Epoxy resin curing agent, epoxy resin composition, and coating material
The use of a diamine-based epoxy resin curing agent with a specific structure enhances water and chemical resistance in paint films, addressing the limitations of existing agents and improving film performance in diverse paint applications.
Patent Information
- Application Number
- JP2021011423
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2021-01-27
- Publication Date
- 2025-01-07
- Estimated Expiration
- 2041-01-27
AI Technical Summary
Existing epoxy resin curing agents, particularly those using isophorone diamine or modified products, suffer from low water resistance, leading to whitening issues when exposed to water droplets, and inadequate chemical resistance in the resulting paint films.
An epoxy resin curing agent containing a diamine represented by a specific general formula (1) or its modified product, such as 2-benzylpropane-1,3-diamine, is used to enhance water and chemical resistance, combined with an epoxy resin composition that includes a reaction product of the diamine and an epoxy compound.
The resulting coating film exhibits excellent water resistance and chemical resistance, suitable for various paints including marine, heavy-duty anticorrosive, tank, pipe interior, and flooring applications.
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Abstract
Description
[Technical field]
[0001] The present invention relates to an epoxy resin curing agent, an epoxy resin composition containing the curing agent, and a coating material. [Background technology]
[0002] Epoxy resin compositions that use polyamines as epoxy resin hardeners are widely used in the coating field, such as anticorrosive paints for ships, bridges, and land and offshore steel structures, as well as in the civil engineering and construction fields, such as linings, reinforcing and repair materials for concrete structures, flooring materials for buildings, linings for water supply and sewerage systems, paving materials, adhesives, etc. Compounds obtained by modifying polyamines are also useful as epoxy resin curing agents. For example, Patent Document 1 discloses that an epoxy resin composition containing a compound obtained by condensing a polyamine such as metaxylylenediamine or isophoronediamine with an aldehyde or an alkylphenol having two or more alkyl groups having 1 to 9 carbon atoms as substituents on an aromatic ring by a Mannich reaction as an epoxy resin curing agent has excellent acid resistance of the cured product obtained, and is particularly suitable for use in the civil engineering field such as bridge pier reinforcement and concrete admixtures, flooring materials, paints, adhesives, etc. [Prior art documents] [Patent documents]
[0003] [Patent Document 1] JP 2007-277508 A Summary of the Invention [Problem to be solved by the invention]
[0004] It is important that the epoxy resin curing agent for paint has good water resistance, appearance, and chemical resistance of the resulting coating film. In the technology disclosed in Patent Document 1, the acid resistance, impact resistance, smoothness, appearance, etc. of the coating film are evaluated, but water resistance has not been considered, and there is still room for improvement. For example, when isophoronediamine or its modified product is used as an epoxy resin curing agent, there is a drawback that it is prone to whitening due to water droplets due to its low water resistance. An object of the present invention is to provide an epoxy resin curing agent, an epoxy resin composition, and a coating material capable of forming a coating film having excellent water resistance and chemical resistance. [Means for solving the problem]
[0005] The present inventors have found that an epoxy resin curing agent containing a specific amine compound or a modified product thereof, and an epoxy resin composition containing the curing agent, can solve the above problems. That is, the present invention relates to the following. [1] An epoxy resin curing agent containing a diamine represented by the following general formula (1) or a modified product thereof: [ka] (In formula (1), R 1 represents an alkyl group having 1 to 8 carbon atoms, an aryl group having 6 to 12 carbon atoms, or an aralkyl group having 7 to 13 carbon atoms. p is a number from 0 to 3. [2] The epoxy resin curing agent according to the above [1], wherein the modified product is a reaction product of a diamine represented by the general formula (1) and an epoxy compound having at least one epoxy group. [3] The epoxy resin curing agent according to the above [1] or [2], wherein the diamine represented by the general formula (1) is 2-benzylpropane-1,3-diamine. [4] An epoxy resin composition containing an epoxy resin and the epoxy resin curing agent according to any one of the above [1] to [3]. [5] A paint containing the epoxy resin composition described in [4] above. Effect of the Invention
[0006] According to the present invention, there is provided an epoxy resin curing agent and an epoxy resin composition capable of forming a coating film having excellent water resistance and chemical resistance. The epoxy resin composition is suitably used in various coating materials such as marine coating materials, heavy-duty anticorrosive coating materials, tank coating materials, pipe interior coating materials, exterior coating materials, and floor coating materials. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0007] [Epoxy resin hardener] The epoxy resin curing agent of the present invention is an epoxy resin curing agent containing a diamine represented by the following general formula (1) or a modified product thereof. [ka] (In formula (1), R 1 represents an alkyl group having 1 to 8 carbon atoms, an aryl group having 6 to 12 carbon atoms, or an aralkyl group having 7 to 13 carbon atoms. p is a number from 0 to 3. By using the above epoxy resin curing agent, it is possible to provide an epoxy resin composition capable of forming a coating film having excellent water resistance and chemical resistance. Hereinafter, the epoxy resin curing agent of the present invention may be simply referred to as the "curing agent of the present invention."
[0008] The reason why the use of the curing agent of the present invention in an epoxy resin composition can form a coating film having excellent water resistance and chemical resistance is not clear, but it is considered that the water resistance and chemical resistance of the coating film formed are improved because the diamine represented by general formula (1) or its modified product, which is contained in the curing agent, has a benzylpropanediamine structure.
[0009] <Diamine represented by general formula (1)> R in the above general formula (1) 1In the above, examples of the alkyl group having 1 to 8 carbon atoms include linear or branched alkyl groups having 1 to 8 carbon atoms, such as methyl groups, ethyl groups, various propyl groups, various butyl groups, various pentyl groups, various hexyl groups, various heptyl groups, and various octyl groups. The term "various" as used herein means to include linear and all branched groups. Examples of the aryl group having 6 to 12 carbon atoms include a phenyl group, a tolyl group, a naphthyl group, and a biphenyl group. Examples of the aralkyl group having 7 to 13 carbon atoms include a benzyl group, a phenethyl group, and a phenylpropyl group. From the viewpoints of improving the water resistance and chemical resistance of the coating film to be formed, compatibility with epoxy resins, and availability, R 1 is preferably an alkyl group having 1 to 8 carbon atoms, more preferably an alkyl group having 1 to 3 carbon atoms, and further preferably a methyl group. When p in the general formula (1) is 2 or 3, R 1 may all be the same or different from each other.
[0010] In the general formula (1), p is a number of 0 to 3, preferably 0 to 1, and more preferably 0.
[0011] The diamine represented by the general formula (1) is preferably 2-benzylpropane-1,3-diamine, in which p in the general formula (1) is 0, from the viewpoints of improving the water resistance and chemical resistance of the coating film to be formed, compatibility with epoxy resins, and availability.
[0012] <Method for producing diamine represented by general formula (1)> The diamine represented by the general formula (1) is preferably produced by a method having the following steps 1 and 2 in order, which method enables efficient production of the diamine. Step 1: A step of subjecting an aldehyde compound represented by the following general formula (I) and malononitrile represented by the following formula (II) to a dehydration condensation reaction to obtain an unsaturated nitrile compound represented by the following general formula (III): Step 2: Hydrogenating the unsaturated nitrile compound represented by the general formula (III) in the presence of at least one catalyst. [ka] In the above formula, R 2 is a substituent represented by the following structure: [ka] (R 1 and p are the same as above. * indicates the attachment site.)
[0013] (Process 1) In step 1, the aldehyde compound represented by the general formula (I) and the malononitrile represented by the general formula (II) are subjected to a dehydration condensation reaction to obtain the unsaturated nitrile compound represented by the general formula (III). The dehydration condensation reaction between the aldehyde compound and malononitrile can be carried out by a conventional method using Knoevenagel condensation, preferably by reacting the aldehyde compound with malononitrile in the presence of a catalyst. The reaction can be carried out in a solvent or without a solvent. The catalyst is preferably a basic catalyst such as zirconyl chloride or piperidine. The reaction conditions are not particularly limited, but the reaction can be carried out at normal pressure and usually at a temperature of 20 to 40° C. After completion of the reaction, for example, the reaction solution is cooled to precipitate and recover the unsaturated nitrile compound represented by general formula (III).
[0014] (Process 2) In step 2, the unsaturated nitrile compound represented by the general formula (III) obtained in step 1 is hydrogenated in the presence of at least one catalyst. Through step 2, the diamine represented by the general formula (1) can be obtained. The hydrogenation in step 2 can be carried out in one step or multiple steps. From the viewpoint of producing the diamine represented by the general formula (1) in high yield, the hydrogenation in step 2 is preferably carried out in two steps. In this case, in the first step, the unsaturated bond portion of the unsaturated nitrile compound represented by the general formula (III) is hydrogenated, and in the second step, -CN is reduced to convert it to -CH2NH2.
[0015] In order to produce the diamine represented by the general formula (1) in high yield, the hydrogenation in step 2 is preferably carried out in a solvent such as tetrahydrofuran. In addition, a hydrogenation catalyst based on at least one selected from the group consisting of palladium and cobalt is preferably used in the hydrogenation in step 2. When the hydrogenation in step 2 is carried out in two stages, from the viewpoint of producing the diamine represented by the general formula (1) in high yield, it is preferable to use a palladium catalyst in the first stage of the hydrogenation, and to use a Raney type catalyst in the second stage of the hydrogenation. The reaction conditions in step 2 can be appropriately selected, but from the viewpoint of improving the reaction efficiency, the first stage of hydrogenation is preferably selected from the ranges of a temperature of 20 to 120° C. and a pressure of 2 to 30 MPa, more preferably a temperature of 40 to 100° C. and a pressure of 2.5 to 15 MPa, and even more preferably a temperature of 60 to 90° C. and a pressure of 3 to 10 MPa. The second stage of hydrogenation is preferably selected from the ranges of a temperature of 20 to 120° C. and a pressure of 2 to 30 MPa, preferably a temperature of 50 to 115° C. and a pressure of 5 to 20 MPa, and even more preferably a temperature of 80 to 110° C. and a pressure of 5 to 15 MPa. When the hydrogenation is carried out in multiple stages, each stage may be carried out in one reactor having a different catalytic zone or in multiple reactors.
[0016] The reaction liquid obtained by the hydrogenation can be purified by distillation or the like to isolate the diamine represented by the general formula (1).
[0017] When the diamine represented by the general formula (1) is 2-benzylpropane-1,3-diamine, 2-benzylpropane-1,3-diamine can also be obtained by hydrogenating benzalmalononitrile represented by the following structural formula as a starting material. The hydrogenation of benzalmalononitrile and the subsequent purification can be carried out by the same method as that described in the step 2. [ka]
[0018] <Modified diamine represented by general formula (1)> Specific examples of modified products of the diamine represented by general formula (1) include reaction products obtained by reacting the diamine represented by general formula (1) with an epoxy compound having at least one epoxy group, an unsaturated hydrocarbon compound, a carboxylic acid or a derivative thereof, etc.; Mannich reaction products obtained by reacting the diamine represented by general formula (1) with a phenol compound and an aldehyde compound; ketimines (ketimines) obtained by reacting the diamine represented by general formula (1) with a ketone compound; and the like. Among these, the modified product of the diamine represented by general formula (1) is preferably a reaction product of the diamine represented by general formula (1) and an epoxy compound having at least one epoxy group from the viewpoint of improving the water resistance and chemical resistance of the coating film formed. In this specification, the reaction product of the diamine represented by general formula (1) and an epoxy compound having at least one epoxy group means a product obtained by the reaction of the diamine with the epoxy compound, and a reaction composition containing a reactant (adduct) of the diamine and the epoxy compound. Hereinafter, the reaction product is also simply referred to as "the reaction product".
[0019] The epoxy compound used in the reaction product may be a compound having at least one epoxy group, and more preferably a compound having two or more epoxy groups. Specific examples of the epoxy compound include polyfunctional epoxy resins having a glycidylamino group derived from epichlorohydrin, butyl diglycidyl ether, neopentyl glycol diglycidyl ether, 1,3-propanediol diglycidyl ether, 1,4-butanediol diglycidyl ether, 1,6-hexanediol diglycidyl ether, biphenol diglycidyl ether, dihydroxynaphthalene diglycidyl ether, dihydroxyanthracene diglycidyl ether, triglycidyl isocyanurate, tetraglycidyl glycoluril, and metaxylylenediamine, and polyfunctional epoxy resins having a glycidylamino group derived from 1,3-bis(aminomethyl)cyclohexane. Examples of such epoxy resins include polyfunctional epoxy resins having a glycidylamino group derived from diaminodiphenylmethane, polyfunctional epoxy resins having a glycidylamino group and / or a glycidyloxy group derived from paraaminophenol, polyfunctional epoxy resins having a glycidyloxy group derived from bisphenol A, polyfunctional epoxy resins having a glycidyloxy group derived from bisphenol F, polyfunctional epoxy resins having a glycidyloxy group derived from phenol novolac, and polyfunctional epoxy resins having two or more glycidyloxy groups derived from resorcinol. These may be used alone or in combination of two or more. From the viewpoint of improving the water resistance and chemical resistance of the coating film to be formed, and from the viewpoint of curability, the epoxy compound is more preferably a compound containing an aromatic ring or an alicyclic structure in the molecule, even more preferably a compound containing an aromatic ring in the molecule, and even more preferably a polyfunctional epoxy resin having a glycidyloxy group derived from bisphenol A.
[0020] The reaction product is obtained by subjecting the diamine represented by the general formula (1) and the epoxy compound to a ring-opening addition reaction by a known method. For example, a method is exemplified in which the diamine represented by the general formula (1) is charged in a reactor, and the epoxy compound is added thereto in one batch or in portions by dropwise addition, and then heated to react. The addition reaction is preferably carried out under an inert atmosphere such as nitrogen gas.
[0021] The amount of the diamine represented by the general formula (1) and the epoxy compound used is not particularly limited as long as the resulting reaction product contains an amino group having active hydrogen, but from the viewpoint of the resulting reaction product exhibiting the function as an epoxy resin curing agent, it is preferable to use an excess amount of the diamine relative to the epoxy equivalent of the epoxy compound in the addition reaction. Specifically, the diamine and the epoxy compound are used so that the number of active hydrogens in the diamine relative to the number of epoxy groups in the epoxy compound (number of active hydrogens in the diamine / number of epoxy groups in the epoxy compound) is preferably 50 / 1 to 4 / 1, more preferably 20 / 1 to 4 / 1.
[0022] The temperature and reaction time during the addition reaction can be appropriately selected, but from the viewpoints of reaction rate, productivity, and prevention of decomposition of raw materials, the temperature during the addition reaction is preferably 50 to 150° C., more preferably 70 to 120° C. The reaction time is preferably 0.5 to 12 hours, more preferably 1 to 6 hours, from the completion of addition of the epoxy compound.
[0023] The curing agent of the present invention may be a curing agent consisting of the diamine represented by the general formula (1) or a modified product thereof, or may contain other curing agent components. Examples of other curing agent components include polyamine compounds other than the diamine represented by the general formula (1) and its modified product. However, from the viewpoint of improving the water resistance and chemical resistance of the coating film to be formed, the content of the diamine represented by the general formula (1) and its modified product in the curing agent of the present invention is preferably 50 mass% or more, more preferably 60 mass% or more, even more preferably 70 mass% or more, still more preferably 80 mass% or more, still more preferably 90 mass% or more, still more preferably 95 mass% or more, and may be 100 mass% based on the total curing agent components in the curing agent.
[0024] From the viewpoint of improving the water resistance and chemical resistance of the coating film to be formed, the curing agent of the present invention preferably contains a modified product of the diamine represented by the general formula (1), and more preferably contains a reaction product of the diamine represented by the general formula (1) and an epoxy compound having at least one epoxy group. When the curing agent of the present invention contains the reaction composition as a modified product of the diamine represented by the general formula (1), the content of the reaction product in the curing agent of the present invention is preferably 50% by mass or more, more preferably 60% by mass or more, even more preferably 70% by mass or more, even more preferably 80% by mass or more, even more preferably 90% by mass or more, even more preferably 95% by mass or more, and may be 100% by mass, based on the total curing agent components in the curing agent, from the viewpoint of improving the water resistance and chemical resistance of the coating film to be formed. The curing agent component in the curing agent means a component contained in the curing agent that has two or more active hydrogens capable of reacting with epoxy groups in the epoxy resin, and the mass % of the reaction product relative to the total amount of the curing agent components in the curing agent means the content ratio of the reaction product relative to the total amount of the curable components contained in the curing agent.
[0025] The curing agent of the present invention may further contain a known curing accelerator, a non-reactive diluent such as benzyl alcohol, etc., within the range that does not impair the effects of the present invention.
[0026] The active hydrogen equivalent of the curing agent component in the curing agent of the present invention is preferably 40 or more from the viewpoint of improving the water resistance and chemical resistance of the coating film formed, and is preferably 150 or less, more preferably 130 or less, from the viewpoint of improving curability. The active hydrogen equivalent (hereinafter also referred to as "AHEW") is the mass per mole of active hydrogen in the epoxy resin curing agent. From the viewpoint of improving the water resistance and chemical resistance of the coating film to be formed, the active hydrogen equivalent of the curing agent of the present invention is preferably 60 or more, more preferably 80 or more, and from the viewpoint of improving the curability, it is preferably 150 or less, more preferably 130 or less. When the non-reactive diluent is blended with the curing agent of the present invention, it is preferable that the AHEW of the curing agent containing the diluent falls within this range.
[0027] [Epoxy resin composition] The epoxy resin composition of the present invention contains an epoxy resin and the epoxy resin curing agent. A coating film formed from the epoxy resin composition of the present invention has high water resistance and chemical resistance, and is suitably used, for example, as a paint.
[0028] <Epoxy resin> The epoxy resin, which is the main component of the epoxy resin composition, may be any of a saturated or unsaturated aliphatic compound, an alicyclic compound, an aromatic compound, and a heterocyclic compound. From the viewpoint of obtaining a cured product with high water resistance, an epoxy resin containing an aromatic ring or an alicyclic structure in the molecule is preferred. Specific examples of the epoxy resin include at least one resin selected from the group consisting of epoxy resins having a glycidylamino group derived from metaxylylenediamine, epoxy resins having a glycidylamino group derived from paraxylylenediamine, epoxy resins having a glycidylamino group derived from 1,3-bis(aminomethyl)cyclohexane, epoxy resins having a glycidylamino group derived from 1,4-bis(aminomethyl)cyclohexane, epoxy resins having a glycidylamino group derived from diaminodiphenylmethane, epoxy resins having a glycidylamino group and / or a glycidyloxy group derived from paraaminophenol, epoxy resins having a glycidyloxy group derived from bisphenol A, epoxy resins having a glycidyloxy group derived from bisphenol F, epoxy resins having a glycidyloxy group derived from phenol novolac, and epoxy resins having a glycidyloxy group derived from resorcinol. The above epoxy resins can also be used in combination of two or more kinds.
[0029] Among the above, from the viewpoint of obtaining a cured product having high water resistance, the epoxy resin is preferably one having as a main component at least one selected from the group consisting of epoxy resins having a glycidylamino group derived from meta-xylylenediamine, epoxy resins having a glycidylamino group derived from para-xylylenediamine, epoxy resins having a glycidyloxy group derived from bisphenol A, and epoxy resins having a glycidyloxy group derived from bisphenol F, and from the viewpoint of obtaining a cured product having high water resistance, availability, and economic efficiency, one having as a main component an epoxy resin having a glycidyloxy group derived from bisphenol A is more preferable. The term "main component" used here means that other components may be contained within a range that does not deviate from the spirit of the present invention, and preferably means 50 to 100% by mass, more preferably 70 to 100% by mass, and even more preferably 90 to 100% by mass of the total.
[0030] The content of the epoxy resin curing agent in the epoxy resin composition of the present invention is an amount such that the ratio of the number of active hydrogens in the epoxy resin curing agent to the number of epoxy groups in the epoxy resin (number of active hydrogens in the epoxy resin curing agent / number of epoxy groups in the epoxy resin) is preferably 1 / 0.5 to 1 / 2, more preferably 1 / 0.75 to 1 / 1.5, and even more preferably 1 / 0.8 to 1 / 1.2.
[0031] The epoxy resin composition of the present invention may further contain other components, such as modifying components such as fillers and plasticizers, flow adjusting components such as thixotropic agents, pigments, leveling agents, tackifiers, and elastomer fine particles, depending on the application. However, from the viewpoint of effectively obtaining the effects of the present invention, the total amount of the epoxy resin and the epoxy resin curing agent in the epoxy resin composition is preferably 50% by mass or more, more preferably 70% by mass or more, even more preferably 80% by mass or more, still more preferably 90% by mass or more, still more preferably 95% by mass or more, and may be 100% by mass.
[0032] The method for preparing the epoxy resin composition of the present invention is not particularly limited, and the epoxy resin, the epoxy resin curing agent, and other components as necessary can be mixed and prepared using a known method and device. The order of mixing the components contained in the epoxy resin composition is also not particularly limited, and the epoxy resin curing agent may be prepared and then mixed with the epoxy resin, or the components constituting the epoxy resin curing agent and other components may be simultaneously mixed with the epoxy resin to prepare the composition.
[0033] [paint] The present invention provides a paint containing the epoxy resin composition. The paint of the present invention contains the epoxy resin composition, and thereby the coating film formed has good water resistance and chemical resistance. Examples of the paint include marine paint, heavy-duty anticorrosive paint, tank paint, pipe interior paint, exterior paint, and floor paint.
[0034] From the viewpoint of improving water resistance and chemical resistance, the content of the epoxy resin composition in the coating material of the present invention is preferably 50% by mass or more, more preferably 70% by mass or more, even more preferably 80% by mass or more, still more preferably 90% by mass or more, still more preferably 95% by mass or more, and may be 100% by mass. EXAMPLES
[0035] The present invention will be described in detail below with reference to examples and comparative examples, but the present invention is not limited to the following examples. The epoxy resin curing agent, the epoxy resin composition, and the cured product thereof were evaluated according to the following methods.
[0036] <Dry to the touch> A zinc phosphate-treated iron plate (SPCC-SD PB-N144 0.8×70×150 mm, manufactured by Paltec Co., Ltd.) was used as the substrate. The epoxy resin composition of each example was applied to the substrate using an applicator at 23°C and 50% RH to form a coating film (coating film thickness immediately after application: 200 μm). This coating film was stored at 23°C and 50% RH, and evaluated by touch after one day according to the following criteria. The results are shown in Table 1. Ex: Excellent (When pressing the thumb with a force of about 50 N, there is no stickiness of the coating film and no fingerprint residue) G: Good (When pressing the thumb with a force of about 50 N, there is no stickiness of the coating film, but there is fingerprint residue after finger contact) F: Passable (When pressing the thumb with a force of about 50 N, there is stickiness of the coating film) P: Poor (When pressing the thumb with a force of about 5 N, there is stickiness of the coating film)
[0037] <Pencil hardness> An epoxy resin composition was applied onto a substrate (zinc phosphate-treated iron plate) in the same manner as described above to form a coating film (thickness immediately after application: 200 μm). This coating film was stored under the conditions of 23°C and 50% R.H., and after 1 day, the pencil hardness was measured in accordance with JIS K5600-5-4:1999. The results are shown in Table 1.
[0038] <Water resistance spot test> An epoxy resin composition was applied onto a substrate (zinc phosphate-treated iron plate) in the same manner as described above to form a coating film (thickness immediately after application: 200 μm). This coating film was stored under the conditions of 23°C and 50% R.H., and after 1, 2, and 7 days, 2 - 3 drops of pure water were dropped onto the surface of the coating film with a dropper, and the location was covered with a 50 mL screw-cap vial. After 24 hours, the water was wiped off, and the appearance was visually observed and evaluated according to the following criteria. The results are shown in Table 1. Ex: No change G: Slight change, but good F: Change
[0039] <RCI curing rate> On a glass plate (manufactured by Taiyu Kikai Co., Ltd., 25 × 348 × 2.0 mm), each example of the epoxy resin composition was applied using a 76 μm applicator under the conditions of 23°C and 50% R.H. to form a coating film. The glass plate with the coating film formed was set in a paint drying time measuring instrument (manufactured by Taiyu Kikai Co., Ltd.), and when the needle of the measuring instrument scratched the surface of the coating film, the streak marks were observed, and the arrival time at each drying stage (tacky dry, semi-dry, fully dry) was measured according to the following criteria. The results are shown in Table 1. A shorter time indicates a faster curing rate. Set to Touch: The time when the needle begins to leave a mark on the glass plate Semi-dry (Dust Free): The time it takes for the needle marks to appear on the surface of the coating. Dry through: The time when no trace of the needle remains on the coating
[0040] <Appearance of coating film> The epoxy resin composition was applied to a substrate (zinc phosphate-treated iron plate) in the same manner as above to form a coating film (thickness immediately after application: 200 μm). The appearance of the resulting coating film was visually observed after one day, and the transparency and gloss were evaluated according to the following criteria. (transparency) Ex: No turbidity G: Slightly cloudy, but no problem in use F: Cloudy (Glossiness) Ex: Glossy G: Slightly less glossy, but no problem in use F: No gloss
[0041] <Chemical resistance> A zinc phosphate-treated iron plate (SPCC-SD PB-N144 0.8×70×150 mm, manufactured by Paltec Co., Ltd.) was used as the substrate. The epoxy resin composition of each example was applied to the substrate using an applicator to form a coating (coating thickness immediately after application: 200 μm), and the uncoated areas were sealed with anti-rust paint ("Million Primer" and "Million Clear", manufactured by Kansai Paint Co., Ltd.) to prepare a test specimen. The test specimen was stored under conditions of 23° C. and 50% RH, and after 14 days, the chemical resistance of the test specimen was evaluated by the following method.
[0042] (Toluene resistant) Toluene was poured into a 1 L plastic container, and the test piece was immersed for about 80 mm. After 1, 2, and 3 weeks at 23° C., the appearance was visually observed and evaluated according to the following criteria. Ex: No change G: Slight changes, but good F: Changed
[0043] (Cross-cut test of coating film under salt spray) Two diagonally intersecting cuts each having a length of 50 mm were made on the coating surface of the test piece using a cutter knife in accordance with JIS K5600-7-9:2006 to prepare a cross-cut test piece. A cross-cut test piece was placed in a salt spray tester (STP-90, manufactured by Suga Test Instruments Co., Ltd., tank temperature 35°C). Salt water (concentration 5% by mass) was continuously sprayed, and the appearance was visually observed after 1, 2, and 3 weeks, and the width (mm) of rust on the substrate at the cross-cut area was confirmed. The smaller the rust width, the better the corrosion resistance.
[0044] Production Example 1 (Synthesis of 2-benzylpropane-1,3-diamine (BPDA)) Benzalmalononitrile was used as a starting material and hydrogenated according to the following procedure. (First hydrogenation stage) 8.0 g of benzalmalononitrile (manufactured by Tokyo Chemical Industry Co., Ltd.) was added to a 200 mL autoclave purged with argon. Then, 80 g of tetrahydrofuran as a solvent and 2.0 g of 10%-Pd / C (manufactured by N.E. Chemcat) as a hydrogenation catalyst were added to the autoclave, which was then sealed, and the inside of the autoclave was purged with hydrogen under pressurized conditions. Hydrogen replacement was performed once at a pressure of 2 MPa and twice at a pressure of 1 MPa. After increasing the pressure in the system to 5 MPa with hydrogen, stirring was started at 300 rpm while increasing the temperature. The reaction started when the temperature reached 75°C and stirring was continued for about 3 hours. The reaction was terminated when hydrogen absorption was no longer observed, heating and stirring were stopped, and the mixture was allowed to cool. After the pressure was reduced, the autoclave was opened, and the reaction solution was filtered to recover the filtrate. The recovered filtrate was analyzed by gas chromatography (GC), and the yield of the partial hydrogenation product of benzalmalononitrile represented by the following structure was 50% in terms of GC area %. [ka]
[0045] (Second stage hydrogenation) Next, 30.0 g of the filtrate containing the partial hydrogenation product of the benzalmalononitrile and 49.4 g of tetrahydrofuran were added to a 200 mL autoclave purged with argon. Then, 6.5 g of Raney cobalt (Raney 2724, manufactured by WR Grace) was weighed and added to the autoclave, and the inside of the autoclave was purged with hydrogen under pressurized conditions. Hydrogen replacement was performed once at a pressure of 2 MPa and twice at a pressure of 1 MPa. After increasing the pressure in the system to 8 MPa with hydrogen, stirring was started at 300 rpm while increasing the temperature. The reaction started when the temperature reached 100°C and stirring was continued for about 5 hours. The reaction was terminated when hydrogen absorption was no longer observed, at which point heating and stirring were stopped and the system was allowed to cool. After lowering the pressure, the autoclave was opened, and the reaction liquid was collected while washing the inside of the system with tetrahydrofuran. The collected reaction liquid was analyzed by gas chromatography (GC), and it was confirmed that the theoretical amount of 2-benzylpropane-1,3-diamine represented by the following structure was produced in terms of GC area % conversion using the partial hydrogenation product of benzalmalononitrile as the starting material. The reaction liquid was further purified by distillation to obtain BPDA. The AHEW of BPDA is 41. [ka]
[0046] Production Example 2 (Synthesis of reaction product of BPDA and epoxy compound) 8.2 g of BPDA obtained in Production Example 1 was charged into a 100 mL separable flask equipped with a stirrer, a thermometer, a nitrogen inlet tube, a dropping funnel and a cooling tube, and the temperature was raised to 80° C. under a nitrogen stream while stirring. While maintaining the temperature at 80° C., 37.2 g (an amount such that the number of active hydrogens in the epoxy resin curing agent / the number of epoxy groups in the epoxy compound=8 / 1) of a multifunctional epoxy resin having a glycidyloxy group derived from bisphenol A ("jER828" manufactured by Mitsubishi Chemical Corporation, epoxy equivalent: 186 g / equivalent) was dropped over 2 hours as an epoxy compound. After the dropwise addition was completed, the temperature was raised to 100° C. and the reaction was carried out for 2 hours, to obtain a reaction product (AHEW73) of BPDA and jER828.
[0047] Comparative Production Example 1 (Synthesis of reaction product of isophoronediamine and epoxy compound) 8.5g of isophoronediamine was charged into a 100mL separable flask equipped with a stirrer, a thermometer, a nitrogen inlet tube, a dropping funnel and a cooling tube, and the temperature was raised to 80°C while stirring under a nitrogen stream. While maintaining the temperature at 80°C, 37.2g (an amount such that the number of active hydrogens in the epoxy resin hardener / the number of epoxy groups in the epoxy compound=8 / 1) of a multifunctional epoxy resin having a glycidyloxy group derived from bisphenol A ("jER828" manufactured by Mitsubishi Chemical Corporation, epoxy equivalent: 186g / equivalent) was dropped over 2 hours as an epoxy compound. After the dropping was completed, the temperature was raised to 100°C and the reaction was carried out for 2 hours, and a reaction product (AHEW75) of isophoronediamine and jER828 was obtained.
[0048] Example 1 (Preparation and Evaluation of Epoxy Resin Composition) The reaction product obtained in Production Example 2 was diluted with benzyl alcohol, a non-reactive diluent, in an amount of 40 mass % of the total amount, to obtain an epoxy resin curing agent A (AHEW122) having a concentration of the reaction product of 60 mass %. A polyfunctional liquid epoxy resin having a glycidyloxy group derived from bisphenol A ("jER828" manufactured by Mitsubishi Chemical Corporation, epoxy equivalent weight 186 g / equivalent) was used as the epoxy resin, which is the main component of the epoxy resin composition. The epoxy resin and curing agent A were mixed together so that the ratio of the number of active hydrogens in the curing agent to the number of epoxy groups in the epoxy resin (number of active hydrogens in the curing agent / number of epoxy groups in the epoxy resin) was 1 / 1 to prepare an epoxy resin composition. The obtained epoxy resin composition was subjected to various evaluations by the above-mentioned methods, and the results are shown in Table 1.
[0049] Comparative Example 1 (Preparation and Evaluation of Comparative Epoxy Resin Composition) The reaction product obtained in Comparative Production Example 1 was diluted with benzyl alcohol, a non-reactive diluent, in an amount of 40 mass% of the total amount to obtain a comparative epoxy resin curing agent a (AHEW125) having a concentration of the reaction product of 60 mass%. An epoxy resin composition was prepared and the above evaluations were carried out in the same manner as in Example 1, except that the epoxy resin curing agent a was used instead of the epoxy resin curing agent A in Example 1. The results are shown in Table 1.
[0050] [Table 1]
[0051] From Table 1, it can be seen that the epoxy resin composition containing the epoxy resin curing agent of the present invention provides a coating film having good water resistance and chemical resistance. In addition, the curing property and the appearance of the coating film were also good. [Industrial Applicability]
[0052] According to the present invention, there is provided an epoxy resin curing agent and an epoxy resin composition capable of forming a coating film having excellent water resistance and chemical resistance. The epoxy resin composition is suitably used in various coating materials such as marine coating materials, heavy-duty anticorrosive coating materials, tank coating materials, pipe interior coating materials, exterior coating materials, and floor coating materials.
Claims
1. An epoxy resin curing agent containing a modified diamine represented by the following general formula (1): 【Chemistry 1】 (In formula (1), R 1 represents an alkyl group having 1 to 8 carbon atoms, an aryl group having 6 to 12 carbon atoms, or an aralkyl group having 7 to 13 carbon atoms; and p is a number from 0 to 3. the modified product of the diamine represented by the general formula (1) includes a reaction product of the diamine represented by the general formula (1) with an epoxy compound having two or more epoxy groups, The reaction product is an epoxy resin curing agent obtained by reacting the diamine with the epoxy compound such that the ratio of the number of active hydrogens in the diamine to the number of epoxy groups in the epoxy compound (number of active hydrogens in the diamine / number of epoxy groups in the epoxy compound) is 50 / 1 to 4 / 1.
2. 2. The epoxy resin curing agent according to claim 1, wherein the diamine represented by the general formula (1) is 2-benzylpropane-1,3-diamine.
3. An epoxy resin composition comprising an epoxy resin and the epoxy resin curing agent according to claim 1 or 2.
4. A coating material comprising the epoxy resin composition according to claim 3.
Citation Information
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