Electronic device, imaging device, and mobile object

Abstract

Provided are an electronic device, an imaging device, and a mobile object that can be further miniaturized while having shielding properties against radiation noise. [Solution] The electronic device includes an electronic component, a substrate on which the electronic component is mounted, and a cylindrical housing. The housing includes a first cylindrical metal sheet that covers the electronic component and the substrate from the outer periphery of the substrate, and a second cylindrical metal sheet that is joined to the first metal sheet from the radially inner side, and portions of the first metal sheet and the second metal sheet are covered with resin.

Description

[Technical field]

[0001] The present disclosure relates to an electronic device, an imaging device, and a moving object. [Background technology]

[0002] There is a demand for electronic devices such as vehicle-mounted cameras to be compact and perform a variety of processing at high speed. As the circuit board becomes more highly integrated to achieve miniaturization, the radiation noise of electronic devices on the circuit board increases. Therefore, a configuration has been proposed in which the entire side surface of the circuit board is covered with a shielding material (see Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2011-259101 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, there is a demand for electronic devices that can be further miniaturized while still having the ability to block radiation noise.

[0005] Therefore, an object of the present disclosure, made in consideration of the problems with the conventional techniques as described above, is to provide an electronic device, an imaging device, and a mobile object that enable further miniaturization while providing shielding against radiated noise. [Means for solving the problem]

[0006] In order to solve the above-mentioned problems, an electronic device according to a first aspect comprises: Electronic components, A substrate on which the electronic components are mounted; a cylindrical housing including a first metal plate that is a cylindrical metal plate covering the electronic components and the substrate from an outer circumferential direction of the substrate, and a second metal plate that is a cylindrical metal plate joined to the first metal plate from a radially inner side, and a portion of the first metal plate and the second metal plate are covered with a resin; Equipped with.

[0007] Moreover, an imaging apparatus according to a second aspect comprises: An imaging optical system; an electronic component including at least an image sensor; A substrate on which the electronic components are mounted; a cylindrical housing including a first metal plate that is a cylindrical metal plate covering the electronic components and the substrate from an outer circumferential direction of the substrate, and a second metal plate that is a cylindrical metal plate joined to the first metal plate from a radially inner side, and a portion of the first metal plate and the second metal plate are covered with a resin; Equipped with.

[0008] Moreover, a moving body according to a third aspect of the present invention is An imaging optical system; an electronic component including at least an image sensor; A substrate on which the electronic components are mounted; a cylindrical housing including a first metal plate that is a cylindrical metal plate covering the electronic components and the substrate from an outer circumferential direction of the substrate, and a second metal plate that is a cylindrical metal plate joined to the first metal plate from a radially inner side, and a portion of the first metal plate and the second metal plate are covered with a resin; The imaging device is equipped with Effect of the Invention

[0009] According to the electronic device, imaging device, and mobile object according to the present disclosure configured as described above, it is possible to further reduce the size while maintaining shielding properties against radiation noise. [Brief description of the drawings]

[0010] [Figure 1] 1 is a layout diagram showing a mounting position of an electronic device in a moving object according to an embodiment; [Diagram 2] 2 is a cross-sectional view showing a schematic configuration of the electronic device of FIG. 1, taken along the optical axis of an imaging optical system. [Diagram 3] 2 is a perspective view showing the appearance of a first housing in FIG. 1. [Figure 4] 4 is a cross-sectional view of the first housing of FIG. 3 cut in the axial direction along line AA' of FIG. 3. [Diagram 5] FIG. 3 is a perspective view showing the appearance of the first metal plate in FIG. 2. [Figure 6] FIG. 3 is a perspective view showing the appearance of the second metal plate in FIG. 2. [Figure 7] 3 is a perspective view showing the appearance of the third metal plate in FIG. 2. FIG. [Figure 8] 3 is a perspective view showing the external appearance of the first substrate, the second substrate, and the third metal plate in FIG. 2 in a state where they are joined together. FIG. [Figure 9] 4 is a schematic diagram showing the external appearance of the first housing in FIG. 3 from the second opening side. FIG. [Figure 10] 3 is a partially exploded perspective view of a third housing of FIG. 2. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, an electronic device, an imaging device, and a moving object according to an embodiment of the present disclosure will be described with reference to the drawings.

[0012] The electronic device according to the embodiment is, for example, an imaging device. As shown in FIG.

[0013] The moving body 11 may include, for example, vehicles, ships, and aircraft. The vehicles may include, for example, automobiles, industrial vehicles, railroad vehicles, residential vehicles, and fixed-wing aircraft that run on runways. The automobiles may include, for example, passenger cars, trucks, buses, motorcycles, and trolley buses. The industrial vehicles may include, for example, industrial vehicles for agriculture and construction. The industrial vehicles may include, for example, forklifts and golf carts. The industrial vehicles for agriculture may include, for example, tractors, cultivators, transplanters, binders, combines, and lawnmowers. The industrial vehicles for construction may include, for example, bulldozers, scrapers, excavators, cranes, dump trucks, and road rollers. The vehicles may include those that run by human power. The classification of the vehicles is not limited to the above examples. For example, the automobiles may include industrial vehicles that can run on roads. The same vehicle may be included in multiple classifications. The ships may include, for example, marine jets, boats, and tankers. Aircraft may include, for example, fixed wing aircraft and rotary wing aircraft.

[0014] 2, the electronic device 10 includes an imaging optical system 12, electronic components 13, a first board (substrate) 14, a second board 15, a first housing (housing) 16, a second housing 17, and a third housing 18. The electronic components 13 may include at least an imaging element 19. In this embodiment, the electronic device 10 is formed by housing the electronic components 13 in a cylindrical first housing 16 or the like. In the present disclosure, the axis of the electronic device 10 refers to the axis of the first housing 16 in the electronic device 10.

[0015] The imaging optical system 12 is composed of optical elements such as lenses. The imaging optical system 12 is designed and formed so that optical characteristics such as the angle of view and the depth of field are set to desired values. The imaging optical system 12 forms a focused subject image on the light receiving surface of the imaging element 19.

[0016] The imaging element 19 is, for example, a charge coupled device (CCD) image sensor or a complementary metal oxide semiconductor (CMOS) image sensor, and generates an image signal by capturing an optical image formed on a light receiving surface.

[0017] The first substrate 14 is a flat member. The first substrate 14 may be substantially rectangular. The first substrate 14 has electronic components 13 including an imaging element 19 mounted on a main surface. The first substrate 14 has the imaging element 19 mounted on a main surface that is joined to a joint 29 of the first housing 16. The first substrate 14 may further have electronic components 13 mounted on at least one of the main surface on which the imaging element 19 is mounted and the main surface opposite to the main surface. The electronic components 13 drive the imaging element 19 or process an image signal generated by the imaging element 19.

[0018] The second substrate 15 is a flat member. The second substrate 15 may be substantially rectangular. The second substrate 15 has electronic components 13 mounted on at least one of its main surfaces. The second substrate 15 may be electrically connected to the first substrate 14 by, for example, a flexible substrate or a connector. The second substrate 15 may further have a connector 20A mounted on one of its main surfaces for electrically connecting to a connector 20B of the third housing 18.

[0019] The first substrate 14 and the second substrate 15 are positioned toward the axial direction of the electronic device 10 so that their respective main surfaces face each other. In this embodiment, a heat dissipation sheet 21 is provided between the first substrate 14 and the second substrate 15 so as to abut against each of the first substrate 14 and the second substrate 15. The heat dissipation sheet 21 may be formed of a material that is soft and has shape-following properties and relatively high thermal conductivity, such as silicone rubber containing a filler.

[0020] As shown in Fig. 3 and Fig. 4, the first housing 16 is a cylindrical housing. Fig. 4 is a cross-sectional view of the first housing 16 shown in Fig. 3 cut in the axial direction at line segment A-A'. As shown in Fig. 4, the first housing 16 includes a first metal plate 22, a second metal plate 23, a third metal plate 24, and a resin part 25. The first housing 16 is formed by so-called insert molding, in which a resin material such as polyamide is injected into a mold or the like in which the first metal plate 22, the second metal plate 23, and the third metal plate 24 are previously placed to form the resin part 25.

[0021] The resin part 25 is composed of a first opening 26, a cylindrical part 27, and a second opening 28, which are continuous in the axial direction of the first housing 16. The first opening 26 may be a cylindrical shape with a substantially circular cross section that extends continuously in the axial direction from one end of the cylindrical part 27. The cylindrical part 27 may be a cylindrical shape with a substantially rectangular cross section. The second opening 28 may be a substantially rectangular cylindrical shape that continues in the axial direction from one end of the cylindrical part 27 opposite to the one end that is continuous with the first opening 26, and protrudes in the radial direction from the cylindrical part 27. As described above, the resin part 25 is formed of a resin material such as polyamide, but is not limited thereto and may be formed of any resin material.

[0022] 2, in the electronic device 10 according to this embodiment, the first housing 16 houses the imaging optical system 12 such that the optical axis of the imaging optical system 12 substantially coincides with the axis of the first housing 16 and the imaging optical system 12 is exposed from the first opening 26. For this reason, the first housing 16 may be provided with a female screw for fixing the imaging optical system 12 on at least a part of the inner surface of the cylindrical portion 27, as shown in FIG.

[0023] 2, the first housing 16 may accommodate the first substrate 14 so that the imaging element 19 is fixed at a fixed position with respect to the imaging optical system 12 in a fixed attitude. Specifically, the first housing 16 may accommodate the first substrate 14 so that a straight line extending vertically from the center of the light receiving surface of the imaging element 19 coincides with the optical axis. For this purpose, as shown in FIG. 4, the first housing 16 is provided with a planar joint 29 that is approximately perpendicular to the axial direction on at least a part of the inner surface of the cylindrical portion 27. In this embodiment, as shown in FIG. 9, in the first housing 16, the joint 29 is ring-shaped when viewed perpendicular to the axial direction from the second opening 28 side, and is formed so as to be able to accommodate the imaging element 19 on the radially inner side. As shown in FIG. 2, in this embodiment, the joint 29 is adhesively fixed to the main surface of the first substrate 14 on which the imaging element 19 is mounted, so that the imaging element 19 is positioned radially inward when the first housing 16 accommodates the first substrate 14.

[0024] Furthermore, as shown in Fig. 4, the first housing 16 has a mold receiving portion 30 formed in the cylindrical portion 27 so as to surround the radially outer periphery of the joint portion 29. The mold receiving portion 30 is a groove extending approximately parallel to the axial direction from the second opening 28 side toward the first opening 26 side. In this embodiment, as shown in Fig. 9, the mold receiving portion 30 is a groove having an approximately rectangular outer periphery and an approximately circular inner periphery when viewed perpendicular to the axial direction from the second opening 28 side.

[0025] The following describes the first metal plate 22, the second metal plate 23, and the third metal plate 24 that are insert molded into the first housing 16. As shown in Fig. 5, the first metal plate 22 has a generally cylindrical shape with a substantially rectangular cross section. The first metal plate 22 has a first peripheral wall portion 31 and a first flat plate portion 32.

[0026] The first peripheral wall portion 31 is tubular and has a substantially rectangular cross section. As shown in Fig. 2, in the electronic device 10, the first peripheral wall portion 31 covers the first board 14, the second board 15, and the electronic components 13 mounted thereon, such as the imaging element 19, from the radial outside, i.e., from the outer periphery of the first board 14 and the second board 15.

[0027] As shown in FIG. 5, the first flat plate portion 32 is substantially flat. The first flat plate portion 32 extends radially inward from one end in the axial direction of the first peripheral wall portion 31. The area surrounded by the outer edge of the first flat plate portion 32 may be substantially rectangular and larger than the main surfaces of the first substrate 14 and the second substrate 15. The first flat plate portion 32 is provided with an opening for exposing the imaging optical system 12 when the imaging optical system 12 is accommodated. As shown in FIG. 2, in the electronic device 10, the first flat plate portion 32 faces at least a part of the main surfaces of the first substrate 14 and the second substrate 15 and covers at least a part of the main surfaces.

[0028] As shown in FIG. 5, a drawn portion 33 is provided on the outer edge of the first flat plate portion 32, extending from the first flat plate portion 32 to the first peripheral wall portion 31. The drawn portion 33 may be provided at a position facing an injection port through which resin is injected from vertically above into a mold in a state in which the first metal plate 22 is placed in a mold or the like so that the first flat plate portion 32 faces vertically upward during insert molding of the first housing 16. In this embodiment, the first metal plate 22 is provided with the drawn portion 33 at each of the four corners of the substantially rectangular first flat plate portion 32. The drawn portion 33 has a shape recessed into the inside of the cylindrical first metal plate 22.

[0029] The first metal sheet 22 is formed by pressing or bending a predetermined portion of a metal sheet, in other words, a substantially cylindrical metallic flat plate. This allows the first metal sheet 22 to be formed seamlessly. The first metal sheet 22 is formed of an alloy such as nickel silver, but is not limited thereto, and may be formed of any metal.

[0030] 6, the second metal plate 23 has a generally rectangular tubular shape as a whole. The second metal plate 23 has a second peripheral wall portion 34, a second flat plate portion 35, and a folded portion 36.

[0031] The second peripheral wall portion 34 is tubular and has a substantially rectangular cross section. The outer periphery of the second metal plate 23 substantially coincides with the inner periphery of the first metal plate 22.

[0032] The second flat plate portion 35 is substantially flat. The second flat plate portion 35 extends radially inward from one axial end of the second peripheral wall portion 34. In this embodiment, the second flat plate portion 35 is formed by bending each of the four side walls of the second peripheral wall portion 34 radially inward and substantially horizontally with respect to the axial direction. The second flat plate portion 35 is provided with an opening through which the imaging optical system 12 is exposed when the imaging optical system 12 is accommodated.

[0033] The folded portion 36 is cylindrical. The folded portion 36 is formed along the end of the second peripheral wall portion 34 opposite to the one end continuing to the second flat plate portion 35. More specifically, the folded portion 36 is formed by folding back each of the four side walls constituting the second peripheral wall portion 34 toward the radially inward direction, so that the end of the side wall contacts the inner surface of the second peripheral wall portion 34. The end of the four side walls described above may be joined to the inner surface of the second peripheral wall portion 34 by welding or the like. At least one inflow hole 37 is provided on the surface of the sheet metal forming each folded portion 36 facing the inner space. The inflow hole 37 can allow the resin material to flow into the cylindrical interior of the folded portion 36 when the second sheet metal 23 is placed in a mold or the like and the resin material is poured in during the insert molding of the first housing 16.

[0034] The second metal sheet 23 is formed by pressing or bending a predetermined portion of a metal sheet, in other words, a substantially cylindrical metallic flat plate. The second metal sheet 23 is formed of an alloy such as nickel silver, but is not limited thereto, and may be formed of any metal. The second metal sheet 23 may be formed of the same material as the first metal sheet 22. The thickness of the second metal sheet 23 may be thicker than the thickness of the first metal sheet 22.

[0035] 7, the third metal plate 24 may be a substantially rectangular metal plate bent so that a cross section perpendicular to the longitudinal direction is L-shaped. The third metal plate 24 is provided with at least one inlet hole so as not to impede the flow of the resin material poured in during the insert molding of the first housing 16.

[0036] The third metal plate 24 is formed by pressing or bending a predetermined portion of a metal plate, in other words, a metal flat plate. The third metal plate 24 may be formed of the same material as the first metal plate 22.

[0037] As shown in FIG. 8, the first metal sheet 22, the second metal sheet 23, and the third metal sheet 24 are joined to each other by welding. The second metal sheet 23 is joined to the first metal sheet 22 from the radially inner side. Specifically, the second metal sheet 23 is inserted inside the first metal sheet 22 so that the opening of the second flat plate portion 35 and the opening of the first flat plate portion 32 overlap. The second flat plate portion 35 is welded to the first flat plate portion 32, and the second peripheral wall portion 34 is welded to a part of the first peripheral wall portion 31. Furthermore, the third metal sheet 24 is welded to the radially outer surface of the end portion opposite to the one end to which the first flat plate portion 32 is continuous, of each of the four side walls constituting the first peripheral wall portion 31. In this embodiment, the first metal plate 22, the second metal plate 23, and the third metal plate 24 are joined to each other by welding, but this is not limited to this and they may be joined by fastening with rivets, bonding with an adhesive, etc.

[0038] As described above, the first metal plate 22, the second metal plate 23, and the third metal plate 24, which are welded to each other, are placed in a mold or the like, and a resin material such as polyamide is injected by insert molding to form the first housing 16.

[0039] 4 again, the shape of the first housing 16 formed by insert molding will be further described. The resin part 25 is formed so as to cover a part of the inner peripheral surface and the entire outer peripheral surface of the first metal plate 22 and the second metal plate 23 in a cross section perpendicular to the axial direction of the first housing 16. The resin part 25 is also filled into the cylindrical interior of the folded-back part 36 of the second metal plate 23.

[0040] The first metal plate 22 is provided in the first housing 16 such that the first flat plate portion 32 is located on the first opening 26 side, and the axis of the first metal plate 22 is substantially aligned with the axis of the first housing 16. In this embodiment, the first peripheral wall portion 31 of the first metal plate 22 extends across the cylindrical portion 27 of the resin portion 25 and the second opening 28. At least a portion of the first metal plate 22, more specifically, at least a portion of the first peripheral wall portion 31 located on the second opening 28 side, is exposed to the inner space of the first housing 16 in the first housing 16. As shown in FIG. 2, in this embodiment, the portion of the first metal plate 22 is in contact with the side of the heat dissipation sheet 21 in the electronic device 10. As a result, the first metal plate 22 is in indirect contact with the electronic components 13 such as the imaging element 19 via at least one of the heat dissipation sheet 21, the first board 14, and the second board 15.

[0041] As shown in FIG. 4, the second metal sheet 23 is provided in the first housing 16 such that the second flat plate portion 35 is located on the first opening 26 side, and the axis of the second metal sheet 23 approximately coincides with the axis of the first housing 16. In this embodiment, the second metal sheet 23 is provided to extend between one end of the cylindrical portion 27 that is continuous with the first opening 26 and the joint portion 29. At least a part of the second metal sheet 23 is exposed from the mold receiving portion 30 in the first housing 16 to the inner space of the first housing 16. As shown by hatching in FIG. 9, the part of the second metal sheet 23 exposed from the mold receiving portion 30 may be at least a part of the second flat plate portion 35 and the folded portion 36. At least a portion of the second metal plate 23 exposed to the inner space of these first housings may be in direct contact with a mold or the like when the second metal plate 23 is placed in the mold or the like during insert molding of the first housing 16.

[0042] As shown in FIG. 2, the second housing 17 may be a cylinder having a rectangular cross section. The second housing 17 is provided in the electronic device 10 so as to cover the first housing 16. More specifically, the second housing 17 is provided so as to cover the first peripheral wall portion 31 and the first flat plate portion 32 of the first housing 16. The second housing 17 may house the imaging optical system 12 and the first housing 16 in the electronic device 10 such that the optical axis of the imaging optical system 12 substantially coincides with the axis of the second housing 17 and the imaging optical system 12 is exposed from one opening. The second housing 17 may be formed of a resin material such as polyamide.

[0043] The third housing 18 may have a box shape with one side open. The third housing 18 may be sealed at the flat portion to an opening on the side of the first housing 16 opposite to the side exposing the imaging optical system 12, i.e., on the image side in the optical axis direction of the imaging optical system 12. As shown in FIG. 10, the third housing 18 may have the above-mentioned connector 20B, a fourth metal plate 38, and a conductive rubber 39.

[0044] The fourth metal plate 38 has a shape including a flat portion and a generally rectangular tubular portion extending generally perpendicularly from the outer edge of the main surface of the flat portion. As shown in Fig. 2, the fourth metal plate 38 faces at least a part of the main surfaces of the first substrate 14 and the second substrate 15 in the electronic device 10 and covers at least a part of the main surfaces.

[0045] As shown in Fig. 10, the conductive rubber 39 may be a ring-shaped rubber material having electrical conductivity. The conductive rubber 39 is fixed to the periphery of the end of the substantially rectangular prism portion of the fourth metal plate 38 opposite to the end continuing to the flat plate portion. As shown in Fig. 2, the conductive rubber 39 abuts against the first metal plate 22 of the first metal plate 16 in a state in which the first housing 16 and the third housing 18 are sealed together. As a result, the conductive rubber 39 physically seals the gap between the first housing 16 and the third housing 18, and also connects the first metal plate 22 and the fourth metal plate 38 in an electrically conductive and thermally conductive manner.

[0046] The first housing 16, the second housing 17, and the third housing 18 are fixed by sandwiching a radially protruding portion of the second opening 28 of the first housing 16 between the second housing 17 and the third housing 18 in the axial direction. The first housing 16, the second housing 17, and the third housing 18 are fixed by, for example, fastening with screws, but are not limited to this, and may be fixed by welding, adhesion with an adhesive, or the like.

[0047] In the electronic device 10 according to the embodiment configured as described above, the first board 14 and the second board 15 are covered from the radial outside all around by the first metal plate 22. With this configuration, the electronic device 10 can have a shielding effect against radiation noise from the electronic components 13, including the imaging element 19, mounted on the first board 14 and the second board 15.

[0048] In the electronic device 10 according to the embodiment, the first metal plate 22 and the second metal plate 23 are included in the first housing 16. Since the first housing 16 itself has a structure including metal plates in this manner, the internal space of the first housing 16 can be made larger, and the first housing 16, and therefore the electronic device 10, can be made smaller.

[0049] Furthermore, in the electronic device 10 according to the embodiment, the first housing 16 is formed by insert molding so that the first metal plate 22, the second metal plate 23, and the third metal plate 24 are covered with the resin part 25. With this configuration, the first housing 16 is less likely to change in size when the temperature of the electronic device 10 rises, compared to when the first housing 16 is formed only from resin. Therefore, the positions of the imaging optical system 12 and the imaging element 19 in the electronic device 10 are less likely to shift, and the focus of the lens of the electronic device 10, which is an imaging device, is less likely to shift.

[0050] Furthermore, in the electronic device 10 according to the embodiment, a portion of the first metal plate 22 and the second metal plate 23 are covered with resin. With such a configuration, in the electronic device 10, the first housing 16 can be easily configured to have any shape.

[0051] Therefore, as described above, the electronic device 10 according to the embodiment can be further miniaturized while having the ability to block radiation noise.

[0052] In the first housing 16 of the electronic device 10 according to the embodiment, a portion of the first metal plate 22 and the second metal plate 23 are covered with resin. This configuration allows the electronic device 10 to be lighter and less expensive than a case in which the first housing 16 is made only of metal by die casting or the like. In addition, since the outside of the first housing 16 is covered with resin, it is not necessary to paint the outer periphery as in a case in which the first housing 16 is made only of metal.

[0053] In the electronic device 10 according to the embodiment, the first metal plate 22 has a first peripheral wall portion 31 that covers the first substrate 14 and the second substrate 15 from the outer circumferential direction of the first substrate 14 and the second substrate 15, and a first flat plate portion 32 that extends radially inward from one end of the first peripheral wall portion 31. With this configuration, the electronic device 10 can have a shielding effect against radiation noise from the electronic components 13, including the imaging element 19, mounted on the first substrate 14 and the second substrate 15, even in the axial direction.

[0054] Moreover, in the first metal plate 22 of the electronic device 10 according to one embodiment, the first peripheral wall portion 31 and the first flat plate portion 32 are formed by pressing or bending without going through a process such as welding. With such a configuration, the first metal plate 22 can be manufactured with a simple configuration. Furthermore, since welding is not used to form the first metal plate 22, the risk of resin entering the welded portion during insert molding of the first housing 16 and causing problems such as deformation and breakage of the first metal plate 22 is reduced.

[0055] Moreover, in the first metal plate 22 of the electronic device 10 according to the embodiment, a drawing portion 33 is provided on the outer edge of the first flat plate portion 32, extending from the first flat plate portion 32 to the first peripheral wall portion 31. With this configuration, the electronic device 10 reduces the risk that the first metal plate 22 placed in a mold or the like will be deformed due to the pressure and heat of the poured resin during insert molding of the first housing 16.

[0056] Moreover, in the first metal plate 22 of the electronic device 10 according to the embodiment, the drawing portion 33 has a shape recessed into the cylindrical first metal plate 22. With this configuration, the thickness of the portion of the resin portion 25 of the first housing 16 that covers the outside of the first metal plate 22 can be made thicker, even if the external dimensions of the electronic device 10 are the same, compared to a case in which the drawing portion 33 is shaped to protrude outward from the first metal plate 22. This can improve the strength of the electronic device 10 against external impacts and the like.

[0057] In the electronic device 10 according to the embodiment, at least a part of the first metal plate 22 is exposed to the inner space of the first housing 16. With this configuration, compared to when the inner circumferential surface of the first metal plate 22 is covered with resin, heat in the inner space of the first housing 16 is more easily transferred to the first metal plate 22, and the heat dissipation of the electronic device 10 can be improved. Furthermore, the exposed part of the first metal plate 22 can be in contact with the heat dissipation sheet 21 in the electronic device 10. With this configuration, the first metal plate 22 is in direct or indirect contact with the electronic components 13, such as the image sensor 19 mounted on the first board 14 or the second board 15, which are heat sources, and the heat dissipation of the electronic device 10 can be further improved.

[0058] Moreover, in the first housing 16 of the electronic device 10 according to the embodiment, the first metal plate 22 extends across the cylindrical portion 27 and the second opening 28. With this configuration, the first metal plate 22 can distribute and equalize the temperature inside the first housing 16. Therefore, the electronic device 10 can reduce the risk of the lens of the imaging optical system 12 fogging up by reducing the temperature difference between a heat source such as the imaging element 19 and the lens of the imaging optical system 12.

[0059] In the electronic device 10 according to the embodiment, the second metal plate 23 has a second peripheral wall portion 34 joined to the first metal plate 22 from the radially inner side, a second flat plate portion 35 extending radially inward from one end of the second peripheral wall portion 34, and a cylindrical folded portion 36 formed along an end portion opposite to the one end of the second peripheral wall portion 34. With this configuration, during the insert molding of the first housing 16, the second metal plate 23 supports the first metal plate 22 at the folded portion 36, thereby reducing the risk of the first metal plate 22 being deformed by the pressure and heat of the poured resin, etc.

[0060] Furthermore, in the electronic device 10 according to the embodiment, at least a part of the second metal plate 23 is exposed to the inner space of the housing. With this configuration, the exposed part of the second metal plate 23 can directly contact a mold or the like during insert molding of the first housing 16. Therefore, the second metal plate 23 supports the first metal plate 22 at that part, thereby reducing the risk of the first metal plate 22 being deformed by the pressure and heat of the poured resin, etc.

[0061] Moreover, in the first housing 16 of the electronic device 10 according to the embodiment, the second metal plate 23 is thicker than the first metal plate 22. With this configuration, the second metal plate 23 can reduce the risk of the first metal plate 22 being deformed due to the pressure and heat of the poured resin during the insert molding of the first housing 16. This allows the first metal plate 22 covering the entire first housing 16 to be made thinner, making it possible to miniaturize the first housing 16 and, ultimately, the electronic device 10.

[0062] In the electronic device 10 according to the embodiment, as described above, the folded portion 36 of the second metal plate 23 is cylindrical. With this configuration, when the first housing 16 is insert-molded, the resin flows into the folded portion 36, improving the adhesion between the second metal plate 23 and the resin, and the bonding strength between the metal plate constituting the first housing 16 and the resin can be increased.

[0063] In the electronic device 10 according to the embodiment, a third metal plate 24 having an L-shaped cross section in the longitudinal direction is joined to the radially outer surface of the first metal plate 22. With this configuration, the contact surface between the metal plate constituting the first housing 16 and the resin becomes larger during insert molding of the first housing 16, and the joining strength between the metal plate and the resin can be increased.

[0064] Furthermore, in the electronic device 10 according to the embodiment, the first metal plate 22, the second metal plate 23, and the third metal plate 24 are made of the same material. This can increase the peel strength when the first metal plate 22, the second metal plate 23, and the third metal plate 24 are joined to each other by welding or the like.

[0065] Moreover, in the electronic device 10 according to the embodiment, the first housing 16 has a joint 29 formed of resin on at least a part of the surface facing the internal space of the first housing 16. The joint 29 is joined to the main surface of the first substrate 14 in the electronic device 10. With this configuration, it becomes easy to fix the image sensor 19 in the electronic device 10 at a determined position and in a determined attitude relative to the imaging optical system 12.

[0066] In the electronic device 10 according to the embodiment, the first metal plate 22 and the fourth metal plate 38 are electrically connected to each other via the conductive rubber 39 when the first housing 16 and the third housing 18 are joined together. With this configuration, the electronic device 10 can ground the first metal plate 22 by grounding the fourth metal plate 38, thereby reducing the risk of the first metal plate 22 becoming an antenna. Furthermore, the electronic device 10 can further improve heat dissipation by transferring heat generated by a component that directly or indirectly contacts the first metal plate 22 to the fourth metal plate 38.

[0067] Although the present disclosure has been described based on the drawings and examples, it should be noted that those skilled in the art can easily make various modifications and corrections based on the present disclosure. Therefore, it should be noted that these modifications and corrections are included in the scope of the present disclosure.

[0068] For example, in the above-mentioned embodiment, the first housing 16 has been described as including the first metal plate 22, the second metal plate 23, and the third metal plate 24, but this is not limited thereto. For example, the first housing 16 may be configured not to include the third metal plate 24. Alternatively, a portion corresponding to the third metal plate 24 may be formed on the first metal plate 22 by pressing or bending one end of the first metal plate 22 radially outward. With such a configuration, it is possible to facilitate the manufacture of the electronic device 10 and reduce the manufacturing cost.

[0069] Also, for example, in the above-mentioned embodiment, the first metal sheet 22, the second metal sheet 23, and the third metal sheet 24 are described as being joined to each other by welding, but this is not limited thereto. For example, the first metal sheet 22, the second metal sheet 23, and the third metal sheet 24 may be placed in a mold or the like so as to be in contact with each other, and may be fixed to each other by injecting a resin material such as polyamide and insert molding. Also, for example, the first metal sheet 22 and the second metal sheet 23 may be fitted to each other by inserting the second metal sheet 23 into the first metal sheet 22 from the radial inside.

[0070] Also, for example, in the above-described embodiment, the electronic device 10 has been described as including the first housing 16, the second housing 17, and the third housing 18, but this is not limited thereto. For example, the electronic device 10 may be configured not to include the third housing 18. With such a configuration, it is possible to facilitate the manufacture of the electronic device 10 and reduce the manufacturing cost.

[0071] Also, for example, in the above-described embodiment, the electronic device 10 has been described as including the first substrate 14 and the second substrate 15, but this is not limited thereto. For example, the electronic device 10 may be configured to include only the first substrate 14. With such a configuration, the electronic device 10 can be made smaller.

[0072] Also, for example, in the above-mentioned embodiment, the drawn portion 33 has been described as having a shape recessed inside the cylindrical first metal sheet 22, but this is not limited thereto. For example, the drawn portion 33 may have a shape protruding outside the cylindrical first metal sheet 22. With such a configuration, it is possible to further reduce the risk that the first metal sheet 22 placed in a mold or the like will be deformed due to the pressure and heat of the resin poured in during the insert molding of the first housing 16. [Explanation of symbols]

[0073] 10 Electronic equipment 11 Mobile 12 Imaging optical system 13. Electronic Components 14 First substrate 15 Second board 16 First Case 17 Second Case 18 The third enclosure 19 Image sensor 20 Connectors 21 Heat dissipation sheet 22 First Sheet Metal 23 Second Sheet Metal 24 The third sheet metal 25 Resin part 26 First Opening 27 Cylindrical section 28 Second Opening 29 Joint 30 Die receiving part 31 First peripheral wall portion 32 First plate section 33 Squeezing section 34 Second peripheral wall portion 35 Second plate section 36 Folded section 37 Inflow hole 38 The Fourth Sheet Metal 39 Conductive rubber

Claims

1. An imaging element that serves as a heat source; a first metal plate that is partly covered with resin, that houses the imaging element, and that forms a cylindrical shape; the first metal sheet has a peripheral wall portion covering the imaging element from the outside in the circumferential direction, and has a third portion protruding radially outward from the cylindrical radially outer surface of the peripheral wall portion of the first metal sheet and covered with the resin.

2. The electronic device according to claim 1 , wherein the resin covers a radially outer surface of the cylindrical peripheral wall portion.

3. The resin forms a ring-shaped joint portion on a radially inner side of the cylindrical peripheral wall portion, The joint accommodates an imaging element on a radially inner side of the ring-shaped joint, The surface of the substrate on which the imaging element is mounted is fixed to the joint.

2. The electronic device according to claim 1.

4. The joint portion is formed continuously with the resin covering the cylindrical radially inner side of the peripheral wall portion.

4. The electronic device according to claim 3.

5. The resin protrudes from the peripheral wall portion along the third portion.

2. The electronic device according to claim 1.

6. The third portion is formed by pressing or bending the first metal plate.

2. The electronic device according to claim 1.

7. The third portion is made of a metal plate and is joined to the first metal plate.

2. The electronic device according to claim 1.

8. The third portion is formed so that a cross section perpendicular to the longitudinal direction is L-shaped.

2. The electronic device according to claim 1.

9. A second metal plate is a cylindrical metal plate joined to the first metal plate from the radially inner side, The second metal plate includes a second peripheral wall portion joined to the first metal plate from a radially inner side, a folded portion formed by folding back an end portion of the second peripheral wall portion on the imaging element side in the axial direction toward an inner space of the second metal plate and covered with the resin; 2. The electronic device according to claim 1.

10. the first metal plate and the third portion are insert-molded into the first housing containing the resin, The third portion has at least one hole.

2. The electronic device according to claim 1.

Images