Wafer handling equipment and semiconductor detection equipment

Abstract

The wafer transfer device comprises a valve plate conduit, a transmission mechanism, and a mounting table. The valve plate conduit comprises a valve plate and a conduit extending from the valve plate in a first direction. The mounting table is connected to the valve plate and located away from the transmission mechanism of the valve plate in the first direction. The transmission mechanism is connected to the conduit and is configured to drive the valve plate conduit to move along the first direction, thereby adjusting the positions of the valve plate and the mounting table in the first direction. By driving the valve plate conduit with the transmission mechanism to move along the first direction, the position of the valve plate in the first direction is changed, switching the two chambers between a closed state and a connected state.

Description

Technical Field

[0001] This application belongs to the technical field of conveying devices, and particularly relates to a wafer conveying device and a semiconductor detection device.

Background Art

[0002] Conventional semiconductor detection devices include an interlock vacuum chamber and a main vacuum chamber. In the interlock vacuum chamber, a mounting table for placing silicon wafers is provided, and in the main vacuum chamber, a process platform and a transfer robot are provided. A gate valve for communicating or blocking the interlock vacuum chamber and the main vacuum chamber is provided between the interlock vacuum chamber and the main vacuum chamber.

[0003] In the conventional wafer transfer process, first, the silicon wafer on the atmospheric side is placed in the interlock vacuum chamber, and then the interlock vacuum chamber is evacuated. When the vacuum degree of the interlock vacuum chamber satisfies the gate valve opening condition, the gate valve is opened, and the transfer robot in the main vacuum chamber operates to transfer the silicon wafer in the interlock vacuum chamber to the process platform. Currently, this wafer transfer process has a complicated operation and low efficiency.

Summary of the Invention

[0004] This application provides a wafer conveying device and a semiconductor detection device, and solves the technical problem that the wafer conveying process mentioned in the prior art is complicated and has low efficiency.

[0005] According to one aspect of the present invention, a wafer transfer device is provided, the wafer transfer device comprising a valve plate conduit, a transmission mechanism, and a mounting table, wherein the valve plate conduit comprises a valve plate and a conduit extending from the valve plate in a first direction, the mounting table is connected to the valve plate and located on the side of the valve plate away from the transmission mechanism in the first direction, the transmission mechanism is connected to the conduit and is provided to drive the valve plate conduit to move in the first direction, thereby adjusting the positions of the valve plate and the mounting table in the first direction.

[0006] In the selectable technical solutions of the present invention, the transmission mechanism comprises a base, a direction-changing stopper mechanism, and a power member, the conduit passing through the base, the direction-changing stopper mechanism being movably connected to the base and the conduit respectively, the power member being provided on the base and connected to the direction-changing stopper mechanism, the power member being provided to drive the direction-changing stopper mechanism to operate in a second direction, thereby adjusting the position of the valve plate conduit in a first direction, where the first direction is perpendicular to the second direction.

[0007] In the selectable technical solutions of the present invention, the direction change stopper mechanism comprises a guide base and rolling elements, the guide base being provided with a guide groove and connected to a power member, the rolling elements being connected to a conduit and provided within the guide groove, the power member being provided to drive the guide base to move in a second direction, and the rolling elements moving in a first direction due to the action of the guide groove.

[0008] In the selectable technical solutions of the present invention, the guide groove includes a plurality of horizontal groove segments and a plurality of inclined groove segments, the horizontal groove segments extending along a second direction, each inclined groove segment connecting two adjacent horizontal groove segments, the two adjacent horizontal groove segments spaced apart in a first direction, and a power member is provided to drive the guide base to move in the second direction, causing rolling elements to switch between the plurality of horizontal groove segments by the action of the corresponding inclined groove segments.

[0009] In the selectable technical solutions of the present invention, the plurality of horizontal groove segments include a first horizontal groove segment, a second horizontal groove segment, and a third horizontal groove segment, the first horizontal groove segment, the second horizontal groove segment, and the third horizontal groove segment are spaced apart from top to bottom in a first direction, and when the rolling element is positioned in the first horizontal groove segment, the valve plate and mounting base are in a first position in the first direction, when the rolling element is positioned in the second horizontal groove segment, the valve plate and mounting base are in a second position in the first direction, and when the rolling element is positioned in the third horizontal groove segment, the valve plate and mounting base are in a third position in the first direction.

[0010] In the selectable technical solutions of the present invention, the wafer transfer device further comprises a seal assembly comprising a first deformation sleeve and a seal support, the seal support being provided parallel to and spaced apart from the valve plate in a first direction and located between the valve plate and the transmission mechanism, the ends of the first deformation sleeve being connected to the valve plate and the seal support respectively, and together enclosing a third chamber, the conduit extending through the third chamber and the seal support and out of the third chamber.

[0011] In another aspect of the present application, a semiconductor detection device is provided, comprising a first chamber, a second chamber, and the wafer transport device, wherein the first chamber is connected to the second chamber in a first direction, a transmission mechanism is located outside the second chamber and away from the first chamber in a first direction, a valve plate is located inside the second chamber, and a conduit is in communication with the first chamber. The valve plate is provided to move by the action of the transmission mechanism to connect or disconnect the first chamber and the second chamber, and when the first chamber and the second chamber are disconnected, the mounting platform is located inside the first chamber, and when the first chamber and the second chamber are in communication, the mounting platform is located inside the second chamber.

[0012] In the selectable technical solutions of the present invention, a vacuum module and a pressure release module are further provided, wherein the vacuum module is located on the side of the transmission mechanism away from the second chamber in a first direction and is in communication with a conduit and used to vacuum the first chamber through the conduit, and the pressure release module is connected to the first chamber, located on the side of the transmission mechanism away from the second chamber in a first direction and used to release pressure from the first chamber.

[0013] In the selectable technical solutions of the present invention, the pressure relief module comprises a cover plate and a pressure relief valve, the cover plate covering a first chamber and having an airway passing through the cover plate, the airway comprising a main airway segment and a plurality of branch airway segments, the pressure relief valve communicating with the main airway segment, the main airway segment extending along a first direction, and each branch airway segment connected to the main airway segment B1 and the first chamber, and arranged symmetrically with respect to the center of the main airway segment.

[0014] In the selectable technical solutions of the present invention, the vacuum module comprises a first pump, a second pump, a first valve, and a relay pipeline assembly, the relay pipeline assembly being connected to a pipeline, the first pump and the second pump both being connected to the relay pipeline assembly and used to vacuum a first chamber, the first valve being connected to the relay pipeline assembly and located upstream of the second pump to control the operation of the second pump, and the first pump being located upstream of the first valve.

[0015] As described above, the wafer transport apparatus and semiconductor detection apparatus according to the present application have at least the following beneficial effects. In the wafer transfer apparatus according to the present invention, the valve plate pipeline is driven by a transmission mechanism to move along a first direction, thereby changing the position of the valve plate in the first direction and switching between a closed state and a connected state between the first chamber and the second chamber. Furthermore, since a mounting platform for placing silicon wafers is provided on the valve plate, it can move along with the valve plate in the first direction and enter either the first chamber or the second chamber. During the process in which the valve plate moves along the first direction and switches the state between the two chambers, the mounting platform is integrated on the valve plate to synchronously transfer the silicon wafers. Thus, it can be seen that the valve plate not only switches between a connected state and a closed state between the two chambers, but also performs the function of transferring silicon wafers. This significantly shortens the transmission process and improves efficiency. [Brief explanation of the drawing]

[0016] To more clearly illustrate specific embodiments of the present application or the technical concepts in the prior art, the drawings necessary for describing specific embodiments or the prior art are briefly described below. The drawings in the following description are of several embodiments of the present application, and it will be obvious to those skilled in the art that other drawings can be derived from these without any creative effort. [Figure 1] This is a schematic diagram of a portion of a semiconductor detection device according to one embodiment of the present invention. [Figure 2] Figure 1 is a schematic diagram of the wafer transfer apparatus. [Figure 3] Figure 1 is a schematic diagram showing the interaction between the vacuum module and the valve plate piping. [Figure 4] A schematic diagram of a guide base according to one embodiment of the present invention. [Figure 5] This is a schematic diagram of the guide base in Figure 4, viewed from a different angle. [Figure 6] This is a cross-sectional view of the cover plate shown in Figure 1. [Modes for carrying out the invention]

[0017] Where terms indicating direction or positional relationships such as "center," "vertical direction," "horizontal direction," "length," "width," "thickness," "top," "bottom," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inside," "outside," "clockwise," "counterclockwise," "axial direction," "radial direction," and "circumferential direction" appear in the description of this application, unless otherwise specified, they are based on the direction or positional relationships shown in the drawings and are used to facilitate the explanation of this application and simplify the description, and do not indicate or imply that the shown devices or elements have a specific direction, or are composed and operated in a specific direction. Therefore, they should not be understood as limitations on this application.

[0018] Furthermore, when limiting terms such as "first" or "second" appear, which are used solely for descriptive purposes, they should not be understood as indicating or implying relative importance, or implicitly indicating the number of technical features being referred to. Features limited by "first" or "second" may explicitly or implicitly include at least one such limited feature. The term "multiple," unless otherwise specified, usually means including at least two, for example, two, three, etc.

[0019] In this application, unless otherwise specified, terms such as “attachment,” “connection,” “bonding,” and “fixing” should be understood broadly. For example, a fixed connection may be a detachable connection, an integral connection, a mechanical connection, an electrical connection, a direct connection, an indirect connection via an intermediate medium, or an internal communication or interaction relationship between two elements. A person skilled in the art will be able to understand the specific meaning of the above terms in this application depending on the specific situation.

[0020] In the description of this specification, when terms such as "one embodiment", "several embodiments", "example", "specific example", or "several examples" appear, it means that the specific features, structures, materials, or characteristics described by referring to the embodiment or example are included in at least one embodiment or example of this application. In this specification, the general expressions for the above terms are not necessarily for the same embodiment or example. Also, the described specific features, structures, materials, or features can be combined in a suitable manner in any one or more embodiments or examples. Also, as long as they do not conflict with each other, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0021] FIG. 1 is a partial schematic view of a semiconductor detection device according to an embodiment of this application. In FIG. 1, the structure related to the conveyance of the semiconductor detection device and a silicon wafer is shown. Referring to FIG. 1, the semiconductor detection device includes a first chamber R1, a second chamber R2, and a wafer conveyance device 100. The wafer conveyance device 100 includes a valve plate pipeline 10, a transmission mechanism 20, and a mounting table.

[0022] FIG. 2 is a schematic view of the wafer conveyance device 100 in FIG. 1. Referring to FIG. 2, the valve plate pipeline 10 includes a valve plate 11 and a pipeline 12. The valve plate 11 is located in the second chamber R2, the pipeline 12 communicates with the first chamber R1, extends along the first direction from the valve plate 11 and extends out of the second chamber R2, and is connected to the transmission mechanism 20. The transmission mechanism 20 is located outside the second chamber R2 and is located on the side away from the first chamber R1 in the first direction.

[0023] The transmission mechanism 20 is provided to drive the valve plate pipeline 10 to move along the first direction, adjust the position of the valve plate 11 in the first direction, and thereby communicate or cut off the first chamber R1 and the second chamber R2. In other words, the valve plate 11 is for switching the first chamber R1 and the second chamber R2 between a cut-off state and a communication state. In the cut-off state, the first chamber R1 and the second chamber R2 are independently sealed from each other, and in the communication state, the first chamber R1 and the second chamber R2 are communicated with each other.

[0024] Since the mounting table 30 is connected to the valve plate 11 and is located on the side away from the transmission mechanism 20 of the valve plate 11 in the first direction, it can also move in the first direction together with the valve plate 11 to change its position. When the first chamber R1 and the second chamber R2 are in the cut-off state, the mounting table 30 is located in the first chamber R1, and when the first chamber R1 and the second chamber R2 are in the communication state, the mounting table 30 is located in the second chamber R2.

[0025] In this embodiment, the mounting table 30 may be used to mount the silicon wafer 600. The mounting table 30 is not fixedly attached to the first chamber R1 but is attached to the valve plate 11. Due to the action of the transmission mechanism 20, it enters the second chamber R2 from the first chamber R1 together with the valve plate 11 to perform subsequent process processing. Thus, the valve plate 11 in the wafer transfer device 100 not only serves to communicate or cut off the first chamber R1 and the second chamber R2 but also plays a role in driving the mounting table 30 to transfer the silicon wafer 600 to the second chamber R2. In other words, in the process of the valve plate 11 moving along the first direction to switch the state, the mounting table 30 is integrated on the valve plate 11 to synchronously transfer the silicon wafer 600. That is, since the valve plate 11 also has the function of transferring the silicon wafer, the transmission process is significantly shortened and the efficiency is improved.

[0026] A passage is provided between the first chamber R1 and the second chamber R2 to connect them, and the valve plate 11 is used to open and close this passage, connecting or blocking the first chamber R1 and the second chamber R2. To ensure sealing performance, a seal ring 50 is provided on the surface of the valve plate 11 closest to the mounting base 30.

[0027] In several selectable embodiments, the transmission mechanism 20 comprises a base 21, a direction change stopper mechanism 22, and a power member 23. The conduit 12 passes through the base 21. The direction change stopper mechanism 22 is movably connected to the base 21 and the conduit 12, respectively. The power member 23 is mounted on the base 21 and connected to the direction change stopper mechanism 22. The power member 23 is provided to drive the direction change stopper mechanism 22 so that it can be operated in a second direction, thereby adjusting the position of the valve plate conduit 10 in a first direction, where the first direction is perpendicular to the second direction.

[0028] In this embodiment, the base 21 is fixed and cannot move, and the direction change stopper mechanism 22 is movably connected to the base 21, and the direction change stopper mechanism 22 operates in a second direction by the action of the power member 23. The valve plate conduit 10 is movably connected to the direction change stopper mechanism 22, and the direction change stopper mechanism 22 can be driven to move the valve plate conduit 10 along a first direction. That is, by the direction change stopper mechanism 22 operating in a second direction relative to the base 21, the valve plate conduit 10 is moved along a first direction relative to the base 21, and by changing the position of the valve plate conduit 10 in the first direction, i.e., the position of the valve plate 11, the first chamber R1 and the second chamber R2 are switched between a connected state and a blocked state.

[0029] It can be seen that the direction change stopper mechanism 22 converts the degree of freedom of movement in the second direction provided by the power member 23 into the degree of freedom of movement of the valve plate conduit 10 in the first direction. In the embodiment shown in Figures 1 and 2, the first direction is the vertical direction, the second direction is the left-right direction, the first chamber R1 is located above the second chamber R2, and the transmission mechanism 20 is located below the second chamber R2. Due to the action of the power member 23, the direction change stopper mechanism 22 moves in the left-right direction, allowing the valve plate 11 to move in the vertical direction.

[0030] In several selectable embodiments, the wafer transfer device 100 further comprises a seal assembly 40, the seal assembly 40 comprising a first deformation sleeve 41 and a seal support 42. The seal support 42 is provided parallel to the valve plate 11 with a gap in a first direction and is located between the valve plate 11 and the transmission mechanism 20. Both ends of the first deformation sleeve 41 are connected to the valve plate 11 and the seal support 42, respectively, and together they surround to form a third chamber R3. The conduit 12 penetrates the third chamber R3 and the seal support 42 and extends outside the third chamber R3.

[0031] In this embodiment, the valve plate 11 is located within the second chamber R2, and the seal support 42 is attached to the bottom wall of the second chamber R2. Therefore, the first deformation sleeve 41 connected between the valve plate 11 and the seal support 42 is located within the second chamber R2 and extends along the first direction. The third chamber R3, formed by being surrounded by the valve plate 11, the first deformation sleeve 41, and the seal support 42, is also located within the second chamber R2, and the third chamber R3 isolates the second chamber R2 from the outside atmosphere.

[0032] Furthermore, in order to ensure the sealing performance of the second chamber R2, there is a certain requirement for the horizontal mounting of the seal support 42 and the valve plate 11 to the second chamber R2. In this embodiment, the seal support 42 and the valve plate 11 are independent of each other, and when horizontal debugging is performed during the installation process of the seal support 42 and the valve plate 11, they are decoupled from each other, reducing the difficulty of sealing the second chamber R2 and making maintenance easier.

[0033] As can be seen from the above, the conduit 12 extends along the first direction, and the first deformable sleeve 41 also extends along the first direction. Since the conduit 12 penetrates the third chamber R3, the first deformable sleeve 41 is fitted onto the conduit 12.

[0034] Furthermore, as the valve plate 11 moves in the first direction, the first deformation sleeve 41 deforms to conform to the position of the valve plate 11 in the first direction. In a specific application, since the first deformation sleeve 41 is a bellows positioned along the first direction, it can deform in the first direction to adapt to the change in position of the valve plate 11. Of course, the first deformation sleeve 41 is not limited to this, and may be, for example, an elastic rubber tube.

[0035] In specific applications, the seal support 42 may be constructed by coaxially assembling a bearing base and a linear bearing. The conduit 12 extends outside the third chamber R3 through the linear bearing, and the linear bearing ensures the smooth movement of the conduit 12 in the first direction. Of course, the seal support 42 is not limited to this, and may be, for example, a flange structure with a through hole in the center, in which the conduit 12 is fitted into the flange structure to ensure the degree of freedom of movement of the conduit 12 in the first direction.

[0036] Furthermore, debris is generated by the relative movement between the conduit 12 and the seal support 42, and by being contained in the third chamber R3, contamination of the second chamber R2 can be avoided.

[0037] In several selectable embodiments, the direction change stopper mechanism 22 comprises a guide base 221 and rolling elements 222. The guide base 221 is provided with a guide groove A and is connected to a power member 23. The rolling elements 222 are connected to a conduit 12 and are located within the guide groove A. The power member 23 is provided to drive the guide base 221 to move in a second direction, causing the rolling elements 222 to move in a first direction due to the action of the guide groove A.

[0038] As can be seen from the above, since the conduit 12 penetrates the seal support 42 and the base 21 in the first direction, the conduit 12 cannot move in the second direction and only has a degree of freedom of movement in the first direction. In this embodiment, the power member 23 drives the guide base 221 to move along the second direction, causing the rolling element 222 to be displaced in the first direction along the guide groove A, thereby driving the valve plate conduit 10 to change its position in the first direction.

[0039] Furthermore, the transmission mechanism 20 further includes a guide mechanism 24, which is provided between the base 21 and the direction change stopper mechanism 22, and extends along the second direction to guide the direction change stopper mechanism 22 in the second direction.

[0040] In this embodiment, the direction change stopper mechanism 22 is movably connected to the base 21 via the guide mechanism 24. Specifically, the guide base 221 is movably connected to the base 21 via the guide mechanism 24, thereby giving the guide base 221 a degree of freedom of movement in a second direction.

[0041] The guide mechanism 24 is a linear transmission mechanism, and in specific applications, the guide mechanism 24 is a slider guide rail transmission mechanism, but is not limited to this, and may be a rack and pinion transmission mechanism or a screw transmission mechanism, for example. The power member 23 may be a motor, and is not limited to this, and may be an electric push rod, for example.

[0042] Furthermore, the guide groove A includes a plurality of horizontal groove segments A1 and a plurality of inclined groove segments A2, the horizontal groove segments A1 extending along a second direction, each inclined groove segment A2 connecting two adjacent horizontal groove segments A1, and the two adjacent horizontal groove segments A1 are spaced apart in a first direction.

[0043] The power member 23 is provided to drive the guide base 221 and move it in a second direction, so that the rolling element 222 switches between multiple horizontal groove segments A1 by the action of the corresponding inclined groove segment A2.

[0044] In this embodiment, the guide groove A is formed by connecting a plurality of horizontal groove segments A1 and a plurality of inclined groove segments A2, and its cross-sectional shape is similar to a step. The plurality of horizontal groove segments A1 are spaced apart in the first direction and each extends along the second direction, and two adjacent horizontal groove segments A1 are connected via the inclined groove segment A2. Therefore, in the process of the rolling element 222 moving along the guide groove A, the valve plate conduit 10 does not move in the first direction in the horizontal groove segment A1 portion, but moves in the first direction when passing through the inclined groove segment A2 portion.

[0045] As can be seen, each horizontal groove segment A1 can act as a stopper, and when the rolling element 222 is located in a different horizontal groove segment A1, the valve plate conduit 10 is located in a different position in the first direction. In other words, the cooperation of the rolling element 222 and the guide groove A enables switching between different grades of position so that the valve plate conduit 10 at different grades of position is located in different positions in the first direction.

[0046] Furthermore, the multiple horizontal groove segments A1 include a first horizontal groove segment A11, a second horizontal groove segment A12, and a third horizontal groove segment A13, and the first horizontal groove segment A11, the second horizontal groove segment A12, and the third horizontal groove segment A13 are spaced apart in a first direction from top to bottom.

[0047] When the rolling element 222 is positioned in the first horizontal groove segment A11, the valve plate 11 and the mounting base 30 are in a first position in the first direction. When the rolling element 222 is positioned in the second horizontal groove segment A12, the valve plate 11 and the mounting base 30 are in a second position in the first direction. When the rolling element 222 is positioned in the third horizontal groove segment A13, the valve plate 11 and the mounting base 30 are in a third position in the first direction.

[0048] In this embodiment, there are three horizontal groove segments A1, meaning the direction-changing stopper mechanism 22 has three levels of positioning. When the rolling element 222 is located in the first horizontal groove segment A11, it is in the high position. In this case, the valve plate 11 and the mounting base 30 are in the first position in the first direction, the valve plate 11 blocks the first chamber R1 and the second chamber R2, and the mounting base 30 is located inside the first chamber R1. When the rolling element 222 is located in the third horizontal groove segment A13, it is in the low position. In this case, the valve plate 11 and the mounting base 30 are in the third position in the first direction, and both the valve plate 11 and the mounting base 30 are located inside the second chamber R2. When the rolling element 222 is located in the second horizontal groove segment A12, it is in the middle position. In this case, the valve plate 11 and the mounting base 30 are in the second position in the first direction and are located inside the second chamber R2. The second position is located between the first and third positions.

[0049] Furthermore, in the middle and low positions, the valve plate 11 opens a passage to connect the first chamber R1 and the second chamber R2. The first position is the upper limit position reachable by the valve plate 11 in the first direction, and the third position is the lower limit position reachable by the valve plate 11 in the first direction.

[0050] Furthermore, the position of the direction change stopper mechanism 22 is not limited to three positions, and the position of the direction change stopper mechanism 22 can be adjusted by increasing or decreasing the number of horizontal groove segments A1 and inclined groove segments A2.

[0051] Figure 4 is a schematic diagram of a guide base 221 according to one embodiment of the present invention, and the guide base 221 is provided with four guide grooves A. Two guide grooves A are provided opposite each other on both the front and rear side walls of the guide base 221. Two guide grooves A on the same side wall are arranged in parallel, and accordingly, the multiple rolling elements 222 must be matched to fit each guide groove A. As a result, during the driving process of the power member 23, the multiple rolling elements 222 operate synchronously to ensure the stability of the vertical movement of the valve plate pipeline 10. Of course, the structure of the guide base 221 is not limited to the illustrated embodiment. In specific applications, rollers may be used for the rolling elements 222. For example, roller shafts may be used, and are not limited to these.

[0052] The angle between the inclined groove segment A2 and the horizontal groove segment A1 is one of the important factors determining the magnitude of the driving force that the power member 23 must provide. Figure 5 is a schematic diagram of the guide base 221 from a different angle in Figure 4. Referring to Figure 5, in several selectable embodiments, the acute angle between the inclined groove segment A2 and the horizontal groove segment A1 is θ. If θ is too large, the power member 23 must provide a larger driving force to ensure the movement of the rolling elements 222, and it becomes more difficult to prevent the rolling elements 222 from sliding down in the event of stall. If θ is too small, the size occupied by the guide groove A becomes larger. Therefore, it is preferable that 5° ≤ θ ≤ 30°.

[0053] Figure 3 is a schematic diagram showing the cooperation of the vacuum module 200 and the valve plate conduit 10 in Figure 1. Referring to Figures 1 and 3, in some optional embodiments, the semiconductor detection device further comprises the vacuum module 200 and a pressure release module 300. The vacuum module 200 is located on the side of the transmission mechanism 20 away from the second chamber R2 in the first direction and communicates with the conduit 12, and is used to vacuum the first chamber R1 through the conduit 12.

[0054] The pressure release module 300 is connected to the first chamber R1, located away from the second chamber R2 in the first direction, and is used to release pressure from the first chamber R1.

[0055] The conduit 12 is a hollow conduit for passing fluid. As can be seen from the above, since the conduit 12 is in communication with the first chamber R1, the vacuum module 200 can evacuate the first chamber R1 via the conduit 12. If it is necessary to increase the pressure inside the first chamber R1 after it has been evacuated, the pressure release module 300 can release the pressure and break the vacuum.

[0056] Furthermore, the silicon wafer 600 on the atmospheric side needs to be transferred to the second chamber R2 via the first chamber R1. The first chamber R1 needs to be in frequent contact with the atmosphere. In this embodiment, the vacuum module 200 is located below the first chamber R1 and the second chamber R2, and the airflow direction is always downward during vacuuming, ensuring that debris in the first chamber R1 does not accumulate on the surface of the silicon wafer 600 and is pulled out downward by the airflow, thereby guaranteeing the cleanliness requirements of the manufacturing process.

[0057] In several selectable embodiments, the vacuum module 200 comprises a first pump 201, a second pump 202, a first valve 203, and a relay pipeline assembly 204. The relay pipeline assembly 204 is connected to pipeline 12, and both the first pump 201 and the second pump 202 are connected to the relay pipeline assembly 204 to vacuum the first chamber R1. The first valve 203 is connected to the relay pipeline assembly 204 and is located upstream of the second pump 202 to control the operation of the second pump 202. The first pump 201 is located upstream of the first valve 203.

[0058] In this embodiment, the first pump 201, the second pump 202, and the first valve 203 are all connected to the pipeline 12 via the relay pipeline assembly 204, and the first pump 201 and the second pump 202 perform a two-stage vacuuming of the first chamber R1. The first valve 203 is used to open and close the pipeline 12 and the second pump 202, and controls the operation of the second pump 202.

[0059] In some selectable embodiments, the semiconductor detection device further comprises a transport device 400, at least a portion of which is located in a second chamber R2 for transporting a sample positioned on a mounting table 30. Specifically, a silicon wafer 600 can be transported by the transport device 400 after it has entered the second chamber R2 together with the mounting table 30. In specific applications, the transport device 400 may be a transport robot arm, a rotary arm, or the like.

[0060] In some selectable embodiments, the semiconductor detection device further comprises a second valve 500, which is connected to the first chamber R1 and used to open and close the first chamber R1. Specifically, a silicon wafer 600 located on the atmospheric side can enter the first chamber R1 through the second valve 500.

[0061] To facilitate the explanation of this solution, the transport process of the silicon wafer 600 will be described below with reference to Figure 1. In the embodiment shown in Figure 1, the second valve 500 seals the first chamber R1, the valve plate 11 separates the first chamber R1 and the second chamber R2, in this case the direction change stopper mechanism 22 is in a high position, both the valve plate 11 and the mounting base 30 are in a first position, and the mounting base 30 is located inside the first chamber R1.

[0062] If the first chamber R1 is under vacuum, the pressure release module 300 is controlled to release gas into the first chamber R1 and increase the pressure until the pressure in the first chamber R1 satisfies the conditions for opening the second valve 500. After that, the pressure release module 300 is closed and the second valve 500 is opened. A transport robot located outside the first chamber R1 removes the silicon wafer 600 that has been detected from the mounting table 30, places the silicon wafer 600 to be detected on the mounting table 30, and then closes the second valve 500.

[0063] The first pump 201 is turned on to perform the first stage of vacuuming the first chamber R1 until the pressure in the first chamber R1 reaches the first stage preset pressure, then the first pump 201 is turned off and the first valve 203 is turned on. The second pump 202 is also turned on to perform the second stage of vacuuming the first chamber R1 until the pressure in the first chamber R1 reaches the second stage preset pressure, ensuring that the vacuum level of the first chamber R1 meets the requirements, and the power member 23 is activated to switch the grade position of the direction change stopper mechanism 22.

[0064] With the direction change stopper mechanism 22 in the middle or low position, both the valve plate 11 and the mounting base 30 are located within the second chamber R2, and accordingly, the silicon wafer 600 is also located within the second chamber R2. In this case, the process of transporting the silicon wafer 600 downstream by the transport device 400 can be controlled. In a specific application, the first pump 201 is a dry pump, and the second pump 202 is a molecular pump.

[0065] Figure 6 is a cross-sectional view of the cover plate 301 in Figure 1. Referring to Figures 1 and 6, in several selectable embodiments, the pressure relief module 300 comprises a cover plate 301 and a pressure relief valve 302, the cover plate 301 covering the first chamber R1 and having an airway B that penetrates the cover plate 301.

[0066] Airway B comprises a main airway segment B1 and a number of branch airway segments B2, and a pressure relief valve 302 is in communication with the main airway segment B1. The main airway segment B1 extends along a first direction, and each branch airway segment B2 is connected to the main airway segment B1 and the first chamber R1, and is arranged symmetrically with respect to the center of the main airway segment B1.

[0067] In this embodiment, the first chamber R1 can communicate with the outside atmosphere via a pressure relief valve 302 and airway B. Airway B consists of a main airway segment B1 and a plurality of branch airway segments B2. Air introduced through the main airway segment B1 is divided by the branch airway segments B2 to reduce the air pressure. The vertical projection of the plurality of branch airway segments B2 is radial, centered on the main airway segment B1. This prevents the introduced airflow from being directed downwards and directly impacting the silicon wafer 600, thereby preventing damage to the silicon wafer 600 and reducing the risk of blowing it away.

[0068] Furthermore, the cover plate 301 may be made of a transparent material such as an acrylic plate or high-pressure resistant glass. This allows observation of the state of the silicon wafer 600 located in the first chamber R1 through the cover plate 301, which is advantageous for early detection of problems and facilitates maintenance.

[0069] Referring to Figure 3, in several selectable embodiments, the vacuum module 200 further comprises a pressure gauge 205 and a vacuum gauge 206, both of which are connected to the relay pipeline assembly 204. The pressure gauge 205 and vacuum gauge 206 monitor whether the pressure in the first chamber R1 has reached the corresponding pressure condition. It should be understood that although both the pressure gauge 205 and vacuum gauge 206 are used to detect the pressure in the chamber, they have different measurement ranges and accuracies. The pressure gauge 205 has a wide measurement range and low accuracy, while the vacuum gauge 206 has a narrow measurement range and high accuracy. The two pressure measuring devices enable monitoring of the pressure in the first chamber R1 at different stages.

[0070] Referring to Figures 1 and 3, in several selectable embodiments, the intermediate conduit assembly 204 comprises an intermediate conduit segment 2041 and a second deformation sleeve 2042, the intermediate conduit segment 2041 being provided on the transmission mechanism 20, and both ends of the second deformation sleeve 2042 being connected to the conduit 12 and the intermediate conduit segment 2041, respectively.

[0071] In this embodiment, the conduit 12 passes through the base 21 and is then connected to the second deformation sleeve 2042. As the valve plate conduit 10 moves along the first direction, the second deformation sleeve 2042 deforms in the first direction to adapt to the change in position of the conduit 12. The first pump 201, the second pump 202, and the first valve 203 are all connected to the intermediate conduit segment 2041, which is fixed to the base 21.

[0072] In specific applications, the second deformation sleeve 2042 is a bellows. Of course, it is not limited to this, and may be an elastic rubber tube, for example. In the above embodiments, the example of transporting a silicon wafer 600 was used, but it is not limited to this.

[0073] Although embodiments of the present application have been described above, these embodiments are illustrative and do not limit the present application. Those skilled in the art can modify, alter, substitute, and transform the above embodiments within the scope of the present application. [Explanation of Symbols]

[0074] 2 Rolling elements 10 Valve Plate Piping 11 Valve Plate 12 Conduit 20 Transmission mechanism 21 Base 22 Direction change stopper mechanism 23 Power Components 24 Guide mechanism 30 Mounting platform 40 seal assemblies 41 First Transformation Sleeve 42 Seal support 50 sealing rings 100 wafer transport equipment 200 Vacuum Module 201 Pump No. 1 202 Pump No. 2 203 Valve No. 1 204 Relay conduit assembly 205 Pressure Gauge 206 Vacuum Gauge 221 Guide Base 300 Pressure Release Module 301 Lid plate 302 Pressure relief valve 400 Conveyor System 500 Second valve 600 silicon wafers 2041 Relay conduit segment 2042 Second Transformation Sleeve A Guide groove A1 Horizontal groove segment A2 Inclined groove segment A11 First horizontal groove segment A12 Second horizontal groove segment A13 Third horizontal groove segment B. Airway B1 Main airway segment B2 Branch Airway Segment R1 First Chamber R2 Second Chamber R3 Third Chamber

Claims

1. A wafer transport device, It comprises a valve plate pipeline, a transmission mechanism, and a mounting base. The valve plate conduit comprises a valve plate and a conduit extending from the valve plate in a first direction. The mounting base is connected to the valve plate and is located on the side of the valve plate away from the transmission mechanism in the first direction. The transmission mechanism is connected to the pipeline and is configured to drive the valve plate pipeline to move along the first direction, thereby adjusting the position of the valve plate and the mounting base in the first direction. A wafer transfer apparatus characterized by the following features.

2. The transmission mechanism comprises a base, a direction change stopper mechanism, and a power member. The aforementioned conduit penetrates the base, The direction change stopper mechanism is movably connected to the base and the conduit, respectively. The power member is provided on the base and connected to the direction change stopper mechanism. The power member is provided to drive the direction change stopper mechanism to operate in the second direction, and adjusts the position of the valve plate pipeline in the first direction. The first direction is perpendicular to the second direction. The wafer transport apparatus according to feature 1.

3. The aforementioned direction change stopper mechanism comprises a guide base and rolling elements, The guide base is provided with a guide groove and is connected to the power member. The rolling element is connected to the pipeline and provided within the guide groove, The power member is provided to drive the guide base and move in the second direction, so that the rolling element moves in the first direction due to the action of the guide groove. The wafer transport apparatus according to feature 2.

4. The guide groove includes a plurality of horizontal groove segments and a plurality of inclined groove segments, the horizontal groove segments extending along the second direction, each inclined groove segment connecting two adjacent horizontal groove segments, and the two adjacent horizontal groove segments are spaced apart in the first direction. The power member is provided to drive the guide base and move in the second direction, so that the rolling element switches between a plurality of horizontal groove segments by the action of the corresponding inclined groove segment. The wafer transport apparatus according to feature 3.

5. The plurality of horizontal groove segments include a first horizontal groove segment, a second horizontal groove segment, and a third horizontal groove segment, and the first horizontal groove segment, the second horizontal groove segment, and the third horizontal groove segment are provided at intervals from top to bottom in the first direction. When the rolling element is positioned in the first horizontal groove segment, the valve plate and the mounting base described above are in a first position in the first direction. When the rolling element is positioned in the second horizontal groove segment, the valve plate and the mounting base described above are positioned in the second position in the first direction. When the rolling element is positioned in the third horizontal groove segment, the valve plate and the mounting base described above are positioned in the third position in the first direction. The wafer transport apparatus according to feature 4.

6. The wafer transfer device further comprises a seal assembly, The seal assembly comprises a first deformation sleeve and a seal support, The seal support is provided parallel to the valve plate with a gap in the first direction and is located between the valve plate and the transmission mechanism, and both ends of the first deformation sleeve are connected to the valve plate and the seal support, respectively, and together they surround to form a third chamber. The conduit extends outside the third chamber, passing through the third chamber and the seal support. The wafer transport apparatus according to feature 1.

7. A semiconductor detection device, The apparatus comprises a first chamber, a second chamber, and a wafer transfer apparatus according to any one of claims 1 to 6. The first chamber is connected to the second chamber in a first direction, and the transmission mechanism is located outside the second chamber and on the side away from the first chamber in a first direction. The valve plate is located within the second chamber, the conduit is in communication with the first chamber, and the valve plate is provided to move by the action of the transmission mechanism to connect or disconnect the first chamber and the second chamber. When the first chamber and the second chamber are separated, the aforementioned mounting base is located inside the first chamber, and when the first chamber and the second chamber are connected, the aforementioned mounting base is located inside the second chamber. A semiconductor detection device characterized by the following features.

8. It further includes a vacuum module and a pressure release module. The vacuum module is provided on the side of the transmission mechanism away from the second chamber in the first direction, and is used to vacuum the first chamber through the conduit, communicating with the conduit. The pressure release module is connected to the first chamber, located away from the second chamber in the first direction, and is used to release pressure from the first chamber. The semiconductor detection device according to claim 7, characterized in that it is as described above.

9. The pressure release module comprises a cover plate and a pressure release valve. The cover plate covers the first chamber and has an airway that penetrates the cover plate. The aforementioned airway comprises a main airway segment and a plurality of branched airway segments. The pressure relief valve is in communication with the main airway segment, The aforementioned main airway segment extends along the first direction, Each of the branch airway segments is connected to the main airway segment B1 and the first chamber, and is arranged symmetrically with respect to the center of the main airway segment. The semiconductor detection device according to claim 8, characterized in that it is as described above.

10. The vacuum module comprises a first pump, a second pump, a first valve, and a relay pipeline assembly. The relay conduit assembly is connected to the conduit, Both the first pump and the second pump are connected to the relay pipeline assembly and used to evacuate the first chamber. The first valve is connected to the relay pipeline assembly and is located upstream of the second pump to control the operation of the second pump. The first pump is located upstream of the first valve, The semiconductor detection device according to claim 8, characterized in that it is as described above.

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