Photovoltaic device and method for manufacturing same

Abstract

The photoelectric conversion element is sealed and isolated from the external environment, preventing the short-term deterioration of power generation efficiency caused by the effects of moisture and oxygen in the air. [Solution] A photoelectric conversion module 2 having a photoelectric conversion element 4 and power drawing conductors 5, 6 is enclosed in an encapsulated panel 3 with the power drawing conductors drawn outward. The encapsulated panel is made of a pair of panel covers 21, 22 made of synthetic resin that house the photoelectric conversion element and are overlapped and joined together to form an integrated unit. At least one of the pair of panel covers, which faces the surface side into which light for power generation of the photoelectric conversion element is incident, is made of a synthetic resin material having optical transparency. The pair of panel covers are integrated by being thermally welded to the joining surfaces where they are overlapped and joined together with an intermediate member 26 for laser light joining interposed therebetween.

Description

[Technical field]

[0001] The present invention relates to a photovoltaic device in which a photoelectric conversion element is encapsulated in an encapsulation panel, and a method for manufacturing the same. [Background technology]

[0002] 2. Description of the Related Art Various photovoltaic power generation devices using a photoelectric conversion element that converts light energy directly into electrical energy by utilizing the photoelectric effect have been proposed and put to practical use.

[0003] Photovoltaic power generation devices of this type that use silicon-based power generation elements or photoelectric conversion elements using gallium arsenide have been put to practical use. Furthermore, in recent years, perovskite-type photovoltaic power generation devices have been proposed that use photoelectric conversion elements with a perovskite crystal structure that improves photoelectric conversion efficiency compared to the above-mentioned power generation elements.

[0004] Various photoelectric conversion elements that make up photovoltaic devices that generate electricity using sunlight, particularly perovskite-type photoelectric conversion elements, are affected by moisture and oxygen present in the air, and their power generation efficiency deteriorates in a short period of time.

[0005] Therefore, in order to improve the durability of photovoltaic devices and extend their lifespan, techniques have been proposed for protecting photoelectric conversion elements from the external environment.

[0006] As a technique for protecting a photoelectric conversion element from the external environment, a technique has been proposed in which an element housing section housing a photoelectric conversion element is sealed with a sealing layer (Patent Document 1).

[0007] Furthermore, in a photovoltaic device using a perovskite-type photoelectric conversion element, a photoelectric conversion element placed on a support is covered with an adhesive layer, and the adhesive layer is further covered with a sealant layer has been proposed (Patent Document 2). [Prior art documents] [Patent documents]

[0008] [Patent Document 1] Patent Publication No. 2022-073832 [Patent Document 2] JP 2023-067523 A Summary of the Invention [Problem to be solved by the invention]

[0009] The technical objective of the present invention is to provide a photovoltaic device and a manufacturing method thereof that more reliably isolates the photoelectric conversion element from the external environment and suppresses the deterioration of power generation efficiency in a short period of time due to the effects of moisture, oxygen, etc. present in the air.

[0010] In addition, the technical objective of the present invention is to provide a photovoltaic device and a manufacturing method thereof that suppresses the effects of the means for encapsulating the photoelectric conversion element in the encapsulation panel, suppresses deterioration of the power generation efficiency of the photoelectric conversion element, and achieves an even longer lifespan.

[0011] Furthermore, the technical objective of the present invention is to provide a photovoltaic device and a manufacturing method thereof that prevent deterioration of the power drawing conductor derived from the photoelectric conversion element, encapsulate the photoelectric conversion element in an encapsulation panel, and achieve an even longer life. [Means for solving the problem]

[0012] The means proposed to solve the above-mentioned technical problem includes a photoelectric conversion module including a photoelectric conversion element and a power drawing conductor led out from the photoelectric conversion element; Derived from the photoelectric conversion element The photovoltaic conversion module is enclosed in an encapsulation panel in a state in which the power extraction conductor is led outward. The encapsulation panel includes: The power lead conductor led from the photoelectric conversion element is led out to the outside of the encapsulation panel. A pair of synthetic resin panel covers that house the photoelectric conversion element and are stacked and joined together to form an integrated unit. and an intermediate member interposed between the joining surfaces of the pair of panel covers that are overlapped and joined to each other, the intermediate member being made of a synthetic resin film sheet as a base material, colored with a black dye or black pigment and having a laser light transmittance of 30% or less for a wavelength of 800 nm or more and 1500 nm or less. Equipped with.

[0013] The pair of panel covers are provided with a light source for generating power for the photoelectric conversion element to be housed therein. is incident At least one of the electrodes arranged opposite the incident surface side butMade from a light-transmitting synthetic resin material It has become , The above The bonding surfaces that are overlapped and bonded to each other are Joined to the intermediate member Integrated At the same time, The power lead-out conductor is The above It is characterized in that it is pulled out to the outside of the encapsulation panel from between the joining surfaces.

[0014] In the photovoltaic device, one of the panel covers is provided with an element housing portion for housing a photoelectric conversion element of the photoelectric conversion module.

[0015] It is also preferable that a laser beam joining intermediate member be attached to the surface of the power lead conductor that faces the overlapping joining surfaces of the pair of panel covers.

[0016] The power lead conductor may be bonded to the laser beam bonding intermediate member via a metal adhesive.

[0017] Furthermore, the intermediate member for laser beam bonding may have a base material having an adhesive layer on one or both sides thereof.

[0018] Furthermore, it is preferable that at least one of an inert gas, an oxygen remover, and a steam remover is disposed inside the enclosure panel.

[0019] In addition, a photoelectric conversion module having a translucent surface on either or both opposing sides of the photoelectric conversion element is enclosed in the encapsulated panel, and one or both of the pair of panel covers constituting the encapsulated panel can be formed from a synthetic resin material having optical transparency.

[0020] Furthermore, the technology proposed herein is a method for manufacturing a photovoltaic power generation device including a photovoltaic conversion module having a photovoltaic conversion element and a power drawing conductor led out from the photovoltaic conversion element, the photovoltaic conversion module being encapsulated in an encapsulation panel with the power drawing conductor led outward, The encapsulating panel includes a pair of panel covers made of synthetic resin that house the photoelectric conversion element and are overlapped and joined together to be integrated in a state in which the power drawing conductor derived from the photoelectric conversion element is drawn out to the outside of the encapsulating panel, and an intermediate member that is interposed between the joining surfaces of the pair of panel covers that are overlapped and joined to each other and has a base material of a synthetic resin film sheet that is colored with a black dye or black pigment and has a transmittance of 30% or less for laser light of 800 nm or more and 1500 nm or less, at least one of the pair of panel covers that is arranged opposite the incident surface side of the light for power generation of the housed photoelectric conversion element is formed of a synthetic resin material having optical transparency, They are overlapped and bonded together The above Between the overlapping and joining surfaces of a pair of panel covers The above The power lead-out conductor is disposed on the other panel cover of the pair of panel covers with an intermediate member interposed therebetween. The other panel cover Outside In the pulled out state The photoelectric conversion module is installed, and then at least one of the photoelectric conversion modules installed on the other panel cover is The above covering the photoelectric conversion element, and then overlapping one of the pair of panel covers on the other panel cover; From the one panel cover side having the light transmitting property, The intermediate member is interposed and overlapped. was done On the overlapping and joining surfaces of the pair of panel covers, The wavelength is between 800nm ​​and 1500nm. A laser beam is irradiated to heat the intermediate member, and the overlapping and joining surfaces of the pair of panel covers that are in contact with the heated area of ​​the intermediate member for laser beam joining are Melt and bond to the intermediate member; The pair of panel covers Together with the intermediate member integration do The present invention is characterized in that an encapsulated panel is produced in which the photoelectric conversion module is encapsulated.

[0021] In addition, a metal adhesive may be applied to the joining surface of the power draw conductor with the intermediate member for laser light joining, and the power draw conductor may be joined to the intermediate member for laser light joining via the metal adhesive.

[0022] Furthermore, a metal adhesive is applied to both sides of the power draw conductor. Then, auxiliary pieces of a laser light joining intermediate member having a width equal to that of the power draw conductor and a length equal to that of the laser light joining intermediate member and made of the same material as the laser light joining intermediate member are bonded to both sides of the power draw conductor via the metal adhesive. Then, a part of the panel cover may be melted by heating the auxiliary pieces, thereby bonding between the panel cover and the power draw conductor. Effect of the Invention

[0023] The present invention protects a photovoltaic conversion module from the external environment, prevents the power generation efficiency from deteriorating in a short period of time, and extends the life of the device.

[0024] Furthermore, the present invention prevents the photoelectric conversion element from being deteriorated by the means for encapsulating the photoelectric conversion module, protects the photoelectric conversion element, and realizes a longer life for the photovoltaic device.

[0025] Furthermore, the present invention makes it possible to generate photovoltaic power with fewer restrictions on installation locations.

[0026] Other advantages of the present invention will become more apparent from the embodiments described below. [Brief description of the drawings]

[0027] [Figure 1] 1 is a perspective view showing the appearance of a photovoltaic device according to an embodiment of the present invention; [Diagram 2] 1 is an exploded perspective view of a photovoltaic device according to an embodiment of the present invention; [Diagram 3] 3 is a cross-sectional view of a photoelectric conversion element constituting a photoelectric conversion module used in the photovoltaic device of the present embodiment. FIG. [Figure 4] FIG. 2 is a cross-sectional view showing a power generation layer of a photoelectric conversion element. [Diagram 5] 13 is a perspective view showing the inner surface side of the other panel cover that constitutes the encapsulation panel, the panel cover covering the photoelectric conversion module. FIG. [Figure 6] 11 is a perspective view showing a state in which a photoelectric conversion module is installed on one of the panel covers. FIG. [Figure 7] FIG. 2 is a perspective view showing a state in which a pair of panel covers are overlapped. [Figure 8] 10 is a cross-sectional view of a power feed conductor in which a metal adhesive is applied to an area where a laser light bonding intermediate member and an auxiliary piece of the power feed conductor are bonded. FIG. [Figure 9] 10 is a side view showing a state in which a pair of overlapping panel covers are irradiated with laser light to melt and bond them together. FIG. [Figure 10]FIG. 2 is a cross-sectional view of an encapsulation panel showing the coupling between a pair of power extraction conductors and a pair of panel covers. [Figure 11] FIG. 11 is a cross-sectional view showing another example of an intermediate member for laser beam bonding. [Figure 12] 1 is a plan view of a power draw conductor to which an auxiliary piece of an intermediate part for laser light bonding is attached via a metal adhesive. FIG. [Figure 13] 10 is a cross-sectional view of a power feed conductor to which an auxiliary piece of an intermediate member for laser light bonding is attached via a metal adhesive. [Figure 14] FIG. 11 is a perspective view showing another example of an intermediate member for laser beam bonding. [Figure 15] 15 is a perspective view showing a state in which a photoelectric conversion module is disposed on the other panel cover on which the separated laser beam bonding intermediate member shown in FIG. 14 is disposed. FIG. [Figure 16] FIG. 13 is a cross-sectional view showing an example in which an inert gas, oxygen scavenger and / or steam scavenger is disposed inside an encapsulation panel. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0028] Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

[0029] As shown in FIG. 1, a photovoltaic device 1 according to this embodiment includes a photovoltaic conversion module 2 that converts light energy into electrical energy by the photovoltaic effect, and an encapsulation panel 3 that encapsulates this photovoltaic conversion module 2.

[0030] As shown in Fig. 2, the photoelectric conversion module 2 used in this embodiment includes a photoelectric conversion element 4 and a pair of power drawing conductors 5, 6 led out from the photoelectric conversion element 4. As shown in Fig. 3, the photoelectric conversion element 4 constituting the photoelectric conversion module 2 is configured by laminating a translucent conductive layer 8 and an electrode 9 with a power generation layer 7 sandwiched therebetween. The photoelectric conversion element 4 is supported by a support substrate 10 with the translucent conductive layer 8 side serving as a support surface.

[0031] The power generation layer 7 constituting the photoelectric conversion element 4 of this embodiment is a layer that causes photoelectric conversion by irradiation with light, and generates electrons and holes from excitons generated by absorbing light. As shown in Fig. 4, the power generation layer 7 includes a hole transport layer 11, a photoelectric conversion layer 12, and an electron transport layer 13. The hole transport layer 11, the photoelectric conversion layer 12, and the electron transport layer 13 are laminated in this order along the direction from the translucent conductive layer 8 toward the electrode 9.

[0032] The hole transport layer 11 constituting the power generation layer 7 extracts holes generated in the photoelectric conversion layer 12 to the translucent conductive layer 8, and prevents electrons generated in the photoelectric conversion layer 12 from moving to the translucent conductive layer 8. The hole transport layer 11 is formed of a metal oxide. Examples of the metal oxide include titanium oxide, molybdenum oxide, vanadium oxide, zinc oxide, nickel oxide, lithium oxide, calcium oxide, cesium oxide, and aluminum oxide.

[0033] The photoelectric conversion layer 12 is a layer that converts absorbed light into electricity, and in this embodiment, a perovskite compound is used. The photoelectric conversion layer 12 containing a perovskite compound has the advantage that the power generation efficiency has a relatively low dependency on the angle of incident light. This makes it possible to obtain a higher power generation efficiency in this embodiment. Here, the perovskite compound includes a perovskite crystal structure and a structure having a crystal similar thereto.

[0034] The electron transport layer 13 extracts electrons generated in the photoelectric conversion layer 12 to the electrode 9, and prevents holes generated in the photoelectric conversion layer 12 from moving to the electrode 9. The electron transport layer 13 preferably contains, for example, any one of a halogen compound or a metal oxide. The electrode 9 is conductive and functions as an anode. The electrode 9 extracts electrons from the photoelectric conversion layer 12 in response to photoelectric conversion caused by the photoelectric conversion layer 12. Here, the electrode 9 is formed of platinum, gold, silver, copper, aluminum, rhodium, indium, titanium, nickel, tin, zinc, an alloy containing any of these, or the like.

[0035] When the photoelectric conversion element 4 used in this embodiment is irradiated with light, the photoelectric conversion layer 12 of the power generation layer 7 absorbs the light and performs photoelectric conversion, generating electrons and holes in the photoelectric conversion layer 12. The electrons are extracted via the electron transport layer 13 to the electrode 9 functioning as an anode, and the holes are extracted via the hole transport layer 11 to the translucent conductive layer 8 functioning as a cathode.

[0036] In this embodiment, a current is extracted from the power extraction conductors 5 and 6 connected to the electrode 9 and the translucent conductive layer 8, respectively. That is, power is generated.

[0037] The photovoltaic conversion module 2 used in this embodiment is configured as a single-sided type in which power is generated by light incident on one surface of the photovoltaic conversion element 4 .

[0038] The photoelectric conversion module 2 having the above-mentioned configuration is encapsulated in an encapsulation panel 3, as shown in FIG.

[0039] 2, the encapsulation panel 3 includes a pair of panel covers 21 and 22, one and the other, which are overlapped and joined together. The pair of panel covers 21 and 22 are formed to be the same size and have the same outer circumferential shape. One panel cover 21 is overlapped on the other panel cover 22, covering the placed photovoltaic conversion module 2. The pair of overlapped panel covers 21 and 22 are joined together by heat welding the overlapping joining surfaces of each other.

[0040] In this embodiment, the other panel cover 22 located on the lower side in FIG. 2 on which the one panel cover 21 is overlapped is formed in a flat plate shape.

[0041] 2 and 5, one panel cover 21 that is placed on the other panel cover 22 has a photoelectric conversion element storage recess 23 formed in the center in which the photoelectric conversion element 4 of the photoelectric conversion module 2 is stored. Furthermore, one panel cover 22 has conductor lead-out recesses 24, 25 formed in continuation with the photoelectric conversion element storage recess 23, in which the power lead-out conductors 5, 6 extend, as shown in Fig. 2 and 5. These conductor lead-out recesses 24, 25 are formed from the photoelectric conversion element storage recess 23 to the outer periphery of one longitudinal side of the one panel cover 21.

[0042] The photovoltaic conversion module 2 enclosed in the encapsulation panel 3 formed by overlapping and joining a pair of panel covers 21, 22 is placed on the other panel cover 22 as shown in Fig. 6, with the photovoltaic conversion element 4 positioned in a photovoltaic conversion element storage recess 23 formed in one panel cover 21, and the power drawing conductors 5, 6 extending into conductor drawing recesses 24, 25 formed in one panel cover 21. At this time, the pair of power drawing conductors 5, 6 overlap each other and protrude outward from between the pair of panel covers 21, 22.

[0043] In this embodiment, at least one of the panel covers 21 arranged on the side where light for power generation of the photovoltaic conversion module 2 enclosed in the encapsulated panel 3 is incident is made of a synthetic resin material that allows at least 30% of light with a wavelength of at least 300 to 1200 nm, including sunlight with a wavelength sufficient for the photovoltaic conversion element 4 using a perovskite compound to generate power, to be transmitted, and further allows 30% or more of laser light with a wavelength of 800 nm or more and 1500 nm or less, which is used to thermally weld the pair of panel covers 21, 22 to be transmitted.

[0044] Examples of this type of synthetic resin material that can be used include polycarbonate (PC), polymethyl methacrylate (PMMA), polyethylene terephthalate (PET), copolymer polyester (PETG), polyvinyl chloride (PVC), cyclic olefin polymer (COC, COP), polyethylene (PE), polyvinylidene chloride (PVDC), inomer resin (IO), transparent polypropylene (PP), fluorinated ethylene propylene copolymer (FEP), styrene-methyl methacrylate (SMMA), styrene-acrylonitrile resin (SAN), general-purpose polystyrene (GPPS), transparent ABS (MABS), and polymethylpentene (PMP).

[0045] In this embodiment, one panel cover 21 is formed using a plate-like member made of polycarbonate resin with a thickness of 0.5 mm that transmits 70 to 90% of light in the wavelength range of 300 to 1500 nm including the visible light range. Note that the thickness of one panel cover 21 is appropriately selected from the viewpoint of maintaining mechanical strength, as long as it transmits 70 to 90% of light in the wavelength range of 300 to 1500 nm.

[0046] The other panel cover 22 is made of a synthetic resin material that has good compatibility with the one panel cover 21 for joining.

[0047] In this embodiment, the other panel cover 22 is also formed from polycarbonate resin having the same type of light transmittance as the one panel cover 21.

[0048] In addition, the other panel cover 22 may be formed from the same type of polycarbonate resin that has good bonding compatibility with the one panel cover 21 formed from polycarbonate resin, or from any of the following synthetic resins: ABS, acrylic resin, or PVC.

[0049] Furthermore, like the one panel cover 21, it is desirable that the other panel cover 22 be formed from a plate-like material of an appropriate thickness to maintain mechanical strength, and in this embodiment it is formed using a polycarbonate resin plate material having a thickness of 0.5 mm.

[0050] 2, a laser beam joining intermediate member 26 used for thermally welding the pair of panel covers 21, 22 is disposed on the overlapping joining surface of the other panel cover 22 to which one panel cover 21 is overlapping and joined. The laser beam joining intermediate member 26 is a region surrounding the entire periphery of the outer periphery of the photoelectric conversion element 4 placed on the other panel cover 22, and is disposed on the overlapping joining surface 22a to be overlapping and joined with the overlapping joining surface 21a of the one panel cover 21.

[0051] The intermediate member 26 for laser beam joining used in this embodiment is formed of a film sheet having a transmittance of 30% or less for laser beams of 800 nm or more and 1500 nm or less used for thermally welding the pair of panel covers 21 and 22, and having the effect of absorbing the irradiated laser beam and generating heat. This film sheet is formed by stretching polycarbonate resin colored with a black dye or black pigment and having a laser beam transmittance of 30% or less. The film sheet constituting the intermediate member 26 for laser beam joining has a thickness of 0.1 to 0.5 mm. In this embodiment, the intermediate member 26 for laser beam joining is formed of a film sheet having a thickness of 0.3 mm.

[0052] The intermediate member 26 for laser light bonding can be made of a film sheet made of a polymeric material such as ABS, acrylic, or PVC that has compatibility with the pair of upper and lower panel covers 21, 22 made of polycarbonate resin. The intermediate member 26 for laser light bonding using these film sheets is endowed with a light absorption function by controlling the transmittance of laser light of 800 nm or more and 1500 nm or less by mixing carbon black, graphite, ketchin black, or the like into the film sheet that serves as the base material.

[0053] Then, the photoelectric conversion module 2 is placed on the other panel cover 22 on which the laser light bonding intermediate member 26 is disposed. The photoelectric conversion module 2 is disposed such that the photoelectric conversion element 4 is located in a photoelectric conversion element mounting area 27 formed in the central portion surrounded by the laser light bonding intermediate member 26, as shown in Fig. 6. At this time, the photoelectric conversion module 2 is disposed such that the pair of power extraction conductors 5, 6 extend onto the laser light bonding intermediate member 26 and protrude outward from one side edge of the one panel cover 21.

[0054] One panel cover 21 is placed on the other panel cover 22 on which the photoelectric conversion module 2 is placed, so as to cover the photoelectric conversion module 2, as shown in Fig. 7. At this time, one panel cover 21 stores the photoelectric conversion element 4 in a photoelectric conversion element storage section 23 formed in the center, and is placed on the other panel cover 22. At this time, the power extraction conductors 5, 6 are positioned in the conductor extraction recesses 24, 25, and protrude outward from between the pair of panel covers 21, 22 that are placed on top of each other, as shown in Fig. 7.

[0055] It is desirable to attach an auxiliary piece 26a of a laser light joining intermediate member made of the same material as the laser light joining intermediate member 26 to at least the surface of the power lead conductors 5, 6 made of a conductive metal such as copper, facing one of the panel covers 21, which is not in contact with the laser light joining intermediate member 26, as shown in Figures 2 and 6. The metal power lead conductors 5, 6 can be well adhered to the synthetic resin panel covers 21, 22 via the laser light joining intermediate member 26 and the auxiliary piece 26a. The close adhesion of the power lead conductors 5, 6 makes it possible to seal the space between the pair of panel covers 21, 22.

[0056] In this embodiment, a metal adhesive 28 may be applied to the area where the laser light joining intermediate member 26 and the auxiliary piece 26a of the power draw conductors 5, 6 are joined, as shown in Fig. 8. The metal adhesive 28 used here is for bonding between the power draw conductors 5, 6 made of a metal such as copper, the laser light joining intermediate member 26 made of a synthetic resin film sheet, and the auxiliary piece 26a, and for example, Chemlock (product name) or the like can be used.

[0057] By applying the metal adhesive 28 to the power lead conductors 5, 6, the metal power lead conductors 5, 6 can be more reliably adhered to the laser beam joining intermediate member 26 and its auxiliary piece 26a, which are made of a synthetic resin film sheet as a base material. This makes it possible to more reliably seal the pair of panel covers 21, 22 joined via the laser beam joining intermediate member 26 and its auxiliary piece 26a.

[0058] As described above, the pair of panel covers 21, 22 housing the photovoltaic conversion module 2 and overlapping each other are integrated by thermally welding the overlapping joining surfaces 21a, 22a with the laser light bonding intermediate member 26 and its auxiliary piece 26a interposed therebetween, thereby forming an encapsulated panel 3 enclosing the photovoltaic conversion module 2. The encapsulated panel 3 enclosing the photovoltaic conversion module 2 forms the photovoltaic power generation device 1 that outputs electric power from the power drawing conductors 5, 6.

[0059] The photovoltaic device 1 according to this embodiment configured as described above is assembled through the following steps.

[0060] First, as shown in FIG. 6, a frame-shaped intermediate member 26 for laser beam bonding is placed on the overlapping and joining surface 22a of the other panel cover 22 on which one panel cover 21 is to be overlapped.

[0061] 6, the photovoltaic conversion module 2 is placed on the other panel cover 22 with the photovoltaic conversion element 4 positioned within the photovoltaic conversion element installation area 27. At this time, the pair of power drawing conductors 5, 6 extend so as to protrude outward from one of the long sides of the other panel cover 22.

[0062] Next, one panel cover 21 is placed on the other panel cover 22 so as to cover the photoelectric conversion module 2 placed on the other panel cover 22. At this time, the one panel cover 21 is placed on the other panel cover 22 so as to store the photoelectric conversion element 4 in the photoelectric conversion element storage section 23, as shown in Fig. 7. Then, the one panel cover 21 and the other panel cover 22 are placed in a state in which their overlapping joining surfaces 21a, 22a are placed on top of each other with the laser light bonding intermediate member 26 sandwiched therebetween, as shown in Fig. 9.

[0063] In addition, it is desirable that the pair of panel covers 21, 22 overlapped with the laser beam bonding intermediate member 26 sandwiched therebetween be held together by a fixture such as a clamper in order to prevent misalignment in the overlapping state.

[0064] The pair of panel covers 21, 22, which house the photoelectric conversion module 2 and are stacked with the intermediate member 26 for laser light joining interposed therebetween, are integrated by thermal welding of the joining surfaces 21a, 22a, which are stacked with the intermediate member 26 for laser light joining interposed therebetween.

[0065] 9, the pair of overlapping panel covers 21, 22 are thermally welded by irradiating a laser beam L onto an area of ​​each panel cover 21, 22 where an intermediate member 26 for laser beam bonding is interposed. Here, the laser beam L has a wavelength in the infrared region of 800 nm to 1500 nm, and is generated by a gas laser, a semiconductor laser, a solid-state laser, or the like.

[0066] When the laser light L is irradiated to an area of ​​the pair of panel covers 21, 22 overlapping and joined to each other, where the intermediate member 26 for laser light joining is interposed, the laser light L passes through one of the panel covers 21 on the incident side of the laser light L and reaches the intermediate member 26 for laser light joining. The area of ​​the intermediate member 26 for laser light joining irradiated with the laser light L absorbs the irradiated laser light L, generates heat, and melts or softens. Then, at least a part of the pair of overlapping panel covers 21, 22 in close contact with the intermediate member 26 for laser light joining is melted by the heat of the melted or softened intermediate member 26 for laser light joining.

[0067] The pair of panel covers 21, 22 are heated and melted by the heat generated by the laser beam bonding intermediate member 26, and are thereby integrally joined to the melted laser beam bonding intermediate member 26.

[0068] The joining by irradiation of the laser light L is performed over the entire circumference of the region in which the intermediate member 26 for laser light joining is interposed between the pair of panel covers 21, 22 that are overlapped and joined to each other. At this time, the laser light L focused into a spot shape by a focusing means irradiates the region in which the intermediate member 26 for laser light joining is interposed while sequentially moving the irradiation position, heats the intermediate member 26 for laser light joining, and melts and joins the pair of overlapping panel covers 21, 22.

[0069] In this embodiment, the pair of power lead conductors 5, 6 and each of the panel covers 21, 22 are connected via a laser beam joining intermediate member 26 and its auxiliary piece 26a, as shown in FIG.

[0070] In this embodiment, the panel covers 21, 22 and the laser beam joining intermediate member 26 and its auxiliary piece 26a are made of materials with good joining compatibility, so that they can be closely attached to each other and integrated.

[0071] The pair of panel covers 21, 22 overlapping each other are integrated to form an encapsulation panel 3 encapsulating the photoelectric conversion module 2.

[0072] Incidentally, a pair of power drawing conductors 5, 6 derived from the photoelectric conversion element 4 sealed in the encapsulation panel 3 also adhere to the molten panel covers 21, 22 via the laser light bonding intermediate member 26 and the laser light bonding intermediate member auxiliary 26a. Moreover, these power drawing conductors 5, 6 are adhered to the laser light bonding intermediate member 26 and its auxiliary piece 26a by being covered with a metal adhesive 28, and are also closely attached to each panel cover 21, 22 via the laser light bonding intermediate member 26 and its auxiliary piece 26a, preventing the adhesion between each panel cover 21, 22 from being impaired.

[0073] As described above, the photovoltaic device 1 according to this embodiment is constructed by encapsulating the photovoltaic conversion module 2 in the encapsulation panel 3 made up of a pair of panel covers 21, 22 that are overlapped and joined together to form an integrated unit.

[0074] In this embodiment, a laser light joining intermediate member 26 and its auxiliary piece 26a for joining the panel covers 21, 22 are interposed on each opposing surface of the power drawing conductors 5, 6. However, when the laser light irradiation can provide a heat capacity sufficient to melt the panel covers 21, 22 using only the laser light joining intermediate member 26, it is not necessary to provide the auxiliary piece 26a of the laser light joining intermediate member 26.

[0075] In the present embodiment, the laser light bonding intermediate member 26 may be configured such that adhesive layers 31, 32 are provided on both sides of a film sheet 30 serving as a base material, as shown in Fig. 11. The adhesive layers 31, 32 can be formed of a thermoplastic elastomer, a non-crosslinked rubber, or the like.

[0076] By providing the adhesive layers 31, 32 on both sides of the intermediate member 26 for laser beam bonding, the pair of panel covers 21, 22 that are overlapped with the intermediate member 26 for laser beam bonding can be temporarily fixed, and the panel covers 21, 22 can be easily and accurately welded by laser beam. The adhesive layers 31, 32 may be provided only on one side.

[0077] In this embodiment, in order to improve the adhesion between the power lead-out conductors 5, 6 led out from between a pair of panel covers 21, 22 joined to each other and these panel covers 21, 22, auxiliary pieces 35, 36 of the laser light joining intermediate member 26 made of the same material as the laser light joining intermediate member 26 are adhered to both sides of the power lead-out conductors 5, 6 via metal adhesives 33, 34 as shown in Figures 12 and 13. These auxiliary pieces 35, 36 have a width W equal to the width of the power lead-out conductors 5, 6, and are formed to a size having a length L equal to the width of the laser light joining intermediate member 26.

[0078] Here, when sealing the photoelectric conversion module 2 in which the auxiliary pieces 35, 36 of the laser light joining intermediate member 26 have been previously adhered to the power draw conductors 5, 6, a cutout portion 37 for conductor drawing is formed in the laser light joining intermediate member 26 interposed between the pair of panel covers 21, 22 at a portion where the power draw conductors 5, 6 extend, as shown in Fig. 14. Then, when the pair of panel covers 21, 22 are overlapped and joined, a further auxiliary piece 38 of the laser light joining intermediate member 26 is disposed in a portion corresponding to the portion between the pair of power draw conductors 5, 6 extending into the cutout portion 37.

[0079] In this way, by disposing the further auxiliary piece 38 of the intermediate member 26 for laser light joining in a portion corresponding to the space between the pair of power lead-out conductors 5, 6, the intermediate member 26 for laser light joining, the auxiliary pieces 35, 36 provided on the power lead-out conductors 5, 6, and the further auxiliary piece 38 extend all around the overlapping and joining surfaces 21a, 22a of the pair of panel covers 21, 22. Therefore, the pair of panel covers 21, 22 are joined all around the overlapping and joining surfaces 21a, 22a, and the insides are more reliably sealed.

[0080] Furthermore, because the auxiliary pieces 35, 36 of the laser light bonding intermediate member 26 are adhered to the power lead-out conductors 5, 6, the auxiliary pieces 35, 36 are heated and melted by irradiation with laser light, and are tightly joined to the overlapping joining surfaces 21a, 22a of the pair of panel covers 21, 22. By tightly joining the power lead-out conductors 5, 6 to the overlapping joining surfaces 21a, 22a of the pair of panel covers 21, 22, the space between the pair of panel covers 21, 22 can be sealed with high accuracy.

[0081] Furthermore, the auxiliary pieces 35, 36 are adhered to the power draw conductors 5, 6 via metal adhesives 33, 34, thereby reliably joining the power draw conductors 5, 6 and the auxiliary pieces 35, 36, and providing a stable joint between the power draw conductors 5, 6 and the panel covers 21, 22.

[0082] To encapsulate the photoelectric conversion module 2 having the auxiliary pieces 35, 36 of the intermediate member 26 for laser light joining adhered to the aforementioned power drawing conductors 5, 6 in the encapsulating panel 3, the intermediate member 26 for laser light joining is placed on the overlapping joining surface 22a of the other panel cover 22 on which one panel cover 21 is overlapped, as shown in Figure 15.

[0083] Next, the photoelectric conversion module 2 is placed on the other panel cover 22 with the photoelectric conversion element 4 positioned within the photoelectric conversion element installation area 27, as shown in Fig. 15. At this time, the pair of power drawing conductors 5, 6 are positioned within the notch portion 37 formed in the laser light bonding intermediate member 26 as shown in Fig. 15, and extend so as to protrude outward from one of the long sides of the other panel cover 22.

[0084] 15, an additional auxiliary piece 38 of the laser light joining intermediate member 26 is disposed between the pair of power lead conductors 5, 6 positioned in the cutout 37. The additional auxiliary piece 38 may be disposed on the other panel cover 22 together with the laser light joining intermediate member 26.

[0085] In particular, by using the intermediate member 26 for laser light joining and the further auxiliary piece 38 having adhesive layers 31, 32 attached to both sides, even if the intermediate member 26 for laser light joining and the further auxiliary piece 38 are cut apart, they can be reliably positioned in the specified position on the panel cover 22.

[0086] Next, the encapsulation panel 3 is assembled through the same assembly steps as described above, so a detailed description will be omitted.

[0087] In this embodiment, an inert gas G such as argon or nitrogen may be enclosed inside the encapsulation panel 3 housing the photoelectric conversion module 2, as shown in Fig. 16. Furthermore, a deoxidizing and / or desteaming agent 41 may be further provided. The deoxidizing and / or desteaming agent 41 is placed in the photoelectric conversion element housing portion 23 formed in the other panel cover 22, as shown in Fig. 16.

[0088] In addition, in the enclosure panel 3, the inert gas G and the deoxidizing and / or dewatering steam agent 41 may be enclosed and installed in combination.

[0089] By sealing and placing an inert gas G, or gas G and a deoxidizing and / or desteaming agent 31 inside the encapsulation panel 3, it is possible to protect the perovskite-type photoelectric conversion element 4 used in this embodiment, which is vulnerable to moisture and oxygen.

[0090] In this embodiment, a pair of panel covers 21, 22 that are overlapped and joined to each other and that constitute the encapsulating panel 3 are made of polycarbonate resin, which is a synthetic resin material that has optical transparency that transmits light with a wavelength of at least 300 to 1200 nm, so that both sides of the encapsulating panel 3 can be light incident surfaces. Therefore, as the photovoltaic conversion module 2, a double-sided power generation type photovoltaic conversion element 4 that can generate power from light incident from both sides can be used.

[0091] As described above, the photovoltaic device 1 of this embodiment encapsulates the photoelectric conversion element 4 in the encapsulation panel 3 which is integrated by fusion bonding, thereby reliably isolating it from the external environment, protecting the photoelectric conversion element 4, and achieving a long life for the photovoltaic device 1. [Explanation of symbols]

[0092] 1 Photovoltaic device 2. Photoelectric conversion module 3 Enclosed Panel 4. Photoelectric conversion element 5, 6 Power Outlet Conductor 21, 22 Panel cover 23 Photoelectric conversion element storage recess 24, 25 Power Outlet Conductor 26 Intermediate material for laser beam joining 28 Metal Adhesive 41 Oxygen and / or desteaming agents

Claims

1. a photoelectric conversion module including a photoelectric conversion element and a power drawing conductor extending from the photoelectric conversion element; an encapsulation panel that encapsulates the photoelectric conversion module in a state in which the power extraction conductor derived from the photoelectric conversion element is led outward, The encapsulation panel comprises: a pair of panel covers made of synthetic resin that house the photoelectric conversion element and are overlapped and joined together to be integrated in a state in which the power drawing conductor led from the photoelectric conversion element is drawn out to the outside of the encapsulating panel; an intermediate member interposed between the joining surfaces of the pair of panel covers which are overlapped and joined to each other, the intermediate member having a base material made of a synthetic resin film sheet which is colored with a black dye or black pigment and has a transmittance of 30% or less for a laser light having a wavelength of 800 nm or more and 1500 nm or less, the intermediate member being heated and melted by irradiation with the laser light, and an adhesive layer provided on one or both sides of the base material; The pair of panel covers include At least one of the panel covers arranged to face the incident surface side of the photoelectric conversion element to which the power generation light is incident is made of a synthetic resin material having optical transparency that transmits at least 30% of light having a wavelength of 300 to 1200 nm, and a conductor lead-out recess is formed on the outer peripheral edge side of the one panel cover, The joining surfaces that are overlapped and joined to each other are welded to the intermediate member to be integrated, The power draw conductor derived from the photoelectric conversion element housed between the pair of panel covers is extended into the conductor draw recess and drawn out from between the joining surfaces of the pair of panel covers to the outside of the pair of panel covers, and the intermediate member attached to the surface of the power draw conductor facing the overlapping joining surfaces of the pair of panel covers is welded to the overlapping joining surfaces of the pair of panel covers. A photovoltaic device characterized by:

2. 2. The photovoltaic device according to claim 1, wherein the one panel cover is provided with an element housing portion for housing the photoelectric conversion element of the photoelectric conversion module.

3. 2. The photovoltaic device according to claim 1, wherein the power draw conductor is joined to the intermediate member via a metal adhesive for synthetic resin bonding.

4. 3. The photovoltaic device according to claim 1, wherein at least one of an inert gas, an oxygen absorber and / or a steam absorber is disposed inside the enclosure panel.

5. a photoelectric conversion module having a light-transmitting surface provided on either or both opposing surfaces of the photoelectric conversion element is enclosed in the encapsulation panel; The photovoltaic device according to claim 1 or claim 2, characterized in that both of the pair of panel covers constituting the encapsulating panel are formed from a synthetic resin material having an optical transparency that transmits at least 30% of light with wavelengths of 300 to 1200 nm.

6. A method for manufacturing a photovoltaic power generation device comprising a photovoltaic conversion module including a photovoltaic conversion element and a power drawing conductor extending from the photovoltaic conversion element, the photovoltaic conversion module being enclosed in an encapsulation panel with the power drawing conductor extended outward, the method comprising: The encapsulation panel comprises: a pair of panel covers made of synthetic resin that house the photoelectric conversion element and are overlapped and joined together to be integrated in a state in which the power drawing conductor led from the photoelectric conversion element is drawn out to the outside of the encapsulating panel; an intermediate member interposed between the joining surfaces of the pair of panel covers which are overlapped and joined to each other, the intermediate member having a base material made of a synthetic resin film sheet which is colored with a black dye or black pigment and has a transmittance of 30% or less for a laser light having a wavelength of 800 nm or more and 1500 nm or less, the intermediate member being heated and melted by irradiation with the laser light, and an adhesive layer provided on one or both sides of the base material; At least one of the pair of panel covers is disposed opposite to an incident surface side of the photoelectric conversion element on which light for generating power is incident, and is made of a synthetic resin material having optical transparency that transmits at least 30% of light having a wavelength of 300 to 1200 nm, and a conductor lead-out recess is formed on the outer peripheral edge side of the one panel cover, When joining the pair of panel covers, The intermediate member is interposed between overlapping and joining surfaces of the pair of panel covers which are overlapped and joined to each other, The intermediate member is attached to a surface of the power lead conductor that faces the overlapping joint surfaces of the pair of panel covers; the photovoltaic conversion module is placed on the other panel cover of the pair of panel covers in a state in which the power draw conductor to which the intermediate member is attached is drawn out to the outside of the other panel cover; Next, at least the photoelectric conversion element of the photoelectric conversion module installed on the other panel cover is covered and the power draw conductor is extended into the conductor draw recess, and the one panel cover is superimposed on the other panel cover, and the pair of panel covers are temporarily fixed to the adhesive layer provided on the intermediate member to position the joining positions of each other, Then, a laser beam having a wavelength of 800 nm or more and 1500 nm or less is irradiated from one of the panel covers to the overlapping and bonding surfaces of the pair of panel covers overlapped with the intermediate member interposed therebetween to heat the intermediate member, melting and fusing the overlapping and bonding surfaces of the pair of panel covers that are in contact with the heated area of ​​the intermediate member to the intermediate member, and in a state in which the power extraction conductor derived from the photoelectric conversion element is extended into the conductor extraction recess and drawn outward from between the bonding surfaces of the pair of panel covers, the pair of panel covers are integrally bonded together with the intermediate member, An encapsulated panel was produced by encapsulating the photoelectric conversion module. A method for manufacturing a photovoltaic device comprising the steps of:

7. a metal adhesive for synthetic resin bonding is applied to a joint surface of the power feed conductor with the intermediate member; 7. The method for manufacturing a photovoltaic device according to claim 6, wherein the power-drawing conductor is bonded to the intermediate member via the metal adhesive.

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