Resin moldings for sealing optical semiconductors

Abstract

To provide a resin molded product for opto-semiconductor encapsulation that provides an optical semiconductor encapsulation material having excellent heat resistance, temperature cycle resistance, and solder reflow resistance.SOLUTION: A resin molded product for opto-semiconductor encapsulation satisfies the following formula (1). 0.0005≤E'265°C / E'100°C≤0.0050 (1). (In the formula, E'265°C and E'100°C represent the storage elastic modulus (Pa) of a cured product (size: width 5 mm×length 35 mm×thickness 1 mm) obtained by the following method at 265°C and 100°C). In the manufacturing method of the cured product, the resin molded product is heated at 150°C for four minutes to form a molded product, and then heated at 150°C for three hours to obtain a cured product.SELECTED DRAWING: None

Description

[Technical Field]

[0001] The present invention relates to a resin molded article for sealing an optical semiconductor. [Background technology]

[0002] Optical semiconductor elements are encapsulated in ceramic or plastic packages to form devices. Since ceramic packages are made of relatively expensive materials and are not suitable for mass production, plastic packages are commonly used. Among these, a technology in which an epoxy resin composition is pre-formed into tablets and then transferred into a mold is mainstream in terms of workability, mass production, and reliability.

[0003] Patent Document 1 discloses a technique for granulating an epoxy resin composition into granules and forming them into tablets. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2011-9394 Summary of the Invention [Problem to be solved by the invention]

[0005] In recent years, as electronic devices have become more functional and powerful, higher reliability is being demanded of optical semiconductors. For example, use in high-temperature environments or environments where temperatures repeatedly change from low to high, as well as the solder reflow process during device manufacturing, can cause cracks, peeling, discoloration, and other problems in the encapsulating material, and there is a demand for reducing damage to optical semiconductor elements caused by these problems.

[0006] An object of the present invention is to provide a resin molded product for encapsulating optical semiconductors, which provides an optical semiconductor encapsulant excellent in heat resistance, temperature cycle resistance and solder reflow resistance. [Means for solving the problem]

[0007] The present invention relates to a resin molded product for encapsulating an optical semiconductor that satisfies the following relational expression (1). 0.0005 ≦ E’ / E’ 100℃ ≦ 0.0050 (1) (In the formula, E’ 265℃ and E’ 100℃ respectively represent the storage elastic moduli (Pa) at 265°C and 100°C of a cured body (size: width 5 mm × length 35 mm × thickness 1 mm) obtained by the following method.) (Method for producing the cured body) The resin molded product is heated at 150°C for 4 minutes for molding, and then heated at 150°C for 3 hours to obtain a cured body.

[0008] The resin molded product for encapsulating an optical semiconductor preferably has a glass transition temperature of 130°C or higher when formed into a cured body (size: width 5 mm × length 35 mm × thickness 1 mm) by the above method, and satisfies the following relational expression (2). Y < 160000X - 14500000 (2) (In the formula, X represents the glass transition temperature (°C) of the cured body, and Y represents the storage elastic modulus (Pa) of the cured body at 265°C.)

[0009] The resin molded product for encapsulating an optical semiconductor preferably satisfies the following relational expressions (3) and (4). Y <6300000> (130 ≦ X < 150) (3) Y < 160000X - 17000000 (150 ≦ X ≦ 190) (4) (In each formula, X represents the glass transition temperature (°C) of a cured body (size: width 5 mm × length 35 mm × thickness 1 mm) obtained by the above method, and Y represents the storage elastic modulus (Pa) of the cured body at 265°C.)

[0010] The resin molded product for encapsulating an optical semiconductor preferably satisfies the following relational expression (5). 0.70 < R 450nm < 1.00 (5) (In the formula, R​450nm represents the ratio (after / before) of linear transmittance at a wavelength of 450 nm before and after solder reflow at 265°C, when the cured product (size: width 50 mm x length 50 mm x thickness 1 mm) obtained by the above method was subjected to three times.

[0011] The optical semiconductor encapsulating resin molded article preferably satisfies the following relational expressions (6) and (7). 0.80 <R 400nm / R 450nm <1.00 (6) 0.10 <R 300nm / R 450nm <0.50 (7) (In each formula, R 300nm , R 400nm and R 450nm The values ​​respectively represent the ratios (after / before) of the linear transmittance at wavelengths of 300 nm, 400 nm, and 450 nm before and after solder reflow at 265°C when a cured product (size: width 50 mm x length 50 mm x thickness 1 mm) obtained by the above method was subjected to solder reflow three times.

[0012] The optical semiconductor encapsulating resin molded product preferably has an in-line transmittance of 70% or more at a wavelength of 450 nm when cured by the above method (size: width 50 mm x length 50 mm x thickness 1 mm).

[0013] The optical semiconductor encapsulating resin molded product preferably contains a thermosetting resin, a curing agent, a reaction product of the thermosetting resin and the curing agent, and a curing accelerator.

[0014] The optical semiconductor encapsulating resin molded product preferably further contains a polyhydric alcohol and a reaction product of a polyhydric alcohol and a curing agent.

[0015] The resin molded product for sealing an optical semiconductor preferably contains at least one compound selected from the group consisting of a compound having a structural unit (I) represented by the following formula (I), a compound having a structural unit (II) represented by the following formula (II), and a compound having a structural unit (III) represented by the following formula (III): Formula (I): [ka] (In the formula, A 1 represents an organic group containing two or more ring structures. 1a represents a moiety containing an epoxy resin residue. 1b is a hydrogen atom or R 1a ) Formula (II): [ka] (In the formula, A 2 represents an organic group. 2a represents a moiety containing a residue of an epoxy resin having two or more consecutive ring structures (excluding oxirane rings). 2b is a hydrogen atom or R 2a ) Formula (III): [ka] (In the formula, A 3 represents an organic group. 3a represents an organic group having a non-aromatic ring.

[0016] The present invention also relates to an optical semiconductor encapsulant obtained by molding the above-mentioned optical semiconductor encapsulating resin molded product.

[0017] The present invention also relates to an optical semiconductor device comprising an optical semiconductor element and the optical semiconductor encapsulant for encapsulating the optical semiconductor element. [Effects of the Invention]

[0018] According to the resin molded product for optical semiconductor encapsulation of the present invention, an optical semiconductor encapsulating material having excellent heat resistance, temperature cycle resistance, and solder reflow resistance can be obtained. Therefore, even when used in a high-temperature environment or during a solder reflow process, the optical semiconductor encapsulating material is less likely to crack, peel, discolor, or the like, and damage to optical semiconductor elements caused by these factors can be reduced. [Brief explanation of the drawings]

[0019] [Figure 1] FIG. 2 is a schematic diagram showing an evaluation package used in Examples and Comparative Examples. DETAILED DESCRIPTION OF THE INVENTION

[0020] The present invention will be specifically described below.

[0021] The optical semiconductor encapsulating resin molded article of the present invention satisfies the following relational expression (1). 0.0005≦E' 265℃ / E' 100℃ ≦0.0050 (1) (In the formula, E' 265℃ and E' 100℃ represent the storage modulus (Pa) at 265°C and 100°C of the cured product (size: width 5 mm × length 35 mm × thickness 1 mm) obtained by the method described below. (Method for producing hardened body) The resin molded product is molded by heating at 150°C for 4 minutes, and then heated at 150°C for 3 hours to obtain a cured product.

[0022] A resin molded product that satisfies relational formula (1) has a high glass transition temperature and provides a cured product with a low elastic modulus at high temperatures, thereby providing an optical semiconductor encapsulant that is excellent in heat resistance, temperature cycle resistance, and solder reflow resistance. Furthermore, an optical semiconductor encapsulant that is also excellent in yellowing resistance, dimensional stability against temperature changes, impact absorption, and impact resistance can be obtained. Such an optical semiconductor encapsulant is less likely to crack, peel, discolor, or the like even when used in a high-temperature environment or during the solder reflow process, thereby reducing damage to optical semiconductor elements that can be caused by these factors. Furthermore, the resin molded product does not become too hard during heat molding, and therefore has excellent handling properties, moldability and releasability.

[0023] E' 265℃ / E' 100℃is 0.0050 or less, preferably 0.0030 or less, more preferably 0.0010 or less, and even more preferably 0.0008 or less. E' 265℃ / E' 100℃ If the value is less than 0.0005 or exceeds 0.0050, the heat resistance, temperature cycle resistance, and solder reflow resistance of the resulting optical semiconductor encapsulating material may be reduced.

[0024] E' 265℃ and E' 100℃ are determined by dynamic viscoelasticity measurement at 265°C and 100°C (mode: tension, scanning temperature: 0 to 270°C, frequency: 1 Hz, heating rate: 10°C / min) using the cured product obtained by the method described above.

[0025] The resin molded product for encapsulating optical semiconductors of the present invention, when cured by the above method (dimensions: width 5 mm × length 35 mm × thickness 1 mm), preferably has a glass transition temperature (Tg) of 130°C or higher and satisfies the following relational expression (2): Y<160000X-14500000 (2) (In the formula, X represents the glass transition temperature (°C) of the cured product, and Y represents the storage modulus (Pa) of the cured product at 265°C.) When such a resin molded product is cured, a cured product having a high glass transition temperature and a low elastic modulus at high temperatures is obtained, thereby providing an optical semiconductor encapsulant having even more excellent heat resistance, temperature cycle resistance, solder reflow resistance, yellowing resistance, dimensional stability against temperature changes, impact absorption, and impact resistance.

[0026] The glass transition temperature is preferably 130° C. or higher, more preferably 140° C. or higher, even more preferably 145° C. or higher, and particularly preferably 155° C. or higher. The glass transition temperature is preferably 200° C. or lower, more preferably 190° C. or lower, and even more preferably 180° C. or lower. When the glass transition temperature of the cured body is within the above range, an optical semiconductor encapsulant that is even more excellent in heat resistance, temperature cycle resistance, yellowing resistance, dimensional stability against temperature changes, and shock absorption can be obtained.

[0027] The above glass transition temperature is obtained by performing dynamic viscoelasticity measurement (mode: tension, scanning temperature: 0 to 270 °C, frequency: 1 Hz, heating rate: 10 °C / min) using the cured body (size: width 5 mm × length 35 mm × thickness 1 mm) obtained by the method described above, obtaining the storage elastic modulus E' and the loss elastic modulus E'', obtaining a curve of tanδ (= E'' / E') from these, and determining it as the peak top temperature of tanδ.

[0028] The resin molded product for optical semiconductor encapsulation of the present invention preferably satisfies the following relational expressions (3) and (4), and more preferably satisfies the following relational expressions (3') and (4'). Y <6300000> (130 ≤ X < 150) (3) Y < 160000X - 17000000 (150 ≤ X ≤ 190) (4) Y <1400000> (130 ≤ X < 150) (3') Y < 160000X - 22000000 (150 ≤ X ≤ 190) (4') (In each formula, X represents the glass transition temperature (°C) of the cured body (size: width 5 mm × length 35 mm × thickness 1 mm) obtained by the above method, and Y represents the storage elastic modulus (Pa) of the cured body at 265 °C.) Thereby, an optical semiconductor encapsulant that is even more excellent in heat resistance, temperature cycle resistance, solder reflow resistance, yellowing resistance, dimensional stability against temperature changes, shock absorption, and impact resistance can be obtained.

[0029] The resin molded product for optical semiconductor encapsulation of the present invention has a storage elastic modulus (E' 265℃ ) at 265 °C when the cured body is formed by the above method (size: width 5 mm × length 35 mm × thickness 1 mm) 7 of preferably 1.5 × 10 7 Pa or less, and more preferably 1.0 × 10

[0030] The optical semiconductor encapsulating resin molded product of the present invention preferably satisfies the following relational expression (5). 0.70 <R 450nm <1.00 (5) (In the formula, R 450nm represents the ratio (after / before) of linear transmittance at a wavelength of 450 nm before and after solder reflow at 265°C, when the cured product (size: width 50 mm x length 50 mm x thickness 1 mm) obtained by the above method was subjected to three times. R 450nm is more preferably 0.80 or more, and more preferably 0.95 or less. R 450nm When the value is within the above range, the decrease in transmittance at a specific wavelength of the cured product after solder reflow is suppressed, and therefore an optical semiconductor encapsulant having even more excellent solder reflow resistance and yellowing resistance can be obtained.

[0031] The optical semiconductor encapsulating resin molded product of the present invention preferably satisfies the following relational expression (5'). 0.60 <R 400nm <0.90 (5') (In the formula, R 400nm represents the ratio (after / before) of linear transmittance at a wavelength of 400 nm before and after solder reflow at 265°C, when the cured product (size: width 50 mm x length 50 mm x thickness 1 mm) obtained by the above method was subjected to solder reflow three times. R 400nm is more preferably 0.70 or more, and more preferably 0.85 or less. R 400nm When the value is within the above range, the decrease in transmittance at a specific wavelength of the cured product after solder reflow is suppressed, and therefore an optical semiconductor encapsulant having even more excellent solder reflow resistance and yellowing resistance can be obtained.

[0032] The optical semiconductor encapsulating resin molded product of the present invention preferably satisfies the following relational expression (5''). 0.10 <R 300nm <0.50 (5'') (In the formula, R 300nmrepresents the ratio (after / before) of linear transmittance at a wavelength of 300 nm before and after solder reflow at 265°C, when the cured product (size: width 50 mm x length 50 mm x thickness 1 mm) obtained by the above method was subjected to solder reflow three times. R 300nm is more preferably 0.15 or more, and more preferably 0.40 or less. R 300nm When the value is within the above range, the decrease in transmittance at a specific wavelength of the cured product after solder reflow is suppressed, and therefore an optical semiconductor encapsulant having even more excellent solder reflow resistance and yellowing resistance can be obtained.

[0033] The optical semiconductor encapsulating resin molded product of the present invention preferably satisfies the following relational expressions (6) and (7). 0.80 <R 400nm / R 450nm <1.00 (6) 0.10 <R 300nm / R 450nm <0.50 (7) (In each formula, R 300nm , R 400nm and R 450nm The values ​​respectively represent the ratios (after / before) of the linear transmittance at wavelengths of 300 nm, 400 nm, and 450 nm before and after solder reflow at 265°C when a cured product (size: width 50 mm x length 50 mm x thickness 1 mm) obtained by the above method was subjected to solder reflow three times. R 400nm / R 450nm is more preferably 0.95 or less. R 300nm / R 450nm is more preferably 0.20 or more, and more preferably 0.40 or less. R 400nm / R 450nm and R 300nm / R 450nm When the value is within the above range, the decrease in transmittance at a specific wavelength of the cured product after solder reflow is suppressed, and therefore an optical semiconductor encapsulant having even more excellent solder reflow resistance and yellowing resistance can be obtained.

[0034] The linear transmittance at each wavelength is determined by preparing a cured product by the above-described method and measuring the transmission spectrum of the cured product using a spectrophotometer before and after solder reflow.

[0035] The solder reflow is carried out using the cured product in a reflow furnace under the conditions of a top peak temperature of 265° C. and 10 seconds per cycle.

[0036] When the resin molded product for encapsulating optical semiconductors of the present invention is cured by the above-mentioned method (size: width 50 mm × length 50 mm × thickness 1 mm), it preferably has an in-line transmittance at a wavelength of 450 nm of 70% or more, more preferably 90% or more, and even more preferably 95% or more. This makes it possible to obtain an optical semiconductor encapsulating material that is excellent in light transmittance (transparency). The linear transmittance is determined by measuring the transmission spectrum of the cured product at a wavelength of 450 nm using a spectrophotometer.

[0037] The resin molded article for sealing an optical semiconductor of the present invention may be a tablet, a sheet, or the like.

[0038] When the resin molded product for sealing an optical semiconductor is a tablet, its volume is not particularly limited, but is preferably 1 to 100 cm 3 is preferable, and 10 to 100 cm 3 is more preferred.

[0039] The optical semiconductor encapsulating molded resin product of the present invention preferably contains a reaction product of a thermosetting resin and a curing agent. It is also preferable that the molded resin product contains a thermosetting resin, a curing agent, a reaction product of a thermosetting resin and a curing agent, and a curing accelerator. In addition to the above, it is also preferable that the molded resin product contains a polyhydric alcohol and a reaction product of a polyhydric alcohol and a curing agent. The optical semiconductor encapsulating molded resin product of the present invention may be in a so-called B-stage (semi-cured) state.

[0040] The thermosetting resin is preferably an epoxy resin, and the epoxy resin is preferably one that is less colored.

[0041] As the epoxy resin, an epoxy resin having two or more consecutive ring structures (excluding oxirane rings) is preferred, since it allows easy production of resin molded products that satisfy the above-mentioned respective relational expressions. Here, two or more consecutive ring structures means that two or more ring structures are in direct contact with each other, in other words, there are no atoms that do not constitute a ring between one ring structure and an adjacent ring structure. In the two or more consecutive ring structures, it is preferred that one ring structure and an adjacent ring structure share two or more atoms.

[0042] The ring structure is preferably a non-aromatic ring, more preferably a non-aromatic carbon ring. The epoxy resin may be an alicyclic epoxy resin.

[0043] The ring structure may have an unsaturated bond, but it is also preferable that it does not have an unsaturated bond.

[0044] The epoxy resin preferably has a hydrocarbon group having a bridged structure, more preferably has a bicyclic or tricyclic hydrocarbon group having a bridged structure, and even more preferably has a bicyclic hydrocarbon group having a bridged structure on a six-membered ring. The hydrocarbon group having the bridged structure is represented by the following formula: [ka] (In the formula, R 11 represents an oxygen atom or an alkylene group. 12 ~R 17 and each independently represent a hydrogen atom or an alkyl group. This makes it possible to more easily obtain a resin molded product that satisfies the above-mentioned relational expressions.

[0045] In the above formula, R 11 represents an oxygen atom or an alkylene group. The alkylene group preferably has 1 to 5 carbon atoms, more preferably 1 to 3 carbon atoms, even more preferably 1 or 2 carbon atoms, and particularly preferably 1 carbon atom. R 11 is preferably an alkylene group.

[0046] In the above formula, R 12 ~R 17 R each independently represents a hydrogen atom or an alkyl group. 12 ~R 17 The alkyl group preferably has 1 to 5 carbon atoms, more preferably 1 to 3 carbon atoms, and even more preferably 1 or 2 carbon atoms. R 12 ~R 17 is preferably a hydrogen atom.

[0047] Examples of the epoxy resin include, but are not limited to, the following. When stereoisomers exist, the examples also include each stereoisomer and a mixture of two or more stereoisomers. [ka]

[0048] Epoxy resins other than those mentioned above can also be used. Examples include bisphenol A epoxy resins, bisphenol F epoxy resins, phenol novolac epoxy resins, alicyclic epoxy resins, heterocyclic epoxy resins such as triglycidyl isocyanate and hydantoin epoxy, hydrogenated bisphenol A epoxy resins, aliphatic epoxy resins, and glycidyl ether epoxy resins. These may be used in combination with the epoxy resins having two or more consecutive ring structures (excluding oxirane rings) mentioned above.

[0049] The epoxy resins can be used alone or in combination of two or more.

[0050] As the curing agent, an acid anhydride that causes little coloring in the cured resin molded product during or after curing is preferred. Among them, an acid anhydride that satisfies the following formula (a): [ka] (In the formula, A 1 represents an organic group containing two or more ring structures. Acid anhydrides (a) represented by the following formula are preferred.

[0051] In formula (a), A 1 is a (polycyclic) organic group containing two or more ring structures. The organic group is a divalent organic group. The number of carbon atoms in the organic group is preferably 5 or more, more preferably 6 or more, and even more preferably 7 or more, and is preferably 20 or less, more preferably 15 or less, even more preferably 10 or less, and particularly preferably 7 or less. The organic group is preferably a hydrocarbon group, which may contain a heteroatom such as an oxygen atom or an unsaturated bond such as a double bond. The organic group is preferably a hydrocarbon group having a bridged structure, more preferably a bicyclic hydrocarbon group having a bridged structure, and even more preferably a bicyclic hydrocarbon group having a bridged structure on a six-membered ring.

[0052] A 1 is expressed by the following formula (A1): [ka] (In the formula, R 2 represents an oxygen atom or an alkylene group. 3 represents a hydrocarbon group having two or more carbon atoms. 4 ~R 7 and each independently represent a hydrogen atom or an alkyl group. This makes it possible to more easily obtain a resin molded product that satisfies the above-mentioned relational expressions.

[0053] In formula (A1), R 2 represents an oxygen atom or an alkylene group. The alkylene group preferably has 1 to 5 carbon atoms, more preferably 1 to 3 carbon atoms, even more preferably 1 or 2 carbon atoms, and particularly preferably 1 carbon atom. R 2is preferably an alkylene group.

[0054] In formula (A1), R 3 represents a hydrocarbon group having 2 or more carbon atoms. The hydrocarbon group is a divalent hydrocarbon group. The hydrocarbon group has 2 or more carbon atoms, preferably 2 to 5 carbon atoms, more preferably 2 to 4 carbon atoms, and particularly preferably 2 carbon atoms.

[0055] R 3 The hydrocarbon group as the above is -CX 1 2-CX 2 2-(wherein, X 1 and X 2 are independently a hydrogen atom or an alkyl group) or -CX 1 =CX 2 -(in the formula, X 1 and X 2 is as described above). X 1 and X 2 The alkyl group preferably has 1 to 5 carbon atoms, more preferably 1 to 3 carbon atoms, and even more preferably 1 or 2 carbon atoms. X 1 or X 2 If there are multiple X 1 or X 2 may be the same or different. X 1 and X 2 is preferably a hydrogen atom.

[0056] In formula (A1), R 4 ~R 7 R each independently represents a hydrogen atom or an alkyl group. 4 ~R 7 The alkyl group preferably has 1 to 5 carbon atoms, more preferably 1 to 3 carbon atoms, and even more preferably 1 or 2 carbon atoms. R 4 and R 5 is preferably a hydrogen atom or an alkyl group, more preferably a hydrogen atom. R 6and R 7 is preferably a hydrogen atom.

[0057] Examples of the group represented by formula (A1) include, but are not limited to, the following. When stereoisomers exist, the examples also include each stereoisomer and a mixture of two or more stereoisomers. [ka]

[0058] Of the groups represented by formula (A1), the following are particularly preferred. [ka]

[0059] Acid anhydrides other than those mentioned above can also be used. Examples include phthalic anhydride, maleic anhydride, trimellitic anhydride, pyromellitic anhydride, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, tetrahydrophthalic anhydride, and glutaric anhydride. These may be used in combination with the acid anhydride (a) mentioned above.

[0060] The curing agent may be used alone or in combination of two or more.

[0061] The amount of curing agent to be added is not particularly limited, but is preferably 20 to 200 parts by mass per 100 parts by mass of the thermosetting resin. If the amount is less than 20 parts by mass, the curing rate will be slow, and if the amount is more than 200 parts by mass, the amount will be excessive for the curing reaction, which may cause a deterioration in various physical properties.

[0062] When the thermosetting resin is an epoxy resin and the curing agent is an acid anhydride, the equivalent ratio (A / E) of the acid anhydride group equivalent (A) to the epoxy group equivalent (E) is preferably 0.5 to 1.5, more preferably 0.8 to 1.2, and most preferably 0.9 to 1.0. If it is less than 0.5 or more than 1.5, the reactivity decreases, and the strength and heat resistance of the cured product may be impaired.

[0063] When the optical semiconductor encapsulating resin molded product of the present invention contains a curing agent, a part of the curing agent may react with the thermosetting resin.

[0064] Examples of curing accelerators include tertiary amines such as triethanolamine and dimethylbenzylamine, imidazoles such as 2-methylimidazole and 2-ethyl-4-methylimidazole, organic phosphorus compounds such as tetraphenylphosphonium tetraphenylborate and triphenylphosphine, and diazabicycloalkene compounds such as 1,8-diazabicyclo[5.4.0]undecene-7 and 1,5-diazabicyclo[4.3.0]nonene-5. These may be used alone or in combination of two or more.

[0065] The amount of the curing accelerator to be added is not particularly limited, and can be appropriately selected, for example, from the range of 0.1 to 5 parts by mass relative to 100 parts by mass of the thermosetting resin, with 0.5 to 3 parts by mass being preferred, and 1 to 2 parts by mass being more preferred. If the amount of curing accelerator added is too small, the curing rate will be slow and productivity will decrease, while if the amount of curing accelerator added is too large, the curing reaction will be too fast, making it difficult to control the reaction state and potentially causing variation in the reaction.

[0066] When the optical semiconductor encapsulating resin molded product of the present invention contains a curing accelerator, a part of the curing accelerator may react with the thermosetting resin and / or the curing agent.

[0067] The optical semiconductor encapsulating resin molded product of the present invention preferably further contains a polyhydric alcohol, which makes it possible to obtain a cured product having a lower elastic modulus and an optical semiconductor encapsulating material having even better impact absorption and impact resistance.

[0068] The polyhydric alcohol may be any compound having two or more hydroxyl groups, but is preferably a diol (glycol).

[0069] The polyhydric alcohol is preferably a polyhydric alcohol having a non-aromatic ring, since it can easily produce a resin molded product that satisfies the above-mentioned relationship formulas. The polyhydric alcohol may be an alicyclic polyhydric alcohol. The number of carbon atoms in the polyhydric alcohol is preferably 3 or more, more preferably 5 or more, and even more preferably 6 or more, and is preferably 30 or less, more preferably 20 or less.

[0070] The non-aromatic ring is more preferably a non-aromatic carbocyclic ring. The non-aromatic ring may have an unsaturated bond, but it is also preferable that it does not have an unsaturated bond. The non-aromatic ring may be monocyclic or polycyclic.

[0071] The non-aromatic ring may be a hydrocarbon ring having a bridged structure. The hydrocarbon ring having a bridged structure is preferably a bicyclic or tricyclic hydrocarbon ring having a bridged structure, and more preferably a tricyclic hydrocarbon ring having a bridged structure.

[0072] As the non-aromatic ring, a cyclohexane ring is particularly preferred.

[0073] Examples of the polyhydric alcohol include, but are not limited to, the following. When stereoisomers exist, the examples also include each stereoisomer and a mixture of two or more stereoisomers. [ka]

[0074] Polyhydric alcohols other than those mentioned above can also be used. For example, diols having preferably 2 to 10 carbon atoms, more preferably 2 to 6, and even more preferably 2 to 5 carbon atoms can be used. Examples of the diols include ethylene glycol, propylene glycol, neopentyl glycol, pentanediol, butanediol, etc., and among these, neopentyl glycol is preferred. They may be used in combination with the polyhydric alcohols having a non-aromatic ring mentioned above.

[0075] The polyhydric alcohols can be used alone or in combination of two or more.

[0076] The amount of polyhydric alcohol to be added is not particularly limited, but can be selected, for example, from the range of 5 to 200 parts by mass per 100 parts by mass of the thermosetting resin. When the curing agent is an acid anhydride, the molar ratio (B / C) of the number of moles of the polyhydric alcohol compound (B) to the number of moles of the acid anhydride (C) is preferably 0.01 to 0.70, more preferably 0.05 to 0.60, and most preferably 0.10 to 0.50. If the amount of polyhydric alcohol blended is too small, the elastic modulus of the resulting cured product may be too high, whereas if the amount of polyhydric alcohol blended is too large, the glass transition temperature and elastic modulus of the resulting cured product may be too low.

[0077] When the optical semiconductor encapsulating resin molded product of the present invention contains a polyhydric alcohol, a part of the polyhydric alcohol may be reacted with the thermosetting resin and / or the curing agent.

[0078] The resin molded product for encapsulating optical semiconductors of the present invention preferably contains an epoxy resin, an acid anhydride, a polyhydric alcohol, a reaction product of an epoxy resin and an acid anhydride, a reaction product of a polyhydric alcohol and an acid anhydride, and a curing accelerator, and satisfies at least one of the following (i) to (iii): (i) The epoxy resin has two or more consecutive ring structures (excluding oxirane rings). (ii) The acid anhydride is the acid anhydride (a) represented by the above formula (a). (iii) The polyhydric alcohol is a polyhydric alcohol having a non-aromatic ring. Such a resin molding has a high glass transition temperature and provides a cured product with a low elastic modulus at high temperatures, thereby providing an optical semiconductor encapsulant that is excellent in heat resistance, temperature cycle resistance, and solder reflow resistance, as well as in yellowing resistance, dimensional stability against temperature changes, impact absorption, and impact resistance.

[0079] Generally, as the glass transition temperature increases, the elastic modulus also tends to increase, but by satisfying at least one of the above (i) to (iii), a resin molded product can be obtained that has a high glass transition temperature and a cured product with a low elastic modulus above the glass transition temperature. The reason for this is not clear, but it is presumed that in the reaction product of an epoxy resin and an acid anhydride, or the reaction product of a polyhydric alcohol and an acid anhydride, the steric repulsion between the side chains derived from the ring structure of the epoxy resin, acid anhydride, or polyhydric alcohol is large, so that the glass transition temperature increases due to the increased rigidity of the main chain of the reaction product, and the elastic modulus decreases due to the increased free volume of the reaction product.

[0080] The resin molded product for encapsulating optical semiconductors of the present invention preferably contains at least one compound selected from the group consisting of a compound having a structural unit (I) represented by the following formula (I), a compound having a structural unit (II) represented by the following formula (II), and a compound having a structural unit (III) represented by the following formula (III): Formula (I): [ka] (In the formula, A 1 represents an organic group containing two or more ring structures. 1a represents a moiety containing an epoxy resin residue. 1b is a hydrogen atom or R 1a ) Formula (II): [ka] (In the formula, A 2 represents an organic group. 2a represents a moiety containing a residue of an epoxy resin having two or more consecutive ring structures (excluding oxirane rings). 2b is a hydrogen atom or R 2a ) Formula (III): [ka] (In the formula, A 3 represents an organic group. 3a represents an organic group having a non-aromatic ring. A resin molded product containing such a compound has a high glass transition temperature and gives a cured product with a low elastic modulus at high temperatures, thereby providing an optical semiconductor encapsulant that is excellent in heat resistance, temperature cycle resistance, and solder reflow resistance, as well as in yellowing resistance, dimensional stability against temperature changes, impact absorption, and impact resistance.

[0081] The compound having the structural unit (I) may be a reaction product of an epoxy resin and the above-mentioned acid anhydride (a). The epoxy resin for forming the structural unit (I) may be the above-mentioned epoxy resin having two or more consecutive ring structures (excluding oxirane rings), but may also be any other epoxy resin.

[0082] In formula (I), A 1 represents an organic group containing two or more ring structures. 1 is A in the above formula (a) 1 is the same as:

[0083] In formula (I), R 1a represents a moiety containing a residue of an epoxy resin. In this specification, the residue of an epoxy resin is a structure in which at least one epoxy group (oxirane ring) has been removed from an epoxy resin. R 1amay further contain one or more unreacted epoxy groups, or may contain a structure in which an epoxy group has reacted with another compound (such as a curing agent, a curing accelerator, or other additives).

[0084] In formula (I), R 1b is a hydrogen atom or R 1a R represents the bond that bonds to 1b If is a bond, R 1a It bonds to form a ring.

[0085] In the compound having the structural unit (I), the adjacent A 1 The number of atoms in the main chain between is preferably 6 to 17. The number of atoms is more preferably 13 or less, and even more preferably 9 or less. The number of atoms may also be 10 or more, or 14 or more. The adjacent A above 1 The number of atoms in the main chain between one A 1 The closest A to 1 The number of atoms in the main chain is the number of atoms on the shortest path along the bond. 1 The atoms that make up the carbonyl group, the oxygen atom, and R 1a and R 1b The atoms that make up the atom are not included. Adjacent A 1 When the number of atoms in the main chain between is within the above range, the rigidity and free volume of the main chain of the compound are further increased, so that a cured product having a higher glass transition temperature and a lower elastic modulus at high temperatures can be obtained, and an optical semiconductor encapsulant having even more excellent heat resistance, temperature cycle resistance, solder reflow resistance, yellowing resistance, dimensional stability against temperature changes, impact absorption, and impact resistance can be obtained.

[0086] The compound having the structural unit (II) may be a reaction product of the epoxy resin having two or more consecutive ring structures (excluding oxirane rings) described above with an acid anhydride. The acid anhydride for forming the structural unit (II) may be the acid anhydride (a) described above, or may be an acid anhydride other than the acid anhydride.

[0087] In formula (II), A 2 represents an organic group, which is a divalent organic group. The organic group preferably has 2 or more carbon atoms, more preferably 6 or more carbon atoms, and preferably 20 or less, more preferably 15 or less, and even more preferably 10 or less carbon atoms. The organic group is preferably a hydrocarbon group, which may contain a heteroatom such as an oxygen atom or an unsaturated bond such as a double bond. The organic group may have a ring structure, and preferably has a ring structure.

[0088] In formula (II), R 2a represents a moiety containing a residue of an epoxy resin having two or more consecutive ring structures (excluding oxirane rings). The epoxy resin having two or more consecutive ring structures (excluding oxirane rings) is as described above. R 2a may further contain one or more unreacted epoxy groups, or may contain a structure in which an epoxy group has reacted with another compound (such as a curing agent, a curing accelerator, or other additives).

[0089] In formula (II), R 2b is a hydrogen atom or R 2a R represents the bond that bonds to 2b If is a bond, R 2a It bonds to form a ring. 2b is R 2a It is preferable that the bond is a bond to

[0090] The compound having the structural unit (III) may be a reaction product of a polyhydric alcohol having a non-aromatic ring and an acid anhydride. The acid anhydride for forming the structural unit (III) may be the above-mentioned acid anhydride (a), or may be an acid anhydride other than the above-mentioned acid anhydride.

[0091] In formula (III), A 3 represents an organic group. 3 The organic group as the above-mentioned A2 The organic groups are the same as those mentioned above.

[0092] In formula (III), R 3a represents an organic group having a non-aromatic ring. The organic group is a divalent organic group. The number of carbon atoms in the organic group is preferably 3 or more, more preferably 5 or more, and even more preferably 6 or more, and is preferably 30 or less, and more preferably 20 or less. The organic group is preferably a hydrocarbon group, which may contain a heteroatom such as an oxygen atom or an unsaturated bond such as a double bond. Examples of the non-aromatic ring contained in the organic group include the same non-aromatic rings as those in the polyhydric alcohols having a non-aromatic ring described above. R 3a may be a group obtained by removing two hydroxyl groups from the above-mentioned polyhydric alcohol having a non-aromatic ring.

[0093] When the molded resin article for encapsulating an optical semiconductor of the present invention contains a compound having the structural unit (III), it preferably further contains a compound having a structural unit (IV) represented by the following formula (IV): Formula (IV): [ka] (In the formula, A 3 As mentioned above, R 4a represents a moiety containing an epoxy resin residue. 4b is a hydrogen atom or R 4a )

[0094] The compound having the structural unit (IV) may be a reaction product of an epoxy resin and an acid anhydride. The epoxy resin for forming the structural unit (IV) may be the above-mentioned epoxy resin having two or more consecutive ring structures (excluding oxirane rings), or may be any other epoxy resin. The acid anhydride for forming the structural unit (IV) may be the above-mentioned acid anhydride (a), or may be any other acid anhydride.

[0095] In formula (IV), R 4a represents a moiety containing an epoxy resin residue. 4a may further contain one or more unreacted epoxy groups, or may contain a structure in which an epoxy group has reacted with another compound (such as a curing agent, a curing accelerator, or other additives).

[0096] In formula (IV), R 4b is a hydrogen atom or R 4a R represents the bond that bonds to 4b If is a bond, R 4a It bonds to form a ring.

[0097] In addition to the above-mentioned components, the resin molded product for encapsulating optical semiconductors of the present invention may contain additives such as color inhibitors, lubricants, modifiers, deterioration inhibitors, mold release agents, phosphors that change the wavelength of light, and inorganic or organic fillers that diffuse light, as needed. Fillers such as silica powder may be added to the extent that they do not impair light transmission.

[0098] Examples of the coloring inhibitor include phenolic compounds, amine compounds, organic sulfur compounds, and phosphine compounds.

[0099] Examples of lubricants include waxes such as stearic acid, magnesium stearate, and calcium stearate, and talc. When the lubricant is added, the amount of the lubricant added is appropriately determined depending on the molding conditions, but it is preferable to set the amount to 0.1 to 0.4% by mass of the entire resin molded product, for example.

[0100] Examples of phosphors that change the wavelength of light and inorganic and organic fillers that diffuse light include quartz glass powder, talc, silica powders such as fused silica powder and crystalline silica powder, alumina, silicon nitride, aluminum nitride, and silicon carbide. When phosphors or inorganic and organic fillers are added, their amounts are appropriately set according to the molding conditions. Specifically, in the case of phosphors, the amount of phosphor added can be appropriately set within the range of 1% to 60% by mass of the total resin molded product. On the other hand, in the case of light-scattering fillers (organic and inorganic), the amount of light-scattering filler can be appropriately set within the range of 0.5% to 25% by mass of the total resin molded product.

[0101] The resin molded product for optical semiconductor encapsulation of the present invention is preferably transparent from an optical viewpoint, since it is used for resin encapsulation of optical semiconductor elements such as light-receiving elements. Here, "transparent" means that the cured product of the molded product has a transmittance of 90% or more at 400 nm. Note that when the molded product contains additives such as phosphors that shift the wavelength of light or inorganic or organic fillers that diffuse light, the transmittance refers to the transmittance of the resin portion excluding the additives.

[0102] The resin molded article for optical semiconductor encapsulation of the present invention may be, for example, a step of kneading a thermosetting resin, a curing agent, a curing accelerator, and optionally a polyhydric alcohol to obtain a curable resin composition; heat-treating the curable resin composition; granulating the curable resin composition to obtain a granular curable resin composition; a step of molding the granular curable resin composition; It can be suitably produced by a production method including the steps of:

[0103] The kneading method is not particularly limited, but examples thereof include a method using an extruder, etc. The kneading temperature is also not particularly limited, and can be appropriately changed depending on the properties of the thermosetting resin.

[0104] The shape of the curable resin composition obtained by kneading is not particularly limited, and examples thereof include a film, a sheet, granules, and a block.

[0105] The curable resin composition obtained by kneading is heat-treated to obtain a B-stage (semi-cured) optical semiconductor encapsulating resin composition. The heat treatment temperature and heat treatment time are not particularly limited and can be changed appropriately depending on the properties of the thermosetting resin.

[0106] The heat-treated resin composition is granulated to obtain a granular curable resin composition. Before granulation, the resin composition can be pulverized using a ball mill, turbo mill, or the like. The granulation method is not particularly limited, but examples include a method using a dry compression granulator. The average particle size of the granules obtained by granulation is not particularly limited, but is preferably 1 to 5000 μm, more preferably 100 to 2000 μm. If the average particle size exceeds 5000 μm, the compressibility tends to decrease.

[0107] The obtained granular curable resin composition is molded to obtain a molded product. Examples of molded products include tablets and sheets, and molding methods include tableting to obtain tablets and extrusion to obtain sheets. As described above, the obtained molded product satisfies the specific relationship, and therefore can provide a cured product with a high glass transition temperature and a low elastic modulus, and can provide an optical semiconductor encapsulant that is excellent in heat resistance, temperature cycle resistance, and solder reflow resistance.

[0108] When the molded product is a tablet, the conditions for tablet compression are adjusted appropriately depending on the composition, average particle size, particle size distribution, etc. of the particulate curable resin composition, but in general, it is preferable to set the compression rate during tablet compression to 90 to 96%. That is, if the compression rate value is less than 90%, the density of the tablet may be low and it may be prone to cracking, and conversely, if the compression rate value is more than 96%, cracks may occur during tablet compression, causing chipping or breakage when released from the mold.

[0109] The optical semiconductor encapsulating resin molded product of the present invention can encapsulate an optical semiconductor element by a molding method such as transfer molding. An optical semiconductor encapsulant obtained by molding the optical semiconductor encapsulating resin molded product of the present invention also constitutes the present invention. Since the optical semiconductor encapsulant of the present invention is obtained from the resin molded product of the present invention, it has excellent heat resistance, temperature cycle resistance, and solder reflow resistance. Furthermore, it also has excellent yellowing resistance, dimensional stability against temperature changes, impact absorption, and impact resistance. Therefore, cracking and peeling are minimal even when used in high-temperature environments or during solder reflow processes, reducing damage to the encapsulated optical semiconductor element. In this specification, an optical semiconductor encapsulant is a member that is formed so as to cover an optical semiconductor element that constitutes an optical semiconductor device, and encapsulates the element.

[0110] The present invention also provides an optical semiconductor device comprising an optical semiconductor element and the optical semiconductor encapsulant of the present invention that encapsulates the optical semiconductor element. Because the optical semiconductor device of the present invention comprises the optical semiconductor encapsulant of the present invention, cracking and peeling of the encapsulant are minimal, and damage to the optical semiconductor element is minimal, even when the optical semiconductor device is operated in a high-temperature environment.

[0111] The resin molded product for sealing optical semiconductors of the present invention is often used in high-temperature environments and can be particularly suitably used for sealing on-board optical semiconductors which are often subjected to a solder reflow process. [Example]

[0112] The present invention will now be described in more detail with reference to examples, but the present invention is not limited to these examples.

[0113] The materials used are listed below. Epoxy resin A: Triglycidyl isocyanurate (Nissan Chemical TEPIC-S, epoxy equivalent 100) Epoxy resin B: Bisphenol A epoxy resin (Mitsubishi Chemical Corporation, JER-1002W, epoxy equivalent 650) Epoxy resin C: Epoxy resin represented by the following formula (DE-102 manufactured by JXTG Corporation, epoxy equivalent weight 111) [ka] Epoxy resin D: Epoxy resin represented by the following formula (DE-103 manufactured by JXTG Corporation, epoxy equivalent weight 174) [ka] Acid anhydride A: a mixture of bicyclo[2.2.1]heptane-2,3-dicarboxylic anhydride and 5-methylbicyclo[2.2.1]heptane-2,3-dicarboxylic anhydride represented by the following formula (Rikacid HNA-100, manufactured by New Japan Chemical Co., Ltd., acid anhydride equivalent: 179) [ka] [ka] Acid anhydride B: cis-5-norbornene-exo-2,3-dicarboxylic acid anhydride represented by the following formula [ka] Acid anhydride C: Hexahydrophthalic anhydride (Rikacid HH manufactured by New Japan Chemical Co., Ltd.) Diol additive A: Neopentyl glycol (Mitsubishi Gas Chemical Company, Inc.) Diol additive B: Hydrogenated bisphenol A (Rikavinol HB, manufactured by New Japan Chemical Co., Ltd.) Curing accelerator: 2-ethyl-4-methylimidazole

[0114] Examples 1 to 16 and Comparative Examples 1 to 2 The components shown in Tables 1 and 2 were melt-mixed at 50 to 140°C in the proportions shown in the tables, and then cooled to obtain an epoxy resin composition. The reactivity of the obtained epoxy resin composition was adjusted at 40 to 80°C, pulverized, and tablet-molded to produce resin tablets for sealing optical semiconductors.

[0115] Using the tablets prepared in each Example and Comparative Example, various physical properties were measured by the methods described below, and solder reflow resistance and hot hardness were evaluated. The results are shown in Tables 1 and 2.

[0116] <Preparation of test specimen (hardened body)> The tablets prepared as described above were molded in a dedicated mold (curing conditions: heated at 150°C for 4 minutes) to prepare cured test specimens of a size appropriate for the measurement method. These were then heated at 150°C for 3 hours to complete curing, yielding test specimens.

[0117] <Storage modulus E'> The test specimens (size: width 5 mm x length 35 mm x thickness 1 mm) prepared above were used to obtain the storage modulus E' of the test specimens using an RSA-II manufactured by RHEOMETRIC SCIENTIFIC under the measurement conditions of tensile mode, frequency 1 Hz, scanning temperature 0 to 270°C, and heating rate 10°C / min, and the storage modulus E' of the cured body was calculated at measurement temperatures of 265°C and 100°C.

[0118] <Glass transition temperature (Tg)> Using an RSA-II manufactured by RHEOMETRIC SCIENTIFIC, the storage modulus E' and loss modulus E'' of the test piece (size: width 5 mm x length 35 mm x thickness 1 mm) prepared above were measured under the following measurement conditions: tension mode, frequency 1 Hz, scanning temperature 0 to 270°C, and heating rate 10°C / min. From these, a curve of tanδ (= E'' / E') was calculated, and the peak top temperature of tanδ was calculated.

[0119] <Linear transmittance> First, a quartz cell was filled with liquid paraffin manufactured by Fujifilm Wako Pure Chemical Industries, Ltd., and a baseline was measured using a V-670 spectrophotometer manufactured by JASCO Corporation. Then, the test piece (size: width 50 mm × length 50 mm × thickness 1 mm) prepared as described above was immersed in liquid paraffin in the quartz cell before and after the solder reflow described below, and the light transmittance at each wavelength (wavelength 300 nm, wavelength 400 nm, wavelength 450 nm) was measured.

[0120] <Solder reflow> The test piece was passed through a reflow furnace (top peak 265°C x 10 seconds) three times.

[0121] <Creating an evaluation package> As shown in Figure 1, the tablets prepared above were molded to cover the edge of a reliability evaluation frame (Ag) manufactured by Hirai Precision Industry Co., Ltd., with dimensions of 5 mm wide x 6 mm long x 2 mm thick (curing conditions: heated at 150°C for 4 minutes). This was heated at 150°C for 3 hours to completely cure the tablet, yielding an evaluation package. Twenty of these packages were produced for each example and comparative example.

[0122] <Solder reflow resistance> The above package was passed through a reflow oven (top peak 265°C x 10 seconds) three times. The package was then immersed in Taiyo Bussan's red ink and decompressed for 10 minutes. After that, the package was removed and visually inspected for ink penetration. Packages with ink penetration were judged to have peeling defects. The number of peeling defects out of 20 packages was counted, and solder reflow resistance was evaluated according to the following criteria. 〇:0~5 pieces ×:6 or more

[0123] <Temperature Cycle Test (TCT)> The above package was exposed to a high temperature (130°C) and a low temperature (-40°C) for 15 minutes each. The return to each temperature was completed within 5 minutes. This constitutes one cycle, and the above package was subjected to a temperature cycle test of 1000 cycles. The package was then removed and inspected for cracks. The number of packages with cracks out of 20 packages was counted and evaluated according to the following criteria. 〇:0~5 pieces ×:6 or more

[0124] <Hardness when heated> The hot hardness of the test pieces (size: width 50 mm x length 50 mm x thickness 3 mm) prepared above was measured at 200°C using a Shore A hardness tester, and evaluated according to the following criteria. ○: Hot hardness less than 70 ×: Hardness when heated 70 or more

[0125] [Table 1]

[0126] [Table 2] [Industrial Applicability]

[0127] The present invention relates to an optical semiconductor encapsulating resin molded product used for encapsulating an optical semiconductor element, an optical semiconductor encapsulant, and an optical semiconductor device, and can be used in the manufacture of an optical semiconductor device.

Claims

1. satisfies the following relational expression (1), further satisfies the following relational expression (3) or (4), and the storage elastic modulus at 265 °C of a cured body (size: width 5 mm × length 35 mm × thickness 1 mm) obtained by the following method is 1.4 × 10 6 Pa or more, a resin molded product for encapsulating an optical semiconductor. 0.0005≦E' ２６５℃ / E' １００℃ ≦0.0050 (1) (In the formula, E' ２６５℃ and E' １００℃ represent the storage modulus (Pa) at 265°C and 100°C of the cured product (size: width 5 mm x length 35 mm x thickness 1 mm) obtained by the method described below. (Method for producing a cured body) The resin molded product is heated and molded at 150 °C for 4 minutes, and then heated at 150 °C for 3 hours to obtain a cured body. Y <6300000> (130 ≤ X < 150) (3) Y < 160000X - 17000000 (150 ≤ X ≤ 190) (4) (In formulas (3) and (4), X represents the glass transition temperature (°C) of the cured body (size: width 5 mm × length 35 mm × thickness 1 mm) obtained by the above method, and Y represents the storage elastic modulus (Pa) of the cured body at 265 °C.)

2. The resin molded product for encapsulating an optical semiconductor according to Claim 1, which satisfies the following relational expression (5). 0.70<R ４５０ｎｍ <1.00 (5) (In the formula, R ４５０ｎｍ represents the ratio of linear transmittance (after / before) at a wavelength of 450 nm before and after solder reflow at 265° C., when the cured product (size: width 50 mm × length 50 mm × thickness 1 mm) obtained by the above method was subjected to solder reflow three times.

3. The resin molded product for encapsulating an optical semiconductor according to Claim 1 or 2, which satisfies the following relational expressions (6) and (7). 0.80<R ４００ｎｍ / R ４５０ｎｍ <1.00 (6) 0.10<R ３００ｎｍ / R ４５０ｎｍ <0.50 (7) (In each formula, R ３００ｎｍ , R ４００ｎｍ and R ４５０ｎｍ Each of the ratios (after / before) of linear transmittance at wavelengths of 300 nm, 400 nm, and 450 nm before and after solder reflow was performed three times at 265° C. on a cured product (size: width 50 mm × length 50 mm × thickness 1 mm) obtained by the above method.

4. The resin molded product for encapsulating an optical semiconductor according to any one of Claims 1 to 3, wherein the linear transmittance at a wavelength of 450 nm is 70% or more when the cured body (size: width 50 mm × length 50 mm × thickness 1 mm) is obtained by the above method.

5. The resin molded product for encapsulating an optical semiconductor according to any one of Claims 1 to 4, which contains a thermosetting resin, a curing agent, a reaction product of the thermosetting resin and the curing agent, and a curing accelerator.

6. The resin molded product for encapsulating an optical semiconductor according to Claim 5, which further contains a polyhydric alcohol and a reaction product of the polyhydric alcohol and the curing agent.

7. The resin molded product for encapsulating an optical semiconductor according to any one of Claims 1 to 6, which contains at least one selected from the group consisting of a compound having a structural unit (I) represented by the following formula (I), a compound having a structural unit (II) represented by the following formula (II), and a compound having a structural unit (III) represented by the following formula (III). Formula (I): 【Chemistry 1】 (In the formula, A １ R represents an organic group containing two or more ring structures. １ａ represents a moiety containing a residue of an epoxy resin. １ｂ is a hydrogen atom, or R １ａ represents the bond that bonds to Formula (II): 【Chemistry 2】 (In the formula, A ２ represents an organic group. ２ａ R represents a moiety containing a residue of an epoxy resin having two or more consecutive ring structures (excluding oxirane rings). ２ｂ is a hydrogen atom, or R ２ａ represents the bond that bonds to Formula (III): 【Chemistry 3】 (In the formula, A ３ represents an organic group. ３ａ represents an organic group having a non-aromatic ring.

8. An optical semiconductor encapsulant obtained by molding the resin molded product for encapsulating an optical semiconductor according to any one of Claims 1 to 7.

9. An optical semiconductor device including an optical semiconductor element and the optical semiconductor encapsulant according to Claim 8 for encapsulating the optical semiconductor element.

10. satisfies the following relational expression (1), Further, the following relational expressions (6) and (7) are satisfied, and a storage modulus at 265° C. of a cured product (size: width 5 mm×length 35 mm×thickness 1 mm) obtained by the method described below is 1.4×10 6 Pa or more. 0.0005≦E' ２６５℃ / E' １００℃ ≦0.0050 (1) (In the formula, E' ２６５℃ and E' １００℃ represent the storage modulus (Pa) at 265°C and 100°C of the cured product (size: width 5 mm x length 35 mm x thickness 1 mm) obtained by the method described below. (Method of Producing a Hardened Body) The resin molded product is molded by heating at 150° C. for 4 minutes, and then heated at 150° C. for 3 hours to obtain a cured product. 0.80<R ４００ｎｍ / R ４５０ｎｍ <1.00 (6) 0.10<R ３００ｎｍ / R ４５０ｎｍ <0.50 (7) (In formulas (6) and (7), R ３００ｎｍ , R ４００ｎｍ and R ４５０ｎｍ Each of the ratios (after / before) of linear transmittance at wavelengths of 300 nm, 400 nm, and 450 nm before and after solder reflow was performed three times at 265° C. on a cured product (size: width 50 mm × length 50 mm × thickness 1 mm) obtained by the above method.

11. 11. The resin molded article for encapsulating an optical semiconductor according to claim 10, wherein a cured product (dimensions: width 5 mm × length 35 mm × thickness 1 mm) obtained by the above method has a glass transition temperature of 130° C. or higher and satisfies the following relational expression (2): Y<160000X-14500000 (2) (In the formula, X represents the glass transition temperature (° C.) of the cured body, and Y represents the storage modulus (Pa) of the cured body at 265° C.)

12. 12. The resin molded product for sealing an optical semiconductor according to claim 10, which satisfies the following relational expression (5): 0.70<R ４５０ｎｍ <1.00 (5) (In the formula, R ４５０ｎｍ represents the ratio of linear transmittance (after / before) at a wavelength of 450 nm before and after solder reflow at 265° C., when the cured product (size: width 50 mm × length 50 mm × thickness 1 mm) obtained by the above method was subjected to solder reflow three times.

13. The resin molded product for sealing an optical semiconductor according to any one of claims 10 to 12, which has a linear transmittance of 70% or more at a wavelength of 450 nm when cured by the method (dimensions: width 50 mm × length 50 mm × thickness 1 mm).

14. 14. The optical semiconductor encapsulating resin molded article according to claim 10, comprising a thermosetting resin, a curing agent, a reaction product of the thermosetting resin and the curing agent, and a curing accelerator.

15. 15. The optical semiconductor encapsulating resin molded article according to claim 14, further comprising a polyhydric alcohol, and a reaction product of a polyhydric alcohol and a curing agent.

16. The resin molded product for sealing an optical semiconductor according to any one of claims 10 to 15, comprising at least one selected from the group consisting of a compound having a structural unit (I) represented by the following formula (I), a compound having a structural unit (II) represented by the following formula (II), and a compound having a structural unit (III) represented by the following formula (III): Formula (I): 【Chemistry 4】 (In the formula, A １ R represents an organic group containing two or more ring structures. １ａ represents a moiety containing a residue of an epoxy resin. １ｂ is a hydrogen atom, or R １ａ represents the bond that bonds to Formula (II): 【Chemistry 5】 (In the formula, A ２ represents an organic group. ２ａ R represents a moiety containing a residue of an epoxy resin having two or more consecutive ring structures (excluding oxirane rings). ２ｂ is a hydrogen atom, or R ２ａ represents the bond that bonds to Formula (III): 【Chemistry 6】 (In the formula, A ３ represents an organic group. ３ａ represents an organic group having a non-aromatic ring.

17. An optical semiconductor encapsulant obtained by molding the optical semiconductor encapsulating resin molded product according to any one of claims 10 to 16.

18. An optical semiconductor device comprising: an optical semiconductor element; and the optical semiconductor encapsulant according to claim 17 for encapsulating the optical semiconductor element.

Images