Resin sealing equipment

Abstract

To provide a resin sealing device which can position a plate-like member with high accuracy.SOLUTION: A resin sealing device 1 includes: an index 100 which aligns a plate-like member H resin-sealed in molds 21 and 31 together with an electronic component P, and regulates horizontal movement in a first direction; and a pick-and-place 200 which lifts the plate-like member H from the index 100, and arranges the plate-like member H in any one of a predetermined position in the molds 21 and 31 or a predetermined position in a second loader 70. The pick-and-place 200 includes: holding members 230L and 230R which lift the plate-like member H in a state where horizontal movement in the first direction is regulated by the index 100, and lower the plate-like member H to a predetermined position in the molds 21 and 31 or the second loader 70; and first and second guide pins 241 and 242 which are arranged so as to sandwich the plate-like member H from a second direction, and regulate the horizontal movement in a second direction of the plate-like member H.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present invention relates to a resin sealing apparatus. [Background technology]

[0002] Semiconductor packages equipped with plate-like members such as a heat spreader for improving heat dissipation efficiency and a shield plate for blocking electromagnetic noise are manufactured by a resin sealing apparatus that resin-seals such plate-like members together with electronic components such as semiconductor chips (see, for example, Patent Documents 1 and 2). The plate-like members are placed at predetermined positions in the mold of the resin sealing apparatus in a process prior to resin sealing. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 6639931 [Patent Document 2] Patent No. 6298719 Summary of the Invention [Problem to be solved by the invention]

[0004] However, in order to maximize productivity, the plate-shaped member is carried into the mold as a rectangular plate without pilot holes and is sealed with resin. Compared to a substrate such as a lead frame, which can correct positional errors by inserting pilot pins into pilot holes, it is difficult to accurately position the plate-shaped member at a predetermined position in the mold.

[0005] SUMMARY OF THE PRESENT EMBODIMENT An object of the present invention is to provide a resin sealing apparatus capable of positioning a plate-like member with high accuracy. [Means for solving the problem]

[0006] A resin sealing apparatus according to one aspect of the present invention includes an index that aligns a plate-shaped member to be resin-sealed together with an electronic component in a mold and restricts horizontal movement in a first direction, and a pick-and-place that lifts the plate-shaped member from the index and places the plate-shaped member at either a predetermined position in the mold or a predetermined position in a loader that carries the plate-shaped member into the mold. The pick-and-place includes a holding member that lifts the plate-shaped member in a state in which its horizontal movement in the first direction is restricted by the index and lowers the plate-shaped member at a predetermined position in the mold or the loader, and first and second guide pins that are arranged to sandwich the plate-shaped member from at least a second direction intersecting the first direction and restrict the horizontal movement of the plate-shaped member in the second direction.

[0007] According to this aspect, the plate-shaped member positioned in the first direction by the index is positioned in the second direction by pick-and-place and placed in the mold or loader. Since the positional accuracy is improved when the plate-shaped member is directly or indirectly carried into the mold, the plate-shaped member can be positioned with high accuracy in the resin-sealed product.

[0008] In the above aspect, each of the first and second guide pins may extend vertically below a bottom surface of the plate-like member lifted by the holding member.

[0009] When the plate-like member is lowered from the pick-and-place, there is a small gap between the holding member and the die or the loader. According to this embodiment, the plate-like member separated from the holding member falls along the first and second guide pins. The horizontal movement of the plate-like member during the fall can be restricted so that the plate-like member does not become misaligned in the first direction.

[0010] In the above aspect, each of the first and second guide pins may have a constant cross-sectional area in the vertical direction.

[0011] According to this embodiment, the gap between the plate-like member and each guide pin does not widen throughout the entire time the plate-like member is dropped from the holding member, and positional deviation can be more reliably prevented compared to when the first and second guide pins are tapered.

[0012] In the above aspect, a drive source for changing the distance between the first and second guide pins may be provided.

[0013] According to this aspect, the pick and place is lowered toward the index by widening the gap between the first guide pin and the second guide pin so as not to interfere with the plate-shaped member, and the gap between the first guide pin and the second guide pin is narrowed to transport the plate-shaped member in a state in which it is positioned with high precision in the second direction, and then it can be loaded into a loader or a mold.

[0014] In the above aspect, the holding member may be a hook facing the plate-like member from the first direction, and a hook-shaped claw provided at the tip of the hook may come into contact with the bottom surface of the plate-like member to lift it up.

[0015] According to this aspect, the bottom surface of the plate-like member is hooked with the hook to lift it, so load is less likely to be applied to the plate-like member compared to when the outer edge of the plate-like member is clamped. When the plate-like member is held by the pickup with the guide pins, and when the lifted plate-like member is lowered, it is less likely to shift position, so the positional relationship determined by the index and the first and second guide pins can be maintained.

[0016] In the above aspect, the holding member may be a suction holding member that suctions and lifts the plate-like member.

[0017] According to this aspect, since there is no need to lay out an index or the like so as not to interfere with the opening and closing hook, the resin sealing device can be made more compact than when the plate-like member is lifted by the claws of the hook.

[0018] In the above aspect, the plate-shaped member may be a heat spreader, a shield plate, or a plate-shaped resin.

[0019] According to this embodiment, the first and second guide pins are positioned close to the outer edge of the plate-shaped member, and horizontal movement can be regulated without using pilot holes, making this embodiment suitable for heat spreaders, shield plates, or plate-shaped resins that do not have pilot holes. Effect of the Invention

[0020] According to the present invention, it is possible to provide a resin sealing apparatus capable of positioning a plate-like member with high accuracy. [Brief description of the drawings]

[0021] [Figure 1] 1 is a plan view illustrating a schematic configuration of a resin sealing apparatus according to an embodiment of the present invention. [Diagram 2] FIG. 2 is a cross-sectional view showing a schematic configuration of the mold and the molded product shown in FIG. [Diagram 3] 2 is a plan view illustrating the movement of the first loader and the second loader illustrated in FIG. 1. [Figure 4] FIG. 4 is a perspective view of an index that constitutes the plate-like member delivery portion. [Diagram 5] FIG. 2 is a perspective view of a pick-and-place that constitutes the plate-shaped member delivery section. [Figure 6] FIG. 5 is a cross-sectional view of the index shown in FIG. [Figure 7] 11 is a cross-sectional view showing the movement of the pick and place lifting the plate-shaped member from the index. FIG. [Figure 8] 8 is an enlarged cross-sectional view of a tip of the holding member shown in FIG. 7. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0022] A preferred embodiment of the present invention will be described with reference to the accompanying drawings. In each drawing, the same reference numerals are used to denote the same or similar configurations. The drawings of each embodiment are illustrative, and the dimensions and shapes of each part are schematic, and the technical scope of the present invention should not be interpreted as being limited to the embodiment. Each configuration will be described in detail below with reference to Figs. 1 to 8.

[0023] 1 is a plan view showing a schematic configuration of a resin sealing apparatus 1 according to an embodiment. Each drawing is conveniently indicated with directions such as front, rear, left and right to clarify the relationship between the drawings and to aid in understanding the positional relationship of each component. The left and right direction is an example of a first direction, and the front and rear direction is an example of a second direction. In addition, the short-side direction of a plate-like component H formed in a strip shape is another example of the first direction, and the long-side direction is another example of the second direction.

[0024] The resin sealing apparatus 1 is a manufacturing apparatus that melts resin R on a workpiece W including a substrate S and an electronic component P to resin-seal the electronic component P and produce a molded product M. The resin sealing apparatus 1 also resin-seals a plate-shaped member H together with the workpiece W. The plate-shaped member H is provided, for example, so as to be exposed on the side opposite to the side on which the substrate S of the molded product M is exposed. The substrate S is, for example, an interposer substrate, a lead frame, a carrier plate with an adhesive sheet, a semiconductor substrate, etc. The electronic component P is, for example, a semiconductor element such as an IC chip, but is not limited thereto, and may be various active elements, passive elements, MEMS devices, etc.

[0025] The plate-shaped member H is, for example, a heat spreader that releases heat generated by the electronic component P or a shield plate that blocks electromagnetic noise, and is exposed after molding, but is not limited thereto. The plate-shaped member may be a rectangular solid or semi-solid plate-shaped resin (including a sheet-shaped resin if positioning by a guide pin is possible). In the case of a plate-shaped resin, it melts itself and molds the electronic component P, and is not necessarily intended to be exposed. The resin R is, for example, a granular thermosetting resin. The resin R may be a powdered thermosetting resin. The shape of the resin R is not limited to a granular shape, and may be a liquid or tablet shape. The resin sealing device 1 according to this embodiment is a compression type resin sealing device. The resin sealing device 1 is not limited to a compression type, and may be a transfer type resin sealing device.

[0026] 1, the resin sealing apparatus 1 includes, for example, a work supply unit 10, a resin supply unit 40, a plate-shaped member supply unit 50, press units 20 and 30, a molded product recovery unit 90, a first loader 60, and a second loader 70. Only one of the press units 20 and 30 may be used. In the illustrated example, the work supply unit 10, the resin supply unit 40, the press units 20 and 30, and the molded product recovery unit 90 are arranged side by side in the left-right direction, and the plate-shaped member supply unit 50 is arranged in the front-rear direction of the resin supply unit 40.

[0027] The first loader 60 is configured to be movable along the first guide portion 60R. The first guide portion 60R extends in the left-right direction across the work supply unit 10, the press units 20 and 30, the resin supply unit 40, and the molded product recovery unit 90. The second loader 70 is configured to be movable along the second guide portion 70R. The second guide portion 70R is provided, for example, in the resin supply unit 40, and extends in the front-rear direction. In the illustrated example, the second guide portion 70R intersects with the first guide portion 60R.

[0028] The work supply unit 10 supplies the work W. In the illustrated example, the work supply unit 10 is arranged at the left end of the planar layout of the resin sealing apparatus 1. The work supply unit 10 includes, for example, a work storage section 11, a work transfer section 13, a work preheating section 15, and the like. The work supply unit 10 may further include a volume measuring section that measures the volume of the work W, an appearance inspection section that inspects the appearance of the work W, and the like.

[0029] The workpiece storage unit 11 stores a plurality of workpieces W and sequentially delivers the workpieces W. The workpiece transfer unit 13 delivers the workpiece W received from the workpiece storage unit 11 to the workpiece preheating unit 15. The workpiece preheating unit 15 preheats the workpiece W received from the workpiece transfer unit 13 and delivers it to the first loader 60. The workpiece transfer unit 13 receives the workpiece W delivered by the workpiece storage unit 11 and delivers it to the workpiece preheating unit 15.

[0030] The molded product recovery unit 90 recovers the molded product M. In the illustrated example, the molded product recovery unit 90 is disposed at the right end of the planar layout of the resin sealing apparatus 1. The molded product recovery unit 90 includes, for example, a molded product receiving section 91, a molded product delivery section 93, and a molded product storage section 95. The molded product recovery unit 90 may further include a volume measuring section that measures the volume of the molded product M, an appearance inspection section that inspects the appearance of the molded product M, and the like.

[0031] When the resin sealing apparatus 1 is of the transfer type, the molded product recovery unit may further include a degate section that separates unnecessary resin called cull or liner from the molded product M, a scrap box for recovering the separated unnecessary resin, and the like.

[0032] The molded product receiving section 91 delivers the molded product M received from the first loader 60 to the molded product transferring section 93. The molded product receiving section 91 is equipped with, for example, a cooling pallet for cooling the molded product M. The molded product transferring section 93 delivers the molded product M received from the molded product receiving section 91 to the molded product storage section 95. The molded product transferring section 93 receives the molded product M sent out by the molded product receiving section 91 and delivers it to the molded product storage section 95. The molded product storage section 95 receives and stores the molded product M.

[0033] The press units 20 and 30 mold the resin R onto the workpiece W and the plate-like member H. In the illustrated example, the press unit 20 is connected to the right side of the workpiece supply unit 10 in the planar layout of the resin sealing apparatus 1, and the press unit 30 is connected to the left side of the molded product recovery unit 90 in the planar layout of the resin sealing apparatus 1. The press unit 20 includes, for example, a mold 21, a film handler 27, etc. Similarly, the press unit 30 includes, for example, a mold 31, a film handler 37, etc.

[0034] The film handler 27 supplies the film F to the mold 21. The film F is a release film that prevents the resin R from entering the gaps in the upper mold 23 and also makes it easy to peel the molded product M from the upper mold 23. The film handler 27 includes, for example, an unwinding section that supplies unused film F and a winding section that collects used film F. Note that the configuration of the press unit 30 is similar to that of the press unit 20, so a description of the mold 31, the film handler 37, etc. will be omitted.

[0035] The resin supplying unit 40 supplies granular resin R to the second loader 70. In the illustrated example, the resin supplying unit 40 is connected to the right side of the press unit 20 and to the left side of the press unit 30. The resin supplying unit 40 includes, for example, a resin supplying section 41, a weight measuring section that measures the weight of the resin R, a resin preheating section that preheats the resin R, a resin guard used as a frame that surrounds the resin R, a vibration section that disperses the resin R by vibration, an inspection section that inspects the dispersion of the resin R, and the like.

[0036] The resin supply unit 41 includes, for example, a hopper, a feeder, and the like. The hopper stores the resin R. The feeder delivers the resin R received from the hopper. When the resin is liquid, the resin supply unit may include a syringe that stores the resin, a piston that pushes out the resin, a pinch valve that opens and closes the tip of the syringe, and the like. When the resin supply unit supplies liquid resin, the resin supply unit may apply the liquid resin onto the workpiece.

[0037] The plate-shaped member supplying unit 50 supplies the plate-shaped members H to the molds 21, 31 via the second loader 70. The plate-shaped member supplying unit 50 may be configured to directly supply the plate-shaped members H to the molds 21, 31. In the illustrated example, the plate-shaped member supplying unit 50 is connected to the front side of the resin supplying unit 40. The plate-shaped member supplying unit 50 includes, for example, a plate-shaped member storage section 51, a plate-shaped member delivery section 53, and the like.

[0038] The plate-shaped member storage unit 51 stores a plurality of plate-shaped members H and sequentially delivers the plate-shaped members H. The plate-shaped member storage unit 51 is equipped with, for example, a plurality of plate-shaped member magazines, each of which stores a plurality of plate-shaped members H so that they overlap, and a plate-shaped member elevation unit that adjusts the positions of the plurality of plate-shaped member magazines to deliver the plate-shaped members H.

[0039] The plate-shaped member delivery section 53 delivers the plate-shaped member H received from the plate-shaped member storage section 51 to the second loader 70 or the dies 21, 31. The plate-shaped member delivery section 53 includes, for example, a plate-shaped member index 100 that receives and aligns the plate-shaped member H sent out by the plate-shaped member storage section 51, and a plate-shaped member pick-and-place 200 that delivers the plate-shaped member H aligned by the index 100 to the second loader 70 or the dies 21, 31. The plate-shaped member delivery section 53 will be described in detail later with reference to Figures 4 to 8.

[0040] Fig. 2 is a cross-sectional view showing a schematic configuration of the mold 21 and molded product M shown in Fig. 1. The mold 21 is a pair of openable and closable resin sealing molds for filling an internal cavity 25 with resin R for molding. The mold 21 includes a lower mold 22 and an upper mold 23. In the example shown in the figure, the cavity 25 is formed in the upper mold 23, so that the mold 21 is configured as a resin sealing mold having a so-called upper cavity structure.

[0041] 2, the upper mold 23 includes an upper plate 23A, a cavity piece 23B, a clamper 23C, and a biasing member 23D. The cavity piece 23B is fixedly attached to the lower surface of the upper plate 23A. The clamper 23C is configured in a frame shape so as to surround the cavity piece 23B. The clamper 23C is attached to the upper plate 23A via the biasing member 23D so as to be movable up and down.

[0042] The lower mold 22 includes a lower plate 22A and a cavity plate 22B. The cavity plate 22B is fixed and assembled to the upper surface of the lower plate 22A. The upper mold 23 includes suction passages 23E and 23F that pass through the clamper 23C, and a suction passage 23G that passes through the upper plate 23A and the cavity piece 23B. The lower mold 22 includes a suction passage 22C that passes through the lower plate 22A and the cavity plate 22B.

[0043] When a predetermined position where the pick and place 200 places the plate-shaped member H is located within the die 21, the plate-shaped member H carried into the die 21 by the pick and place 200 is placed on the workpiece W. The workpiece W is sucked and positioned by the suction path 22C of the lower die 22. The workpiece W may also be sucked by the suction path 23G of the upper die 23. In that case, the plate-shaped member H may be placed within the cavity of the lower die 22.

[0044] When the predetermined position where the pick and place 200 places the plate-shaped member H is within the second loader 70, the plate-shaped member H carried into the mold 21 by the second loader 70 may be configured to be sucked into the suction path 23G of the upper mold 23. In this case, a through hole T is formed in the film F at a position corresponding to the suction path 23G. Alternatively, the plate-shaped member H carried into the mold 21 by the second loader 70 may be configured to be placed on the workpiece W. Alternatively, the plate-shaped member H may be placed in the second loader 70, and then the resin R may be sprayed on the plate-shaped member H, and the plate-shaped member H and the resin R may be placed in the cavity of the lower mold 22.

[0045] Fig. 3 is a plan view that shows the schematic movement of the first loader and the second loader shown in Fig. 1. The first loader 60 includes, for example, a first loader hand 61, a first base 62, a first guide rod 63, etc. The second loader 70 includes, for example, a second loader hand 71, a second base 72, a second guide rod 73, etc.

[0046] 3, the first loader 60 is configured to be movable along the first guide portion 60R, and transports the workpiece W or the molded product M. The first loader hand 61 is equipped with a holding mechanism for the workpiece W or the molded product M. The first loader hand 61 is also configured to be capable of moving forward and backward relative to the molds 21, 31. The first base 62 is connected to the first guide portion 60R so as to be movable in the left-right direction, and movement in the front-rear direction is restricted.

[0047] The first base 62 supports the first loader hand 61 via a first guide rod 63. In a plan view, the first guide rod 63 extends and retracts from a point where it is connected to the first base 62. As a result, the first guide rod 63 moves the first loader hand 61 in the front-rear direction.

[0048] For example, after receiving the workpiece W at the workpiece transfer section 13, the first loader hand 61 is transported rightward by the first base 62 and moves to a position facing the die 21 in the front-rear direction. Next, the first loader hand 61 enters the die 21 from the rear by extension and retraction of the first guide rod 63, and carries the workpiece W into the die 21.

[0049] The first loader hand 61, which has delivered the workpiece W to the die 21, retreats to the rear of the die 21 due to the extension and contraction of the first guide rod 63. The first loader hand 61, which has removed the molded product M from the die 21 by the same operation as when the workpiece W was delivered, is transported to the right by the first base 62 and moves to the molded product receiving section 91, where it delivers the molded product M.

[0050] The second loader 70 transports the resin R and / or the plate-shaped member H. In the illustrated example, the second loader 70 transports the resin R and the plate-shaped member H simultaneously, but is not limited to this. One of the resin R and the plate-shaped member H may be transported first, and then the other may be transported.

[0051] The second loader hand 71 is equipped with a holding mechanism for the resin R and the plate-shaped member H. Specifically, the second loader hand 71 is equipped with a resin guard 77 as a frame that surrounds the resin R. The second loader hand 71 may also be equipped with side rails, a chuck, a suction mechanism, etc. that hold the plate-shaped member H.

[0052] In the resin supply unit 41, the resin R is sent from a hopper to the second loader hand 71. The resin R is leveled flat by a vibration unit or the like in an area surrounded by a resin guard 77. When a predetermined position where the pick and place 200 places the plate-shaped member H is within the second loader 70, the plate-shaped member H carried into the second loader 70 by the pick and place 200 is placed at a predetermined position of the resin R that has been leveled flat.

[0053] The second loader hand 71 is configured to be able to advance and retreat relative to the molds 21, 31. The second base 72 is connected to the second guide portion 70R so as to be able to move in the front-rear direction, and movement in the left-right direction is restricted. If there is a low possibility that the resin R will fall out of the second loader hand 71, the resin guard 77 of the second loader hand 71 may be omitted.

[0054] The second base 72 supports the second loader hand 71 via a second guide rod 73. In plan view, the second guide rod 73 extends and retracts and rotates from a point where it is connected to the second base 72. As a result, the second guide rod 73 moves the second loader hand 71 in the front-rear or left-right directions, and also rotates the second loader hand 71 around the second base 72.

[0055] For example, after the second loader hand 71 receives the resin R at the resin supply unit 41, it is transported forward by the second base 72 and moves to a position P1 facing the resin supply unit 41 in the front-rear direction. Next, the second loader hand 71 moves to a position P2 facing the plate-like member delivery unit 53 in the front-rear direction by the rotation of the second guide rod 73. Next, the second loader hand 71 moves to the plate-like member delivery unit 53 by the extension and contraction of the second guide rod 73 to receive the plate-like member H, and then returns to position P2.

[0056] Next, the second loader hand 71 moves to position P3 facing the mold 21 in the left-right direction by pivoting the second guide rod 73. Next, the second loader hand 71 enters the mold 21 from the right by extending and contracting the second guide rod 73, and carries the resin R and the plate-shaped member H into the mold 21. After delivering the resin R and the plate-shaped member H to the mold 21, the second loader hand 71 retreats to the right of the mold 21 by extending and contracting the second guide rod 73.

[0057] For example, the second loader hand 71 receives the resin R and then the plate-shaped member H, and carries both of them into the mold 21 at the same time, but this is not limited to the above. The second loader hand 71 may receive the plate-shaped member H and then the resin R. The second loader hand 71 may also carry one of the resin R and the plate-shaped member H into the mold 21 and then the other.

[0058] In this manner, with a configuration in which the second loader hand 71 moves to the plate material delivery section 53 by the extension and contraction of the second guide rod 73, the plate material supply unit 50 can be inserted and removed without extending the second guide section 70R to the plate material supply unit 50. In the second loader 70, the mechanism for rotating the second guide rod 73 may be omitted. In that case, the second guide section 70R may be extended to the plate material supply unit 50.

[0059] Fig. 4 is a perspective view of the index 100 constituting the plate-like member delivery section 53. Fig. 5 is a perspective view of the pick-and-place 200 constituting the plate-like member delivery section 53. As described above, the plate-like member delivery section 53 includes the index 100 that receives and aligns the plate-like members H sent out by the plate-like member storage section 51, and the pick-and-place 200 that delivers the plate-like members H aligned by the index 100 to the second loader 70 or the molds 21, 31.

[0060] The index 100 includes, for example, a pair of rails 110L, 110R, a chuck for moving the plate-shaped member H, and the like. As shown in Fig. 4, the pair of rails 110L, 110R extend along the second direction, and a notch (recess) 120 is formed at a position corresponding to a claw provided at each tip of the holding members 230L, 230R of the pick and place 200.

[0061] The plate-shaped members H sequentially supplied by the plate-shaped member storage unit 51 are pushed out by a pusher (not shown) and wait in a state where they partially protrude from the housing of the plate-shaped member storage unit 51. A chuck (not shown) of the index 100 pulls out the plate-shaped member H along the rails 110L, 110R. The position of the plate-shaped member H in the second direction is determined by the amount of movement of the chuck. As shown in FIG. 4, the distance between the pair of rails 110L, 110R has a width in the first direction that is approximately the same as that of the plate-shaped member H, so that the horizontal movement of the plate-shaped member H in the first direction is restricted.

[0062] 5, the pick and place 200 includes a base 210 and at least one hand 220 attached so as to be suspended from the base 210. The pick and place 200 lifts the plate member H from the index 100 and places the plate member H at either a predetermined position in the second loader 70 or a predetermined position in the molds 21, 31.

[0063] The base 210 is configured to be capable of reciprocating between the index 100 and the second loader 70 or the molds 21, 31. The base 210 may be provided with a rotation mechanism for changing the orientation of each hand 220. In the example shown in FIG. 2, when the second guide rod 73 is rotated to bring the second loader 70 close to the plate-like member delivery section 53, the second loader 70 is disposed in an orientation rotated 90 degrees with respect to the molds 21, 31. By rotating the orientation of each hand 220 by 90 degrees, the plate-like member H can be placed at a predetermined position of the second loader 70 in an orientation rotated 90 degrees.

[0064] When three plate-shaped members H are carried into the molds 21 and 31, three hands 220 may be attached to the base 210. In this case, the base 210 may be configured to move so as to align the positions of the hands 220 with respect to the index 100, and all the hands 220 may receive the plate-shaped members H from the index 100.

[0065] Each hand 220 includes holding members 230L, 230R, first and second guide pins 241, 242, and driving sources 253, 254. The holding members 230L, 230R lift up the bottom surface of the plate-like member H in a state in which the horizontal movement in the first direction is restricted by the index 100, and lower the plate-like member to a predetermined position in the second loader 70 or the molds 21, 31.

[0066] The holding members 230L, 230R are hooks facing the plate-shaped member H from the first direction, and a hook-shaped claw provided at the tip of the hook abuts against the bottom surface of the plate-shaped member H. The pair of holding members 230L, 230R are arranged to sandwich the plate-shaped member H in the first direction. A driving source 253 such as an air cylinder or a servo motor changes the distance between the holding members 230L, 230R. In the illustrated example, each hand 220 has four pairs of holding members 230L, 230R.

[0067] The first and second guide pins 241, 242 are disposed to sandwich the plate-shaped member H from the second direction, and regulate the horizontal movement of the plate-shaped member H in the second direction. A driving source 254 such as an air cylinder or a servo motor changes the distance between the first and second guide pins 241, 242. Each of the first and second guide pins 241, 242 has a straight shape without a taper, and has a constant cross-sectional area in the vertical direction. In addition, each of the first and second guide pins 241, 242 extends in the vertical direction below the bottom surface of the plate-shaped member H lifted by the holding members 230L, 230R.

[0068] Fig. 6 is a cross-sectional view of the index shown in Fig. 4. Fig. 7 is a cross-sectional view showing the movement of the pick and place 200 lifting the plate member H from the index 100. As shown in Fig. 6 and Fig. 7, each notch 120 forms a gap larger than the tip of the holding members 230L, 230R of the pick and place 200 outside the outer edge of the plate member H placed on the pair of rails 110L, 110R, and also forms a gap larger than the tip of the holding members 230L, 230R below the bottom surface of the plate member H.

[0069] Fig. 8 is an enlarged cross-sectional view of the tip of the holding members 230L, 230R shown in Fig. 7. As shown in Fig. 8, the distance between the rails 110L, 110R is slightly larger than the width of the plate-shaped member H. The holding members 230L, 230R lift up the bottom surface of the plate-shaped member H with a small gap between them and the outer edge of the plate-shaped member H. In other words, the holding members 230L, 230R do not press and hold the plate-shaped member H from the first direction, but support the plate-shaped member H from below in the vertical direction.

[0070] According to the resin sealing apparatus 1 of the present embodiment configured as described above, the plate-like member positioned in the first direction by the index is positioned in the second direction by pick-and-place and placed in the mold or loader. Since the positional accuracy is improved when the plate-like member is directly or indirectly carried into the mold, the plate-like member can be positioned with high accuracy in the resin-sealed product.

[0071] Since the first and second guide pins 241, 242 each extend below the plate-like member H lifted by the holding members 230L, 230R, the plate-like member H that has left the holding members 230L, 230R falls along the first and second guide pins 241, 242. The horizontal movement of the plate-like member H during the fall can be restricted so that the plate-like member H does not shift position in the first direction. Since the first and second guide pins 241, 242 have a straight shape without a taper, the gap between the plate-like member H and each guide pin 241, 242 does not widen throughout the fall from the holding members 230L, 230R.

[0072] Since the drive source 254 is provided, by narrowing the gap between the first guide pin 241 and the second guide pin 242, the plate-shaped member H can be loaded into the second loader 70 or the molds 21, 31 while being positioned with high precision in the second direction. Since the horizontal movement of the plate-shaped member H can be restricted without using pilot holes, this is suitable for resin sealing of heat spreaders and shield plates, in which pilot holes are difficult to form.

[0073] The above-described embodiments are intended to facilitate understanding of the present invention, and are not intended to limit the present invention. The elements of the embodiments, as well as their arrangements, materials, conditions, shapes, sizes, etc., are not limited to those shown as examples and can be changed as appropriate. In addition, configurations shown in different embodiments can be partially substituted or combined with each other.

[0074] For example, the hand 220 of the pick and place 200 may further include third and fourth guide pins arranged to sandwich the plate member H from the first direction and restrict the horizontal movement of the plate member H in the first direction. According to this embodiment, the plate member H separated from the holding members 230L, 230R falls along the first to fourth guide pins. The horizontal movement of the plate member H during the fall can be restricted so that the plate member H does not shift in position in both the first and second directions. Alternatively, in addition to the holding members 230L, 230R facing in the first direction, a holding member facing in the second direction may be further included. Also, for example, the holding member is not limited to a hook shape that lifts the bottom surface of the plate member. It may be an adsorption holding member equipped with an adsorption pad or the like that can adsorb and hold the top surface of the plate member. [Explanation of symbols]

[0075] 1...resin sealing device, 10...work supply unit, 11...work storage section, 13...work transfer section, 15...work preheating section, 20, 30...press unit, 21, 31...mold, 25, 35...cavity, 27, 37...film handler, 40...resin supply unit, 41...resin supply section, 50...plate-shaped member supply unit, 51...plate-shaped member storage section, 53...plate-shaped member transfer section, 60...first loader, 60R...first guide portion, 61...first loader hand, 62...first base, 63...first guide rod, 70...second loader, 70R...second guide portion, 71...second loader hand, 72...second base, 73...second guide rod, 77...resin guard, 90...molded product recovery unit, 91...molded product receiving portion, 93...molded product delivery portion, 95...molded product storage portion, 100...index, 110L, 110R...rail, 120...notch, 200...pick and place, 210...base, 220...hand, 230L, 230R...holding member, 241, 242...first and second guide pins, 253, 254...driving source, F...film, H...plate-shaped member, M...molded product, P...electronic component, R...resin, S...substrate, W...work.

Claims

1. an index that aligns a plate-like member to be resin-sealed together with the electronic component in the mold and restricts horizontal movement in a first direction; a pick-and-place step of lifting the plate-like member from the index and placing the plate-like member at a predetermined position in the mold or at a predetermined position in a loader that carries the plate-like member into the mold; The pick and place method includes: a holding member that lifts up the plate-like member in a state in which the horizontal movement in the first direction is restricted by the index, and lowers the plate-like member to the predetermined position in the mold or the loader; and first and second guide pins arranged to sandwich the plate-like member from at least a second direction intersecting the first direction and restrict horizontal movement of the plate-like member in the second direction. Resin sealing equipment.

2. Each of the first and second guide pins extends in the vertical direction below a bottom surface of the plate-like member lifted by the holding member. The resin sealing apparatus according to claim 1 .

3. Each of the first and second guide pins has a constant cross-sectional area in the vertical direction. The resin sealing apparatus according to claim 1 or 2.

4. A drive source is provided for changing the distance between the first and second guide pins. The resin sealing device according to claim 1 .

5. The holding member is a hook facing the plate-like member from the first direction, and a hook-shaped claw provided at a tip of the hook abuts against a bottom surface of the plate-like member to lift it up. The resin sealing device according to claim 1 .

6. 5. The resin sealing apparatus according to claim 1, wherein the holding member is a suction holding member that suctions and lifts the plate-like member.

7. The plate-shaped member is a heat spreader, a shield plate, or a plate-shaped resin. The resin sealing device according to claim 1 .

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