Optical connection structure, optical module, and method for manufacturing optical connection structure

Abstract

This optical connection structure (10) comprises, in the stated order: an optical waveguide element (11) including a substrate (111), a BOX layer (112), a first waveguide (113), and overcladding (114); an optical fiber (12) disposed in a V groove (110) formed in the substrate (111); a self-forming waveguide (131) disposed between an end surface of the optical waveguide element (11) and an end surface of the optical fiber (12); and cladding (132) disposed around the self-forming optical waveguide (131). The optical fiber (12) is disposed such that an end surface of the optical fiber (12) opposes the end surface of the optical waveguide element (11) so that signal light emitted from the optical fiber (12) is incident on the waveguide (113), and the self-forming optical waveguide (131) is a section formed by curing by irradiation with resin curing light.　The foregoing makes it possible for this optical connection structure to allow connection of the optical fiber to the optical waveguide, etc., disposed on the substrate in a simple manner and at low loss.

Description

[Technical field]

[0001] The present invention relates to an optical connection structure for connecting an optical fiber and an optical element, an optical module, and a method for manufacturing the optical connection structure. [Background technology]

[0002] Silicon photonics (SiPh), which makes it possible to create smaller optical devices than conventional technologies, is attracting attention in order to increase network capacity and save space within data centers.

[0003] In recent years, in order to simplify the optical connection of SiPh, which requires high-precision positioning, a method has been attracting attention in which a V-groove is formed on the Si substrate of the chip and the structure is used as a positioning structure to position the optical fiber on the SiPh chip end face (Non-Patent Document 1). This method is a processing technology that utilizes the fact that when the Si substrate is etched with an alkaline liquid such as KOH, a shape is determined by the crystal orientation. With this method, it is possible to integrally form a V-groove for positioning the optical fiber on the Si substrate with the precision of lithography.

[0004] This makes it possible to omit active alignment, which was previously required when connecting chips and optical fibers, by using a large alignment device to align the optical fiber array while monitoring the optical coupling efficiency. Therefore, this technology is expected to reduce costs by simplifying the optical connection process. [Prior art documents] [Non-patent literature]

[0005] [Non-Patent Document 1] S. Fathololoumi, et al. "1.6 Tbps Silicon Photonics Integrated Circuit for Co-Packaged Optical-IO Switch Applications." Optical Fiber Communication Conference. Optical Society of America, 2020. Summary of the Invention [Problem to be solved by the invention]

[0006] However, the above-mentioned technology has the following problems due to the etching method: Normally, in order to optically connect an optical fiber to a chip end face and to transmit light in each core with low loss, it is necessary to precisely align and butt the cores together.

[0007] On the other hand, when forming a V-groove in a Si substrate by the above-mentioned wet etching, for example, as shown in Figs. 24A and 24B, <110> When a V-groove is formed in the <1-10> direction (X direction in the figure), not only is an etched surface A610a with an inclination angle (hereinafter referred to as the "inclined etched surface") formed on the side surface, but also a similar inclined etched surface B610b is formed on the side surface in the <1-10> direction (Y direction in the figure). This inclination angle is an angle determined by the crystal orientation (hereinafter referred to as the "etching angle").

[0008] FIG. 25 and FIG. 26 respectively show a side cross-sectional view and a cross-sectional view XXVI-XXVI' of the structure in which an optical fiber is arranged in the V-groove of the Si substrate described above. As shown in FIG. 25, since the etching surface is inclined, it is not possible to butt the end face of the optical fiber completely against the end face of the chip. As a result, a gap is generated between the optical fiber and the Si waveguide layer, and loss occurs due to this gap. In order to avoid this gap, an additional process is used in which the chip is mechanically and chemically processed with high precision. For example, a process is required to remove the inclination of the Si by dicing in the depth direction of FIG. 25, or a process is required to remove the inclined portion of the Si by additional etching.

[0009] As described above, conventional methods require an additional process of butting optical fibers, which increases the manufacturing process and costs, and reduces chip yields due to chipping caused by dicing, etc. [Means for solving the problem]

[0010] In order to solve the above-mentioned problems, an optical connection structure according to the present invention comprises, in order, an optical waveguide element having a substrate, a BOX layer, a first waveguide, and an overclad, an optical fiber arranged in a V-groove formed in the substrate, a self-formed waveguide arranged between an end face of the optical waveguide element and an end face of the optical fiber, and a clad arranged around the self-formed waveguide, wherein a part of the end face of the optical fiber faces a slope of the V-groove at a predetermined angle, the optical fiber is arranged so that the end face of the optical fiber faces the end face of the optical waveguide element such that signal light output from the optical fiber is incident on the first waveguide, and the self-formed waveguide is a portion that has been cured by irradiation with resin curing light. the optical fiber for inputting resin curing light is disposed on one of the end faces of the optical waveguide element; a coupled waveguide into which the resin curing light is input from the optical fiber for inputting resin curing light; and a branching structure connecting the second waveguide core and the coupled waveguide; directions in which light propagates through the first waveguide and the second waveguide core are approximately parallel; the second waveguide core is transparent to visible light; and the resin curing light, which is visible light, propagates through the second waveguide core and is output from the end face of the optical waveguide element to perform the irradiation. It is characterized by:

[0011] Further, a method for manufacturing an optical connection structure according to the present invention includes the steps of: A method for manufacturing an optical connection structure including an optical fiber, an optical waveguide element having a first waveguide into which signal light output from the optical fiber is incident, and an optical fiber for receiving resin curing light, comprising: A step of stacking a BOX layer and Si on a substrate in this order; The above forming a first waveguide; forming a second waveguide core and a coupling waveguide connecting to the second waveguide core;forming an overclad; and forming a V-groove in the substrate; The above A step of disposing a self-written waveguide material on an end face of an optical waveguide element; The above a step of arranging an optical fiber such that a portion of an end face of the optical fiber faces a slope of the V-groove at a predetermined angle; a step of arranging the optical fiber for receiving the resin curing light on an end face of the coupling waveguide; The material The resin curing light is emitted from the resin curing light input optical fiber through the coupling waveguide and the second waveguide core from the end face of the optical waveguide element. The method includes a step of forming a self-written waveguide by irradiating a resin curing light, and a step of forming a cladding around the self-written waveguide. the second waveguide core is transparent to visible light and is disposed so as to cover the first waveguide; the signal light propagates through the first waveguide, and the resin curing light propagates through the coupling waveguide and the second waveguide core, and is emitted from an end face of the optical waveguide element to perform the irradiation; and the direction in which the signal light propagates through the first waveguide and the direction in which the resin curing light propagates through the second waveguide core are approximately parallel to each other. do. Effect of the Invention

[0012] According to the present invention, it is possible to provide an optical connection structure that can easily and with low loss connect an optical fiber to an optical waveguide element or the like disposed on a substrate. [Brief description of the drawings]

[0013] [Figure 1A] FIG. 1A is a side cross-sectional view of an optical connection structure according to a first embodiment of the present invention. [Figure 1B] FIG. 1B is a cross-sectional view taken along line IB-IB' of the optical connection structure according to the first embodiment of the present invention. [Diagram 2] FIG. 2 is a side cross-sectional view of the optical connection structure according to the first embodiment of the present invention. [Diagram 3] FIG. 3 is a top perspective view of the optical connection structure according to the first embodiment of the present invention. [Figure 4] FIG. 4 is a diagram for explaining a method for producing an optical connection structure according to the first embodiment of the present invention. [Diagram 5] FIG. 5 is a side cross-sectional view of an optical connection structure according to the second embodiment of the present invention. [Figure 6] FIG. 6 is a cross-sectional view taken along line VI-VI' of an optical connection structure according to the second embodiment of the present invention. [Figure 7] FIG. 7 is a top perspective view of an optical connection structure according to the second embodiment of the present invention. [Figure 8]FIG. 8 is a side cross-sectional view of an optical connection structure according to the second embodiment of the present invention. [Figure 9] FIG. 9 is a light intensity distribution diagram for explaining the operation of the optical connection structure according to the second embodiment of the present invention. [Figure 10] FIG. 10 is a top perspective view of an optical connection structure according to the second embodiment of the present invention. [Figure 11] FIG. 11 is a top perspective view of an example of an optical connection structure according to the second embodiment of the present invention. [Figure 12] FIG. 12 is a side cross-sectional view of an example of an optical connection structure according to the second embodiment of the present invention. [Figure 13] FIG. 13 is a side cross-sectional view of an optical connection structure according to a modified example of the second embodiment of the present invention. [Figure 14] FIG. 14 is a side cross-sectional view of an optical connection structure according to a modified example of the second embodiment of the present invention. [Figure 15] FIG. 15 is a side cross-sectional view of an optical connection structure according to a modified example of the second embodiment of the present invention. [Figure 16] FIG. 16 is a side cross-sectional view of an optical connection structure according to a modified example of the second embodiment of the present invention. [Figure 17] FIG. 17 is a top perspective view of an optical connection structure according to the third embodiment of the present invention. [Figure 18] FIG. 18 is a top perspective view of an optical connection structure according to the fourth embodiment of the present invention. [Figure 19] FIG. 19 is a top perspective view of an optical connection structure according to the fifth embodiment of the present invention. [Figure 20] FIG. 20 is a top perspective view for explaining an optical connection structure according to the fifth embodiment of the present invention. [Figure 21] FIG. 21 is a top perspective view for explaining an optical connection structure according to the fifth embodiment of the present invention. [Figure 22] FIG. 22 is a top perspective view of an example of an optical connection structure according to the fifth embodiment of the present invention. [Diagram 23]FIG. 23 is a top perspective view for explaining an optical connection structure according to the fifth embodiment of the present invention. [Figure 24A] FIG. 24A is a top view for explaining a conventional optical connection structure. [Figure 24B] FIG. 24B is a cross-sectional view taken along line XXIVB-XXIVB' for explaining a conventional optical connection structure. [Diagram 25] FIG. 25 is a side cross-sectional view of a conventional optical connection structure. [Figure 26] FIG. 26 is a cross-sectional view taken along line XXVI-XXVI' of a conventional optical connection structure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] <First embodiment> An optical connection structure according to a first embodiment of the present invention will be described with reference to FIGS. 1A to 4. FIG.

[0015] <Optical connection structure configuration> 1A and 1B are schematic cross-sectional views of an optical connection structure 10 according to a first embodiment, with Fig. 1A being a side view and Fig. 1B being a cross-sectional view taken along line IB-IB'.

[0016] The optical connection structure 10 includes an optical waveguide element 11, an optical fiber 12, and a self-written waveguide connection portion (hereinafter referred to as a “connection portion”) 13.

[0017] Optical waveguide element 11 is a silicon photonics (SiPh) element, and includes, on a Si substrate 111, a BOX (Buried Oxide) layer 112, a waveguide made of Si as a first waveguide 113 (hereinafter referred to as a “Si waveguide”), and an overclad 114, in that order.

[0018] A groove (hereinafter referred to as a "V groove") 110 having inclined side walls and a V-shaped cross section is formed in a Si substrate 111. Hereinafter, the direction of the ridge line at the bottom of the V groove 110 is referred to as the "longitudinal direction of the V groove." When a Si substrate having a (001) surface is used as the substrate, the longitudinal direction of the V groove is <110> direction or <1-10> direction.

[0019] 1B, the angle 15 that the inclined surface 110a of the V-groove 110 makes with the surface of the substrate 111 is 54.7°. Also, as shown in FIG 1A, the angle 15 that the inclined surface 110b at the tip of the groove 110 makes with the surface of the substrate 111 is 54.7°.

[0020] As shown in Fig. 1B, the optical fiber 12 is disposed in a V-groove 110 formed in a Si substrate 111. As shown in Fig. 1A, the optical fiber 12 is disposed such that its end face faces a surface 11a which is an end face of an optical waveguide element (chip). As a result, when the optical connection structure 10 is operated as an element (or a part of an element), the signal light emitted from the optical fiber 12 is incident on the Si waveguide 113. Hereinafter, the end face of the optical waveguide element (chip) 11 refers to the end face of a layer including at least the BOX layer 112 and the overclad 114 in the optical waveguide element 11 on the substrate 111.

[0021] Here, as described later, as shown in FIG. 1A, silicon nitride (SiNx) 119 used as a protective mask when forming the V-groove may remain on the surface and end faces of the optical waveguide element (chip) 11. In this case, the end faces of the optical waveguide element (chip) 11 become end faces of a layer that also contains silicon nitride (SiNx). Furthermore, this silicon nitride (SiNx) is gradually etched during wet etching for forming the V-groove, and may be removed depending on the etching conditions, and may not remain on the surface and end faces of the optical waveguide element (chip) 11.

[0022] In the connection portion 13, the self-written waveguide 131 is formed between the optical waveguide element 11 and the optical fiber 12. In the self-written waveguide 131, the portion where the refractive index is changed by light irradiation becomes the self-written waveguide (core) 131.

[0023] Moreover, as the cladding 132 of the self-formed waveguide 131, a refractive index matching agent is applied between the optical fiber 12 and the optical waveguide element (chip) 11 so as to cover the self-formed waveguide 131. As a result, the cladding 132 is disposed around the self-formed waveguide 131.

[0024] The refractive index matching material 132 may have any refractive index that acts as a cladding of the self-written waveguide 131. For example, an adhesive may be applied whose refractive index when hardened acts as a cladding. This allows stable connection characteristics to be maintained.

[0025] In the optical waveguide element 11, for example, the width and thickness of the Si waveguide 113 are 440 nm and 220 nm, respectively, the thickness of the BOX layer 112 is 3 μm, and the thickness of the overcladding 114 is about 4 μm.

[0026] In addition, photocurable resin is often used as the material for the self-written waveguide 131, but it has also been reported that a self-written waveguide can be formed from a bulk material such as a crystal that changes its refractive index when irradiated with light. In this way, if the self-written waveguide is made of a material that changes its refractive index when irradiated with light, a self-written waveguide can be formed and the same effect can be obtained.

[0027] According to the present invention, the optical fiber 12 and the end face of the optical waveguide element (chip) 11 can be connected by the self-written waveguide 131, thereby reducing the connection loss caused by the gap. In addition, the connection by the self-written waveguide 131 does not require additional processing of the chip 11 itself as described later, so that the influence of the gap can be easily reduced.

[0028] Self-written waveguide technology is an optical connection technology that uses a photocurable resin. The self-written waveguide technology will be explained below using an example of connecting two optical waveguides.

[0029] First, a photocurable resin is dropped between the two waveguides.

[0030] Next, a self-forming waveguide is formed in the light-irradiated portion by irradiating the light-curable resin with resin-curing light from one of the waveguides. At this time, the light-curable resin is cured in sequence from the portion with the highest light intensity, which is a characteristic of the light-curable resin, so that cores are formed in sequence from the end face of the waveguide.

[0031] As a result, a self-written waveguide is always formed on the end face of the core. This technology makes it possible to form a waveguide that confines light between gaps, making it possible to connect waveguides with gaps with low loss.

[0032] 2, in the fabrication of the self-written waveguide 131, a mode field converter 115 connected to the Si waveguide 113 may be disposed near the end of the waveguide, including the end of the waveguide, regardless of the shape of the Si waveguide 113. In this case, the mode field converter 115 can expand the mode field diameter of light that can propagate through the chip 11 at the end of the chip 11, so that the mode field diameter in the optical fiber 12 and the self-written waveguide 131 can be matched with that inside the chip 11, thereby reducing the connection loss.

[0033] The mode field converter 115 can be realized by a tapered structure in which the width of the waveguide narrows toward the end of the chip 11, as shown in the top perspective view of Fig. 3. The mode field converter 115 can be realized by a structure other than that of Fig. 3, for example, a three-pronged structure, but the mode field conversion shown in this embodiment can be realized with any structure of a known mode field converter.

[0034] <Method of manufacturing the optical connection structure 10> A method for manufacturing the optical connection structure 10 will be described below.

[0035] First, a material for the BOX layer 112, for example, silicon oxide, is laminated on the Si substrate 111, and Si is laminated thereon.

[0036] Next, the Si is processed into a waveguide by photolithography, and at this time, the Si in the portion other than the Si waveguide (first waveguide) 113 is removed.

[0037] Next, the overclad 114 is formed on the Si waveguide (first waveguide) 113 using, for example, silicon oxide as a material.

[0038] Next, the V-groove 110 is formed. First, the silicon oxide (the overclad 114 and the BOX layer 112) in the portion where the V-groove 110 is to be formed is removed by a normal process.

[0039] Next, in forming the V-groove, a protective mask is made of silicon nitride to protect the Si waveguide 113 from the alkaline liquid (such as a KOH solution) used in anisotropic etching. For example, after forming silicon nitride (SiNx) on the entire surface, the silicon nitride is processed to protect the areas other than the area where the V-groove 110 is to be formed, to create a protective mask.

[0040] Next, anisotropic etching is performed using a KOH aqueous solution to form a V-groove 110. As a result of this V-groove formation process, the silicon nitride (SiNx) protective mask remains on the surface and end faces of the optical waveguide element (chip) 11. Alternatively, this silicon nitride (SiNx) is gradually etched during wet etching for forming the V-groove, and depending on the etching conditions, it may be removed and not remain on the surface and end faces of the optical waveguide element (chip) 11.

[0041] At this time, depending on the etching conditions, the end face of the chip 11 may also be slightly affected by the etching, and the angle between the bottom face and the end face of the chip 11 may be a structure having a slight inclination rather than a perfect right angle as shown in Fig. 1A. However, if the refractive index of the resin forming the self-written waveguide 131 and the end face of the chip 11 is sufficiently close, the influence of refraction is reduced, so that the light beam emitted from the end face of the chip 11 travels almost straight without being affected by the shape of the end face. At this time, the self-written waveguide 131 formed by the resin curing light is formed in an approximately straight line, so the shape of the end face by etching does not have a significant effect on the operation of the optical connection structure 10 according to this embodiment.

[0042] In this embodiment, an example is shown in which silicon oxide in the portion where the V groove is to be formed is removed before silicon nitride is formed on the surface, but the present invention is not limited to this. For example, after forming a silicon nitride protection mask, silicon oxide in the portion (opening) where the V groove is to be formed may be removed by an acid solution or dry etching, and then Si may be anisotropically etched with a KOH aqueous solution.

[0043] Next, optical connection is performed in a process of optical connection using the self-written waveguide 131. First, the material of the self-written waveguide 131, for example, a photocurable resin, is dropped (placed) on the end face of the optical waveguide element (chip) 11 and the surrounding V-groove.

[0044] Next, the optical fiber 12 is positioned using the V-groove 110 as a positioning structure. At this time, by moving the optical fiber 12 along the V-groove 110 until it comes into contact with the end face of the V-groove 110, the resin on the end face of the chip 11 adheres to the end face of the optical fiber 12, and it is possible to fill the space between the optical fiber 12 and the end face of the chip 11 with the photocurable resin.

[0045] 1A, due to the inclined surface 110b of the Si substrate 111, when the optical fiber 12 is moved in a direction in which it abuts against the optical waveguide element 11, there is a possibility that the optical fiber 12 will ride up on the top of the overclad 114. For this reason, for example, as shown in Fig. 4, a glass lid 14 is placed on the optical fiber 12, and the optical fiber 12 is abutted against the optical waveguide element 11 while pressing the optical fiber 12 from above, thereby preventing the optical fiber 12 from riding up on the overclad 114. In this case, the length of the glass lid 14 may be set appropriately.

[0046] Next, resin curing light is emitted from the optical fiber 12. Here, the resin curing light can be easily incident on the optical fiber 12 by, for example, an optical connector. In this way, the photocurable resin is irradiated with the resin curing light and photocured, thereby forming a self-written waveguide 131.

[0047] Next, the uncured photocurable resin is washed away with a cleaning liquid such as ethanol.

[0048] Finally, a refractive index matching material 132 is dropped around the self-written waveguide 131 to form a cladding for the self-written waveguide 131 .

[0049] Alternatively, the self-written waveguide 131 and the surrounding cladding may be formed by the following method. This formation method is substantially similar to the above-mentioned manufacturing method, but the resin used to form the self-written waveguide and the cladding is different.

[0050] In this forming method, first, multiple resins (two in this embodiment) are mixed together. Each resin is cured by irradiation with light of a different wavelength, and has a different refractive index after curing.

[0051] Next, the mixed resin is dropped (placed) on the end face of the optical waveguide element (chip) 11 and in the surrounding V-groove.

[0052] Next, after adjusting the position of the optical fiber 12, a resin curing light of one wavelength is irradiated from the end face of the optical fiber 12 to cure the self-written waveguide 131 portion.

[0053] Finally, the resin curing light of the other wavelength is irradiated from outside (mainly from above) the dropped resin to cure the uncured part, forming a clad part (corresponding to the part of the refractive index matching agent 132 in the above-mentioned manufacturing method). The refractive index of this clad part is smaller than that of the self-written waveguide 131.

[0054] According to this formation method, the self-written waveguide 131 and the cladding 132 can be formed without the need for a process of washing away the uncured photocurable resin.

[0055] As described above, the optical connection structure 10 according to the present embodiment can be manufactured.

[0056] <Second embodiment> An optical connection structure according to a second embodiment of the present invention will be described with reference to FIGS.

[0057] <Configuration of optical connection structure 20> 5 and 6 are schematic cross-sectional views of an optical connection structure 20 according to this embodiment. Fig. 5 is a side view, and Fig. 6 is a cross-sectional view taken along line VI-VI'.

[0058] The optical connection structure 20 has substantially the same configuration as the optical connection structure 10 according to the first embodiment, but differs in that a second waveguide core 216 is formed so as to cover a Si waveguide (first waveguide) 213, as shown in Fig. 6. Specifically, the second waveguide core 216 is formed so as to cover the front and side surfaces of the Si waveguide 213.

[0059] Hereinafter, the end face of the optical waveguide element (chip) 21 refers to the end face of a layer including at least the BOX layer 212 and the overclad 214 in the optical waveguide element 21 on the substrate 211 .

[0060] 5, silicon nitride (SiNx) 219 used as a protective mask when forming the V-groove may remain on the surface and end faces of the optical waveguide element (chip) 21. In this case, the end faces of the optical waveguide element (chip) 21 become end faces of a layer that also contains silicon nitride (SiNx) 219. Also, silicon nitride (SiNx) 219 is gradually etched during wet etching for forming the V-groove, and may be removed depending on the etching conditions, and may not remain on the surface and end faces of the optical waveguide element (chip) 21.

[0061] A refractive index matching agent 232 is applied as a cladding between the optical fiber 22 and the chip 21 so as to cover the self-written waveguide 231 .

[0062] Examples of the dimensions are: second waveguide core 216 has a width and thickness of 3 μm, Si waveguide 213 has a width and thickness of 440 nm and 220 nm, BOX (Buried Oxide) layer 212 has a thickness of 3 μm, and overclad 214 has a thickness of about 4 μm.

[0063] In this embodiment, unlike the first embodiment, the resin curing light is irradiated not only onto the optical fiber 22 but also onto the end face of the optical waveguide element (chip) 21 to form a self-written waveguide 231.

[0064] This makes it possible to achieve the effect of enabling low-loss connection even if there is not only a gap but also an optical axis misalignment between the waveguides (misalignment of the centers of the cores in the direction into the paper in FIG. 5 or in the direction perpendicular to the surface of the substrate 211) that self-written waveguide 231 has. This makes it possible to achieve low-loss connection even if a processing error occurs in the formed V-groove and there is an optical axis misalignment between the optical fiber 22 and the end face of the chip 21.

[0065] A top perspective view of this connection structure is shown in Fig. 7. A mode field conversion section, which is a structure that changes the mode field diameter of light, is connected to the Si waveguide 213, and can be realized, for example, by a waveguide whose width gradually narrows along the longitudinal direction. In this case, the mode field conversion section 215 can be realized, for example, with a length of about 300 μm.

[0066] As a material for forming this structure, for example, second waveguide core 216 may be made of SiON, which is made by adding nitrogen to silicon oxide.

[0067] Furthermore, when resin curing light is emitted from both the optical fiber 22 and the optical waveguide element (chip) 21, in the event that an optical axis misalignment occurs between the respective waveguides, a self-written waveguide 231 having a bent (S-shaped) shape that compensates for this optical axis misalignment is formed, as shown in FIG. 8, making it possible to connect with low loss.

[0068] The photocurable resin used in the self-written waveguide technology cures sequentially from the portion irradiated with high-intensity resin curing light. As a result, in this embodiment, when resin curing light is emitted from both the optical fiber 22 and the optical waveguide element (chip) 21, even if there is a misalignment of the optical axes of the optical fiber 22 in the direction perpendicular to the longitudinal direction of the V-groove 210 on the horizontal plane and in the direction perpendicular to the surface of the Si substrate 211, a self-written waveguide 231 having a bent (S-shaped) shape that compensates for the misalignment of the optical axis is formed. Therefore, it is possible to realize low-loss optical connection even under the misalignment of the optical axis caused by the processing error of the V-groove 210.

[0069] The following describes the resin curing light emitted from the optical fiber 22 and the optical waveguide element (chip) 21. The wavelength of the resin curing light is in the visible light range. Quartz, which is the main material of the optical fiber 22, is transparent to visible light, so the visible light, i.e., the resin curing light, can propagate through the optical fiber 22 with low loss.

[0070] On the other hand, semiconductor waveguides such as Si have strong absorption in the visible light range, and it is difficult to obtain the emission of resin curing light from the waveguide end face due to the material absorption loss. Therefore, in this embodiment, a material transparent to visible light is used as the material for the second waveguide core 216, thereby realizing optical connection by a self-written waveguide.

[0071] In this structure, visible light can propagate with sufficiently low loss in the region of the second waveguide core 216. Figure 9 shows the results of numerical calculations of the normalized electric field amplitude of the propagation mode of this structure. The structure used for the calculations includes a Si waveguide 213, SiON as the second waveguide core 216, and silicon oxide as the overclad 214 and BOX layer 212. The calculations were performed using Lumerical's MODE solution.

[0072] The electric field amplitude is normalized by the maximum electric field amplitude in this structure and shown as relative light intensity. The shaded area in Fig. 9 indicates a relative light intensity of 0.9 or more, and indicates a portion where light is strongly confined. Thus, with this structure, it is possible to confine light in the transparent portion of second waveguide core 216 and to propagate it.

[0073] Moreover, the structure in this embodiment in which the Si waveguide 213 is covered with the second waveguide core 216 is a structure that is generally used for the purpose of adiabatically transferring light to a core having a different cross-sectional area, and is composed of waveguides having different mode fields and a mode field conversion section 215 that connects them with low loss.

[0074] In this structure, the core width of the light confined in the Si waveguide 213 gradually narrows toward the tip of the mode field conversion section 215, so that the light confinement weakens, and after the mode field gradually expands into the second waveguide core 216, the light transitions to a mode of light propagating within the second waveguide core 216 and propagates therein. Note that the mode field conversion section 215 can have many structures, such as a three-pronged structure, in addition to a simple tapered structure in which the width tapers toward the end of the second waveguide core 216 shown in Fig. 7, and the present invention does not limit the shape.

[0075] Furthermore, in order to perform optical connection using a self-written waveguide in this structure, it is necessary to emit resin curing light from an end face of the second waveguide core 216. Therefore, for example, as shown in Fig. 10, a Y-branch structure 217 is provided in the second waveguide core 216. Resin curing light 27 propagates through the coupling waveguide 218 and is coupled to the second waveguide core 216 by the Y-branch structure 217, and propagates through the second waveguide core 216 to be emitted from the end face of the optical waveguide element 21. This configuration makes it possible to realize the emission of resin curing light 27 from the end face of the waveguide, which is essential for obtaining the compensation effect of the self-written waveguide 231 for the optical axis misalignment.

[0076] Here, it is preferable that the Y branch structure 217 is formed in the second waveguide core 216 that covers the Si waveguide 213 and covers the region other than the mode field conversion section 215. When the signal light is input from the optical fiber 22 to the optical waveguide element 21 and is transmitted through the optical waveguide from the end face of the optical waveguide element 21, the signal light is sufficiently confined in the Si waveguide 213 after passing through the mode field conversion section 215. As a result, since the distance between the Si waveguide 213 and the Y branch structure 217 is equal to or greater than the wavelength of light, the signal light confined in the Si waveguide 213 is hardly affected by the Y branch structure 217. In this way, the influence of the Y branch structure 217 on the mode field conversion effect in the transmission of the signal light can be sufficiently suppressed.

[0077] In order to emit the resin curing light 27 in this structure, it is necessary to couple the resin curing light 27 from outside the optical waveguide element (chip) 21 to the optical waveguide on the Si substrate 211. Therefore, for example, as shown in FIG. 11, an optical fiber 28 for inputting the resin curing light is arranged in the V-groove 210_2. Here, the end face of the optical fiber 28 is arranged facing the end face of the optical waveguide element (chip) 21 so that the resin curing light 27 outputted from the optical fiber 28 is inputted (coupled) to the coupling waveguide 218. In this manner, the optical fiber 22 and the optical fiber 28 for inputting the resin curing light are arranged in the V-grooves 210 and 210_2, respectively, and the resin curing light 27 is inputted from the optical fiber 28 for inputting the resin curing light and the optical fiber 22.

[0078] At this time, as shown in FIG. 11, by propagating light to the Y branch structure 217 through the bent waveguide of the coupling waveguide 218, it becomes possible to emit the resin curing light 27 from the end face of the chip 21.

[0079] In this structure, there is a gap between the end face of the resin curing light input fiber 28 and the chip 21. As a result, there is a loss due to the diffraction of light when the resin curing light 27 is input. However, the light intensity per unit area of ​​the resin curing light 27 required for the self-written waveguide 231 is low, and for example, several tens of μW is sufficient for the second waveguide core 216 having a thickness of 3 μm and a width of 3 μm. In addition, the output of a semiconductor laser in the wavelength band of the resin curing light 27, which is relatively inexpensive and available on the market, is sufficiently large at several mW, so that even if there is some loss, a sufficient output can be secured to form the self-written waveguide 231. Note that any technology that can couple light propagating through a known waveguide, such as a multimode interference type coupler or a directional coupler, into an arbitrary waveguide may be used, instead of the Y branch.

[0080] <Method of manufacturing the optical connection structure 20> Next, a method for manufacturing this structure will be described. First, a material for the BOX layer 212, for example, silicon oxide, is laminated on the Si substrate 211, and Si is laminated thereon.

[0081] Next, the Si is processed into a waveguide by photolithography, and at this time, the Si in the portion other than the Si waveguide (first waveguide) 113 is removed.

[0082] Next, a material for the second waveguide core 216, for example, SiON, is laminated on the Si waveguide 213 so as to cover the Si waveguide 213.

[0083] Next, the SiON is processed into a waveguide (second waveguide core 216) using normal photolithography. At this time, the SiON in the portion other than the second waveguide core 216 is removed.

[0084] Next, the overclad 214 is formed on the second waveguide core 216 using, for example, silicon oxide as a material so as to cover the second waveguide core 216 .

[0085] At this time, the overclad 214 laminated above the SiON waveguide has a convex portion as shown in Fig. 6. Since it is difficult to form a protective film on the side surface of this convex portion, the protective film can be formed after polishing the convex portion by chemical mechanical polishing (CMP) or the like to flatten the surface of the overclad 214.

[0086] Next, the V-grooves 210 and 210_2 are formed. First, silicon oxide (the overclad 214 and the BOX layer 212) in the portion where the V-grooves 210 and 210_2 are to be formed is removed by a normal process.

[0087] Next, in forming the V-groove, a protective mask is made of silicon nitride to protect the Si waveguide 213 and the second waveguide core 216 from the alkaline liquid (such as a KOH solution) used in anisotropic etching. For example, after forming silicon nitride (SiNx) on the entire surface, the silicon nitride is processed to protect the areas other than the areas where the V-grooves 210 and 210_2 are to be formed, to create a protective mask.

[0088] Next, anisotropic etching is performed using a KOH aqueous solution to form the V-grooves 210 and 210_2. As a result of this V-groove formation process, the silicon nitride (SiNx) protective mask remains on the surface and end faces of the optical waveguide element (chip) 11. Alternatively, this silicon nitride (SiNx) is gradually etched during wet etching for forming the V-groove, and may be removed depending on the etching conditions, and may not remain on the surface and end faces of the optical waveguide element (chip) 11.

[0089] At this time, since the self-written waveguide 231 formed by the resin curing light 27 is formed in a substantially straight line, the shape of the end face by etching does not have a large effect on the operation of the optical connection structure 20 according to this embodiment.

[0090] In this embodiment, an example is shown in which silicon oxide in the portion where the V groove is to be formed is removed before silicon nitride is formed on the surface, but the present invention is not limited to this. For example, after forming a silicon nitride protection mask, silicon oxide in the portion (opening) where the V groove is to be formed may be removed by an acid solution or dry etching, and then Si may be anisotropically etched with a KOH aqueous solution.

[0091] Next, optical connection is performed in a process of optical connection using the self-written waveguide 231. First, a material for the self-written waveguide 231, for example, a photocurable resin, is dropped (placed) on the end face of the second waveguide core 216 described above.

[0092] Next, the V-grooves 210 and 210_2 are used as positioning structures, and the optical fiber 22 and the optical fiber 28 for resin-curing light incidence are placed in the V-grooves 210 and 210_2, respectively. At this time, by moving the optical fiber 22 along the V-groove 210 until it comes into contact with the end face of the V-groove 210, the resin on the end face of the chip 21 adheres to the end face of the optical fiber 22, and it is possible to fill the space between the end faces of the optical fiber 22 and the chip 21 with the light-curing resin. At this time, it is recommended to use a glass lid or the like as described above.

[0093] Next, the resin curing light 27 is emitted from the resin curing light input optical fiber 28 and the optical fiber 22. As a result, the photocurable resin is irradiated with the resin curing light 27 and photocured, thereby forming a self-written waveguide 231.

[0094] Next, the uncured photocurable resin is washed away with a cleaning liquid such as ethanol.

[0095] Finally, a refractive index matching agent 232 is dropped around the self-written waveguide 231 to form a cladding portion of the self-written waveguide 231. At this time, the optical fiber 22 and the chip 21 may be bonded together using an adhesive having a refractive index similar to that of the resin for refractive index matching.

[0096] Here, the self-written waveguide 231 and the cladding around it may be formed using a plurality of resins, similarly to the first embodiment, without washing off the uncured photocurable resin.

[0097] <Modification of the second embodiment> An optical connection structure according to a modified example of this embodiment will be described.

[0098] First, in this structure, the self-written waveguide 231_2 may have any shape as long as it confines light by the refractive index difference between the core and the clad as a waveguide. For example, as shown in FIG. 12, the cross section may be gradually enlarged from the end face of the optical fiber 22 toward the end face of the chip 21. The self-written waveguide 231_2 between the waveguides with different core diameters has such a structure. In this structure, the self-written waveguide 231_2 can convert the mode field of light. This makes it possible to compensate for the connection loss caused by the difference in mode field between the core 221 of the optical fiber 22 and the core of the waveguide at the end face of the chip 21.

[0099] 13, a tapered structure may be formed on the end face of the chip 21 into which the resin curing light 27 is incident in the U-shaped coupling waveguide 218 for inputting the self-written waveguide 231. There may also be a difference in mode field diameter between the core of the optical fiber 28 for inputting the resin curing light and the coupling waveguide 218 due to the size of the core and the optical characteristics of the waveguide. By forming the structure shown in FIG. 13, the mode field diameter of the resin curing light 27 in the chip 21 can be enlarged, and this makes it possible to improve the coupling efficiency of light from the optical fiber 28 for inputting the resin curing light to the coupling waveguide 218.

[0100] As for the method of inputting the resin curing light 27, other than the method using the V-groove 210_2, as shown in FIG. 14, the optical fiber 22 may be directly aligned with the end face of the chip 21 opposite the end face of the chip 21 on which the V-groove 210 for the optical fiber 22 is formed, and the resin curing light 27 may be input into the coupling waveguide 218 and coupled to the second waveguide core 216.

[0101] Furthermore, the resin curing light 27 may be incident from an end face of the chip 21 other than the end face on the opposite side facing the end face of the chip 21 on which the V groove 210 for the optical fiber 22 is formed, for example, from a side end face of the chip 21 (substantially perpendicular to the end face of the optical waveguide element 21 facing the end face of the optical fiber 22) as shown in Fig. 15. In this way, by creating a position for the incidence of the resin curing light 27 in a portion other than the end face on which the V groove 210 for the optical fiber 22 is formed, it becomes unnecessary to create the V groove 210 for arranging the optical fiber for the resin curing light incidence, and the connection portion between the optical fiber 22 and the chip 21 can be made smaller.

[0102] Furthermore, instead of connecting the optical fiber 22 to the side (end face) of the optical waveguide element (chip) 21, any known method can be applied as long as it is possible to cause total reflection at the interface between the air and the waveguide by using a diffraction grating type coupler or a configuration in which the end face of the chip 21 is polished at an angle, thereby allowing resin curing light to be incident from the top face of the chip.

[0103] Also, although the configuration in which the Si waveguide 213 is in the second waveguide core 216 has been shown as an example, any known configuration may be applied as long as the second waveguide core 216 and the Si waveguide 213 are adiabatically optically coupled and function as a spot size converter. For example, a configuration may be used in which the directions of light propagation through the second waveguide core 216 and the Si waveguide 213 are approximately parallel to each other and the waveguides are optically coupled, such as a waveguide in which the second waveguide core 216 is arranged on the upper surface of the Si waveguide 213.

[0104] Regarding the shape of the V-groove 210, if the anisotropic etching is stopped before the formation of the V-groove 210, it may have the structure shown in Fig. 16. Even in this state, if the depth of the Si substrate 211 is sufficiently larger than the radius of the core 221 of the optical fiber 22, it will still function as a positioning structure for the optical fiber 22, and the present invention is similarly applicable. In the embodiment of the present invention, the V-groove also includes a groove shaped with inclined surfaces on both sides and a bottom surface as shown in Fig. 16.

[0105] <Third embodiment> An optical connection structure according to a third embodiment of the present invention will be described with reference to FIG.

[0106] <Configuration of optical connection structure 30> FIG. 17 shows an optical connection structure 30 according to the present embodiment.

[0107] The optical connection structure 30 further includes a groove portion (hereinafter referred to as a "resin intrusion prevention groove") 31 between the V-groove 210 in which the optical fiber 22 in the second embodiment is arranged and the V-groove 210_2 in which the optical fiber 28 for resin curing light incidence is arranged.

[0108] In the second embodiment, the photocurable resin used to form the self-written waveguide 231 has very high light absorption in the curing wavelength band.

[0109] On the other hand, since the curable resin is liquid before curing, when the curable resin is dropped to place the optical fiber 22 in the V-groove 210, it may enter the nearby V-groove 210_2 in which the optical fiber 28 for resin curing light incidence is placed.

[0110] In this case, if curable resin penetrates between the optical fiber 28 for inputting resin curing light and the end face of the chip 21, the resin curing light 27 input from the optical fiber 28 for inputting resin curing light to the second waveguide core 216 will suffer absorption loss due to the curable resin, and as a result, it may not be possible to obtain the output required to form the self-forming waveguide 231.

[0111] Therefore, in this embodiment, a groove portion (resin intrusion prevention groove) 31 for preventing intrusion of liquid curable resin is formed between the V groove 210 in which the optical fiber 22 is arranged and the V groove 210_2 in which the resin curing light input optical fiber 28 is arranged. Even when an excessive amount of curable resin is dropped onto the end face of the chip 21, the resin intrusion prevention groove 31 allows the curable resin to flow into the groove portion, so that intrusion of resin into the resin curing light input optical fiber 28 can be suppressed.

[0112] The resin intrusion prevention groove 31 can be formed, for example, by a process similar to the process for forming the V-groove 210 for arranging the optical fiber 22. In the present embodiment, it is sufficient that a groove is formed, and the present invention does not limit the manufacturing method or shape thereof.

[0113] <Fourth embodiment> An optical connection structure according to a fourth embodiment of the present invention will be described with reference to Fig. 18. An optical connection structure 40 according to this embodiment has substantially the same configuration and effect as the second embodiment, but differs in the following respects.

[0114] In the optical connection structure 40, although the resin curing light is input at a single point, by utilizing an optical circuit structure to branch the optical power, the resin curing light can be emitted simultaneously from the ends of multiple optical waveguides, and self-formed waveguides (SWWs) can be formed simultaneously in each of the multiple waveguides.

[0115] <Configuration of optical connection structure 40> 18 shows a top perspective view of an optical connection structure 40 according to this embodiment, where arrows in the figure indicate positive and negative directions on the X and Y axes.

[0116] The optical connection structure 40 includes an optical waveguide including a plurality of (two in this embodiment) Si waveguides 413_1, 413_2, second waveguide cores 416_1, 416_2, and mode field conversion sections 415_1, 415_2. Furthermore, a plurality of optical fibers 42_1, 42_2 are arranged in the V-grooves 410_1, 410_2 so that their end faces face the respective end faces of the optical waveguides, and connection sections 43_1, 43_2 are arranged between the respective optical waveguides and the optical fibers 42_1, 42_2. Furthermore, a coupling waveguide 218 coupled to the resin curing light input optical fiber 28 arranged in the V-groove 210_2 branches out and connects to the plurality of optical waveguides.

[0117] In the optical connection structure 40, first, the resin curing light 27 input from the resin curing light input optical fiber 28 to the coupling waveguide 218 is branched by the branching structure 417_2. One of the branched lights is coupled to the second waveguide core 416_2 from the coupling waveguide 218 on the X-side out of the two coupling waveguides 218, propagates in the X-direction, and is emitted from the end face of the optical waveguide.

[0118] The other light, after passing through the branch structure 417_2, propagates through the coupling waveguide 218 in the Y+ direction and reaches the cross structure where the coupling waveguide 218 and the second waveguide core 416_2 cross each other. In this cross structure, the coupling waveguide 218 connects to the second waveguide core 416_2 above the Si waveguide 413_2. In this cross structure, excess loss occurs due to diffraction in the cross structure and the influence of Si. However, as described above, the light required for optical connection by the self-written waveguide may be weak, so a small loss does not have a large impact.

[0119] After passing through this intersection structure, the resin curing light 27 further propagates in the Y+ direction, is coupled to the second waveguide core 416_1 by the Y branch structure 417_1, propagates in the X- direction, and is emitted from the end face of the optical waveguide.

[0120] As described above, resin curing light 27 can be emitted simultaneously from two positions on the end face of chip 21, and therefore the two positions can be connected simultaneously by a self-written waveguide.

[0121] In this embodiment, the resin curing light 27 is emitted from only two end faces of the waveguide, but by combining a branching structure and a crossing structure, the resin curing light 27 can be emitted simultaneously from two or more end faces of the waveguide. This allows a large number of waveguides to be connected simultaneously.

[0122] <Fifth embodiment> An optical connection structure according to a fifth embodiment of the present invention will be described with reference to FIGS.

[0123] <Configuration of optical connection structure 50> 19 shows a top perspective view of an optical connection structure 50 according to this embodiment. The optical connection structure 50 has a V-groove (hereinafter referred to as a "gap widening groove") 51 that is continuous with and has a narrower width than the V-groove 210 for positioning the optical fiber.

[0124] It is necessary to control the gap length when fabricating a tapered self-written waveguide as shown in Fig. 12. When the mode field diameter of light is converted by a tapered waveguide of a self-written waveguide, the excess loss at the time of mode field diameter conversion can be sufficiently reduced by sufficiently reducing the angle of the tapered shape with respect to the traveling direction of the light (hereinafter referred to as the "taper angle").

[0125] The taper angle is determined by the core diameters of the optical fiber 22 and the waveguide (second waveguide core 216) of the optical waveguide element 21, and the length of the gap. It is generally known that the core diameter of a self-written waveguide is approximately larger than the core diameter of the waveguide from which light is emitted. Therefore, when connecting cores with different diameters, by setting an optimal gap length, it is possible to form a self-written waveguide having a taper angle suitable for connecting the cores.

[0126] However, when forming a V-groove with a rectangular opening (for example, FIG. 24A), it is difficult to control the length of the gap between the optical fiber core 221 and the end face of the chip 21 while matching the height of the core 221 of the optical fiber 22 with the height of the waveguide. This is because, in the case of a rectangular opening, both the height of the core 221 of the optical fiber 22 and the length of the gap are mostly determined by the opening width 16 shown in FIG. 1B, as described below. Here, "height" refers to the height from the ridge or bottom surface of the bottom of the V-groove in the direction perpendicular to the surface of the Si substrate 211.

[0127] First, since the angle of the inclined etching surface A of the anisotropically etched V-groove 210 is constant (54.7°), the height of the core 221 at the center of the optical fiber 22 in the V-groove 210 is determined by the outer diameter of the optical fiber 22 and the opening width 16 of the V-groove 210, as can be seen from FIG. 1B.

[0128] Here, since the outer diameter of a general-purpose optical fiber is almost always fixed, the height of the core 221 of the optical fiber 22 is determined by the opening width 16 of the V-groove 210 .

[0129] 1A, when the optical fiber 22 is positioned by the V-groove 210, the tip of the optical fiber 22 is pushed in until it abuts against the inclined etched surface B of the V-groove 210. The gap that occurs at this time is determined by the height of the core 221 of the optical fiber 22 and the inclination angle of the inclined etched surface B of the V-groove 210. The height of the core 221 of the optical fiber 22 is determined by the opening width as described above, and the inclination angle of the inclined etched surface B of the V-groove 210 is constant (54.7°). Therefore, the length of the gap between the optical fiber 22 and the waveguide end face in the chip 21 is also mostly determined by the opening width 16.

[0130] As such, since both the height of the core 221 of the optical fiber 22 and the length of the gap are determined by the opening width 16, it is difficult to control the gap while aligning the optical fiber core 221 with the optical waveguide 23 of the chip 21.

[0131] Therefore, in this embodiment, in order to control the gap between the waveguides while aligning them in the vertical direction, a gap widening groove 51 having a narrower width than the V-groove 210 for placing the optical fiber 22 is formed adjacent to the end face of the V-groove 210.

[0132] 19, by arranging a narrow gap widening groove 51, the length of the gap between the end face of the optical fiber 22 and the chip 21 can be widened in the longitudinal direction of the V-groove. The length of the gap can be changed, for example, by changing the layout of the mask used to form the V-groove. This makes it possible to realize any gap length.

[0133] As described above, according to the present embodiment, the length of the gap can be arbitrarily controlled, so that the taper angle in the tapered self-written waveguide can be made small, and excess loss during mode field diameter conversion can be reduced.

[0134] 20, if the V-groove 52 has an opening width wider than the V-groove 210 for arranging the optical fiber 22, the optical fiber 22 can enter the added groove, making it impossible to control the length of the gap. Therefore, it is necessary to add a groove with an opening width narrower than the width of the V-groove 210 for arranging the optical fiber 22.

[0135] The gap may be appropriately set depending on the purpose, such as the connection characteristics, reliability, mechanical strength, etc. For example, in the case of a self-written waveguide connection between waveguides with optical axis misalignment, it is known that the reduction effect of connection loss under the axis misalignment has gap dependency.

[0136] 21, so long as the width W2 of the gap widening groove 51 is smaller than the width W1 of the V-groove 210 for arranging the optical fiber 22 and is larger than the width W3 of the waveguide at the end face of the chip 21 (hereinafter referred to as the "end face waveguide width"), the same effect can be obtained, and the shape of the opening does not matter. Here, the end face waveguide width W3 is the mode field diameter of the light at the chip end face.

[0137] Here, when width W3 is larger than width W2, the width of the self-formed waveguide that is formed is determined almost entirely by width 2, so that a self-formed waveguide having a diameter approximately equal to the optical waveguide core diameter cannot be formed, resulting in increased connection loss.

[0138] When a self-formed waveguide is formed using this structure, the self-formed waveguide is formed by dropping photocurable resin into the narrow gap widening groove 51, so the width of the self-formed waveguide is narrower than the width W1 of the V-groove 210 for arranging the optical fiber 22 and wider than the width W3 of the waveguide at the end face of the chip 21 according to the width of the gap widening groove 51. In practice, the width of the self-formed waveguide is formed so as to increase from the width W3 of the waveguide at the end face of the chip 21 to the width W1 of the V-groove 210 for arranging the optical fiber 22. Alternatively, the self-formed waveguide can be formed with a constant width.

[0139] 22, a groove portion (hereinafter referred to as a "flow path groove") 53 is further provided on the side surface of the gap widening groove. As an example of the arrangement of this flow path groove 53, a configuration is shown in which its longitudinal direction is perpendicular to the longitudinal direction of the gap widening groove 51. This groove portion can be used as a flow path for dripping resin or a solution for washing uncured resin, making it easy to drip resin from above the chip 21.

[0140] Note that the gap widening groove 51 and the flow path groove 53 can obtain the same effect as in the present invention regardless of their shapes as long as they are shaped to ensure a gap between the end faces of the optical fiber 22 and the chip 21. For example, instead of a V-groove, a groove that can be produced by dry etching or the like may be used.

[0141] Also, as shown in Fig. 23, the shape 54 of the continuous portion of the two different sized V-grooves may have a smooth continuous portion due to the crystal orientation of the etched surface being disturbed by etching conditions such as etching time. However, as shown in Fig. 23, as long as the groove with a small opening width has a shape that can secure a gap between the waveguides and the optical fiber 22, the same effect can be obtained and the shape is not important.

[0142] Sixth embodiment An optical module 60 according to a sixth embodiment of the present invention will be described. The optical module 60 includes the optical connection structure according to any one of the first to fifth embodiments, an optical circuit, and an electronic circuit. An optical signal input via the optical connection structure is optically processed in the optical circuit, and converted into an electrical signal by a photodiode in the electronic circuit, where the electrical signal is subjected to processing such as arithmetic operations. Here, the optical module 60 may not include an optical circuit, and may be configured to be directly connected to the electronic circuit from the optical connection structure. Also, the optical module 60 can integrate the optical waveguide element of the optical connection structure, the optical circuit, and the electronic circuit on the same substrate.

[0143] The materials used in the embodiment of the present invention are examples, and are not limited thereto. The material of the waveguide in the optical waveguide element may be a semiconductor such as InP or GaAs other than Si, a dielectric material, a resin, or the like. The second waveguide core may be a resin material or a semiconductor other than a dielectric material such as SiOx. Here, as long as the refractive index of the core (waveguide) covered by the second waveguide core is higher than that of the second waveguide core, and the second waveguide core is a material having a higher refractive index than the overcladding portion, the material is not limited to this structure. In addition, the substrate may be a material such as SiC or glass other than Si. Here, the substrate may be any material as long as a V-groove can be formed by etching.

[0144] In the embodiment of the present invention, the structure, dimensions, materials, etc. of each component in the configuration and manufacturing method of the optical connection structure are shown as examples, but the present invention is not limited to these. Anything that can exert the function and effect of the optical connection structure may be used. [Industrial Applicability]

[0145] The present invention relates to an optical connection structure for connecting an optical fiber and an optical element, an optical module, and a method for manufacturing an optical connection structure, and can be applied to equipment and systems for optical communications and the like. [Explanation of symbols]

[0146] 10 Optical connection structure 11 Optical Waveguide Device 110 V groove 111 Substrate 112 BOX layer 113 First Waveguide 114 Overclad 12 Optical Fiber 131 Self-formed waveguide 132 Clad

Claims

1. an optical waveguide element including, in order, a substrate, a BOX layer, a first waveguide, and an overclad; an optical fiber disposed in a V-groove formed in the substrate; a self-written waveguide disposed between an end face of the optical waveguide element and an end face of the optical fiber; a cladding disposed around the self-written waveguide; a part of the end face of the optical fiber faces the slope of the V-groove at a predetermined angle; the optical fiber is disposed such that an end face of the optical fiber faces an end face of the optical waveguide element such that signal light outputted from the optical fiber is incident on the first waveguide; the self-written waveguide is a portion that has been cured by irradiation with resin curing light, a second waveguide core arranged to be optically coupled to the first waveguide and covering the first waveguide; an optical fiber for receiving resin curing light, the optical fiber being disposed on one of the end faces of the optical waveguide element; a coupling waveguide into which the resin curing light is incident from the resin curing light incident optical fiber; a branching structure in which the second waveguide core and the coupling waveguide are connected, an optical connection structure characterized in that the directions in which light propagates through the first waveguide and the second waveguide core are approximately parallel, the second waveguide core is transparent to visible light, and the resin curing light, which is visible light, propagates through the second waveguide core and is emitted from an end face of the optical waveguide element to perform the irradiation.

2. Silicon nitride is provided on the overclad.

2. The optical connection structure according to claim 1 .

3. the optical fiber and the resin curing light input optical fiber are disposed on the same end surface of the optical waveguide element; An intrusion prevention groove is provided between the optical fiber and the optical fiber for receiving the resin curing light.

3. The optical connection structure according to claim 1 or 2.

4. a plurality of the optical fibers, a plurality of the first waveguides, and a plurality of the second waveguide cores; The coupling waveguide is branched and connected to each of the second waveguide cores.

4. The optical connection structure according to claim 1, wherein the first and second electrodes are arranged in a first direction.

5. a gap expansion groove having a width narrower than the width of the V groove and wider than a mode field diameter of light at the end surface, on an end surface of the V groove in which the optical fiber is disposed; The length of the gap widening groove changes the tapered shape of the self-written waveguide.

5. The optical connection structure according to claim 1, wherein the first and second electrodes are arranged in a first direction.

6. A flow passage groove is provided which is connected to the gap widening groove, A resin for forming the self-forming waveguide or a solution for cleaning the uncured resin is dropped into the flow channel groove.

6. The optical connection structure according to claim 5.

7. An optical module comprising the optical connection structure according to claim 1 and an electronic circuit.

8. A method for manufacturing an optical connection structure including an optical fiber, an optical waveguide element having a first waveguide into which signal light output from the optical fiber is incident, and an optical fiber for incident resin-curing light, comprising: A step of stacking a BOX layer and Si on a substrate in this order; processing the Si into the first waveguide; forming a second waveguide core and a coupling waveguide connecting to the second waveguide core; forming an overcladding; forming a V-groove in the substrate; disposing a self-forming waveguide material on an end face of the optical waveguide element; placing the optical fiber in the V-groove such that a portion of an end face of the optical fiber faces a slope of the V-groove at a predetermined angle; a step of arranging the optical fiber for receiving the resin curing light on an end face of the coupling waveguide; a step of irradiating the material with the resin curing light emitted from the resin curing light input optical fiber through the coupling waveguide and the second waveguide core and outgoing from an end face of the optical waveguide element to form a self-forming waveguide; forming a cladding around the self-written waveguide; Equipped with a second waveguide core that is transparent to visible light and that is disposed so as to cover the first waveguide, the signal light propagates through the first waveguide, the resin curing light propagates through the coupled waveguide and the second waveguide core, and is emitted from an end face of the optical waveguide element to perform the irradiation, and a direction in which the signal light propagates through the first waveguide and a direction in which the resin curing light propagates through the second waveguide core are approximately parallel to each other.

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