Conductive heat dissipation power supply

Abstract

A conductive heat dissipation power supply device is provided that improves the heat dissipation effect of electronic elements in a power supply. [Solution] The conductive heat dissipation power supply device includes a power supply unit 3 and a heat dissipation unit 4, the power supply unit includes a power shell 31 and a power supply module arranged in the power shell, the heat dissipation unit includes a heat conductive structure 43 arranged in the power shell and a heat conductive layer 44 connected to the heat conductive structure, and the power supply module is connected to the heat conductive layer.

Description

[Technical Field]

[0001] The present invention relates to a power supply device, and more particularly to a conductive heat dissipation power supply device. [Background technology]

[0002] Today's technology is evolving day by day, and electronic devices are widely used in people's lives, and various electronic devices have a main processing circuit board (motherboard) that houses a central processing unit, memory, processing circuits, etc. Therefore, the workload, value, and importance of such a processing circuit board are more important than other electronic devices within the electronic device.

[0003] Furthermore, as computer workloads tend to increase, the computing efficiency and grade of computer components are proportional to their power consumption, and the amount of power required also increases. Most water-cooled structures currently on the market are designed for the central processing unit (CPU) and graphics processing unit (GPU). During computer operation, the central processing unit processes data, and the graphics card processes images, but both generate a large amount of heat. Therefore, computer manufacturers usually install fans or water-cooled radiators to dissipate heat from the central processing unit and graphics card, but water-cooled structures for power supplies are not commercially available.

[0004] In the early days, the electronic components inside the power supply were not densely arranged, and the power supplies used in computers were around 300 watts or less, which generated little heat and made dissipation easy, eliminating the need for a separate heat dissipation structure. However, conventional high-power power supplies can reach 1000 watts, but their overall volume does not increase significantly, and the electronic components inside are densely arranged, generating a lot of heat. If heat dissipation inside the power supply is not smooth, heat will accumulate, affecting the lifespan of the electronic components.

[0005] 1, Patent Document 1 describes a conductive heat-conducting structure 1 for a high-power power supply, which includes a magnetic core-shell 11, an induction coil 12 provided in the magnetic core-shell 11, an induction copper wire 13 connected to the induction coil 12, a power element 14 connected to the induction copper wire 13, a thermally conductive element 15 connected to the power element 14, and a heat dissipation material 16 connected to the thermally conductive element 15. Heat generated in the power element 14 is induced to the outside through the heat dissipation material 16, and can be induced to the induction coil 12 and the magnetic core-shell 11 through the induction copper wire 13.

[0006] Although the prior art has already disclosed that conductors made of copper can conduct heat, there are still the following drawbacks in practical use:

[0007] First, the heat dissipation efficiency is poor.

[0008] Currently, power supplies mainly use air cooling to dissipate heat. This method involves drilling multiple heat dissipation holes in the case or installing a cooling fan to force air into the power supply. However, because the electronic components are closely spaced, it is difficult for heat to be dissipated through the air, resulting in poor heat dissipation performance for conventional power supplies.

[0009] Second, the power element has a reduced heat dissipation effect.

[0010] Although the prior art discloses using copper to dissipate heat from power elements, the prior art transfers heat to the induction coil and the magnetic core shell, and then dissipates the heat from the power elements through a cooling system outside the shell, which makes the heat conduction path too long and reduces the heat dissipation effect of the power elements.

[0011] Third, the coil element is unable to dissipate heat.

[0012] The coils installed in current power supplies include common mode chokes / filters (EMI chokes), power factor correction inductors (PFC inductors), etc., and as the output of the power supply increases, the coils themselves generate heat, so not only does heat dissipation become necessary, but heat absorption must also be applied.

[0013] Therefore, a method for improving the heat dissipation effect of electronic components in a power supply and providing a heat dissipation structure for power components and coil components is an urgent goal that related engineers should strive for. [Prior art documents] [Patent documents]

[0014] [Patent Document 1] Taiwan Patent No. I757654B Specification Summary of the Invention [Problem to be solved by the invention]

[0015] In view of this, the present invention provides a conductive heat dissipation power supply device, which includes a power supply unit and a heat dissipation unit. [Means for solving the problem]

[0016] The power supply unit includes a power supply shell and a power supply module disposed in the power supply shell.

[0017] The heat dissipation unit includes a heat-conducting structure disposed in the power shell and a heat-conducting layer connected to the heat-conducting structure, and the power module is connected to the heat-conducting layer.

[0018] In one embodiment, the heat dissipation unit further includes a flow path base connected to the heat conduction structure, a liquid flow path defined by a combination of the flow path base and the heat conduction structure, a liquid inflow structure provided in the flow path base, and a liquid outflow structure provided in the flow path base, and the structure of the liquid flow path is curved and distributed between the heat conduction structure and the flow path base.

[0019] In one embodiment, the power supply unit further includes a liquid input opening provided in the power supply shell and a liquid output opening provided in the power supply shell, the power supply shell having a front plate, the liquid input opening and the liquid output opening being provided in the front plate, the liquid inflow structure being exposed to the outside through the liquid input opening, and the liquid outflow structure being exposed to the outside through the liquid output opening.

[0020] In one embodiment, the conductive heat dissipation power supply device further includes a fixing unit, the fixing unit including at least one first fixing body, the first fixing body being provided on the heat conduction structure, the flow path base and the power shell.

[0021] In one embodiment, the conductive heat dissipation power supply device further includes a fixing unit, the fixing unit including a second fixing sheet provided on the heat conduction structure and a second fixing body provided on the power module, and the second fixing body is connected to the second fixing sheet.

[0022] In one embodiment, the conductive heat dissipation power supply device further includes a fixing unit, the fixing unit including a third fixing body, the third fixing body being disposed on the channel base and the heat conducting structure.

[0023] In one embodiment, the heat dissipation unit further includes a liquid stop ring disposed between the flow path base and the heat conduction structure, and the liquid stop ring surrounds the liquid flow path.

[0024] In one embodiment, the power supply module includes a main power supply circuit board, an upper surface provided on the main power supply circuit board, at least one first electronic component provided on the upper surface, and at least one board opening hole provided on the main power supply circuit board and penetrating the main power supply circuit board, wherein the first electronic component is provided through the board opening hole and is in contact with the thermal conduction layer.

[0025] In one embodiment, the power supply module comprises a main power supply circuit board, a bottom surface provided on the main power supply circuit board, and at least one second electronic component provided on the bottom surface, and the second electronic component is connected to the thermally conductive layer.

[0026] In one embodiment, the material of the heat conducting structure is brass. [Effects of the Invention]

[0027] The beneficial effects of the present invention are as follows: the thermally conductive layer is in close contact with the main power circuit board and the thermally conductive structure, and can directly dissipate heat from the power module; the first electronic component is in direct contact with the thermally conductive layer through the board opening, and can directly dissipate heat from the first electronic component; and the second electronic component is disposed on the underside of the main power circuit board, and is in direct contact with the thermally conductive layer, and can directly dissipate heat from the second electronic component. [Brief explanation of the drawings]

[0028] [Figure 1] FIG. 1 is a schematic three-dimensional diagram of Patent Document 1. [Figure 2] 1 is a schematic diagram of a first embodiment of a conductive heat dissipation power supply device according to the present invention; [Figure 3] FIG. 2 is an exploded schematic diagram of the first embodiment. [Figure 4] FIG. 2 is a schematic cross-sectional side view of the first embodiment. [Figure 5] FIG. 2 is a schematic three-dimensional view of a heat dissipation unit in the first embodiment. [Figure 6]FIG. 4 is another schematic three-dimensional view of the heat dissipation unit of the first embodiment. [Figure 7] FIG. 2 is a schematic exploded view of the heat dissipation unit of the first embodiment. [Figure 8] FIG. 2 is a schematic three-dimensional view of a power supply unit in the first embodiment. [Figure 9] FIG. 3 is another schematic three-dimensional view of the power supply unit according to the first embodiment. [Figure 10] FIG. 2 is a schematic side view of the first electronic element of the first embodiment. [Figure 11] FIG. 10 is a schematic side view of the first embodiment in which another first electronic element is provided. [Figure 12] 2 is a side cross-sectional view of a second embodiment of the conductive heat dissipation power supply device of the present invention; FIG. DETAILED DESCRIPTION OF THE INVENTION

[0029] The features and technical contents of the patent application of the present invention can be explained in detail and clearly shown in the following two examples in conjunction with the drawings.

[0030] 2, 3 and 4, there is shown a first embodiment of the conductive heat dissipation power supply device of the present invention, which includes a power supply unit 3, a heat dissipation unit 4 and a fixing unit 5.

[0031] The power supply unit 3 includes a power supply shell 31, a power supply module 32 provided in the power supply shell 31, a liquid input opening 33 provided in the power supply shell 31, and a liquid output opening 34 provided in the power supply shell 31.

[0032] 5, 6 and 7, the heat dissipation unit 4 includes a flow path base 41 provided in the power supply shell 31, a liquid flow path 42 formed in the flow path base 41, a heat conductive structure 43 connected to the flow path base 41, a heat conductive layer 44 connected to the heat conductive structure 43, a liquid inflow structure 45 provided in the flow path base 41, a liquid outflow structure 46 provided in the flow path base 41, a liquid stop ring 47 provided between the flow path base 41 and the heat conductive structure 43, and a support structure 48 provided on the flow path base 41.

[0033] The fixing unit 5 includes at least one first fixing body 51, a second fixing sheet 52 provided on the heat conducting structure 43, a second fixing body 53 provided on the power supply module 32, and a third fixing body 54.

[0034] In the first embodiment, the planar shape of the liquid flow passage 42 is a U-shaped groove waterway, but in actual implementation, the structure of the liquid flow passage 42 may be other shapes and is not limited thereto. In some embodiments, the liquid inflow structure 45 may be provided with a liquid inflow sealing cap 451, and the liquid outflow structure 46 may be provided with a liquid outflow sealing cap 461, to prevent the flow passage base 41 of the liquid flow passage 42 and the heat conduction structure 43 from rusting.

[0035] The liquid inflow structure 45 is exposed to the outside through the liquid input opening 33, and the liquid outflow structure 46 is exposed to the outside through the liquid output opening 34, and the liquid inflow structure 45 and the liquid outflow structure 46 are connected to a water-cooled device. In some embodiments, the heat dissipation unit 4 and the computer are connected to a water-cooled device, and the coolant is driven to enter the liquid inflow structure 45 into the liquid flow path 42, and the coolant in the liquid flow path 42 flows back into the water-cooled device through the liquid outflow structure 46. In some embodiments, the water-cooled structure of the central processing unit (CPU), the water-cooled structure of the graphics processing unit (GPU), the cooling structure, the pump module, and the heat dissipation unit 4 are all connected in series, and the coolant flows through each of the structures.

[0036] The power module 32 is connected to the thermally conductive layer 44, which is connected to the thermally conductive structure 43, which is connected to the coolant, and the thermally conductive layer 44 and the thermally conductive structure 43 transfer the heat of the power module 32 to the coolant in the liquid flow path 42, achieving a direct heat dissipation effect. The thermally conductive structure 43 is made of brass, and the thermally conductive layer 44 is made of a commercially available thermally conductive adhesive. In actual implementation, the thermally conductive structure 43 and the thermally conductive layer 44 may be made of other thermally conductive materials, but are not limited thereto.

[0037] The liquid stop ring 47 surrounds the liquid flow path 42, and in the first embodiment, the liquid stop ring 47 is a rubber ring (O-ring) to prevent water leakage at the connection point between the flow path base 41 and the heat conduction structure 43.

[0038] The support structures 48 are distributed on the surface of the channel base 41. In the first embodiment, the bottom surface of the channel base 41 has an irregular shape. In some embodiments, the shape of the bottom surface of the channel base 41 matches the shape of the liquid channel 42, and the support structures 48 are distributed on the bottom surface of the channel base 41 to strengthen the structure of the bottom surface of the channel base 41.

[0039] The power supply shell 31 includes a front plate 311, a rear plate 312 opposite to the front plate 311, two side plates 313 connected to the front plate 311 and the rear plate 312, a bottom plate 314 connected to the front plate 311 and the rear plate 312, and a top plate 315 connected to the front plate 311 and the rear plate 312.

[0040] An AC input socket is provided on the rear plate 312, a plurality of DC output sockets are provided on one of the side plates 313, and the liquid input opening 33 and the liquid output opening 34 are provided on the front plate 311. In actual implementation, the liquid input opening 33, the liquid output opening 34 and the plurality of DC output sockets may be provided at other positions on the power supply shell 31, but are not limited thereto.

[0041] In the first embodiment, the first fixing body 51, the second fixing body 53, and the third fixing body 54 are screws, the bottom of the second fixing sheet 52 has a screw structure, and the top of the second fixing sheet 52 has a screw hole structure. In actual implementation, the heat dissipation unit 4 may use other fixing structures and is not limited thereto.

[0042] The first fixing body 51 is provided on the heat conducting structure 43, the channel base 41, and the power supply shell 31, and the first fixing body 51 fixes the heat dissipation unit 4 to the bottom surface of the power supply shell 31. In some embodiments, the first fixing body 51 passes through the heat conducting structure 43 and the channel base 41 and is then screwed to the power supply shell 31.

[0043] The second fixing body 53 is connected to the second fixing sheet 52, and the second fixing body 53 and the second fixing sheet 52 fix the power module 32 to the thermal conductive structure 43. In some embodiments, the second fixing sheet 52 is screwed to the thermal conductive structure 43, and the second fixing body 53 passes through the main power circuit board 321 of the power module 32 before being screwed to the second fixing sheet 52.

[0044] The third fixing body 54 is provided on the flow channel base 41 and the heat conducting structure 43. The third fixing body 54 fixes the heat conducting structure 43 to the flow channel base 41. In some embodiments, the third fixing body 54 passes through the flow channel base 41 and is screwed to the heat conducting structure 43.

[0045] 8 and 9, the power module 32 includes a main power circuit board 321, a side power circuit board 322 provided on the main power circuit board 321, an output assembly 323 connected to the side power circuit board 322, an upper surface 324 provided on the main power circuit board 321, a plurality of first electronic components 325 provided on the upper surface 324, a plurality of board opening holes 326 provided on the main power circuit board 321, a lower surface 327 provided on the main power circuit board 321, and a plurality of second electronic components 328 provided on the lower surface 327. In actual implementation, the numbers of the first electronic components 325, the board opening holes 326, and the second electronic components 328 may be, but are not limited to, one.

[0046] The main power supply circuit board 321 and the side power supply circuit board 322 are printed circuit boards (PCBA) equipped with electronic components, and can convert city household electricity into DC electricity for use in computers. The output assembly 323 is a plate equipped with a plurality of connection sockets for connection to computer components such as a motherboard, a disk drive, and a graphics card. The top surface 324 and the bottom surface 327 are opposite surfaces of the main power supply circuit board 321. The first electronic components 325 include, but are not limited to, two common mode chokes / filters (EMI chokes) and one power factor correction inductor (PFC inductor). The second electronic components 328 include, but are not limited to, bridge rectifier control chips (active bridges), power amplifier chips (PFC MOSFETs), Schottky diode chips (SIC DIODEs), synchronous rectification field-effect diode chips (SR MOSFETs), and resonant conversion field-effect diode chips (LLC MOSFETs).

[0047] The first component 325 is disposed through the substrate opening 326 and is in contact with the thermally conductive layer 44. 4 and 10 are side views of the first component 325 of the common mode choke / filter (EMI choke), and the first component 325 is generally located on the main power circuit board 321 and disposed through the substrate opening 326. The thermally conductive layer 44 located below the main power circuit board 321 can be in contact with the first component 325, and the thermally conductive layer 44 can directly absorb heat from the first component 325.

[0048] 4 and 11, which are side views of a first component 325 of a power factor correction inductor (PFC inductor), the first component 325 is generally located on the main power circuit board 321, the bottom of the first component 325 protrudes to the outside through the board opening hole 326, the thermally conductive layer 44 located under the main power circuit board 321 can be in contact with the first component 325, and the thermally conductive layer 44 can directly absorb heat from the first component 325.

[0049] Referring to Figures 2 and 9, the plurality of second electronic elements 328 are disposed on the lower surface 327, and the surfaces of the plurality of second electronic elements 328 are all in contact with the thermally conductive layer 44, so that the thermally conductive layer 44 can directly absorb the heat of the plurality of second electronic elements 328.

[0050] 12, the second embodiment of the conductive heat dissipation power supply device of the present invention is substantially the same as the first embodiment, and therefore will not be further described here. The difference is that the heat dissipation unit 4 does not include the flow channel base 41, the liquid flow channel 42, the liquid inflow structure 45, the liquid outflow structure 46, and the liquid stop ring 47.

[0051] The heat conducting structure 43 is disposed within the power shell 31, and is disposed at the bottom of the power shell 31, directly serving as the bottom shell of the power shell 31. In actual implementation, the power shell 31 may also serve as the bottom shell to cover the heat conducting structure 43, but is not limited thereto. In some embodiments, the heat conducting structure 43 is fixed to the power shell 31, and in some embodiments, the heat conducting structure 43 is fixed to the power module 32.

[0052] In the second embodiment, the bottom of the heat conducting structure 43 is provided with a number of protrusions to increase the heat dissipation area, which is a manual heat dissipation module. In some embodiments, a fin structure may be provided at the bottom of the heat conducting structure 43, and in some embodiments, a fan may be further provided at the bottom of the heat conducting structure 43 to form an active heat dissipation module.

[0053] The main power circuit board 321 is accommodated in the power shell 31, the first electronic component 325 is in contact with the thermally conductive layer 44 through the board opening 326, and the second electronic component 328 is located at the bottom of the main power circuit board 321 and in contact with the thermally conductive layer 44. The heat from the first electronic component 325 and the second electronic component 328 is transferred to the thermally conductive layer 44 and then transferred back to the thermally conductive structure 43 for dissipation.

[0054] As can be seen from the above description, the conductive heat dissipation power supply device of the present invention certainly has the following advantages:

[0055] First, it has excellent heat dissipation properties.

[0056] The liquid inflow structure 45 is arranged to allow the coolant to flow into the liquid flow path 42, and the liquid outflow structure 46 is arranged to allow the coolant from the liquid flow path 42 to flow out. The power supply module 32 is connected to the thermally conductive layer 44, the thermally conductive layer 44 is connected to the thermally conductive structure 43, and the thermally conductive structure 43 is connected to the coolant. The thermally conductive layer 44 and the thermally conductive structure 43 transfer the heat of the power supply module 32 to the coolant in the liquid flow path 42. Even if the electronic components of the power supply module 32 are closely spaced, this does not affect the heat dissipation effect of the water-cooled system, and the heat dissipation unit 4 has excellent heat dissipation efficiency.

[0057] Second, it improves the heat dissipation effect of the power element.

[0058] In the present invention, the second electronic components 328 of the power elements are arranged on the underside 327 of the main power circuit board 321, so that the second electronic components 328 are in direct contact with the thermally conductive layer 44. The heat generated by the second electronic components 328 is directly transferred to the coolant in the liquid flow path 42, thereby improving the heat dissipation effect of the second electronic components 328.

[0059] Third, the heat dissipation effect of the coil element is improved.

[0060] The main power supply circuit board 321 is provided with a plurality of board opening holes 326, and the first electronic elements 325 of the plurality of coil elements are provided on the upper surface 324 of the main power supply circuit board 321. The bottoms of the plurality of first electronic elements 325 pass through the plurality of board opening holes 326 and are in direct contact with the thermal conduction layer 44, and the heat generated by the plurality of first electronic elements 325 is directly transferred to the cooling liquid in the liquid flow path 42, thereby improving the heat dissipation effect of the plurality of first electronic elements 325.

[0061] To summarize the above, the thermally conductive layer 44 is in close contact with the main power circuit board 321 and the thermally conductive structure 43, allowing the heat of the power module 32 to be directly transferred to the coolant; the first electronic component 325 is in direct contact with the thermally conductive layer 44 through the board opening 326, allowing the heat of the first electronic component 325 to be directly dissipated; the second electronic component 328 is mounted on the underside 327 of the main power circuit board 321, in direct contact with the thermally conductive layer 44, allowing the heat of the second electronic component 328 to be directly dissipated; and the heat dissipation unit 4 can reliably provide an excellent heat dissipation effect for the power module 32, thereby achieving the objectives of the present invention.

[0062] The above content is only two examples of the present invention, which cannot limit the scope of the present invention. Simple equivalent changes and modifications according to the claims and utility model content of the present invention still fall within the patent scope of the present invention. [Explanation of symbols]

[0063] 1. Conductive heat transfer structure 11 Magnetic Core-Shell 12 induction coil 13 Inductive copper wire 14 Power elements 15 Thermally conductive elements 16 Heat dissipation material 3 Power Supply Unit 31 Power Shell 311 Front Plate 312 Back Plate 313 Side Plate 314 Bottom Plate 315 Upper Plate 32 Power Supply Modules 321 Main power circuit board 322 Side power circuit board 323 Output Assembly 324 Top 325 First Electronic Element 326 PCB opening hole 327 Bottom surface 328 Second Electronic Element 33 Liquid input opening 34 Liquid output opening 4 Heat dissipation unit 41 Flow path base 42 Liquid flow path 43 Heat Conduction Structure 44 Thermal Conduction Layer 45 Liquid inlet structure 451 Liquid Inlet Sealing Cap 46 Liquid outflow structure 461 Liquid Spill Seal Cap 47 Liquid Stop Ring 48 Support structure 5 Fixed Unit 51 1st fixed body 52 Second fixed seat 53 Second fixed body 54 Third fixed body

Claims

1. A conductive heat dissipation power supply device, comprising: a power supply unit including a power supply shell and a power supply module disposed within the power supply shell; a heat dissipation unit including a heat conduction structure provided in the power shell and a heat conduction layer connected to the heat conduction structure, wherein the power module is connected to the heat conduction layer.

2. 2. The conductive heat dissipation power supply device of claim 1, wherein the heat dissipation unit further includes a channel base connected to the heat conductive structure, a liquid channel defined by a combination of the channel base and the heat conductive structure, a liquid inflow structure provided in the channel base, and a liquid outflow structure provided in the channel base, and the structure of the liquid channel is curved and distributed between the heat conductive structure and the channel base.

3. 3. The conductive heat dissipation power supply device of claim 2, wherein the power supply unit further includes a liquid input opening provided in the power supply shell and a liquid output opening provided in the power supply shell, the power supply shell having a front plate, the liquid input opening and the liquid output opening being provided in the front plate, the liquid inflow structure being exposed to the outside through the liquid inflow opening, and the liquid outflow structure being exposed to the outside through the liquid output opening.

4. 3. The conductive heat dissipation power supply device of claim 2, further comprising a fixing unit, the fixing unit including at least one first fixing body, the first fixing body being provided on the heat conduction structure, the channel base and the power supply shell.

5. 3. The conductive heat dissipation power supply device of claim 2, further comprising a fixing unit, the fixing unit including a second fixing sheet provided on the thermal conduction structure and a second fixing body provided on the power module, the second fixing body being connected to the second fixing sheet.

6. The conductive heat dissipation power supply device according to claim 2 , further comprising a fixing unit, the fixing unit including a third fixing body, the third fixing body being mounted on the channel base and the heat conducting structure.

7. The conductive heat-dissipating power supply device of claim 2 , wherein the heat-dissipating unit further comprises a liquid stop ring disposed between the flow path base and the heat-conducting structure, the liquid stop ring surrounding the liquid flow path.

8. 2. The conductive heat dissipation power supply device of claim 1, wherein the power module comprises a main power circuit board, an upper surface provided on the main power circuit board, at least one first electronic component provided on the upper surface, and at least one board opening hole provided on the main power circuit board and penetrating the main power circuit board, the first electronic component being provided through the board opening hole and in contact with the thermal conductive layer.

9. 2. The conductive heat dissipation power supply device of claim 1, wherein the power module comprises a main power circuit board, a bottom surface provided on the main power circuit board, and at least one second electronic component provided on the bottom surface, the second electronic component being connected to the thermally conductive layer.

10. 2. The conductive heat dissipation power supply device as claimed in claim 1, wherein the material of the heat conducting structure is brass.

Images