Processing device and method for using the processing device

Abstract

To provide a processing device capable of preventing information input errors.SOLUTION: A processing device 2 that processes a workpiece includes a chuck table 22 that holds a workpiece, a processing unit 26 that processes the workpiece held by the chuck table 22, a control unit 44, and a reading unit 42 that reads a code including information corresponding to a plurality of operation commands that specify operations on the processing device 2 and information corresponding to the order in which the operations specified by the operation commands are executed. The control unit 44 controls the processing device 2 such that the operations specified by the plurality of operation commands are executed in the order on the basis of the code read by the reading unit 42.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a processing device for processing a workpiece and a method for using the processing device. [Background technology]

[0002] In the device chip manufacturing process, a wafer is used in which devices are formed in multiple areas defined by multiple planned division lines (streets) arranged in a grid pattern. By dividing this wafer along the planned division lines, multiple device chips, each equipped with a device, are obtained. The device chips are incorporated into various electronic devices such as mobile phones and personal computers.

[0003] To divide the wafers, a cutting device that cuts the workpiece with an annular cutting blade, a laser processing device that performs laser processing on the workpiece, etc. are used. For example, Patent Document 1 discloses a cutting device that includes a cassette mounting area on which a cassette containing multiple workpieces is mounted, a chuck table that holds the workpieces, and a cutting unit to which a cutting blade is attached. The wafers contained in the cassette are transported and held by the chuck table, and the cutting blade is rotated to cut into the wafers, thereby cutting and dividing the wafers.

[0004] In recent years, with the trend of electronic devices becoming smaller and thinner, there is a demand for thinner device chips. Therefore, a process to thin the wafer is sometimes carried out before the wafer is divided. To thin the wafer, a grinding device that grinds the workpiece with a grinding wheel containing multiple grinding stones, or a polishing device that polishes the workpiece with a disc-shaped polishing pad, etc. are used. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Publication No. 7-45556 Summary of the Invention [Problem to be solved by the invention]

[0006] The various processing devices as described above are equipped with a display unit that displays various information related to processing, and an input unit for inputting information to the processing device. An operator of the processing device operates the input unit while referring to the information displayed on the display unit to input predetermined information to the processing device. For example, before processing a workpiece by the processing device, the operator inputs processing conditions (recipe) suitable for processing the workpiece to the processing device according to the operation screen displayed on the display unit.

[0007] The processing conditions include many items such as the size and material of the workpiece, the moving speed of the components of the processing device, and the position of the area to be processed within the workpiece. Therefore, when inputting the processing conditions into the processing device, the operator must operate the input unit to perform input work (entering numerical values ​​and characters, selecting items, etc.) into each of the many input fields displayed on the display unit. As a result, the operator must operate the input unit more frequently, making input errors more likely to occur.

[0008] In addition to the processing conditions, a wide variety of information is input to the processing device. For example, before the processing device starts processing the workpiece, it is necessary to input into the processing device an instruction to execute a process (system initial) for moving each component included in the processing device to a predetermined initial position, information specifying a workpiece to be processed among multiple workpieces stored in a cassette, etc. When such input operations are performed, there is a risk that incorrect information will be input to the processing device due to an input error by the operator.

[0009] The present invention has been made in consideration of the above problems, and has an object to provide a processing device capable of preventing information input errors, and a method of using the processing device. [Means for solving the problem]

[0010] According to one aspect of the present invention, there is provided a processing apparatus for processing a workpiece, the processing apparatus comprising: a chuck table for holding the workpiece; and a processing unit for processing the workpiece held by the chuck table. A cassette support table on which a cassette capable of accommodating a plurality of the workpieces is mounted; a control unit; and a reading unit that reads a code including information corresponding to a plurality of operation commands that specify operations for the processing device, and information corresponding to an order in which the operations specified by the operation commands are to be performed; The plurality of operation commands include an operation command specifying whether or not a system initialization is required, whether or not an inspection of the cutting blade attached to the processing unit is required, the number of cassettes to be processed continuously, whether or not the cassette needs to be updated, which of the plurality of workpieces contained in the cassette is to be processed first or last, or whether or not the processing of the workpieces is to be performed fully automatically, The control unit controls the processing device so that the operations specified by the plurality of operation commands are executed in the order based on the code read by the reading unit.

[0011] Preferably, the processing device further includes a display unit, and the control unit causes the display unit to display the operation commands and the sequence based on the code read by the reading unit. Also, preferably, the code is a matrix type two-dimensional code.

[0012] According to another aspect of the present invention, there is provided a method of using a processing apparatus for processing a workpiece, the processing apparatus including a chuck table for holding the workpiece, and a processing unit for processing the workpiece held by the chuck table, A cassette support table on which a cassette capable of accommodating a plurality of the workpieces is mounted; a reading unit that reads a code including information corresponding to a plurality of operation commands that specify operations for the processing device and information corresponding to an order in which the operations specified by the operation commands are to be performed; The plurality of operation commands include an operation command specifying whether or not a system initialization is required, whether or not an inspection of the cutting blade attached to the processing unit is required, the number of cassettes to be processed continuously, whether or not the cassette needs to be updated, which of the plurality of workpieces contained in the cassette is to be processed first or last, or whether or not the processing of the workpieces is to be performed fully automatically, A method of using a processing device is provided, the method including the steps of reading the code by the reading unit, and controlling the processing device based on the code read by the reading unit so that the operations specified by the multiple operation instructions are performed in the order.

[0013] Preferably, the processing device further includes a display unit, and the method of using the processing device further includes a step of displaying the operation commands and the sequence on the display unit based on the code read by the reading unit. Also, preferably, the code is a matrix type two-dimensional code. Effect of the Invention

[0014] A processing device according to one aspect of the present invention includes a reading unit that reads a code including information corresponding to a plurality of operation commands and information corresponding to the order in which the operations specified by the operation commands are to be executed. Then, by having the reading unit read the code, an operator can input the operation commands and the operation order to the processing device without operating an input unit (such as an operation panel). This prevents inputting errors in information to the processing device. [Brief description of the drawings]

[0015] [Figure 1] FIG. [Diagram 2] FIG. [Diagram 3] FIG. 4 is a perspective view showing a state in which a code is read by a reading unit. [Figure 4] FIG. [Diagram 5] 4 is a flowchart showing the operation of a control unit. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0016] Hereinafter, an embodiment according to one aspect of the present invention will be described with reference to the accompanying drawings. First, a configuration example of a processing device according to this embodiment will be described. FIG. 1 is a perspective view showing a processing device (cutting device) 2 that performs cutting processing on a workpiece. In FIG. 1, the X-axis direction (processing feed direction, left-right direction, first horizontal direction) and the Y-axis direction (indexing feed direction, front-back direction, second horizontal direction) are perpendicular to each other. Also, the Z-axis direction (vertical direction, up-down direction, height direction) is perpendicular to the X-axis direction and the Y-axis direction.

[0017] The processing device 2 includes a base 4 that supports or houses each of the components that make up the processing device 2. An opening 4a is formed in a corner on the front end side of the base 4, and inside the opening 4a, a cassette support table 6 that moves (lifts and lowers) along the Z-axis direction by a lifting mechanism (not shown) is provided. A cassette 8 capable of housing a plurality of workpieces 11 to be processed by the processing device 2 is mounted on the cassette support table 6. Note that in FIG. 1, the outline of the cassette 8 is indicated by a two-dot chain line.

[0018] For example, the workpiece 11 is a disk-shaped wafer made of a semiconductor such as silicon, and has a front surface and a back surface that are generally parallel to each other. The workpiece 11 is partitioned into a plurality of rectangular regions by a plurality of planned division lines (streets) that are arranged in a lattice shape so as to intersect with each other. Devices such as ICs (Integrated Circuits), LSIs (Large Scale Integration), LEDs (Light Emitting Diodes), and MEMS (Micro Electro Mechanical Systems) are formed in each of the regions partitioned by the planned division lines on the front side of the workpiece 11.

[0019] A circular tape (dicing tape) 13 having a diameter larger than that of the workpiece 11 is attached to the back side of the workpiece 11. The tape 13 includes a film-like base material and an adhesive (glue layer) on the base material. For example, the base material is made of a resin such as polyolefin, polyvinyl chloride, or polyethylene terephthalate, and the adhesive is made of an epoxy-, acrylic-, or rubber-based adhesive. Alternatively, an ultraviolet-curing resin that is cured by irradiation with ultraviolet light may be used as the adhesive.

[0020] The outer periphery of the tape 13 is affixed to an annular frame 15 made of metal or the like. The frame 15 has a circular opening in the center that is larger in diameter than the workpiece 11, and the workpiece 11 is placed inside the opening of the frame 15. When the center of the tape 13 is affixed to the workpiece 11 and the outer periphery of the tape 13 is affixed to the frame 15, the workpiece 11 is supported by the frame 15 via the tape 13.

[0021] The workpiece 11 is accommodated in a cassette 8 while being supported by a frame 15, and is processed by the processing device 2. For example, the processing device 2 cuts and divides the workpiece 11 along planned division lines to produce a plurality of device chips, each including a device.

[0022] However, there are no limitations on the type, material, shape, structure, size, etc. of the workpiece 11. For example, the workpiece 11 may be a wafer (substrate) made of a semiconductor other than silicon (GaAs, InP, GaN, SiC, etc.), glass, sapphire, ceramics, resin, metal, etc. In addition, there are no limitations on the type, number, shape, structure, size, arrangement, etc. of devices, and the workpiece 11 does not necessarily have to have devices formed thereon.

[0023] A transport unit (transport mechanism) 10 that transports the workpiece 11 is provided behind the opening 4a. The transport unit 10 is configured to be movable along the Y-axis direction, and transports the workpiece 11 out of the cassette 8 and into the cassette 8. A gripper 10a that grips a frame 15 supporting the workpiece 11 is provided at the end of the transport unit 10 on the opening 4a side (cassette 8 side).

[0024] Between the opening 4a and the transport unit 10, there is provided a temporary placement area 12 in which the workpiece 11 carried out from the cassette 8 or the workpiece 11 carried into the cassette 8 is temporarily placed. A pair of guide rails 14 arranged generally parallel to each other along the Y-axis direction are provided in the temporary placement area 12. The pair of guide rails 14 move toward and away from each other along the X-axis direction, and align the workpiece 11 by sandwiching a frame 15 therebetween.

[0025] A transport unit (transport mechanism) 16 that transports the workpiece 11 is provided near the temporary placement area 12. For example, the transport unit 16 includes a plurality of suction pads that suction-hold the upper surface side of a frame 15 that supports the workpiece 11.

[0026] A rectangular opening 4b is provided on the side of the opening 4a, with its longitudinal direction aligned with the X-axis direction. A moving unit (moving mechanism) 18 having a flat moving table 18a is provided inside the opening 4b. The moving unit 18 is, for example, a ball screw type moving mechanism, and moves the moving table 18a along the X-axis direction. A bellows-shaped dust-proof and drip-proof cover 20 is provided on both sides of the moving table 18a, covering a part of the moving unit 18 and expanding and contracting along the X-axis direction.

[0027] A chuck table (holding table) 22 that holds the workpiece 11 is provided on the moving table 18a. The upper surface of the chuck table 22 is a flat surface that is approximately parallel to the horizontal direction (XY plane direction) and constitutes a holding surface 22a that holds the workpiece 11. The holding surface 22a is connected to a suction source (not shown) such as an ejector via a flow path (not shown) provided inside the chuck table 22. In addition, a plurality of clamps 24 that grip and fix the frame 15 that supports the workpiece 11 are provided around the chuck table 22.

[0028] The moving unit 18 moves the chuck table 22 together with the moving table 18a along the X-axis direction. The moving unit 18 positions the chuck table 22 between a transfer area A where the workpiece 11 is transferred and a processing area B where the workpiece 11 is processed. A rotation drive source (not shown) such as a motor is connected to the chuck table 22, and this rotation drive source rotates the chuck table 22 around a rotation axis that is approximately parallel to the Z-axis direction.

[0029] The machining area B is provided with a machining unit (cutting unit) 26 that cuts the workpiece 11 held by the chuck table 22. The machining unit 26 includes a cylindrical spindle (not shown) arranged along the Y-axis direction. An annular cutting blade 28 that cuts the workpiece 11 is attached to the tip end (one end side) of the spindle. A rotation drive source (not shown) such as a motor that rotates the spindle is connected to the base end (other end side) of the spindle. The cutting blade 28 rotates around a rotation axis that is approximately parallel to the Y-axis direction by power transmitted from the rotation drive source via the spindle.

[0030] A moving unit (moving mechanism, not shown) that moves the processing unit 26 along the Y-axis direction and the Z-axis direction is connected to the processing unit 26. For example, the moving unit is a ball screw type moving mechanism that includes a Y-axis ball screw arranged along the Y-axis direction and a Z-axis ball screw arranged along the Z-axis direction. The moving unit adjusts the position of the cutting blade 28 attached to the processing unit 26 in the Y-axis direction and the Z-axis direction.

[0031] As the cutting blade 28, for example, a hub-type cutting blade (hub blade) is used. The hub blade is configured by integrating an annular base made of metal or the like with an annular cutting edge formed along the outer periphery of the base. The cutting edge of the hub blade is configured by an electroformed grinding stone in which abrasive grains made of diamond or the like are fixed by a binder such as nickel plating. However, a washer-type cutting blade (washer blade) can also be used as the cutting blade 28. The washer blade is configured by an annular cutting edge in which abrasive grains are fixed by a binder made of metal, ceramics, resin, or the like.

[0032] An imaging unit 30 is provided at a position overlapping with the movement path of the chuck table 22 (between the transport area A and the processing area B) to capture images of the workpiece 11 held by the chuck table 22. For example, the imaging unit 30 includes a visible light camera equipped with an imaging element that receives visible light and converts it into an electrical signal, and an infrared camera equipped with an imaging element that receives infrared light and converts it into an electrical signal. The image captured by the imaging unit 30 is used for aligning the workpiece 11 with the processing unit 26 (cutting blade 28), etc.

[0033] A cleaning unit (cleaning mechanism) 32 for cleaning the workpiece 11 is provided behind the chuck table 22. For example, the cleaning unit 32 includes a spinner table for holding the workpiece 11, and a nozzle for supplying a cleaning fluid toward the workpiece 11 held by the spinner table. As the cleaning fluid, a mixed fluid obtained by mixing a liquid (e.g., pure water) and a gas (e.g., air) is used.

[0034] A transport unit (transport mechanism) 34 is provided above the cleaning unit 32 to transport the workpiece 11 between the chuck table 22 and the cleaning unit 32. For example, the transport unit 34 includes a plurality of suction pads that suction-hold the upper surface side of the frame 15 supporting the workpiece 11.

[0035] A support stand 36 is provided behind the processing area B, and a display section (display unit, display device) 38 is mounted on the support stand 36. The display section 38 displays various information related to the processing device 2. For example, the display section 38 displays an operation screen for operating the processing device 2, the operating status of the processing device 2, an image of the workpiece 11 acquired by the imaging unit 30, and the like. In addition, an input section (input unit, input device) 40 for inputting various information to the processing device 2 is provided at the front end of the base 4.

[0036] For example, various displays can be used as the display unit 38. Furthermore, as the input unit 40, an operation panel equipped with a plurality of operation keys, or a mouse and keyboard can be used.

[0037] The processing device 2 may also be equipped with a touch panel that functions as a user interface. In this case, the touch panel functions as the display unit 38 and the input unit 40, and the operator can input information to the processing device 2 by touching the touch panel.

[0038] A reading section (reading unit, reading device) 42 that reads a code for causing the processing device 2 to execute a predetermined operation is provided near the input section 40. Details of the function, use, etc. of the reading section 42 will be described later.

[0039] Each of the components constituting the processing device 2 (such as the cassette support table 6, the transport unit 10, the guide rails 14, the transport unit 16, the moving unit 18, the chuck table 22, the clamps 24, the processing unit 26, the imaging unit 30, the cleaning unit 32, the transport unit 34, the display unit 38, the input unit 40, the reading unit 42, etc.) is connected to a control unit (control unit, control device) 44. The control unit 44 controls the operation of the processing device 2 by generating control signals that control the operation of each component of the processing device 2.

[0040] For example, the control unit 44 is configured by a computer and includes a calculation unit that performs calculations necessary for the operation of the processing device 2, and a storage unit that stores various information (data, programs, etc.) used in the calculations by the calculation unit. The calculation unit includes a processor such as a CPU (Central Processing Unit). The storage unit includes various memories that function as a main storage device, an auxiliary storage device, etc.

[0041] The workpiece 11 is processed by the above-mentioned processing device 2. Specifically, first, the transport unit 10 moves toward the cassette 8 and grips the end of the frame 15 housed in the cassette 8 with the gripping portion 10a. Then, the transport unit 10 moves away from the cassette 8 along the Y-axis direction. As a result, the workpiece 11 is pulled out of the cassette 8 and placed on the pair of guide rails 14.

[0042] The pair of guide rails 14 approach each other while supporting the frame 15 from below, and sandwich the frame 15. This aligns the position of the workpiece 11. The workpiece 11 is then sucked and held by the transport unit 16, and transported to the chuck table 22 positioned in the transport area A.

[0043] The workpiece 11 is placed on the holding surface 22a of the chuck table 22 via the tape 13. In addition, the frame 15 is fixed by a plurality of clamps 24. In this state, when negative pressure from a suction source is applied to the holding surface 22a, the workpiece 11 is sucked and held by the chuck table 22 via the tape 13. Then, the chuck table 22 holding the workpiece 11 is positioned in the processing area B by the moving unit 18.

[0044] Next, the workpiece 11 is cut by the cutting blade 28 attached to the processing unit 26. For example, with the lower end of the cutting blade 28 positioned below the upper surface of the workpiece 11, the chuck table 22 is moved along the X-axis direction while rotating the cutting blade 28 (processing feed). As a result, the chuck table 22 and the processing unit 26 move relatively along the X-axis direction, and the rotating cutting blade 28 cuts into the workpiece 11. As a result, the workpiece 11 is cut linearly.

[0045] As described above, the moving unit is connected to the processing unit 26. Indexing is performed by moving the processing unit 26 in the Y-axis direction with the moving unit. In addition, the cutting depth of the cutting blade 28 into the workpiece 11 is adjusted by moving the processing unit 26 in the Z-axis direction with the moving unit.

[0046] For example, the cutting blade 28 cuts the workpiece 11 along the intended division lines with a cutting depth that reaches the tape 13. As a result, the workpiece 11 is cut along the intended division lines and divided into a plurality of device chips.

[0047] When the processing of the workpiece 11 is completed, the workpiece 11 is transported from the chuck table 22 to the cleaning unit 32 by the transport unit 34, and is cleaned by the cleaning unit 32. Then, after cleaning, the workpiece 11 is transported onto the pair of guide rails 14 by the transport unit 16, and is then held by the gripping portion 10a of the transport unit 10 and stored in the cassette 8.

[0048] When the workpiece 11 is processed by the processing device 2, various pieces of information related to the processing are input by an operator to the processing device 2. For example, the operator can input information such as the processing conditions (recipe) for the workpiece 11 and information related to preparatory work to be performed before starting processing of the workpiece 11 by operating the input unit 40. The information input to the input unit 40 is then output to the control unit 44, and the control unit 44 controls the operation of the processing device 2 based on the information input from the input unit 40.

[0049] The information input to the processing device 2 includes many items. For example, the processing conditions input to the processing device 2 include the size and material of the workpiece 11, the processing feed rate, the cutting depth and rotation speed of the cutting blade 28, the number and interval of the planned dividing lines, etc. Furthermore, the information on the preparation work includes an instruction to execute a process (system initial) for moving each component included in the processing device 2 to an initial position, an instruction to execute an inspection of the cutting blade 28, etc.

[0050] When the input unit 40 is used to input a large amount of information as described above, the operator must repeat the input work (inputting numerical values ​​and characters, selecting items, etc.) many times. This makes it easier for input errors to occur, and there is a risk that incorrect information will be input to the processing device 2.

[0051] Therefore, in this embodiment, the information to be input to the processing device 2 is coded (encoded) in advance, and the information is input to the processing device 2 by having the reading unit 42 of the processing device 2 read the code. This makes it possible to easily and quickly input information to the processing device 2. It also eliminates the need for the operator to manually input information by operating the input unit 40, thereby reducing the occurrence of input errors. Specific examples of codes read by the reading unit 42 are described below.

[0052] 2 is a front view showing an operation instruction manual 50. When processing the workpiece 11 with the processing device 2, the operation instruction manual 50 is given to an operator. The operation instruction manual 50 lists a series of operation procedures required to process the workpiece 11 under predetermined conditions using the processing device 2. The operator operates the processing device 2 according to the procedures described in the operation instruction manual 50.

[0053] The operation instruction manual 50 is created individually according to the type of workpiece 11, the processing conditions, etc. For example, a cassette 8 contains a plurality of workpieces 11 of the same type and processing conditions. An experienced manager selects an operating procedure for the processing device 2 so that the workpieces 11 contained in the cassette 8 are processed by the processing device 2 as intended. The selected series of operations is then printed on paper in the form of bullet points, and the operation instruction manual 50 corresponding to the cassette 8 is created.

[0054] The operation instruction manual 50 describes a plurality of pieces of operation information 52 that indicate how to operate the processing device 2. Each of the plurality of pieces of operation information 52 includes an operation command 54 that specifies an operation for the processing device 2, and an operation sequence 56 that indicates the sequence in which the operation specified by the operation command 54 is to be performed. That is, the operation instruction manual 50 notifies the operator that the plurality of operation commands 54 should be performed in accordance with the operation sequence 56. Note that FIG. 2 shows an example in which nine pieces of operation information 52 (operation information 52A to 52I) are itemized in the operation instruction manual 50.

[0055] The operation information 52A is information related to the placement of the cassette 8, and includes an operation command 54A and an operation sequence 56A. The operation command 54A is information instructing the placement of the cassette 8, which contains a plurality of workpieces 11 to be processed, on the cassette support table 6. Next to the operation command 54A, an operation sequence 56A is written, which indicates the sequence in which the operation instructed by the operation command 54A (placement of the cassette 8) is to be performed. For example, the number "0" is added next to the operation command 54A, indicating that the placement of the cassette 8 is the operation to be performed first. The placement of the cassette 8 is performed manually, for example, by an operator.

[0056] The operation information 52B is information on a preparatory operation (system initial) for moving each component included in the processing device 2 to a predetermined initial position before starting processing of the workpiece 11, and includes an operation command 54B and an operation sequence 56B. The operation command 54B is information instructing input of whether or not a system initial is required. For example, if it is necessary to perform a system initial before processing the workpiece 11, a message to the effect that an instruction to execute the system initial should be input to the processing device 2 is written as the operation command 54B.

[0057] The operation information 52C is information related to the preparation work of the cutting blade 28 attached to the processing unit 26, and includes an operation command 54C and an operation sequence 56C. The operation command 54C is information instructing input of whether or not the cutting blade 28 needs to be inspected. For example, if the cutting blade 28 needs to be inspected before processing the workpiece 11, a message to the effect that an instruction to perform the inspection of the cutting blade 28 should be input to the processing device 2 is written as the operation command 54C. Note that, in the inspection of the cutting blade 28, for example, the position of the tip (outer peripheral edge) of the cutting blade 28 is measured by an optical sensor or the like, and the position of the cutting blade 28 is corrected based on the measurement result.

[0058] The operation information 52D is information related to the processing conditions (recipe) of the workpiece 11, and includes an operation command 54D and an operation sequence 56D. The operation command 54D is information instructing input of processing conditions suitable for the workpiece 11 contained in the cassette 8. For example, a message to the processing device 2 to input a character string "111 8-INCH-SAMPLE CUT" that designates processing conditions selected so that a predetermined cutting process is performed on the workpiece 11 is described as the operation command 54D.

[0059] The operation information 52E is information regarding the number of cassettes 8 containing the workpieces 11 to be processed by the processing device 2, and includes an operation command 54E and an operation sequence 56E. The operation command 54E is information instructing input of the number of cassettes 8 to be continuously processed by the processing device 2. In other words, the operation command 54E instructs how many cassettes 8 of workpieces 11 are to be continuously processed. For example, a message indicating that "1" should be selected as the number of cassettes 8 to be processed by the processing device 2 is entered as the operation command 54E.

[0060] The operation information 52F is information related to cassette updating, and includes an operation command 54F and an operation sequence 56F. The operation command 54F is information instructing input of whether or not to treat the cassette 8 placed on the cassette support stand 6 as a new cassette (whether or not the cassette 8 needs to be updated). For example, when a cassette update is necessary, a message to the effect that an instruction to execute the cassette update should be input to the processing device 2 is written as the operation command 54F. When the cassette update is executed, all workpieces 11 contained in the cassette 8 are treated as targets for processing.

[0061] The operation information 52G is information regarding the designation of the workpiece 11 to be processed first among the multiple workpieces 11 stored in the cassette 8, and includes an operation command 54G and an operation sequence 56G. Specifically, each cassette 8 has multiple storage shelves in which the workpieces 11 are stored, and the operation command 54G is information instructing input of the storage shelf number in which the workpiece 11 to be processed first is stored. For example, if the workpiece 11 to be processed first is the workpiece 11 stored in the first storage shelf, a message to select the number "1" is written as the operation command 54G.

[0062] The operation information 52H is information regarding the designation of the workpiece 11 to be processed last among the multiple workpieces 11 accommodated in the cassette 8, and includes an operation command 54H and an operation sequence 56H. Specifically, the operation command 54H is information instructing input of the number of the storage shelf in which the workpiece 11 to be processed last is accommodated. For example, if the workpiece 11 to be processed last is the workpiece 11 accommodated in the 13th storage shelf, a message to select the number "13" is entered as the operation command 54H.

[0063] The operation information 52I is information about an operation mode of the processing device 2 when processing the workpiece 11, and includes an operation command 54I and an operation sequence 56I. The operation command 54I is information instructing an input as to whether or not the processing of the workpiece 11 is to be performed fully automatically by the processing device 2. For example, when the processing device 2 is operated fully automatically to process the workpiece 11, a message to the effect that a full-automatic execution command should be input to the processing device 2 is described as the operation command 54I.

[0064] Moreover, the operation sequences 56B to 56I included in the operation information 52B to 52I are specified so that the operation commands 54B to 54I are executed in that order. Specifically, the numbers "1" to "8" corresponding to the order in which the operations are executed are written as the operation sequences 56B to 56I.

[0065] An operator in charge of processing the workpiece 11 by the processing device 2 prepares the cassette 8 containing the workpiece 11, and obtains and checks the operating instructions 50 corresponding to the cassette 8. This allows the operator to understand the content and order of the information to be input to the processing device 2.

[0066] Moreover, the operation instruction sheet 50 is provided with a code 58 corresponding to the operation information 52 (operation information 52B-52I) indicating the operation to be performed after placing the cassette 8 on the cassette support table 6. For example, the code 58 is a one-dimensional code (barcode) or a two-dimensional code, and includes information corresponding to the operation information 52B-52I. In particular, it is preferable that the code 58 is a matrix type two-dimensional code. In this case, it becomes possible to read a large amount of operation information at high speed, and space can be saved.

[0067] 3 is a perspective view showing how code 58 is read by reading unit 42. First, the operator prepares cassette 8 (see FIG. 1) to be placed on cassette support base 6 and operation instruction manual 50 corresponding to cassette 8. Then, the operator checks the contents of operation instruction manual 50 and causes reading unit 42 to read code 58. Information read by reading unit 42 (read information) is input to control unit 44 (see FIG. 1).

[0068] There are no limitations on the type and configuration of the reading unit 42, and they are appropriately selected depending on the type of code 58. For example, if the code 58 is a one-dimensional code (barcode), a one-dimensional code reader (barcode reader) is used as the reading unit 42. Also, if the code 58 is a two-dimensional code, a two-dimensional code reader is used as the reading unit 42. Note that while FIG. 3 shows the reading unit 42 that can be held by the operator, a stationary reading unit 42 may also be used.

[0069] Operation information 52 corresponding to the read information is stored in advance in a storage unit (memory) of the control unit 44 (see FIG. 1). Then, when the read information is input from the reading unit 42 to the control unit 44, the control unit 44 accesses the storage unit and reads out an operation command 54 and an operation sequence 56 corresponding to the input read information. Then, the control unit 44 outputs a control signal to the display unit 38 and causes the display unit 38 to display the operation command 54 and the operation sequence 56 in characters or the like.

[0070] 4 is a front view showing the display unit 38. The display unit 38 has a display area 38a capable of displaying various information, and displays predetermined information in the display area 38a according to a control signal input from the control unit 44. When the code 58 attached to the operation instruction manual 50 is read by the reading unit 42 (see FIG. 3), a control signal including operation information 52 is input from the control unit 44 to the display unit 38, and a part or all of the operation information 52 described in the operation instruction manual 50 is displayed in the display area 38a. Then, the operator can visually check the operation information 52 displayed on the display unit 38 to confirm whether the operation information 52 has been correctly input to the processing device 2.

[0071] Moreover, in the display area 38a of the display unit 38, selection keys 60 for performing operations according to the operation information 52 are displayed. After the operator confirms that the operation information 52 displayed in the display area 38a is correct, the operator selects the selection key 60. Note that the selection of the selection key 60 can be performed by operating the input unit 40 (see FIG. 1) while visually checking the display unit 38. Furthermore, in the case where a touch panel in which the display unit 38 and the input unit 40 are integrated is used, the selection key 60 can be selected by tapping the area in which the selection key 60 is displayed.

[0072] When the selection key 60 is selected, the control unit 44 controls the processing device 2 so that the operations specified by the operation command 54 are executed according to the operation sequence 56. As a result, a series of operations of the processing device 2 that should originally be executed by the operator are executed spontaneously by the processing device 2.

[0073] Next, a specific example of the operation of the control unit 44 will be described. Fig. 5 is a flowchart showing the operation of the control unit 44. An example of a series of operations of the control unit 44 will be described below mainly with reference to Figs. 1, 2 and 5.

[0074] First, the control unit 44 outputs a control signal to the reading unit 42 to start the reading unit 42 (step S1). This enables the reading unit 42 to read the code 58. The reading unit 42 is then maintained in a standby state until the code 58 is read by the reading unit 42 (NO in step S2).

[0075] When the operator causes the reading unit 42 to read the code 58 attached to the operation instruction sheet 50 (YES in step S2), the read information is input from the reading unit 42 to the control unit 44. Then, the control unit 44 accesses the storage unit (memory) and reads out the operation information 52B to 52I corresponding to the read information (step S3).

[0076] Next, the control unit 44 outputs a control signal to the display unit 38 to display the operation information 52 in the display area 38a of the display unit 38 (step S4). As a result, for example, as shown in Fig. 4, the operation information 52B to 52I are listed in the display area 38a. The control unit 44 also displays a selection key 60 in the display area 38a of the display unit 38. Then, the display on the display unit 38 is maintained until the selection key 60 is selected by the operator (NO in step S5).

[0077] When the operator selects the selection key 60 (YES in step S5), the control unit 44 first checks whether or not the cassette 8 is properly placed on the cassette support base 6. For example, the cassette support base 6 is equipped with a sensor (such as an optical sensor) that detects the cassette 8. When the cassette 8 is properly placed on the cassette support base 6, the sensor detects the cassette 8. On the other hand, when the cassette 8 is not placed on the cassette support base 6, when the position of the cassette 8 placed on the cassette support base 6 is misaligned, when the size of the cassette 8 placed on the cassette support base 6 is incorrect, etc., the sensor will not detect the cassette 8.

[0078] The control unit 44 judges whether or not the cassette 8 is properly positioned based on a signal input from a sensor provided on the cassette support base 6. Then, when it is judged that the cassette 8 is not properly positioned (NO in step S6), for example, the control unit 44 causes the display unit 38 to display a warning message notifying the operator that the cassette 8 is not properly positioned, and prompts the operator to properly position the cassette 8.

[0079] When it is determined that the cassette 8 is appropriately arranged (YES in step S6), the control unit 44 controls the processing device 2 so that the operations specified by the operation commands 54B to 54I are executed in accordance with the operation sequences 56B to 56I (step S7).

[0080] Specifically, the control unit 44 first executes system initialization and inspection of the cutting blade 28 in that order by outputting control signals to each component of the processing device 2. As a result, the operations specified by the operation commands 54B and 54C are executed according to the operation sequences 56B and 56C.

[0081] Next, the control unit 44 accesses the storage unit (memory) and sequentially registers the information identified by reading the code 58 (the processing conditions of the workpieces 11, the number of cassettes 8, whether or not the cassettes 8 need to be updated, the starting cassette level, the number of cassette levels accommodated, and whether or not full automation is required) in the storage unit. As a result, the operations specified by the operation commands 54D-54I are executed according to the operation sequences 56D-56I. Thereafter, the control unit 44 outputs control signals to each component of the processing device 2, thereby fully automatically processing the workpieces 11 accommodated in the cassettes 8 one by one.

[0082] The above-mentioned operation of the control unit 44 is realized by executing a program. Specifically, a program that causes the control unit 44 to execute each process (steps S1 to S7) in order to operate the processing device 2 based on the read information read by the reading unit 42 is stored in the storage unit of the control unit 44. Then, when the processing device 2 starts operating, the control unit 44 executes the program to perform the operation of the processing device 2 corresponding to the code 58.

[0083] As described above, the processing device 2 according to this embodiment includes the reading unit 42 that reads the code 58 including information corresponding to a plurality of operation commands 54 and information corresponding to the operation sequence 56 indicating the sequence in which operations specified by the operation commands 54 are to be performed. Then, by having the reading unit 42 read the code 58, the operator can input the operation commands 54 and the operation sequence 56 to the processing device 2 without operating the input unit 40. This prevents errors in inputting information to the processing device 2.

[0084] An expiration date may be set for the code 58 attached to the operation instruction manual 50. For example, when the processing conditions for the workpiece 11 and the operating method of the processing device 2 are updated periodically, the code 58 may include information on the expiration date. When the code 58 is read by the reading unit 42 after the expiration date has passed, the processing device 2 notifies the operator that the code 58 has expired, for example, by displaying an error on the display unit 38.

[0085] In the present embodiment, the processing device (cutting device) 2 that cuts the workpiece 11 with the processing unit (cutting unit) 26 has been described, but the type of processing device according to the present embodiment is not limited. For example, a grinding device equipped with a processing unit (grinding unit) that grinds the workpiece 11, or a polishing device equipped with a processing unit (polishing unit) that polishes the workpiece 11 may also be used.

[0086] The grinding unit of the grinding device has a spindle, and an annular grinding wheel including a plurality of grinding stones is attached to the tip of the spindle. The grinding unit grinds the workpiece 11 by bringing the grinding stone into contact with the workpiece 11 while rotating the grinding wheel. The polishing unit of the polishing device has a spindle, and a disk-shaped polishing pad is attached to the tip of the spindle. The polishing unit polishes the workpiece 11 by bringing the polishing pad into contact with the workpiece 11 while rotating the polishing pad.

[0087] The processing device according to this embodiment may be a laser processing device including a processing unit (laser irradiation unit) that processes the workpiece 11 by irradiating a laser beam. The laser irradiation unit includes a laser oscillator that oscillates a laser beam of a predetermined wavelength, and a condenser that condenses the laser oscillated from the laser oscillator. The workpiece 11 is processed by irradiating the workpiece 11 with a laser beam from the laser irradiation unit.

[0088] In addition, the structures, methods, etc. according to the above-described embodiments can be modified as appropriate without departing from the scope of the object of the present invention. [Explanation of symbols]

[0089] 11 Workpiece 13 Tape (dicing tape) 15 Frames 2 Processing equipment (cutting equipment) 4 Foundation 4a,4b opening 6 Cassette support stand 8 Cassettes 10 Transport unit (transport mechanism) 10a Grip part 12 Temporary Storage Area 14 Guide rail 16 Transport unit (transport mechanism) 18 Mobile unit (mobile mechanism) 18a Mobile table 20 Dust-proof / water-proof cover 22 Chuck table (holding table) 22a Holding surface 24 Clamp 26 Processing unit (cutting unit) 28 Cutting blade 30 Imaging unit 32 Cleaning unit (cleaning mechanism) 34 Transport unit (transport mechanism) 36 Support stand 38 Display section (display unit, display device) 38a Display area 40 Input section (input unit, input device) 42 Reading section (reading unit, reading device) 44 Control section (control unit, control device) 50 Operating Instructions 52 Operation information 54,54A~54I Operation command 56,56A~56I Operation order 58 Code 60 Selection Key

Claims

1. A processing device for processing a workpiece, comprising: A chuck table for holding the workpiece; a processing unit that processes the workpiece held by the chuck table; A cassette support table on which a cassette capable of accommodating a plurality of the workpieces is mounted; A control unit; a reading unit that reads a code including information corresponding to a plurality of operation commands that specify operations for the processing device and information corresponding to an order in which the operations specified by the operation commands are to be performed; The plurality of operation commands include an operation command specifying whether or not a system initialization is required, whether or not an inspection of the cutting blade attached to the processing unit is required, the number of cassettes to be processed continuously, whether or not the cassette needs to be updated, which of the plurality of workpieces contained in the cassette is to be processed first or last, or whether or not the processing of the workpieces is to be performed fully automatically, The control unit controls the processing device so that the operations specified by the plurality of operation commands are executed in the order based on the code read by the reading unit.

2. Further comprising a display unit, 2. The processing device according to claim 1, wherein the control unit causes the display unit to display the plurality of operation commands and the sequence based on the code read by the reading unit.

3. 3. The processing device according to claim 1, wherein the code is a matrix type two-dimensional code.

4. A method of using a processing device for processing a workpiece, comprising the steps of: The processing device is A chuck table for holding the workpiece; a processing unit that processes the workpiece held by the chuck table; A cassette support table on which a cassette capable of accommodating a plurality of the workpieces is mounted; a reading unit that reads a code including information corresponding to a plurality of operation commands that specify operations for the processing device and information corresponding to an order in which the operations specified by the operation commands are to be performed; The plurality of operation commands include an operation command specifying whether or not a system initialization is required, whether or not an inspection of the cutting blade attached to the processing unit is required, the number of cassettes to be processed continuously, whether or not the cassette needs to be updated, which of the plurality of workpieces contained in the cassette is to be processed first or last, or whether or not the processing of the workpieces is to be performed fully automatically, reading the code by the reader; and controlling the processing device so that the operations specified by the plurality of operation instructions are performed in the order based on the code read by the reading unit.

5. The processing device further includes a display unit, 5. The method for using a processing device according to claim 4, further comprising the step of displaying the plurality of operation commands and the sequence on the display unit based on the code read by the reading unit.

6. 6. The method for using a processing device according to claim 4 or 5, wherein the code is a matrix type two-dimensional code.

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