Semiconductor device and method for manufacturing the same

Abstract

To preferably manufacture a semiconductor device without poor contact.SOLUTION: A semiconductor device includes semiconductor chips, a plurality of insulated boards equipped with the semiconductor chips, a printed circuit board provided facing the plurality of insulating boards, and a conductor member that electrically connects the plurality of insulating boards and the printed circuit boards. The printed circuit board includes a first penetration portion arranged between a plurality of adjacent insulating substrates in the top view, and a second penetration portion whose shape in the top view is different from that of the first penetration portion.SELECTED DRAWING: Figure 3A

Description

[Technical field]

[0001] The present invention relates to a semiconductor device and a method for manufacturing the semiconductor device. [Background technology]

[0002] 2. Description of the Related Art Conventionally, semiconductor devices including a printed circuit board electrically connected to a semiconductor chip are known (see, for example, Patent Documents 1 to 6). Patent Document 1: Japanese Patent Application Laid-Open No. 4-97595 Patent Document 2 Japanese Patent Application Laid-Open No. 10-284639 Patent Document 3: JP 2012-148287 A Patent document 4: Japanese Patent Application Laid-Open No. 3-170379 Patent Document 5 Patent No. 6202094 Patent Document 6 Patent No. 5644440 Summary of the Invention [Problem to be solved by the invention]

[0003] It is preferable to manufacture semiconductor devices that are free of contact failures. [Means for solving the problem]

[0004] In a first aspect of the present invention, a semiconductor device is provided, comprising a semiconductor chip, a plurality of insulating substrates carrying the semiconductor chip, a printed circuit board arranged opposite the plurality of insulating substrates, and a conductor member electrically connecting the plurality of insulating substrates and the printed circuit board, wherein the printed circuit board has, in a top view, a first penetrating portion arranged between the plurality of adjacent insulating substrates, and a second penetrating portion whose shape in a top view is different from that of the first penetrating portion.

[0005] The second penetrating portion may be disposed between adjacent insulating substrates in a top view.

[0006] The cross-sectional shape of the second piercing portion may include a major axis and a minor axis. The major axis may be greater than a maximum width of the cross-sectional shape of the first piercing portion.

[0007] The first through portion and the second through portion may be arranged in a predetermined arrangement direction. The second through portion may have a width in the arrangement direction that is greater than a width of the first through portion.

[0008] The arrangement direction may be the short side direction of the printed circuit board.

[0009] The first through portion may be a circular through hole, and the second through portion may be a through hole including a major axis and a minor axis in a top view.

[0010] The first through portion may be a circular through hole, and the second through portion may be a notch provided at an end of the printed circuit board.

[0011] The printed circuit board may include a second through portion and a third through portion provided on the outer periphery side of the printed circuit board relative to the insulating substrates. The first through portion may be a circular through hole. The second through portion and the third through portion may be through holes including a major axis and a minor axis in a top view.

[0012] In a second aspect of the present invention, there is provided a method for manufacturing a semiconductor device, comprising the steps of: arranging a plurality of insulating substrates on a lower jig having a plurality of columnar members, penetrating a plurality of columnar members through a plurality of through-holes in the printed circuit board, electrically connecting the plurality of insulating substrates and the printed circuit board with a conductor member, and subjecting the plurality of insulating substrates and the printed circuit board to a heat treatment. At least one of the plurality of columnar members may be provided between the plurality of adjacent insulating substrates in a top view.

[0013] The step of arranging the plurality of insulating substrates on the lower jig may include the step of arranging the plurality of insulating substrates in a plurality of recesses provided in the lower jig.

[0014] The plurality of columnar members may have the same cross-sectional shape.

[0015] The cross-sectional shape of the plurality of columnar members may be circular.

[0016] The method for manufacturing a semiconductor device may include providing a first penetration portion disposed between adjacent insulating substrates in a top view on the printed circuit board. The method for manufacturing a semiconductor device may include providing a second penetration portion having a cross-sectional shape different from that of the first penetration portion on the printed circuit board.

[0017] The above summary of the invention does not list all of the features of the present invention. Also, subcombinations of these features may also be inventions. [Brief description of the drawings]

[0018] [Figure 1A] 1 shows a perspective view of the top surface of a semiconductor device 100. FIG. [Figure 1B] 1 shows a perspective view of the bottom side of the semiconductor device 100. FIG. [Figure 1C] An example of a cross-sectional view of a semiconductor assembly 50 is shown. [Figure 2A] 1 shows a top view and a cross-sectional view of the lower jig 300. [Figure 2B] An example of a process for arranging a plurality of insulating substrates 10 on a lower jig 300 will be described. [Figure 2C] An example of a process for arranging the printed circuit board 30 and the conductive member 40 on the insulating substrate 10 will be described. [Figure 2D] An example of a process for heat treating the semiconductor assembly 50 will be described. [Figure 2E] A top view of a semiconductor assembly 50 during a heat treatment process is shown. [Figure 2F] 2 is an example of a flowchart for manufacturing the semiconductor device 100. [Figure 3A] An example of the configuration of the printed circuit board 30 and the lower jig 300 is shown. [Figure 3B] 1 shows modified examples of the printed circuit board 30 and the lower jig 300. [Figure 3C] 1 shows modified examples of the printed circuit board 30 and the lower jig 300. [Figure 3D] 1 shows modified examples of the printed circuit board 30 and the lower jig 300. [Figure 4]An example of a method for manufacturing the semiconductor device 500 according to the comparative example will be described. [Diagram 5] An example of a method for manufacturing the semiconductor device 500 according to the comparative example will be described. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0019] The present invention will be described below through embodiments of the invention, but the following embodiments do not limit the scope of the invention according to the claims. Furthermore, not all of the combinations of features described in the embodiments are necessarily essential to the solution of the invention.

[0020] In this specification, one side of a semiconductor device may be referred to as "upper" and the other side as "lower". Of the two main surfaces of a substrate, layer or other member, one may be referred to as the upper surface and the other as the lower surface. The directions of "upper" and "lower" are not limited to the direction of gravity. In other words, the directions of "upper" and "lower" are not limited to the direction in which the semiconductor device is attached to a substrate or the like when mounted.

[0021] In this specification, technical matters may be described using orthogonal coordinate axes of X-axis, Y-axis, and Z-axis. In one example, a plane parallel to the top surface of a semiconductor chip is defined as an XY plane, and a depth direction of a semiconductor substrate of the semiconductor chip is defined as a Z-axis. For example, a surface on the positive side in the Z-axis direction is defined as an upper surface, and a surface on the negative side in the Z-axis direction is defined as a lower surface.

[0022] 1A shows a perspective view of the top side of a semiconductor device 100. The semiconductor device 100 of this example is a power semiconductor module. The semiconductor device 100 includes a housing 110 and conductive terminal pins 120.

[0023] The housing 110 houses the semiconductor chip 20 of the semiconductor device 100. The semiconductor chip 20 will be described later. The housing 110 is molded from an insulating resin. The housing 110 in this example is a molded body formed into a rectangular parallelepiped shape by molding using a thermosetting resin such as an epoxy resin.

[0024] The conductive terminal pins 120 are pins for connecting an internal circuit of the semiconductor device 100 to the outside of the semiconductor device 100. The semiconductor device 100 includes a plurality of conductive terminal pins 120. The conductive terminal pins 120 may include an input / output terminal for inputting / outputting a current to / from the outside of the semiconductor device 100 and a control terminal for inputting a control signal to the semiconductor chip 20 from the outside of the semiconductor device 100.

[0025] The mounting holes 130 are provided penetrating from the top surface to the bottom surface of the semiconductor device 100. By inserting a fastener such as a bolt into the mounting holes 130, the semiconductor device 100 can be fixed in a predetermined position. The semiconductor device 100 of this example has a plurality of mounting holes 130 at both ends in the X-axis direction. Note that the configuration of the semiconductor device 100 of this example is merely an example and is not limited thereto.

[0026] 1B is a perspective view of the bottom surface of the semiconductor device 100. The semiconductor device 100 includes a plurality of heat dissipation sections 140.

[0027] The heat dissipation sections 140 are arranged in the X-axis direction on the lower surface of the semiconductor device 100. The heat dissipation sections 140 are provided corresponding to the insulating substrates 10 inside the semiconductor device 100. The heat dissipation sections 140 dissipate heat generated in the semiconductor chip 20 to the outside of the semiconductor device 100. The insulating substrates 10 will be described later.

[0028] 1C shows an example of a cross-sectional view of a semiconductor assembly 50. The semiconductor assembly 50 includes an insulating substrate 10, a semiconductor chip 20, a printed circuit board 30, and a conductive member 40. The semiconductor assembly 50 of this example includes a plurality of insulating substrates 10. The semiconductor assembly 50 is mounted inside a housing 110 of a semiconductor device 100.

[0029] The insulating substrate 10 has a semiconductor chip 20 mounted thereon. The insulating substrate 10 may be a DCB (Direct Copper Bonding) substrate or an AMB (Active Metal Brazing) substrate. The semiconductor assembly 50 of this example includes two insulating substrates 10a and 10b arranged in the X-axis direction. The insulating substrates 10a and 10b are provided apart from each other by a predetermined insulation distance. The insulating substrate 10 includes a circuit pattern layer 11, an insulating layer 12, and a conductive layer 13.

[0030] The circuit pattern layer 11 is provided on the upper surface of the insulating layer 12. The conductive layer 13 is provided on the lower surface of the insulating layer 12. The circuit pattern layer 11 and the conductive layer 13 may be formed of a plate containing a metal material such as copper or a copper alloy. The circuit pattern layer 11 and the conductive layer 13 may be fixed to the surface of the insulating layer 12 by a bonding material such as a brazing material.

[0031] The insulating layer 12 is a plate-like member made of an insulating material such as ceramics, including alumina (Al2O3), aluminum nitride (AlN), silicon nitride (Si3N4), etc. For example, the thickness of the insulating layer 12 is 0.2 mm or more and 1 mm or less.

[0032] The semiconductor chip 20 is a semiconductor chip provided on a semiconductor substrate such as a silicon substrate. The semiconductor chip 20 may be formed on a compound semiconductor substrate such as SiC or GaN. In one example, the semiconductor chip 20 includes a switching element such as an insulated gate bipolar transistor (IGBT) or a power MOSFET. The semiconductor chip 20 may include a RC-IGBT (Reverse-Conducting IGBT) including a freewheel diode (FWD).

[0033] An upper electrode and a lower electrode may be formed on the semiconductor chip 20. The upper electrode and the lower electrode may be electrically connected to a negative potential and a positive potential of a power supply, respectively. The insulating substrate 10 may mount a plurality of semiconductor chips 20.

[0034] The printed circuit board 30 is provided to face the multiple insulating substrates 10. In this example, the printed circuit board 30 is provided so as to cover the insulating substrates 10a and 10b. The printed circuit board 30 has an insulating plate and a circuit pattern layer provided on the insulating plate.

[0035] For example, the insulating plate of the printed circuit board 30 is a rigid board made of a glass epoxy material or a flexible board made of a polyimide material, but the material of the printed circuit board 30 is not limited to these.

[0036] The circuit pattern layer of the printed circuit board 30 connects the electrodes of the semiconductor chip 20 to external terminals. The circuit pattern layer of the printed circuit board 30 is provided on the surface of an insulating plate using a conductive metal such as copper, a copper alloy, or aluminum. The printed circuit board 30 is disposed above the insulating substrate 10 and spaced apart from the insulating substrate 10. The insulating substrates 10a and 10b may be electrically connected via the printed circuit board 30.

[0037] The conductive member 40 electrically connects the insulating substrates 10 and the printed circuit board 30. The conductive member 40 is formed into a columnar shape such as a cylinder using a conductive metal such as copper or aluminum. The lower end of the conductive member 40 is fixed to the insulating substrate 10 or the semiconductor chip 20 by a bonding material such as a solder portion 15. The upper end of the conductive member 40 may be fixed to the printed circuit board 30 by soldering, brazing, crimping, or the like.

[0038] The conductive member 40 of this example has a conductive member 40a, a conductive member 40b, and a conductive member 40c. The conductive member 40a electrically connects the semiconductor chip 20 and the circuit pattern layer of the printed circuit board 30. The conductive member 40b electrically connects the circuit pattern layer 11 and the circuit pattern layer of the printed circuit board 30. One end of the conductive member 40c is electrically connected to the circuit pattern layer 11, and the other end of the conductive member 40c protrudes outside the housing 110.

[0039] 2A shows a top view and a cross-sectional view of the lower jig 300. The lower jig 300 is used to mount the semiconductor assembly 50 and to position the insulating substrate 10 and the printed circuit board 30. The lower jig 300 includes a plurality of columnar members, a frame portion 304, a recessed portion 306, and a protruding portion 308.

[0040] The lower jig 300 includes a plurality of columnar members, namely, a first columnar member 301 and a second columnar member 302. The plurality of columnar members of the lower jig 300 may have the same cross-sectional shape, or may have cross-sectional shapes different from each other.

[0041] The first columnar member 301 and the second columnar member 302 are members for positioning the printed circuit board 30. The first columnar member 301 and the second columnar member 302 are disposed at positions corresponding to the through-holes 31 and 32, respectively, of the printed circuit board 30. The through-holes 31 and 32 will be described later.

[0042] The first columnar member 301 has a cross-sectional shape corresponding to the cross-sectional shape of the through-hole 31. The second columnar member 302 has a cross-sectional shape corresponding to the cross-sectional shape of the through-hole 32. The cross-sectional shapes of the first columnar member 301 and the second columnar member 302 in this example are circular. A circular shape may be a perfect circle having a predetermined radius. The first columnar member 301 and the second columnar member 302 may have different cross-sectional shapes.

[0043] The frame 304 has a size and a shape corresponding to the semiconductor assembly 50. The frame 304 may be made of a material that has good thermal conductivity in a furnace. For example, the material of the frame 304 is carbon.

[0044] The recesses 306 are depressions provided in the frame 304 to position the insulating substrate 10. The lower jig 300 has a plurality of recesses 306 inside the frame 304, and the insulating substrates 10 are arranged at positions corresponding to the recesses 306. The lower jig 300 has recesses 306a and recesses 306b arranged in the X-axis direction. The recesses 306 in this example have a rectangular shape when viewed from above, but are not limited to this. The top view refers to a viewpoint along the Z-axis.

[0045] The protrusion 308 is provided between the recess 306a and the recess 306b. That is, when the multiple insulating substrates 10 are placed on the lower jig 300, the protrusion 308 is located between the multiple insulating substrates 10. The first columnar member 301 and the second columnar member 302 are provided on the upper surface of the protrusion 308.

[0046] 2B shows an example of a process for arranging a plurality of insulating substrates 10 on a lower jig 300. A semiconductor chip 20 is arranged on the upper surface of each of the insulating substrates 10. Solder parts 15 for electrically connecting to the conductive member 40 are provided on the upper surface of the insulating substrate 10 and the upper surface of the semiconductor chip 20. A first columnar member 301 is arranged between the plurality of insulating substrates 10.

[0047] Insulating substrate 10a is disposed inside recess 306a, and its position in the XY plane is restricted. Insulating substrate 10b is disposed inside recess 306b, and its position in the XY plane is restricted. As a result, insulating substrate 10a and insulating substrate 10b are disposed at positions that are apart from each other by a predetermined insulation distance.

[0048] 2C shows an example of a process for arranging the printed circuit board 30 and the conductive member 40 on the insulating substrate 10. The printed circuit board 30 is positioned by a plurality of columnar members and provided at a position facing the insulating substrate 10. The printed circuit board 30 may be positioned in a state where it is connected to the conductive member 40. With the lower jig 300 restricting the positions of the printed circuit board 30 and the conductive member 40, the printed circuit board 30 and the conductive member 40 are transported to a furnace for soldering. A hot plate 310 is provided below the lower jig 300.

[0049] 2D shows an example of a process for heat treating the semiconductor assembly 50. The semiconductor assembly 50 is heat treated while being positioned by the lower jig 300. The semiconductor assembly 50 expands due to the heat treatment. The printed circuit board 30 of this example expands while its position in the XY plane is fixed by the first columnar members 301.

[0050] 2E shows a top view of the semiconductor assembly 50 during the heat treatment process. The dashed lines around the periphery of the printed circuit board 30 indicate that the printed circuit board 30 expands due to the heat treatment.

[0051] The through portion 31 is penetrated from the lower surface to the upper surface by the first columnar member 301. The position of the through portion 31 relative to the first columnar member 301 is fixed in the XY plane by the first columnar member 301. The through portion 31 is an example of a first through portion. The through portion 31 has substantially the same cross-sectional shape as the first columnar member 301. The through portion 31 in this example is a circular through hole. The through hole refers to the through portion 31 whose outer periphery is covered with the printed circuit board 30. The shape of the through portion 31 may be rectangular or another polygonal shape.

[0052] The through portion 32 is penetrated from the lower surface to the upper surface by the second columnar member 302. The through portion 32 has a cross-sectional shape different from that of the through portion 31 when viewed from above. The cross section of the through portion 32 includes a width larger than that of the through portion 31.

[0053] The cross-sectional shape of the through portion 32 includes a long axis and a short axis. The long axis may be the maximum width of the cross-sectional shape of the through portion 32 in a top view. The short axis may be a width shorter than the long axis of the cross-sectional shape of the through portion 32 in a top view. The cross-sectional shape of the through portion 32 may be a shape that is line symmetrical with respect to the long axis, or may not be a shape that is line symmetrical with respect to the long axis. The through portion 32 in this example is an oval through hole, but may be another shape such as an ellipse. The maximum width of the through portion 32 is larger than the maximum width of the through portion 31. The long axis of the through portion 32 may be larger than the maximum width of the through portion 31. The through portion 32 is an example of a second through portion. In this example, the long axis of the through portion 32 is the X-axis direction, and the short axis of the through portion 32 is the Y-axis direction.

[0054] The position of the through-hole 32 relative to the second columnar member 302 is fixed in the X-axis direction. The second columnar member 302 in this example prevents the printed circuit board 30 from rotating in the XY plane centered on the first columnar member 301. On the other hand, the position of the through-hole 32 relative to the second columnar member 302 is not fixed in the Y-axis direction. Therefore, the printed circuit board 30 expands and contracts in the Y-axis direction. In this way, the expansion and contraction of the printed circuit board 30 is not hindered. The shape of the through-hole 32 is not limited to this example as long as it does not hinder the expansion and contraction of the printed circuit board 30.

[0055] The through portions 31 and 32 are arranged in a predetermined arrangement direction. In this example, the arrangement direction is the Y-axis direction. That is, the arrangement direction in this example is the short-side direction of the printed circuit board 30. The through portion 32 has a width greater than the width of the through portion 31 in the arrangement direction. This allows the printed circuit board 30 to expand and contract outward in the arrangement direction, starting from the through portion 31, unless obstructed by the second columnar member 302. The distance between the through portion 31 and the through portion 32 may be half or more of the width in the short-side direction of the printed circuit board 30.

[0056] The through portion 31 is disposed between the adjacent insulating substrates 10 in a top view. Similarly, the through portion 32 may be disposed between the adjacent insulating substrates 10 in a top view. The through portion 31 and the through portion 32 may be disposed outside the insulating substrates 10 in the Y-axis direction as long as the positions in the X-axis direction are between the insulating substrates 10. The through portion 31 and the through portion 32 in this example are disposed near the center in the X-axis direction. By arranging the through portion 31 and the through portion 32 in the short-side direction of the printed circuit board 30, the printed circuit board 30 can expand and contract outward from the through portion 31 as a starting point in the long-side direction of the printed circuit board 30.

[0057] In this example, the expansion of the semiconductor assembly 50 is not hindered, and the relative positional relationship between the multiple insulating substrates 10 and the printed circuit board 30 can be maintained. In addition, in this example, the first columnar member 301 and the second columnar member 302 have a simple configuration, and the number of parts of the jig can be reduced. Furthermore, since there is no need to prepare an upper jig corresponding to the lower jig 300, the semiconductor assembly 50 can be easily removed by lifting it upward after the heat treatment.

[0058] 2F is an example of a flowchart for manufacturing the semiconductor device 100. In step S100, a plurality of insulating substrates 10 are placed on a lower jig 300. The plurality of insulating substrates 10 are placed in a plurality of recesses 306 of the lower jig 300. The plurality of insulating substrates 10 may have semiconductor chips 20 mounted thereon and solder portions 15 applied thereto.

[0059] In step S102, the printed circuit board 30 is positioned by the lower jig 300. The printed circuit board 30 is positioned by penetrating a plurality of columnar members through a plurality of through holes. In step S104, the plurality of insulating substrates 10 and the printed circuit board 30 are electrically connected by conductive members 40. Before the heat treatment of the semiconductor assembly 50, the solder portions 15 have not yet solidified, and the conductive members 40 are temporarily fixed to the solder portions 15 by the viscosity of the solder portions 15.

[0060] In step S106, the semiconductor assembly 50 is heat-treated. In the heat treatment, a process of increasing the temperature, maintaining the temperature, and decreasing the temperature is performed in a furnace. The semiconductor assembly 50 expands and contracts in response to temperature changes. Since the semiconductor assembly 50 of this example has the through-holes 31 and 32, the influence of the expansion of the printed circuit board 30 can be mitigated. The solder joints of the semiconductor assembly 50 are fixed in a balanced position by the self-alignment effect of the solder parts 15.

[0061] In step S108, the semiconductor assembly 50 is mounted in the housing 110. In the manufacturing method of this example, since an upper jig is not used, the semiconductor assembly 50 can be easily removed after heat treatment, and the efficiency of automatic production can be improved.

[0062] Fig. 3A shows an example of the configuration of the printed circuit board 30 and the lower jig 300. The printed circuit board 30 of this example has the same structure as the printed circuit board 30 of Fig. 2E. In this example, the state of the printed circuit board 30 before heat treatment is shown.

[0063] The width W1 is the width of the through portion 31 in a predetermined direction in the XY plane. When the through portion 31 is circular, the width of the through portion 31 corresponds to the diameter of the circle. In this example, the width W1 is the width of the through portion 31 in the Y-axis direction. The width W1 may be 0.5 mm or more and 1.5 mm or less. In one example, the width W1 is 1 mm.

[0064] The width W2 is the width of the through portion 32 in a predetermined direction in the XY plane. In this example, the width W2 is the length of the major axis of the through portion 32. In this example, the width W2 is the width of the through portion 32 in the Y-axis direction. The width W2 may be the maximum width of the through portion 32. The width W2 may be larger than the width W1 of the through portion 31 and may be larger than the diameter of the second columnar member 302. The width W2 may be 1.5 mm or more and 2.5 mm or less. In one example, the width W2 is 2 mm.

[0065] The width Ws2 is the length of the minor axis of the penetrating portion 32. The width Ws2 may be equal to the width W1. The width Ws2 may be approximately equal to the diameter of the second columnar member 302. The width Ws2 may be 0.5 mm or more and 1.5 mm or less. The width W2 may be 1.5 times the width Ws2 or more and 2.5 times or less.

[0066] The gap S is a region between the second columnar member 302 and the printed circuit board 30. The gap S is located between the through portion 31 and the through portion 32 in a top view.

[0067] The width Ls of the gap S is the distance in the arrangement direction between the printed circuit board 30 and the through portion 32 before heat treatment. This allows room for the printed circuit board 30 to displace to the position of the gap S when expansion of the printed circuit board 30 occurs. In one example, the width Ls of the gap S is 0.5 mm or more and 1.5 mm or less. The width Ls of the gap S may be changed depending on the shape or material of the printed circuit board 30, etc.

[0068] 3B shows a modified example of the printed circuit board 30 and the lower jig 300. The printed circuit board 30 of this example has a notch as the through-hole 32. This example shows the state of the printed circuit board 30 before heat treatment. Differences from the embodiment of FIG. 3A will be particularly described.

[0069] 3A, the position of the through-hole 31 in the XY plane is fixed by the first columnar member 301. In this example, the through-hole 31 and the first columnar member 301 have a circular cross section. The shapes of the through-hole 31 and the first columnar member 301 are not limited thereto as long as the positions in the XY plane can be fixed.

[0070] The through portion 32 is a cutout provided at an end of the printed circuit board 30. The cutout is a region extending inward from the outer periphery of the printed circuit board 30. The through portion 32 has a shape like a part of an ellipse. In this way, the through portion 32 does not need to completely cover the periphery of the second columnar member 302, and may have a structure with a part open.

[0071] The second columnar member 302 has a circular cross section in the XY plane. The through-hole 32 has a longitudinal direction in the arrangement direction of the through-holes 31 and 32 (the Y-axis direction in this example). This prevents the expansion and contraction of the printed circuit board 30 from being hindered. The shape of the through-hole 32 is not limited to this example as long as it does not hinder the expansion and contraction of the printed circuit board 30. In other words, the second columnar member 302 prevents the rotation of the printed circuit board 30 in the XY plane around the first columnar member 301, but does not hinder the expansion and contraction of the printed circuit board 30 in the Y-axis direction.

[0072] Fig. 3C shows a modified example of the printed circuit board 30 and the lower jig 300. The second columnar members 302 of this example differ from the embodiment of Fig. 3B in that they have a rectangular cross section in the XY plane. This example shows the state of the printed circuit board 30 before heat treatment. The differences from the embodiment of Fig. 3B will be particularly described.

[0073] The second columnar member 302 is provided so as to penetrate the through-hole 32. The second columnar member 302 may be provided so as to extend from the through-hole 32 to the outside of the printed circuit board 30 in a top view. The second columnar member 302 may be accommodated inside the through-hole 32 in a top view. A gap S is provided between the second columnar member 302 and the printed circuit board 30 before the heat treatment of the printed circuit board 30. Meanwhile, the second columnar member 302 inhibits the movement of the through-hole 32 in the X-axis direction. As a result, the second columnar member 302 prevents the rotation of the printed circuit board 30 in the XY plane centered on the first columnar member 301, but does not inhibit the expansion and contraction of the printed circuit board 30 in the Y-axis direction.

[0074] 3D shows a modified example of the printed circuit board 30 and the lower jig 300. The printed circuit board 30 of this example includes a through portion 31, a through portion 32, and a through portion 33. A first columnar member 301 of this example fixes the position of the through portion 31 in the XY plane, similar to the embodiment of FIG. 3A. The through portion 31 is a circular through hole.

[0075] The through portion 32 and the through portion 33 are provided closer to the outer periphery of the printed circuit board 30 than the multiple insulating substrates 10 in a top view. The distance between the through portion 31 and the through portion 32 or the through portion 33 is sufficient to prevent rotation of the printed circuit board 30 in the XY plane centered on the through portion 31. The through portion 32 and the through portion 33 are oval through holes. The through portion 33 is an example of a third through portion.

[0076] The through portion 32 is provided on the positive side of the through portion 31 in the Y-axis direction and on the negative side of the through portion 31 in the X-axis direction. The through portion 32 has a long axis in the arrangement direction of the through portion 31 and the through portion 32. The arrangement direction of the through portion 31 and the through portion 32 is indicated by a dashed line connecting the through portion 31 and the through portion 32. The short axis of the through portion 32 extends in a direction perpendicular to the long axis of the through portion 32 in the XY plane.

[0077] Through portion 33 is provided on the positive side of through portion 31 in the Y-axis direction and on the positive side of through portion 31 in the X-axis direction. Through portion 33 has a long axis in the arrangement direction of through portion 31 and through portion 33. The arrangement direction of through portion 31 and through portion 33 is indicated by a dashed line connecting through portion 31 and through portion 33. The short axis of through portion 33 extends in a direction perpendicular to the long axis of through portion 33 in the XY plane. It is sufficient that printed circuit board 30 has either through portion 32 or through portion 33.

[0078] 4 shows an example of a manufacturing method of a semiconductor device 500 according to a comparative example. The semiconductor device 500 includes an insulating substrate 510 on which a semiconductor chip 520 is mounted. A semiconductor assembly 550 is transported into a furnace for heat treatment by a transport unit 610. The transport unit 610 is a conveyor, and automatically transports the semiconductor assembly 550 mounted on a lower jig 600. In this example, the relative positional relationship between the insulating substrate 510 and the printed circuit board 530 is not fixed, and vibrations or impacts during transport may cause poor contact of the conductive member 540.

[0079] 5 shows an example of a manufacturing method for a semiconductor device 500 according to a comparative example. A lower jig 600 and an upper jig 620 are fixed by screws using fixing parts 625. The relative positional relationship between an insulating substrate 510 and a printed circuit board 530 is fixed by the lower jig 600 and the upper jig 620. However, there is a risk of defective products being produced due to warping caused by local stress concentration caused by heat treatment.

[0080] Although the present invention has been described above using the embodiments, the technical scope of the present invention is not limited to the scope described in the above embodiments. It is clear to those skilled in the art that various modifications and improvements can be made to the above embodiments. It is clear from the description of the claims that such modifications and improvements can also be included in the technical scope of the present invention.

[0081] It should be noted that the order of execution of each process, such as operations, procedures, steps, and stages, in the devices, systems, programs, and methods shown in the claims, specifications, and drawings is not specifically stated as "before," "prior to," etc., and may be realized in any order unless the output of a previous process is used in a later process. Even if the operational flow in the claims, specifications, and drawings is explained using "first," "next," etc. for convenience, it does not mean that it is essential to perform the process in this order. [Explanation of symbols]

[0082] REFERENCE SIGNS LIST 10 insulating substrate, 11 circuit pattern layer, 12 insulating layer, 13 conductive layer, 15 solder portion, 20 semiconductor chip, 30 printed circuit board, 31 through portion, 32 through portion, 33 through portion, 40 conductive member, 50 semiconductor assembly, 100 semiconductor device, 110 housing, 120 conductive terminal pin, 130 mounting hole, 140 heat dissipation portion, 300 Lower jig, 301, first columnar member, 302, second columnar member, 304, frame portion, 306, recessed portion, 308, protruding portion, 310, heat plate, 500, semiconductor device, 510, insulating substrate, 520, semiconductor chip, 530, printed circuit board, 540, conductive member, 550, semiconductor assembly, 600, lower jig, 610, transport portion, 620, upper jig, 625, fixing portion

Claims

1. A semiconductor chip; A plurality of insulating substrates on which the semiconductor chips are mounted; a printed circuit board provided opposite the insulating substrates; a conductor member electrically connecting the insulating substrates and the printed circuit board; Equipped with the printed circuit board has a first penetration portion and a second penetration portion for penetrating a plurality of columnar members of a lower jig on which the plurality of insulating substrates are arranged, the first penetrating portion is disposed between adjacent ones of the insulating substrates in a top view, The second through-hole has a shape in a top view different from that of the first through-hole, The first through portion and the second through portion are arranged in a predetermined arrangement direction, The second through portion has a width in the arrangement direction that is greater than a width of the first through portion. Semiconductor device.

2. The second penetration portion is disposed at a position shifted in the short direction of the printed circuit board from the first penetration portion in a top view. The semiconductor device according to claim 1 .

3. The second penetration portion is disposed between the adjacent insulating substrates in a top view.

3. The semiconductor device according to claim 1 or 2.

4. The cross-sectional shape of the second penetrating portion includes a major axis and a minor axis, The major axis is greater than the maximum width of the cross-sectional shape of the first penetrating portion. The semiconductor device according to claim 1 .

5. The arrangement direction is the short side direction of the printed circuit board. The semiconductor device according to claim 1 .

6. The first through-hole is a circular through-hole, The second through-hole is a through-hole including a major axis and a minor axis in a top view. The semiconductor device according to claim 1 .

7. The first through-hole is a circular through-hole, The second penetration portion is a notch provided at an end portion of the printed circuit board. The semiconductor device according to claim 1 .

8. the second through portion and the third through portion are provided on an outer periphery side of the printed circuit board relative to the insulating substrates, The first through-hole is a circular through-hole, The second through portion and the third through portion are through holes including a major axis and a minor axis when viewed from above.

3. The semiconductor device according to claim 1 or 2.

9. placing a plurality of insulating substrates on a lower jig having a plurality of columnar members; penetrating the plurality of columnar members through a plurality of penetration portions of a printed circuit board; electrically connecting the insulating substrates and the printed circuit board with a conductor member; heat treating the insulating substrates and the printed circuit board; Equipped with The plurality of through-holes include a first through-hole and a second through-hole, the first penetrating portion is provided between adjacent ones of the insulating substrates in a top view, The first through portion and the second through portion are arranged in a predetermined arrangement direction, The second through portion has a width in the arrangement direction that is greater than a width of the first through portion. A method for manufacturing a semiconductor device.

10. The step of arranging the plurality of insulating substrates on the lower jig includes the step of arranging the plurality of insulating substrates in a plurality of recesses provided in the lower jig. The method for manufacturing a semiconductor device according to claim 9 .

11. The plurality of columnar members have the same cross-sectional shape. The method for manufacturing a semiconductor device according to claim 9 or 10.

12. The cross-sectional shape of the plurality of columnar members is circular. The method for manufacturing a semiconductor device according to claim 11 .

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