Power conversion device and method for manufacturing the same

Abstract

To provide a power conversion device that can be downsized and a manufacturing method thereof.SOLUTION: A winding wound around a magnetic body 37 is formed by a first winding pattern 51 formed on a first printed circuit board 25, a winding member 61 including first winding members 61a and 61c and second winding members 61b and 61d, and a second winding pattern 81 formed on a second printed circuit board 41. The first printed circuit board 25 and the second printed circuit board 41 are arranged to face each other in the Z-axis direction so as to sandwich the magnetic body 37 therebetween. The first winding members 61a and 61c and the second winding members 61b and 61d are arranged so as to sandwich the magnetic body 37 between the first printed circuit board 25 and the second printed circuit board 41.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present disclosure relates to a power conversion device and a manufacturing method thereof. [Background technology]

[0002] A printed circuit board in a power converter is equipped with, for example, a reactor and a transformer, which are winding devices having a winding wound around a magnetic body. In Patent Document 1, a transformer unit having an E-shaped core is mounted on the printed circuit board.

[0003] In the power conversion device, in order to place the E-shaped core on the printed circuit board, the printed circuit board is provided with an opening (through hole) through which part of the E-shaped core is inserted. Furthermore, on the printed circuit board, a winding pattern for winding the E-shaped core is formed around the opening. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2010-178439 A Summary of the Invention [Problem to be solved by the invention]

[0005] As described above, in the printed circuit board of the power conversion device, it is necessary to form an opening for inserting the magnetic material and a winding pattern around the opening, which places a limit on how much area the reactor or transformer, etc., occupies, and this is considered to be one of the factors that hinders the miniaturization of the power conversion device.

[0006] The present disclosure has been made based on such development, and one object of the present disclosure is to provide a power conversion device that can be miniaturized, and another object of the present disclosure is to provide a method for manufacturing such a power conversion device. [Means for solving the problem]

[0007] The power conversion device according to the present disclosure is a power conversion device including a winding device having a winding arranged on a magnetic body, and the winding device includes a first printed circuit board, a second printed circuit board, a magnetic body, a winding member, and a fixing member. A first winding pattern is formed on the first printed circuit board. The second printed circuit board is disposed so as to face the first printed circuit board at a distance in a first direction, and a second winding pattern is formed on the second printed circuit board. The magnetic body is connected to the first printed circuit board and the second printed circuit board. The winding members are arranged so as to span between the first printed circuit board and the second printed circuit board, and include a first winding member and a second winding member which are electrically connected to the first winding pattern and to the second winding pattern. The fixing member holds the magnetic body sandwiched between the first printed circuit board and the second printed circuit board. The winding includes a first winding pattern, a winding member, and a second winding pattern. The first winding pattern, the winding member, and the second winding pattern are arranged so as to wind around the magnetic body. Between the magnetic body and the winding member At least in part An air gap is provided. The first printed circuit board includes a winding support portion that extends from the first printed circuit board toward the second printed circuit board and supports the winding member.

[0008] A method for manufacturing a power conversion device according to the present disclosure includes a step of manufacturing a winding device in which a winding is arranged on a magnetic body, and the step of manufacturing the winding device includes the following steps: preparing a first printed circuit board on which a first winding pattern is formed as a winding; preparing a second printed circuit board on which a second winding pattern is formed as a winding; preparing a magnetic body to be arranged between the first printed circuit board and the second printed circuit board; preparing a winding member as a winding having a first end and a second end, the first end being electrically connected to the first winding pattern and the second end being electrically connected to the second winding pattern; arranging the winding member so that the first end of the winding member is electrically connected to the first winding pattern on the first printed circuit board; arranging the magnetic body on the first printed circuit board in a manner to be sandwiched between the winding member; arranging a second printed circuit board so as to cover the magnetic body, and electrically connecting the second end of the winding member to the second winding pattern on the second printed circuit board. In the step of arranging the magnetic body, the magnetic body is arranged in such a manner that a gap is provided between the magnetic body and the winding member. The process of arranging the winding member includes a process of forming a winding support portion that supports the winding member by raising a portion of the first printed circuit board toward the side where the second printed circuit board is to be arranged, and a process of arranging the winding member on the winding support portion. Effect of the Invention

[0009] According to the power conversion device of the present disclosure, a winding wound around a magnetic body is formed by a first winding pattern formed on a first printed circuit board, a winding member including a first winding member and a second winding member, and a second winding pattern formed on a second printed circuit board. The first printed circuit board and the second printed circuit board are arranged to face each other in a first direction so as to sandwich the magnetic body. The first winding member and the second winding member are arranged to span between the first printed circuit board and the second printed circuit board so as to sandwich the magnetic body. This can reduce the area occupied by the winding device, which can contribute to the miniaturization of the power conversion device.

[0010] According to the method for manufacturing a power conversion device disclosed herein, a winding to be wound around a magnetic body is formed by a first winding pattern, a winding member, and a second winding pattern. A winding member is disposed on a first printed circuit board on which the first winding pattern is formed, and the magnetic body is disposed so as to be sandwiched between the winding members. A second printed circuit board on which the second winding pattern is formed is disposed so as to cover the magnetic body. This makes it possible to manufacture a power conversion device that can reduce the area occupied by the winding device. [Brief description of the drawings]

[0011] [Figure 1] 1 is a circuit diagram of a DC-DC converter as an example of a power conversion device according to each embodiment. [Diagram 2] 1 is a perspective view showing an example of a power conversion device according to a first embodiment. [Diagram 3] FIG. 2 is an exploded perspective view showing an example of a smoothing reactor in the power conversion device in the embodiment. [Figure 4] 2 is a perspective view showing an example of a winding member applied to a smoothing reactor in the embodiment. FIG. [Diagram 5] 11 is a perspective view showing another example of a winding member applied to the smoothing reactor in the embodiment. FIG. [Figure 6] FIG. 4 is a plan view for explaining a four-layer structure of a second printed circuit board in the smoothing reactor in the embodiment. [Figure 7] FIG. 2 is an exploded perspective view illustrating the structure of a smoothing reactor including a second printed circuit board with a four-layer structure in the embodiment. [Figure 8] 8 is a cross-sectional view taken along line VIII-VIII in FIG. 6 in the embodiment. [Figure 9] FIG. 2 is an exploded perspective view illustrating a current flow in a smoothing reactor including a second printed circuit board having a four-layer structure in the embodiment. [Figure 10] FIG. 2 is a partial perspective view for explaining the arrangement of windings wound around a magnetic body in the embodiment. [Figure 11] 4 is a diagram for explaining a correspondence relationship between the symbols of smoothing reactors and windings in the embodiment. FIG. [Figure 12] FIG. 4 is a side view showing a smoothing reactor according to a comparative example. [Figure 13] FIG. 11 is a plan view for explaining the structure of a printed circuit board in a smoothing reactor according to a comparative example. [Figure 14] 11 is a cross-sectional view showing an example of a smoothing reactor in a power conversion device according to a second embodiment. FIG. [Figure 15] 2 is a perspective view showing an example of a winding member applied to a smoothing reactor in the embodiment. FIG. [Figure 16] 11 is a perspective view showing another example of a winding member applied to the smoothing reactor in the embodiment. FIG. [Figure 17] 13 is a perspective view showing still another example of a winding member applied to the smoothing reactor in the embodiment. FIG. [Figure 18] 11 is a cross-sectional view showing an example of a smoothing reactor in a power conversion device according to a third embodiment. FIG. [Figure 19] 2 is a perspective view showing an example of a winding member applied to a smoothing reactor in the embodiment. FIG. [Figure 20] 11 is a perspective view showing another example of a winding member applied to the smoothing reactor in the embodiment. FIG. [Figure 21] FIG. 11 is an exploded perspective view showing an example of a smoothing reactor in a power conversion device according to a fourth embodiment. [Figure 22] 22 is a cross-sectional view taken along line XXII-XXII in FIG. 21 in the embodiment. [Figure 23] 2 is a perspective view showing a step of a manufacturing method of the smoothing reactor in the embodiment. FIG. [Figure 24] 24 is a perspective view showing a step performed after the step shown in FIG. 23 in the embodiment. FIG. [Diagram 25] 25 is a perspective view showing a step performed after the step shown in FIG. 24 in the embodiment. FIG. [Figure 26] 26 is a perspective view showing a step performed after the step shown in FIG. 25 in the embodiment. FIG. [Figure 27] 13 is a cross-sectional view showing an example of a smoothing reactor in a power conversion device according to a fifth embodiment. FIG. [Figure 28] FIG. 11 is a perspective view conceptually showing a structure of a smoothing reactor according to a first modified example in the power conversion device according to each embodiment. [Figure 29] FIG. 11 is a perspective view conceptually showing a structure of a smoothing reactor according to a second modified example in the power conversion device according to each embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] First, an example of a circuit diagram of a power conversion device according to each embodiment will be described. Fig. 1 shows a circuit diagram of a DC-DC converter as an example of a power conversion device. The DC-DC converter is mounted on, for example, an electric vehicle. The DC-DC converter has a function of converting an input voltage of a lithium ion battery of about 100V to 300V into a voltage of 12V to 15V and outputting the converted voltage to charge a lead storage battery. The output power of the DC-DC converter is, for example, 2kW.

[0013] 1, the power conversion device 1 includes four MOS transistors 3 (MOSFETs: Metal Oxide Semiconductor Field Effect Transistors), a transformer 5, two diodes 7, a smoothing reactor 9, a smoothing capacitor 11, an input terminal 13, and an output terminal 15. The transformer 5 has a primary winding 5a and a secondary winding 5b.

[0014] By controlling the switching of the four MOS transistors 3, a voltage (DC) input to the input terminal 13 is converted into an AC voltage. The AC voltage is input to the primary winding 5a of the transformer 5. In the transformer 5, the AC voltage input to the primary winding 5a is converted into an arbitrary AC voltage according to the turn ratio between the primary winding 5a and the secondary winding 5b. The converted AC voltage is supplied to the secondary winding 5b. The primary winding 5a and the secondary winding 5b are electrically insulated from each other.

[0015] The diode 7 converts the AC voltage supplied from the transformer 5 (secondary winding 5b) back into a DC voltage. The smoothing reactor 9 and the smoothing capacitor 11 smooth the DC voltage converted by the diode 7, and stabilize the output voltage output from the output terminal 15.

[0016] The power conversion device 1 is equipped with a plurality of components (devices) such as four MOS transistors 3, a transformer 5, two diodes 7, and a smoothing reactor 9. The smoothing reactor 9 or the transformer 5, which is a winding device having a winding arranged on a magnetic body, is required to have a reduced occupied area. Furthermore, these components generate heat when electricity is passed through them. These heat-generating components need to be cooled so that their temperatures do not exceed a rated temperature. Each embodiment will be specifically described below.

[0017] Embodiment 1 An example of a power conversion device according to the first embodiment will be described. As shown in Fig. 2, in the power conversion device 1, a MOS transistor 3, a transformer 5, two diodes 7, a smoothing reactor 9, and a smoothing capacitor 11 are mounted on a first printed circuit board 25. An input terminal 13 electrically connected to the MOS transistor 3 is provided on the first printed circuit board 25. Also, an output terminal 15 electrically connected to the smoothing capacitor 11 is provided on the first printed circuit board 25. The input terminal 13 and the output terminal 15 are electrically connected to a conductive pattern (not shown) provided on the first printed circuit board 25, for example, by soldering.

[0018] The power conversion device 1 is equipped with a smoothing reactor 9 and a transformer 5 as winding devices. Next, the winding devices will be specifically described by taking the smoothing reactor 9 as an example.

[0019] 3, the smoothing reactor 9 as a winding device includes a magnetic body 35, a winding member 61, and a second printed circuit board 41 in addition to a first printed circuit board 25. The first printed circuit board 25 and the second printed circuit board 41 are arranged to face each other at a distance in the Z-axis direction as a first direction. The magnetic body 35 is arranged between the first printed circuit board 25 and the second printed circuit board 41.

[0020] An elastic member 33a may be interposed between the first printed circuit board 25 and the magnetic body 35. An elastic member 33b may be interposed between the magnetic body 35 and the second printed circuit board 41. The elastic member 33a has through holes 33aa and 33ab formed therein. The elastic member 33b has through holes 33ba and 33bb formed therein.

[0021] The first printed circuit board 25 has through holes 25a, 25b, 25c, and 25d formed therein. The magnetic body 35 is a magnetic body 37 having through holes 37a and 37b formed therein. The through holes 37a and 37b are formed to penetrate the magnetic body 37 along the Z-axis direction. The through holes 37a and 37b are formed at a distance from each other in the X-axis direction. The second printed circuit board 41 has through holes 43a, 43b, 43c, and 43d formed therein.

[0022] The winding member 61 includes a first winding member 61a, a second winding member 61b, a first winding member 61c, and a second winding member 61d. The winding member 61 is formed of a copper plate having a thickness of about 1 mm, for example. As shown in FIG. 4, the winding member 61 has a first extending portion 63, a first connecting portion 65 as a first end portion, a second connecting portion 67 as a second end portion, and a positioning portion 69. The first extending portion 63 is inserted into the through holes 37a and 37b of the magnetic body 37.

[0023] The first extending portion 63 is attached substantially perpendicularly from the first printed circuit board 25 toward the second printed circuit board 41. As shown in Fig. 5, the winding member 61 may be formed in a tapered shape such that the first connecting portion 65 and the second connecting portion 67 have a narrower width than the first extending portion 63.

[0024] The first winding member 61a is inserted through the through holes 37a, 33aa, and 33ba. The first connection portion 65 of the first winding member 61a is connected to the through hole 25a. The second connection portion 67 of the first winding member 61a is connected to the through hole 43a. The second winding member 61b is inserted through the through holes 37b, 33ab, and 33bb. The first connection portion 65 of the second winding member 61b is connected to the through hole 25b. The second connection portion 67 of the second winding member 61b is connected to the through hole 43b.

[0025] The first winding member 61c is inserted through the through holes 37a, 33aa, and 33ba. The first connection portion 65 of the first winding member 61c is connected to the through hole 25c. The second connection portion 67 of the first winding member 61c is connected to the through hole 43c. The second winding member 61d is inserted through the through holes 37b, 33ab, and 33bb. The first connection portion 65 of the second winding member 61d is connected to the through hole 25d. The second connection portion 67 of the second winding member 61d is connected to the through hole 43d.

[0026] A first winding pattern 51 is formed on the first printed circuit board 25 as a part of the winding. The first winding pattern 51 includes a first winding pattern 51a, a first winding pattern 51b, and a first winding pattern 51c. The first winding pattern 51a is electrically connected to a first connecting portion 65 of the first winding member 61a. One end of the first winding pattern 51b is electrically connected to a first connecting portion 65 of the second winding member 61b, and the other end is electrically connected to a first connecting portion 65 of the first winding member 61c. The first winding pattern 51c is electrically connected to a first connecting portion 65 of the second winding member 61d.

[0027] 6, 7 and 8, the second printed circuit board 41 has a four-layer structure. The second printed circuit board 41 includes a first layer board 41a, a second layer board 41b, a third layer board 41c and a fourth layer board 41d.

[0028] A second winding pattern 81 is formed on the first layer substrate 41a as a part of the winding. The second winding pattern 81 includes a second winding pattern 81a and a second winding pattern 81b. The second winding pattern 81a also functions as a heat dissipation pattern 83a. The second winding pattern 81b also functions as a heat dissipation pattern 83b.

[0029] In the first layer substrate 41a, the first winding member 61a (second connection portion 67) and the second winding member 61b (second connection portion 67) are electrically connected by a second winding pattern 81a. The first winding member 61c (second connection portion 67) and the second winding member 61d (second connection portion 67) are electrically connected by a second winding pattern 81b.

[0030] A heat dissipation pattern 83c, a wiring pattern 87a, and a wiring pattern 87b are formed on the second layer substrate 41b. The heat dissipation pattern 83c is electrically insulated from the wiring patterns 87a and 87b.

[0031] In the second layer substrate 41b, the first winding member 61a (second connection portion 67) and the second winding member 61b (second connection portion 67) are electrically connected by a wiring pattern 87a. The first winding member 61c (second connection portion 67) and the second winding member 61d (second connection portion 67) are electrically connected by a wiring pattern 87b.

[0032] A second winding pattern 81 is formed on the third layer substrate 41c as a part of the winding. The second winding pattern 81 includes a second winding pattern 81a and a second winding pattern 81b. The second winding pattern 81a also functions as a heat dissipation pattern 83a. The second winding pattern 81b also functions as a heat dissipation pattern 83b.

[0033] In the third layer substrate 41c, the first winding member 61a (second connection portion 67) and the second winding member 61b (second connection portion 67) are electrically connected by a second winding pattern 81a. The first winding member 61c (second connection portion 67) and the second winding member 61d (second connection portion 67) are electrically connected by a second winding pattern 81b.

[0034] A heat dissipation pattern 83c, a wiring pattern 87a, and a wiring pattern 87b are formed on the fourth-layer substrate 41d. The heat dissipation pattern 83c is electrically insulated from the wiring patterns 87a and 87b.

[0035] In the fourth layer substrate 41d, the first winding member 61a (second connection portion 67) and the second winding member 61b (second connection portion 67) are electrically connected by a wiring pattern 87a. The first winding member 61c (second connection portion 67) and the second winding member 61d (second connection portion 67) are electrically connected by a wiring pattern 87b.

[0036] The second winding pattern 81a in the first layer board 41a, the wiring pattern 87a in the second layer board 41b, the second winding pattern 81a in the third layer board 41c, and the wiring pattern 87a in the fourth layer board 41d are electrically connected to each other via through-hole regions 85a.

[0037] The second winding pattern 81b in the first layer board 41a, the wiring pattern 87b in the second layer board 41b, the second winding pattern 81b in the third layer board 41c, and the wiring pattern 87b in the fourth layer board 41d are electrically connected to each other via through-hole regions 85b.

[0038] The magnetic body 37, the second printed circuit board 41, etc. are fixed to the first printed circuit board 25 by a magnetic body fixing screw 49 as a first male thread portion, a cylindrical member 47, and a female thread portion 19 as a first female thread portion, which serve as fixing members. The cylindrical member 47 is disposed between the first printed circuit board 25 and the second printed circuit board 41. The magnetic body 37, the second printed circuit board 41, etc. are fixed to the first printed circuit board 25 by inserting the magnetic body fixing screw 49 into the cylindrical member 47 and screwing into the female thread portion 19 formed in the cooling plate 17.

[0039] 8, the thickness of the magnetic body 37 is D1, the thickness of the elastic members 33a and 33b is DS, the length of the cylindrical member 47 is D2, the thicknesses of the first printed circuit board 25 and the second printed circuit board 41 are DB, and the thickness of the spacer 21 is HS. The length D2 of the cylindrical member 47 is set to be equal to or less than the sum of the thickness D1 and the thickness DS×2.

[0040] Furthermore, the length D2 of the magnetic fixing screw 49 is longer than the length D4 obtained by combining the thicknesses DB and HS of the first printed circuit board 25 and the second printed circuit board 41. An example of the power conversion device 1 including the smoothing reactor 9 as a winding device is configured as described above.

[0041] Next, an example of a manufacturing method of the above-mentioned power conversion device 1 will be described. First, a first printed circuit board 25 (see FIG. 3, etc.) is prepared. As shown in FIG. 2 and FIG. 3, the winding members 61 (61a to 61d) are joined to the first printed circuit board 25 together with surface mounted components such as the MOS transistor 3 and the diode 7, for example, by soldering.

[0042] Next, the corresponding winding members 61 (61a to 61d) are inserted through the through holes 33aa, 33ab of the elastic member 33a, the through holes 37a, 37b of the magnetic body 37, and the through holes 33ba, 33bb of the elastic member 33b, and the elastic member 33a, the magnetic body 37, and the elastic member 33b are sequentially arranged on the first printed circuit board 25.

[0043] Next, the winding members 61 (61a to 61d) are inserted into the corresponding through holes 43a, 43b, 43c, and 43d of the second printed circuit board 41, and the second printed circuit board 41 is placed on the elastic member 33b. Next, the cylindrical member 47 is placed between the first printed circuit board 25 and the second printed circuit board 41. The cylindrical member 47 is placed at a position communicating with the screw hole 45 formed in the second printed circuit board 41.

[0044] Next, the magnetic body fixing screw 49 is inserted through the screw hole 45 and the cylindrical member 47 and screwed into the female thread portion 19 provided on the cooling plate 17, thereby fixing the magnetic body 37 and the second printed circuit board 41 to the first printed circuit board 25. Next, the winding member 61 and the corresponding second winding pattern 81 formed on the second printed circuit board 41 are electrically connected by a bonding material 77 such as solder. The winding member 61 and the corresponding second winding pattern 81 may also be electrically connected by contacting each other. In this way, the smoothing reactor 9 is mounted on the first printed circuit board 25, and the main part of the power conversion device 1 is completed.

[0045] Next, an example of a current flow in the smoothing reactor 9 of the power conversion device 1 will be described. First, the AC voltage supplied from the transformer 5 is converted to a DC voltage by the diode 7 (see FIG. 1). Next, as shown in FIG. 9, the current converted to the DC voltage flows through the first winding pattern 51a as indicated by an arrow Y1. The current that has flowed through the first winding pattern 51a flows through the first winding member 61a, and then flows through the second winding member 61b. At this time, the current flows in parallel through the path indicated by the arrow Y1D, the path indicated by the arrow Y1A, the path indicated by the arrow Y1B, and the path indicated by the arrow Y1C.

[0046] Arrow Y1D indicates a path along which a current flows from the first winding member 61a through the second winding pattern 81a formed on the first layer substrate 41a to the second winding member 61b. Arrow Y1A indicates a path along which a current flows from the first winding member 61a through the wiring pattern 87a formed on the fourth layer substrate 41d to the second winding member 61b. Arrow Y1B indicates a path along which a current flows from the first winding member 61a through the second winding pattern 81a formed on the third layer substrate 41c to the second winding member 61b. Arrow Y1C indicates a path along which a current flows from the first winding member 61a through the wiring pattern 87a formed on the second layer substrate 41b to the second winding member 61b.

[0047] The current that has flowed through the second winding member 61b flows through the first winding pattern 51b as indicated by the arrow Y2. The current that has flowed through the first winding pattern 51b flows through the first winding member 61c, and then flows through the second winding member 61d. At this time, the current flows in parallel through the path indicated by the arrow Y2D, the path indicated by the arrow Y2A, the path indicated by the arrow Y2B, and the path indicated by the arrow Y2C.

[0048] Arrow Y2D indicates a path along which a current flows from the first winding member 61c through the second winding pattern 81b formed on the first layer substrate 41a to the second winding member 61d. Arrow Y2A indicates a path along which a current flows from the first winding member 61c through the wiring pattern 87b formed on the fourth layer substrate 41d to the second winding member 61d. Arrow Y2B indicates a path along which a current flows from the first winding member 61c through the second winding pattern 81b formed on the third layer substrate 41c to the second winding member 61d. Arrow Y2C indicates a path along which a current flows from the first winding member 61c through the wiring pattern 87b formed on the second layer substrate 41b to the second winding member 61d.

[0049] The current that has flowed through the second winding member 61d flows through the first winding pattern 51c as indicated by an arrow Y3. The current that has flowed through the first winding pattern 51c passes through a smoothing capacitor 11 and is output as an output current (voltage) from an output terminal 15 (see FIG. 1).

[0050] This smoothing reactor 9 has a first winding pattern 51 (51b), a winding member 61, and a second winding pattern 81 as the winding wound around the magnetic body 37. In Fig. 7 and other figures, the smoothing reactor 9 is shown with a winding number of 2 (2 turns) as the number of turns of the winding wound around the magnetic body 37. This is shown typically in Fig. 10, and further, the correspondence between the symbol of the smoothing reactor and the winding is shown in Fig. 11.

[0051] 10 and 11, the first winding member 61a, the second winding pattern 81a (wiring pattern 87a), the second winding member 61b, and the first winding pattern 51b form a winding having one winding number (one turn) wound around the magnetic body 37. The first winding pattern 51b, the first winding member 61c, the second winding pattern 81b (wiring pattern 87b), and the second winding member 61d form a winding having one winding number (one turn) wound around the magnetic body 37.

[0052] The number of turns (number of turns) of the winding wound around the magnetic body 37 of the smoothing reactor 9 shown in Figure 7 etc. is just an example, and the number of turns (number of turns) of the winding wound around the magnetic body 37 can be set to a desired number of turns by increasing or decreasing the number of winding members 61 and the number of second winding patterns 81.

[0053] In the smoothing reactor 9 in the above-described power conversion device 1, the first winding pattern 51 (51b), the winding member 61, and the second winding pattern 81 form a winding that is wound around the magnetic body 37. This can contribute to miniaturization of the smoothing reactor 9. This will be explained in comparison with a smoothing reactor according to a comparative example.

[0054] 12, in a smoothing reactor 109 according to the comparative example, a printed circuit board 125 is disposed on a cooling plate 117 with a spacer 121 interposed therebetween. The printed circuit board 125 is fixed to the cooling plate 117 by a board fixing screw 131. A magnetic body 135 is disposed on the cooling plate 117. The magnetic body 135 is composed of an E-shaped magnetic body 137 and an I-shaped magnetic body 139.

[0055] An opening 127 (see FIG. 13) is formed in the printed circuit board 125, through which the legs of the E-shaped magnetic body 137 are inserted. An I-shaped magnetic body 139 is disposed so as to abut against the legs of the E-shaped magnetic body 137 inserted into the opening 127. A fixing plate 123 is disposed on the cooling plate 117, with a cylindrical member 147 interposed therebetween. The magnetic body fixing screw 149 is inserted into the cylindrical member 147 and screwed to the cooling plate 117, thereby fixing the magnetic body 135 to the cooling plate 117.

[0056] As shown in Fig. 13, the printed circuit board 125 has a four-layer structure and is composed of a printed circuit board 125a, a printed circuit board 125b, a printed circuit board 125c, and a printed circuit board 125d. A winding pattern 131a is formed on the printed circuit board 125a so as to surround the periphery of an opening 127. A winding pattern 131b is formed on the printed circuit board 125b so as to surround the periphery of an opening 127. The winding patterns 131a and 131b are the same pattern. The winding patterns 131a and 131b are electrically connected in parallel via a through-hole region 133 with the number of turns being one.

[0057] A winding pattern 131c is formed on the printed circuit board 125c so as to surround the periphery of the opening 127. A winding pattern 131d is formed on the printed circuit board 125d so as to surround the periphery of the opening 127. The winding pattern 131c and the winding pattern 131d are the same pattern. The winding pattern 131c and the winding pattern 131d are electrically connected in parallel via a through-hole region 133 with the number of turns being 1. The winding pattern 131a and the winding pattern 131b are electrically connected in series to the winding pattern 131c and the winding pattern 131d via the through-hole region 133.

[0058] In the smoothing reactor 109 according to the comparative example, an opening 127 is formed in a printed circuit board 125. Winding patterns 131a to 131d that become windings are formed around the opening 127. For this reason, there is a limit to reducing the area occupied by the smoothing reactor.

[0059] Unlike the smoothing reactor 109 according to the comparative example, in the smoothing reactor 9 in the power conversion device 1 according to the first embodiment, there is no need to provide an opening through which the magnetic body 37 penetrates in both the first printed circuit board 25 and the second printed circuit board 41. Also, the first winding pattern 51 (51b), the winding member 61 (the first winding member 61a and the second winding member 61b, etc.), and the second winding pattern 81 form a winding that is wound around the magnetic body 37.

[0060] The first winding pattern 51 (51b) is formed on the first printed circuit board 25, of the first and second printed circuit boards facing each other in the Z-axis direction, so as to sandwich the magnetic body 37, and the second winding pattern 81 is formed on the second printed circuit board 41. The first winding member 61a and the second winding member 61b, etc. are arranged to bridge between the first printed circuit board 25 and the second printed circuit board 41 and to sandwich the magnetic body 37 at a distance in the X-axis direction.

[0061] This makes it possible to reduce the area occupied by the smoothing reactor 9 compared to the smoothing reactor 109 according to the comparative example in which the winding patterns 131a to 131d are formed around the opening 127 in the printed circuit board 125. Also, the height of the smoothing reactor 9 can be reduced. As a result, this can contribute to the miniaturization of the power conversion device 1.

[0062] In addition, in the smoothing reactor 109 according to the comparative example, heat generated in both the printed circuit board 125 and the magnetic body 135 due to energization is dissipated to the cooling plate 117. At this time, in order to bring the printed circuit board 125 as close as possible to the cooling plate 117 and to efficiently dissipate the heat to the cooling plate 117, a recess 117a having a depth corresponding to the height of the magnetic body 135 is formed in the cooling plate 117. The magnetic body 135 is disposed in the recess 117a.

[0063] Unlike the smoothing reactor 109 according to the comparative example, in the above-described smoothing reactor 9, heat generated in the first printed circuit board 25 and the magnetic body 37 is dissipated to the cooling plate 17 via the elastic member 33a. Also, heat generated in the second printed circuit board 41 is dissipated from the heat dissipation patterns 83a, 83b, and 83c to the cooling plate 17 via the magnetic body fixing screw 49 and the cylindrical member 47.

[0064] As a result, compared to the smoothing reactor of the comparative example in which a recess 117a is formed in the cooling plate 117, there is no need to process the cooling plate 117, which simplifies the manufacturing process of the smoothing reactor 9 and ultimately contributes to reducing the production costs of the power conversion device 1.

[0065] Furthermore, in the above-described smoothing reactor 9, it is not necessary to provide an opening in the first printed circuit board 25 for passing the magnetic body 37 therethrough, and therefore the variety of the magnetic body 37 can be increased.

[0066] As the magnetic body 37, it is not necessary to use a magnetic body divided into an E-type magnetic body and an I-type magnetic body, and a magnetic body in which the E-type magnetic body and the I-type magnetic body are integrated may be used. Also, a magnetic body in which the E-type magnetic body and the I-type magnetic body are integrated in advance by, for example, an adhesive or tape may be used.

[0067] When the E-shaped magnetic body 137 and the I-shaped magnetic body 139 are pressed by the fixing plate 123 (see FIG. 12), the degree of adhesion between the E-shaped magnetic body and the I-shaped magnetic body changes depending on the degree of tightening of the magnetic body fixing screw 49, which may change the inductance as a smoothing reactor.

[0068] In the smoothing reactor 9 described above, the magnetic body 37 having through holes 37a, 37b through which the winding member 61 is inserted is used as the magnetic body 35. The magnetic body 35 is not a magnetic body formed by integrating two magnetic bodies, such as an E-shaped magnetic body and an I-shaped magnetic body. This makes it possible to reduce the variation in inductance of the smoothing reactor 9.

[0069] Embodiment 2 An example of a power converter 1 including a smoothing reactor according to a second embodiment will be described. As shown in Fig. 14 and Fig. 15, in a smoothing reactor 9 of the power converter 1 according to the second embodiment, a winding member 61 which is a part of the winding has a second extension portion 71 in addition to a first extension portion 63. The second extension portion 71 is bent from the first extension portion 63 and positioned approximately horizontally along the first printed circuit board 25. The second extension portion 71 is disposed between the first printed circuit board 25 and the elastic member 33a.

[0070] The width of the first extension portion 63 and the width of the second extension portion 71 are set to be substantially the same. Note that the second extension portion 71 of the winding member 61 may be a second extension portion 71 having a width narrower than the width of the first extension portion 63, as shown in Fig. 16. Alternatively, the second extension portion 71 may be a second extension portion 71 having a width wider than the width of the first extension portion 63, as shown in Fig. 17.

[0071] The second extension portion 71 is electrically connected to the first winding pattern 51 formed on the first printed circuit board 25, for example, by soldering. Note that other configurations are similar to those of the smoothing reactor 9 shown in Fig. 8 etc., so the same members are given the same reference numerals and descriptions thereof will not be repeated unless necessary.

[0072] Next, a description will be given of an example of a manufacturing method for the above-mentioned power converter 1. In this case, the power converter 1 having the smoothing reactor 9 can be manufactured by a manufacturing method substantially the same as the manufacturing method described in the first embodiment, except for the application of the winding member 61 having the second extension portion 71.

[0073] The winding member 61 is joined, for example, by soldering, to the first printed circuit board 25 together with surface mounted components such as the MOS transistor 3. At this time, the second extending portion 71 of the winding member 61 is joined, by soldering, to the corresponding first winding pattern 51 formed on the first printed circuit board 25.

[0074] Next, the elastic member 33a, the magnetic body 37, the elastic member 33b and the second printed circuit board 41 are arranged in this order. Next, the magnetic body 37, the second printed circuit board 41 and the like are fixed to the first printed circuit board 25 by the cylindrical member 47 and the magnetic body fixing screw 49. Thereafter, the winding member 61 and the corresponding second winding pattern 81 formed on the second printed circuit board 41 are electrically connected by, for example, soldering. In this manner, the main parts of the power conversion device 1 are completed.

[0075] Next, the current flow in the smoothing reactor 9 of the power conversion device 1 is as described with reference to Fig. 9. As shown in Fig. 9, the current converted into a DC voltage flows from the first winding pattern 51a through the first winding member 61a, and then flows through the second winding member 61b. At this time, the current flows in parallel through the path indicated by the arrow Y1D, the path indicated by the arrow Y1A, the path indicated by the arrow Y1B, and the path indicated by the arrow Y1C.

[0076] The current that has flowed through the second winding member 61b flows from the first winding pattern 51b to the first winding member 61c, and then flows through the second winding member 61d. At this time, the current flows in parallel through the path indicated by the arrow Y2D, the path indicated by the arrow Y2A, the path indicated by the arrow Y2B, and the path indicated by the arrow Y2C. The current that has flowed through the second winding member 61d passes through the first winding pattern 51c and the smoothing capacitor 11, and is output as an output current (voltage) from the output terminal 15 (see FIG. 1).

[0077] In the smoothing reactor 9 in the above-described power conversion device 1, similarly to the smoothing reactor 9 described in the first embodiment, the smoothing reactor 9 can be made smaller, which can contribute to the miniaturization of the power conversion device 1. In the above-described smoothing reactor 9, the cooling effect can be further improved.

[0078] When a current is applied, heat generated in the first printed circuit board 25 (first winding pattern 51), the first extension portion 63 of the winding member 61, the second printed circuit board 41 (second winding pattern 81), etc. is transferred to the second extension portion 71. The heat transferred to the second extension portion 71 is transferred to the cooling plate 17 via the elastic member 33a. This allows the heat generated in the first printed circuit board 25, the first extension portion 63 of the winding member 61, and the second printed circuit board 41 to be efficiently dissipated to the cooling plate 17.

[0079] Furthermore, a part of the current flowing through the first winding pattern 51 also flows through the second extending portion 71 of the winding member 61. This reduces the electrical resistance through the first winding pattern 51, and the amount of heat generated in the first printed circuit board 25 can be suppressed.

[0080] Embodiment 3 An example of a power converter 1 including a smoothing reactor according to a third embodiment will be described. As shown in Figs. 18 and 19, in a smoothing reactor 9 of the power converter 1 according to the third embodiment, a winding member 61 which is a part of the winding has a second connection portion 67 in which a screw hole 73 which serves as a second female screw portion is formed. The second connection portion 67 is located along the second printed circuit board 41. The second connection portion 67 has a screw hole 73 which serves as a part of the fixing member formed therein. A magnetic material fixing screw 49 which serves as a second male screw portion is screwed into the screw hole 73.

[0081] The winding member 61 may be a winding member 61 having a shape in which the first connecting portion 65 protrudes from the positioning portion 69, or may be a winding member 61 having a positioning portion 69 formed so that the width narrows from the first extending portion 63 toward the first connecting portion 65, as shown in Fig. 20. Note that the other configuration is similar to that of the smoothing reactor 9 shown in Fig. 8 etc., and therefore the same members are denoted by the same reference characters, and description thereof will not be repeated unless necessary.

[0082] Next, a description will be given of an example of a manufacturing method for the above-mentioned power converter 1. In this case, the power converter 1 having the smoothing reactor 9 can be manufactured by substantially the same manufacturing method as that described in the first embodiment, except for the application of the winding member 61 having the second extension portion 71 in which the screw hole 73 is formed.

[0083] The winding member 61 is joined to the first printed circuit board 25, for example, by soldering, together with surface mounted components such as the MOS transistor 3. Next, the elastic member 33a, the magnetic body 37, the elastic member 33b, and the second printed circuit board 41 are arranged in this order. At this time, the second connection portion 67 of the winding member 61 is brought into contact with the corresponding second winding pattern 81 formed on the second printed circuit board 41, for electrical connection.

[0084] Next, the magnetic body fixing screw 49 is screwed into the screw hole 73 formed in the second connection portion 67 of the winding member 61 to fix the magnetic body 37, the second printed circuit board 41, etc. to the first printed circuit board 25. Thereafter, the winding member 61 and the corresponding second winding pattern 81 formed on the second printed circuit board 41 are electrically connected by, for example, soldering. In this manner, the main portion of the power conversion device 1 is completed.

[0085] Next, the current flow in the smoothing reactor 9 of the power conversion device 1 is substantially the same as that described with reference to Fig. 9. As shown in Fig. 9, the current converted into a DC voltage flows from the first winding pattern 51a through the first winding member 61a, and then flows through the second winding member 61b. The current that has flowed through the second winding member 61b flows from the first winding pattern 51b through the first winding member 61c, and then flows through the second winding member 61d. The current that has flowed through the second winding member 61d passes through the first winding pattern 51c and the smoothing capacitor 11, and is output as an output current (voltage) from the output terminal 15 (see Fig. 1).

[0086] In the smoothing reactor 9 in the above-described power conversion device 1, similarly to the smoothing reactor 9 described in the first embodiment, the smoothing reactor 9 can be made smaller, which can contribute to the miniaturization of the power conversion device 1. In the above-described smoothing reactor 9, the number of parts can further be reduced.

[0087] In the above-described smoothing reactor 9, the magnetic body 37 and the second printed circuit board 41 are fixed to the first printed circuit board 25 by screwing the magnetic body fixing screw 49 into a screw hole 73 formed in the second connection portion 67 of the winding member 61. This eliminates the need for a cylindrical member and reduces the number of parts. As a result, this contributes to reducing the manufacturing costs of the smoothing reactor 9 and, ultimately, the power conversion device 1.

[0088] Embodiment 4 An example of a power converter 1 including a smoothing reactor according to embodiment 4 will be described. As shown in Fig. 21 and Fig. 22, in a smoothing reactor 9 of a power converter 1 according to embodiment 4, a winding support part 27a and a winding support part 27b that respectively support a winding member 61 and the like are arranged on a first printed circuit board 25. The winding support parts 27a and 27b each extend from the first printed circuit board 25 toward the second printed circuit board 41.

[0089] A winding member 61 is disposed on one surface of the winding support parts 27a, 27b, and a first winding pattern 51 is disposed on the other surface. The winding member 61 is formed, for example, from a copper plate having a thickness of about 0.1 mm. The winding member 61 is, for example, soldered to one surface of the winding support parts 27a, 27b.

[0090] In addition to the through holes 37a and 37b, the magnetic body 37 is formed with legs 36 protruding toward the cooling plate 17. Note that other configurations are similar to those of the smoothing reactor 9 shown in Fig. 8 and the like, so the same members are given the same reference numerals and descriptions thereof will not be repeated unless necessary.

[0091] Next, an example of a manufacturing method of the above-mentioned power conversion device 1 will be described. First, first printed circuit board 25 (see FIG. 23) and winding member 61 are prepared. At this time, as shown in FIG. 23, patterns that become winding support parts 27a, 27b are also formed on first printed circuit board 25 by, for example, punching. The patterns that become winding support parts 27a, 27b are connected to first printed circuit board 25 (main body part) by connection parts 29.

[0092] 24, winding member 61 is joined, for example, by soldering, to a pattern that will become winding support portions 27a and 27b on first printed circuit board 25. In addition, surface mount components such as MOS transistor 3 (not shown) are joined to first printed circuit board 25 by soldering.

[0093] 25, connecting portion 29 is cut, and winding support portion 27a and winding support portion 27b are each bent in the positive direction of the Z-axis. Next, as shown in Fig. 26 and Fig. 21, winding support portions 27a and 27b bent in the positive direction of the Z-axis are inserted through through holes 37a and 37b of magnetic body 37 and through holes 33ba and 33bb of elastic member 33b, and magnetic body 37 and elastic member 33b are sequentially arranged on first printed circuit board 25.

[0094] Next, the second printed circuit board 41 is placed on the elastic member 33b by inserting the corresponding winding support parts 27a, 27b into the through holes 43e, 43f of the second printed circuit board 41. Next, the magnetic body 37, the second printed circuit board 41, etc. are fixed to the first printed circuit board 25 by the cylindrical member 47 and the magnetic body fixing screw 49. Thereafter, the winding member 61 and the corresponding second winding pattern 81 formed on the second printed circuit board 41 are electrically connected by, for example, soldering. The legs 36 of the magnetic body come into contact with the cooling plate 17. In this manner, the main parts of the power conversion device 1 are completed.

[0095] Next, the current flow in the smoothing reactor 9 of the power conversion device 1 is substantially the same as that described with reference to Fig. 9. As shown in Fig. 9, the current converted into a DC voltage flows from the first winding pattern 51 through the first winding member 61a, and then flows through the second winding member 61b. The current that has flowed through the second winding member 61b flows from the first winding pattern 51 through the first winding member 61c, and then flows through the second winding member 61d. The current that has flowed through the second winding member 61d passes from the first winding pattern 51 through the smoothing capacitor 11, and is output as an output current (voltage) from the output terminal 15 (see Fig. 1).

[0096] In the smoothing reactor 9 in the above-described power conversion device 1, similarly to the smoothing reactor 9 described in the first embodiment, the smoothing reactor 9 can be made smaller, which contributes to the miniaturization of the power conversion device 1. In the above-described smoothing reactor 9, furthermore, the cooling effect can be improved and the first printed circuit board 25 can be effectively utilized.

[0097] In the above-described smoothing reactor 9, the legs 36 of the magnetic body 37 abut against the cooling plate 17. This allows heat generated in the magnetic body 37 when a current is applied to be efficiently dissipated to the cooling plate 17.

[0098] Furthermore, by forming the winding support parts 27a, 27b that support the winding member 61 using a part of the first printed circuit board 25, it is possible to make more effective use of the first printed circuit board 25 than in the case where the winding support parts 27a, 27b are made from separate members, which can contribute to reducing the production costs of the power conversion device 1.

[0099] Embodiment 5. An example of a power converter 1 including a smoothing reactor according to embodiment 5 will be described. As shown in Fig. 27, in the smoothing reactor 9 of the power converter 1 according to embodiment 3, a crank-shaped member 48 as a pressing member is used instead of the cylindrical member 47 (see Fig. 3, etc.) as one of the fixing members for fixing the first printed circuit board 25, the magnetic body 37, the second printed circuit board 41, etc. to the cooling plate 17.

[0100] The crank-shaped member 48 has a first portion 48a, a second portion 48b, and a third portion 48c. The first portion 48a is disposed parallel to the first printed circuit board 25. The second portion 48b is bent from the first portion 48a and extends upward. The third portion 48c is bent from the second portion 48b and disposed parallel to the second printed circuit board 41. The length DE (height) of the second portion 48b is set to be equal to or less than the length corresponding to the combined thickness of the elastic member 33a, the magnetic body 37, the elastic member 33b, and the second printed circuit board 41.

[0101] The first printed circuit board 25, the magnetic body 37 and the second printed circuit board 41 are fixed to the cooling plate 17 by inserting a magnetic body fixing screw 49 serving as a third male threaded portion into a screw hole provided in the first portion 48a and screwing it into the female threaded portion 19 serving as a third female threaded portion. Note that the rest of the configuration is similar to that of the smoothing reactor 9 shown in Fig. 8 etc., so the same members are given the same reference numerals and descriptions thereof will not be repeated unless necessary.

[0102] Next, a description will be given of an example of a manufacturing method for the above-mentioned power conversion device 1. In this case, the power conversion device 1 having the smoothing reactor 9 can be manufactured by a manufacturing method substantially the same as the manufacturing method described in the first embodiment, except for the application of the crank member 48 and the like.

[0103] The winding member 61 is joined to the first printed circuit board 25 together with surface mounted components such as the MOS transistor 3, for example, by soldering. Next, the elastic member 33a, the magnetic body 37, the elastic member 33b, and the second printed circuit board 41 are arranged in this order (see FIG. 3). Next, the crank-shaped member 48 is prepared. The first portion 48a of the crank-shaped member 48 is brought into contact with the upper surface of the first printed circuit board 25, and the third portion 48c is brought into contact with the upper surface of the second printed circuit board 41 (see FIG. 27). At this time, the third portion 48c is brought into contact, in particular, with the heat dissipation patterns 83a, 83b formed on the second printed circuit board 41.

[0104] Next, the magnetic body fixing screw 49 is inserted into a screw hole provided in the first portion 48a and screwed into the female thread portion 19 to fix the first printed circuit board 25, the magnetic body 37 and the second printed circuit board 41 to the cooling plate 17. Thereafter, the winding member 61 and the corresponding second winding pattern 81 formed on the second printed circuit board 41 are electrically connected by, for example, soldering. In this manner, the main portion of the power conversion device 1 is completed.

[0105] Next, the current flow in the smoothing reactor 9 of the power conversion device 1 is substantially the same as that described with reference to Fig. 9. As shown in Fig. 9, the current converted into a DC voltage flows from the first winding pattern 51a through the first winding member 61a, and then flows through the second winding member 61b. The current that has flowed through the second winding member 61b flows from the first winding pattern 51b through the first winding member 61c, and then flows through the second winding member 61d. The current that has flowed through the second winding member 61d passes through the first winding pattern 51c and the smoothing capacitor 11, and is output as an output current (voltage) from the output terminal 15 (see Fig. 1).

[0106] In the smoothing reactor 9 in the above-described power conversion device 1, similarly to the smoothing reactor 9 described in the first embodiment, the smoothing reactor 9 can be made smaller, which can contribute to the miniaturization of the power conversion device 1. In the above-described smoothing reactor 9, the cooling effect can be further improved.

[0107] In the smoothing reactor 9 described above, the third portion 48c of the crank-shaped member 48 contacts particularly the heat dissipation patterns 83a, 83b formed on the second printed circuit board 41. This provides a larger contact area between the heat dissipation patterns 83a, 83b and the third portion 48c, compared to the case where the magnetic fixing screws 49 are inserted from the second printed circuit board 41.

[0108] This reduces the thermal resistance between the heat dissipation patterns 83a, 83b and the crank-shaped member 48. As a result, the thermal resistance from the second winding pattern 81 to the cooling plate 17 is reduced, and the heat generated in the second printed circuit board 41 can be dissipated to the cooling plate 17 more effectively.

[0109] (Modification) In each of the above-described embodiments, the smoothing reactor 9 has been described as an example in which the magnetic body 37 having two through holes 37a, 37b is used as the magnetic body 35. As long as the winding can be wound around the magnetic body 35, it is not necessary to provide the magnetic body 35 with two through holes.

[0110] 28, a magnetic body 37 having one through hole 38 formed therein may be used as the magnetic body 35. In this case, a winding wound around the magnetic body 37 is composed of a winding member 93 arranged in the through hole 38, a winding member 93 arranged on the outer periphery of the magnetic body 37, a winding pattern 91 arranged on the lower surface side (Z-axis negative direction side) of the magnetic body 37, and a winding pattern 91 arranged on the upper surface side (Z-axis positive direction side) of the magnetic body 37. Even with such a winding structure, it is possible to cause it to function as a smoothing reactor.

[0111] 29, a magnetic body 39 without a through hole may be used as the magnetic body 35. In this case, a winding wound around the magnetic body 37 is formed by a winding member 93 arranged on one side surface (Y-axis positive side) of the magnetic body 39, a winding member 93 arranged on the other side surface (Y-axis negative side) of the magnetic body 39, a winding pattern 91 arranged on the lower surface (Z-axis negative side) of the magnetic body 37, and a winding pattern 91 arranged on the upper surface (Z-axis positive side) of the magnetic body 37. Even with such a winding structure, it is possible to make it function as a smoothing reactor.

[0112] Furthermore, in each embodiment, a smoothing reactor has been described as an example of a winding device having a winding wound around a magnetic body, but the winding device is not limited to a smoothing reactor and may be applied to, for example, a transformer 5 or the like.

[0113] It should be noted that the power conversion devices including the winding devices described in each embodiment can be combined in various ways as necessary.

[0114] The embodiments disclosed herein are illustrative and are not limited thereto. The present disclosure is not limited to the above-described scope, but is defined by the scope of the claims, and is intended to include all modifications within the meaning and scope equivalent to the scope of the claims. [Industrial Applicability]

[0115] The present disclosure is effectively applied to a power conversion device including a winding device in which a winding is wound around a magnetic body. [Explanation of symbols]

[0116] 1 power converter, 3 MOS transistor, 5 transformer, 5a primary winding, 5b secondary winding, 7 diode, 9 smoothing reactor, 11 smoothing capacitor, 13 input terminal, 15 output terminal, 17 cooling plate, 19 female threaded portion, 21 board spacer, 25 first printed circuit board, 25a, 25b, 25c, 25d through hole, 27a winding support portion, 27b winding support portion, 29 connection portion, 31 board fixing screw, 33a, 33b, 33c elastic member, 33aa, 33ab, 33ba, 33bb through hole, 35, 37, 39 magnetic body, 36 leg portion, 37a, 37b, 38 through hole, 41 second printed circuit board, 41a first layer board, 41b second layer board, 41c third layer board, 41d Fourth layer board, 43a, 43b, 43c, 43d, 43e, 43f through hole, 45 screw hole, 47 cylindrical member, 47a screw hole, 48 crank-shaped member, 48a first part, 48b second part, 48c third part, 49 magnetic material fixing screw, 51, 51a, 51b, 51c first winding pattern, 61 winding member (representative), 61a first winding member, 61b second winding member, 61c first winding member, 61d second winding member, 63 first extension, 65 first connection, 67 second connection, 69 positioning portion, 71 second extension, 73 screw hole, 77 bonding material, 81, 81a, 81b second winding pattern, 83a, 83b, 83c heat dissipation pattern, 85a, 85b Through hole area, 87a, 87b wiring pattern, 91 winding pattern, 93 winding member, 95 connection part, Y1, Y2, Y3, Y1A, Y2A, Y1B, Y2B, Y1C, Y2C, Y1D, Y2D arrows.

Claims

1. A power conversion device including a winding device having a winding disposed on a magnetic body, The winding device includes: a first printed circuit board on which a first winding pattern is formed; a second printed circuit board arranged to face the first printed circuit board at a distance in the first direction, the second printed circuit board having a second winding pattern formed thereon; the magnetic body disposed between the first printed circuit board and the second printed circuit board; a winding member including a first winding member and a second winding member, the first winding member and the second winding member being disposed so as to span between the first printed circuit board and the second printed circuit board, and being electrically connected to the first winding pattern and to the second winding pattern; a fixing member for holding the magnetic body in a sandwiched state between the first printed circuit board and the second printed circuit board; Equipped with the winding includes the first winding pattern, the winding member, and the second winding pattern, the first winding pattern, the winding member, and the second winding pattern are arranged to wind around the magnetic body, a gap is provided at least partially between the magnetic body and the winding member; The first printed circuit board includes a winding support portion that extends from the first printed circuit board toward the second printed circuit board and supports the winding member.

2. a cooling plate for dissipating heat generated when a current flows through the winding; The power conversion device according to claim 1 , wherein the cooling plate is fixed to the first printed circuit board.

3. The magnetic material includes: a first through hole penetrating the magnetic body along the first direction; a second through hole is formed at a distance from the first through hole and piercing the magnetic body along the first direction, the first winding member is disposed in the first through hole, The power converter according to claim 2 , wherein the second winding member is disposed in the second through hole.

4. The winding member includes: a first extension portion extending from the first printed circuit board toward the second printed circuit board; a second extension portion bent from a portion of the first extension portion located on the first printed circuit board side and located along the first printed circuit board; The power converter of claim 3 .

5. The fixing member is A first male thread portion; a cylindrical body into which the first male screw portion is inserted and which is disposed between the first printed circuit board and the second printed circuit board; a first female thread portion formed on the cooling plate and into which the first male thread portion is screwed; Including, 5. The power conversion device according to claim 3, wherein the magnetic body is fixed between the first printed circuit board and the second printed circuit board by the first male threaded portion being inserted through the cylindrical body and screwed into the first female threaded portion.

6. a second female screw portion is formed on the side of the winding member facing the second printed circuit board, The fixing member includes a second male threaded portion that screws into the second female threaded portion, The power conversion device according to claim 3 , wherein the magnetic body is fixed between the first printed circuit board and the second printed circuit board by the second male threaded portion being screwed into the second female threaded portion.

7. The fixing member is a third male screw portion that is inserted into the first printed circuit board; a third female thread portion formed in the cooling plate and into which the third male thread portion is screwed; a pressing member having a first end and a second end, the first end being attached to the third male screw portion and the second end being in contact with the second printed circuit board; Including, 4. The power conversion device according to claim 3, wherein the third male threaded portion is screwed into the third female threaded portion, the first end is fixed to the first printed circuit board, the second end is abutted against the second printed circuit board, and the second printed circuit board is pressed against the first printed circuit board, thereby fixing the magnetic body between the first printed circuit board and the second printed circuit board.

8. The power conversion device according to any one of claims 1 to 7, wherein at least one of the first winding pattern and the winding member, and the second winding pattern and the winding member are electrically connected by a conductive bonding material.

9. The power conversion device according to any one of claims 1 to 7, wherein at least one of the first winding pattern and the winding member, and the second winding pattern and the winding member are electrically connected by contacting each other.

10. The power conversion device according to claim 1 , wherein the magnetic body is located between the first winding member and the second winding member and includes a portion located between the first winding pattern and the second winding pattern.

11. The magnetic body does not have a through hole penetrating the magnetic body, The power conversion device according to claim 10 , wherein the magnetic body includes a portion located between the first winding member and the second winding member.

12. The magnetic body is formed with a through hole penetrating the magnetic body along the first direction, the first winding member is disposed in the through hole, The power conversion device according to claim 10 , wherein the magnetic body includes a portion located between the first winding member and the second winding member.

13. The winding member has a positioning portion, The power conversion device according to any one of claims 1 to 12, wherein the winding member is fixed to a through hole formed in the first printed circuit board with the positioning portion abutting the first printed circuit board.

14. The power conversion device according to any one of claims 1 to 13, wherein the winding member is plate-shaped.

15. A method for manufacturing a power conversion device, the method including a step of manufacturing a winding device in which a winding is arranged on a magnetic body, the method comprising the steps of: The process for manufacturing the winding device includes: preparing a first printed circuit board on which a first winding pattern is formed as the winding; preparing a second printed circuit board on which a second winding pattern is formed as the winding; preparing a magnetic body to be disposed between the first printed circuit board and the second printed circuit board; preparing a winding member as the winding, the winding having a first end and a second end, the first end being electrically connected to the first winding pattern and the second end being electrically connected to the second winding pattern; disposing the winding member so that the first end of the winding member is electrically connected to the first winding pattern on the first printed circuit board; arranging the magnetic body on the first printed circuit board in a manner that the magnetic body is sandwiched between the winding members; disposing the second printed circuit board so as to cover the magnetic body, and electrically connecting the second end of the winding member to the second winding pattern on the second printed circuit board; Equipped with In the step of arranging the magnetic body, the magnetic body is arranged in such a manner that a gap is provided between the magnetic body and the winding member, The step of arranging the winding member includes: forming a winding support portion that supports the winding member by raising a part of the first printed circuit board toward a side where the second printed circuit board is disposed; placing the winding member on the winding support portion; A method for manufacturing a power conversion device, comprising:

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