Method and apparatus for multiple direct transfer of semiconductor devices - Patents.com

Abstract

An apparatus for directly transferring a semiconductor device die from a wafer tape to a substrate. A first frame holds the wafer tape, and a second frame fixes the substrate. The second frame holds the substrate so that a transfer surface faces the semiconductor device die on a first surface of the wafer tape. Two or more needles are positioned adjacent to a second surface of the wafer tape opposite the first surface. The lengths of the two or more needles extend in a direction toward the wafer tape. A needle actuator operates the two or more needles to a die transfer position where at least one of the two or more needles presses against the second surface of the wafer tape to press one of the one or more semiconductor device dies into contact with the transfer surface of the substrate.

Description

[Technical field]

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS This application is a continuation of and claims priority to U.S. patent application Ser. No. 15 / 978,094, entitled “Method and Apparatus for Multiple Direct Transfers of Semiconductor Devices,” filed May 12, 2018, the entire contents of which are incorporated herein by reference. This application also relates to U.S. patent application Ser. No. 14 / 939,896, filed Nov. 12, 2014, entitled "Apparatus for Transfer of Semiconductor Devices," now patented as U.S. Patent No. 9,633,883; U.S. patent application Ser. No. 15 / 343,055, filed Nov. 3, 2016, entitled "Compliant Needle for Direct Transfer of Semiconductor Devices; U.S. patent application Ser. No. 15 / 360,471, filed Nov. 23, 2016, entitled "Top-Side Laser for Direct Transfer of Semiconductor Devices; U.S. patent application Ser. No. 15 / 360,645, filed Nov. 23, 2016, entitled "Pattern Array Direct Transfer Apparatus and Method Therefor; and U.S. patent application Ser. No. 15 / 360,645, filed Nov. 23, 2016, entitled "Flexible Support Substrate for Transfer of Semiconductor No. 15 / 409,409, filed Jan. 18, 2017, entitled "Methods for Producing High-Performance, High-Performance, and High-Performance Devices," the entire contents of which are incorporated by reference. [Background technology]

[0002] A semiconductor device is an electrical component that utilizes a semiconductor material, such as silicon, germanium, gallium arsenide, etc. Semiconductor devices are typically fabricated as single discrete elements or as integrated circuits (ICs). Examples of single discrete elements include electrically operable elements, such as light emitting diodes (LEDs), diodes, transistors, resistors, capacitors, fuses, etc.

[0003] The manufacture of semiconductor devices typically requires a complex manufacturing process involving a myriad of steps. The end product of manufacture is a "packaged" semiconductor device. The qualifier "packaged" indicates that enclosure and protection features have been incorporated into the end product, as well as interfaces that allow the device within the package to be incorporated into a final circuit.

[0004] The conventional manufacturing process for semiconductor devices begins with handling of a semiconductor wafer. The wafer is diced into a number of "unpackaged" semiconductor devices. The modifier "unpackaged" refers to unsealed semiconductor devices without protective features. In this specification, the unpackaged semiconductor devices may be referred to as semiconductor device dies, or simply "dies" for simplicity. A single semiconductor wafer may be diced to create dies of various sizes, and from a semiconductor wafer, 100,000 or more dies may be formed (depending on the starting size of the semiconductor), or 1,000,000 or more dies may be formed, each die having a certain quality. The unpackaged dies are then "packaged" by a conventional manufacturing process, briefly described below. The processing between wafer handling and packaging may be referred to as "dicing".

[0005] In some cases, dicing may include sorting of the die by a "pick and place process" whereby the diced die are individually picked up and sorted into bins. Sorting may be based on the forward voltage capability of the die, the average power of the die, and / or the wavelength of the die.

[0006] Packaging typically involves mounting the die into a plastic or ceramic package (e.g., a mold or enclosure). Packaging also involves connecting the die contacts to pins / wires for interfacing / interconnecting with the final circuit. Packaging of semiconductor devices is usually completed by encapsulating the die to protect it from the environment (e.g., dust).

[0007] The manufacturer then places the packaged semiconductor device into a product circuit. With packaging, the device becomes "connected" to the circuit assembly of the product being manufactured. Additionally, while packaging the device protects it from elements that may degrade or destroy the device, the packaged device is inherently larger (e.g., in some cases, approximately 10 times the thickness and 10 times the area, resulting in 100 times the volume) than the die that resides within the package. Thus, the resulting circuit assembly cannot in any case be thinner than the packaging of the semiconductor device.

[0008] As previously mentioned, conventional devices typically pick and place die individually from selected bins. This process introduces multiple inefficiencies into the system. Additionally, pick-and-place techniques make the process of placing multiple dies simultaneously cumbersome and inefficient. Conventional devices do not have the capability or efficiency to manufacture multiple semiconductor dies simultaneously. [Brief description of the drawings]

[0009] DETAILED DESCRIPTION OF THE EMBODIMENTS The embodiments for carrying out the invention are described with reference to the accompanying drawings. In the drawings, the leftmost digit(s) of a reference number indicates the figure in which the reference number first appears. Use of the same reference number in different drawings indicates similar or identical items. Furthermore, the drawings may be considered to provide an approximate depiction of the relative size of individual components within each figure. However, the drawings are not to scale, and the relative size of individual components both within each figure and between different figures may differ from what is depicted. In particular, some of the figures may show components as a particular size or shape, while other figures may show the same components at a larger scale or with a different shape for clarity.

[0010] [Figure 1] FIG. 1 is a perspective view of an embodiment of a transfer device. [Figure 2A] FIG. 2A is a schematic diagram of an embodiment of a transfer device in a pre-transfer position. [Figure 2B] FIG. 2B is a schematic diagram of an embodiment of a transfer device in a transfer position. [Diagram 3] FIG. 3 is an embodiment of a shape profile of the end of a needle of a transfer mechanism. [Figure 4] FIG. 4 is an embodiment of a needle action stroke profile. [Diagram 5] FIG. 5 is a top view of an embodiment of a product substrate having circuitry thereon. [Figure 6] FIG. 6 is a schematic diagram of an embodiment of elements of a die transfer system. [Figure 7] FIG. 7 is a schematic diagram of an embodiment of the circuit paths between the mechanical hardware and the controller of the die transfer system. [Figure 8] FIG. 8 is a method of a die transfer process according to an embodiment of the present application. [Figure 9] FIG. 9 is a method of a die transfer operation according to an embodiment of the present application. [Figure 10] FIG. 10 is an embodiment of a direct transfer apparatus and process implementing a conveyor system. [Figure 11] Figure 11A is a schematic diagram of another embodiment of a transfer apparatus in a pre-transfer position, and Figure 11B is a schematic top view of the product substrate transport mechanism of the embodiment of Figure 11A after transfer. [Figure 12] FIG. 12 is a schematic diagram of another embodiment of a transfer device in a pre-transfer position. [Figure 13] FIG. 13 is a schematic diagram of another embodiment of a transfer device in a pre-transfer position. [Figure 14] FIG. 14 is a schematic diagram of another embodiment of a transfer device in a pre-transfer position. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] The present disclosure relates to a machine for directly transferring and attaching a semiconductor device die to a circuit, and a process for accomplishing the same, as well as the circuit with the die attached (as a product). In some cases, the machine functions to directly transfer an unpackaged die from a substrate, such as a "wafer tape," to a product substrate, such as a circuit substrate. Direct transfer of an unpackaged die can significantly reduce the thickness of the final product, as well as the time and / or cost to manufacture the product substrate, as compared to similar products manufactured by conventional means. In some cases, the machine can function to simultaneously or sequentially transfer multiple semiconductor device dies to a circuit. Additionally, as used herein, when the term "needle" (or a variation of needle as used herein) is used, it is contemplated that multiple needles are contemplated instead of a single needle, unless the context of using "needle" implies otherwise.

[0012] For purposes of this description, the term "substrate" refers to any material on or to which a process or treatment is performed. Additionally, the term "product" refers to the desired output from a process or treatment, regardless of state of completion. Thus, a product substrate refers to any material on or to which a process or treatment occurs for the desired product.

[0013] In one embodiment, the machine can secure a product substrate for receiving, for example, an LED, that is "unpackaged" die, e.g., transferred from a wafer tape. To reduce the dimensions of the product using the die, the die may be very small and thin, e.g., the die thickness may range from about 12.5 to 200 microns thick. Due to the relatively small size of the die, the machine includes components that function to precisely align both the wafer tape carrying the die and the product substrate to ensure accurate placement and / or avoid waste of product material. In some cases, the components that align the product substrate with the die on the wafer tape may include a set of frames in which the wafer tape and the product substrate are each secured and transported separately to an alignment position such that a particular die on the wafer tape is transferred to a particular location on the product substrate.

[0014] The frame carrying the product substrate may move in a variety of directions, including horizontally and / or vertically, or even to allow transfer onto curved surfaces. The frame carrying the wafer tape may move in a variety of directions as well. A system of gears, tracks, motors, and / or other elements may be used to secure and transport each frame carrying the product substrate and wafer tape, respectively, to align the product substrate with the wafer tape and place the die in a precise location on the product substrate. Each frame system may be moved to an unloading position to easily unload the wafer tape and product substrate upon completion of the transfer process.

[0015] In some cases, the machine may further include a transfer mechanism that transfers the die directly from the wafer tape to the product substrate without "packaging" the die. The transfer mechanism may be positioned vertically above the wafer tape to press the die down through the wafer tape toward the product substrate. This process of pressing the die down can peel the die from the wafer tape, starting from the side of the die, until the die separates from the wafer tape and is attached to the product substrate. That is, the die can be transferred by reducing the adhesive force between the die and the wafer tape and increasing the adhesive force between the die and the product substrate.

[0016] In some embodiments, the transfer mechanism may include an elongated rod, such as a pin or needle, which may move cyclically against the wafer tape, pushing the wafer tape from above. Additionally and / or alternatively, the transfer mechanism may include multiple needles that may move simultaneously and / or individually against the wafer tape. The needle, or multiple needles, may be sized to be narrower than the width of the die to be transferred. However, in other examples, the needles may be wider or of other dimensions. When the end of the needle contacts the wafer tape, a localized deflection of the wafer tape may occur in the area between the die and the wafer tape. This deflection is so localized and occurs so quickly that the portion of the wafer tape that does not receive pressure from the needle may begin to bend away from the surface of the die. This partial separation therefore causes the die to lose sufficient contact with the wafer tape, thereby allowing the die to be peeled off the wafer tape. Additionally, in some cases, minimizing flexure of the wafer tape allows the entire surface area of ​​the die to remain in contact with the wafer tape while leaving the opposing surface of the die extending out of the plane of the extended corresponding surface of the adjacent die, thereby avoiding inadvertent transfer of the adjacent die.

[0017] Alternatively, or in addition, the machine may include a fastening mechanism for attaching the separated "unpackaged" die to the product substrate. In some cases, the product substrate may have circuit wiring on its surface for transferring and attaching the die. The fastening mechanism may include an energy irradiating device, e.g., a laser, to melt / soften the circuit wiring material on the product substrate. Additionally, in some cases, a laser may be used to activate / harden the circuit wiring material. Thus, the fastening mechanism may be actuated before and / or after the die contacts the circuit wiring material. Accordingly, when the transfer mechanism is actuated to release the die onto the product substrate, the energy irradiating device may be actuated to prepare the wiring material to receive the die. Activation of the energy irradiating device may further facilitate the release and acquisition of the die from the wafer tape, and the formation of the semiconductor product on the product substrate may begin. EXAMPLES

[0018] First Exemplary Embodiment of the Direct Transfer Apparatus FIG. 1 illustrates an embodiment of an apparatus 100 that can be used to directly transfer unpackaged semiconductor components (or "dies") from a wafer tape to a product substrate. The wafer tape may also be referred to herein as a semiconductor device die substrate, or simply a die substrate. The apparatus 100 may include a product substrate transport mechanism 102 and a wafer tape transport mechanism 104. Each of the product substrate transport mechanism 102 and the wafer tape transport mechanism 104 may include a frame system or other means for securing the respective substrates to be transported to a desired alignment position relative to one another. The apparatus 100 may further include a transfer mechanism 106, which may be positioned directly vertically above the wafer tape transport mechanism 104 as shown. In some cases, the transfer mechanism 106 may be positioned so as to be nearly in contact with the wafer substrate. Additionally, the apparatus 100 may include a fixation mechanism 108. The fixation mechanism 108 may be positioned vertically below the product substrate transport mechanism 102 so as to be aligned with the transfer mechanism 106 at a transfer position where a die or multiple dies may be placed on the product substrate. As described below, FIGS. 2A and 2B illustrate exemplary details of device 100.

[0019] 2A and 2B illustrate different stages of a transfer operation while referencing the same elements and features of the apparatus 200, and therefore discussion of certain features below may refer interchangeably to either or both of FIGS. 2A and 2B, except where expressly indicated. Specifically, FIGS. 2A and 2B illustrate an embodiment of the apparatus 200 including a product substrate transport mechanism 202, a wafer tape transport mechanism 204, a transfer mechanism 206, and a fixation mechanism 208. The product substrate transport mechanism 202 may be disposed adjacent to the wafer tape transport mechanism 204. For example, as illustrated, the product substrate transport mechanism 202 may extend substantially horizontally or may be disposed vertically below the wafer tape transport mechanism 204 to take advantage of any effects that gravity may have on the transfer process. Alternatively, the product substrate transport mechanism 202 may be oriented to extend across a horizontal plane.

[0020] As described herein below, during the transfer operation, the transport mechanisms 202, 204 can be positioned such that the space between the surface of the product substrate transported by the product substrate transport mechanism 202 and the surface of the wafer tape transported by the wafer tape transport mechanism 204 is greater than 1 mm, including the amount of deflection caused by the components during the transfer operation, or less than 1 mm, depending on various other aspects of the apparatus 200. In some cases, the respective opposing surfaces of the wafer tape and the product substrate may be the most prominent structures compared to the support structures of the transport mechanisms 202, 204. That is, to avoid collisions between machine components and the products thereon, which may be caused by moving parts (e.g., the transport mechanisms 202, 204), the distance between the respective surfaces of the wafer tape and the product substrate may be less than the distance between any of these surfaces and any other opposing structural components.

[0021] As shown, in some cases, the transfer mechanism 206 may be positioned vertically above the wafer tape transport mechanism 204, and the clamping mechanism 208 may be positioned vertically below the product substrate transport mechanism 202. It is contemplated that in some embodiments, one or both of the transfer mechanism 206 and the clamping mechanism 208 may be oriented in a different position than that illustrated in Figures 2A and 2B. For example, the transfer mechanism 206 may be positioned to extend at an acute angle relative to the horizontal plane. In another embodiment, the clamping mechanism 208 may be oriented to apply energy during the transfer process from the same operating direction as the transfer mechanism 206, or from any direction and position that allows the clamping mechanism 208 to participate in the transfer process.

[0022] The product substrate transport mechanism 202 may be used to secure the product substrate 210. As used herein, the term "product substrate" may include, but is not limited to, wafer tapes (e.g., for pre-screening dies and creating screened die sheets for future use), paper or polymer substrates formed into sheets or other non-planar shapes, where the polymer (translucent or not) may be selected from any suitable polymer, including but not limited to silicone, acrylic, polyester, polycarbonate, and the like, circuit substrates (e.g., printed circuit boards (PCBs)), string or thread circuits that may include a pair of conductive wires or "threads" running parallel to each other, and fabric materials such as cotton, nylon, rayon, leather, and the like. The material selection for the product substrate may include durable materials, flexible materials, rigid materials, and other materials that facilitate a successful transfer process and maintain compatibility with the end use of the product substrate. The product substrate 210 may be formed entirely or at least partially of conductive materials such that the product substrate 210 functions as a conductive circuit to form a product. Possible types of product substrates can further include items such as glass bottles, vehicle windows, or glass panes.

[0023] In embodiments such as those shown in Figures 2A and 2B, product substrate 210 may include circuit traces 212 disposed thereon. As shown, circuit traces 212 may include a pair of adjacent wiring lines spaced apart by a trace spacing, or gap, to correspond to the distance between electrical contact terminals (not shown) on the die to be transferred. Thus, the trace spacing or gap between adjacent wiring lines of circuit traces 212 may be sized according to the size of the die to be transferred to ensure proper connection and subsequent operation of the die. For example, circuit traces 212 may have a trace spacing or gap in the range of about 75-200 microns, about 100-175 microns, or about 125-150 microns.

[0024] The circuit traces 212 may be formed from conductive ink that is placed via screen printing, inkjet printing, laser printing, manual printing, or other printing means. Additionally, the circuit traces 212 may be pre-cured, semi-dried or dried to improve stability, but still be activatable for die conductivity. A wet conductive ink may be used to form the circuit traces 212, or a combination of wet and dry inks may be used for the circuit traces 212. Alternatively, or in addition, the circuit traces 212 may be pre-formed as wire traces, photo-etched, or formed from molten material into a circuit pattern and then adhered, embedded, or affixed to the product substrate 210.

[0025] The material of the circuit traces 212 may include, but is not limited to, silver, copper, gold, carbon, conductive polymers, and the like. In some cases, the circuit traces 212 may include copper particles coated with silver. The thickness of the circuit traces 212 may vary depending on the type of material used, the intended function and the appropriate strength or flexibility to achieve that function, the energy capacity, the size of the LEDs, and the like. For example, the thickness of the circuit traces may range from about 5 microns to 20 microns, about 7 microns to 15 microns, or about 10 microns to 12 microns.

[0026] Thus, in one non-limiting example, the product substrate 210 may be a flexible, translucent polyester sheet having the desired circuit pattern screen printed thereon to form the circuit traces 212 using a silver-based conductive ink material.

[0027] The product substrate transport mechanism 202 may include a product substrate conveyor frame 214 for securing a product substrate holder frame 216. The structure of the product substrate holder frame 216 may vary widely depending on the type and characteristics (e.g., shape, size, elasticity, etc.) of the product substrate used. Because the product substrate 210 may be a flexible material, the product substrate 210 may be held under tension within the product substrate holder frame 216 to create a more rigid surface on which the transfer operations described herein below are performed. In the above example, the rigidity caused by the tension in the product substrate 210 may increase the placement accuracy when transferring components.

[0028] In some cases, using a more durable or stiffer material for the product substrate 210 naturally provides a solid surface for component placement accuracy, whereas flexing of the product substrate 210 may result in wrinkles and / or other discontinuities in the product substrate 210 that may interfere with the preset pattern of the circuit traces 212 to the extent that the transfer operation may fail.

[0029] While the means for holding the product substrate 210 may vary widely, Figure 2A illustrates an embodiment of a product substrate holder frame 216 that includes a first portion 216a having a concave shape and a second portion 216b having an opposing convex shape that corresponds in shape to the concave shape. In the illustrated example, tension is placed on the product substrate 210 by inserting the periphery of the product substrate 210 between the first portion 216a and the second portion 216b, thereby firmly clamping the product substrate 210.

[0030] The product substrate conveyor frame 214 can be transported in at least three directions, two directions in a horizontal plane as well as vertically. Transport may occur via a system of motors, rails, and gears (none of which are shown). Thus, the product substrate pulling frame 216 may be transported to and held in a specific position as directed and / or programmed and controlled by a user of the apparatus 200.

[0031] The wafer tape transport mechanism 204 may be implemented to secure a wafer tape 218 having dies 220 (i.e., semiconductor device dies) thereon. The wafer tape 218 may be transported in multiple directions by a wafer tape conveyor frame 222 to a specific transfer location for a transfer operation. Similar to the product substrate conveyor frame 214, the wafer tape conveyor frame 222 may include a system of motors, rails, and gears (none of which are shown).

[0032] The unpackaged semiconductor die 220 for transfer can be quite small, and in fact the height of the die 220 can range from 12.5 to 200 microns, or from 25 to 100 microns, or from 50 to 80 microns.

[0033] Due to the micro-size of the dies, when the wafer tape 218 is transported to the appropriate transfer position, the gap spacing between the wafer tape 218 and the product substrate 210 can range, for example, from about 0.25 mm to 1.50 mm, or from about 0.50 mm to 1.25 mm, or from about 0.75 mm to 1.00 mm. The minimum gap spacing may depend on factors including the thickness of the dies to be transferred, the stiffness of the wafer tape involved, the amount of wafer tape deflection required to achieve proper capture and release of the dies, the proximity of adjacent dies, etc. As the distance between the wafer tape 218 and the product substrate 210 decreases, the speed of the transfer operation may also decrease because the cycle time (discussed further herein) of the transfer operation decreases. Such a decrease in the time of the transfer operation may therefore increase the speed of die transfer. For example, the die transfer speed may range from about 6 to 500 dies placed per second, or 20 to 400 per second, or 50 to 250 per second, or 80 to 150 per second. Furthermore, depending on the number of needles in use and the speed of the transport mechanism, die transfer rates can exceed 500 per second.

[0034] Additionally, the wafer tape conveyor frame 222 can secure a wafer tape holder frame 224, which can stretch and hold the wafer tape 218 under tension. As illustrated in FIG. 2A, the wafer tape 218 may be secured to the wafer tape holder frame 224 by clamping the periphery of the wafer tape 218 between adjacent components of the wafer holder frame 224. Such clamps help maintain the tension and stretching properties of the wafer tape 218, thereby increasing the success rate of the transfer operation. Given the various characteristics of the different types / brands / qualities of wafer tape available, a particular wafer tape can be selected for use based on its ability to stably maintain at a desired tension during the transfer process. In some cases, the needle operation performance profile (described further herein below) may be altered depending on the tension of the wafer tape 218.

[0035] Materials used for the wafer tape 218 can include materials with elastic properties, such as rubber or silicone. Additionally, materials with properties that are resistant to temperature fluctuations can be advantageous, since the temperature of the environment and of the wafer tape 218 itself can potentially damage the wafer tape 218 during the transfer process. Additionally, in some cases, the wafer tape 218 can be slightly stretched to create spaces or gaps between the individual dies 220 to facilitate the transfer operation. The surface of the wafer tape 218 can include an adhesive substance, through which the dies 220 can be removably adhered to the wafer tape 218.

[0036] The dies 220 on the wafer tape 218 may include dies that are individually cut from a solid semiconductor wafer and placed on the wafer tape 218 to secure the dies. In such a situation, for example, the dies may be pre-sorted and specifically organized on the wafer tape 218 to facilitate the transfer operation. Specifically, the dies 220 may be sequentially placed on the product substrate 210 in a predicted transfer order. Pre-arranging the dies 220 on the wafer tape 218 in this manner may reduce the amount of movement that would otherwise occur between the product substrate transport mechanism 202 and the wafer tape transport mechanism 204. Additionally or alternatively, the dies on the wafer tape 218 may be pre-sorted to include only dies that have substantially similar performance characteristics. In this case, the efficiency of the supply chain may be increased, and thus the movement time of the wafer tape transport mechanism 204 may be minimized.

[0037] In some cases, materials used for the die may include, but are not limited to, silicon carbide, gallium nitride, coated silicon oxide, etc. Additionally, sapphire or silicon may also be used as the die. Additionally, as noted above, "die" may be used herein broadly to refer to any electrically operable element.

[0038] In some embodiments, the wafer tape 218 may contain dies that are not pre-sorted, but rather are formed by simply cutting the semiconductor directly onto the wafer tape and leaving the dies on the wafer tape, without "picking and placing" the dies according to their respective performance qualities. In such a situation, the dies may be mapped onto the wafer tape to represent the exact relative positions of the dies of different qualities. Thus, in some cases, it may not be necessary to use a wafer tape with pre-sorted dies. In such a case, the amount of time and movement for the wafer tape transport mechanism 204 to move between specific dies for each successive transfer operation may increase. This may be due in part to the fact that dies of various qualities are distributed within the area of ​​the semiconductor, i.e., a die of a specific quality for the next transfer operation may not be directly adjacent to a die that was previously moved. Thus, the wafer tape transport mechanism 204 moves the wafer tape 218 further to align the appropriate die for transfer with a specific quality than would be necessary if the wafer tape 218 contained dies of substantially equivalent quality.

[0039] Further with respect to the dies 220 on the wafer tape 218, in some cases a data map of the dies 220 may be provided to the wafer tape 218. The data map may include a digital file that provides information describing the specific qualities and location of each die on the wafer tape 218. The data map file may be input to a processing system in communication with the apparatus 200 such that the apparatus 200 can be controlled / programmed to locate and transfer the appropriate die 220 on the wafer tape 218 to the product substrate 210.

[0040] The transfer operation is performed in part via a transfer mechanism 206, which is a die separation device to facilitate separation of the die from the wafer tape 218. Operation of the transfer mechanism 206 can cause one or more dies 220 to be peeled off from the wafer tape 218 and captured by the product substrate 210. In some cases, the transfer mechanism 206 can operate by pressing at least one elongated rod, e.g., a pin or needle 226, into the top surface of the wafer tape 218 against the die 220. The needle 226 can be coupled to a needle actuator 228. The needle actuator 228 can include a motor that connects to the needle 226 and moves the needle 226 toward the wafer tape 218 for a predetermined / programmed time. In some embodiments, the transfer mechanism 206 can include multiple needles 226 coupled to the needle actuator 228.

[0041] Considering the function of the needle 226, the needle 226 may comprise a material that is durable enough to withstand repeated, rapid, small impacts while minimizing potential damage to the die 220 upon impact. For example, the needle 226 may comprise metal, ceramic, plastic, etc. Additionally, the tip of the needle 226 may have a particular geometric profile that may affect the ability of the needle to operate repeatedly without frequently breaking either tip or damaging the wafer tape 218 or the die 220. The profile shape of the needle tip is described in more detail below with respect to FIG.

[0042] In a transfer operation, the needle 226 may be aligned with the die 220, as shown in FIG. 2A, and the needle actuator may move the needle 226 to press against the adjacent side of the wafer tape 218 at the location where the die 220 is aligned on the opposite side of the wafer tape 218, as shown in FIG. 2B. The pressure from the needle 226 may deflect the wafer tape 218 to bring the die 220 closer to the product substrate 226 than the adjacent die 220 that is not transferred. As noted above, the amount of deflection may vary depending on several factors, such as the thickness of the die and the circuitry. For example, if the die 220 is about 50 microns thick and the circuitry 212 is about 10 microns thick, the amount of deflection of the wafer tape 218 may be about 75 microns. Thus, the die 220 may be pressed by the needle 226 toward the product substrate 210 to the extent that the electrical contact terminals (not shown) of the die can bond with the circuit traces 212, at which point the transfer operation proceeds to completion and the die 220 is peeled off from the wafer tape 218.

[0043] To the extent that the transfer process can include a rapidly repetitive set of steps that include cyclical movement of the needle 226 pressing onto the die 220, the method of the process is described in detail herein with respect to Figure 8. Additionally, the stroke profile of the movement of the needle 226 (within the context of the transfer process) is described in further detail herein below with respect to Figure 4.

[0044] Returning to FIGS. 2A and 2B, in some cases, the transfer mechanism 206 may further comprise a needle storage support 230 (also known as a pepper pot). In one embodiment, the support 230 may comprise a structure having a hollow space, and the needle 226 may be accommodated by passing into the space through an opening 232 at a first end of the support 230. The support 230 may further comprise at least one opening 234 on a second opposite end of the support 230. Additionally, the support may comprise a plurality of perforations near the opening 234. The at least one opening 234 may be sized relative to the diameter of the needle 226 to accommodate passing the needle 226 through the opening 234 for pressing against the wafer tape 218 during the transfer process.

[0045] Further, in some cases, the support 230 may be positioned adjacent to the top surface of the wafer tape 218. Thus, when the needle 226 is retracted from pressing against the wafer tape 218 during the transfer operation, the bottom surface of the support 230 (having at least one opening 234) may contact the top surface of the wafer tape 218, thereby preventing the wafer tape 218 from bending upward. This bending upward may occur if the needle 226 at least partially penetrates the wafer tape 218 and the wafer tape sticks to the tip of the needle 226 while the needle is being retracted. Thus, the support 230 may reduce the time it takes to move to the next die 220. The wall peripheral shape of the support 230 may be cylindrical or any other shape that can be accommodated in the apparatus 200. Thus, the support 230 may be positioned between the needle 226 and the top surface of the wafer tape 218.

[0046] With regard to the effect of temperature on the integrity of the wafer tape 218, it is contemplated that the temperature of the support 230 can be adjusted to adjust the temperature of the needles 226 and at least the wafer tape 218 near the point of the transfer operation. Thus, the temperature of the support 230 can be heated or cooled, and the material of the support 230 can be selected to maximize thermal conductivity. For example, the support 230 can be formed of aluminum, or other relatively high thermal conductivity metal or equivalent material, which can control the temperature and maintain consistent results of the transfer operation. In some cases, air can be circulated within the support 230 to help control the temperature of localized portions of the wafer tape 218. Additionally or alternatively, a fiber optic cable 230a can be inserted into the needle storage support 230 and even contact the needles 226 to help regulate the temperature of the wafer tape 218 and / or the needles 226.

[0047] As described above, the fastening mechanism 208 can facilitate attachment of the die 220 to the circuit trace 212 on the surface of the product substrate 210. FIG. 2B illustrates the apparatus 200 in a transfer stage in which the die 220 is pressed against the circuit trace 212. In one embodiment, the fastening mechanism 208 can include an energy application device 236, including but not limited to a laser, electromagnetic irradiation, pressure vibration, ultrasonic welding, and the like. In some cases, the energy application device 236 can function by exerting a vibration energy force by using pressure vibration to disrupt molecules in the circuit trace against molecules of the electrical contact terminals and form a bond through vibration pressure. Additionally, in one embodiment, the fastening mechanism 208 can be omitted entirely and the transfer of one or more dies to the circuit substrate can occur through other means, including adhesive strength or bonding potential.

[0048] In a non-limiting example, a laser may be implemented as the energy application device 236, as shown in FIG. 2B. During the transfer operation, the laser 236 may be activated to apply light energy of a particular wavelength and intensity toward the die 220 to be transferred. The wavelength of light of the laser 236 may be selected based specifically on the absorption of the wavelength of light by the material of the circuit trace 212 without significantly affecting the material of the product substrate 210. For example, a laser having an operating wavelength of 808 nm and operating at 5 W may be easily absorbed by silver but not by polyester. That is, the laser beam penetrates the polyester substrate and affects the silver of the circuit trace. Alternatively, the wavelength of the laser may be matched to the absorption of the material of the circuit trace and substrate. The focal area of ​​the laser 236 (shown by the dashed line emanating vertically from the laser 236 toward the product substrate 210 in FIG. 2B) may be sized according to the size of the LED, for example, a 300 micron wide area.

[0049] Upon activation of a predetermined controlled pulse duration of the laser 236, the circuit traces 212 may begin to harden (and / or melt or soften) to the extent that a fusion bond may be formed between the material of the circuit traces 212 and the electrical contact terminals (not shown) on the die 220. This bond may also facilitate not only separating the unpackaged die 220 from the wafer tape 218, but also simultaneously attaching the die 220 to the product substrate 210. Additionally, the laser 236 may induce some heat transfer onto the wafer tape 218, which may reduce the adhesion of the die 220 to the wafer tape 218, thereby facilitating the transfer operation.

[0050] In other cases, the die can be released and secured to the product substrate in a number of ways, including using a laser or focused light with a certain wavelength (e.g., IR, UV, broadband / multispectral) to heat / activate the circuit traces to cure the epoxy or phase change bonding material, or to deactivate / release the die from the wafer tape, or to initiate some combination of reactions. Additionally or alternatively, a laser or light of a specific wavelength may be used to penetrate one layer of the system and interact with the other layers. Furthermore, a vacuum may be applied to pull the die away from the wafer tape, or air pressure may be applied to press the die against the product substrate, potentially with a rotating head between the die wafer substrate and the product substrate. In yet other cases, ultrasonic vibrations may be combined with pressure to bond the die to the circuit traces.

[0051] Similar to the needle storage support 230, the fixing mechanism may also include a product substrate support 238 that may be disposed between the laser 236 and the bottom surface of the product substrate 210. The support 238 may include an opening 240 at its bottom and an opening 242 at its top. For example, the support 238 may be formed in a ring shape or a hollow cylinder. The support may further include a structure for fixing a lens (not shown) to assist in directing the laser. The laser 236 shines light through the openings 240, 242 to reach the product substrate 210. Additionally, the top end of the sidewall of the support 238 may be disposed in direct contact with or adjacent to the bottom surface of the product substrate 210. In this manner, the support 238 may help prevent damage to the product substrate 210 during the stroke of the needle 226 during the transfer operation. In some cases, during the transfer operation, the portion of the bottom surface of the product substrate 210 aligned with the support 238 can contact the support 238, thereby providing resistance to the incoming motion of the die 220 pressed by the needles 226. Additionally, the support 238 can be movable along a vertical axis such that its height can be adjusted, allowing the support 238 to be raised or lowered as needed, including rising to the height of the product substrate 210.

[0052] In addition to the above features, the apparatus 200 may further include a first sensor 244 from which the apparatus 200 receives information regarding the dies 220 on the wafer tape 218. To determine which dies to use for the transfer operation, the wafer tape 218 may have a bar code (not shown) or other identifier that is read or detected. The identifier may provide die map data to the apparatus 200 via the first sensor 244.

[0053] As shown in FIGS. 2A and 2B, the first sensor 244 may be positioned near the transfer mechanism 206 (or specifically the needle 226) at a distance d that may range from about 1-5 inches from the transfer mechanism 206 to improve the accuracy of position detection. In another embodiment, the first sensor 244 may be positioned adjacent to the tip of the needle 226 to detect the exact position of the die 220 in real time. During the transfer process, the wafer tape 218 may be perforated and / or further stretched over time, which may change the previously mapped, and therefore expected, position of the die 220 on the wafer tape 218. That is, small changes due to stretching of the wafer tape 218 may result in significant errors in the alignment of the transferred die 220. Therefore, real-time detection may be implemented to facilitate determining the exact die position.

[0054] In some cases, the first sensor 244 may be able to identify the exact location and type of die 220 being detected. This information may be used to provide instructions to the wafer tape conveyor frame 222 indicating the exact location to which the wafer tape 218 should be transported to perform the transfer operation. The sensor 244 may be one of many types of sensors or a combination of multiple types of sensors to better perform multiple functions. The sensor 244 may include, but is not limited to, a laser range finder, or an optical sensor, such as a high resolution optical camera with micro-photography capabilities as a non-limiting example.

[0055] Additionally, in some cases, a second sensor 246 may also be included with the apparatus 200. The second sensor 246 may be positioned relative to the product substrate 210 to detect the exact location of the circuit trace 212 on the product substrate 210. This information may then be used to determine any adjustments required to align the product substrate 210 between the transfer mechanism 206 and the clamping mechanism 208 so that the next transfer operation occurs at the correct location on the circuit trace 212. This information may then be relayed back to the apparatus 200 to coordinate the transportation of the product substrate 210 to the correct location while simultaneously communicating instructions to the wafer tape conveyor frame 222. The sensor 246 may also be a variety of sensors, including optical sensors, such as, but not limited to, a high resolution optical camera with micro-photography capabilities.

[0056] 2A and 2B further illustrate that the first sensor 244, the second sensor 246, and the laser 236 may be grounded. In some cases, the first sensor 244, the second sensor 246, and the laser 236 may all be grounded to the same ground (G) or to different grounds (G).

[0057] Depending on the type of sensors used for the first and second sensors 244, 246, the first or second sensors may be further capable of testing the functionality of the transferred die. Alternatively, a separate test sensor (not shown) may be incorporated into the structure of the apparatus 200 to test individual die prior to removal of the product substrate 210 from the apparatus 200.

[0058] Additionally, in some examples, the machine can be implemented with multiple independently operable needles and / or lasers to transfer and fix multiple dies at a given time. The multiple needles and / or lasers may be independently movable in three-dimensional space. Multiple die transfers can be performed synchronously (multiple needles down at the same time) or sequentially (e.g., one needle down while the other goes up, this arrangement can better balance the components and minimize vibrations). Control of the multiple needles and / or lasers may be coordinated to avoid collisions between the multiple components. Additionally, in other examples, the multiple needles and / or lasers may be positioned in fixed positions relative to each other.

[0059] Exemplary Needle Tip Profiles As discussed above, the profile shape of the tip 300 of the needle is described with respect to Figure 3, which shows a schematic example of the profile shape of the tip 300. In one embodiment, the tip 300 can be defined as the end of the needle and may include a sidewall 302 adjacent a tapered portion 304, a corner portion 306, and a base 308 extending laterally opposite the needle. The specific size and shape of the tip 300 may vary depending on factors of the transfer process, such as the size of the die 220 being transferred, and the speed and impact force of the transfer operation. For example, as shown in FIG. 3, the angle θ measured between the longitudinal direction of the central axis of the needle and the tapered portion 304 may be in the range of approximately 10 degrees to 15 degrees, the radius r of the corner 306 may be in the range of approximately 15 to 50 microns, the width w of the bottom 308 may be in the range of approximately 0 to 100 microns (μm), where w may be equal to or less than the width of the die 220 to be transferred, the height h of the tapered portion 304 may be in the range of approximately 1 to 2 mm, where h is greater than the distance the needle travels during a stroke of the transfer operation, and the diameter d of the needle 226 may be approximately 1 mm.

[0060] Other needle tip profiles are contemplated and may have different advantages depending on various factors related to the transfer operation. For example, the needle tip 300 may be rounder to reflect the width of the die or may be sharper to press into a smaller area of ​​the wafer tape. The transfer mechanism 206 may include one or more needles having the same or different needle profiles.

[0061] Exemplary Needle Operation Performance Profile An embodiment of a needle motion performance profile is illustrated in FIG. 4. That is, FIG. 4 illustrates an example stroke pattern executed during a transfer operation by displaying how the height of the needle tip changes over time relative to the plane of the wafer tape 218. That is, the "0" position in FIG. 4 can be the top surface of the wafer tape 218. Additionally, the dashed lines shown in the idle and ready phases of the stroke pattern are approximate times, but may be longer or shorter, because the needle idle time and needle ready time may vary depending on the programmed process or different time periods between the time to transfer a first die and the time it takes to reach a second die for transfer. Moreover, while the solid lines shown for use of the laser are exemplary times for the embodiments illustrated herein, it should be understood that the actual durations when the laser is on and off may vary depending on the materials used to form the circuit (e.g., material selection for the circuit traces), the type of product substrate, the desired effect (pre-melted circuit traces, partial bond, full bond, etc.), the distance of the laser from the bond point (i.e., top surface of the product substrate), the size of the die being transferred, and the power / intensity / wavelength of the laser, etc. Thus, the following description of the profile shown in FIG. 4 can be an exemplary embodiment of a needle profile.

[0062] In some cases, prior to the transfer operation, the fully retracted needle tip may be idled at about 2000 μm above the surface of the wafer tape. After a variable amount of time, the needle tip may be rapidly lowered to wait in a ready state at about 750 μm above the surface of the wafer tape. After another undetermined amount of time in the ready state, the needle tip may be lowered again to contact the die and push the wafer tape with the die down to a height of about -1000 μm, where the die can be transferred to the product substrate. The vertical dotted line at the beginning of the section where the laser is on indicates that the laser may be turned on at some point between the start of the descent from the ready stage and the bottom of the needle tip's stroke. For example, the laser may be turned on at about 50% of the way down. In some cases, by turning the laser on early, for example before the needle begins to descend, the circuit traces may begin to soften before contacting the die and forming a stronger bond, or even during this time the die wafer may be affected or prepared. The laser on phase may last about 20 ms ("milliseconds"). At the bottom of the stroke when the laser is on, the phase may be a die to product substrate bonding phase. This bonding phase allows the circuit traces to attach to the die contacts, which harden quickly after the laser is turned off. In this way, the die may be bonded to the product substrate. The bonding phase may last about 30 ms. The laser may then be turned off and the needle may rise to the priming phase quickly. Conversely, the laser may be turned off before the needle begins to rise, or at some point during the needle tip rise back to the priming phase. After the needle tip rises to the priming height, the needle tip height may overshoot and recover slightly to return below the priming height. Some of the recovery may be due to the speed at which the needle tip rises to the priming height, but the speed and recovery force may be intentional to facilitate retraction of the needle tip from the surface of the wafer tape if the needle penetrates and attaches to the wafer tape.

[0063] As shown in FIG. 4, the timing when the laser is off may be longer than the timing when the laser is on. In that case, a slower descent speed may help prevent damage to the die, and as mentioned above, a faster rise speed may help retract the needle tip from the wafer tape more effectively. However, as previously described, the timings shown in FIG. 4 are approximate, particularly with respect to the idle and warm-up periods. Thus, the numbers specified along the bottom edge of FIG. 4 are for reference only and should not be taken literally, unless otherwise specified.

[0064] Exemplary Product Substrates 5 illustrates an exemplary embodiment of a processed product substrate 500. The product substrate 502 may include a first portion 504A of circuit traces that may function as a negative or positive power supply terminal when power is applied to it. A second portion 504B of the circuit traces may extend adjacent to the first portion 504A of the circuit traces and may function as a corresponding positive or negative power supply terminal when power is applied thereto.

[0065] As similarly described above with respect to a wafer tape, the product substrate 502 has a bar code (not shown) or other identifier that is read or detected to determine where to transport the product substrate 502 to perform the transfer operation. The identifier may provide the circuit trace data to the device. The product substrate 502 may further include a reference point 506. The reference point 506 may be a visual indicator for detection by a product substrate sensor (e.g., the second sensor 246 of FIG. 2) to position the first and second portions 504A, 504B of the circuit trace. Once the reference point 506 is detected, the shape and relative position of the first and second portions 504A, 504B of the circuit trace with respect to the reference point 506 can be determined based on preprogrammed information. Using the detection information in conjunction with the preprogrammed information, the product substrate transport mechanism can transport the product substrate 502 to the proper alignment position for the transfer operation.

[0066] Further, the die 508 is shown in FIG. 5 as spanning between the first portion 504A of the circuit trace and the second portion 504B of the circuit trace. In this manner, electrical contact terminals (not shown) of the die 508 may be coupled to the product substrate 502 during the transfer operation. Accordingly, power may be applied to flow between the first portion 504A of the circuit trace and the second portion 504B of the circuit trace, thereby driving the die 508. For example, the die may be an unpackaged LED that is transferred directly from a wafer tape to the circuit trace on the product substrate 502. The product substrate 502 may then be processed to complete the product substrate 502 or may be used in a circuit or other end product. Furthermore, other components of the circuit may be added by the same or other transfer means to create a complete circuit, and may include control logic for controlling the LEDs as one or more groups in some static, programmable, or adaptive manner.

[0067] Simplified Exemplary Direct Transfer System A simplified embodiment of an exemplary direct transfer system 600 is illustrated in FIG. The transfer system 600 may include a personal computer (PC) 602 (or server, data entry device, user interface, etc.), a data storage device 604, a wafer tape mechanism 606, a product substrate mechanism 608, a transfer mechanism 610, and a fastening mechanism 612. A more detailed description of the wafer tape mechanism 606, the product substrate mechanism 608, the transfer mechanism 610, and the fastening mechanism 612 has been provided above, so specific details regarding these mechanisms will not be repeated here. However, an overview of how the wafer tape mechanism 606, the product substrate mechanism 608, the transfer mechanism 610, and the fastening mechanism 612 relate to the interaction between the PC 602 and the data storage device 604 is provided below.

[0068] In some cases, PC 602 communicates with data storage device 604 to receive information and data useful for the transfer process of directly transferring a die from the wafer tape in wafer tape mechanism 606 onto a product substrate in product substrate mechanism 608 using transfer mechanism 610, where the die may be secured onto the product substrate by operation of a laser or other energy application device located in clamping mechanism 612. PC 602 may act as a receiver, compiler, organizer and controller of data being relayed between each of wafer tape mechanism 606, product substrate mechanism 608, transfer mechanism 610, and clamping mechanism 612. PC 602 may further receive instructional information from a user of transfer system 600.

[0069] It should be noted that while FIG. 6 shows arrows next to the wafer tape mechanism 606 and the product substrate mechanism 608 indicating the direction of possible movement, these arrows are merely intended to indicate the general direction of movement, and it is contemplated that both the wafer tape mechanism 606 and the product substrate mechanism 608 may be capable of movement in other directions as well, including, for example, in-plane rotation, pitch, bob, and yaw.

[0070] Further details regarding the interaction of the components of transfer system 600 are discussed below with respect to FIG.

[0071] Detailed Exemplary Direct Transfer System The communication paths between each of the elements of the transfer system 700 can be generally described as follows.

[0072] The direct transcription system may include a personal computer (PC) 702 (or server, data entry device, user interface, etc.) that may receive information from and provide information to a data storage device 704. The PC 702 may further communicate with a first cell manager 706 (illustrated as "Cell Manager 1") and a second cell manager 708 (illustrated as "Cell Manager 2"). Thus, the PC 702 may control and synchronize instructions between the first cell manager 706 and the second cell manager 708.

[0073] The PC 702 may include a processor and memory components that execute instructions to perform various functions related to the first and second cell managers 706, 708, and the data storage device 704. In some cases, the PC 702 may include a project manager 710 and a needle profile definition unit 712.

[0074] A project manager 710 may receive input from the first and second cell managers 706, 708, and the data storage device 704 to manage the direct transfer process and maintain smooth functioning of the orientation and alignment of the product substrate relative to the wafer tape and the dies thereon.

[0075] The needle profile definition unit 712 may store data regarding needle stroke performance profiles and may use this data to instruct the transfer mechanism regarding the desired needle stroke performance according to the particular die on the loaded wafer tape and the pattern of circuit wiring on the product substrate. Further details of the needle profile definition unit 712 are described further below in this specification.

[0076] Returning to the data storage device 704, the data storage device 704 may include memory storing data, such as a die map 714, which may be dedicated to the wafer tape loaded in the wafer tape mechanism. As previously explained, the die map may describe the relative location of each die on the wafer tape and its quality to provide a pre-organized description of the location of a particular die. Additionally, the data storage device 704 may also include memory storing a circuit CAD file 716. The circuit CAD file 716 may store data regarding a particular circuit wiring pattern on a loaded product substrate.

[0077] The project manager 710 may receive a die map 714 and a circuit CAD file 716 from the data store 704 and may relay the respective information to the first and second cell managers 706, 708, respectively.

[0078] In one embodiment, the first cell manager 706 may use the die map 714 from the data storage device 704 via the die manager 718. More specifically, the die manager 718 may compare the die map 714 with information received by the sensor manager 720 and, based thereon, may provide instructions to the movement manager 722 regarding the location of a particular die. The sensor manager 720 may receive data regarding the actual location of the die on the wafer tape from the die detector 724. The sensor manager 720 may also instruct the die detector 724 to locate a particular die in a particular location according to the die map 714. The die detector 724 may comprise a sensor, for example, the second sensor 244 of FIGS. 2A and 2B. Based on the received data of the actual location of the die on the wafer tape (either a confirmation or an update regarding the misalignment), the movement manager 722 may instruct the first robot 726 (illustrated as “Robot 1”) to transport the wafer tape to an alignment position with the needles of the transfer mechanism.

[0079] Upon reaching the commanded position, the first robot 726 may communicate to the needle board manager 728 that its movement is complete. Additionally, the needle board manager 728 may communicate directly with the PC 702 to coordinate the execution of the transfer operation. When performing the transfer operation, the PC 702 may instruct the needle board manager 728 to activate the needle actuator / needle 730, which causes the needle to perform a stroke according to the loaded needle profile in the needle profile definition unit 712. The needle board manager 728 may also activate the laser controller / laser 732, which causes the laser to shine a beam of light toward the product substrate as the needle presses down the die through the wafer tape to perform the transfer operation. As described above, activation of the laser controller / laser 732 may occur before, simultaneously with, during, or after the activation or complete movement of the needle stroke.

[0080] In response, the first cell manager 706 may go through a number of states including determining where to command the first robot 726 to go, commanding the first robot 726 to go to the determined location, turning on the needle, activating the fixation device, and resetting.

[0081] Prior to performing the transfer operation, the project manager 710 may relay data of the circuit CAD file 716 to the second cell manager 708. The second cell manager 708 may include a sensor manager 734 and a movement manager 736. Using the circuit CAD file 716, the sensor manager 734 may find a reference point on the product substrate, thereby instructing the substrate alignment sensor 738 to detect and orient the product substrate according to the position of the circuit traces thereon. The sensor manager 734 may receive confirmed or updated position information of the circuit trace patterns on the product substrate. The sensor manager 734, in coordination with the movement manager 736, may instruct a second robot 740 (exemplified as "Robot 2") to transport the product substrate to an alignment position (i.e., transfer fixation position) for performing the transfer operation. Thus, the circuit CAD file 716 may facilitate the project manager 710 to align the product substrate with respect to the wafer tape so that the die can be accurately transferred to the circuit traces on the substrate.

[0082] In response, the second cell manager 708 may go through a number of states, including determining where to command the second robot 740 to go, commanding the second robot 740 to go to the determined location, and resetting.

[0083] It will be understood that additional and alternative communication paths are possible between all or less than all of the various components of the direct transfer system 700 described above.

[0084] Exemplary Direct Transfer Methods A method 800 of performing a direct transfer process in which one or more dies are transferred directly from a wafer tape to a product substrate is illustrated in FIG. The steps of the method 800 described herein may not be in any particular order and may therefore be performed in any order sufficient to achieve a desired product state. The method 800 may include a step 802 of loading transfer process data into a PC and / or data storage device. The transfer process data may include data such as die map data, circuit CAD file data, and needle profile data.

[0085] The method 800 may include a step 804 of loading the wafer tape onto a wafer tape conveyor mechanism. Loading the wafer tape onto the wafer tape conveyor mechanism may include controlling the wafer tape conveyor mechanism to move to a loading position, also known as an unloading position. The wafer tape may be secured to the wafer tape conveyor mechanism in the loading position. The wafer tape may be loaded such that the semiconductor dies face down toward the product substrate conveyor mechanism.

[0086] The method 800 may further include a step 806 of preparing and loading a product substrate onto a product substrate conveyor mechanism. Preparing the product substrate may include screen printing circuit traces onto the product substrate according to a pattern of a CAD file loaded onto a PC or data storage device. Additionally, fiducials may be printed onto the circuit substrate to facilitate the transfer process. The product substrate conveyor mechanism may be controlled to move to a loading position, also known as an unloading position, where the product substrate may be loaded onto the product substrate conveyor mechanism. The product substrate may be loaded such that the circuit traces face the dies on the wafer. In some cases, for example, the product substrate may be delivered and placed into the loading position by a conveyor (not shown) or other automated mechanism, for example in the manner of an assembly line. Alternatively, the product substrate may be loaded manually by an operator.

[0087] Once the product substrate is properly loaded onto the product substrate conveyor mechanism and the wafer tape is properly loaded onto the wafer tape conveyor mechanism, a direct transfer operation 808 may be initiated by executing a program via a PC that controls the direct transfer of die from the wafer tape to the circuitry of the product substrate. The direct transfer operation is described in more detail below.

[0088] Exemplary Direct Transfer Operating Methods A direct transfer operation method 900 for directly transferring die from a wafer tape (or other substrate that holds the die, also referred to as a "die substrate" for ease of explanation of FIG. 9) to a product substrate is shown in FIG. 9. The steps of method 900 described herein do not need to be in any particular order, and thus may be performed in any order sufficient to achieve the desired product state.

[0089] To determine which die should be placed on the product substrate and where the die should be placed on the product substrate, at 902 the PC can receive input regarding the identification of the product substrate and the identification of the die substrate containing the die to be transferred. This input can be entered manually by a user or the PC can send a request to the cell manager under control of the product substrate alignment sensor and die detector, respectively. This request can instruct the sensor to scan the loaded substrate for an identification marker, e.g., a bar code or QR code, and / or can instruct the detector to scan the loaded die substrate for an identification marker, e.g., a bar code or QR code.

[0090] At 904, using the input for the product substrate identification, the PC may query a data storage device or other memory to match the respective identification markers of the product substrate and die substrate and retrieve associated data files. Specifically, the PC may retrieve a circuit CAD file associated with the product substrate that describes the pattern of circuit traces on the product substrate. The circuit CAD file may further include data, such as the number, relative positions, and individual quality requirements of the die that are to be transferred to the circuit traces. Similarly, the PC may retrieve a die map data file associated with the die substrate that provides a map of the relative positions of particular dies on the die substrate.

[0091] At 906, in the process of performing the transfer of the die to the product substrate, the PC may determine an initial orientation of the product substrate and die substrate relative to the transfer mechanism and the fixturing mechanism. Within step 906, the PC may instruct the substrate alignment sensor to search for fiducial points on the product substrate. As previously described, the fiducial points may be used as reference markers to determine the relative position and orientation of the circuit traces on the product substrate. Additionally, the PC may instruct the die detector to search for one or more fiducial points on the die substrate to determine the outline of the die.

[0092] Once the initial orientations of the product substrate and die substrate are determined, at 908 the PC may instruct each of the product substrate transport mechanism and die substrate transport mechanism to orient the product substrate and die substrate into alignment with the transfer mechanism and fixation mechanism, respectively.

[0093] The alignment step 908 may include determining 910 a location of the portion of the circuitry to which the die is to be transferred, and determining 912 where that portion is located relative to a transfix position. The transfix position may be considered to be an alignment position between the transfer mechanism and the fixation mechanism. At 914, based on the data determined in steps 910 and 912, the PC may instruct the product substrate transport mechanism to transport the product substrate to align the portion of the circuitry to which the die is to be transferred with the transfix position.

[0094] The alignment step 908 may further include determining which die on the die substrate to transfer 916 and determining where the die is located relative to the transfix position 918. At 920, based on the data determined in steps 916 and 918, the PC may instruct the wafer tape transport mechanism to transport the die substrate to align the die to be transferred with the transfix position.

[0095] Once the die to be transferred from the die substrate and the portion of the circuitry to which the die will be transferred are aligned with the transfer mechanism and the fixturing mechanism, at 922 the needle and / or multiple needles and a fixturing device (e.g., a laser) may be operated to perform the transfer of the die from the die substrate to the product substrate.

[0096] After the die is transferred, the PC may determine whether another die is to be transferred at 924. If another die is to be transferred, the PC may return to step 908 and realign the product substrate and die substrate accordingly for the next transfer operation. If there is not another die to be transferred, the transfer process ends at 926.

[0097] Exemplary Direct Transfer Conveyor / Assembly Line System In the embodiment described with respect to FIG. 10, some of the components of the direct transfer apparatus described above may be implemented in a conveyor / assembly line system 1000 (hereinafter "conveyor system"). Specifically, FIGS. 2A and 2B show that the product substrate 210 is held by a product substrate conveyor frame 214 and tensioned by a product substrate tensioning frame 216. As an alternative to fixing the product substrate conveyor frame 214 within a confined area via a system of motors, rails and gears as shown with respect to the apparatus 200, FIG. 10 illustrates that the product substrate conveyor frame 214 is transported by a conveyor system 1000, in which the product substrate undergoes an assembly line-style process. As the actual transport means between operations performed on the product substrate being transported, the conveyor system 1000 may include a series of tracks, rollers and belts 1002, and / or other transport devices for sequentially transporting multiple product substrate conveyor frames 214, each of which holds a product substrate.

[0098] In some cases, the handling stations of the conveyor system 1000 may include one or more printing stations 1004. An unprinted product substrate is transported to the printing station 1004 so that a circuit trace can be printed thereon. When there are multiple printing stations 1004, the multiple printing stations 1004 may be arranged in series and each may be configured to perform one or more printing operations to form a complete circuit trace.

[0099] Further, in the conveyor system 1000, the product substrate conveyor frame 214 may be transported to one or more die transfer stations 1006. When there are multiple die transfer stations 1006, the multiple die transfer stations 1006 may be arranged in series and each may be configured to perform one or more die transfers. At the transfer station, the product substrate may have one or more dies transferred and attached to the product substrate by a transfer operation using one or more of the direct transfer device embodiments described herein. For example, each transfer station 1006 may include a wafer tape transport mechanism, a transfer mechanism, and a fixation mechanism. In some cases, the product substrate may have circuit wiring fabricated on it in advance, and thus the product substrate may be transported directly to one or more transfer stations 1006.

[0100] In the transfer station 1006, the wafer tape transport mechanism, the transfer mechanism, and the fixturing mechanism may be aligned with respect to the transported product substrate conveyor frame 214 as it enters the station. In this situation, the components of the transfer station 1006 may repeatedly perform the same transfer operation at the same relative position for each product substrate as multiple product substrates are transported by the conveyor system 1000.

[0101] Additionally, the conveyor system 1000 may further include one or more finishing stations 1008 where the product substrate may be conveyed for final processing. The type, amount, and duration of final processing may depend on the characteristics of the product and the properties of the materials used to make the product. For example, the product substrate may receive extended curing times, protective coatings, additional components, etc. at the finishing stations 1008.

[0102] Second Exemplary Embodiment of the Direct Transfer Apparatus In another embodiment of the direct transfer apparatus, a "light string" may be formed, as shown in Figures 11A and 11B. Many of the features of the apparatus 1100 may remain substantially similar to those of the apparatus 200 of Figures 2A and 2B, but the product substrate transport mechanism 1102 may be configured to transport a product substrate 1104 that is different from the product substrate 212, as shown in Figures 11A and 11B. Specifically, in Figures 2A and 2B, the product substrate transport mechanism 202 includes a conveyor frame 214 and a tensioning frame 216, which secure the sheet-like product substrate 212 under tension. However, in the embodiment of Figures 11A and 11B, the product substrate transport mechanism 1102 may include a product substrate reel system.

[0103] The product substrate reel system may include one or two circuit wiring reels 1106 wound with a "string circuit," which may include a pair of adjacently wound conductive strings or wires as the product substrate 1104. In an example having only one reel, the reel 1106 may be located on a first side of the transfer station, and a pair of conductive strings (1104) may be wound on a single reel 1106. Alternatively, two circuit wiring reels 1106 may be located on the first side of the transfer station, with each reel 1106 including one strand of the string circuit, and the strands are grouped together and pass through the transfer station.

[0104] Regardless of whether one reel 1106 or two reels 1106 are implemented, the die transfer process to form the string circuit may be substantially similar in either case. Specifically, the conductive string of product substrate 1104 may be pulled from the reel 1106 across a transfer location and fed to a finishing device 1108. In some cases, the finishing device 1108 may be a coating device that applies a protective coating of, for example, translucent or transparent plastic, or a curing device that can complete the curing of the string circuit as part of the final processing of the product. Additionally or alternatively, the circuit string may be fed onto a separate reel that may wind the string circuit onto itself prior to final processing of the string circuit. As the conductive strings of the product substrate 1104 pass through the transfer position, the transfer mechanism 206 may be operated to perform a needle stroke (described above) to transfer the dies 220 to the conductive strings of the product substrate 1104, thereby positioning the electrical contact terminals of the dies 220 respectively on adjacent strings, and the fixing mechanism 208 may be operated to attach the dies 220 in the appropriate positions.

[0105] Additionally, the apparatus 1100 may include tensioning rollers 1110, which may support and further tension the conductive strings of the product substrate 1104. The tensioning rollers 1110 may thus facilitate maintaining tension in the formed string circuit to enhance die transfer accuracy.

[0106] In FIG. 11B, die 220 is shown as being transferred to the conductive strings of product substrate 1104, thereby joining (to some extent) the conductive strings of product substrate 1104 to form string circuits.

[0107] Third Exemplary Embodiment of the Direct Transfer Apparatus In another embodiment of a direct transfer apparatus, as shown in Figure 12, an apparatus 1200 may include a wafer tape transport mechanism 1202. Specifically, instead of the wafer tape conveyor frame 222 and tension frame 224 shown in Figures 2A and 2B, the wafer tape transport mechanism 1202 may include a system of one or more reels 1204 to transport the dies 220 through a transfer position of the apparatus 1200 and transfer the dies to a single substrate. Specifically, each reel 1204 may include a substrate 1206 formed as a narrow, continuous, elongated strip to which the dies 220 are successively attached along the length of the strip.

[0108] If a single reel 1204 is used, the transfer operation may include transporting the product substrate 210 through the product substrate transport mechanism 202 substantially as described above using motors, tracks and gears. However, the wafer tape transport mechanism 1202 may comprise a substantially stationary mechanism in that it may continuously feed the die 220 through the transfer position by unwinding the substrate 1206 from the reel 1204, but the reel 1204 itself remains held in a fixed position. In some cases, tension in the substrate 1206 may be maintained for stability purposes by tension rollers 1208 and / or tension reels 1210, which may be located on the side of the apparatus 1200 opposite the reel 1204. The tension reel 1210 may wind up the substrate 1206 after the die has been transferred. Alternatively, tension may be maintained by any other suitable means of securing the substrate 1206 to facilitate pulling the substrate through the transfer position after each transfer operation to cycle the die 220.

[0109] In embodiments using multiple reels 1204, each reel 1204 may be positioned horizontally adjacent to the other reels 1204. Each reel 1204 may be paired with a specific transfer mechanism 206 and a specific clamping mechanism 208. In this case, each respective set of transfer mechanisms and clamping mechanisms may be arranged with respect to the product substrate 210 such that multiple dies can be simultaneously placed at multiple locations on the same product substrate 210. For example, in some cases, each transfer location (i.e., the alignment of a transfer mechanism with its corresponding clamping mechanism) may be in line, offset, or staggered to accommodate various circuit wiring patterns.

[0110] Regardless of whether one reel 1204 or multiple reels 1204 are implemented, the die transfer operation may be relatively similar to the transfer operation described above with respect to the first exemplary embodiment of the direct transfer apparatus 200. For example, the product substrate 210 may be transported to a transfer position (die fixing position) via the product substrate transport mechanism 202 as described above, the transfer mechanism 206 may perform a needle stroke to transfer the die 220 from the die substrate 1206 to the product substrate 210, and the fixing mechanism 208 may operate to facilitate attachment of the die 220 to the product substrate 210.

[0111] It should be noted that in embodiments having multiple reels 1204, the circuit wiring pattern may be such that not all transfer mechanisms need to be operated simultaneously, and accordingly, multiple transfer mechanisms may be operated intermittently as product substrates are transported to various locations for transfer.

[0112] Fourth Exemplary Embodiment of the Direct Transfer Apparatus 13 illustrates an embodiment of a direct transfer apparatus 1300. Similar to FIGS. 2A and 2B, the product substrate transport mechanism 202 may be positioned adjacent to the wafer tape transport mechanism 204. However, there is a space between the transport mechanism 202 and the transport mechanism 204 in which a transfer mechanism 1302 may be positioned to perform the transfer of the die 220 from the wafer tape 218 to the product substrate 210.

[0113] The transfer mechanism 1302 may include a collet 1304 that picks one or more dies 220 at a time from the wafer tape 218 and rotates about an axis A that extends through an arm 1306. For example, FIG. 13 shows the wafer tape 218 facing the product substrate 210 such that the collet 1304 can pivot 180 degrees about a pivot point 1308 (see arrow indicating the direction of pivot) between the die-carrying surface of the wafer tape 218 and the transfer surface of the product substrate 210. That is, the extension direction of the collet 1304 pivots in a plane that is perpendicular to the surfaces or transfer planes of both the wafer tape 218 and the product substrate 210. Alternatively, in some embodiments, the collet arm structure may be arranged to pivot between two parallel surfaces, and the collet arms may pivot along parallel planes. Thus, when facing the wafer tape 218, the collet 1304 may pick up the die 220 and immediately pivot to the surface of the product substrate 210 so as to align with the fastening mechanism 208. The collet 1304 then peels the die 220 away to transfer the die 220 to be attached to the circuit traces 212 on the product substrate 210.

[0114] In some cases, the transfer mechanism 1302 may include two or more collets (not shown) extending in different directions from the arm. In such an embodiment, the collets may be rotationally indexed 360 degrees through the collet stops, and one collet may pick and transfer a die each time it passes over the wafer tape 218.

[0115] Additionally, one or more collets 1304 may pick and release the die 220 from the wafer tape using positive or negative vacuum pressure by the collet 1304 .

[0116] Fifth Exemplary Embodiment of the Direct Transfer Apparatus In another embodiment of the direct transfer apparatus, multiple needles may be used, as shown in FIG. 14. Many of the features of the apparatus 1400 may remain substantially similar to those of the apparatus 200 of FIGS. 2A and 2B, however, multiple needles 226 may be implemented in the machine to transfer multiple dies 220 simultaneously or substantially simultaneously (e.g., within microseconds or milliseconds of each other). Although a set of three needles 226 is shown in FIG. 14, a machine implementing multiple needle technology may include more than two. For example, the multiple needles 226 may include 2, 3, 9, 24, etc., numbers of needles, as well as any number between or greater than the exemplary numbers.

[0117] Regardless of the number, the individual needles of the multiple needles 226 may be independently operable, allowing the individual needles of the multiple needles 226 to operate alone and / or sequentially, as well as in one or more groups. For example, the multiple needles 226 may be independently movable in three-dimensional space, allowing the multiple needles 226 to operate independently of one another. In such an embodiment, by implementing a head or cluster of multiple needles 226, the machine can transfer die in a manner that can be more efficient than a machine implementing a single needle 226. For example, a machine implementing multiple needles 226 can transfer multiple dies 220 at one time as the transfer mechanism 206 moves over the product substrate 210. Transferring multiple dies 220 with a head with multiple needles 226 or a cluster of multiple needles 226 can significantly reduce the total transfer time as well as the circuit substrate formation time, since it reduces the travel distance that the transfer mechanism 206 would otherwise have to travel. In one embodiment, the multiple needles 226 may operate synchronously or sequentially. However, in other embodiments, as noted above, one or more, but less than all, of the plurality of needles 226 may be operated simultaneously or substantially simultaneously.

[0118] In one embodiment, control of the needles 226 may be coordinated to avoid collisions between components of the apparatus 1400. To this end, the needles 226 may be operated via a needle actuator 228. The needle actuator 228 may comprise a motor that connects to the needles 226 and moves the needles 226 toward the wafer tape 218 for a predetermined / programmed time. In one embodiment, the needle actuator 228 may comprise an electromechanical actuator. However, other types of actuators may be implemented in other embodiments. For example, the needle actuator 228 may comprise one or more return springs (not shown) to facilitate the return of the needles 226 to a neutral position, as shown in FIG. 14 .

[0119] In one embodiment, the multiple needles 226 may be arranged in fixed positions relative to one another. For example, the multiple needles 226 may be clustered in a predefined pattern. Each needle of the multiple needles 226 may be formed of the same material and / or have the same shape. For example, each needle 226 of the multiple needles 226 may be similar in size and shape to the needles described with respect to FIG. 3 above. In one embodiment, the multiple needles 226 may comprise a uniform multiple needles 226, meaning that all needles selected for use may be substantially identical in material and size. Alternatively, in another embodiment, one or more of the multiple needles 226 within the same multiple needles implemented may be formed of a different material and may have a different size and / or shape than one or more other needles. In such an embodiment, the transfer mechanism 206 may have multiple types of needles 226 for different applications without the need to change the needles 226 (or heads / clusters of needles) within the transfer mechanism 206.

[0120] In one embodiment, the transfer mechanism 206 may comprise a configuration similar to a needle / head configuration used in a dot matrix printer device, where the transfer mechanism 206 may comprise multiple needles grouped at predetermined locations in a predetermined matrix carried by a single head unit. For example, the transfer mechanism 206 may comprise two or more needles 226 arranged in a pattern, where the pattern may be circular, rectangular, linear, etc. The frame 1402 (also referred to as a needle guide or needle guide with housing) may operate to guide the multiple needles 226 to specific locations in the matrix configuration. For example, the transfer mechanism may comprise seven needles 226 grouped in a 7x1 matrix, where the matrix comprises seven rows and one column of needles. However, any variation of the matrix may be used in the transfer mechanism 206 (i.e., the transfer mechanism 206 may comprise any number of columns and rows containing any number of needles 226, and the multiple needles 226 may be offset and / or staggered with respect to one another so as not to be in rows and columns).

[0121] In one embodiment, the frame 1402 may guide each of the needles of the plurality of needles 226 into a respective opening 1404 in the frame 1402. Additionally and / or alternatively, in one embodiment, the transfer mechanism 206 may not include a frame 1402. In such an embodiment, the plurality of needles 226 may be driven from a cluster as shown in FIG. 14 and may move in a straight up and down direction rather than being guided from the cluster configuration into specific alignment with the respective openings 1404.

[0122] In some embodiments, the transfer mechanism 206 may exhibit a scanning motion when transferring the dies 220. For example, the transfer mechanism 206 may move continuously to predetermined locations and positions relative to the product substrate 210 to transfer the corresponding dies 220. In such exemplary embodiments, the product substrate 210 may remain stationary while the transfer mechanism 206 moves freely. However, in other embodiments, the product substrate 210 may move relative to the transfer mechanism 206 while the transfer mechanism 206 remains stationary. In yet another embodiment, both the transfer mechanism 206 and the product substrate 210 may be configured to move relative to one another. The transfer mechanism 206 may be capable of moving in any direction relative to any one of the substrates. For example, the transfer mechanism 206 may be capable of moving in the X, Y, and Z directions and / or in multiple directions simultaneously.

[0123] In one embodiment, the transfer mechanism 206 may use one or more of the multiple needles 226 to ensure that the product substrate 210 remains stationary or that the semiconductor die 220 remains in the correct orientation while the multiple dies 220 are transferred. For example, two non-adjacent needles 226 may be operated (i.e., lowered from a neutral or final state) to hold the product substrate 210 in place, while one or more other needles 226 are used to transfer one or more dies 220 either simultaneously or synchronously. Additionally, the transfer mechanism 206 may implement a specific needle 226 to hold the product substrate 210 each time. Additionally and / or alternatively, the transfer mechanism 206 may be configured and / or programmed to designate a different needle 226 to hold the product substrate each time a die 220 is transferred. In such an embodiment, the needle 226 used may be selected based on the position and / or configuration of the die 220 to be transferred.

[0124] Example clauses A: An apparatus having a transfer mechanism that transfers an electrically operable element directly from a wafer tape to a transfer position on a circuit wiring, the transfer mechanism comprising two or more needles and a needle actuator configured to move the two or more needles toward and away from the transfer position.

[0125] B: The apparatus of clause A, wherein the needle actuator is configured to operate two or more needles sequentially, synchronously, or in any combination thereof.

[0126] C: The device of any one of clauses A or B, wherein the two or more needles are operable independently of each other.

[0127] D: An apparatus described in any one of clauses A to C, wherein the two or more needles are positioned in fixed positions relative to each other.

[0128] E: The device of any one of clauses A to D, wherein the needle actuator includes an electromechanical actuator, the needle actuator comprising one or more return springs.

[0129] F: An apparatus described in any one of clauses A-E, wherein the needle actuator is configured to operate at least one of the two or more needles to stabilize the circuit wiring for transferring an electrically operable element to the circuit wiring.

[0130] G: The apparatus of any one of clauses A-F, wherein the apparatus is configured for transfer of an electrically operable element, the element being a micro-sized unpackaged LED, the height of the micro-sized unpackaged LED being in the range of 12.5 microns to 200 microns, 25 microns to 100 microns, or 50 microns to 80 microns.

[0131] H: An apparatus for performing direct transfer of one or more semiconductor device dies from a wafer tape to a substrate, the apparatus comprising: a product substrate frame for securing a substrate, the product substrate frame having a first side and a second side; a die substrate frame for securing a wafer tape holding a plurality of semiconductor device dies, the die substrate frame being positioned adjacent to the first side of the product substrate frame; and a transfer mechanism positioned adjacent to the die substrate frame for transferring the semiconductor device dies from the wafer tape when the wafer tape is secured to the die substrate frame, the transfer mechanism comprising at least two or more needles.

[0132] I: The apparatus of clause H, wherein the two or more needles are positioned in fixed positions relative to each other.

[0133] J: The apparatus of any one of clauses H or I, wherein each of the two or more needles is substantially uniform in size and shape.

[0134] K: An apparatus described in any one of clauses H to J, wherein the transfer mechanism includes a guide for positioning two or more needles at specific positions of the matrix configuration throughout the entire transfer operation.

[0135] L: The apparatus of any one of clauses H-K, wherein two of the product substrate, die substrate, and transfer mechanism move across the die substrate in a continuous motion.

[0136] M: An apparatus described in any one of clauses H to L, wherein the transfer mechanism operates at least a first needle of the two or more needles to hold the semiconductor device die in a substantially fixed position when at least a second needle of the two or more needles transfers the semiconductor device die from the die substrate.

[0137] N: An apparatus described in any one of clauses H-M, wherein the transfer mechanism is configured to operate at least one of the two or more needles based at least in part on a position of the transfer mechanism.

[0138] O: An apparatus for performing direct transfer of one or more semiconductor device dies from a wafer tape to a substrate, the apparatus comprising: a first frame configured to hold the wafer tape; a second frame configured to fix the substrate, the second frame configured to hold the substrate such that a transfer surface is positioned facing one or more semiconductor device dies on a first side of the wafer tape; two or more needles positioned adjacent a second side opposite the first side of the wafer tape, wherein lengths of the two or more needles extend in a direction toward the wafer tape; and a needle actuator configured to operate the two or more needles to a die transfer position where at least one needle of the two or more needles presses against the second side of the wafer tape to press one of the one or more semiconductor device dies into contact with the transfer surface of the substrate.

[0139] P: The apparatus of clause O, wherein each needle of the two or more needles is independently operable.

[0140] Q: An apparatus described in any one of clauses O or P, wherein the needle actuator is configured to enable two or more needles to operate synchronously.

[0141] R: An apparatus described in any one of clauses O-Q, wherein the needle actuator is configured to enable sequential operation of two or more needles.

[0142] S: The apparatus of any one of clauses O-R, wherein the needle actuator comprises an electromechanical actuator.

[0143] T: An apparatus described in any one of clauses O-S, wherein the needle actuator comprises one or more return springs.

[0144] conclusion Although some embodiments have been described in language specific to structural features and / or methodological acts, it should be understood that the claims are not necessarily limited to the specific features and acts described. Rather, the specific features and acts are disclosed as exemplary forms of implementing the claimed subject matter. Moreover, as used herein, the term "may" is used to indicate the possibility of a particular feature being used in one or more various embodiments, but not necessarily in all embodiments.

Claims

1. 1. An apparatus for performing direct transfer of one or more semiconductor device dies from a wafer tape to a substrate, the apparatus comprising: a first frame configured to hold the wafer tape; a second frame configured to secure the substrate, the second frame configured to hold the substrate such that a transfer surface is disposed facing the one or more semiconductor device dies on a first side of the wafer tape held by the first frame, the first frame disposed adjacent to the second frame; two or more needles disposed adjacent a second surface of the wafer tape opposite the first surface, the two or more needles having lengths extending in a direction toward the wafer tape; a needle actuator configured to individually operate the two or more needles to each of die transfer locations where at least one needle of the two or more needles presses against the second surface of the wafer tape to press one of the one or more semiconductor device dies into contact with the transfer surface of the substrate; and a guide for positioning the two or more needles at specific locations in a matrix configuration, the guide maintaining the matrix configuration of the two or more needles throughout a transfer operation; and Equipped with each of the two or more needles is configured to be independently movable in three-dimensional space; the two or more needles are at least partially clustered; One or more of the two or more clustered needles are formed of different materials or have different sizes and / or shapes. An apparatus comprising:

2. 10. The device of claim 1, wherein the needle actuator is configured to allow the two or more needles to move in a synchronized manner.

3. 10. The device of claim 1, wherein the needle actuator is configured to allow sequential movement of the two or more needles.

4. The device of claim 1 , wherein the needle actuator comprises an electromechanical actuator.

5. 10. The device of claim 1, wherein the needle actuator comprises one or more return springs.

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