Aerosol generator power supply unit

Abstract

A power supply unit (10) is provided with: a power supply (BAT); a discharge terminal (41) connected to a heater (21) that consumes electric power supplied from the power supply (BAT) to generate an aerosol from an aerosol source; a receptacle mounting substrate; an MCU mounting substrate; a substrate connection cable (Cb1) for connecting these substrates to each other; and an MCU mounting substrate-side connector (Cn2) mounted on the MCU mounting substrate and connected to the substrate connection cable (Cb1). In the power supply unit (10), the shortest distance between the edge of the MCU mounting substrate closest to the MCU mounting substrate-side connector (Cn2) and the MCU mounting substrate-side connector (Cn2) is longer than the shortest distance between the center of the MCU mounting substrate and the MCU mounting substrate-side connector (Cn2).

Description

[Technical field]

[0001] The present invention relates to a power supply unit for an aerosol generating device. [Background technology]

[0002] Patent Document 1 discloses an aerosol generation device including a plurality of circuit boards. In the aerosol generation device including a plurality of circuit boards, the circuit boards are electrically connected to each other by flexible printed circuits (FPC) cables or the like. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] China Patent Publication No. 111096480 Summary of the Invention [Problem to be solved by the invention]

[0004] The circuit board of the power supply unit of the aerosol generating device, which includes multiple circuit boards connected via cables, needs to be equipped with a connector to which the cables are connected. However, if the connector is not mounted in an appropriate position, the circuit board may become large, and there is room for improvement in this regard in the conventional technology.

[0005] The present invention provides a power supply unit for an aerosol generating device that has multiple circuit boards connected via cables, which can avoid the circuit board on which the connector to which the cables are connected is mounted becoming larger. [Means for solving the problem]

[0006] The present invention relates to Power supply, a first connector to which a load that consumes power supplied from the power source to generate an aerosol from an aerosol source or a coil that transmits power to the load by electromagnetic induction is connected; A first circuit board; A second circuit board; a first cable connecting the first circuit board and the second circuit board; mounted on the second circuit board; and 、 a second connector to which the first cable is connected; a third connector mounted on the second circuit board and connected to the power source; Equipped with The shortest distance between the edge of the second circuit board closest to the second connector and the second connector is longer than the shortest distance between the center of the second circuit board and the second connector. Ku, the first cable is connected to the second connector from a width direction of the second circuit board, The first circuit board, the power supply, the third connector, and the second connector are arranged in the following order in the longitudinal direction of the second circuit board: the first circuit board, the power supply, the third connector, and the second connector. , This is the power supply unit for the aerosol generating device. Effect of the Invention

[0007] According to the present invention, a power supply unit for an aerosol generating device can be provided that has multiple circuit boards connected via cables, which makes it possible to avoid increasing the size of the circuit board on which the connector to which the cables are connected is mounted. [Brief description of the drawings]

[0008] [Figure 1] FIG. 1 is a perspective view of an aerosol inhalator 1. [Diagram 2] FIG. 2 is another perspective view of the aerosol inhalator 1. [Diagram 3] FIG. 2 is a cross-sectional view of the aerosol inhalator 1. [Figure 4] FIG. 2 is a perspective view of the power supply unit 10. [Diagram 5] FIG. 2 is an exploded perspective view of the power supply unit 10. [Figure 6] 2 is a diagram showing a circuit configuration of a power supply unit 10. FIG. [Figure 7]FIG. 2 is a perspective view of the power supply unit 10 with the case 11 removed. [Figure 8] 2 is a diagram showing a main surface layer 71a of the MCU mounted board 7. FIG. [Figure 9] 2 is a diagram showing a second wiring layer 74a of the MCU mounted board 7. FIG. [Figure 10] 2 is a diagram showing a secondary surface layer 71b of the MCU mounted board 7. FIG. [Figure 11] 13 is a diagram showing a fourth wiring layer 74b of the MCU mounted board 7. FIG. [Figure 12] 13 is a diagram showing the positional relationship between the MCU mounted board 7 and a discharge terminal 41. FIG. [Figure 13] 2 is a cross-sectional view of an MCU mounting board 7. FIG. [Figure 14] 10 is an enlarged view of the periphery of an end portion on the X1 direction side of the main surface side wiring layer 74a of the MCU mounted board 7 shown in FIG. 9. FIG. [Figure 15] 15 is an enlarged view of the wiring pattern 77_Ln6a shown in FIG. 14. [Figure 16] 15 is an enlarged view of the wiring pattern 77_Ln6b shown in FIG. 14. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] Below, we will explain the power supply unit of the aerosol generation device of one embodiment of the present invention, but first we will explain the aerosol generation device (hereinafter referred to as an aerosol inhaler) equipped with the power supply unit with reference to Figures 1 to 3.

[0010] (Aerosol inhaler) The aerosol inhaler 1 is a device for inhaling flavored aerosol without combustion, and has a rod shape extending along a predetermined direction (hereinafter referred to as the X direction). As shown in Figs. 1 and 2, the aerosol inhaler 1 includes a power supply unit 10, a first cartridge 20, and a second cartridge 30, which are provided in this order along the X direction. The first cartridge 20 may be detachable from the power supply unit 10, and the second cartridge 30 is detachable from the first cartridge 20. In other words, the first cartridge 20 and the second cartridge 30 are each replaceable with respect to the power supply unit 10. The second cartridge 30 is also replaceable with respect to the first cartridge 20. The first cartridge 20 may be fitted and fixed to the power supply unit 10, so that the user cannot easily attach or detach it.

[0011] (Power supply unit) As shown in Figures 3 to 5 and 7, the power supply unit 10 of this embodiment is configured by accommodating a battery pack BP, an MCU (Micro Controller Unit) 50, an MCU mounted board 7, a receptacle mounted board 8, etc. inside a cylindrical case 11.

[0012] The power source BAT contained in the battery pack BP is a rechargeable secondary battery, an electric double layer capacitor, etc., and is preferably a lithium ion secondary battery. The electrolyte of the power source BAT may be one of a gel electrolyte, an electrolytic solution, a solid electrolyte, and an ionic liquid, or a combination of these.

[0013] A discharge terminal 41 is provided on a top portion 11a located on one end side (first cartridge 20 side) of the case 11 in the X direction. The discharge terminal 41 is composed of a positive electrode side discharge terminal 41a and a negative electrode side discharge terminal 41b. In this specification, the "positive electrode side" means a side having a higher potential than the "negative electrode side". In other words, the "negative electrode side" means a side having a lower potential than the "positive electrode side". Therefore, the term "positive electrode side" in the following description may be read as "high potential side" and the term "negative electrode side" may be read as "low potential side", respectively.

[0014] The positive electrode discharge terminal 41a and the negative electrode discharge terminal 41b are provided to protrude from the top portion 11a toward the first cartridge 20 and are configured to be electrically connectable to the heater 21 of the first cartridge 20. In addition, in the case 11, a low floor portion 11b is provided around the top portion 11a.

[0015] A charging opening 43 (see FIG. 2) that allows access to the charging terminal 42 is provided in the peripheral wall on the bottom portion 11c side located at the other end side in the X direction of the case 11 (opposite side to the first cartridge 20). The charging terminal 42 is electrically connected to an external power source such as an outlet or a mobile battery to receive power, and in this embodiment is a Universal Serial Bus (USB) Type-C shaped receptacle, but is not limited to this. The charging opening 43 may be provided on the bottom surface of the bottom portion 11c side instead of on the peripheral wall on the bottom portion 11c side.

[0016] The charging terminal 42 may include, for example, a power receiving coil and may be configured to be able to contactlessly receive power transmitted from an external power source. In this case, the method of power transmission (Wireless Power Transfer) may be an electromagnetic induction type, a magnetic resonance type, or a combination of the electromagnetic induction type and the magnetic resonance type. As another example, the charging terminal 42 may be connectable to various USB terminals and may include the above-mentioned power receiving coil. With such a configuration, the opportunities for charging the power source BAT can be increased.

[0017] In addition, the case 11 is provided with an operation unit 14 that can be operated by the user, on the peripheral wall of the top part 11a, facing the opposite side to the charging opening 43. The operation unit 14 is composed of a button-type switch, and is used to start / shut off the MCU 50 and various sensors depending on the user's intention. The operation unit 14 may be composed of a touch panel or the like.

[0018] The aerosol inhaler 1 is also provided with a notification unit that notifies various information. The notification unit may be composed of a light-emitting element, a vibration element, or a sound output element. The notification unit may also be a combination of two or more elements among a light-emitting element, a vibration element, and a sound output element. The notification unit may be provided in any of the power supply unit 10, the first cartridge 20, and the second cartridge 30, but is preferably provided in the power supply unit 10 in order to shorten the conductor (i.e., the wiring distance) from the power supply BAT. The notification unit of this embodiment is composed of an LED window 13 provided around the operation unit 14, and LED_L1 and LED_L2 (see FIG. 6 and FIG. 8) described later.

[0019] The internal configuration of the power supply unit 10 will be described later.

[0020] (1st cartridge) As shown in FIG. 3, the first cartridge 20 is provided with a reservoir 23 for storing the aerosol source 22 inside a cylindrical cartridge case 27, a heater 21 for atomizing and / or vaporizing (hereinafter simply referred to as atomization) the aerosol source 22, a wick 24 for drawing the aerosol source from the reservoir 23 to the heater 21, an aerosol flow path 25 through which the aerosol generated by atomizing the aerosol source 22 flows toward the second cartridge 30, and an end cap 26 for accommodating a portion of the second cartridge 30.

[0021] The reservoir 23 is partitioned so as to surround the periphery of the aerosol flow path 25, and stores the aerosol source 22. The reservoir 23 may contain a porous body such as a resin web or cotton, and the porous body may be impregnated with the aerosol source 22. The reservoir 23 may not contain a resin web or a porous body on the cotton, and may store only the aerosol source 22. The aerosol source 22 includes a liquid such as glycerin, propylene glycol, water, etc. The amount of the aerosol source 22 stored in the reservoir 23 can be visually confirmed through a remaining amount confirmation window 28 (see Figs. 1 and 2) provided in the first cartridge 20. A gap (not shown) serving as an air intake port is formed between the remaining amount confirmation window 28 and the cartridge case 27, and outside air is taken into the inside of the cartridge case 27 through this gap. The air intake port does not necessarily have to be provided around the remaining amount confirmation window 28. For example, a gap may be formed between operation section 14 provided on the power supply unit and LED window 13, and outside air may be taken into case 11 from the gap, or charging opening 43 may be used. Also, a communication hole that communicates between the inside and the outside may be provided in cartridge case 27 or the wall surface of case 11.

[0022] The wick 24 is a liquid retention member that draws the aerosol source 22 from the reservoir 23 to the heater 21 by utilizing capillary action, and is made of, for example, glass fiber or porous ceramic.

[0023] Heater 21 atomizes aerosol source 22 without combustion by power supplied from power source BAT via discharge terminal 41. Heater 21 is composed of an electric heating wire (coil) wound at a predetermined pitch. Heater 21 is an example of a load capable of atomizing aerosol source 22 to generate aerosol, and the load is, for example, a heating element or an ultrasonic generator. Examples of heating elements include a heating resistor, a ceramic heater, and an induction heating heater.

[0024] The aerosol flow path 25 is provided downstream of the heater 21 and on the center line L of the power supply unit 10 (case 11). Note that this center line L is a line that continuously connects in the X direction the center points of the power supply unit 10 (case 11) when the power supply unit 10 (case 11) is cut along a plane perpendicular to the X direction.

[0025] The end cap 26 includes a cartridge accommodating portion 26a that accommodates a portion of the second cartridge 30, and a communication passage 26b that connects the aerosol flow path 25 with the cartridge accommodating portion 26a.

[0026] (2nd cartridge) The second cartridge 30 stores a flavor source 31. The second cartridge 30 is removably housed in a cartridge housing portion 26a provided in the end cap 26 of the first cartridge 20. The end of the second cartridge 30 opposite to the first cartridge 20 side is a mouthpiece 32 for the user. The mouthpiece 32 is not limited to being inseparably formed with the second cartridge 30, but may be configured to be detachable from the second cartridge 30. By configuring the mouthpiece 32 separately from the power supply unit 10 and the first cartridge 20 in this way, the mouthpiece 32 can be kept hygienic.

[0027] The second cartridge 30 imparts flavor to the aerosol by passing the aerosol generated by atomizing the aerosol source 22 by the heater 21 through the flavor source 31. The raw material pieces constituting the flavor source 31 may be cut tobacco or a molded product obtained by molding a tobacco raw material into a granular shape. The flavor source 31 may be made of a plant other than tobacco (e.g., mint, Chinese medicine, herbs, etc.). The flavor source 31 may be imparted with a flavoring such as menthol.

[0028] In the aerosol inhalator 1 of the present embodiment, aerosol with flavor added can be generated by the aerosol source 22, the flavor source 31, and the heater 21. In other words, the aerosol source 22 and the flavor source 31 can be said to be an aerosol generation source that generates aerosol.

[0029] The configuration of the aerosol generation source used in the aerosol inhaler 1 may be a configuration in which the aerosol source 22 and the flavor source 31 are separate entities, a configuration in which the aerosol source 22 and the flavor source 31 are formed integrally, a configuration in which the flavor source 31 is omitted and a substance that can be contained in the flavor source 31 is added to the aerosol source 22, a configuration in which a drug or the like is added to the aerosol source 22 instead of the flavor source 31, etc.

[0030] In the aerosol inhaler 1 configured in this manner, the heater 21 atomizes the aerosol source 22 drawn or moved from the reservoir 23 by the wick 24. The aerosol generated by atomization flows through the aerosol flow path 25 together with air flowing in from a gap (not shown) serving as an air intake formed between the remaining amount confirmation window 28 and the cartridge case 27, and is supplied to the second cartridge 30 via the communication path 26b. The aerosol supplied to the second cartridge 30 is flavored by passing through the flavor source 31, and is supplied to the mouthpiece 32.

[0031] (Circuit configuration of power supply unit 10) Next, the circuit configuration of the power supply unit 10 will be described with reference to FIG. 6, the electronic components illustrated within the area surrounded by the dashed line are electronic components mounted on the receptacle mounted board 8. That is, the receptacle mounted board 8 includes, as main electronic components, a charging terminal 42 which is a receptacle into which a USB Type-C plug (hereinafter also simply referred to as a USB plug) can be inserted, and a receptacle mounted board side connector Cn1 to which one end of a board connection cable Cb1 which connects the receptacle mounted board 8 and the MCU mounted board 7 is connected. In this embodiment, the board connection cable Cb1 is an FPC (Flexible Printed Circuit) cable having six printed patterns, but is not limited to this.

[0032] 6, the electronic components illustrated within the range surrounded by the two-dot chain line are electronic components mounted on the MCU mounting board 7. That is, the MCU mounting board 7 includes, as main electronic components, an MCU mounting board side connector Cn2 to which the other end of the board connection cable Cb1 is connected, an MCU 50 that controls the entire aerosol inhaler 1 including the power supply unit 10, a charging IC (Integrated Circuit) 55 that charges the power supply BAT, a protection IC 61 that protects the charging IC 55, an LDO (Low Dropout) regulator 62 that supplies a predetermined voltage to the MCU 50, etc., an inhalation sensor 15 for detecting a puff (inhalation) operation of the user, a discharge terminal 41 (41a, 41b) to which the heater 21 is connected, a DC / DC converter 63 that can supply power to the discharge terminal 41, and a battery connector Cn3 to which a battery connection cable Cb2 that connects the battery pack BP and the MCU mounting board 7 is connected.

[0033] The MCU 50, the charging IC 55, the protection IC 61, the LDO regulator 62, the suction sensor 15, and the DC / DC converter 63 are, for example, configured by forming a plurality of circuit elements into chips, and are provided with pins as terminals for electrically connecting the inside and outside of the device. Details of the pins provided in each of these chipped electronic components will be described later. Note that this specification and the like describes only the main pins among the pins provided in each of these chipped electronic components.

[0034] The battery pack BP includes a power source BAT, a fuse FS connected to the positive terminal of the power source BAT, and a thermistor TH connected to the negative terminal of the power source BAT and disposed close to the power source BAT. The thermistor TH is mainly composed of an element having NTC (Negative Temperature Coefficient) characteristics or PTC (Positive Temperature Coefficient) characteristics, that is, an element having a correlation between an electric resistance value and a temperature. In this embodiment, the battery connection cable Cb2 connecting the battery pack BP and the MCU mounting board 7 is an FPC cable having three printed patterns, but is not limited to this. The battery connection cable Cb2 may be connected by three wires.

[0035] 6, the wiring indicated by the thick solid line is a wiring (for example, a wiring configured by a ground pattern 78 described later) connected to a ground provided in the power supply unit 10. In other words, this wiring is a wiring having the same potential as the reference potential (ground potential) in the power supply unit 10, and hereinafter is also referred to as a ground line.

[0036] In addition, the power supply unit 10 is provided with a VBUS line Ln1, a VBAT line Ln2, a D+ line Ln3a, a D- line Ln3b, a Power-Path line Ln4, a VSYS line Ln5, and a VHEAT line Ln6 as main wiring other than the ground line. Each of these lines (wiring) is mainly composed of a conductive pattern formed on the MCU mounting board 7. The electronic components connected to each of these lines will be described later.

[0037] In the following, the board connecting cable Cb1, the receptacle mounting board side connector Cn1, and the MCU mounting board side connector Cn2, which are electronic components that connect the receptacle mounting board 8 and the MCU mounting board 7, are collectively referred to as the board connection part CN.

[0038] (Charging terminal and protection IC) The charging terminal 42 includes pins (terminals) connected to the A1 pin, A4 pin, A5 pin, A6 pin, A7 pin, A8 pin, A9 pin, A12 pin, B1 pin, B4 pin, B5 pin, B6 pin, B7 pin, B8 pin, B9 pin, and B12 pin of the inserted USB plug. In this specification, the pin of the charging terminal 42 that corresponds to the An pin (where n=1 to 12) of the USB plug is also referred to as the An pin of the charging terminal 42. Similarly, the pin of the charging terminal 42 that corresponds to the Bn pin of the USB plug is also referred to as the Bn pin of the charging terminal 42.

[0039] The A1 pin, A12 pin, B1 pin, and B12 pin of the charging terminal 42, which correspond to the GND (ground) pin of the USB plug, are connected to the ground line.

[0040] USB plug V BUS The A4 pin, A9 pin, B4 pin, and B9 pin of the charging terminal 42 corresponding to the pins are connected to the VBUS pin, which is the high-potential power terminal of the charging IC 55, via the board connection part CN, the VBUS line Ln1, and the protection IC 61. This allows power (e.g., USB bus power) from an external power source input to the power supply unit 10 via the A4 pin, A9 pin, B4 pin, or B9 pin of the charging terminal 42 to be supplied to the charging IC 55, making it possible for the charging IC 55 to use this power to charge the power supply BAT and to supply power to the MCU 50.

[0041] Describing in more detail the protection IC 61 provided between the charging terminal 42 and the charging IC 55, the protection IC 61 includes an IN pin which is a high potential side power supply terminal, a VSS pin which is a low potential side power supply terminal, a GND pin which is grounded, an OUT pin which is an output terminal from which a first system voltage Vs1 described below is output, a CE pin for turning the operation of the protection IC 61 on and off (hereinafter also referred to as turning on / off), and a VBAT pin for detecting the connection state of the power supply BAT.

[0042] The A4 pin and the B9 pin and the A9 pin and the B4 pin of the charging terminal 42 are connected in parallel to the IN pin of the protection IC 61 via the board connection part CN and the VBUS line Ln1. In other words, the IN pin of the protection IC 61 is connected to the A4 pin and the B9 pin and the A9 pin and the B4 pin of the charging terminal 42, respectively. The VSS pin, the GND pin, and the CE pin of the protection IC 61 are connected to the ground line. The OUT pin of the protection IC 61 is connected to the VBUS pin of the charging IC 55. The VBAT pin of the protection IC 61 is connected to the positive terminal (i.e., the high potential side) of the power supply BAT via the VBAT line Ln2, the battery connector Cn3, the battery connection cable Cb2, and the fuse FS. The negative terminal (i.e., the low potential side) of the power supply BAT is connected to the ground line via the battery connection cable Cb2 and the battery connector Cn3.

[0043] The protection IC 61 operates when a power supply voltage is supplied based on the difference between the potential of the IN pin and the potential of the VSS pin and the input to the CE pin is at a low level, outputting a predetermined first system voltage Vs1 from the OUT pin and detecting whether the power supply BAT is connected based on the input voltage to the VBAT pin. The charging IC 61 in this embodiment operates in negative logic since it is enabled by inputting a low level to the CE pin. Alternatively, a protection IC 61 that operates in positive logic and is enabled by inputting a high level to the CE pin may be used. In this case, it is preferable that the CE pin is connected to the IN pin so that a high level is input to the CE pin.

[0044] More specifically, when a USB plug is inserted into the charging terminal 42 and a USB cable including this USB plug is connected to an external power supply, a predetermined USB voltage (e.g., 5 [V]) is supplied from the external power supply to the A4 pin, A9 pin, B4 pin, and B9 pin of the charging terminal 42. This USB voltage is then supplied to the protection IC 61 as a power supply voltage. In addition, since the CE pin of the protection IC 61 is grounded, the input voltage to this CE pin is always at a low level. Therefore, in response to the supply of the USB voltage from the external power supply via the charging terminal 42, the protection IC 61 outputs the first system voltage Vs1 to the charging IC 55.

[0045] The first system voltage Vs1 output by the protection IC 61 has a voltage value included in the range of the recommended input voltage of the charging IC 55 (for example, a range of 4.35 to 6.4 [V]).

[0046] For example, when the input voltage to the IN pin (in other words, the potential of the IN pin) is within the range of the recommended input voltage of the charging IC 55, the protection IC 61 outputs the input voltage to the IN pin as it is from the OUT pin as the first system voltage Vs1. On the other hand, when the input voltage to the IN pin exceeds the maximum value of the recommended input voltage of the charging IC 55, the protection IC 61 converts the input voltage to the IN pin to a predetermined voltage (e.g., 5.5±0.2 [V]) within the range of the recommended input voltage of the charging IC 55, and outputs the converted voltage from the OUT pin as the first system voltage Vs1. As a result, even if a high voltage exceeding the maximum value of the recommended input voltage of the charging IC 55 is input to the protection IC 61, it is possible to prevent the high voltage from being output from the protection IC 61 to the charging IC 55 and protect the charging IC 55 from the high voltage.

[0047] In addition, when a high voltage exceeding the maximum recommended input voltage of the charging IC 55 is input to the IN pin, the protection IC 61 may prevent the high voltage input to the IN pin from being output from the OUT pin by opening a circuit (not shown) within the protection IC 61 that connects the IN pin and OUT pin.

[0048] As described above, the protection IC 61 can detect whether the power supply BAT is connected based on the input voltage to the VBAT pin. The protection IC 61 may use the detection result of whether the power supply BAT is connected in its own device, or may output the result to the outside of its own device (e.g., the MCU 50 or the charging IC 55). Furthermore, in addition to the function of protecting the charging IC 55 described above, the protection IC 61 may have various protection functions for protecting the electric circuit of the power supply unit 10, such as an overcurrent detection function or an overvoltage detection function.

[0049] 6, a capacitor (also called a smoothing capacitor or a bypass capacitor) Cd1 for stabilizing (smoothing) the input to the IN pin of the protection IC 61 is connected to the VBUS line Ln1 as needed. Similarly, a capacitor Cd2 for stabilizing the input to the VBUS pin of the charging IC 55 (i.e., the first system voltage Vs1 output from the protection IC 61) is connected between the OUT pin of the protection IC 61 and the VBUS pin of the charging IC 55 as needed.

[0050] Incidentally, the A4 pin, A9 pin, B4 pin, and B9 pin of the charging terminal 42, which are connected to the IN pin of the protection IC 61, are also connected to the ground line via a varistor (variable resistor: non-linear resistance element) VR1. By connecting the A4 pin, A9 pin, B4 pin, and B9 pin of the charging terminal 42 to the ground line via the varistor VR1 in this way, even if static electricity is generated in the A4 pin, A9 pin, B4 pin, or B9 pin of the charging terminal 42 due to friction between them when a USB plug is inserted into the charging terminal 42, the static electricity can be released to the ground line via the varistor VR1. Therefore, it is possible to protect the protection IC 61 from static electricity generated in the A4 pin, A9 pin, B4 pin, or B9 pin of the charging terminal 42.

[0051] The A6 pin and B6 pin of the charging terminal 42 corresponding to the Dp (also called D+) 1 pin or the Dp2 pin of the USB plug are connected to the PA11 pin of the MCU 50 via the board connection part CN and the D+ line Ln3a. The A7 pin and B7 pin of the charging terminal 42 corresponding to the Dn (also called D-) 1 pin or the Dp2 pin of the USB plug are connected to the PA12 pin of the MCU 50 via the board connection part CN and the D- line Ln3b. This enables serial communication using, for example, two signal lines, the D+ line Ln3a and the D- line Ln3b, between the MCU 50 and an external device (hereinafter simply referred to as the external device) to which a USB cable including a USB plug inserted into the charging terminal 42 is connected. Note that a communication method other than serial communication may be adopted for communication between the external device and the MCU 50.

[0052] Furthermore, the A6 and B6 pins of the charging terminal 42, which are connected to the PA11 pin of the MCU 50, are also connected to the ground line via the varistor VR2. As a result, even if static electricity occurs in the A6 or B6 pin of the charging terminal 42, this static electricity can be released to the ground line via the varistor VR2. Therefore, it is possible to protect the MCU 50 from static electricity occurring in the A6 or B6 pin of the charging terminal 42.

[0053] 6, if a resistor R11 is provided between the A6 pin and the B6 pin of the charging terminal 42 and the PA11 pin of the MCU 50, it becomes possible for the resistor R11 to suppress input of a large current to the PA11 pin of the MCU 50. Note that in this specification and the like, a resistor is an element having a predetermined electrical resistance value, which is composed of a resistive element, a transistor, or the like.

[0054] Furthermore, the A7 pin and B7 pin of the charging terminal 42, which are connected to the PA12 pin of the MCU 50, are also connected to the ground line via the varistor VR3. As a result, even if static electricity occurs in the A7 pin or B7 pin of the charging terminal 42, this static electricity can be released to the ground line via the varistor VR3. Therefore, it is possible to protect the MCU 50 from static electricity generated in the A7 pin or B7 pin of the charging terminal 42.

[0055] Furthermore, as shown in FIG. 6, by providing a resistor R12 between the A7 pin and the B7 pin of the charging terminal 42 and the PA12 pin of the MCU 50, it is possible to prevent a large current from being input to the PA12 pin of the MCU 50 by the resistor R12.

[0056] Furthermore, in the power supply unit 10, no problem occurs even if the MCU 50 does not recognize whether the USB plug is inserted into the charging terminal 42 in the upside-up or upside-down orientation. Therefore, the A5 pin and the B5 pin of the charging terminal 42 corresponding to the CC1 pin or the CC2 pin of the USB plug are connected to the ground line. Furthermore, the A8 pin and the B8 pin of the charging terminal 42 corresponding to the SBU1 pin or the SBU2 pin of the USB plug are not connected to the electric circuit of the power supply unit 10. In other words, these pins of the charging terminal 42 are not used in the power supply unit 10, and therefore can be omitted as appropriate. In this way, the circuit configuration of the power supply unit 10 can be prevented from becoming complicated.

[0057] (Charging IC) The charging IC 55 includes a VBUS pin which is one of the power supply terminals on the high potential side, a GND pin which is a power supply terminal on the low potential side, a BAT_1 pin and a BAT_2 pin which are input / output terminals used for power transfer between the charging IC 55 and the power supply BAT, a BAT_SNS pin which is a detection terminal for detecting an input to the power supply BAT or an output from the power supply BAT, SYS_1, SYS_2 pins, SW_1 pin, and SW_2 pins which are output terminals from which a second system voltage Vs2 described later is output, and a CE pin for turning on / off the operation of the charging IC 55. The BAT_1 pin and the BAT_2 pin can also function as power supply terminals on the high potential side in the charging IC 55.

[0058] The VBUS pin of the charging IC 55 is connected to the OUT pin of the protection IC 61 as described above. The BAT_1 pin, the BAT_2 pin, and the BAT_SNS pin of the charging IC 55 are connected to the positive terminal of the power supply BAT via the VBAT line Ln2, the battery connector Cn3, the battery connection cable Cb2, and the fuse FS. The SYS_1 pin, the SYS_2 pin, the SW_1 pin, and the SW_2 pin of the charging IC 55 are connected to the IN pin, which is the high-potential power supply terminal of the LDO regulator 62, and the VIN pin, which is the high-potential power supply terminal of the DC / DC converter 63, via the power path line Ln4. The SW_1 pin and the SW_2 pin are connected to the power path line Ln4 via the reactor Rc1. The CE pin of the charging IC 55 is connected to the PB14 pin of the MCU 50.

[0059] The charging IC 55 is supplied with a power supply voltage based on the difference between the potential of the VBUS pin, the BAT_1 pin, or the BAT_2 pin and the potential of the GND pin, and operates when the input to the CE pin is at a high level to charge the power supply BAT and supply the power discharged from the power supply BAT to the LDO regulator 62, the DC / DC converter 63, etc. The charging IC 55 in this embodiment operates in positive logic because it is enabled by inputting a high level to the CE pin. Alternatively, a charging IC 55 that operates in negative logic and is enabled by inputting a low level to the CE pin may be used.

[0060] More specifically, when the first system voltage Vs1 is input to the VBUS pin, the charging IC 55 outputs a voltage (for example, the first system voltage Vs1) for charging the power supply BAT from the BAT_1 pin and the BAT_2 pin to the power supply BAT. On the other hand, when the power supply BAT is discharged, the output voltage (terminal voltage) of the power supply BAT is input to the BAT_1 pin and the BAT_2 pin. In this case, the charging IC 55 outputs a second system voltage Vs2 according to the input voltage to the BAT_1 pin and the BAT_2 pin from the SYS_1 pin, the SYS_2 pin, the SW_1 pin, and the SW_2 pin to the LDO regulator 62, the DC / DC converter 63, etc. The second system voltage Vs2 is, for example, the output voltage of the power supply BAT itself, and specifically, can be a voltage of about 3 to 4 [V].

[0061] The charging IC 55 further includes an SCL pin connected to a PB8 pin of the MCU 50, and an SDA pin connected to a PB9 pin of the MCU 50. This allows, for example, I2C (Inter-Integrated Circuit) communication between the charging IC 55 and the MCU 50. Using this communication, the charging IC 55 transmits, for example, battery information related to the power supply BAT to the MCU 50. Here, the battery information is, for example, information indicating the charging state of the power supply BAT by the charging IC 55 (for example, charging or charging stopped) and the remaining capacity (SOC: State Of Charge) of the power supply BAT. Note that a communication method other than I2C communication may be adopted for the communication between the charging IC 55 and the MCU 50.

[0062] 6, the charging IC 55 may further include an ISET pin, an ILIM pin, a TS pin, and the like. When the charging IC 55 includes an ISET pin, the electric resistance value of a resistor connected between the ISET pin and a ground line can set the value of a current output from the charging IC 55 to the power supply BAT. When the charging IC 55 includes an ILIM pin, the electric resistance value of a resistor connected between the ILIM pin and a ground line can set the upper limit of the value of a current output from the charging IC 55 to the LDO regulator 62, the DC / DC converter 63, and the like. When the charging IC 55 includes a TS pin, the charging IC 55 can detect the electric resistance value and temperature of a resistor connected to the TS pin based on the input voltage to the TS pin.

[0063] 6, a capacitor Cd3 for stabilizing the input to the BAT_SNS pin of the charging IC 55 is appropriately connected to the VBAT line Ln2 as needed. In addition, a capacitor Cd4 for stabilizing the second system voltage Vs2 output from the charging IC 55 and a capacitor Cd5 for stabilizing the input to the IN pin of the LDO regulator 62 are appropriately connected to the power path line Ln4 as needed.

[0064] (LED circuit) The power path line Ln4, to which the second system voltage Vs2 output from the charging IC 55 is supplied, is further connected to a first LED circuit Cc1 for operating (e.g., lighting) LED_L1 and a second LED circuit Cc2 for operating LED_L2.

[0065] The first LED circuit Cc1 is configured by connecting in series an LED_L1 and a switch Sw1 that switches the first LED circuit Cc1 between conduction and interruption. One end of the first LED circuit Cc1 is connected to the power path line Ln4, and the other end is connected to the ground line. The switch Sw1 of the first LED circuit Cc1 is turned on in response to an on command from the MCU 50, and is turned off in response to an off command from the MCU 50. When the switch Sw1 is turned on, the first LED circuit Cc1 is brought into a conducting state, and the second system voltage Vs2 output from the charging IC 55 is supplied to the LED_L1, causing the LED_L1 to light up.

[0066] As the switch Sw1, for example, a switch formed of a MOSFET can be used. In this embodiment, as an example, a gate terminal of the MOSFET forming the switch Sw1 is connected to the PA0 pin of the MCU 50, and the MCU 50 controls the output from the PA0 pin to change the gate voltage applied to the gate terminal of the switch Sw1 and turn the switch Sw1 on or off. Note that the switch Sw1 is not limited to a MOSFET, and may be any switch that is turned on / off according to the control of the MCU 50.

[0067] The second LED circuit Cc2 is configured by connecting the LED_L2 and a switch Sw2 that switches the second LED circuit Cc2 between conduction and cutoff in series. One end of the second LED circuit Cc2 is connected to the power path line Ln4, and the other end is connected to the ground line. The switch Sw2 of the second LED circuit Cc2 is turned on in response to an on command from the MCU 50, and is turned off in response to an off command from the MCU 50. When the switch Sw2 is turned on, the second LED circuit Cc2 is brought into a conductive state, and the second system voltage Vs2 output from the charging IC 55 is supplied to the LED_L2, causing the LED_L2 to light up.

[0068] As with the switch Sw1, the switch Sw2 may be, for example, a switch configured with a MOSFET. In the present embodiment, as an example, a gate terminal of the MOSFET configuring the switch Sw2 is connected to the PB3 pin of the MCU 50, and the MCU 50 controls the output from the PB3 pin to change the gate voltage applied to the gate terminal of the switch Sw2 and turn the switch Sw2 on or off. Note that the switch Sw2 is not limited to a MOSFET, and may be any switch that is turned on / off according to the control of the MCU 50.

[0069] (LDO regulator) The LDO regulator 62 has an IN pin which is a high-potential power supply terminal, a GND pin which is a low-potential power supply terminal, an OUT pin which is an output terminal from which a third system voltage Vs3 described below is output, and an EN pin for turning the operation of the LDO regulator 62 on / off.

[0070] As described above, the IN pin of the LDO regulator 62 is connected to the SYS_1 pin, SYS_2 pin, etc. of the charging IC 55 via the power path line Ln4. The GND pin of the LDO regulator 62 is connected to the ground line. The OUT pin of the LDO regulator 62 is connected to the VDD pin, which is the high-potential power supply terminal of the MCU 50, and the VDD pin, which is the high-potential power supply terminal of the suction sensor 15, via the VSYS line Ln5. The EN pin of the LDO regulator 62 is connected to the power path line Ln4.

[0071] The LDO regulator 62 operates when a power supply voltage is supplied based on the difference between the potential of the IN pin and the potential of the GND pin and when the input voltage to the EN pin is at a high level, generating a predetermined third system voltage Vs3 and outputting it from the OUT pin. The LDO regulator 62 in this embodiment operates in positive logic since it is enabled when a high level is input to the EN pin. Alternatively, an LDO regulator 62 that operates in positive logic and is enabled when a low level is input to the EN pin may be used. In this case, it is preferable that the EN pin is connected to the ground line so that a low level is always input to the EN pin.

[0072] More specifically, in response to the second system voltage Vs2 being output from the charging IC 55, the second system voltage Vs2 is supplied as a power supply voltage to the LDO regulator 62. Furthermore, when the second system voltage Vs2 is being output from the charging IC 55, the input voltage to the EN pin of the LDO regulator 62 becomes the second system voltage Vs2 (i.e., high level). Therefore, when the second system voltage Vs2 is output from the charging IC 55, the LDO regulator 62 generates a third system voltage Vs3 and outputs the generated third system voltage Vs3 to the MCU 50, the suction sensor 15, etc.

[0073] The third system voltage Vs3 output by the LDO regulator 62 has a voltage value suitable for operating the MCU 50, the suction sensor 15, etc. Specifically, the third system voltage Vs3 is a voltage lower than the second system voltage Vs2, and can be set to, for example, 2.5 [V].

[0074] (Operation switch circuit) The VSYS line Ln5, to which the third system voltage Vs3 output from the LDO regulator 62 is supplied, is further connected to an operation switch circuit Cc3 for detecting a user's operation of the operation switch OPS, and a power supply temperature detection circuit Cc4 for detecting the temperature of the power supply BAT.

[0075] The operation switch circuit Cc3 is composed of resistors R1, R2, R3, and an operation switch OPS. One end of the resistor R1 is connected to the VSYS line Ln5, and the other end is connected to one end of each of the resistors R2 and R3. The other end of the resistor R2 is connected to the PC4 pin of the MCU 50, and the other end of the resistor R3 is connected to one end of the operation switch OPS. The other end of the operation switch OPS is connected to the ground line.

[0076] When the operation switch OPS is not operated by the user, a voltage obtained by stepping down the third system voltage Vs3 supplied to the VSYS line Ln5 by resistors R1 and R2 is input to the PC4 pin of the MCU 50. On the other hand, when the operation switch OPS is operated by the user, a voltage obtained by dividing the third system voltage Vs3 supplied to the VSYS line Ln5 by resistors R1 and R3 and then stepping down the voltage by resistor R2 is input to the PC4 pin of the MCU 50. Therefore, the MCU 50 can detect whether the user has operated the operation switch OPS based on the input voltage to the PC4 pin.

[0077] (Power supply temperature detection circuit) The power supply temperature detection circuit Cc4 is configured by connecting in series a thermistor TH, a resistor R4, and a switch Sw3 that switches the power supply temperature detection circuit Cc4 between conduction and interruption. One end of the power supply temperature detection circuit Cc4 on the switch Sw3 side is connected to the VSYS line Ln5, and the other end of the power supply temperature detection circuit Cc4 on the thermistor TH side is connected to the ground line. The PC1 pin of the MCU 50 is connected to a connection point CP between the resistor R4 and the thermistor TH in the power supply temperature detection circuit Cc4.

[0078] The switch Sw3 of the power supply temperature detection circuit Cc4 is turned on in response to an on command from the MCU 50, and is turned off in response to an off command from the MCU 50. When the switch Sw3 is turned on, the power supply temperature detection circuit Cc4 is brought into a conductive state, and a voltage obtained by dividing the third system voltage Vs3 supplied to the VSYS line Ln5 by the electric resistance value of the resistor R4 and the electric resistance value of the thermistor TH is input to the PC1 pin of the MCU 50. As described above, since the thermistor TH has a correlation between the electric resistance value and the temperature, the input voltage to the PC1 pin when the switch Sw3 is turned on varies depending on the temperature of the thermistor TH. Therefore, the MCU 50 can detect the temperature of the thermistor TH (i.e., the temperature of the power supply BAT) based on the input voltage to the PC1 pin when the switch Sw3 is turned on.

[0079] As with the switches Sw1 and the like, the switch Sw3 may be, for example, a switch made of a MOSFET. In this embodiment, as an example, a gate terminal of the MOSFET constituting the switch Sw3 is connected to the PA8 pin of the MCU 50, and the MCU 50 controls the output from the PA8 pin to change the gate voltage applied to the gate terminal of the switch Sw3 and turn the switch Sw3 on or off. The switch Sw3 is not limited to a MOSFET, and may be any switch that is turned on / off according to the control of the MCU 50.

[0080] (DC / DC converter) The DC / DC converter 63 includes a VIN pin which is a high potential power supply terminal, a GND pin which is a low potential power supply terminal, a SW pin to which a voltage is input, a VOUT pin which is an output terminal from which a fourth system voltage Vs4 described below is output, an EN pin for turning the operation of the DC / DC converter 63 on / off, and a MODE pin for setting the operating mode of the DC / DC converter 63.

[0081] As described above, the VIN pin of the DC / DC converter 63 is connected to the SYS_1 pin, SYS_2 pin, etc. of the charging IC 55 via the power path line Ln4. The GND pin of the DC / DC converter 63 is connected to the ground line. The SW pin of the DC / DC converter 63 is connected to the power path line Ln4 via the reactor Rc2. The VOUT pin of the DC / DC converter 63 is connected to the positive side discharge terminal 41a, which is the positive terminal (i.e., the high potential side) of the discharge terminal 41, via the VHEAT line Ln6. The EN pin of the DC / DC converter 63 is connected to the PB2 pin of the MCU 50. The MODE pin of the DC / DC converter 63 is connected to the power path line Ln4. In addition, the negative side discharge terminal 41b, which is the negative terminal (i.e., the low potential side) of the discharge terminal 41, is connected to the ground line.

[0082] The DC / DC converter 63 operates when a power supply voltage is supplied based on the difference between the potential of the VIN pin and the potential of the GND pin and when the input voltage to the EN pin is at a high level, boosting the input voltage and outputting it from the VOUT pin. The DC / DC converter 63 in this embodiment operates on positive logic since it is enabled when a high level is input to the EN pin. Alternatively, a DC / DC converter 63 that operates on negative logic and is enabled when a low level is input to the EN pin may be used.

[0083] More specifically, in response to the second system voltage Vs2 being output from the charging IC 55, the second system voltage Vs2 is supplied as a power supply voltage to the DC / DC converter 63. Furthermore, when the MCU 50 determines to heat the heater 21 in response to an aerosol generation request (for example, a puffing operation by a user) or the like, it inputs a high-level voltage signal to the EN pin of the DC / DC converter 63. As a result, the DC / DC converter 63 outputs the fourth system voltage Vs4 obtained by boosting the voltage input to the DC / DC converter 63 to the discharge terminal 41 (i.e., the heater 21).

[0084] The fourth system voltage Vs4 output by the DC / DC converter 63 has a voltage value suitable for heating the heater 21. Specifically, the fourth system voltage Vs4 is a voltage higher than the third system voltage Vs3, and may be, for example, a voltage of about 4.2 [V].

[0085] The DC / DC converter 63 is, for example, a switching regulator, and can take a pulse width modulation mode (hereinafter also referred to as PWM mode) and a pulse frequency modulation mode (hereinafter also referred to as PFM mode) as operation modes. In this embodiment, by connecting the MODE pin of the DC / DC converter 63 to the power path line Ln4, the input voltage to the MODE pin when the DC / DC converter 63 is operable becomes a high level, so that the DC / DC converter 63 operates in the PWM mode.

[0086] 6, the VHEAT line Ln6 is provided with a switch Sw4 that switches the VHEAT line Ln6 between conductive and cut-off. The switch Sw4 is turned on in response to an on command from the MCU 50, and is turned off in response to an off command from the MCU 50. When the switch Sw4 is turned on, the VHEAT line Ln6 is brought into a conductive state, and the fourth system voltage Vs4 output from the DC / DC converter 63 is supplied to the discharge terminal 41 (specifically, the positive electrode side discharge terminal 41a), thereby heating the heater 21. This allows the aerosol source to be atomized or vaporized, and the aerosol can be generated.

[0087] The switch Sw4 may be, for example, a switch made of a MOSFET. More specifically, the switch Sw4 is preferably a power MOSFET with a high switching speed. In the present embodiment, as an example, a gate terminal of the MOSFET constituting the switch Sw4 is connected to the PB4 pin of the MCU 50, and the MCU 50 controls the output from the PB4 pin to change the gate voltage applied to the gate terminal of the switch Sw4 and turn the switch Sw4 on or off.

[0088] (Other electronic components connected to VHEAT line Ln6) If the power supplied to the discharge terminal 41 becomes unstable, the amount of aerosol generated by the heater 21 may vary, which may lead to a deterioration in the flavor and aroma. Therefore, as shown in FIG. 6, a capacitor for stabilizing the fourth system voltage Vs4 output from the DC / DC converter 63 is connected to the VHEAT line Ln6.

[0089] More specifically, in the power supply unit 10, three capacitors, capacitor Cd61, capacitor Cd62, and capacitor Cd63, are provided in parallel as capacitors for stabilizing the fourth system voltage Vs4 output from the DC / DC converter 63. In this way, by stabilizing (smoothing) the voltage using multiple capacitors, the heat generated by the voltage stabilization can be distributed to the multiple capacitors. Therefore, compared to the case where the voltage is stabilized using one capacitor, it is possible to prevent the capacitors from becoming too hot, and to suppress deterioration and failure of the capacitors.

[0090] In particular, a high voltage value is required for the fourth system voltage Vs4 in order to ensure the amount of aerosol generated by the heater 21. If such a high voltage were to be stabilized by a single capacitor, it is expected that the capacitor would become extremely hot. As a result, not only would the hot capacitor be significantly deteriorated, but other electronic components arranged around the capacitor may also be adversely affected. Therefore, as described above, it is desirable to stabilize the fourth system voltage Vs4 by using multiple capacitors.

[0091] Among the capacitors Cd61, Cd62, and Cd63, the capacitor Cd61 has a relatively small capacitance and, accordingly, a relatively small physical size. On the other hand, the capacitors Cd62 and Cd63 have a relatively large capacitance and, accordingly, a relatively large physical size. As a specific example, the capacitance of the capacitor Cd61 can be 0.1 [μF], and the capacitance of the capacitors Cd62 and Cd63 can be 50 [μF]. In this way, by using a plurality of capacitors having different capacitances, even if various pulsating components (ripples) are included in the fourth system voltage Vs4, these can be removed.

[0092] 6, in this embodiment, a varistor VR4 is provided in the VHEAT line Ln6 between the discharge terminal 41 and the switch Sw4. More specifically, one end of the varistor VR4 is connected to the VHEAT line Ln6, and the other end is connected to the ground line. By providing such a varistor VR4, even if static electricity noise occurs in the discharge terminal 41 due to, for example, the attachment or detachment of the first cartridge 20, this noise can be released to the ground line via the varistor VR4. Therefore, it is possible to protect the system of the power supply unit 10, such as the switch Sw4 and the DC / DC converter 63, from noise such as static electricity generated in the discharge terminal 41.

[0093] 6, in the VHEAT line Ln6, a capacitor Cd7 for stabilizing the voltage supplied to the discharge terminal 41 via the switch Sw4 is also connected between the discharge terminal 41 and the switch Sw4. The capacitor Cd7 can also function as a protection component for protecting the system of the power supply unit 10, such as the switch Sw4 and the DC / DC converter 63, from noise such as static electricity generated at the discharge terminal 41. Therefore, the capacitor Cd7 can also protect the system of the power supply unit 10, such as the switch Sw4 and the DC / DC converter 63, from noise such as static electricity generated at the discharge terminal 41. In addition to when the first cartridge 20 is attached or detached, noise such as static electricity can also be generated at the discharge terminal 41 when the user touches the discharge terminal 41 or when stress is applied to the discharge terminal 41.

[0094] (Suction sensor) The suction sensor 15 includes a VDD pin which is a high potential power supply terminal, a GND pin which is a low potential power supply terminal, and an OUT pin which is an output terminal.

[0095] As described above, the VDD pin of the suction sensor 15 is connected to the OUT pin of the LDO regulator 62 via the VSYS line Ln5. The GND pin of the suction sensor 15 is connected to the ground line. The OUT pin of the suction sensor 15 is connected to the PC5 pin of the MCU 50.

[0096] The suction sensor 15 operates when a power supply voltage is supplied based on the difference between the potential of the VDD pin and the potential of the GND pin. Specifically, the suction sensor 15 operates when the third system voltage Vs3 output from the LDO regulator 62 is supplied as a power supply voltage, and functions as a sensor device that detects the user's puffing action. For example, the suction sensor 15 is mainly composed of a condenser microphone and a pressure sensor, and outputs a signal indicating the value of the pressure (internal pressure) change in the power supply unit 10 caused by the user's inhalation as a detection result from the OUT pin to the MCU 50. Note that a sensor device other than a condenser microphone or a pressure sensor may be used for the suction sensor 15.

[0097] (MCU) The MCU 50 has a VDD pin which is a high-potential power supply terminal, a VSS pin which is a low-potential power supply terminal, and a number of pins which function as input or output terminals (hereinafter also referred to as input / output pins). The MCU 50 operates when a power supply voltage is supplied based on the difference between the potential of the VDD pin and the potential of the VSS pin.

[0098] Since the MCU 50 has the aforementioned PA11 pin and PA12 pin as input / output pins, it can use these pins to communicate with external devices, for example, to obtain firmware update data, etc. from the external devices. In addition, since the MCU 50 has the aforementioned PB8 pin and PB9 pin as input / output pins, it can use these pins to communicate with the charging IC 55, and can obtain the aforementioned battery information, etc. from the charging IC 55.

[0099] Furthermore, since the MCU 50 has the aforementioned PB14 pin and PB2 pin as input / output pins, it can control the on / off of the charging IC 55 by output from the PB14 pin, and the on / off of the DC / DC converter 63 by output from the PB2 pin.

[0100] In addition, since MCU 50 has the aforementioned PA0 pin, PB3 pin, PA8 pin, and PB4 pin as input / output pins, switch Sw1 can be turned on / off by output from PA0 pin, switch Sw2 by output from PB3 pin, switch Sw3 by output from PA8 pin, and switch Sw4 by output from PB4 pin.

[0101] And since MCU50 has the aforementioned PC5 pin, PC4 pin, and PC1 pin as input / output pins, it can detect the user's puffing action based on the input to the PC5 pin, the user's operation of the operating switch OPS based on the input to the PC4 pin, and the temperature of thermistor TH (i.e., the temperature of the power supply BAT) based on the input to the PC1 pin when switch Sw3 is turned on.

[0102] (Internal structure of the power supply unit) Next, the internal configuration of the power supply unit 10 will be described with reference to FIG. 5, and FIGS. A chassis 12 is provided in the internal space of the case 11, and a charging terminal 42 (see Figure 3), a receptacle mounting board 8, a battery pack BP including a power source BAT, and an MCU mounting board 7 are held in the chassis 12 in this order from the bottom portion 11c to the top portion 11a.

[0103] In this way, by arranging the receptacle mounting board 8, the power supply BAT, and the MCU mounting board 7 in this order from the bottom part 11c toward the top part 11a (i.e., in the X direction), the MCU mounting board 7 can be arranged in a position closer to the power supply BAT than when the receptacle mounting board 8 is arranged between the power supply BAT and the MCU mounting board 7. By arranging the MCU mounting board 7 in a position closer to the power supply BAT, the wiring distance between the power supply BAT and an electronic component (e.g., battery connector Cn3) connected to the power supply BAT on the MCU mounting board 7 can be shortened, reducing excess wiring and making it possible to miniaturize the power supply unit 10. In addition, the cost of manufacturing the power supply unit 10 can be reduced.

[0104] Furthermore, if the wiring distance between the power supply BAT and the electronic components connected to the power supply BAT is short, the number of electronic components that are affected by noise generated by the current flowing through this wiring can be reduced compared to when the wiring distance is long. Therefore, even if the current value of the current flowing through this wiring (for example, the charging current that charges the power supply BAT or the discharging current from the power supply BAT) becomes large, the influence of the noise generated by this current on the electronic components of the power supply unit 10 can be reduced, and the operation of the power supply unit 10 can be stabilized.

[0105] The chassis 12 that holds the MCU-mounted board 7, the battery pack BP, etc. is made of an insulating material such as synthetic resin (e.g., plastic). The chassis 12 has a wall 12a that separates the part that holds the MCU-mounted board 7 from the part that holds the battery pack BP in the X direction. This wall 12a can function as a spacer that insulates the MCU-mounted board 7 from the power source BAT of the battery pack BP.

[0106] In this way, by providing the wall portion 12a that functions as an insulating spacer between the MCU mounted board 7 and the battery pack BP, it is possible to prevent a short circuit from occurring due to physical contact between the MCU mounted board 7 and the power supply BAT. Note that in this embodiment, the spacer that insulates the MCU mounted board 7 from the power supply BAT is configured by the wall portion 12a of the chassis 12, but this is not limiting and may be provided separately from the chassis 12, for example.

[0107] In addition, the case 11 is provided with the aforementioned charging opening 43 which allows access to the charging terminal 42, an operation opening which exposes the operation unit 14 to the outside, and a pair of discharge openings which expose the discharge terminal 41 to the outside from the top portion 11a.

[0108] (MCU mounted board) The MCU mounting board 7 is mounted with a plurality of electronic components described in the circuit configuration of the power supply unit 10 (see FIG. 6, etc.). The MCU mounting board 7 is a multi-layer board formed by stacking a plurality of layers, and has a substantially rectangular shape. The MCU mounting board 7 is disposed so that its longitudinal direction is aligned with the extension direction of the center line L of the case 11 (i.e., the X direction) and so that one element mounting surface faces the operation unit 14.

[0109] In the following description, the X direction may be referred to as the longitudinal direction X, and in the X direction, the top part 11a side is referred to as the X1 direction, and the bottom part 11c side is referred to as the X2 direction. In addition, on the MCU mounting board 7, a direction perpendicular to the longitudinal direction X is referred to as the transverse direction Y, and in the transverse direction Y, one side (the left side of FIG. 7, the upper side of FIG. 8 and FIG. 9, and the lower side of FIG. 10 and FIG. 11) is referred to as the Y1 direction, and the other side (the right side of FIG. 7, the lower side of FIG. 8 and FIG. 9, and the upper side of FIG. 10 and FIG. 11) is referred to as the Y2 direction. The longitudinal direction X may be referred to as the length direction of the MCU mounting board 7, and the transverse direction Y may be referred to as the width direction of the MCU mounting board 7. The center line of the MCU mounting board 7 coincides with the center line L of the power supply unit 10 (case 11) extending in the X direction. The center line of the MCU mounting substrate 7 is a line that continuously connects the center points of the width direction (short direction) and thickness direction of the MCU mounting substrate 7 in the longitudinal direction X when the MCU mounting substrate 7 is cut along a plane perpendicular to the longitudinal direction X.

[0110] 7, the MCU mounted board 7 is made up of a rectangular portion 81 that occupies most of the MCU mounted board 7, and a protruding portion 82 that protrudes in the X1 direction from the rectangular portion 81. Both ends of the protruding portion 82 in the short side direction Y are cut out, and the X1 direction end of the protruding portion 82 faces the top portion 11a of the case 11, and the X1 direction end of the rectangular portion 81 where the protruding portion 82 is not provided faces the low floor portion 11b of the case 11.

[0111] If the surface of the MCU board 7 facing the operation unit 14 is referred to as the main surface 7a and the opposite surface (i.e., the back surface) is referred to as the sub-surface 7b, the MCU board 7 is a double-sided mounting board in which electronic components are mounted on both the main surface 7a and the sub-surface 7b.

[0112] As shown in FIG. 8, a battery connector Cn3, an MCU 50, an operation switch OPS, an LED_L1, an LED_L2, a DC / DC converter 63, a reactor Rc2, a capacitor Cd61, a capacitor Cd62, a capacitor Cd63, a switch Sw4, a capacitor Cd7, a varistor VR4, a positive electrode discharge terminal 41a, etc. are mounted on the main surface side surface layer 71a of the main surface 7a (hereinafter simply referred to as the main surface 7a).

[0113] More specifically, a button-type operation switch OPS is mounted approximately in the center of the main surface 7a so as to face the operation unit 14. This allows a user to press down the operation switch OPS via the operation unit 14 of the case 11. Also, LED_L1 and LED_L2 are mounted near the operation switch OPS so as to sandwich the operation switch OPS in the short-side direction Y. This allows a user to visually recognize the light emitted from LED_L1 and LED_L2 through LED windows 13 provided around the operation unit 14.

[0114] A battery connector Cn3 is mounted on the end of the main surface 7a in the X2 direction. A battery connection cable Cb2 extending from a battery pack BP including a power source BAT is connected to the battery connector Cn3 from the Y2 direction side (see also FIG. 7).

[0115] Here, the end in the X2 direction where the battery connector Cn3 is mounted is located close to the power supply BAT. By arranging the battery connector Cn3 at a position close to the power supply BAT in this way, it is possible to configure the battery connection cable Cb2 to be short, and the power supply unit 10 can be made smaller. In addition, the cost of manufacturing the power supply unit 10 can be reduced. Furthermore, by shortening the battery connection cable Cb2, even if the current value of the current flowing through the battery connection cable Cb2, such as the charging current for charging the power supply BAT or the discharging current from the power supply BAT, becomes large, the influence of noise generated by this current on the electronic components of the power supply unit 10 can be reduced, and the operation of the power supply unit 10 can be stabilized.

[0116] As described above, the wall 12a, which is a spacer that insulates the MCU mounting board 7 and the battery pack BP (i.e., the power source BAT) in the longitudinal direction X, is provided between them. For this reason, in this embodiment, the battery connector Cn3 is mounted on the MCU mounting board 7 with the battery connector Cn3 facing in the Y2 direction, and the battery connection cable Cb2 is connected to the battery connector Cn3 from the Y2 direction side. This makes it possible to avoid physical interference between the battery connection cable Cb2 and / or the wall 12a without making them have complex shapes.

[0117] In this embodiment, the battery connector Cn3 is mounted on the MCU mounting board 7 with the battery connector Cn3 facing in the Y2 direction, and the battery connection cable Cb2 is connected to the battery connector Cn3 from the Y2 direction side, but this is not limited to the above. The battery connector Cn3 may be mounted on the MCU mounting board 7 with the battery connector Cn3 facing in the Y1 direction, and the battery connection cable Cb2 may be connected to the battery connector Cn3 from the Y1 direction side.

[0118] 8, the dashed line indicated by the reference numeral 55 indicates the mounting position of the charging IC 55 mounted on the secondary surface 7b, which is the reverse surface of the primary surface 7a. That is, the battery connector Cn3 and the charging IC 55 are mounted on different surfaces of the MCU mounting board 7 such that at least a part of the battery connector Cn3 overlaps with the charging IC 55 in a direction perpendicular to the MCU mounting board 7. Here, the direction perpendicular to the MCU mounting board 7 refers to the direction perpendicular to the longitudinal direction X and the lateral direction Y.

[0119] The battery connector Cn3 and the charging IC 55 are physically large in size and tend to occupy a large area on the MCU-mounted board 7. Therefore, by mounting the battery connector Cn3 and the charging IC 55 on different surfaces of the MCU-mounted board 7, it becomes possible to mount the battery connector Cn3 and the charging IC 55 by effectively utilizing both the main surface 7a and the sub-surface 7b. This makes it possible to mount the battery connector Cn3 and the charging IC 55 on the MCU-mounted board 7 while preventing the MCU-mounted board 7 from becoming large.

[0120] At least a part of the battery connector Cn3 overlaps with the charging IC 55 in a direction perpendicular to the main surface 7a of the MCU mounting board 7, so that the wiring distance between the battery connector Cn3 and the charging IC 55 can be shortened. This reduces excess wiring (for example, a conductive pattern formed on the MCU mounting board 7) and reduces the size of the MCU mounting board 7. In addition, the cost of manufacturing the MCU mounting board 7 can be reduced. If the wiring distance between the battery connector Cn3 and the charging IC 55 is short, even if the current value of the current flowing through this wiring (for example, the VBAT line Ln2) becomes large, the effect of noise caused by this current on other electronic components in the MCU mounting board 7 can be reduced, and the operation of the power supply unit 10 can be stabilized. The current flowing through the wiring between the battery connector Cn3 and the charging IC 55 is, for example, a charging current for charging the power supply BAT (hereinafter, also simply referred to as a charging current) or a discharging current from the power supply BAT (hereinafter, also simply referred to as a discharging current).

[0121] Further, a positive electrode side discharge terminal 41a is mounted on a protruding portion 82 which is an end portion in the X1 direction of the main surface 7a. A heater 21 provided in the first cartridge 20 is connected to the positive electrode side discharge terminal 41a. The end portion in the X1 direction where the positive electrode side discharge terminal 41a is mounted is located close to the first cartridge 20. In this manner, by arranging the positive electrode side discharge terminal 41a at a position close to the first cartridge 20, it is possible to easily and efficiently connect the positive electrode side discharge terminal 41a and the heater 21.

[0122] The positive electrode discharge terminal 41a is disposed on the Y2 side of the protruding portion 82 across the center line L. On the other hand, a switch Sw4 is disposed on the Y1 side of the protruding portion 82 across the center line L.

[0123] Furthermore, on the main surface 7a, a DC / DC converter 63, a reactor Rc2, a capacitor Cd61, a capacitor Cd62, a capacitor Cd63, a capacitor Cd7, etc. are mounted between the operation switch OPS and the switch Sw4 in the X direction.

[0124] As shown in FIG. 8, the DC / DC converter 63, the capacitor Cd61, the capacitor Cd62, and the capacitor Cd63 are arranged in a substantially L-shape when viewed from a direction perpendicular to the MCU mounting board 7 (hereinafter also referred to as a plan view of the MCU mounting board 7).

[0125] More specifically, the capacitor Cd61 is aligned with the DC / DC converter 63 and the capacitor Cd62 in the short-side direction Y (i.e., the width direction of the MCU mounted board 7), but is not aligned with the capacitor Cd63. Here, "aligned in the short-side direction Y" means that at least a portion of each of them overlaps when viewed from the short-side direction Y.

[0126] Furthermore, the capacitor Cd63 is aligned with the DC / DC converter 63 in the longitudinal direction X (i.e., the length direction of the MCU mounted board 7), but is not aligned with the capacitors Cd61 and Cd62. Aligned in the longitudinal direction X here means that at least a portion of each of them overlaps when viewed from the longitudinal direction X.

[0127] 8, the capacitors Cd61 and Cd63 are not aligned in a line in the longitudinal direction X, which is the length direction of the MCU mounting board 7, and in the lateral direction Y, which is the width direction of the MCU mounting board 7. Similarly, the capacitors Cd62 and Cd63 are not aligned in a line in the longitudinal direction X and the lateral direction Y.

[0128] If capacitor Cd61 or capacitor Cd62 and capacitor Cd63 are mounted on the MCU mounting board 7 in a row in the longitudinal direction X or the lateral direction Y, there is a risk that the size of the MCU mounting board 7 in the longitudinal direction X (i.e., the size in the length direction; hereinafter also referred to as the length dimension) or the size in the lateral direction Y (i.e., the size in the width direction; hereinafter also referred to as the width dimension) will become large in order to secure the space to line them up.

[0129] Therefore, in this embodiment, the capacitor Cd61 or the capacitor Cd62 and the capacitor Cd63 are mounted on the MCU mounting substrate 7 so as not to be aligned in a row in the longitudinal direction X and the lateral direction Y, thereby preventing the length and width of the MCU mounting substrate 7 from becoming larger than when they are aligned in a row. This allows the MCU mounting substrate 7 to be made smaller, and the cost of manufacturing the MCU mounting substrate 7 to be reduced. In addition, by making the MCU mounting substrate 7 smaller, the power supply unit 10 itself can also be made smaller. This improves the portability of the aerosol inhaler 1, thereby improving the convenience of the user.

[0130] Furthermore, in this embodiment, the number of capacitors mounted on the MCU mounting board 7 so as to be aligned with the DC / DC converter 63 in the longitudinal direction X is one (only capacitor Cd63), which is fewer than the number of capacitors (two capacitors, capacitor Cd61 and capacitor Cd62) mounted on the MCU mounting board 7 so as to be aligned with the DC / DC converter 63 in the lateral direction Y. In this way, by reducing the number of capacitors mounted on the MCU mounting board 7 so as to be aligned with the DC / DC converter 63 in the longitudinal direction X to be fewer than the number of capacitors mounted on the MCU mounting board 7 so as to be aligned with the DC / DC converter 63 in the lateral direction Y, it is possible to prevent the length dimension of the MCU mounting board 7 from becoming large, and the MCU mounting board 7 can be made smaller in size.

[0131] As described above, the capacitance of the capacitor Cd63 is larger than that of the capacitor Cd61. By arranging the capacitor Cd63, which has a large capacitance and tends to be large in physical size, in this way with the DC / DC converter 63 in the longitudinal direction X, it is possible to prevent the width of the MCU mounting board 7 from becoming larger than when these are arranged in the lateral direction Y. This makes it possible to reduce the size of the MCU mounting board 7.

[0132] Furthermore, as described above, the capacitance of the capacitor Cd62 is also larger than the capacitance of the capacitor Cd61. In this manner, by arranging the capacitor Cd62, which has a large capacitance and tends to be large in physical size, alongside the DC / DC converter 63 in the short-side direction Y, it is possible to avoid arranging the capacitors Cd62 and Cd63 in the short-side direction Y. This makes it possible to avoid an increase in the width dimension of the MCU mounting substrate 7 compared to the case where the capacitors Cd62 and Cd63 are arranged in the short-side direction Y. This allows the MCU mounting substrate 7 to be made smaller in size.

[0133] Also, the DC / DC converter 63, the capacitor Cd61, and the capacitor Cd62 are arranged in a row in this order in the short-side direction Y. That is, in the MCU mounting substrate 7, a large number of vias and the like tend to be provided around the DC / DC converter 63. For this reason, it is difficult to mount a large-sized, large-capacity capacitor such as the capacitor Cd62 in close proximity to the DC / DC converter 63 on the MCU mounting substrate 7. On the other hand, a small-sized capacitor such as the capacitor Cd61 is easy to mount in close proximity to the DC / DC converter 63 on the MCU mounting substrate 7. Therefore, by arranging the DC / DC converter 63, the capacitor Cd61, and the capacitor Cd62 in this order in the short-side direction Y, it is possible to mount them in high density on the MCU mounting substrate 7, and the substrate area of ​​the MCU mounting substrate 7 can be effectively utilized to reduce the size of the MCU mounting substrate 7.

[0134] Moreover, the capacitor Cd63 has a rectangular shape consisting of long sides and short sides in a plan view of the MCU mounting substrate 7. The capacitor Cd63 is mounted on the MCU mounting substrate 7 so that its short sides are parallel to the longitudinal direction X. In other words, the capacitor Cd63 is mounted on the MCU mounting substrate 7 so that the short side direction of the capacitor Cd63 coincides with the longitudinal direction X of the MCU mounting substrate 7. This makes it possible to prevent an increase in the length dimension of the MCU mounting substrate 7 even if the capacitor Cd63 is arranged next to the DC / DC converter 63 in the longitudinal direction X. This makes it possible to reduce the size of the MCU mounting substrate 7.

[0135] Moreover, the capacitor Cd62 has a rectangular shape consisting of long sides and short sides in a plan view of the MCU mounting board 7. The capacitor Cd62 is mounted on the MCU mounting board 7 so that the long sides are parallel to the longitudinal direction X. In other words, the capacitor Cd62 is mounted on the MCU mounting board 7 so that the short side direction of the capacitor Cd62 coincides with the short side direction Y of the MCU mounting board 7. This makes it possible to prevent an increase in the width dimension of the MCU mounting board 7 even if the capacitor Cd62 is arranged next to the DC / DC converter 63 in the short side direction Y. This makes it possible to reduce the size of the MCU mounting board 7.

[0136] As shown in FIG. 10, a charging IC 55, a reactor Rc1, a protection IC 61, an MCU mounted board side connector Cn2, a suction sensor 15, a negative electrode side discharge terminal 41b, etc. are mounted on a secondary surface layer 71b of the secondary surface 7b (hereinafter simply referred to as the secondary surface 7b).

[0137] More specifically, the MCU mount board side connector Cn2 is mounted approximately at the center of the secondary surface 7b. Explaining in detail the mounting position of the MCU mount board side connector Cn2, reference symbol O1 in Fig. 10 indicates the center of the MCU mount board 7 when viewed from a direction perpendicular to the MCU mount board 7. Here, the center O1 of the MCU mount board 7 is a point on the center line of the MCU mount board 7 that coincides with the center line L of the case 11 and is the center of the MCU mount board 7 in the longitudinal direction X.

[0138] 10 indicates the center of the MCU mounting board side connector Cn2 when viewed from a direction perpendicular to the MCU mounting board 7. Here, the MCU mounting board side connector Cn2 has a substantially rectangular shape with two sides parallel to the longitudinal direction X and the other two sides parallel to the lateral direction Y in a plan view of the MCU mounting board 7. For this reason, the center O2 of the MCU mounting board side connector Cn2 is the center of the MCU mounting board side connector Cn2 in the longitudinal direction X and the center of the MCU mounting board side connector Cn2 in the lateral direction Y.

[0139] In this embodiment, the MCU board side connector Cn2 is mounted on the secondary surface 7b of the MCU board 7 so that the shortest distance d1 between the edge of the MCU board 7 closest to the MCU board side connector Cn2 and the center O2 of the MCU board side connector Cn2 is longer than the shortest distance d2 between the center O1 of the MCU board 7 and the center O2 of the MCU board side connector Cn2.

[0140] In this way, by mounting the MCU mounting board side connector Cn2 on the MCU mounting board 7 so that the shortest distance d1 between the edge of the MCU mounting board 7 closest to the MCU mounting board side connector Cn2 and the MCU mounting board side connector Cn2 is longer than the shortest distance d2 between the centre of the MCU mounting board 7 and the MCU mounting board side connector Cn2, the MCU mounting board side connector Cn2 can be mounted approximately in the centre of the MCU mounting board 7 (here, the secondary surface 7b).

[0141] By mounting the MCU mounting board side connector Cn2 substantially at the center of the MCU mounting board 7, it is possible to shorten the wiring distance between the MCU mounting board side connector Cn2 and other electronic components mounted on the MCU mounting board 7, compared to the case where the MCU mounting board side connector Cn2 is mounted on the end of the MCU mounting board 7. This is because it is easier to mount many electronic components around and in the vicinity of the MCU mounting board side connector Cn2. This makes it possible to shorten the conductive pattern formed on the MCU mounting board 7 as the wiring for connecting the MCU mounting board side connector Cn2 and other electronic components mounted on the MCU mounting board 7. Therefore, it is possible to reduce the unnecessary conductive pattern and to miniaturize the MCU mounting board 7. In addition, it is possible to reduce the cost of manufacturing the MCU mounting board 7.

[0142] Further, a board connection cable Cb1 extending from a receptacle mounting board 8 on which the charging terminal 42 and the like are mounted is connected to the MCU mounting board side connector Cn2. More specifically, in this embodiment, the MCU mounting board side connector Cn2 is mounted on the MCU mounting board 7 with the MCU mounting board side connector Cn2 facing in the Y1 direction, and the board connection cable Cb1 is connected to the MCU mounting board side connector Cn2 from the Y1 direction side.

[0143] In this way, by connecting the board connecting cable Cb1 to the MCU board side connector Cn2 from the short side direction Y of the MCU mounting board 7, it is possible to prevent physical interference between the board connecting cable Cb1 and other electronic components mounted on the MCU mounting board 7, even if the MCU mounting board side connector Cn2 is mounted approximately in the center of the MCU mounting board 7. This makes it possible to improve the durability of the other electronic components mounted on the MCU mounting board 7 and to increase the degree of freedom in the layout of the electronic components on the MCU mounting board 7.

[0144] On the other hand, if the MCU board side connector Cn2 were mounted approximately in the center of the MCU board 7 and the board connecting cable Cb1 were to be connected to the MCU board side connector Cn2 from the longitudinal direction X of the MCU board 7, restrictions such as the inability to use tall electronic components for electronic components aligned in a row with the MCU board side connector Cn2 in the longitudinal direction X would arise, in order to avoid physical interference with the board connecting cable Cb1.

[0145] In this embodiment, the MCU mounting board side connector Cn2 is mounted on the MCU mounting board 7 facing in the Y1 direction, and the board connection cable Cb1 is connected to the MCU mounting board side connector Cn2 from the Y1 direction side, but this is not limited to the above. The MCU mounting board side connector Cn2 may be mounted on the MCU mounting board 7 facing in the Y2 direction, and the board connection cable Cb1 may be connected to the MCU mounting board side connector Cn2 from the Y2 direction side.

[0146] Furthermore, the charging IC 55 is mounted on the secondary surface 7b on the X2 side of the MCU-board-side connector Cn2. This allows the charging IC 55 to be disposed in a position close to the battery connector Cn3 mounted on the end of the primary surface 7a in the X2 direction. As described above, it is possible to make at least a portion of the battery connector Cn3 overlap with the charging IC 55 in the direction perpendicular to the primary surface 7a of the MCU-board 7.

[0147] Furthermore, on the sub-surface 7b, between the charging IC 55 and the MCU-board side connector Cn2 in the longitudinal direction X, a reactor Rc1 is mounted closer to the Y1 direction in the lateral direction Y, and a protection IC 61 is mounted closer to the Y2 direction.

[0148] Also, on the secondary surface 7b, a suction sensor 15 is mounted on the X1 direction side of the MCU mounted board side connector Cn2. As a result, in the power supply unit 10, the receptacle mounted board 8 (see FIG. 7) arranged on the X2 direction side of the MCU mounted board 7, the MCU mounted board side connector Cn2, and the suction sensor 15 are arranged in this order from the X2 direction toward the X1 direction. In other words, the suction sensor 15 is not arranged between the receptacle mounted board 8 arranged on the X2 direction side of the MCU mounted board 7 and the MCU mounted board side connector Cn2 in the longitudinal direction X.

[0149] Here, the suction sensor 15 is an electronic component whose height from the secondary surface 7b (secondary surface surface layer 71b) is higher than the MCU-mounted-board-side connector Cn2. This is because the suction sensor 15 is likely to be large in size due to its structure of detecting suction by vibration of a diaphragm provided inside. If such a suction sensor 15 is arranged on the X2 direction side of the MCU-mounted-board-side connector Cn2 on the MCU-mounted board 7 (i.e., between the receptacle-mounted board 8 and the MCU-mounted-board-side connector Cn2), the suction sensor 15 is likely to physically interfere with the board connection cable Cb1 connected to the MCU-mounted-board-side connector Cn2. In order to avoid this interference, it may be necessary to give the board connection cable Cb1 a complex shape.

[0150] Therefore, in this embodiment, the suction sensor 15 is disposed on the X1 direction side of the MCU-board-side connector Cn2 on the MCU-board 7 (i.e., the opposite side to the receptacle-mounted board 8). This makes it possible to easily avoid physical interference between the board connecting cable Cb1 and the suction sensor 15 without making the board connecting cable Cb1 have a complex shape. This makes it possible to suppress an increase in the manufacturing cost of the power supply unit 10 caused by the board connecting cable Cb1 having a complex shape.

[0151] In this embodiment, the reactor Rc2 and the operation switch OPS are electronic components that are taller than the MCU-board-side connector Cn2 (i.e., electronic components that are taller from the mounting surface of the MCU-board 7) like the suction sensor 15. Therefore, in this embodiment, as described above, the reactor Rc2 and the operation switch OPS are mounted on the main surface 7a, which makes it difficult for these electronic components to physically interfere with the board connecting cable Cb1 without making the board connecting cable Cb1 have a complex shape.

[0152] In addition, in this embodiment, as described above, the battery connector Cn3 is mounted on the main surface 7a, and the MCU-mounted-board-side connector Cn2 is mounted on the sub-surface 7b, and these connectors are mounted on different surfaces of the MCU-mounted board 7. The battery connector Cn3 and the MCU-mounted-board-side connector Cn2 are large in physical size and tend to occupy a large area on the MCU-mounted board 7. Therefore, by mounting the battery connector Cn3 and the MCU-mounted-board-side connector Cn2 on different surfaces of the MCU-mounted board 7, it becomes possible to mount the battery connector Cn3 and the MCU-mounted-board-side connector Cn2 by effectively utilizing both the main surface 7a and the sub-surface 7b. This makes it possible to mount the battery connector Cn3 and the MCU-mounted-board-side connector Cn2 on the MCU-mounted board 7 while preventing the MCU-mounted board 7 from becoming large.

[0153] 10, the dashed line indicated by the reference numeral 50 indicates the mounting position of the MCU 50 mounted on the main surface 7a, which is the reverse side of the sub-surface 7b. That is, the MCU mount board side connector Cn2 and the MCU 50 are mounted on different surfaces of the MCU mount board 7 such that at least a part of the MCU mount board side connector Cn2 overlaps with the MCU 50 in a direction perpendicular to the main surface 7a of the MCU mount board 7.

[0154] Generally, there is a tendency for conductive patterns, vias, etc. to be provided less in the location on the MCU mounting board 7 where a connector such as the MCU mounting board side connector Cn2 is mounted than in other locations. For this reason, it is easy to provide conductive patterns, vias, etc. required for other electronic components on the back side of the location on the MCU mounting board 7 where a connector such as the MCU mounting board side connector Cn2 is mounted. Therefore, by mounting an IC that uses a lot of conductive patterns and vias, such as MCU 50, at a position that overlaps with the MCU mounting board side connector Cn2 in a direction perpendicular to the MCU mounting board 7, the board area of ​​the MCU mounting board 7 can be effectively utilized, and the MCU mounting board 7 can be made smaller.

[0155] In this embodiment, the electronic component that overlaps with the MCU-mounted-board-side connector Cn2 in the direction perpendicular to the MCU-mounted board 7 is the MCU 50, but the electronic component is not limited to this and may be any electronic component. However, as described above, from the viewpoint of effectively utilizing the board area of ​​the MCU-mounted board 7, it is preferable that the electronic component be an IC that makes extensive use of conductive patterns, vias, etc.

[0156] 10, the dashed line indicated by the symbol Cn3 indicates the mounting position of the battery connector Cn3 mounted on the main surface 7a, which is the reverse side of the sub-surface 7b. That is, the battery connector Cn3 is mounted on the X2 direction side of the MCU mounting board side connector Cn2. Therefore, in the power supply unit 10, the receptacle mounting board 8, the battery pack BP including the power supply BAT, the battery connector Cn3, and the MCU mounting board side connector Cn2 are arranged in this order from the X2 direction side toward the X1 direction side (that is, in the longitudinal direction X). As a result, the battery connector Cn3 is arranged in a position close to the power supply BAT, and the battery connection cable Cb2 can be configured to be short, thereby making it possible to miniaturize the power supply unit 10. In addition, it is possible to reduce the cost of manufacturing the power supply unit 10, and further, it is possible to reduce the influence of noise caused by the current flowing through the battery connection cable Cb2 on the electronic components of the power supply unit 10, thereby stabilizing the operation of the power supply unit 10.

[0157] Further, a negative electrode side discharge terminal 41b is mounted on a protruding portion 82 which is an end portion in the X1 direction of the secondary surface 7b. A heater 21 provided in the first cartridge 20 is connected to the negative electrode side discharge terminal 41b. The end portion in the X1 direction where the negative electrode side discharge terminal 41b is mounted is located close to the first cartridge 20. By arranging the negative electrode side discharge terminal 41b in a position close to the first cartridge 20 in this manner, it is possible to easily and efficiently connect the negative electrode side discharge terminal 41b and the heater 21.

[0158] The negative discharge terminal 41b is disposed on the Y1 direction side of the protruding portion 82 with the center line L interposed therebetween. In this manner, the positive discharge terminal 41a is mounted on the main surface 7a of the MCU mounting board 7, and the negative discharge terminal 41b is mounted on the sub-surface 7b. Here, the positive discharge terminal 41a and the negative discharge terminal 41b have probes. As shown in FIG. 12, when viewed from the extending direction (X direction) of the center line L of the case 11, an imaginary line P connecting the center Pa of the probe of the positive discharge terminal 41a and the center Pb of the probe of the negative discharge terminal 41b is disposed so as to pass through the center line L, and further, the center Pa of the probe of the positive discharge terminal 41a and the center Pb of the probe of the negative discharge terminal 41b are disposed on a circle Q passing through the center line L.

[0159] 13, the MCU mounting board 7 includes a first wiring layer 72a, a main surface insulating layer 73a, and a second wiring layer 74a in this order from the base layer 70 toward the main surface layer 71a, and a third wiring layer 72b, a sub-surface insulating layer 73b, and a fourth wiring layer 74b in this order from the base layer 70 toward the sub-surface surface layer 71b. The MCU mounting board 7 is not limited to this, and various configurations can be adopted. For example, a plurality of the second wiring layers 74a and / or the fourth wiring layers 74b may be provided, or only one of the first wiring layer 72a and the third wiring layer may be provided.

[0160] (Conductive pattern on MCU board) The second wiring layer 74a and the fourth wiring layer 74b are provided with a conductive pattern made of copper foil or the like. The first wiring layer 72a and the third wiring layer 72b may also be provided with a conductive pattern made of copper foil or the like, similar to the second wiring layer 74a and the fourth wiring layer 74b. In the following description, the conductive pattern constituting the power supply line and the signal line of the MCU mounting board 7 is referred to as a wiring pattern 77, and the conductive pattern constituting the ground line is referred to as a ground pattern 78. Furthermore, in this specification, among the wiring patterns 77, the one constituting the VBUS line Ln1 may be referred to as wiring pattern 77_Ln1, the one constituting the VBAT line Ln2 as wiring pattern 77_Ln2, the one constituting the D+ line Ln3a as wiring pattern 77_Ln3a, the one constituting the D- line Ln3b as wiring pattern 77_Ln3b, the one constituting the power path line Ln4 as wiring pattern 77_Ln4, the one constituting the VSYS line Ln5 as wiring pattern 77_Ln5, and the one constituting the VHEAT line Ln6 as wiring pattern 77_Ln6.

[0161] As shown in Figures 9 and 11, the ground pattern 78 is provided so as to surround the wiring pattern 77. Note that Figure 9 is a diagram showing the second wiring layer 74a of the MCU mounting board 7, and Figure 11 is a diagram showing the fourth wiring layer 74b of the MCU mounting board 7. In Figures 9 and 11, the parts shown with diagonal hatching are the wiring patterns 77, and the parts shown with dotted hatching are the ground patterns 78. It should be noted that Figures 9 and 11 show only some of the wiring patterns 77 provided on the MCU mounting board 7.

[0162] In Fig. 11, the dashed line indicated by reference numeral 55 represents the charging IC 55 mounted on the secondary surface 7b (on the secondary surface layer 71b). The charging IC 55 is mounted on the MCU mounting board 7 such that the BAT_1 pin and the BAT_2 pin are located at the location indicated by reference numeral P1 in Fig. 11 of the wiring pattern 77_Ln2 that constitutes the VBAT line Ln2, and the BAT_SNS pin is located at the location indicated by reference numeral P2 in Fig. 11. Here, the location indicated by reference numeral P2 is closer to the end of the MCU mounting board 7 in the X2 direction than the location indicated by reference numeral P1.

[0163] That is, the BAT_SNS pin, which serves as a detection terminal for detecting the output voltage of the power supply BAT, is disposed closer to the end of the MCU mounting board 7 in the X2 direction than the BAT_1 pin and the BAT_2 pin, which are input / output terminals used for power transfer between the charging IC 55 and the power supply BAT. This allows the BAT_SNS pin to be disposed at a position closer to the power supply BAT, and the wiring distance between the power supply BAT and the BAT_SNS pin can be shortened. This reduces the influence of the conductor resistance, etc., contained in the input to the BAT_SNS pin, and enables the charging IC 55 to accurately detect the output voltage of the power supply BAT based on the input to the BAT_SNS pin. If the charging IC 55 can accurately detect the output voltage of the power supply BAT, the accuracy and speed of charging the power supply BAT by the charging IC 55 are improved.

[0164] 11, the dashed line indicated by the symbol Cn2 represents the MCU mounting board side connector Cn2 mounted on the sub-surface 7b (on the sub-surface layer 71b). As shown in FIG. 11, the wiring pattern 77 is formed on the sub-surface 7b of the MCU mounting board 7 at a location overlapping the MCU mounting board side connector Cn2. That is, as described above, there is a tendency that the conductive patterns and vias provided are fewer at the location where the connector such as the MCU mounting board side connector Cn2 is mounted than at other locations. Therefore, by forming the wiring pattern 77 that connects other electronic components mounted on the MCU mounting board 7 at the location overlapping the MCU mounting board side connector Cn2 on the MCU mounting board 7, the board area of ​​the MCU mounting board 7 can be effectively utilized to reduce the size of the MCU mounting board 7. Note that the type of electronic component to be connected to the wiring pattern 77 formed at the location overlapping the MCU mounting board side connector Cn2 is not particularly limited.

[0165] Further, referring to FIG. 13, an example of a via provided on the MCU mounting board 7 will be described. In FIG. 13, the via V1 is made of a conductor penetrating from the second wiring layer 74a to the fourth wiring layer 74b, and the conductive patterns formed on the first wiring layer 72a, the second wiring layer 74a, the third wiring layer 72b, and the fourth wiring layer 74b, which are electrically connected to the via V1, are set to the same potential. For example, a predetermined wiring pattern 77 formed on the second wiring layer 74a and a predetermined wiring pattern 77 formed on the fourth wiring layer 74b are electrically connected to each other through the via V1. Similarly, in FIG. 13, the via V2 is made of a conductor penetrating from the second wiring layer 74a to the first wiring layer 72a, and the conductive patterns formed on the first wiring layer 72a and the second wiring layer 74a, which are electrically connected to the via V2, are set to the same potential. The via V3 is made of a conductor penetrating from the third wiring layer 72b to the fourth wiring layer 74b, and the conductive patterns formed on the third wiring layer 72b and the fourth wiring layer 74b that are electrically connected to the via V3 are set to the same potential. For example, the ground pattern 78 formed on the second wiring layer 74a and a part of the conductive patterns formed on the first wiring layer 72a are electrically connected to each other through the via V2, and the ground pattern 78 formed on the fourth wiring layer 74b and a part of the conductive patterns formed on the third wiring layer 72b are electrically connected to each other through the via V3. The via V4 is made of a conductor penetrating from the first wiring layer 72a to the third wiring layer 72b, and the conductive patterns formed on the first wiring layer 72a and the third wiring layer 72b that are electrically connected to the via V4 are set to the same potential. For example, a part of the conductive patterns formed on the first wiring layer 72a and a part of the conductive patterns formed on the third wiring layer 72b are electrically connected to each other through the via V4. As a result, some of the conductive patterns of the first wiring layer 72a and some of the conductive patterns of the third wiring layer 72b, and the ground pattern 78 of the second wiring layer 74a and the ground pattern 78 of the fourth wiring layer 74b connected thereto, can be made into ground lines having a common reference potential.

[0166] Furthermore, the wiring pattern 77 of the second wiring layer 74a and the wiring pattern 77 of the fourth wiring layer 74b can be electrically connected to each other through the via V1, which allows electrical connection between the electronic components mounted on the main surface 7a (the main surface-side surface layer 71a) and the electronic components mounted on the sub-surface 7b (on the sub-surface-side surface layer 71b).

[0167] The main surface side surface layer 71a and the sub-surface side surface layer 71b are made of, for example, a resist film, cover the second wiring layer 74a and the fourth wiring layer 74b, and protect the wiring patterns 77 from short-circuiting and the wiring patterns 77 from short-circuiting with the ground pattern 78. The base layer 70, the main surface side insulating layer 73a, and the sub-surface side insulating layer 73b are made of an insulator containing, for example, glass or epoxy resin, and bond the upper and lower layers while preventing short-circuiting.

[0168] (Conductive pattern that constitutes the VHEAT line Ln6) Next, a supplementary explanation will be given of the wiring pattern 77_Ln6, which is a conductive pattern constituting the VHEAT line Ln6, and the electronic components connected to the wiring pattern 77_Ln6, with reference to Figs. 14 to 16. Fig. 14 is an enlarged view of the periphery of the end portion on the X1 direction side of the second wiring layer 74a of the MCU mounting substrate 7 shown in Fig. 9. Fig. 15 is an enlarged view of the wiring pattern 77_Ln6a (described later) shown in Fig. 14, and Fig. 16 is an enlarged view of the wiring pattern 77_Ln6b (described later) shown in Fig. 14.

[0169] In Fig. 14, each dashed line with a reference symbol represents an electronic component corresponding to the reference symbol among the electronic components mounted on the main surface 7a (main-surface-side surface layer 71a). Specifically, in Fig. 14, the dashed line indicated by reference symbol 63 represents a DC / DC converter 63, the dashed line indicated by reference symbol Cd61 represents a capacitor Cd61, the dashed line indicated by reference symbol Cd62 represents a capacitor Cd62, the dashed line indicated by reference symbol Cd63 represents a capacitor Cd63, the dashed line indicated by reference symbol Sw4 represents a switch Sw4, the dashed line indicated by reference symbol Cd7 represents a capacitor Cd7, the dashed line indicated by reference symbol VR4 represents a varistor VR4, and the dashed line indicated by reference symbol 41a represents a positive-side discharge terminal 41a.

[0170] As shown in Fig. 14, the wiring pattern 77_Ln6 includes a wiring pattern 77_Ln6a to which the DC / DC converter 63, the capacitor Cd61, the capacitor Cd62, the capacitor Cd63, etc. are connected, and a wiring pattern 77_Ln6b to which the capacitor Cd7, the varistor VR4, the positive electrode side discharge terminal 41a, etc. are connected. For example, the wiring pattern 77_Ln6a is a conductive pattern that constitutes a portion of the VHEAT line Ln6 shown in Fig. 6 from the VOUT pin of the DC / DC converter 63 to the switch Sw4. The wiring pattern 77_Ln6b is a conductive pattern that constitutes a portion of the VHEAT line Ln6 shown in Fig. 6 from the switch Sw4 to the positive electrode side discharge terminal 41a.

[0171] First, the wiring pattern 77_Ln6a to which the DC / DC converter 63, the capacitor Cd61, the capacitor Cd62, and the capacitor Cd63 are connected will be described. As shown in Fig. 15, the wiring pattern 77_Ln6a includes a trapezoidal portion 771 having a trapezoidal shape in a plan view of the MCU mounting board 7. The trapezoidal portion 771 has an upper base 771a, a lower base 771b that is longer than the upper base 771a, a first leg 771c, and a second leg 771d that forms an angle with the lower base 771b smaller than that of the first leg 771c.

[0172] The VOUT pin of the DC / DC converter 63, one end (in other words, one terminal) of the capacitor Cd61, and one end (in other words, one terminal) of the capacitor Cd62 are each connected to a predetermined location on the lower base 771b side of the wiring pattern 77_Ln6a. The GND pin of the DC / DC converter 63, the other end (in other words, the other terminal) of the capacitor Cd61, and the other end (in other words, the other terminal) of the capacitor Cd62 are each connected to a ground pattern 78. One end (in other words, one terminal) of the capacitor Cd63 is connected to a location on the wiring pattern 77_Ln6a corresponding to the first leg 771c of the trapezoidal portion 771, and the other end (in other words, the other terminal) of the capacitor Cd63 is connected to the ground pattern 78.

[0173] 15, the wiring pattern 77_Ln6a has a substantially rectangular shape in a plan view of the MCU mounting substrate 7, and further includes a rectangular portion 772 connected to the lower base 771b and a connection point p between the lower base 771b and the second leg 771d. The VOUT pin of the DC / DC converter 63, one end of the capacitor Cd61, and one end of the capacitor Cd62 are connected to positions corresponding to the rectangular portion 772. The capacitor Cd62 is disposed so as not to overlap the second leg 771d in a plan view of the MCU mounting substrate 7.

[0174] Therefore, a current can flow from DC / DC converter 63 to capacitor Cd62, for example, as shown by the arrow with symbol Ia in Fig. 15. And a current can flow from capacitor Cd62 to capacitor Cd63, for example, as shown by the arrow with symbol Ib in Fig. 15. Therefore, even if DC / DC converter 63, capacitor Cd61, capacitor Cd62, and capacitor Cd63 are arranged in a substantially L-shape, a current can efficiently flow from DC / DC converter 63 to capacitor Cd63.

[0175] On the other hand, for example, suppose that the portion surrounded by the dashed line in FIG. 15 is cut out and the conductive pattern connecting the DC / DC converter 63, the capacitor Cd61, the capacitor Cd62, and the capacitor Cd63 is formed into a substantially L-shape according to the arrangement of these. In this case, between the capacitors Cd62 and Cd63, the current cannot flow through the shortest path as indicated by the arrow of the symbol Ib, or even if the current can flow through the shortest path, the path portion cannot be sufficiently thick. As a result, the electrical resistance value of the (apparent) conductive pattern connecting the DC / DC converter 63 to the capacitor Cd63 increases, and it may become impossible to efficiently flow the current from the DC / DC converter 63 to the capacitor Cd63. In addition, since the current flows to bend at a right angle through the substantially L-shaped conductive pattern, noise may be generated.

[0176] In contrast, in this embodiment, as described above, the wiring pattern 77_Ln6a is configured to include a trapezoidal portion 771 and a rectangular portion 772 connected to its lower base 771b, and the DC / DC converter 63, capacitor Cd61, and capacitor Cd62 are respectively connected to the rectangular portion 772, and capacitor Cd63 is connected to the trapezoidal portion 771. This makes it possible to avoid an increase in the (apparent) electrical resistance value of the conductive pattern connecting the DC / DC converter 63 to the capacitor Cd63, and enables current to flow efficiently from the DC / DC converter 63 to the capacitor Cd63.

[0177] In addition, in Fig. 14, each circle drawn with a dashed line represents a via. For example, in Fig. 14, the via in the region surrounded by the dashed line and indicated by the symbol Cd62 is a via that connects the other end of the above-mentioned capacitor Cd62 to ground (for example, the ground pattern 78 formed on the first wiring layer 72a). On the other hand, the via in the region surrounded by the dashed line and indicated by the symbol Cd63 is a via that connects the other end of the above-mentioned capacitor Cd63 to ground (for example, the ground pattern 78 formed on the first wiring layer 72a).

[0178] 14, for example, the number of vias connecting the other end of the capacitor Cd63 to ground (e.g., 6) is smaller than the number of vias connecting the other end of the capacitor Cd62 to ground (e.g., 13). In other words, the number of vias connecting the other end of the capacitor Cd62 to ground is greater than the number of vias connecting the other end of the capacitor Cd63 to ground.

[0179] Generally, the more the number of vias connected to the ground, the more the smoothing effect of the capacitor is improved (stabilized). Therefore, by connecting the other end of the capacitor Cd62 to the ground using a large number of vias, the capacitor Cd62 can more effectively smooth the output voltage (fourth system voltage Vs4) of the DC / DC converter 63. Therefore, it is possible to supply a more stable voltage to the heater 21 that generates the aerosol, and the generation of the aerosol by the heater 21 can be stabilized. This makes it possible to suppress deterioration of the flavor and aroma of the aerosol inhaler 1 due to unstable generation of the aerosol.

[0180] 14, the capacitor Cd63 is mounted on the MCU mounting board 7 so as to be closer to the switch Sw4 than the capacitor Cd62. In other words, the capacitor Cd62, which is connected to ground using a larger number of vias than the capacitor Cd63, is mounted on the MCU mounting board 7 so as to be farther from the switch Sw4 than the capacitor Cd63.

[0181] That is, the capacitor Cd62, which is connected to the ground using a larger number of vias than the capacitor Cd63, tends to generate heat because it smoothes the output voltage of the DC / DC converter 63 more actively than the capacitor Cd63. Therefore, by arranging the capacitor Cd62 farther from the switch Sw4 than the capacitor Cd63, the heat generated by the capacitor Cd62 is less likely to be transmitted to the switch Sw4, and the operation of the switch Sw4 can be stabilized. In addition, by making it difficult for the heat generated by the capacitor Cd62 to be transmitted to the switch Sw4, the temperature rise of the switch Sw4 can be suppressed, and the increase in the on-resistance of the switch Sw4 can be suppressed. This increases the efficiency of the power supply to the heater 21 that generates the aerosol, and enables the heater 21 to generate aerosol with high efficiency.

[0182] It should be noted that FIG. 14 shows only a portion of the vias provided in the MCU mounting board 7.

[0183] Next, the wiring pattern 77_Ln6b to which the capacitor Cd7, the varistor VR4, and the positive electrode side discharge terminal 41a are connected will be described. As shown in FIG. 16, the wiring pattern 77_Ln6b includes a first conductive pattern 77A and a second conductive pattern 77B.

[0184] 14, the first conductive pattern 77A is formed to extend along the short-side direction Y from the position where the switch Sw4 is mounted to the position where the positive discharge terminal 41a is mounted, and is configured to be able to supply the above-mentioned fourth system voltage Vs4 to the positive discharge terminal 41a. Considering that the fourth system voltage Vs4 is generated based on the output voltage of the power source BAT, the first conductive pattern 77A can be said to be (at least a part of) a conductive pattern that connects the power source BAT and the positive discharge terminal 41a. The switch Sw4, the varistor VR4, the positive discharge terminal 41a, and the like are connected to the first conductive pattern 77A as electronic components.

[0185] The second conductive pattern 77B is provided branching off from the first conductive pattern 77A. In this embodiment, the second conductive pattern 77B is formed so as to branch off from a portion of the first conductive pattern 77A connected to the positive electrode side discharge terminal 41a and extend along the longitudinal direction X on the opposite side (X2 direction side) from the positive electrode side discharge terminal 41a. Only a capacitor Cd7, for example, is connected as an electronic component to the second conductive pattern 77B.

[0186] The capacitor Cd7 can function as a protective component that protects the electronic components of the MCU mounting board 7 from noise (for example, static electricity generated at the positive electrode discharge terminal 41a; hereinafter, also referred to as external noise) that enters the power supply unit 10 via the positive electrode discharge terminal 41a. Specifically, the capacitor Cd7 is mounted on the MCU mounting board 7 so that one end (in other words, one terminal) is connected to the second conductive pattern 77B, and the other end (in other words, the other terminal) is connected to the ground pattern 78 (i.e., ground).

[0187] In this manner, in this embodiment, the second conductive pattern 77B branching off from the first conductive pattern 77A connecting the power supply BAT and the positive electrode side discharge terminal 41a is provided, and one end of the capacitor Cd7 serving as a protective component for protecting the electronic components of the MCU mounted board 7 from external noise is connected to this second conductive pattern 77B. This allows at least a portion of the external noise to escape from the first conductive pattern 77A to the second conductive pattern 77B, thereby reducing the external noise flowing through the first conductive pattern 77A and making it possible to protect the electronic components connected to the first conductive pattern 77A from the external noise.

[0188] Moreover, two or more electronic components including the switch Sw4 and the positive electrode discharge terminal 41a (for example, three components: the switch Sw4, the varistor VR4, and the positive electrode discharge terminal 41a) are connected to the first conductive pattern 77A, whereas only the capacitor Cd7 is connected as an electronic component to the second conductive pattern 77B. In other words, the number of electronic components connected to the second conductive pattern 77B is smaller than the number of electronic components connected to the first conductive pattern 77A. This makes it possible to reduce the number of electronic components that are affected by external noise, compared to the case where a large number of electronic components are connected to the second conductive pattern 77B.

[0189] In addition, the second conductive pattern 77B is provided so as to branch off from a portion of the first conductive pattern 77A that is connected to the positive electrode side discharge terminal 41a. This makes it difficult for external noise to flow toward the first conductive pattern 77A, thereby reducing the external noise that flows through the first conductive pattern 77A and making it possible to protect electronic components connected to the first conductive pattern 77A from the external noise.

[0190] Also, at the location where the second conductive pattern 77B branches off from the first conductive pattern 77A (hereinafter, also simply referred to as the branching location), as shown in FIG. 16, a chamfered portion 77C is provided so that the branching location does not have an angle of 90° or less (i.e., does not become an acute angle). If a right-angled or acute-angled portion is provided at the branching location, noise may occur when current flows through that corner portion. That is, in such a case, due to the interaction between the conductive pattern having a right-angled or acute-angled portion and the external noise flowing through the conductive pattern, noise different from the external noise may further occur. Therefore, in the present embodiment, by making the branching location not have an angle of 90° or less, the occurrence of noise different from the external noise is suppressed when the external noise flows into the second conductive pattern 77B. Note that instead of the chamfered portion 77C, for example, the branching location may be formed in an arc shape so that the branching location does not have an angle of 90° or less.

[0191] Also, the second conductive pattern 77B is a conductive pattern thinner than the first conductive pattern 77A. In the present embodiment, as shown in FIG. 16, the dimension of the thinnest portion in the first conductive pattern 77A is w1, and the dimension of the thinnest portion in the second conductive pattern 77B is w2 (where w2 < w1). By making the second conductive pattern 77B thinner than the first conductive pattern 77A in this way, the area on the MCU mounting substrate 7 occupied by the second conductive pattern 77B can be reduced compared to the case where the thickness is equal to or greater than that of the first conductive pattern 77A. This makes it possible to thicken the first conductive pattern 77A while avoiding an increase in the size of the MCU mounting substrate 7. And if the first conductive pattern 77A is thickened, even if a large current is passed through the first conductive pattern 77A to ensure the amount of aerosol generated by the heater 21, it is possible to reduce the heat and noise generated in the first conductive pattern 77A due to this large current.

[0192] Moreover, the capacitor Cd7 has a rectangular shape consisting of long sides and short sides in a plan view of the MCU mounting board 7. The capacitor Cd7 is mounted on the MCU mounting board 7 so that its long sides are parallel to the longitudinal direction X. That is, the length direction of the capacitor Cd7 coincides with the longitudinal direction X, which is the extension direction of the case 11 (i.e., the power supply unit 10, and thus the aerosol inhalator 1). By mounting the capacitor Cd7 so that its length direction coincides with the longitudinal direction X in this way, it is possible to mount the capacitor Cd7 while avoiding an increase in the width dimensions of the MCU mounting board 7, the power supply unit 10, and the aerosol inhalator 1, compared to a case in which the length direction of the capacitor Cd7 coincides with the transverse direction Y.

[0193] Moreover, the second conductive pattern 77B is formed so as to extend in the X2 direction, i.e., in a direction away from the positive electrode side discharge terminal 41a. That is, the positive electrode side discharge terminal 41a itself is an electronic component that is not physically small, and generally, a large number of components (e.g., insulating components) tend to be provided around the positive electrode side discharge terminal 41a. For this reason, it may be difficult to mount the capacitor Cd7 near the positive electrode side discharge terminal 41a. Therefore, by forming the second conductive pattern 77B so as to extend in the X2 direction, i.e., in a direction away from the positive electrode side discharge terminal 41a, it is possible to mount the capacitor Cd7 at a position away from the positive electrode side discharge terminal 41a, and the mounting of the capacitor Cd7 can be facilitated.

[0194] Then, as shown in FIG. 14, by connecting the capacitor Cd7 to the end of the second conductive pattern 77B on the X2 direction side, it is possible to mount the capacitor Cd7 at a position farther away from the positive electrode discharge terminal 41a, making it easier to mount the capacitor Cd7.

[0195] 14, a varistor VR4 is connected to the first conductive pattern 77A as a protective component that protects electronic components of the MCU mounting board 7 from external noise. Specifically, the varistor VR4 is mounted on the MCU mounting board 7 so that one end (in other words, one terminal) is connected to the first conductive pattern 77A and the other end (in other words, the other terminal) is connected to the ground pattern 78 (i.e., ground). As a result, even if external noise flows through the first conductive pattern 77A, the varistor VR4 can dissipate this external noise to the ground, so that other electronic components connected to the first conductive pattern 77A can be protected from the external noise.

[0196] Moreover, the varistor VR4 has a rectangular shape consisting of long sides and short sides in a plan view of the MCU mounting board 7. The varistor VR4 is mounted on the MCU mounting board 7 so that its long sides are parallel to the longitudinal direction X. That is, the length direction of the varistor VR4 coincides with the longitudinal direction X, which is the extension direction of the case 11 (i.e., the power supply unit 10, and thus the aerosol inhalator 1). By mounting the varistor VR4 so that its length direction coincides with the longitudinal direction X in this way, it is possible to mount the varistor VR4 while avoiding an increase in the width dimensions of the MCU mounting board 7, the power supply unit 10, and the aerosol inhalator 1, compared to a case in which the length direction of the varistor VR4 coincides with the transverse direction Y.

[0197] The switch Sw4, the varistor VR4, and the positive discharge terminal 41a connected to the first conductive pattern 77A are arranged in a line on the first conductive pattern 77A. In this embodiment, the first conductive pattern 77A is formed to extend along the short-side direction Y from the location where the switch Sw4 is mounted to the location where the positive discharge terminal 41a is mounted. The switch Sw4, the varistor VR4, and the positive discharge terminal 41a are arranged on the first conductive pattern 77A in a line in the short-side direction Y (i.e., the extension direction of the first conductive pattern 77A), and each is connected to the first conductive pattern 77A. This allows the first conductive pattern 77A to have a simple shape. Therefore, it is possible to form the first conductive pattern 77A thicker than when the first conductive pattern 77A has a complicated shape to connect the switch Sw4, the varistor VR4, and the positive discharge terminal 41a. Furthermore, by forming the first conductive pattern 77A thick, it is possible to reduce heat and noise that are generated when a current flows through the first conductive pattern 77A.

[0198] Moreover, the varistor VR4 is disposed on the first conductive pattern 77A between the switch Sw4 and the positive electrode discharge terminal 41a. As a result, even if external noise flows through the first conductive pattern 77A, the varistor VR4 can protect the switch Sw4 from the external noise. This makes it possible to prevent the switch Sw4 from breaking down due to the external noise, and to prevent unintended energization of the heater 21 due to a failure of the switch Sw4.

[0199] 14, a via V10 is provided in the space between the first conductive pattern 77A and the second conductive pattern 77B (in other words, the space adjacent to the first conductive pattern 77A and the second conductive pattern 77B). The via V10 is a via connected to the ground, and more specifically, a via that connects the ground pattern 78 in the first wiring layer 72a (and / or the third wiring layer 72b) to the ground pattern 78 in the second wiring layer 74a.

[0200] That is, when external noise is passed to the ground by the capacitor Cd7 or the varistor VR4, the ground may generate heat. Therefore, in this embodiment, a via V10 connected to the ground (for example, the ground pattern 78 in the first wiring layer 72a) is provided between the first conductive pattern 77A and the second conductive pattern 77B, and the heat of the ground can be dissipated to the second wiring layer 74a close to the main surface 7a of the MCU mounting board 7 through the via V10. This makes it possible to effectively utilize the space between the first conductive pattern 77A and the second conductive pattern 77B to prevent the MCU mounting board 7 from becoming large, while suppressing heat accumulation in the MCU mounting board 7 and efficiently cooling the MCU mounting board 7.

[0201] As described above, according to the power supply unit 10 of the present embodiment, it is possible to prevent the MCU mounting board 7 from becoming large, and to reduce the size of the MCU mounting board 7. By reducing the size of the MCU mounting board 7, it is possible to reduce the size of the power supply unit 10 including the MCU mounting board 7, thereby improving the portability of the aerosol inhaler 1 and increasing the convenience for the user. Furthermore, by reducing the size of the MCU mounting board 7, it is possible to reduce the cost of manufacturing the MCU mounting board 7.

[0202] Although various embodiments of the present invention have been described above with reference to the drawings, it goes without saying that the present invention is not limited to the above examples. It is clear that a person skilled in the art can come up with various modified or altered examples within the scope of the claims, and it is understood that these also naturally belong to the technical scope of the present invention.

[0203] For example, in the above-described embodiment, the heating unit that consumes power supplied from the power source BAT to generate an aerosol from the aerosol source is the heater 21, and power is supplied to the heater 21 from the discharge terminal 41 of the power supply unit 10, but the present invention is not limited to this. For example, the heating unit that generates the aerosol can be configured by a susceptor built into the first cartridge 20 or the like, and an induction heating coil that transmits power to the susceptor by electromagnetic induction. When the heating unit is configured by a susceptor and an induction heating coil, the discharge terminal 41 of the power supply unit 10 is connected to the induction heating coil and supplies power to the induction heating coil.

[0204] This specification describes at least the following items. Note that, in parentheses, components corresponding to those in the above-mentioned embodiment are shown, but the present invention is not limited to these.

[0205] (1) Power supply (power supply BAT), a load (heater 21) that consumes the power supplied from the power source to generate an aerosol from an aerosol source, or a first connector (discharge terminal 41) to which a coil that transmits power to the load by electromagnetic induction is connected; A first circuit board (receptacle mounting board 8), A second circuit board (MCU mounting board 7), a first cable (board connecting cable Cb1) that connects the first circuit board and the second circuit board; a second connector (MCU mounted board side connector Cn2) mounted on the second circuit board and to which the first cable is connected; Equipped with a shortest distance between the edge of the second circuit board closest to the second connector and the second connector is longer than a shortest distance between the center of the second circuit board and the second connector; A power supply unit (power supply unit 10) of an aerosol generating device (aerosol inhaler 1).

[0206] According to (1), the second connector is mounted approximately in the center of the second circuit board. This makes it possible to shorten the wiring distance between the second connector and other electronic components mounted on the second circuit board, and shorten the conductive pattern formed on the second circuit board as the wiring for connecting them. Therefore, it is possible to reduce the unnecessary conductive pattern, prevent the second circuit board from becoming large, and reduce the size of the second circuit board.

[0207] (2) A power supply unit for the aerosol generating device according to (1), the first cable is connected to the second connector from a width direction (short side direction Y) of the second circuit board; Power supply unit for the aerosol generator.

[0208] According to (2), by connecting the first cable to the second connector from the width direction of the second circuit board, even if the second connector is mounted substantially in the center of the second circuit board, it is possible to reduce physical interference between the first cable and other electronic components mounted on the second circuit board, thereby improving the durability of the other electronic components mounted on the second circuit board and increasing the degree of freedom in the layout of the electronic components on the second circuit board.

[0209] (3) A power supply unit for the aerosol generating device according to (1) or (2), Further, the electronic component (suction sensor 15) is mounted on the second circuit board and has a height from the second circuit board higher than that of the second connector. The electronic component is not disposed between the first circuit board and the second connector in the longitudinal direction of the second circuit board. Power supply unit for the aerosol generator.

[0210] According to (3), it is possible to easily prevent physical interference between the first cable and electronic components that are taller than the second connector, without making the first cable have a complex shape, and therefore it is possible to suppress an increase in the manufacturing cost of the power supply unit due to the first connection cable having a complex shape.

[0211] (4) A power supply unit for the aerosol generating device according to (1) or (2), Further, the electronic component (suction sensor 15) is mounted on the second circuit board and has a height from the second circuit board higher than that of the second connector. The first circuit board, the second connector, and the electronic component are arranged in the following order in a longitudinal direction of the second circuit board: the first circuit board, the second connector, and the electronic component. Power supply unit for the aerosol generator.

[0212] According to (4), it is possible to easily prevent physical interference between the first cable and electronic components that are taller than the second connector, without making the first cable have a complex shape, and therefore it is possible to suppress an increase in the manufacturing cost of the power supply unit due to the first connection cable having a complex shape.

[0213] (5) A power supply unit for the aerosol generating device according to any one of (1) to (4), Further comprising a third connector (battery connector Cn3) mounted on the second circuit board and connected to the power source; the first circuit board, the power supply, the third connector, and the second connector are arranged in the following order in a longitudinal direction of the second circuit board: the first circuit board, the power supply, the third connector, and the second connector; Power supply unit for the aerosol generator.

[0214] According to (5), it is possible to arrange the third connector in a position close to the power supply. This makes it possible to shorten the wiring distance between the power supply and the third connector, thereby enabling the miniaturization of the power supply unit. At the same time, it is possible to reduce the cost of manufacturing the power supply unit. Furthermore, by shortening the wiring distance between the power supply and the third connector, even if the current value of the current flowing through the wiring between the power supply and the third connector, such as the charging current for charging the power supply or the discharging current from the power supply, becomes large, it is possible to reduce the effect of noise generated by this current on the electronic components of the power supply unit, and it is also possible to stabilize the operation of the power supply unit.

[0215] (6) A power supply unit for the aerosol generating device according to (5), The charging IC (charging IC55) has a detection terminal (BAT_SNS pin) for detecting the voltage of the power supply, and output terminals (BAT_1 pin, BAT_2 pin) for outputting power for charging the power supply, The third connector is mounted on one end of the second circuit board in a longitudinal direction (longitudinal direction X), The detection terminal is closer to the one end than the output terminal. Power supply unit for the aerosol generator.

[0216] According to (6), the detection terminal of the charging IC can be arranged close to the power source, and the wiring distance between the power source and the detection terminal can be shortened. This reduces the influence of the conductor resistance included in the input to the detection terminal, and enables the charging IC to accurately detect the voltage of the power source based on the input to the detection terminal.

[0217] (7) A power supply unit for the aerosol generating device according to (6), The second circuit board has a surface A (main surface 7a) and a surface B (secondary surface 7b) that is a reverse surface of the surface A, the third connector is mounted on the A surface, The charging IC is mounted on the B surface. Power supply unit for the aerosol generator.

[0218] According to (7), the third connector and the charging IC are physically large in size and tend to occupy a large area on the second circuit board. Therefore, by mounting the third connector and the charging IC on different sides of the second circuit board, it becomes possible to mount the third connector and the charging IC by effectively utilizing both sides A and B. This makes it possible to mount the third connector and the charging IC on the second circuit board while avoiding an increase in the size of the second circuit board.

[0219] (8) A power supply unit for the aerosol generating device according to (7), At least a portion of the third connector overlaps with the charging IC in a direction perpendicular to the A surface. Power supply unit for the aerosol generator.

[0220] According to (8), by making at least a portion of the third connector overlap with the charging IC in a direction perpendicular to the A surface, the wiring distance between the third connector and the charging IC can be shortened. This reduces excess wiring (e.g., conductive patterns formed on the second circuit board) and makes it possible to miniaturize the second circuit board. At the same time, it is possible to reduce the cost of manufacturing the second circuit board. Furthermore, if the wiring distance between the third connector and the charging IC is short, even if the current value of the current flowing through this wiring becomes large, it is possible to reduce the effect of noise generated by this current on other electronic components on the second circuit board, and it is possible to stabilize the operation of the power supply unit.

[0221] (9) A power supply unit for the aerosol generating device according to any one of (5) to (8), The second circuit board has a surface A (main surface 7a) and a surface B (secondary surface 7b) that is a reverse surface of the surface A, the third connector is mounted on the A surface, The second connector is mounted on the B surface. Power supply unit for the aerosol generator.

[0222] According to (9), the third connector and the second connector are physically large in size and tend to occupy a large area on the second circuit board. Therefore, by mounting the third connector and the second connector on different sides of the second circuit board, it becomes possible to mount the third connector and the second connector by effectively utilizing both sides A and B. This makes it possible to mount the third connector and the second connector on the second circuit board while avoiding an increase in the size of the second circuit board.

[0223] (10) A power supply unit for the aerosol generating device according to any one of (5) to (9), a second cable (battery connection cable Cb2) that connects the power supply and the third connector; an insulating spacer (wall portion 12a) provided between the power source and the second circuit board in the longitudinal direction of the second circuit board; Further equipped with The second cable is connected to the third connector from a width direction of the second circuit board. Power supply unit for the aerosol generator.

[0224] According to (10), by providing an insulating spacer between the second circuit board and the power supply, it is possible to prevent a short circuit caused by physical contact between the second circuit board and the power supply. And by connecting the second cable to the third connector from the width direction of the second circuit board, it is possible to prevent physical interference between the second cable and / or the spacer without making them have a complex shape.

[0225] (11) A power supply unit for the aerosol generating device according to any one of (1) to (10), the second circuit board includes a conductive pattern (wiring pattern 77) that connects electronic components different from the second connector, the conductive pattern is formed on a portion of the second circuit board that overlaps with the second connector; Power supply unit for the aerosol generator.

[0226] Generally, there is a tendency that the number of conductive patterns, vias, etc. provided in the second circuit board is smaller in the area where a connector such as the second connector is mounted than in other areas. According to (11), by forming a conductive pattern that connects other electronic components mounted on the second circuit board in the area of ​​the second circuit board that overlaps with the second connector, the board area of ​​the second circuit board can be effectively utilized, thereby making it possible to reduce the size of the second circuit board.

[0227] (12) A power supply unit for the aerosol generating device according to any one of (1) to (11), The second circuit board has a surface A (main surface 7a) and a surface B (secondary surface 7b) that is a reverse surface of the surface A, the second connector is mounted on the B surface; Further comprising an IC (MCU50) mounted on the A surface and overlapping the second connector in a direction perpendicular to the A surface. Power supply unit for the aerosol generator.

[0228] Generally, the second circuit board tends to have fewer conductive patterns, vias, etc. at the location where a connector such as the second connector is mounted compared to other locations. For this reason, it is easy to provide conductive patterns, vias, etc. required for other electronic components on the back side of the location where a connector such as the second connector is mounted on the second circuit board. According to (12), by mounting an IC that uses a lot of conductive patterns and vias at a position that overlaps with the second connector in a direction perpendicular to the A-side, the board area of ​​the second circuit board can be effectively utilized to reduce the size of the second circuit board.

[0229] (13) A power supply unit for the aerosol generating device according to (12), The IC is an MCU (MCU50). Power supply unit for the aerosol generator.

[0230] According to (13), by mounting an MCU that uses a large amount of conductive patterns and vias at a position that overlaps with the second connector in a direction perpendicular to the second circuit board, the board area of ​​the second circuit board can be effectively utilized, thereby making the second circuit board smaller. [Explanation of symbols]

[0231] 1. Aerosol aspirator (aerosol generating device) 7 MCU mounting board (second circuit board) 7a Main surface (A side) 7b Secondary side (B side) 8 Receptacle mounting board (first circuit board) 10 Power supply unit 15 Suction sensor (electronic component) 21 Heater (load) 41 Discharge terminal (first connector) 50 MCU(IC) 55 Charging IC BAT power supply Cb1 Board connection cable (first cable) Cb2 Battery connection cable (second cable) Cn2 MCU board side connector (second connector) Cn3 Battery connector (third connector) X Longitudinal direction (length direction) Y Short side direction (width direction)

Claims

1. Power supply, a first connector to which a load that consumes power supplied from the power source to generate an aerosol from an aerosol source or a coil that transmits power to the load by electromagnetic induction is connected; A first circuit board; A second circuit board; a first cable connecting the first circuit board and the second circuit board; a second connector mounted on the second circuit board and connected to the first cable; a third connector mounted on the second circuit board and connected to the power source; Equipped with a shortest distance between an edge of the second circuit board closest to the second connector and the second connector is longer than a shortest distance between a center of the second circuit board and the second connector; the first cable is connected to the second connector from a width direction of the second circuit board, the first circuit board, the power supply, the third connector, and the second connector are arranged in the following order in a longitudinal direction of the second circuit board: the first circuit board, the power supply, the third connector, and the second connector; Power supply unit for the aerosol generator.

2. A power supply unit for the aerosol generating device according to claim 1, an electronic component mounted on the second circuit board and having a height from the second circuit board greater than that of the second connector; The electronic component is not disposed between the first circuit board and the second connector in the longitudinal direction of the second circuit board. Power supply unit for the aerosol generator.

3. A power supply unit for the aerosol generating device according to claim 1, an electronic component mounted on the second circuit board and having a height from the second circuit board greater than that of the second connector; the first circuit board, the second connector, and the electronic component are arranged in the length direction of the second circuit board in the following order: the first circuit board, the second connector, and the electronic component. Power supply unit for the aerosol generator.

4. A power supply unit for the aerosol generating device according to any one of claims 1 to 3, a charging IC having a detection terminal for detecting a voltage of the power supply and an output terminal for outputting power for charging the power supply; the third connector is mounted on one end of the second circuit board in a longitudinal direction, The detection terminal is closer to the one end than the output terminal. Power supply unit for the aerosol generator.

5. A power supply unit for the aerosol generating device according to claim 4, the second circuit board has a surface A and a surface B that is a reverse surface of the surface A, the third connector is mounted on the A surface, The charging IC is mounted on the B surface. Power supply unit for the aerosol generator.

6. A power supply unit for the aerosol generating device according to claim 5, At least a portion of the third connector overlaps with the charging IC in a direction perpendicular to the A surface. Power supply unit for the aerosol generator.

7. A power supply unit for the aerosol generating device according to any one of claims 1 to 6, the second circuit board has a surface A and a surface B that is a reverse surface of the surface A, the third connector is mounted on the A surface, The second connector is mounted on the B surface. Power supply unit for the aerosol generator.

8. A power supply unit for the aerosol generating device according to any one of claims 1 to 7, a second cable connecting the power source and the third connector; an insulating spacer provided between the power source and the second circuit board in a longitudinal direction of the second circuit board; Further equipped with The second cable is connected to the third connector from a width direction of the second circuit board. Power supply unit for the aerosol generator.

9. A power supply unit for an aerosol generating device according to any one of claims 1 to 8, the second circuit board includes a conductive pattern that connects electronic components different from the second connector, the conductive pattern is formed on a portion of the second circuit board that overlaps with the second connector; Power supply unit for the aerosol generator.

10. A power supply unit for an aerosol generating device according to any one of claims 1 to 9, the second circuit board has a surface A and a surface B that is a reverse surface of the surface A, the second connector is mounted on the B surface, an IC mounted on the A surface and overlapping the second connector in a direction perpendicular to the A surface; Power supply unit for the aerosol generator.

11. A power supply unit for the aerosol generating device according to claim 10, The IC is an MCU. Power supply unit for the aerosol generator.

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