Alignment fixtures related to processing chambers, as well as related apparatus, systems, and methods.

Abstract

The alignment assembly includes a sensor and a lid containing a first window. The alignment assembly also includes a rotary joint connected to the lid. The alignment assembly also includes a fixture connected to the rotary joint and pivotable around the rotary joint relative to the lid. The fixture includes an extendable arm that can move from a retracted position where the sensor is positioned above the first window to an extended position where the sensor is positioned above the first window. The alignment assembly also includes a lock configured to selectively pivot the fixture relative to the lid and to selectively lock the extendable arm in either the retracted or extended position.

Description

Technical Field

[0001]

[0001] This disclosure relates to a semiconductor processing chamber, and more particularly, to analyzing the alignment of components within the processing chamber.

Background Art

[0002]

[0002] Processing chambers are used to manufacture semiconductor devices. A processing chamber includes a substrate support that rotates within the chamber to support a substrate. If the substrate support is misaligned within the processing chamber, the substrate support may contact another component within the processing chamber. This contact may damage the components within the chamber and may generate particles that interfere with the formation of semiconductor devices on the substrate. Further, devices for determining the alignment of the substrate support may be limited with respect to the chamber configuration.

[0003]

[0003] In the art, there is a need for a system for determining the alignment of various models of substrate supports within a processing chamber (including measuring various portions of the substrate support using the same sensors).

Summary of the Invention

[0004]

[0004] This disclosure relates to a semiconductor processing chamber, and more particularly, to analyzing the alignment of components within the processing chamber. In one or more embodiments, the alignment between a substrate support and an outer structure (such as a preheat ring) is determined.

[0005]

[0005] In one or more embodiments, a fixture for mounting to a substrate processing chamber usable in semiconductor manufacturing includes a base arm having at least one base opening. The fixture includes an extendable arm having a first opening and a second opening, the openings being offset from each other by a certain distance, the first opening being aligned with at least a portion of at least one base opening when the extendable arm is in the retracted position. The second opening is aligned with at least a portion of at least one base opening when the extendable arm is in the extended position. The fixture includes a sensor mount connected to a first end of the extendable arm and a guide rail assembly. The guide rail assembly includes at least one rail and a carriage engaged with at least one rail and connected to the extendable arm. The carriage is movable along at least one rail to move the extendable arm between the retracted position and the extended position.

[0006]

[0006] In one or more embodiments, the alignment assembly includes a sensor, a lid including a first window, a rotary joint connected to the lid, and a fixture connected to the rotary joint and pivotable around the rotary joint relative to the lid. The fixture includes an extendable arm that can move from a retracted position where the sensor is positioned at a first position above the first window to an extended position where the sensor is positioned at a second position above the first window. The alignment assembly includes a lock configured to selectively pivot the fixture relative to the lid, and to selectively fix the extendable arm in the retracted or extended position.

[0007]

[0007] In one or more embodiments, a method for positioning a sensor includes pivoting a fixture attached to the lid of a processing chamber relative to a first pivot position in order to position a sensor connected to an extendable arm of the fixture above a first window of the lid. The method includes adjusting the position of the extendable arm relative to the base arm of the fixture to position the sensor at a first position above the first window. The method includes securing the sensor at the first position above the first window by inserting a locking pin through the extendable arm and the base arm into a first locking opening formed in the lid.

[0008]

[0008] To enable a detailed understanding of the above-described features of the Disclosure, a more specific description of the Disclosure, which has been briefly summarized above, can be obtained by referring to embodiments. Some of these embodiments are illustrated in the accompanying drawings. However, it should be noted that the accompanying drawings only illustrate exemplary embodiments of the Disclosure and should not be considered to limit its scope, and the Disclosure may permit other equally effective embodiments. [Brief explanation of the drawing]

[0009] [Figure 1]

[0009] This is a partial schematic side cross-sectional view of an exemplary processing chamber. [Figure 2A]

[0010] This is a schematic top view of the jig and sensor shown in Figure 1, according to one or more embodiments. [Figure 2B]

[0011] Figure 2A is a schematic top view of the fixture, which includes an extendable arm separated from a base arm, according to one or more embodiments. [Figure 2C]

[0012] This is a schematic partial cross-sectional view of the jig shown in Figure 2A, according to one or more embodiments. [Figure 3]

[0013] This is a schematic top view of an exemplary alignment assembly 300 used to determine the alignment of a preheating ring and a substrate support, according to one or more embodiments. [Figure 4]

[0014] Figure 3 shows a schematic partial cross-sectional side view of the alignment assembly above the non-overlapping substrate support and preheating ring structure according to one or more embodiments. [Figure 5]

[0015] The signals obtained by the sensors of the alignment assembly shown in Figure 4, compared to a reference profile, are shown according to one or more embodiments. [Figure 6]

[0016] Figure 3 shows a schematic partial cross-sectional side view of the alignment assembly above the overlapping substrate supports and preheating ring according to the embodiment. [Figure 7]

[0017] The signals obtained by the sensors of the alignment assembly shown in Figure 6, compared to a reference profile, are shown according to one or more embodiments. [Figure 8]

[0018] A schematic diagram of the controller user interface according to one or more embodiments is shown. [Figure 9]

[0019] This is a flowchart of a method for arranging sensors according to one or more embodiments. [Figure 10]

[0020] A flowchart shows an exemplary method for determining alignment within a processing chamber according to one or more embodiments. [Modes for carrying out the invention]

[0010]

[0021] For ease of understanding, the same reference numerals have been used to indicate identical elements common to the figures where possible. It is intended that elements and features of one embodiment can be advantageously incorporated into other embodiments without further description.

[0011]

[0022] This book discloses apparatus and methods for determining the in-situ alignment of a substrate support. In one or more embodiments, the alignment between the substrate support and an outer structure (e.g., a preheating ring) is determined.

[0012]

[0023] FIG. 1 is a partial schematic side cross-sectional view of a processing chamber 100 including a process kit 111 according to one or more embodiments. The processing chamber 100 is a deposition chamber. In one or more embodiments, the processing chamber 100 is an epitaxial deposition chamber. An epitaxial film is grown on a substrate 102 using the processing chamber 100. The processing chamber 100 generates a cross-flow of precursors across the upper surface 150 of the substrate 102. In one or more embodiments, the processing chamber 100 is used for rapid thermal processing. The processing chamber 100 can operate under vacuum, such as near low pressure or near atmospheric pressure. Other pressure values are also contemplated.

[0013]

[0024] The processing chamber 100 includes an upper body 156, a lower body 148 disposed below the upper body 156, and a flow module 112 disposed between the upper body 156 and the lower body 148. The upper body 156, the flow module 112, and the lower body 148 form at least a part of the chamber body. Inside the chamber body, a substrate support 106, an upper window 108 (e.g., an upper dome), a lower window 110 (e.g., a lower dome), a plurality of upper heat sources 141, and a plurality of lower heat sources 143 are deposited. As shown, a controller 120 is connected to the processing chamber 100 and is used to control processes and methods, such as the operation of the methods described herein. FIG. 1 also includes an X, Y, Z coordinate system indicating various axial directions along the processing chamber 100.

[0014]

[0025] In one or more embodiments, the heat sources (e.g., heat sources 141, 143) described herein include radiant heat sources such as lamps (e.g., halogen lamps). In the present disclosure, it is contemplated that other heat sources may be used as the various heat sources described herein (in addition to, or instead of, lamps). For example, as the various heat sources described herein, a resistive heater, a light-emitting diode (LED), and / or a laser may be used.

[0015]

[0026] The upper window 108 and the lower window 110 are formed of a material that transmits energy such as quartz and may be transparent in one or more embodiments, allowing heat to be transferred from the upper heat source 141 and the lower heat source 143 to the substrate 102 and / or the substrate support 106.

[0016]

[0027] The processing space 136 and the purge space 138 are formed between the upper window 108 and the lower window 110. The processing space 136 and the purge space 138 are part of an internal space at least partially defined by the upper window 108, the lower window 110, the upper liner 122, and one or more lower liners 109.

[0017]

[0028] The substrate support 106 is disposed between the upper window 108 and the lower window 110 within the internal space. The substrate support 106 includes an upper surface on which the substrate 102 is disposed. The substrate support 106 is attached to a shaft 118. The shaft 118 is connected to a motion assembly 121. The motion assembly 121 includes one or more actuators and / or adjustment devices that move and / or adjust the shaft 118 and / or the substrate support 106 within the processing space 136. For example, the motion assembly 121 can adjust the vertical position (e.g., in the Z direction) of the substrate support 106. The motion assembly 121 can adjust the lateral position (e.g., the position in one or both of the X and Y directions). In addition, the motion assembly 121 can be used to adjust the tilt of the substrate support 106. For example, the motion assembly 121 can pivot the substrate support 106 in the X-Z plane and / or the Y-Z plane. The substrate support 106 is rotatable about the central axis 101 relative to the preheat ring 105. The motion assembly 121 can rotate the substrate support 106.

[0018]

[0029] The substrate support 106 may include internally located lift pin holes 107. The lift pin holes 107 are sized to accommodate lift pins 132 for raising and lowering the substrate 102 to and from the substrate support 106 before or after the deposition process. The lift pins 132 may rest on lift pin stops 134 when the substrate support 106 is lowered from the processing position to the moving position. The lift pin stops 134 may be connected to the second shaft 104 through a plurality of arms.

[0019]

[0030] The preheating ring 105 is positioned outside the substrate support 106. The preheating ring 105 is supported on the ledge of one or more lower liners 109. In one or more embodiments, the preheating ring 105 and / or liners 109, 113, and / or 122 are formed from one or more of the following: quartz (e.g., transparent quartz such as clear quartz, opaque quartz such as white quartz, quartz impregnated with particles such as SiC or Si, and / or black quartz), silicon carbide (SiC), and / or graphite coated with SiC.

[0020]

[0031] The lid assembly 180 is connected to the upper body 156. The lid assembly 180 includes a lid 182 (e.g., a lid plate) having a plurality of windows 184. An extendable fixture 190 is positioned on the outer surface 183 of the lid 182. The sensor 192 is mounted on the fixture 190. The fixture 190 is used to position the sensor 192 above the window 184 and at the interface between the substrate support 106 and the preheating ring 105. The alignment of the substrate support 106 with respect to the preheating ring 105 is determined by measuring the preheating ring 105 and the substrate support 106 through one of the windows 184 using the sensor 192. The lid assembly 180, the fixture 190, and the sensor 192 are at least part of the alignment assembly of the processing chamber 100.

[0021]

[0032] The motion assembly 121 can be used to adjust the alignment of the substrate support 106 with respect to the preheating ring 105 based on measurements obtained by the sensor 192. The motion assembly 121 can be used to move the substrate support 106 and change its vertical position, lateral position, and / or tilt, thereby achieving the desired alignment with the preheating ring 105. For example, the motion assembly 121 can be used to move the central axis 101 to align it with the center of the opening of the preheating ring 105 as shown in Figure 1, thereby centering the substrate support 106 within the preheating ring 105. In one or more embodiments, the controller 120 sends an instruction to the operator allowing the operator to manually adjust the alignment of the substrate support 106 using the motion assembly 121. In one or more embodiments, if the controller 120 determines, based on information obtained by the sensor 192, that the substrate support 106 is misaligned, the controller 120 automatically causes the motion assembly 121 to adjust the alignment of the substrate support 106 relative to the preheating ring 105.

[0022]

[0033] The controller 120 may include a programmable central processing unit (CPU) that can be operated together with memory (e.g., non-transient computer-readable media and / or non-volatile memory) and support circuitry. The support circuitry, coupled to the CPU, includes a cache, clock circuitry, input / output subsystems, power supplies, and combinations thereof coupled to various components of the processing chamber 100, in order to facilitate control of the processing chamber 100. For example, in one or more embodiments, the CPU is one of any form of general-purpose computer processor used in industrial settings, such as a programmable logic controller (PLC), for controlling various polishing system components and subprocessors. The memory coupled to the CPU is non-transient and is one or more readily available memories, such as random access memory (RAM), read-only memory (ROM), floppy disk drives, hard disks, or any other form of local or remote digital storage.

[0023]

[0034] Here, memory is in the form of a computer-readable storage medium (e.g., non-volatile memory) containing instructions, which, when executed by the CPU, facilitate the operation of the processing chamber 100. The instructions in memory are in the form of a program product (e.g., a middleware application, a device software application, etc., a program that implements the method of this disclosure). The program code may be adapted to one of several different programming languages. In one or more embodiments, this disclosure may be implemented as a program product stored on a computer-readable storage medium for use with a computer system. The program of the program product defines the functions of the embodiments (including the methods and operations described herein).

[0024]

[0035] An example of a computer-readable storage medium is, (i) a non-writable storage medium on which information is permanently stored (e.g., a read-only memory device in a computer, such as a CD-ROM disk that can be read by a CD-ROM drive, flash memory, ROM chip, or any type of solid-state non-volatile semiconductor memory), and (ii) a writable storage medium on which modifiable information is stored (e.g., a floppy disk in a diskette drive or hard disk drive, or any type of solid-state random-access semiconductor memory). Such a computer-readable storage medium constitutes an embodiment of the disclosure if it holds computer-readable instructions that direct the functions of the methods described herein.

[0025]

[0036] The various methods (e.g., Method 900 and / or Method 1000) and processes disclosed herein can generally be implemented by the CPU of the controller 120 executing computer instruction codes stored in memory (or the memory of a particular processing chamber) as software routines, for example, under the control of the CPU. Once the computer instruction codes are executed by the CPU, the CPU controls the components of the processing chamber 100 and executes the processes according to the various methods and processes described herein. In one or more embodiments, memory (a non-temporary computer-readable medium) contains stored instructions, which, when executed, cause the methods (e.g., Method 900 and / or Method 1000) and processes (e.g., processes 902-908 and / or processes 1003-1015) described herein to be performed. The processes described herein may be stored in memory in the form of computer-readable logic. The controller 120 is connected to the sensor 192 and the motion assembly 121 and can, for example, perform multiple processes.

[0026]

[0037] The controller 120 may include one or more machine learning and / or artificial intelligence (ML / AI) algorithms. One or more ML / AI algorithms can optimize, for example, the adjustment instructions for step 1015 of method 1000. One or more ML / AI algorithms can use, for example, a regression model (such as a linear regression model) or a clustering method to estimate the optimized parameters. The algorithms may be unsupervised or supervised. In one or more embodiments, the controller 120 automatically executes the steps described herein without using one or more ML / AI algorithms. In one or more embodiments, the controller 120 compares measured values ​​(such as data from one or more of steps 1006, 1009, 1010, 1011, and / or 1015) with data in a lookup table and / or library to determine whether the data for the adjustment instructions should be changed. The controller 120 can store the measured values ​​as data in a lookup table and / or library.

[0027]

[0038] Multiple upper heat sources 141 are positioned between the upper window 108 and the lid assembly 180. The multiple upper heat sources 141 form part of the upper heat source module 155. The upper heat sources 141 supply heat to the substrate 102 and / or substrate support 106. The upper heat sources 141 may be, for example, tungsten filament heat sources or higher-power LEDs. The multiple upper heat sources 141 can direct radiation, such as infrared radiation, through the upper window 108 to heat the substrate 102 and / or substrate support 106. The lid assembly 180 may include multiple sensors positioned inside to measure the temperature inside the processing chamber 100.

[0028]

[0039] Multiple lower heat sources 143 are positioned between the lower window 110 and the floor 152. The multiple lower heat sources 143 form part of the lower heating module 145. The lower heat source 143 may be, for example, a tungsten filament heat source or a higher-power LED. Multiple lower heat sources 143 can direct radiation, such as infrared radiation, through the lower window 110 to heat the substrate 102 and / or substrate support 106.

[0029]

[0040] The upper reflector 140 can be attached to the underside of the lid 182. The upper heat source 141 above the substrate support 106 may be installed below the lid 182, either inside or adjacent to the upper reflector 140. The upper reflector 140 may be made of a reflective metal alloy, such as a reflective aluminum alloy. An upper temperature sensor 170, such as a pyrometer, may be installed inside, on top of, or adjacent to the lid assembly 180 to detect the temperature of the substrate 102 during processing.

[0030]

[0041] The lower heat source 143 may be installed in or adjacent to the lower reflector 130, or in or adjacent to the lower shell assembly 173. The lower reflector 130 may surround the lower shell assembly 173. The lower reflector 130 and / or the lower shell assembly 173 may be formed at least partially (for example, partially or entirely) of a reflective metal alloy such as a reflective aluminum alloy. A lower temperature sensor 174, such as a pyrometer, may be installed in the lower shell assembly 173 and may detect the temperature of the substrate support 106 and / or the temperature of the back side of the substrate 102.

[0031]

[0042] Figure 1 shows heat sources 141 and 143 of the same size and number, installed above and below the upper window 108 and lower window 110, respectively, but heat sources of different types, intensities, wavelengths, numbers, and / or sizes may be installed in or adjacent to one or more of the reflectors 130 and 140. In addition, the upper heat sources 141 and lower heat sources 143 may be placed in additional and / or alternative locations.

[0032]

[0043] The flow module 112 includes a plurality of gas inlets 114, a plurality of purge gas inlets 164, and one or more gas exhaust outlets 116. In one or more embodiments, the plurality of gas inlets 114 and the plurality of purge gas inlets 164 are located on the opposite side of the flow module 112 from the one or more gas exhaust outlets 116. An upper liner 122 and a lower liner 108 are located on the inner surface of the flow module 112 and protect the flow module 112 from reactive gases used during deposition and / or cleaning processes. The gas inlets 114 and purge gas inlets 164 are each positioned to allow gas to flow parallel to the upper surface 150 of the substrate 102 located in the processing space 136. The gas inlets 114 are fluidically connected to one or more processing gas sources 151 and one or more cleaning gas sources 153. The purge gas inlets 164 are fluidically connected to one or more purge gas sources 162. One or more gas exhaust outlets 116 are fluidically connected to an exhaust pump 157. One or more process gases supplied using one or more process gas sources 151 may contain one or more reactive gases (e.g., one or more of silicon (Si), phosphorus (P), and / or germanium (Ge)) and one or more carrier gases (e.g., one or more of nitrogen (N2) and / or hydrogen (H2)). One or more purge gases supplied using one or more purge gas sources 162 may contain one or more inert gases (e.g., one or more of argon (Ar), helium (He), hydrogen (H2), and / or nitrogen (N2)). One or more cleaning gases supplied using one or more cleaning gas sources 153 may contain one or more of hydrogen (H) and / or chlorine (Cl). In one or more embodiments, one or more process gases contain silicon phosphide (SiP) and / or phosphine (PH3), and one or more cleaning gases contain hydrochloric acid (HCl).

[0033]

[0044] One or more gas exhaust outlets 116 are connected to or include an exhaust system 178. The exhaust system 178 fluidly connects one or more gas exhaust outlets 116 to an exhaust pump 157. The exhaust system 178 may be useful when controlling the deposition of layers on the substrate 102. In one or more embodiments, the exhaust system 178 is located on the opposite side of the processing chamber 100 from the gas inlet 114 and / or purge gas inlet 164.

[0034]

[0045] During processing, one or more processing gases P1 flow over the substrate 102 from the gas inlet 114 to the processing space 136, forming one or more layers on the substrate 102 (e.g., epitaxial growth) while heat sources 141, 143 heat the preheating ring 105 and the substrate 102. After flowing over the substrate 102, one or more processing gases P1 flow out of the internal space through one or more gas outlets 116. The flow module 112 may be at least part of one or more side walls of the processing chamber 100. In this disclosure, it is assumed that one or more purge gases may be supplied to and discharged from the purge space 138 (through a plurality of purge gas inlets 164) during the deposition process.

[0035]

[0046] Figure 2A is a schematic top view of the fixture 190 and sensor 192 shown in Figure 1, according to one or more embodiments. The fixture 190 supports the sensor 192 above one of the windows 184 of the lid assembly 180. The fixture 190 includes a base arm 210, an extendable arm 220, a guide rail assembly 250, and a locking pin 290. The guide rail assembly 250 facilitates adjusting the position of the extendable arm 220 from a retracted position to an extended position relative to the base arm 210. Figure 2A shows the extendable arm 220 and the locking pin 290, which is inserted through the base arm 210 and locks the extendable arm 220 in the extended position.

[0036]

[0047] Figure 2B is a schematic top view of the fixture 190 shown in Figure 1 and an extendable arm 220 separated from the base arm 210 to better illustrate the features of the base arm 210, according to one or more embodiments. As shown in Figure 2B, the extendable arm 220 includes a first arm opening 221 and a second arm opening 222 formed within the arm member 224. The centers of the first arm opening 221 and the second arm opening 222 are offset from each other by a distance A1 along the longitudinal axis. In other words, the centers of the arm openings 221 and 222 are not aligned along a transverse axis perpendicular to the longitudinal axis. The extendable arm 220 includes a sensor mount 230 located at one end. The sensor mount 230 may be a plate perpendicular to the extendable arm 220, and the tongue of the extendable arm 220 may be fixedly mounted within an opening formed within the sensor mount 230. The sensor 192 can be mounted on the sensor mount 230. For example, the sensor 192 may be bonded to the sensor mount 230 or attached by one or more fasteners (e.g., one or more screws, bolts, studs, nuts, and / or screw interfaces). The sensor mount 230 may include one or more openings within the sensor mount 230 so that a wire or cable can be connected to the sensor 192 through the opening. Multiple fasteners (see Figures 2A-2B) may be inserted through fastener openings in the arm member 224 to attach an extendable arm 220 to the carriage 260 of the guide rail assembly 250.

[0037]

[0048] The base arm 210 includes a first base opening 211 and a second base opening 212 extending through a base arm member 214. The base openings 211 and 212 are located on either side of the rail 252 of the guide rail assembly 250, as shown in Figure 2B. The base arm 210 is attachable to the rotary joint 280 at a first end 216. As shown, a plurality of fasteners 215 may be positioned within corresponding openings 217 formed within the first end 216 to attach the base arm 210 to the rotary joint 280. The rotary joint 280 is also attached to the lid assembly 180. In one or more embodiments, the rotary joint 280 includes a body 282 and a mounting member 284. The mounting member 284 may be a flange that can be secured to the surface of the lid assembly 180 using a plurality of fasteners. The mounting member 284 is partially positioned within a race of the body 282, which engages with one or more internal bearing elements that allow the body to rotate around a pivot point 286 relative to the mounting member 284. In one or more embodiments, the rotary joint 280 is a swivel bearing. The body 282 is rotatable relative to the mounting member 284, facilitating the rotation of the fixture 190 around the pivot point 286 to position the sensor 192 above a particular window 184 of the lid assembly 180.

[0038]

[0049] Figure 2C is a partial schematic side cross-sectional view of a fixture 190 showing a guide rail assembly 250 according to one or more embodiments. The guide rail assembly 250 guides the movement of an extendable arm 220 relative to a base arm 210 from an extended position (Figures 2A, 2C, 4) to a retracted position (Figure 6). In one or more embodiments, the guide rail assembly 250 includes at least one rail 252 and a carriage 260. The carriage 260 is slidable along at least one rail 252 to move the extendable arm 220 between the extended and retracted positions. The carriage 260 may include a plurality of roller elements, such as ball bearings, which are positioned in a corresponding race 254 formed on at least one side of the rail 252 and configured to rotate along the race. The embodiments shown in Figures 2A to 2C include a single rail 252. In one or more embodiments, the carriage 260 is attached to an extendable arm 220, and at least one rail 252 is attached to a base arm 210. The carriage 260 may be attached to the base arm 210, while at least one rail 252 is attached to the extendable arm 220. In addition, the carriage 260 may be integrated with the extendable arm 220 or the base arm 210 rather than being a separate part attached to them. In one or more embodiments, the rail 252 extends along the length of an opening formed in either the base arm 210 or the extendable arm 220, together with the carriage 260 which can slide within the opening forming the rail 252.

[0039]

[0050] When the extendable arm 220 is in the extended position as shown in Figure 2C, the first arm opening 221 is positioned above and aligned with the first base opening 211. The locking pin 290 can be inserted into the aligned first base opening 211 and the first arm opening 221 to secure the extendable arm 220 in the extended position. When the extendable arm is in the retracted position (see Figure 6), the second arm opening 222 is positioned above and aligned with the second base opening 212. The locking pin 290 can be inserted into the aligned second arm opening 222 and the second base opening 212 to secure the extendable arm in the retracted position.

[0040]

[0051] In one or more embodiments, the extendable arm 220 is fixed in a position between the extended position and the retracted position. For example, the extendable arm 220 may include one or more openings located between the first arm opening 221 and the second arm opening 222, and may be aligned with at least one of the first base opening 211 and the second base opening 212 to accommodate the insertion of the locking pin 290.

[0041]

[0052] The jig 190 is used to support the sensor 192 above the interface between the preheating ring 105 and the substrate support 106, so that the sensor can scan both the preheating ring 105 and the substrate support 106 (and any gap between the preheating ring 105 and the substrate support 106) to determine alignment with both the preheating ring 105 and the substrate support 106. The jig 190 is used to position the sensor 192 in the correct position above the preheating ring 105 and the substrate support 106 of various types (e.g., models). The interface may be in different positions depending on the diameter of the internal opening in the preheating ring 105 and the dimensions of the substrate support 106. In other words, the position of the interface may depend on the dimensions of the model of the preheating ring 105 and / or the substrate support 106. The extendable arm 220 is movable to position the sensor 192 above the interface between the preheating ring 105 and the substrate support 106. In other words, the jig 190 is not limited to being used in conjunction with a preheating ring 105 and substrate support 106 of a specific type or size.

[0042]

[0053] Figure 3 is a schematic top view of an exemplary alignment assembly 300 used to determine the alignment of the preheating ring 105 and the substrate support 106, according to one or more embodiments. The alignment assembly 300 includes a lid assembly 180, a fixture 190, and a sensor 192. The fixture 190 is attached to the lid assembly 180 by a rotary joint 280. The rotary joint 280 facilitates rotating (e.g., swiveling) the fixture 190 around the central axis 301 of the alignment assembly 300 to position the sensor 192 above a particular window 184. The central axis 301 coincides with the pivot point 286 of the rotary joint 280. In one or more embodiments, when the substrate support 106 is centered within the preheating ring 105, the central axis 301 coincides with the central axis 101 of the substrate support 106. In one or more embodiments, the jig 190 may be moved to two or more windows 184 (e.g., across between windows 184) during the operation to determine the alignment of the preheating ring 105 and the substrate support 106. The sensor 192 may be an optical (e.g., laser) sensor configured to guide light (e.g., light in the red wavelength band) to the preheating ring 105 and the substrate support 106 through the windows 184. The sensor 192 collects light reflected from the surface of the preheating ring 105, the surface of the substrate support 106, and / or a surface aligned below the gap between the preheating ring 105 and the substrate support 106. The reflected light is analyzed (e.g., by analyzing the intensity using pixels in an image) to measure the distance between the sensor 192 and each surface from which the light was reflected. In one or more embodiments, a higher intensity of light indicates a shorter distance to the sensor 192.

[0043]

[0054] The lid assembly 180 includes a set of openings 310 configured to receive a locking pin 290 and to pivotally secure the fixture 190 to the lid assembly 180. The lid assembly 180 may optionally include one or more handles 330 to facilitate raising and lowering the lid assembly 180. Each set of openings 310 includes a first locking opening 311 and a second locking opening 312. The locking openings 311 and 312 are positioned at the same radial distance from the central axis 301 as the base openings 211 and 212. The locking pin 290 is insertable into the first locking opening 311 through the aligned first arm opening 221 and first base opening 211 when the extendable arm 220 is in the extended position. The locking pin 290 is insertable into the second locking opening 312 through the aligned second base opening 212 and second arm opening 222 when the extendable arm 220 is in the retracted position. In one or more embodiments, the locking openings 311, 312 may be holes, blind holes, recesses, recesses, or other features in the lid assembly, and the insertion of the locking pin 290 prevents the fixture 190 from pivoting relative to the lid assembly 180.

[0044]

[0055] The sensor 192 is positioned and fixed in a scan position above the window 184 before scanning the preheating ring 105 and substrate support 106 located below the window 184. The scan position is based on the position of the interface (e.g., gap) between the substrate support 106 and the preheating ring 105. The sensor 192 is in a first scan position when the extendable arm 220 is in the extended position, and in a second scan position when the extendable arm 220 is in the retracted position. Once positioned in the scan position, the sensor 192 can be substantially fixed in the position for scanning by inserting the locking pin 290 into each locking opening 311, 312 through the jig 190.

[0045]

[0056] Figure 4 is a schematic partial cross-sectional view of the alignment assembly 300 of Figure 3, above the configuration of non-overlapping substrate supports 106 and preheating ring 105 according to one or more embodiments. Sensor 192 is shown in a first scan position for scanning the non-overlapping substrate supports 106 and preheating ring 105. The interface between the non-overlapping substrate supports 106 and preheating ring 105 is a gap 401 located at a first radial distance from the central axis 301 of the alignment assembly 300. The extendable arm 220 is moved to an extended position, positioning sensor 192 in a first scan position above the gap 401. The first base opening 211, the first arm opening 221, and the first locking opening 311 are shown aligned with a locking pin 290 inserted, which fixes the extendable arm in the extended position and pivotally secures the jig 190 to the lid assembly 180.

[0046]

[0057] The sensor 192 is positioned above the gap 401 between the inner end 411 of the preheating ring 105 and the outer end 421 of the substrate support 106. The preheating ring 105 includes a flat upper ring surface 412, and the substrate support 106 includes a flat support surface 422. The substrate 102 engages with the support surface 422 during processing in the processing chamber 100. The sensor 192 performs a scan 430 of the area inside the processing chamber 100 through the window 184. As shown in Figure 4, the scan 430 includes a portion of the upper ring surface 412, the gap 401, and a portion of the support surface 422.

[0047]

[0058] As shown in Figure 4, the vertical distance from the upper ring surface 412 to the support surface 422 is shown as the first distance X1, which reflects the vertical alignment of the substrate support 106 and the preheating ring 105. The horizontal distance between the opposing inner ring ends 411 and outer ends 421 (e.g., the width of the gap 401) is shown as the second distance X2. This second distance X2 reflects the horizontal alignment of the substrate support 106 and the preheating ring 105. The controller 120 uses the information obtained from the sensor 192 to determine the first distance X1 and / or the second distance X2 and to determine the alignment between the substrate support 106 and the preheating ring 105.

[0048]

[0059] Figure 5 shows a signal 501 obtained from the sensor 192 of the alignment assembly 300 shown in Figure 4, compared to a reference profile 530. The signal 501 is generated by scanning the non-overlapping substrate support 106 and preheating ring 105 using the sensor 192 at a first scan position above the non-overlapping substrate support 106 and preheating ring 105. The signal 501 represents the distance of the surface scanned using the sensor 192 (e.g., the distance extending radially outward from the center of the substrate support 106). In one or more embodiments, the sensor 192 first begins by scanning the support surface 422 of the substrate support 106 and scans radially outward (including across the gap 401) until the sensor 192 scans a portion of the upper ring surface 412 of the preheating ring 105. In one or more embodiments, the sensor 192 scans the support surface 422, the gap 401, and the upper ring surface 412 simultaneously. Signal 501 includes a first profile 510 comprising a first segment 511 separated from a second segment 512 by a third segment 513. The first segment 511 corresponds to a portion of the signal obtained by scanning the support surface 422 of the substrate support 106. The second segment 512 corresponds to a portion of the signal obtained by scanning the upper surface of the preheating ring 105. The third segment 513 corresponds to the gap 401. The third segment 513 is a descending portion in signal 501, and the lower end of the third segment 513 may correspond to the surface of the processing chamber 100 located below the gap 401 scanned by the sensor 192. As shown in Figure 5, the first segment 511 is positioned above the second segment 512. This indicates that the support surface 422 is positioned above the upper ring surface 412 and therefore not coplanar, and that the support surface 422 is not below the upper ring surface 412.

[0049]

[0060] Signal 501 is analyzed for profile 510. If no profile is detected, for example, if signal 501 does not include a signal dropout that indicates a gap 401 (e.g., if signal 501 does not include a segment such as a third segment 513 having an error range value), the controller may display an error message. If no profile is detected in signal 501, either the sensor 192 is not in the correct position above the gap 401, or the substrate support 106 and the preheating ring 105 are in an unacceptable alignment, such as contacting each other in a way that blocks the gap 401. The fixture 190 may be adjusted to change the position of the sensor 192 in order to position the sensor 192 above the interface.

[0050]

[0061] Profile 510 can be analyzed to determine various distances between the substrate support 106 and the preheating ring 105. For example, a first distance X1 can be measured by determining the vertical distance between the first segment 511 and the second segment 512. A second distance X2 can be measured by determining the width of a recessed portion (e.g., a third segment 513).

[0051]

[0062] After profile 510 is detected, profile 510 is compared to a generated reference alignment profile 530, which is shown by a dashed line in Figure 5. The generated reference alignment profile 530 may be stored in the memory of the controller 120. The alignment profile 530 may be generated based on inputting a desired width of the gap 401 and / or a desired offset distance between the support surface 422 of the substrate support 106 and the support surface 422 of the preheating ring 105. In one or more embodiments, the alignment profile 530 is generated based on the closest acceptable alignment between the substrate support 106 and the preheating ring 105 that does not interfere with the process in the processing chamber 100. For example, the closest alignment may be the minimum width of the gap 401 that prevents the substrate support 106 from contacting the preheating ring 105 even if it rotates during processing of the substrate 102. Other configurations may also be considered as the closest acceptable alignment.

[0052]

[0063] The reference alignment profile 530 includes a first reference segment 531, a second reference segment 532, and a third reference segment 533. The first reference segment 531 represents the reference position of the support surface 522. The second reference segment 532 represents the reference position of the upper ring surface 412. The vertical distance between the first reference segment 531 and the second reference segment 532 is the reference vertical alignment and is indicated as the first reference distance Y1. In one or more embodiments, the first reference distance Y1 may be based on the thickness of the substrate 102, such that the upper surface 150 of the substrate 102 is coplanar with the upper surface 412 of the preheating ring 105. The third reference segment 533 represents the reference width, indicated as the second reference distance Y2 of the gap 401. The width of the third reference segment 533 is the reference horizontal alignment between the substrate support 106 and the preheating ring 105. The lower ends of both the third segment 513 and the third reference segment 533 may overlap depending on the position of the surface below the gap 401.

[0053]

[0064] The controller 120 compares profile 510 with reference profile 530 to determine whether the substrate support 106 is in an acceptable vertical and horizontal alignment state with respect to the preheating ring 105. In one or more embodiments, the controller 120 may determine whether the upper ring surface 412 and the support surface 422 are in an acceptable vertical alignment state by determining whether the measured first distance X1 is within an acceptable range of variation of the first reference distance Y1. For example, the controller 120 may determine that the substrate support 106 and the preheating ring 105 are in an acceptable vertical alignment state if the difference between the measured first distance X1 and the first reference distance Y1 is within approximately 10% (e.g., within approximately 5% and within approximately 1%). In one or more embodiments, the controller 120 may determine whether the substrate support 106 and the preheating ring 105 are in an acceptable horizontal alignment state by determining whether the measured second distance X2 is within an acceptable range of variation of the second reference distance Y1. For example, if the difference between the measured second distance X2 and the second reference distance Y2 is within approximately 10% (e.g., within approximately 5%, within approximately 1%), the controller 120 may determine that the horizontal alignment is in an acceptable state.

[0054]

[0065] If the controller 120 determines that the substrate support 106 and the preheating ring 105 are not in an acceptable alignment state (e.g., misaligned), the controller instructs either the operator or the motion assembly 121 to adjust the alignment. For example, the controller 120 may determine that the distance between the first segment 511 and the first reference segment 531 is outside the acceptable range. The controller 120 can then cause the motion assembly 121 to raise or lower the substrate support 106 to align it with the desired vertical position relative to the preheating ring 105. Similarly, the controller 120 may measure the difference in width between the third segment 513 and the third reference segment 533 and cause the motion assembly 121 to move the substrate support (e.g., pedestal and / or one or more ring segments (e.g., a complete ring)) laterally to move the substrate support 106 to the desired horizontal position relative to the preheating ring 105. In one or more embodiments, the controller 120 may instruct the operator on how to use the motion assembly 121 manually to move the substrate support to a desired alignment. For example, the controller 120 may instruct the operator to turn the dial on the motion assembly 121 several times to adjust the alignment of the substrate support 106.

[0055]

[0066] In one or more embodiments, the alignment of the substrate support 106 and the preheating ring 105 is determined by performing a single scan through a single window 184 using the sensor 192. In one or more embodiments, multiple scans are performed at various positions at the interface between the substrate support 106 and the preheating ring 105 (e.g., three positions 371a to 371c above the various windows 184, as shown in Figure 3). To perform multiple scans, the fixture 190 is positioned in a first position by rotating the fixture 190 around the rotary union 280 so that the sensor 192 is positioned above the first window 184. When the fixture 190 is in the first position, the base openings 211, 212 are positioned above the corresponding locking openings 311, 312. The position of the sensor 192 above the first window 184 may be positioned so that the sensor 192 is located above the interface between the preheating ring 105 and the substrate support 106. Subsequently, the locking pin 290 is inserted through the fixture 190 into the locking openings 311, 312, fixing the extendable arm 220 in a certain position and fixing the fixture 190 in a first position. After the scan is complete, the locking pin 290 is removed from at least the corresponding locking openings 311, 312. The fixture 190 is swung around the rotating union 280 to position the sensor 192 above the second window. The extendable arm 220 can then be positioned to position the sensor 192 over the interface. In one or more embodiments, the locking pin 290 is not completely removed from the fixture 190, thereby keeping the extendable arm 220 fixed in a certain position while the fixture 190 is swung to different positions. In this way, the sensor 192 can be moved to two or more (e.g., three or more) windows, and the sensor 192 can be positioned over different portions of the interface between the substrate support 106 and the preheating ring 105.

[0056]

[0067] Figure 6 is a schematic partial cross-sectional side view of the alignment assembly 300 of Figure 3, over the configuration of overlapping substrate supports 106 and preheating ring 105 according to one or more embodiments. The sensor 192 is shown in a second scanning position to scan the overlapping substrate supports 106 and preheating ring 105. The interface between the overlapping substrate supports 106 and preheating ring 105 (shown as a gap 601) is located at a second radial distance from the central axis 301 of the alignment assembly 300, which is shorter than the first radial distance shown in Figure 4. The extendable arm 220 is moved to a retracted position to position the sensor 192 at the second scanning position above the gap 601. The second base opening 212, the second arm opening 222, and the second locking opening 312 are shown aligned, into which the locking pin 290 is inserted to fix the extendable arm in the retracted position and pivotally secure the jig 190 to the lid assembly 180.

[0057]

[0068] As shown in Figure 6, the preheating ring 105 includes a flat upper ring surface 612 that partially extends along the ring shoulder 615. The ring shoulder 615 includes an inner ring end 611 that extends to a flat ring shoulder surface 616 located below the upper ring surface 612. The substrate support 106 includes a flat support surface 622 (e.g., the top surface). The support shoulder 625 extends from the substrate support 106 that overlaps with the ring shoulder 615. The end face 621 extends from the support surface 612 to the flat support shoulder surface 626 of the support shoulder 625. The gap 601 separates the opposing inner ring end 611 and end face 621, and the opposing ring shoulder surface 616 and support shoulder surface 626.

[0058]

[0069] Sensor 192 is positioned above the gap 601. Sensor 192 performs a scan 630 of the area inside the processing chamber 100 through window 184. As shown in Figure 6, the scan 630 includes a portion of the upper ring surface 612, a portion of the support shoulder surface 626 at the bottom of the gap 601, and a portion of the support surface 622.

[0059]

[0070] As shown in Figure 6, the vertical distance between the upper ring surface 612 and the support shoulder surface 626 is indicated as the first distance D1. The horizontal distance between the opposing inner ring ends 611 and end faces 621 (e.g., the width of the gap 601) is indicated as the second distance D2. This second distance D2 reflects the horizontal alignment of the substrate support 106 and the preheating ring 105. The vertical distance between the upper ring surface 612 and the support surface 622 is indicated as the third distance D3, which reflects the vertical alignment of the substrate support 106 and the preheating ring 105. The vertical distance between the ring shoulder surface 616 and the support shoulder surface 626 is indicated as the distance D4. The controller 120 uses information obtained from the sensor 192 to determine a first distance D1, a second distance D2, a third distance D3, and a fourth distance D4, and uses these distances to determine one or more alignments (e.g., vertical alignment and / or horizontal alignment) between the substrate support 106 and the preheating ring 105.

[0060]

[0071] Figure 7 shows a signal 701 obtained from the sensor 192 of the alignment assembly 300 shown in Figure 6, compared to a reference profile 730. The signal 701 is generated by scanning the overlapping substrate support 106 and preheating ring 105 using the sensor 192 at a second scan position above the overlapping substrate support 106 and preheating ring 105. The signal 701 indicates the distance of the scanned surface from the sensor 192. In one or more embodiments, the sensor 192 first begins scanning the support surface 622 of the substrate support 106 and scans radially outward until it scans a portion of the upper ring surface 612 of the preheating ring 105. In one or more embodiments, the sensor 192 scans the support surface 622, the gap 601, and the upper ring surface 612 simultaneously. The signal 701 includes a profile 710 comprising a first segment 711 separated from the second segment 712 by a third segment 713. The first segment 711 corresponds to a portion of the signal obtained by scanning the support surface 622 of the substrate support 106. The second segment 712 corresponds to a portion of the signal obtained by scanning the upper ring surface 612 of the preheating ring 105. The third segment 713 corresponds to the gap 601, and the bottom of the signal drop corresponds to the distance of the support shoulder surface 626 from the sensor 192. As shown in Figure 7, the first segment 711 is positioned below the second segment 712, which indicates that the support surface 622 is located below the upper ring surface 612, i.e., they are not on the same plane.

[0061]

[0072] Signal 701 is analyzed for profile 710. If profile 710 is not detected, for example, if signal 701 does not contain a drop in the signal indicating gap 601, the controller may display an error message. If the profile is not detected in signal 701, either the sensor 192 is not precisely positioned above gap 601, or the substrate support 106 and the preheating ring 105 are in an unacceptable alignment, such as contacting each other to block gap 401. Fixture 190 may be adjusted to reposition the sensor 192 to position the sensor 192 above the interface in an acceptable manner.

[0062]

[0073] The profile 710 can be analyzed to determine various distances between the substrate support 106 and the preheating ring 105. For example, a first distance D1 can be measured by determining the vertical distance between the bottoms of the second segment 712 and the third segment 713, as shown in Figure 7. A second distance D2 can be measured by determining the width of a recessed portion (such as the third segment 713), for example, by determining the length of the bottom 714 of the third segment 713. A third distance D3 can be measured by determining the vertical distance between the first segment 711 and the second segment 712. In this disclosure, distance D3 may also be determined by subtracting the vertical distance of a known (e.g., fixed) end face 621 from distance D1. A fourth distance D4 (distance between opposing ring shoulder surfaces 616 and support shoulder surfaces 626) can be determined by subtracting the vertical dimension of a known (e.g., fixed) inner ring end 611 from distance D1.

[0063]

[0074] After profile 710 is generated (for example, after detection and / or display), it is compared with the generated reference alignment profile 730, which is shown by a dashed line in Figure 7. The generated reference alignment profile 730 can be stored in the memory of the controller 120. The reference alignment profile 730 includes a first reference segment 731, a second reference segment 732, and a third reference segment 733. The first reference segment 731 represents the reference position of the support surface 622. The second reference segment 732 represents the reference position of the upper ring surface 612. The vertical distance between the bottom 734 of the first reference segment 731 and the third reference segment 733 is the first reference distance R1, which is the reference distance between the upper ring surface 622 and the substrate shoulder surface 626. The third reference segment 733 represents the reference width, which is shown as the second reference distance R2 of the gap 601. The width of the third reference segment 733 is the reference horizontal alignment between the substrate support 106 and the preheating ring 105. The vertical distance between the first reference segment 731 and the second reference segment 732 is the reference vertical alignment, and is indicated as the third reference distance R3. This third reference distance R3 may be based on the thickness of the substrate 102, such that the upper surface 150 of the substrate 102 is coplanar with the upper ring surface 612 of the preheating ring 105.

[0064]

[0075] In one or more embodiments, the alignment profile 730 is generated based on the desired alignment of the substrate support 106 and the preheating ring 105 during processing. The alignment profile 730 (indicated as a first reference distance R1) may be generated by inputting a desired vertical distance between the upper ring surface 612 of the preheating ring 105 and the shoulder support surface 626 of the substrate support 106 to the controller 120. In addition, the alignment profile may be generated by inputting a desired distance (e.g., the width of the gap 601) between opposing inner ring ends 611 and end faces 621.

[0065]

[0076] The controller 120 compares profile 710 with reference profile 730 to determine whether the substrate support 106 is in an acceptable vertical and / or horizontal alignment state with respect to the preheating ring 105. In one or more embodiments, the controller 120 may determine whether the upper ring surface 612 and the support surface 622 are in an acceptable vertical alignment state by determining whether the measured third distance D3 is within an acceptable variation range of the third reference distance R3. For example, the controller 120 may determine that the substrate support 106 and the preheating ring 105 are in an acceptable vertical alignment state if the difference between the measured third distance D3 and the third reference distance R3 is within approximately 10% (e.g., within approximately 5% and within approximately 1%). In one or more embodiments, the controller 120 may determine whether the substrate support 106 and the preheating ring 105 are in an acceptable horizontal alignment state by determining whether the measured second distance D2 is within an acceptable variation range of the second reference distance D1. For example, the controller 120 may determine that the substrate support 106 and the preheating ring 105 are in an acceptable horizontal alignment state if the difference between the measured second distance D2 and the second reference distance R2 is within approximately 10% (e.g., within approximately 5%, within approximately 1%).

[0066]

[0077] In one or more embodiments, the reference vertical alignment is the vertical distance (e.g., height) between the second reference segment 732 and the third segment 733. In other words, the first reference distance R1 is the height of the drop-off between the second reference segment 732 and the third segment 733. In one or more embodiments, the controller 120 may determine whether the upper ring surface 612 and the support surface 622 are in an acceptable vertical alignment state by determining whether the measured first distance D1 is within an acceptable range of variation of the first reference distance R1. For example, the controller 120 may determine that the preheating ring 105 and the substrate support 106 are in an acceptable vertical alignment state if the difference between the measured third distance D1 and the first reference distance R1 is within about 10% (e.g., within about 5%, within about 1%).

[0067]

[0078] If the controller 120 determines that the substrate support 106 and the preheating ring 105 are not in an acceptable alignment (e.g., misaligned), the controller instructs either the operator or the motion assembly 121 to adjust the alignment. For example, the controller 120 may determine that the distance between the first segment 711 and the first reference segment 731 is outside the acceptable range. The controller 120 can then cause the motion assembly 121 to raise or lower the substrate support 106 to align it with the desired vertical position relative to the preheating ring 105. Similarly, the controller 120 may measure the difference in width between the third segment 713 and the third reference segment 733 and cause the motion assembly 121 to move the substrate support 106 laterally to a desired horizontal position relative to the preheating ring 105. In one or more embodiments, the controller 120 may instruct the operator to use the motion assembly 121 manually to move the substrate support to the desired alignment. For example, the controller 120 may instruct the operator to turn the dial on the motion assembly 121 several times to adjust the alignment of the substrate support 106.

[0068]

[0079] In one or more embodiments, the alignment profile 730 is generated based on the closest possible alignment of the substrate support 106 and the preheating ring 105 that does not interfere with the process in the processing chamber 100. The alignment profile 730 may be generated based on inputting to the controller 120 the minimum allowable vertical distance between the upper ring surface 612 of the preheating ring 105 and the shoulder support surface 626 of the substrate support 106. This minimum vertical distance may be based on the closest possible distance between the opposing ring shoulder surfaces 616 and shoulder support surface 626 to avoid contact between them during processing. In addition, the alignment profile may be generated based on the minimum allowable distance between the opposing inner ring ends 611 and end faces 621 to avoid contact between them during processing.

[0069]

[0080] If the alignment profile 730 is based on the closest alignment of the substrate support 106 and the preheating ring 105, then the reference profile 730 is a threshold. In other words, the controller 120 evaluates whether profile 710 exceeds reference profile 730. If the profile exceeds reference profile 730, the controller 120 determines that the substrate support 106 and the preheating ring 105 are in an unacceptable alignment state. For example, if the first segment 711 exceeds the first reference segment 731 (e.g., is positioned above it), the alignment may be determined to be unacceptable. Similarly, if the second segment 712 exceeds the second reference segment 712 (e.g., is positioned above it), the alignment may also be determined to be unacceptable. In addition, if the width of the third segment 713 is smaller than the third reference segment 733, the alignment may also be determined to be unacceptable. If the controller 120 determines that the substrate support 106 and the preheating ring 105 are misaligned, the controller instructs either the operator or the motion assembly 121 to adjust the alignment. For example, the controller 120 may measure how far above the first segment 711 is above the first reference segment 731 and instruct the motion assembly 121 to lower the substrate support 106 relative to the preheating ring by at least that distance. Similarly, the controller 120 may instruct the motion assembly 121 to adjust the lateral position of the substrate support 106 by at least the difference in the width of the third profile segment 713 relative to the third reference segment 733. When profile 710 exactly matches the reference profile 730, the substrate support 106 and the preheating ring 105 are in the closest possible alignment state. The controller 120 may instruct the operator to adjust the alignment to increase the distance between the substrate support 106 and the preheating ring 105.

[0070]

[0081] In one or more embodiments, the alignment of the substrate support 106 and the preheating ring 105 is determined by performing a single scan through a single window 184 using the sensor 192. In one or more embodiments, multiple scans are performed at various positions (and various windows 184) of the interface between the substrate support 106 and the preheating ring 105. To perform multiple scans, the fixture 190 is rotated around the rotary union 280 to position the fixture 190 in a first position such that the sensor 192 is positioned above the first window 184. When the fixture 190 is in the first position, the base openings 211, 212 are positioned above the corresponding locking openings 311, 312. The position of the sensor 192 above the first window 184 may be such that the sensor 192 is positioned above the interface between the preheating ring 105 and the substrate support 106. Subsequently, the locking pin 290 is inserted through the fixture 190 into the locking openings 311, 312, fixing the extendable arm 220 in a position and fixing the fixture 190 in a first position. After the scan is complete, the locking pin 290 is removed from at least the corresponding locking openings 311, 312. The fixture 190 is swung around the rotary union 280 to position the sensor 192 above the second window. The extendable arm 220 can then be positioned to position the sensor 192 above the interface. In one or more embodiments, the locking pin 290 is not completely removed from the fixture 190, thereby keeping the extendable arm 220 fixed in a position while the fixture 190 is swung to different positions. In this way, the sensor 192 can be moved to two or more (e.g., three or more) windows, and the sensor 192 can be positioned above different portions of the interface between the substrate support 106 and the preheating ring 105.

[0071]

[0082] For example, the extendable arm 220 may be moved to the extended position so that the sensor 192 is positioned above the interface below the first window 184, as shown in Figure 3, with the sensor 192 above the lowest window 184. The locking pin 290 is then inserted through the aligned first base opening 211, the first arm opening 222, and the first locking opening 311 to fix the extendable arm 220 in the extended position and fix the fixture 190 in the first position. The sensor 192 then scans the internal region of the processing chamber 100 below it through the window 184 and scans the interface between the substrate support 106 and the preheating ring 105. After scanning through the first window 184, the locking pin 290 is removed at least from the first locking opening 311, allowing the fixture 190 to be swung to a second position so that the sensor 192 is positioned above the second window 184. The jig 190 can be rotated by a certain angle, such as approximately 90 degrees, 120 degrees, or 135 degrees clockwise from the position shown in Figure 3, to position the sensor 192 above another window 184. For example, the jig 190 can be rotated approximately 90 degrees from the position shown in Figure 3 to position 371a, positioning the sensor above the window 184 adjacent to the left handle 330. The locking pin 290 is then inserted to fix the jig 190 in the second position, fixing the jig 190 in the extended position. The sensor 192 scans the internal area of ​​the processing chamber 100 below it through the second window 184, scanning the interface between the substrate support 106 and the preheating ring 105. After scanning through the second window 184, the locking pin 290 is removed at least from the first locking opening 311, allowing the fixture 190 to be swung to a third position, thereby positioning the sensor 192 above the third window 184. For example, the fixture 190 may be swung clockwise by approximately 135 degrees to position the sensor 192, which is in position 371c above the window 184, to the right of the topmost window shown in Figure 3. The locking pin 290 is then inserted to fix the fixture 190 in the third position, and to fix the fixture 190 in the extended position.Subsequently, the sensor 192 scans the internal region of the processing chamber 100 below it through the third window 184, scanning the interface between the substrate support 106 and the preheating ring 105. The sensor 192 may be positioned above an additional window in a similar manner (for example, by swiveling it about 90 degrees to position 371b). In addition, the fixture 190 is moved to one or more retracted positions in a similar manner to that described in this paragraph, and the locking pin 290 is inserted through the aligned second base opening 212, the second arm opening 222, and the second locking opening 332.

[0072]

[0083] Multiple scans performed by sensor 192 can be used to determine the alignment of the substrate support 106 and the preheating ring 105 in three different dimensions. For example, by analyzing the information collected in each scan, it can be determined whether the substrate support 106 is tilted at an unacceptable angle relative to the preheating ring 105. In addition, by analyzing multiple scans, it can be determined whether the substrate support 106 is off-center in both the X and Y axes. The controller 120 can use the multiple scans to issue instructions for adjusting the alignment of the substrate support 106, for example, by instructing an operator or by having the motion assembly 121 automatically adjust the alignment.

[0073]

[0084] Figure 8 shows a schematic diagram of a user interface 800 of a controller 120 that can be accessed by a customer operator, according to one or more embodiments. The user interface 800 can be displayed on a screen or touchscreen connected to the processing chamber 100, or can be detected remotely from the processing chamber 100. For example, the user interface 800 corresponds to the overlapping substrate support 106 and preheating ring 105 shown in Figure 8. The distance between the upper ring surface 612 of the preheating ring 105 and the substrate shoulder surface 626 (e.g., first distance D1), measured by a sensor 192 above the first window 184, is displayed in box 801. Box 802 displays the distance between the inner ring end 611 and the end face 621 (e.g., second distance D2), measured by the sensor 192 through the first window 184. The first distance D1 and the second distance D2, obtained by a sensor 192 above the second window 184, are displayed as boxes 803 and 804, respectively. The first distance D1 and the second distance D2, acquired by the sensor 192 above the third window 184, are displayed as boxes 805 and 806, respectively.

[0074]

[0085] The operator can select the first button 810 to acquire the measurements displayed in boxes 801 and 802 after the sensor 192 has been fixed in a first position above the first window 184 (for example, by selecting it with a mouse or by tapping it on a touchscreen). The second button 811 can be selected to acquire the measurements displayed in boxes 803 and 804 after the sensor 192 has been fixed in a position above the second window 184, and the third button 812 can be selected to acquire the measurements displayed in boxes 805 and 806 after the sensor 192 has been fixed in a position above the third window 184. Buttons 810, 811, and 813 may be buttons on a touchscreen.

[0075]

[0086] Box 831 represents the level (e.g., tilt) of the support surface 622 located below the first window 184. Boxes 832 and 833 represent the level of the support surface 622 below the second and third windows 184, respectively. Boxes 831, 832, and 833 can display the amount of difference from a state where the support surface 622 is horizontally aligned with the upper ring surface 612 of the preheating ring 105. The level can be calculated using the difference in a first distance D1 or a third distance D3 in each measured area of ​​the interface, which can be used to determine the angle at which the substrate support 106 is tilted. Box 834 displays on the display the distance from a state where the center of the substrate support 106 is centered within the preheating ring 105. In other words, box 834 represents the offset of the center of the substrate support 106 below the first window. The center offset may be calculated by subtracting D2 measured from a second reference distance R2, where the second distance R2 is the width of the gap 601 that would exist if the substrate support 106 were centered within the preheating ring 105. Boxes 835 and 836 represent the center offsets below the second and third windows 184, respectively. In one or more embodiments, the values ​​in boxes 801, 803, and 805 indicate the values ​​of the first distance D1 at each of the three positions below each of the three windows 184. In one or more embodiments, the values ​​in boxes 802, 804, and 806 indicate the values ​​of the third distance D3 at each of the three positions below each of the three windows 184. In one or more embodiments, the values ​​in boxes 831, 832, and 833 indicate the values ​​of the fourth distance D4 at each of the three positions below each of the three windows 184. In one or more embodiments, the values ​​in boxes 834, 835, and 836 represent the values ​​of the second distance D2 at each of the three positions below each of the three windows 184. In one or more embodiments, the display shows the first distance D1, the second distance D2, the third distance D3, and the fourth distance D4, respectively, for each of the three positions below each of the three windows 184.

[0076]

[0087] The operator can select the calculate button 820 to calculate the level and center offset values, which are then displayed to the operator. In one or more embodiments, the operator waits for the sensor 192 to complete measurements through all three windows before calculating the level and center offset values. In one or more embodiments, the operator can press the calculate button 820 after each scan to display the level and offset values.

[0077]

[0088] In one or more embodiments, the user interface 800 includes a panel 840 that can indicate whether the substrate support 106 is in an acceptable alignment state. If the controller 120 determines that the alignment is acceptable, the user can press a button 841 to approve the alignment. If the controller 120 determines that the alignment is unacceptable, the panel 840 may display instructions on how to adjust the alignment to move the substrate support 106 to an acceptable alignment. If the alignment is adjusted manually, the operator can press a button 841 to approve the alignment after the manual adjustment is complete. In one or more embodiments, the panel 840 may indicate that the alignment is unacceptable, and the user can press a button 841 to move the substrate support 106 to an acceptable alignment using the motion assembly 121. In one or more embodiments, the user interface 800 also includes a reset button 850 that can be used to reset the user interface 800.

[0078]

[0089] In one or more embodiments, a user interface may be displayed on the display (before, during, and / or after the display of the user interface 800) in which the user can input reference data for each of the distances D1 to D4. The reference data entered into the user interface can be used, for example, to generate one of the reference profiles described herein.

[0079]

[0090] Figure 8 shows a second user interface 860 used to generate a reference signal. The second user interface 860 may be displayed on the display before, during, and / or after the user interface 800 is displayed on the display. Box 861 shows the current first reference distance R1. This first reference distance R1 can be changed by entering a new distance into input 862. By pressing button 863, a reference profile is generated based on the new reference distance R1 entered into input 862. The second user interface 860 may also include an input for a second reference distance R2, and the reference profile may be generated based on the first and second reference distances R1 and R2. The second user interface 860 may be locked from the customer operator. In other words, a manufacturing person may enter the reference distance R1 based on the model of the substrate support 106 and preheating ring 105 used in the processing chamber 100.

[0080]

[0091] Figure 9 shows a flowchart of an exemplary method 900 for positioning the sensor 192 according to one or more embodiments.

[0081]

[0092] In step 902, the jig 190 attached to the lid 182 of the processing chamber 100 is rotated to a first pivot position, positioning the sensor 192 connected to the extendable arm 220 of the jig 190 above the first window 184 of the lid 182.

[0082]

[0093] In step 904, the position of the extendable arm 220 relative to the base arm 210 of the jig 190 is adjusted to position the sensor in a first position above the first window 184.

[0083]

[0094] In step 906, the sensor 192 is fixed in a first position above the first window 184 by inserting the lock pin 290 through the extendable arm 220 and base arm 210 into a first lock opening 311 formed in the lid 182. With the sensor 192 then fixed in the first position, the sensor 192 can scan the surface of the preheating ring 105, the surface of the substrate support 106, and the gap between the preheating ring 105 and the substrate support 106.

[0084]

[0095] In step 908, the sensor is released from the first position by removing the locking pin 290 and pivoting the extendable arm 220 to a second pivot position, thereby positioning the sensor 192 above the second window 184 of the lid 182. The position of the extendable arm 220 relative to the base arm 210 can be adjusted to position the sensor 192 above the second window in a second position. The sensor 192 is fixed in the second position above the second window 184 by inserting the locking pin 290 through the extendable arm 220 and base arm 210 into a second locking opening 312 formed in the lid 182. The sensor 192 is at the same radial distance from the center of the lid in the second position as it is in the first position. With the sensor 192 then fixed in the second position, it can scan the surface of the preheating ring 105, the surface of the substrate support 106, and the gap between the preheating ring 105 and the substrate support 106.

[0085]

[0096] Figure 10 shows a flowchart of an exemplary method 1000 for determining alignment within a processing chamber, according to one or more embodiments.

[0086]

[0097] Step 1003 includes generating a reference alignment profile. In one or more embodiments, the reference alignment profile includes a reference horizontal alignment and a reference vertical alignment.

[0087]

[0098] Step 1006 includes scanning an area inside the processing chamber using a sensor to generate a signal containing a profile. In one or more embodiments, step 1006 includes analyzing the signal to identify a profile, which represents a measurement of the intensity of light energy (e.g., reflected light) along a radial distance within the processing chamber.

[0088]

[0099] Step 1008 includes comparing the profile to a reference alignment profile to determine whether the preheating ring and the substrate support are within an acceptable alignment range. In one or more embodiments, the comparison includes comparing the vertical alignment to a reference vertical alignment and the horizontal alignment to a reference horizontal alignment. One or more additional profiles (e.g., a second profile at a second position) may be generated in step 1006, and step 1008 includes comparing the second profile to the reference alignment profile.

[0089]

[0100] Step 1009 includes determining a first vertical distance between the upper surface of the preheating ring and the shoulder surface of the substrate support.

[0090]

[0101] Step 1010 includes determining a second vertical distance between the upper surface of the preheating ring and the upper surface of the substrate support by subtracting a first vertical distance from a first fixed distance.

[0091]

[0102] Step 1011 includes determining a third vertical distance between the shoulder surface and the preheating ring shoulder surface, wherein the preheating ring shoulder surface is separated from the upper surface of the preheating ring by a second fixed distance. In one or more embodiments, the third vertical distance is determined by subtracting the first vertical distance from the second fixed distance.

[0092]

[0103] Step 1013 includes generating an error message if at least a portion of the profile is outside the error range.

[0093]

[0104] Step 1015 includes displaying adjustment instructions to move the substrate support to an acceptable alignment range. If an error message is generated in step 1013, step 1015 includes adjusting the alignment of the substrate support relative to the preheating ring after the error message was generated, and steps 1003-1011 may be performed after the error has been corrected.

[0094]

[0105] In this disclosure, it is assumed that the subject matter described herein may be represented in one or more of the following embodiments.

[0095]

[0106] Example 1 In one or more embodiments, a fixture for mounting to a substrate processing chamber usable in semiconductor manufacturing includes a base arm, an extendable arm, a sensor mount, and a guide rail assembly. The base arm includes at least one base opening. The extendable arm includes a first opening and a second opening, which are offset from each other by a certain distance. When the extendable arm is in the retracted position, the first opening is aligned with at least a portion of at least one base opening, and when the extendable arm is in the extended position, the second opening is aligned with at least a portion of at least one base opening. The sensor mount is connected to the first end of the extendable arm. The guide rail assembly includes at least one rail and a carriage. The carriage engages with at least one rail and is connected to the extendable arm. The carriage is movable along at least one rail to move the extendable arm between the retracted position and the extended position.

[0096]

[0107] Example 2 In one or more embodiments of the jig of Example 1, at least one rail includes a single rail.

[0097]

[0108] Example 3 In one or more embodiments of the jig of Embodiment 2, at least one base opening includes a first base opening and a second base opening. The first and second base openings are located on opposite sides of a single rail. When the extendable arm is in the retracted position, the first opening is aligned with the first base opening, and when the extendable arm is in the extended position, the second opening is aligned with the second base opening.

[0098]

[0109] Example 4 In one or more embodiments of the jig of Example 3, the first base opening and the second base opening are aligned laterally.

[0099]

[0110] Example 5 In one or more embodiments of the jig of Embodiment 1, at least one base opening includes a first base opening, the first opening is aligned with the first base opening when the extendable arm is in the retracted position, and the second opening is aligned with the first base opening when the extendable arm is in the extended position.

[0100]

[0111] Example 6 In one or more embodiments of the jig of Example 1, the jig further includes a rotary joint, and the base arm is connectable to the rotary joint at a first end.

[0101]

[0112] Example 7 In one or more embodiments of the jig of Embodiment 1, the first end of the extendable arm is positioned within the mounting opening of the sensor mount.

[0102]

[0113] Example 8 In one or more embodiments of the jig of Example 1, the laser sensor can be attached to the sensor mount.

[0103]

[0114] Example 9 In one or more embodiments of the jig of Embodiment 1, the jig further includes at least one aligned base opening and a locking pin insertable into the first opening for fixing an extendable arm in a retracted position.

[0104]

[0115] Example 10 In one or more embodiments, the alignment assembly includes a sensor and a lid having a first window. The alignment assembly also includes a rotary joint connected to the lid. The alignment assembly also includes a fixture connected to the rotary joint and pivotable around the rotary joint relative to the lid. The fixture includes an extendable arm that can move from a retracted position in which the sensor is positioned above the first window to an extended position in which the sensor is positioned above the first window. The alignment assembly also includes a lock configured to selectively pivot the fixture relative to the lid and to selectively lock the extendable arm in the retracted or extended position.

[0105]

[0116] Example 11 In one or more embodiments of the alignment assembly of Example 10, the fixture further includes a base arm connected to a rotary joint at a first end, the base arm including at least one base opening. The fixture includes a guide rail assembly comprising at least one rail and a carriage. The carriage engages with at least one rail and is connected to an extendable arm. The carriage is movable along at least one rail to move the extendable arm between an extended position and a retracted position.

[0106]

[0117] Example 12 In one or more embodiments of the alignment assembly of Example 11, the extendable arm includes a first opening and a second opening offset from each other by a certain distance. When the extendable arm is in the retracted position, the first opening is aligned with at least a portion of at least one base opening. When the extendable arm is in the extended position, the second opening is aligned with at least a portion of at least one base opening.

[0107]

[0118] Example 13 In one or more embodiments of the alignment assembly of Embodiment 11, at least one base opening includes a first base opening. When the extendable arm is in the retracted position, the first opening is aligned with the first base opening, and when the extendable arm is in the extended position, the second opening is aligned with the first base opening.

[0108]

[0119] Example 14 In one or more embodiments of the alignment assembly of Example 10, the lid includes a first locking opening, the lock extending through the fixture into the first locking opening to pivotably secure the fixture to the lid.

[0109]

[0120] Example 15 In one or more embodiments of the alignment assembly of Example 14, the first locking opening is located between the first window and the rotary joint.

[0110]

[0121] Example 16 In one or more embodiments of the alignment assembly of Example 10, the lid includes a first locking opening, a second locking opening, and a second window. The fixture is pivotable relative to the lid from a first pivot position where the sensor is above the first window to a second pivot position where the sensor is above the second window. A lock is configured to be inserted into the fixture and into the second locking opening to pivotably secure the fixture within the second pivot position.

[0111]

[0122] Example 17 In one or more embodiments, a method for positioning a sensor includes pivoting a fixture attached to the lid of a processing chamber relative to a first pivot position to position a sensor connected to an extendable arm of the fixture above a first window of the lid. The method further includes adjusting the position of the extendable arm relative to the base arm of the fixture to position the sensor at a first position above the first window. The method further includes securing the sensor at the first position above the first window by inserting a locking pin through the extendable arm and the base arm into a first locking opening formed in the lid.

[0112]

[0123] Example 18 In one or more embodiments, the method for positioning the sensor of Example 17 further includes releasing the sensor from a first position by removing a locking pin, and swiveling an extendable arm relative to a second pivot position to position the sensor above a second window of the lid.

[0113]

[0124] Example 19 In one or more embodiments, the method for positioning the sensor of Example 18 further includes adjusting the position of an extendable arm relative to a base arm so as to fix the sensor in a second position above the second window. The method further includes fixing the sensor in the second position above the second window by inserting a locking pin through the extendable arm and base arm into a second locking opening formed in the lid.

[0114]

[0125] Example 20 In one or more embodiments, the method for positioning the sensor of Example 17 further includes using a sensor fixed in a first position to scan the surface of the preheating ring, the surface of the substrate support, and the gap between the preheating ring and the substrate support.

[0115]

[0126] Example 21 In one or more embodiments, a method for determining alignment within a processing chamber includes generating a reference alignment profile. The method further includes scanning a region inside the processing chamber using a sensor to generate a signal containing a profile, the profile including a first segment separated from a second segment by a third segment, the third segment being a drop in the signal, the first segment corresponding to the upper surface of the substrate support, the second segment corresponding to the upper surface of the preheating ring, and the drop in the profile corresponding to the gap between the preheating ring and the substrate support. The method further includes comparing the profile to a reference alignment profile to determine whether the preheating ring and the substrate support are within an acceptable alignment range.

[0116]

[0127] Example 22 In one or more embodiments, the method for determining the alignment of Example 21 includes displaying adjustment instructions to move the substrate support to an acceptable alignment.

[0117]

[0128] Example 23 In one or more embodiments, the method for determining the alignment of Example 21 includes determining the width of the gap by measuring the width of the third segment, the width of which indicates the horizontal alignment of the substrate support with respect to the preheating ring.

[0118]

[0129] Example 24 In one or more embodiments, the method for determining the alignment of Example 23 further includes determining the vertical alignment of the upper surface of the substrate support with respect to the upper surface of the preheating ring by measuring the vertical distance between the first segment and the second segment.

[0119]

[0130] Example 25 In one or more embodiments of the method for determining alignment in Example 24, the reference alignment profile includes a reference horizontal alignment and a reference vertical alignment of the substrate support relative to the preheating ring. The method further includes comparing the profile with the reference alignment profile, the comparison including comparing the vertical alignment with a reference vertical alignment and comparing the horizontal alignment with a reference horizontal alignment.

[0120]

[0131] Example 26 In one or more embodiments, the method for determining alignment in Example 24 further includes determining a first vertical distance between the upper surface of the preheating ring and the shoulder surface of the substrate support by measuring the vertical distance between a first segment and a third segment, wherein the shoulder surface is separated from the upper surface of the substrate support by a first fixed distance. The method further includes determining a second vertical distance between the upper surface of the preheating ring and the upper surface of the substrate support by subtracting the first vertical distance from the first fixed distance.

[0121]

[0132] Example 27 In one or more embodiments of the method for determining alignment in Example 26, the reference alignment profile includes a reference horizontal alignment and a reference vertical alignment of the substrate support relative to the preheating ring, wherein the reference vertical alignment is a reference distance between the top surface of the substrate support and the top surface of the preheating ring. The method includes comparing the profile with the reference alignment profile, which includes comparing a second vertical distance with the reference distance and comparing the horizontal alignment with a reference horizontal alignment.

[0122]

[0133] Example 28 In one or more embodiments, the method for determining the alignment of Example 26 and / or Example 27 further includes determining a third vertical distance between the shoulder surface and the preheating ring shoulder surface, wherein the preheating ring shoulder surface is separated from the upper surface of the preheating ring by a second fixed distance, and the third vertical distance is calculated by subtracting the first vertical distance from the second fixed distance.

[0123]

[0134] Example 29 In one or more embodiments, the method for determining the alignment of Example 21 further includes analyzing the signal to identify a profile, which represents a measurement of the intensity of light energy along a radial distance within the processing chamber.

[0124]

[0135] Example 30 In one or more embodiments, the method for determining the alignment of Example 21 further includes generating an error message if at least a portion of the profile is outside the error range. The method further includes adjusting the alignment of the substrate support with respect to the preheating ring after the error message has been generated.

[0125]

[0136] Example 31 In one or more embodiments of the method for determining alignment in Example 21, the region is a first region below the sensor at a first position, the signal is a first signal, and the profile is a first profile. The method further includes moving the sensor to a second position above a second region inside a processing chamber. The method further includes using the sensor to scan the second region to generate a second signal including a second profile.

[0126]

[0137] Example 32 In one or more embodiments of the method for determining alignment in Example 31, comparing a profile to a reference alignment profile in order to determine whether the preheating ring and the substrate support are within the alignment range includes comparing a first profile and a second profile to the reference alignment profile.

[0127]

[0138] In this disclosure, the terms “couples,” “couplable,” “coupling,” “couple,” and “coupled” are assumed to include, but not be limited to, welding, fusion, welding, interference fit, and / or fastening using bolts, nuts, screw connections, pins, and / or screws. In this disclosure, the terms “couples,” “couplable,” “coupling,” “couple,” and “coupled” are assumed to include, but not be limited to, integral formation. In this disclosure, the terms “couples,” “couplable,” “coupling,” “couple,” and “coupled” are assumed to include, but not be limited to, direct connection and / or indirect connection (indirect connection via parts such as links, blocks, and / or frames).

[0128]

[0139] The advantages of this disclosure include accurately, simply, and effectively measuring and adjusting the alignment of the substrate support with respect to the chamber components (e.g., the preheating ring) in a modular manner across various configurations of the substrate support and the preheating ring, and across various chamber configurations.

[0129]

[0140] The embodiments described in this book are assumed to be combinable. For example, the features, aspects, components, operations, and / or characteristics relating to the processing chamber 100, the fixture 190, the sensor 192, the controller 120, the alignment assembly 300, the signal 501, the first profile 510, the reference alignment profile 530, the signal 701, the profile 710, the reference alignment profile 730, the user interface 800, the second user interface 860, the method 900, the method 1000, and / or one or more of Examples 1 to 32 are combinatorial. Furthermore, it is assumed that any combination will achieve the advantages described herein.

[0130]

[0141] While the foregoing applies to embodiments of the present disclosure, other embodiments and additional embodiments of the present disclosure may be devised without departing from the basic scope of the present disclosure. The scope of the present disclosure is determined by the following claims.

Claims

1. A jig for attachment to a substrate processing chamber usable in semiconductor manufacturing, A base arm comprising a base arm including at least one base opening, An extendable arm comprising a first opening and a second opening, the openings being offset from each other by a certain distance, wherein the first opening is aligned with at least a portion of the at least one base opening when the extendable arm is in a retracted position, and the second opening is aligned with at least a portion of the at least one base opening when the extendable arm is in an extended position, A sensor mount comprising a sensor mount connected to the first end of the extendable arm, A guide rail assembly, At least one rail, and A carriage that engages with the at least one rail and is connected to the extendable arm, and is movable along the at least one rail to move the extendable arm between the retracted position and the extended position. Guide rail assembly including A jig, including a fixture.

2. The fixture according to claim 1, wherein the at least one rail includes a single rail.

3. The at least one base opening includes a first base opening and a second base opening, The first base opening and the second base opening are located on both sides of the single rail, The first opening is aligned with the first base opening when the extendable arm is in the retracted position, and the second opening is aligned with the second base opening when the extendable arm is in the extended position. The jig according to claim 2.

4. The jig according to claim 3, wherein the first base opening and the second base opening are aligned laterally.

5. The at least one base opening includes a first base opening, the first opening being aligned with the first base opening when the extendable arm is in the retracted position, and the second opening being aligned with the first base opening when the extendable arm is in the extended position. The jig according to claim 1.

6. A rotary joint wherein the base arm is connectable to the rotary joint at a first end. The jig according to claim 1, further comprising:

7. The fixture according to claim 1, wherein the first end of the extendable arm is positioned within the mounting opening of the sensor mount.

8. The jig according to claim 1, wherein the laser sensor can be attached to the sensor mount.

9. A locking pin, which can be inserted into the aligned at least one base opening and the first opening, is used to secure the extendable arm in the retracted position. The jig according to claim 1, further comprising:

10. Alignment assembly, Sensors and, The lid containing the first window, A rotary joint connected to the lid, A jig connected to the rotary joint and pivotable around the rotary joint relative to the lid, wherein the jig is From a retracted position where the sensor is positioned at a first position above the first window, The sensor is positioned in an extended position at a second location above the first window. A movable, extendable arm A jig including, A lock configured to selectively fix the jig pivotably to the lid, and to selectively fix the extendable arm in the retracted position or the extended position. Alignment assembly, including [specific component].

11. The aforementioned jig is A base arm connected to the rotary joint at a first end, the base arm including at least one base opening, A guide rail assembly, At least one rail, and A carriage that engages with the at least one rail and is connected to the extendable arm, and is movable along the at least one rail to move the extendable arm between the extended position and the retracted position. A guide rail assembly including, The alignment assembly according to claim 10, further comprising:

12. The extendable arm includes a first opening and a second opening, the openings being offset from each other by a certain distance, the first opening being aligned with at least a portion of the at least one base opening when the extendable arm is in the retracted position, and the second opening being aligned with at least a portion of the at least one base opening when the extendable arm is in the extended position. The alignment assembly according to claim 11.

13. The at least one base opening includes a first base opening, the first opening being aligned with the first base opening when the extendable arm is in the retracted position, and the second opening being aligned with the first base opening when the extendable arm is in the extended position. The alignment assembly according to claim 11.

14. The lid includes a first locking opening, the lock extending through the fixture into the first locking opening to pivotally secure the fixture to the lid. The alignment assembly according to claim 10.

15. The first locking opening is positioned between the first window and the rotary joint. The alignment assembly according to claim 14.

16. The lid includes a first locking opening, a second locking opening, and a second window, and the fixture is pivotable relative to the lid from a first pivoting position where the sensor is above the first window to a second pivoting position where the sensor is above the second window, and the lock is configured to be inserted into the fixture and the second locking opening to pivotably secure the fixture within the second pivoting position. The alignment assembly according to claim 10.

17. A method for positioning a sensor, To position a sensor connected to the extendable arm of the fixture above the first window of the lid of the processing chamber, the fixture attached to the lid is rotated relative to a first pivot position. To position the sensor at a first position above the first window, the position of the extendable arm is adjusted relative to the base arm of the fixture. The sensor is fixed in the first position above the first window by inserting a locking pin into the first locking opening formed in the lid through the extendable arm and the base arm. Methods that include...

18. By removing the locking pin, the sensor is released from the first position. To position the sensor above the second window of the lid, the extendable arm is rotated relative to the second pivot position. The method according to claim 17, further comprising:

19. To position the sensor at a second position above the second window, the position of the extendable arm is adjusted relative to the base arm, and The sensor is fixed in the second position above the second window by inserting the lock pin into the second lock opening formed in the lid through the extendable arm and the base arm. The method according to claim 18, further comprising:

20. Using the sensor fixed in the first position, scan the surface of the preheating ring, the surface of the substrate support, and the gap between the preheating ring and the substrate support. The method according to claim 17, further comprising:

Images