Power supply device
The power supply device allows for modular assembly and repair of components by stacking and combining planar transformer and circuit components like LEGO blocks, simplifying manufacturing and improving component utilization and recyclability.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- DELTA ELECTRONICS INC(CN)
- Filing Date
- 2023-10-20
- Publication Date
- 2026-05-01
AI Technical Summary
Conventional power supply devices require all electronic components to be fixed to the circuit board before assembly, making manufacturing inconvenient and preventing individual component repair, leading to complete disassembly for maintenance and hindering recycling.
A power supply device with a planar transformer and power supply circuit components that can be stacked and combined like LEGO blocks, allowing separate assembly and repair of components.
Facilitates easier manufacturing, reduces production costs, and improves component utilization by enabling modular assembly and repair without full disassembly, enhancing production efficiency and recyclability.
Smart Images
Figure 2026513952000001_ABST
Abstract
Description
Technical Field
[0001] The present invention belongs to the field of power supply devices, and particularly relates to a power supply device in which a planar transformer and power supply circuit components are stacked and combined like LEGO (registered trademark) blocks. [[ID= / / ]]
Background Art
[0002] A power supply device is used to convert received input power into output power and supply the output power to a load. A power supply device usually includes a plurality of electronic components and a circuit board, and the most important of the plurality of electronic components is a transformer. In conventional electronic devices, since all electronic components are fixed to the circuit board, it is necessary to prepare all the electronic components before starting assembly at the production site, making manufacturing very inconvenient. Furthermore, in conventional electronic devices, all electronic components are fixed to the circuit board and cannot be separated, so they cannot be repaired individually. Therefore, when repairing, it is necessary to completely disassemble the electronic device, and as a result, the entire power supply device cannot be recycled.
[0003] Therefore, developing a power supply device that overcomes the above drawbacks has become the most urgent issue to be solved currently.
Summary of the Invention
Problems to be Solved by the Invention
[0004] An object of the present invention is to provide a power supply device that facilitates the manufacture of the electronic device of the present invention and enables some components within the power supply device to be repaired individually by stacking and combining a planar transformer and power supply circuit components like LEGO (registered trademark) blocks.
Means for Solving the Problems
[0005] To achieve the above objective, a broad embodiment of the present invention provides a power supply device including a power supply circuit component and a planar transformer. The power supply circuit component includes a first printed circuit board and a power conversion module, the first printed circuit board including a first surface and a second surface arranged opposite each other, and the power conversion module being located on the first surface. The planar transformer includes a magnetic core assembly, at least one second printed circuit board, and at least one coil module, the magnetic core assembly including a first magnetic core and a second magnetic core, at least one of the first and second magnetic cores being located adjacent to the first printed circuit board, at least one second printed circuit board being located between the first magnetic core and the second magnetic core and including a first coil, at least one coil module being located between the first magnetic core and the second magnetic core and including a second coil and an injection-molded layer, the injection-molded layer covering at least a portion of the outer surface of the second coil. [Brief explanation of the drawing]
[0006] [Figure 1] This is a schematic diagram of the assembly structure of a power supply device according to a first preferred embodiment of the present invention. [Figure 2] Figure 1 is a schematic diagram of the disassembled structure of the power supply unit shown. [Figure 3] Figure 1 is a schematic diagram of the structure of the second coil of the planar transformer shown. [Figure 4] Figure 1 is a schematic diagram showing the internal wiring of the second printed circuit board of the planar transformer. [Figure 5] Figure 2 is a schematic diagram of a modified example of the second coil of the planar transformer shown in Figure 2. [Figure 6] This is a schematic diagram of the assembly structure of a power supply device according to a second preferred embodiment of the present invention. [Modes for carrying out the invention]
[0007] Several typical embodiments illustrating the features and advantages of the present invention will be described in detail in the following description. The present invention can be modified in various ways in different embodiments, none of which will depart from the scope of the invention, and the description and drawings are used for illustrative purposes only and are not intended to limit the invention.
[0008] Refer to Figures 1, 2, 3, and 4. Figure 1 is a schematic diagram of the assembled structure of a power supply device according to a first preferred embodiment of the present invention, Figure 2 is a schematic diagram of the exploded structure of the power supply device shown in Figure 1, Figure 3 is a schematic diagram of the structure of the second coil of the planar transformer shown in Figure 1, and Figure 4 is a schematic diagram showing the internal wiring of the second printed circuit board of the planar transformer shown in Figure 1. The power supply device 1A of this embodiment can receive input power, convert it into output power, and supply it to a load (not shown). The power supply device 1A includes at least one power supply circuit component 7 and a planar transformer 1. The power supply circuit component 7 includes a first printed circuit board 70 and a power conversion module 71. The first printed circuit board 70 includes a first surface 700 and a second surface 701 arranged opposite each other, and the power conversion module 71 is arranged on the first surface 700.
[0009] In some embodiments, the power conversion module 71 is used to convert input power into intermediate power and may include at least one electronic component such as (but not limited to) a switching element, a controller, a diode, a resistor, and a multilayer ceramic capacitor. In some embodiments, as shown in Figure 1, all electronic components of the power conversion module 71 may be arranged independently on the first surface 700. In other embodiments, all electronic components of the power conversion module 71 may be packaged into a single module and then arranged on the first surface 700.
[0010] In other embodiments, the power supply circuit component 7 may further include a power factor correction module (not shown), an electromagnetic interference (EMI) / radio frequency interference (RFI) module, and an input capacitor. The power factor correction module (not shown), the electromagnetic interference (EMI) / radio frequency interference (RFI) module, and the input capacitor are each arranged on the first surface 700, the power factor correction module is used to correct the power factor of the input power, the electromagnetic interference (EMI) / radio frequency interference (RFI) module is used to suppress electromagnetic interference and radio frequency interference, and the input capacitor is used to stabilize the voltage.
[0011] The planar transformer 1 of this embodiment satisfies the requirements for circuit thinning and high frequency operation and is suitable for fully automated assembly and testing. The planar transformer 1 includes a magnetic core assembly 2, at least one second printed circuit board 3, and at least one coil module 4.
[0012] The magnetic core assembly 2 includes a first magnetic core 20 and a second magnetic core 21, which are located on opposite sides of the planar transformer 1. Furthermore, at least one of the first magnetic core 20 and the second magnetic core 21 is located adjacent to the first printed circuit board 70, for example, as shown in Figure 2, the second magnetic core 21 is located adjacent to the first printed circuit board 70, and the first printed circuit board 70 (or power supply circuit component 7) is located on the outermost side of the power supply unit 1A.
[0013] The number of second printed circuit boards 3 may be one or more, and Figure 2 shows one second printed circuit board 3. The second printed circuit boards 3 are positioned between the first magnetic core 20 and the second magnetic core 21, and each second printed circuit board 3 includes a first coil 30 (as shown in Figure 4), the first coil 30 being formed within the second printed circuit board 3 and consisting of traces or conductors within the second printed circuit board 3.
[0014] The number of coil modules 4 may be one or more, and Figure 2 shows one coil module 4. The coil module 4 is positioned between the first magnetic core 20 and the second magnetic core 21 and can be located between the second printed circuit board 3 and the first magnetic core 20. The coil module 4 also further includes a second coil 40 and an injection-molded layer 41. The second coil 40 may, but is not limited to, press-molded from a conductive sheet such as a copper sheet. The injection-molded layer 41 can be formed on the second coil 40 by injection molding and covers at least a portion of the outer surface of the second coil 40, and the injection-molded layer 41 allows the planar transformer 1 to meet safety protection requirements. In this embodiment, the second printed circuit board 3 and the coil module 4 are separate parts, i.e., the second printed circuit board 3 and the coil module 4 are not integrally formed.
[0015] As can be seen from the above, the power supply unit 1A of the present invention includes a power supply circuit component 7 and a planar transformer 1, and the power supply circuit component 7 and the planar transformer 1 can be stacked and combined like LEGO® blocks. In this way, since the power supply circuit component 7 and the planar transformer 1 can be combined or disassembled, it is not necessary to gather all the electronic components before manufacturing and assembling the power supply unit 1A on the production line. The power supply circuit component 7 and the planar transformer 1 can be assembled in different locations and then combined to form the power supply unit 1A, making the manufacturing of the power supply unit 1A simpler. Furthermore, since the power supply circuit component 7 and the planar transformer 1 can be stacked and combined like LEGO® blocks, the power supply circuit component 7 and the planar transformer 1 can be repaired individually during repairs, and it is not necessary to completely disassemble the power supply unit 1A. This improves the utilization rate of the components within the power supply unit 1A. Furthermore, since the planar transformer 1 includes separate components, a second printed circuit board 3 and a coil module 4, with the second printed circuit board 3 containing a first coil 30 and the coil module 4 containing a second coil 40, the planar transformer 1 separates the coils required for the transformer, forming the first coil 30 and the second coil 40 located on two independent components. Because the second coil 40 is located on the coil module 4, the number of layers on the second printed circuit board 3 can be reduced, resulting in fewer layers on the second printed circuit board 3 than on a single circuit board of a conventional planar transformer. This shortens the production cycle of the planar transformer 1, simplifies the manufacturing process of the second printed circuit board 3, improves yield, and ultimately reduces the production cost of the planar transformer 1. Moreover, the planar transformer 1 of the present invention offers a high degree of adjustability.
[0016] In some embodiments, the first coil 30 constitutes one of the primary and secondary coils of the planar transformer 1, and the second coil 40 constitutes the other of the primary and secondary coils of the planar transformer 1. The thickness of the second coil 40 may be between 0.01 mm and 1.5 mm, and the number of turns of the second coil 40 is two or more. The safety standard insulation distance between the first coil 30 and the second coil 40 is 0.4 mm, and this safety standard insulation distance can be achieved by the thickness of the injection-molded layer 41 or the thickness of the second printed circuit board 3. The thickness of the injection-molded layer 41 may be between 0.4 mm and 0.8 mm.
[0017] In some embodiments, the magnetic core assembly 2 further includes a first side column 22, a second side column 23, and an intermediate column 24. The first side column 22 and the second side column 23 are located on opposite sides of the magnetic core assembly 2, and the intermediate column 24 is located between the first side column 22 and the second side column 23. The first side column 22, the second side column 23, and the intermediate column 24 are located between the first magnetic core 20 and the second magnetic core 21. Also, as shown in Figure 2, the first side column 22, the second side column 23, and the intermediate column 24 each consist of two sub-magnetic columns, with one sub-magnetic column of the first side column 22, one sub-magnetic column of the second side column 23, and one sub-magnetic column of the intermediate column 24 being connected to the first magnetic core 20, and the other sub-magnetic column of the first side column 22, the other sub-magnetic column of the second side column 23, and the other sub-magnetic column of the intermediate column 24 being connected to the second magnetic core 21. Of course, in other embodiments, the first side column 22, the second side column 23, and the intermediate column 24 may each consist of a single structure connected to the first magnetic core 20 or the second magnetic core 21.
[0018] In some embodiments, the second printed circuit board 3 includes a first through-hole 31, and the coil module 4 includes a second through-hole 42. The first through-hole 31 penetrates the second printed circuit board 3, and the second through-hole 42 penetrates the coil module 4. The first through-hole 31 and the second through-hole 42 are positioned to correspond to the intermediate column 24 of the magnetic core assembly 2. When the first magnetic core 20 and the second magnetic core 21 of the magnetic core assembly 2 are fitted into the second printed circuit board 3 and the coil module 4 from opposite sides of the planar transformer 1, the intermediate column 24 passes through the first through-hole 31 and the second through-hole 42.
[0019] In some embodiments, the injection-molded layer 41 includes a first base 44, which is located on the first side of the injection-molded layer 41 and includes a first upper surface and a first lower surface, which are substantially parallel to the second printed circuit board 3. The planar transformer 1 further includes at least one conductor 5, for example, a first conductive pin. The conductor 5 can be positioned synchronously with the position of the first base 44 of the injection-molded layer 41 when the injection-molded layer 41 is formed on the second coil 40 by injection molding. The conductor 5 is substantially perpendicular to the first upper surface and first lower surface of the first base 44, a portion of which is covered by the injection-molded layer 41, and the conductor 5 is further exposed from the first upper surface and first lower surface of the first base 44 and extends in a direction perpendicular to the first base 44. The portion of the conductor 5 exposed from the first base 44 can be electrically connected to a trace or conductor on the second printed circuit board 3 by soldering, for example, to the first coil 30 by soldering, and the conductor 5 may be inserted into a system board (not shown).
[0020] Furthermore, in other embodiments, the first printed circuit board 70 further includes at least one first through hole 72, and the number and arrangement positions of the first through holes 72 correspond to the number and arrangement positions of the conductors 5. By passing the corresponding conductors 5 through each of the first through holes 72, the conductors 5 can be connected to the first printed circuit board 70. Thereby, the power circuit component 7 and the planar transformer 1 can be stacked and combined like Lego (registered trademark) blocks. The conductors 5 can be electrically connected to the power conversion module 71 via traces (not shown) or conductors (not shown) of the first printed circuit board 70.
[0021] In some embodiments, the second printed circuit board 3 includes at least one second through hole 32, and the second through holes 32 are arranged at positions facing the corresponding conductors 5. By passing the corresponding conductors 5 through each of the second through holes 32, at least a part of the conductors 5 is electrically connected to the traces or conductors of the second printed circuit board 3.
[0022] In other embodiments, the injection-molded layer 41 includes a second base 45, and the second base 45 is located on a second side opposite to the first side of the injection-molded layer 41. The second base 45 includes a second upper surface and a second lower surface, and the second upper surface and the second lower surface of the second base 45 are substantially parallel to the second printed circuit board 3. Further, the coil module 4 further includes at least one second conductive pin 46 (for example, two second conductive pins 46 shown in FIG. 3), and at least a part of the second conductive pin 46 is disposed within the second base 45. One end of each second conductive pin 46 is connected to a corresponding end of the second coil 40 and is disposed within the second base 45. The other end of each second conductive pin 46 is exposed from the upper surface or the lower surface of the second upper surface or the second lower surface of the second base 45, extends in a direction perpendicular to the second base 45, and the two second conductive pins 46 may be inserted into the system board. In some embodiments, the two second conductive pins 46 may be integrally formed with two opposite ends of the second coil 40 respectively, that is, the two second conductive pins 46 may be formed by directly extending from the two opposite ends of the second coil 40 respectively. Each second conductive pin 46 may be bent once at 90 degrees from the corresponding end of the second coil 40 so that the other end of the second conductive pin 46 is exposed from the second upper surface or the second lower surface of the second base 45 and extends in a direction perpendicular to the second base 45.
[0023] In some embodiments, the second coil 40 formed of a conductive sheet further includes a surface 400 and a recess 401, and the recess 401 is formed by recessing from the surface 400. By the design of the recess 401, the skin effect can be reduced and the conversion efficiency of the planar transformer 1 can be improved. In other embodiments, when the second conductive pin 46 and the corresponding end of the second coil 40 are integrally formed, a recess may be similarly formed on the surface of the second conductive pin 46.
[0024] In some embodiments, the area of the first surface 700 of the first printed circuit board 70 is the same as the area of the second surface 701 of the first printed circuit board 70, the area of the first surface 200 of the first magnetic core 20 is the same as the area of the second surface 210 of the second magnetic core 21, and the area of the second surface 701 of the first printed circuit board 70 is 1.5 times or less the area of the second surface 210 of the second magnetic core 21. When the first printed circuit board 70 is placed adjacent to the second magnetic core 21, the overlapping portion of the second surface 701 of the first printed circuit board 70 and the second surface 210 of the second magnetic core 21 occupies at least 70% of the area of the second surface 701 of the first printed circuit board 70 or 70% of the area of the second surface 210 of the second magnetic core 21. When the first printed circuit board 70 is positioned adjacent to the first magnetic core 20, the overlapping portion between the second surface 701 of the first printed circuit board 70 and the first surface 200 of the first magnetic core 20 occupies at least 70% of the area of the second surface 701 of the first printed circuit board 70 or 70% of the area of the first surface 200 of the first magnetic core 20.
[0025] Refer again to Figure 4. In some embodiments, the second printed circuit board 3 further includes, in addition to the first coil 30, at least one auxiliary coil 33 and at least one shielding structure 34. Each auxiliary coil 33 and each shielding structure 34 can be placed in the space of any one or more layers within the second printed circuit board 3, and is not limited to the positions shown in Figure 4. The auxiliary coils 33 and the first coil 30 together constitute the primary or secondary coil of the planar transformer 1. The auxiliary coils 33 can be used as control signal lines of the circuit. Furthermore, the wire diameter of the auxiliary coils 33 is less than or equal to the wire diameter of the first coil 30. The shielding structure 34 is a metal conductor structure for suppressing EMI electromagnetic interference. In some embodiments, at least one layer of the second printed circuit board 3 includes the first coil 30. Also, each layer of the second printed circuit board 3 can include at least one of the first coil 30, auxiliary coils 33, and shielding structures 34.
[0026] In some embodiments, the power supply circuit components 7 and the planar transformer 1 can be stacked and assembled like LEGO® blocks, and then potting can be used to cover and seal at least a portion of the power supply circuit components 7 and the planar transformer 1 with resin. This can improve the safety standard strength of the power supply unit 1A. In other embodiments, the conductors 5 (i.e., the first conductive pins) and the second conductive pins 46 can each be at least partially exposed from the potting resin. This allows the conductors 5 and the second conductive pins 46 to be inserted into the system board.
[0027] In some embodiments, as shown in Figure 2, the power supply unit 1A further includes a hollow cover 8 for housing the combined power supply circuit components 7 and the planar transformer 1, thereby protecting the internal components of the power supply unit 1A.
[0028] In other embodiments, the power supply unit 1A may alternatively include two power supply circuit components, each located on the outside of the power supply unit 1A, opposite each other. The first printed circuit board 70 of one of the two power supply circuit components is located adjacent to the second magnetic core 21, and the first printed circuit board of the other power supply circuit component is located adjacent to the first magnetic core 20.
[0029] Refer to Figure 5. Figure 5 is a schematic diagram of a modified example of the second coil of the planar transformer shown in Figure 2. In some embodiments, as shown in Figure 5, at least one second conductive pin 46 may include a first bend 460 and a second bend 461. The first bend 460 is connected between the corresponding end of the second coil 40 and the second bend 461, and at least a portion of it is located within the second base 45. Furthermore, the first bend 460 is formed by bending one end of the second coil 40 at least once. The second bend 461 is at least partially exposed from the second upper or second lower surface of the second base 45 and extends in a direction perpendicular to the second base 45. The second bend 461 is formed by bending one end of the first bend 460 once and includes a U-shaped structure 462 at the bend. The formation of the U-shaped structure 462 can increase the overall lead length of the second coil 40.
[0030] Of course, as can be seen from the above, the number of printed circuit boards and coil modules of the planar transformer of the present invention can be arbitrarily changed according to actual requirements, and may include, for example, two coil modules and one printed circuit board.
[0031] Refer to Figure 6. Figure 6 is a schematic diagram of the assembly structure of a power supply unit according to a second preferred embodiment of the present invention. Power supply unit 1B of this embodiment is similar in structure to power supply unit 1A shown in Figure 1, and the same reference numerals represent the same components, structure and function, which are not repeated here. While the power supply circuit component 7 of power supply unit 1A shown in Figure 1 is located on the outermost part of power supply unit 1A, the power supply circuit component 7 of power supply unit 1B of this embodiment is located between the first magnetic core 20 and the second magnetic core 21 of the magnetic core assembly 2. Accordingly, the first printed circuit board 70 is located adjacent to the first magnetic core 20 and the second magnetic core 21, respectively.
[0032] As described above, the present invention is a power supply device. The power supply device includes power circuit components and a planar transformer, and the power circuit components and the planar transformer can be stacked and combined like LEGO® blocks. As a result, because the power circuit components and the planar transformer have a combined structure, it is not necessary to gather all electronic components before manufacturing and assembling the power supply device on the production line. The power circuit components and the planar transformer can be assembled in different locations and then combined to form the power supply device, making the manufacturing of the power supply device simpler. Furthermore, because the power circuit components and the planar transformer can be stacked and combined like LEGO® blocks, during repairs, the power circuit components and the planar transformer can be repaired individually, and it is not necessary to completely disassemble the power supply device. This improves the utilization rate of the components within the power supply device. Furthermore, since the planar transformer includes a second printed circuit board and a coil module, which are separate components, with the second printed circuit board containing the first coil and the coil module containing the second coil, the planar transformer can design the coils required for the transformer separately, forming the first and second coils located on two independent components. Because the second coil is located on the coil module, the number of layers on the second printed circuit board can be reduced, resulting in fewer layers on the second printed circuit board than on a single circuit board in a conventional planar transformer. This shortens the production cycle of the planar transformer, simplifies the manufacturing process of the second printed circuit board, improves yield, and ultimately reduces the production cost of the planar transformer. Moreover, the planar transformer of this invention offers a high degree of adjustability. [Explanation of Symbols]
[0033] 1A, 1B: Power supply 7: Power supply circuit components 70: First Printed Circuit Board 71: Power Conversion Module 700, 200: 1st page 701, 210: 2nd side 1: Planar transformer 2: Magnetic core assembly 3: Second printed circuit board 4: Coil Module 20: First Magnetic Core 21: Second Magnetic Core 30: First coil 40, 40a: Second coil 41: Injection molding layer 22: First side column 23: Second side column 24: Intermediate column 31: First through hole 42: Second through hole 44:1st base 5: Conductor 32: Second through hole 45:Second base 46, 46a: Second conductive pin 400: Surface 401: Recess 460: 1st bending part 461:Second bending part 462: U-shaped structure 33: Auxiliary coil 34: Shielding structure 72: First through hole
Claims
1. A power supply device comprising at least one power supply circuit component and a planar transformer, The at least one power supply circuit component includes a first printed circuit board and a power conversion module, the first printed circuit board includes a first surface and a second surface arranged opposite each other, and the power conversion module is arranged on the first surface. The planar transformer includes a magnetic core assembly, at least one second printed circuit board, and at least one coil module. The magnetic core assembly includes a first magnetic core and a second magnetic core, and at least one of the first magnetic core and the second magnetic core is disposed adjacent to the first printed circuit board. The at least one second printed circuit board is positioned between the first magnetic core and the second magnetic core and includes a first coil. The at least one coil module is positioned between the first magnetic core and the second magnetic core and includes a second coil and an injection-molded layer, the injection-molded layer covering at least a portion of the outer surface of the second coil. power supply.
2. The power supply device according to claim 1, wherein the power supply circuit component is located on the outermost side of the power supply device, and the second magnetic core is arranged adjacent to the first printed circuit board.
3. The power supply device according to claim 1, wherein the planar transformer further includes at least one conductor, the at least one conductor being partially covered by the injection-molded layer, the first printed circuit board further includes at least one first through-hole, the number and position of the first through-holes corresponding to the number and position of the conductors, and the conductors are connected to the first printed circuit board by the corresponding conductors passing through each of the first through-holes.
4. The power supply according to claim 1, further comprising a hollow cover for housing the combined power supply circuit components and the planar transformer.
5. The power supply device according to claim 1, wherein the first coil constitutes one of the primary coil and the secondary coil of the planar transformer, and the second coil constitutes the other of the primary coil and the secondary coil of the planar transformer.
6. The power supply device according to claim 1, wherein the thickness of the second coil is 0.01 mm or more and 1.5 mm or less, and the thickness of the injection-molded layer is 0.4 mm or more and 0.8 mm or less.
7. The planar transformer includes at least one conductor, the at least one conductor being partially covered by the injection-molded layer, The power supply device according to claim 1, wherein the at least one conductor is connected to the first coil and connected to the first printed circuit board, thereby connecting to the power conversion module.
8. The injection-molded layer includes a first base, the first base is located on the first side of the injection-molded layer and includes a first upper surface and a first lower surface, the first upper surface and the first lower surface are parallel to the second printed circuit board. The power supply device according to claim 7, wherein the at least one conductor includes at least one first conductive pin, the first conductive pin is located on the first base and partially covered by the injection-molded layer, the first conductive pin is exposed from the first upper and first lower surfaces of the first base, extends perpendicular to the first base and is connected to the first coil.
9. The power supply device according to claim 8, wherein the second printed circuit board includes at least one second through-hole, each of which is positioned opposite to the corresponding conductor and provided for passing through the corresponding conductor.
10. The injection-molded layer includes a second base, the second base is located on the second side of the injection-molded layer opposite to the first side, and includes a second upper surface and a second lower surface, the second upper surface and the second lower surface are parallel to the second printed circuit board. The power supply device according to claim 8, wherein the coil module further includes at least one second conductive pin, the second conductive pin being located on the second base and partially covered by the injection-molded layer, the second conductive pin being exposed from the second upper or second lower surface of the second base, extending perpendicularly to the second base, and connected to the second coil.
11. The second conductive pin includes a first bent portion and a second bent portion, The first bent portion is connected between the second coil and the second bent portion, and at least a portion of it is located within the second base, and the first bent portion is formed by bending one end of the second coil at least once. The power supply device according to claim 10, wherein the second bent portion is at least partially exposed from the second upper surface or the second lower surface of the second base and extends in a direction perpendicular to the second base, and the second bent portion is formed by bending one end of the first bent portion once, and the bent portion includes a U-shaped structure.
12. The power supply device according to claim 1, wherein the power supply circuit components and the planar transformer are sealed by potting, with at least partially covered with resin.
13. The power supply device according to claim 10, wherein the power supply circuit components and the planar transformer are at least partially covered and sealed with resin by potting, and the first conductive pin and the second conductive pin are at least partially exposed from the potting resin.
14. The power supply device according to claim 1, wherein the second coil is formed by press working of a conductive sheet.
15. The power supply device according to claim 14, wherein the second coil further includes a surface and a recess, the recess being formed recessed from the surface of the second coil.
16. The second printed circuit board comprises at least one layer and includes at least one auxiliary coil and at least one shielding structure. The auxiliary coil and the first coil both constitute the primary or secondary coil of the planar transformer, the auxiliary coil constitutes a control signal line, and the shielding structure is a metal conductor structure. The power supply device according to claim 1, wherein at least one layer of the second printed circuit board includes the first coil, and each layer of the second printed circuit board includes at least one of the first coil, the auxiliary coil, and the shielding structure.
17. The power supply device according to claim 1, wherein the power supply device includes two power supply circuit components, the two power supply circuit components are each arranged on two opposing outer sides of the power supply device, the first printed circuit board of one of the two power supply circuit components is arranged adjacent to the second magnetic core, and the first printed circuit board of the other of the two power supply circuit components is arranged adjacent to the first magnetic core.
18. The area of the first surface of the first printed circuit board is the same as the area of the second surface of the first printed circuit board, the area of the first surface of the first magnetic core is the same as the area of the second surface of the second magnetic core, and the area of the second surface of the first printed circuit board is 1.5 times or less the area of the second surface of the second magnetic core. When the first printed circuit board is positioned adjacent to the second magnetic core, the overlapping portion between the second surface of the first printed circuit board and the second surface of the second magnetic core occupies at least 70% of the area of the second surface of the first printed circuit board or 70% of the area of the second surface of the second magnetic core. The power supply device according to claim 1, wherein when the first printed circuit board is arranged adjacent to the first magnetic core, the overlapping portion between the second surface of the first printed circuit board and the first surface of the first magnetic core occupies at least 70% of the area of the second surface of the first printed circuit board or 70% of the area of the first surface of the first magnetic core.
19. The power supply device according to claim 1, wherein the power conversion module includes at least one switching element, at least one controller, at least one diode, at least one resistor, and at least one multilayer ceramic capacitor.