Circuit boards, circuit modules

Abstract

To provide a circuit board capable of improving the freedom of layout without forming an interlayer connection structure on a magnetic shielding member.SOLUTION: The circuit board includes: a magnetic shielding member that has a first main surface and a second main surface opposite to the first main surface; and a flexible wiring substrate that has one face and the other face that is the opposite face of the one face, and the other face is fixed to the first main surface and the second main surface of the magnetic shielding member. One side of the circuit board includes a circuit area where electronic components are mounted and a terminal area where connection terminals are arranged, and the circuit area is arranged on the first main surface of the magnetic shielding member. The circuit board is bent along the magnetic shielding member, and the terminal area is located on the second main surface of the magnetic shielding member.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a circuit board and a circuit module. [Background technology]

[0002] Various circuit modules for instruments and the like are known. For example, there is an instrument having a circuit board with electronic components mounted thereon and a magnet inside a case. This instrument has a shielding section to prevent the magnetic field generated by the magnet from affecting the electronic components (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2016-90295 A Summary of the Invention [Problem to be solved by the invention]

[0004] Incidentally, the materials of the magnetic shielding members used in the circuit boards are generally more difficult to process than resin materials, and it is difficult to form interlayer connection structures such as through holes and vias in them. On the other hand, if the electronic components and connection terminals are concentrated only on one side of the circuit board without forming an interlayer connection structure in the magnetic shielding member, this places great restrictions on the layout.

[0005] The present invention has been made in consideration of the above-mentioned points, and an object of the present invention is to provide a circuit board that improves the degree of freedom in layout without forming an interlayer connection structure in a magnetic shielding member. [Means for solving the problem]

[0006] The circuit board has a magnetic shielding member having a first main surface and a second main surface that is the opposite surface to the first main surface, and a flexible wiring board having one side and the other side that is the opposite surface to the one side, the other side being fixed to the first main surface and the second main surface of the magnetic shielding member, one side of the wiring board including a circuit area on which electronic components are mounted and a terminal area on which connection terminals are arranged, the circuit area being disposed on the first main surface of the magnetic shielding member, the wiring board being folded along the magnetic shielding member, and the terminal area being disposed on the second main surface of the magnetic shielding member. Effect of the Invention

[0007] According to the disclosed technique, it is possible to provide a circuit board with improved freedom of layout without forming an interlayer connection structure in a magnetic shielding member. [Brief description of the drawings]

[0008] [Figure 1] 1 is a plan view illustrating a circuit module according to a first embodiment. [Diagram 2] FIG. 2 is a cross-sectional view taken along line AA in FIG. [Diagram 3] 3 is a plan view illustrating the wiring board according to the first embodiment in an unbent state. FIG. [Figure 4] 1 is a cross-sectional view illustrating a circuit module according to a first modified example of the first embodiment. FIG. [Diagram 5] 10 is a plan view illustrating a wiring board according to Modification 1 of the first embodiment in an unbent state. FIG. [Figure 6] 11 is a cross-sectional view illustrating a circuit module according to a second embodiment. FIG. [Figure 7] 13 is a plan view illustrating a state in which the wiring board according to the second embodiment is not bent. FIG. [Figure 8] 13 is a plan view illustrating a wiring board according to Modification 1 of the second embodiment in an unbent state. FIG. [Figure 9] 13 is a bottom view illustrating a state in which the wiring board according to Modification 1 of the second embodiment is bent. FIG. [Figure 10] 13 is a plan view illustrating a wiring board according to Modification 2 of the second embodiment in an unbent state. FIG. [Figure 11] 13 is a bottom view illustrating a state in which the wiring board according to Modification 2 of the second embodiment is bent. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In the drawings, the same components are denoted by the same reference numerals, and duplicated explanations may be omitted.

[0010] First embodiment Fig. 1 is a plan view illustrating a circuit module according to a first embodiment. Fig. 2 is a cross-sectional view taken along line AA in Fig. 1. As shown in Figs. 1 and 2, the circuit module 1 has a circuit board 10 and a substrate 20 with electrodes.

[0011] (Circuit board 10) Fig. 3 is a plan view illustrating the wiring board according to the first embodiment in an unfolded state. With reference to Figs. 1 to 3, the circuit board 10 has a wiring board 110, electronic components 120, adhesive layers 131 to 133, a magnetic shielding member 140, and magnets 151 and 152. However, the circuit board 10 may not have the magnets 151 and 152, and may have a structure in which the magnets 151 and 152 can be mounted when necessary.

[0012] The wiring board 110 is a flexible board. The wiring board 110 has a wiring pattern, pads for mounting components, an insulating layer, and the like, on an insulating resin having a low Young's modulus and flexibility. Examples of the insulating resin having a low Young's modulus and flexibility include polyimide resin, epoxy resin, urethane resin, and liquid crystal polymer. The planar shape of the wiring board 110 is, for example, rectangular, but is not limited thereto. The thickness of the wiring board 110 can be, for example, about 20 to 100 μm.

[0013] 3, one surface 110a of wiring board 110 includes a circuit region 111 and terminal regions 112 and 113. Before wiring board 110 is folded, circuit region 111 is provided at approximately the center in the longitudinal direction of one surface 110a. Furthermore, terminal regions 112 and 113 are provided on both outer sides of circuit region 111 on one surface 110a.

[0014] A plurality of electronic components 120 are mounted on the circuit region 111. The electronic components 120 may include semiconductor components and passive components. The electronic components 120 constitute, for example, a circuit for processing a biosignal. Examples of the semiconductor components constituting the electronic components 120 include integrated circuits for signal processing. Examples of the passive components constituting the electronic components 120 include resistors, capacitors, inductors, antennas, connectors, and the like. Note that no electronic components or the like are mounted on the other surface 110b of the wiring board 110.

[0015] A connection terminal 116 is disposed in the terminal region 112, and a connection terminal 117 is disposed in the terminal region 113. The planar shape of the connection terminals 116 and 117 is, for example, circular, but may be rectangular or the like. The connection terminals 116 and 117 are electrically connected to necessary parts of the electronic component 120 by wiring (not shown). The connection terminals 116 and 117 may be made of, for example, copper. The connection terminals 116 and 117 may have a thickness of, for example, about 5 to 35 μm.

[0016] 2, the other surface 110b of the wiring board 110 on which the multiple electronic components 120 are mounted is fixed to the magnetic shielding member 140 via adhesive layers 131 to 133. The magnetic shielding member 140 has a first main surface 140a and a second main surface 140b opposite to the first main surface 140a, and is preferably larger than the circuit region 111 in plan view. The magnetic shielding member 140 may be made of, for example, permalloy or silicon steel. The magnetic shielding member 140 may have a thickness of, for example, about 0.1 to 2 mm. The magnetic shielding member 140 may be flexible. The adhesive layers 131 to 133 may be made of, for example, acrylic resin or epoxy resin. The adhesive layers 131 to 133 may be supplied in a liquid state or a film state. The adhesive layers 131 to 133 may have a thickness of, for example, about 20 to 100 μm.

[0017] Specifically, on the other surface 110b of the wiring board 110, a region overlapping with the circuit region 111 in a plan view is fixed to the first main surface 140a of the magnetic shielding member 140 via an adhesive layer 131. That is, the circuit region 111 of the wiring board 110 is disposed on the first main surface 140a of the magnetic shielding member 140.

[0018] Both end sides of wiring board 110 are bent along both end portions of magnetic shielding member 140 in the region between circuit region 111 and terminal region 112 and the region between circuit region 111 and terminal region 113. In the other surface 110b of wiring board 110, a region overlapping with terminal region 112 in a plan view is fixed to second main surface 140b of magnetic shielding member 140 via adhesive layer 132.

[0019] Furthermore, on the other surface 110b of the wiring board 110, a region overlapping with the terminal region 113 in a plan view is fixed to the second main surface 140b of the magnetic shielding member 140 via the adhesive layer 133. That is, the terminal regions 112 and 113 of the wiring board 110 are disposed on the second main surface 140b of the magnetic shielding member 140. In this manner, the circuit region 111 and the terminal regions 112 and 113 are disposed on opposite sides of the magnetic shielding member 140 in a cross-sectional view.

[0020] A magnet 151 may be joined to the connection terminal 116 by, for example, solder or the like. A magnet 152 may be joined to the connection terminal 117 by, for example, solder or the like. In order to improve the connection reliability between the connection terminals 116 and 117 and the magnets 151 and 152 and to reduce electrical resistance, it is preferable that a metal layer 155 is formed on the surface of the magnets 151 and 152. Examples of materials for the magnets 151 and 152 include ferrite, cobalt, neodymium, etc. Examples of materials for the metal layer 155 include copper and gold, etc. The metal layer 155 can be formed by, for example, electroless plating.

[0021] At least the other surface 110b of wiring board 110, which corresponds to the portion in plan view corresponding to connection terminals 116, 117 to which magnets 151, 152 are joined, is firmly joined to magnetic shielding member 140 using an adhesive layer.

[0022] (Substrate with electrodes 20) The electrode-attached substrate 20 has a wiring board 210 having ferromagnetic metal parts 251 and 252 on one surface 210a and external electrodes 216 and 217 electrically connected to the ferromagnetic metal parts 251 and 252 on the other surface 210b. The wiring board 210 is a flexible or stretchable board. The wiring board 210 has, for example, a wiring pattern, a pad for mounting components, an insulating layer, and the like on an insulating resin. As the insulating resin, for example, polyimide resin, epoxy resin, liquid crystal polymer, and the like can be used, as in the wiring board 110. The wiring board 210 may be made of a material having excellent stretchability, such as urethane. The thickness of the wiring board 210 can be, for example, about 20 to 100 μm.

[0023] On one surface 210a of the wiring board 210, pads (not shown) are formed in areas overlapping the connection terminals 116 and 117 in a plan view, and ferromagnetic metal parts 251 and 252 are joined to the pads (not shown) by, for example, solder or the like. The ferromagnetic metal parts 251 and 252 are protruding electrodes, and are detachably connected to the magnets 151 and 152 by magnetic force, and are electrically connected to each other. Examples of materials for the ferromagnetic metal parts 251 and 252 include SUS430. In order to improve the connection reliability with the pads and to reduce electrical resistance, it is preferable that a metal layer 255 is formed on the surface of the ferromagnetic metal parts 251 and 252. Examples of materials for the metal layer 255 include copper and gold. The metal layer 255 can be formed by, for example, electroless plating.

[0024] It should be noted that magnets may be used as protruding electrodes instead of the ferromagnetic metal parts 251 and 252. However, since magnets have polarity, it is necessary to align the polarity so that they can be attracted to the magnets 151 and 152. For this reason, it is easier to manufacture the electrode-equipped substrate 20 by using the non-polarized ferromagnetic metal parts 251 and 252 as protruding electrodes.

[0025] External electrodes 216 and 217 are provided on the other surface 210b of the wiring board 210. The external electrodes 216 and 217 are electrically connected to the pads to which the ferromagnetic metal parts 251 or 252 are fixed via wiring, through holes, or the like (not shown). The external electrodes 216 and 217 are parts that come into contact with the object to be measured and to which a signal is input. The external electrodes 216 and 217 may be made of, for example, copper or silver. The thickness of each of the external electrodes 216 and 217 may be, for example, about 5 to 35 μm.

[0026] A signal input from external electrode 216 is input to a necessary portion of electronic component 120 via ferromagnetic metal part 251, magnet 151, and connection terminal 116. A signal input from external electrode 217 is input to a necessary portion of electronic component 120 via ferromagnetic metal part 252, magnet 152, and connection terminal 117.

[0027] In this manner, in the circuit board 10, the electronic component 120 is mounted on the first main surface 140a side of the magnetic shielding member 140, and the connection terminals 116 and 117 connectable to the magnets 151 and 152 are arranged on the second main surface 140b side of the magnetic shielding member 140. As a result, even if components that generate a magnetic field, such as the magnets 151 and 152, are arranged on the connection terminals 116 and 117, the magnetism of the magnets 151 and 152, etc. is blocked by the magnetic shielding member 140. Therefore, it is possible to reduce the effect of noise caused by the magnetism of the magnets 151 and 152, etc. on the electronic component 120 and obtain a desired output signal.

[0028] In addition, since permalloy, silicon steel, etc., which are generally used as materials for the magnetic shielding member 140, are more difficult to process than resin materials, etc., forming an interlayer connection structure such as through holes or vias leads to an increase in costs. In the circuit board 10, the electronic component 120 is mounted only on one surface 110a of the wiring board 110, and the connection terminals 116 and 117 are also arranged only on one surface 110a of the wiring board 110. Therefore, in the circuit board 10, the electronic component 120 and the connection terminals 116 and 117 can be easily arranged on the opposite surface side of the magnetic shielding member 140 simply by bending the wiring board 110, and there is no need to form an interlayer connection structure in the magnetic shielding member 140, which can reduce costs. In addition, since the electronic component 120, the connection terminals 116, etc. can be arranged on both sides of the magnetic shielding member 140, the degree of freedom of layout can be improved.

[0029] Furthermore, since the circuit board 10 is detachably connected to the ferromagnetic metal parts 251 and 252 by the magnetic forces of the magnets 151 and 152, it can be attached to the electrode-equipped substrate 20 only when necessary.

[0030] The circuit module 1 can be used as a sensor that detects various types of biological information from a living body by contacting the external electrodes 216 and 217 with the living body. Specifically, the circuit module 1 can be used as an electromyogram sensor. Alternatively, the circuit module 1 may be used as an electrocardiogram sensor or a magnetoencephalogram sensor.

[0031] First Modification of the First Embodiment In Modification 1 of the first embodiment, an example of a circuit module having a wiring board different from that of the first embodiment is shown. Note that in Modification 1 of the first embodiment, the description of the same components as those in the already described embodiments may be omitted.

[0032] Fig. 4 is a cross-sectional view illustrating a circuit module according to Modification 1 of the first embodiment, showing a cross section corresponding to Fig. 2. Fig. 5 is a plan view illustrating a wiring board according to Modification 1 of the first embodiment in an unbent state. With reference to Figs. 4 and 5, circuit module 1A differs from circuit module 1 (see Figs. 1 to 3) in that circuit board 10 is replaced with circuit board 10A.

[0033] The circuit board 10A has a wiring board 110A, electronic components 120, adhesive layers 131 and 132, a magnetic shielding member 140, and magnets 151 and 152. However, the circuit board 10A may not have the magnets 151 and 152, and may have a structure in which the magnets 151 and 152 can be mounted when necessary.

[0034] 5, one surface 110a of the wiring board 110A includes a circuit region 111A and a terminal region 112A. Before the wiring board 110A is folded, the circuit region 111A is provided at one end of the one surface 110a in the longitudinal direction. A plurality of electronic components 120 are mounted on the circuit region 111A. No electronic components or the like are mounted on the other surface 110b of the wiring board 110A. The terminal region 112A is provided adjacent to the circuit region 111A at the other end of the one surface 110a in the longitudinal direction. Connection terminals 116 and 117 are arranged in the terminal region 112A.

[0035] 4, wiring board 110A on which multiple electronic components 120 are mounted is fixed to magnetic shielding member 140 via adhesive layers 131 and 132. Specifically, an area on the other surface 110b of wiring board 110A that overlaps with circuit region 111A in a plan view is fixed to first main surface 140a of magnetic shielding member 140 via adhesive layer 131. That is, circuit region 111A of wiring board 110A is disposed on first main surface 140a of magnetic shielding member 140.

[0036] The other end of the wiring board 110A is bent along the end of the magnetic shielding member 140 in a region between the circuit region 111A and the terminal region 112A. In the other surface 110b of the wiring board 110A, a region overlapping with the terminal region 112A in a plan view is fixed to the second main surface 140b of the magnetic shielding member 140 via an adhesive layer 132. That is, the terminal region 112A of the wiring board 110A is disposed on the second main surface 140b of the magnetic shielding member 140. In this way, the circuit region 111A and the terminal region 112A are disposed on opposite sides of the magnetic shielding member 140 in a cross-sectional view.

[0037] In this manner, before the wiring board 110A is folded, one terminal area 112A in which the connection terminals 116 and 117 are arranged may be provided on one side of the circuit area 111A on one surface 110a. In this case, the wiring board 110A is folded along the magnetic shielding member 140 in a region between the circuit area 111A and the terminal area 112A. As a result, the circuit area 111A is arranged on the first main surface 140a of the magnetic shielding member 140, and the terminal area 112A is arranged on the second main surface 140b of the magnetic shielding member 140. As a result, the same effects as those of the first embodiment are achieved.

[0038] Second Embodiment In the second embodiment, an example of a circuit module having three or more external electrodes will be described. Note that in the second embodiment, the description of the same components as those in the embodiments already described may be omitted.

[0039] Fig. 6 is a cross-sectional view illustrating a circuit module according to a second embodiment, showing a cross section corresponding to Fig. 2. Fig. 7 is a plan view illustrating a wiring board according to the second embodiment in a state where it is not bent. With reference to Figs. 6 and 7, circuit module 1B differs from circuit module 1 (see Figs. 1 to 3) in that circuit board 10 is replaced with circuit board 10B, and electrode board 20 is replaced with electrode board 20B.

[0040] Circuit board 10B has wiring board 110B, electronic component 120, adhesive layers 131 and 132, magnetic shielding member 140, and magnets 151 to 153. However, circuit board 10B may not have magnets 151 to 153, and may have a structure in which magnets 151 to 153 can be mounted when necessary.

[0041] Referring to FIG. 7, one surface 110a of the wiring board 110B includes a circuit region 111B and a terminal region 112B. Before the wiring board 110B is folded, the circuit region 111B is provided at one end of the one surface 110a in the longitudinal direction. A plurality of electronic components 120 are mounted on the circuit region 111B. Note that no electronic components or the like are mounted on the other surface 110b of the wiring board 110B, and no wiring or electrodes are formed thereon. The terminal region 112B is provided adjacent to the circuit region 111B at the other end of the one surface 110a in the longitudinal direction. Connection terminals 116, 117, and 118 are arranged in the terminal region 112B.

[0042] 6, the circuit region 111B of the wiring board 110B is disposed on the first main surface 140a of the magnetic shielding member 140, and the terminal region 112B is disposed on the second main surface 140b of the magnetic shielding member 140. In this manner, the circuit region 111B and the terminal region 112B are disposed on opposite sides of the magnetic shielding member 140 in a cross-sectional view.

[0043] Magnet 153 may be fixed to connection terminal 118 by, for example, solder or the like. In order to improve the connection reliability between connection terminal 118 and magnet 153 and to reduce electrical resistance, it is preferable that a metal layer 155 is formed on the surface of magnet 153. As the material of magnet 153, for example, the same material as that of magnets 151 and 152 can be used.

[0044] The electrode-equipped substrate 20B has a wiring board 210B and ferromagnetic metal parts 251 to 253. On one surface 210a of the wiring board 210B, a pad (not shown) is formed in an area overlapping with the connection terminal 118 in a plan view, and a ferromagnetic metal part 253 is joined onto the pad (not shown) by, for example, solder or the like. The ferromagnetic metal part 253 is a protruding electrode, and is detachably connected to the magnet 153 by magnetic force, and the two are electrically connected. For example, the same material as the ferromagnetic metal parts 251 and 252 can be used as the material of the ferromagnetic metal part 253. It is preferable that a metal layer 255 is formed on the surface of the ferromagnetic metal part 253.

[0045] A magnet may be used as the protruding electrode instead of the ferromagnetic metal part 253. However, since the magnet has a polarity, it is necessary to align the polarity so that it can be attracted to the magnet 153. For this reason, it is easier to manufacture the electrode-equipped substrate 20B by using the non-polarized ferromagnetic metal part 253 as the protruding electrode.

[0046] On the other surface 210b of the wiring board 210B, the external electrodes 216 to 218 are provided, for example, along the longitudinal direction of the wiring board 210. The external electrode 218 is electrically connected to a pad to which the ferromagnetic metal part 253 is fixed via wiring, a through hole, or the like (not shown). The external electrodes 216 to 218 are parts that come into contact with a measurement object and to which a signal is input. For example, the same material as the external electrodes 216 and 217 can be used as the material of the external electrode 218. The signal input from the external electrode 218 is input to a necessary part of the electronic component 120 via the ferromagnetic metal part 253, the magnet 153, and the connection terminal 118. One of the external electrodes 216 to 218 can be used as a reference electrode.

[0047] In this manner, before the wiring board 110B is folded, one terminal region 112B in which the connection terminals 116-118 are arranged may be provided on one side of the circuit region 111B on one surface 110a. In this case, similarly to the case of the wiring board 110A, the wiring board 110B is folded along the magnetic shielding member 140 in the region between the circuit region 111B and the terminal region 112B. As a result, the circuit region 111B is arranged on the first main surface 140a of the magnetic shielding member 140, and the terminal region 112B is arranged on the second main surface 140b of the magnetic shielding member 140. As a result, the same effects as those of the first embodiment are achieved.

[0048] Furthermore, for example, when the circuit module 1B is used as a myoelectric sensor, the reference electrode serves as a reference potential for the myoelectric signal. Therefore, in the circuit module 1B, by using one of the external electrodes 216-218 electrically connected to the connection terminals 116-118 as a reference electrode, more stable detection of the myoelectric signal becomes possible.

[0049] <Modification 1 of the second embodiment> In the first modification of the second embodiment, another example of a circuit module having three or more external electrodes is shown. Note that in the first modification of the second embodiment, the description of the same components as those in the already described embodiments may be omitted.

[0050] Fig. 8 is a plan view illustrating the wiring board according to the first modification of the second embodiment in an unfolded state, and Fig. 9 is a bottom view illustrating the wiring board according to the first modification of the second embodiment in a folded state.

[0051] 8 and 9, before the wiring board 110C is folded, the circuit area 111C has four sides in a plan view. Terminal areas 112C, 113C, and 114C extend outside the three sides of the circuit area 111C on one surface 110a of the wiring board 110C. Connection terminals 116, 117, and 118 are provided in the terminal areas 112C, 113C, and 114C, respectively.

[0052] The wiring board 110C is folded along the magnetic shielding member 140 in a region between the circuit region 111C and the terminal regions 112C, 113C, and 114C. As a result, the circuit region 111C is disposed on the first main surface 140a of the magnetic shielding member 140, and the terminal regions 112C, 113C, and 114C are disposed on the second main surface 140b of the magnetic shielding member 140. As a result, the same effects as those of the first embodiment are achieved. The terminal regions 112C, 113C, and 114C can be formed into appropriate shapes so as not to overlap on the second main surface 140b of the magnetic shielding member 140 when folded.

[0053] Furthermore, for example, when the circuit module according to the first modification of the second embodiment is used as a myoelectric sensor, the reference electrode serves as a reference potential for the myoelectric signal. Therefore, in the circuit module according to the first modification of the second embodiment, by using one of the external electrodes electrically connected to the connection terminals 116 to 118 as a reference electrode, more stable detection of the myoelectric signal is possible.

[0054] <Modification 2 of the second embodiment> In the second modification of the second embodiment, another example of a circuit module having three or more external electrodes is shown. Note that in the second modification of the second embodiment, the description of the same components as those in the already described embodiments may be omitted.

[0055] Fig. 10 is a plan view illustrating a state in which the wiring board according to the second modification of the second embodiment is not bent. Fig. 11 is a bottom view illustrating a state in which the wiring board according to the second modification of the second embodiment is bent.

[0056] 10 and 11, before the wiring board 110D is folded, the circuit area 111D has four sides in a plan view. Terminal areas 112D, 113D, 114D, and 115D extend outside the four sides of the circuit area 111D on one surface 110a of the wiring board 110D. Connection terminals 116, 117, 118, and 119 are provided in the terminal areas 112D, 113D, 114D, and 115D, respectively.

[0057] The wiring board 110D is folded along the magnetic shielding member 140 in a region between the circuit region 111D and the terminal regions 112D, 113D, and 114D. As a result, the circuit region 111D is disposed on the first main surface 140a of the magnetic shielding member 140, and the terminal regions 112D, 113D, 114D, and 115D are disposed on the second main surface 140b of the magnetic shielding member 140. As a result, the same effects as those of the first embodiment are achieved. The terminal regions 112D, 113D, 114D, and 115D can be appropriately shaped so as not to overlap on the second main surface 140b of the magnetic shielding member 140 when folded.

[0058] Furthermore, for example, when the circuit module according to the second modification of the second embodiment is used as a myoelectric sensor, the reference electrode serves as a reference potential for the myoelectric signal. Therefore, in the circuit module according to the second modification of the second embodiment, by using two of the external electrodes electrically connected to the connection terminals 116 to 119 as reference electrodes, more stable detection of the myoelectric signal is possible.

[0059] Although preferred embodiments have been described above in detail, the present invention is not limited to the above-described embodiments, and various modifications and substitutions can be made to the above-described embodiments without departing from the scope of the claims. [Explanation of symbols]

[0060] 1, 1A, 1B Circuit Module 10, 10A, 10B Circuit Board 20, 20B Substrate with electrodes 110, 110A, 110B, 110C, 110D, 210, 210B Wiring board 110a, 210a One side 110b, 210b other side 111, 111A, 111B, 111C, 111D circuit area 112, 112A, 112B, 112C, 112D, 113, 113C, 113D, 114, 114C, 114D, 115, 115D terminal area 116, 117, 118, 119 Connection terminals 120 Electronic Components 131, 132, 133 Adhesive layer 140 Magnetic shielding material 140a First main surface 140b 2nd principal surface 151, 152, 153 Magnets 155, 255 metal layer 216, 217, 218 external electrode 251, 252 Ferromagnetic metal part

Claims

1. a magnetic shielding member having a first main surface and a second main surface opposite to the first main surface; a flexible wiring board having one surface and another surface opposite to the one surface, the other surface being fixed to the first main surface and the second main surface of the magnetic shielding member, one surface of the wiring board includes a circuit region on which electronic components are mounted and a terminal region on which connection terminals are arranged; the circuit region is disposed on the first main surface of the magnetic shielding member, the wiring board is folded along the magnetic shielding member, and the terminal area is disposed on a second main surface of the magnetic shielding member.

2. The circuit board according to claim 1 , wherein a magnet covered with a metal layer is joined to the connection terminal.

3. 3. The circuit board according to claim 1, wherein the other surface of the wiring board corresponding to the connection terminal in a plan view is joined to a magnetic shielding member via an adhesive layer.

4. one of the terminal areas in which the plurality of connection terminals are arranged is provided on one side of the circuit area on the one surface before the wiring board is folded; 4. The circuit board according to claim 1, wherein the wiring board is folded along the magnetic shielding member in a region between the circuit region and the terminal region, and the terminal region is disposed on a second main surface of the magnetic shielding member.

5. the terminal areas are provided outside the circuit area on the one surface before the wiring board is folded; 4. The circuit board according to claim 1, wherein the wiring board is folded along the magnetic shielding member in a region between the circuit region and each of the terminal regions, and each of the terminal regions is disposed on a second main surface of the magnetic shielding member.

6. the circuit region has four sides in a plan view, The circuit board according to claim 5 , wherein the three terminal areas extend outside three sides of the circuit area on the one surface before the wiring board is folded.

7. the circuit region has four sides in a plan view, The circuit board according to claim 5 , wherein the four terminal areas extend outside the four sides of the circuit area on the one surface before the wiring board is folded.

8. A circuit board according to claim 2; a substrate having protruding electrodes on one surface and having external electrodes electrically connected to the protruding electrodes on the other surface; The magnet and the protruding electrodes are detachably connected to a circuit module.

9. 9. The circuit module according to claim 8, wherein the protruding electrode includes a ferromagnetic metal portion.

10. The circuit module according to claim 8 or 9, wherein the substrate is flexible or stretchable.

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