the upper surface of the second cassette plate 1031). In one or more embodiments, the side temperature sensor 281 is oriented toward the first shield plate 161 and / or substrate support 212 of the cassette 1030. In one or more embodiments, the lower temperature sensor 282 is oriented toward the bottom of the cassette 1030 (e.g., the lower surface of the first cassette plate 1032).

[0037]

[0046] The processing apparatus 100 includes a controller 1070 configured to control the processing apparatus 100 or its components. For example, the controller 1070 can control the operation of the components of the processing apparatus 100 by using direct control of the components or by controlling controllers associated with the components. In the process, the controller 1070 enables data collection and feedback from each chamber to adjust and control the performance of the processing apparatus 100.

[0038]

[0047] The controller 1070 generally includes a central processing unit (CPU) 1071, memory 1072, and support circuitry 1073. The CPU 1071 may be one of any general-purpose processors available for use in an industrial environment. The memory 1072, or non-transient computer-readable medium, is accessible by the CPU 1071 and may be one or more types of memory such as random access memory (RAM), read-only memory (ROM), floppy disks, hard disks, or any other form of local or remote digital storage. The support circuitry 1073 is connected to the CPU 1071 and may include a cache, clock circuitry, input / output subsystems, power supply, etc.

[0039]

[0048] Various methods (e.g., Method 700 and / or Method 900) and processes disclosed herein can generally be implemented under the control of the CPU 1071 by the CPU 1071 executing computer instruction code stored in memory 1072 (or memory of a particular processing chamber) as, for example, software routines. When the computer instruction code is executed by the CPU 1071, the CPU 1071 controls the components of the processing unit 100 to perform the operations relating to the various methods and processes described herein. In one or more embodiments, memory 1072 (a non-transient computer-readable medium) contains instructions stored therein that, when executed, cause the methods (e.g., Method 700 and / or Method 900) and processes (e.g., Processes 702-734 and / or Processes 902-910) described herein to be implemented. The processes described herein may be stored in memory 1072 in the form of computer-readable logic. The controller 1070 can communicate with, for example, the heat source, gas source, and / or vacuum pump(s) of the processing unit 100 to perform a number of processes. The controller 1070 can control the lift assembly 300 described below. The controller 1070 can control the motors 310, 340, and 370 described below, for example, to implement at least part of method 700 and / or method 900.

[0040]

[0049] The controller 1070 may include one or more machine learning and / or artificial intelligence (ML / AI) algorithms. One or more ML / AI algorithms may optimize the detection of fault conditions (of process 902) and optimize the execution of processes 904, 906, 908, and 910 of method 900 based on the detection of fault conditions. One or more ML / AI algorithms may use, for example, a regression model (such as a linear regression model) or a clustering technique to estimate optimized parameters. The algorithms may be unsupervised or supervised. In one or more embodiments, the controller 1070 automatically executes the processes described herein without using one or more ML / AI algorithms. In one or more embodiments, the controller 1070 determines whether a fault condition has been detected by comparing the measured values ​​with data in a lookup table and / or library. The controller 1070 may store the measured values ​​as data in a lookup table and / or library.

[0041]

[0050] Figure 2 is a schematic side cross-sectional view of the processing apparatus 100 shown in Figure 1, according to one or more embodiments. The cross-sectional view shown in Figure 2 is rotated 55 degrees relative to the cross-sectional view shown in Figure 1.

[0042]

[0051] The processing apparatus 100 includes one or more side heat sources 118a, 118b (e.g., side lamps, side resistance heaters, side LEDs, and / or side lasers) positioned outside the processing area 124. One or more second side heat sources 118b are located on the opposite side of the processing area 124 from one or more first side heat sources 118a.

[0043]

[0052] In Figure 2, the flow guide structure 150 and the heat shield structure 1060 are not shown for the purpose of visual clarity. Furthermore, this disclosure assumes that the flow guide structure 150 and / or the heat shield structure 1060 may be omitted from the processing apparatus 100 shown in Figures 1 and 2. In such embodiments, one or more process gases P1 flow from the gas injection passage 182 into the outer annular portion of the processing area 124, then into the opening 216 between the substrate supports 212 (e.g., arched supports) of the cassette 1030 and the area outside thereto, and then into the gaps between the substrates 107. One or more process gases P1 flow out of the gaps into the exhaust-side opening 216 of the substrate 107 (between and outside the substrate supports), flow into the outer annular portion of the processing area 124, and flow into one or more gas exhaust passages 172. The disclosure also assumes that multiple lines (conduits, etc.) within the processing area 124 may connect each gas injection passage 182 to each inlet opening of the cassette 1030.

[0044]

[0053] In addition to one or more temperature sensors 191, 192 positioned above the processing area 124 and above the second shield plate 1062, the processing apparatus 100 may include one or more temperature sensors 281, such as an optical pyrometer, for measuring the temperature inside the processing apparatus 100 (e.g., the surface of the upper window 116 and / or the substrate 107, the heat shield structure 1060, the multiple windows 257, and / or one or more surfaces of the cassette 1030). If multiple windows 257 are used, the multiple windows 257 may be located in the gaps between one or more liners 120, or may be formed in one or more liners 120. One or more temperature sensors 281 are side temperature sensors (e.g., side pyrometers) positioned outside the processing area 124, outside the flow guide structure 150, and outside the multiple windows 257. One or more temperature sensors 281 may be radially aligned with the multiple windows 257, for example (as shown in Figure 2).

[0045]

[0054] One or more side temperature sensors 281 (one or more pyrometers, etc.) can be used to measure the temperature within the processing area 124 from each side of the processing area 124. The side sensors 281 are arranged at multiple sensor levels (three sensor levels are shown in Figure 2). In one or more embodiments, the number of sensor levels is equal to the number of heat source levels. Each side sensor 281 can be oriented horizontally or directed toward the substrate 107 and substrate support 212 at each level of the cassette 1030 (for example, it can be oriented at a downward angle).

[0046]

[0055] A cassette 1030 supporting multiple substrates 107 is shown in Figures 1 and 2. This disclosure assumes that the subject matter described herein may be used in relation to substrate supports (such as pedestals and / or one or more ring segments) that support a single substrate during processing.

[0047]

[0056] Figure 3 is a partial schematic perspective front view of the first side of a lift assembly 300 according to one or more embodiments.

[0048]

[0057] Figure 4 is a partial schematic perspective rear view of the first side of the lift assembly 300 shown in Figure 3, according to one or more embodiments.

[0049]

[0058] The lift assembly 300 is connected to the processing unit 100. For example, as shown in Figure 5, the lift assembly 300 is connected to the first shaft 126, the second shaft 125, and / or section 151 of the lower window 115.

[0050]

[0059] The lift assembly 300 includes a first motor 310, a first drive assembly 320 connected to the first motor 310, and a first support block 330 (e.g., a first support bracket) connected to the first drive assembly 320. In one or more embodiments, the first support block 330 is a substrate support block. The first motor 310 is mounted on a motor block 309. The first motor 310 is configured to linearly move the first support block 330 using the first drive assembly 320. The first drive assembly 320 includes a first drive shaft 321 connected to the first motor 310 and a first moving block 322 positioned along the first drive shaft 321. The first moving block 322 is coupled to the first support block 330 and configured to linearly move along the first drive shaft 321. In one or more embodiments, a plurality of plates 328, 329 are connected to a first support block 330 and / or a first movable block 322. A first motor 310 is configured to rotate a first drive shaft 321 to move the first movable block 322 so that the first support block 330 moves together with the first movable block 322. In one or more embodiments, the first drive shaft 321 is a first lead screw, and there is a first threaded joint between the first lead screw and the first movable block 322 such that the rotation of the first drive shaft 321 moves the first movable block 322 linearly along the first drive shaft 321.

[0051]

[0060] The lift assembly 300 includes a second motor 340, a second drive assembly 350 connected to the second motor 340, and a second support block 360 connected to the second drive assembly 350. In one or more embodiments, the second support block 360 is a lift pin support block. The second motor 340 is configured to linearly move the second support block 360 using the second drive assembly 350. The second motor 340 is configured to linearly move the second support block 360 independently of the first motor 310 which linearly moves the first support block 330. The second drive assembly 350 includes a second drive shaft 351 connected to the second motor 340 and a second moving block 352 arranged along the second drive shaft 351. The second movable block 352 is connected to the second support block 360 and configured to move linearly along the second drive shaft 351. In one or more embodiments, the second movable block 352 is connected to the second support block 360 using a plurality of plates 358, 359. The second motor 340 is configured to rotate the second drive shaft 351 to move the second movable block 352 so that the second support block 360 moves together with the second movable block 352. In one or more embodiments, the second drive shaft 351 is a second lead screw, and there is a second threaded joint between the second lead screw and the second movable block 352 such that the rotation of the second drive shaft 351 causes the second movable block 352 to move linearly along the second drive shaft 351.

[0052]

[0061] The second drive assembly 350 includes one or more stoppers 354, 355 (such as wheels and / or barrels) arranged along the second drive shaft 351 to restrict the linear movement of the second moving block 352 (and the second support block 360).

[0053]

[0062] The lift assembly 300 includes a support beam 365 and a mount block 366 connected to the support beam 365. A first motor 310 and a second motor 340 are connected to the mount block 366. A motor block 309 may be connected to the support beam 365 through the mount block 366, or the motor block 309 may be directly connected to the support beam 365. The support beam 365 includes one or more tracks 367 joined to a first support block 330. In one or more embodiments, the one or more tracks 367 are one or more openings (e.g., holes) formed in the support beam 365, and the first support block 330 includes one or more first legs 364 (e.g., two legs) extending through the one or more tracks 367 and connected to a first moving block 322. In one or more embodiments, the second support block 360 includes one or more second legs 361 connected to the second movable block 352.

[0054]

[0063] One or more restraints 324, 325, 326 (such as the ledge(s) of the support beam 365 and / or the end(s) of one or more tracks 367) restrict the linear movement of the first support block 330 (and the first moving block 322). For example, the front plate 377 of the first support block 330 can move to abut against the first restraint 324. For another example, the first leg 364 of the first support block 330 can move between the two restraints 325, 326.

[0055]

[0064] The support beam 365 is connected to the base block 368, which is connected to the base frame 369. The base frame 369 attaches the lift assembly 300 to the structure. For example, the base frame 369 may be connected to the main frame of the cluster tool.

[0056]

[0065] The lift assembly 300 includes a third motor 370 connected to the first support block 330. In one or more embodiments, the third motor 370 moves linearly in conjunction with the linear movement of the first support block 330.

[0057]

[0066] Figure 5 is a partial schematic side cross-sectional view of the lift assembly 300 shown in Figures 3 and 4 according to one or more embodiments. Some components are not shaded for visual clarity. The respective shafts 125, 126 may be integrally formed or may include one or more interconnected components. In the implementation shown in Figure 5, the first shaft 126 includes an internal rod 326a and an external rod 326b. The respective rods 326a, 326b may be integrally formed or may include one or more interconnected components.

[0058]

[0067] The first support block 330 supports the first shaft 126 of the first support frame 199 such that the linear movement of the first support block 330 causes the first support frame 199 to move linearly, causing the first support frame 199 to rise and / or fall. The linear movement of the first moving block 322 (driven by the first motor 310 which rotates the first drive shaft 321) causes the first support block 330 and the first support frame 199 to move linearly. In one or more embodiments, the first shaft 126 is connected to the first support block 330 (for example, by fasteners and / or overlapping shoulder interlocking fits).

[0059]

[0068] The second support block 360 supports the second shaft 125 of the second support frame 198 so that the linear movement of the second support block 360 causes the second support frame 198 to move linearly, causing the second support frame 198 to rise and / or fall. The linear movement of the second moving block 352 (driven by the second motor 340 which rotates the second drive shaft 351) causes the second support block 360 and the second support frame 198 to move linearly. The second motor 340 is configured to move the second moving block 352, the second support block 360, and the second support frame 198 linearly (e.g., up and / or down) independently of the first motor 310 which moves the first moving block 322, the first support block 330, and the first support frame 199 linearly (e.g., up and / or down). In one or more embodiments, the second shaft 125 is connected to the second support block 360 (for example, by fasteners and / or interlocking fits of overlapping shoulders).

[0060]

[0069] The first support block 330 is linearly movable along a first range of motion MR1. The first range of motion MR1 is between a first end linear position 502 and a second end linear position 504. The upper end 505 of the first support block 330 is movable within the first range of motion MR1 between the first end linear position 502 and the second end linear position 504. The position 507 of the upper end 505 along the first range of motion MR1 may be determined (e.g., tracked) during the process. Position 507 may be correlated with the position of the first support frame 199. The first end linear position 502 defines a first retracted position (e.g., fixed position) of the first support block 330. In one or more embodiments, the first retracted position is a zero position below which the first support block 330 cannot move.

[0061]

[0070] The second support block 360 is linearly movable along a second range of motion MR2, which is between the first end linear position 512 and the second end linear position 514. The lower end 515 of the second support block 360 is movable within the second range of motion MR2 between the first end linear position 512 and the second end linear position 514. The position 517 of the lower end 515 along the second range of motion MR2 may be determined (e.g., tracked) during the process. Position 517 may be correlated with the position of the second support frame 198. The first end linear position 512 defines a second retracted position (e.g., fixed position) of the second support block 360. In one or more embodiments, the second retracted position is a zero position below which the second support block 360 cannot move.

[0062]

[0071] The second movement range MR2 overlaps with the first movement range MR1 by only the overlapping range OR1. In Figure 5, position 507 is shown in an inward state where the upper end 505 is within the first movement range MR1. The first support block 330 can be lowered to an outward state where the upper end 505 is below the first end linear position 502 and outside the first movement range MR1.

[0063]

[0072] The first range of motion MR1 and / or the second range of motion MR2 may be defined (e.g., boundaries are defined) by components that restrict the linear movement of the respective support blocks 330, 360 and / or components that restrict the linear movement of the respective movement blocks 322, 352. In one or more embodiments, the first range of motion MR1 and / or the second range of motion MR2 may be defined (e.g., boundaries are defined) by one or more stop components described herein. In one or more embodiments, the first range of motion MR1 and / or the second range of motion MR2 may be defined (e.g., boundaries are defined) by the threaded lengths of the respective drive shafts 321, 351.

[0064]

[0073] The third motor 370 is configured to rotate the first shaft 126 of the first support frame 199 using a rotor 371 connected to the first shaft 126. The rotor 371 and the first shaft 126 are configured to rotate within the first support block 330 and relative to the first support block 330. The third motor 370 can rotate the first support frame 199 (and the substrate support 212 and substrate 107 of the cassette 1030 supported by the first support frame 199) during deposition processes such as epitaxial deposition.

[0065]

[0074] Each of the motors 310, 340, and 370 may include, for example, an electric motor such as a servo motor. Other motors are also conceivable for each of the motors 310, 340, and 370. The first and second motors 310 and 340 may be rotary motors or linear motors, respectively. The third motor 370 may be a rotary motor.

[0066]

[0075] The lift assembly 300 includes one or more position sensors 389 configured to measure the vertical position of the first support frame 199 and / or the second support frame 198 over a plurality of positions. The plurality of positions may include, for example, the processing position, the transport position, and the rotation start position of the first support frame 199. One or more position sensors 389 communicate with the controller 1070. When one or more position sensors 389 detect the rotation start position of the first support frame 199, the controller 1070 automatically instructs the third motor 370 to begin rotating the first support frame 199 (and the cassette 1030). The rotation start position is located perpendicularly between the processing position and the transport position so that the first support frame 199 passes through the rotation start position as it rises from the transport position toward the processing position. The plurality of positions may include a fixed position (for example, of the first support frame 199) between the rotation start position and the transport position.

[0067]

[0076] The position 507 of the first support block 330 can be determined, for example, by monitoring the first motor 310 using a controller 1070. In one or more embodiments, the controller 1070 monitors the number of rotations (e.g., revolutions) of the rotor of the first motor 310 and determines the position 507 by correlating the number of rotations with a parameter for the distance per rotation. The position 517 of the second support block 360 can be determined, for example, by monitoring the second motor 340 using a controller 1070. In one or more embodiments, the controller 1070 monitors the number of rotations (e.g., revolutions) of the rotor of the second motor 340 and determines the position 507 by correlating the number of rotations with a parameter for the distance per rotation. One or more position sensors 389 can be used to detect one or more surfaces aligned horizontally to the position sensors 389 and determine whether the position 507 is at the first end linear position 502 and / or whether the position 517 is at the first end linear position 512. For example, one or more sensors 389 can detect the side 521 of the plate 359 when the side 521 is aligned with one or more sensors 389. When one or more sensors 389 detect the side 521, the controller 1070 can determine that the second support block 360 is at the first end linear position 512 (e.g., in a fixed position). As another example, one or more sensors 389 can detect the side 522 of the first support block 330 when the side 522 is aligned with one or more sensors 389. When one or more sensors 389 detect the side 522, the controller 1070 can determine that the first support block 330 is at the first end linear position 502 (e.g., in a fixed position).

[0068]

[0077] A first seal sleeve 381 is positioned between the first support block 330 and the second support block 360, and a second seal sleeve 382 is positioned between the second support block 360 and the end flange 383 of the lift assembly 300. The second shaft 125 is joined to the shoulder of the support ring 384. A clamp ring 385 connects the support ring 384, the first seal sleeve 381, and the second seal sleeve 382 to the second support block 360. The clamp ring 385 may be fixed to the second support block 360 using one or more fasteners. The first seal sleeve 381 and the second seal sleeve 382 may each include bellows, such as a bellows made of a metallic or metallized material.

[0069]

[0078] Figure 6 is a partially schematic enlarged perspective front view of the second side of the lift assembly 300 shown in Figures 3 to 5, according to one or more embodiments.

[0070]

[0079] The linear movement of the second support block 360 may be restricted by one or more restraints 356 (such as ledges of the support beam 365). A track plate 390 may be connected to the support beam 365. The track plate 390 includes one or more projections 391 that are received by one or more recesses of the first support block 330 and / or one or more recesses of the second support block 360, so that the first support block 330 and / or the second support block 360 can slide linearly along the track plate 390.

[0071]

[0080] Figure 7A is a schematic block diagram of a substrate transfer method 700 according to one or more embodiments.

[0072]

[0081] Figure 7B is a schematic block diagram of a continuation of the method 700 shown in Figure 7A, according to one or more embodiments.

[0073]

[0082] Step 702 includes moving the first substrate into a chamber (such as an epitaxial deposition chamber). The first substrate can be moved within the chamber, for example, on a robot arm (such as on the robot blade of the robot arm) through a transfer opening 136.

[0074]

[0083] Step 704 includes raising a second support frame (e.g., second support frame 198) relative to a first support frame (e.g., first support frame 199) to engage with the first substrate. The first support frame is positioned in a transport position. The first support frame includes a first shaft and a plurality of first arms, and the second support frame includes a second shaft and a plurality of second arms. Raising may include engaging with the first substrate and then lifting the first substrate from the robot arms. In one or more embodiments, raising the second support frame to engage with the first substrate includes raising a plurality of lift pins through which the plurality of second arms engage with the first substrate.

[0075]

[0084] Step 706 includes lowering the second support frame relative to the first support frame to land the first substrate on the first substrate support. The first substrate support may be part of a cassette (such as cassette 1030) supported by the first support frame.

[0076]

[0085] Step 708 includes raising the first support frame. In one or more embodiments, the first support frame is raised to align the second substrate support (located below the first substrate support) with the transport opening 136. In one or more embodiments, the second support frame is raised at least partially simultaneously with raising the first support frame.

[0077]

[0086] This disclosure assumes that step 706 may be omitted, and that the ascent in step 708 engages the first substrate support with the first substrate, thereby allowing the first substrate to land on the first substrate support.

[0078]

[0087] Step 710 includes moving the second substrate into the chamber.

[0079]

[0088] Step 712 includes raising the second support frame relative to the first support frame to engage with the second substrate. This raising may include engaging with the second substrate and then lifting the second substrate from the robot arm.

[0080]

[0089] Step 714 includes lowering the second support frame relative to the first support frame to land the second substrate on the second substrate support.

[0081]

[0090] Step 716 includes raising the first support frame to a processing position (such as the position of the cassette 1030 shown in Figure 1).

[0082]

[0091] Step 718 includes processing the first substrate and the second substrate. In one or more embodiments, the processing includes epitaxially depositing one or more layers onto the first substrate and the second substrate, respectively. The first support frame (and the cassette 1030 supported by the first support frame) can be rotated during processing.

[0083]

[0092] Step 720 (shown in Figure 7B) includes lowering the first support frame. The first support frame can be lowered and returned to the transport position.

[0084]

[0093] Step 722 includes raising the second support frame relative to the first support frame to engage with the second substrate. This raising may include engaging with the second substrate (by using lift pins, etc.) and lifting the second substrate away from the second substrate support so that the robot arm is positioned below the second substrate.

[0085]

[0094] Step 724 includes lowering the second support frame relative to the first support frame to disengage from the second substrate (for example, so that the second substrate lands on the robot arm and the lift pins disengage from the second substrate by the continuous descent of the lift pins).

[0086]

[0095] Step 726 includes moving the second substrate out of the processing chamber (for example, onto a robotic arm).

[0087]

[0096] Step 728 includes lowering the first support frame. In one or more embodiments, the first support frame is lowered to align the first substrate support with the transport opening 136. In one or more embodiments, the second support frame is lowered at least partially simultaneously with lowering the first support frame.

[0088]

[0097] Step 730 includes raising the second support frame relative to the first support frame and engaging it with the first substrate. This raising may include engaging the first substrate (by using lift pins, etc.) and lifting the first substrate away from the first substrate support so that the robot arm is positioned below the first substrate.

[0089]

[0098] Step 732 includes lowering the second support frame relative to the first support frame (for example, so that the first substrate lands on the robot arm and the lift pins disengage from the first substrate by the continuous descent of the lift pins).

[0090]

[0099] Step 734 includes moving the first substrate out of the processing chamber (for example, on a robotic arm).

[0091]

[0100] Method 700 can be carried out using at least partially the lift assembly 300 shown in Figures 3 to 5 and / or the processing apparatus 100 shown in Figures 1 and 2.

[0092]

[0101] Figures 8A to 8D are diagrams (from a partially schematic side view) showing the process flow for transferring two substrates 107a and 107b onto a cassette in a processing chamber, according to one or more embodiments.

[0093]

[0102] In Figure 8A, the robot blade 801 extends above the first substrate support 212A in the processing chamber, and the second support frame 198 rises, causing the lift pin 889 to engage with the first substrate 107A and lift the first substrate 107A from the robot blade 801. The lift pin 889 can engage with the first substrate 107A directly, or it can engage with the first substrate 107A indirectly by utilizing the structure between the lift pin 889 and the first substrate 107A.

[0094]

[0103] In Figure 8B, the robot blade 801 is retracting from the processing chamber. The second support frame 198 is descending, and the first substrate 107A is landing on the first substrate support 212A.

[0095]

[0104] In Figure 8C, the first support frame 199 rises from the position shown in Figures 8A and 8B, and the robot blade 801 extends above the second substrate support 212B in the processing chamber. In Figure 8C, the second support frame 198 rises, and the lift pin 889 engages with the second substrate 107B, lifting the second substrate 107B from the robot blade 801. The lift pin 889 can engage with the second substrate 107B directly, or it can engage with the second substrate 107B indirectly by utilizing the structure between the lift pin 889 and the second substrate 107B.

[0096]

[0105] In Figure 8D, the robot blade 801 is retracting from the processing chamber. The second support frame 198 is descending, and the second substrate 107B is landing on the second substrate support 212B.

[0097]

[0106] In one or more embodiments, as shown in Figures 8A to 8D, each first arm 1021 includes a column 805 that extends through one or more (one, several, or all, etc.) substrate supports 212. Each column 805 is part of a support column 1081 that supports the substrate supports 212. The substrate supports 212 are spaced apart from each other using one or more sleeves 806 (e.g., hollow cylinders) placed between them. Each support column 1081 includes one or more sleeves 806 around each column 805.

[0098]

[0107] Figure 9 is a schematic diagram of a method 900 for returning a support frame to its fixed position according to one or more embodiments.

[0099]

[0108] Step 902 includes detecting a fault condition. In one or more embodiments, the fault condition is a notification that the user has chosen to stop the processing step. In one or more embodiments, the fault condition indicates that processing parameters (such as processing temperature and / or processing pressure) are not being met. In one or more embodiments, the fault condition indicates that a component has failed (e.g., broken) and / or requires maintenance. For example, the rotation of the first shaft 126 may stop and the failed component may be a bearing. The disclosure assumes that other(s) fault conditions may be detected.

[0100]

[0109] Step 904 includes determining a first position of the first support frame (e.g., first support frame 199) along a first range of movement. The first range of movement is between a first end linear position and a second end linear position of the first support frame. In one or more embodiments, the first position is a first linear position of the first support block (e.g., first support block 330). The linear movement of the first support block causes the first support frame to move linearly as the first support block supports the first shaft of the first support frame. In one or more embodiments, the first position of the first support frame is defined by the upper end (e.g., upper end 505) of the first support block.

[0101]

[0110] Step 906 includes determining a second position of the second support frame (e.g., second support frame 198) along a second range of movement. The second range of movement is between a first end linear position and a second end linear position of the second support frame. The second range of movement overlaps with the first range of movement by an overlapping range. In one or more embodiments, the second position is a second linear position of the second support block (e.g., second support block 360) that supports the second shaft of the second support frame such that linear movement of the second support block causes linear movement of the second support frame. In one or more embodiments, the second position of the second support frame is defined by the lower end (e.g., lower end 515) of the second support block.

[0102]

[0111] Step 908 includes determining whether the first position is in an inner state or an outer state. An inner state is within the overlapping range, and an outer state is outside the overlapping range.

[0103]

[0112] Step 910 includes moving (e.g., lowering) the first support frame and the second support frame to a first retracted position and a second retracted position, respectively.

[0104]

[0113] If the first position is in the outward state (of step 908), the movement includes moving the second support frame to the second retracted position (in step 912), and after the second support frame has reached the second retracted position, moving the first support frame to the first retracted position (in step 914).

[0105]

[0114] If the first position is in the inward state (in step 908), the movement includes moving the first support frame and the second support frame simultaneously (in step 916) until the first position is in the outward state, and stopping the movement of the first support frame (in step 918). This movement includes moving the second support frame to the second retracted position (in step 920), and after the second support frame has reached the second retracted position, moving the first support frame to the first retracted position (in step 922).

[0106]

[0115] In one or more embodiments, moving a first support frame includes rotating a first drive shaft to linearly move a first moving block arranged along the first drive shaft, the first moving block being connected to a first support block. In one or more embodiments, moving a second support frame includes rotating a second drive shaft to linearly move a second moving block arranged along the second drive shaft, the second moving block being connected to a second support block.

[0107]

[0116] This disclosure assumes that one or more steps (e.g., one or all) of Method 900 may be performed simultaneously with, before, and / or after, one or more steps of Method 700 and / or one or more steps of Figures 8A to 8D. In one or more embodiments, a fault condition is detected in step 902 during the execution of Method 700. In one or more embodiments, when a fault condition is detected, the execution of Method 700 is stopped (e.g., at least temporarily) and steps 902 to 910 are performed.

[0108]

[0117] One or more steps of this disclosure can be performed automatically by using a controller 1070 or the like. In one or more embodiments, the steps are continuously monitored, and if a fault condition is detected in step 902, steps 904 to 910 of method 900 are performed automatically.

[0109]

[0118] The advantages of this disclosure include a return-to-position support frame that reduces or eliminates the possibility of collision, damage, and / or failure of components; reduced machine downtime, processing delays, and costs; improved throughput; return-to-position with reduced extra movement; and a return-to-position support frame associated with a processing chamber having smaller dimensions and a smaller footprint.

[0110]

[0119] The advantages of this disclosure include moving the support block and the corresponding support frame independently at any time, in any order, and in any linear position (e.g., within the range permitted by the stopper, if a stopper is used), and rapidly loading and unloading substrates from a cassette for a batch substrate processing step. The three motors described herein can be used independently to perform one, some, or all of the following at any time and in any linear position: linearly moving the first support frame 199, rotating the first support frame 199, and / or linearly moving the second support frame 198. One of the two support frames 198, 199 can be raised or lowered without first raising or lowering the other of the two support frames 198, 199.

[0111]

[0120] For example, the second support frame 198 can be raised and lowered while the first support frame 199 is stationary, and the first support frame 199 can be raised and lowered while the second support frame 198 is stationary. In another example, the first support frame 199 and the second support frame 198 can be raised and lowered simultaneously. Such modularity in independent movement facilitates various movement sequences of the support frames 198 and 199, and facilitates a method (such as Method 700) for quickly and easily loading and unloading multiple boards into and from a batch processing cassette.

[0112]

[0121] As another example, the first support frame 199 and the second support frame 198 can move to their respective first and second fixed positions (e.g., the lowest position) in a reasonable manner while reducing or eliminating collisions between the first support block 330 and the second support block 360. The first support frame 199 and the second support frame 198 can move to their respective first and second fixed positions (e.g., the lowest position) in a reasonable manner while reducing or eliminating collisions between the first support frame 199 and the second support frame 198. For example, collisions between the first arm 1021 and the second shaft 125 are reduced or eliminated. Such advantages may be facilitated for chambers and systems having smaller dimensions and footprints (e.g., vertical dimensions), such as smaller vertical dimensions below the floor 134 and / or below the bottom 135. Such advantages may be facilitated for chambers and systems having overlapping ranges OR1, and for chambers and systems having relatively high overlapping ranges OR1.

[0113]

[0122] The embodiments described herein are assumed to be combinable. For example, one or more features, embodiments, components, operations, and / or characteristics of the apparatus 100, cassette 1030, lift assembly 300, method 700, the cassettes shown in Figures 8A to 8D, and / or method 900 can be combined. It is further assumed that any combination(s) can achieve the aforementioned advantages.

[0114]

[0123] While the foregoing applies to embodiments of the present disclosure, it is possible to devise other further embodiments of the present disclosure without departing from its basic scope as defined by the following claims.

Claims

1. A non-transient computer-readable medium containing instructions that, when executed, cause multiple processes to be carried out, The aforementioned steps are: Detecting a fault condition, Determining the first position of the first support frame along the first range of movement, Determining a second position of a second support frame along a second range of movement, wherein the second range of movement overlaps with the first range of movement by an overlapping amount, Determining whether the first position is in an inner state or an outer state, wherein the inner state is within the overlapping range and the outer state is outside the overlapping range, The first support frame and the second support frame are moved to a first retracted position and a second retracted position, respectively. Non-transient computer-readable media, including [specific examples of such media].

2. When the first position is in the outer state, The aforementioned movement is, Moving the second support frame to the second retracted position, After the second support frame reaches the second retracted position, the first support frame is moved to the first retracted position. A non-transient computer-readable medium according to claim 1, including the following:

3. When the first position is in the inner state, The aforementioned movement is, The first support frame and the second support frame are moved simultaneously until the first position is in the outward state, Stopping the movement of the first support frame, The second support frame is moved to the second retracted position, and after the second support frame has reached the second retracted position, the first support frame is moved to the first retracted position. A non-transient computer-readable medium according to claim 1, including the following:

4. The non-transient computer-readable medium according to claim 1, wherein the first range of movement is between a linear position of the first end and a linear position of the second end of the first support frame, and the second range of movement is between a linear position of the first end and a linear position of the second end of the second support frame.

5. The non-transient computer-readable medium according to claim 4, wherein the first position is a first linear position of the first support block that supports the first shaft of the first support frame such that the linear movement of the first support block causes the first support frame to move linearly.

6. The non-transient computer-readable medium according to claim 5, wherein the second position is a second linear position of the second support block that supports the second shaft of the second support frame such that the linear movement of the second support block causes the second support frame to move linearly.

7. The non-transient computer-readable medium according to claim 6, wherein the first position of the first support frame is defined by the upper end of the first support block.

8. The non-transient computer-readable medium according to claim 7, wherein the second position of the second support frame is defined by the lower end of the second support block.

9. Moving the first support frame involves rotating the first drive shaft to move the first moving block, which is arranged along the first drive shaft, in a linear fashion, and the first moving block is connected to the first support block. The non-transient computer-readable medium according to claim 6, wherein moving the second support frame includes rotating the second drive shaft to linearly move a second moving block arranged along the second drive shaft, the second moving block being connected to the second support block.

10. A lift assembly for placement in relation to a substrate processing chamber, The first motor and A first drive assembly connected to the first motor, A first support block connected to the first drive assembly, wherein the first motor is configured to move the first support block linearly using the first drive assembly, The second motor, A second drive assembly connected to the second motor, A second support block connected to the second drive assembly, wherein the second motor is configured to move the second support block linearly using the second drive assembly, and the second motor is configured to move the second support block linearly independently of the first motor which moves the first support block linearly, A controller communicating with the first motor and the second motor, which includes instructions that, when executed by a processor, cause a plurality of processes to be performed, Detecting a fault condition, Determining the first position of the first support block along the first range of movement, Determining the second position of the second support block along a second range of movement, wherein the second range of movement overlaps with the first range of movement by an overlapping amount, Determining whether the first position is in an inner state or an outer state, wherein the inner state is within the overlapping range and the outer state is outside the overlapping range, The first support block and the second support block are moved to a first retracted position and a second retracted position, respectively. Including controllers and A lift assembly equipped with the following features.

11. The first drive assembly is A first drive shaft connected to the first motor, A first moving block arranged along the first drive shaft and Includes, The first movable block is connected to the first support block, Moving the first support block includes driving the first motor to rotate the first drive shaft, The second drive assembly described above is A second drive shaft connected to the second motor, A second moving block arranged along the second drive shaft and Includes, The second movable block is connected to the second support block, Moving the second support block includes driving the second motor to rotate the second drive shaft. The lift assembly according to claim 10.

12. The first drive shaft is a first lead screw, and there is a first threaded joint between the first lead screw and the first moving block. The second drive shaft is a second lead screw, and there is a second threaded joint between the second lead screw and the second moving block. The lift assembly according to claim 11.

13. The lift assembly according to claim 11, wherein the first support block includes one or more first legs connected to the first movable block, and the second support block includes one or more second legs connected to the second movable block.

14. The system further comprises a third motor connected to the first support block, The first support block supports the first shaft of the first support frame such that the linear movement of the first support block causes the first support frame to move linearly. The second support block supports the second shaft of the second support frame such that the linear movement of the second support block causes the second support frame to move linearly. The lift assembly according to claim 11, wherein the third motor is configured to rotate the first shaft of the first support frame.

15. The linear movement of the first moving block causes the first support block and the first support frame to move linearly. The linear movement of the second moving block causes the second support block and the second support frame to move linearly, The third motor is configured to rotate the first shaft of the first support frame. The lift assembly according to claim 14.

16. A substrate processing apparatus, The lift assembly according to claim 10, The chamber body, Processing area and Multiple gas injection passages formed within the chamber body, One or more gas exhaust passages formed within the chamber body The chamber body includes, One or more heat sources configured to generate heat, A substrate support assembly positioned within the processing region, Multiple lift pins, One or more substrate supports, A first support frame comprising a first shaft and a plurality of first arms, wherein the plurality of first arms are configured to connect with the plurality of lift pins, and the first shaft is supported by a first support block, A second support frame comprising a second shaft and a plurality of second arms, wherein the plurality of second arms are configured to support the one or more substrate supports, and the second shaft is supported by a second support block, and Including a substrate support assembly and A substrate processing apparatus comprising:

17. A method for transporting a substrate, Moving the first substrate into the chamber, Raising the second support frame relative to the first support frame in order to engage it with the first substrate, wherein the first support frame includes a first shaft and a plurality of first arms, and the second support frame includes a second shaft and a plurality of second arms, In order to land the first substrate on the first substrate support, the second support frame is lowered relative to the first support frame, Detecting a fault condition, Determining the first position of the first support frame along the first range of movement, Determining the second position of the second support frame along a second range of movement, wherein the second range of movement overlaps with the first range of movement by an overlapping amount, Determining whether the first position is in an inner state or an outer state, wherein the inner state is within the overlapping range and the outer state is outside the overlapping range, The first support frame and the second support frame are lowered to a first retracted position and a second retracted position, respectively. A method that includes this.

18. Raising the first support frame in a direction away from the first retracted position, Moving the second substrate into the chamber, To engage with the second substrate, the second support frame is raised relative to the first support frame in a direction away from the second retracted position, In order to land the second substrate on the second substrate support, the second support frame is lowered relative to the first support frame. The method according to claim 17, further comprising:

19. Raising the first support frame to the processing position, Processing the first substrate and the second substrate, Lowering the first support frame and The method according to claim 18, further comprising:

20. Raising the second support frame to engage with the first substrate is, The plurality of second arms raise the plurality of lift pins that engage with the first substrate. The method according to claim 17, including the method described in claim 17.

Images