Housing unit for semiconductor power module, method for manufacturing the same, and semiconductor power module

Abstract

The housing unit (2) for the semiconductor power module (1) comprises a molded body (3) configured to surround the electrical components of the semiconductor power module (1). The housing unit (2) further comprises at least one terminal (10) that extends through the molded body (3), and at least one terminal (10) is at least partially integrated and incorporated into the molded body (3) such that an end portion (11) of the at least one terminal (10) is exposed on the upper surface (6) of the molded body (3) with respect to the stacking direction (A) of the semiconductor power module (1). The at least one terminal (10) further comprises at least one sealing structure (13, 14) disposed within a boundary region (5) between the exposed end portion (11) and the molded edge portion (4) of the molded body (3), and the sealing structure (13, 14) is configured to limit the upward extension of the molded body (3) during its formation.

Description

Technical Field

[0001] The present disclosure relates to a housing unit for a semiconductor power module and a corresponding manufacturing method for the housing unit. The present disclosure further relates to a semiconductor power module comprising such a housing unit.

Background Art

[0002] Conventional power modules form a technology for power semiconductor packages and typically comprise a housing and electrical components assembled therein. It is a problem to provide a stable housing that contributes to the reliable function of the power module.

Summary of the Invention

Means for Solving the Problems

[0003] Embodiments of the present disclosure can provide a housing unit for a semiconductor power module that enables a stable function for high-voltage power module applications and can be reliably manufactured. Further embodiments of the present disclosure can provide a manufacturing method for a semiconductor power module and a housing unit for a semiconductor power module.

[0004] According to one embodiment, a housing unit for a semiconductor power module comprises a molded body configured to surround the electronic devices and / or electrical components of the semiconductor power module. The housing unit further comprises at least one terminal that is at least partially integrated and incorporated into the molded body such that at least one terminal extends through the molded body. The end of the at least one terminal forms the top of the terminal and is at least partially exposed on the upper surface of the molded body with respect to the stacking direction of the semiconductor power module. The at least one terminal further comprises at least one sealing structure disposed in a boundary region between the exposed end and the molded edge of the molded body. The sealing structure is configured to limit the upward extension of the molded body during its formation by molding.

[0005] Due to the described configuration of the housing unit, one or more terminals extending through the molded body are securely sealed and can provide a reliable electrical connection to further components of the semiconductor power module. Thus, the housing unit prevents unwanted leakage of the molding material into the area of each end of the corresponding terminal and thus contributes to the reliable functioning of the semiconductor power module for low, medium, and even high voltage power module applications and large modules. The described configuration with its non-contaminated upper end enables reliable electrical contact to an external bus or signal connection. The end of each terminal may be formed as a nut of the terminal.

[0006] A specific sealing structure attached to the terminal enables reliable sealing even for, for example, circular or square vertically arranged terminals. In this context, terms such as "vertical", "upper side", or "lower side" refer to the alignment or orientation of the elements as intended in the normal operating state of the semiconductor power module. Thus, the stacking direction can also be called the vertical direction, and the corresponding lateral direction can also be called the horizontal direction, which usually extends over the main plane of expansion.

[0007] According to one embodiment, the sealing structure is formed on the outer surface of at least one terminal so as to partially or completely surround the terminal in a lateral direction or a radial direction perpendicular to the stacking direction. The terminal may have a terminal leg portion and an elongated terminal shaft or body whose upper end forms an end of the terminal. The terminal shaft extends through the molded body and can have different shapes such as circular, rectangular, elliptical, or any other shape with respect to a cross-section along a lateral plane. Inside the housing, each terminal may have a different shape or any shape. Thus, at least one terminal having a cylindrical shape, a rectangular parallelepiped shape, and an elliptical shape can be formed. At least one terminal can be further formed as a tubular solid or hollow. The sealing structure forms a restriction on the molding material of the molded body and may be formed partially around the terminal shaft or as a closed ring. Alternatively or additionally, the sealing structure may be formed by spirally surrounding the terminal shaft. One or more terminals can have, for example, a plurality of rings.

[0008] According to one embodiment, the sealing structure includes at least one recess formed on the outer surface of at least one terminal. The recess can be formed such that the molding edge of the molded body extends into the at least one recess. The molding edge can realize a local top of the molded body adjacent to the terminal. Thus, interacting with the corresponding molding tool, the recess can form a given notch for absorption and retention of the molding material to prevent unwanted bleed-out into the end region.

[0009] Alternatively or additionally, the sealing structure can include at least one protrusion formed on the outer surface of at least one terminal. Such a protrusion can limit the upward extension of the molding edge of the molded body with respect to the stacking direction. Thus, interacting with the corresponding molding tool, the protrusion can form a given barrier for blocking the outflow of the molding material to prevent unwanted contamination of the end.

[0010] According to a further embodiment, one or more terminals comprise two or more sealing structures formed within a boundary region between an exposed end portion and a molding edge of the molded body. Each of the sealing structures can comprise one or more recesses and / or one or more protrusions formed on an outer surface of the respective terminal. The sealing structure can comprise, for example, only a protruding portion or a recessed portion, or a combination of varying protruding and recessed portions. The arrangement of the one or more sealing portions may completely or only partially or partly surround the respective terminal.

[0011] The sealing structure can be realized as an additional element separate from the elongated body of the terminal or can be integrally formed with the terminal. With respect to a vertical cross-section along the stacking direction, the sealing structure can be formed in at least one of the shapes of a square, a rectangle, a trapezoid, a semi-circle, and a triangle. Further, with respect to a vertical cross-section along the stacking direction, the sealing structure can have a height having a value of 0.1 to 2.0 mm and / or a width having a value of 0.1 to 2.0 mm. The height refers to the vertical direction along the stacking direction, and the width refers to the corresponding vertical horizontal direction. The horizontal direction can also be referred to as the lateral direction, and the width can also be referred to as the depth of the recess or the thickness of the protrusion or the sealing structure. The height and the width are set with respect to the outer surface of the associated terminal adjacent to each respective sealing structure. Thus, the height can refer to the length of the protrusion or the recess along the stacking direction, respectively.

[0012] For example, considering a circular or cylindrical terminal, the protrusion forming the sealing mechanism can protrude in a radial direction above the adjacent outer surface of the terminal with a maximum width of 2 mm. Thus, considering a cylindrical terminal, the recess forming the sealing mechanism can protrude in a radial rearward direction of the adjacent outer surface of the terminal by a maximum width or depth of 2 mm. It is a finding in the context of the present disclosure that such dimensions can surely contribute to preventing an undesired leakage of the molding material during the formation of the molded body and thus during the formation of the outer region of the nut or the end portion of each terminal.

[0013] According to one embodiment, a semiconductor power module includes an embodiment of a housing unit and electrical components and / or electronic components disposed inside the housing unit. The semiconductor power module can further include an insulated metal substrate structure having a metal top layer, a metal bottom layer, and a dielectric layer therebetween. The dielectric layer can be formed as a resin sheet or a molded resin layer. The insulated metal substrate structure is electrically coupled to the housing unit by coupling at least one terminal to the metal top layer. The metal top layer can form a metallization made from a film and / or sheet including copper and / or aluminum and / or an alloy of copper and / or an alloy of aluminum. This can also be applied to, for example, a metal bottom layer formed as a copper and / or aluminum plate and / or a corresponding alloy. As a result of the described semiconductor power module including an embodiment of the aforementioned housing unit, the described features and characteristics of the housing unit are also disclosed for the semiconductor power module, and vice versa.

[0014] Alternatively, the semiconductor power module can include a substrate or a base plate coupled to the housing unit. Preferably, the substrate is an isolated substrate. The substrate can include an insulating sheet made from a ceramic material, at least one metallization layer on which a power semiconductor device is mounted, and optionally a backside metallization. As an alternative or in addition, the semiconductor power module can include a substrate in the form of a lead frame, a ceramic-based substrate such as an LTCC substrate. The substrate can be attached to the base plate.

[0015] According to one embodiment, a method for manufacturing a housing unit for a semiconductor power module includes providing a molding material configured to form a molded body of the housing unit so as to surround electrical or electronic components of the semiconductor power module. The method further includes providing and positioning at least one terminal having an end portion and at least one sealing structure formed adjacent to the end portion. The method further includes forming the molded body by molding with the molding material provided around the at least one terminal such that the at least one terminal is integrated and at least partially incorporated into the molded body and extends through the molded body. The molded body is formed in interaction with the at least one terminal such that the end portion is exposed on an upper surface of the molded body with respect to the stacking direction of the semiconductor power module. The at least one sealing structure is arranged within a boundary region between the exposed end portion and a molded edge of the molded body by restricting an upward extension of the molded body during its formation.

[0016] As a result of the described method manufacturing an embodiment of the aforementioned housing unit for a semiconductor power module, the described features and characteristics of the housing unit are also disclosed with respect to the manufacturing method, and vice versa. Accordingly, the present disclosure includes several aspects, and any feature described with respect to one of the aspects is also disclosed herein with respect to other aspects, even if each feature is not explicitly recited in the context of a particular aspect.

[0017] According to one embodiment of the method, the molding material includes a thermoplastic or thermosetting resin composed of a filler material made from particles and / or fibers for injection molding or transfer molding, and the molded body is formed by injection molding or transfer molding with the thermoplastic or thermosetting resin.

[0018] According to a further embodiment of the method, providing and positioning at least one terminal includes providing at least one sealing structure having recesses and / or protrusions formed on the outer surface of the terminal. The method includes positioning a terminal extending into a cavity of a molding tool such that the recesses and / or protrusions limit an upper level of the cavity before the molding tool forms a molded body by molding. One or more sealing structures of the terminal can be configured to cooperate with corresponding structures of the molding tool, for example, to enable a very accurate and reliable seal.

[0019] The described configuration of the housing unit enables the attachment of a terminal block, and the main power supply and / or auxiliary terminals can be, for example, used for signal wiring and be an integral part of the molded housing. For example, the terminal block includes a plurality of vertically arranged and incorporated terminals having portions exposed from the molded body, and each of the vertically arranged terminals has at least one sealing feature adjacent to an edge of the molded body. The terminal portions inside the housing or inside the molded body can have any shape and can also have horizontal portions. The described configuration of the housing unit enables, for example, the positioning of the vertically arranged terminals and the formation of the encapsulated molded body even when the molding tool includes two clamped shells and the terminals are present at locations other than the interface between the shells of the molding tool. This may also refer to a situation where most of the terminals are arranged horizontally with respect to the clamp of the molding tool, but further vertically arranged terminals can be present.

[0020] The terminals can have a base material of, for example, copper or a copper alloy. Additionally, one or more terminals can be made of or include a coating made of nickel, gold, silver, or any other metal. The terminals can include a coating on the bottom surface of one or more layers made of or including nickel, gold, silver, and / or other metals. Alternatively or in addition, further components or complete terminals can be coated. One or more terminals are specifically designed to firmly seal their upper parts and prevent contamination of the upper ends of the terminals intended to be exposed from the underlying molded body.

[0021] The terminal block can provide a complete module housing or can realize a part of the housing. The molded body can be made of or include a thermoplastic resin, a thermosetting resin, or any other resin material. The production of the molded body can be carried out by injection molding, transfer molding, or any other applicable molding process. The corresponding molding material can include a filling material such as particles or fibers.

[0022] Due to a specific sealing structure formed on the terminals, it is possible to prevent contamination of exposed portions such as the respective ends of the main terminals and / or auxiliary terminals vertically arranged within the molded body forming the terminal block. The terminals extending vertically from the terminal block may have a horizontal portion or an inclined portion inside the molded body. Thus, each sealing mechanism prevents the bleed-out of the resin component during the formation of the molded body by molding. The sealing structure can completely or at least partially surround the shaft of the terminal adjacent to the edge of the molded portion in contact with the terminal. As a result, it is possible to reliably prevent the terminal portion exposed from the terminal block from being covered or contaminated by the molding material.

[0023] The provision of such terminal blocks or housing parts with integrated power terminals and / or auxiliary terminals can have a beneficial impact on the assembly of the corresponding semiconductor power module. If at least part of the housing and one or more terminals form one common structural block, such as a housing unit, the assembly of the semiconductor power module can be simplified. On the one hand, instead of a plurality of single parts, there is only one large part to be mounted on the module assembly. For the subsequent joining process of soldering or welding the terminals to a substrate, such as an insulated metal substrate, all terminals can be properly aligned. On the other hand, the terminal block or housing unit can be used as a fixture to assist the joining process. In addition, the pre-manufacture of a terminal block with integrated terminals as described enables the mounting of vertical main terminals and / or auxiliary terminals to the semiconductor power module. Alternatively or additionally, one or more terminals incorporated in a molded body can each have a predetermined inclination or other orientation with respect to the vertical or stacking direction.

[0024] It is a finding in the context of the present disclosure that there is a risk that the part of the terminal intended to be exposed from the molded article is partially covered or contaminated by the molding material with respect to conventional terminals integrated within the molded article. Such risk can be reduced by using complex and expensive molding tools, which must provide proper sealing to the terminals in order to prevent the exposed part of the terminal from being covered by the molding material or contaminated by bleed-out of components of the molding material.

[0025] For example, considering a lead frame-based package that undergoes a transfer molding process using a molding tool consisting of an upper and a lower part, a dam bar that mechanically connects all horizontally oriented terminals can be implemented on the lead frame to effect sealing, such that the two parts of the molding tool can provide sealing by clamping both sides of the dam bar. However, such a method of sealing terminals does not guarantee prevention of leakage and is not applicable, in particular, to vertically arranged terminals when the terminals have a circular cross-sectional shape, nor is it applicable to the situation where the terminals are located in other places of the module body, and sealing by a dam bar is not possible. In such a case, the molding tool comprises two clamped shells, but when the terminals are present at locations other than on the interface between the shells, the vertically arranged terminals cannot be firmly surrounded by the molding tool, so the clamping and sealing method does not function properly.

[0026] By using the described housing unit and a specifically designed structure for firmly sealing on the terminals, it is possible to prevent or at least impede the undesirable leakage of the molding material into the area of the exposed ends at low cost. Thus, the described housing unit contributes to the reliable functioning of semiconductor power modules and can be manufactured with little effort without the need for complex and expensive molding equipment. The housing unit further contributes to easy installation in customer applications. The housing unit can be used for large semiconductor power modules and power modules for high voltage classes. For example, this enables the manufacture of semiconductor power modules with a lateral length or width of up to 34 mm × 100 mm, or even 140 mm × 190 mm. In this regard, the lateral length or width extends in the lateral direction perpendicular to the stacking direction of the semiconductor power module.

[0027] The conscious introduction of a sealing structure to prevent or at least reduce the contamination of the exposed portions of the terminals by the molding material has at least some of the following advantages, not only for the manufacturer but also for customer acceptance.

[0028] · Improvement of the yield rate at the supplier site → Reduction of component costs due to a decrease in component waste or a reduction in the labor for rework or cleaning · Reduction of the required tolerances for the auxiliary ends → Reduction of component prices · Clean optical appearance of the final product compared to undefined bleed / flash lines → Improvement of customer acceptance · Additional design freedom → Increase in the space for the customer gate unit The described housing unit can be applied to all power modules having a housing with main terminals and / or auxiliary terminals integrated with a molded body.

[0029] Exemplary embodiments are described below with the aid of schematic diagrams and reference numerals. The figures show the following.

Brief Description of the Drawings

[0030]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Modes for Carrying Out the Invention

[0031] The attached figures are included to provide further understanding. It should be understood that the embodiments shown in the figures are exemplary representations and are not necessarily drawn to scale. The same reference numerals designate elements or components having the same function. As long as the elements or components correspond to each other with respect to their functions in different figures, their descriptions are not repeated for each of the following figures. For clarity, elements may not be labeled with corresponding reference signs in all figures.

[0032] FIG. 1 shows a perspective view of an embodiment of a semiconductor power module 1. According to further embodiments, the semiconductor power module 1 can include a form different from that shown in FIG. 1. The semiconductor power module 1 comprises a housing unit 2 having a molded body 3 configured to surround electrical components of the semiconductor power module 1, such as, for example, power semiconductor devices, conductive plates, or conductive tracks. The housing unit 2 further comprises at least one terminal 10 which is at least partially integrated and incorporated into the molded body 3. According to FIG. 1, the housing unit 2 of the semiconductor power module 1 comprises six vertically arranged terminals 10 which extend through the molded body 3 on its upper surface such that respective ends 11 of the associated terminals 10 are at least partially exposed on the upper surface 6 of the molded body 3.

[0033] In this description, terms such as "vertical", "horizontal", "upper", or "lower" refer to the alignment or orientation of elements as intended in the normal operating state of the semiconductor power module 1 shown in FIG. 1. Thus, the stacking direction A realizes the vertical direction, and the corresponding lateral directions B and C realize the horizontal direction and extend over the main plane of the expansion of the semiconductor power module 1. Thus, the illustrated terminals 10 can be referred to as vertical terminals.

[0034] The semiconductor power module 1 can further comprise a substrate or a base plate to which the substrate is soldered. The substrate can be realized as an insulating substrate or an insulating metal substrate structure comprising a metal top layer, a metal bottom layer, and a dielectric layer therebetween.

[0035] The terminal 10 further comprises at least one sealing structure in the form of a recess 13 (see FIGS. 2 and 3) or a protrusion 14 (see FIGS. 4 and 5) arranged on the outer surface 15 of each terminal 10. Each sealing structure is arranged within the boundary region 5 and / or defines the generation of the boundary region 5 between the exposed portion or end 11 and the molding edge 4 of the molded body 3 during its formation by molding. Accordingly, each sealing structure is configured to reliably limit the upward extension of the molded body 3 during the corresponding molding process.

[0036] FIGS. 2 to 6 show enlarged cross-sectional views of the boundary region 5 and possible embodiments of the sealing structure attached to or formed on the outer surface 15 of the terminal 10. According to FIGS. 2 and 3, the sealing structure can be formed as a recess 13 that completely surrounds the elongated shaft 12 of the terminal 10. Accordingly, the recess 13 can be formed as a funnel-shaped or groove-shaped circumferential groove. Considering the illustrated cross-section, the recess 13 can be limited by the remaining outer surface 15 of the terminal 10 having a square, rectangular, trapezoidal, semi-circular, and / or triangular shape.

[0037] The recess 13 forms a free volume for taking in and holding the molding material during the formation of the molded body 3. Accordingly, the molding edge 4 is formed on the shaft 12 and extends into the recess 13. The recess 13 or the sealing structure can generally be formed in cooperation with the corresponding molding tool required to perform the molding process for creating the molded body 3. As a result, the upward extension of the molded body is limited because the remaining outer surface of the end is not contaminated by the molding material.

[0038] According to FIGS. 4 and 5, the sealing structure can alternatively be formed as a protrusion 14 that can completely surround the elongated shaft 12 of the terminal 10. Thus, the protrusion 14 can be formed as a circumferential ring having a wedge shape, a bead shape, or a bulge shape. Considering the illustrated cross-section, the protrusion 14 can be formed by the outer surface 15 of the terminal 10 having a square, rectangular, trapezoidal, semi-circular, and / or triangular shape. The protrusion 14 forms a barrier against the molding material and limits the upward extension of the molding edge 4 in the stacking direction A. Moreover, one or more terminals 10 can be provided with a sealing structure having one or more recesses 13 and / or one or more protrusions 14.

[0039] FIG. 6 shows the possible dimensions of a sealing structure in the form of a rectangular recess 13. However, the dimensions can also apply to other shapes of the recess 13 and possible shapes of the protrusion 14. With respect to the illustrated cross-sectional view, the recess 13 has a height H along the vertical or stacking direction A and a depth or width W along the radial or transverse directions B, C. For example, the height H can have a value of 0.1 to 2.0 mm, and the width W can have a value of 0.1 to 2.0 mm. Depending on the intended application, the height H and / or width W of the recess 13 or protrusion 14 can alternatively have larger values.

[0040] The description and illustration of the housing unit 2 having the terminal 10 contribute to preventing the exposed portions of the vertical main terminal and / or auxiliary terminal 10 from being contaminated by the resin material or the resin component from bleeding out in the region of the exposed end 11, and providing a reliable electrical connection to further components. As a result, it can be prevented that the coating of the terminal portion is exposed from the molded body 3 by the molding material. The terminal 10 can have a circular or angular solid or hollow or tubular shape. With respect to the completed molded body 3, the recess 13 or protrusion 14 is arranged adjacent to the molding edge 4 of the molded body 3 within the boundary region 5.

[0041] The steps of the corresponding manufacturing method can follow the flowchart shown in FIG. 7. In step S1, a molding material configured to form a raw material for the molded body 3 of the housing unit 2 is provided. The molding material can be, for example, a thermoplastic resin and / or a thermosetting resin having a filler material made from particles or fibers.

[0042] In a further step S2, one or more terminals 10 are provided and positioned within the molding tool. Each terminal 10 comprises an upper end portion 11 and a lower shaft 12, and at least one sealing structure in the form of a recess 13 or a protrusion 14 formed adjacent to the end portion 11. The terminals 10 can be purchased with the desired sealing structure, or the sealing structure can be formed during the manufacturing method. Thus, one or more recesses 13 can be cut, drilled, redirected, pressed, or rolled within the outer surface 15 of the terminal 10. One or more protrusions 14 can be formed in the same way.

[0043] In a further step S3, a molded body can be formed by molding with the molding material provided around the arranged terminals 10. The housing unit 2 having the molded body 3 and the integrated terminals 10 can be manufactured by any type of molding process such as injection molding or transfer molding. Thus, the terminals 10 are integrated and incorporated into the molded body 3, extend through the molded body 3, and the end portions 11 are exposed on the upper surface 6 of the molded body 3. The sealing structure restricted or restricted the upward extension of the molded body 3 during its formation in the boundary region 5 between the exposed end portion 11 and the molding edge portion 4 of the molded body 3. One or more sealing structures can be provided in cooperation with the corresponding structure of the molding tool to enable accurate and reliable sealing and restriction in consideration of the incorporated molding liquid.

[0044] The embodiments shown in FIGS. 1 to 7 described above represent exemplary embodiments of an improved housing unit 2 and a semiconductor power module 1 and their manufacturing methods, and thus they do not constitute a complete list of all embodiments. The actual arrangements and methods may be different from those of the embodiments shown, for example, with respect to the metal substrate structure and the power module.

Explanation of Reference Signs

[0045] Reference Sign 1 Semiconductor power module 2 Housing unit 3 Molded body of the housing 4 Molded edge 5 Boundary region 6 Upper surface of the molded body 10 Terminal 11 End portion of the terminal 12 Elongated shaft of the terminal 13 Recess of the terminal 14 Protrusion of the terminal 15 Outer surface of the terminal A Laminating direction B Lateral direction C Lateral direction H Height of the sealing structure W Width of the sealing structure S(i) Steps of a method for manufacturing a housing unit for a semiconductor power module

Claims

1. A housing unit (2) for a semiconductor power module (1), A molded body (3) configured to surround the electrical components of the semiconductor power module (1), At least one terminal (10) extends through the molded body (3), and an end portion (11) of the at least one terminal (10) is exposed on an upper surface (6) of the molded body (3) with respect to a stacking direction (A) of the semiconductor power module (1). The at least one terminal (10) is at least partially integrated and incorporated into the molded body (3). The at least one terminal (10) further includes at least one sealing structure (13, 14) disposed within a boundary region (5) between the exposed end portion (11) and a molded edge portion (4) of the molded body (3). The sealing structure (13, 14) is configured to limit upward extension of the molded body (3). At least one terminal (10) A housing unit (2) comprising.

2. The housing unit (2) according to claim 1, wherein the sealing structure (13, 14) is formed on an outer surface (15) of the at least one terminal (10) so as to partially or completely surround the terminal (10) with respect to a lateral direction (B, C) perpendicular to the stacking direction (A).

3. The housing unit (2) according to any one of the preceding claims, wherein the sealing structure includes at least one recess (13) formed on an outer surface (15) of the at least one terminal (10).

4. The housing unit (2) according to claim 3, wherein the molded edge portion (4) of the molded body (3) extends into the at least one recess (13).

5. The housing unit (2) according to any one of the preceding claims, wherein the sealing structure includes at least one protrusion (14) formed on an outer surface (15) of the at least one terminal (10).

6. The housing unit (2) according to claim 5, wherein the at least one protrusion (14) restricts upward elongation of the molding edge portion (4) of the molded body (3) with respect to the lamination direction (A).

7. The at least one terminal (10) includes two or more sealing structures (13, 14) formed in the boundary region (5) between the exposed end portion (11) and the molding edge portion (4) of the molded body (3), and each of the sealing structures (13, 14) includes at least one of a recess (13) and a protrusion formed on the outer surface (15) of the at least one terminal (10). The housing unit (2) according to any one of the preceding claims.

8. The housing unit (2) according to any one of the preceding claims, wherein the sealing structure (13, 14) is formed integrally with the terminal (10).

9. The housing unit (2) according to any one of the preceding claims, wherein the sealing structure (13, 14) is formed in at least one of the shapes of a square, a rectangle, a trapezoid, a semi - circle, and a triangle with respect to a cross - section along the lamination direction (A).

10. The housing unit (2) according to any one of the preceding claims, wherein the sealing structure (13, 14) has a height (H) having a value of 0.1 to 2.0 mm with respect to the lamination direction (A) and / or a width (W) having a value of 0.1 to 2.0 mm with respect to the lateral directions (B, C), and each is with respect to the outer surface (15) of the at least one terminal (10) adjacent to each of the respective sealing structures (13, 14).

11. The housing unit (2) according to any one of the preceding claims, wherein the at least one terminal (10) is formed solid or hollow and includes an elongated shaft (12) having at least one of the shapes of a cylindrical shape, a rectangular parallelepiped shape, and an elliptical shape with respect to the lamination direction (A).

12. The housing unit (2) according to any one of the preceding claims, and an electrical component disposed inside the housing unit (2), and A semiconductor power module (1) comprising:

13. An insulating substrate structure having, wherein the insulating substrate structure is electrically coupled to the housing unit (2) by the at least one terminal (10), the semiconductor power module (1) according to claim 12, comprising an insulating substrate structure.

14. A method for manufacturing a housing unit (2) for a semiconductor power module (1), comprising: providing a molding material configured to form a molded body (3) of the housing unit (2) so as to surround the electrical components of the semiconductor power module (1); providing and positioning at least one terminal (10) having an end portion (11) and at least one sealing structure (13, 14) formed adjacent to the end portion (11); forming the molded body (3) by molding with the provided molding material around the at least one terminal (10) such that the at least one terminal (10) is integrated and incorporated into the molded body (3) and extends through the molded body (3), wherein the end portion (11) is exposed on an upper surface (6) of the molded body (3) with respect to a stacking direction (A) of the semiconductor power module (1), and the at least one sealing structure (13, 14) is disposed within a boundary region (5) between the exposed end portion (11) and a molded edge portion (4) of the molded body (3) by restricting an upward extension of the molded body (3) during its formation; A method comprising.

15. providing and positioning at least one terminal (10) is providing the at least one sealing structure having a recess (13) and / or a protrusion (14) formed on an outer surface (15) of the terminal (10); Positioning the terminal (10) extending into the cavity of the molding tool so that the recess (13) and / or the projection (14) restricts the upper level of the cavity before the molding body (3) is formed by molding The method according to claim 14, comprising this.

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