Air-cooled heat dissipation device

Abstract

This invention provides an air-cooled heat dissipation device that improves the mounting stability of the fan unit, enhances heat dissipation efficiency, improves strength, and reduces the risk of deformation of the metal fins. [Solution] The device comprises a base portion 31 positioned below the heat dissipation fin group 32, a plurality of tubular bodies 33 provided on the base portion 31 and extending outward through the heat dissipation fin group 32, and a fan unit 34 provided on the heat dissipation fin group 32. The heat dissipation fin group 32 is made up of a plurality of integrally formed metal fins 32', each metal fin 32' having a fin body with a through hole, and the heat dissipation fin group 32 is formed by stacking the fin bodies, defining a housing space 323 that communicates with the outside through the interconnected through holes. The fan unit 34 comprises a first fan 341 provided in the housing space 323 and a second fan 342 provided on one side of the heat dissipation fin group 32, and the first fan 341 and the second fan 342 are fixed to the heat dissipation fin group 32 via fastening parts 4.

Description

Technical Field

[0001] The present invention relates to a heat dissipation structure, and more particularly to an air-cooled heat dissipation device for dissipating heat and cooling an external device.

Background Art

[0002] In recent years, as the computing capabilities of central processing units (CPUs), graphics processing units (GPUs), and other high-performance electronic devices continue to improve, the amount of heat generated during operation has also increased significantly. If the heat generated by electronic devices cannot be discharged in a timely and effective manner, it may lead to a decrease in the performance of the electronic devices, instability of the system, and ultimately a shortening of the service life. Therefore, a heat dissipation device has become an indispensable component in modern electronic devices.

[0003] Among these, air-cooled radiators are the most widely adopted in the market because of their relatively simple structure and low cost. Referring to FIG. 1, a conventional dual-tower type radiator 1 adopting an air-cooling method includes a base portion 11, two groups of heat dissipation fins 12 arranged at intervals from each other, a plurality of tubes 13 provided on the base portion 11 and extending outward to penetrate the heat dissipation fin groups 12, and a fan unit 14 provided on the heat dissipation fin groups 12. The fan unit 14 has a first fan 141 disposed between the two groups of heat dissipation fins 12 and a second fan 142 provided on one side of one of the groups of heat dissipation fins 12. Each group of heat dissipation fins 12 is composed of a plurality of metal fins 12' stacked together, and the first fan 141 and the second fan 142 are respectively attached to the heat dissipation fin groups 12 by a locking method using a wire 2. In this way, by closely attaching the base portion 11 to an electronic device (not shown), the base portion 11 absorbs the heat of the electronic device, and heat exchange is performed between the heat and the working medium inside the tube 13, thereby changing the working medium from a liquid to a gas and dissipating the heat to the outside.

[0004] However, conventional dual-tower type heat sinks 1 as described above have a problem in actual use: because the heat sink fins 12 are independently structured, they are prone to deformation due to external forces such as compression and vibration during manufacturing, assembly, and transportation. In particular, after the dual-tower type heat sink 1 is installed inside the enclosure, vibrations during transport and delivery may cause the metal fins 12' to bend or become misaligned. Furthermore, the metal fins 12' are typically formed by press-forming aluminum or copper plates with a thickness of approximately 0.3 to 0.5 mm, and because their structural rigidity is limited, they cannot adequately withstand external forces. Furthermore, with wire 2, the first fan 141 and the second fan 142 cannot be securely fixed to the heat dissipation fin group 12, and during transport, installation, or use, the first fan 141 and the second fan 142 may shake, make abnormal noises, or even fall off. In addition, since the first fan 141 is positioned between the heat dissipation fin groups 12, if any of the metal fins 12' on the heat dissipation fin groups 12 deform and become misaligned, they are highly likely to interfere with the first fan 141, which could result in the first fan 141 not functioning properly. Furthermore, since the heat dissipation fin group 12 needs to be manufactured separately as two independent units and then assembled during the manufacturing process, the process becomes more complex, leading to increased production time and costs, and ultimately reducing overall production efficiency. There is room for improvement in this regard. [Overview of the project] [Problems that the invention aims to solve]

[0005] The objective of this invention is to provide an air-cooled heat dissipation device that effectively improves the stability of fan unit mounting, enhances heat dissipation efficiency, and improves the overall structural strength through the design of an integrated molded structure for the heat dissipation fin group, thereby reducing the risk of deformation of the metal fins during transportation and installation. [Means for solving the problem]

[0006] The air-cooled heat dissipation device of the present invention comprises a group of heat dissipation fins having an upper surface and a lower surface, a base portion disposed below the group of heat dissipation fins, a plurality of tubular bodies provided on the base portion and extending outward through the group of heat dissipation fins, and a fan unit provided on the group of heat dissipation fins. The group of heat dissipation fins is formed by integrally forming a plurality of metal fins, each of which has a fin body and a through hole formed in the fin body. The group of heat dissipation fins is formed by stacking the fin bodies of the plurality of metal fins on each other, and when the fin bodies are stacked, a housing space is defined in which the through holes of the metal fins communicate with each other and communicate with the outside. The fan unit comprises a first fan provided in the housing space and a second fan provided on one side of the group of heat dissipation fins, and the first fan and the second fan are each fixed to the group of heat dissipation fins via a plurality of fastening components.

[0007] As a further improvement of the present invention, the fan unit is provided with a mounting plate located at the upper end of the first fan, and when the first fan is positioned within the housing space, the mounting plate abuts against the upper surface of the heat dissipation fin group.

[0008] As a further improvement of the present invention, the second fan of the fan unit has a plurality of connecting parts protruding from one side facing the heat dissipation fin group, and these connecting parts are provided on the edge of the second fan, and these connecting parts are fixed to the upper and lower surfaces of the heat dissipation fin group via the fastening parts.

[0009] As a further improvement of the present invention, the heat dissipation fin group is provided with a cover group, the cover group comprising an upper cover, a middle cover connected to the upper cover and provided on the upper surface of the heat dissipation fin group, and a lower cover provided on the bottom surface of the heat dissipation fin group, the through hole, the housing space and the first fan are shielded by the cover group.

[0010] As a further improvement of the present invention, the cover group is equipped with a magnetic component on the middle cover, and the middle cover is fixed to the upper surface of the heat dissipation fin group by magnetic force.

[0011] As a further improvement to the present invention, a locking device for fixing the base portion to an external device is provided below the base portion.

[0012] As a further improvement of the present invention, the tubular body provided between the base portion and the heat dissipation fin group is inclined, and is positioned so that the center reference line of the heat dissipation fin group and the center reference line of the base portion are offset from each other. [Effects of the Invention]

[0013] The air-cooled heat dissipation device of this invention has a heat dissipation fin group as an integrally molded structure, and by forming a housing space in the heat dissipation fin group, the first fan and the second fan can be arranged with a gap between them on one side of the housing space and the heat dissipation fin group. This effectively improves the strength of the overall structure, reduces the risk of deformation of the metal fins during transportation and installation, improves the mounting stability of the fan unit, prevents shaking and abnormal noise caused by insufficient fixing of the fan unit, and improves heat dissipation efficiency. [Brief explanation of the drawing]

[0014] [Figure 1] This is an overview perspective of a conventional dual-tower type heat sink. [Figure 2] This is an exploded perspective view of an air-cooled heat dissipation device according to an embodiment of the present invention. [Figure 3] This is a perspective view of a metal fin according to an embodiment of the present invention. [Figure 4] This is a cross-sectional view of an air-cooled heat dissipation device according to an embodiment of the present invention. [Figure 5] This is a side view showing the assembled state of an air-cooled heat dissipation device according to an embodiment of the present invention. [Figure 6] This is another exploded perspective view of an air-cooled heat dissipation device according to an embodiment of the present invention.

Best Mode for Carrying Out the Invention

[0015] Hereinafter, in order to clarify the technical content of the present invention, embodiments of the present invention will be described in detail with reference to the drawings. It is needless to say that the present invention is not limited to the embodiments described below.

[0016] As shown in FIG. 2, an air-cooled heat dissipation device 3 according to an embodiment of the present invention includes a base portion 31, a heat dissipation fin group 32 disposed above the base portion 31, a plurality of tubes 33 provided on the base portion 31 and extending outward to penetrate the heat dissipation fin group 32, a fan unit 34 provided on the heat dissipation fin group 32, and a cover group 35 provided on the heat dissipation fin group 32.

[0017] The base portion 31 is made of a metal material having high thermal conductivity, is attached on an electronic device (not shown), receives heat generated from the electronic device, and is configured to conduct heat through the tubes 33. The tubes 33 are respectively connected to the base portion 31 and the heat dissipation fin group 32 and are provided to penetrate them. The inside of the tubes 33 is filled with a working medium for heat exchange. The working medium has characteristics of being easy to evaporate and condense and flows and circulates between the base portion 31 and the heat dissipation fin group 32 through the tubes 33. Also, in the present embodiment, a locking tool 31a is provided on the bottom surface of the base portion 31, whereby the base portion 31 is positioned and fixed with respect to the electronic device and contacts the electronic device.

[0018] Furthermore, in the present embodiment, as shown in FIG. 5, the tubes 33 disposed between the base portion 31 and the heat dissipation fin group 32 are disposed obliquely, whereby the center reference line 32L of the heat dissipation fin group 32 is displaced from the center reference line 31L of the base portion 31. That is, the center reference line 32L of the heat dissipation fin group and the center reference line 31L of the base portion are not aligned and are disposed at displaced positions. With this configuration, interference with other components or modules on the electronic device can be avoided, the overall mounting compatibility can be improved, flexible adjustment can be made according to different specifications, and interference problems that generally occur easily in the radiator can be solved.

[0019] As shown in FIGS. 2 and 3, the heat radiation fin group 32 has an upper surface 32a and a bottom surface 32b located on the side opposite to the upper surface 32a. The heat radiation fin group 32 is formed by integrally press-molding a plurality of metal fins 32', the upper surface 32a is formed by the uppermost metal fin 32', and the bottom surface 32b is formed by the lowermost metal fin 32'. Each metal fin 32' has a fin body 321 and a through hole 322 formed at the central portion of the fin body 321. These metal fins 32' are laminated on each other, and the fin bodies 321 are in close contact with each other, so that the through holes 322 communicate with each other, and an accommodation space 323 communicating with the outside is defined.

[0020] Referring to FIGS. 2 and 6, the cover group 35 includes a middle cover 351 covering the upper surface 32a of the heat radiation fin group 32, an upper cover 352 connected to the middle cover 351 and covering the upper part thereof, a lower cover 353 covering the bottom surface 32b of the heat radiation fin group 32, and a magnet component 354 provided on the middle cover 351.

[0021] As shown in FIGS. 2, 4 and 6, the fan unit 34 includes a first fan 341 disposed in the accommodation space 323, a second fan 342 disposed on one side of the heat radiation fin group 32, a mounting plate 343 provided above the first fan 341, and a plurality of coupling portions 344 protruding from the side of the second fan 342 facing the heat radiation fin group 32. The dimension of the mounting plate 343 is formed slightly larger than the dimension of the through hole 322, and the mounting plate 343 and the first fan 341 are fixed to the upper surface 32a of the heat radiation fin group 32 via a plurality of fastening components 4. Furthermore, the connecting portion 344 is provided on the upper and lower edges of the second fan 342, and the connecting portion 344 is fixed to the upper surface 32a and the lower surface 32b of the heat dissipation fin group 32, respectively, via the fastening component 4.

[0022] As shown in Figures 2 to 6, when assembling the air-cooled heat dissipation device 3, the tube 33 penetrates the inside of the base portion 31 and is positioned to sequentially penetrate each metal fin 32'. This allows the working fluid inside the tube 33 to circulate between the base portion 31 and the heat dissipation fin group 32 via the tube 33.

[0023] Furthermore, the second fan 342 is fixed to one side of the heat dissipation fin group 32 by having its connecting portion 344 fixed to the upper surface 32a and bottom surface 32b of the heat dissipation fin group 32 via fastening components 4. On the other hand, the mounting plate 343 is attached to the top of the first fan 341, and the mounting plate 343 and the first fan 341 are further fixed to the upper surface 32a of the heat dissipation fin group 32 via fastening components 4. As a result, the first fan 341 is housed in the housing space 323, and the mounting plate 343 is in contact with the upper surface 32a of the heat dissipation fin group 32.

[0024] Subsequently, the middle cover 351 is positioned above the mounting plate 343, and the magnetic force of the magnetic component 354 fixes the middle cover 351 to the upper surface 32a of the heat dissipation fin group 32. Next, the upper cover 352 is attached above the middle cover 351. As a result, the opening (i.e., through-hole 322) formed on the upper surface 32a side of the heat dissipation fin group 32 in the housing space 323 is completely covered, and the coupling portion 344 provided on the upper edge of the second fan 342 is shielded. Furthermore, by attaching the lower cover 353 to the bottom surface 32b of the heat dissipation fin group 32, the other opening (i.e., the through hole 322) formed on the bottom surface 32b side of the housing space 323 is completely covered, thereby sealing the housing space 323 and the first fan 341, and thus completing the assembly of the air-cooled heat dissipation device 3.

[0025] Referring to Figures 2 to 6, when using the air-cooled heat dissipation device 3, the base portion 31 is first fixed to the electronic device via the locking device 31a and comes into contact with the electronic device. As the electronic equipment operates, heat is generated, causing the base portion 31, which is in direct contact with the electronic equipment, to rise in temperature. Since the tube 33 penetrates the inside of the base portion 31, the working fluid inside the tube 33 can absorb the heat received by the base portion 31. The working fluid, whose temperature has risen due to heat absorption, moves through the tube 33 to the heat dissipation fin group 32, conducts heat to the metal fins 32' via the tube 33, and dissipates heat to the outside.

[0026] Furthermore, when the electronic equipment is started up, the first fan 341 located within the housing space 323 and the second fan 342 located on one side of the heat dissipation fin group 32 are driven simultaneously. As a result, the first fan 341 directly introduces cooling air into the heat dissipation fin group 32, while the second fan 342 located on the side plays a role in quickly expelling the heated air. In this way, coordinated airflow circulation is formed in the front-to-back or inward-to-outward direction, and the airflow velocity is improved, which allows heat from the metal fins 32' to be quickly dissipated to the outside, promoting heat exchange and resulting in an excellent heat dissipation effect.

[0027] In this embodiment, the heat dissipation fin group 32 is formed by integrally press-molding a plurality of metal fins 32', and the through holes 322 formed in the fin bodies 321 of these metal fins 32' constitute the housing space 323. Furthermore, the first fan 341 and the second fan 342 can be installed alternately with a gap between them, inside the housing space 323 and on one side of the heat dissipation fin group 32, respectively. Furthermore, by combining the mounting plate 343 and the connecting part 344, the first fan 341 and the second fan 342 can be securely fixed, preventing displacement due to inappropriate external forces acting on the first fan 341 and the second fan 342. In addition, the intake and exhaust flow paths are made smoother, reducing airflow turbulence and backflow, thereby improving the effective airflow and contributing to improved heat dissipation efficiency.

[0028] In addition, the overall structural strength of the air-cooled heat dissipation device 3 can be increased. In other words, conventionally, the two heat dissipation fin groups 12 were individually press-molded, laminated, and assembled before the fan unit 14 was positioned and fixed, resulting in a complicated manufacturing process that affected yield. This new design eliminates these problems. At the same time, in this embodiment, the risk of deformation of the metal fins 32' during transportation and installation is reduced, the mounting stability of the fan unit 34 is improved, oscillation and abnormal noise during operation are prevented, and heat dissipation efficiency is increased.

[0029] The air-cooled heat dissipation device of this invention improves the overall structural strength and simplifies the manufacturing and assembly processes by making the heat dissipation fin group an integrally molded structure. Furthermore, by creating a housing space for positioning the first fan within the heat dissipation fin group and directly fixing the second fan to one side of the heat dissipation fin group, the risk of the fan unit loosening, making abnormal noise, or falling off can be significantly reduced compared to the conventional method of securing it to a single fin with a wire. This prevents interference with or damage to the operation of the fan unit due to deformation of the metal fins, reduces the risk of deformation of the metal fins during transportation and installation, enhances the mounting stability of the fan unit, and enables the overall fan unit to exhibit superior heat dissipation performance. [Explanation of Symbols]

[0030] (Conventional product) 1. Dual-tower heat sink 11 Base section 12 heat dissipation fin group 13. Body 14 Fan Units 12' Metal Fins 141 First Fan 142 Second Fan 2 wires (This invention) 3. Air-cooled heat dissipation device 31 Base section 32 heat dissipation fin group 33. Body 34 Fan Units 35 Cover Groups 31a Locking device 31L Center reference line of the base 32' Metal Fin 32a top surface 32b Bottom Center reference line of the 32L heat sink fin group 321 Fin body 322 Through hole 323 Containment space 341 First Fan 342 Second Fan 343 Mounting plate 344 Joint 351 Inner cover 352 Top cover 353 Lower cover 354 Magnetic parts 4 Fastening components

Claims

1. An air-cooled heat dissipation device comprising a group of heat dissipation fins having an upper surface and a lower surface, a base portion disposed below the group of heat dissipation fins, a plurality of tubular bodies provided on the base portion and extending outward through the group of heat dissipation fins, and a fan unit provided on the group of heat dissipation fins, The heat dissipation fin group is formed by integrally forming a plurality of metal fins, each metal fin having a fin body and a through hole formed in the fin body, and the heat dissipation fin group is formed by stacking the fin bodies of the plurality of metal fins on each other, and when the fin bodies are stacked, the through holes of the metal fins communicate with each other, defining a housing space that communicates with the outside, The fan unit comprises a first fan provided within the housing space and a second fan provided on one side of the heat dissipation fin group, and the first fan and the second fan are each fixed to the heat dissipation fin group via a plurality of fastening components, characterized in that it is an air-cooled heat dissipation device.

2. The fan unit is provided with a mounting plate located at the upper end of the first fan, and the mounting plate is in contact with the upper surface of the heat dissipation fin group when the first fan is positioned within the housing space, as described in claim 1.

3. The air-cooled heat dissipation device according to claim 1, characterized in that the second fan of the fan unit has a plurality of connecting portions protruding on one side facing the heat dissipation fin group, the connecting portions are provided on the edge of the second fan, and these connecting portions are fixed to the upper and lower surfaces of the heat dissipation fin group via the fastening components.

4. The air-cooled heat dissipation device according to claim 1, wherein the heat dissipation fin group is provided with a cover group, the cover group comprising an upper cover, a middle cover connected to the upper cover and provided on the upper surface of the heat dissipation fin group, and a lower cover provided on the bottom surface of the heat dissipation fin group, the through hole, the housing space and the first fan are shielded by the cover group.

5. The air-cooled heat dissipation device according to claim 4, characterized in that the cover group is provided with a magnetic component on the middle cover, and the middle cover is fixed to the upper surface of the heat dissipation fin group by magnetic force.

6. The air-cooled heat dissipation device according to claim 1, characterized in that a locking device for fixing the base portion to an external device is provided below the base portion.

7. The air-cooled heat dissipation device according to claim 1, characterized in that the pipe provided between the base portion and the heat dissipation fin group is inclined and is positioned at a location where the center reference line of the heat dissipation fin group and the center reference line of the base portion are offset.

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