Sealed integrated heat dissipation assembly structure and liquid cooling module thereof

Abstract

A sealed integrated heat dissipation assembly structure and its liquid cooling module are provided that simplify the system design structure, reduce the occupied volume and weight, and at the same time reduce the risk of cooling fluid leakage. [Solution] The heat dissipation assembly structure 1 includes a heat dissipation plate 10, power modules 20a-20c, a flow path forming member 30, a flow path plate 40, an inlet pipe 51, and an outlet pipe 52. The heat dissipation plate has a top surface 11, a bottom surface 12, and a plurality of columnar heat dissipation fins attached to the bottom surface. A plurality of power modules are attached directly to the top surface of the heat dissipation plate. The flow path forming member is attached to the bottom surface of the heat dissipation plate and forms a cooling flow path in combination with the plurality of columnar heat dissipation fins. The flow path plate is in close contact with the bottom surface of the heat dissipation plate and includes an inlet 43, an outlet 44, an inlet chamber 41, and an outlet chamber 42, which are connected to each other via the cooling flow path.

Description

[Technical Field]

[0001] The present invention relates to a heat dissipation assembly structure, and more particularly to a heat dissipation assembly structure and its liquid cooling module that has a sealed, integrated structure that simplifies the system design, reduces the occupied volume and weight, and simultaneously reduces the risk of cooling fluid leakage. [Background technology]

[0002] Generally, electronic devices are combined with a heat dissipation assembly structure to dissipate internal heat. Among them, high-power modules used in inverters often generate high heat, so they need to be combined with a water-cooled heat dissipation assembly structure to achieve effective heat dissipation.

[0003] Traction inverters for vehicle motors typically consist of three high-power modules arranged in a slender structure. The combined water-cooled heat-dissipating module is often composed of a heat-dissipating plate, a waterproof gasket, and a flow-path plate. The cooling fluid enters the heat exchange chamber through the inlet flow path, then flows through the heat-dissipating fins of the multiple heat-dissipating plates to dissipate heat, and finally exits through the outlet flow path. While this structure is easy to assemble, each component requires a relatively large volume and weight, and there is a high thermal resistance between the components after assembly. Additionally, O-rings are still required between the heat-dissipating plate and the flow-path plate, which can further increase the risk of cooling fluid leakage. Solving the challenges of designing heat-dissipating assemblies that can accommodate multiple electronic devices in a long array has always been a major concern in this field.

[0004] In view of this situation, it is an urgent task to provide a heat dissipation assembly structure and its liquid cooling module that can simplify the system design structure, reduce the occupied volume and weight through a sealed integrated structure, while reducing the risk of cooling fluid leakage, thereby solving the drawbacks of the prior art. Summary of the Invention

[0005] The present invention aims to provide a heat dissipation assembly structure and its liquid cooling module that simplifies system design, reduces volume and weight, and reduces the risk of cooling fluid leakage through a sealed, integrated structure. Multiple power modules are soldered directly to the top surface of the heat dissipation plate, and the joining surfaces are bonded with solder, effectively reducing the thermal resistance of the contact surfaces. The heat dissipation plate, flow path-forming member, and flow path plate are also welded together, and the columnar heat dissipation fins of the heat dissipation plate are joined to the flow path-forming member to form cooling channels that effectively reduce cooling fluid resistance and improve the heat dissipation efficiency of the heat dissipation assembly structure for multiple power modules.

[0006] Another objective of the present invention is to provide a sealed, integrated heat dissipation assembly structure and its liquid-cooling module. To accommodate the heat dissipation needs of multiple power modules arranged in a single direction, the heat dissipation plates, flow channel plates, and flow channel plates of the power modules and liquid-cooling module are integrally assembled using processes such as brazing, diffusion bonding, friction stir welding, laser welding, and ultrasonic welding to form an integrated, elongated structure that reduces thermal resistance between components and provides horizontal parallel flow channels. The heat dissipation plates and flow channel plates divide the cooling flow channel into multiple flow channel chambers and connect to the columnar heat dissipation fins thermally coupled to the multiple power modules. The flow channel plate is divided into symmetrical inlet and outlet chambers by a partition wall. The flow channel structure allows the cooling fluid from the inlet chamber to be equally divided and enter the multiple flow channel chambers through multiple vents on adjacent long sides, then merge into the outlet chamber through another vent on the long side for discharge. The multiple diverter chambers form multiple horizontal channels with corresponding vents on both long sides, and the multiple horizontal channels are connected in parallel between the inlet and outlet chambers, carrying cooling fluid with equal flow rates through the multiple vertical ridges of the channel-forming member, respectively dissipating heat for the multiple power modules. The flow direction of the multiple horizontal channels is perpendicular to the extension direction of the long sides, rather than designed to extend along the long sides. A short-path design is adopted, and the horizontal channels of the multiple diverter chambers are located between the opposing long sides of the elongated structure, thereby shortening the channel length and achieving the goal of improving uniform heat dissipation performance. As a result, the cooling channel inlet and cooling channel outlet can provide cooling fluid inlet and outlet from different ends of the long sides. Furthermore, the vents extending along the opposing long sides and the diversion chambers connecting them have the same width, and the formed multiple flow paths ensure that the electronic devices in the corresponding multiple diversion chambers in the heat dissipation assembly structure have approximately equal heat dissipation conditions due to uniform diversion by at least one diversion structure, thereby quickly and uniformly removing the heat generated by the multiple electronic devices and effectively improving the overall heat dissipation efficiency.

[0007] To achieve the above objective, the present invention provides a heat dissipation assembly structure including a heat dissipation plate, multiple power modules, a flow path forming member, a flow path plate, an inlet pipe, and an outlet pipe. The heat dissipation plate has a top surface, a bottom surface, and multiple columnar heat dissipation fins, the top and bottom surfaces being opposite each other, and the multiple columnar heat dissipation fins are installed on the bottom surface. Multiple power modules are installed directly on the top surface of the heat dissipation plate. The flow path forming member is installed on the bottom surface of the heat dissipation plate and combines with the multiple columnar heat dissipation fins to form cooling channels. The flow path plate is assembled to the bottom surface of the heat dissipation plate in close contact with the flow path plate. The flow path plate has an inlet, an outlet, an inlet chamber, and an outlet chamber, the inlet and outlet are connected to the inlet and outlet chambers, respectively, and the inlet and outlet chambers are connected to each other via the cooling channels. The inlet and outlet pipes are connected to the inlet and outlet, respectively.

[0008] In one embodiment, the power modules are directly attached to the top surface of the heat sink plate by soldering, brazing, ultrasonic welding, laser welding, or diffusion bonding. The heat sink plate, the flow path member, and the flow path plate are integrally assembled by brazing, diffusion bonding, friction stir welding, laser welding, or ultrasonic welding.

[0009] In one embodiment, the cooling flow path includes a plurality of diverter chambers arranged between the bottom surface of the heat dissipation plate and the flow path forming member, the plurality of diverter chambers being spaced apart along the first direction and capable of thermal conduction with the plurality of power modules via the heat dissipation plate.

[0010] In one embodiment, the heat dissipation plate and the flow path forming member are assembled to form a plurality of first communication ports and a plurality of second communication ports, which are respectively arranged along the second direction corresponding to two opposite ends of the plurality of diverter chambers, the second direction being perpendicular to the first direction, and the inlet chamber is connected to the plurality of diverter chambers via the plurality of first communication ports, and the plurality of diverter chambers are connected to the outlet chamber via the plurality of second communication ports.

[0011] In one embodiment, the flow path plate further includes a partition wall, the partition wall being inclined relative to the first direction and the second direction, and dividing the internal space of the flow path plate into an inflow chamber and an outflow chamber.

[0012] In one embodiment, the flow channel plate further includes a flow dividing structure, which is disposed in the inlet chamber and connected to the partition wall, and is assembled to provide a flow dividing function for the plurality of first communication ports.

[0013] In one embodiment, the plurality of first communication ports and the plurality of second communication ports are elongated holes extending along a first direction. The plurality of branch chambers, the plurality of first communication ports, and the plurality of second communication ports have equal widths in the first direction. The flow path forming member includes a plurality of ridge members extending along the first direction, the ridge members being arranged to spatially correspond to the plurality of columnar heat dissipation fins, and the plurality of ridge members and the plurality of columnar heat dissipation fins being assembled along a third direction, the third direction being perpendicular to the first direction and the second direction.

[0014] In one embodiment, the plurality of power modules, the heat dissipation plates, the flow path forming members, and the flow path plates are stacked by welding along a third direction to form an integrated elongated structure, the third direction being perpendicular to the first and second directions, and the inlet and the outlet are disposed adjacent to a pair of short sides of the elongated structure, respectively.

[0015] In one embodiment, the inlet and outlet pipes are connected to the inlet and outlet, respectively, via quick connectors.

[0016] In one embodiment, the heat dissipation assembly structure further includes a plurality of fastening members that are installed on the outer peripheral edge of the heat dissipation plate, the flow path forming member, or the flow path plate, and secure the heat dissipation assembly structure to the housing such that the flow path plate faces the housing.

[0017] In one embodiment, the inlet and outlet chambers are triangular in shape and symmetrical to each other.The heat sink plate, the flow path forming member and the flow path plate are made of metal material.

[0018] To achieve the above objective, the present invention further provides a liquid cooling module, comprising a heat dissipation plate, a flow path forming member, and a flow path plate. The heat dissipation plate has a top surface, a bottom surface, and a plurality of columnar heat dissipation fins, the top and bottom surfaces being opposite each other, with the columnar heat dissipation fins located on the bottom surface, and the top surface of the heat dissipation plate being used for direct heat dissipation. The flow path forming member is located on the bottom surface of the heat dissipation plate and combines with the columnar heat dissipation fins to form cooling flow paths. The flow path plate is assembled to be in close contact with the bottom surface of the heat dissipation plate or the flow path forming member. The flow path plate has an inlet, an outlet, an inlet chamber, and an outlet chamber, the inlet and outlet communicating with the inlet chamber and the outlet chamber, respectively, the inlet and outlet chambers communicating with each other via cooling flow paths, and the inlet and outlet communicating with the outside via an inlet pipe and an outlet pipe, respectively.

[0019] In one embodiment, the heat dissipation plate, the flow passage member, and the flow passage plate are made of a metal material, and are joined together by brazing, diffusion bonding, friction stir welding, laser welding, or ultrasonic welding.

[0020] In one embodiment, the power modules are spaced apart along a first direction and mounted on the top surface of the heat dissipation plate, and the cooling channels communicate with the inlet chamber and the outlet chamber along a second direction, and the first direction is perpendicular to the second direction.

[0021] In one embodiment, the plurality of power modules, heat dissipation plates, flow path forming members, and flow path plates are stacked by welding along a third direction to form an integrated elongated structure, and the third direction is perpendicular to the first direction and the second direction. [Brief explanation of the drawings]

[0022] The following detailed description of the present invention and schematic diagrams of embodiments are intended to enable those skilled in the art to more fully understand the above content, and are not intended to limit the present invention. [Figure 1] 1 is a perspective view of a heat dissipation assembly structure according to a first embodiment of the present invention; [Figure 2] 1 is an exploded view of a heat dissipation assembly structure according to a first embodiment of the present invention; [Figure 3] 1 is an exploded view of a heat dissipation assembly structure according to a first embodiment of the present invention; [Figure 4] 3 is a schematic view showing the flow direction of the cooling fluid in the inlet and outlet chambers in the first embodiment of the present invention; FIG. [Figure 5] 3 is a schematic view showing the flow direction of the cooling fluid in the cooling channel according to the first embodiment of the present invention; [Figure 6] 10 is a cross-sectional view of a heat dissipation assembly structure according to a second embodiment of the present invention; DETAILED DESCRIPTION OF THE INVENTION

[0023] Several exemplary embodiments embodying the features and advantages of the present invention are detailed in the following description. It should be understood that the present invention is susceptible to various modifications in different aspects, all of which do not depart from the scope of the present invention, and that the descriptions and drawings herein are illustrative in nature and not limiting of the present invention. For example, in the following description, when a first feature is described as being located on or above a second feature, this can be interpreted to include embodiments in which the first and second features are in direct contact with each other, or embodiments in which an additional feature is located between the first and second features, thereby preventing the first and second features from being in direct contact with each other. Furthermore, different embodiments herein may use repeated symbols and / or labels. The repetition of these symbols or labels is for the purposes of simplicity and clarity and does not limit the relationship between the embodiments and / or the described external structures. Furthermore, spatially related terms such as "top," "bottom," "top," "bottom," "front," "rear," and similar terms may be used to describe the relationship of one component or feature to another component or feature in the drawings. In addition to the orientation depicted in the drawings, spatially related terms are intended to indicate different orientations of the device during use or operation. The device may also be positioned differently (e.g., rotated 90 degrees or at other orientations), and the spatially related terms used should be interpreted accordingly. Furthermore, when a component is described as being "connected" or "coupled" to another component, it may be directly connected or coupled to the other component, or intervening components may be present. While the broad ranges and parameters herein are approximations, specific examples describe numerical values ​​as precisely as possible. Furthermore, while terms such as "first" and "second" may be used to describe different components in the claims, it should be understood that these components should not be limited by these terms, and that correspondingly described components in the embodiments may be represented by different component reference numerals. These terms are used to distinguish between different components.For example, a first element may be termed a second element, and similarly, a second element may be termed a first element without departing from the scope of the embodiments. The term "and / or" as used in this manner may include any and all combinations of one or more of the associated listed items.

[0024] FIG. 1 is a three-dimensional structural diagram of a heat dissipation assembly structure according to a first embodiment of the present invention. FIGS. 2 and 3 are exploded three-dimensional structural diagrams of the heat dissipation assembly structure according to the first embodiment of the present invention. FIG. 4 is a schematic diagram illustrating the flow direction of a cooling fluid in the inlet and outlet chambers of the first embodiment of the present invention. FIG. 5 is a schematic diagram illustrating the flow direction of a cooling fluid in the cooling channel of the first embodiment of the present invention. Please refer to FIGS. 1 to 5. In this embodiment, the present invention provides a sealed integrated heat dissipation assembly structure 1 for an inverter. The heat dissipation assembly structure 1 includes a heat dissipation plate 10, a plurality of power modules 20a, 20b, and 20c, a channel-forming member 30, a channel plate 40, an inlet pipe 51, and an outlet pipe 52. The heat dissipation plate 10 includes a top surface 11, a bottom surface 12, and a plurality of columnar pin fins 13. The top surface 11 and the bottom surface 12 are opposite each other, and the columnar pin fins 13 are provided on the bottom surface 12. The power modules 20a, 20b, and 20c are spaced apart along a first direction (i.e., the X-axis direction) and are directly attached to the top surface 11 of the heat dissipation plate 10 by soldering, brazing, ultrasonic welding, laser welding, or diffusion bonding. The joining surfaces of the two are joined with a solder material, which effectively reduces the thermal resistance of the contact surface. In this embodiment, the flow path forming member 30 is attached to the bottom surface 12 of the heat dissipation plate 10 and forms a cooling flow path in combination with a plurality of columnar heat dissipation fins 13. The bottom surface 12 of the heat dissipation plate 10 and the top surface 31 of the flow path forming member 30 are joined together by brazing, diffusion bonding, friction stir welding, laser welding, or ultrasonic welding. The formed cooling flow path includes a plurality of flow distribution chambers 14a, 14b, and 14c disposed between the bottom surface 12 of the heat dissipation plate 10 and the flow path forming member 30. In this embodiment, the multiple flow distribution chambers 14a, 14b, and 14c are arranged at intervals along the first direction (i.e., the X-axis direction) and are capable of thermal conduction with the multiple power modules 20a, 20b, and 20c via the heat dissipation plate 10.In another embodiment, the flow path forming member 30 is embedded in, for example, the bottom surface 12 of the heat dissipation plate 10 and partially connected to the plurality of columnar heat dissipation fins 13 to form the plurality of flow distribution chambers 14a, 14b, and 14c. The present invention is not limited thereto. In this embodiment, the flow path plate 40 is assembled in close contact with the bottom surface 32 of the flow path forming member 30, and is further assembled in close contact with the bottom surface 12 of the heat dissipation plate 10 via the top surface 31 of the flow path forming member 30. In another embodiment, the flow path forming member 30 is embedded in the bottom surface 12 of the heat dissipation plate 10, and the flow path plate 40 is assembled in close contact directly with the peripheral portion of the bottom surface 12 of the heat dissipation plate 10. The heat dissipation plate 10, the flow path forming member 30, and the flow path plate 40 are all made of metal, and can be integrally assembled by brazing, diffusion bonding, friction stir welding, laser welding, or ultrasonic welding to form the liquid cooling module 2 having an elongated structure with opposing long sides L1 and L2 and opposing short sides S1 and S2.

[0025] In this embodiment, the flow path plate 40 includes an inlet 43, an outlet 44, an inlet chamber 41, and an outlet chamber 42. The inlet 43 and the outlet 44 are connected to the inlet chamber 41 and the outlet chamber 42, respectively, and the inlet chamber 41 and the outlet chamber 42 are connected to each other via the plurality of branch chambers 14a, 14b, and 14c of the cooling flow path. The inlet pipe 51 and the outlet pipe 52 are connected to the inlet 43 and the outlet 44, respectively. Note that in this embodiment, the heat dissipation plate 10 and the flow path forming member 30 are further combined (joined) to form a plurality of first communication ports 33a, 33b, and 33c and a plurality of second communication ports 34a, 34b, and 34c. The plurality of first communication ports 33a, 33b, and 33c and the plurality of second communication ports 34a, 34b, and 34c are all elongated holes and extend along a first direction (i.e., the X-axis direction). In this embodiment, the first communication ports 33a, 33b, and 33c are provided adjacent to the long side L1 and spaced apart along the first direction (i.e., the X-axis direction). The second communication ports 34a, 34b, and 34c are provided adjacent to the long side L2 and spaced apart along the first direction (i.e., the X-axis direction). The first communication ports 33a, 33b, and 33c and the second communication ports 34a, 34b, and 34c are provided corresponding to opposite ends of the flow division chambers 14a, 14b, and 14c along the second direction (i.e., the Y-axis direction), respectively, and the second direction is perpendicular to the first direction. In this embodiment, the inflow chamber 41 is connected to a plurality of diversion chambers 14a, 14b, 14c via a plurality of first communication ports 33a, 33b, 33c, and the plurality of diversion chambers 14a, 14b, 14c are connected to the outflow chamber 42 via a plurality of second communication ports 34a, 34b, 34c.

[0026] In this embodiment, the flow path forming member 30 further includes a plurality of ridge members 35 extending along a first direction (i.e., the X-axis direction). The ridge members 35 are spaced apart from one another in a second direction (i.e., the Y-axis direction) and spatially oppose the plurality of columnar heat dissipation fins 13 on the bottom surface 12 of the heat dissipation plate 10. In this embodiment, the heat dissipation plate 10, the flow path forming member 30, and the flow path plate 40 are stacked by welding along a third direction (i.e., the Z-axis direction) to form an integrated liquid cooling module 2 having an elongated structure, where the third direction is perpendicular to the first and second directions. The plurality of ridge members 35 of the flow path forming member 30 and the plurality of columnar heat dissipation fins 13 of the heat dissipation plate 10 are further assembled along the third direction (i.e., the Z-axis direction) to form flow diversion chambers 14a, 14b, and 14c having a fluid acceleration function.

[0027] In this embodiment, the number of the multiple flow-diversion chambers 14a, 14b, 14c, the number of the multiple first communication ports 33a, 33b, 33c, and the number of the multiple second communication ports 34a, 34b, 34c are all equal, three in total. The flow-diversion chamber 14a, the first communication port 33a, and the second communication port 34a correspond to form a flow path F1. The flow-diversion chamber 14b, the first communication port 33b, and the second communication port 34b correspond to form a flow path F2. The flow-diversion chamber 14c, the first communication port 33c, and the second communication port 34c correspond to form a flow path F3. The three flow paths F1, F2, and F3 are connected in parallel between the inlet chamber 41 and the outlet chamber 42, and the flow directions of the three flow paths F1, F2, and F3 are perpendicular to the first direction (X-axis direction) and parallel to the Y-axis direction. Of course, the present invention is not limited to this.

[0028] In this embodiment, the flow channel plate 40 further includes a partition 45, which is inclined relative to the first direction (i.e., the X-axis direction) and the second direction (i.e., the Y-axis direction) and is configured to divide the internal space of the flow channel plate 40 into an inlet chamber 41 and an outlet chamber 42. The partition 45 allows the inlet chamber 41 and the outlet chamber 42 to have a triangular shape and be symmetrical to each other. In this embodiment, the inlet 43 is located adjacent to the short side S1 of the elongated structure, and the outlet 44 is located adjacent to the short side S2 of the elongated structure. Therefore, the inlet 43 and the outlet 44 are arranged approximately along the first direction (i.e., the X-axis direction) on the elongated structure. Of course, the present invention is not limited to this.

[0029] In this embodiment, the flow path plate 40 further includes a flow dividing structure 46, which is disposed in the inlet chamber 41. One end of the flow dividing structure 46 is connected to the partition wall 45, and the other end of the flow dividing structure 46 extends in the second direction (i.e., the Y-axis direction). The flow dividing structure 46 is configured to divide the flow of the first communication ports 33a, 33b, and 33c, and the parallel flow paths F1, F2, and F3 can better meet the heat dissipation needs of the power modules 20a, 20b, and 20c arranged in a single direction. Of course, in other embodiments, the flow dividing structure 46 may be disposed in the outlet chamber 42 and configured to divide the flow of the second communication ports 34a, 34b, and 34c; however, the present invention is not limited thereto.

[0030] In this embodiment, the heat dissipation assembly structure 1 is applied to an inverter. To accommodate the heat dissipation needs of multiple power modules 20a, 20b, and 20c arranged in a single direction in the inverter, the power modules 20a, 20b, and 20c and the heat dissipation plate 10, flow path forming member 30, and flow path plate 40 of the liquid-cooled module 2 are integrally assembled using processes such as brazing, diffusion bonding, friction stir welding, laser welding, and ultrasonic welding to form an integrated, elongated structure, reducing thermal resistance between components and providing horizontal parallel flow paths. The heat dissipation assembly structure 1 for the power modules 20a, 20b, and 20c and the liquid-cooled module 2 is further constructed on an inverter housing. In this embodiment, the heat dissipation assembly structure 1 includes multiple fastening members 60. The multiple fastening members 60 are provided on the outer periphery of the flow path forming member 30 of the liquid-cooled module 2. The housing 9 also includes multiple mounting posts 93 to spatially accommodate the multiple fastening members 60. By engaging the fastening members 60 with the corresponding mounting posts 93, the liquid cooling module 2 of the heat dissipation assembly structure 1 can be fixed to the housing 9, and the bottom of the flow path plate 40 can be attached to the housing 9. Meanwhile, the housing 9 further includes two openings 91 and 92, which spatially face the inlet 43 and the outlet 44 on the flow path plate 40, respectively. This allows the inlet pipe 51 and the outlet pipe 52 to be connected to the inlet 43 and the outlet 44, respectively, via quick connectors along the third direction (i.e., the Z-axis direction). Note that the direction in which the inlet pipe 51 and the outlet pipe 52 are connected to the inlet 43 and the outlet 44 is not limited to this.

[0031] In this embodiment, the power modules 20a, 20b, and 20c are further applied to, for example, three power devices of a multi-phase inverter and configured to output driving current for a motor. Because each power device requires separate input and output electrical connections, they must be arranged in a single direction and are electrically connected to the outside through both long sides L1 and L2 of the heat dissipation assembly structure 1. To meet the heat dissipation needs of the multiple power modules 20a, 20b, and 20c arranged in a single direction, the multiple power modules 20a, 20b, and 20c are mounted on the top surface 11 of the heat dissipation plate 10, arranged along a first direction (i.e., the X-axis direction), and can conduct heat to the multiple columnar heat dissipation fins 13. If the multiple power modules 20a, 20b, and 20c are power devices of the aforementioned multi-phase inverter, they can be electrically connected to the outside through the long sides L1 and L2. However, the present invention is not limited to this.

[0032] In this embodiment, cooling fluid (not shown) enters the inlet chamber 41 through the inlet port 43 via the inlet pipe 51. The flow-diverting structure 46 in the inlet chamber 41 divides the cooling fluid evenly, allowing it to pass through the first communication ports 33a, 33b, and 33c and enter the diversion chambers 14a, 14b, and 14c. The cooling fluid in the diversion chambers 14a, 14b, and 14c is acted upon by the ridge members 35 of the flow-path forming member 30 and exchanges heat with the columnar heat dissipation fins 13, dissipating heat to the power modules 20a, 20b, and 20c. The cooling fluid in the diversion chambers 14a, 14b, and 14c then merges with the outlet chamber 42 via the second communication ports 34a, 34b, and 34c, respectively. Finally, the cooling fluid is discharged through the outlet port 44 and the outlet pipe 52.

[0033] In this embodiment, the multiple diversion chambers 14a, 14b, 14c form multiple lateral flow paths F1, F2, F3 along the second direction (i.e., the Y-axis direction) corresponding to the first communication ports 33a, 33b, 33c on the long side L1 and the second communication ports 34a, 34b, 34c on the long side L2. Due to the design of the inlet chamber 41, the outlet chamber 42, and the diversion structure 46, the multiple lateral flow paths F1, F2, F3 are connected in parallel between the inlet chamber 41 and the outlet chamber 42, i.e., can provide cooling fluid with equal flow rates, thereby dissipating heat for the multiple power modules 20a, 20b, 20c, respectively. The flow direction of the multiple lateral flow channels F1, F2, F3 is perpendicular to the extension direction of the long sides L1, L2, and is not designed to extend along the long sides. By adopting a short path design, the lateral flow channels F1, F2, F3 of the multiple flow distribution chambers 14a, 14b, 14c flow along the shortest path on the elongated liquid cooling module 2, shortening the flow path length and helping to achieve the goal of improving uniform heat dissipation performance. As a result, the inlet 43 and outlet 44 can provide cooling fluid inflow and outflow close to the short sides S1, S2, respectively. In this embodiment, the first communication ports 33a, 33b, 33c and the second communication ports 34a, 34b, 34c are all slotted holes extending along a first direction (i.e., the X-axis direction). The first communication ports 33a, 33b, 33c and the second communication ports 34a, 34b, 34c and the diverter chambers 14a, 14b, 14c have the same width W in the first direction. The formed flow paths F1, F2, F3 form uniform diverter flows, and the power modules 20a, 20b, 20c of the corresponding diverter chambers 14a, 14b, 14c in the heat dissipation assembly structure 1 have approximately equal heat dissipation conditions. The heat generated by the power modules 20a, 20b, 20c can be quickly and uniformly removed, effectively improving the overall heat dissipation efficiency.

[0034] FIG. 6 is a cross-sectional view of a heat dissipation assembly structure according to a second embodiment of the present invention. In this embodiment, the heat dissipation assembly structure 1a and the liquid-cooled module 2a are substantially similar in structure to the heat dissipation assembly structure 1 and the liquid-cooled module 2 shown in FIGS. 1 to 5. The same reference numerals denote the same components, structures, and functions, and therefore detailed descriptions are omitted. See FIGS. 4, 5, and 6. In this embodiment, the power module 20 is soldered to the top surface 11 of the heat dissipation plate 10 using solder material 21. The flow path-forming member 30a is embedded in the bottom surface 12 of the heat dissipation plate 10a by welding, forming a plurality of flow-division chambers 14a, 14b, and 14c, a plurality of first communication ports 33a, 33b, and 33c, and a plurality of second communication ports 34a, 34b, and 34c, as shown in FIG. 5. Of course, the number and dimensions of the flow-dividing chambers 14a, 14b, 14c, the first communication ports 33a, 33b, 33c, and the second communication ports 34a, 34b, 34c, as well as the dimensions, type, and arrangement of the columnar heat-dissipating fins 13 and ridge members 35, can all be modified according to actual needs, and the present invention is not limited thereto. After welding the flow-path forming member 30a to the heat-dissipating plate 10a, parallel flow paths F1, F2, and F3 with uniform flow rates can be formed, meeting the heat-dissipating needs of multiple power modules 20 arranged in a single direction. The bottom surface 12 of the heat-dissipating plate 10a is further welded to the flow-path plate 40a, forming the inlet 43, outlet 44, inlet chamber 41, and outlet chamber 42, as shown in FIG. 4. Of course, the dimensions, shapes, and arrangements of the inlet 43, outlet 44, inlet chamber 41, and outlet chamber 42 can all be modified according to actual needs, and the present invention is not limited thereto. Furthermore, in this embodiment, the opening direction of the inlet 43 is not limited to the third direction (i.e., the Z-axis direction). As shown in FIG. 6, the opening direction of the inlet 43 is, for example, the second direction (i.e., the Y-axis direction). Depending on the opening direction of the inlet 43, the inlet pipe 51 can be connected to the inlet 43 along the second direction using a quick connector. Of course, the flow path through which the liquid cooling module 2a guides the cooling fluid 70 to the cooling flow path can be changed according to actual needs, and the present invention is not limited thereto.In addition, the present invention can be achieved by simply assembling the power module 20, heat dissipation plate 10a, flow path forming member 30a, and flow path plate 40a by welding to form a sealed integrated heat dissipation assembly structure 1a including the power module 20 and liquid cooling module 2a. The liquid cooling module 2a can be fixed to the housing 9 by engaging the fasteners 60 with the corresponding mounting posts 93. The welding order and method of the power module 20, heat dissipation plate 10a, flow path forming member 30a, and flow path plate 40a, as well as the assembly method with the housing 9, can all be modified according to actual needs. However, the present invention is not limited to this, and a detailed description thereof will be omitted.

[0035] As described above, the present invention provides a heat dissipation assembly structure and its liquid-cooled module, which utilizes a sealed, integrated structure to simplify system design, reduce volume and weight, and reduce the risk of cooling fluid leakage. Multiple power modules are directly soldered to the top surface of the heat dissipation plate, and the joining surfaces are connected with solder, effectively reducing the thermal resistance of the contact surfaces. The heat dissipation plate, flow path-forming member, and flow path plate are also integrally assembled by welding. The cooling channels formed by the columnar heat dissipation fins of the heat dissipation plate and the flow path-forming member effectively reduce the resistance of the cooling fluid, improving the heat dissipation efficiency of the heat dissipation assembly structure for multiple power modules. To meet the heat dissipation needs of multiple power modules arranged in a single direction, the heat dissipation plate, flow path-forming member, and flow path plate of the power modules and liquid-cooled modules are integrally assembled by processes such as brazing, diffusion bonding, friction stir welding, laser welding, and ultrasonic welding to form an integrated, elongated structure that reduces thermal resistance between the components and provides horizontal parallel flow paths. The heat dissipation plate and the channel-forming member divide the cooling channel into multiple diverter chambers, which connect the multiple power modules to the thermally conductive columnar heat dissipation fins. The channel plate is divided into symmetrical inlet and outlet chambers by partitions, and the diverter structure allows the cooling fluid in the inlet chamber to be equally divided, enter the multiple diverter chambers through multiple vents on adjacent long sides, and then merge into the outlet chamber through vents on another long side to discharge the cooling fluid. The multiple diverter chambers form multiple horizontal channels with corresponding vents on both long sides, and the multiple horizontal channels are connected in parallel between the inlet and outlet chambers. The cooling fluid flows through the multiple vertical ridges of the channel-forming member and provides equal flow rates to each of the multiple power modules, thereby dissipating heat. The flow path direction of the multiple lateral flow paths is perpendicular to the extension direction of the long side, and is not designed to extend along the long side. By adopting a short path design, the lateral flow paths of the multiple branch chambers are located between the opposing long sides of the elongated structure, which helps to shorten the flow path length and achieve the purpose of improving uniform heat dissipation performance.In this way, the cooling channel inlet and the cooling channel outlet can respectively provide the inflow and outflow of the cooling fluid from different ends of the long side. Furthermore, the vents arranged along the opposite long sides and the diversion chambers communicating therewith have the same width, and the formed channels ensure that the electronic devices in the corresponding diversion chambers in the heat dissipation assembly structure have approximately the same heat dissipation conditions due to the uniform flow diversion provided by at least one diversion structure, thereby quickly and uniformly removing the heat generated by the multiple electronic devices and effectively improving the overall heat dissipation efficiency.

[0036] Various modifications of the present invention may be made by those skilled in the art, and all such modifications are within the scope of the appended utility model claims. [Explanation of symbols]

[0037] 1, 1a: Heat dissipation assembly structure 2, 2a: Liquid cooling module 10, 10a: Heat dissipation plate 11:Top surface 12: Bottom 13: Column-shaped heat dissipation fin 14a, 14b, 14c: Flow dividing chamber 20, 20a, 20b, 20c: Power module 21: Solder material 30, 30a: flow path forming member 31:Top surface 32: Bottom 33a, 33b, 33c: 1st communication port 34a, 34b, 34c: 2nd communication port 35: Ridge member 40, 40a: flow path plate 41: Inflow chamber 42: Outflow chamber 43:Inlet 44: Outlet 45: Bulkhead 46: Diversion structure 51: Inlet pipe 52: Outlet pipe 60: Fastening member 70: Cooling fluid 9: Housing 91,92:Aperture 93: Mounting post F1, F2, F3: Flow path L1, L2: Long sides S1, S2: Short side W: Width X, Y, Z: Axes

Claims

1. A heat dissipation assembly structure comprising a heat dissipation plate, a plurality of power modules, a flow path forming member, a flow path plate, an inlet pipe, and an outlet pipe; the heat sink has a top surface, a bottom surface and a plurality of columnar heat dissipation fins, the top surface and the bottom surface being two opposite surfaces, and the plurality of columnar heat dissipation fins are disposed on the bottom surface; the plurality of power modules are directly mounted on the top surface of the heat sink; the flow path forming member is installed on the bottom surface of the heat dissipation plate, and forms a cooling flow path in combination with the plurality of columnar heat dissipation fins; the flow path plate is assembled to be in close contact with the bottom surface of the heat sink, the flow path plate has an inlet, an outlet, an inlet chamber, and an outlet chamber, the inlet is connected to the inlet chamber, the outlet is connected to the outlet chamber, and the inlet chamber and the outlet chamber are connected to each other by the cooling flow path; The heat dissipation assembly structure, wherein the inlet pipe is connected to the inlet, and the outlet pipe is connected to the outlet.

2. 2. The heat dissipation assembly structure of claim 1, wherein the plurality of power modules are directly mounted on the top surface of the heat dissipation plate by soldering, brazing, ultrasonic welding, laser welding, or diffusion welding, and the heat dissipation plate, the flow path forming member, and the flow path plate are integrally assembled by brazing, diffusion welding, friction stir welding, laser welding, or ultrasonic welding.

3. 2. The heat dissipation assembly structure of claim 1, wherein the cooling flow path comprises a plurality of diverter chambers disposed between the bottom surface of the heat dissipation plate and the flow path forming member, the plurality of diverter chambers being spaced apart along a first direction and capable of thermal conduction with the plurality of power modules via the heat dissipation plate.

4. 4. The heat dissipation assembly structure of claim 3, wherein the heat dissipation plate and the flow path forming member combine to form a plurality of first communication ports and a plurality of second communication ports, the plurality of first communication ports and the plurality of second communication ports are arranged corresponding to two opposite ends of the plurality of diverter chambers along a second direction, the second direction is perpendicular to the first direction, the inlet chamber is connected to the plurality of diverter chambers through the plurality of first communication ports, and the plurality of diverter chambers are connected to the outlet chamber through the plurality of second communication ports.

5. 5. The heat dissipation assembly structure of claim 4, wherein the flow path plate further comprises a partition wall, the partition wall being inclined with respect to the first direction and the second direction, and dividing the internal space of the flow path plate into the inflow chamber and the outflow chamber.

6. 5. The heat dissipation assembly structure of claim 4, wherein the plurality of first communication ports and the plurality of second communication ports are elongated holes extending along the first direction, the plurality of diversion chambers, the plurality of first communication ports, and the plurality of second communication ports have equal widths in the first direction, the flow path forming member comprises a plurality of ridge members extending along the first direction, the plurality of ridge members are arranged to spatially correspond to the plurality of columnar heat dissipation fins, and the plurality of ridge members and the plurality of columnar heat dissipation fins are assembled along a third direction, and the third direction is perpendicular to the first direction and the second direction.

7. 5. The heat dissipation assembly structure of claim 4, wherein the plurality of power modules, the heat sink, the flow path forming member, and the flow path plate are stacked along a third direction by welding to form an integrated elongated structure, the third direction being perpendicular to the first direction and the second direction, and the inlet and the outlet are respectively positioned adjacent to a pair of short sides of the elongated structure.

8. 2. The heat dissipation assembly structure of claim 1, further comprising a plurality of fastening members, the plurality of fastening members being installed on the outer peripheral edge of the heat dissipation plate, the flow path forming member, or the flow path plate, and fixing the heat dissipation assembly structure to the housing so that the flow path plate faces the housing.

9. The heat dissipation assembly structure of claim 1 , wherein the inflow chamber and the outflow chamber are triangular and symmetrical to each other, and the heat dissipation plate, the flow path forming member, and the flow path plate are made of metal materials.

10. A liquid cooling module comprising a heat sink, a flow path forming member, and a flow path plate; the heat sink has a top surface, a bottom surface and a plurality of columnar heat sink fins, the top surface and the bottom surface being two opposite surfaces, the plurality of columnar heat sink fins being disposed on the bottom surface, and the top surface of the heat sink is used for heat dissipation; the flow path forming member is installed on the bottom surface of the heat sink, and forms a cooling flow path in combination with the plurality of columnar heat dissipation fins; a flow path plate assembled to the bottom surface of the heat sink or the flow path forming member, the flow path plate having an inlet, an outlet, an inlet chamber and an outlet chamber, the inlet connected to the inlet chamber, the outlet connected to the outlet chamber, the inlet and the outlet chamber connected to each other via the cooling flow path, the inlet connected to the outside via an inlet pipe, and the outlet connected to the outside via an outlet pipe.

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