Power semiconductor package signal connection components and semiconductor modules

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The power semiconductor package signal connection component with a continuous protruding pattern addresses solder flow issues by increasing thickness and reducing stress, enhancing structural reliability in semiconductor modules.

JP7603745B2Active Publication Date: 2024-12-20ACTRON TECH

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Patent Information

Application Number: JP2023088681
Authority / Receiving Office: JP · JP
Patent Type: Patents
Current Assignee / Owner
Priority Date: 2023-02-09
Filing Date: 2023-05-30
Publication Date: 2024-12-20
Estimated Expiration: 2043-05-30

AI Technical Summary

Technical Problem

Conventional power semiconductor package signal connections experience issues with solder flow into the cylinder, leading to obstructed electrical connections and low reliability due to a flat contact surface.

Method used

A power semiconductor package signal connection component with a continuous protruding pattern on bases, forming an uneven surface to increase solder thickness and prevent solder entry into the cylinder, enhancing structural reliability.

Benefits of technology

The uneven surface design effectively increases solder thickness and reduces stress, improving the structural reliability of the semiconductor module by preventing solder intrusion into the cylinder.

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Abstract

To provide a power semiconductor package signal connection component that includes a continuous protruding pattern and can effectively increase the thickness of a solder in a subsequent application.SOLUTION: A power semiconductor package signal connection component includes: a cylinder 110 having a first through hole; and two bases 120, 130 respectively arranged on both sides of the cylinder 110. Each of the bases includes a continuous protruding pattern 122... and further includes a flat surface 121..., a curved surface 123..., and a second through hole 125.... The flat surface is connected to the curved surface, and a first side E1 of the curved surface is connected to the cylinder 110. The second through hole penetrates the curved surface and communicates with the first through hole. The continuous protruding pattern 122... is connected to a second side E2... of the curved surface 123... and is located on the flat surface 121....SELECTED DRAWING: Figure 2A

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Description

[Technical field]

[0001] The present invention relates to a power semiconductor package signal connection component and a semiconductor module, and more particularly to a power semiconductor package signal connection component having a continuous protruding pattern and a semiconductor module using the power semiconductor package signal connection component. [Background technology]

[0002] Power modules typically use connection components to connect signals between the laminate substrate (such as a direct bonded copper (DBC) substrate) and press-fit pins. Conventional connection components are connected to the laminate substrate by soldering. Because the surface of the connection component that comes into contact with the solder is a completely flat surface, the solder tends to flow into the cylinder of the connection component when pressed. Furthermore, if the thickness of the solder is insufficient, the electrical connection between the external terminal and the laminate substrate through the cylinder is hindered, resulting in a problem of low reliability. Summary of the Invention [Problem to be solved by the invention]

[0003] The present invention provides a power semiconductor package signal connection component which includes a continuous protruding pattern and can effectively increase the solder thickness in subsequent applications.

[0004] The present invention also provides a semiconductor module including the above-mentioned power semiconductor package signal connection component, which can increase the thickness of the solder and has better structural reliability. [Means for solving the problem]

[0005] The power semiconductor package signal connection component of the present invention includes a cylinder having a first through hole and two bases arranged on both sides of the cylinder. Each base includes a continuous protruding pattern and has a flat surface, a curved surface, and a second through hole. The flat surface is connected to the curved surface, and a first side of the curved surface is connected to the cylinder. The second through hole penetrates the curved surface and communicates with the first through hole. The continuous protruding pattern is connected to the second side of the curved surface and is located on the flat surface.

[0006] In one embodiment of the present invention, the above-mentioned continuous protruding pattern includes a plurality of protruding portions and a plurality of connecting portions, the protruding portions and the connecting portions being alternately connected to form a continuous pattern.

[0007] In one embodiment of the present invention, the protrusions of the continuous protrusion pattern of each base and the periphery of each base are are spaced apart.

[0008] In one embodiment of the present invention, the protrusions of the above-mentioned continuous protrusion pattern of each base are connected to the periphery of each base.

[0009] In one embodiment of the present invention, the side of the continuous protruding pattern away from the curved surface presents an arcuate contour.

[0010] In one embodiment of the present invention, the extension direction of the cylinder is perpendicular to the extension direction of each base portion.

[0011] In one embodiment of the invention, the periphery of each of the above-mentioned bases and the periphery of the cylinder are separated by a horizontal distance.

[0012] In one embodiment of the invention, there is a height difference between the first and second sides of the curved surface.

[0013] The semiconductor module of the present invention includes a laminated substrate having a contact surface, a power semiconductor package signal connection component arranged on the contact surface of the laminated substrate and including a cylinder and two bases, and a solder. The cylinder has a first through hole. The bases are arranged on both sides of the cylinder. Each base includes a continuous protruding pattern and has a flat surface, a curved surface, and a second through hole. The flat surface is connected to the curved surface, and a first side of the curved surface is connected to the cylinder. The second through hole penetrates the curved surface and communicates with the first through hole. The continuous protruding pattern is connected to the second side of the curved surface and is located on the flat surface. The solder is arranged between one of the two bases of the power semiconductor package signal connection component and the laminated substrate. The continuous protruding pattern of one of the two bases is in direct contact with the solder, and the continuous protruding pattern and the laminated substrate are arranged at a distance from each other.

[0014] In one embodiment of the present invention, the laminated substrate includes an insulating layer, a wiring layer, and a metal layer. The insulating layer has a first surface and a second surface facing each other. The wiring layer is disposed on the first surface of the insulating layer and has a contact surface. The metal layer is disposed on the second surface of the insulating layer. Effect of the Invention

[0015] Based on the above, in the power semiconductor package signal connection component of the present invention, the base includes a continuous protruding pattern. The continuous protruding pattern is connected to a curved surface and located on a flat surface. That is, due to the arrangement of the continuous protruding pattern and the flat surface, the base can have an internally convex and externally concave concave plane. Therefore, in subsequent applications, when the solder is arranged between the base of the power semiconductor package signal connection component and the laminated substrate, the concave-convex plane not only increases the thickness of the solder between the power semiconductor package signal connection component and the laminated substrate, but also reduces / avoids the solder from entering the cylinder, and reduces the stress on the solder. Therefore, the power semiconductor package signal connection component of the present invention can effectively increase the thickness of the solder in subsequent applications, and the semiconductor module using the power semiconductor package signal connection component of the present invention can have better structural reliability.

[0016] In order to make the above mentioned features and advantages of the present invention clearer and easier to understand, specific embodiments are shown and described in detail below with reference to the accompanying drawings. [Brief description of the drawings]

[0017] [Figure 1] 1 is a schematic cross-sectional view of a semiconductor module according to an embodiment of the present invention; [Figure 2A] FIG. 2 is a schematic perspective view of a power semiconductor package signal connection component of FIG. 1. [Figure 2B] FIG. 2B is a schematic top view of the power semiconductor package signal connection components of FIG. 2A. [Figure 2C] FIG. 2B is a schematic bottom view of the power semiconductor package signal connection component of FIG. 2A. [Diagram 3] FIG. 2 is a schematic top view of a power semiconductor package signal connection component according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0018] Fig. 1 is a schematic cross-sectional view of a semiconductor module according to an embodiment of the present invention. Fig. 2A is a schematic perspective view of the power semiconductor package signal connection component of Fig. 1. Fig. 2B is a schematic top view of the power semiconductor package signal connection component of Fig. 2A. Fig. 2C is a schematic bottom view of the power semiconductor package signal connection component. The cross-sectional view of the power semiconductor package signal connection component of Fig. 1 is taken along line II of Fig. 2A.

[0019] First, please refer to Fig. 1. In this embodiment, the semiconductor module 10 includes a laminated substrate 200, a power semiconductor package signal connection component 100a, and a solder 300. The power semiconductor package signal connection component 100a is disposed on a contact surface 221 of the laminated substrate 200, and the solder 300 is disposed between the power semiconductor package signal connection component 100a and the laminated substrate 200.

[0020] In detail, the semiconductor module 10 of the present embodiment is, for example, a power module, but is not limited thereto. As shown in FIG. 1, the laminated substrate 200 of the present embodiment includes an insulating layer 210, a wiring layer 220, and a metal layer 230. The insulating layer 210 has a first surface 211 and a second surface 213 facing each other. The wiring layer 220 is disposed on the first surface 211 of the insulating layer 210, and has a contact surface 221. The metal layer 230 is disposed on the second surface 213 of the insulating layer 210. Here, the laminated substrate 200 may be, for example, a direct bonding copper (DBC) substrate, but is not limited thereto. In one embodiment, the insulating layer 210 may be replaced with a ceramic substrate.

[0021] Next, please refer to FIG. 1 and FIG. 2A at the same time. The power semiconductor package signal connection component 100a of this embodiment includes a cylinder 110 and two bases 120, 130. The cylinder 110 has a first through hole 115, which means that the cylinder 110 is embodied as a hollow cylinder. The bases 120, 130 are respectively connected to both sides of the cylinder 110. As shown in FIG. 2A, the extension direction L1 of the cylinder 110 is approximately perpendicular to the extension direction L2 of the bases 120, 130. The shape of the bases 120, 130 is, for example, a disk shape. The periphery S2 of the base 120 and the periphery S1 of the cylinder 110 are separated by a horizontal distance D1, and the periphery S3 of the base 130 and the periphery S1 of the cylinder 110 are separated by a horizontal distance D2. That is, the shape of the cylinder 110 and the bases 120, 130 in this embodiment is, for example, an I-shape. The material of the power semiconductor package signal connection component 100a is, for example, a metal or alloy such as copper or a copper alloy, but is not limited to this.

[0022] Further, please refer to FIG. 1, FIG. 2A and FIG. 2B at the same time. The base 120 of this embodiment includes a continuous protruding pattern 122, and has a flat surface 121, a curved surface 123 and a second through hole 125. The flat surface 121 is connected to the curved surface 123, and the first side E1 of the curved surface 123 is connected to the cylinder 110. The second through hole 125 penetrates the curved surface 123 and communicates with the first through hole 115. The continuous protruding pattern 122 is connected to the second side E2 of the curved surface 123 and is located on the flat surface 121, which means that the continuous protruding pattern 122 and the plane 121 can form a concave-convex surface. Furthermore, in this embodiment, there is a height difference H1 between the first side E1 and the second side E2 of the curved surface 123. The side of the continuous protruding pattern 122 away from the curved surface 123 has an arc-shaped outline like an arced hexagram, but is not limited thereto. The continuous protruding pattern 122 includes a plurality of protruding portions 124 and a plurality of connecting portions 126. The protruding portions 124 and the connecting portions 126 are alternately connected to form a continuous pattern. Here, the protruding portions 124 of the continuous protruding pattern 122 of the base 120 and the periphery S2 of the base 120 are arranged with a gap therebetween. In other words, since the edge of the protruding portion 124 does not contact the periphery S2 of the base 120, the continuous protruding pattern 122 approaches the second through hole 125, and the flat surface 121 without the continuous protruding pattern 122 approaches the periphery S2 of the base 120, forming an inner convex outer concave concave surface.

[0023] Similarly, please refer to FIG. 1 and FIG. 2C. The base 130 includes a continuous protruding pattern 132, and has a flat surface 131, a curved surface 133, and a second through hole 135. The flat surface 131 is connected to the curved surface 133, and the first side E3 of the curved surface 133 is connected to the cylinder 110. The second through hole 135 penetrates the curved surface 133 and communicates with the first through hole 115. The continuous protruding pattern 132 is connected to the second side E4 of the curved surface 133 and is located on the flat surface 131, which means that the continuous protruding pattern 132 and the flat surface 131 can form an uneven surface. Furthermore, in this embodiment, there is a height difference H2 between the first side E3 and the second side E4 of the curved surface 133. The side of the continuous protruding pattern 132 away from the curved surface 133 has an arc-shaped outline like an arced hexagram, but is not limited thereto. The continuous protruding pattern 132 includes a plurality of protruding portions 134 and a plurality of connecting portions 136. The protruding portions 134 and the connecting portions 136 are alternately connected to form a continuous pattern. Here, the protruding portions 134 of the continuous protruding pattern 132 of the base 130 and the periphery S3 of the base 130 are arranged with a gap therebetween. In other words, since the edge of the protruding portion 134 does not contact the periphery S3 of the base 130, the continuous protruding pattern 132 approaches the second through hole 135, and the flat surface 131 without the continuous protruding pattern 132 approaches the periphery S3 of the base 130, forming an inner convex outer concave concave surface.

[0024] Please refer to Fig. 1 again. The solder 300 is disposed between one of the two bases 120, 130 (for example, the base 130) of the power semiconductor package signal connection component 100a and the laminated substrate 200. The continuous protruding pattern 132 of the base 130 may be in direct contact with the solder, and the continuous protruding pattern 132 and the laminated substrate 200 are disposed at an interval. The continuous protruding pattern 132 and the flat surface 131 of this embodiment can form an uneven surface with an inner convex and an outer concave, so that when the continuous protruding pattern 132 of the base 130 contacts the solder 300, the thickness of the solder 300 between the flat surface 131 of the base 130 and the laminated substrate 200 can be increased. Furthermore, the design of the curved surface 133 having the height difference H2, the continuous protruding pattern 132, and the flat surface 131 can prevent / reduce the solder from entering the cylinder 110, thereby allowing the subsequent external terminal (not shown) to pass through the cylinder 110 and be electrically connected to the laminated substrate 200. Also, since the continuous protruding pattern 132 is close to (i.e., located inside) the second through hole 135, the stress that the solder 300 below the power semiconductor package signal connection component 100a receives can be reduced when the power semiconductor package signal connection component 100a is deformed by heat. This allows the semiconductor module 10 of this embodiment to have better structural reliability.

[0025] Here, it should be noted that in the following embodiments, some of the reference numerals of the components and contents of the previous embodiments are continued to be used, the same reference numerals are used to indicate the same or similar components, and the description of the same technical contents is omitted. For the description of the omitted parts, you can refer to the previous embodiments, and the details will not be repeated here.

[0026] FIG. 3 is a schematic top view of a power semiconductor package signal connection component according to an embodiment of the present invention. Please refer to FIG. 2B and FIG. 3 at the same time. The power semiconductor package signal connection component 100b of this embodiment is similar to the power semiconductor package signal connection component 100a of FIG. 2B. The difference between the two is that in this embodiment, the continuous protruding pattern 122' of the base 120' includes a plurality of protruding portions 124' and a plurality of connecting portions 126'. The protruding portions 124' and the connecting portions 126' are alternately connected to form a continuous pattern, and the protruding portions 124' are connected to the periphery S2' of the base 120'. That is, the continuous protruding pattern 122' of this embodiment occupies a larger area than the flat surface 121 without the continuous protruding pattern 122'. However, the continuous protruding pattern 122' is still close to the second through-hole 125, and the flat surface 121 without the continuous protruding pattern 122' is close to the peripheral edge S2' of the base 120, so that an inner convex and outer concave uneven surface is formed.

[0027] In summary, in the power semiconductor package signal connection component of the present invention, the base includes a continuous protruding pattern. The continuous protruding pattern is connected to a curved surface and located on a flat surface. That is, due to the arrangement of the continuous protruding pattern and the flat surface, the base can have an uneven surface with an inner convex and an outer concave. Therefore, when the solder is arranged between the base of the power semiconductor package signal connection component and the laminated substrate in the subsequent application, the uneven surface not only increases the thickness of the solder between the power semiconductor package signal connection component and the laminated substrate, but also reduces / avoids the solder from entering the cylinder, and reduces the stress on the solder. Therefore, the power semiconductor package signal connection component of the present invention can effectively increase the thickness of the solder in the subsequent application, and the semiconductor module using the power semiconductor package signal connection component of the present invention can have better structural reliability.

[0028] The present invention has been described above with reference to the embodiments, but these embodiments do not limit the present invention. Those skilled in the art can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of the present invention is defined by the appended claims. [Industrial Applicability]

[0029] The power semiconductor package signal connection component and semiconductor module of the present invention can increase the solder thickness, have better structural reliability, and can be applied in the field of power modules. [Explanation of symbols]

[0030] 10: Semiconductor Module 100a, 100b: Power semiconductor package signal connection parts 110: Cylinder 115: First through hole 120, 120', 130: base 121, 131: Flat surface 122, 122', 132: Continuous protruding pattern 123, 133: Curved surface 124, 124', 134: Protrusion 125, 135: second through hole 126, 126', 136: Connections 200: Multilayer board 210: Insulating layer 211: First Surface 213: Second Surface 220: Wiring layer 221: Contact surface 230: Metal layer 300: Solder D1, D2: horizontal distance E1, E3: First side E2, E4: Second side H1, H2: Height difference e L1, L2: Extending direction S1, S2, S2', S3: Periphery

Claims

1. a cylinder having a first through hole; two bases respectively disposed on both sides of the cylinder, each of the bases having a continuous protruding pattern, the base having a flat surface, a curved surface and a second through hole, the flat surface being connected to the curved surface, a first side of the curved surface being connected to the cylinder, the second through hole penetrating the curved surface and communicating with the first through hole, the continuous protruding pattern being connected to the second side of the curved surface and located on the flat surface, and the continuous protruding pattern presenting an outline of an arc hexagram; A power semiconductor package signal connection component comprising:

2. The continuous protruding pattern includes a plurality of protruding portions and a plurality of connecting portions, and the protruding portions and the connecting portions are alternately connected to form a continuous pattern.