Acoustic cleavage device and acoustic cleavage method
The acoustic splitting device addresses the inefficiencies of existing substrate removal methods by using a crack initiator and acoustic system for controlled crack propagation, enhancing substrate reuse and reducing costs in semiconductor manufacturing.
JP2026524929APending Publication Date: 2026-07-24クリスタル ソニック インコーポレイテッド
View PDF 0 Cites 0 Cited by
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- クリスタル ソニック インコーポレイテッド
- Filing Date
- 2024-07-09
- Publication Date
- 2026-07-24
Smart Images
Figure 2026524929000001_ABST
Abstract
An acoustic cleavage system for initiating and controlling crack propagation is described. In one embodiment, the system includes an acoustic generator including a piezoelectric device, a high-voltage power supply, and an acoustic cleavage circuit. The acoustic cleavage circuit includes a push-pull circuit coupled to the piezoelectric device and the high-voltage power supply, and a capacitor bank including one or more capacitors coupled in parallel to the push-pull circuit. In one embodiment, the push-pull circuit is for receiving at least one input signal and for generating an amplified output signal for driving the piezoelectric device.
Need to check novelty before this filing date? Find Prior Art