Semiconductor Device

Abstract

The purpose of the present invention is to provide a technique that enables inhibiting of cracks that reach a semiconductor element. This semiconductor device comprises: a semiconductor element; a lead electrode terminal; a first encapsulation member; and an intervening member. The lead electrode terminal has an extension portion that is separated from the upper surface of the semiconductor element, and is joined to the semiconductor element. The first encapsulation member encapsulates the lead electrode terminal. The intervening member is provided between the semiconductor element and an end portion of the extension portion in the extension direction. The intervening member has an interface with respect to the first encapsulation member below the end portion.

Description

[Technical field]

[0001] The present disclosure relates to a semiconductor device. [Background technology]

[0002] A typical structure of a case-type semiconductor device is one in which a semiconductor element and a lead electrode terminal electrically connected to the semiconductor element are sealed with a sealing resin. In such a semiconductor device, when a thermal cycle occurs due to repeated operation and non-operation of the semiconductor element, stress is generated in the sealing resin due to the difference in linear expansion coefficient between the lead electrode terminal and the sealing resin. This stress may cause a crack in the sealing resin that propagates from the end of the lead electrode terminal and reaches the semiconductor element.

[0003] In order to reduce such stress, techniques have been proposed, such as using a material with a linear expansion coefficient close to that of the lead electrode terminal for the sealing resin, and devising a shape for the lead electrode terminal, etc. For example, Patent Document 1 proposes a technique of using a lead electrode terminal with a special shape in order to reduce the stress in the sealing resin caused by the expansion and contraction of the lead electrode terminal. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2016-082048 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, when the temperature difference in the thermal cycle is large, cracks still occur that reach the semiconductor element, resulting in a problem of reduced reliability of the semiconductor device.

[0006] Therefore, the present disclosure has been made in consideration of the above-mentioned problems, and has an object to provide a technique capable of suppressing cracks that reach semiconductor elements. [Means for solving the problem]

[0007] The semiconductor device according to the present disclosure includes a semiconductor element and an extension portion spaced apart from an upper surface of the semiconductor element, and is joined to the semiconductor element. It is a plate-shaped member a lead electrode terminal; a first sealing member for sealing the lead electrode terminal; and an intervening member provided between an end of the extension portion in the extension direction and the semiconductor element, the intervening member having an interface with the first sealing member below the end. The interface is provided across the end of the extension portion from the outside to the inside. do. Effect of the Invention

[0008] According to the present disclosure, the lead electrode terminal includes an intervening member provided between the end portion in the extending direction of the lead electrode terminal and the semiconductor element, the intervening member having an interface with the first sealing member below the end portion. With this configuration, it is possible to suppress cracks that reach the semiconductor element.

[0009] The objects, features, aspects and advantages of the present disclosure will become more apparent from the following detailed description and the accompanying drawings. [Brief description of the drawings]

[0010] [Figure 1] 1 is a cross-sectional view showing a configuration of a semiconductor device according to a first embodiment. [Diagram 2] FIG. 1 is a cross-sectional view showing a configuration of a related semiconductor device. [Diagram 3] FIG. 1 is a cross-sectional view showing a configuration of a part of a related semiconductor device. [Figure 4] 1 is a cross-sectional view showing a configuration of a portion of a semiconductor device according to a first embodiment. [Diagram 5] FIG. 11 is a cross-sectional view showing a configuration of a portion of a semiconductor device according to a second embodiment. [Figure 6] FIG. 11 is a cross-sectional view showing a configuration of a portion of a semiconductor device according to a third embodiment. [Figure 7]FIG. 11 is a top view showing a configuration of a portion of a semiconductor device according to a third embodiment. [Figure 8] FIG. 11 is a cross-sectional view showing a configuration of a portion of a semiconductor device according to a fourth embodiment. [Figure 9] FIG. 13 is a cross-sectional view showing a configuration of a portion of a semiconductor device according to a fifth embodiment. [Figure 10] FIG. 13 is a cross-sectional view showing a configuration of a portion of a semiconductor device according to a sixth embodiment. [Figure 11] FIG. 13 is a cross-sectional view showing a configuration of a portion of a semiconductor device according to a seventh embodiment. [Figure 12] FIG. 13 is a cross-sectional view showing a configuration of a portion of a semiconductor device according to an eighth embodiment. [Figure 13] FIG. 13 is a cross-sectional view showing a configuration of a portion of a semiconductor device according to a ninth embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, the embodiments will be described with reference to the accompanying drawings. The features described in each of the following embodiments are merely examples, and not all features are necessarily required. In addition, in the following description, similar components in multiple embodiments are given the same or similar reference numerals, and different components are mainly described. In addition, in the following description, specific positions and directions such as "upper", "lower", "left", "right", "front" or "back" do not necessarily correspond to positions and directions in actual implementation.

[0012] <Embodiment 1> Fig. 1 is a cross-sectional view showing the configuration of a semiconductor device according to the present embodiment 1. The semiconductor device in Fig. 1 may be an inverter or converter for controlling a motor of an electric vehicle or a train, or may be other devices.

[0013] The semiconductor device in FIG. 1 includes an insulating substrate 1, fins 2, a semiconductor element 3, lead electrode terminals 4, signal terminals 5, a case 6, a sealing resin 7 which is a first sealing member, and a sealing resin 8a which is a second sealing member.

[0014] A conductive pattern 1a is provided on the lower surface of the insulating substrate 1, and a conductive pattern 1b is provided on the upper surface of the insulating substrate 1. The fins 2 are joined to the conductive pattern 1a by a joining member 11a such as solder or brazing material.

[0015] The semiconductor element 3 is joined to the conductive pattern 1b by a joining member 11b such as solder or brazing material. The semiconductor element 3 includes, for example, a semiconductor switching element such as an IGBT (Insulated Gate Bipolar Transistor) and a MOSFET (Metal Oxide Semiconductor Field Effect Transistor), or a diode such as a PND (PN junction diode) and an SBD (Schottky Barrier Diode). In the present embodiment 1, the material of the semiconductor element 3 is generally silicon (Si), but is not limited to this as described later. In the present embodiment 1, the number of semiconductor elements 3 is two, but it may be one or more.

[0016] The lead electrode terminal 4 is a plate-like member made of a metal material such as copper, and is joined to the semiconductor element 3. The lead electrode terminal 4 has an extended portion extending along the upper surface of the semiconductor element 3, and the extended portion is spaced from the upper surface of the semiconductor element 3. In the present embodiment 1, the extended portion of the lead electrode terminal 4 is joined to the semiconductor element 3, but this is not limited thereto. For example, when the lead electrode terminal 4 has a protruding portion protruding downward, the protruding portion may be joined to the semiconductor element 3. In the present embodiment 1, the lead electrode terminal 4 is joined to the semiconductor element 3 by a joining member 11c such as solder and brazing material, but it may be joined directly to the semiconductor element 3, for example.

[0017] The signal terminals 5 are electrically connected to the semiconductor element 3 by wires 12 .

[0018] The case 6 is an insert case made of, for example, resin, and is provided on the fins 2 to surround the periphery of the semiconductor element 3. The case 6 fixes the lead electrode terminal 4 in a state in which the end 4a of the extended portion of the lead electrode terminal 4 in the extension direction and the electrode terminal 4b which is the end of the lead electrode terminal 4 are exposed. Similarly, the case 6 fixes the signal terminal 5 in a state in which the end of the signal terminal 5 connected to the wire 12 and another end are exposed.

[0019] The sealing resin 7 is provided in the upper part of the space surrounded by the case 6, and seals the lead electrode terminals 4. The sealing resin 8a is provided in the lower part of the space surrounded by the case 6, and seals the semiconductor element 3. In the example of Fig. 1, the sealing resin 8a also seals the insulating substrate 1 and the like. Each of the sealing resin 7 and the sealing resin 8a is made of, for example, an epoxy resin.

[0020] Here, at least a part of the sealing resin 8a is provided between the end 4a of the lead electrode terminal 4 and the semiconductor element 3, and functions as an intervening member having an interface with the sealing resin 7 below the end 4a. Such an interface is formed, for example, by separately forming the sealing resin 7 and the sealing resin 8a from the same resin under the same manufacturing conditions. Note that, when the sealing resin 7 is formed after the sealing resin 8a is formed once, the linear expansion coefficient of the sealing resin 8a becomes larger than that of the sealing resin 7, but the linear expansion coefficient of the sealing resin 7 and the linear expansion coefficient of the sealing resin 8a may be the same.

[0021] 2 is a cross-sectional view showing a configuration of a semiconductor device related to the semiconductor device according to the first embodiment (hereinafter, referred to as a "related semiconductor device") The related semiconductor device includes a sealing resin 16 that does not have an interface under the end portion 4a, instead of the sealing resin 7 and the sealing resin 8a.

[0022] In this related semiconductor device, when a thermal cycle occurs due to repeated operation and non-operation of the semiconductor element 3, peeling 17 occurs between the end 4a and the sealing resin 16 as shown in Fig. 3 due to the difference in the linear expansion coefficient between the lead electrode terminal 4 and the sealing resin 16. Furthermore, when a thermal cycle occurs again due to repeated operation and non-operation of the semiconductor element 3, stress is concentrated in the sealing resin 16 in contact with the end 4a, and a crack 18 may occur in the sealing resin 16 that extends from the end 4a to the semiconductor element 3. In this case, a problem occurs in that the reliability of the semiconductor device is reduced.

[0023] Various techniques have been proposed to solve these problems. However, in recent years, due to the demand to increase the maximum operating temperature of semiconductor devices, the change in the operating temperature of the semiconductor device or the ambient temperature of the semiconductor device has become greater, the temperature difference in the thermal cycle has become larger, and the stress generated in the resin has become greater. For this reason, even when the conventional techniques are used, there have been problems such as the occurrence of cracks 18 and an increase in the rate at which the cracks 18 progress.

[0024] <Summary of the first embodiment> In the present embodiment 1, the sealing resin 8a is provided between the end 4a of the lead electrode terminal 4 and the semiconductor element 3, and functions as an intervening member having an interface with the sealing resin 7 below the end 4a. As a result, even if a crack 18 that propagates vertically from the end 4a of the lead electrode terminal 4 to the semiconductor element 3 occurs in the sealing resin 7, the interface between the sealing resin 7 and the sealing resin 8a changes the propagation direction of the crack 18 to the interface direction (i.e., horizontal direction). This makes it possible to suppress the crack 18 from reaching the semiconductor element 3, thereby improving the reliability of the semiconductor device, such as the thermal cycle resistance.

[0025] <First Modification of First Embodiment> In the first embodiment, the sealing resin 7 and the sealing resin 8a may have different physical properties, such as the linear expansion coefficient and the mechanical strength.

[0026] When the physical property value is a linear expansion coefficient, the difference between the linear expansion coefficient of the sealing resin 7 and the linear expansion coefficient of the lead electrode terminal 4 may be smaller than the difference between the linear expansion coefficient of the sealing resin 8a and the linear expansion coefficient of the lead electrode terminal 4. In other words, the linear expansion coefficient of the sealing resin 7 may be close to the linear expansion coefficient of the lead electrode terminal 4. With this configuration, the occurrence of cracks 18 in the sealing resin 7 adjacent to the end 4a of the lead electrode terminal 4 can be suppressed.

[0027] Furthermore, the difference between the linear expansion coefficient of sealing resin 8a and the linear expansion coefficient of insulating substrate 1 may be smaller than the difference between the linear expansion coefficient of sealing resin 7 and the linear expansion coefficient of insulating substrate 1. In other words, the linear expansion coefficient of sealing resin 8a may be close to the linear expansion coefficient of insulating substrate 1. With this configuration, it is possible to suppress warping deformation of the semiconductor device due to thermal cycles over time and the occurrence of cracks 18 in sealing resin 8a adjacent to insulating substrate 1.

[0028] When the physical property value is mechanical strength, the mechanical strength of the sealing resin 8a may be greater than the mechanical strength of the sealing resin 7. With such a configuration, it is possible to prevent cracks 18 reaching the semiconductor element 3 from occurring in the sealing resin 8a.

[0029] <Modification 2 of the First Embodiment> The material of the sealing resin 8a in the first embodiment may be silicone gel. With this configuration, even if cracks 18 propagating from the ends 4a of the lead electrode terminals 4 occur in the sealing resin 7, the silicone gel can prevent the cracks 18 from reaching the semiconductor element 3. This can improve the reliability of the semiconductor device, such as its thermal cycle resistance.

[0030] <Embodiment 2> Fig. 5 is a cross-sectional view showing a configuration of a part of a semiconductor device according to the second embodiment. In the second embodiment, the sealing resin 8a described in the first embodiment is replaced with a molded resin 8b formed by molding. Fig. 5 shows that the molded resin 8b is provided along the outer periphery of the semiconductor element 3 and the bonding member 11b without sealing the insulating substrate 1, as a trace formed by molding. Resins formed by molding, such as the molded resin 8b, are generally high-hardness resins.

[0031] <Summary of the second embodiment> In the present embodiment 2, the sealing resin 8a is the molded resin 8b. According to such a configuration, as in the embodiment 1, the propagation direction of the crack 18 changes toward the interface direction due to the interface between the sealing resin 7 and the molded resin 8b, so that the crack 18 can be prevented from reaching the semiconductor element 3.

[0032] Moreover, since molded resin 8b is a high-hardness resin, it is possible to further suppress cracks 18 from reaching semiconductor element 3. Moreover, since molded resin 8b does not seal insulating substrate 1, it is possible to suppress the occurrence of cracks 18 in molded resin 8b due to thermal expansion of insulating substrate 1.

[0033] The configuration of the second embodiment may be combined with at least any of the configurations of the first embodiment and the first and second modifications described above.

[0034] <Embodiment 3> 6 is a cross-sectional view showing a configuration of a portion of a semiconductor device according to a preferred embodiment 3. The configuration of the preferred embodiment 3 is similar to that of the preferred embodiment 1, except that the sealing resin 8a is replaced with a stress buffer frame 8c.

[0035] The stress buffer frame 8c is a plate-like member made of resin or the like and provided at a distance from the lead electrode terminals 4 and the semiconductor element 3. In the present embodiment 3, the stress buffer frame 8c is provided between the end 4a of the lead electrode terminal 4 and the semiconductor element 3, and functions as an intervening member having an interface with the sealing resin 7 below the end 4a. The sealing resin 7 seals not only the lead electrode terminals 4, but also the semiconductor element 3 and the stress buffer frame 8c.

[0036] FIG. 7 is a top view showing the lead electrode terminal 4 and the stress buffer frame 8c. The stress buffer frame 8c is preferably provided with a structure through which the sealing resin 7 liquefied during manufacturing can easily pass, such as a lattice structure having holes 8c1 in FIG. 7. With this structure, the sealing resin 7 liquefied during manufacturing can easily reach the lower side of the stress buffer frame 8c in FIG. 6 from the upper side, thereby reducing the gap between the sealing resin 7 and other components. In addition, it is preferable that the end 4a of the lead electrode terminal 4 is located inside the outer contour of the line portion 8c2 of the stress buffer frame 8c in a plan view. With this structure, it is possible to suppress the cracks 18 reaching the semiconductor element 3.

[0037] <Summary of the Third Embodiment> In the present embodiment 3, the molding resin 8b functions as an intervening member similarly to the sealing resin 8a described in the embodiment 1. According to such a configuration, similarly to the embodiment 1, the propagation direction of the crack 18 is changed toward the interface direction by the interface between the sealing resin 7 and the stress buffer frame 8c, so that the crack 18 reaching the semiconductor element 3 can be suppressed.

[0038] The stress buffer frame 8c may be integrated with the case 6. This configuration can suppress warping of the semiconductor device due to thermal cycles over time. In this configuration, it is preferable to use a resin having a linear expansion coefficient close to that of the sealing resin 7 for the stress buffer frame 8c.

[0039] The configuration of the third embodiment may be combined with at least any of the configurations of the first and second embodiments and the first and second modifications described above.

[0040] <Fourth embodiment> 8 is a cross-sectional view showing a configuration of a portion of a semiconductor device according to the present embodiment 4. The semiconductor device according to the present embodiment 4 does not include an intervening member such as the sealing resin 8a described in the embodiment 1. On the other hand, in the present embodiment 4, the distance Wa between the semiconductor element 3 and the extended portion of the lead electrode terminal 4 is equal to or greater than the thickness Wb of the extended portion, and the sealing resin 7 seals the semiconductor element 3, the lead electrode terminal 4, etc.

[0041] <Summary of the fourth embodiment> In the fourth embodiment, since the distance Wa between the semiconductor element 3 and the extended portion of the lead electrode terminal 4 is relatively large, it is possible to lengthen the time it takes for the crack 18 propagating from the end 4a of the lead electrode terminal 4 to reach the semiconductor element 3. This makes it possible to prevent the crack 18 from reaching the semiconductor element 3, thereby improving the reliability of the semiconductor device, such as the thermal cycle resistance.

[0042] The configuration of the fourth embodiment may be combined with at least any of the configurations of the first to third embodiments and the first and second modifications described above.

[0043] <Embodiment 5> 9 is a cross-sectional view showing a configuration of a portion of a semiconductor device according to the present embodiment 5. The configuration of the present embodiment 5 is similar to the configuration in the embodiment 1 in which a protrusion 4c is provided on the upper surface side of an end 4a in the extension direction of the lead electrode terminal 4. Such a lead electrode terminal 4 can be formed, for example, by setting punching during the formation of the lead electrode terminal 4 so that it has a drooping surface on the semiconductor element 3 side and a burred surface on the opposite side to the semiconductor element 3.

[0044] <Summary of the fifth embodiment> In the fifth embodiment, when cracks 18 are formed by thermal cycles, the protrusions 4c can promote the propagation of the cracks 18 in the opposite direction to the semiconductor element 3. This can suppress the occurrence of cracks 18 that reach the semiconductor element 3, thereby improving the reliability of the semiconductor device, such as the thermal cycle resistance.

[0045] The configuration of the fifth embodiment may be combined with at least any of the configurations of the first to fourth embodiments and the first and second modifications described above.

[0046] <Sixth embodiment> 10 is a cross-sectional view showing a configuration of a portion of a semiconductor device according to the sixth embodiment. The configuration of the sixth embodiment is similar to the configuration in the first embodiment in which the extending direction of the extending portion of the lead electrode terminal 4 is inclined with respect to the upper surface of the semiconductor element 3. In other words, the angle between the extending direction of the extending portion of the lead electrode terminal 4 and the in-plane direction of the semiconductor element 3 is larger than 0 degrees.

[0047] <Summary of the sixth embodiment> In the sixth embodiment, the extending direction of the extending portion of the lead electrode terminal 4 is inclined with respect to the upper surface of the semiconductor element 3, so that the distance between the semiconductor element 3 and the end 4a is increased. For example, when the lead electrode terminal 4 is inclined by 5°, the distance between the semiconductor element 3 and the end 4a increases by 8.7%. As a result, it is possible to lengthen the time until the crack 18 propagating from the end 4a of the lead electrode terminal 4 reaches the semiconductor element 3. This makes it possible to suppress the crack 18 from reaching the semiconductor element 3, so that the reliability of the semiconductor device, such as the thermal cycle resistance, can be improved.

[0048] The configuration of the sixth embodiment may be combined with at least any of the configurations of the first to fifth embodiments and the first and second modifications described above.

[0049] <Embodiment 7> 11 is a cross-sectional view showing a configuration of a portion of a semiconductor device according to a seventh preferred embodiment of the present invention. The configuration of the seventh preferred embodiment of the present invention is similar to that of the first preferred embodiment, except that the sealing resin 8a is replaced with a buffer layer 8d.

[0050] The buffer layer 8d is provided on the upper surface of the semiconductor element 3. In the seventh embodiment, the buffer layer 8d is provided between the end 4a of the lead electrode terminal 4 and the semiconductor element 3, and functions as an intervening member having an interface with the sealing resin 7 below the end 4a. The sealing resin 7 seals not only the lead electrode terminal 4, but also the semiconductor element 3 and the buffer layer 8d.

[0051] <Summary of the seventh embodiment> In the present embodiment 7, the buffer layer 8d functions as an intervening member similarly to the sealing resin 8a described in the embodiment 1. According to such a configuration, the propagation direction of the crack 18 is changed toward the interface direction by the interface between the sealing resin 7 and the buffer layer 8d, similarly to the embodiment 1, so that the crack 18 reaching the semiconductor element 3 can be suppressed.

[0052] The buffer layer 8d is preferably made of a material, such as a polyimide material, having a lower hardness (e.g., Vickers hardness) than the sealing resin 7. With such a configuration, the buffer layer 8d can absorb the stress from the sealing resin 7, thereby improving the reliability of the semiconductor device, such as the thermal cycle resistance.

[0053] The configuration of the seventh embodiment may be combined with at least any of the configurations of the first to sixth embodiments and the first and second modifications described above.

[0054] <Embodiment 8> 12 is a cross-sectional view showing a configuration of a portion of a semiconductor device according to the present embodiment 8. In the configuration of the present embodiment 8, the sealing resin 8a is omitted from the configuration of the embodiment 1.

[0055] On the other hand, in the present embodiment 8, the taper angle of the bonding member 11c that bonds the semiconductor element 3 and the lead electrode terminal 4 is relatively large. As a result, in the present embodiment 8, at least a part of the bonding member 11c is provided between the end 4a of the lead electrode terminal 4 and the semiconductor element 3, and functions as an intervening member having an interface with the sealing resin 7 below the end 4a. The sealing resin 7 seals not only the lead electrode terminal 4, but also the semiconductor element 3 and the bonding member 11c.

[0056] <Summary of the eighth embodiment> In the present embodiment 8, the bonding member 11c functions as an intervening member similarly to the sealing resin 8a described in the embodiment 1. According to such a configuration, the propagation direction of the crack 18 is changed toward the interface direction by the interface between the sealing resin 7 and the bonding member 11c, and the distance until the crack 18 reaches the semiconductor element 3 is increased, so that the crack 18 can be prevented from reaching the semiconductor element 3.

[0057] The configuration of the eighth embodiment may be combined with at least any of the configurations of the first to seventh embodiments and the first and second modifications described above.

[0058] <Embodiment 9> 13 is a cross-sectional view showing a configuration of a portion of a semiconductor device according to the present embodiment 9. The configuration of the present embodiment 9 is similar to the configuration of the embodiment 4 (see FIG. 8) in which the region 3a directly below the end 4a of the semiconductor element 3 is a non-conductive region. The non-conductive region is a region where the semiconductor element 3 can maintain normal operation even if the crack 18 reaches it, and is, for example, a region where a temperature sensor is provided and an insulating region.

[0059] <Summary of the 9th embodiment> In the ninth embodiment, since the region 3a directly below the end portion 4a of the semiconductor element 3 is a non-conductive region, even if the crack 18 reaches the semiconductor element 3, the semiconductor element 3 can operate normally. The semiconductor element 3 may be configured to perform a retreat operation when a defect in the region 3a is detected due to the arrival of the crack 18, etc. This configuration can prevent the semiconductor element 3 from suddenly stopping unintentionally due to a defect in the region 3a.

[0060] The configuration of the ninth embodiment may be combined with at least any of the configurations of the first to eighth embodiments and the first and second modifications described above.

[0061] <Modifications of the First to Ninth Embodiments> In any of the above-described first to ninth embodiments and first and second modifications, the material of the semiconductor element 3 may be a wide band gap semiconductor. The wide band gap semiconductor is, for example, silicon carbide (SiC), gallium nitride (GaN), diamond, or the like.

[0062] The semiconductor element 3 made of a wide band gap semiconductor has a higher hardness (e.g., Vickers hardness) than the semiconductor element 3 made of silicon. For example, the hardness of silicon carbide is about 23 GPa, and the hardness of silicon is about 10 GPa, and the hardness of the former is about 2.3 times that of the latter. For this reason, by using a wide band gap semiconductor as the material of the semiconductor element 3, it is possible to increase the stress resistance against the progression of the crack 18.

[0063] It should be noted that the embodiments and modifications may be freely combined, and the embodiments and modifications may be modified or omitted as appropriate.

[0064] The above description is illustrative in all respects and is not restrictive. It is understood that countless variations not illustrated can be envisioned. [Explanation of symbols]

[0065] 3 semiconductor element, 3a region, 4 lead electrode terminal, 4a end, 4c protrusion, 7, 8a sealing resin, 8b molded resin, 8c stress buffer frame, 8d buffer layer, 11c bonding member.

Claims

1. A semiconductor element; a lead electrode terminal which is a plate-shaped member having an extended portion spaced apart from an upper surface of the semiconductor element and joined to the semiconductor element; a first sealing member for sealing the lead electrode terminal; an intervening member provided between an end of the extension portion in an extension direction and the semiconductor element, the intervening member having an interface with the first sealing member below the end; Equipped with The interface is provided across from the outer side to the inner side of the end portion of the extension portion.

2. 2. The semiconductor device according to claim 1, The intervening member includes a second sealing member that seals the semiconductor element.

3. 3. The semiconductor device according to claim 2, A semiconductor device, wherein the first sealing member and the second sealing member have different physical properties.

4. 4. The semiconductor device according to claim 2, The semiconductor device, wherein the material of the second sealing member includes silicone gel.

5. 4. The semiconductor device according to claim 2, The second sealing member includes a molding resin.

6. 2. The semiconductor device according to claim 1, the intermediate member includes a stress buffer frame, The first sealing member further seals the semiconductor element and the stress buffer frame.

7. 2. The semiconductor device according to claim 1, the interposition member includes a buffer layer provided on the upper surface of the semiconductor element, The first sealing member further encapsulates the semiconductor element and the buffer layer.

8. 2. The semiconductor device according to claim 1, the intermediate member includes a joining member that joins the semiconductor element and the lead electrode terminal, The semiconductor device, wherein the first sealing member further seals the semiconductor element and the bonding member.

9. A semiconductor element; a lead electrode terminal having an extended portion spaced from an upper surface of the semiconductor element and joined to the semiconductor element; a sealing member that seals the semiconductor element and the lead electrode terminals; Equipped with a distance between the semiconductor element and the extension portion is equal to or greater than a thickness of the extension portion; A region of the semiconductor element directly below an end of the extension portion in the extension direction is a non-conductive region.

10. 10. The semiconductor device according to claim 1, The semiconductor device further comprises a protrusion provided on an upper surface side of the end portion in the extending direction of the extending portion.

11. The semiconductor device according to any one of claims 1 to 10, The extending direction of the extension portion is inclined with respect to the upper surface of the semiconductor element.

12. 9. The semiconductor device according to claim 1, A region of the semiconductor element directly below an end of the extension portion in the extension direction is a non-conductive region.

13. 13. The semiconductor device according to claim 1, A semiconductor device, wherein the material of the semiconductor element includes a wide band gap semiconductor.

Images