Resin sealing equipment

Abstract

A resin sealing device (1) equipped with a workpiece supply unit (10), a resin supply unit (40), a functional member supply unit (50), a resin-molding unit (20), a first loader (60) for transporting a workpiece (W) supplied from the workpiece supply unit (10), and a second loader (70) which transports the resin (R) and / or the functional member (H) and has a transport path which is different from that of the first loader (60), wherein the workpiece supply unit (10), the resin-molding unit (20) and the resin supply unit (40) are positioned so as to align with one another in a first direction in a flat layout, and the functional member supply unit (50) is adjacent to the resin supply unit (40) in a second direction which intersects the first direction in the flat layout.

Description

[Technical field]

[0001] The present invention relates to a resin sealing apparatus. [Background technology]

[0002] 2. Description of the Related Art As an example of a resin sealing apparatus that melts resin onto a workpiece including a substrate and electronic components to resin-seal the electronic components, a resin sealing apparatus that molds resin onto a functional member together with the workpiece is known.

[0003] Patent documents 1 and 2 disclose a resin sealing device that includes a work supply unit, a molded product recovery unit, and an additional rail unit that is separably arranged between the two, in which a resin molding unit and a functional material supply unit are each removably arranged as the additional rail unit. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 6639931 [Patent Document 2] JP 2004-259816 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, in the case of the configurations as disclosed in Patent Documents 1 and 2, since it is assumed that the work, resin, and functional components are transported using a common transport path, there is a problem that the layout of each unit is restricted. Also, for example, when attempting to attach or detach the functional component supply unit, it is necessary to release the connection of each unit, attach or detach the functional component supply unit, adjust the position of each unit, and reconnect them, which is time-consuming, and can make handling of the resin sealing apparatus cumbersome.

[0006] The present invention has been made in view of the above circumstances, and an object of the present invention is to improve the degree of freedom in layout and to improve the handling of a resin sealing device. [Means for solving the problem]

[0007] A resin sealing apparatus according to one embodiment of the present invention is a resin sealing apparatus that melts resin on a workpiece including a substrate and an electronic component to resin seal the electronic component, and includes a work supply unit that supplies the workpiece, a resin supply unit that supplies resin, a functional component supply unit that supplies a functional component, a resin molding unit that molds resin on the workpiece and the functional component, a first loader that transports the workpiece supplied from the work supply unit, and a second loader that transports at least one of the resin and the functional component, the second loader having a transport path different from that of the first loader, wherein the work supply unit, the resin molding unit, and the resin supply unit are arranged side by side in a first direction in a planar layout of the resin sealing apparatus, and the functional component supply unit is adjacent to the resin supply unit in a second direction that intersects the first direction in the planar layout.

[0008] According to this aspect, since the second loader that transports at least one of the resin and the functional component has a transport path different from that of the first loader that transports the workpiece, the degree of freedom of layout can be improved compared to a conventional configuration that assumes that the workpiece, the resin, and the functional component are transported using a common transport path. Also, since the functional component supply unit is adjacent to the resin supply unit in the second direction in the planar layout, for example, attachment and detachment of the functional component supply unit can be facilitated, and handling of the resin sealing apparatus can be improved.

[0009] In the above aspect, the first loader may have a first transport path extending along a first direction, and the second loader may have a second transport path extending along a second direction.

[0010] In the above aspect, the resin molding unit has a mold for molding resin, the first loader has a first loader hand for transporting a workpiece into the mold, and the second loader has a second loader hand for transporting at least one of resin and a functional component into the mold, the first loader hand being configured to be able to advance and retreat relative to the mold along the second direction, and the second loader hand being configured to be able to advance and retreat relative to the mold along the first direction.

[0011] In the above aspect, the resin molding unit may have a first resin molding unit and a second resin molding unit, the first resin molding unit and the second resin molding unit being arranged side by side in the first direction, and the resin supply unit may be provided between the first resin molding unit and the second resin molding unit.

[0012] In the above aspect, the resin supplying unit may have a resin supplying section that supplies resin to the second loader, and in a planar layout of the resin sealing apparatus, the functional member supplying unit may be disposed on the opposite side to the resin supplying section as viewed from the first transport path.

[0013] In the above aspect, the resin supplying unit may have a resin supplying section that supplies resin to the second loader, and in a planar layout of the resin sealing apparatus, the functional member supplying unit may be disposed on the same side as the supplying section when viewed from the first transport path.

[0014] In the above-described aspect, in the planar layout of the resin sealing apparatus, the functional component supplying unit may be disposed on the front side of the resin sealing apparatus.

[0015] In the above aspect, the functional member supplying unit may be disposed on the rear side of the resin sealing apparatus.

[0016] In the above aspect, the second loader may receive the resin at the resin supplying unit, and receive the functional member on top of the resin at the functional member supplying unit.

[0017] In the above aspect, the second loader may receive the functional member at the functional member supplying unit, and receive the resin onto the functional member at the resin supplying unit.

[0018] A resin sealing apparatus according to another embodiment of the present invention is a resin sealing apparatus that melts resin on a workpiece including a substrate and an electronic component to resin seal the electronic component, and includes a work supply unit that supplies the workpiece, a first resin supply unit that supplies a sheet-like first resin, a resin molding unit that molds the first resin on the workpiece, a first loader that transports the workpiece supplied from the work supply unit, and a second loader that transports the first resin and has a transport path different from that of the first loader, wherein the work supply unit and the resin molding unit are arranged side by side in a first direction in the planar layout of the resin sealing apparatus, and the first resin supply unit is arranged in a second direction that intersects the first direction with respect to an area that includes the work supply unit and the resin molding unit and extends in the first direction in the planar layout.

[0019] In the above aspect, the resin sealing apparatus may further include a second resin supply unit that supplies a second resin, the resin molding unit molds the second resin together with the first resin onto the workpiece, the workpiece supply unit, the resin molding unit and the second resin supply unit are arranged in a line in a first direction in the planar layout, and the first resin supply unit may be arranged in a second direction in the planar layout relative to the second resin supply unit.

[0020] In the above embodiment, the second resin may be in the form of granules, powder or liquid.

[0021] In the above aspect, the second loader may transport the first resin and the second resin that have been fused to each other by preheating.

[0022] In the above aspect, the resin sealing apparatus may further include a functional member supplying unit that supplies a functional member, and the first resin supplying unit, the second resin supplying unit and the functional member supplying unit may be arranged side by side in the second direction in the planar layout. Effect of the Invention

[0023] According to the present invention, the degree of freedom in layout is improved and the handling of the resin sealing device is improved. [Brief description of the drawings]

[0024] [Figure 1] FIG. 1 is a plan view illustrating a schematic configuration of a resin sealing apparatus according to a first embodiment. [Diagram 2] 4 is a plan view illustrating a more detailed configuration of a first loader and a second loader. FIG. [Diagram 3] FIG. 2 is a cross-sectional view showing a schematic configuration of a mold and a molded product. [Figure 4] FIG. 11 is a cross-sectional view illustrating a second loader to which resin has been supplied. [Diagram 5] FIG. 11 is a cross-sectional view illustrating a second loader to which a heat sink is provided. [Figure 6] FIG. 2 is a cross-sectional view showing a schematic diagram of a mold before clamping. [Figure 7] FIG. 11 is a plan view illustrating a schematic configuration of a resin sealing apparatus according to a second embodiment. [Figure 8] FIG. 11 is a cross-sectional view illustrating a schematic configuration of a mold according to a third embodiment. [Figure 9] FIG. 13 is a plan view illustrating a schematic configuration of a resin sealing apparatus according to a fourth embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0025] Hereinafter, embodiments of the present invention will be described with reference to the drawings. The drawings of each embodiment are merely examples, and the dimensions and shapes of each part are schematic, and the technical scope of the present invention should not be interpreted as being limited to the embodiment.

[0026] First Embodiment The configuration of a resin sealing apparatus 1 according to an embodiment of the present invention will be described with reference to Fig. 1 to Fig. 3. Fig. 1 is a plan view that shows a schematic configuration of the resin sealing apparatus according to the first embodiment. Fig. 2 is a plan view that shows a schematic configuration of a first loader and a second loader in more detail. Fig. 3 is a cross-sectional view that shows a schematic configuration of a mold and a molded product.

[0027] 1 and 2 show the layout when viewed from above. In each drawing, directions such as front-rear and left-right are conveniently indicated to clarify the relationship between the drawings and to aid in understanding the positional relationship of each component. The left-right direction corresponds to an example of the "first direction" according to the present invention, and the front-rear direction corresponds to an example of the "second direction" according to the present invention.

[0028] The resin sealing apparatus 1 is a manufacturing apparatus that melts the resin R on the workpiece W including the substrate S and the electronic component P to resin-seal the electronic component P and manufacture the molded product M. The resin sealing apparatus 1 molds the resin R on the functional member H together with the workpiece W. The functional member H is provided so as to be exposed on the opposite side of the substrate S of the molded product M. The substrate S is, for example, an interposer substrate, a lead frame, a carrier plate with an adhesive sheet, or a semiconductor substrate. The electronic component P is, for example, a semiconductor element such as an IC chip, but is not limited thereto, and may be various active elements, passive elements, MEMS devices, or the like. The functional member H is, for example, a plate-shaped member such as a heat dissipation member that dissipates heat generated by the electronic component P or a shielding member that shields electromagnetic waves, but is not limited thereto. The resin R is, for example, a granular thermosetting resin. The shape of the resin R is not limited to the above, and may be a powder, liquid, sheet, or tablet.

[0029] The resin sealing apparatus 1 according to this embodiment is a compression type resin sealing apparatus. However, the resin sealing apparatus according to one embodiment of the present invention is not limited to the above, and may be a transfer type resin sealing apparatus.

[0030] 1, the resin sealing apparatus 1 includes a work supply unit 10, a resin supply unit 40, a functional material supply unit 50, resin molding units 20 and 30, a molded product recovery unit 90, a first loader 60, and a second loader 70. The work supply unit 10, the resin supply unit 40, the resin molding units 20 and 30, and the molded product recovery unit 90 are arranged side by side in the left-right direction. The resin supply unit 40 and the functional material supply unit 50 are adjacent to each other in the front-rear direction.

[0031] The work supply unit 10 supplies a work W. The work supply unit 10 includes a work storage section 11, a work transfer section 13, a work preheating section 15, and a work supply control panel 19. When viewed from above as shown in FIG. 1, the work supply unit 10 is disposed at the left end of the resin sealing apparatus 1, for example.

[0032] The work storage unit 11 stores a plurality of workpieces W and sequentially delivers the workpieces W. For example, the work storage unit 11 is provided with a plurality of work magazines in which a plurality of workpieces W are stored so as to overlap each other, and a work elevation that adjusts the positions of the plurality of work magazines to deliver the workpieces W.

[0033] The workpiece transferring section 13 transfers the workpiece W received from the workpiece storage section 11 to the workpiece preheating section 15. For example, the workpiece transferring section 13 is provided with a work index that receives and aligns the workpiece W sent out by the workpiece storage section 11, and a work pick and place that transfers the workpiece W aligned by the work index to the workpiece preheating section 15.

[0034] The workpiece preheating section 15 preheats the workpiece W received from the workpiece transfer section 13 and transfers it to the first loader 60. By preheating the workpiece W before it is transported to the resin molding units 20, 30, deformation of the workpiece W due to a sudden change in temperature is suppressed. For example, the workpiece preheating section 15 is provided with a preheat rail that heats the workpiece W received from the workpiece storage section 11.

[0035] The work supply control panel 19 is a control panel for controlling the operation of the work supply unit 10. When viewed from above as shown in Fig. 1, the work supply control panel 19 is disposed in front of the work supply unit 10. For example, the work supply control panel 19 is provided with a display unit that displays the control parameters of the work supply unit 10, and an input unit for inputting the control parameters of the work supply unit 10.

[0036] The display section of the work supply control panel 19 may be configured to be able to collectively display the control parameters of each component of the resin sealing apparatus 1, such as the work supply unit 10, the resin supply unit 40, the functional member supply unit 50, the molded product recovery unit 90, the first loader 60, the second loader 70, etc. Similarly, the input section of the work supply control panel 19 may be configured to collectively input the control parameters of each component of the resin sealing apparatus 1, such as the work supply unit 10, the resin supply unit 40, the functional member supply unit 50, the molded product recovery unit 90, the first loader 60, the second loader 70, etc.

[0037] In addition, the work supply unit 10 may further include a volume measuring unit that measures the volume of the work W, a weight measuring unit that measures the weight of the work W, a thickness measuring unit that measures the thickness of the work W, and an appearance inspection unit that inspects the appearance of the work W.

[0038] The molded product recovery unit 90 recovers the molded products M. The molded product recovery unit 90 includes a molded product receiving section 91, a molded product delivery section 93, and a molded product storage section 95. When viewed from above as shown in FIG. 1, the molded product recovery unit 90 is disposed, for example, at the right end of the resin sealing apparatus 1.

[0039] The molded product receiving section 91 delivers the molded product M received from the first loader 60 to the molded product delivery section 93. For example, the molded product receiving section 91 is provided with a cooling pallet for cooling the molded product M.

[0040] The molded product delivery section 93 delivers the molded products M received from the molded product receiving section 91 to the molded product storage section 95. For example, the molded product delivery section 93 is provided with a molded product index that receives and aligns the molded products M sent out by the molded product receiving section 91, and a molded product pick and place that delivers the molded products M aligned by the molded product index to the molded product storage section 95.

[0041] The molded product storage unit 95 receives and stores the molded products M. For example, the molded product storage unit 95 is provided with a plurality of molded product magazines, each of which stores a plurality of molded products M so that they overlap, and a molded product elevation that adjusts the positions of the plurality of molded product magazines to receive the molded products M.

[0042] The molded product recovery unit 90 may further include a volume measuring unit that measures the volume of the molded product M, a weight measuring unit that measures the weight of the molded product M, a thickness measuring unit that measures the thickness of the molded product M, and an appearance inspection unit that inspects the appearance of the molded product M. When the resin sealing apparatus according to one embodiment of the present invention is a transfer type resin sealing apparatus, the molded product recovery unit may include a degate unit that separates unnecessary resin called cull or runner from the molded product M, and a scrap box for collecting the separated unnecessary resin.

[0043] The resin molding unit 20 molds a resin R onto a workpiece W and a functional component H. The resin molding unit 20 includes a mold 21, a film handler 27, and a resin molding control panel 29. When viewed from above as shown in FIG. 1, the resin molding unit 20 is connected to the right side of the workpiece supply unit 10, for example.

[0044] The mold 21 is a pair of openable and closable molds that fill an internal cavity 25 with resin R to resin-seal the electronic component P. The mold 21 includes a lower mold 22 and an upper mold 23. The mold 21 is a compression molding mold with a so-called movable upper cavity structure in which the cavity 25 is formed on the lower mold 22 side of the upper mold 23 and the volume of the cavity 25 changes as the mold is clamped.

[0045] The lower die 22 includes a lower plate 22A and a cavity plate 22B. The cavity plate 22B is fixedly assembled to the upper surface (surface on the upper die 23 side) of the lower plate 22A. The lower die 22 is provided with a suction passage 22C penetrating the lower plate 22A and the cavity plate 22B. The suction passage 22C opens to the upper surface of the cavity plate 22B. The suction passage 22C is an air hole for sucking and holding the workpiece W set in the lower die 22.

[0046] The upper mold 23 includes an upper plate 23A, a cavity piece 23B, a clamper 23C, and a biasing member 23D. The cavity piece 23B is fixed and assembled to the lower surface (the surface on the lower mold 22 side) of the upper plate 23A. The clamper 23C is configured in a frame shape so as to surround the cavity piece 23B. The clamper 23C is assembled to the upper plate 23A via the biasing member 23D so as to be movable up and down. The cavity piece 23B forms the bottom of the cavity 25, and the clamper 23C forms the side of the cavity 25. The upper mold 23 is provided with suction passages 23E and 23F penetrating the clamper 23C, and a suction passage 23G penetrating the upper plate 23A and the cavity piece 23B. The suction passage 23E opens to the lower surface of the clamper 23C. The suction passage 23F opens on the inner surface of the clamper 23C facing the cavity piece 23B. The suction passage 23G opens on the lower surface of the cavity piece 23B. The suction passages 23E, 23F, and 23G are vents for sucking and holding the film F set on the upper die 23. The suction passage 23G is also a vent for sucking and holding the functional member H set on the lower surface of the film F. Specifically, the suction passage 22G sucks the functional member H through a through hole T provided in the film F. The through hole T may be provided before the film F is sucked to the upper die 23, or may be provided after the film F is sucked to the upper die 23. For example, the through hole T is opened by piercing a needle-shaped member into the film F sucked to the upper die 23.

[0047] The film handler 27 supplies the film F to the mold 21. The film F is a release film that prevents the resin R from entering the gap of the upper mold 23 and facilitates the peeling of the molded product M from the upper mold 23. The film handler 27 is provided with an unwinding section that supplies unused film F in a roll and a winding section that collects used film F. As the material of the film F, a polymer material having excellent heat resistance, ease of peeling, flexibility, and extensibility, such as PTFE (polytetrafluoroethylene), ETFE (polytetrafluoroethylene-ethylene copolymer), FEP (tetrafluoroethylene-hexafluoropropylene copolymer), PET (polyethylene terephthalate), PP (polypropylene), or PVDC (polyvinylidine chloride), is preferably used. The material of the film F is not limited to the above, and may be, for example, fluorine-impregnated glass cloth. The thickness of the film F is suitably selected according to the physical properties of the material, and is, for example, about 50 μm. The shape of the film F is not limited to a roll, and may be a strip.

[0048] The resin molding control panel 29 is a control panel for controlling the operation of the resin molding unit 20. When viewed from above as shown in Fig. 1, the resin molding control panel 29 is disposed in front of the resin molding unit 20. For example, the resin molding control panel 29 includes a display unit that displays the control parameters of the resin molding unit 20, and an input unit that inputs the control parameters of the resin molding unit 20.

[0049] The resin molding unit 30 includes a metal mold 31, a film handler 37, and a resin molding control panel 39. When viewed from above as shown in Fig. 1, the resin molding unit 30 is connected, for example, to the left side of the molded product recovery unit 90. Note that since the configuration of the resin molding unit 30 is similar to that of the resin molding unit 20, a description of the metal mold 31, the film handler 37, and the resin molding control panel 39 will be omitted.

[0050] At least some of the functions of the resin molding control panels 29, 39 may be integrated into the work supply control panel 19. For example, the control parameters of the resin molding units 20, 30 may be displayed on a display unit of the work supply control panel 19, and the control parameters of the resin molding units 20, 30 may be input into an input unit of the work supply control panel 19. When all the functions of the control panels of the respective units are integrated into the work supply control panel 19, the resin molding control panels 29, 39 may be omitted.

[0051] The resin supplying unit 40 supplies granular resin R to the second loader 70. When viewed from above as shown in Fig. 1, the resin supplying unit 40 is connected to the right side of the resin molding unit 20 and connected to the left side of the resin molding unit 30. The resin supplying unit 40 includes a resin supplying section 41.

[0052] The resin supply unit 41 includes a hopper 42 and a feeder 43, as described later with reference to FIG. 4, for example. The hopper 42 corresponds to an example of a storage unit that stores the resin R. The feeder 43 corresponds to an example of a supply unit that feeds the resin R received from the hopper 42. When the resin is liquid, the resin supply unit may include a syringe that stores the resin, a piston that pushes out the resin, and a pinch valve that opens and closes the tip of the syringe. When the resin supply unit supplies liquid resin, the resin supply unit may apply the liquid resin onto the workpiece.

[0053] In addition, the resin supply unit 40 may further include a weight measuring section that measures the weight of the resin R, a resin preheating section that preheats the resin R, a resin guard used as a frame that surrounds the resin R, a vibration section that disperses the resin R by vibration, and an inspection section that inspects the dispersion of the resin R.

[0054] The functional member supplying unit 50 supplies the functional member H to the second loader 70. The functional member supplying unit 50 includes a functional member storage section 51 and a functional member transfer section 53. When viewed from above as shown in FIG. 1, the functional member supplying unit 50 is connected to the front side of the resin supplying unit 40. In other words, the functional member supplying unit 50 is disposed on the front side of the resin sealing apparatus 1. Here, the front side of the resin sealing apparatus 1 is the side on which the work supply control panel 19 and the resin molding control panels 29, 39 are disposed in the front-rear direction. The functional member supplying unit 50 is disposed on the opposite side of the resin supplying section 41 in the front-rear direction as viewed from a first guide section 60R described later. Specifically, the functional member supplying unit 50 is located in front of the first guide section 60R, and the resin supplying section 41 is located behind the first guide section 60R. In other words, the first guide section 60R is provided between the functional member supplying unit 50 and the resin supplying section 41.

[0055] The functional component storage section 51 stores a plurality of functional components H and sequentially delivers the functional components H. For example, the functional component storage section 51 is provided with a plurality of functional component magazines, each of which stores a plurality of functional components H so that they overlap, and a functional component elevation that adjusts the positions of the plurality of functional component magazines to deliver the functional components H. The functional component magazine is, for example, a so-called slit magazine in which a plurality of functional components H are held in slits at intervals from each other, but it may also be a so-called stack magazine in which a plurality of functional components H are held directly stacked on top of each other.

[0056] The functional component delivery section 53 delivers the functional components H received from the functional component storage section 51 to the second loader 70. For example, the functional component delivery section 53 is provided with a functional component index that receives and aligns the functional components H sent out by the functional component storage section 51, and a functional component pick-and-place that delivers the functional components H aligned by the functional component index.

[0057] In addition, the functional component supply unit 50 may further include a volume measuring unit that measures the volume of the functional component H, a weight measuring unit that measures the weight of the functional component H, a thickness measuring unit that measures the thickness of the functional component H, an appearance inspection unit that inspects the appearance of the functional component H, and a functional component preheating unit that preheats the functional component H.

[0058] The first loader 60 transports the workpiece W from the workpiece supply unit 10 to the resin molding units 20 and 30. The first loader 60 is configured to be movable along the first guide portion 60R. The first guide portion 60R extends in the left-right direction across the workpiece supply unit 10, the resin molding units 20 and 30, the resin supply unit 40, and the molded product recovery unit 90. The first guide portion 60R corresponds to an example of a "first transport path" according to the present invention. When viewed from above as shown in FIG. 1, the first guide portion 60R is provided, for example, behind the molds 21 and 31 and in front of the resin supply portion 41. In the configuration example shown in FIG. 1, the first loader 60 transports the molded product M from the resin molding units 20 and 30 to the molded product recovery unit 90.

[0059] As shown in FIG. 2, the first loader 60 includes a first loader hand 61, a first base 62, and a first guide rod 63.

[0060] The first loader hand 61 has a holding mechanism for the workpiece W or the molded product M. The first loader hand 61 is configured to be movable forward and backward relative to the die 21. The first base 62 is connected to the first guide portion 60R so as to be movable in the left-right direction, and movement in the front-rear direction is restricted.

[0061] The first base 62 supports the first loader hand 61 via a first guide rod 63. In a plan view, the first guide rod 63 extends and retracts from a point where it is connected to the first base 62. As a result, the first guide rod 63 moves the first loader hand 61 in the front-rear direction.

[0062] As an example, after the first loader hand 61 receives the workpiece W at the workpiece transfer section 13, it is transported rightward by the first base 62 and moves to the rear of the die 21. Next, the first loader hand 61 enters the die 21 from the rear by the extension and contraction of the first guide rod 63, and carries the workpiece W into the die 21. After delivering the workpiece W to the die 21, the first loader hand 61 retreats to the rear of the die 21 by the extension and contraction of the first guide rod 63. The first loader hand 61 carries out the molded product M from the die 21 by the same operation as when carrying in the workpiece W, is transported rightward by the first base 62, moves to the molded product receiving section 91, and hands over the molded product M.

[0063] The second loader 70 transports the resin R and the functional member H. The second loader 70 is configured to be movable along the second guide portion 70R. The second guide portion 70R is provided, for example, in the resin supply unit 40 and extends in the front-rear direction. The second guide portion 70R corresponds to an example of a "second transport path" according to the present invention. When viewed in a plan view as shown in FIG. 1, the second guide portion 70R intersects, for example, with the first guide portion 60R. In the configuration example shown in FIG. 1, the second loader 70 moves the resin R received from the resin supply portion 41 and the functional member H received from the functional member delivery portion 53 in the left-right direction to transport them into both the mold 21 and the mold 31.

[0064] The second loader 70 simultaneously transports, for example, both the resin R and the functional member H, but is not limited to this. One of the resin R and the functional member H may be transported first, and then the other may be transported.

[0065] As shown in FIG. 2, the second loader 70 includes a second loader hand 71, a second base 72, and a second guide rod 73.

[0066] The second loader hand 71 is provided with a holding mechanism for the resin R and the functional member H. Specifically, the second loader hand 71 is provided with a resin guard 77 as a frame surrounding the resin R. The second loader hand 71 may also be provided with a side rail, a chuck claw, or a suction mechanism as a holding mechanism for the functional member H. The second loader hand 71 is configured to be movable forward and backward relative to the mold 21. The second base 72 is connected to the second guide portion 70R so as to be movable in the front-rear direction, and movement in the left-right direction is restricted. Note that, for example, when the resin R is sufficiently fused to each other in the second loader hand 71 and there is a low possibility of it falling off, the resin guard 77 of the second loader hand 71 may be omitted.

[0067] The second base 72 supports the second loader hand 71 via a second guide rod 73. In plan view, the second guide rod 73 extends and retracts and rotates from a point where it is connected to the second base 72. As a result, the second guide rod 73 moves the second loader hand 71 in the front-rear or left-right directions, and also rotates the second loader hand 71 around the second base 72.

[0068] As an example, after receiving the resin R at the resin supply unit 41, the second loader hand 71 is transported forward by the second base 72 and moves to a position P1 in front of the first guide unit 60R. Next, the second loader hand 71 moves to a position P2 behind the functional member delivery unit 53 by the rotation of the second guide rod 73. Next, the second loader hand 71 moves to the functional member delivery unit 53 by the extension and contraction of the second guide rod 73, receives the functional member H, and returns to the position P2. Next, the second loader hand 71 moves to a position P3 on the right side of the mold 21 by the rotation of the second guide rod 73. Next, the second loader hand 71 enters the mold 21 from the right by the extension and contraction of the second guide rod 73, and carries the resin R and the functional member H into the mold 21. After delivering the resin R and the functional component H to the mold 21, the second loader hand 71 retreats to the right of the mold 21 due to the extension and contraction of the second guide rod 73.

[0069] For example, the second loader hand 71 receives the resin R and then the functional component H, and carries both of them into the mold 21 at the same time, but this is not limited to the above. The second loader hand 71 may receive the functional component H and then the resin R. The second loader hand 71 may also carry one of the resin R and the functional component H into the mold 21 and then the other.

[0070] In this way, if the second loader hand 71 moves to the functional member delivery section 53 by the extension and contraction of the second guide rod 73, the functional member supply unit 50 can be inserted and removed without extending the second guide section 70R to the functional member supply unit 50.

[0071] It should be noted that the mechanism for rotating the second guide rod 73 may be omitted in the second loader 70. In this case, for example, the second guide portion 70R extends in the front-rear direction from the resin supply unit 40 to the functional member supply unit 50, and the second loader hand 71 moves to the resin supply portion 41 and the functional member delivery portion 53 by the second base 72.

[0072] The first loader 60 and the second loader 70 operate in the same manner as they operate in the mold 21 of the resin molding unit 20 with respect to the mold 31 of the resin molding unit 30. Therefore, a description of the operations of the first loader 60 and the second loader 70 with respect to the mold 31 will be omitted. However, the operation of the second loader 70 with respect to the mold 31 is a left-right inverted operation of the operation of the second loader 70 with respect to the mold 21.

[0073] Next, the transport and loading of the resin R and the functional component H by the second loader hand 71 will be described with reference to Fig. 4 to Fig. 6. Fig. 4 is a cross-sectional view that shows a schematic of the second loader to which the resin has been supplied. Fig. 5 is a cross-sectional view that shows a schematic of the second loader to which a heat sink has been supplied. Fig. 6 is a cross-sectional view that shows a schematic of the mold before clamping.

[0074] 4, in the resin supply unit 41, the resin R is stored in a hopper 42, and is sent from the hopper 42 to a second loader hand 71 by a feeder 43. The second loader hand 71 receives the resin R on a plate-shaped pressing member 75. In an area surrounded by a resin guard 77, the resin R is leveled to a substantially uniform height by a vibration unit (not shown) or the like.

[0075] Next, as shown in Fig. 5, the functional member H is placed on the resin R. The granules of the resin R are preheated by a preheating unit (not shown) and are fixed to each other. The granules of the resin R are fused together by preheating, for example, but may be compressed by applying pressure. The functional member H may be fixed to the resin R, or may be placed so as to be detachable.

[0076] Next, as shown in FIG. 6, the resin R and the functional member H are carried into the mold 21. The second loader hand 71 that has entered the mold 21 raises the pressing member 75 by the telescopic mechanism 76. This causes the functional member H to be pressed against the cavity piece 23B via the film F. The functional member H is adsorbed by the suction path 23G through the through hole T of the film F. If the resin R is not fixed to the functional member H when the second loader hand 71 enters the mold 21, the functional member H and the resin R may be heated by the heater of the upper mold 23 when the pressing member 75 is pressed, and the resin R may be fused to the functional member H adsorbed to the upper mold 23. At this time, the upper mold 23 is heated to an appropriate set temperature, for example, in a temperature range of 100° C. to 200° C., so that the resin R can be easily fused to the functional member H.

[0077] It is preferable that the first loader hand 61 loads the work W into the die 21 after the resin R and the functional member H have been loaded. It is even more preferable that the first loader hand 61 advances into the die 21 while cleaning the die surface of the lower die 22 when loading the work W. This makes it possible to prevent the generation of defective products caused by dust or the like that falls off when the resin R and the functional member H are loaded.

[0078] As described above, in the resin sealing apparatus 1 according to one embodiment of the present invention, the work supply unit 10, the resin molding units 20, 30, and the resin supply unit 40 are arranged side by side in the left-right direction in the planar layout of the resin sealing apparatus 1, and the functional member supply unit 50 is adjacent to the front of the resin supply unit 40 in the planar layout of the resin sealing apparatus 1. In addition, the first guide part 60R corresponding to the transport path of the first loader 60 and the second guide part 70R corresponding to the transport path of the second loader 70 are different.

[0079] According to this, the second loader 70 which transports at least one of the resin R and the functional component H has a transport path different from that of the first loader 60 which transports the workpiece W, so that the degree of freedom of layout can be improved compared to a conventional configuration which is based on the premise that the workpiece, resin and functional component are transported using a common transport path. Also, since the functional component supply unit 50 is adjacent to the resin supply unit 40 in the front-rear direction in the planar layout, for example, the functional component supply unit 50 can be easily attached and detached, so that the handling of the resin sealing apparatus 1 can be improved.

[0080] In the above embodiment, the first guide portion 60R and the second guide portion 70R in the planar layout of the resin sealing device 1 intersect with each other.

[0081] According to this, since most of the transport path of the resin R and the transport path of the workpiece W are largely separated in the planar layout, it is possible to prevent the transport path of the workpiece W from being contaminated by dust generated during the transport of the resin R. Therefore, it is possible to suppress the occurrence of defective products caused by the adhesion of dust to the workpiece W.

[0082] In the above embodiment, the resin supplying unit 40 is provided between the resin molding unit 20 and the resin molding unit 30 .

[0083] According to this, the supply of the resin R to the two resin molding units 20 and 30 can be performed by one resin supply unit 40, so that the resin sealing apparatus 1 can be made compact.

[0084] Either the resin molding unit 20 or the resin molding unit 30 may be omitted. That is, only one resin molding unit may be provided, and one resin supply unit may supply resin to one resin molding unit. Also, three or more resin molding units may be provided. In this case, two or more resin supply units may be provided. For example, two resin molding units and a resin supply unit provided between the two resin molding units and supplying resin to the two resin molding units may be regarded as one unit group, and a plurality of unit groups may be arranged side by side in the left-right direction.

[0085] The first loader 60 according to the present embodiment functions as a work loader that loads the work W into the molds 21 and 31, and also functions as a molded product unloader that unloads the molded product M from the molds 21 and 31, but the function of the first loader 60 may be limited to the work loader. That is, the resin sealing apparatus may further include a third loader as a molded product unloader. Such a third loader may share a transport path with the first loader, for example, and be configured to be movable along the first guide section. In addition, the resin sealing apparatus may further include a third guide section for transporting the third loader.

[0086] In this embodiment, the work W and the molded product M are transported between the units by the first loader 60, but this is not limited thereto. For example, the work preheating section and the molded product receiving section may be configured to be movable left and right along the first guide section. Specifically, the work preheating section may transport the work from the work supply unit to the resin molding unit and hand over the work to a loader provided in the resin molding unit. Also, the molded product receiving section may receive the molded product from the loader in the resin supply unit and transport the molded product from the resin molding unit to the molded product recovery unit. When the resin sealing device includes multiple resin molding units, such a loader may be provided in each of the multiple resin molding units.

[0087] In this embodiment, the second loader hand 71 moves between the positions P1 to P3 by rotating, but the second loader hand 71 may be configured not to rotate. For example, if the second loader hand is movable in two directions, the front-rear direction and the left-right direction, the second loader hand does not have to move between the positions P1 to P3 by rotating. Also, for example, if the second loader hand can move to the resin supply section and the functional member supply section only by moving the second base in the front-rear direction along the second guide section, the second guide rod does not have to be configured to be rotatable as long as it can extend and contract in the left-right direction.

[0088] In this embodiment, both the resin R and the functional member H are held by the second loader hand 71, and the resin R and the functional member H are simultaneously carried into the mold 21 and delivered to the upper mold 23, but this is not limited thereto. For example, the resin and the functional member may be held separately and independently by the same loader hand and delivered into the mold, the functional member may be adsorbed to the upper mold, and then the resin may be fused to the functional member. That is, the functional member and the resin may be delivered to the mold in this order when one loader hand advances or retreats into the mold. Also, the functional member may be held by the loader hand and delivered into the mold, the functional member may be adsorbed to the upper mold, and then the loader hand may be withdrawn from the mold once, the resin may be held by the loader hand and delivered into the mold, and then the resin may be fused to the functional member. That is, the functional member may be delivered to the mold when one loader hand advances or retreats into the mold for the first time, and the resin may be delivered to the mold when one loader hand advances or retreats into the mold for the second time. In addition, the functional component may be held by a first loader hand and carried into the mold, the functional component may be adsorbed onto the upper mold, and then the resin may be held by a second loader hand and carried into the mold, and the resin may be fused to the functional component.

[0089] The resin molding units 20 and 30 according to the present embodiment are compression molding units having a compression molding die with a movable cavity structure, but the resin molding units are not limited to this. The resin molding units according to the present invention may be transfer molding units having a transfer molding die.

[0090] The configuration of a resin sealing device according to another embodiment of the present invention will be described below. In the following embodiment, matters common to the first embodiment will be omitted, and only the differences will be described. In particular, similar effects due to similar configurations will not be mentioned one by one.

[0091] <Second embodiment> The configuration of a resin sealing apparatus 2 according to the second embodiment will be described with reference to Fig. 7. Fig. 7 is a plan view that illustrates a schematic configuration of the resin sealing apparatus according to the second embodiment.

[0092] When viewed from above as shown in FIG. 7, the functional member supply unit 50 is connected to the rear side of the resin supply unit 40. In other words, the functional member supply unit 50 is disposed on the rear side of the resin sealing apparatus 1. Here, the rear side of the resin sealing apparatus 1 is the opposite side in the front-rear direction to the side where the work supply control panel 19 and the resin molding control panels 29, 39 are disposed. The functional member supply unit 50 is disposed on the same side in the front-rear direction as the resin supply section 41 when viewed from the first guide section 60R. Specifically, both the functional member supply unit 50 and the resin supply section 41 are located behind the first guide section 60R. The resin supply section 41 is provided between the functional member supply unit 50 and the first guide section 60R. Note that both the functional member supply unit and the resin supply section may be located in front of the first guide section 60R.

[0093] <Third embodiment> The configuration of a mold 221 according to the third embodiment will be described with reference to Fig. 8. Fig. 8 is a cross-sectional view that illustrates the configuration of the mold according to the third embodiment.

[0094] The mold 221 is a compression molding mold having a so-called lower cavity movable structure in which a cavity 25 is formed on the lower mold 222 side of the upper mold 223. When the mold 221 has a lower cavity movable structure, the work W is set in the upper mold 223, and the resin R and the functional member H are set in the lower mold 222. The functional member H to be carried into the mold 221 is provided below the resin R. Therefore, the second loader 70 receives the functional member H in the functional member supply unit 50, for example, and receives the resin R on top of the functional member H in the resin supply unit 40. However, the second loader 70 may receive the resin R in the resin supply unit 40, and receive the functional member H on top of the resin R in the functional member supply unit 50. In this case, the second loader 70 may include a mechanism for upsetting the resin R and the functional member H upside down, for example.

[0095] <Fourth embodiment> The configuration of a resin sealing apparatus 4 according to the fourth embodiment will be described with reference to Fig. 9. Fig. 9 is a plan view that illustrates a schematic configuration of the resin sealing apparatus according to the fourth embodiment.

[0096] The resin sealing apparatus 4 further includes a sheet resin supply unit 80. The sheet resin supply unit 80 supplies a sheet-shaped resin (hereinafter referred to as "sheet resin SR") to be molded in the resin molding units 20 and 30. The sheet resin supply unit 80 includes a sheet resin storage section 81 and a sheet resin delivery section 83. The sheet resin SR corresponds to an example of a first resin, and the sheet resin supply unit 80 corresponds to an example of a first resin supply unit. The resin R supplied from the resin supply unit 40 corresponds to an example of a second resin, and the resin supply unit 40 corresponds to an example of a second resin supply unit.

[0097] The sheet resin storage unit 81 stores a plurality of sheet resins SR and sequentially delivers the sheet resins SR. For example, the sheet resin storage unit 81 is provided with a plurality of sheet resin magazines, each of which stores a plurality of sheet resins SR so that they overlap, and a sheet resin elevation that adjusts the positions of the plurality of sheet resin magazines to deliver the sheet resin SR. In the sheet resin magazine, the plurality of sheet resins SR may be stored with a gap between them, or may be directly stacked on top of each other and held.

[0098] The sheet resin delivery unit 83 delivers the sheet resin SR received from the sheet resin storage unit 81 to the second loader 70. For example, the sheet resin delivery unit 83 is provided with a sheet resin index that receives and aligns the sheet resin SR sent out by the sheet resin storage unit 81, and a sheet resin pick and place that delivers the sheet resin SR aligned by the sheet resin index.

[0099] The sheet resin storage unit 81 may have a roll stocker that stores rolls of wound long sheet resin. The sheet resin delivery unit 83 may have a sheet delivery unit that delivers the long sheet resin from the roll resin, a sheet cutter that cuts out the sheet resin SR from the long sheet resin, and a scrap collection unit that collects scraps generated when the sheet resin SR is cut out.

[0100] In addition, the sheet resin supply unit 80 may further include a film peeling section that peels off a protective film from the sheet resin SR, a volume measuring section that measures the volume of the sheet resin SR, a weight measuring section that measures the weight of the sheet resin SR, a thickness measuring section that measures the thickness of the sheet resin SR, an appearance inspection section that inspects the appearance of the sheet resin SR, and a resin preheating section that preheats the sheet resin SR.

[0101] 9, the resin supplying unit 40, the functional member supplying unit 50, and the sheet resin supplying unit 80 are arranged side by side in the front-rear direction. For example, the sheet resin supplying unit 80 is located between the resin supplying unit 40 and the functional member supplying unit 50, and is adjacent to both the resin supplying unit 40 and the functional member supplying unit 50 in the front-rear direction.

[0102] According to this, the position of the sheet resin supply unit 80 is not limited to a position aligned with the workpiece supply unit 10 and the resin molding units 20, 30 in the left-right direction, thereby improving the degree of freedom in layout.

[0103] For example, both the sheet resin SR and the resin R are transported by the second loader 70 to the resin molding units 20, 30 and molded by the resin molding units 20, 30.

[0104] According to this, the sheet resin SR, the resin R, and the functional components H can all be transported by the second loader 70, so that the resin sealing apparatus can be prevented from becoming complicated due to the addition of an additional loader.

[0105] For example, the sheet resin SR and the resin R are resins of the same composition but in different shapes.

[0106] According to this, by adjusting the supply amount of the resin R, the total supply amount of the resin supplied to the resin molding units 20, 30 can be adjusted without adjusting the shape or size of the sheet resin SR. Therefore, even if the state of the workpiece W changes due to a missing electronic component P or the like, the state of the workpiece W is measured, and the supply amount or supply position of the resin R supplied from the resin supply unit 40 is adjusted based on the measurement result, so that the variation in the thickness of the molded product M can be suppressed. However, it is preferable that the resin R is granular, powdery, or liquid. According to this, the adjustment accuracy of the supply amount or supply position of the resin R can be improved compared to the case where the resin R is a resin having a large dimension per piece such as a sheet resin. Also, compared to the case where only the resin R is supplied and molded, the supply amount of the resin R per time is reduced by the supply amount of the sheet resin SR. Therefore, the productivity can be improved by reducing the frequency of refilling the resin R to the resin supply unit 41.

[0107] In this embodiment, the sheet resin supply unit 80 is located behind the resin supply unit 40 and in front of the functional member supply unit 50, but the position of the sheet resin supply unit 80 is not limited thereto. The sheet resin supply unit 80 is disposed in front or behind an area including the work supply unit 10 and the resin molding units 20, 30 and extending in the left-right direction.

[0108] For example, when the sheet resin SR is transported by the second loader 70, it is desirable that the sheet resin supply unit 80 is adjacent to at least one of the resin supply unit 40 and the functional member supply unit 50 in the front-rear direction. In a planar layout, the sheet resin supply unit 80 may be disposed behind the functional member supply unit 50, or may be disposed in front of the resin supply unit 40. In addition, when the functional member supply unit 50 is disposed in front of the resin supply unit 40, the sheet resin supply unit 80 may be disposed between the resin supply unit 40 and the functional member supply unit 50, may be disposed in front of the functional member supply unit 50, or may be disposed behind the resin supply unit 40.

[0109] The sheet resin SR may be transported by the first loader 60, and the resin sealing apparatus may further include a loader for transporting the sheet resin SR. In these cases, in the planar layout, the sheet resin supply unit 80 is arranged in the front-rear direction with respect to a region including the work supply unit 10 and the resin molding units 20, 30 and extending in the left-right direction. For example, the sheet resin supply unit 80 may be adjacent to the resin molding units 20, 30, the work supply unit 10, or the molded product recovery unit 90 in the front-rear direction. When the work W and the sheet resin SR are transported by the first loader 60, the first loader 60 may transport the work W and the sheet resin SR to the resin molding units 20, 30 in random order, or may transport them to the resin molding units 20, 30 at the same time. When the first loader 60 transports the work W and the sheet resin SR at the same time, the first loader 60 may hold the work W and the sheet resin SR at an interval from each other, or may hold the work W and the sheet resin SR by stacking them directly.

[0110] In this embodiment, the sheet resin SR and the resin R are provided by resins of the same composition but different shapes, but are not limited thereto. The sheet resin SR and the resin R may be resins of the same shape but different compositions, or may be resins of different compositions and shapes. For example, from the viewpoint of suppressing the occurrence of defects due to voids, a low-viscosity resin that easily penetrates into the details of the workpiece W may be supplied to the side closer to the workpiece W. In addition, in the resin sealing device according to this embodiment, from the viewpoint of improving the airtightness and mechanical strength of the molded product M, or from the viewpoint of suppressing damage to the workpiece W due to heat and pressure in the resin sealing process, different types of resins whose curing conditions or physical properties of the cured product change when cured together may be supplied from the sheet resin supply unit 80 and the resin supply unit 40.

[0111] In this embodiment, the second loader 70 may transport the sheet resin SR, the resin R, and the functional member H to the resin molding units 20, 30 in random order, or may transport them to the resin molding units 20, 30 at the same time. For example, the second loader 70 transports the resin R on the sheet resin SR. In a resin sealing apparatus in which the second loader 70 transports the sheet resin SR and the resin R at the same time, the production speed of the molded product M is improved compared to a resin sealing apparatus in which the second loader 70 transports them separately. In addition, from the viewpoint of suppressing internal contamination of the resin sealing apparatus due to scattering of the resin R during transportation and a decrease in the amount of resin actually used for molding, the resin R may be transported in a state fused to the sheet resin SR by preheating. When the resin R is fused to the sheet resin SR, it is possible to suppress the position of the resin R relative to the sheet resin SR from changing during transportation, so that the positional accuracy of the resin R can be improved.

[0112] When the resin sealing apparatus includes the sheet resin supply unit 80, the resin supply unit 40 may be omitted. That is, the resin sealing apparatus according to one embodiment of the present invention may mold only the sheet resin SR supplied from the sheet resin supply unit 80 to resin seal the electronic components P of the workpiece W. In this case, the functional member supply unit 50 may be omitted together with the resin supply unit 40.

[0113] The resin sealing apparatus may include a composite material supplying unit that supplies a composite material obtained by fusing a sheet resin SR to a functional material H, instead of the functional material supplying unit 50 and the sheet resin supplying unit 80. The composite material supplying unit is disposed, for example, in front of or behind the resin supplying unit 40, and the composite material is transported by the second loader 70. However, the location of the composite material supplying unit is not limited to this. The composite material supplying unit may be disposed in front of or behind the work supplying unit 10, the resin molding units 20, 30, or the molded product recovery unit 90, etc. The composite material may be transported by the first loader 60, and the resin sealing apparatus may further include a loader that transports the composite material.

[0114] In the embodiment in which the resin sealing apparatus includes the composite member supplying unit, the resin sealing apparatus can be made smaller and simpler than in the embodiment in which the resin sealing apparatus includes the functional member supplying unit 50 and the sheet resin supplying unit 80 .

[0115] As described above, according to one aspect of the present invention, the degree of freedom in layout is improved and handling of the resin sealing device is improved.

[0116] The above-described embodiments are intended to facilitate understanding of the present invention, and are not intended to limit the present invention. The elements of the embodiments, as well as their arrangements, materials, conditions, shapes, sizes, etc., are not limited to those shown as examples and can be changed as appropriate. In addition, configurations shown in different embodiments can be partially substituted or combined with each other. [Explanation of symbols]

[0117] 1...Resin sealing equipment 10...Work supply unit 11...Work storage section 13...Work receiving and delivering section 15…Work preheating section 19…Work supply control panel 20, 30...Resin molding unit 21,31…Mold 25,35…Cavity 27,37…Film handler 29,39…Resin molded control panel 40…Resin supply unit 41…Resin supply section 50…Functional material supply unit 51...Functional component storage section 53…Functional material delivery section 60…First loader 60R…First guide section 61…First loader hand 62…First base 63…First guide rod 70…Second loader 70R…Second guide section 71…2nd Loader Hand 72…Second base 73…Second guide rod 77…Resin guard 80…Sheet resin supply unit 81…Sheet resin storage section 83...Sheet resin delivery section 90…Molded product recovery unit 91…Molded product receiving section 93…Molded product delivery department 95…Molded product storage section W…Work P…Electronic parts S...Base material R…Resin H…Functional material F…Film SR: Sheet resin

Claims

1. A resin sealing apparatus that melts a resin on a workpiece including a substrate and an electronic component to resin-seal the electronic component, A work supply unit that supplies the work; A resin supply unit for supplying the resin; a functional member supplying unit for supplying a functional member; a resin molding unit that molds the resin onto the workpiece and the functional component; a first loader that transports the workpiece supplied from the workpiece supply unit; a second loader for transporting at least one of the resin and the functional member, the second loader having a transport path different from that of the first loader; Equipped with the work supply unit, the resin molding unit, and the resin supply unit are arranged side by side in a first direction in a planar layout of the resin sealing apparatus, the functional member supplying unit is adjacent to the resin supplying unit in a second direction intersecting the first direction in the planar layout; Resin sealing equipment.

2. the first loader has a first transport path extending along the first direction, The second loader has a second transport path extending along the second direction. The resin sealing apparatus according to claim 1 .

3. the resin molding unit has a mold for resin-sealing the electronic component, The first loader has a first loader hand that carries the workpiece into the die, the second loader has a second loader hand that carries at least one of the resin and the functional member into the mold, the first loader hand is configured to be movable toward and away from the mold along the second direction, The second loader hand is configured to be movable toward and away from the mold along the first direction. The resin sealing apparatus according to claim 2 .

4. the resin molding unit includes a first resin molding unit and a second resin molding unit, the first resin molding unit and the second resin molding unit are arranged side by side in the first direction, The resin supply unit is provided between the first resin molding unit and the second resin molding unit. The resin sealing apparatus according to claim 2 .

5. the resin supply unit has a resin supply section that supplies the resin to the second loader, In a planar layout of the resin sealing apparatus, the functional member supply unit is disposed on an opposite side to the resin supply unit as viewed from the first transport path. The resin sealing apparatus according to claim 2 .

6. the resin supply unit has a resin supply section that supplies the resin to the second loader, In a planar layout of the resin sealing apparatus, the functional member supply unit is disposed on the same side as the resin supply unit when viewed from the first transport path. The resin sealing apparatus according to claim 2 .

7. In a planar layout of the resin sealing apparatus, the functional component supply unit is disposed on a front side of the resin sealing apparatus. The resin sealing apparatus according to claim 1 .

8. The functional member supply unit is disposed on the rear side of the resin sealing apparatus. The resin sealing apparatus according to claim 1 .

9. The second loader receives the resin at the resin supply unit, and receives the functional member on the resin at the functional member supply unit. The resin sealing apparatus according to claim 1 .

10. The second loader receives the functional member at the functional member supply unit, and receives the resin on the functional member at the resin supply unit. The resin sealing apparatus according to claim 1 .

11. A resin sealing apparatus that melts a resin on a workpiece including a substrate and an electronic component to resin-seal the electronic component, A work supply unit that supplies the work; a first resin supply unit that supplies a sheet-shaped first resin; a resin molding unit that molds the first resin onto the workpiece; a first loader that transports the workpiece supplied from the workpiece supply unit; a second loader for transporting the first resin, the second loader having a transport path different from that of the first loader; Equipped with the work supply unit and the resin molding unit are arranged side by side in a first direction in a planar layout of the resin sealing apparatus, the first resin supply unit is disposed in a second direction intersecting the first direction with respect to a region that includes the work supply unit and the resin molding unit and extends in the first direction in the planar layout; Resin sealing equipment.

12. Further comprising a second resin supply unit that supplies a second resin, The resin molding unit molds the second resin together with the first resin onto the workpiece, the work supply unit, the resin molding unit, and the second resin supply unit are arranged side by side in the first direction in the planar layout, the first resin supply unit is disposed in the second direction in the planar layout with respect to the second resin supply unit; The resin sealing apparatus according to claim 11.

13. The second resin is in a granular, powdered or liquid form. The resin sealing apparatus according to claim 12.

14. the second loader transports the first resin and the second resin that have been fused to each other by preheating; The resin sealing apparatus according to claim 12.

15. A functional member supply unit for supplying a functional member is further provided. the first resin supply unit, the second resin supply unit, and the functional member supply unit are arranged side by side in the second direction in the planar layout. The resin sealing apparatus according to any one of claims 12 to 14.

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