Resin composition

Abstract

To provide a resin composition capable of giving a cured product that can keep high peel strength even under high-temperature and high-humidity conditions, with its dielectric loss tangent being kept low.SOLUTION: A resin composition comprises (A) a cyclic carbonate compound, (B) an epoxy resin, and (C) an inorganic filler.SELECTED DRAWING: None

Description

[Technical field]

[0001] The present invention relates to a resin composition containing an epoxy resin, and further to a resin sheet, a printed wiring board, and a semiconductor device obtained by using the resin composition. [Background technology]

[0002] As a manufacturing technique for printed wiring boards, a manufacturing method using a build-up method in which insulating layers and conductor layers are alternately stacked is known. In the manufacturing method using the build-up method, the insulating layer is generally formed by curing a resin composition containing an epoxy resin and an inorganic filler. In recent years, with the further miniaturization and densification of wiring on printed wiring boards and the increase in signal frequency, there is a demand for further reduction in the dielectric tangent of the insulating layer. In addition, since printed wiring boards are generally exposed to high temperature and high humidity environments, they are also required to have peel strength resistance to high temperature and high humidity environments.

[0003] Incidentally, various cyclic carbonate compounds have been known up to now (Patent Documents 1 to 5). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 6141261 [Patent Document 2] JP 2018-118946 A [Patent Document 3] Japanese Patent Application Publication No. 5-209041 [Patent Document 4] Patent No. 4273530 [Patent Document 5] Patent No. 6635668 Summary of the Invention [Problem to be solved by the invention]

[0005] An object of the present invention is to provide a resin composition which is capable of retaining high peel strength even when exposed to a high-temperature, high-humidity environment and which can give a cured product having a low dielectric tangent. [Means for solving the problem]

[0006] Means for Solving the Problems of the Invention The present inventors conducted extensive research in order to achieve the objects of the present invention and unexpectedly found that by using a cyclic carbonate compound (A) in a resin composition containing an epoxy resin (B) and an inorganic filler (C), it is possible to obtain a cured product that is capable of retaining high peel strength and having a low dielectric tangent even when exposed to a high-temperature and high-humidity environment, and thus completed the present invention.

[0007] That is, the present invention includes the following. [1] A resin composition comprising (A) a cyclic carbonate compound, (B) an epoxy resin, and (C) an inorganic filler. [2] The resin composition according to the above [1], further comprising (D) an active ester compound. [3] The resin composition according to the above [2], wherein the content of the (A) component is 1% by mass to 10% by mass, relative to 100% by mass of the total amount of the (A) component, the (B) component, and the (D) component. [4] The resin composition according to [2] or [3] above, wherein the content of the (D) component is 12 mass% or more, based on 100 mass% of the non-volatile components in the resin composition. [5] The resin composition according to any one of the above [1] to [4], wherein the component (A) contains a compound selected from a 5-membered cyclic carbonate compound and a 6-membered cyclic carbonate compound. [6] The component (A) is represented by the formula (1):

[0008] [ka]

[0009] [In the formula, R 1 , R 2 , R 3 , R 4 , R5 and R 6 each independently represents (1) a hydrogen atom, (2) an alkyl group which may be substituted with a group selected from RO-, RCO-, RCOO-, and ROCO-, (3) an alkenyl group which may be substituted with a group selected from RO-, RCO-, RCOO-, and ROCO-, (4) an aralkyl group which may be substituted with a group selected from R-, RO-, RCO-, RCOO-, and ROCO-, or (5) a group represented by the formula (2-1):

[0010] [ka]

[0011] or (6) a group represented by formula (2-2):

[0012] [ka]

[0013] represents a group represented by the formula: R 1’ , R 2’ , R 3’ , R 4’ , R 5’ and R 6’ each independently represents (1) a hydrogen atom, (2) an alkyl group which may be substituted with a group selected from RO-, RCO-, RCOO-, and ROCO-, (3) an alkenyl group which may be substituted with a group selected from RO-, RCO-, RCOO-, and ROCO-, or (4) an aralkyl group which may be substituted with a group selected from R-, RO-, RCO-, RCOO-, and ROCO-; A 1 and A 2 each independently represents -O-, -CO-, -COO-, or -OCO-; X and Y each independently represent (1) an alkylene group optionally substituted with a group selected from RO-, RCO-, RCOO-, and ROCO-, or (2) an alkenylene group optionally substituted with a group selected from RO-, RCO-, RCOO-, and ROCO-; R each independently represents an alkyl group, an alkenyl group, an aralkyl group, or an aryl group, each of which may be substituted with a group selected from a halogen atom, an alkyl-oxy group, an alkenyl-oxy group, an aryl-oxy group, an aralkyl-oxy group, an alkyl-carbonyl group, an alkenyl-carbonyl group, an aryl-carbonyl group, an aralkyl-carbonyl group, an alkyl-oxy-carbonyl group, an alkenyl-oxy-carbonyl group, an aryl-oxy-carbonyl group, an aralkyl-oxy-carbonyl group, an alkyl-carbonyl-oxy group, an alkenyl-carbonyl-oxy group, an aryl-carbonyl-oxy group, and an aralkyl-carbonyl-oxy group; Z's each independently represent a divalent hydrocarbon group which may have a substituent; n is 0, 1, 2, or 3; * indicates binding site.] The resin composition according to any one of the above [1] to [5], comprising a compound represented by the following formula: [7] The resin composition according to any one of the above [1] to [6], wherein the content of the component (B) is 1% by mass to 20% by mass, relative to 100% by mass of the non-volatile components in the resin composition. [8] The resin composition according to any one of the above [1] to [7], wherein the content of the component (C) is 60 mass% or more, based on 100 mass% of the non-volatile components in the resin composition. [9] The resin composition according to any one of the above [1] to [8], further comprising a curing agent selected from the group consisting of phenol-based curing agents and carbodiimide-based curing agents.

[10] The resin composition according to any one of the above [1] to [9], wherein a dielectric loss tangent (Df) of a cured product of the resin composition is 0.0030 or less when measured at 5.8 GHz and 23°C.

[11] The resin composition according to any one of the above [1] to

[10] , wherein the elongation at break of a cured product of the resin composition is 0.2% or more, as measured at 23°C in accordance with JIS K7127.

[12] The resin composition according to any one of the above [1] to

[11] , which is for forming an insulating layer for forming a conductor layer.

[13] The resin composition according to any one of the above [1] to

[11] , which is for forming an insulating layer of a printed wiring board.

[14] A cured product of the resin composition according to any one of [1] to

[13] above.

[15] A sheet-like laminate material comprising the resin composition according to any one of the above [1] to

[13] .

[16] A resin sheet comprising: a support; and a resin composition layer formed on the support, the resin composition being formed from the resin composition according to any one of [1] to

[13] above.

[17] A printed wiring board comprising an insulating layer made of a cured product of the resin composition according to any one of [1] to

[13] above.

[18] A semiconductor device comprising the printed wiring board according to

[17] above. Effect of the Invention

[0014] According to the resin composition of the present invention, it is possible to obtain a cured product which is capable of retaining high peel strength even when exposed to a high-temperature and high-humidity environment and has a low dielectric tangent. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0015] The present invention will be described in detail below with reference to preferred embodiments. However, the present invention is not limited to the following embodiments and examples, and can be modified and implemented as desired without departing from the scope of the claims of the present invention and their equivalents.

[0016] <Resin composition> The resin composition of the present invention contains (A) a cyclic carbonate compound, (B) an epoxy resin, and (C) an inorganic filler. With such a resin composition, a cured product can be obtained that can maintain high peel strength even when exposed to a high-temperature and high-humidity environment and has a low dielectric tangent.

[0017] The resin composition of the present invention may further contain optional components in addition to (A) the cyclic carbonate compound, (B) the epoxy resin, and (C) the inorganic filler, such as (D) an active ester compound, (D') other curing agents, (E) a compound containing a radical polymerizable group, (F) a thermoplastic resin, (G) a curing accelerator, (H) other additives, and (I) an organic solvent.

[0018] Each component contained in the resin composition will be described in detail below.

[0019] <(A) Cyclic carbonate compound> The resin composition of the present invention contains (A) a cyclic carbonate compound. (A) cyclic carbonate compound is a compound containing a cyclic structure containing a carbonate skeleton (-OC(=O)-O-). (A) cyclic carbonate compound has one or more cyclic structures containing a carbonate skeleton in one molecule, and in one embodiment, preferably has one or two cyclic structures. (A) cyclic carbonate compound, in one embodiment, preferably contains a compound selected from a 5-membered cyclic carbonate compound having an ethylene carbonate skeleton and a 6-membered cyclic carbonate compound having a trimethylene carbonate skeleton, more preferably contains a compound selected from a 5-membered cyclic carbonate compound having one or two ethylene carbonate skeletons in one molecule and a 6-membered cyclic carbonate compound having one or two trimethylene carbonate skeletons in one molecule, and further preferably contains a 6-membered cyclic carbonate compound having one or two trimethylene carbonate skeletons in one molecule.

[0020] In a particularly preferred embodiment, the (A) cyclic carbonate compound is represented by the formula (1):

[0021] [ka]

[0022] The compound includes a compound represented by the formula:

[0023] R1 , R 2 , R 3 , R 4 , R 5 and R 6 each independently represents (1) a hydrogen atom, (2) an alkyl group which may be substituted with a group selected from RO-, RCO-, RCOO-, and ROCO-, (3) an alkenyl group which may be substituted with a group selected from RO-, RCO-, RCOO-, and ROCO-, (4) an aralkyl group which may be substituted with a group selected from R-, RO-, RCO-, RCOO-, and ROCO-, or (5) a group represented by the formula (2-1):

[0024] [ka]

[0025] or (6) a group represented by formula (2-2):

[0026] [ka]

[0027] The symbol * indicates a bonding site.

[0028] The alkyl group refers to a linear, branched and / or cyclic monovalent aliphatic saturated hydrocarbon group. Unless otherwise specified, the alkyl group is preferably an alkyl group having 1 to 14 carbon atoms, more preferably an alkyl group having 1 to 10 carbon atoms, and even more preferably an alkyl group having 1 to 6 carbon atoms. Examples of the alkyl group include a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, a sec-butyl group, a tert-butyl group, a pentyl group, an isopentyl group, a sec-pentyl group, a neopentyl group, a tert-pentyl group, a hexyl group, an isohexyl group, a heptyl group, an isoheptyl group, an octyl group, an isooctyl group, a tert-octyl group, a cyclopentyl group, and a cyclohexyl group.

[0029] The term "alkenyl group" refers to a linear, branched and / or cyclic monovalent aliphatic unsaturated hydrocarbon group having at least one carbon-carbon double bond. Unless otherwise specified, the alkenyl group is preferably an alkenyl group having 2 to 14 carbon atoms, more preferably an alkenyl group having 2 to 10 carbon atoms, and even more preferably an alkenyl group having 2 to 6 carbon atoms. Examples of alkenyl (groups) include vinyl groups, propenyl groups (allyl groups, 1-propenyl groups, isopropenyl groups), butenyl groups (1-butenyl groups, crotyl groups, methallyl groups, isocrotyl groups, etc.), pentenyl groups (1-pentenyl groups, etc.), hexenyl groups (1-hexenyl groups, etc.), heptenyl groups (1-heptenyl groups, etc.), octenyl groups (1-octenyl groups, etc.), cyclopentenyl groups (2-cyclopentenyl groups, etc.), and cyclohexenyl groups (3-cyclohexenyl groups, etc.).

[0030] The aryl group refers to a monovalent aromatic hydrocarbon group formed by removing one hydrogen atom from an aromatic carbon ring. Unless otherwise specified, the aryl group is preferably an aryl group having 6 to 14 carbon atoms, and more preferably an aryl group having 6 to 10 carbon atoms. Examples of the aryl group include a phenyl group, a 1-naphthyl group, and a 2-naphthyl group.

[0031] The aralkyl group refers to an alkyl group substituted with one or more (preferably one) aryl groups. Unless otherwise specified, the aralkyl group is preferably an aralkyl group having 7 to 15 carbon atoms, and more preferably an aralkyl group having 7 to 11 carbon atoms. Examples of the aralkyl group include a benzyl group, a phenethyl group, a hydrocinnamyl group, an α-methylbenzyl group, an α-cumyl group, a 1-naphthylmethyl group, and a 2-naphthylmethyl group.

[0032] R 1 , R 2 , R 5 and R 6In one embodiment, each is independently preferably (1) a hydrogen atom, or (2) an alkyl group optionally substituted with a group selected from RO-, RCO-, RCOO-, and ROCO-; more preferably (1) a hydrogen atom, or (2) an alkyl group optionally substituted with RO-; particularly preferably (1) a hydrogen atom, or (2) an alkyl group.

[0033] R 3 and R 4 In one embodiment, each is preferably, independently, (1) a hydrogen atom, (2) an alkyl group which may be substituted with a group selected from RO-, RCO-, RCOO-, and ROCO-, (3) a group represented by formula (2-1), or (4) a group represented by formula (2-2); more preferably, (1) a hydrogen atom, (2) an alkyl group which may be substituted with RO-, (3) a group represented by formula (2-1), or (4) a group represented by formula (2-2); and even more preferably, (1) a hydrogen atom, (2) an alkyl group, or (3) a group represented by formula (2-2).

[0034] R 1’ , R 2’ , R 3’ , R 4’ , R 5’ and R 6’ each independently represents (1) a hydrogen atom, (2) an alkyl group which may be substituted with a group selected from RO-, RCO-, RCOO-, and ROCO-, (3) an alkenyl group which may be substituted with a group selected from RO-, RCO-, RCOO-, and ROCO-, or (4) an aralkyl group which may be substituted with a group selected from R-, RO-, RCO-, RCOO-, and ROCO-.

[0035] R 1’ , R 2’ , R 3’ , R 4’ , R 5’ and R 6’In one embodiment, each is independently preferably (1) a hydrogen atom, or (2) an alkyl group optionally substituted with a group selected from RO-, RCO-, RCOO-, and ROCO-; more preferably (1) a hydrogen atom, or (2) an alkyl group optionally substituted with RO-; particularly preferably (1) a hydrogen atom, or (2) an alkyl group.

[0036] A 1 and A 2 each independently represents -O-, -CO-, -COO-, or -OCO-. 1 and A 2 In one embodiment, is preferably -O-.

[0037] X and Y each independently represent (1) an alkylene group which may be substituted with a group selected from RO-, RCO-, RCOO-, and ROCO-, or (2) an alkenylene group which may be substituted with a group selected from RO-, RCO-, RCOO-, and ROCO-.

[0038] The alkylene group refers to a linear, branched, and / or cyclic divalent aliphatic saturated hydrocarbon group. Unless otherwise specified, the alkylene group is preferably an alkylene group having 1 to 14 carbon atoms, more preferably an alkylene group having 1 to 10 carbon atoms, and even more preferably an alkylene group having 1 to 6 carbon atoms. Examples of the alkylene group include linear alkylene groups such as methylene, ethylene, trimethylene, tetramethylene, pentamethylene, hexamethylene, heptamethylene, octamethylene, nonamethylene, and decamethylene; and branched alkylene groups such as ethylidene, propylidene, isopropylidene, ethylmethylmethylene, and diethylmethylene.

[0039] The term "alkenylene group" refers to a linear, branched and / or cyclic divalent aliphatic unsaturated hydrocarbon group having at least one carbon-carbon double bond. Unless otherwise specified, the alkenyl group is preferably an alkenylene group having 2 to 14 carbon atoms, more preferably an alkenylene group having 2 to 10 carbon atoms, and even more preferably an alkenylene group having 2 to 6 carbon atoms. Examples of alkenylene (groups) include -CH=CH-, -CHCH=CH-, -CH=C(CH)-, -C(CH)=CH-, -CHCHCH=CH-, -CHCH=CHCH-, -CHCH=CHCHCH-, -CH=CHCHCH-, -CHCH=C(CH)-, -C(CH)=CHCH-, -CHC(CH)=CH-, -CH=C(CH)CH-, -CH(CH)CH=CH-, -CH=CHCH(CH)-, and the like.

[0040] In one embodiment, X and Y are each independently preferably an alkylene group optionally substituted with a group selected from RO-, RCO-, RCOO-, and ROCO-; more preferably an alkylene group optionally substituted with RO-; and even more preferably an alkylene group.

[0041] R each independently represents an alkyl group, an alkenyl group, an aralkyl group, or an aryl group, each of which may be substituted with a group selected from a halogen atom, an alkyl-oxy group, an alkenyl-oxy group, an aryl-oxy group, an aralkyl-oxy group, an alkyl-carbonyl group, an alkenyl-carbonyl group, an aryl-carbonyl group, an aralkyl-carbonyl group, an alkyl-oxy-carbonyl group, an alkenyl-oxy-carbonyl group, an aryl-oxy-carbonyl group, an aralkyl-oxy-carbonyl group, an alkyl-carbonyl-oxy group, an alkenyl-carbonyl-oxy group, an aryl-carbonyl-oxy group, and an aralkyl-carbonyl-oxy group.

[0042] In one embodiment, each R is independently preferably an alkyl group, an alkenyl group, an aralkyl group, or an aryl group, and more preferably an alkyl group.

[0043] Each Z independently represents a divalent hydrocarbon group which may have a substituent.

[0044] A divalent hydrocarbon group is a divalent hydrocarbon group having one or more (for example, 1 to 100, 2 to 50, 2 to 30) carbon atoms as the skeleton atom. The divalent hydrocarbon group includes a straight chain structure, a branched chain structure, and / or a cyclic structure. The divalent hydrocarbon group may be a hydrocarbon group that does not include an aromatic ring, or may be a hydrocarbon group that includes an aromatic ring.

[0045] Examples of divalent hydrocarbon groups include alkylene groups, alkenylene groups, aromatic carbocyclic groups, non-aromatic carbocyclic groups, alkylene-aromatic carbocyclic-alkylene groups, alkenylene-aromatic carbocyclic-alkenylene groups, alkylene-non-aromatic carbocyclic-alkylene groups, alkenylene-non-aromatic carbocyclic-alkenylene groups, aromatic carbocyclic-aromatic carbocyclic groups, non-aromatic carbocyclic-non-aromatic carbocyclic groups, aromatic carbocyclic-alkylene-aromatic carbocyclic groups, aromatic carbocyclic-alkenylene-aromatic carbocyclic groups, aromatic carbocyclic-aromatic carbocyclic-aromatic carbocyclic groups, aromatic carbocyclic-non-aromatic carbocyclic groups, Examples of the aromatic carbocycle include a non-aromatic carbocycle-aromatic carbocyclic group, a non-aromatic carbocycle-alkylene-non-aromatic carbocyclic group, a non-aromatic carbocycle-alkylene-non-aromatic carbocyclic group, a non-aromatic carbocycle-aromatic carbocycle-non-aromatic carbocyclic group, and a non-aromatic carbocycle-non-aromatic carbocyclic group, wherein the non-aromatic carbocycle may be fused with an aromatic carbocycle or may be substituted with a group selected from an alkyl group, an alkenyl group, and an aryl group, and the aromatic carbocycle may be fused with a non-aromatic carbocycle or may be substituted with a group selected from an alkyl group, an alkenyl group, and an aryl group.

[0046] The aromatic carbocycle means a carbocycle that follows the Huckel rule, in which the number of electrons contained in the π electron system on the ring is 4p+2 (p is a natural number). The aromatic carbocycle has only carbon atoms as ring-constituting atoms. In one embodiment, the aromatic carbocycle is preferably a 6- to 14-membered aromatic carbocycle, and more preferably a 6- to 10-membered aromatic carbocycle. Suitable specific examples of the aromatic carbocycle include a benzene ring, a naphthalene ring, an anthracene ring, and a phenanthrene ring, and more preferably a benzene ring or a naphthalene ring, and particularly preferably a benzene ring.

[0047] A non-aromatic carbocycle is a carbocycle that is not aromatic and has aromaticity throughout the ring. A non-aromatic carbocycle has only carbon atoms as ring constituent atoms. A non-aromatic carbocycle may be a saturated carbocycle consisting of only single bonds, or a non-aromatic unsaturated carbocycle having at least one of a double bond and a triple bond. The non-aromatic carbocycle is preferably a non-aromatic carbocycle having 3 to 20 carbon atoms, more preferably a non-aromatic carbocycle having 4 to 15 carbon atoms, and even more preferably a non-aromatic carbocycle having 4 to 10 carbon atoms. Suitable specific examples of non-aromatic carbocycles include monocyclic saturated carbocycles such as a cyclobutane ring, a cyclopentane ring, a cyclohexane ring, a cycloheptane ring, a cyclooctane ring, a cyclononane ring, a cyclodecane ring, a cycloundecane ring, a cyclododecane ring, a cyclotridecane ring, a cyclotetradecane ring, a cyclopentadecane ring, a cyclohexadecane ring, a cycloheptadecane ring, a cyclooctadecane ring, and a cyclononadecane ring. Bicyclic saturated carbocyclic rings such as bicyclo[2.2.1]heptane ring (norbornane ring), bicyclo[4.4.0]decane ring (decalin ring), bicyclo[5.3.0]decane ring, bicyclo[4.3.0]nonane ring (hydrindane ring), bicyclo[3.2.1]octane ring, bicyclo[5.4.0]undecane ring, bicyclo[3.3.0]octane ring, and bicyclo[3.3.1]nonane ring; tricyclo[5.2.1.0 2,6 ] Decane ring (tetrahydrodicyclopentadiene ring), tricyclo[3.3.1.1 3,7 ]Decane ring (adamantane ring), tricyclo[6.2.1.0 2,7 ]undecane ring and other tricyclic saturated carbocyclic rings; tetracyclo[6.2.1.13,6 .0 2,7 ]dodecane ring and other saturated tetracyclic carbocyclic rings; pentacyclo[9.2.1.1 4,7 .0 2,1 0.0 3,8 ]Pentadecane ring, pentacyclo[6.5.1.1 3,6 .0 2,7 .0 9,13 ]Pentadecane ring (tetrahydrotricyclopentadiene ring) and other saturated five-ring carbon rings are also included.

[0048] The "substituents" that the divalent hydrocarbon group in Z may have are not particularly limited, and examples thereof include halogen atoms, alkyl-oxy groups, alkenyl-oxy groups, aryl-oxy groups, aralkyl-oxy groups, alkyl-carbonyl groups, alkenyl-carbonyl groups, aryl-carbonyl groups, aralkyl-carbonyl groups, alkyl-oxy-carbonyl groups, alkenyl-oxy-carbonyl groups, aryl-oxy-carbonyl groups, aralkyl-oxy-carbonyl groups, alkyl-carbonyl-oxy groups, alkenyl-carbonyl-oxy groups, aryl-carbonyl-oxy groups, aralkyl-carbonyl-oxy groups, alkyl-carbonyl-oxy groups, alkenyl-carbonyl-oxy groups, aryl-carbonyl-oxy groups, aralkyl-carbonyl-oxy groups, and groups represented by the formula (Z-1):

[0049] [ka]

[0050] A group represented by formula (Z-2):

[0051] [ka]

[0052] The symbol * indicates a bonding site.

[0053] The halogen atom is a fluorine atom, a chlorine atom, a bromine atom, or an iodine atom, and is preferably a fluorine atom.

[0054] R 1’’ , R2’’ , R 3’’ , R 4’’ , R 5’’ and R 6’’ each independently represents (1) a hydrogen atom, (2) an alkyl group which may be substituted with a group selected from RO-, RCO-, RCOO-, and ROCO-, (3) an alkenyl group which may be substituted with a group selected from RO-, RCO-, RCOO-, and ROCO-, or (4) an aralkyl group which may be substituted with a group selected from R-, RO-, RCO-, RCOO-, and ROCO-, and in one embodiment, a preferred range is 1’ , R 2’ , R 3’ , R 4’ , R 5’ and R 6’ is the same as:

[0055] A 3 each independently represents -O-, -CO-, -COO-, or -OCO-; in one embodiment, the preferred range is 1 and A 2 is the same as:

[0056] Y' each independently represents (1) an alkylene group optionally substituted with a group selected from RO-, RCO-, RCOO-, and ROCO-, or (2) an alkenylene group optionally substituted with a group selected from RO-, RCO-, RCOO-, and ROCO-, and in one embodiment, the preferred ranges are the same as those of X and Y.

[0057] In one embodiment, each Z is independently preferably represented by the formula (Z1):

[0058] [ka]

[0059] and more preferably, a group represented by the formula (Z2):

[0060] [ka]

[0061] and more preferably, a group represented by the formulae (Z3-1) to (Z3-36):

[0062] [ka]

[0063] [ka]

[0064] [ka]

[0065] Particularly preferred is a group represented by formula (Z3-25). * indicates a binding site.

[0066] Ring Z a and ring Z b each independently represents an aromatic carbocyclic ring which may have a substituent. Ring Z a and ring Z b In one embodiment, each independently is preferably a benzene ring which may have a substituent, more preferably a benzene ring which may be substituted with an alkyl group, and particularly preferably an (unsubstituted) benzene ring.

[0067] X z is a single bond or -CR z1 R z2 In one embodiment, preferably -CR z1 R z2 -It is.

[0068] n z represents 0, 1, 2, or 3, and in one embodiment, is preferably 0, 1, or 2, and more preferably 0 or 1. z The units may be the same for each unit or may be different.

[0069] R z1 and R z2 each independently represents a hydrogen atom, an optionally substituted alkyl group, an optionally substituted alkenyl group, an optionally substituted aryl group, or an optionally substituted aralkyl group, or R z1 and R z2 R are bonded together to form a non-aromatic carbocyclic ring which may have a substituent and which may be condensed with an aromatic carbocyclic ring. z1 and R z2 In one embodiment, R z1 and R z2 are bonded together, and is preferably a non-aromatic carbocyclic ring which may have a substituent and which may be fused with an aromatic carbocyclic ring, more preferably a monocyclic saturated carbocyclic ring which may have a substituent and which may be fused with a benzene ring, and particularly preferably a cyclopentane ring which may be fused with a benzene ring.

[0070] R z R each independently represents a substituent. z In one embodiment, each independently is preferably an alkyl group.

[0071] Ring Z a and ring Z b The "substituents" that the aromatic carbocyclic ring may have in R z1 and R z2 The "substituents" that may be possessed by the alkyl group, alkenyl group, aryl group, aralkyl group, and non-aromatic carbocyclic ring that may be condensed with the aromatic carbocyclic ring in zThe "substituent" in is not particularly limited, and examples thereof include a halogen atom, an alkyl group, an alkenyl group, an aryl group, an aralkyl group, an alkyl-oxy group, an alkenyl-oxy group, an aryl-oxy group, an aralkyl-oxy group, an alkyl-carbonyl group, an alkenyl-carbonyl group, an aryl-carbonyl group, an aralkyl-carbonyl group, an alkyl-oxy-carbonyl group, an alkenyl-oxy-carbonyl group, an aryl-oxy-carbonyl group, an aralkyl-oxy-carbonyl group, an alkyl-carbonyl-oxy group, an alkenyl-carbonyl-oxy group, an aryl-carbonyl-oxy group, an aralkyl-carbonyl-oxy group, an alkyl-carbonyl-oxy group, an alkenyl-carbonyl-oxy group, an aryl-carbonyl-oxy group, an aralkyl-carbonyl-oxy group, and the like.

[0072] Each z is independently 0, 1, 2, or 3. In one embodiment, each z is independently preferably 0, 1, or 2, more preferably 0 or 1, and particularly preferably 0.

[0073] n represents 0, 1, 2, or 3. In one embodiment, n is preferably, independently, 0 or 1. The n units may be the same or different for each unit.

[0074] The molecular weight of the (A) cyclic carbonate compound is preferably 10,000 or less, more preferably 5,000 or less, further preferably 2,000 or less, and particularly preferably 1,000 or less. The lower limit can be, for example, 88 (the molecular weight of ethylene carbonate) or more, 102 (the molecular weight of trimethylene carbonate) or more, etc.

[0075] Specific examples of the cyclic carbonate compound (A) include those of the formulae (A1) to (A17):

[0076] [ka]

[0077] [ka]

[0078] Examples of the compound include compounds represented by the following formula:

[0079] The content of the (A) cyclic carbonate compound in the resin composition is not particularly limited, but is preferably 20% by mass or less, more preferably 15% by mass or less, even more preferably 10% by mass or less, even more preferably 5% by mass or less, and particularly preferably 2.5% by mass or less, when the non-volatile components in the resin composition are 100% by mass. The lower limit of the content of the (A) cyclic carbonate compound in the resin composition is not particularly limited, but is preferably 0.01% by mass or more, more preferably 0.05% by mass or more, even more preferably 0.1% by mass or more, even more preferably 0.5% by mass or more, and particularly preferably 0.8% by mass or more, when the non-volatile components in the resin composition are 100% by mass.

[0080] The content of the (A) cyclic carbonate compound relative to the total amount of the (A) cyclic carbonate compound and the (B) epoxy resin (when an (D) active ester compound is used, the total amount of the (A) cyclic carbonate compound, the (B) epoxy resin, and the (D) active ester compound) is not particularly limited, but is preferably 0.01% by mass to 50% by mass, more preferably 0.1% by mass to 20% by mass, still more preferably 0.5% by mass to 15% by mass, and particularly preferably 1% by mass to 10% by mass, relative to the total amount of the (A) cyclic carbonate compound and the (B) epoxy resin (the total amount of the (A) cyclic carbonate compound, the (B) epoxy resin, and the (D) active ester compound) taken as 100% by mass.

[0081] <(B) Epoxy resin> The resin composition of the present invention contains an epoxy resin (B). The epoxy resin (B) is a curable resin having an epoxy group with an epoxy equivalent of 5,000 g / eq. or less.

[0082] Examples of the epoxy resin (B) include bixylenol type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bisphenol AF type epoxy resin, dicyclopentadiene type epoxy resin, trisphenol type epoxy resin, naphthol novolac type epoxy resin, phenol novolac type epoxy resin, tert-butyl-catechol type epoxy resin, naphthalene type epoxy resin, naphthol type epoxy resin, anthracene type epoxy resin, glycidylamine type epoxy resin, glycidyl ester type epoxy resin, cresol novolac type epoxy resin, phenol aralkyl type epoxy resin, biphenyl type epoxy resin, linear aliphatic epoxy resin, epoxy resin having a butadiene structure, alicyclic epoxy resin, heterocyclic epoxy resin, spiro ring-containing epoxy resin, cyclohexane type epoxy resin, cyclohexane dimethanol type epoxy resin, naphthylene ether type epoxy resin, trimethylol type epoxy resin, tetraphenylethane type epoxy resin, isocyanurate type epoxy resin, and phenolphthalimidine type epoxy resin. The (B) epoxy resin may be used alone or in combination of two or more kinds.

[0083] The resin composition preferably contains, as the (B) epoxy resin, an epoxy resin having two or more epoxy groups in one molecule. The proportion of the epoxy resin having two or more epoxy groups in one molecule relative to 100% by mass of the non-volatile components of the (B) epoxy resin is preferably 50% by mass or more, more preferably 60% by mass or more, and particularly preferably 70% by mass or more.

[0084] Epoxy resins include epoxy resins that are liquid at a temperature of 20° C. (hereinafter sometimes referred to as "liquid epoxy resins") and epoxy resins that are solid at a temperature of 20° C. (hereinafter sometimes referred to as "solid epoxy resins"). The resin composition of the present invention may contain only a liquid epoxy resin as the epoxy resin, or may contain only a solid epoxy resin, or may contain a combination of a liquid epoxy resin and a solid epoxy resin.

[0085] The liquid epoxy resin is preferably a liquid epoxy resin having two or more epoxy groups in one molecule.

[0086] As the liquid epoxy resin, glycirol type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AF type epoxy resin, naphthalene type epoxy resin, glycidyl ester type epoxy resin, glycidyl amine type epoxy resin, phenol novolac type epoxy resin, alicyclic epoxy resin having an ester skeleton, cyclohexane dimethanol type epoxy resin, cyclic aliphatic glycidyl ether, and epoxy resin having a butadiene structure are preferred, and glycirol type epoxy resin, cyclic aliphatic glycidyl ether, bisphenol A type epoxy resin, and bisphenol F type epoxy resin are more preferred.

[0087] Specific examples of liquid epoxy resins include "EX-992L" manufactured by Nagase ChemteX Corporation, "YX7400" manufactured by Mitsubishi Chemical Corporation, "HP4032", "HP4032D", and "HP4032SS" (naphthalene type epoxy resins) manufactured by DIC Corporation; "828US", "828EL", "jER828EL", "825", and "Epikote 828EL" (bisphenol A type epoxy resins) manufactured by Mitsubishi Chemical Corporation; "jER807" and "1750" ( bisphenol F type epoxy resin; "jER152" (phenol novolac type epoxy resin) manufactured by Mitsubishi Chemical; "630", "630LSD", "604" (glycidylamine type epoxy resin) manufactured by Mitsubishi Chemical; "ED-523T" (glycirol type epoxy resin) manufactured by ADEKA; "EP-3950L", "EP-3980S" (glycidylamine type epoxy resin) manufactured by ADEKA; "EP-4088S" (dicyclopentadiene type epoxy resin) manufactured by ADEKA; "ZX1059" (mixture of bisphenol A type epoxy resin and bisphenol F type epoxy resin) manufactured by Nippon Steel Chemical & Material; "EX-721" (glycidyl ester type epoxy resin) manufactured by Nagase ChemteX; "EX-991L" (alkyleneoxy and butadiene type epoxy resin) manufactured by Nagase ChemteX; "Celloxide 2021P" (alicyclic epoxy resin with ester structure) manufactured by Daicel ); "PB-3600" manufactured by Daicel Corporation, "JP-100" and "JP-200" manufactured by Nippon Soda Co., Ltd. (epoxy resins having a butadiene structure); "ZX1658" and "ZX1658GS" (liquid 1,4-glycidylcyclohexane type epoxy resins) manufactured by Nippon Steel Chemical & Material Co., Ltd.; "EG-280" (fluorene structure-containing epoxy resin) manufactured by Osaka Gas Chemicals Co., Ltd.; and "EX-201" (cyclic aliphatic glycidyl ether) manufactured by Nagase ChemteX Corporation.

[0088] As the solid epoxy resin, a solid epoxy resin having three or more epoxy groups in one molecule is preferable, and an aromatic solid epoxy resin having three or more epoxy groups in one molecule is more preferable.

[0089] Preferred solid epoxy resins include bixylenol type epoxy resins, naphthalene type epoxy resins, naphthalene type tetrafunctional epoxy resins, naphthol novolac type epoxy resins, cresol novolac type epoxy resins, dicyclopentadiene type epoxy resins, trisphenol type epoxy resins, naphthol type epoxy resins, biphenyl type epoxy resins, naphthylene ether type epoxy resins, anthracene type epoxy resins, bisphenol A type epoxy resins, bisphenol AF type epoxy resins, phenol aralkyl type epoxy resins, tetraphenylethane type epoxy resins, and phenolphthalimidine type epoxy resins.

[0090] Specific examples of solid epoxy resins include "HP4032H" (naphthalene type epoxy resin) manufactured by DIC Corporation; "HP-4700" and "HP-4710" (naphthalene type tetrafunctional epoxy resins) manufactured by DIC Corporation; "N-690" (cresol novolac type epoxy resin) manufactured by DIC Corporation; "N-695" (cresol novolac type epoxy resin) manufactured by DIC Corporation; "HP-7200", "HP-7200HH", "HP-7200H", and "HP-7200L" (dicyclopentadiene type epoxy resins) manufactured by DIC Corporation; and "EXA-7311" manufactured by DIC Corporation. , "EXA-7311-G3", "EXA-7311-G4", "EXA-7311-G4S", "HP6000" (naphthylene ether type epoxy resin); "EPPN-502H" (trisphenol type epoxy resin) manufactured by Nippon Kayaku Co., Ltd.; "NC7000L" (naphthol novolac type epoxy resin) manufactured by Nippon Kayaku Co., Ltd.; "NC3000H", "NC3000", "NC3000L", "NC3000FH", "NC3100" (biphenyl type epoxy resin) manufactured by Nippon Steel Chemical & Material Co., Ltd.; "ESN475V", "ESN4 100V" (naphthalene type epoxy resin); "ESN485" (naphthol type epoxy resin) manufactured by Nippon Steel Chemical & Material Co., Ltd.; "ESN375" (dihydroxynaphthalene type epoxy resin) manufactured by Nippon Steel Chemical & Material Co., Ltd.; "YX4000H", "YX4000", "YX4000HK", "YL7890" (bixylenol type epoxy resin) manufactured by Mitsubishi Chemical Co., Ltd.; "YL6121" (biphenyl type epoxy resin) manufactured by Mitsubishi Chemical Co., Ltd.; "YX8800" (anthracene type epoxy resin) manufactured by Mitsubishi Chemical Co., Ltd.; "Y Examples of epoxy resins include "X7700" (phenol aralkyl type epoxy resin); "PG-100" and "CG-500" manufactured by Osaka Gas Chemicals; "YL7760" (bisphenol AF type epoxy resin) manufactured by Mitsubishi Chemical; "YL7800" (fluorene type epoxy resin) manufactured by Mitsubishi Chemical; "jER1010" (bisphenol A type epoxy resin) manufactured by Mitsubishi Chemical; "jER1031S" (tetraphenylethane type epoxy resin) manufactured by Mitsubishi Chemical; and "WHR991S" (phenolphthalimidine type epoxy resin) manufactured by Nippon Kayaku Co., Ltd.These may be used alone or in combination of two or more.

[0091] When a solid epoxy resin and a liquid epoxy resin are used in combination as the (B) epoxy resin, the mass ratio thereof (solid epoxy resin:liquid epoxy resin) is preferably 100:1 to 1:100, more preferably 50:1 to 1:50, and particularly preferably 10:1 to 1:10.

[0092] The epoxy equivalent of the (B) epoxy resin is preferably 50 g / eq. to 5,000 g / eq., more preferably 60 g / eq. to 2,000 g / eq., even more preferably 70 g / eq. to 1,000 g / eq., and even more preferably 80 g / eq. to 500 g / eq. The epoxy equivalent is the mass of the resin per equivalent of epoxy group. This epoxy equivalent can be measured according to JIS K7236.

[0093] The weight average molecular weight (Mw) of the epoxy resin (B) is preferably from 100 to 5,000, more preferably from 250 to 3,000, and further preferably from 400 to 1500. The weight average molecular weight of the resin can be measured by gel permeation chromatography (GPC) as a polystyrene-equivalent value.

[0094] The content of the (B) epoxy resin in the resin composition is not particularly limited, but is preferably 30% by mass or less, more preferably 25% by mass or less, even more preferably 20% by mass or less, even more preferably 15% by mass or less, and particularly preferably 10% by mass or less, when the non-volatile components in the resin composition are taken as 100% by mass. The lower limit of the content of the (B) epoxy resin in the resin composition is not particularly limited, but is preferably 0.01% by mass or more, more preferably 0.1% by mass or more, even more preferably 1% by mass or more, even more preferably 5% by mass or more, and particularly preferably 7% by mass or more, when the non-volatile components in the resin composition are taken as 100% by mass.

[0095] The mass ratio of the epoxy resin (B) to the cyclic carbonate compound (A) in the resin composition (component (B) / component (A)) is not particularly limited, but is preferably 0.1 or more, more preferably 0.5 or more, and particularly preferably 1 or more. The upper limit of the mass ratio of the epoxy resin (B) to the cyclic carbonate compound (A) in the resin composition (component (B) / component (A)) is not particularly limited, but is preferably 100 or less, more preferably 50 or less, and particularly preferably 10 or less.

[0096] <(C) Inorganic filler> The resin composition of the present invention contains an inorganic filler (C). The inorganic filler (C) is contained in the resin composition in the form of particles.

[0097] (C) An inorganic compound is used as the material of the inorganic filler. (C) Examples of the material of the inorganic filler include silica, alumina, aluminosilicate, glass, cordierite, silicon oxide, barium sulfate, barium carbonate, talc, clay, mica powder, zinc oxide, hydrotalcite, boehmite, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum nitride, manganese nitride, aluminum borate, strontium carbonate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium oxide, zirconium oxide, barium titanate, barium zirconate titanate, barium zirconate, calcium zirconate, zirconium phosphate, and zirconium tungstate phosphate. Among these, silica or aluminosilicate is particularly suitable. Examples of silica include amorphous silica, fused silica, crystalline silica, synthetic silica, and hollow silica. In addition, spherical silica is preferable as the silica. The (C) inorganic filler may be used alone or in combination of two or more kinds in any ratio.

[0098] Examples of commercially available (C) inorganic fillers include "SP60-05" and "SP507-05" manufactured by Nippon Steel Chemical & Material Co., Ltd.; "YC100C", "YA050C", "YA050C-MJE", and "YA010C" manufactured by Admatechs Co., Ltd.; "UFP-30" manufactured by Denka Company; "Silfill NSS-3N", "Silfill NSS-4N", and "Silfill NSS-5N" manufactured by Tokuyama Corporation; "SC2500SQ", "SO-C4", "SO-C2", and "SO-C1" manufactured by Admatechs Co., Ltd.; "DAW-03" and "FB-105FD" manufactured by Denka Company; "BA-S" manufactured by JGC Catalysts and Chemicals Co., Ltd.; and "MG-005" manufactured by Taiheiyo Cement Corporation.

[0099] The average particle size of the (C) inorganic filler is not particularly limited, but is preferably 10 μm or less, more preferably 5 μm or less, even more preferably 4 μm or less, even more preferably 3 μm or less, and particularly preferably 2.7 μm or less. The lower limit of the average particle size of the (C) inorganic filler is not particularly limited, but is preferably 0.01 μm or more, more preferably 0.05 μm or more, even more preferably 0.1 μm or more, and particularly preferably 0.2 μm or more. The average particle size of the (C) inorganic filler can be measured by a laser diffraction / scattering method based on the Mie scattering theory. Specifically, the particle size distribution of the inorganic filler is created on a volume basis using a laser diffraction / scattering particle size distribution measuring device, and the median diameter is taken as the average particle size. The measurement sample can be prepared by weighing 100 mg of the inorganic filler and 10 g of methyl ethyl ketone into a vial and dispersing it by ultrasonic waves for 10 minutes. The measurement sample was measured using a laser diffraction type particle size distribution measuring device with blue and red light source wavelengths, and the particle size distribution of the inorganic filler on a volume basis was measured using a flow cell method, and the average particle size was calculated as the median diameter from the particle size distribution obtained. An example of a laser diffraction type particle size distribution measuring device is the "LA-960" manufactured by Horiba, Ltd.

[0100] The specific surface area of ​​the (C) inorganic filler is not particularly limited, but is preferably 0.1 m 2 / g or more, more preferably 0.5m 2 / g or more, more preferably 1m 2 / g or more, particularly preferably 3m 2 The upper limit of the specific surface area of ​​the inorganic filler (C) is not particularly limited, but is preferably 100 m 2 / g or less, more preferably 70m 2 / g or less, more preferably 50m 2 / g or less, particularly preferably 40m 2 The specific surface area of ​​the inorganic filler is obtained by adsorbing nitrogen gas onto the surface of a sample using a specific surface area measuring device (Macsorb HM-1210 manufactured by Mountech Co., Ltd.) according to the BET method, and calculating the specific surface area using the BET multipoint method.

[0101] The (C) inorganic filler may be a non-hollow inorganic filler with a porosity of 0 volume % (preferably non-hollow silica, non-hollow aluminosilicate), or a hollow inorganic filler with a porosity of more than 0 volume % (preferably hollow silica, hollow aluminosilicate), or may contain both. From the viewpoint of lowering the dielectric constant, the (C) inorganic filler preferably contains only a hollow inorganic filler (preferably hollow silica, hollow aluminosilicate), or contains both a non-hollow inorganic filler (preferably non-hollow silica, non-hollow aluminosilicate) and a hollow inorganic filler (preferably hollow silica, hollow aluminosilicate). The porosity of the hollow inorganic filler is preferably 90 volume % or less, more preferably 85 volume % or less. The lower limit of the porosity of the (C) inorganic filler may be, for example, more than 0 volume %, 1 volume % or more, 5 volume % or more, 10 volume % or more, 20 volume % or more, etc. The porosity P (volume %) of an inorganic filler is defined as the volume ratio of the total volume of one or more voids present inside the particle to the total volume of the particle based on the outer surface of the particle (total volume of voids / volume of particle). For example, the measured value of the actual density of the inorganic filler D M (g / cm 3 ), and the theoretical value of the material density of the material forming the inorganic filler D T (g / cm 3 ) is used to calculate according to the following formula (I).

[0102]

number

[0103] The actual density of the inorganic filler can be measured, for example, by using a true density measuring device. Examples of the true density measuring device include ULTRAPYCNOMETER 1000 manufactured by QUANTACHROME Co., Ltd. As the measurement gas, for example, nitrogen is used.

[0104] (C) The inorganic filler is preferably treated with a surface treatment agent from the viewpoint of improving moisture resistance and dispersibility. Examples of the surface treatment agent include a fluorine-containing silane coupling agent, an aminosilane coupling agent, an epoxysilane coupling agent, a mercaptosilane coupling agent, a silane coupling agent, an alkoxysilane, an organosilazane compound, and a titanate coupling agent. The surface treatment agent may be used alone or in any combination of two or more.

[0105] Examples of commercially available surface treatment agents include Shin-Etsu Chemical Co., Ltd.'s "KBM403" (3-glycidoxypropyltrimethoxysilane), Shin-Etsu Chemical Co., Ltd.'s "KBM803" (3-mercaptopropyltrimethoxysilane), Shin-Etsu Chemical Co., Ltd.'s "KBE903" (3-aminopropyltriethoxysilane), Shin-Etsu Chemical Co., Ltd.'s "KBM573" (N-phenyl-3-aminopropyltrimethoxysilane), Shin-Etsu Chemical Co., Ltd.'s "SZ-31" (hexamethyldisilazane), Shin-Etsu Chemical Co., Ltd.'s "KBM103" (phenyltrimethoxysilane), Shin-Etsu Chemical Co., Ltd.'s "KBM-4803" (long-chain epoxy-type silane coupling agent), and Shin-Etsu Chemical Co., Ltd.'s "KBM-7103" (3,3,3-trifluoropropyltrimethoxysilane).

[0106] From the viewpoint of improving the dispersibility of the inorganic filler, the degree of surface treatment with the surface treatment agent is preferably within a predetermined range. Specifically, 100% by mass of the inorganic filler is preferably surface-treated with 0.2% to 5% by mass of the surface treatment agent, more preferably 0.2% to 3% by mass, and even more preferably 0.3% to 2% by mass.

[0107] The degree of surface treatment with the surface treatment agent can be evaluated by the amount of carbon per unit surface area of ​​the inorganic filler. From the viewpoint of improving the dispersibility of the inorganic filler, the amount of carbon per unit surface area of ​​the inorganic filler is set to 0.02 mg / m 2 More than 0.1 mg / m is preferable. 2 More preferably, 0.2 mg / m or more 2 On the other hand, from the viewpoint of preventing an increase in the melt viscosity of the resin composition or the melt viscosity in the form of a sheet, it is more preferable that the melt viscosity is 1.0 mg / m 2 Less than 0.8 mg / m is preferred. 2 Less than 0.5 mg / m is more preferable. 2 The following is even more preferred:

[0108] (C) The amount of carbon per unit surface area of ​​the inorganic filler can be measured after the surface-treated inorganic filler is washed with a solvent (e.g., methyl ethyl ketone (MEK)). Specifically, a sufficient amount of MEK as a solvent is added to the inorganic filler that has been surface-treated with a surface treatment agent, and ultrasonic cleaning is performed at 25°C for 5 minutes. After removing the supernatant and drying the solid content, the amount of carbon per unit surface area of ​​the inorganic filler can be measured using a carbon analyzer. As the carbon analyzer, the "EMIA-320V" manufactured by Horiba, Ltd., or the like can be used.

[0109] The content of the inorganic filler (C) in the resin composition is not particularly limited, but when the non-volatile components in the resin composition are taken as 100 mass%, it may be preferably 90 mass% or less, more preferably 85 mass% or less, even more preferably 80 mass% or less, and particularly preferably 78 mass% or less. The lower limit of the content of the inorganic filler (C) in the resin composition is not particularly limited, but when the non-volatile components in the resin composition are taken as 100 mass%, it is, for example, preferably 5 mass% or more, or 10 mass% or more, more preferably 20 mass% or more, or 30 mass% or more, even more preferably 40 mass% or more, or 50 mass% or more, even more preferably 55 mass% or more, or 60 mass% or more, and particularly preferably 65 mass% or more, or 70 mass% or more.

[0110] The mass ratio of the inorganic filler (C) to the cyclic carbonate compound (A) in the resin composition (component (C) / component (A)) is not particularly limited, but is preferably 1 or more, more preferably 5 or more, and particularly preferably 10 or more. The upper limit of the mass ratio of the inorganic filler (C) to the cyclic carbonate compound (A) in the resin composition (component (C) / component (A)) is not particularly limited, but is preferably 1,000 or less, more preferably 500 or less, and particularly preferably 100 or less.

[0111] <(D) Active ester compound> The resin composition of the present invention preferably contains an active ester compound (D). The active ester compound (D) may be used alone or in combination of two or more kinds in any ratio. The active ester compound (D) may function as an epoxy resin curing agent that reacts with the epoxy resin (B) to cure the epoxy resin.

[0112] As the (D) active ester compound, generally, compounds having two or more highly reactive ester groups in one molecule, such as phenol esters, thiophenol esters, N-hydroxyamine esters, and esters of heterocyclic hydroxy compounds, are preferably used. The active ester compound is preferably one obtained by a condensation reaction between a carboxylic acid compound and / or a thiocarboxylic acid compound and a hydroxy compound and / or a thiol compound. In particular, from the viewpoint of improving heat resistance, an active ester compound obtained from a carboxylic acid compound and a hydroxy compound is preferred, and an active ester compound obtained from a carboxylic acid compound and a phenol compound and / or a naphthol compound is more preferred. Examples of the carboxylic acid compound include benzoic acid, acetic acid, succinic acid, maleic acid, itaconic acid, phthalic acid, isophthalic acid, terephthalic acid, and pyromellitic acid. Examples of phenol compounds or naphthol compounds include hydroquinone, resorcin, bisphenol A, bisphenol F, bisphenol S, phenolphthaline, methylated bisphenol A, methylated bisphenol F, methylated bisphenol S, phenol, o-cresol, m-cresol, p-cresol, catechol, α-naphthol, β-naphthol, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, dihydroxybenzophenone, trihydroxybenzophenone, tetrahydroxybenzophenone, phloroglucin, benzenetriol, dicyclopentadiene-type diphenol compounds, phenol novolac, etc. Here, the term "dicyclopentadiene-type diphenol compounds" refers to diphenol compounds obtained by condensing one molecule of dicyclopentadiene with two molecules of phenol.

[0113] Specifically, the (D) active ester compound is preferably a dicyclopentadiene type active ester compound, a naphthalene type active ester compound containing a naphthalene structure, an active ester compound containing an acetylated product of phenol novolac, or an active ester compound containing a benzoylated product of phenol novolac, and more preferably at least one selected from a dicyclopentadiene type active ester compound and a naphthalene type active ester compound. As the dicyclopentadiene type active ester compound, an active ester compound containing a dicyclopentadiene type diphenol structure is preferred.

[0114] (D) Commercially available active ester compounds include, as active ester compounds containing a dicyclopentadiene-type diphenol structure, "EXB9451", "EXB9460", "EXB9460S", "HPC-8000L-65TM", "HPC-8000-65T", "HPC-8000H", and "HPC-8000H-65TM" (manufactured by DIC Corporation); and as active ester compounds containing a naphthalene structure, "HP-B-8151-62T", "EXB-8100L-65T", "EXB-9416-70BK", and "HPC-8150-62T". " or "EXB-8" (manufactured by DIC Corporation); an active ester compound containing phosphorus, "EXB9401" (manufactured by DIC Corporation), an active ester compound which is an acetylated product of phenol novolac, "DC808" (manufactured by Mitsubishi Chemical Corporation), active ester compounds which are benzoylated products of phenol novolac, "YLH1026", "YLH1030", and "YLH1048" (manufactured by Mitsubishi Chemical Corporation), and an active ester compound containing a styryl group and a naphthalene structure, "PC1300-02-65MA" (manufactured by Air Water Corporation), etc.

[0115] The active ester group equivalent of the (D) active ester compound (reactive group equivalent as a curing agent) is preferably 50 g / eq. to 500 g / eq., more preferably 50 g / eq. to 400 g / eq., and further preferably 100 g / eq. to 300 g / eq. The active ester group equivalent is the mass of the active ester compound per equivalent of the active ester group.

[0116] The content of the (D) active ester compound in the resin composition is not particularly limited, but is preferably 1% by mass or more, more preferably 5% by mass or more, even more preferably 10% by mass or more, even more preferably 12% by mass or more, and particularly preferably 13% by mass or more, when the non-volatile components in the resin composition are taken as 100% by mass. The upper limit of the content of the (D) active ester compound in the resin composition is not particularly limited, but is preferably 50% by mass or less, more preferably 40% by mass or less, even more preferably 30% by mass or less, even more preferably 25% by mass or less, and particularly preferably 20% by mass or less, when the non-volatile components in the resin composition are taken as 100% by mass.

[0117] The mass ratio of the active ester compound (D) to the cyclic carbonate compound (A) in the resin composition (component (D) / component (A)) is not particularly limited, but is preferably 0.5 or more, more preferably 1 or more, and particularly preferably 5 or more. The upper limit of the mass ratio of the active ester compound (D) to the cyclic carbonate compound (A) in the resin composition (component (D) / component (A)) is not particularly limited, but is preferably 100 or less, more preferably 30 or less, and particularly preferably 15 or less.

[0118] <(D') Other hardeners> The resin composition of the present invention may further contain a (D') curing agent other than the (D) component as an optional component. The (D') other curing agent may be used alone or in any combination of two or more. The (D') other curing agent may function as an epoxy resin curing agent that reacts with the (B) epoxy resin to cure it, similar to the (D) active ester curing agent.

[0119] (D') The other curing agent is not particularly limited, but examples thereof include phenol-based curing agents, carbodiimide-based curing agents, acid anhydride-based curing agents, amine-based curing agents, benzoxazine-based curing agents, cyanate ester-based curing agents, and thiol-based curing agents. Among them, a curing agent selected from the group consisting of phenol-based curing agents and carbodiimide-based curing agents is preferred, and it is more preferred that the resin composition of the present invention contains both a phenol-based curing agent and a carbodiimide-based curing agent.

[0120] As the phenol-based curing agent, from the viewpoint of heat resistance and water resistance, a phenol-based curing agent having a novolac structure is preferable. Also, from the viewpoint of adhesion to the adherend, a nitrogen-containing phenol-based curing agent is preferable, and a triazine skeleton-containing phenol-based curing agent is more preferable. Among them, from the viewpoint of highly satisfying heat resistance, water resistance, and adhesion, a triazine skeleton-containing phenol novolac resin is preferable. Specific examples of phenol-based curing agents include "MEH-7700", "MEH-7810", and "MEH-7851" manufactured by Meiwa Kasei Co., Ltd.; "NHN", "CBN", and "GPH" manufactured by Nippon Kayaku Co., Ltd.; "SN-170", "SN-180", "SN-190", "SN-475", "SN-485", "SN-495", "SN-375", and "SN-395" manufactured by Nippon Steel Chemical & Material Co., Ltd.; and "LA-7052", "LA-7054", "LA-3018", "LA-3018-50P", "LA-1356", "TD2090", and "KA-1160" manufactured by DIC Corporation.

[0121] Examples of the carbodiimide-based curing agent include curing agents having one or more, preferably two or more, carbodiimide structures in one molecule, such as aliphatic biscarbodiimides, such as tetramethylene-bis(t-butylcarbodiimide) and cyclohexane bis(methylene-t-butylcarbodiimide); aromatic biscarbodiimides, such as phenylene-bis(xylylcarbodiimide); and aliphatic polycarbodiimides, such as polyhexamethylenecarbodiimide, polytrimethylhexamethylenecarbodiimide, polycyclohexylenecarbodiimide, poly(methylenebiscyclohexylenecarbodiimide), and poly(isophoronecarbodiimide). ; polycarbodiimides such as aromatic polycarbodiimides such as poly(phenylenecarbodiimide), poly(naphthylenecarbodiimide), poly(tolylenecarbodiimide), poly(methyldiisopropylphenylenecarbodiimide), poly(triethylphenylenecarbodiimide), poly(diethylphenylenecarbodiimide), poly(triisopropylphenylenecarbodiimide), poly(diisopropylphenylenecarbodiimide), poly(xylylenecarbodiimide), poly(tetramethylxylylenecarbodiimide), poly(methylenediphenylenecarbodiimide), and poly[methylenebis(methylphenylene)carbodiimide].

[0122] Commercially available carbodiimide curing agents include, for example, "Carbodilite V-02B", "Carbodilite V-03", "Carbodilite V-04K", "Carbodilite V-07", and "Carbodilite V-09" manufactured by Nisshinbo Chemical Inc.; and "Stavaxol P", "Stavaxol P400", and "Hi-Kasil 510" manufactured by Rhein Chemie.

[0123] Examples of the acid anhydride curing agent include a curing agent having one or more acid anhydride groups in one molecule, and a curing agent having two or more acid anhydride groups in one molecule is preferable. Specific examples of the acid anhydride curing agent include phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, methylnadic anhydride, hydrogenated methylnadic anhydride, trialkyltetrahydrophthalic anhydride, dodecenyl succinic anhydride, 5-(2,5-dioxotetrahydro-3-furanyl)-3-methyl-3-cyclohexene-1,2-dicarboxylic anhydride, trimellitic anhydride, pyromellitic anhydride, benzophenonetetracarboxylic dianhydride, and the like. Examples of acid anhydrides include anhydrides, biphenyltetracarboxylic dianhydride, naphthalenetetracarboxylic dianhydride, oxydiphthalic dianhydride, 3,3'-4,4'-diphenylsulfonetetracarboxylic dianhydride, 1,3,3a,4,5,9b-hexahydro-5-(tetrahydro-2,5-dioxo-3-furanyl)-naphtho[1,2-C]furan-1,3-dione, ethylene glycol bis(anhydrotrimellitate), and polymeric acid anhydrides such as styrene-maleic acid resin, which is a copolymer of styrene and maleic acid. Commercially available acid anhydride curing agents include "HNA-100", "MH-700", "MTA-15", "DDSA", and "OSA" manufactured by New Japan Chemical Co., Ltd., "YH-306" and "YH-307" manufactured by Mitsubishi Chemical Corporation, "HN-2200" and "HN-5500" manufactured by Hitachi Chemical Co., Ltd., and "EF-30", "EF-40", "EF-60", and "EF-80" manufactured by Clay Valley.

[0124] The amine-based curing agent may be a curing agent having one or more, preferably two or more, amino groups in one molecule, such as aliphatic amines, polyether amines, alicyclic amines, aromatic amines, etc., and among them, aromatic amines are preferred from the viewpoint of achieving the desired effects of the present invention. The amine-based curing agent is preferably a primary amine or secondary amine, and more preferably a primary amine. Specific examples of amine-based curing agents include 4,4'-methylenebis(2,6-dimethylaniline), 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenyl sulfone, 3,3'-diaminodiphenyl sulfone, m-phenylenediamine, m-xylylenediamine, diethyltoluenediamine, 4,4'-diaminodiphenyl ether, 3,3'-dimethyl-4,4'-diaminobiphenyl, 2,2'-dimethyl-4,4'-diaminobiphenyl, 3,3'-dihydroxybenzidine, and 2,2-bis(3-amino-4-hydroxyphenyl)propane. propane, 3,3-dimethyl-5,5-diethyl-4,4-diphenylmethanediamine, 2,2-bis(4-aminophenyl)propane, 2,2-bis(4-(4-aminophenoxy)phenyl)propane, 1,3-bis(3-aminophenoxy)benzene, 1,3-bis(4-aminophenoxy)benzene, 1,4-bis(4-aminophenoxy)benzene, 4,4'-bis(4-aminophenoxy)biphenyl, bis(4-(4-aminophenoxy)phenyl)sulfone, bis(4-(3-aminophenoxy)phenyl)sulfone, and the like. As the amine-based curing agent, commercially available products may be used, and examples thereof include "SEIKACURE-S" manufactured by Seika Corporation, "KAYABOND C-200S", "KAYABOND C-100", "KAYAHARD AA", "KAYAHARD AB", and "KAYAHARD AS" manufactured by Nippon Kayaku Co., Ltd., and "Epicure W" manufactured by Mitsubishi Chemical Corporation.

[0125] Specific examples of benzoxazine-based curing agents include "JBZ-OP100D" and "ODA-BOZ" manufactured by JFE Chemical Corporation; "HFB2006M" manufactured by Showa Polymer Co., Ltd.; and "Pd" and "Fa" manufactured by Shikoku Chemical Industry Co., Ltd.

[0126] Examples of the cyanate ester curing agent include bifunctional cyanate resins such as bisphenol A dicyanate, polyphenol cyanate (oligo(3-methylene-1,5-phenylene cyanate)), 4,4'-methylenebis(2,6-dimethylphenyl cyanate), 4,4'-ethylidene diphenyl dicyanate, hexafluorobisphenol A dicyanate, 2,2-bis(4-cyanate)phenylpropane, 1,1-bis(4-cyanate phenylmethane), bis(4-cyanate-3,5-dimethylphenyl)methane, 1,3-bis(4-cyanate phenyl-1-(methylethylidene))benzene, bis(4-cyanate phenyl)thioether, and bis(4-cyanate phenyl)ether; polyfunctional cyanate resins derived from phenol novolac and cresol novolac; and prepolymers in which these cyanate resins are partially converted to triazine. Specific examples of cyanate ester-based curing agents include "PT30" and "PT60" (both of which are phenol novolac-type multifunctional cyanate ester resins), "BA230" and "BA230S75" (prepolymers in which part or all of bisphenol A dicyanate has been converted to triazine to form a trimer), all of which are manufactured by Lonza Japan.

[0127] Examples of thiol-based curing agents include trimethylolpropane tris(3-mercaptopropionate), pentaerythritol tetrakis(3-mercaptobutyrate), and tris(3-mercaptopropyl)isocyanurate.

[0128] The reactive group equivalent of the (D') other curing agent is preferably 50 g / eq. to 3000 g / eq., more preferably 100 g / eq. to 1000 g / eq., further preferably 100 g / eq. to 500 g / eq., and particularly preferably 100 g / eq. to 300 g / eq. The reactive group equivalent is the mass of the curing agent per equivalent of reactive group. The reactive group means a group that reacts with an epoxy resin, and varies depending on the type of curing agent, such as a phenolic curing agent being a phenolic hydroxyl group and a carbodiimide curing agent being a carbodiimide group.

[0129] The content of the (D') other curing agent in the resin composition is not particularly limited, but is preferably 15% by mass or less, more preferably 10% by mass or less, even more preferably 5% by mass or less, and particularly preferably 3.5% by mass or less, when the non-volatile components in the resin composition are 100% by mass. The lower limit of the content of the (D') other curing agent in the resin composition is not particularly limited, but may be, for example, 0% by mass or more, 0.1% by mass or more, 1% by mass or more, 1.5% by mass or more, 2% by mass or more, 2.5% by mass or more, when the non-volatile components in the resin composition are 100% by mass.

[0130] The content of the (D) active ester compound in the resin composition is preferably 10 mass% or more, more preferably 30 mass% or more, even more preferably 40 mass% or more, and particularly preferably 50 mass% or more, when the total of the (D) active ester compound and (D') other curing agents in the resin composition is 100 mass%.

[0131] The ratio of the total molar equivalent number of epoxy groups in the epoxy resin (B) to the total molar equivalent number of curing agent reactive groups in the active ester compound (D) and the other curing agents (D') in the resin composition (curing agent reactive groups / epoxy groups) is preferably in the range of 0.2 to 2, more preferably in the range of 0.5 to 1.8, and even more preferably in the range of 1 to 1.5. "The total molar equivalent number of epoxy groups in the epoxy resin (B)" indicates the sum of the values ​​obtained by dividing the mass of the epoxy resin (B) present in the resin composition by the epoxy equivalent. In addition, "The total molar equivalent number of curing agent reactive groups in the active ester compound (D) and the other curing agents (D')" indicates the sum of the value obtained by dividing the mass of the active ester compound (D) present in the resin composition by the active ester group equivalent, and the value obtained by dividing the mass of the other curing agents (D') by the reactive group equivalent.

[0132] <(E) Compound containing a radically polymerizable group> The resin composition of the present invention may contain (E) a radical polymerizable group-containing compound. (B) The radical polymerizable group-containing compound is a compound containing one or more (preferably two or more) radical polymerizable groups in one molecule. (E) The radical polymerizable group-containing compound may be used alone or in combination of two or more.

[0133] The radically polymerizable group is a group having a radically polymerizable ethylenically unsaturated bond, and is not particularly limited. Examples thereof include, but are not limited to, (1) Formula (R):

[0134] [ka]

[0135] [In the formula, R a each independently represents a hydrogen atom or a methyl group; X a each independently represents a carbonyl group, a methylene group, or a phenylene group; * represents a bonding site. A group represented by (2) Maleimide group (2,5-dihydro-2,5-dioxo-1H-pyrrol-1-yl group) and the like.

[0136] In the first embodiment, the (E) radical polymerizable group-containing compound preferably contains a thermoplastic resin (e.g., a number average molecular weight of 800 or more) having two or more groups represented by the above formula (R). The thermoplastic resin is not particularly limited, but examples thereof include phenoxy resin, polyvinyl acetal resin, polystyrene resin, polyethylene resin, polypropylene resin, polybutadiene resin, polyimide resin, polyamideimide resin, polyetherimide resin, polysulfone resin, polyethersulfone resin, polyphenylene ether resin, polyetheretherketone resin, and polyester resin, and the (E) radical polymerizable group-containing compound in this embodiment contains a modified resin of these resins having two or more groups represented by the above formula (R).

[0137] In the first embodiment, the (E) radically polymerizable group-containing compound more preferably contains a resin selected from a modified polyphenylene ether resin having two or more groups represented by the above formula (R) and a modified polystyrene resin having two or more groups represented by the above formula (R), still more preferably contains a modified polyphenylene ether resin having two or more groups represented by the above formula (R), and particularly preferably contains a modified polyphenylene ether resin having two or more groups represented by the above formula (2):

[0138] [ka]

[0139] [In the formula, R b each independently represents a hydrogen atom or a methyl group; X b are each independently a carbonyl group, a methylene group, a phenylene group, or a phenylene-methylene group (the bonding direction is not particularly limited, but the phenylene side is "R b -C" is preferably bonded to C; R 11 and R 12 each independently represents an alkyl group; R 13 , R 14 , R 21 , R 22 , R 23 and R 24 each independently represents a hydrogen atom or an alkyl group; A represents a single bond, -C(R c )2-, -O-, -CO-, -S-, -SO-, or -SO2-; R c each independently represents a hydrogen atom or an alkyl group; p represents 0 or 1; and q and r each independently represent an integer of 1 or more. The q units and the r units may be the same or different for each unit.

[0140] R b Each of X independently represents a hydrogen atom or a methyl group. bare each independently a carbonyl group, a methylene group, a phenylene group, or a phenylene-methylene group (the bonding direction is not particularly limited, but the phenylene side is "R b -C" is preferably bonded to C), and is preferably a carbonyl group or a phenylene-methylene group.

[0141] R 11 and R 12 R each independently represents an alkyl group, and is preferably a methyl group. 13 and R 14 R each independently represents a hydrogen atom or an alkyl group, and is preferably a hydrogen atom. 21 and R 22 R each independently represents a hydrogen atom or an alkyl group, preferably a hydrogen atom or a methyl group, and more preferably a methyl group. 23 and R 24 each independently represents a hydrogen atom or an alkyl group, and is preferably a hydrogen atom or a methyl group.

[0142] A is a single bond, -C(R c )2-, -O-, -CO-, -S-, -SO-, or -SO2-, and preferably a single bond, -C(R c )2- or -O-. c each independently represents a hydrogen atom or an alkyl group, and is preferably a hydrogen atom or a methyl group. p represents 0 or 1, and is preferably 1. q and r each independently represent an integer of 1 or more, and is preferably an integer of 1 to 200, and more preferably an integer of 1 to 100.

[0143] The radical polymerizable group equivalent of the (E) radical polymerizable group-containing compound in the first embodiment is preferably 300 g / eq. to 2500 g / eq., more preferably 400 g / eq. to 2000 g / eq. The radical polymerizable group equivalent represents the mass of the resin (compound) per equivalent of the radical polymerizable group.

[0144] The number average molecular weight of the radically polymerizable group-containing compound (E) in the first embodiment is preferably 800 to 10000, more preferably 900 to 5000. The number average molecular weight of the resin can be measured by gel permeation chromatography (GPC) as a polystyrene-equivalent value.

[0145] Examples of commercially available products of the (E) radically polymerizable group-containing compound in the first embodiment include "OPE-2St 1200" and "OPE-2St 2200" (vinylbenzyl-modified polyphenylene ether resins) manufactured by Mitsubishi Gas Chemical Company, Inc.; and "SA9000" and "SA9000-111" (methacrylic-modified polyphenylene ether resins) manufactured by SABIC Innovative Plastics.

[0146] In the second embodiment, the radical polymerizable group-containing compound (E) is preferably represented by the formula (3′):

[0147] [ka]

[0148] [In the formula, ring B represents a monocycloalkane ring which may have a substituent, or a monocycloalkene ring which may have a substituent; i and j each independently represent an integer of 0 or 1 or more, and the sum of i and j is 6 or more; and * represents a bonding site.] The maleimide compound includes a maleimide compound having a partial structure represented by the following formula: The maleimide compound means a compound containing at least one maleimide group (2,5-dihydro-2,5-dioxo-1H-pyrrol-1-yl group) in one molecule. The number of maleimide groups in one molecule of the maleimide compound in the second embodiment is preferably 2 or more, and particularly preferably 2. The maleimide compound in the second embodiment may be used alone or in combination of two or more at any ratio.

[0149] The monocycloalkane ring means a monocyclic aliphatic saturated hydrocarbon ring. The monocycloalkane ring is preferably a monocycloalkane ring having 4 to 14 carbon atoms, more preferably a monocycloalkane ring having 4 to 10 carbon atoms, and particularly preferably a monocycloalkane ring having 5 or 6 carbon atoms. Examples of the monocycloalkane ring include a cyclobutane ring, a cyclopentane ring, a cyclohexane ring, a cycloheptane ring, and a cyclooctane ring. The monocycloalkene ring means a monocyclic aliphatic unsaturated hydrocarbon ring having at least one carbon-carbon double bond. The monocycloalkene ring is preferably a monocycloalkene ring having 4 to 14 carbon atoms, more preferably a monocycloalkene ring having 4 to 10 carbon atoms, and particularly preferably a monocycloalkene ring having 5 or 6 carbon atoms. Examples of the monocycloalkene ring include a cyclobutene ring, a cyclopentene ring, a cyclohexene ring, a cycloheptene ring, a cyclooctene ring, a cyclopentadiene ring, and a cyclohexadiene ring.

[0150] The "substituents" of the monocycloalkane ring and the monocycloalkene ring include the same as the "substituents" that the aromatic carbocyclic ring in the above-mentioned ring Z' may have.

[0151] Ring B represents a monocycloalkane ring which may have a substituent, or a monocycloalkene ring which may have a substituent. Ring B is preferably a monocycloalkane ring which may have a group selected from an alkyl group and an alkenyl group; or a monocycloalkene ring which may have a group selected from an alkyl group and an alkenyl group. Ring B is more preferably a monocycloalkane ring which may have a group selected from an alkyl group having 1 to 14 carbon atoms and an alkenyl group having 2 to 14 carbon atoms; or a monocycloalkene ring which may have a group selected from an alkyl group having 1 to 14 carbon atoms and an alkenyl group having 2 to 14 carbon atoms.

[0152] i and j each independently represent an integer of 0 or 1 or more, and the sum of i and j is 6 or more (preferably 8 or more, more preferably 10 or more). i and j are preferably each independently an integer of 0 to 20, and the sum of i and j is 6 or more (preferably 8 or more, more preferably 10 or more). i and j are more preferably each independently an integer of 1 to 20, and the sum of i and j is 6 or more (preferably 8 or more, more preferably 10 or more). i and j are further preferably each independently an integer of 5 to 10. i and j are particularly preferably 8.

[0153] In the second embodiment, the radical polymerizable group-containing compound (E) is particularly preferably a compound represented by formula (3):

[0154] [ka]

[0155] [In the formula, R 10 each independently represents a substituent; each ring C independently represents an aromatic ring which may have a substituent; D 1 and D. 2 are each independently a single bond, -C(R x )2-, -O-, -CO-, -S-, -SO-, -SO2-, -CONH-, -NHCO-, -COO-, or -OCO-; R x each independently represents a hydrogen atom or an alkyl group; each a independently represents 0 or 1; each b independently represents an integer of 0 or 1 or more; each c independently represents 0, 1, or 2; each m independently represents an integer of 0 or 1 or more; and the other symbols are the same as above. The b units, c units and m units may be the same or different for each unit.

[0156] The aromatic ring means a ring that follows the Huckel rule, in which the number of electrons contained in the π electron system on the ring is 4p+2 (p is a natural number). The aromatic ring may be an aromatic carbocycle having only carbon atoms as ring-constituting atoms, or an aromatic heterocycle having heteroatoms such as oxygen atoms, nitrogen atoms, and sulfur atoms in addition to carbon atoms as ring-constituting atoms, but in one embodiment, it is preferably an aromatic carbocycle. In one embodiment, the aromatic ring is preferably a 5- to 14-membered aromatic ring, more preferably a 6- to 14-membered aromatic ring, and even more preferably a 6- to 10-membered aromatic ring. Suitable specific examples of the aromatic ring include a benzene ring, a naphthalene ring, an anthracene ring, and a phenanthrene ring, and more preferably a benzene ring or a naphthalene ring, and particularly preferably a benzene ring.

[0157] R 10 and the "substituent" of the aromatic ring include the same as the "substituent" that the aromatic carbocyclic ring in ring Z' described above may have.

[0158] Each ring C is independently an aromatic ring which may have a substituent, and is preferably a benzene ring which may have a substituent selected from an alkyl group. 1 and D. 2 are each independently a single bond, -C(R x )2-, -O-, -CO-, -S-, -SO-, -SO2-, -CONH-, -NHCO-, -COO-, or -OCO-, and preferably a single bond, -C(R x )2- or -O-. x each independently represents a hydrogen atom or an alkyl group, preferably a hydrogen atom or a methyl group. each a independently represents 0 or 1, preferably 0. each b independently represents 0 or an integer of 1 or more, preferably 0, 1, 2 or 3, more preferably 0, 1 or 2. each c independently represents 0, 1 or 2, preferably 0. each m independently represents 0 or an integer of 1 or more, preferably 0.

[0159] Formula (D) contained in formula (3):

[0160] [ka]

[0161] [In the formula, * indicates a binding site; other symbols are as above.] The partial structure represented by the formula (D-1) to (D-3):

[0162] [ka]

[0163] [In the formula, * is the same as above.] Examples of the partial structure include those represented by the following formula:

[0164] The radical polymerizable group equivalent of the (E) radical polymerizable group-containing compound in the second embodiment is preferably 200 g / eq. to 2500 g / eq., more preferably 250 g / eq. to 2000 g / eq., and further preferably 300 g / eq. to 1500 g / eq. The (E) radical polymerizable group-containing compound has a radical polymerizable group equivalent of the mass of the resin per equivalent of the radical polymerizable group.

[0165] The weight average molecular weight of the (E) radically polymerizable group-containing compound in the second embodiment is preferably 400 to 10,000, more preferably 500 to 7,000, and particularly preferably 600 to 5,000.

[0166] Examples of commercially available products of the (E) radically polymerizable group-containing compound in the second embodiment include “BMI-689”, “BMI-1500”, “BMI-1700”, and “BMI-3000J” manufactured by Designer Molecules, Inc., and “SLK-6895-T90” manufactured by Shin-Etsu Chemical Co., Ltd.

[0167] In the third embodiment, the radical polymerizable group-containing compound (E) is preferably represented by the formula (4):

[0168] [ka]

[0169] [In the formula, R 20 each independently represents a hydrogen atom or an alkyl group; ring E, ring F and ring G each independently represent an aromatic ring which may have a substituent; Z 1 are each independently a single bond, -C(R z )2-, -O-, -CO-, -S-, -SO-, -SO2-, -CONH-, or -NHCO-; R z each independently represents a hydrogen atom or an alkyl group; s represents an integer of 1 or more; each independently represents 0 or 1; and each independently represents 0, 1, 2, or 3. The maleimide compound according to the third embodiment includes a maleimide compound represented by the following formula: The s unit and the u unit may be the same or different for each unit. The maleimide compound according to the third embodiment may be used alone or in combination of two or more kinds at any ratio.

[0170] R 20 are each independently a hydrogen atom or an alkyl group, preferably a hydrogen atom or a methyl group, and more preferably a hydrogen atom. Ring E, ring F, and ring G are each independently an aromatic ring which may have a substituent, preferably a benzene ring which may have a substituent, more preferably a benzene ring which may be substituted with a group selected from an alkyl group and an aryl group, and particularly preferably an (unsubstituted) benzene ring.

[0171] Z 1 are each independently a single bond, -C(R z )2-, -O-, -CO-, -S-, -SO-, -SO2-, -CONH-, or -NHCO-, and preferably a single bond, -C(R z )2- or -O-, more preferably a single bond or -C(R z )2-, and particularly preferably a single bond. zeach independently represents a hydrogen atom or an alkyl group, and is preferably a hydrogen atom or a methyl group.

[0172] Each s represents an integer of 1 or more, and preferably an integer of 1 to 10. Each t independently represents 0 or 1, and preferably 1. Each u independently represents 0, 1, 2 or 3, and preferably 0, 1 or 2, more preferably 0 or 1, and particularly preferably 1.

[0173] The radical polymerizable group equivalent of the (E) radical polymerizable group-containing compound in the third embodiment is preferably 150 g / eq. to 1000 g / eq., and more preferably 200 g / eq. to 500 g / eq.

[0174] The weight average molecular weight of the (E) radically polymerizable group-containing compound in the third embodiment is preferably 100 to 10,000, more preferably 150 to 5,000, and particularly preferably 200 to 3,000.

[0175] Commercially available products of the radically polymerizable group-containing compound (E) in the third embodiment include, for example, "MIR-3000-70MT" and "MIR-5000-60T" manufactured by Nippon Kayaku Co., Ltd.

[0176] The (E) radically polymerizable group-containing compound may contain any one of the suitable thermoplastic resins in the first embodiment, the suitable maleimide compounds in the second embodiment, and the suitable maleimide compounds in the third embodiment alone, or may contain a combination of two or more of these in any ratio.

[0177] The radical polymerizable group equivalent of the (E) radical polymerizable group-containing compound is preferably 30 g / eq. to 2500 g / eq., and particularly preferably 75 g / eq. to 2000 g / eq.

[0178] The content of the (E) radical polymerizable group-containing compound in the resin composition is not particularly limited, but is preferably 50% by mass or less, more preferably 30% by mass or less, even more preferably 20% by mass or less, even more preferably 10% by mass or less, and particularly preferably 5% by mass or less, when the non-volatile components in the resin composition are 100% by mass. The lower limit of the content of the (E) radical polymerizable group-containing compound in the resin composition is not particularly limited, but may be, for example, 0.01% by mass or more, 0.1% by mass or more, 0.5% by mass or more, 1% by mass or more, etc., when the non-volatile components in the resin composition are 100% by mass.

[0179] <(F)Thermoplastic resin> The resin composition of the present invention may further contain a thermoplastic resin (F) as an optional component. The thermoplastic resin (F) is a component that does not fall under the category of the epoxy resin (B) explained above.

[0180] Examples of the (F) thermoplastic resin include polyimide resin, phenoxy resin, polyvinyl acetal resin, polyolefin resin, polybutadiene resin, polyamideimide resin, polyetherimide resin, polysulfone resin, polyethersulfone resin, polyphenylene ether resin, polycarbonate resin, polyetheretherketone resin, polyester resin, etc. In one embodiment, the (F) thermoplastic resin preferably contains a thermoplastic resin selected from the group consisting of polyimide resin and phenoxy resin, and more preferably contains a phenoxy resin. The thermoplastic resin may be used alone or in combination of two or more kinds.

[0181] Specific examples of polyimide resins include "SLK-6100" manufactured by Shin-Etsu Chemical Co., Ltd., and "Rikacoat SN20" and "Rikacoat PN20" manufactured by New Japan Chemical Co., Ltd.

[0182] Examples of the phenoxy resin include phenoxy resins having one or more skeletons selected from the group consisting of bisphenol A skeleton, bisphenol F skeleton, bisphenol S skeleton, bisphenolacetophenone skeleton, novolac skeleton, biphenyl skeleton, fluorene skeleton, dicyclopentadiene skeleton, norbornene skeleton, naphthalene skeleton, anthracene skeleton, adamantane skeleton, terpene skeleton, and trimethylcyclohexane skeleton. The terminal of the phenoxy resin may be any functional group such as a phenolic hydroxyl group or an epoxy group.

[0183] Specific examples of phenoxy resins include "1256" and "4250" manufactured by Mitsubishi Chemical Corporation (both of which are phenoxy resins containing a bisphenol A skeleton); "YX8100" manufactured by Mitsubishi Chemical Corporation (phenoxy resin containing a bisphenol S skeleton); "YX6954" manufactured by Mitsubishi Chemical Corporation (phenoxy resin containing a bisphenol acetophenone skeleton), "FX280" and "FX293" manufactured by Nippon Steel Chemical & Material Co., Ltd.; and "YX7200B35", "YL7500BH30", "YX6954BH30", "YX7553BH30", "YL7769BH30", "YL6794", "YL7213", "YL7290", and "YL7482" manufactured by Mitsubishi Chemical Corporation.

[0184] Examples of polyvinyl acetal resin include polyvinyl formal resin and polyvinyl butyral resin, and polyvinyl butyral resin is preferred.Specific examples of polyvinyl acetal resin include "Denka Butyral 4000-2", "Denka Butyral 5000-A", "Denka Butyral 6000-C", and "Denka Butyral 6000-EP" manufactured by Denki Kagaku Kogyo Co., Ltd.; S-LEC BH series, BX series (e.g. BX-5Z), KS series (e.g. KS-1), BL series, and BM series manufactured by Sekisui Chemical Co., Ltd.

[0185] Examples of polyolefin resins include ethylene-based copolymer resins such as low-density polyethylene, very low-density polyethylene, high-density polyethylene, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, and ethylene-methyl acrylate copolymer; and polyolefin polymers such as polypropylene and ethylene-propylene block copolymer.

[0186] Examples of polybutadiene resins include hydrogenated polybutadiene skeleton-containing resins, hydroxy group-containing polybutadiene resins, phenolic hydroxy group-containing polybutadiene resins, carboxy group-containing polybutadiene resins, acid anhydride group-containing polybutadiene resins, epoxy group-containing polybutadiene resins, isocyanate group-containing polybutadiene resins, urethane group-containing polybutadiene resins, polyphenylene ether-polybutadiene resins, and the like.

[0187] Specific examples of polyamide-imide resins include "Viromax HR11NN" and "Viromax HR16NN" manufactured by Toyobo Co., Ltd. Specific examples of polyamide-imide resins also include modified polyamide-imides such as "KS9100" and "KS9300" (polysiloxane skeleton-containing polyamide-imide) manufactured by Hitachi Chemical Co., Ltd.

[0188] A specific example of the polyethersulfone resin is "PES5003P" manufactured by Sumitomo Chemical Co., Ltd.

[0189] Specific examples of polysulfone resins include polysulfones "P1700" and "P3500" manufactured by Solvay Advanced Polymers.

[0190] A specific example of the polyphenylene ether resin is NORYL SA90 manufactured by SABIC, etc. A specific example of the polyetherimide resin is ULTEM manufactured by GE, etc.

[0191] Examples of polycarbonate resins include hydroxyl group-containing carbonate resins, phenolic hydroxyl group-containing carbonate resins, carboxyl group-containing carbonate resins, acid anhydride group-containing carbonate resins, isocyanate group-containing carbonate resins, and urethane group-containing carbonate resins. Specific examples of polycarbonate resins include Mitsubishi Gas Chemical's "FPC0220," Asahi Kasei Chemical's "T6002" and "T6001" (polycarbonate diols), and Kuraray's "C-1090," "C-2090," and "C-3090" (polycarbonate diols). Specific examples of polyether ether ketone resins include Sumitomo Chemical's "Sumiploy K."

[0192] Examples of the polyester resin include polyethylene terephthalate resin, polyethylene naphthalate resin, polybutylene terephthalate resin, polybutylene naphthalate resin, polytrimethylene terephthalate resin, polytrimethylene naphthalate resin, and polycyclohexane dimethyl terephthalate resin.

[0193] From the viewpoint of further improving film formability, the weight average molecular weight (Mw) of the (F) thermoplastic resin is preferably 5,000 or more, more preferably 8,000 or more, even more preferably 10,000 or more, particularly preferably 20,000 or more, and is preferably 100,000 or less, more preferably 70,000 or less, even more preferably 60,000 or less, particularly preferably 50,000 or less.

[0194] The content of the (F) thermoplastic resin relative to the total non-volatile components in the resin composition is not particularly limited, but when the non-volatile components in the resin composition are taken as 100 mass%, it may be preferably 20 mass% or less, more preferably 15 mass% or less, even more preferably 10 mass% or less, even more preferably 5 mass% or less, and particularly preferably 3 mass% or less. The lower limit of the content of the (F) thermoplastic resin relative to the total non-volatile components is not particularly limited, but when the non-volatile components in the resin composition are taken as 100 mass%, it is, for example, 0 mass% or more, 0.01 mass% or more, 0.1 mass% or more, etc.

[0195] <(G) Curing accelerator> The resin composition of the present invention may further contain, as an optional component, a curing accelerator (G). The curing accelerator (G) functions as a curing catalyst that accelerates the curing of the epoxy resin (B).

[0196] Examples of the (G) curing accelerator include phosphorus-based curing accelerators, urea-based curing accelerators, guanidine-based curing accelerators, imidazole-based curing accelerators, metal-based curing accelerators, and amine-based curing accelerators. The (G) curing accelerator preferably contains a curing accelerator selected from imidazole-based curing accelerators and amine-based curing accelerators, and more preferably contains an imidazole-based curing accelerator. The (G) curing accelerator may be used alone or in combination of two or more.

[0197] Examples of the phosphorus-based curing accelerator include aliphatic phosphonium salts such as tetrabutylphosphonium bromide, tetrabutylphosphonium chloride, tetrabutylphosphonium acetate, tetrabutylphosphonium decanoate, tetrabutylphosphonium laurate, bis(tetrabutylphosphonium)pyromellitate, tetrabutylphosphonium hydrogenhexahydrophthalate, tetrabutylphosphonium 2,6-bis[(2-hydroxy-5-methylphenyl)methyl]-4-methylphenolate, and di-tert-butylmethylphosphonium tetraphenylborate; methyltriphenylphosphonium bromide, ethyltriphenylphosphonium bromide, propyltriphenylphosphonium bromide, butyltriphenylphosphonium bromide, benzyltriphenylphosphonium chloride, tetraphenylphosphonium bromide, p-tolyltriphenylphosphonium tetra-p-tolylborate ... aromatic phosphonium salts such as tetraphenylborate, tetraphenylphosphonium tetra-p-tolylborate, triphenylethylphosphonium tetraphenylborate, tris(3-methylphenyl)ethylphosphonium tetraphenylborate, tris(2-methoxyphenyl)ethylphosphonium tetraphenylborate, (4-methylphenyl)triphenylphosphonium thiocyanate, tetraphenylphosphonium thiocyanate, and butyltriphenylphosphonium thiocyanate; aromatic phosphine-borane complexes such as triphenylphosphine-triphenylborane; aromatic phosphine-quinone adducts such as triphenylphosphine-p-benzoquinone adduct; aliphatic phosphines such as tributylphosphine, tri-tert-butylphosphine, trioctylphosphine, di-tert-butyl(2-butenyl)phosphine, di-tert-butyl(3-methyl-2-butenyl)phosphine, and tricyclohexylphosphine;Dibutylphenylphosphine, di-tert-butylphenylphosphine, methyldiphenylphosphine, ethyldiphenylphosphine, butyldiphenylphosphine, diphenylcyclohexylphosphine, triphenylphosphine, tri-o-tolylphosphine, tri-m-tolylphosphine, tri-p-tolylphosphine, tris(4-ethylphenyl)phosphine, tris(4-propylphenyl)phosphine, tris(4-isopropylphenyl)phosphine, tris(4-butylphenyl)phosphine, tris(4-tert-butylphenyl)phosphine, tris(2,4-dimethylphenyl)phosphine, tris(2,5-dimethylphenyl)phosphine, tris(2,6-dimethylphenyl)phosphine Examples of aromatic phosphines include tris(3,5-dimethylphenyl)phosphine, tris(2,4,6-trimethylphenyl)phosphine, tris(2,6-dimethyl-4-ethoxyphenyl)phosphine, tris(2-methoxyphenyl)phosphine, tris(4-methoxyphenyl)phosphine, tris(4-ethoxyphenyl)phosphine, tris(4-tert-butoxyphenyl)phosphine, diphenyl-2-pyridylphosphine, 1,2-bis(diphenylphosphino)ethane, 1,3-bis(diphenylphosphino)propane, 1,4-bis(diphenylphosphino)butane, 1,2-bis(diphenylphosphino)acetylene, and 2,2'-bis(diphenylphosphino)diphenyl ether.

[0198] Examples of the urea-based curing accelerator include 1,1-dimethylurea; aliphatic dimethylureas such as 1,1,3-trimethylurea, 3-ethyl-1,1-dimethylurea, 3-cyclohexyl-1,1-dimethylurea, and 3-cyclooctyl-1,1-dimethylurea; 3-phenyl-1,1-dimethylurea, 3-(4-chlorophenyl)-1,1-dimethylurea, 3-(3,4-dichlorophenyl)-1,1-dimethylurea, 3-(3-chloro-4-methylphenyl)-1,1-dimethylurea, 3-(2-methylphenyl)-1,1-dimethylurea, 3-(4-methylphenyl)-1,1-dimethylurea, and 3-(3,4-dimethylphenyl)-1,1-dimethylurea. aromatic dimethylureas such as butylurea, 3-(4-isopropylphenyl)-1,1-dimethylurea, 3-(4-methoxyphenyl)-1,1-dimethylurea, 3-(4-nitrophenyl)-1,1-dimethylurea, 3-[4-(4-methoxyphenoxy)phenyl]-1,1-dimethylurea, 3-[4-(4-chlorophenoxy)phenyl]-1,1-dimethylurea, 3-[3-(trifluoromethyl)phenyl]-1,1-dimethylurea, N,N-(1,4-phenylene)bis(N',N'-dimethylurea), and N,N-(4-methyl-1,3-phenylene)bis(N',N'-dimethylurea) [toluene bisdimethylurea].

[0199] Examples of the guanidine curing accelerator include dicyandiamide, 1-methylguanidine, 1-ethylguanidine, 1-cyclohexylguanidine, 1-phenylguanidine, 1-(o-tolyl)guanidine, dimethylguanidine, diphenylguanidine, trimethylguanidine, tetramethylguanidine, pentamethylguanidine, 1,5,7-triazabicyclo[4.4.0]dec-5-ene, 7-methyl-1,5,7-triazabicyclo[4.4.0]dec-5-ene, 1-methylbiguanide, 1-ethylbiguanide, 1-n-butylbiguanide, 1-n-octadecylbiguanide, 1,1-dimethylbiguanide, 1,1-diethylbiguanide, 1-cyclohexylbiguanide, 1-allylbiguanide, 1-phenylbiguanide, and 1-(o-tolyl)biguanide.

[0200] Examples of the imidazole-based curing accelerator include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, and 1-benzyl-2-methylimidazole. Phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazolium trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2,4-diamino-6-[2'-methylimidazolyl -(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-undecylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-ethyl-4'-methylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine isocyanuric acid adduct, 2-phenylimidazole isocyanuric acid adduct imidazole compounds such as 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2,3-dihydro-1H-pyrrolo[1,2-a]benzimidazole, 1-dodecyl-2-methyl-3-benzylimidazolium chloride, 2-methylimidazoline, and 2-phenylimidazoline, as well as adducts of imidazole compounds and epoxy resins.

[0201] As the imidazole-based curing accelerator, commercially available products may be used, for example, "1B2PZ", "2MZA-PW", "2PHZ-PW", and "C11Z-A" manufactured by Shikoku Chemical Industry Co., Ltd., and "P200-H50" manufactured by Mitsubishi Chemical Corporation.

[0202] Examples of metal-based curing accelerators include organometallic complexes or organometallic salts of metals such as cobalt, copper, zinc, iron, nickel, manganese, and tin. Specific examples of organometallic complexes include organocobalt complexes such as cobalt(II) acetylacetonate and cobalt(III) acetylacetonate, organocopper complexes such as copper(II) acetylacetonate, organozinc complexes such as zinc(II) acetylacetonate, organoiron complexes such as iron(III) acetylacetonate, organonickel complexes such as nickel(II) acetylacetonate, and organomanganese complexes such as manganese(II) acetylacetonate. Examples of organometallic salts include zinc octylate, tin octylate, zinc naphthenate, cobalt naphthenate, tin stearate, and zinc stearate.

[0203] Examples of the amine curing accelerator include trialkylamines such as triethylamine and tributylamine, 4-dimethylaminopyridine, benzyldimethylamine, 2,4,6-tris(dimethylaminomethyl)phenol, and 1,8-diazabicyclo(5,4,0)-undecene.

[0204] As the amine-based curing accelerator, a commercially available product may be used, for example, "MY-25" manufactured by Ajinomoto Fine-Techno Co., Ltd.

[0205] The content of the (G) curing accelerator in the resin composition is not particularly limited, but is preferably 5% by mass or less, more preferably 1% by mass or less, even more preferably 0.5% by mass or less, and particularly preferably 0.3% by mass or less, when the non-volatile components in the resin composition are taken as 100% by mass. The lower limit of the content of the (G) curing accelerator in the resin composition is not particularly limited, but may be, for example, 0% by mass or more, 0.001% by mass or more, 0.01% by mass or more, etc., when the non-volatile components in the resin composition are taken as 100% by mass.

[0206] <(H) Other Additives> The resin composition of the present invention may further contain any additive. Examples of such additives include radical polymerization initiators such as peroxide radical polymerization initiators and azo radical polymerization initiators; thermosetting resins other than epoxy resins such as epoxy acrylate resins, urethane acrylate resins, urethane resins, cyanate resins, benzoxazine resins, unsaturated polyester resins, phenolic resins, melamine resins, and silicone resins; organic fillers such as phenoxy resins, polyvinyl acetal resins, polyolefin resins, polysulfone resins, and rubber particles; organic metal compounds such as organic copper compounds, organic zinc compounds, and organic cobalt compounds; colorants such as phthalocyanine blue, phthalocyanine green, iodine green, diazo yellow, crystal violet, titanium oxide, and carbon black; polymerization inhibitors such as hydroquinone, catechol, pyrogallol, and phenothiazine; leveling agents such as silicone leveling agents and acrylic polymer leveling agents; thickeners such as bentone and montmorillonite; silicone defoamers, acrylic defoamers, fluorine defoaming agents such as terephthalic acid-based defoaming agents and vinyl resin-based defoaming agents; ultraviolet absorbers such as benzotriazole-based ultraviolet absorbers; adhesion improvers such as urea silane; adhesion imparting agents such as triazole-based adhesion imparting agents, tetrazole-based adhesion imparting agents, and triazine-based adhesion imparting agents; antioxidants such as hindered phenol-based antioxidants; fluorescent brightening agents such as stilbene derivatives; surfactants such as fluorine-based surfactants and silicone-based surfactants; phosphorus-based flame retardants (e.g., phosphate ester compounds, phosphazene compounds, phosphine oxide compounds, etc.) Examples of the flame retardants include flame retardants such as fluorine-containing compounds, red phosphorus, nitrogen-based flame retardants (e.g., melamine sulfate), halogen-based flame retardants, and inorganic flame retardants (e.g., antimony trioxide); dispersants such as phosphate ester-based dispersants, polyoxyalkylene-based dispersants, acetylene-based dispersants, silicone-based dispersants, anionic dispersants, and cationic dispersants; and stabilizers such as borate-based stabilizers, titanate-based stabilizers, aluminate-based stabilizers, zirconate-based stabilizers, isocyanate-based stabilizers, carboxylic acid-based stabilizers, and carboxylic anhydride-based stabilizers. (H) Other additives may be used alone or in combination of two or more at any ratio. The content of (H) other additives can be appropriately determined by those skilled in the art.

[0207] <(I) Organic solvent> The resin composition of the present invention may further contain an arbitrary organic solvent. (I) As the organic solvent, known ones can be appropriately used, and the type is not particularly limited. (I) As the organic solvent, for example, ketone-based solvents such as acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, etc.; ester-based solvents such as methyl acetate, ethyl acetate, butyl acetate, isobutyl acetate, isoamyl acetate, methyl propionate, ethyl propionate, γ-butyrolactone, etc.; ether-based solvents such as tetrahydropyran, tetrahydrofuran, 1,4-dioxane, diethyl ether, diisopropyl ether, dibutyl ether, diphenyl ether, anisole, etc.; alcohol-based solvents such as methanol, ethanol, propanol, butanol, ethylene glycol, etc.; 2-ethoxyethyl acetate, propylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, ethyl diglycol acetate, γ-butyrolactone, methoxypropionic acid, etc. Examples of suitable organic solvents include ether ester solvents such as methyl lactate, ethyl lactate, and methyl 2-hydroxyisobutyrate; ether alcohol solvents such as 2-methoxypropanol, 2-methoxyethanol, 2-ethoxyethanol, propylene glycol monomethyl ether, and diethylene glycol monobutyl ether (butylcarbitol); amide solvents such as N,N-dimethylformamide, N,N-dimethylacetamide, and N-methyl-2-pyrrolidone; sulfoxide solvents such as dimethyl sulfoxide; nitrile solvents such as acetonitrile and propionitrile; aliphatic hydrocarbon solvents such as hexane, cyclopentane, cyclohexane, and methylcyclohexane; and aromatic hydrocarbon solvents such as benzene, toluene, xylene, ethylbenzene, and trimethylbenzene. (I) The organic solvent may be used alone or in combination of two or more in any ratio.

[0208] The content of the (I) organic solvent in the varnish-like resin composition before drying is not particularly limited, but is, for example, 40% by mass or less, 30% by mass or less, preferably 20% by mass or less, more preferably 10% by mass or less, even more preferably 8% by mass or less, and particularly preferably 6% by mass or less, when the total components in the resin composition are 100% by mass. The content of the (I) organic solvent in the resin composition forming the resin composition layer after drying in the resin sheet is not particularly limited, but is preferably 5% by mass or less, more preferably 3% by mass or less, even more preferably 2% by mass or less, and particularly preferably 1% by mass or less, when the total components in the resin composition are 100% by mass.

[0209] <Method of producing resin composition> The resin composition of the present invention can be produced, for example, by adding (A) a cyclic carbonate compound, (B) an epoxy resin, (C) an inorganic filler, if necessary (D) an active ester compound, if necessary (D') other curing agents, if necessary (E) a radical polymerizable group-containing compound, if necessary (F) a thermoplastic resin, if necessary (G) a curing accelerator, if necessary (H) other additives, if necessary, and if necessary (I) an organic solvent in any order and / or all at once and mixing them in any preparation vessel. In addition, the temperature can be appropriately set during the process of adding and mixing each component, and heating and / or cooling may be performed temporarily or throughout. In addition, during or after the process of adding and mixing, the resin composition may be stirred or shaken using a stirring device or shaking device such as a mixer to disperse uniformly. In addition, degassing may be performed under low pressure conditions such as under vacuum at the same time as stirring or shaking.

[0210] <Characteristics of resin composition> The resin composition of the present invention contains (A) a cyclic carbonate compound, (B) an epoxy resin, and (C) an inorganic filler. With such a resin composition, a cured product can be obtained that can maintain high peel strength even when exposed to a high-temperature and high-humidity environment and has a low dielectric tangent.

[0211] The cured product of the resin composition of the present invention may have a feature that it can maintain a high peel strength even when exposed to a high temperature and high humidity environment. Thus, in one embodiment, for example, as in the following Test Examples 4 and 5, a copper-plated conductor layer is formed on the cured product, and the copper-plated conductor layer is peeled off in the vertical direction. The peel strength at 25°C calculated from the load may be preferably 0.2kgf / cm or more, more preferably 0.25kgf / cm or more, even more preferably 0.3kgf / cm or more, even more preferably 0.35kgf / cm or more, and particularly preferably 0.4kgf / cm or more before the accelerated environmental test (HAST) is performed, whereas after the accelerated environmental test (HAST) is performed for 100 hours under high temperature and high humidity conditions of 130°C and 85%RH, it may maintain preferably 0.1kgf / cm or more, more preferably 0.15kgf / cm or more, even more preferably 0.2kgf / cm or more, even more preferably 0.25kgf / cm or more, and particularly preferably 0.3kgf / cm or more. The upper limit is not particularly limited, but may be, for example, 10 kgf / cm or less before and after the accelerated environmental test (HAST). The decrease rate (%) of the peel strength value before and after the accelerated environmental test (HAST) can be suppressed to preferably 45% or less, more preferably 40% or less, even more preferably 35% or less, even more preferably 30% or less, and particularly preferably 25% or less, or 20% or less. The decrease rate (%) of the peel strength value is calculated as the decrease ratio (%) of the peel strength (kgf / cm) value after the accelerated environmental test (HAST) to the peel strength (kgf / cm) value before the accelerated environmental test (HAST).

[0212] The cured product of the resin composition of the present invention may be characterized by a low dielectric loss tangent (Df). Thus, in one embodiment, the dielectric loss tangent (Df) of the cured product of the resin composition measured at 5.8 GHz and 23° C. as in the following Test Example 1 is not particularly limited, but may be preferably 0.0100 or less, more preferably 0.0080 or less, even more preferably 0.0060 or less, even more preferably 0.0050 or less, or 0.0040 or less, and particularly preferably 0.0035 or less, or 0.0030 or less.

[0213] In one embodiment, the cured product of the resin composition of the present invention may be characterized by a low relative dielectric constant (Dk). Thus, in one embodiment, the relative dielectric constant (Dk) of the cured product of the resin composition measured at 5.8 GHz and 23° C. as in the following Test Example 1 is not particularly limited, but may be preferably 5.0 or less, more preferably 4.0 or less, even more preferably 3.5 or less, and particularly preferably 3.0 or less.

[0214] In one embodiment, the cured product of the resin composition of the present invention may be characterized by excellent mechanical strength. Thus, in one embodiment, the elongation at break of the cured product measured at 23°C in accordance with the Japanese Industrial Standard JIS K7127 as in the following Test Example 2 is not particularly limited, but may be preferably 0.05% or more, more preferably 0.1% or more, even more preferably 0.15% or more, even more preferably 0.2% or more, and particularly preferably 0.22% or more. The upper limit of the elongation at break is not particularly limited, but may usually be 10% or less, 5% or less, etc.

[0215] In one embodiment, the cured product of the resin composition of the present invention may be characterized by a low arithmetic mean roughness (Ra) of the insulating layer surface after roughening treatment. Therefore, in one embodiment, the arithmetic mean roughness (Ra) of the insulating layer surface after roughening treatment measured as in the following Test Example 3 is not particularly limited, but may be preferably 500 nm or less, more preferably 400 nm or less, even more preferably 300 nm or less, even more preferably 200 nm or less, and particularly preferably 100 nm or less. The lower limit is not particularly limited, and may be, for example, 1 nm or more, 2 nm or more, etc.

[0216] <Applications of resin composition> The resin composition of the present invention can be suitably used as a resin composition for insulating purposes, particularly as a resin composition for forming an insulating layer. Specifically, it can be suitably used as a resin composition for forming an insulating layer (resin composition for forming an insulating layer for forming a conductor layer) for forming a conductor layer (including a rewiring layer) formed on an insulating layer. In addition, in a printed wiring board described later, it can be suitably used as a resin composition for forming an insulating layer of a printed wiring board (resin composition for forming an insulating layer of a printed wiring board). The resin composition of the present invention can also be used in a wide range of applications requiring a resin composition, such as a resin sheet, a sheet-like laminate material such as a prepreg, a solder resist, an underfill material, a die bonding material, a semiconductor encapsulant, a hole filling resin, and a component embedding resin.

[0217] In addition, for example, when a semiconductor chip package is manufactured through the following steps (1) to (6), the resin composition of the present invention can be suitably used as a resin composition for a rewiring formation layer (resin composition for forming a rewiring formation layer) as an insulating layer for forming a rewiring layer, and as a resin composition for sealing a semiconductor chip (resin composition for sealing a semiconductor chip). When a semiconductor chip package is manufactured, a rewiring layer may be further formed on the sealing layer. (1) A step of laminating a temporary fixing film onto a substrate; (2) a step of temporarily fixing a semiconductor chip on a temporary fixing film; (3) forming an encapsulation layer on the semiconductor chip; (4) peeling the substrate and the temporary fixing film from the semiconductor chip; (5) forming a rewiring formation layer as an insulating layer on the surface of the semiconductor chip from which the base material and the temporary fixing film have been peeled off; and (6) A process of forming a rewiring layer as a conductor layer on the rewiring formation layer.

[0218] Furthermore, the resin composition of the present invention provides an insulating layer with good component embedding properties, and therefore can be suitably used when the printed wiring board is a circuit board with built-in components.

[0219] <Sheet-type laminated material> The resin composition of the present invention can be used by coating in the form of a varnish, but from an industrial perspective, it is generally preferred to use the resin composition in the form of a sheet-like laminate material containing the resin composition.

[0220] As the sheet-like laminate material, the following resin sheets and prepregs are preferred.

[0221] In one embodiment, the resin sheet includes a support and a resin composition layer provided on the support, and the resin composition layer is formed from the resin composition of the present invention.

[0222] The thickness of the resin composition layer is preferably 50 μm or less, more preferably 40 μm or less, from the viewpoint of making the printed wiring board thinner and being able to provide a cured product with excellent insulation even if the cured product of the resin composition is a thin film. The lower limit of the thickness of the resin composition layer is not particularly limited, but can usually be 5 μm or more, 10 μm or more, etc.

[0223] Examples of the support include films made of plastic materials, metal foils, and release papers, with films made of plastic materials and metal foils being preferred.

[0224] When a film made of a plastic material is used as the support, examples of the plastic material include polyesters such as polyethylene terephthalate (hereinafter sometimes abbreviated as "PET") and polyethylene naphthalate (hereinafter sometimes abbreviated as "PEN"), polycarbonate (hereinafter sometimes abbreviated as "PC"), acrylics such as polymethyl methacrylate (PMMA), cyclic polyolefins, triacetyl cellulose (TAC), polyether sulfide (PES), polyether ketone, polyimide, etc. Among these, polyethylene terephthalate and polyethylene naphthalate are preferred, and inexpensive polyethylene terephthalate is particularly preferred.

[0225] When a metal foil is used as the support, examples of the metal foil include copper foil, aluminum foil, etc., and copper foil is preferred. As the copper foil, a foil made of a single metal, copper, or an alloy of copper and another metal (e.g., tin, chromium, silver, magnesium, nickel, zirconium, silicon, titanium, etc.) may be used.

[0226] The surface of the support to be bonded to the resin composition layer may be subjected to a matte treatment, a corona treatment, or an antistatic treatment.

[0227] In addition, as the support, a support with a release layer having a release layer on the surface to be bonded to the resin composition layer may be used. The release agent used in the release layer of the support with a release layer may be, for example, one or more release agents selected from the group consisting of alkyd resins, polyolefin resins, urethane resins, and silicone resins. The support with a release layer may be a commercially available product, for example, "SK-1", "AL-5", and "AL-7" manufactured by Lintec Corporation, "Lumirror T60" manufactured by Toray Industries, Inc., "Purex" manufactured by Teijin Limited, and "Unipeel" manufactured by Unitika Limited, which are PET films having a release layer mainly composed of an alkyd resin-based release agent.

[0228] The thickness of the support is not particularly limited, but is preferably in the range of 5 μm to 75 μm, and more preferably in the range of 10 μm to 60 μm. When a support with a release layer is used, it is preferable that the total thickness of the support with a release layer is in the above range.

[0229] In one embodiment, the resin sheet may further include an optional layer as necessary. For example, such an optional layer may be a protective film equivalent to the support provided on the surface of the resin composition layer that is not bonded to the support (i.e., the surface opposite to the support). The thickness of the protective film is not particularly limited, but is, for example, 1 μm to 40 μm. By laminating the protective film, adhesion of dirt and the like to the surface of the resin composition layer and scratches can be suppressed.

[0230] The resin sheet can be produced, for example, by preparing a liquid (varnish-like) resin composition as is or by dissolving the resin composition in an organic solvent to prepare a liquid (varnish-like) resin composition, applying this onto a support using a die coater or the like, and then drying to form a resin composition layer.

[0231] The organic solvent may be the same as the organic solvent described as a component of the resin composition. The organic solvent may be used alone or in combination of two or more kinds.

[0232] Drying may be performed by a known method such as heating or hot air blowing. Drying conditions are not particularly limited, but drying is performed so that the content of the organic solvent in the resin composition layer becomes 10 mass % or less, preferably 5 mass % or less. Although it varies depending on the boiling point of the organic solvent in the resin composition, for example, when a resin composition containing 30 mass % to 60 mass % of the organic solvent is used, the resin composition layer can be formed by drying at 50°C to 150°C for 3 minutes to 10 minutes.

[0233] The resin sheet can be stored in a rolled state. When the resin sheet has a protective film, it can be used by peeling off the protective film.

[0234] In one embodiment, the prepreg is formed by impregnating a sheet-like fiber substrate with the resin composition of the present invention.

[0235] The sheet-like fiber substrate used for the prepreg is not particularly limited, and can be a substrate commonly used for prepreg, such as glass cloth, aramid nonwoven fabric, liquid crystal polymer nonwoven fabric, etc. From the viewpoint of thinning the printed wiring board, the thickness of the sheet-like fiber substrate is preferably 50 μm or less, more preferably 40 μm or less, even more preferably 30 μm or less, and particularly preferably 20 μm or less. The lower limit of the thickness of the sheet-like fiber substrate is not particularly limited. It is usually 10 μm or more.

[0236] The prepreg can be produced by a known method such as a hot melt method or a solvent method.

[0237] The thickness of the prepreg may be in the same range as that of the resin composition layer in the above-mentioned resin sheet.

[0238] The sheet-like laminate material of the present invention can be suitably used for forming an insulating layer of a printed wiring board (for an insulating layer of a printed wiring board), and can be more suitably used for forming an interlayer insulating layer of a printed wiring board (for an interlayer insulating layer of a printed wiring board).

[0239] <Printed wiring board> The printed wiring board of the present invention includes an insulating layer made of a cured product obtained by curing the resin composition of the present invention.

[0240] The printed wiring board can be produced, for example, by using the above-mentioned resin sheet by a method including the following steps (I) and (II). (I) A step of laminating a resin sheet on an inner layer substrate such that a resin composition layer of the resin sheet is bonded to the inner layer substrate. (II) A step of curing (e.g., heat curing) the resin composition layer to form an insulating layer.

[0241] The "inner layer substrate" used in step (I) is a member that becomes the substrate of the printed wiring board, and examples thereof include a glass epoxy substrate, a metal substrate, a polyester substrate, a polyimide substrate, a BT resin substrate, and a thermosetting polyphenylene ether substrate. The substrate may have a conductor layer on one or both sides, and the conductor layer may be patterned. An inner layer substrate having a conductor layer (circuit) formed on one or both sides of the substrate may be called an "inner layer circuit substrate". In addition, an intermediate product on which an insulating layer and / or a conductor layer is to be formed during the manufacture of a printed wiring board is also included in the "inner layer substrate" of the present invention. When the printed wiring board is a circuit board with built-in components, an inner layer substrate with built-in components may be used.

[0242] The lamination of the inner layer substrate and the resin sheet can be carried out, for example, by thermocompression bonding the resin sheet to the inner layer substrate from the support side. Examples of the member for thermocompression bonding the resin sheet to the inner layer substrate (hereinafter also referred to as the "thermocompression bonding member") include a heated metal plate (such as a SUS plate) or a metal roll (SUS roll). It is preferable to press the thermocompression member not directly onto the resin sheet, but via an elastic material such as heat-resistant rubber so that the resin sheet can sufficiently follow the surface irregularities of the inner layer substrate.

[0243] The lamination of the inner layer substrate and the resin sheet may be performed by a vacuum lamination method. In the vacuum lamination method, the thermocompression temperature is preferably in the range of 60°C to 160°C, more preferably in the range of 80°C to 140°C, the thermocompression pressure is preferably in the range of 0.098MPa to 1.77MPa, more preferably in the range of 0.29MPa to 1.47MPa, and the thermocompression time is preferably in the range of 20 seconds to 400 seconds, more preferably in the range of 30 seconds to 300 seconds. The lamination may be performed under reduced pressure conditions, preferably at a pressure of 26.7hPa or less.

[0244] The lamination can be performed by a commercially available vacuum laminator, such as a vacuum pressure laminator manufactured by Meiki Seisakusho Co., Ltd., a vacuum applicator manufactured by Nikko Materials Co., Ltd., or a batch type vacuum pressure laminator.

[0245] After lamination, the laminated resin sheet may be smoothed under normal pressure (atmospheric pressure), for example, by pressing a thermocompression member from the support side. The pressing conditions for the smoothing treatment may be the same as the thermocompression conditions for the lamination. The smoothing treatment may be performed using a commercially available laminator. The lamination and smoothing treatment may be performed consecutively using the commercially available vacuum laminator.

[0246] The support may be removed between step (I) and step (II) or after step (II).

[0247] In step (II), the resin composition layer is cured (for example, thermally cured) to form an insulating layer made of a cured product of the resin composition. The curing conditions for the resin composition layer are not particularly limited, and conditions that are usually adopted when forming an insulating layer for a printed wiring board may be used.

[0248] For example, the thermal curing conditions for the resin composition layer vary depending on the type of resin composition, etc., but in one embodiment, the curing temperature is preferably 120° C. to 240° C., more preferably 150° C. to 220° C., and even more preferably 170° C. to 210° C. The curing time is preferably 5 minutes to 120 minutes, more preferably 10 minutes to 100 minutes, and even more preferably 15 minutes to 100 minutes.

[0249] Before the resin composition layer is thermally cured, the resin composition layer may be preheated at a temperature lower than the curing temperature. For example, prior to thermally curing the resin composition layer, the resin composition layer may be preheated at a temperature of 50° C. to 120° C., preferably 60° C. to 115° C., more preferably 70° C. to 110° C. for 5 minutes or more, preferably 5 minutes to 150 minutes, more preferably 15 minutes to 120 minutes, and even more preferably 15 minutes to 100 minutes.

[0250] In manufacturing a printed wiring board, the steps of (III) drilling holes in the insulating layer, (IV) roughening the insulating layer, and (V) forming a conductor layer may be further carried out. These steps (III) to (V) may be carried out according to various methods known to those skilled in the art for use in manufacturing printed wiring boards. When the support is removed after step (II), the support may be removed between step (II) and step (III), between step (III) and step (IV), or between step (IV) and step (V). In addition, the formation of the insulating layer and the conductor layer in steps (II) to (V) may be repeated to form a multilayer wiring board, as necessary.

[0251] In another embodiment, the printed wiring board of the present invention can be manufactured using the above-mentioned prepreg. The manufacturing method is basically the same as when a resin sheet is used.

[0252] Step (III) is a step of drilling holes in the insulating layer, which allows holes such as via holes and through holes to be formed in the insulating layer. Step (III) may be performed using, for example, a drill, a laser, plasma, etc., depending on the composition of the resin composition used to form the insulating layer. The dimensions and shape of the holes may be appropriately determined depending on the design of the printed wiring board.

[0253] Step (IV) is a step of roughening the insulating layer. Usually, smears are also removed in this step (IV). The procedure and conditions of the roughening treatment are not particularly limited, and known procedures and conditions that are usually used when forming an insulating layer of a printed wiring board can be adopted. For example, the insulating layer can be roughened by carrying out a swelling treatment with a swelling liquid, a roughening treatment with an oxidizing agent, and a neutralization treatment with a neutralizing liquid in this order.

[0254] The swelling liquid used in the roughening treatment is not particularly limited, but includes an alkaline solution, a surfactant solution, etc., and is preferably an alkaline solution, and more preferably a sodium hydroxide solution or a potassium hydroxide solution. Examples of commercially available swelling liquids include "Swelling Dip Securigans P" and "Swelling Dip Securigans SBU" manufactured by Atotech Japan. The swelling treatment using the swelling liquid is not particularly limited, but can be performed by immersing the insulating layer in a swelling liquid at 30°C to 90°C for 1 to 20 minutes, for example. From the viewpoint of suppressing the swelling of the resin of the insulating layer to an appropriate level, it is preferable to immerse the insulating layer in a swelling liquid at 40°C to 80°C for 5 to 15 minutes.

[0255] The oxidizing agent used in the roughening treatment is not particularly limited, but examples thereof include an alkaline permanganate solution in which potassium permanganate or sodium permanganate is dissolved in an aqueous solution of sodium hydroxide. The roughening treatment using an oxidizing agent such as an alkaline permanganate solution is preferably performed by immersing the insulating layer in an oxidizing agent solution heated to 60°C to 100°C for 10 minutes to 30 minutes. The concentration of permanganate in the alkaline permanganate solution is preferably 5% by mass to 10% by mass. Examples of commercially available oxidizing agents include alkaline permanganate solutions such as "Concentrate Compact CP" and "Dosing Solution Securigans P" manufactured by Atotech Japan.

[0256] The neutralizing solution used in the roughening treatment is preferably an acidic aqueous solution, and a commercially available product such as "Reduction Solution Securigant P" manufactured by Atotech Japan can be mentioned.

[0257] The treatment with the neutralizing solution can be carried out by immersing the surface that has been roughened with an oxidizing agent in a neutralizing solution at 30° C. to 80° C. for 5 to 30 minutes. From the viewpoint of workability, etc., a method in which the object that has been roughened with an oxidizing agent is immersed in a neutralizing solution at 40° C. to 70° C. for 5 to 20 minutes is preferred.

[0258] In one embodiment, the root mean square roughness (Rq) of the insulating layer surface after the roughening treatment is preferably 500 nm or less, more preferably 400 nm or less, and even more preferably 300 nm or less. The lower limit is not particularly limited, and may be, for example, 1 nm or more, 2 nm or more, etc. The root mean square roughness (Rq) of the insulating layer surface can be measured using a non-contact surface roughness meter.

[0259] Step (V) is a step of forming a conductor layer, and the conductor layer is formed on the insulating layer. The conductor material used for the conductor layer is not particularly limited. In a preferred embodiment, the conductor layer contains one or more metals selected from the group consisting of gold, platinum, palladium, silver, copper, aluminum, cobalt, chromium, zinc, nickel, titanium, tungsten, iron, tin and indium. The conductor layer may be a single metal layer or an alloy layer, and examples of the alloy layer include layers formed from alloys of two or more metals selected from the above group (e.g., nickel-chromium alloy, copper-nickel alloy and copper-titanium alloy). Among these, from the viewpoints of versatility in forming the conductor layer, cost, ease of patterning, and the like, a single metal layer of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver, or copper, or an alloy layer of a nickel-chromium alloy, a copper-nickel alloy, or a copper-titanium alloy is preferred, a single metal layer of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver, or copper, or an alloy layer of a nickel-chromium alloy is more preferred, and a single metal layer of copper is even more preferred.

[0260] The conductor layer may be a single-layer structure or a multi-layer structure in which two or more single metal layers or alloy layers made of different kinds of metals or alloys are laminated. When the conductor layer has a multi-layer structure, the layer in contact with the insulating layer is preferably a single metal layer of chromium, zinc or titanium, or an alloy layer of a nickel-chromium alloy.

[0261] The thickness of the conductor layer depends on the desired design of the printed wiring board, but is generally 3 μm to 35 μm, and preferably 5 μm to 30 μm.

[0262] In one embodiment, the conductor layer may be formed by plating. For example, a conductor layer having a desired wiring pattern can be formed by plating the surface of the insulating layer by a conventionally known technique such as a semi-additive method or a full-additive method, and from the viewpoint of ease of production, it is preferable to form the conductor layer by the semi-additive method. An example of forming the conductor layer by the semi-additive method will be described below.

[0263] First, a plating seed layer is formed on the surface of an insulating layer by electroless plating. Next, a mask pattern is formed on the formed plating seed layer to expose a part of the plating seed layer corresponding to a desired wiring pattern. After a metal layer is formed on the exposed plating seed layer by electrolytic plating, the mask pattern is removed. Thereafter, unnecessary plating seed layer is removed by etching or the like to form a conductor layer having a desired wiring pattern.

[0264] In another embodiment, the conductor layer may be formed using a metal foil. When the conductor layer is formed using a metal foil, it is preferable to carry out step (V) between steps (I) and (II). For example, after step (I), the support is removed, and a metal foil is laminated on the exposed surface of the resin composition layer. The lamination of the resin composition layer and the metal foil may be carried out by a vacuum lamination method. The lamination conditions may be the same as those described for step (I). Next, step (II) is carried out to form an insulating layer. Thereafter, a conductor layer having a desired wiring pattern can be formed by a conventionally known technique such as a subtractive method or a modified semi-additive method, using the metal foil on the insulating layer.

[0265] The metal foil can be produced by a known method such as an electrolytic method, a rolling method, etc. Commercially available metal foils include, for example, HLP foil and JXUT-III foil manufactured by JX Nippon Mining & Metals Corporation, and 3EC-III foil and TP-III foil manufactured by Mitsui Mining & Smelting Co., Ltd.

[0266] <Semiconductor device> The semiconductor device of the present invention includes the printed wiring board of the present invention. The semiconductor device of the present invention can be manufactured by using the printed wiring board of the present invention.

[0267] Examples of the semiconductor device include various semiconductor devices used in electric appliances (for example, computers, mobile phones, digital cameras, and televisions) and vehicles (for example, motorcycles, automobiles, trains, ships, and aircraft). EXAMPLES

[0268] The present invention will be specifically described below with reference to examples. The present invention is not limited to these examples. In the following, "parts" and "%" representing amounts mean "parts by mass" and "% by mass", respectively, unless otherwise specified. Unless otherwise specified, the temperature condition is room temperature (23°C), and unless otherwise specified, the pressure condition is atmospheric pressure (1 atm).

[0269] <Example 1> 15 parts of a biphenyl type epoxy resin ("NC3000L" manufactured by Nippon Kayaku Co., Ltd., epoxy equivalent of about 269 g / eq.) was heated and dissolved in 20 parts of solvent naphtha while stirring. This was cooled to room temperature to prepare a dissolved composition of epoxy resin. This dissolved composition of epoxy resin was mixed with 2 parts of a cyclic carbonate compound 1 ("4,4,6-trimethyl-1,3-dioxane-2-one" manufactured by JNC Corporation, a compound represented by formula (A4)), 45 parts of an active ester compound ("HPC-8000-65T" manufactured by DIC Corporation, active ester group equivalent of about 223 g / eq., toluene solution with a non-volatile content of 65%), and spherical silica ("SO-C2" manufactured by Admatechs Co., Ltd., average particle size 0.5 μm, specific surface area 5.8 m) surface-treated with a silane coupling agent ("KBM-573" manufactured by Shin-Etsu Chemical Co., Ltd.). 2 130 parts of 100g / g triazine skeleton-containing phenolic curing agent (DIC Corporation "LA-3018-50P", active group equivalent of about 151g / eq., 2-methoxypropanol solution with non-volatile content of 50%), 3 parts of carbodiimide curing agent (Nisshinbo Chemical Co., Ltd. "V-03", active group equivalent of about 216g / eq., toluene solution with non-volatile content of 50%), 0.2 parts of imidazole curing accelerator (Shikoku Chemical Industry Co., Ltd. "1B2PZ", 1-benzyl-2-phenylimidazole), 2.5 parts of phenoxy resin (Mitsubishi Chemical Corporation "YX7553BH30", 1:1 solution of MEK and cyclohexanone with non-volatile content of 30% by mass) were mixed and uniformly dispersed in a high-speed rotating mixer to prepare a resin composition.

[0270] <Example 2> A resin composition was prepared in the same manner as in Example 1, except that 15 parts of a naphthalene type epoxy resin (DIC Corporation's "HP-4032-SS", 1,6-bis(glycidyloxy)naphthalene, epoxy equivalent of about 145 g / eq.) was used instead of 15 parts of a biphenyl type epoxy resin (Nippon Kayaku Corporation's "NC3000L"), and the amount of the cyclic carbonate compound 1 (JNC Corporation's "4,4,6-trimethyl-1,3-dioxane-2-one") was changed from 2 parts to 4 parts.

[0271] <Example 3> Instead of 2 parts of the cyclic carbonate compound 1 ("4,4,6-trimethyl-1,3-dioxane-2-one" manufactured by JNC Corporation), 1 part of the cyclic carbonate compound 2 ("DEPPO" manufactured by JNC Corporation, a compound represented by formula (A11)) and 1 part of the cyclic carbonate compound 3 ("DXC" manufactured by JNC Corporation, a compound represented by formula (A10)) were used, and instead of 45 parts of the active ester compound ("HPC-8000-65T" manufactured by DIC Corporation), 45 parts of an active ester compound ("HPC-8150-62T" manufactured by DIC Corporation, active ester group equivalent of about 220 g / eq., toluene solution with a non-volatile content of 62% by mass) were used. Furthermore, spherical silica ("SO-C2" manufactured by Admatechs Co., Ltd., average particle size 0.5 μm, specific surface area 5.8 m) surface-treated with a silane coupling agent ("KBM-573" manufactured by Shin-Etsu Chemical Co., Ltd.) was used. 2 A resin composition was prepared in the same manner as in Example 1, except that the amount of 130 parts by weight of 1 / g was changed to 155 parts by weight.

[0272] <Example 4> Instead of 15 parts of biphenyl-type epoxy resin ("NC3000L" manufactured by Nippon Kayaku Co., Ltd.), 12 parts of naphthol-type epoxy resin ("ESN475V" manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., epoxy equivalent: approx. 330 g / eq.) and 3 parts of bisphenol-type epoxy resin ("ZX1059" manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., 1:1 mixture of bisphenol A type and bisphenol F type, epoxy equivalent: approx. 169 g / eq.) were used, and cyclic carbonate compound 1 ("4,4,6-trimethylsilyl 1,3-diphenyl ether" manufactured by JNC Corporation) was used. A resin composition was prepared in the same manner as in Example 1, except that 2 parts of a cyclic carbonate compound 3 ("DXC" manufactured by JNC Corporation) were used instead of 2 parts of "methyl-1,3-dioxane-2-one"), and 45 parts of an active ester compound ("HPC-8150-62T" manufactured by DIC Corporation, active ester group equivalent weight about 220 g / eq., non-volatile content ratio 62 mass% in toluene solution) were used instead of 45 parts of an active ester compound ("HPC-8000-65T" manufactured by DIC Corporation).

[0273] <Example 5> A resin composition was prepared in the same manner as in Example 4, except that 2 parts of cyclic carbonate compound 4 (a compound represented by formula (A16), synthesized in a manner similar to that described in Example 13 of Japanese Patent No. 6,141,261) was used instead of 2 parts of cyclic carbonate compound 3 ("DXC" manufactured by JNC Corporation).

[0274] <Example 6> A resin composition was prepared in the same manner as in Example 4, except that 2 parts of cyclic carbonate compound 5 (a compound represented by formula (A17), synthesized by a method similar to that described in the Examples of JP2018-118946A) were used instead of 2 parts of cyclic carbonate compound 3 ("DXC" manufactured by JNC Corporation).

[0275] <Example 7> A resin composition was prepared in the same manner as in Example 1, except that 45 parts of an active ester compound (DIC Corporation's "HPC-8150-62T", active ester group equivalent of approximately 220 g / eq., toluene solution with non-volatile content of 62 mass%) was used instead of 45 parts of the active ester compound (DIC Corporation's "HPC-8000-65T"), and 4 parts of a biphenylaralkyl novolac type maleimide (Nippon Kayaku Co., Ltd.'s "MIR-3000-70MT", MEK / toluene mixed solution with non-volatile content of 70%) was used.

[0276] <Example 8> A resin composition was prepared in the same manner as in Example 7, except that 15 parts of a naphthalene type epoxy resin (DIC Corporation's "HP-4032-SS", 1,6-bis(glycidyloxy)naphthalene, epoxy equivalent of about 145 g / eq.) was used instead of 15 parts of a biphenyl type epoxy resin (Nippon Kayaku Co., Ltd.'s "NC3000L"), and 3 parts of a maleimide-terminated polyimide compound (DMI Corporation's "BMI-1500") was used instead of 4 parts of a biphenyl aralkyl novolac type maleimide (Nippon Kayaku Co., Ltd.'s "MIR-3000-70MT", MEK / toluene mixed solution with a non-volatile content of 70%).

[0277] <Example 9> A resin composition was prepared in the same manner as in Example 7, except that 12 parts of a naphthol-type epoxy resin ("ESN475V" manufactured by Nippon Steel & Sumitomo Metal Chemical Co., Ltd., epoxy equivalent of about 330 g / eq.) and 3 parts of a bisphenol-type epoxy resin ("ZX1059" manufactured by Nippon Steel & Sumitomo Metal Chemical Co., Ltd., a 1:1 mixture of bisphenol A type and bisphenol F type, epoxy equivalent of about 169 g / eq.) were used instead of 15 parts of a biphenyl-type epoxy resin ("NC3000L" manufactured by Nippon Kayaku Co., Ltd.), and 3 parts of a methacrylic-modified polyphenylene ether ("SA9000-111" manufactured by SABIC Innovative Plastics Co., Ltd.) were used instead of 4 parts of a biphenylaralkylnovolac-type maleimide ("MIR-3000-70MT" manufactured by Nippon Kayaku Co., Ltd.).

[0278] <Example 10> The amount of biphenyl-type epoxy resin ("NC3000L" manufactured by Nippon Kayaku Co., Ltd.) used was changed from 15 parts to 10 parts, and further, 5 parts of naphthalene-type epoxy resin ("HP-4032-SS" manufactured by DIC Corporation, 1,6-bis(glycidyloxy)naphthalene, epoxy equivalent of about 145 g / eq.) was used. In place of 4 parts of biphenylaralkylnovolac-type maleimide ("MIR-3000-70MT" manufactured by Nippon Kayaku Co., Ltd.), 4 parts of vinylbenzyl-modified polyphenylene ether ("OPE-2St 2200" manufactured by Mitsubishi Gas Chemical Co., Ltd., toluene solution with non-volatile content of 65%) was used. A resin composition was prepared in the same manner as in Example 7.

[0279] <Example 11> The amount of biphenyl-type epoxy resin (Nippon Kayaku's "NC3000L") used was changed from 15 parts to 10 parts, and 5 parts of naphthalene-type epoxy resin (DIC's "HP-4032-SS", 1,6-bis(glycidyloxy)naphthalene, epoxy equivalent of approximately 145 g / eq.) were used. A silane coupling agent (Shin-Etsu Chemical's "KBM-573") was used to treat the surface of spherical silica (Admatechs' "SO-C2", average particle size 0.5 μm, specific surface area 5.8 m). 2 A resin composition was prepared in the same manner as in Example 1, except that the amount of 130 parts by weight of 100 parts by weight of cellulose acetate / g was changed from 130 parts by weight to 100 parts by weight, and 7 parts by weight of hollow aluminosilicate particles (manufactured by Taiheiyo Cement Corporation, "MG-005", average particle size 1.6 μm, porosity 80% by volume) were used.

[0280] <Comparative Example 1> A resin composition was prepared in the same manner as in Example 1, except that 2 parts of the cyclic carbonate compound 1 ("4,4,6-trimethyl-1,3-dioxane-2-one" manufactured by JNC Corporation) was not used.

[0281] <Comparative Example 2> A spherical silica (Admatechs' "SO-C2", average particle size 0.5 μm, specific surface area 5.8 m) surface-treated with a silane coupling agent (Shin-Etsu Chemical's "KBM-573") was used without using 2 parts of the cyclic carbonate compound 1 (JNC's "4,4,6-trimethyl-1,3-dioxane-2-one") and 3 parts of the maleimide-terminated polyimide compound (DMI's "BMI-1500"), 2 A resin composition was prepared in the same manner as in Example 8, except that the amount of 130 parts by weight of 1 / g was changed to 150 parts by weight.

[0282] <Comparative Example 3> Instead of 15 parts of naphthalene-type epoxy resin (DIC "HP-4032-SS", 1,6-bis(glycidyloxy)naphthalene, epoxy equivalent of about 145 g / eq.), 12 parts of naphthol-type epoxy resin (Nippon Steel Sumikin Chemical "ESN475V", epoxy equivalent of about 330 g / eq.) and 12 parts of bisphenol-type epoxy resin (Nippon Steel Sumikin Chemical "ZX1059", 1:200 of bisphenol A type and bisphenol F type) were used. 1 mixture, epoxy equivalent weight approximately 169 g / eq.) was used, and the amount of an active ester compound (DIC Corporation's "HPC-8150-62T", active ester group equivalent weight approximately 220 g / eq., toluene solution with non-volatile content of 62% by mass) was reduced from 45 parts to 20 parts, and spherical silica (Admatechs Corporation's "SO-C2", average particle size 0.5 μm, specific surface area 5.8 m) surface-treated with a silane coupling agent (Shin-Etsu Chemical Co., Ltd.'s "KBM-573") was added. 2 The amount of 150 parts of polyvinyl chloride (PC) was reduced to 90 parts (g). Except for the above, the same procedure as in Comparative Example 2 was followed to prepare a resin composition.

[0283] <Comparative Example 4> Spherical silica (Admatechs' "SO-C2", average particle size 0.5 μm, specific surface area 5.8 m) surface-treated with a silane coupling agent (Shin-Etsu Chemical's "KBM-573"). 2A resin composition was prepared in the same manner as in Comparative Example 2, except that the amount of 1,2-dichlorophenyl ether (1 / g) used was changed from 150 parts to 125 parts, and 2 parts of a polyester compound ("Teslac 5001-40T" manufactured by Showa Denko Materials Co., Ltd., number average molecular weight 27000, toluene solution with non-volatile content of 40 mass%) was used.

[0284] <Production Example 1: Production of resin sheet> A polyethylene terephthalate film ("AL5" manufactured by Lintec Corporation, thickness 38 μm) with a release layer was prepared as a support. The resin compositions obtained in the examples and comparative examples were uniformly applied onto the release layer of this support so that the thickness of the resin composition layer after drying was 40 μm. Thereafter, the resin composition was dried at 80°C to 100°C (average 90°C) for 4 minutes to obtain a resin sheet including a support and a resin composition layer.

[0285] <Test Example 1: Measurement of relative dielectric constant (Dk) and dielectric loss tangent (Df)> The protective film was peeled off from the resin sheet produced in Production Example 1, and the resin composition layer was thermally cured by heating at 200°C for 90 minutes, and then the support was peeled off to obtain a cured film formed of the cured product of the resin composition. No cured film was obtained for Comparative Example 4. The cured film was cut into a width of 2 mm and a length of 80 mm to obtain a cured product A for evaluation.

[0286] The dielectric constant (Dk value) and dielectric loss tangent (Df value) of the obtained cured product A for evaluation were measured by the cavity resonance perturbation method at a measurement frequency of 5.8 GHz and a measurement temperature of 23° C. using an “HP8362B” manufactured by Agilent Technologies. Measurements were performed on three test pieces, and the average values ​​were calculated.

[0287] <Test Example 2: Measurement of elongation at break> For the cured product A for evaluation obtained in the same manner as in Test Example 1, a tensile test was carried out at 23°C in accordance with Japanese Industrial Standard JIS K7127 using a Tensilon universal testing machine ("RTC-1250A" manufactured by Orientec Co., Ltd.) to measure the elongation at break (%).

[0288] <Test Example 3: Measurement of arithmetic mean roughness (Ra)> (1) Surface preparation for interior substrates A glass cloth-based epoxy resin double-sided copper-clad laminate (copper foil thickness 18 μm, substrate thickness 0.8 mm, Panasonic "R1515A") with copper foil on the surface was prepared as an inner layer substrate. The copper foil on the surface of this inner layer substrate was etched with a microetching agent (Mec "CZ8101") with a copper etching amount of 1 μm to perform a roughening treatment. Then, it was dried at 190°C for 30 minutes.

[0289] (2) Lamination and hardening of resin sheets The resin sheet prepared in Production Example 1 was laminated on both sides of the inner layer substrate using a batch-type vacuum pressure laminator (a two-stage build-up laminator "CVP700" manufactured by Nikko Materials Co., Ltd.) so that the resin composition layer was bonded to the inner layer substrate. This lamination was performed by reducing the pressure for 30 seconds to 13 hPa or less, and then pressing at a temperature of 100°C and a pressure of 0.74 MPa for 30 seconds.

[0290] The laminated resin sheet was then heat-pressed at atmospheric pressure at 100°C and a pressure of 0.5 MPa for 60 seconds to smooth it, and then placed in a 130°C oven for 30 minutes, and then transferred to a 170°C oven for 30 minutes.

[0291] (3) Formation of via holes Using a CO2 laser processing machine (LK-2K212 / 2C) manufactured by Via Mechanics, the insulating layer was processed under the conditions of a frequency of 2000Hz, a pulse width of 3μs, an output of 0.95W, and a shot number of 3, to form via holes with a top diameter of 50μm on the insulating layer surface and a diameter of 40μm on the insulating layer bottom surface. After that, the PET film was peeled off.

[0292] (4) Roughening treatment The inner layer substrate was immersed in a swelling solution, Swelling Dip Securiganth P (manufactured by Atotech Japan), at 60°C for 10 minutes. Next, it was immersed in a roughening solution, Concentrate Compact P (aqueous solution of KMnO4: 60g / L, NaOH: 40g / L) (manufactured by Atotech Japan), at 80°C for 20 minutes. Finally, it was immersed in a neutralizing solution, Reduction Solution Securiganth P (manufactured by Atotech Japan), at 40°C for 5 minutes. The obtained substrate was designated as evaluation substrate A.

[0293] (5) Measurement of arithmetic mean roughness (Ra) The Ra value of the obtained evaluation substrate A was calculated using a non-contact surface roughness meter (WYKO NT3300 manufactured by B-CO Instruments) in VSI mode with a 50x lens over a measurement range of 121 μm × 92 μm. Each was measured by calculating the average value of 10 randomly selected points.

[0294] <Test Example 4: Measurement of peel strength of plated conductor layer before HAST test> Evaluation substrate A obtained in the same manner as in Test Example 3(4) was immersed in an electroless plating solution containing PdCl2 at 40°C for 5 minutes, and then immersed in an electroless copper plating solution at 25°C for 20 minutes. After heating at 150°C for 30 minutes to perform an annealing treatment, an etching resist was formed, and after forming a pattern by etching, copper sulfate electrolytic plating was performed to form a conductor layer with a thickness of 30 μm. Next, an annealing treatment was performed at 200°C for 60 minutes, and the resulting substrate was designated evaluation substrate B.

[0295] A 10 mm wide and 150 mm long cut was made in a portion of the conductor layer of the obtained evaluation board B that did not contain a via hole, and one end of this cut was peeled off and held with a gripping tool (TSE Corporation, Autocom type testing machine AC-50C-SL). The load (kgf / cm) when 100 mm was peeled off vertically at a speed of 50 mm / min at room temperature (25°C) was measured.

[0296] <Test Example 5: Measurement of peel strength of plated conductor layer after HAST test> Evaluation board B, which was prepared in the same manner as in Test Example 4, was subjected to 100 hours of accelerated environmental testing (HAST) under high temperature and high humidity conditions of 130°C and 85%RH using a highly accelerated life tester (Kusumoto Chemical Industries, Ltd., "PM422"). After HAST, an incision was made in the evaluation board B in the same manner as above, and one end of the incision was peeled off and gripped with the gripper of the tensile tester in the same manner as in Test Example 4, and the load (kgf / cm) was measured when 35 mm was peeled off in the vertical direction at a speed of 50 mm / min at room temperature (normal temperature). The measurement was performed in accordance with the Japanese Industrial Standard JIS C6481.

[0297] The amounts of raw materials used in the resin compositions of the Examples and Comparative Examples, and the measurement results of the Test Examples are summarized in Table 1 below.

[0298] [Table 1]

[0299] From the results shown in Table 1 above, it can be seen that in a resin composition containing (B) epoxy resin and (C) inorganic filler, when (A) cyclic carbonate compound is used, it is possible to obtain a cured product that can maintain high peel strength even after HAST test and has a low dielectric tangent, compared to a case where (A) cyclic carbonate compound is not used. Also, it can be seen that in Example 11, which contains a hollow inorganic filler as (C) inorganic filler, the relative dielectric constant is further reduced compared to Example 1.

Claims

1. A resin composition comprising (A) a cyclic carbonate compound, (B) an epoxy resin, and (C) an inorganic filler, The component (C) contains silica, The component (A) is represented by formula (1): [Formula 1] [In the formula, R 1 , R 2 , R 3 , R 4 , R 5 and R 6 each independently represent (1) a hydrogen atom, (2) an alkyl group which may be substituted with a group selected from RO-, RCO-, RCOO-, and ROCO-, (3) an alkenyl group which may be substituted with a group selected from RO-, RCO-, RCOO-, and ROCO-, (4) an aralkyl group which may be substituted with a group selected from R-, RO-, RCO-, RCOO-, and ROCO-, or (5) a group represented by formula (2-1): [Case 2] or (6) a group represented by formula (2-2): [C3] represents a group represented by R 1' , R 2' , R 3' , R 4' , R 5' and R 6' each independently represent (1) a hydrogen atom, (2) an alkyl group which may be substituted with a group selected from RO-, RCO-, RCOO-, and ROCO-, (3) an alkenyl group which may be substituted with a group selected from RO-, RCO-, RCOO-, and ROCO-, or (4) an aralkyl group which may be substituted with a group selected from R-, RO-, RCO-, RCOO-, and ROCO-; A 1 and A 2 each independently represent —O—, —CO—, —COO—, or —OCO—; X and Y each independently represent (1) an alkylene group which may be substituted with a group selected from RO-, RCO-, RCOO-, and ROCO-, or (2) an alkenylene group which may be substituted with a group selected from RO-, RCO-, RCOO-, and ROCO-; R each independently represents an alkyl group, an alkenyl group, an aralkyl group, or an aryl group, each of which may be substituted with a group selected from a halogen atom, an alkyl-oxy group, an alkenyl-oxy group, an aryl-oxy group, an aralkyl-oxy group, an alkyl-carbonyl group, an alkenyl-carbonyl group, an aryl-carbonyl group, an aralkyl-carbonyl group, an alkyl-oxy-carbonyl group, an alkenyl-oxy-carbonyl group, an aryl-oxy-carbonyl group, an aralkyl-oxy-carbonyl group, an alkyl-carbonyl-oxy group, an alkenyl-carbonyl-oxy group, an aryl-carbonyl-oxy group, and an aralkyl-carbonyl-oxy group; Z's each independently represent a divalent hydrocarbon group which may have a substituent; n represents 0, 1, 2, or 3; * indicates the binding site.] A resin composition comprising a compound represented by the formula:

2. The resin composition according to claim 1 , further comprising (D) an active ester compound.

3. The resin composition according to claim 2, wherein the content of the component (A) is 1% by mass to 10% by mass, where the total amount of the components (A), (B) and (D) is 100% by mass.

4. The resin composition according to claim 2 or 3, wherein the content of the component (D) is 12% by mass or more, based on 100% by mass of non-volatile components in the resin composition.

5. In the formula (1), R 1 , R 2 , R 5 and R 6 are each independently (1) a hydrogen atom or (2) an alkyl group having 1 to 10 carbon atoms; The resin composition according to any one of claims 1 to 4, wherein in formula (2-1) and formula (2-2), R 1', R 2', R 5' and R 6' are each independently (1) a hydrogen atom or (2) an alkyl group having 1 to 10 carbon atoms.

6. A resin composition described in any one of claims 1 to 5, wherein the compound represented by formula (1) in component (A) is a compound selected from the compounds represented by formulas (A1) to (A17). [C4]

7. The resin composition according to any one of claims 1 to 6, wherein the content of the component (B) is 1% by mass to 20% by mass, based on 100% by mass of non-volatile components in the resin composition.

8. A resin composition described in any one of claims 1 to 7, wherein the average particle size of component (C) is 0.2 μm or more.

9. A resin composition described in any one of claims 1 to 8, wherein the content of component (C) is 5 mass% or more when the non-volatile components in the resin composition are 100 mass%.

10. The resin composition according to any one of claims 1 to 9, wherein the content of the component (C) is 60 mass% or more, based on 100 mass% of non-volatile components in the resin composition.

11. The resin composition according to any one of claims 1 to 10, further comprising a curing agent selected from the group consisting of phenol-based curing agents and carbodiimide-based curing agents.

12. The resin composition according to any one of claims 1 to 11, wherein the dielectric loss tangent (Df) of a cured product of the resin composition is 0.0030 or less when measured at 5.8 GHz and 23 ° C.

13. The resin composition according to any one of claims 1 to 12, wherein the elongation at break of a cured product of the resin composition is 0.2% or more when measured at 23 ° C. in accordance with JIS K7127.

14. The resin composition according to any one of claims 1 to 13, which is for forming an insulating layer for forming a conductor layer.

15. The resin composition according to any one of claims 1 to 13, which is for forming an insulating layer of a printed wiring board.

16. A cured product of the resin composition according to any one of claims 1 to 15.

17. A sheet-like laminate material comprising the resin composition according to any one of claims 1 to 15.

18. A resin sheet comprising a support and a resin composition layer formed from the resin composition according to any one of claims 1 to 15 provided on the support.

19. A printed wiring board comprising an insulating layer made of a cured product of the resin composition according to any one of claims 1 to 15.

20. A semiconductor device comprising the printed wiring board according to claim 19.

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