Measuring device

Abstract

To measure an adhesion strength of a sheet adhered to a ring frame.SOLUTION: A measuring instrument for measuring an adhesion strength of a sheet adhered to a ring frame having an opening part at a center, comprises: a support table that has an annular supporting surface that can support the ring frame; an indenter that presses the sheet adhered to the ring frame mounted on the support table from an upper direction in an inner side of the opening part; a lifting unit that makes the indenter lift and drop to / from the support table; a load measurement part that measures a weight applied to the indenter; and a control unit that controls the lifting unit and the load measurement part. The control unit includes: a measurement control part that controls the lifting unit while measuring the weight applied to the indenter by the load measurement part to press the sheet to the indenter by dropping the indenter to the sheet; and a storage part that stores a measurement result of the load measurement part.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a measuring device for measuring the adhesion strength of a sheet attached to a ring frame to the ring frame. [Background technology]

[0002] In the manufacturing process of device chips to be incorporated into electronic devices, plate-shaped workpieces, such as semiconductor wafers and resin package substrates, are cut by a cutting device equipped with an annular cutting blade or irradiated with a laser beam to be divided into individual pieces. A member called dicing tape is attached in advance to the back side of the workpiece to be processed by the cutting device or laser processing device.

[0003] A dicing tape is a sheet having a base layer made of resin or the like and an adhesive layer provided on one side of the base layer. When the workpiece is divided and the sheet is expanded outward from all four sides, the distance between each chip increases, making it easier to pick up the chips. Here, in a workpiece in which the chips are formed in different vertical and horizontal sizes, it is necessary to change the amount of expansion of the sheet depending on the expansion direction in order to open the gap between the formed chips to the same extent in the vertical and horizontal directions.

[0004] Therefore, an expansion device has been proposed that can hold the four sides of a sheet and expand the sheet by different amounts of expansion in the vertical and horizontal directions (see Patent Document 1). A ring frame made of metal with an opening in the center is prepared in advance, and in a state in which the sheet is expanded by this expansion device, the ring frame is attached to the sheet while each chip is placed in the opening, and the sheet is cut along the outer periphery of the ring frame to form a frame unit. In this frame unit, the gap between each chip is maintained, making it easy for a pickup device to pick up the chips. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Patent No. 5980600 Summary of the Invention [Problem to be solved by the invention]

[0006] However, when the sheet is expanded, the adhesive layer becomes thinner together with the base layer, and the adhesive strength of the sheet decreases. Therefore, when the adhesive strength of the sheet to the ring frame gradually decreases over time, the sheet eventually peels off from the ring frame. Therefore, it is necessary to select a sheet that can maintain a predetermined adhesive strength when attached to the ring frame, and it is necessary to select the expansion conditions and attachment conditions of the sheet that can maintain the predetermined adhesive strength.

[0007] In order to evaluate the adhesion strength of the sheet to the ring frame based on the type of sheet, expansion conditions, etc., a measuring device that can measure this adhesion strength is desired. In particular, when the expansion amount of the sheet changes depending on the direction, it is considered that the adhesion strength to the ring frame varies depending on the location due to the thickness of the adhesive layer changing depending on the location. Therefore, there is a demand to evaluate the adhesion strength of the sheet attached to the ring frame at various points.

[0008] The present invention has been made in consideration of the above problems, and an object of the present invention is to provide a measuring device capable of measuring the adhesion strength of a sheet attached to a ring frame. [Means for solving the problem]

[0009] According to one aspect of the present invention, there is provided a measuring instrument for measuring the adhesive strength of a sheet attached to a ring frame having an opening in the center, the measuring instrument comprising: a support table with an annular support surface capable of supporting the ring frame; an indenter that presses the sheet attached to the ring frame placed on the support table from above inside the opening; a lifting unit that raises and lowers the indenter relative to the support table; a load measuring unit that measures the load applied to the indenter; and a control unit that controls the lifting unit and the load measuring unit, the control unit having a measurement control unit that measures the load applied to the indenter using the load measuring unit while controlling the lifting unit to lower the indenter towards the sheet and cause the indenter to press the sheet against the sheet; and a memory unit that stores the measurement results of the load measuring unit.

[0010] Preferably, the measurement control unit detects that peeling of the sheet from the ring frame has occurred when a decrease in the load applied to the indenter is observed while the indenter is pressing the sheet, and the memory unit stores as the measurement result the maximum load value, which is the measured value of the load applied to the indenter just before a decrease in the load applied to the indenter is observed.

[0011] Alternatively, preferably, the measurement control unit determines that the adhesive strength of the sheet to the ring frame is insufficient if a decrease in the load applied to the indenter is observed before the measured value of the load applied to the indenter measured by the load measuring unit reaches a predetermined value, and determines that the adhesive strength of the sheet to the ring frame is sufficient if no decrease in the load applied to the indenter is observed before the measured value of the load applied to the indenter measured by the load measuring unit reaches a predetermined value, and the memory unit stores the judgment result of the measurement control unit as the measurement result.

[0012] Preferably, the apparatus further comprises a rotation unit for rotating the support table about a rotation axis that passes through the center of the support table and extends in a direction perpendicular to the support surface.

[0013] Further, preferably, when a substrate is attached to the sheet inside the opening of the ring frame supported by the support table, the indenter is capable of pressing the sheet from above via the substrate. Effect of the Invention

[0014] A measuring device according to one aspect of the present invention includes a support table having an annular support surface capable of supporting a ring frame to which a sheet is attached, an indenter that presses the sheet from above, a lifting unit that raises and lowers the indenter, and a load measuring unit that measures the load applied to the indenter. The load is measured while the indenter presses the sheet from above, and the measurement results are stored in a memory unit of a control unit. The measurement results stored in the memory unit can be used to evaluate the adhesion strength of the sheet attached to the ring frame.

[0015] For example, the sheet is pressed with an indenter so that a load corresponding to the strength required for the sheet's adhesion is applied to the sheet, and the presence or absence of peeling of the sheet is judged based on the measured value of the load measuring unit at this time. Alternatively, the sheet is pressed with the indenter while the load applied to the indenter is measured by the load measuring unit, and the load is gradually increased, and peeling of the sheet is detected when a decrease in the load applied to the indenter is observed, and the measured value immediately before this decrease in load is observed is taken as the maximum load value. The magnitude relationship of this maximum load value between multiple sheets is compared to evaluate the adhesion strength.

[0016] Therefore, according to one aspect of the present invention, there is provided a measuring device capable of measuring the adhesion strength of a sheet attached to a ring frame. [Brief description of the drawings]

[0017] [Figure 1] FIG. 2 is a perspective view showing a schematic diagram of a measuring device. [Diagram 2] FIG. 13 is a perspective view showing a schematic diagram of a measuring device having a sheet attached to a ring frame; [Diagram 3] FIG. 2 is a cross-sectional view showing a schematic diagram of a measuring device for measuring the adhesion strength of a sheet to a ring frame. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0018] An embodiment of the present invention will be described with reference to the accompanying drawings. First, a measurement object of a measurement device according to this embodiment will be described. Fig. 2 includes a perspective view of a measurement object 1 arranged in a measurement device 2, and Fig. 3 includes a cross-sectional view of the measurement object 1 arranged in the measurement device 2.

[0019] The measurement object 1 of the measuring device according to this embodiment is composed of a ring frame 5 made of a material such as metal, and a sheet 3 attached to the ring frame 5. The ring frame 5 has an opening 5a in the center, and the sheet 3 is attached to the ring frame 5 so as to cover this opening 5a.

[0020] The sheet 3 includes a base layer made of a resin material such as polyolefin or polyester, and an adhesive layer provided on one side of the base layer. The sheet 3 is used, for example, by being attached to a semiconductor wafer, which is the raw material for device chips. When the semiconductor wafer is divided and the sheet 3 to which the divided semiconductor wafers are attached is expanded outward on all four sides, the distance between each of the formed chips increases, making it easy to pick up the chips.

[0021] A ring frame 5 is prepared, and in a state where the sheet 3 is expanded, the ring frame 5 is attached to the sheet 3 while each chip is accommodated in an opening 5a, and the sheet 3 is cut along the outer periphery of the ring frame 5 to form a frame unit. In this frame unit, the gap between each chip is maintained, making it easy to pick up the chips with a pick-up device.

[0022] However, when the sheet 3 is expanded, the adhesive layer becomes thinner together with the base layer, thereby reducing the adhesive strength of the sheet 3. As a result, when the adhesive strength of the sheet 3 to the ring frame 5 gradually decreases over time, the sheet 3 may eventually peel off from the ring frame 5.

[0023] Therefore, it is necessary to select a sheet 3 that can maintain a predetermined adhesion strength when attached to the ring frame 5, and it is necessary to select the expansion conditions and adhesion conditions of the sheet 3 that can maintain the predetermined adhesion strength. The measuring device according to this embodiment measures the adhesion strength in order to evaluate the adhesion strength of the sheet 3 to the ring frame 5 based on the type of sheet 3, the expansion conditions, etc.

[0024] Next, a measuring device according to the present embodiment for measuring the adhesion strength of a sheet 3 attached to a ring frame 5 having an opening 5a in the center will be described. Fig. 1 is a perspective view showing a measuring device 2 according to the present embodiment. Fig. 2 is a perspective view showing a measuring device 2 on which a measurement target 1 is disposed, and Fig. 3 is a cross-sectional view showing a measuring device 2 when measuring the adhesion strength of a sheet 3 to a ring frame 5.

[0025] The measuring device 2 has a rectangular exterior cover 4 that houses the components. A circular opening 4b is formed in the center of the upper surface 4a of the exterior cover 4, and a support table 6 having an annular support surface 6a capable of supporting a ring frame 5 is exposed upward from the opening 4b. A circular recess 8 is formed on the inner side of the support surface 6a on the upper surface of the support table 6.

[0026] It is preferable that the support table 6 is replaceable. It is preferable that the measuring device 2 is provided with a plurality of types of support tables 6 capable of respectively supporting various types of ring frames 5 that may be included in the measuring object 1. In other words, it is preferable that the measuring device 2 is provided in advance with and uses a support table 6 capable of appropriately supporting the ring frame 5 included in the measuring object 1.

[0027] The measuring device 2 uses a support table 6 in which the inner diameter of the support surface 6a roughly matches the diameter of the opening 5a of the ring frame 5 of the measurement object 1 and the outer diameter of the support surface 6a is larger than the outer diameter of the ring frame 5.

[0028] In addition, a plurality of positioning pins 6b are erected on the support surface 6a. The positioning pins 6b have their sides abutting against the outer side of the ring frame 5 of the measurement object 1 placed on the support surface 6a, and determine the position and orientation of the ring frame 5. In other words, the arrangement of the positioning pins 6b is determined so that the ring frame 5 is aligned in a position and orientation suitable for measurement.

[0029] In particular, when a notch of a specific shape is provided on the outer periphery of the ring frame 5, it is preferable to position the positioning pin 6b so as to match the position of this notch. In this case, the ring frame 5 is aligned to a predetermined position and orientation with high precision by the positioning pin 6b. As described later, when the adhesion strength of the sheet 3 to the ring frame 5 is measured at multiple points on the measurement target 1, alignment of the ring frame 5 is important for high-precision measurement.

[0030] The support table 6 is rotatable around a rotation axis passing through the center of the support table 6. Fig. 3 shows a motor 26 and a spindle 28 that function as a rotation unit that rotates the support table 6. As described later, by operating the rotation unit, the measurement position of the adhesion strength of the sheet 3 on the measurement target 1 can be changed.

[0031] The upper end of the spindle 28 is fixed to the center of the lower surface of the support table 6, and the lower end of the spindle 28 is accommodated in the motor 26. The motor 26 rotates the spindle 28 to rotate the support table 6 about a rotation axis 30 that passes through the center of the support table 6 along a direction perpendicular to the support surface 6a.

[0032] A measuring unit is disposed above the support table 6 for measuring the adhesive strength of the sheet 3 to the ring frame 5 of the measurement object 1 placed on the support surface 6a. The measuring unit includes an indenter 18 that presses the sheet 3 from above, a lifting unit 12 that raises and lowers the indenter 18, and a load measuring section (sensor) 16 that measures the load applied to the indenter 18. The configuration of the measuring unit that measures the adhesive strength of the sheet 3 will be described in detail below.

[0033] An erect portion 10 accommodating a lifting unit 12 is provided at the rear end of the upper surface 4a of the exterior cover 4. The lifting unit 12 is formed, for example, by a ball screw type drive mechanism. That is, provided inside the erect portion 10 are a guide rail (not shown) that is roughly aligned in the vertical direction, a movable body (not shown) that is movable along the guide rail, and a ball screw (not shown) that is aligned along the guide rail. The movable body is provided with a nut portion (not shown) that is screwed into the ball screw.

[0034] A pulse motor 12a for rotating the ball screw is provided at the upper end of the ball screw. When the pulse motor 12a is operated to rotate the ball screw, the moving body moves along the guide rail. An opening 12b is formed in the front of the standing portion 10, through which an arm 14 having a base end connected to the moving body passes. The opening 12b is elongated in the vertical direction so that the arm 14, which is raised and lowered by the lifting unit 12, can be raised and lowered.

[0035] A load measuring part 16 of the measurement unit is fixed to the tip of an arm part 14 that extends horizontally from the standing part 10 toward above the support table 6. A rod-shaped indenter 18 protrudes from the underside of the load measuring part 16.

[0036] The length of arm 14 is determined so that indenter 18 is positioned above circular recess 8 and not above support surface 6a of support table 6. In particular, it is preferable to determine the length of arm 14 so that indenter 18 can press sheet 3 midway between an area inside opening 5a of ring frame 5 where a substrate such as a semiconductor wafer is expected to be attached to sheet 3 and opening 5a. However, the length of arm 14 is not limited to this.

[0037] Activating the lifting unit 12 allows the load measuring section 16 and the indenter 18 to be raised and lowered. When the lifting unit 12 is activated to lower the indenter 18 toward the support table 6 on which the measurement object 1 is placed, the lower end of the indenter 18 comes into contact with the upper surface of the sheet 3. When the indenter 18 is further lowered, the sheet 3 is pressed and stretched downward, and the indenter 18 receives an upward repulsive force from the sheet 3.

[0038] If the lower end of the indenter 18 has an angular shape, there is a risk that the indenter 18 will break the sheet 3 when measuring the adhesion strength of the sheet 3. In this case, the adhesion strength of the sheet 3 to the ring frame 5 cannot be measured appropriately. Therefore, it is preferable that the shape of the lower end of the indenter 18 is a shape without corners, and it is more preferable that the shape is hemispherical. For example, the indenter 18 has a hemispherical lower end and a cylindrical main part with a diameter of 1.2 mm. However, the shape of the indenter 18 is not limited to this.

[0039] In this way, the indenter 18 presses the sheet 3 attached to the ring frame 5 placed on the support table 6 from above inside the opening 5a. The load measuring unit 16 measures the load (repulsive force) acting on the indenter 18 at this time. The load measuring unit 16 is an electronic device that is used by being connected to other devices, etc. via a wired or wireless connection, and has a function of transmitting the measured load value to the connected device.

[0040] A touch panel display 20, which functions as both a user interface and a display monitor for the meter 2, is disposed on the front surface 4c of the exterior cover 4 of the meter 2. However, the touch panel display 20 may be provided on another surface of the exterior cover 4. The touch panel display 20 displays various information and operation screens for the meter 2. A user of the meter 2 can operate the meter 2 using the touch panel display 20. It should be noted that the user interface and display monitor of the meter 2 are not limited to this.

[0041] The measuring device 2 further includes a control unit 22 that controls various components such as the lifting unit 12 and the load measuring unit 16. The control unit 22 is configured by a computer including a processing device such as a processor represented by a CPU (Central Processing Unit), a main storage device such as a DRAM (Dynamic Random Access Memory), an SRAM (Static Random Access Memory), or a ROM (Read Only Memory), and an auxiliary storage device such as a flash memory, a hard disk drive, or a solid state drive.

[0042] The auxiliary storage device stores software including a predetermined program. The functions of the control unit 22 are realized by operating the processing device according to this software. A part of the auxiliary storage device functions as a storage section 22a that stores a program that causes the control unit 22 to execute a specific operation. Then, by operating the processing device according to the software such as the program stored in the storage section 22a, the auxiliary storage device functions as a concrete means in which the software and the processing device (hardware resource) work together.

[0043] A control unit 22 is connected to the load measuring section 16. The control unit 22 includes a measurement control section 22b that controls the measurement operation of the measuring device 2 in accordance with software stored in a memory section 22a. The measurement control section 22b controls the lifting unit 12, the load measuring section 16, etc., so as to obtain measurement results that serve as an index for comparing the adhesion strength of the sheet 3 to the ring frame 5 for each system. The memory section 22a then stores the measurement results.

[0044] A first example of the measurement operation of the measuring device 2 will be described with reference to Fig. 3. The control unit 22 (measurement control section 22b) controls the lifting unit 12 to lower the indenter 18 toward the sheet 3 and cause the indenter 18 to press the sheet 3 while measuring the load applied to the indenter 18 with the load measuring section 16. When the sheet 3 is pressed by the indenter 18, the sheet 3 is stretched downward, and a force is applied to the area of ​​the sheet 3 that is attached to the ring frame 5. Since a circular recess 8 is formed in the support table 6, the sheet 3 deforms within the circular recess 8 and does not contact the floor surface.

[0045] When a force exceeding the adhesive strength of the sheet 3 is applied to this area, the sheet 3 peels off from the ring frame 5. When the sheet 3 peels off from the ring frame 5, the repulsive force that the sheet 3 exerts on the indenter 18, which is deformed when pressed by the indenter 18, decreases. As a result, the measured value of the load observed by the load measuring section 16 decreases sharply. The control unit 22 (measurement control section 22b) detects that the sheet 3 has peeled off from the ring frame 5 when a decrease in the load applied to the indenter 18 is observed while the indenter 18 is pressing the sheet 3.

[0046] The magnitude of the pressing force of the indenter 18 on the sheet 3 when the sheet 3 peels off corresponds to the adhesion strength of the sheet 3 to the ring frame 5. Therefore, the memory unit 22a stores, as the measurement result, the maximum load value, which is the measured value of the load immediately before a decrease in the load observed by the load measuring unit 16 is observed.

[0047] This maximum load value is an index representing the adhesion strength of the sheet 3. For example, the conditions for attaching the sheet 3 to the ring frame 5, the type of the sheet 3, and the conditions for expanding the sheet 3 are changed, and the sheet 3 is pressed by the indenter 18 in the measuring device 2 in the same manner, and the maximum load value is stored in the memory unit 22a. In this case, the magnitude of the adhesion strength of the sheet 3 can be determined by comparing the maximum load values ​​of each system stored in the memory unit 22a.

[0048] A second example of the measurement operation in the measuring device 2 will be described. The control unit 22 (measurement control section 22b) controls the lifting unit 12 to lower the indenter 18 toward the sheet 3 while measuring the load applied to the indenter 18 with the load measuring section 16, and causes the indenter 18 to press the sheet 3 until the measured value of the load reaches a predetermined value. This predetermined value is preferably set to a measured value equivalent to the adhesion strength required for the sheet 3.

[0049] If the sheet 3 peels off from the ring frame 5 before the measured value of the load measured by the load measuring unit 16 reaches the predetermined value, the load (repulsive force) applied by the sheet 3 to the indenter 18 decreases. At this time, the measured value of the load observed by the load measuring unit 16 drops sharply, and the control unit 22 (measurement control unit 22b) detects that peeling of the sheet 3 has occurred. The control unit 22 (measurement control unit 22b) determines that the adhesion strength of the sheet 3 to the ring frame 5 does not meet the required level and is insufficient.

[0050] On the other hand, if no sudden decrease is observed in the measured load value observed by the load measuring unit 16 until the measured load value reaches the predetermined value, the control unit 22 (measurement control unit 22b) determines that the sheet 3 has not peeled off from the ring frame 5. In other words, the control unit 22 (measurement control unit 22b) determines that the adhesion strength of the sheet 3 to the ring frame 5 meets the required level and is sufficient.

[0051] The memory section 22a then stores, as the measurement result of the load measuring section, the judgment result by the control unit 22 (measurement control section 22b) as to whether or not peeling of the sheet 3 from the ring frame 5 has occurred, i.e., whether or not the adhesive strength is sufficient.

[0052] As described above, the measuring device 2 according to this embodiment can measure the adhesion strength of the sheet 3 attached to the ring frame 5 and judge the acceptability of the type of sheet 3, the conditions for attachment to the ring frame 5, the expansion conditions of the sheet 3, etc. A user of the measuring device 2 can expand the sheet 3 to which the processed and divided semiconductor wafers are attached to increase the spacing between the chips, and select the optimal type of sheet 3, attachment conditions, and expansion conditions when attaching the sheet 3 to the ring frame 5.

[0053] Here, when the semiconductor wafer is divided to form chips of different vertical and horizontal sizes, the amount of expansion of the sheet 3 is changed depending on the expansion direction so that the spacing between the formed chips is approximately the same in the vertical and horizontal directions. When the amount of expansion of the sheet 3 changes depending on the direction, it is considered that the adhesive layer thickness of the expanded sheet 3 varies depending on the location, and the adhesion strength to the ring frame 5 varies depending on the location. For this reason, there is a demand to be able to evaluate the adhesion strength of the sheet 3 attached to the ring frame 5 at various locations.

[0054] Therefore, in the measuring device 2 according to the present embodiment, the adhesive strength of each point of the sheet 3 to the ring frame 5 is measured while switching the point of the sheet 3 pressed by the indenter 18. Next, a measurement operation for measuring the adhesive strength of the sheet 3 while switching the point of the sheet 3 pressed by the indenter 18 will be described.

[0055] When evaluating the difference in adhesion strength due to differences in the pressed positions on the sheet 3, the orientation of the measurement object 1 placed on the support table 6 of the measuring device 2 is important. Therefore, it is preferable to determine the arrangement of the positioning pins 6b so that the measurement object 1 is placed on the support table 6 in a specific orientation.

[0056] The outer periphery of the ring frame 5 is not uniformly circular, but has straight lines and notches on the outer periphery of the ring frame 5. Therefore, it is preferable to determine the arrangement of the positioning pins 6b so as to correspond to the arrangement of the straight lines and notches on the outer periphery of the ring frame 5. In this case, when the ring frame 5 is placed on the support surface 6a of the support table 6 so as to be surrounded by the positioning pins 6b as shown in Fig. 2, the ring frame 5 is automatically oriented in a specific direction.

[0057] The measuring device 2 presses the first pressing point of the sheet 3 with the indenter 18 and measures the adhesion strength of the sheet 3. Thereafter, in order to press the next pressing point with the indenter 18 and measure the adhesion strength of the sheet 3, the motor 26 is operated to rotate the spindle 28, thereby rotating the support table 6 around the rotation axis 30, and the next pressing point is positioned below the indenter 18.

[0058] Thereafter, the sheet 3 is similarly pressed by the indenter 18 to measure the adhesion strength of the sheet 3. In this manner, by operating the motor 26 to press the sheet 3 one after another with the indenter 18 while changing the pressing location, the adhesion strength at each point of the sheet 3 can be measured.

[0059] The expansion direction of the sheet 3 can be set separately for a first direction and a second direction perpendicular to the first direction. Therefore, when it is desired to evaluate the effect of the difference in the expansion amount in the first direction and the second direction on the adhesion strength of the sheet 3, it is advisable to measure the adhesion strength of the sheet 3 at least at two points on the sheet 3. More specifically, after the first pressing point of the sheet 3 is pressed with the indenter 18 to measure the adhesion strength of the sheet 3, the support table 6 is rotated by 90°, and the next pressing point is pressed with the indenter 18 to measure the adhesion strength of the sheet 3.

[0060] Here, the evaluation positions for the adhesion strength of the sheet 3 are not limited to two, and the pressing points by the indenter 18 may be set at more than two points. In this case, the adhesion strength at each point of the sheet 3 can be analyzed in more detail. However, since the adhesion strength of the sheet 3 to the ring frame 5 decreases around the point pressed by the indenter 18, it is preferable to select the pressing points on one sheet 3 so that they are spaced apart from each other by a predetermined distance.

[0061] As described above, the measuring device 2 according to this embodiment can measure the adhesion strength of the sheet 3 attached to the ring frame 5 at various points on the sheet 3, and evaluate the suitability of the expansion conditions of the sheet 3 when expanding the sheet 3 by different amounts of expansion depending on the direction.

[0062] In the above embodiment, a case has been described in which the sheet 3 is pressed with the indenter 18 to measure the adhesion strength of the sheet 3 to the ring frame 5 in the measurement object 1 consisting of the sheet 3 and the ring frame 5. However, the measuring device 2 according to one aspect of the present invention is not limited to this. In other words, the measurement object 1 may include elements other than the sheet 3 and the ring frame 5.

[0063] For example, a semiconductor wafer is divided to form a plurality of chips, the plurality of chips are attached to a sheet 3, the sheet 3 is expanded outward to increase the spacing between each chip, and a ring frame 5 is attached to the sheet 3 so that each chip is accommodated in an opening 5a. Then, the ring frame 5 is cut along its outer periphery to form a frame unit in which the chips, the sheet 3, and the ring frame 5 are integrated.

[0064] The chips are transported to a pickup device in the form of a frame unit and picked up by the pickup device. If an unexpected impact is applied to the frame unit during transportation, the chips will shake violently, inducing peeling of the sheet 3 from the ring frame 5.

[0065] Therefore, in order to measure the adhesion strength of the sheet 3 in a state close to the actual use of the sheet 3 and the ring frame 5, the measurement object 1 may include a substrate simulating a chip. In this case, the measurement device 2 may press the substrate attached to the sheet 3 with the indenter 18, so that the indenter 18 presses the sheet 3 from above via the substrate.

[0066] Furthermore, if a substrate is attached to sheet 3, the strength of attachment of sheet 3 to ring frame 5 can be measured under conditions that replicate actual use. Therefore, even when indenter 18 directly presses sheet 3, it is preferable that a substrate is attached to sheet 3 in order to obtain more useful measurement results.

[0067] In addition, the structures, methods, and the like according to the above-described embodiments and modified examples can be modified as appropriate without departing from the scope of the present invention. [Explanation of symbols]

[0068] 1. Measurement object 3 Sheets 5 Ring Frame 5a opening 2 Measuring instrument 4 Exterior cover 4a Top side 4b aperture 4c front 6 Support Table 6a Support surface 6b Locating pin 8 Circular recess 10. Standing section 12 Lifting unit 12a Pulse motor 12b opening 14 Arm 16 Load measurement section 18 Indenter 20. Display with touch panel 22 Control Unit 22a Storage section 22b Measurement control section 26 Motor 28 Spindle 30 Rotational Axis

Claims

1. A measuring device for measuring the adhesive strength of a sheet attached to a ring frame having an opening in the center, a support table having an annular support surface capable of supporting the ring frame; an indenter that presses the sheet attached to the ring frame placed on the support table from above inside the opening; a lifting unit that lifts and lowers the indenter relative to the support table; a load measuring unit that measures the load applied to the indenter; a control unit that controls the lifting unit and the load measuring unit, The control unit a measurement control unit that controls the lifting unit to lower the indenter toward the sheet and press the sheet against the indenter while measuring the load applied to the indenter using the load measuring unit; and a storage unit that stores the measurement results of the load measuring unit.

2. the measurement control unit detects that peeling of the sheet from the ring frame has occurred when a decrease in the load applied to the indenter is observed while the indenter is pressing the sheet; 2. The measuring instrument according to claim 1, wherein the memory unit stores as the measurement result a maximum load value, which is a measured value of the load applied to the indenter immediately before a decrease in the load applied to the indenter is observed.

3. The measurement control unit if a decrease in the load applied to the indenter is observed before the measured value of the load applied to the indenter measured by the load measuring unit reaches a predetermined value, it is determined that the adhesive strength of the sheet to the ring frame is insufficient; determining that the adhesive strength of the sheet to the ring frame is sufficient when no decrease in the load applied to the indenter is observed until the measured value of the load applied to the indenter measured by the load measuring unit reaches a predetermined value; 2. The measuring device according to claim 1, wherein the storage unit stores the determination result of the measurement control unit as the measurement result.

4. 4. The measuring instrument according to claim 1, further comprising a rotation unit that rotates the support table around a rotation axis that passes through the center of the support table and extends in a direction perpendicular to the support surface.

5. A measuring instrument as described in any one of claims 1 to 4, characterized in that when a substrate is attached to the sheet inside the opening of the ring frame supported on the support table, the indenter can press the sheet from above through the substrate.

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