Module

Abstract

In a module according to the present application, a metal member includes a right support part, and the right support part has a right support part forefront portion that is positioned at the forefront of the right support part and that is positioned further forward than a plate-shaped part. The right support part is bent frontward from a right boundary when the right support part has the right support part forefront portion. The right support part is bent rearward and rightward from the right support part forefront portion when the right support part has the right support part forefront portion. A first lower notch, that extends upward from from the lower side of the right support part and that overlaps with the right support part forefront portion when viewed in the up-down direction, is provided to the right support part.

Description

[Technical field]

[0001] The present invention relates to a module including a substrate on which electronic components are mounted. [Background technology]

[0002] As an invention relating to a conventional module, for example, the high-frequency module described in Patent Document 1 is known. This high-frequency module includes a substrate, a surface-mounted element, a metal wall, a resin molding portion, and a metal thin film. The surface-mounted element is mounted on the upper surface of the substrate. The metal wall extends upward from the upper surface of the substrate. The resin molding portion seals the metal wall and the surface-mounted element. The metal thin film covers the upper surface of the resin molding portion. The metal wall is provided so as to be located between the first surface-mounted element and the second surface-mounted element. In such a module described in Patent Document 1, electromagnetic interference between some of the first surface-mounted elements and some of the second surface-mounted elements is suppressed (blocked) by the metal wall. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2007-294965 A Summary of the Invention [Problem to be solved by the invention]

[0004] Incidentally, in the high-frequency module described in Patent Document 1, a module having a metal wall with high self-supporting properties is desired.

[0005] It is an object of the present invention to provide a module with highly self-supporting metal walls. [Means for solving the problem]

[0006] The module of the present invention comprises: A substrate having an upper main surface and a lower main surface aligned in a vertical direction; a metal member including a plate-like portion provided on an upper main surface of the substrate, the plate-like portion having a front main surface and a rear main surface aligned in a front-rear direction when viewed in a vertical direction; a first electronic component mounted on an upper main surface of the substrate and disposed in front of the metal member; a second electronic component mounted on the upper main surface of the substrate and disposed behind the metal member; a sealing resin layer provided on an upper main surface of the substrate and covering the first electronic component, the second electronic component, and the metal member; Equipped with The metal member includes a right support portion, The boundary between the plate-like portion and the right support portion is defined as the right boundary, The right boundary is located on the right side of the metal member. the right support portion has a right support portion foremost portion that is located most forward in the right support portion and is located forward of the plate-shaped portion, or a right support portion rearmost portion that is located most rearward in the right support portion and is located rearward of the plate-shaped portion, When the right support portion has a right support portion frontmost portion, the right support portion bends forward from the right boundary, When the right support portion has a right support portion frontmost portion, the right support portion bends from the right support portion frontmost portion in a rear direction and in a right direction, When the right support portion has a right support portion rearmost portion, the right support portion bends rearward from the right boundary, When the right support portion has a right support portion rearmost portion, the right support portion bends forward and to the right from the right support portion rearmost portion, When viewed from the top to bottom, the line connecting the bottom end of the right support part in the left-right direction is defined as the bottom side. The right support part is provided with a first lower cutout extending upward from the lower side and overlapping with the frontmost part or the rearmost part of the right support part when viewed in the up-down direction. Effect of the Invention

[0007] According to the present invention, a module including a metal member with high self-supporting properties can be provided. [Brief description of the drawings]

[0008] [Figure 1] FIG. 1 is a perspective view of a module 10. [Diagram 2] FIG. 2 is a top view of the module 10. [Diagram 3] FIG. 3 is a top view of the metal member 14. As shown in FIG. [Figure 4] FIG. 4 is a cross-sectional view of the module 10 taken along line AA. [Diagram 5] FIG. 5 is a cross-sectional view of the module 10 taken along line BB. [Figure 6] FIG. 6 is a cross-sectional view of the module 10 taken along line CC. [Figure 7] FIG. 7 is a perspective view of the metal member 14. As shown in FIG. [Figure 8] FIG. 8 is a top view of the metal member 14, the solder pieces Sd1 to Sd6, and the mounting electrode 122. As shown in FIG. [Figure 9] FIG. 9 is a perspective view of the metal member 14 and the substrate 12 seen from the front-rear direction. [Figure 10] FIG. 10 is a perspective view of the metal member 14 during manufacturing. [Figure 11] FIG. 11 is a front view of the metal member 14 during manufacture. [Figure 12] FIG. 12 is a top view of the metal member 14, the solders Sd1 to Sd6, and the mounting electrodes 122 during manufacturing. [Figure 13] FIG. 13 is a top view of a metal member 14a according to the second embodiment. [Figure 14] FIG. 14 is a perspective view of a metal member 14b according to the third embodiment. [Figure 15] FIG. 15 is a top view of a metal member 14b according to the embodiment of the third embodiment. [Figure 16] FIG. 16 is a perspective view of a metal member 14c according to the fourth embodiment. [Figure 17] FIG. 17 is a top view of a metal member 14c according to an embodiment of the fourth embodiment. [Figure 18]FIG. 18 is a front view of a metal member 14d according to the embodiment of the fifth embodiment. [Figure 19] FIG. 19 is a top view of the mounting electrode 123 and the solder pieces Sd31 to Sd33 according to a first modification of the mounting pattern of the mounting electrode 122 and the solder pieces Sd1 to Sd6. [Figure 20] FIG. 20 is a cross-sectional view taken along line DD of the mounting electrode 1231, the solder Sd31, and the left support portion 140L. [Figure 21] FIG. 21 is a cross-sectional view taken along line EE of the mounting electrode 1233, the solder Sd33, and the right support portion 140R. [Figure 22] FIG. 22 is a cross-sectional view taken along line DD of solder Sd31X according to a modified example of the mounting pattern of the solder Sd31. [Figure 23] FIG. 23 is a cross-sectional view taken along line EE of solder Sd33X according to a modified example of the mounting pattern of the solder Sd33. [Figure 24] FIG. 24 is a top view of the mounting electrodes 124 and the solders Sd41 to Sd43 according to a second modification of the mounting pattern of the mounting electrodes 122 and the solders Sd1 to Sd6. [Diagram 25] FIG. 25 is a cross-sectional view taken along line DD of the mounting electrode 1241, the solder Sd41, and the left support portion 140L. [Figure 26] FIG. 26 is a cross-sectional view taken along line EE of the mounting electrode 1243, the solder Sd43, and the right support portion 140R. [Figure 27] FIG. 27 is a diagram showing a solder Sd41X according to a modified example of the mounting pattern of the solder Sd41. [Figure 28] FIG. 28 is a diagram showing a solder Sd43X according to a modified example of the mounting pattern of the solder Sd43. [Figure 29] FIG. 29 is a top view of the mounting electrode 125 and the solders Sd51, Sd52, Sd3, Sd4, Sd55, and Sd56 according to a third modification of the mounting pattern of the mounting electrode 122 and the solders Sd1 to Sd6. [Diagram 30] FIG. 30 is a top view of the mounting electrode 125, the solders Sd51, Sd52, Sd3, Sd4, Sd55, and Sd56, and the metal member 14 during manufacture. [Diagram 31] FIG. 31 is a front view of a metal member 14e according to another embodiment. [Diagram 32] FIG. 32 is a front view of a metal member 14f according to another embodiment. [Diagram 33] FIG. 33 is a front view of a metal member 14g according to another embodiment. [Diagram 34] FIG. 34 is a front view of a metal member 14h according to another embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] (Embodiment) [Module 10 Structure] The structure of a module 10 according to an embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view of the module 10. FIG. 1 shows the inside of the module 10 in a see-through manner. FIG. 2 is a top view of the module 10. FIG. 2 shows the inside of the module 10 in a see-through manner. FIG. 3 is a top view of a metal member 14. FIG. 4 is a cross-sectional view of the module 10 taken along line AA. FIG. 5 is a cross-sectional view of the module 10 taken along line BB. FIG. 6 is a cross-sectional view of the module 10 taken along line CC. FIG. 7 is a perspective view of the metal member 14. FIG. 8 is a top view of the metal member 14 and the mounting electrode 122. FIG. 9 is a see-through view of the metal member 14 and the substrate 12 from the front-rear direction.

[0010] The directions in the module 10 will be described below. As shown in FIG. 1, the substrate 12 of the module 10 has a plate shape. Therefore, as shown in FIG. 1 and FIG. 4, the direction in which the upper main surface SU2 and the lower main surface SD2 of the substrate 12 are aligned is defined as the up-down direction. As shown in FIG. 2, the direction in which the front main surface SF3 and the rear main surface SB3 of the metal member 14 are aligned when viewed in the up-down direction is defined as the front-rear direction. In addition, the direction perpendicular to the front-rear direction and the up-down direction is defined as the left-right direction. The up-down direction, the left-right direction, and the front-rear direction are perpendicular to each other. However, the up-down direction, the left-right direction, and the front-rear direction may not coincide with the up-down direction, the left-right direction, and the front-rear direction when the module 10 is actually used. In addition, in each drawing, the up-down direction may be interchanged with the down-down direction, the left-right direction may be interchanged with the right-left direction, and the front-rear direction may be interchanged with the rear-rear direction.

[0011] The definitions of terms in this specification are explained below. First, the positional relationship of the members in this specification is defined. X to Z are members or parts that constitute the module 10. In this specification, X and Y arranged in the front-rear direction indicate the following state. When X and Y are viewed in a direction perpendicular to the front-rear direction, both X and Y are arranged on an arbitrary straight line indicating the front-rear direction. In this specification, X and Y arranged in the front-rear direction when viewed in the up-down direction indicate the following state. When X and Y are viewed in the up-down direction, both X and Y are arranged on an arbitrary straight line indicating the front-rear direction. In this case, when X and Y are viewed from a left-right direction different from the up-down direction, either one of X and Y may not be arranged on an arbitrary straight line indicating the front-rear direction. Note that X and Y may be in contact with each other. X and Y may be separated from each other. Z may exist between X and Y. This definition is also applied to directions other than the front-rear direction.

[0012] In this specification, X being placed in front of Y refers to the following state. At least a part of X is placed within an area through which Y passes when it translates forward. Therefore, X may be contained within an area through which Y passes when it translates forward, or may protrude from an area through which Y passes when it translates forward. In this case, X and Y are lined up in the front-rear direction. This definition also applies to directions other than the front-rear direction.

[0013] In this specification, X being placed in front of Y in the left-right direction refers to the following state: X and Y are aligned in the front-back direction in the left-right direction, and a part of X facing Y in the left-right direction is placed in front of Y. In this definition, X and Y do not have to be aligned in the front-back direction in three dimensions. This definition also applies to directions other than the front-back direction.

[0014] In this specification, X being placed in front of Y refers to the following state: X is placed in front of a plane that passes through the front end of Y and is perpendicular to the front-to-rear direction. In this case, X and Y may or may not be aligned in the front-to-rear direction. This definition also applies to directions other than the front-to-rear direction.

[0015] In this specification, unless otherwise specified, each part of X is defined as follows. The front part of X means the front half of X. The rear part of X means the rear half of X. The left part of X means the left half of X. The right part of X means the right half of X. The upper part of X means the upper half of X. The lower part of X means the lower half of X. The front end of X means the front end of X. The rear end of X means the rear end of X. The left end of X means the left end of X. The right end of X means the right end of X. The upper end of X means the upper end of X. The lower end of X means the lower end of X. The front end of X means the front end of X and its vicinity. The rear end of X means the rear end of X and its vicinity. The left end of X means the left end of X and its vicinity. The right end of X means the right end of X and its vicinity. The upper end of X means the upper end of X and its vicinity. The lower end of X means the lower end of X and its vicinity.

[0016] In the present specification, when any two members are defined as X and Y, the relationship between any two members has the following meaning. In the present specification, "X is supported by Y" includes the case where X is attached to Y so as to be immovable relative to Y (i.e., fixed), and the case where X is attached to Y so as to be movable relative to Y. In addition, "X is supported by Y" includes both the case where X is directly attached to Y, and the case where X is attached to Y via Z.

[0017] In this specification, "X and Y are electrically connected" means that electricity is conducted between X and Y. Therefore, X and Y may or may not be in contact with each other. When X and Y are not in contact with each other, Z having electrical conductivity is disposed between X and Y.

[0018] In this specification, turning to the right means turning in a manner that includes a vector component in the right direction. Therefore, turning to the right may include a vector component in a direction other than the right direction (for example, a vector component in the forward direction). Similarly, turning to the left means turning in a manner that includes a vector component in the left direction. Turning to the forward direction means turning in a manner that includes a vector component in the forward direction. Turning to the backward direction means turning in a manner that includes a vector component in the backward direction. Turning to the upward direction means turning in a manner that includes a vector component in the upward direction. Turning to the downward direction means turning in a manner that includes a vector component in the downward direction.

[0019] [Module 10 Structure] The module 10 is, for example, a high-frequency module. The high-frequency module is, for example, an analog front-end module of a portable wireless communication device. However, the module 10 is not limited to being a high-frequency module.

[0020] The module 10 includes a substrate 12, a metal member 14, electronic components 16a to 16e, a sealing resin layer 18, and a shield 20, as shown in FIGS.

[0021] The substrate 12 is a multilayer wiring substrate having a structure in which a plurality of insulating layers made of materials such as low-temperature co-fired ceramic, high-temperature co-fired ceramic, glass epoxy, or the like are laminated.

[0022] The substrate 12 has a plate shape. Therefore, the substrate 12 has an upper main surface SU2, a lower main surface SD2, a left surface SL2, a right surface SR2, a front surface SF2, and a rear surface SB2, as shown in Figures 1 and 4. The substrate 12 has a rectangular shape when viewed in the vertical direction.

[0023] An electric circuit is provided by a conductor layer on the upper main surface SU2, the lower main surface SD2, and inside the substrate 12. In this embodiment, the substrate 12 includes ground conductor layers G, G1 as shown in Fig. 4 and Fig. 5. The ground conductor layers G, G1 are provided inside the substrate 12. A ground potential is connected to the ground conductor layers G, C1.

[0024] The metal member 14 is provided on the upper main surface SU2 of the substrate 12. Specifically, the metal member 14 extends upward from the upper main surface SU2 of the substrate 12.

[0025] The metal member 14 has a structure in which one metal plate is bent. The metal member 14 is made of, for example, tough pitch copper. Note that, instead of tough pitch copper, brass, phosphor bronze, SUS, aluminum, etc. may be used. The thickness of the metal member 14 is, for example, 50 μm.

[0026] The electronic components 16a, 16b (first electronic components) are mounted on the upper main surface SU2 of the substrate 12 as shown in Figures 1, 2, and 4. The electronic components 16a, 16b are mounted, for example, by soldering. The electronic components 16a, 16b are chip components such as semiconductor elements such as ICs and PAs (power amplifiers), chip inductors, chip capacitors, and chip resistors. The electronic components 16a, 16b are arranged in front of the metal member 14 as shown in Figures 1, 2, and 4.

[0027] In this embodiment, the electronic components 16a, 16b are disposed in front of the metal member 14. Therefore, the electronic components 16a, 16b overlap the metal member 14 when viewed in the front-rear direction. The left ends of the electronic components 16a, 16b are located to the right of the left end of the metal member 14. The right ends of the electronic components 16a, 16b are located to the left of the right end of the metal member 14. The upper ends of the electronic components 16a, 16b are located below the upper end of the metal member 14.

[0028] In the example shown in Fig. 4, the electronic component 16a is electrically connected to the via v11. Moreover, the electronic component 16b is electrically connected to the via v12. The via v1 and the via v2 are electrically connected through the signal conductor layer SC1. That is, in the example shown in Fig. 4, the electronic components 16a and 16b are electrically connected through the signal conductor layer SC1.

[0029] The electronic components 16c, 16d, and 16e (second electronic components) are mounted on the upper main surface SU2 of the substrate 12. The electronic components 16c, 16d, and 16e are mounted, for example, by soldering. The electronic components 16c, 16d, and 16e are chip components such as semiconductor elements such as ICs and PAs (power amplifiers), chip inductors, chip capacitors, and chip resistors. The electronic components 16c, 16d, and 16e are arranged behind the metal member 14 as shown in FIGS. 1, 2, and 4.

[0030] In this embodiment, the electronic components 16c, 16d, and 16e are disposed behind the metal member 14. Therefore, the electronic components 16c, 16d, and 16e overlap the metal member 14 when viewed in the front-to-rear direction. The left ends of the electronic components 16c, 16d, and 16e are located to the right of the left end of the metal member 14. The right ends of the electronic components 16c, 16d, and 16e are located to the left of the right end of the metal member 14. The upper ends of the electronic components 16c, 16d, and 16e are located below the upper end of the metal member 14.

[0031] In the example shown in Fig. 4, the electronic component 16c is electrically connected to the via v21. Moreover, the electronic component 16d is electrically connected to the via v22. The via v21 and the via v22 are electrically connected through the signal conductor layer SC2. That is, in the example shown in Fig. 4, the electronic components 16c and 16d are electrically connected through the signal conductor layer SC2.

[0032] The electronic components 16a to 16e may generate magnetic flux, for example, as a coil. When the electronic components 16a to 16e generate magnetic flux, the shielding by the metal member 14 may be used in two cases, a first case and a second case, as described below.

[0033] The first case is a case that shields magnetic flux generated from electronic components by metal member 14 in order to suppress the influence of the magnetic flux on surrounding electronic components. Examples of electronic components that correspond to the first case include a SAW (Aurface Acoustic Wave) filter, an LNA (Low Noise Amplifier), and a switch.

[0034] In the case of an electronic component corresponding to the first case, it is easy to shield the magnetic flux generated from the electronic component by placing the electronic component close to the metal member 14. For example, like electronic components 16b and 16c shown in Figs. 1 and 2, the electronic component is placed close to the metal member 14.

[0035] The second case is a case that does not shield the magnetic flux generated by the electronic component so as to prevent the characteristics of the electronic component from deteriorating. An example of the electronic component that corresponds to the second case is a chip inductor.

[0036] In the case of electronic components corresponding to the second case, the possibility that the magnetic flux shielded by the metal member 14 will degrade the characteristics of the electronic components is reduced by arranging the electronic components away from the metal member 14. For example, the electronic components are arranged away from the metal member 14, as in the case of electronic components 16a, 16d, and 16e shown in Figs. 1 and 2.

[0037] Moreover, electronic components equivalent to the second case include vertical type inductors and horizontal type inductors.

[0038] A vertical inductor is an inductor whose winding axis extends in the vertical direction. A horizontal inductor is an inductor whose winding axis extends in the vertical direction.

[0039] Here, the metal member 14 will be described in detail. As shown in Figs. 1, 2, and 3, the metal member 14 has a shape in which one plate-like body is bent forward or backward. At this time, the metal member 14 has a bent portion which is a portion that is bent forward or backward. In the example shown in Figs. 2 and 3, the metal member 14 has a bent portion (hereinafter referred to as a first bent portion) that is bent forward at the right end of the metal member 14. Also, the metal member 14 has a bent portion (hereinafter referred to as a second bent portion) that is bent backward at the left end of the metal member 14. At this time, the metal member 14 includes a plate-like portion 140, a right support portion 140R, and a left support portion 140L, as shown in Figs. 1, 2, and 3. The plate-like portion 140 has a plate shape. That is, the plate-like portion 140 has a rectangular shape when viewed in the front-rear direction. The right support part 140R is a part located between the first bent part and the right end of the metal member 14. That is, the right support part 140R is connected to the right end (first bent part) of the plate-shaped part 140. The right support part 140R extends from the first bent part toward the front direction. Similarly, the left support part 140L is a part located between the second bent part and the left end of the metal member 14. That is, the left support part 140L is connected to the left end (second bent part) of the plate-shaped part 140. The left support part 140L extends from the second bent part toward the rear direction.

[0040] In the case of the configuration shown above, the first bent portion is the boundary between the plate-shaped portion 140 and the right support portion 140R. Here, as shown in FIG. 3, the boundary between the plate-shaped portion 140 and the right support portion 140R is defined as a right boundary CR1. In this case, the right boundary CR1 includes the first bent portion. At this time, the right boundary CR1 is located on the right part of the plate-shaped portion 140. More precisely, the right boundary CR1 is located on the right end of the plate-shaped portion 140. As shown in FIG. 5, FIG. 6, and FIG. 7, the right support portion 140R extends from the right boundary CR1 toward the right direction when viewed in the front-rear direction. Also, as shown in FIG. 3, the right support portion 140R extends from the right boundary CR1 toward the front direction. Similarly, the second bent portion is the boundary between the plate-shaped portion 140 and the left support portion 140L. Here, as shown in FIG. 3, the boundary between the plate-shaped portion 140 and the left support portion 140L is defined as a left boundary CL1. In this case, the left boundary CL1 includes the second bent portion. At this time, the left boundary CL1 is located on the left part of the plate-shaped portion 140. More precisely, the left boundary CL1 is located on the left end of the plate-shaped portion 140. As shown in Figs. 5, 6 and 7, the left support portion 140L extends leftward from the left boundary CL1 when viewed in the front-rear direction. Also, as shown in Fig. 3, the left support portion 140L extends rearward from the left boundary CL1.

[0041] As shown in FIGS. 2 and 4, the plate-shaped portion 140 has a front principal surface SF3 and a rear principal surface SB3.

[0042] 5, 6 and 7, upper notches 142a, 142b and lower notches 144a to 144c are provided in the plate-shaped portion 140. Therefore, strictly speaking, the plate-shaped portion 140 has a shape other than a rectangular shape when viewed in the front-rear direction.

[0043] 5 and 6, a line connecting the upper ends of the metal members 14 in the left-right direction when viewed in the front-rear direction is defined as an upper side LU. A line connecting the lower ends of the metal members 14 in the left-right direction when viewed in the front-rear direction is defined as a lower side LD. The upper side LU is located at a position farther upward from the substrate 12 than the lower side LD.

[0044] In this specification, a cutout is a depression formed on the outer edge of the metal member 14 by removing a part of the metal member 14. The cutout in this specification includes, for example, a U-shaped cutout extending from side to side of a rectangular plate in a direction perpendicular to the side, and an L-shaped cutout formed by removing a corner of a rectangle. The cutout may also be an angular U-shaped cutout.

[0045] As shown in Figs. 5 and 6, the upper notches 142a and 142b extend downward from the upper side LU. The upper notches 142a and 142b have a U-shape when viewed in the front-rear direction. That is, the upper notches 142a and 142b have a shape that combines a rectangle having an upper side, a lower side, a left side, and a right side with a semicircle that protrudes downward from the lower side of the rectangle. The lower ends of the upper notches 142a and 142b are located above the center in the vertical direction of the plate-shaped part 140 when viewed in the front-rear direction. The upper notch 142a is located to the left of the upper notch 142b. The vertical length of the upper notches 142a and 142b is, for example, half or less of the vertical length of the plate-shaped part 140. The horizontal width of the upper notches 142a and 142b is, for example, 150 µm.

[0046] As shown in Figs. 5 and 6, the lower cutouts 144a to 144c extend upward from the lower side LD. The lower cutouts 144a to 144c have an inverted U-shape when viewed in the front-rear direction. That is, the lower cutouts 144a to 144c have a shape that combines a rectangle with a semicircle that protrudes upward from the upper side of the rectangle. The upper ends of the lower cutouts 144a to 144c are located below the center in the up-down direction of the plate-shaped part 140 when viewed in the front-rear direction. The lower cutouts 144a to 144c are lined up in a row from left to right in this order. The lower cutouts 144a to 144c are lined up at equal intervals in the left-right direction when viewed in the front-rear direction. The vertical length of the lower cutouts 144a to 144c is, for example, half or less of the vertical length of the plate-shaped part 140. The width in the left-right direction of the lower cutouts 144a to 144c is, for example, 150 μm.

[0047] Here, the positional relationship between the upper cutouts 142a, 142b and the lower cutouts 144a to 144c will be described. As shown in Figs. 5, 6 and 7, the upper cutouts 142a, 142b are shifted in the left-right direction from the lower cutouts 144a to 144c when viewed in the up-down direction. The upper cutout 142a is located between the lower cutouts 144a and 144b in the left-right direction when viewed in the up-down direction. The upper cutout 142b is located between the lower cutouts 144b and 144c in the left-right direction when viewed in the up-down direction. This prevents the upper cutouts 142a, 142b and the lower cutouts 144a to 144c from being too close to each other. The shortest distance between the upper cutouts 142a, 142b and the lower cutouts 144a to 144c is 1.5 times or more the thickness of the plate-shaped portion 140. More preferably, the shortest distance between the upper cutouts 142a, 142b and the lower cutouts 144a to 144c is twice the thickness of the plate-shaped portion 140 or more.

[0048] The plate-shaped portion 140 provided with the lower cutouts 144a to 144c includes foot portions 146a to 146d as shown in Figs. 5, 6, and 7. The foot portions 146a to 146d are located at the lower portion of the plate-shaped portion 140. The foot portion 146a is a portion located between the left boundary CL1 and the lower cutout 144a as shown in Fig. 7. In this case, the foot portion 146a is located at the left end portion of the plate-shaped portion 140. The foot portion 146d is a portion located between the right boundary CR1 and the lower cutout 144c as shown in Fig. 7. In this case, the foot portion 146d is located at the right end portion of the plate-shaped portion 140. The foot portions 146b and 146c are portions located between two adjacent lower cutouts in the plate-shaped portion 140. Specifically, the foot portion 146b is located between the lower cutouts 144a and the lower cutouts 144b. Further, the foot portion 146c is located between the lower cutouts 144b and 144c. That is, in this specification, the foot portion of the plate-shaped portion 140 refers to a portion located between two adjacent lower cutouts, a portion located at the right end portion of the plate-shaped portion 140, or a portion located at the left end portion of the plate-shaped portion 140.

[0049] 5, 6, and 7, the foot portion 146a is located to the left of the lower cutout 144a in the left-right direction.

[0050] As shown in FIGS. 5, 6 and 7, the foot portion 146b is located between the lower cutout 144a and the lower cutout 144b in the left-right direction.

[0051] As shown in FIGS. 5, 6 and 7, the foot portion 146c is located between the lower cutout 144b and the lower cutout 144c in the left-right direction.

[0052] 5, 6, and 7, the foot portion 146d is located to the right of the lower cutout 144c in the left-right direction.

[0053] Here, the positional relationship between the foot portions 146a to 146d and the lower cutouts 144a to 144c will be described. The foot portion 146a, the lower cutout 144a, the foot portion 146b, the lower cutout 144b, the foot portion 146c, the lower cutout 144c, and the foot portion 146d are arranged in this order from left to right when viewed in the front-rear direction, as shown in Figures 5, 6, and 7. The lower cutouts 144a to 144c have the same shape. Therefore, the foot portions 146a to 146d are arranged at equal intervals in the left-right direction when viewed in the front-rear direction.

[0054] Further, the outer edges of the legs 146a to 146d are connected to the outer edges of the lower cutouts 144a to 144c. Therefore, the lower cutouts 144a to 144c are located on at least one of the left and right sides of the legs 146a to 146d. Therefore, the legs 146a to 146d include the legs 146b, 146c (first legs) located between the lower cutouts 144a to 144c in the left-right direction when viewed in the front-rear direction. The lower cutouts 144a to 144c are located on both the left and right sides of the legs 146b, 146c.

[0055] As shown in FIGS. 5, 6 and 7, the right support portion 140R is provided with a lower notch 144R.

[0056] 5 and 6, the lower cutout 144R extends upward from the lower side LD. The lower cutout 144R has an inverted U-shape when viewed in the front-rear direction. The upper end of the lower cutout 144R is located below the center of the plate-shaped portion 140 in the up-down direction when viewed in the front-rear direction.

[0057] The right support part 140R provided with the lower cutout 144R includes foot parts 146R1 and 146R2 as shown in Figs. 5, 6 and 7. The foot parts 146R1 and 146R2 are located at the lower end of the right support part 140R. The foot part 146R1 is a part located between the right boundary CR1 and the lower cutout 144R. In this case, the foot part 146R1 is located to the left of the lower cutout 144R in the right support part 140R. The foot part 146R2 is a part located at the right end of the right support part 140R. In this case, the foot part 146R2 is a part located to the right of the lower cutout 144R in the right support part 140R. That is, in this specification, the foot part of the right support part 140R is a part located between the right boundary CR1 and the lower cutout, or a part located at the right end of the right support part 140R. When the right support part 140R is provided with a plurality of lower cutouts, a portion of the right support part 140R located between two adjacent lower cutouts also becomes a foot part.

[0058] The foot portion 146R1 is located to the left of the lower cutout 144R. That is, the foot portion 146R1 is located at the left end portion of the right support portion 140R.

[0059] The foot portion 146R2 is located to the right of the lower cutout 144R. That is, the foot portion 146R2 is located at the right end portion of the right support portion 140R.

[0060] As shown in FIGS. 1, 5 and 6, the left support portion 140L is provided with a lower notch 144L extending upward from the lower side LD.

[0061] The shape of the lower cutout 144L is the same as that of the lower cutout 144R, and therefore a description thereof will be omitted.

[0062] The left support part 140L provided with the lower cutout 144L includes foot parts 146L1 and 146L2. The foot parts 146L1 and 146L2 are located at the lower end of the left support part 140L. The foot part 146L2 is a part located between the left boundary CL1 and the lower cutout 144L in the left support part 140L. In this case, the foot part 146L2 is located to the right of the lower cutout 144L in the left support part 140L. The foot part 146L1 is a part located at the left end of the left support part 140L. In this case, the foot part 146L1 is located to the left of the lower cutout 144L in the left support part 140L. That is, in this specification, the foot part of the left support part 140L is a part located between the left boundary CL1 and the lower cutout, or a part located at the left end of the left support part 140L. When the left support part 140L has a plurality of lower cutouts, a portion of the left support part 140L located between two adjacent lower cutouts also becomes a foot part.

[0063] The foot portion 146L1 is located to the left of the lower cutout 144L. That is, the foot portion 146L1 is located at the left end portion of the left support portion 140L.

[0064] The foot portion 146L2 is located to the right of the lower cutout 144L. That is, the foot portion 146L2 is located at the right end portion of the left support portion 140L.

[0065] The legs 146L1, 146L2, 146a to 146d, 146R1, and 146R2 are fixed to an upper main surface SU2 of the substrate 12. Specifically, the legs 146L1, 146L2, 146a to 146d, 146R1, and 146R2 are fixed to a mounting electrode 122 of the substrate 12, as shown in FIG. 8. In other words, the mounting electrode 122 is a part of the upper main surface SU2 of the substrate 12.

[0066] 8 and 9, mounting electrode 122 has a rectangular shape with long sides extending in the left-right direction when viewed in the up-down direction. As shown in FIG.

[0067] The mounting electrode 122 and the metal member 14 are fixed with solders Sd1 to Sd6. More specifically, as shown in FIG. 8 and FIG. 9, the foot 146L1 is fixed to the mounting electrode 1221 with solder Sd1. The feet 146L2 and 146a are fixed to the mounting electrode 1222 with solder Sd2. In this case, the left support 140L is fixed with solders Sd1 and Sd2 (left conductive member). The foot 146b is fixed to the mounting electrode 1223 with solder Sd3. The foot 146c is fixed to the mounting electrode 1224 with solder Sd4. The feet 146d and 146R1 are fixed to the mounting electrode 1225 with solder Sd5. The foot 146R2 is fixed to the mounting electrode 1226 with solder Sd6. In this case, the right support portion 140R is fixed by solders Sd5 and Sd6 (right conductive member).

[0068] 8 and 9, the mounting electrode 1221 fixed to the foot 146L1 of the left support part 140L and the mounting electrode 1222 fixed to the foot 146L2 of the left support part 140L are left mounting electrodes in this embodiment. Similarly, the mounting electrode 1225 fixed to the foot 146R1 of the right support part 140R and the mounting electrode 1226 fixed to the foot 146L2 of the right support part 140R are right mounting electrodes in this embodiment.

[0069] The metal member 14 is electrically connected to the ground conductor layer G2 via the mounting electrode 122. More specifically, the lower end of the metal member 14 is connected to the mounting electrodes 1221-1226 by the solders Sd1-Sd6. As shown in Fig. 9, the mounting electrodes 1221-1226 are connected to the vias v1-v6, respectively. The vias v1-v6 are connected to the ground conductor layer G2. Therefore, the metal member 14 is electrically connected to the ground conductor layer G2 via the solders Sd1-Sd6, the mounting electrodes 1221-1226, and the vias v1-v6.

[0070] In addition, the legs 146L1, 146L2, 146a to 146d, 146R1, and 146R2 may be connected to the mounting electrode 122 directly without using the solder Sd1 to Sd6, and the legs 146L1, 146L2, 146a to 146d, 146R1, and 146R2 may be mounted in direct contact with the upper surface SU1.

[0071] In the above configuration, as shown in FIG. 9, the vias v1 to v6 are arranged at equal intervals in the left-right direction in the substrate 12. The interval between adjacent vias v1 to v6 is, for example, 1 / 2 or 1 / 4 or less of the wavelength of a signal transmitted through a signal conductor layer (not shown) of the substrate 12. In this case, the vias v1 to v6 can shield the signal propagating through the substrate 12. Specifically, when the vias v1 to v6 are arranged at intervals of 1 / 2 or 1 / 4 of the wavelength of the signal, the vias v1 to v6 are located at nodes of a composite wave (i.e., a standing wave) of an incident wave of the signal and a reflected wave of the signal. This makes it difficult for a standing wave to occur in the substrate 12 in response to an input signal. As a result, the vias v1 to v6 can shield the signal propagating through the substrate 12.

[0072] The shielding properties of the metal member 14 provided with the vias v1 to v6 will be described in more detail below. For example, as shown in FIG. 4, there is a possibility that an interference wave IW1 is generated from the signal conductor layer SC1. At this time, as shown in FIG. 4, there is a possibility that the interference wave IW1 generated from the signal conductor layer SC1 travels backward. In the case of a metal member not provided with the vias v1 to v6, there is a possibility that the interference wave generated from the signal conductor layer SC1 passes under the metal member. On the other hand, in the case of the metal member 14 provided with the vias v1 to v6, the interference wave generated from the signal conductor layer SC1 is shielded by the vias v1 to v6. Therefore, there is a low possibility that the interference wave generated from the signal conductor layer SC1 passes under the metal member 14.

[0073] Similarly, there is a possibility that an interference wave IW2 may be generated from the signal conductor layer SC2 as shown in Fig. 4. In this case, if vias v1 to v6 are provided under the metal member 14 as shown in Fig. 4, the interference wave IW2 is shielded by the vias v1 to v6. Therefore, there is a low possibility that the interference wave IW2 will pass under the metal member 14.

[0074] As shown in Fig. 1 and Fig. 4, the sealing resin layer 18 is provided on the upper main surface SU2 of the substrate 12. The sealing resin layer 18 covers the metal member 14 and the electronic components 16a to 16e. As a result, the sealing resin layer 18 protects the metal member 14 and the electronic components 16a to 16e. At this time, the metal member 14 is fixed by the sealing resin layer 18. The material of the sealing resin layer 18 is, for example, epoxy resin. The sealing resin layer 18 has a rectangular parallelepiped shape. Therefore, the sealing resin layer 18 has an upper surface SU1, a lower surface SD1, a left surface SL1, a right surface SR1, a front surface SF1, and a rear surface SB1.

[0075] In this embodiment, the upper end of the metal member 14 is exposed from the sealing resin layer 18 at the upper surface SU1 of the sealing resin layer 18.

[0076] The left end of the left support portion 140L is located to the right of the left surface SL1 of the sealing resin layer 18. In this embodiment, the left end of the left support portion 140L is not exposed from the left surface SL1 of the sealing resin layer 18.

[0077] The right end of the right support portion 140R is located to the left of the right surface SR1 of the sealing resin layer 18. In this embodiment, the right end of the right support portion 140R is not exposed from the sealing resin layer 18 at the right surface SR1 of the sealing resin layer 18.

[0078] The shield 20 covers the upper surface SU1 of the sealing resin layer 18. In this embodiment, the shield 20 covers the upper surface SU1, left surface SL1, right surface SR1, front surface SF1, and rear surface SB1 of the sealing resin layer 18, and the left surface SL2, right surface SR2, front surface SF2, and rear surface SB2 of the substrate 12. The shield 20 is electrically connected to the metal member 14. Specifically, the shield 20 is in contact with a portion of the metal member 14 exposed from the sealing resin layer 18. Therefore, as shown in FIGS. 2, 5, and 6, the shield 20 is not in contact with the right end of the metal member 14. As shown in FIGS. 2, 5, and 6, the shield 20 is not in contact with the left end of the metal member 14.

[0079] Furthermore, the shield 20 is connected to a ground conductor layer G exposed from the rear surface SB2 of the substrate 12. As a result, the shield 20 is connected to the ground potential.

[0080] The shield 20 has a multi-layer structure. Specifically, the shield 20 includes an adhesive layer, a conductive layer, and a protective layer. The adhesive layer, conductive layer, and protective layer are laminated in this order from the bottom to the top. The adhesive layer serves to increase the adhesive strength between the conductive layer and the sealing resin layer 18. The material of the adhesive layer is, for example, SUS (Stainless Steel). The conductive layer performs a shielding function. The material of the conductive layer is, for example, a metal such as Cu, Ag, or Al. The protective layer serves to prevent corrosion of the conductive layer. The material of the protective layer is, for example, SUS.

[0081] The surface roughness of the surface of the metal member 14 in contact with the shield 20 is rougher than the surface roughness of the front principal surface SF3 and the rear principal surface SB3 of the metal member 14. This can reduce the possibility that the shield 20 will peel off from the metal member 14. More specifically, the surface roughness of the surface of the metal member 14 in contact with the shield 20 is rough. In this case, the contact area between the surface of the metal member 14 in contact with the shield 20 and the shield 20 increases. Therefore, the adhesion between the metal member 14 and the shield 20 is improved (e.g., anchor effect) compared to when the surface of the metal member 14 in contact with the shield 20 is flat. As a result, the possibility that the shield 20 will peel off from the metal member 14 in the module 10 can be reduced.

[0082] External terminals ET are provided on a lower main surface SD2 of the substrate 12. The module 10 is connected to a circuit outside the module 10 via the external terminals ET.

[0083] Incidentally, the metal member 14 of this embodiment has a highly self-supporting structure, which will be described in more detail below.

[0084] As shown in FIGS. 3 and 5, the right support portion 140R includes a first portion RFP and a second portion RSP.

[0085] The first portion RFP is connected to the right boundary CR1 as shown in Fig. 3 and Fig. 5. The first portion RFP is a portion that extends forward from the right boundary CR1 as viewed in the up-down direction as shown in Fig. 3. In this case, the right support portion 140R bends forward from the right boundary CR1. In other words, the metal member 14 is curved in the vicinity of the right boundary CR1. At this time, the first portion RFP is located forward of the plate-shaped portion 140 in the front-rear direction.

[0086] The second part RSP is connected to the right end CR2 of the first part RFP as shown in Fig. 3 and Fig. 5. The second part RSP extends from the right end CR2 of the first part RFP rearward and rightward as viewed in the up-down direction as shown in Fig. 3. In this case, the right support part 140R bends rearward and rightward from the right end CR2 of the first part RFP. At this time, as shown in Fig. 3 and Fig. 5, the second part RSP extends from the right end CR2 of the first part RFP to the right end of the right support part 140R.

[0087] With the above configuration, the right support portion 140R has a shape in which the vicinity of the center in the left-right direction protrudes forward. In this case, the right end CR2 of the first portion RFP becomes the right support portion foremost portion X1, which is located most forward in the right support portion 140R when viewed in the up-down direction. At this time, the right support portion foremost portion X1 is located in front of the plate-shaped portion 140 when viewed in the up-down direction.

[0088] In the case of the above-described configuration, the right support part 140R is in the following state. When a first straight line RS1 parallel to the left-right direction is defined as shown in Fig. 3, the first straight line RS1 overlaps with at least two points (a first point RP1 and a second point RP2 shown in Fig. 3) of the right support part 140R. When the right support part 140R has a right support part foremost portion X1, the first straight line RS1 is located in front of the plate-shaped part 140.

[0089] In addition, the angle Rθ2 of the angle between the first portion RFP and the second portion RSP is larger than the angle Rθ1 of the angle between the plate-shaped portion 140 and the first portion RFP. Specifically, as shown in Fig. 3, a second straight line RS2 parallel to the first portion RFP and a third straight line RS3 parallel to the second portion RSP are defined when viewed in the up-down direction. At this time, the angle Rθ2 of the angle between the second straight line RS2 and the third straight line RS3 is larger than the angle Rθ1 of the angle between the first straight line RS1 and the second straight line RS2, as shown in Fig. 3.

[0090] 6 and 7, the lower cutout 144R is provided in a portion where the first portion RFP and the second portion RSP are connected (a portion protruding forward in the right support portion 140R). In this case, in the right support portion 140R, the lower cutout 144R overlaps with the right support portion foremost portion X1 when viewed in the up-down direction.

[0091] The left support part 140L will be described below. The left support part 140L has a structure rotationally symmetrical to the right support part 140R.

[0092] As shown in FIGS. 3 and 5, the left support portion 140L includes a first portion LFP and a second portion LSP.

[0093] The first portion LFP is connected to the left boundary CL1 of the plate-shaped portion 140 as shown in Fig. 3 and Fig. 5. The first portion LFP is a portion that extends rearward from the left boundary CL1 when viewed in the up-down direction as shown in Fig. 3. In this case, the left support portion 140L bends rearward from the left boundary CL1. In other words, the metal member 14 is curved in the vicinity of the left boundary CL1. At this time, the first portion LFP is located rearward of the plate-shaped portion 140 in the front-rear direction.

[0094] The second part LSP is connected to the left end CL2 of the first part LFP as shown in Fig. 3 and Fig. 5. The second part LSP extends forward and leftward from the left end CL2 of the first part LFP as viewed in the up-down direction as shown in Fig. 3. In this case, the left support part 140L bends forward and leftward from the left end CL2 of the first part LFP. At this time, as shown in Fig. 3 and Fig. 5, the second part LSP extends from the left end CL2 of the first part LFP to the left end of the left support part 140L.

[0095] As a result, the left support part 140L has a shape in which the vicinity of the center in the left-right direction protrudes rearward. In this case, the left end CL2 of the first part LFP becomes the left support part rearmost part X2, which is located furthest back in the left support part 140L when viewed in the up-down direction. At this time, the left support part rearmost part X2 is located rearward of the plate-shaped part 140 when viewed in the up-down direction.

[0096] In the above-described configuration, the left support part 140L is in the following state. When a first straight line LS1 parallel to the left-right direction is defined as shown in Fig. 3, the first straight line LS1 overlaps with at least two points (a first point LP1 and a second point LP2) of the left support part 140L. When the left support part 140L has a left support part rearmost portion X2, the first straight line LS1 is located behind the plate-shaped part 140.

[0097] Also, the angle Lθ2 of the angle between the first portion LFP and the second portion LSP is larger than the angle Lθ1 of the angle between the plate-like portion 140 and the first portion LFP. Specifically, as shown in Fig. 3, a second straight line LS2 parallel to the first portion LFP and a third straight line LS3 parallel to the second portion LSP are defined when viewed in the up-down direction. The angle Lθ2 of the angle between the second straight line LS2 and the third straight line LS3 is larger than the angle Lθ1 of the angle between the first straight line LS1 and the second straight line LS2.

[0098] 6 and 7, the lower cutout 144L is provided in a portion where the first portion LFP and the second portion LSP are connected (a portion protruding rearward in the left support portion 140L). In this case, in the left support portion 140L, the lower cutout 144L overlaps with the left support portion rearmost portion X2 when viewed in the up-down direction.

[0099] The metal member 14 may have a structure including a right support portion 140R having a shape protruding rearward near the center in the left-right direction, instead of the right support portion 140R having a shape protruding rearward near the center in the left-right direction. In this case, the right support portion 140R has a right support portion rearmost part located rearward of the plate-shaped portion 140, which is the right support portion rearmost part located rearward of the plate-shaped portion 140. At this time, the right support portion 140R bends rearward from the right boundary CR1. Furthermore, the right support portion 140R bends forward and rightward from the right support portion rearmost part.

[0100] The metal member 14 may have a structure including a left support portion 140L having a shape protruding forward near the center in the left-right direction, instead of the left support portion 140L having a shape protruding rearward near the center in the left-right direction. In this case, the left support portion 140L has a left support portion foremost portion located forward of the plate-shaped portion 140, which is the left support portion foremost portion located at the front of the left support portion 140L. At this time, the left support portion 140L bends forward from the left boundary CL1. Furthermore, the left support portion 140L bends rearward and leftward from the left support portion foremost portion.

[0101] [Module manufacturing method] Next, a manufacturing method of the module 10 will be described with reference to the drawings. Fig. 10 is a perspective view of the metal member 14 during manufacturing. Fig. 11 is a view of the metal member 14 during manufacturing, as seen from the front. Fig. 12 is a top view of the metal member 14 and the mounting electrodes 122 during manufacturing.

[0102] First, in a first step, the substrate 12 is prepared. Electronic components 16a to 16e are mounted on an upper main surface SU2 of the substrate 12. A plurality of external terminals ET are provided on a lower main surface SD2 of the substrate 12. The substrate 12 is provided with vias v1 to v6, v11, v12, v21, and v22 and signal conductor layers SC1 and SC2.

[0103] In the next step, as shown in FIG. 9, the metal members 14 are mounted on the substrate 12 so as to extend in the vertical direction on the upper main surface SU2 of the substrate 12 and between the electronic components 16a, 16b and the electronic components 16c, 16d, 16e.

[0104] Here, the metal member 14 during the manufacture of the module 10 will be described. During the manufacture of the module 10, the metal member 14 further includes a top surface portion 148 (see FIGS. 10 and 11). As shown in FIGS. 10 and 11, the top surface portion 148 is located between the upper cutouts 142a and 142b when viewed in the front-rear direction. The top surface portion 148 extends rearward from the upper side LU (see FIG. 11). The top surface portion 148 is formed by bending a part of the metal member 14 rearward.

[0105] The top surface portion 148 is used for mounting the metal member 14. Specifically, a mounting machine is used to suck the top surface portion 148. Then, the mounting machine moves the metal member 14, and the legs 146L1, 146L2, 146a to 146d, 146R1, and 146R2 are set on the mounting electrodes 122.

[0106] Thereafter, the legs 146L1, 146L2, 146a to 146d, 146R1, and 146R2 are fixed to the mounting electrode 122 with solders Sd1 to Sd6, respectively. At this time, solder is applied to the legs 146L1, 146L2, 146a to 146d, 146R1, and 146R2, respectively, and also to the mounting electrode 122.

[0107] 12, the mounting electrodes 1222-1225 and the solders Sd2-Sd5 that overlap with the plate-shaped portion 140 when viewed in the up-down direction are located near the center in the front-rear direction of the plate-shaped portion 140. This makes it easier for the forward force of the solders Sd2-Sd5 pulling the metal member 14 and the rearward force of the solders Sd2-Sd5 pulling the metal member 14 to be uniform. As a result, the self-supporting ability of the metal member 14 is improved.

[0108] The top surface portion 148 may extend rearward from the plate-like portion 140 .

[0109] Next, in the second step, the sealing resin layer 18 is formed on the upper main surface SU2 of the substrate 12. At this time, the sealing resin layer 18 is formed so as to cover the entire upper main surface SU2 of the substrate 12. Specifically, the substrate 12 is set in a metal mold. Then, molten resin (molten resin) is injected into the metal mold. At this time, the molten resin passes through the upper cutouts 142a, 142b and the lower cutouts 144a to 144c, 144L, and 144R and spreads over the entire upper main surface SU2 of the substrate 12. Then, the electronic components 16a to 16e and the metal member 14 are located within the sealing resin layer 18. That is, the electronic components 16a to 16e and the metal member 14 are not exposed from the sealing resin layer 18.

[0110] Next, in a third step, the upper main surface SU of the encapsulating resin layer 18 is ground with a grindstone. The grindstone grinds the upper surface SU1 of the encapsulating resin layer 18 while, for example, moving forward relative to the upper surface SU1 of the encapsulating resin layer 18. As a result, the upper end of the metal member 14 is exposed from the upper surface SU1 of the encapsulating resin layer 18. When grinding the upper surface SU1 of the encapsulating resin layer 18, the top surface portion 148 of the metal member 14 is ground. Specifically, the encapsulating resin layer 18 is ground while the grindstone is moved forward relative to the encapsulating resin layer 18.

[0111] In addition, the upper end of the metal member 14 is ground with a grindstone. Therefore, the surface roughness of the upper end of the plate-shaped portion 140 is greater than the surface roughness of the front principal surface SF3 and the rear principal surface SB3 of the plate-shaped portion 140.

[0112] Furthermore, in a fourth step, a dicer is used to cut the substrate 12 and the sealing resin layer 18 in the up-down direction to divide the substrate 12 and the sealing resin layer 18. At this time, a left surface SL1, a right surface SR1, a front surface SF1, and a rear surface SB1 of the sealing resin layer 18 are formed. The left end of the left support portion 140L and the right end of the right support portion 140R are exposed from the left surface SL1 and the right surface SR1 of the sealing resin layer 18, respectively.

[0113] Next, in the fifth step, the shield 20 is formed on the upper surface SU1, the left surface SL1, the right surface SR1, the front surface SF1, and the rear surface SB1 of the sealing resin layer 18. Specifically, three sputtering processes are performed to form an adhesion layer, a conductive layer, and a protective layer. As described above, the surface roughness of the upper end of the metal member 14, the left end of the left support portion 140L, and the right end of the right support portion 140R is greater than the surface roughness of the front main surface SF3 and the rear main surface SB3 of the metal member 14. Therefore, the adhesion layer adheres to the upper end of the metal member 14, the left end of the left support portion 140L, and the right end of the right support portion 140R with high adhesion strength.

[0114] Through the above steps, the module 10 is completed.

[0115] [effect] According to the metal member 14, the self-supporting property of the metal member 14 is improved. More specifically, the right support portion 140R of the metal member 14 includes a first portion RFP extending forward and to the right from the right boundary CR1. As a result, when the metal member 14 is pushed forward, the first portion RFP supports the metal member 14. Therefore, the metal member 14 is less likely to rotate forward about the upper side LU. Therefore, the possibility that the metal member 14 will fall forward is reduced. For the same reason, the first portion LFP prevents the metal member 14 from falling backward. As a result, the self-supporting property of the metal member 14 is improved by the right support portion 140R or the left support portion 140L of this embodiment.

[0116] The metal member 14 enhances the self-supporting ability of the metal member 14. More specifically, the right support part 140R has the second part RSP. This increases the weight of the metal member 14. In this case, the downward force applied to the metal member 14 becomes stronger. Therefore, the metal member 14 becomes less susceptible to the influence of the front-rear force applied to the metal member 14. For the same reason, the second part LSP makes the metal member 14 less susceptible to the influence of the front-rear force applied to the metal member 14, and as a result, the right support part 140R or the left support part 140L of this embodiment improves the self-supporting ability of the metal member 14.

[0117] The metal member 14 enhances the self-supporting ability of the metal member 14. More specifically, the right support part 140R has the second part RSP. By the right support part 140R having the second part RSP, the area of ​​the solder that contacts the metal member 14 is increased. This increases the force of the solder that supports the metal member 14. Therefore, the self-supporting ability of the metal member 14 is enhanced.

[0118] According to the module 10 including the metal member 14, the degree of freedom in layout of electronic components in the module 10 is increased. More specifically, the metal member 14 includes a right support portion 140R having a first portion RFP and a second portion RSP. Below, a description will be given by comparing a metal member not including the right support portion 140R (hereinafter referred to as Comparative Example 1) with the metal member 14. In the case of Comparative Example 1, it is necessary to bend the lower end portions of all the legs in the forward or backward direction in order to improve the self-supporting property of Comparative Example 1. In this case, it is necessary to greatly protrude the legs in the forward or backward direction in order to improve the self-supporting property of Comparative Example 1. Therefore, in the case of a module including Comparative Example 1, there is a risk that the area on the board on which electronic components can be mounted will be narrowed.

[0119] On the other hand, in the metal member 14, the right support portion 140R has the first portion RFP and the second portion RSP, thereby ensuring self-supporting property. Therefore, it is not necessary to bend the lower ends of the legs 146L1, 146L2, 146a to 146d, 146R1, and 146R2 of the metal member 14 forward or backward. This prevents the metal member 14 from protruding forward or backward significantly. Therefore, in the case of the module 10 including the metal member 14, the area on the board 12 on which electronic components can be mounted is not narrowed. As a result, the degree of freedom in the layout of the electronic components in the module 10 is increased. For the same reason, the metal member 14 includes the left support portion 140L having the first portion LFP and the second portion LSP, thereby ensuring self-supporting property. As a result, it is not necessary to make the legs 146L1, 146L2, 146a to 146d, 146R1, and 146R2 of the metal member 14 protrude significantly forward or backward in order to ensure the independence of the metal member 14. In the case of the module 10 including the metal member 14, the area on the board on which electronic components can be mounted is not narrowed. As a result, the degree of freedom in the layout of the electronic components in the module 10 is increased.

[0120] Furthermore, when the right support portion 140R includes the right support portion foremost portion X1 that is located at the forefront of the right support portion 140R and is located in front of the plate-shaped portion 140 when viewed in the up-down direction, the self-supporting ability of the metal member 14 is improved. Therefore, the self-supporting ability of the metal member 14 can be ensured even if the right support portion 140R does not protrude significantly in the forward direction. Therefore, compared to Comparative Example 1, it is possible to minimize the amount of protrusion of the metal member 14 in the forward or rearward direction.

[0121] Also, by increasing the area of ​​the right support part 140R, it is possible to disperse the pressure of the metal member 14 pressing into the solder. In other words, by the right support part 140R having a first part RFP extending in the forward direction and a second part RSP extending in the rearward direction, the area of ​​the lower end of the metal member 14 is increased. This makes it possible to disperse the pressure of the metal member 14 pressing into the solder. Similarly, by the left support part 140L having a first part LFP extending in the rearward direction and a second part LSP extending in the forward direction, it is possible to disperse the pressure of the metal member 14 pressing into the solder.

[0122] According to the metal member 14, the self-supporting property of the metal member 14 is improved. More specifically, the right support portion 140R has a first portion RFP and a second portion RSP extending in the rear direction. In addition, when the sealing resin layer 18 is formed, the molten resin passes through the lower cutouts 144R and 144L and spreads over the entire upper main surface SU2 of the substrate 12. At this time, the molten resin flows along the shape of the right support portion 140R. That is, a part of the molten resin flowing from the front direction to the rear direction flows to the left by the first portion RFP. And a part of the molten resin flowing from the front direction to the rear direction flows to the right by the second portion RSP. Therefore, it is possible to disperse the pressure of the molten resin in two directions (rightward and leftward). As a result, the pressure of the molten resin is not concentrated in the vicinity of the lower side LD of the right support portion 140R and the left support portion 140L. Therefore, the metal member 14 is suppressed from falling so as to rotate around the upper side LU. As a result, the self-supporting property of the metal member 14 is improved.

[0123] According to the module 10 including the metal member 14, the degree of freedom in the layout of electronic components in the module 10 is increased. In general, electronic components need to be arranged at a predetermined distance from the end of the substrate 12. On the other hand, the right support portion 140R can be arranged at the end of the substrate 12. Therefore, by arranging the right support portion 140R at the end of the substrate 12 where electronic components cannot be arranged, it is possible to prevent the area of ​​the region in which electronic components can be arranged from being narrowed. As a result, the degree of freedom in the layout of electronic components in the module 10 is increased. In other words, by arranging the right support portion 140R for enhancing the self-supporting property of the metal member 14 at the end of the substrate 12, the degree of freedom in the layout of electronic components in the module 10 is increased. For the same reason, by arranging the left support portion 140L for enhancing the self-supporting property of the metal member 14 at the end of the substrate 12, the degree of freedom in the layout of electronic components in the module 10 is increased.

[0124] According to the module 10 including the metal member 14, the degree of freedom in the layout of electronic components in the module 10 is increased. The right support portion 140R has a first portion RFP extending in the forward direction and a second portion RSP extending in the rearward direction. Due to this shape, the right support portion 140R can have high self-supporting properties even if it does not protrude significantly only in the forward direction or the rear direction. Since the right support portion 140R does not protrude significantly only in the forward direction or the rear direction, the region (area) in which electronic components can be mounted is increased on the upper main surface SU2 of the substrate 12. As a result, the metal member 14 of this embodiment can increase the degree of freedom in the layout of electronic components. For the same reason, the left support portion 140L has a first portion LFP extending in the rearward direction and a second portion LSP extending in the forward direction, so that the region (area) in which electronic components can be mounted is increased in the module 10.

[0125] According to the module 10 including the metal member 14, the degree of freedom in layout of electronic components in the module 10 is increased. More specifically, when the right support portion 140R forms an angle at the right end CR2 of the first part RFP when viewed in the up-down direction, the angle Rθ2 of the angle formed by the second straight line RS2 and the third straight line RS3 in the right support portion 140R is larger than the angle Rθ1 of the angle formed by the first straight line RS1 and the second straight line RS2 in the right support portion 140R. In this case, a part of the right support portion 140R is not formed in front of the right end CR2 of the first part RFP (the second part RSP is not located in front of the right end CR2 of the first part RFP). Below, a metal member in which a part of the right support portion 140R is located in front of the right end CR2 of the first part RFP (hereinafter referred to as Comparative Example 2) will be compared with the metal member 14 for explanation. In the case of Comparative Example 2, the second part is located in front of the first part. In other words, the first and second parts of the comparative example 2 protrude forward. In this case, the electronic components need to be spaced apart from the comparative example 2 by the length of the protrusion forward. Therefore, there is a risk that the degree of freedom in arranging the electronic components may be restricted. On the other hand, in the case of the metal member 14, the second part RSP is not positioned in front of the first part RFP. Specifically, the second part RSP is bent backward at the right end CR2 of the first part RFP. That is, the metal member 14 does not protrude forward. Therefore, the region (area) on the upper main surface SU2 of the substrate 12 where electronic components can be mounted is increased. As a result, the metal member 14 of this embodiment can increase the degree of freedom in the layout of electronic components.

[0126] Moreover, when the left support part 140L forms an angle at the left end CL2 of the first part LFP when viewed in the up-down direction, the angle Lθ2 of the angle formed by the second straight line LS2 and the third straight line LS3 of the left support part 140L is larger than the angle Lθ1 of the angle formed by the first straight line LS1 and the second straight line LS2 of the left support part 140L. In this case, the left support part 140L is not formed behind the left end CL2 of the first part LFP (the second part LSP is not located behind the left end CL2 of the first part LFP). Below, a metal member in which a part of the left support part 140L is located behind the left end CL2 of the first part LFP (hereinafter referred to as Comparative Example 3) is compared with the metal member 14 for explanation. In the case of Comparative Example 3, the second part is located behind the first part. In other words, Comparative Example 3 is largely protruded backward by the first part and the second part. In this case, it is necessary to move the electronic component away from Comparative Example 3 by the length of the protrusion in the backward direction. Therefore, there is a risk that the degree of freedom in arranging electronic components may be limited. On the other hand, in the case of the metal member 14, the second portion LSP is not located behind the first portion LFP. Specifically, the second portion LSP bends forward at the left end CL2 of the first portion LFP. That is, the metal member 14 does not protrude significantly in the rear direction. Therefore, the region (area) on the upper main surface SU2 of the substrate 12 where electronic components can be mounted is increased. As a result, the metal member 14 of this embodiment can increase the degree of freedom in the layout of electronic components.

[0127] According to the module 10, the metal member 14 can be prevented from falling when the sealing resin layer 18 is formed. More specifically, the plate-shaped portion 140 is provided with upper notches 142a and 142b extending downward from the upper side LU. The plate-shaped portion 140 is provided with one or more lower notches 144a to 144c extending upward from the lower side LD. As a result, when the sealing resin layer 18 is formed, the molten resin passes through the upper notches 142a and 142b and the lower notches 144a to 144c and spreads over the entire upper main surface SU2 of the substrate 12. Therefore, the vicinity of the upper side LU and the vicinity of the lower side LD of the plate-shaped portion 140 are less likely to be subjected to pressure from the molten resin. This prevents the plate-shaped portion 140 from falling as if rotating around the upper side LU or the plate-shaped portion 140 from falling as if rotating around the lower side LD. As a result, according to the module 10, the metal member 14 can be prevented from falling when the sealing resin layer 18 is formed.

[0128] According to the module 10, the potential of the metal member 14 is likely to be uniform. More specifically, the legs 146a to 146c are arranged at equal intervals in the left-right direction when viewed in the front-rear direction. The legs 146a to 146c are connected to the ground potential via the mounting electrode 122. As a result, the metal member 14 is connected to the ground potential at the portions arranged at equal intervals in the left-right direction when viewed in the front-rear direction. As a result, according to the module 10, the potential of the metal member 14 is likely to be uniform.

[0129] According to the metal member 14, the self-alignment property of the legs 146a to 146d is improved. More specifically, the legs 146a to 146d are arranged at equal intervals in the left-right direction when viewed in the front-rear direction. As a result, when the solder melts during mounting of the metal member 14, the solder attached to the lower ends of the legs 146a to 146d has a symmetrical structure. In this case, a difference in the force pulled by the solder is unlikely to occur between the left part of the plate-shaped part 140 and the right part of the plate-shaped part 140 (the pulling force is not concentrated on either the right part or the left part of the plate-shaped part 140). In other words, when the solder melts during mounting of the metal member 14, the independence of the metal member 14 is ensured. As a result, according to the metal member 14, the self-alignment property of the legs 146a to 146d is improved. The self-alignment property means that when the solder melts during mounting of the metal member 14, the legs 146a to 146d are maintained in an appropriate position by the surface tension of the solder.

[0130] According to the module 10, it is possible to prevent the metal member 14 from falling when the sealing resin layer 18 is formed. More specifically, in the module 10, the lower cutouts 144a to 144c are arranged at equal intervals in the left-right direction when viewed in the front-rear direction. This allows the vicinity of the lower edge LD of the plate-shaped portion 140 to receive uniform pressure from the molten resin. As a result, it is possible to prevent the plate-shaped portion 140 from falling due to a large pressure being applied to a specific portion near the lower edge LD of the plate-shaped portion 140.

[0131] According to the module 10, the processing of the metal member 14 is easy. More specifically, the shortest distance between the upper cutouts 142a, 142b and the lower cutouts 144a to 144c is 1.5 times or more the plate thickness of the plate-shaped portion 140. This prevents the upper cutouts 142a, 142b and the lower cutouts 144a to 144c from being too close to each other. As a result, the punching process of the metal member 14 is easy.

[0132] In addition, since the plate-shaped portion 140 is provided with the upper notches 142a and 142b, the total length of the upper end of the metal member 14b in the left-right direction is short. Therefore, when grinding the upper surface SU1 of the sealing resin layer 18, the amount of the metal member 14 to be ground is reduced. As a result, deterioration of the grindstone is suppressed.

[0133] In module 10, since mounting electrode 122 has a large area, the solder on mounting electrode 122 is positioned on the front, rear, left and right sides of legs 146L1, 146L2, 146a to 146d, 146R1, and 146R2. This makes it easier for the solder to wet and rise upward on the side surfaces of legs 146L1, 146L2, 146a to 146d, 146R1, and 146R2.

[0134] In the module 10, the cleaning property of the flux is improved. More specifically, after the metal member 14 is mounted on the mounting electrode 122, the board 12 and the metal member 14 are immersed in a tank containing a flux cleaning liquid. This cleans the flux. At this time, in order to improve the cleaning property of the flux, it is preferable that the flux cleaning liquid has high fluidity. Therefore, the upper notches 142a, 142b and the lower notches 144L, 144R, 144a to 144c are provided in the metal member 14. This allows the flux cleaning liquid to pass through the upper notches 142a, 142b and the lower notches 144L, 144R, 144a to 144c. Therefore, the fluidity of the flux cleaning liquid is improved. As a result, in the module 10, the cleaning property of the flux is improved. Furthermore, the flux cleaning liquid remaining at the bent portion of the top surface portion 148 flows out from the bent portion of the top surface portion 148 through the upper cutouts 142a and 142b.

[0135] In the right support portion 140R shown in FIGS. 2 and 3, the position of the right end of the right support portion 140R in the front-rear direction is substantially the same as the position of the plate-shaped portion 140 in the front-rear direction. In other words, the second portion RSP extends from the first portion RFP so that the position of the right end of the second portion RSP in the front-rear direction is the same as the position of the plate-shaped portion 140 in the front-rear direction. The length of the second portion RSP extending from the first portion RFP may be short. Specifically, the second portion RSP may be located in front of the plate-shaped portion 140. In this case, the length of the mounting electrode 1226 in the left-right direction can be shortened by the amount that the second portion RSP is short. Therefore, the degree of freedom in arranging the metal member 14 can be increased.

[0136] (Embodiment of Example 2) Hereinafter, the metal member 14a according to the embodiment of Example 2 will be described with reference to the drawings. Fig. 13 is a top view of the metal member 14a according to the embodiment of Example 2.

[0137] Metal member 14a differs from metal member 14 in that it includes a right support portion 140Ra having a different shape from right support portion 140R. Similarly, metal member 14a differs from metal member 14 in that it includes a left support portion 140La having a different shape from left support portion 140L. Note that parts of metal member 14 that have the same configuration as metal member 14 are given the same reference numerals as metal member 14, and descriptions thereof will be omitted.

[0138] The right support part 140Ra includes a second part RSPa having a different shape from the second part RSP. More specifically, the right end of the second part RSPa is located behind the plate-shaped part 140. As a result, the right support part 140Ra includes a right support part front part FR and a right support part rear part BR as shown in FIG. 13. The right support part front part FR is located in front of the plate-shaped part 140 as shown in FIG. 13. Specifically, when a straight line SRL including a line passing through the plate-shaped part 140 when viewed in the up-down direction is defined, the right support part front part FR is located in front of the straight line SRL. In this case, the right support part front part FR includes a part of the second part RSPa and the first part RFP as shown in FIG. 13.

[0139] The right support portion rear portion BR is located behind the straight line SRL as shown in Fig. 13. In this case, the right support portion rear portion BR includes a part of the second portion RSPa as shown in Fig. 13.

[0140] Similar to the right support part 140Ra, the left support part 140La includes a second part LSPa having a different shape from the second part LSP. More specifically, the left end of the second part LSPa is located in front of the plate-shaped part 140. As a result, the left support part 140La includes a left support part front part FL and a left support part rear part BL as shown in FIG. 13. The left support part rear part BL is located behind the straight line SRL as shown in FIG. In this case, the left support part rear part BL includes a part of the second part LSPa and the first part LFP as shown in FIG. 13.

[0141] The left support part front portion FL is located in front of the straight line SRL as shown in Fig. 13. In this case, the left support part front portion FL includes a part of the second portion LSPa as shown in Fig. 13.

[0142] The metal member 14a does not necessarily have to include both the right support portion 140Ra and the left support portion 140La. The metal member 14a only needs to include at least one of the right support portion 140Ra or the left support portion 140La.

[0143] (Effects of the second embodiment) The metal member 14a improves the self-supporting ability of the metal member 14a. More specifically, the right support part 140Ra includes a right support part front portion FR and a right support part rear portion BR. This makes it possible to prevent the upper side of the metal member 14 from falling over so as to rotate in the rear direction. Alternatively, the left support part 140La includes a left support part front portion FL and a left support part rear portion BL. This makes it possible to prevent the upper side of the metal member 14 from falling over so as to rotate in the forward direction. As a result, the self-supporting ability of the metal member 14a is improved.

[0144] (Embodiment of Example 3) Hereinafter, the metal member 14b according to the embodiment of Example 3 will be described with reference to the drawings. Fig. 14 is a perspective view of the metal member 14b according to the embodiment of Example 3. Fig. 15 is a top view of the metal member 14b according to the embodiment of Example 3.

[0145] 14 and 15, the metal member 14b differs from the metal member 14 in that it includes a right support portion 140Rb that is different in shape from the right support portion 140R. Similarly, the metal member 14b differs from the metal member 14 in that it includes a left support portion 140Lb that is different in shape from the left support portion 140L.

[0146] 14 and 15, the shape of the first portion RFPb of the right support portion 140Rb is different from the shape of the first portion RFP of the right support portion 140R. In addition, the shape of the second portion RSPb of the right support portion 140Rb is different from the shape of the second portion RSP of the right support portion 140R.

[0147] The first portion RFPb and the second portion RSPb have an arc shape when viewed in the up-down direction, as shown in Fig. 15. Specifically, a part of the first portion RFPb describes an arc around a first point XR1 at the right boundary CR1 when viewed in the up-down direction, as shown in Fig. 15.

[0148] Also, as shown in FIG. 15, a part of the second portion RSPb describes an arc centered on a second point XR2 when viewed in the up-down direction at the right end CR2 (right support portion foremost portion X1) of the first portion RFPb.

[0149] At this time, the degree of bending of the right support portion 140Rb in the vicinity of the right end CR2 of the first portion RFPb is greater than the degree of bending of the right support portion 140Rb in the vicinity of the right boundary CR1.

[0150] Specifically, a part of the first portion RFPb becomes an arc (a first arc in the right support part 140Rb) centered on the first point XR1 at the right boundary CR1 when viewed in the up-down direction, as shown in Fig. 15. In this case, as shown in Fig. 15, a radius of curvature dR1 of the arc centered on the first point XR1 when viewed in the up-down direction can be defined.

[0151] Similarly, a part of the second part RSPb becomes an arc (a second arc in the right support part 140Rb) centered on the second point XR2 at the right end CR2 (the right support part foremost part X1) of the first part RFPb when viewed in the up-down direction, as shown in Fig. 15. In this case, as shown in Fig. 15, a radius of curvature dR2 of the arc centered on the second point XR2 when viewed in the up-down direction can be defined.

[0152] The radius of curvature dR2 is smaller than the radius of curvature dR1.

[0153] As shown in FIG. 15, similarly to the right support part 140Rb, the first part LFPb and the second part LSPb of the left support part 140Lb have an arc shape when viewed in the up-down direction.

[0154] As shown in FIG. 15, a part of the first portion LFPb of the left support part 140Lb describes an arc (a first arc in the left support part 140Lb) centered on the first point XL1 at the left boundary CL1 when viewed in the up-down direction.

[0155] As shown in FIG. 15, a part of the second portion LSPb describes an arc (a second arc in the left support portion 140Lb) centered on a second point XL2 at the left end CL2 (left support portion rearmost portion X2) of the first portion LFPb when viewed in the up-down direction.

[0156] At this time, the degree of bending of the left support part 140Lb in the vicinity of the left end CL2 of the first part LFPb is greater than the degree of bending of the left support part 140Lb in the vicinity of the left boundary CL1.

[0157] Specifically, part of the first portion LFPb is a circular arc centered on the first point XL1 at the left boundary CL1. In this case, a radius of curvature dL1 of the circular arc centered on the first point XL1 when viewed in the up-down direction can be defined.

[0158] Similarly, a part of the second portion LSPb becomes an arc centered on the second point XL2 near the left end CL2 of the first portion LFPb. In this case, a radius of curvature dL2 of the arc centered on the second point XL2 when viewed in the up-down direction can be defined. The radius of curvature dL2 is smaller than the radius of curvature dL1.

[0159] (Effects of the third embodiment) The metal member 14b increases the strength of the metal member 14b. More specifically, the right support portion 140Rb is curved in an arc shape near the right boundary CR1 and near the right end CR2 of the first portion RFPb. As a result, no corners are formed at the right boundary CR1 and the right end CR2 of the first portion RFPb when viewed in the up-down direction. This reduces the possibility of breakage occurring at the right boundary CR1 and the right end CR2 of the first portion RFPb. Therefore, the strength of the metal member 14b increases.

[0160] Furthermore, the left support part 140Lb is curved in an arc shape near the left boundary CL1 and near the left end CL2 of the first part LFPb. As a result, no corners are formed at the left boundary CL1 and the left end CL2 of the first part LFPb when viewed in the up-down direction. This reduces the possibility of breakage occurring at the left boundary CL1 and the left end CL2 of the first part LFPb. This increases the strength of the metal member 14b.

[0161] According to the module 10 including the metal member 14b, the degree of freedom in layout of electronic components in the module 10 is increased. More specifically, the radius of curvature dR2 of the arc of the right support part 140Rb drawn around the second point XR2 is smaller than the radius of curvature dR1 of the arc of the right support part 140Rb drawn around the first point XR1. In this case, the right support part 140Rb is not formed in front of the right end CR2 of the first part RFPb (the second part RSPb is not positioned in front of the right end CR2 of the first part RFPb). Below, a metal member in which a part of the right support part 140Rb is positioned in front of the right end CR2 of the first part RFPb (hereinafter referred to as Comparative Example 4) is compared with the metal member 14b for explanation. In the case of Comparative Example 4, the second part is positioned in front of the first part. In other words, Comparative Example 4 is largely protruded forward by the first part and the second part. In this case, the electronic components provided in the module need to be spaced away from Comparative Example 4 by the length of the protrusion in the forward direction. Therefore, there is a risk of restrictions being placed on the arrangement of the electronic components. On the other hand, in the case of the metal member 14b, the second portion RSPb is not positioned in front of the first portion RFPb. Specifically, the second portion RSPb is bent in the rear direction at the right end CR2 of the first portion RFPb. That is, the metal member 14 does not protrude significantly in the forward direction. Therefore, the region (area) in which the electronic components can be placed is increased on the upper main surface SU2 of the substrate 12. As a result, the metal member 14b of this embodiment can increase the degree of freedom in the layout of the electronic components.

[0162] Also, the radius of curvature dL2 of the arc of the left support part 140Lb drawn around the second point XL2 is smaller than the radius of curvature dL1 of the arc of the left support part 140Lb drawn around the first point XL1. In this case, the left support part 140L is not formed behind the left end CL2 of the first part LFPb. For example, when the magnitude of the radius of curvature dL2 is larger than the magnitude of the radius of curvature dL1, the second part LSPb is positioned behind the left end CL2 of the first part LFPb (the second part LSP is not positioned behind the left end CL2 of the first part LFP). Below, a metal member in which a part of the left support part 140L is positioned behind the left end CL2 of the first part LFP (hereinafter referred to as Comparative Example 5) is compared with the metal member 14b for explanation. In the case of Comparative Example 5, the second part is positioned behind the first part. In other words, Comparative Example 5 is largely protruded backward by the first part and the second part. In this case, the electronic components need to be spaced away from Comparative Example 5 by the length of the protrusion in the rear direction. Therefore, there is a risk of restrictions being placed on the arrangement of the electronic components. On the other hand, in the case of the metal member 14b, the second portion LSPb is not positioned behind the first portion LFPb. Specifically, the second portion LSPb bends in the front direction at the left end CL2 of the first portion LFPb. That is, the metal member 14b does not protrude significantly in the rear direction. Therefore, the region (area) in which the electronic components can be arranged is increased on the upper main surface SU2 of the substrate 12. As a result, the metal member 14 of this embodiment can increase the degree of freedom in the layout of the electronic components.

[0163] (Embodiment of Example 4) Hereinafter, the metal member 14c according to the embodiment of Example 4 will be described with reference to the drawings. Fig. 16 is a perspective view of the metal member 14c according to the embodiment of Example 4. Fig. 17 is a top view of the metal member 14c according to the embodiment of Example 4. Note that the same reference numerals are used for the same configuration as the metal member 14, and the description will be omitted.

[0164] As shown in FIGS. 16 and 17, the metal member 14c differs from the metal member 14 in that it includes a right support portion 140Rc having a different shape from the right support portion 140R.

[0165] 17, the first part RFPc of the right support part 140Rc bends rearward from the right boundary CR1. Also, the right support part 140Rc bends forward and rightward at the right end CR2 of the first part RFPc when viewed in the up-down direction.

[0166] At this time, the metal member 14c is in the following state. The right support portion 140Rc has a right support portion rearmost portion X3. The right support portion rearmost portion X3 is located at the frontmost position of the right support portion 140Rc, as shown in Fig. 17. The right support portion rearmost portion X3 is located behind the plate-shaped portion 140, as shown in Fig. 17.

[0167] Furthermore, the metal member 14c is in the following state. The left support portion 140L has a left support portion rearmost portion X2. As shown in Fig. 17, the left support portion rearmost portion X2 is located forward of the left end and the right end of the left support portion 140L. The left support portion rearmost portion X2 is located at the frontmost position of the left support portion 140L.

[0168] In other words, in the metal member 14c, both the right support portion 140Rc and the left support portion 140L have a shape that protrudes rearward near the center in the left-right direction.

[0169] In addition, in the metal member 14c, both the right support portion 140Rc and the left support portion 140L may have a shape that protrudes forward near the center in the left-right direction.

[0170] (Effects of the fourth embodiment) According to the metal member 14c, the self-supporting property of the metal member 14c is improved. More specifically, in the case of the metal member 14c, the two support parts (the right support part 140Rc and the left support part 140L) are located in front of the plate-shaped part 140. This reduces the possibility that the metal member 14c will fall over so as to rotate backward around the upper side LU. Therefore, the self-supporting property of the metal member 14c is improved.

[0171] (Embodiment of Example 5) Hereinafter, a metal member 14d according to an embodiment of Example 5 will be described with reference to the drawings. Fig. 18 is a view of the metal member 14d according to the embodiment of Example 5 as viewed in the front direction.

[0172] The metal member 14d differs from the metal member 14a in that it is provided with lower cutouts 144CR, 144CL (second lower cutouts). The lower cutout 144CR is provided at a position overlapping with the right boundary CR1 when viewed in the vertical direction, as shown in Fig. 18. Similarly, the lower cutout 144CL is provided at a position overlapping with the left boundary CL1 when viewed in the vertical direction, as shown in Fig. 18.

[0173] The shapes of the lower cutouts 144CR, 144CL when viewed in the front-rear direction substantially correspond to the shapes of the lower cutouts 144R, 144L when viewed in the front-rear direction.

[0174] (Effects of the embodiment of Example 5) The metal member 14d improves the self-supporting property of the metal member 14d. More specifically, the metal member 14d has a lower cutout 144CR at a position (left end of the right support portion 140R) overlapping with the right boundary CR1 when viewed in the vertical direction. The metal member 14d also has a lower cutout 144CL at a position (right end of the left support portion 140L) overlapping with the left boundary CL1 when viewed in the vertical direction. In other words, the lower cutout is provided at a portion of the metal member 14 that has been bent. This allows the module 10 to be manufactured without impairing the fluidity of the molten resin when the sealing resin layer 18 is formed.

[0175] In the above configuration, the right support portion 140R is provided with a lower notch 144R and a lower notch 144CR. The lower notch 144R is provided in the right support portion front portion X1 (portion protruding forward in the metal member 14) in the right support portion 140R. In this case, when the sealing resin layer 18 is formed, the molten resin flowing from the rear to the front direction gathers in the vicinity of the right support portion front portion X1. At this time, the molten resin is likely to apply a pressure in the forward direction to the vicinity of the right support portion front portion X1 in the metal member 14. On the other hand, the lower notch 144CR is provided in the right boundary CR1 which is a corner in the rear direction in the metal member 14. In this case, the molten resin flowing from the front to the rear direction gathers in the vicinity of the right boundary CR1 in the right support portion 14. At this time, the molten resin is likely to apply a pressure in the rear direction to the vicinity of the right boundary CR1 in the metal member 14. In the above case, the forward pressure near the right support-portion-foremost portion X1 and the rearward pressure near the right boundary CR1 tend to cancel each other out. This prevents the metal member 14d from falling over so as to rotate about the upper side LU. As a result, the self-supporting ability of the metal member 14d is improved.

[0176] (Modification 1 of the mounting pattern of the mounting electrodes 122 and the solders Sd1 to Sd6) The first modification of the mounting pattern of the mounting electrode 122 will be described below with reference to the drawings. FIG. 19 is a top view of the mounting electrode 123 and the solders Sd31-Sd33 according to the first modification of the mounting pattern of the mounting electrode 122 and the solders Sd1-Sd6. FIG. 20 is a cross-sectional view of the mounting electrode 1231, the solder Sd31, and the left support portion 140L taken along the line DD. As shown in FIG. 20, the DD cross-section overlaps with the right end of the lower cutout 144L. FIG. 21 is a cross-sectional view of the mounting electrode 1233, the solder Sd33, and the right support portion 140R taken along the line EE. As shown in FIG. 20, the EE cross-section overlaps with the right end of the lower cutout 144R.

[0177] As shown in Fig. 19, adjacent legs may be fixed to one mounting electrode. For example, adjacent legs 146L1 and 146L2 are collectively fixed to mounting electrode 1231 as shown in Fig. 19. Similarly, adjacent legs 146a to 146d are collectively fixed to mounting electrode 1232. Similarly, adjacent legs 146R1 and 146R2 are collectively fixed to mounting electrode 1233. This makes it possible to further stabilize the ground potential.

[0178] As shown in Fig. 20, in the DD cross section, the entire surface of the lower end of the left support part 140L is not in contact with the solder Sd31. More specifically, the front half of the lower end of the left support part 140L is in contact with the solder Sd31. Similarly, as shown in Fig. 21, in the EE cross section, the entire surface of the lower end of the right support part 140R is not in contact with the solder Sd33. More specifically, the rear half of the lower end of the right support part 140R is in contact with the solder Sd33.

[0179] When the left support portion 140L has a shape that protrudes forward near the center in the left-right direction, the rear half of the lower end of the left support portion 140L comes into contact with the solder Sd31. Similarly, when the right support portion 140R has a shape that protrudes backward near the center in the left-right direction, the front half of the lower end of the right support portion 140R comes into contact with the solder Sd33.

[0180] The pair of legs that are fixed together is not limited to the example shown in Fig. 19. For example, the pair of legs 146a, 146b may be fixed together to one mounting electrode.

[0181] (Modification of mounting pattern of solder Sd31 and solder Sd33) The following describes modified mounting patterns of the solder Sd31 and the solder Sd33 with reference to the drawings. Fig. 22 is a cross-sectional view of the solder Sd31X according to a modified mounting pattern of the solder Sd31 taken along line DD. Fig. 23 is a cross-sectional view of the solder Sd33X according to a modified mounting pattern of the solder Sd33 taken along line EE.

[0182] The mounting pattern of the solder Sd31X is different from that of the solder Sd31. More specifically, as shown in FIG. 22, a part of the solder Sd31X is in contact with the front main surface SFL3 of the left support part 140L. That is, as shown in FIG. 22, when the vicinity of the center in the left-right direction of the left support part 140L protrudes in the rear direction (when the left support part 140L has the left support part rear part X2), the area of ​​the part PP1 with which the solder Sd31X is in contact on the front main surface SFL3 of the left support part 140L is larger than the area of ​​the part with which the solder Sd31X is in contact on the rear main surface SBL3 of the left support part 140L. In the example shown in FIG. 22, the solder Sd31X is not in contact with the rear main surface SBL3 of the left support part 140L. However, the solder Sd31X may be in contact with the rear main surface SBL3 of the left support part 140L. However, even in this case, the area of ​​the portion PP1 in contact with the solder Sd31X on the front main surface SFL3 of the left support portion 140L is larger than the area of ​​the portion in contact with the solder Sd31X on the rear main surface SBL3 of the left support portion 140L.

[0183] Furthermore, when the center of the left support part 140L in the left-right direction protrudes forward (when the left support part 140L has the frontmost part of the left support part), the area of ​​the portion where the solder Sd31X is in contact on the rear main surface SBL3 of the left support part 140L is larger than the area of ​​the portion where the solder Sd31X is in contact on the front main surface SFR3 of the left support part 140L.

[0184] The mounting pattern of the solder Sd33X is different from the mounting pattern of the solder Sd33. More specifically, as shown in FIG. 23, a part of the solder Sd33X is in contact with the rear main surface SBR3 of the right support part 140R. That is, when the vicinity of the center in the left-right direction of the right support part 140R protrudes forward (when the right support part 140R has the right support part front part X1), the area of ​​the part PP2 with which the solder Sd33X is in contact on the rear main surface SBR3 of the right support part 140R is larger than the area of ​​the part with which the solder Sd33X is in contact on the front main surface SFR3 of the right support part 140R. In the example shown in FIG. 23, the solder Sd33X is not in contact with the front main surface SFR3 of the right support part 140R. However, the solder Sd33X may be in contact with the front main surface SFR3 of the right support part 140R. However, even in this case, the area of ​​the portion PP2 in contact with the solder Sd33X on the rear main surface SBR3 of the right support part 140R is larger than the area of ​​the portion in contact with the solder Sd33X on the front main surface SFR3 of the right support part 140R.

[0185] In addition, when the center of the right support part 140R in the left-right direction protrudes toward the rear (when the right support part 140R has the rearmost part of the right support part), the area of ​​the portion where the solder Sd33X is in contact on the front main surface SFR3 of the right support part 140R is larger than the area of ​​the portion where the solder Sd33X is in contact on the rear main surface SBR3 of the right support part 140R.

[0186] (Effects of solder Sd31X and solder Sd33X) The solder Sd31X enhances the self-supporting property of the metal member 14. More specifically, when the left support portion 140L has the left support portion rearmost portion X2, the area of ​​the portion PP1 in contact with the solder Sd31X on the front main surface SFL3 of the left support portion 140L is larger than the area of ​​the portion in contact with the solder Sd31X on the rear main surface SBL3 of the left support portion 140L. As a result, as shown in FIG. 22, the solder Sd31X generates a force PO1 that pulls the left support portion 140L forward. In this case, the force PO1 is generated toward the direction in which the center of gravity of the metal member 14 is located. Therefore, the metal member 14 is less likely to rotate backward around the upper side LU. As a result, the self-supporting property of the metal member 14 is enhanced. For the same reason, when the left support portion 140L has a left support portion-front portion, the independence of the metal member 14 is enhanced by making the area of ​​the portion with which the solder Sd31X is in contact on the rear main surface SBL3 of the left support portion 140L larger than the area of ​​the portion with which the solder Sd33X is in contact on the front main surface SFL3 of the left support portion 140L.

[0187] The solder Sd33X enhances the self-supporting property of the metal member 14. More specifically, when the right support portion 140R has the right support portion front portion X1, the area of ​​the portion PP2 in the rear main surface SBR3 of the right support portion 140R where the solder Sd33X is in contact is larger than the area of ​​the portion in the front main surface SFR3 of the right support portion 140R where the solder Sd33X is in contact. As a result, as shown in FIG. 23, the solder Sd33X generates a force PO2 that pulls the right support portion 140R in the rear direction. In this case, the force PO2 is generated toward the direction in which the center of gravity of the metal member 14 is located. Therefore, the metal member 14 is less likely to rotate forward around the upper side LU. As a result, the self-supporting property of the metal member 14 is enhanced. For the same reason, when the right support portion 140R has a right support portion rearmost portion, the area of ​​the portion where the solder Sd33X is in contact on the front main surface SFR3 of the right support portion 140R is made larger than the area of ​​the portion where the solder Sd33X is in contact on the rear main surface SBR3 of the right support portion 140R, thereby improving the independence of the metal member 14.

[0188] Furthermore, by arranging both the solder Sd31X and the solder Sd33X, the self-supporting property of the metal member 14 is improved. More specifically, the solder Sd31X generates a force PO1 that pulls the left support part 140L in the forward direction. Furthermore, the solder Sd33X generates a force PO2 that pulls the right support part 140R in the rearward direction. In this case, the forward force PO1 and the forward force PO2 applied to the metal member 14 tend to cancel each other out. Therefore, the self-supporting property of the metal member 14 is improved.

[0189] (Modification 2 of the mounting pattern of the mounting electrodes 122 and the solders Sd1 to Sd6) The second modification of the mounting pattern of the mounting electrode 122 and the solders Sd1 to Sd6 will be described below with reference to the drawings. FIG. 24 is a top view of the mounting electrode 124 and the solders Sd41 to Sd43 according to the second modification of the mounting pattern of the mounting electrode 122 and the solders Sd1 to Sd6. FIG. 25 is a cross-sectional view of the mounting electrode 1241, the solder Sd41, and the left support portion 140L taken along the line DD. As shown in FIG. 25, the DD cross-section overlaps with the right end of the lower cutout 144L. FIG. 26 is a cross-sectional view of the mounting electrode 1243, the solder Sd43, and the right support portion 140R taken along the line EE. As shown in FIG. 26, the EE cross-section overlaps with the right end of the lower cutout 144L.

[0190] 24, the mounting electrode 124 differs from the mounting electrode 122 in that it includes mounting electrodes 1241, 1242, 1245, and 1246 that are arranged differently from the mounting electrode 122. More specifically, the mounting electrodes 1241 and 1242 (left mounting electrodes) are arranged rearward of the left support part 140L in the front-rear direction. Moreover, the mounting electrodes 1245 and 1246 (right mounting electrodes) are arranged forward of the right support part 140R in the front-rear direction.

[0191] At this time, as shown in Fig. 25, the entire surface of the lower end of the left support part 140L is not in contact with the solder Sd41 in the DD cross section. More specifically, the rear half of the lower end of the left support part 140L is in contact with the solder Sd41. Similarly, as shown in Fig. 26, the entire surface of the lower end of the right support part 140R is not in contact with the solder Sd43 in the EE cross section. More specifically, the front half of the lower end of the right support part 140R is in contact with the solder Sd43.

[0192] (Modification of mounting pattern of solder Sd41 and solder Sd43) The following describes modified mounting patterns of the solder Sd41 and the solder Sd43 with reference to the drawings. Fig. 27 is a cross-sectional view of the solder Sd41X according to a modified mounting pattern of the solder Sd41 at DD. Fig. 28 is a cross-sectional view of the solder Sd43X according to a modified mounting pattern of the solder Sd43 at EE.

[0193] The mounting pattern of the solder Sd41X is different from that of the solder Sd41. More specifically, as shown in FIG. 27, a part of the solder Sd41X is in contact with the rear main surface SBL3 of the left support portion 140L. That is, in this modification, when the vicinity of the center in the left-right direction of the left support portion 140L protrudes in the rear direction (when the left support portion 140L has the left support portion rearmost part X2), the area of ​​the part PP3 with which the solder Sd41X is in contact on the rear main surface SBL3 of the left support portion 140L is larger than the area of ​​the part with which the solder Sd41X is in contact on the front main surface SFL3 of the left support portion 140L. In the example shown in FIG. 27, the solder Sd41X is not in contact with the front main surface SFL3 of the left support portion 140L. However, the solder Sd41X may be in contact with the front main surface SFL3 of the left support portion 140L. However, even in this case, the area of ​​the portion PP3 in contact with the solder Sd41X on the rear main surface SBL3 of the left support portion 140L is larger than the area of ​​the portion in contact with the solder Sd41X on the front main surface SFL3 of the left support portion 140L.

[0194] Furthermore, when the center of the left support part 140L in the left-right direction protrudes forward (when the left support part 140L has the frontmost part of the left support part), the area of ​​the portion where the solder Sd41X is in contact on the front main surface SFL3 of the left support part 140L is larger than the area of ​​the portion where the solder Sd41X is in contact on the rear main surface SBR3 of the left support part 140L.

[0195] The mounting pattern of the solder Sd43X is different from the mounting pattern of the solder Sd43. More specifically, as shown in FIG. 28, a part of the solder Sd43X is in contact with the front main surface SFR3 of the right support part 140R. That is, in this modification, when the vicinity of the center in the left-right direction of the right support part 140R protrudes forward (when the right support part 140R has the right support part front part X1), the area of ​​the part PP4 with which the solder Sd43X is in contact on the front main surface SFR3 of the right support part 140R is larger than the area of ​​the part with which the solder Sd43X is in contact on the rear main surface SBR3 of the right support part 140R. In the example shown in FIG. 28, the solder Sd43X is not in contact with the rear main surface SBR3 of the right support part 140R. However, the solder Sd43X may be in contact with the rear main surface SBR3 of the right support part 140R. However, even in this case, the area of ​​the portion PP4 in contact with the solder Sd43X on the front main surface SFR3 of the right support portion 140R is larger than the area of ​​the portion in contact with the solder Sd43X on the rear main surface SBR3 of the right support portion 140R.

[0196] In addition, when the center of the right support part 140R in the left-right direction protrudes toward the rear (when the right support part 140R has the rearmost part of the right support part), the area of ​​the portion where the solder Sd43X contacts the rear main surface SBR3 of the right support part 140R is larger than the area of ​​the portion where the solder Sd43X contacts the front main surface SFR3 of the right support part 140R.

[0197] (Effects of solder Sd41X and solder Sd43X) The solder Sd41X enhances the self-supporting ability of the metal member 14. More specifically, when the left support portion 140L has the left support portion rearmost portion X2, the area of ​​the portion PP3 with which the solder Sd41X is in contact on the rear main surface SBL3 of the left support portion 140L is larger than the area of ​​the portion with which the solder Sd41X is in contact on the front main surface SFL3 of the left support portion 140L. As a result, as shown in FIG. 27, the solder Sd41X generates a force PO3 that pulls the left support portion 140L in the rear direction. This makes it difficult for the metal member 14 to fall forward. As a result, the self-supporting ability of the metal member 14 is enhanced. For the same reason, when the left support portion 140L has a left support portion-front portion, the independence of the metal member 14 is enhanced by making the area of ​​the portion where the solder Sd41X is in contact on the front main surface SFL3 of the left support portion 140L larger than the area of ​​the portion where the solder Sd43X is in contact on the rear main surface SBL3 of the left support portion 140L.

[0198] The solder Sd43X enhances the self-supporting property of the metal member 14. More specifically, when the right support portion 140R has the right support portion front portion X1, the area of ​​the portion PP4 with which the solder Sd43X is in contact on the front main surface SFR3 of the right support portion 140R is larger than the area of ​​the portion with which the solder Sd43X is in contact on the rear main surface SBR3 of the right support portion 140R. As a result, as shown in FIG. 28, the solder Sd43X generates a force PO4 that pulls the right support portion 140R forward. This makes it difficult for the metal member 14 to fall backward. As a result, the self-supporting property of the metal member 14 is enhanced. For the same reason, when the right support portion 140R has a right support portion rearmost portion, the area of ​​the portion where the solder Sd43X contacts the rear main surface SBR3 of the right support portion 140R is made larger than the area of ​​the portion where the solder Sd43X contacts the front main surface SFR3 of the right support portion 140R, thereby improving the independence of the metal member 14.

[0199] Furthermore, by arranging both the solder Sd41X and the solder Sd43X, the self-supporting property of the metal member 14 is improved. More specifically, the solder Sd41X generates a force PO3 that pulls the left support part 140L in the rear direction. Furthermore, the solder Sd43X generates a force PO4 that pulls the right support part 140R in the front direction. In this case, the rearward force PO3 and the forward force PO4 applied to the metal member 14 tend to cancel each other out. Therefore, the self-supporting property of the metal member 14 is improved.

[0200] (Modification 3 of the mounting pattern of the mounting electrodes 122 and the solders Sd1 to Sd6) The following describes Modification 3 of the mounting pattern of the mounting electrode 122 and the solders Sd1 to Sd6 with reference to the drawings. Fig. 29 is a top view of the mounting electrode 125 and the solders Sd51, Sd52, Sd3, Sd4, Sd55, and Sd56 according to Modification 3 of the mounting pattern of the mounting electrode 122 and the solders Sd1 to Sd6. Fig. 30 is a top view of the mounting electrode 125, the solders Sd51, Sd52, Sd3, Sd4, Sd55, and Sd56, and the metal member 14 during manufacture.

[0201] 29, the mounting electrode 125 differs from the mounting electrode 122 in that it includes mounting electrodes 1251, 1252, 1255, and 1256 that are arranged differently from the mounting electrode 122. More specifically, the mounting electrodes 1251, 1252, 1255, and 1256 fixed to the two supporting portions (the right supporting portion 140R and the left supporting portion 140L) are each arranged rearward of the metal member 14.

[0202] 29, the arrangement of the solders Sd51, Sd52, Sd55, and Sd56 is different from the arrangement of the solders Sd1, Sd2, Sd5, and Sd6. More specifically, the solders Sd51, Sd52, Sd55, and Sd56 are each biasedly arranged behind the metal member 14.

[0203] At this time, the area of ​​the portion where the solders Sd55, Sd56 are in contact on the rear main surface SBR3 of the right support part 140R is larger than the area of ​​the portion where the solders Sd55, Sd56 are in contact on the front main surface SFR3 of the right support part 140R. Also, the area of ​​the portion where the solders Sd51, Sd52 are in contact on the rear main surface SBL3 of the left support part 140L is larger than the area of ​​the portion where the solders Sd51, Sd52 are in contact on the front main surface SFL3 of the left support part 140L.

[0204] (Effects of Modification 3) The mounting electrode 125 and the solders Sd51, Sd52, Sd55, and Sd56 improve the self-supporting property of the metal member 14. Hereinafter, the mounting of the metal member 14 on the board 12 (when the top surface portion 148 is formed) will be described as an example. As shown in FIG. 30, when the top surface portion 148 extends rearward from the upper side LU, a force toward the rear direction is applied to the metal member 14 by the top surface portion 148. By arranging the solders Sd55 and Sd56 so that the area of ​​the portion in contact with the rear main surface SBR3 of the right support portion 140R is larger than the area of ​​the portion in contact with the solders Sd55 and Sd56 on the front main surface SFR3 of the right support portion 140R, it is possible to push the metal member 14 into the solder applied to the mounting electrodes 1255 and 1256. This increases the adhesive force of the solder to the metal member 14. As a result, the self-supporting property of the metal member 14 is improved. For the same reason, by making the area of ​​the portion where the solder Sd51, Sd52 are in contact on the rear main surface SBL3 of the left support part 140L larger than the area of ​​the portion where the solder Sd51, Sd52 are in contact on the front main surface SFL3 of the left support part 140L, it is possible to push the metal member 14 into the solder applied to the mounting electrodes 1251, 1252.

[0205] In addition, when the top surface portion 148 extends forward from the upper side LU of the metal member 14, the same effect can be obtained by making the area of ​​the portion where the solders Sd55, Sd56 are in contact on the front main surface SFR3 of the right support portion 140R larger than the area of ​​the portion where the solders Sd55, Sd56 are in contact on the rear main surface SBR3 of the right support portion 140R. Furthermore, the same effect can be obtained by making the area of ​​the portion where the solders Sd51, Sd52 are in contact on the front main surface SFL3 of the left support portion 140L larger than the area of ​​the portion where the solders Sd51, Sd52 are in contact on the rear main surface SBL3 of the left support portion 140L.

[0206] (Other embodiments) Modules according to other embodiments will be described below with reference to the drawings. Fig. 31 is a view of a metal member 14e according to another embodiment as seen in the front direction. Fig. 32 is a view of a metal member 14f according to another embodiment as seen in the front direction. Fig. 33 is a view of a metal member 14g according to another embodiment as seen in the front direction. Fig. 34 is a view of a metal member 14h according to another embodiment as seen in the front direction.

[0207] For example, like a metal member 14e shown in Fig. 31, two lower cutouts may be provided in a plate-shaped portion 140. In this case, one leg portion 1460 is provided between the lower cutout 144a and the lower cutout 144c.

[0208] For example, like a metal member 14f shown in Fig. 32, one lower cutout may be provided in the plate-shaped portion 140. In this case, one foot portion 1461 is provided to the left of the lower cutout 144b. Also, one foot portion 1462 is provided to the right of the lower cutout 144b.

[0209] For example, like a metal member 14g shown in Fig. 33, the plate-shaped portion 140 does not have to have a lower notch. In this case, the plate-shaped portion 140 is provided with one leg portion 1463.

[0210] 34, the plate-shaped portion 140 may be provided with only a portion of the lower cutout 144CR that overlaps with the right boundary CR1 when viewed in the up-down direction and a portion of the lower cutout 144CL that overlaps with the left end (right boundary CR1) of the plate-shaped portion 140. In this case, one foot portion 1464 is provided between the lower cutout 144CR and the lower cutout 144CL.

[0211] The module according to the present invention is not limited to the module 10 according to the above embodiment, and can be modified within the scope of the invention.

[0212] The number of lower cutouts provided in the plate-shaped portion 140 is not limited to three.

[0213] It should be noted that for the module 10, the structures of the metal members 14, 14a to 14h and the structures of the mounting electrodes 122 to 125 may be combined in any desired manner.

[0214] The substrate 12 may have a shape other than a rectangle when viewed in the vertical direction.

[0215] The number of electronic components is not limited to five (electronic components 16a to 16e).

[0216] It should be noted that the plate-like portion 140 may have one or more upper cutouts.

[0217] The foot portion does not have to be adjacent to the lower cutout in the left-right direction. Therefore, the foot portion and the lower cutout may be separated from each other in the left-right direction.

[0218] The multiple foot portions extend in the rear direction from the lower side LD of the plate-shaped portion 140. However, the multiple foot portions may extend in the front direction from the lower side of the plate-shaped portion 140. Also, some of the multiple foot portions may extend in the rear direction from the lower side of the plate-shaped portion 140, and the remaining of the multiple foot portions may extend in the front direction from the lower side of the plate-shaped portion 140.

[0219] The shortest distance between the upper cutout and the lower cutout may be shorter than 1.5 times the plate thickness of the plate-shaped portion 140 .

[0220] The left end of the plate-shaped portion 140 does not have to be located on the left surface SL1 of the sealing resin layer 18. The right end of the plate-shaped portion 140 does not have to be located on the right surface SR1 of the sealing resin layer 18. The upper end of the plate-shaped portion 140 does not have to be located on the upper surface SU1 of the sealing resin layer 18. In addition, by positioning the upper end of the plate-shaped portion 140 on the upper surface SU1 of the sealing resin layer 18, the upper end of the plate-shaped portion 140 is electrically connected to the shield 20, and the left end of the plate-shaped portion 140 does not have to be located on the left surface SL1 of the sealing resin layer 18, and the right end of the plate-shaped portion 140 does not have to be located on the right surface SR1 of the sealing resin layer 18.

[0221] It should be noted that the module 10 does not necessarily have to include the shield 20 .

[0222] It is sufficient that the shield 20 covers at least the upper surface SU1 of the sealing resin layer 18. Therefore, the shield 20 does not need to cover, for example, part or all of the left surface SL1, right surface SR1, front surface SF1, and rear surface SB1 of the sealing resin layer 18.

[0223] Incidentally, the outer edge of the substrate 12 does not have to overlap with the outer edge of the sealing resin layer 18 when viewed in the up-down direction. That is, the front surface SF1 of the sealing resin layer 18 may be located in front of the front surface SF2 of the substrate 12. The rear surface SB1 of the sealing resin layer 18 may be located behind the rear surface SB2 of the substrate 12. The left surface SL1 of the sealing resin layer 18 may be located to the left of the left surface SL2 of the substrate 12. The right surface SR1 of the sealing resin layer 18 may be located to the right of the right surface SR2 of the substrate 12.

[0224] When viewed in the front-rear direction, the electronic components 16a-16e do not protrude leftward or rightward from the metal member 14. However, parts of the electronic components 16a-16e may protrude leftward or rightward from the metal member 14 when viewed in the front-rear direction.

[0225] The area of ​​the top surface 148 may be larger than the area of ​​each of the legs 146L1, 146L2, 146a to 146d, 146R1, and 146R2, which makes it easier for the mounting machine to adsorb the metal member 14.

[0226] It should be noted that, for example, when viewed in the vertical direction, the top surface portion 148 does not overlap with the electronic component 16e that is the tallest in the vertical direction among the electronic components 16a to 16e.

[0227] The top surface portion 148 is formed by bending a part of the metal member 14 backward.

[0228] It is sufficient that each of the metal members 14, 14a to 14d includes one or more legs.

[0229] Solder is used to fix the legs 146L1, 146L2, 146a to 146d, 146R1, and 146R2 to the mounting electrodes 122, 123, 124, and 125. However, instead of solder, a resin adhesive containing a metal filler such as Cu or Ag may be used. That is, a conductive member such as solder or a resin adhesive may be used to fix the legs 146L1, 146L2, 146a to 146d, 146R1, and 146R2 to the mounting electrodes 122, 123, 124, and 125. [Explanation of symbols]

[0230] 10: Module 12: Substrate 14, 14a to 14d: Metallic members 16a-16e: Electronic components 18: Sealing resin layer 140: Plate-shaped part 140R, 140Ra, 140Rb, 140Rc: Right support part 140L, 140La, 140Lb: Left support part 142a, 142b: Upper notch 144a~144c, 144L, 144R: Lower notch SU2: Upper main surface of the substrate 12 SD2: Lower main surface of substrate 12 SF3: Front main surface of metal member 14 SB3: Rear main surface of metal member 14 LD: Bottom LU: Top RS1, LS1: First straight line CR2: Right end of the first part RFP CL2: Left end of the first part LFP X1: Frontmost part of right support part X2: Last part of left support part

Claims

1. A substrate having an upper main surface and a lower main surface aligned in a vertical direction; a metal member including a plate-shaped portion provided on the upper main surface of the substrate, the plate-shaped portion having a front main surface and a rear main surface aligned in a front-rear direction when viewed in the up-down direction; a first electronic component mounted on the upper main surface of the substrate and disposed in front of the metal member; a second electronic component mounted on the upper main surface of the substrate and disposed behind the metal member; a sealing resin layer provided on the upper main surface of the substrate and covering the first electronic component, the second electronic component, and the metal member; Equipped with The metal member includes a right support portion, A boundary between the plate-shaped portion and the right support portion is defined as a right boundary, the right boundary is located on the right side of the metal member, the right support portion has a right support portion foremost portion that is located most forward in the right support portion and is located forward of the plate-shaped portion, or a right support portion rearmost portion that is located most rearward in the right support portion and is located rearward of the plate-shaped portion, When the right support portion has the right support portion frontmost portion, the right support portion bends forward from the right boundary, When the right support portion has the right support portion frontmost portion, the right support portion bends from the right support portion frontmost portion in a rear direction and in a right direction, When the right support portion has the right support portion rearmost portion, the right support portion bends rearward from the right boundary, When the right support portion has the right support portion rearmost portion, the right support portion bends forward and rightward from the right support portion rearmost portion, When viewed in the up-down direction, a line connecting the lower end of the right support part in the left-right direction is defined as a lower side, The right support portion is provided with a first lower cutout extending upward from the lower side and overlapping with a front end portion of the right support portion or a rear end portion of the right support portion when viewed in the up-down direction. Module.

2. Define the first straight line parallel to the left and right direction. The first straight line overlaps with at least two points of the right support portion. The module of claim 1 .

3. the right support portion includes a right support portion front portion located forward of the plate-shaped portion in the front-rear direction, and a right support portion rear portion located rearward of the plate-shaped portion in the front-rear direction.

3. A module according to claim 1 or 2.

4. when the right support portion has the right support portion foremost portion, the right support portion includes a first portion located in the right support portion between the right boundary and the right support portion foremost portion, and a second portion located in the right support portion between the right support portion foremost portion and a right end of the right support portion, When the right support portion has the right support portion rearmost portion, the right support portion includes a first portion located in the right support portion between the right boundary and the right support portion rearmost portion, and a second portion located in the right support portion between the right support portion rearmost portion and a right end of the right support portion, The straight line extending in the left-right direction is defined as a first straight line, The first portion is parallel to a second straight line when viewed in the up-down direction, The second portion is parallel to a third straight line when viewed in the up-down direction, an angle between the second straight line and the third straight line is larger than an angle between the first straight line and the second straight line; A module according to any one of claims 1 to 3.

5. when the right support portion has the right support portion foremost portion, the right support portion includes a first portion located in the right support portion between the right boundary and the right support portion foremost portion, and a second portion located in the right support portion between the right support portion foremost portion and a right end of the right support portion, When the right support portion has the right support portion rearmost portion, the right support portion includes a first portion located in the right support portion between the right boundary and the right support portion rearmost portion, and a second portion located in the right support portion between the right support portion rearmost portion and a right end of the right support portion, the first portion describes a first circular arc centered on a first point when viewed in the up-down direction; the second portion describes a second arc centered on a second point when viewed in the up-down direction; The radius of curvature of the second arc is smaller than the radius of curvature of the first arc. A module according to any one of claims 1 to 3.

6. the metal member is provided with a right support portion second lower cutout extending upward from the lower side and overlapping with the right boundary when viewed in the up-down direction, A module according to any one of claims 1 to 5.

7. When viewed in the front-rear direction, a line connecting the upper end of the plate-shaped portion in the left-right direction is defined as an upper side, The plate-shaped portion is provided with an upper notch extending downward from the upper side. A module according to any one of claims 1 to 6.

8. the substrate includes a mounting electrode and a conductive member that are part of the upper main surface of the substrate; the conductive member includes a right conductive member in contact with the right support portion, the mounting electrodes include a right mounting electrode fixed to the right support portion by a right conductive member; A module according to any preceding claim.

9. when the right support portion has the right support portion frontmost portion, an area of ​​a portion of the rear main surface of the right support portion with which the right conductive member is in contact is larger than an area of ​​a portion of the front main surface of the right support portion with which the right conductive member is in contact, when the right support portion has the right support portion rearmost portion, an area of ​​a portion of a front main surface of the right support portion with which the right conductive member is in contact is larger than an area of ​​a portion of a rear main surface of the right support portion with which the right conductive member is in contact, The module of claim 8.

10. when the right support portion has the right support portion frontmost portion, an area of ​​a portion of the front main surface of the right support portion with which the right conductive member is in contact is larger than an area of ​​a portion of the rear main surface of the right support portion with which the right conductive member is in contact, when the right support portion has the right support portion rearmost portion, an area of ​​a portion of the rear main surface of the right support portion with which the right conductive member is in contact is larger than an area of ​​a portion of the front main surface of the right support portion with which the right conductive member is in contact, The module of claim 8.

11. The metal member further includes a left support portion, A boundary between the plate-shaped portion and the left support portion is defined as a left boundary, the left boundary is located on a left portion of the metal member, the left support portion has a left support portion foremost portion that is located most forward in the left support portion and is located forward of the plate-shaped portion, or a left support portion rearmost portion that is located most rearward in the left support portion and is located rearward of the plate-shaped portion, When the left support portion has the left support portion frontmost portion, the left support portion bends forward from the left boundary, When the left support portion has the left support portion frontmost portion, the left support portion bends rearward and leftward from the left support portion frontmost portion, When the left support portion has the left support portion rearmost portion, the left support portion bends rearward from the left boundary, When the left support portion has the left support portion rearmost portion, the left support portion bends forward and leftward from the left support portion rearmost portion, When viewed in the up-down direction, a line connecting the lower end of the left support part in the left-right direction is defined as a lower side; The left support portion is provided with a first lower cutout extending upward from the lower side and overlapping with a front end portion of the left support portion or a rear end portion of the left support portion when viewed in the up-down direction. A module according to any one of claims 1 to 10.

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