Cooling systems for rail vehicles

Abstract

To provide a cooling device for railway vehicles capable of ensuring the long-term reliability of a cooling device by increasing the rigidity of a cooling device to suppress the structure vibration of the cooling device, which is caused running wind and running vibration, and capable of reducing the time until the cooling operation starts by self-oscillation vibration by increasing the thermal conductivity of multi-hole flat tubes.SOLUTION: A cooling device 5A for railway vehicles for cooling a heat-generating component 3 includes: a heat receiving plate 6 to which the heat-generating component is fixed; multiple fins 7 of a cantilever structure, which are attached to the opposite side of the fixed surface of the heat-generating component; and a heat dissipation member 9 joined between the fins. The fin is formed with a convex part protruding between fins from a portion where the joint position of the heat dissipation member is aligned with respect to the fin.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a cooling device for a rail vehicle. [Background technology]

[0002] Electric railway cars (hereinafter, railway cars) are equipped with various devices that require cooling. Railway cars are equipped with power conversion devices such as converters and inverters to control the electric motors that drive the cars. These power conversion devices perform power conversion by switching at high frequencies using semiconductor elements such as IGBTs (Insulated Gate Bipolar Transistors) and GTOs (Gate Turn-Off Thyristors).

[0003] In semiconductor elements, heat is generated when electricity is applied and when switching occurs. If the semiconductor elements become too hot due to this heat, the conversion efficiency decreases and, in some cases, the elements may be destroyed. For this reason, it is necessary to cool the semiconductor elements so that they remain within a specified temperature range. However, since power conversion devices and the like are mainly mounted under the floor of a vehicle where mounting space is limited, it is necessary to efficiently cool multiple semiconductor elements using a compact device configuration.

[0004] For example, Patent Document 1 discloses an example of a conventional power conversion device for a railway vehicle. Patent Document 1 discloses a structure in which a heat receiving member is installed vertically under the vehicle body, a power semiconductor element is attached to one side of the heat receiving member, a heat pipe is attached to the opposite side of the heat receiving member, and wind generated by the vehicle's movement is directed at fins provided on the heat pipe. With this structure, heat from the power semiconductor element is dissipated into the air. Also, for example, Patent Document 2 discloses a cooling structure in which a self-excited oscillating heat pipe (PHP: Pulsating Heat Pipe) is applied to a power conversion device for a railway vehicle in order to effectively cool a heat generating body in a small space. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2011-50166 A [Patent Document 2] JP 2018-88744 A Summary of the Invention [Problem to be solved by the invention]

[0006] When a railroad vehicle is traveling, the cooler is exposed to the wind generated by the traveling wind. Therefore, the wind generates a fluctuating wind pressure on the surface of the cooler, which causes structural vibration of the cooler. In addition, the vibration of the car body during traveling is also a cause of structural vibration of the cooler. For example, in the cooler of Patent Document 2, multiple fins of a cantilever structure fixed to a heat receiving plate are connected to each other by fins of a separate member, so a fundamental vibration mode occurs in which the end portion, which is the other side of the longitudinal direction, vibrates around the fixed base end portion, which is one side of the longitudinal direction. As a result, repeated stress is generated in the multiple fins constituting the cooler and the fins of the separate member, and in some cases, there is a concern that this may lead to fatigue failure.

[0007] In addition, in Patent Document 2, a multi-hole flat tube is selected as the multiple fins of the cantilever structure, and a self-excited vibration heat pipe cooler is adopted. In this cooler, the cooling operation by self-excited vibration does not start unless the entire multi-hole flat tube reaches a certain temperature or higher due to heat from the semiconductor element. As a result, the temperature of the semiconductor element increases before the cooling operation by self-excited vibration starts, and there is a risk that the conversion efficiency of the power conversion device will decrease. In addition, if the thermal conductivity of the multi-hole flat tube is low, the height of the cooler itself is also limited.

[0008] Therefore, it was desired to ensure the long-term reliability of the cooler by increasing the rigidity of the cooler and suppressing the stress generated by the vibration of the running wind.Furthermore, it was desired to increase the thermal conductivity of the multi-hole flat tube so that the entire multi-hole flat tube would reach a certain temperature or higher when the power conversion device started operating, and the cooling operation by self-excited vibration would start instantly.

[0009] The present invention has been made in consideration of these problems, and its purpose is to increase the rigidity of the cooler to suppress structural vibration of the cooling device caused by wind and vibration while driving, and to increase the thermal conductivity of the multi-hole flat tube to shorten the time until cooling action due to self-excited vibration begins, thereby ensuring the long-term reliability of the cooler. [Means for solving the problem]

[0010] In order to achieve the above-mentioned object, the present invention provides a cooling device for railway vehicles that cools a heat-generating component, comprising a heat receiving plate to which the heat-generating component is fixed, a plurality of fins having a cantilever structure attached to the side opposite the fixed side of the heat-generating component, and a heat dissipation member joined between the fins, and the fins are provided with a convex portion that protrudes between the fins from a point that aligns the joining position of the heat dissipation member to the fins. Effect of the Invention

[0011] According to the present invention, the rigidity of the cooler is increased to suppress structural vibration of the cooling device caused by wind and vibration during driving, and the thermal conductivity of the multi-hole flat tube is increased to shorten the time until cooling operation due to self-excited vibration begins, thereby ensuring the long-term reliability of the cooler. [Brief description of the drawings]

[0012] [Figure 1] 1 is a cross-sectional view of a power conversion device mounted on a railway vehicle. [Diagram 2] FIG. 2 is a front view of the cooling device according to the first embodiment. [Diagram 3] FIG. 2 is a plan view of the cooling device in the first embodiment. [Figure 4] FIG. 1 is a cross-sectional view of a multi-hole flat tube in a conventional structure. [Diagram 5] 2 is a diagram showing a cross-sectional structure of a multi-hole flat tube in Example 1. FIG. [Figure 6] 2 is a diagram showing a cross-sectional structure of a multi-hole flat tube in Example 1. FIG. [Figure 7] FIG. 2 is a diagram showing a fundamental vibration mode in the first embodiment. [Figure 8]FIG. 1 is a diagram showing a connection between a multi-hole flat tube and a corrugated fin in a conventional structure. [Figure 9] 4 is a diagram showing the connection between a multi-hole flat tube and a corrugated fin in Example 1. FIG. [Figure 10] 4 is a diagram showing the connection between a multi-hole flat tube and a corrugated fin in Example 1. FIG. [Figure 11] 4 is a diagram showing the connection between a multi-hole flat tube and a corrugated fin in Example 1. FIG. [Figure 12] FIG. 11 is a front view of a cooling device according to a second embodiment. [Figure 13] FIG. 11 is a diagram showing a cross-sectional structure of a cantilever beam structure fin in Example 2. [Figure 14] FIG. 11 is a diagram showing a cross-sectional structure of a cantilever beam structure fin in Example 2. [Figure 15] FIG. 11 is a front view of the cooling device according to the third embodiment. [Figure 16] 13 is a diagram showing a cross-sectional structure of a cantilever beam structure fin (end portion) in Example 3. FIG. [Figure 17] FIG. 1 is a front view of a cooling device in a conventional forced air cooling structure. [Figure 18] FIG. 1 is a plan view of a cooling device in a conventional forced air cooling structure. [Figure 19] FIG. 11 is a cross-sectional view of a cooling device in a fourth embodiment. [Figure 20] FIG. 11 is a plan view of a cooling device according to a fourth embodiment. [Figure 21] FIG. 11 is a front view of the cooling device according to the fourth embodiment. [Figure 22] 13 is a diagram showing a detailed structure of a wind collecting plate in the fourth embodiment. FIG. [Diagram 23] 13 is a plan view (another example of the air collecting plate) of the cooling device in the fourth embodiment. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. Note that the embodiment described below does not limit the invention according to the claims, and not all of the elements and combinations described in the embodiment are essential to the solution of the invention. Also, for configurations that are essential to the configuration of the invention but are well known, illustration and description may be omitted. Also, the number of each element shown in each figure is an example and is not limited to the illustrated number. The terms used throughout the specification are provided as examples and are not intended to be limiting.

[0014] In the following embodiments, the disclosed cooling structure is applied to a power conversion device for a railway vehicle as an example, but is not limited thereto and can be applied to various heat-generating devices and components for railway vehicles, such as current reducers.

[0015] In the case of a reference symbol with a subscript attached to a number, the subscript is used to distinguish between identical or similar components, whereas the number alone without the subscript collectively refers to identical or similar components.

[0016] (Schematic configuration of cooling device 5) Prior to describing the embodiments, the power conversion device 1 and the cooling device 5 will be described. Fig. 1 is a cross-sectional view of the power conversion device 1 mounted on a railway vehicle 2. As shown in Fig. 1, an XYZ coordinate system is defined. In the XYZ coordinate system, the height direction of the railway vehicle 2 is the positive direction of the Z axis, the width direction of the railway vehicle 2 from left to right on the paper surface of Fig. 1 is the positive direction of the Y axis, and the traveling direction of the railway vehicle 2 from the back to the front on the paper surface of Fig. 1 is the positive direction of the X axis.

[0017] The power conversion device 1 is installed under the floor of a railway vehicle 2 or the like, and controls the rotation speed of an electric motor (not shown) that drives the railway vehicle 2 by adjusting the frequency of power supplied to the electric motor. A plurality of semiconductor elements 3 constituting a power conversion circuit, and a group of electrical components 4 are installed inside the power conversion device 1. The semiconductor elements 3 generate heat when current is applied and when they are switched ON / OFF. As the conversion efficiency of the semiconductor elements 3 deteriorates when they become hot, a cooling device 5 is attached to cool the semiconductor elements 3.

[0018] The cooling device 5 cools the power conversion device 1 including the semiconductor elements 3 and the group of electric parts 4. A running wind 8 generated when the railcar 2 runs is supplied to the cooling device 5 as cooling wind in the X-axis direction (perpendicular to the paper surface of FIG. 1), which is the direction of travel of the railcar 2, and dissipates heat generated from the semiconductor elements 3. Note that since the railcar 2 moves in both forward and backward directions, a running wind is generated in the positive and negative directions of the X-axis (both directions perpendicular to the paper surface). Here, the semiconductor elements 3 are, for example, IGBTs (Insulated Gate Bipolar Transistors) and MOSFETs (Metal-Oxide-Semiconductor Field-Effect Transistors). EXAMPLES

[0019] (Configuration of Cooling Device 5A of Example 1) The cooling device 5A of the first embodiment will be described with reference to Fig. 2 to Fig. 11. Fig. 2 is a front view of the cooling device 5A (viewed from the positive direction of the X-axis), and Fig. 3 is a plan view of the cooling device 5A (viewed from the positive direction of the Y-axis).

[0020] The cooling device 5A includes a heat receiving plate 6, a multi-hole flat tube 7, a corrugated fin 9, a slit plate 10, and a block plate 11. The heat receiving plate 6, the multi-hole flat tube 7, the corrugated fin 9, the slit plate 10, and the block plate 11 are made of, for example, an aluminum alloy, copper, another metal, or an alloy made up of any combination of these metals.

[0021] In the first embodiment, the multiple fins having a cantilever structure are formed as the multi-hole flat tube 7, but this is merely one example of a fin having a cantilever structure having thermal conductivity, and is not necessarily limited to this. In addition, the corrugated fin 9 is also merely one example of a heat dissipation member, and is not necessarily limited to a corrugated fin. Therefore, instead of the corrugated fin 9, a non-corrugated type fin or another heat dissipation member different from a fin may be used.

[0022] A plurality of semiconductor elements 3 are fixed to one surface (the surface in the negative direction of the Y-axis) of the heat receiving plate 6 by a mechanical fixing method such as a screw (not shown) via a member such as grease (not shown) (FIG. 2). The multi-hole flat tube 7 is joined to the other surface (the surface in the positive direction of the Y-axis) of the heat receiving plate 6 via a slit plate 10 and a block plate 11 by an adhesive method such as brazing.

[0023] The multi-hole flat tube 7 has a plate-like structure with multiple flow paths formed in the longitudinal direction (Y-axis direction). A continuous long flow path is formed by combining a plurality of multi-hole flat tubes 7 with a block plate 11 and a slit plate 10 in which the flow paths are provided. In addition, corrugated fins 9 are joined between the multi-hole flat tubes 7 by brazing or the like so as to connect the opposing surfaces of the multi-hole flat tubes 7.

[0024] With this configuration, a long, continuous flow path is formed across the multi-hole flat tube 7, the block plate 11, and the slit plate 10, and heat receiving sections, which are in contact with the heat receiving plate 6, and heat dissipation sections, which are in contact with the corrugated fins 9, are arranged alternately.

[0025] (Convex portion of multi-hole flat tube 7 in Example 1) The cooling device 5A of the first embodiment has a structure in which a convex portion is formed on a conventional cross section of at least one of the multiple multi-hole flat tubes 7. The cross section of the multi-hole flat tube 7 will be described with reference to Fig. 4 to Fig. 6. Fig. 4 shows a conventional cross section of the multi-hole flat tube 7, Fig. 5 shows a cross section in which a convex portion is provided on only one side of the multi-hole flat tube 7 in the first embodiment, and Fig. 6 shows a cross section in which a convex portion is provided on both sides of the multi-hole flat tube 7 in the first embodiment.

[0026] As shown in FIG. 4, the cross section of the conventional multi-hole flat tube 7 has a cross section structure that extends flat in the direction of the traveling wind 8 (X-axis direction). On the other hand, as shown in FIG. 5 and FIG. 6, the cross section of the multi-hole flat tube 7 of the first embodiment has a structure in which at least one convex portion is provided in the direction perpendicular (Z-axis direction) to the longitudinal direction (X-axis direction) of the cross section and on one or both sides of the cross section. FIG. 5(a) shows a structure in which an I-shaped convex portion 7A (7A1, 7A2) is provided only on one side of the multi-hole flat tube 7, and FIG. 5(b) shows a structure in which an L-shaped convex portion 7B (7B1, 7B2) is provided on one side of the multi-hole flat tube 7. FIG. 6(a) shows a structure in which an I-shaped convex portion 7A (7A1, 7A2) is provided on both sides of the multi-hole flat tube 7, and FIG. 6(b) shows a structure in which an L-shaped convex portion 7B (7B1, 7B2) is provided on both sides of the multi-hole flat tube 7.

[0027] By using such a cross-sectional structure, the bending rigidity of the multi-hole flat tube 7 is increased, and the vibration in the Z-axis direction due to the fundamental vibration mode of the cooling device 5A shown in FIG. 7 can be suppressed. As a result, the stress generated in the multi-hole flat tube 7, the corrugated fin 9, and the brazed portion can be reduced, and the long-term reliability of the cooling device 5A can be ensured. In addition, the thermal conductivity of the multi-hole flat tube 7 is improved, and the cooling operation by self-excited vibration can be started early. When the multi-hole flat tube 7 is extrusion molded, the multi-hole flat tube 7 of Example 1 can be molded in the same process as the conventional multi-hole flat tube 7.

[0028] (Connection between multi-hole flat tube 7 and corrugated fin 9 in Example 1) The connection between the multi-hole flat tube 7 and the corrugated fin 9 will be described with reference to Figs. 8 to 11. Fig. 8 shows a connection structure between the multi-hole flat tube 7 and the corrugated fin 9 in a conventional structure, Fig. 9 shows a connection structure between the multi-hole flat tube 7 and the corrugated fin 9 in which a convex portion is provided only on one side in Example 1, Fig. 10 shows a connection structure between the multi-hole flat tube and the corrugated fin in which a convex portion is provided on both sides in Example 1, and Fig. 11 shows a connection structure between the multi-hole flat tube 7 and the corrugated fin 9 in which a convex portion is provided on one side and both sides in Example 1. In Fig. 9, the convex portions 7A and 7B are shown protruding from one side of the multi-hole flat tube 7, but they may protrude from the other side of the multi-hole flat tube 7 in the Z-axis direction. The multi-hole flat tubes 7 adjacent to each other in the Z-axis direction are joined so as to be stacked via the corrugated fin 9 in any combination of Figs. 9, 10, and 11 to form a stack of a group of multi-hole flat tubes 7 and corrugated fins 9. 11 is preferably arranged at the end in the Z-axis direction of a stack of a group of multi-hole flat tubes 7 and corrugated fins 9. In either case, the convex portion of the multi-hole flat tube 7 aligns the position of the corrugated fins 9 with respect to the multi-hole flat tube 7, improving the alignment accuracy.

[0029] (Effects of Example 1) In the first embodiment, the multi-hole flat tube 7, which is a cantilever fin, is provided with an I-shaped protrusion 7A and an L-shaped protrusion 7B protruding between adjacent multi-hole flat tubes 7 in the cooling device 5A. This suppresses vibration due to the fundamental vibration mode of the cooling device 5A, and reduces stress generated in the cooling device 5A. In addition, the second moment of area in the protruding direction of the protrusions 7A and 7B can be increased, improving the bending rigidity of the cooling device 5A. Furthermore, the cross-sectional area of ​​the multi-hole flat tube 7 is increased by the protrusions 7A and 7B, improving the thermal conductivity.

[0030] In this way, stress caused by structural vibration of the cantilever structure fins generated by wind while traveling and vehicle body vibration can be suppressed, and further, when the cantilever structure fins are multi-hole flat tubes, the time until cooling action due to self-excited vibration begins can be shortened, thereby ensuring the long-term reliability of the cooling device. EXAMPLES

[0031] (Configuration of Cooling Device 5B of Second Embodiment) A cooling device 5B of Example 2 will be described with reference to Figs. 12 to 14. The difference from Example 1 is that multi-hole flat tubes 7 and cantilever structure fins 12 are used in combination. Fig. 12 shows a front view of cooling device 5B. In Fig. 12, cooling device 5B has a structure in which cantilever structure fins 12 are used in combination in place of some of the multi-hole flat tubes 7. In this example, six multi-hole flat tubes 7 are replaced with cantilever structure fins 12, but the number of cantilever structure fins used in combination can be arbitrary. The arrangement of cantilever structure fins 12 can also be arbitrary.

[0032] (Cross-sectional structure of the cantilever beam structure fin 12 having protrusions 12A and 12B according to the second embodiment) The cross-sectional structure of the cantilever fin 12 will be described with reference to Figures 13 to 14. As shown in Figures 13 and 14, the cross section of the cantilever fin 12 has at least one convex portion provided in the direction perpendicular (Z-axis) to the longitudinal direction (X-axis) of the cross section and on one or both sides of the cross section, similar to the cross section of the multi-hole flat tube 7 of Example 1. Figure 13(a) shows a structure in which an I-shaped convex portion 12A (12A1, 12A2) is provided on only one side of the cantilever fin 12, and Figure 13(b) shows a structure in which an L-shaped convex portion 12B (12B1, 12B2) is provided on only one side of the cantilever fin 12. In addition, (a) of Figure 14 shows a structure in which I-shaped protrusions 12A (12A1, 12A2) are provided on both sides of the cantilever beam structure fin 12, and (b) of Figure 14 shows a structure in which L-shaped protrusions 12B (12B1, 12B2) are provided on both sides of the cantilever beam structure fin 12.

[0033] By using the cantilever beam structure fin 12 having such a cross-sectional structure in combination with the multi-hole flat tube 7, the bending rigidity of the cooling device 5B is increased, and vibration due to the fundamental vibration mode of the cooling device 5B can be suppressed. As a result, stress generated in the multi-hole flat tube 7, the corrugated fin 9, and the brazed parts can be reduced, and the long-term reliability of the cooling device 5B can be ensured. In addition, by replacing the multi-hole flat tube 7 with the cantilever beam structure fin 12, costs can be reduced. EXAMPLES

[0034] (Configuration of Cooling Device 5C of Third Embodiment) A cooling device 5C of Example 3 will be described with reference to Figs. 15 and 16. The difference from Examples 1 and 2 is that a cantilever structure fin (end) 13 is arranged at the end in the Z-axis direction where the multi-hole flat tube 7 and the cantilever structure fin 12 are arranged side by side. Fig. 15 shows a front view of the cooling device 5C. The cross-sectional shape of the multi-hole flat tube 7 and the cantilever structure fin 12 constituting the cooling device 5C is the same as the conventional structure shown in Fig. 4, the structure of Example 1 shown in Figs. 5 and 6, or the structure of Example 2 shown in Figs. 13 and 14, except for the cantilever structure fin (end) 13 at the end.

[0035] (Configuration of cantilever structure fin (end) 13) FIG. 16 shows a cross-sectional view of the cantilever structure fin (end) 13. FIG. 16(a) shows the structure of an I-shaped cantilever structure fin (end) 13A, and FIG. 16(b) shows the structure of an L-shaped cantilever structure fin (end) 13B. When a continuous flow path is formed by a plurality of multi-hole flat tubes 7, a block plate 11, and a slit plate 10, as in the cooling device 5A of the first embodiment shown in FIG. 2, a dead space where the multi-hole flat tubes 7 are not arranged is generated at the end of the block plate 11 where the flow path is provided. Therefore, as shown in FIG. 16, the dead space of the block plate 11 is utilized to the maximum extent, and a cantilever structure fin (end) 13A with high bending rigidity is arranged at the end of the block plate 11 in the Z-axis direction. In other words, the cantilever structure fin (end) 13A is arranged at the end of a group of a plurality of multi-hole flat tubes 7 and corrugated fins 9.

[0036] The cantilever structure fin (end) 13A shown in FIG. 16(a) has an inclined surface 13A1 that changes the direction of the cooling air from the end of the block plate 11 in the Z-axis direction to the multiple multi-hole flat tubes 7 as shown by the arrow in the figure. Also, the cantilever structure fin (end) 13B shown in FIG. 16(b) has an inclined surface 13B1 that changes the direction of the cooling air from the end of the block plate 11 in the Z-axis direction to the multiple multi-hole flat tubes 7 as shown by the arrow in the figure. Furthermore, the cantilever structure fin (end) 13B has a folded surface 13B2 that prevents the cooling air from going around the end of the block plate 11 in the Z-axis direction as shown by the arrow in the figure. This not only improves the bending rigidity of the cooling device 5C, but also provides an air collection effect toward the stacked multi-hole flat tubes 7 and the cantilever structure fin 12, thereby improving the cooling performance of the cooling device 5C. EXAMPLES

[0037] 17 to 21, a cooling device 5D according to a fourth embodiment will be described. In the first to third embodiments, it is assumed that the semiconductor element 3 is cooled by utilizing the wind 8 generated by the movement of the railroad vehicle 2. On the other hand, in the fourth embodiment, it is assumed that the semiconductor element 3 is cooled by forced air cooling using a cooling fan.

[0038] (Cooling device 5D of Example 4) A cooling device 5D that uses forced air cooling will be described with reference to Fig. 17 and Fig. 18. Fig. 17 is a front view of the cooling device 5D, and Fig. 18 is a plan view of the cooling device 5D. In Fig. 18, the surface of the duct 14 parallel to the XZ plane is not shown.

[0039] As shown in Figs. 17 and 18, in forced air cooling, a duct 14 is disposed so as to surround the cooling device 5D in order to prevent the diffusion of air caused by a cooling fan (not shown). The duct 14, together with the heat receiving plate 6, secures the multiple multi-hole flat tubes 7 and the corrugated fins 9 so as to surround them, forming an air passage such that the forced air passes through the corrugated fins 9 between the multiple multi-hole flat tubes 7. As a result, the forced air passes through the inside of the duct 14 in the X-axis direction. If there is a dead space between the cooling device 5D and the duct 14 that can be a flow path other than for the corrugated fins 9, the forced air passes mainly through the dead space.

[0040] Furthermore, since the multiple hole flat tubes 7 and the corrugated fins 9 are fixed by the heat receiving plate 6 and the duct 14, the bending rigidity of the cooling device 5D is improved.

[0041] A cooling device 5D that takes into consideration prevention of forced air passing through dead spaces will be described with reference to Figs. 19 to 21. Fig. 19 is a cross-sectional view in the X-axis direction as viewed from the front of cooling device 5D, Fig. 20 is a plan view of cooling device 5D, and Fig. 21 is a front view of cooling device 5D. In Fig. 20, the surface of duct 14 parallel to the XZ plane is omitted from illustration.

[0042] 19, in the cooling device 5D, cantilever structure fins (ends) 13 are arranged at both ends of the stack of multi-hole flat tubes 7 and corrugated fins 9 stacked in the Z-axis direction, as in Example 3. This not only improves the bending rigidity of the cooling device 5D, but also makes it possible to collect the forced air that has passed through the dead space toward the multi-hole flat tubes 7 and corrugated fins 9.

[0043] As shown in the plan view of Fig. 20, a space 15 is generated between the cooling device 5D and the duct 14. In addition, as shown by the dashed line in Fig. 20, a space 151 that serves as a flow path for forced air in the X-axis direction parallel to the space 15 is also generated between the block plates 11.

[0044] Therefore, as shown in Fig. 20, an air collecting plate 16 (16A1) is provided to prevent air from leaking into the space 15, and an air collecting plate 16 (16A2) is provided to prevent air from leaking into the space 151. The air collecting plate 16 of the cooling device 5D will be described with reference to the front view of Fig. 21. That is, the air collecting plate 16 is provided so as to block the flow passages other than the corrugated fins 9 between the multi-hole flat tubes 7 in the ventilation passage.

[0045] 21, the wind collecting plate 16 is installed at a position overlapping with the cantilever structure fin (end portion) 13 in the X-axis direction when viewed from the front (X-axis direction) so as not to block the forced wind passing through the corrugated fins 9. Fig. 22 shows the detailed structure of the wind collecting plate 16.

[0046] As shown in FIG. 22, the wind collecting plate 16 may have a structure of pattern 1 (wind collecting plates 16A1, 16A2) that enhances the wind collecting effect, or a structure of pattern 2 (wind collecting plates 16B1, 16B2) that is specialized only in preventing wind from leaking into the space.

[0047] As shown in Fig. 20, the structure of pattern 1 of the wind collecting plate 16 is such that the wind collecting plates 16A and 16B have inclined surfaces 16A11 and 16A21, respectively. Fig. 22 shows wind collecting plates 16A1 and 16A2 at the top in the X-axis direction in Fig. 20 as the structure of pattern 1 of the wind collecting plate 16. The wind collecting plates 16A1 and 16A2 prevent the forced wind flowing in the X-axis direction from flowing into the space 15 and the space 151, and change the wind direction in the direction of the arrow shown in Fig. 20 to collect the wind toward the multi-hole flat tube 7 and the corrugated fin 9.

[0048] Moreover, as shown in Fig. 23, the structure of pattern 2 of the wind collecting plate 16 does not have an inclined surface like pattern 1. Fig. 23 shows wind collecting plates 16B1 and 16B2 at the top in the X-axis direction of Fig. 23 as the structure of pattern 2 of the wind collecting plate 16. The wind collecting plates 16B1 and 16B2 prevent forced wind from entering the space 15 and the space 151 with simple members.

[0049] Although the four embodiments have been described above, the present invention is not limited to the above-mentioned embodiments, and various modified examples are included. For example, the above-mentioned embodiments have been described in detail to easily explain the present invention, and the present invention is not necessarily limited to those having all the configurations described. In addition, it is possible to replace a part of the configuration in one embodiment with the configuration of another embodiment, and it is also possible to add the configuration of another embodiment to the configuration of one embodiment. It is also possible to add, delete, or replace a part of the configuration in each embodiment with another configuration. For example, the present invention is applicable not only to railroad cars, but also to cooling devices for moving bodies such as automobiles, aircraft, and ships. [Explanation of symbols]

[0050] 1: power conversion device, 2: railway vehicle, 3: semiconductor element, 4: group of electrical components, 5, 5A, 5B, 5C, 5D: cooling device, 6: heat receiving plate, 7: multi-hole flat tube, 7A, 7A1, 7A2, 7B, 7B1, 7B2: convex portion, 9: corrugated fin, 10: slit plate, 11: block plate, 12: cantilever beam structure fin, 12A, 12B: convex portion, 13, 13A, 13B: cantilever beam structure fin (end portion), 13A1, 13B1: inclined surface, 13B2: folded surface, 14: duct, 15, 151: space, 16, 16A1, 16A2, 16B, 16B1, 16B2: air collecting plate, 16A11, 16A21: inclined surface

Claims

1. A cooling device for a railway vehicle that cools a heat-generating component, A heat receiving plate to which the heat generating component is fixed; a plurality of fins including a first fin having a cantilever structure attached to a surface opposite to a fixed surface of the heat generating component; a heat dissipation member joined between the fins, The fins are provided with protrusions that protrude between the fins from positions that align the joining positions of the heat dissipation members to the fins. A cooling device characterized by:

2. a duct that is fixed to the heat receiving plate so as to surround the plurality of fins and the heat dissipating member and that forms an air passage through which cooling air passes through the heat dissipating member between the plurality of fins; The cooling device according to claim 1 , further comprising:

3. a wind collecting plate that closes a flow path of the ventilation passage other than between the fins The cooling device according to claim 2, further comprising:

4. The air collecting plate has a second inclined surface that collects air by changing the direction of the cooling air that is about to flow into a flow path other than between the plurality of fins to between the plurality of fins. The cooling device according to claim 3, further comprising:

5. At least one of the plurality of fins is the first fin, and the other fins are second fins. The cooling device according to any one of claims 1 to 4.

6. The first fin is a multi-hole flat tube, The heat dissipation member is a corrugated fin. The cooling device according to any one of claims 1 to 5.

7. A third fin having a cantilever structure is provided at an end of the group of fins and the heat dissipation member. The cooling device according to any one of claims 1 to 6.

8. The third fin has a first inclined surface that changes the direction of cooling air from the end portion to between the plurality of fins and collects the air.

8. The cooling device according to claim 7.

9. The third fin has a folded surface that prevents the cooling air from flowing around the end portion.

9. The cooling device according to claim 8.

10. The protrusion is provided on one side of the fin. The cooling device according to any one of claims 1 to 9.

11. The protrusions are provided on both sides of the fin. The cooling device according to any one of claims 1 to 9.

12. The protrusion has a folded portion that extends from a protruding direction between the fins toward the heat dissipation member.

12. The cooling device according to claim 10 or 11.

13. A cooling device for cooling heat-generating components for a railway vehicle, comprising: A heat receiving plate fixed to the heat generating component; A plurality of fins having a cantilever structure fixed to a surface opposite to a fixing surface of the heat generating component; A heat dissipation member joined between the fins; a duct that is fixed to the heat receiving plate so as to surround the fins and the heat dissipation member and that forms an air passage through which cooling air passes through the heat dissipation member between the fins; a wind collecting plate that closes a flow path of the ventilation passage other than between the plurality of fins; A cooling device comprising:

14. The airflow collecting plate has an inclined surface that collects air by changing the direction of the cooling air that is about to flow into a flow path other than between the fins to between the fins.

14. The cooling device according to claim 13.

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