Cleaning mechanism for resin protruding from dielectric lamination

Abstract

To provide a mechanism for cleaning the resin that has spilled out after lamination of the ABF dielectric and the ABF dielectric carrier board. [Solution] The system includes a belt or roller conveying mechanism 5, a back pressure roller mechanism 7, and a resin removal cleaning wheel plate 4. The cleaning wheel plate is supported by a stainless steel cleaning machine spindle mechanism 6 and rotates at high speed to cut and remove the surface. During cleaning, the bottom of the product workpiece is supported by the back pressure roller mechanism which rotates at the same speed as the conveying mechanism, achieving stable and uniform cleaning, and providing better excess resin removal efficiency and process yield. In addition, a quick release device for the cleaning wheel plate is further provided to efficiently attach and detach the cleaning wheel plate, thereby shortening the production line downtime and maximizing profits.

Description

[Technical field]

[0001] The present invention relates to a mechanism for removing resin that has protruded from the four sides of a circuit board, and in particular to a belt or roller conveying mechanism, a cleaning machine spindle mechanism, and a cleaning wheel plate quick release device that can achieve a stable and uniform cleaning effect and improve the efficiency of replacing the cleaning wheel plate. [Background technology]

[0002] ABF carrier boards are becoming more and more popular in the current industry, and are used to introduce the production of high-end carrier boards such as Flip Chip. Compared with BT substrates, ABF materials can manufacture ICs with finer lines, more pin counts and more data transmission, and are widely used in large high-end chips such as CPUs, GPUs and chipsets.

[0003] As shown in FIG. 1, in the lamination process of the ABF dielectric 1 and the ABF dielectric carrier board 3, after hot pressing, the resin 2 protruding from the lamination will protrude into the blank area around the ABF dielectric carrier board 3, and defects in the lamination process will cause abnormalities such as a decrease in the build-up uniformity of the ABF dielectric carrier board 3 and contamination of the subsequent process due to dust problems.

[0004] In the prior art, the solution to remove the resin 2 protruding from the lamination is to use the laser edge burning method, but this technique is still limited in improving production and yield, and the influence of the laser process will generate subsequent related foreign matter, which cannot be cleaned and metabolized, and will further cause abnormalities such as contaminating subsequent processes.

[0005] Furthermore, in the prior art, the efficiency of installing and removing the cleaning wheel is low, and the work time for removing and replacing the cleaning wheel cannot be effectively shortened, which affects production efficiency and increases the equipment downtime, and therefore needs to be further improved. Summary of the Invention [Means for solving the problem]

[0006] In view of this, the main objective of the present invention is to provide a cleaning mechanism for cleaning excess resin after lamination of a dielectric, which mainly includes a belt or roller transport mechanism for transporting an ABF dielectric carrier board to the position of a cleaning wheel plate and then transporting the ABF dielectric carrier board horizontally, a cleaning machine spindle mechanism which is a carrier for mounting the cleaning wheel plate and has the functions of pressure detection and vertical adjustment of the cleaning position, and can process both the upper and lower surfaces of the ABF dielectric carrier board simultaneously using multiple mechanisms, wherein the cleaning wheel plate is driven by a motor spindle mechanism to rotate at high speed and clean the excess resin caused by lamination in the blank areas around the ABF dielectric carrier board, and a back pressure roller mechanism and back pressure wheel which are used to support the ABF dielectric carrier board, have rotational characteristics (the rotational speed is the same as that of the roller transport), and can achieve a uniform cleaning and removal effect.

[0007] Another object of the present invention is to provide a quick release device for a cleaning wheel plate, in order to solve the problem of low installation and removal efficiency of the prior art, the quick release device including: a fixing member for fixing the cleaning wheel plate; a handle fixedly connected to a quick release shaft for pressing and rotating the quick release shaft; an elastic member provided on the quick release shaft for telescopically mounting the quick release shaft; a fixing pin fixed to one end of the quick release shaft and provided symmetrically along the circumferential direction of the quick release shaft; two moving grooves provided on one end of the fixing member for moving the fixing pin; and two locking grooves provided on one end of the fixing member, used for removing and installing the quick release shaft and for fixing the fixing pin.

[0008] By using the above components, the present invention can effectively improve the problems that occur in the conveying mechanism and installation and removal of the cleaning wheel in the known laser-based resin overflow removal work line, and further greatly improve production efficiency. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a schematic diagram of a known lamination process in which resin extrusion occurs around the perimeter of an ABF dielectric carrier board. [Diagram 2] FIG. 2 is a schematic diagram of the cleaning spindle mechanism of the present invention. [Diagram 3] FIG. 3 is a schematic diagram of the overall cleaning mechanism of the present invention. [Figure 4] FIG. 4 is a schematic diagram of the cleaning process using the cleaning mechanism of the present invention. [Diagram 5] FIG. 5 is a structural schematic diagram of the quick release device of the cleaning wheel of the present invention. [Figure 6] FIG. 6 is a schematic diagram of the fixing pin of the quick release device of the cleaning wheel of the present invention engaging with the fixing member. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] The present invention provides a mechanism for cleaning resin that has spilled out after laminating dielectric layers, and its usage technology and embodiments will be described in detail with reference to FIGS. 2, 3 and 4. In the lamination process of the ABF dielectric 1 and the ABF dielectric carrier board 3, the ABF dielectric carrier board 3 is moved to the position of the cleaning wheel plate 4 which is continuously rotated by the conveying mechanism 5 of the belt or roller, and when the front end of the ABF dielectric carrier board 3 is close to the position directly below the cleaning wheel plate 4, the cleaning wheel plate 4 moves downward to contact the ABF dielectric carrier board 3, at this time, the cleaning mechanism rotates the cleaning wheel plate 4 at high speed by the motor spindle mechanism through the spindle moving structure 61 by the spindle driving module 62, and moves it forward by the movement of the conveying mechanism 5, thereby removing the resin 2 protruding from the lamination on the four sides of the ABF dielectric 1 and protruding into the blank area around the ABF dielectric carrier board 3 due to hot pressing, and in the removal process, the back pressure roller mechanism 7 and the back pressure wheel 71 which rotate at the same speed as the conveying mechanism 5 (the rotation speed is the same as that of the belt or roller) play the role of supporting the ABF dielectric carrier board 3, thereby achieving a stable and uniform cleaning effect.

[0011] The cleaning wheel plate 4 uses a stainless steel cleaning machine spindle mechanism 6 as its carrier, and the cleaning machine spindle mechanism 6 has the functions of pressure detection and up / down adjustment of the cleaning position, and multiple mechanisms can process both the upper and lower surfaces of the ABF dielectric carrier board 3 simultaneously.

[0012] The present invention further provides a quick release device 41 for the cleaning wheel plate 4. As shown in FIG. 2, FIG. 5 and FIG. 6, the quick release device 41 fixes the cleaning wheel plate 4 with a fixing member 8, and presses the handle 10 of the cleaning wheel plate 4 to engage the quick release shaft 14 fixedly connected to the handle 10 with the elastic member 9 of the quick release shaft 14 to perform expansion and contraction pressing. Then, the handle 10 is rotated clockwise to insert two fixing pins 11 fixed to one end of the quick release shaft 14, which are symmetrically arranged in the circumferential direction, into the locking grooves 13 provided on the fixing member 8 along the moving grooves 12 provided on one end of the fixing member 8 (as shown in FIG. 6). Then, the handle 10 is released, and the installation of the cleaning wheel plate 4 is completed.

[0013] This quick release device 41 expands and contracts by pressing the handle 10 to engage the quick release shaft 14 with the elastic member 9, rotates the handle 10 clockwise to fix the fixing pin 11 of the quick release shaft 14 in the locking groove 13, and rotates the handle 10 counterclockwise to disengage the fixing pin 11 of the quick release shaft 14 from the locking groove 13, thereby achieving quick attachment and detachment to and from the cleaning wheel plate 4, saving time and labor compared to known methods such as screwing or clamping, and greatly improving the efficiency of replacing the cleaning wheel plate 4, thereby shortening the downtime of the production line and maximizing profits. [Explanation of symbols]

[0014] 1:ABF dielectric 2: Resin protruding from lamination 3:ABF dielectric carrier board 4: Cleaning wheel plate 41: Quick release device 5: Transport mechanism 6: Cleaning machine spindle mechanism 61: Spindle moving structure 62: Spindle drive module 7: Back pressure roller mechanism 71: Back pressure wheel 8: Fixing material 9: Elastic material 10: Handle 11: Fixed pin 12: Moving groove 13: Locking groove 14: Quick release shaft

Claims

1. A dielectric lamination resin spill cleaning mechanism, which is applied to the removal of the resin spill generated during the lamination process of ABF dielectric and ABF dielectric carrier board, a belt or roller transport mechanism for transporting the ABF dielectric on the ABF dielectric carrier board to a cleaning wheel plate position and thereafter transporting the ABF dielectric carrier board horizontally; a cleaning machine spindle mechanism including a spindle driving module and a spindle moving structure, which functions as a carrier for mounting and installing the cleaning wheel plate, the cleaning wheel plate is rotated at high speed by a motor spindle mechanism, and is advanced by the movement of the conveying mechanism, and has the functions of pressure detection and vertical adjustment of the cleaning position, and can process both the upper and lower surfaces of the ABF dielectric carrier board simultaneously by multiple mechanisms; A cleaning mechanism for the resin that has been squeezed out after lamination of the dielectric, the cleaning mechanism including: a back pressure roller mechanism and a back pressure wheel, which are used to support the ABF dielectric carrier board, have a rotating property, and when the ABF dielectric is located directly under the cleaning wheel plate, remove the resin that has been squeezed out due to lamination and has been squeezed out into the blank area around the ABF dielectric carrier board after hot pressing, thereby achieving a uniform cleaning and removal effect.

2. 2. A cleaning mechanism for cleaning resin that spills out after dielectric lamination as described in claim 1, wherein the conveying mechanism conveys the ABF dielectric carrier board to the position of the back pressure roller mechanism, and the cleaning wheel plate can move up and down to increase or decrease the pressure or torque according to a set cleaning pressure or torque load, and after cleaning is completed, the conveying mechanism conveys the ABF dielectric carrier board to the next process.

3. 2. The cleaning mechanism for cleaning resin spilled out after dielectric lamination according to claim 1, wherein the cleaning wheel plate is further provided with a quick release device including: a fixing member for fixing the cleaning wheel plate; a handle fixedly connected to a quick release shaft and for pressing and rotating the quick release shaft; an elastic member provided on the quick release shaft and for attaching the quick release shaft in an expandable and contractible manner; a fixing pin fixed to one end of the quick release shaft and provided symmetrically along a circumferential direction of the quick release shaft; two moving grooves provided on one end of the fixing member for moving the fixing pin; and two locking grooves provided on one end of the fixing member, used for removing and attaching the quick release shaft and for fixing the fixing pin.

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