Glass assemblies having performance enhancing features and methods of making same - Patents.com

Abstract

To provide an improved method of manufacturing a glass assembly including a performance-enhancing feature.SOLUTION: A method of manufacturing a glass assembly having a performance-enhancing feature includes a step of forming a curved glass substrate. The method also includes a step of digitally applying an ink without using a mask onto a surface of the curved glass substrate. The method further includes a step of curing the ink to form the performance-enhancing feature on the surface of the curved glass substrate.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] This application claims priority to U.S. Patent Application No. 17 / 860,411, filed July 8, 2022, which is incorporated herein by reference in its entirety.

[0002] FIELD OF THE DISCLOSURE This application relates generally to glazing assemblies and methods of manufacturing glazing assemblies, and more particularly to glazing assemblies having performance-enhancing features and methods of manufacturing glazing assemblies having performance-enhancing features. [Background technology]

[0003] Glass assemblies used in automobiles often contain performance-enhancing features. Typically, these performance-enhancing features include substances deposited on the glass assembly to add additional functionality and / or improve the aesthetics of the glass assembly. Examples of performance-enhancing features include conductive features (heating grids or antennas), opaque boundary features (such as black bands or light sensor boundaries), or other functional coatings (anti-reflective coatings, IR-transmitting coatings, water-repellent coatings, oleophobic coatings, oleophilic coatings, etc.). Often, performance-enhancing features are formed by depositing a substance (such as a mixture of ceramic frit and other substances such as pigments or conductive particles) on a flat glass substrate and then firing the glass substrate at temperatures above 500° C. to fuse the substance into the glass. The glass substrate containing the molten substance is typically fired at temperatures above 600° C. to bend the substrate into the desired shape. When glass assemblies containing these substances are fired at such high temperatures, there is a problem that the portions of the glass assembly containing the substance absorb heat differently than the remainder of the glass assembly that does not contain the substance. For example, a portion of the glass assembly containing the substance may experience a temperature of 650° C. during firing, while the remainder of the glass assembly (not containing the substance) may experience a temperature of 640° C. during firing. Thus, the portion of the glass assembly containing the substance has a different softness than the remainder of the glass assembly not containing the substance. The difference in softness between the portion of the glass assembly containing the substance and the remainder of the glass assembly may result in different deformations in each portion of the glass assembly, which may cause significant optical distortions in the glass assembly and affect its strength. This optical distortion is particularly detrimental to the performance of optical sensors used in semi-autonomous or autonomous operation, including cameras and LIDAR sensors. Summary of the Invention [Problem to be solved by the invention]

[0004] Furthermore, conventional analog printing processes for depositing materials (e.g., screen printing, spray printing through a mask, etc.) are generally limited to a maximum resolution of about 200 dots per inch and typically require a mask. As an example, in a conventional screen printing process, a mask (i.e., a "screen") is placed over a substrate that defines gaps corresponding to the desired areas to be printed. Material is deposited over the mask by manual processes such as rollers, squeegees, brushes, sprays, etc. These manual processes often require the deposition of excess material over the mask to ensure that all gaps in the mask are adequately filled. Furthermore, conventional analog printing processes are typically performed on flat substrates, as it is difficult to print accurately and repeatedly on curved substrates.

[0005] In view of the above, there is a need for improved methods of manufacturing glazing assemblies having performance-enhancing features. [Means for solving the problem]

[0006] The present disclosure includes a method of manufacturing a glass assembly having performance enhancing features (PEFs). The method includes forming a curved glass substrate. The method also includes digitally depositing an ink on a surface of the curved glass substrate without the use of a mask. The method also includes curing the ink to form a PEF on the surface of the curved glass substrate. Significantly, by digitally depositing the ink after forming the curved glass substrate, optical distortions caused by firing a glass assembly containing conventional materials can be suppressed. Furthermore, because of the precise control provided by digitally depositing the ink, the ink can be deposited to tighter tolerances and create finer features than conventional analog printing processes.

[0007] The advantages of the present disclosure will be readily understood by considering the following detailed description in conjunction with the accompanying drawings, in which: [Brief description of the drawings]

[0008] [Figure 1] 1 is a flow chart illustrating the method of the present disclosure. [Diagram 2] 1A-1D are schematic cross-sectional views of steps for forming a curved glass substrate. [Figure 3A] FIG. 1 is a schematic front view of digitally depositing ink on a curved glass substrate and curing the ink to form performance-enhancing features. [Figure 3B] FIG. 3B is a top perspective view of FIG. 3A. [Figure 4A] 1 is a cross-sectional view of an example of a glazing assembly having performance-enhancing features. [Figure 4B] 1 is a cross-sectional view of an example of a glazing assembly having performance-enhancing features. [Figure 4C] 1 is a cross-sectional view of an example of a glazing assembly having performance-enhancing features. [Diagram 5] 4A-4C are schematic cross-sectional views of disposing a polymer interlayer between a first curved glass substrate and a second curved glass substrate. [Figure 6A] 1 is a schematic cross-sectional view of an example of a laminated glass assembly having performance-enhancing features. [Figure 6B] 1 is a schematic cross-sectional view of an example of a laminated glass assembly having performance-enhancing features. [Figure 6C] 1 is a schematic cross-sectional view of an example of a laminated glass assembly having performance-enhancing features. [Figure 6D] 1 is a schematic cross-sectional view of an example of a laminated glass assembly having performance-enhancing features. [Figure 7] FIG. 1 is a partial front view of a vehicle including a windshield assembly having opaque boundary features. [Figure 8A] FIG. 8 is a schematic cross-sectional view of an example of the glass assembly of FIG. 7 along line 8-8 having opaque boundary features. [Figure 8B] FIG. 8 is a schematic cross-sectional view of an example of the glass assembly of FIG. 7 along line 8-8 having opaque boundary features. [Figure 8C] FIG. 8 is a schematic cross-sectional view of an example of the glass assembly of FIG. 7 along line 8-8 having opaque boundary features. [Figure 9A] FIG. 2 is a front view of a glass assembly having an opaque boundary feature formed as a band. [Figure 9B] 1 is a front view of a glazing assembly having an opaque boundary feature formed as a band having a first opacity at a first end and a second opacity at a second end. [Figure 10A] FIG. 8 is a schematic cross-sectional view of an example of the glass assembly of FIG. 7 along line 10-10 having an opaque boundary feature formed as an optical sensor boundary. [Figure 10B] FIG. 8 is a schematic cross-sectional view of an example of the glass assembly of FIG. 7 along line 10-10 having an opaque boundary feature formed as an optical sensor boundary. [Figure 10C] FIG. 8 is a schematic cross-sectional view of an example of the glass assembly of FIG. 7 along line 10-10 having an opaque boundary feature formed as an optical sensor boundary. [Figure 11A] 1 is a front view of a glass assembly having an opaque boundary feature formed as a band and an optical sensor boundary defining a detection window, the detection window being transparent to visible light. [Figure 11B] 1 is a front view of a glass assembly having an opaque boundary feature formed as a band and an optical sensor boundary defining a detection window that is opaque to visible light and transparent to infrared light. [Figure 11C] FIG. 2 is a front view of a glass assembly having an opaque boundary feature having a first portion formed from enamel with a ceramic frit and a second portion formed from an organic ink. [Figure 12A] FIG. 8 is a schematic cross-sectional view of an example of the glass assembly of FIG. 7 along line 12-12 having opaque boundary features and graphic-containing information. [Figure 12B] FIG. 8 is a schematic cross-sectional view of an example of the glass assembly of FIG. 7 along line 12-12 having opaque boundary features and graphic-containing information. [Figure 13A] FIG. 1 is a front view of a glass assembly having opaque border features and graphic-containing information. [Figure 13B]FIG. 1 is a front view of a glass assembly having opaque border features and graphic-containing information. [Figure 13C] FIG. 1 is a front view of a glass assembly having opaque border features and graphic-containing information. [Figure 14] FIG. 1 is a rear perspective view of a vehicle having a rear glass assembly including conductive features that define a heating element. [Figure 15A] FIG. 15 is a schematic cross-sectional view of an example of the glass assembly of FIG. 14 taken along line 15-15. [Figure 15B] FIG. 15 is a schematic cross-sectional view of an example of the glass assembly of FIG. 14 taken along line 15-15. [Figure 16] FIG. 1 is a front view of a vehicle having a windshield assembly having conductive features that define a heating element. [Figure 17A] FIG. 17 is a schematic cross-sectional view of an example of the glass assembly of FIG. 16 taken along line 17-17. [Figure 17B] FIG. 17 is a schematic cross-sectional view of an example of the glass assembly of FIG. 16 taken along line 17-17. [Figure 18] FIG. 1 is a rear perspective view of a vehicle having a rear glass assembly having conductive features defining an antenna. [Figure 19A] FIG. 19 is a schematic cross-sectional view of an embodiment of the glass assembly of FIG. 18 taken along line 19-19. [Figure 19B] FIG. 19 is a schematic cross-sectional view of an embodiment of the glass assembly of FIG. 18 taken along line 19-19. [Figure 19C] FIG. 19 is a schematic cross-sectional view of an embodiment of the glass assembly of FIG. 18 taken along line 19-19. [Figure 20] FIG. 1 is a front view of a vehicle having a windshield assembly having conductive features defining an antenna. [Figure 21A] FIG. 21 is a schematic cross-sectional view of an example of the glass assembly of FIG. 20 taken along line 21-21. [Figure 21B] FIG. 21 is a schematic cross-sectional view of an example of the glass assembly of FIG. 20 taken along line 21-21. [Figure 22] 1 is a rear perspective view of a vehicle having a rear glass assembly having a functional coating; [Figure 23A] FIG. 23 is a schematic cross-sectional view of an example of the glass assembly of FIG. 22 taken along line 23-23. [Figure 23B] FIG. 23 is a schematic cross-sectional view of an example of the glass assembly of FIG. 22 taken along line 23-23. [Figure 24] FIG. 1 is a front view of a vehicle having a windshield assembly having a functional coating. [Figure 25A] FIG. 25 is a schematic cross-sectional view of an example of the glass assembly of FIG. 24 taken along line 25-25. [Figure 25B] FIG. 25 is a schematic cross-sectional view of an example of the glass assembly of FIG. 24 taken along line 25-25. [Figure 25C] FIG. 25 is a schematic cross-sectional view of an example of the glass assembly of FIG. 24 taken along line 25-25. [Figure 25D] FIG. 25 is a schematic cross-sectional view of an example of the glass assembly of FIG. 24 taken along line 25-25. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] In the various drawings, like reference numbers are used to identify like or identical components. Referring to the drawings, FIG. 1 generally illustrates a method 100 of forming a glazing assembly 20 having performance enhancing features PEF. In one example, the glazing assembly 20 is used in an automotive context as a window for a vehicle 18, such as a windshield, side window, quarter window, or rear window. Of course, it is understood that the method 100 of forming the glazing assembly 20 may have non-automotive applications.

[0010] 1-3B, a method 100 of forming a glass assembly 20 includes step S1 of forming a curved glass substrate 22, step S2 of digitally depositing ink I on a surface of the curved glass substrate 22 without the use of a mask, and step S3 of curing the ink I to form performance-enhancing features PEF on the surface of the curved glass substrate 22. A description of each of steps S1, S2, S3, and S4 of method 100 is provided in further detail below.

[0011] As previously discussed, step S1 of method 100 includes forming a curved glass substrate 22. With reference to Figure 2, the curved glass substrate 22 may be formed having an exterior surface (P1) and an opposing interior surface (P2). In one embodiment, the P2 surface is positioned to face the interior of the vehicle 18 when the glazing assembly 20 is installed on the vehicle 18, and the P1 surface is positioned to face the exterior of the vehicle 18 when the glazing assembly 20 is installed on the vehicle 18.

[0012] 2, in one example of step S1, the curved glass substrate 22 is first formed as a flat glass sheet 22F. The flat glass sheet 22F may be manufactured using any suitable sheet glass manufacturing method, including but not limited to the float process. The flat glass sheet 22F may be composed of any suitable glass composition, including but not limited to soda-lime glass, aluminosilicate glass, borosilicate glass, boroaluminosilicate glass, and the like.

[0013] After forming the flat glass sheet 22F, the flat glass sheet 22F is bent to form the curved glass substrate 22. The flat glass sheet 22F may be bent using any suitable glass bending process, including, but not limited to, press bending, gravity bending (i.e., flexure bending), roll forming, or cold bending. The flat glass sheet 22F may be bent into any geometric shape suitable for a desired application.

[0014] In another example of step S1, the curved glass substrate 22 is first formed as a curved substrate, as opposed to forming a flat glass sheet 22F and then bending it. The curved glass substrate 22 may be manufactured using any suitable curved glass manufacturing process, including, but not limited to, glass blowing. As with the flat glass sheet 22F described above, in this example, the curved glass substrate 22 is first formed, and may be composed of any suitable glass composition, including, but not limited to, soda-lime glass, aluminosilicate glass, borosilicate glass, boroaluminosilicate glass, and the like.

[0015] In some examples, the glass assembly 20 is formed as a laminated glass assembly 20. In these examples, the laminated glass assembly 20 includes a curved glass substrate 22 (also referred to as a "first curved glass substrate 22") having an outer surface (P1) and an opposing inner surface (P2), a second curved glass substrate 24 having an inner surface (P3) and an opposing outer surface (P4), and a polymer interlayer 28 disposed between the P2 and P3 surfaces (described in further detail below). Thus, in relation to the laminated glass assembly 20, step S1 of the method 100 may further include forming a curved second glass substrate 24. Of course, the second curved glass substrate 24 may be formed by any of the processes described with respect to the first curved glass substrate 22. It is also understood that the first curved glass substrate 22 and the second curved glass substrate 24 may be formed together (i.e., bent while positioned adjacent to each other) or may be formed separately. Like the first curved glass substrate 22, the second curved glass substrate 24 may be composed of any suitable glass composition, including, but not limited to, soda-lime glass, aluminosilicate glass, borosilicate glass, boroaluminosilicate glass, etc. The first curved glass substrate 22 and the second curved glass substrate 24 may be composed of the same or different glass compositions.

[0016] Significantly, during the bending process, the first curved glass substrate 22 and / or the second curved glass substrate 24 may be free of conventional materials (such as coatings with ceramic frits) used to form performance-enhancing features that are subject to firing, particularly in portions of the glass assembly 20 where it is important to minimize distortion (e.g., the field of view of an optical sensor). Thus, the first curved glass substrate 22 and / or the second curved glass substrate 24 absorb heat more uniformly than substrates that include these conventional materials, thereby preventing non-uniform deformation (i.e., optical distortion) of the first curved glass substrate 22 and / or the second curved glass substrate 24. Instead, the ink I is applied and cured on the surface of the first curved glass substrate 22 and / or the second curved glass substrate 24 to form the performance-enhancing features PEF after step S1, as described below in the context of steps S2 and S3.

[0017] In some examples, the first curved glass substrate 22 and / or the second curved glass substrate 24 are transparent. In this context, the term "transparent", also referred to as "substantially transparent", refers to a material that allows 70% or more of light transmission therethrough in a given visible light range. Unless otherwise specified, the given visible light range is a segment of the electromagnetic spectrum that is visible to the human eye. More simply, wavelengths in this range are referred to as visible light. Typically, the human eye can detect wavelengths from about 380 to about 780 nanometers, and thus the given visible light range described herein represents wavelengths of light from about 380 to about 780 nanometers, unless otherwise specified. In some examples, the first curved glass substrate 22 and / or the second curved glass substrate 24 include various additives that change the transparency of the curved glass substrate, for example, the additives may provide various levels of coloration or coloration while maintaining the first curved glass substrate 22 and / or the second curved glass substrate 24 as "transparent" or "substantially transparent" as described above.

[0018] In other examples, the first curved glass substrate 22 and / or the second curved glass substrate 24 are less transparent than described above. For example, if the glazing assembly 20 is privacy glass, the transmissivity of the glazing assembly 20 is substantially reduced such that the glazing assembly 20 provides less than 70% light transmission over a given wavelength range, such as 0 to 70% light transmission over a given wavelength range.

[0019] The curved glass substrate 22 has a thickness T1. The thickness T1 of the curved glass substrate 22 may be any suitable thickness suitable for the application. For example, in an automotive window application, the thickness T1 of the curved glass substrate 22 may be from about 0.3 mm to about 4.1 mm. More specifically, the thickness T1 may be about 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, 1.0 mm, 1.1 mm, 1.2 mm, 1.3 mm, 1.4 mm, 1.5 mm, 1.6 mm, 1.7 mm, 1.8 mm, 1.9 mm, 2.0 mm, 2.1 mm, 2.2 mm, 2.3 mm, 2.4 mm, 2.5 mm, 2.6 mm, 2.7 mm, 2.8 mm, 2.9 mm, 3.0 mm, 3.1 mm, 3.2 mm, 3.3 mm, 3.4 mm, 3.5 mm, 3.6 mm, 3.7 mm, 3.8 mm, 3.9 mm, or 4.1 mm.

[0020] Similarly, for the laminated glass assembly 20, the second curved glass substrate 24 has a thickness T2. The thickness T2 of the second curved glass substrate 24 may be any suitable thickness suitable for the application. For example, in an automotive laminated glass assembly application, the thickness T2 of the second curved glass substrate 24 may be from about 0.3 mm to about 4.1 mm. More specifically, the thickness T2 may be about 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, 1.0 mm, 1.1 mm, 1.2 mm, 1.3 mm, 1.4 mm, 1.5 mm, 1.6 mm, 1.7 mm, 1.8 mm, 1.9 mm, 2.0 mm, 2.1 mm, 2.2 mm, 2.3 mm, 2.4 mm, 2.5 mm, 2.6 mm, 2.7 mm, 2.8 mm, 2.9 mm, 3.0 mm, 3.1 mm, 3.2 mm, 3.3 mm, 3.4 mm, 3.5 mm, 3.6 mm, 3.7 mm, 3.8 mm, 3.9 mm, or 4.1 mm. Of course, the thickness T1 and the thickness T2 may be the same or different. In one example, the first curved glass substrate 22 and the second curved glass substrate 24 have the same thickness (i.e., T1 is equal to T2) such that the glass assembly 20 is considered a "symmetric" stack. However, in another example, the first curved glass substrate 22 and the second curved glass substrate 24 have different thicknesses (i.e., T1 is not equal to T2) such that the glass assembly 20 is considered an "asymmetric" stack. All combinations of the above exemplary T1 and T2 values, and all fractional values ​​therebetween, are contemplated.

[0021] Step S2 of the method 100 includes digitally depositing ink I on the surface of the curved glass substrate 22 without the use of a mask. For example, FIGS. 3A-3B show digitally depositing ink I on the P2 surface of the curved glass substrate 22. As described in more detail below, examples of ink I include, but are not limited to, organic ink OI, conductive ink CI, and functional ink FI. Of note, ink I is typically liquid when digitally deposited in step S2. However, it is understood that ink I may be deposited in other forms, including, but not limited to, powder. Also, ink I may not include a ceramic frit, and thus, in some examples, glass assembly 20 may not include a ceramic frit. As described in more detail below, method 100 includes (S3) curing ink I to solidify ink I and form performance-enhancing features PEF.

[0022] The term "digitally depositing" refers to any suitable depositing process in which, unlike traditional analog printing processes, the depositing of ink I is digitally controlled and ink I is deposited on a substrate according to a digitally based image. Exemplary processes for digitally depositing ink I include, but are not limited to, inkjet printing, electrohydrodynamic printing, laser printing, etc. In particular, because of the precise control afforded by digitally depositing ink I according to step S2 of method 100, ink I may be deposited with significantly higher resolution than traditional analog printing processes. For example, ink I may be digitally deposited on the surface of the curved glass substrate 22 at a resolution of greater than 200 dots / inch, greater than 300 dots / inch, greater than 400 dots / inch, greater than 500 dots / inch, greater than 600 dots / inch, greater than 700 dots / inch, greater than 800 dots / inch, greater than 900 dots / inch, greater than 1000 dots / inch, greater than 1100 dots / inch, greater than 1200 dots / inch, greater than 1300 dots / inch, greater than 1400 dots / inch, greater than 1500 dots / inch, greater than 1600 dots / inch, greater than 1700 dots / inch, greater than 1800 dots / inch, greater than 1900 dots / inch, greater than 2000 dots / inch, greater than 2100 dots / inch, greater than 2200 dots / inch, greater than 2300 dots / inch, greater than 2400 dots / inch, greater than 2500 dots / inch, or greater than 2600 dots / inch.

[0023] Thus, the higher resolution and more precise control of the digital placement process of step S2 allows the ink I to be deposited to form significantly more detailed features and achieve significantly tighter tolerances than conventional analog printing processes. In other words, a "more detailed" feature may include forming a member of performance-enhancing features PEF having smaller geometries than are achievable with conventional analog printing processes. Also, using conventional analog printing processes such as screen printing, the performance-enhancing features PEF can only be repeatably placed within a tolerance of + / - 1.5 millimeters. In contrast, the finer control provided by digitally placing the ink I according to step S2 of method 100 allows the performance-enhancing features PEF to be more repeatably placed during manufacturing than conventional analog screen printing processes. For example, using the digital placement process of step S2, the performance-enhancing features PEF can be repeatably placed within a tolerance of + / - 0.1 millimeters.

[0024] It is also noted that when digitally depositing the ink I, a mask is not required, as is typically required in a conventional analog printing process. For example, as shown in FIG. 3A and FIG. 3B, when digitally depositing the ink I according to step S2 of the method 100, the ink I is deposited directly on the surface of the curved glass substrate 22 according to a digital base image, eliminating the need for a mask and using less ink than the extra ink required in conventional analog printing using a mask. Furthermore, the increased control gained by digitally depositing the ink I allows for a layer that is much thinner to be digitally deposited than is possible in a conventional analog printing process. As an example, the ink I may have a thickness of more than 0.1 micrometers and less than 15 micrometers on the surface of the curved glass substrate 22. It is also contemplated that the ink I may be digitally deposited with a variable thickness and cured to form a performance-enhancing feature PEF having a variable thickness.

[0025] Additionally, digitally placing ink I according to method 100 has advantages over conventional analog printing processes because the digitally based image used to control the digital placement process can be quickly and electronically modified, whereas modifying the design of a conventional analog printing process requires fabricating new physical printing tools (such as screens in screen printing). Thus, digitally placing ink I according to step S2 of method 100 allows rapid prototyping of many different configurations of performance enhancing features PEF by simply modifying the digitally based image instead of fabricating new analog printing tools.

[0026] With respect to the laminated glass assembly 20, step S2 of the method 100 may include digitally placing ink I on at least one of the P1 surface of the first curved glass substrate 22, the P2 surface of the first curved glass substrate 22, the P3 surface of the second curved glass substrate 24, and the P4 surface of the second curved glass substrate 24. It is understood that ink I may be digitally placed on at least one of the P1 surface, the P2 surface, the P3 surface, and the P4 surface according to any of the digital placement processes described above. It is contemplated that ink I may be placed on any combination of the P1 surface, the P2 surface, the P3 surface, and the P4 surface.

[0027] Notably, because Ink I is solidified on the substrate on which it is placed, instead of being fired, Ink I does not fuse to the substrate as do conventional substances such as ceramic frits. Significantly, because the glass assembly 20 formed according to method 100 is not fired to fuse Ink I to the first curved glass substrate 22 and / or the second curved glass substrate 24, the strength of the first curved glass substrate 22 and / or the second curved glass substrate 24 is not affected. However, because Ink I is not fused to the first curved glass substrate 22 and / or the second curved glass substrate 24, the performance-enhancing features PEF may be weaker as compared to conventional performance-enhancing features formed using conventional substances such as ceramic frits. Thus, in some examples, it may be advantageous to digitally place ink I on at least one of the P2 surface of the first curved glass substrate 22 and the P3 surface of the second curved glass substrate 24, so that upon lamination of the glass assembly 20 (described below in the context of step S4), the performance-enhancing features PEF are sandwiched within the glass assembly 20, such that the first curved glass substrate 22 and the second curved glass substrate 24 protect the performance-enhancing features PEF from the surrounding environment.

[0028] In one example, the step S2 of digitally depositing the ink I comprises inkjet printing the ink I onto the surface of the curved glass substrate 22. In general, the term "inkjet printing" refers to a printing process in which a digitally controlled printhead propels droplets of ink onto a substrate according to a digitally based image. Examples of inkjet printing processes include, but are not limited to, continuous inkjet printing, thermal inkjet printing, piezo inkjet printing, drop-on-demand inkjet printing, and the like. The step of inkjet printing the ink I onto the surface of the first curved glass substrate 22 and / or the second curved glass substrate 24 may include, but is not limited to, continuous inkjet printing, thermal inkjet printing, piezo inkjet printing, drop-on-demand inkjet printing, and the like. The step of inkjet printing the ink I onto the surface of the first curved glass substrate 22 and / or the second curved glass substrate 24 may include, but is not limited to, continuous inkjet printing, thermal inkjet printing, piezo inkjet printing, drop-on-demand inkjet printing, and the like. The optical fiber may be implemented at a resolution of greater than 0 dots / inch, greater than 1400 dots / inch, greater than 1500 dots / inch, greater than 1600 dots / inch, greater than 1700 dots / inch, greater than 1800 dots / inch, greater than 1900 dots / inch, greater than 2000 dots / inch, greater than 2100 dots / inch, greater than 2200 dots / inch, greater than 2300 dots / inch, greater than 2400 dots / inch, greater than 2500 dots / inch, or greater than 2,600 dots / inch.

[0029] In another example, the step S2 of digitally placing the ink I comprises electrohydrodynamically printing the ink I on the surface of the curved glass substrate 22. In general, the term "electrohydrodynamic printing" refers to a printing process in which ink is directed through a nozzle onto a substrate according to a digitally based image by a digitally controlled and electrically charged printhead. In the context of the present disclosure, the nozzle may be as wide as the line width W (described below) of the performance enhancement feature PEF. In some examples, the width of the nozzle may be on the order of 10 micrometers. Thus, in some examples, the line width W of the performance enhancement feature PEF is also 10 micrometers. Of course, it is understood that the width of the nozzle may be selected to be wider than 10 micrometers to form a performance enhancement feature PEF having a line width W wider than 10 micrometers. Also, the step of electrohydrodynamically printing the conductive ink CI on the surface of the first curved glass substrate 22 and / or the second curved glass substrate 24 may be performed at a rate of more than 200 dots / inch, more than 300 dots / inch, more than 400 dots / inch, more than 500 dots / inch, more than 600 dots / inch, more than 700 dots / inch, more than 800 dots / inch, more than 900 dots / inch, more than 1000 dots / inch, more than 1100 dots / inch, more than 1200 dots / inch, It is contemplated that the image may be implemented at a resolution of greater than 1300 dots / inch, greater than 1400 dots / inch, greater than 1500 dots / inch, greater than 1600 dots / inch, greater than 1700 dots / inch, greater than 1800 dots / inch, greater than 1900 dots / inch, greater than 2000 dots / inch, greater than 2100 dots / inch, greater than 2200 dots / inch, greater than 2300 dots / inch, greater than 2400 dots, 2500 dots / inch, or greater than 2600 dots / inch.

[0030] As mentioned above, digitally placing ink on a curved substrate has its challenges. Thus, in one example, the step S2 of digitally placing the ink I includes providing a robot applicator 30 having a print head 32. In this example, the step S2 of digitally placing the ink I further includes disposing the robot applicator 30 adjacent to the surface of the first curved glass substrate 22 and / or the second curved glass substrate 24. Also, in this example, the step S2 of digitally placing the ink I includes digitally placing the ink I from the print head 32 of the robot applicator 30 without providing a mask on the surface of the first curved glass substrate 22 and / or the second curved glass substrate 24. In this case, the robot applicator 30 moves the print head 32 along the surface of the first curved glass substrate 22 and / or the second curved glass substrate 24. 3A and 3B show schematic diagrams of a robotic applicator 30 and print head 32 positioned adjacent to the P2 surface of the first curved glass substrate 22. Thus, in the context of this embodiment, the step S2 of digitally depositing ink I comprises digitally depositing ink I from the print head 32 of the robotic applicator 30 without a mask on the P2 surface of the first curved glass substrate 22 as the robotic applicator 30 moves the print head 32 along the P2 surface of the first curved glass substrate 22.

[0031] Any suitable robotic applicator 30 capable of moving the print head 32 along the surface of the first curved glass substrate 22 and / or the second curved glass substrate 24 is contemplated. In other words, a robotic applicator 30 configured to follow a curved path having the curvature of the first curved glass substrate 22 and / or the second curved glass substrate 24 as the robotic applicator 30 moves the print head 32 along the surface of the first curved glass substrate 22 and / or the second curved glass substrate 24 is desirable. More specifically, a robotic applicator 30 suitable for maintaining a distance between the print head 32 and the surface of the first curved glass substrate 22 and / or the second curved glass substrate 24 and maintaining the print head 32 at a substantially perpendicular angle to the surface of the first curved glass substrate 22 and / or the second curved glass substrate 24 is desirable. For example, the robotic applicator 30 may be a six-axis robot, a Cartesian robot, or the like configured to move the print head 32 along the surface of the first curved glass substrate 22 and / or the second curved glass substrate 24 .

[0032] It is contemplated that ink I is deposited a width per each pass of the robotic applicator 30. The maximum width per pass at which the printhead 32 deposits ink I is based on the design and configuration of the printhead 32. Any suitable printhead 32 capable of digitally depositing ink I without the use of a mask is contemplated. In one example, the printhead 32 digitally applies ink I a maximum width of 30 millimeters to 70 millimeters per pass of the robotic applicator 30. Other printheads 32 are contemplated. It is also contemplated that the robotic applicator 30 may have multiple printheads 32 positioned adjacent to one another to increase the width per pass at which the robotic applicator 30 digitally deposits ink I.

[0033] Step S3 of method 100 includes curing the ink I to form performance-enhancing features PEF on the surface of the curved glass substrate 22. In particular, after digital placement and prior to step S3 of curing the ink I, the ink I may be spread or dispersed on the surface of the curved glass substrate 22. For example, the ink I may be digitally placed in step S2 with a resolution of 400 dots / inch. However, prior to the curing step S3, the ink I digitally placed with 400 dots / inch may be spread on the surface of the curved glass substrate 22 such that when the curing step S3 is completed, the performance-enhancing features PEF have a lower resolution, e.g., a resolution of 200 dots / inch, compared to the resolution of the initial digital placement. Additionally, the curing step S3 itself may affect the resolution of the performance-enhancing features PEF. For example, the ink I may expand or contract during the curing step S3, which may affect the resolution of the performance-enhancing features PEF.

[0034] Therefore, the resolution of the ink I when digitally placed in step S2 may be different from the resolution of the performance-enhancing feature PEF after completion of step S3 of curing the digitally placed ink I, and the resolution of the performance-enhancing feature PEF after completion of step S3 of curing the digitally placed ink I may be greater than 200 dots per inch. In particular, it is contemplated that the performance enhancing features PEF may have a resolution of greater than 200 dots / inch, greater than 300 dots / inch, greater than 400 dots / inch, greater than 500 dots / inch, greater than 600 dots / inch, greater than 700 dots / inch, greater than 800 dots / inch, greater than 900 dots / inch, greater than 1000 dots / inch, greater than 1100 dots / inch, greater than 1200 dots / inch, greater than 1300 dots / inch, greater than 1400 dots / inch, greater than 1500 dots / inch, greater than 1600 dots / inch, greater than 1700 dots / inch, greater than 1800 dots / inch, greater than 1900 dots / inch, greater than 2000 dots / inch, greater than 2100 dots / inch, greater than 2200 dots / inch, greater than 2300 dots / inch, greater than 2400 dots / inch, greater than 2500 dots / inch, or greater than 2600 dots / inch.

[0035] As mentioned above, the step of curing the ink I is usually beneficial because the ink I is liquid when digitally placed in step S2. Thus, the step of curing the ink I, S3, may be initiated immediately after the step of digitally placing the ink I, S2, to prevent the ink I from running and smearing. For example, the curing step S3 may be initiated within a time period of zero to five seconds after the step S2 of digitally placing the ink I on the surface of the curved glass substrate 22. More specifically, the curing step S3 may be initiated less than five seconds after step S2, less than four seconds after step S2, less than three seconds after step S2, less than two seconds after step S2, or less than one second after step S2.

[0036] In one example, step S3 of method 100 includes thermally curing (sometimes referred to as "sintering") the ink I to form the performance-enhancing features PEF. Any suitable thermal curing device is contemplated for thermally curing the ink I, including, but not limited to, an oven or a heat gun, or an infrared heater. It should be understood that thermal curing in the context of this disclosure does not mean heating to a level at which the glass assembly 20 is fired. As mentioned above, a typical firing process includes heating the glass substrate to a temperature in excess of 500° C. to fuse a substance such as a ceramic frit to the glass substrate and / or to bend the glass substrate into a desired shape. On the other hand, a thermal curing process in the context of this disclosure includes heating the first curved glass substrate 22 and / or the second curved glass substrate 24 to a sufficient temperature (but less than the firing temperature of 500° C.) to cure the ink I on the surface of the first curved glass substrate 22 and / or the second curved glass substrate 24.

[0037] In some examples, the curing temperature for curing the ink I is selected taking into consideration the thermal degradation temperature of the ink I. Specifically, the curing temperature is selected to be lower than the thermal degradation temperature of the ink I to prevent the ink I from burning off the curved glass substrate 22 and to minimize optical distortion of the glass assembly 20. For example, the ink I may include a thermosetting organic monomer and functional particles (e.g., silver nanoparticles, pigments, etc.) dispersed in the organic monomer. It should be understood that in other examples, the organic monomer may instead be an oligomer or a combination of a monomer and an oligomer. In this example, the ink I may have a thermal degradation temperature of 210° C. Thus, the curing temperature may be selected to be less than 210° C., for example, 200° C. In particular, the curing temperature for curing the ink I is set sufficiently lower than the temperature required to sinter conventional materials. Thus, the glass assembly 20 is not exposed to a temperature at which the glass assembly 20 softens, for example, at which the glass assembly 20 is significantly deformed. Therefore, the step S3 of curing the ink I is unlikely to introduce significant optical distortion into the glass assembly 20.

[0038] In another example, step S3 of the method 100 includes photocuring the ink I using the UV curing device 34. In this example, the ink I is a photocurable ink I. The photocurable ink I may include a photoinitiator, an organic monomer, and functional particles (e.g., silver nanoparticles, pigments, etc.) dispersed in the organic monomer. It should be understood that in other examples, the organic monomer may instead be an oligomer or a combination of a monomer and an oligomer. The photoinitiator may include any suitable compound that initiates polymerization of the organic monomer in response to exposure to UV light. For example, the photoinitiator may be a compound that generates a reactive species (e.g., free radicals, cations, or anions) upon exposure to UV light to initiate polymerization of the organic monomer and / or oligomer. Thus, in this example, in step S3 of curing the ink I to form the performance-enhancing feature PEF, the ink I is exposed to the UV curing device 34, the photoinitiator is activated, polymerization of the organic monomer is initiated, and the ink I is cured. Because, in this example, step S3 of curing the ink I does not involve any external application of heat, this example of step S3 is unlikely to introduce optical distortions into the glass assembly 20.

[0039] In one example, the UV curing device 34 is a UV light emitting diode that emits UV light. For example, the UV curing device 34 may emit UV light having a wavelength between 315 nanometers and 400 nanometers (commonly known as the UV-A spectrum). The UV light emitting diode may emit UV light having a narrower spectrum, such as UV light having a wavelength of substantially 385 nanometers. Any wavelength within the UV spectrum is contemplated.

[0040] FIG. 3A shows an example of step S3. In the example of FIG. 3A, the robot applicator 30 further includes a UV curing device 34. Although not required, the UV curing device 34 may be disposed adjacent to the print head 32, and the UV curing device 34 may follow the same path as the print head 32 when the robot applicator 30 moves the print head 32 along the surface of the curved glass substrate 22. Thus, in this embodiment, the step S3 of curing the ink I to form the performance enhancing feature PEF includes activating the UV curing device 34 of the robot applicator 30 to start photo-curing the digitally placed ink I when the robot applicator 30 moves along the surface of the curved glass substrate 22. In this case, the step S3 of quickly curing the ink I occurs after the step S2 of digitally placing the ink I, so as to prevent the ink I from running and smudging.

[0041] In some examples, step S3 of method 100 may further include exposing glass assembly 20 to elevated humidity and / or pressure during one of the curing processes contemplated above.

[0042] With respect to laminated glass assembly 20, step S3 of method 100 includes curing ink I to form performance-enhancing features PEF on at least one of the P1, P2, P3, and P4 surfaces. It will be appreciated that curing ink I to form performance-enhancing features PEF on at least one of the P1, P2, P3, and P4 surfaces may be performed according to any of the curing processes previously described.

[0043] 4A-4C show schematic cross-sectional views of various examples of glass assemblies 20 formed according to method 100. FIG. 4A shows one glass assembly 20 having a curved glass substrate 22 with a performance-enhancing feature PEF formed on a P1 surface of the curved glass substrate 22. FIG. 4B shows another glass assembly 20 having a curved glass substrate 22 with a performance-enhancing feature PEF formed on a P2 surface of the curved glass substrate 22. FIG. 4C shows yet another glass assembly 20 having a curved glass substrate 22 with one performance-enhancing feature PEF formed on a P1 surface of the curved glass substrate 22 and another performance-enhancing feature PEF formed on a P2 surface of the curved glass substrate 22.

[0044] 5, if the glass assembly 20 is a laminated glass assembly 20, the method 100 further comprises a step S4 of disposing a polymer interlayer 28 between the P2 surface of the first curved glass substrate 22 and the P3 surface of the second curved glass substrate 24. The polymer interlayer 28 bonds the first curved glass substrate 22 and the second curved glass substrate 24, and in the event of a collision or breakage of the laminated glass assembly 20, the polymer interlayer 28 retains the first curved glass substrate 22 and / or the second curved glass substrate 24. The polymer interlayer 28 comprises a polymer or thermoplastic resin, such as, for example, polyvinyl butyral (PVB), ethylene-vinyl acetate (EVA), thermoplastic polyurethane (TPU). Other suitable materials for implementing the polymer interlayer 28 may be utilized to provide the required performance characteristics with respect to optical haze, adhesion to glass, and structural rigidity. Like the first curved glass substrate 22 and the second curved glass substrate 24, the polymer interlayer 28 is also substantially transparent or transmissive to light. Thus, the laminated glass assembly 20 having the polymer interlayer 28 between the first curved glass substrate 22 and the second curved glass substrate 24 is also substantially transparent or transmissive to light.

[0045] An example of a lamination process includes laminating and arranging the first curved glass substrate 22, the second curved glass substrate 24, the polymer interlayer 28, and any other interlayers that may be part of the laminated glass assembly 20. After laminating and arranging these members, the glass assembly 20 is subjected to an air removal process and evacuated to remove any air trapped between the first curved glass substrate 22, the second curved glass substrate 24, the polymer interlayer 28, and any other interlayers. After the de-airing process, the glass assembly 20 is subjected to an autoclave process, in which the glass assembly 20 is subjected to high temperature and / or pressure, and the polymer interlayer 28 is bonded to each layer adjacent to the polymer interlayer 28 to form the laminated glass assembly 20. In particular, the temperature in the autoclave needs to be lower than the thermal degradation temperature of Ink I to prevent damage to Ink I.

[0046] In the example shown in Figure 6A, the laminated glass assembly 20 has a first curved glass substrate 22, a performance-enhancing feature PEF formed on the P1 surface of the first curved glass substrate 22, a second curved glass substrate 24, and a polymer interlayer 28 disposed between the P2 and P3 surfaces. In the example shown in Figure 6B, the laminated glass assembly 20 has a first curved glass substrate 22, a performance-enhancing feature PEF formed on the P2 surface of the first curved glass substrate 22, a second curved glass substrate 24, and a polymer interlayer 28 disposed between the P2 and P3 surfaces. In the example shown in Figure 6C, the laminated glass assembly 20 has a first curved glass substrate 22, a second curved glass substrate 24, a performance-enhancing feature PEF formed on the P3 surface of the second curved glass substrate 24, and a polymer interlayer 28 disposed between the P2 and P3 surfaces. In the example shown in Figure 6D, the laminated glass assembly 20 includes a first curved glass substrate 22, a second curved glass substrate 24, a performance-enhancing feature PEF formed on the P4 surface of the second curved glass substrate 24, and a polymer interlayer 28 disposed between the P2 and P3 surfaces. Figures 6A-6D show performance-enhancing features PEF formed on each of the P1, P2, P3, and P4 surfaces, however, it is contemplated that multiple performance-enhancing features PEF may be formed on any combination of the P1, P2, P3, and P4 surfaces.

[0047] In some examples, the ink I may be an organic ink OI. In some examples, the organic ink OI is a photo-curable organic ink OI. Similar to the photo-curable ink I described above, the photo-curable organic ink OI may include a photoinitiator, an organic monomer, and a pigment. In another example, the organic ink OI may include a thermally curable organic monomer and a pigment. In these examples, step S2 of the method 100 includes digitally depositing the organic ink OI on at least one surface of the first curved glass substrate 22 and the second curved glass substrate 24 without the use of a mask. The organic ink OI may be digitally deposited according to the digital deposition process described above. Also, in these examples, step S3 of the method 100 includes curing the organic ink OI to form performance-enhancing features PEF on at least one surface of the first curved glass substrate 22 and the second curved glass substrate 24. The organic ink OI may be cured according to the curing process described above.

[0048] In an example where the ink I is an organic ink OI, the performance-enhancing feature PEF may be formed as an opaque boundary feature OBF. Referring now to Figures 7-11B, various examples of laminated glass assemblies 20 having opaque boundary features OBF are shown. For example, Figure 7 shows a vehicle 18 having a windshield assembly 20 having an opaque boundary feature OBF formed according to the method 100. Figures 8A-8C show schematic cross-sectional views of laminated glass assemblies 20 having opaque boundary features OBF. In the example shown in Figure 8A, the glass assembly 20 has a first curved glass substrate 22, an opaque boundary feature OBF formed on a P2 surface of the first curved glass substrate 22, a second curved glass substrate 24, and a polymer interlayer 28 disposed between the P2 surface and the P3 surface. In the example shown in Figure 8B, the glass assembly 20 has a first curved glass substrate 22, a second curved glass substrate 24, an opaque boundary feature OBF formed on the P3 surface of the second curved glass substrate 24, and a polymer interlayer 28 disposed between the P2 and P3 surfaces. In the example shown in Figure 8C, the glass assembly 20 has a first curved glass substrate 22, an opaque boundary feature OBF formed on the P2 surface of the first curved glass substrate 22, a second curved glass substrate 24, another opaque boundary feature OBF formed on the P3 surface of the second curved glass substrate 24, and a polymer interlayer 28 disposed between the P2 and P3 surfaces. Although Figures 8A-8C show the opaque boundary feature OBF formed on at least one of the P2 surface of the first curved glass substrate 22 and the P3 surface of the second curved glass substrate 24, it is understood that the opaque boundary feature OBF may be formed on one or more of the P1, P2, P3, or P4 surfaces of the laminated glass assembly 20, or on at least one of the P1 and P2 surfaces of a glass assembly 20 that includes only the first curved glass substrate 22.

[0049] 9A and 9B each show a front view of a glass assembly 20 formed according to method 100. In these examples, the opaque boundary feature OBF is formed as a band 36 that extends around the entire perimeter 38 of the glass assembly 20. In FIGS. 9A and 9B, the glass assembly 20 is a windshield. However, it is contemplated that the opaque boundary feature OBF formed as a band 36 that extends around the entire perimeter 38 of the glass assembly 20 may be formed in other examples of the glass assembly 20, such as a side window, a quarter window, a rear window, etc. The band 36 that surrounds the entire perimeter 38 of the glass assembly 20 serves a number of functions. The band 36 blocks the transmission of light through the region of the glass assembly 20 that extends around the entire perimeter 38. In this way, the band 36 prevents UV light from degrading the underlying adhesive that bonds the glass assembly 20 to the vehicle. As another example, band 36 may extend further down from the top 39 of glass assembly 20 to act as a sunshade to protect the driver's eyes from the sun. Band 36 may also block the visibility of the underlying adhesive to an outside observer, improving aesthetics. As another example, band 36 may define an aesthetically pleasing decorative pattern, such as a dot pattern, a manufacturing logo, or government required information (such as information required by FMVSS 205).

[0050] 9A, in one example, the opaque boundary feature OBF has a uniform opacity throughout the opaque boundary feature OBF. In this context, opacity refers to the average transmittance of visible light through a sample area of ​​the opaque boundary feature OBF. The opacity of the opaque boundary feature OBF may be measured using a light transmittance meter (e.g., according to ISO 9050 and / or ISO 13837) that determines the amount of light absorbed, scattered, or reflected by the opaque boundary feature OBF. In one example, the opaque boundary feature OBF may have an opacity of less than 1% transmittance of visible light, or less than 0.1% transmittance of visible light.

[0051] Referring to FIG. 9B , in another example, the opaque boundary feature OBF has a first end 40 and a second end 42 opposite the first end 40. The first end 40 may be the peripheral end 38 of the glass assembly 20, and the opaque boundary feature OBF may extend inwardly from the first end 40 and terminate at the second end 42. In the example of FIG. 9B , the opaque boundary feature does not have a uniform opacity throughout the opaque boundary feature OBF. Rather, the opaque boundary feature OBF has a first opacity at the first end 40 and a second opacity at the second end 42. In the example of FIG. 9B , the second opacity is less than the first opacity.

[0052] In particular, because the organic ink OI is digitally applied, the organic ink OI may form more detailed features than traditional analog printing, which may affect the opacity of the opaque boundary feature OBF. For example, the organic ink OI may be applied with near full coverage at the first end 40 such that the first opacity of the opaque boundary feature OBF has a visible light transmission of less than 1%, and the organic ink OI may be applied with less than full coverage at the second end 42 such that the second opacity has a visible light transmission of more than 1%. Thus, in some configurations, the first opacity may have a visible light transmission of less than 1%, or may have a visible light transmission of less than 0.1%, and the second opacity of the opaque boundary feature OBF may have a visible light transmission of more than 99%, or may have a visible light transmission of more than 99.9%. It is contemplated that the first opacity and the second opacity may be selected from any value between 0.1% visible light transmission and 99.9% visible light transmission, independently of one another. Additionally, any suitable transition between the first and second opacity is contemplated, including, but not limited to, a smooth transition between the first and second opacity (e.g., forming a gradient pattern) or a gradual transition between the first and second opacity.

[0053] As previously mentioned, the band formed around the peripheral edge of the glass assembly is typically black. However, it is contemplated in the present disclosure that the pigment of the organic ink OI may be any color, allowing greater design flexibility in designing the glass assembly 20 having the opaque boundary feature OBF. While the band 36 shown in Figures 9A-10C is black, it is contemplated that the opaque boundary feature OBF may be formed having any color, such as black, shades of gray, white, any primary color, or combinations thereof.

[0054] 9A-11B, in some examples, the opaque boundary feature OBF has an optical sensor boundary 44 disposed adjacent to the peripheral edge 38 of the glass assembly 20. In particular, the optical sensor boundary 44 may be disposed at or near the peripheral edge 38 of the glass assembly 20. Any suitable placement of the optical sensor boundary 44 that does not obscure the view of the driver of the vehicle 18 is contemplated. The optical sensor boundary 44 defines a detection window 46, which may be aligned with a field of view FOV of an optical sensor 48 mounted to the glass assembly 20. It is understood that the optical sensor may be mounted to the glass assembly 20 in any suitable manner. For example, FIGS. 10A-10C show schematic cross-sectional views of an example of an optical sensor 48 mounted to the P4 surface of the glass assembly 20. Referring to FIG. 10A, in some examples, the optical sensor boundary 44 may be formed only on the P2 surface of the glass assembly 20. 10B, in some examples, the optical sensor boundary 44 is formed only on the P3 surface of the glass assembly 20. Referring to FIG. 10C, in some examples, the optical sensor boundary 44 is formed on both the P2 and P3 surfaces of the glass assembly 20. Although FIGS. 10A-10C show the optical sensor boundary 44 formed on at least one of the P2 surface of the first curved glass substrate 22 and the P3 surface of the second curved glass substrate 24, it will be understood that the optical sensor boundary 44 may be formed on one or more of the P1, P2, P3, or P4 surfaces of the laminated glass assembly 20, or on at least one of the P1 and P2 surfaces of a glass assembly 20 having only the first curved glass substrate 22.

[0055] As previously mentioned, opaque boundary features formed using conventional materials such as ceramic frits tend to exhibit significant optical distortion, which is particularly detrimental to the performance characteristics of the optical sensor if the distortion is within the field of view of the optical sensor. In the context of the present disclosure, the glass assembly 20 having the opaque boundary feature OBF formed by the method 100 does not include a ceramic frit and is therefore not subjected to a post-printing firing, which substantially reduces the optical distortion of the glass assembly 20. Thus, the optical distortion of the glass assembly 20 is sufficiently low to meet the specifications required for optimal performance of an optical sensor 48, such as a camera or LIDAR sensor, as well as an optical projection device, such as a head-up display. For example, the glass assembly 20 formed according to the method 100 may exhibit an optical distortion of less than 100 millidiopters within the sensing window 46.

[0056] However, in other examples, the opaque boundary feature OBF may be formed in part of an enamel with a fired ceramic frit. Referring to FIG. 11C, the glass assembly 20 includes a first portion OBF′ of the opaque boundary feature OBF, which may be formed by depositing and then firing an enamel with a ceramic frit on at least one surface of the first curved glass substrate 22 and / or the second curved glass substrate 24. The glass assembly 20 may further include a second portion OBF″ formed by digitally depositing and curing an organic ink OI. In the illustrated example, the first portion OBF′ defines a band 36 surrounding the entire peripheral edge 38 of the glass assembly 20, and the second portion OBF″ defines an optical sensor boundary 44 disposed adjacent the peripheral edge 38 of the glass assembly 20, in which a sensing window 46 is defined. Beneficially, because optical sensor boundary 44 is formed according to method 100, optical distortion of glass assembly 20 within sensing window 46 is low enough to meet the specifications required for optimal performance of optical sensor 48. More specifically, in this embodiment, sensing window 46 is spaced from first portion OBF' so that optical distortion caused by firing glass assembly 20 to form first portion OBF' does not affect the portion of glass assembly 20 aligned with sensing window 46. Thus, glass assembly 20 in this embodiment may exhibit optical distortion within sensing window 46 of less than 100 millidiopters. By forming a first portion OBF' from enamel with ceramic frit in portions of the glass assembly 20 where optical distortion is not critical, and forming a second portion OBF" from organic ink OI in portions of the glass assembly 20 where optical distortion is critical, the process time for forming the glass assembly 20 can be reduced compared to forming the entire opaque boundary feature OBF according to method 100. The first portion OBF' and second portion OBF" may be any individual portions of the opaque boundary feature OBF.

[0057] 11A and 11B each show a front view of an example of a glass assembly 20 formed according to method 100. In these examples, the opaque boundary feature OBF of the glass assembly 20 includes a band 36 that extends entirely around a peripheral edge 38 of the glass assembly 20 and a light sensor boundary 44 that extends downwardly from an upper inner edge 50 of the band 36 to enclose a field of view FOV of the light sensor 48 and define a sensing window 46. However, it is contemplated that the band 36 and the light sensor boundary 44 may not be adjacent to one another in all configurations. For example, the light sensor boundary 44 may be spaced apart from the band 36. In other configurations, the glass assembly 20 may only include an opaque boundary feature OBF that defines the band 36. In yet other configurations, the glass assembly 20 may only include an opaque boundary feature OBF that defines the light sensor boundary 44.

[0058] 10A-10C and the example shown in FIG. 11A, the optical sensor boundary 44 defines a detection window 46 that does not include organic ink OI and is therefore transparent to visible light. In particular, if the optical sensor 48 is a camera, it is important that the detection window 46 is transparent to visible light, so that the camera can "see" through the detection window 46. However, if the optical sensor 48 is a LIDAR sensor, the detection window 46 is transparent to infrared light. Thus, in some configurations, the organic ink OI may be selected to be transparent to infrared light but opaque to visible light. Thus, with reference to FIG. 11B, in some configurations, the optical sensor boundary 44 may include a detection window 46 in which the organic ink OI is deposited such that the detection window 46 is opaque to visible light. However, in this example, the organic ink OI is transparent to infrared light, so that the LIDAR sensor can still "see" through the detection window 46.

[0059] Also, in some configurations, the method 100 further comprises digitally placing the ink I to form an information-bearing graphic 52 on at least one of the P1, P2, P3, and P4 surfaces of the glass assembly 20. Several example arrangements of the information-bearing graphic 52 are shown generally in FIGS. 12A and 12B. For example, FIG. 12A shows possible arrangements of the information-bearing graphic 52 on the glass assembly 20. The information-bearing graphic 52 is spaced from the opaque boundary feature OBF. Each possible arrangement of the information-bearing graphic 52 is represented by a faint line. On the other hand, FIG. 12B shows possible arrangements of the information-bearing graphic 52, but the information-bearing graphic 52 is aligned with the opaque boundary feature OBF. Each possible arrangement of the information-bearing graphic 52 is represented by a faint line. It is contemplated that the information-bearing graphic 52 may be placed in any suitable location or surface of the glass assembly 20 to convey the desired information. It is also contemplated that the ink I for the information-containing graphic 52 may be the same as or different from the organic ink OI.

[0060] 13A-13C show non-limiting examples of information-containing graphic 52. For example, FIG. 13A shows information-containing graphic 52 as a barcode 54. It is contemplated that barcode 54 may be a traditional barcode or a QR code. In another example, FIG. 13B shows information-containing graphic 52 as a serial number 56. It is contemplated that serial number 56 may be a serial number associated with a batch of glass assemblies, or an individual serial number, or a serial number associated with a vehicle VIN number. FIG. 13C shows information-containing graphic 52 as a graphic 58. It is contemplated that graphic 58 may be formed as any desired design for decorative or informational purposes. In particular, FIGS. 13A and 13B show an example of information-containing graphic 52 spaced apart from an opaque boundary feature, while FIG. 13C shows an example of information-containing graphic 52 aligned with an opaque boundary feature OBF.

[0061] In another example, the ink I may be a conductive ink CI. In one example, the conductive ink CI is a photocurable conductive ink CI. Similar to the photocurable ink I described above, the photocurable conductive ink CI may include a photoinitiator, an organic monomer, and conductive particles (e.g., silver nanoparticles, etc.) dispersed in the organic monomer. In another example, the conductive ink CI may include a thermally curable organic monomer, and conductive particles (e.g., silver nanoparticles, etc.) dispersed in the organic monomer. In yet another example, the conductive ink CI has a metal-organic complex that is thermally cured to form the conductive feature CF. The metal-organic complex may include a silver-organic compound, or any other suitable metal-organic complex, the latter having an organic component and a conductive metal component, such as a copper-organic compound. In this example, after the conductive ink CI having the metal-organic complex is digitally deposited on the surface of the curved glass substrate 22 in step S2, step S3 includes exposing the conductive ink CI to a temperature sufficient to volatilize the organic component of the metal-organic complex, such that only the metal particles (e.g., silver particles) remain on the surface of the curved glass substrate 22 to form the conductive feature CF. Notably, the temperature sufficient to volatilize the organic component of the metal-organic complex is significantly lower than conventional temperatures used to form performance-enhancing features.

[0062] In these examples, step S2 of method 100 includes digitally depositing conductive ink CI on at least one surface of first curved glass substrate 22 and second curved glass substrate 24 without the use of a mask. The conductive ink CI may be digitally deposited according to a digital deposition process described above. Also in these examples, step S3 of method 100 includes curing the conductive ink CI to form performance-enhancing features PEF on at least one surface of first curved glass substrate 22 and second curved glass substrate 24. The conductive ink CI may be cured according to a curing process described above.

[0063] In an example where the ink I is a conductive ink CI, the performance-enhancing feature PEF may be formed as a conductive feature CF having at least one conductive trace 27. Significantly, by digitally depositing the conductive ink CI, the at least one trace 27 of the conductive feature CF can have a width W that is sufficiently shorter than that of a conventional analog printing process. For example, based on a conventional screen printing process of 100 dots / inch, the minimum width of a trace that can theoretically be printed in an analog printing process is about 254 micrometers. On the other hand, when the conductive ink CI is digitally deposited with a resolution of, for example, 400 dots / inch, the at least one trace 27 of the conductive feature CF can be printed with a width W as short as 64 micrometers. As another example, when the conductive ink CI is digitally deposited with a resolution of 2500 dots / inch, the at least one trace 27 can be printed with a width W as short as 10 micrometers.

[0064] 14-21B, various examples of glass assemblies 20 are shown having conductive features CF with at least one conductive trace 27. For example, Figures 14 and 18 show a vehicle 18 having a rear glass assembly 20 having a conductive feature CF with at least one conductive trace 27 formed according to method 100. Figures 16 and 20 show a vehicle 18 having a front glass assembly 20 having a conductive feature CF with at least one conductive trace 27 formed according to method 100.

[0065] 14-17B, in some examples, the conductive feature CF having at least one conductive trace 27 defines a heating element 60 configured to provide heat (i.e., defrost and / or defrost) to at least a portion of the glass assembly 20. The heating element 60 may be formed according to the method 100 to have any suitable geometric shape that forms a circuit configured to provide heat (i.e., defrost and / or defrost) to at least a portion of the glass assembly 20. Suitable geometric shapes of the heating element 60 include, but are not limited to, a serpentine shape, a grid shape, a fan shape, and a spiral shape. The at least one conductive trace 27 has a line width W (shown in FIG. 15A). Any suitable line width W forming the heating element 60 is contemplated. It is understood that the line width W of the at least one conductive trace 27 and the conductive particle loading of the conductive ink CI may be adjusted to achieve a desired resistivity for the heating element 60. For example, the heating element 60 may have a resistivity of less than 10 μΩ·cm. Preferably, the heating element 60 may have a resistivity of less than 5 μΩ·cm.

[0066] FIG. 14 illustrates an example of a vehicle 18 having a rear glass assembly 20. The rear glass assembly 20 has a conductive feature CF having at least one conductive trace 27 that defines a heating element 60 having a serpentine shape. In this example, the heating element 60 of FIG. 14 is defined by the conductive trace 27. The conductive trace 27 turns back and forth across the surface of the curved glass substrate 22 to form a circuit configured to provide heat (i.e., defrost and / or defrost) to at least a portion of the glass assembly 20. FIGS. 15A-15B illustrate various examples of schematic cross-sectional views of the glass assembly 20 of FIG. 14. More specifically, FIG. 15A illustrates a conductive feature CF having a conductive trace 27 formed on the P1 surface of the curved glass substrate 22. FIG. 15B illustrates a conductive feature CF having a conductive trace 27 formed on the P2 surface of the curved glass substrate 22. It should also be understood that in some instances, a conductive feature CF having at least one conductive trace 27 may be formed on both the P1 and P2 surfaces of the curved glass substrate 22.

[0067] FIG. 16 illustrates another example of a vehicle 18 having a windshield assembly 20. The windshield assembly 20 has a conductive feature CF including at least one conductive trace 27 that defines a heating element 60 having a grid shape. In this example, the heating element 60 is defined by a plurality of conductive traces 27 that cross to form a circuit configured to provide heat (i.e., defrost and / or frost) to at least a portion of the glass assembly 20. FIGS. 17A and 17B illustrate various examples of schematic cross-sectional views of the glass assembly 20 of FIG. 16. In particular, in this example, the windshield assembly 20 is a laminated glass assembly 20. Thus, the glass assembly 20 has a first curved glass substrate 22, a second curved glass substrate 24, and a polymer interlayer 28.

[0068] As mentioned above, in some examples, it is advantageous to form the performance-enhancing features PEF on at least one of the P2 and P3 surfaces to protect the performance-enhancing features PEF from the ambient environment. Thus, in the example of FIG. 17A, the conductive features CF are formed on the P2 surface of the first curved glass substrate 22. In the example of FIG. 17B, the conductive features CF are formed on the P3 surface of the second curved glass substrate 24. Although FIGS. 17A and 17B show the conductive features CF formed on the P2 and P3 surfaces, it should be understood that the conductive features CF may also be formed on the P1 and / or P4 surfaces of the glass assembly 20.

[0069] With continued reference to FIGS. 16-17B, in some examples, the glass assembly 20 may include: Additionally, the glass assembly 20 may have an optical sensor 48 attached thereto. As previously mentioned, the optical sensor 48 has a field of view FOV (i.e., a limited angular range that the optical sensor 48 can "see" when stationary). In particular, frost and other condensation may obscure the field of view FOV, thereby impeding the performance of the optical sensor 48. Thus, in some examples, the glass assembly 20 has another conductive feature CF having at least one conductive trace 27, which defines another heating element 60 aligned with the field of view FOV of the optical sensor 48, to heat (i.e., defrost and / or heat) at least a portion of the glass assembly 20 corresponding to the field of view FOV of the optical sensor 48. As previously mentioned, conductive features formed using conventional conductive materials tend to exhibit significant optical distortion of the glass assembly, and if the distortion is within the field of view FOV of the optical sensor, the performance of the optical sensor is significantly adversely affected. However, in the present disclosure, the conductive features CF (e.g., heating elements 60) are not subjected to firing after printing, which substantially reduces the optical distortion of the glass assembly 20. Significantly, therefore, the optical distortion obtained by the glass assembly 20 formed according to the method 100 is sufficiently low to meet the requirements for optimal performance of the optical sensor 48, such as a camera or LIDAR sensor, as well as optical projection devices, such as head-up displays. For example, the glass assembly 20 formed according to the method 100 may exhibit optical distortion of less than 100 millidiopters within the field of view FOV of the optical sensor.

[0070] In the context of a heating element 60 aligned with the field of view FOV of an optical sensor 48, it is desirable that the at least one conductive trace 27 defining the heating element 60 does not visually block the optical sensor 48 to such an extent that the characteristics of the optical sensor 48 are affected. In particular, when the heating element 60 is aligned with the field of view FOV of the optical sensor 48, it is advantageous to form the trace 27 of the conductive feature CF to have a line width W small enough that the trace 27 does not create a "blind spot" in the field of view of the optical sensor 48, and to minimize the diffraction of light incident on the optical sensor 48 caused by the trace 27. As mentioned above, the high resolution of the digital placement process of step S2 allows the at least one conductive trace 27 of the conductive feature CF to be formed with a line width W that is sufficiently smaller than that possible in a conventional analog printing process. Thus, in one embodiment, when the optical sensor 48 is a camera, the at least one conductive trace 27 of the conductive feature CF may be formed to have a line width W of less than 100 micrometers. In another example, if the optical sensor is a LIDAR sensor, at least one conductive trace 27 of the conductive feature CF may be formed to have a smaller line width W of less than 65 micrometers.

[0071] 16, another example of a conductive feature CF having at least one trace 27 formed according to method 100 is a bus bar 61. The bus bar 61 may be configured to transfer energy to another conductive feature CF (such as a heating element 60) of the glass assembly 20. For example, the glass assembly 20 may be formed according to method 100 to have a heating element 60. To provide power to the heating element 60, a bus bar 61 is formed according to method 100 and electrically connected to the heating element 60 to provide power to the heating element 60. Any suitable geometry (e.g., line width W) and arrangement of the bus bar 61 relative to the other conductive features CF are contemplated. A bus bar 61 that provides power beyond the heating element 60 to other conductive features CF is also contemplated.

[0072] 18-21B, in another example, the conductive feature CF having at least one conductive trace 27 defines an antenna 62 configured to transmit and / or receive wireless signals. In some examples, the antenna 62 may be configured to transmit and / or receive wireless signals having frequencies from 540 kilohertz to 6 gigahertz. Thus, the antenna 62 may be configured to transmit and / or receive wireless signals within any number of standard frequencies, including, but not limited to, amplitude modulation (AM), frequency modulation (FM), digital audio broadcast (DAB), remote keyless entry (RKE), digital television (DTV), global positioning system (GPS), 2G cellular, 3G cellular, 4G cellular, and some 5G cellular frequencies (more specifically, low-band and mid-band 5G cellular frequencies below 6 gigahertz).

[0073] The antenna 62 may be formed according to the method 100 to have any suitable structure for transmitting and / or receiving radio signals having frequencies between 540 kilohertz and 6 gigahertz. Examples of suitable antenna structures for the antenna 62 include various configurations of planar antennas, such as, but not limited to, planar monopole antennas, planar dipole antennas, patch antennas, slot antennas, Vivaldi antennas, planar conical antennas, planar spherical antennas, planar horn antennas, and the like. It should be understood that at least one conductive trace 27 of the conductive feature may define a portion or the entirety of the antenna 62. For example, the at least one conductive trace 27 may define one or more of the feed trace FL, the radiating element RE, and the ground plane GP. In examples where a portion of the antenna 62 has a nonlinear structure (e.g., a patch antenna), multiple conductive traces 27 may be digitally placed and cured adjacent to one another to define a portion of the antenna 62 having a nonlinear structure.

[0074] Forming the antenna 62 according to method 100 is advantageous in various aspects. In one aspect, as previously described, the high resolution of the digital placement process of step S2 allows the conductive ink CI to be deposited with tolerances significantly tighter than conventional analog printing processes. For example, using conventional analog printing processes such as screen printing, the conductive features may only be repeatably placed within a tolerance of + / - 1.5 millimeters. However, with the precise control of the digital placement process of step S2, the conductive feature CF having at least one conductive trace 27 that defines the antenna 62 may be repeatably placed within a tolerance of less than + / - 0.1 millimeters.

[0075] In another aspect, as mentioned above, the high resolution of the digital placement process of step S2 may deposit the conductive ink CI to form finer features than conventional analog printing processes. For example, using a conventional analog screen printing process such as screen printing, a conductive feature may only be deposited with a width W of 113 micrometers. However, due to the increased precision and fineness of the digital placement process of step S2, the antenna 62 formed according to the present method 100 may have finer features than an antenna formed using a conventional analog printing process. For example, the conductive feature CF having at least one conductive trace 27 defining the antenna 62 may be formed to have a width W of less than 100 micrometers, or reduced to 10 micrometers. Also, due to the finer features, the antenna 62 of the present disclosure may transmit and / or receive radio signals at higher frequencies and / or higher bandwidths than an antenna formed using a conventional analog printing process. As an example, the antenna 62 of the present disclosure may have a small "tuning stub" feature extending from the antenna 62 to improve the bandwidth of the antenna 62.

[0076] FIG. 18 illustrates an example of a vehicle 18 having a rear glass assembly 20 with conductive features CF formed according to method 100. The conductive features CF have at least one conductive trace 27 that defines an antenna 62 configured to transmit and / or receive wireless signals. In this example, the antenna 62 has a feed line FL coupled to a radiating element RE and a ground plane GP disposed adjacent the feed line FL and the radiating element RE. One potential structure for the antenna 62 is illustrated in FIG. 18, but it should be understood that any suitable antenna structure is contemplated. FIGS. 19A-19C illustrate various examples of schematic cross-sectional views of the glass assembly 20 of FIG. 18. In the example of FIG. 19A, the antenna 62 is formed on the P1 surface of the curved glass substrate 22, with the feed line FL, the radiating element RE, and the ground plane GP all disposed on the P1 surface. In the example of Figure 19B, the antenna 62 is formed on the P2 surface of the curved glass substrate 22, with the feed line FL, radiating element RE, and ground plane GP all disposed on the P2 surface. In other examples, the antenna 62 may be formed as a multi-plane antenna. For example, referring to Figure 19C, the glass assembly 20 may include a first portion 64 of the antenna 62 (in this example, the feed line FL and radiating element RE) on the P1 surface of the curved glass substrate 22, and a second portion 66 of the antenna (in this example, the ground plane GP) on the P2 surface of the curved glass substrate 22. Any suitable multi-plane antenna configuration is contemplated.

[0077] When the glass assembly 20 is formed as a laminated glass assembly 20, the conductive feature CF having at least one conductive trace 27 defining the antenna 62 may include a first antenna portion 64 formed on one of the P1, P2, P3, and P4 surfaces and a second antenna portion 66 formed on another of the P1, P2, P3, and P4 surfaces. Beneficially, the tighter tolerances provided by digitally placing the conductive ink CI according to step S2 of method 100 can improve the alignment of the first antenna portion 66 and the second antenna portion 66, which improves electrical communication between the first antenna portion 64 and the second antenna portion 66, and therefore improves performance of the antenna 62.

[0078] Also as mentioned above, with respect to the laminated glass assembly 20, it is advantageous to digitally place the conductive ink CI on at least one of the P2 surface of the first curved glass substrate 22 and the P3 surface of the second curved glass substrate 24 such that upon lamination of the glass assembly 20, the conductive feature CF is sandwiched within the glass assembly 20. Thus, in some examples, the first antenna portion 64 is formed on one of the P2 and P3 surfaces, and the second antenna portion 66 is formed on one of the P1, P2, P3, and P4 surfaces, with at least one of the first antenna portion 64 and the second antenna portion 66 being sandwiched within the glass assembly 20. In some examples, the second antenna portion 66 is formed on a different surface than the first antenna portion 64. However, in other embodiments, it is contemplated that the second antenna portion 66 is formed on the same surface as the first antenna portion 64. 19C and 21A-21B show an example of a second antenna portion 66 formed on a different surface than the first antenna portion 64. In FIG.

[0079] FIG. 20 illustrates a vehicle 18 having a windshield assembly 20 with conductive features CF formed according to method 100. The conductive features CF have at least one conductive trace 27 that defines an antenna 62 configured to transmit and / or receive wireless signals. Similar to the example of FIG. 18, the antenna 62 of FIG. 20 has a feed line FL coupled to a radiating element RE and a ground plane GP disposed adjacent to the feed line FL and the radiating element RE. FIGS. 21A-21B illustrate various examples of schematic cross-sectional views of the glass assembly 20 of FIG. 20. In the example of FIG. 21A, the glass assembly 20 has a first portion 64 of the antenna 62 (in this example, the feed line FL and the radiating element RE) on the P3 surface of the second curved glass substrate 24 and a second portion 66 of the antenna 62 (in this example, the ground plane GP) on the P4 surface of the second curved glass substrate 24. In the example of Figure 21B, the glass assembly 20 has a first portion 64 of the antenna 62 (in this example, the feed line FL and the radiating element RE) on the P2 surface of the first curved glass substrate 22, and a second portion 66 of the antenna 62 (in this example, the ground plane GP) on one of the P3 and P4 surfaces of the second curved glass substrate 24 (these alternative configurations of the second antenna portion 66 are shown in dashed schematic lines). Although Figures 21A and 21B show an example arrangement in which the ground plane GP is located closer to the interior of the vehicle 18, it should be understood that the first antenna portion 64 and the second antenna portion 66 may be independently formed on any of the P1, P2, P3, and P4 surfaces to form a suitable antenna 62.

[0080] In the example where the ink I is a functional ink FI, the performance-enhancing feature PEF may be formed as a functional coating FC. The functional ink FI may have an anti-reflective coating, an IR-transmitting coating, a water-repellent coating, an oleophobic coating, or an oleophilic coating. The functional coating FC may be formed on at least a portion of the surface of the glass assembly (to align with the detection window 46) or on the entire surface of the glass assembly 20. FIG. 24 illustrates a glass assembly 20 having a functional coating FC formed according to the method 100. In the example of FIG. 24, the functional coating FC is formed on the entire surface of the glass assembly 20. It is contemplated that the functional coating FC may be formed on at least one of the P1 surface, the P2 surface, and, in the case of a laminated glass assembly 20, on at least one of the P3 surface and the P4 surface. FIGS. 24-25B illustrate cross-sectional views of various examples of the glass assembly 20 including the functional coating FC.

[0081] In the example shown in Figure 25A, the glass assembly 20 has a first curved glass substrate 22, a functional coating FC formed on the P1 surface of the first curved glass substrate 22, a second curved glass substrate 24, and a polymer interlayer 28 disposed between the P2 and P3 surfaces. In the example shown in Figure 25B, the glass assembly 20 has a first curved glass substrate 22, a functional coating FC formed on the P2 surface of the first curved glass substrate 22, a second curved glass substrate 24, and a polymer interlayer 28 disposed between the P2 and P3 surfaces. In the example shown in Figure 25C, the glass assembly 20 has a first curved glass substrate 22, a second curved glass substrate 24, a functional coating FC formed on the P3 surface of the second curved glass substrate 24, and a polymer interlayer 28 disposed between the P2 and P3 surfaces. In the example shown in Figure 25D, the glass assembly 20 has a first curved glass substrate 22, a second curved glass substrate 24, a functional coating FC formed on the P4 surface of the second curved glass substrate 24, and a polymer interlayer 28 disposed between the P2 and P3 surfaces. Although Figures 25A-25D show the functional coatings FC formed individually on the P1, P2, P3, and P4 surfaces of the laminated glass assembly 20, it is contemplated that multiple functional coatings FC may be formed on any combination of the P1, P2, P3, and P4 surfaces of the laminated glass assembly 20, or on at least one of the P1 and P2 surfaces of a glass assembly 20 having only the first curved glass substrate 22.

[0082] In the foregoing description, several embodiments have been described. However, the embodiments described herein are not intended to be exhaustive or to limit the invention to any particular form. The terminology used is intended to be descriptive in nature rather than limiting. Many modifications and variations are possible in light of the above teachings, and the invention may be practiced otherwise than as specifically described.

[0083] Various additional modifications and variations may be made to the foregoing embodiments other than those already described herein. This disclosure has been presented for purposes of illustration and should not be construed as an exhaustive description of all embodiments or to limit the scope of the claims to the specific elements shown or described with respect to these embodiments. For example, but not limited to, any individual element of the described embodiments may be replaced with another element that provides substantially similar functionality or provides the preferred operation. This includes currently known alternative elements, such as those currently known to those of skill in the art, and alternative elements developed in the future that those of skill in the art will recognize as alternatives during development. For example, reference to a claim element in the singular form using the articles "a," "an," "the," or "said" should not be construed as limiting the element to the singular form. Additionally, it is understood that "include," "includes," and "including" have the same meaning as the terms "comprise," "comprises," and "comprising." [Explanation of symbols]

[0084] 20 Glass Assembly 22 First curved glass substrate 24 Second curved glass substrate 28 Middle Class PEF performance improvement features

Claims

1. 1. A method of manufacturing a glazing assembly having performance enhancing features (PEFs), comprising: forming a curved first glass substrate, the first glass substrate having an outer (P1) surface and an opposing inner (P2) surface; forming a curved second glass substrate, the second glass substrate having an inner (P3) surface and an opposing outer (P4) surface; digitally depositing a ceramic frit-free ink onto at least one of the P1 surface, the P2 surface, the P3 surface, and the P4 surface without the use of a mask; curing the ink to form a PEF on at least one of the P1 surface, the P2 surface, the P3 surface, and the P4 surface; disposing a polymer interlayer between the P2 surface of the first glass substrate and the P3 surface of the second glass substrate; The method comprising:

2. the ink has a thermal degradation temperature; The method of claim 1 , wherein curing the ink to form the PEF occurs below the thermal degradation temperature of the ink.

3. The method of claim 1 , wherein curing the ink to form the PEF comprises photo-curing the ink with a UV curing device.

4. The method of claim 1 , wherein the step of curing the ink is initiated within 5 seconds after the step of digitally depositing the ink.

5. and / or the step of digitally placing the ink further comprises digitally placing the ink at a resolution greater than 400 dots per inch. The method of claim 1 , wherein the PEF has a resolution greater than 200 dots per inch.

6. The method of claim 1 , wherein digitally depositing the ink further comprises inkjet printing the ink.

7. moreover, providing a robotic applicator having a print head and a curing device; positioning the robotic applicator adjacent at least one of the P1 surface, the P2 surface, the P3 surface, and the P4 surface; having digitally depositing the ink comprises digitally depositing the ink from the printhead of the robotic applicator onto at least one of the P1 surface, the P2 surface, the P3 surface, and the P4 surface without depositing a mask as the robotic applicator moves along at least one of the P1 surface, the P2 surface, the P3 surface, and the P4 surface; 2. The method of claim 1 , wherein curing the ink to form the PEF comprises activating the curing device of the robotic applicator to cure the digitally placed ink as the robotic applicator moves along at least one of the P1 surface, the P2 surface, the P3 surface, and the P4 surface, such that the PEF is formed on at least one of the P1 surface, the P2 surface, the P3 surface, and the P4 surface.

8. 2. The method of claim 1, wherein the PEF has a thickness of less than 15 micrometers on at least one of the P1 surface, the P2 surface, the P3 surface, and the P4 surface.

9. and / or wherein the step of digitally depositing an ink comprises digitally depositing an organic ink; The method of claim 1 , wherein the PEF is an opaque boundary feature located adjacent a peripheral edge of the glass assembly.

10. and / or wherein the step of digitally depositing ink comprises digitally depositing conductive ink; The PEF is a conductive feature having at least one conductive trace, the conductive feature comprising: (i) a heating element configured to provide heat to at least a portion of the glass assembly; (ii) a bus bar configured to transfer energy to a conductive feature of the glass assembly; and (iii) an antenna configured to transmit / receive wireless signals; The method of claim 1 , further comprising:

11. the PEF is a functional coating formed on at least a portion of the glass assembly; digitally depositing ink comprises digitally depositing a functional ink onto at least one of the P1 surface, the P2 surface, the P3 surface, and the P4 surface without the use of a mask; The method of claim 1 , wherein the functional ink is selected from the group consisting of an anti-reflective coating, an IR-transmitting coating, a water-repellent coating, an oleophobic coating, and an oleophilic coating.

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