Asymmetric Wafer Cleaning Equipment
Mechanically asymmetric gels are used to efficiently clean IC wafers by bouncing water droplets and vibrating the gel, addressing the inefficiencies and costs of current cleaning methods.
Patent Information
- Application Number
- JP2024003365U
- Authority / Receiving Office
- JP · JP
- Patent Type
- Utility models
- Current Assignee / Owner
- Filing Date
- 2024-09-24
- Publication Date
- 2025-05-16
- Estimated Expiration
- 2034-09-24
AI Technical Summary
The current methods for cleaning IC wafers require multiple water pools and are time-consuming and costly.
Utilization of mechanically asymmetric gels that can distinguish between left and right forces, allowing for efficient cleaning of IC wafers by bouncing water droplets and vibrating the gel to remove fine dust.
The solution reduces the number of water pools needed and shortens the cleaning time, thereby lowering costs and improving efficiency in the IC wafer manufacturing process.
Smart Images

Figure 0003251280000001_ABST
Abstract
Description
[Technical field] .
[0001] The present invention relates to a technique for cleaning wafers of IC materials using a mechanical asymmetric gel. [Background technology]
[0002] Mechanically asymmetric gels are gel materials that can distinguish between left and right when an external force is applied, and can deform in only one direction. These gels have the ability to move matter, energy, and living things in one direction, and have the power to resist the increase in entropy, turning a chaotic state into an orderly state, and are expected to be used in a variety of fields. [Prior art documents] [Non-patent literature]
[0004] [Non-Patent Document 1] Gel material that defies entropy increase | RIKEN (riken.jp) Summary of the Invention [Problem to be solved by the invention]
[0005] When manufacturing IC wafers, the equipment requires about five swimming pools of water to clean. The purpose of this invention is to reduce the cost and time required for cleaning. [Means for solving the problem]
[0006] The mechanically asymmetric gel has the property of bouncing upwards when it is vibrated up and down and water droplets are dropped onto its sides. The entire surface of the wafer can be cleaned, including fine particles, by following the steps of: ▲1▼ Rotating the rotating table, ▲2▼ Bringing the mechanically asymmetric gel attached to the vibration table, ▲3▼ Over the wafer, ▲4▼ Approaching it while vibrating it, ▲5▼ Squeezing water from the pipe, and rotating the rotating table from side to side. [Brief description of the drawings]
[0007] [Figure 1]FIG. 2 is a side view of the present invention.
Claims
[Claim 1] As shown in the drawing, an IC wafer cleaning apparatus utilizing a mechanical asymmetric gel.