Storage tray and method for manufacturing semiconductor chip package

Abstract

To provide a storage tray with a new configuration that is less likely to cause a problem during pickup and enables a chip to be held properly.SOLUTION: A storage tray 12 storing a plurality of chips 6 includes a tray body 13 having a chip storage portion 14 and a frame portion 16 surrounding the chip storage portion 14, and a chip holding layer 18 that is mounted on the chip storage portion 14 of the tray body 13 and forms a holding surface 18a which exerts holding force for holding the chips 6, and a plurality of grooves 30 for setting the holding force are formed on the holding surface 18a of the chip holding layer 18.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a storage tray for storing a plurality of chips. [Background technology]

[0002] Conventionally, it is known to store and handle individual semiconductor chips in a storage tray, and a storage tray capable of storing chips of different sizes has been disclosed (see, for example, Patent Document 1).

[0003] The storage tray disclosed in Patent Document 1 is configured to have an adhesive material with an adhesive surface to which multiple chips can be adhered, and multiple chips can be adhered at once by pressing the chips against the adhesive surface. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2012-043914 A Summary of the Invention [Problem to be solved by the invention]

[0005] In the configuration disclosed in Patent Document 1, there are no partitions separating the chips, and the chips are held in place with an adhesive material, making it easy to store the chips and preventing the chips from moving and hitting the partitions and being damaged.

[0006] On the other hand, chips (semiconductor device chips) formed by dividing a semiconductor wafer may be individually measured for chipping, strength, etc. before packaging. After the measurement, the chips are temporarily stored in a storage tray, and then picked up from the storage tray and packaged.

[0007] Here, it is possible to consider using a storage tray of the type disclosed in Patent Document 1, but the holding force between the adhesive surface and the chip varies depending on the thickness and size of the chip. If the holding force is too strong, it becomes difficult to pick up the chip, and in some circumstances the chip may be damaged.

[0008] On the other hand, if the holding force is too weak, it may not be possible to continue holding the chips in some circumstances, and for example, the chips may move during transport, causing adjacent chips to come into contact with each other and becoming damaged.

[0009] In view of the above, the present invention proposes a storage tray with a novel configuration that is less likely to cause problems during pick-up and is capable of properly holding chips. [Means for solving the problem]

[0010] The problem to be solved by the present invention has been described above, and the means for solving this problem will now be described.

[0011] According to one aspect of the present invention, A storage tray for storing a plurality of chips, A tray body having a chip storage section and a frame section surrounding the chip storage section; a chip holding layer that is attached to the chip storage portion of the tray body and forms a holding surface that exerts a holding force to hold the chip; The holding surface of the chip holding layer has a plurality of grooves formed therein for setting the holding force, and the holding tray is provided with the plurality of grooves.

[0012] According to another aspect of the present invention, The grooves are formed in a lattice shape extending in directions intersecting each other, A columnar holding portion for contacting the chip is formed in an area surrounded by each groove, The columnar holding portions and the grooves are arranged alternately, A separation starting point for the chip is formed at the boundary between the columnar holding portion and the groove.

[0013] According to another aspect of the present invention, The chip retaining layer is made of a synthetic resin, The columnar holding portion is configured to be elastically deformable.

[0014] According to another aspect of the present invention, The groove is a cut groove formed by cutting the chip retaining layer with a rotating cutting blade.

[0015] According to another aspect of the present invention, A step of forming a holding surface by machining a cutting groove in a surface of the chip holding layer using a cutting device having a rotating cutting blade; integrating the chip holding layer with a tray body to form a storage tray; cutting the wafer with the cutting device and dividing it to form chips; measuring chipping and / or strength of the chip, and placing the chip after the measurement on the holding surface of the chip holding layer and storing it in a storage tray; peeling the chips contained in the container tray from the holding surface and packaging the chips; The method for manufacturing a semiconductor chip package includes: Effect of the Invention

[0016] According to one aspect of the present invention, it is possible to configure a storage tray that is less likely to cause problems during pick-up and is capable of properly holding chips. In addition, the width, number, spacing, number, etc. of the grooves can be adjusted to set the holding force according to the size, type, and environment of the chips.

[0017] Furthermore, according to one aspect of the present invention, the peeling start point can be located on the inside of the chip, and the peeling properties of the chip can be improved when an external force is applied to pick up the chip.

[0018] Furthermore, according to one aspect of the present invention, it is possible to hold the chip while maintaining contact between the contact surface and the bottom surface of the chip, thereby preventing the chip from shifting sideways.

[0019] Furthermore, according to one aspect of the present invention, the grooves can be formed by utilizing a cutting device that cuts the wafer before it is divided into chips.

[0020] Furthermore, according to one embodiment of the present invention, problems are unlikely to occur during pick-up, and the chip can be held appropriately, thereby preventing damage to the chip during the manufacturing process. [Brief description of the drawings]

[0021] [Figure 1] 1A is a diagram showing components of the storage tray, and FIG. 1B is a perspective view showing the completed storage tray. [Diagram 2] 1A is a diagram showing a state in which a chip is placed on a chip holding layer, and FIG. 1B is a diagram for explaining a peeling starting point. [Diagram 3] 1A is a side cross-sectional view and a partially enlarged view of the storage tray, and FIG. 1B is a diagram for explaining the columnar holding portion. [Figure 4] 1A is a diagram for explaining the formation of grooves by a cutting device, FIG. 1B is a diagram for explaining the manufacturing process of the storage tray, and FIG. 1C is a side cross-sectional view showing the completed storage tray. [Diagram 5] 11A to 11C are diagrams for explaining an example of a process using a storage tray. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0022] Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. 1(A) and (B) are perspective views of a receiving tray 12 according to an embodiment of the present invention. The storage tray 12 has a tray body 13 having a chip storage section 14 formed as a recess and a frame section 16 surrounding the chip storage section 14. A chip holding layer 18 for holding the chip 6 is housed in the chip storage section 14.

[0023] In this embodiment, the chip holding layer 18 is made of a sheet-like plate material that is a separate member from the tray main body 13 and is attached to the bottom surface 14a of the chip accommodating section 14 by double-sided tape or the like, but the two may also be made by integral molding.

[0024] The material constituting the chip holding layer 18 may be, for example, UMI (registered trademark) manufactured by Flexcarrier Co., Ltd., "Separess" or "Handecotack" (trade name) manufactured by Shin-Tack Kasei Co., Ltd., or Intellimer (registered trademark) tape, which is a temperature-sensitive adhesive sheet manufactured by Nitta Co., Ltd. In addition, it may be constituted by a sheet made of urethane resin.

[0025] The upper surface of the chip holding layer 18 constitutes a holding surface 18a that exerts a holding force for holding the chip 6, and is exposed upward. The holding surface 18a is disposed at a position lower than the frame portion 16, and prevents the chip 6 from climbing over the frame portion 16 and falling.

[0026] As shown in Figures 2(A) and 2(B) and Figures 3(A) and 3(B), grooves 30 are formed on the holding surface 18a of the chip holding layer 18. In this embodiment, the grooves 30 are formed in a first direction F1 and a second direction F2 that are perpendicular to each other. Then, the columnar holding parts 40 are formed by leaving areas surrounded by each groove 30.

[0027] In addition, by forming grooves 30 in a first direction F1 and a second direction F2 perpendicular to each other, grooves can be formed in a lattice pattern, or multiple grooves extending in only one direction can be formed.

[0028] The upper end surface of each columnar holding portion 40 constitutes a contact surface 42 that contacts the lower surface 6b of the chip 6, and the contact surfaces 42 and the grooves 30 are arranged alternately. By arranging the contact surfaces 42 and the grooves 30 alternately in this manner, the holding surface 18a that holds the chip 6 is configured to have the contact surface 42 and the grooves 30 that are non-contact surfaces.

[0029] The contact surface 42 comes into contact with the lower surface 6b of the chip 6, thereby exerting a holding force that restricts horizontal deviation of the chip 6 and holds the chip 6. This holding force is generated when the contact surface 42 comes into contact with the chip holding layer 18 (columnar holding portion 40) made of synthetic resin, and is also called a tack force.

[0030] The area of ​​each contact surface 42 that comes into contact with the lower surface 6b of the chip 6 is determined by the size of the area of ​​the contact surface 42, and this also determines the holding force exerted by each contact surface 42. The area of ​​each contact surface 42 is determined by the width, number, spacing, number, etc. of the grooves 30. Therefore, the holding force can be set according to the size, type, and environment of the chip 6 by adjusting the width, number, spacing, number, etc. of the grooves 30.

[0031] The boundary portion between the contact surface 42 and the groove 30, i.e., the contour portion of the contact surface 42, constitutes a peeling starting point 42b when the lower surface 6b of the chip 6 separates from the contact surface 42 when the chip 6 is picked up from the storage tray 12. The peeling starting point 42b means the boundary between the portion where the lower surface 6b of the chip 6 is held and the portion where it is not held.

[0032] As shown by the bold line in Figure 2(B), this peel starting point 42b is located not only on the contour of the outer periphery of the chip 6, but also on the inside of the chip 6, thereby improving the peelability of the chip 6 when an external force is applied to pick up the chip 6.

[0033] For example, when the center of the surface 6a (FIG. 2(A)) of the chip 6 is held by suction and picked up, peeling can also start near the center of the chip 6, preventing pick-up failure. If the holding surface were flat and no grooves 30 were formed, the peeling starting point would be formed only on the outer periphery of the chip 6, and the entire bottom surface 6b of the chip 6 would be in contact with the entire holding surface, making it difficult for peeling to occur from the inside of the chip 6, and the probability of pick-up failure could increase.

[0034] As is clear from the above, by forming the grooves 30 in the chip holding layer 18, the holding force exerted by the chip holding layer 18 can be set, and problems occurring during pick-up can be prevented.

[0035] As shown in Figures 2(A) and 3(B), the columnar holding part 40 is configured so that the columnar holding part 40 can be elastically deformed. The example of Figure 3(B) shows how the columnar holding part 40 is tilted, thereby maintaining contact between the contact surface 42 and the lower surface 6b of the chip 6.

[0036] 3(B), even if a lateral load K is applied to the chip 6 due to, for example, tilting of the storage tray, the chip 6 can be held while maintaining contact between the contact surface 42 and the lower surface 6b of the chip 6, preventing lateral displacement of the chip 6. This prevents the chip 6 from moving during transportation and coming into contact with other chips, causing chipping on the outer periphery of the chip, or from jumping out of the chip storage section 14 and being damaged.

[0037] As is apparent from the above, by forming the grooves 30 in the chip-holding layer 18, the holding force exerted by the chip-holding layer 18 can be set, and the chip can be held appropriately.

[0038] The horizontal cross section of the columnar holding portion 40 may be rectangular, polygonal, circular, or the like.

[0039] The receiving tray 12 having the above-described configuration can be manufactured, for example, as shown in FIGS. 4(A), the plate material constituting the chip retaining layer 18 is integrated with the base plate 19, and the base plate 19 is held by a holding table 62 of a cutting device 60. The cutting device 60 has a cutting blade 64 that rotates at high speed, and the cutting blade 64 is positioned at a predetermined height while the holding table 62 is processed and fed, thereby forming the grooves 30 in the chip retaining layer 18.

[0040] After the grooves 30 are formed in the first direction F1 of the chip holding layer 18, the holding table 62 is rotated 90 degrees and fed for processing, so that the grooves 30 are also formed in the second direction F2 (FIG. 1).

[0041] Next, as shown in FIG. 4(B), the chip holding layer 18 and the base plate 19 are accommodated together in the chip accommodating section 14 of the tray main body 13, thereby forming the accommodating tray 12 as shown in FIG. 4(C).

[0042] As described above, the grooves 30 may be formed by cutting, or may be formed in advance at the time of resin molding, or may be formed by press molding.

[0043] FIG. 5 is a diagram for explaining an example of a process using the receiving tray 12. In FIG. The chips 6 are formed by dividing a wafer W. The wafer W is a disk-shaped semiconductor wafer, and devices D are formed in areas defined by dividing lines S arranged in a lattice pattern.

[0044] The separated chips 6 are placed on the chip holding layer 18 of the storage tray 12 after undergoing a process of measuring chipping, strength, and the like.

[0045] After the storage tray 12 storing the chips 6 is transported, the chips 6 are picked up appropriately and packaged with molding resin in a packaging process.

[0046] The present invention can be realized in the above manner. That is, as shown in FIG. A storage tray 12 for storing a plurality of chips 6, A tray body 13 having a chip receiving portion 14 and a frame portion 16 surrounding the chip receiving portion 14; a chip holding layer 18 that is attached to the chip storage portion 14 of the tray body 13 and forms a holding surface 18a that exerts a holding force to hold the chip 6; The holding surface 18a of the chip holding layer 18 is formed with a plurality of grooves 30 for setting the holding force, forming the storage tray 12.

[0047] This makes it possible to configure a storage tray 12 that is less likely to cause problems when picking up chips and that can properly hold chips. In addition, the width, number, spacing, number, etc. of the grooves 30 can be adjusted to set the holding force according to the size, type, and environment of the chips 6.

[0048] In addition, as shown in FIG. 1 and FIG. 2(A)(B), The grooves 30 are formed in a lattice shape, extending in directions intersecting each other. A columnar holding portion 40 for contacting the chip 6 is formed in the area surrounded by each groove 30, The columnar holding portions 40 and the grooves 30 are arranged alternately. A peeling starting point 42a with the chip 6 is formed at the boundary between the columnar holding portion 40 and the groove 30. This is what we intend to do.

[0049] This allows the peeling starting point 42a to be located inside the chip 6, and improves the peeling properties of the chip 6 when an external force is applied to pick up the chip 6.

[0050] As shown in FIG. 3(B), the chip holding layer 18 is made of synthetic resin, and the columnar holding portions 40 are configured to be elastically deformable.

[0051] This makes it possible to hold the chip 6 while maintaining contact between the contact surface 42 and the lower surface 6b of the chip 6, thereby preventing the chip 6 from shifting sideways.

[0052] As shown in FIG. 5(A), the grooves 30 are cut grooves formed by cutting the chip retaining layer 18 with a rotating cutting blade 64.

[0053] This makes it possible to form the grooves by using a cutting device that cuts the wafer before it is divided into chips.

[0054] Also, as shown in Figs. A step of forming a retaining surface 18a by processing a cutting groove 30 in the surface of the chip retaining layer 18 using a cutting device 60 having a rotating cutting blade 64; forming a storage tray 12 by integrating the chip holding layer 18 with a tray body 13; a step of cutting the wafer W by a cutting device and dividing it to form chips 6; measuring chipping and / or strength of the chip 6, and placing the chip 6 after the measurement on the holding surface 18a of the chip holding layer 18 and storing it in the storage tray 12; a step of peeling the chips 6 accommodated in the accommodation tray 12 from the holding surface 18a and packaging the chips; The present invention relates to a method for manufacturing a semiconductor chip package, comprising:

[0055] This makes it possible to hold the chip appropriately while preventing problems from occurring during pick-up, and prevents damage to the chip during the manufacturing process. [Explanation of symbols]

[0056] 4 Column holding part 6 Chips 6b Bottom side 12 Storage Tray 13 Tray body 14 Chip storage section 14a Bottom 16 Frame section 18 Chip retention layer 18a Holding surface 19 Base Plate 30 grooves 40 Column holding part 42 Contact surface 42b Peeling origin 60 Cutting equipment 62 Holding Table 64 Cutting Blade D Device F1 First Direction F2 Second Direction K load S Division line W wafer

Claims

1. A storage tray for storing a plurality of chips, A tray body having a chip storage section and a frame section surrounding the chip storage section; a chip holding layer that is attached to the chip storage portion of the tray body and forms a holding surface that exerts a holding force to hold the chip; a plurality of grooves for setting the holding force are formed on the holding surface of the chip holding layer; The grooves are formed in a lattice shape extending in directions intersecting each other, A columnar holding portion for contacting the chip is formed in an area surrounded by each groove, The columnar holding portions and the grooves are arranged alternately, A separation starting point for the tip is formed at a boundary between the columnar holding portion and the groove, The tip of the columnar holding portion is formed with a rectangular flat contact surface, and the contact surface and the lower surface of the chip are in contact with each other. When the columnar holding portion is tilted due to elastic deformation, the contact surface is maintained in contact with the lower surface of the chip.

2. The chip retaining layer is made of a synthetic resin, The columnar holding portion is configured to be elastically deformable.

2. The storage tray according to claim 1.

3. The groove is a cutting groove formed by cutting the chip retaining layer with a rotating cutting blade.

3. The storage tray according to claim 2.

4. A step of forming a holding surface by machining a cutting groove in a surface of the chip holding layer using a cutting device having a rotating cutting blade; integrating the chip holding layer with a tray body to form a storage tray; cutting the wafer with the cutting device and dividing it to form chips; measuring chipping and / or strength of the chip, and placing the chip after the measurement on the holding surface of the chip holding layer and storing it in the storage tray; peeling the chips contained in the container tray from the holding surface and packaging the chips; A method for manufacturing a semiconductor chip package, comprising: The storage tray is A tray body having a chip storage section and a frame section surrounding the chip storage section; a chip holding layer that is attached to the chip storage portion of the tray body and forms a holding surface that exerts a holding force to hold the chip; a plurality of grooves for setting the holding force are formed on the holding surface of the chip holding layer; The grooves are formed in a lattice shape extending in directions intersecting each other, A columnar holding portion for contacting the chip is formed in an area surrounded by each groove, The columnar holding portions and the grooves are arranged alternately, A separation starting point for the tip is formed at a boundary between the columnar holding portion and the groove, The tip of the columnar holding portion is formed with a rectangular contact surface, and the contact surface and the lower surface of the chip are in contact with each other. When the columnar holding portion is tilted due to elastic deformation, contact between the contact surface and the underside of the chip is maintained.

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