Electronic Devices, Electronic Equipment and Mobile Devices

Abstract

To provide a method for manufacturing an electronic device with which the electronic device that can reduce its size while maintaining a necessary bonding strength between a substrate and a lid can be simply and appropriately manufactured, an electronic device, an electronic apparatus, and a movable body.SOLUTION: A method for manufacturing an electronic device includes steps of: forming a structure that is surrounded by a joint material in plan view and has a plurality of storage parts storing at least one functional element; and cutting the structure between the adjacent two storage parts into individual pieces in plan view. In the step of forming the structure, in the plan view, the joint material has a first portion that overlaps a wiring group and is located between a terminal group and the storage parts, and an intermediate part that is located between the adjacent two storage parts. In the step of cutting the structure into individual pieces, in the plan view, the intermediate part is cut along with the cutting of the structure to form second portions having smaller width than that of the first portion.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a method for manufacturing an electronic device, an electronic device, an electronic instrument, and a mobile object. [Background technology]

[0002] In recent years, electronic devices manufactured using silicon Micro Electro Mechanical System (MEMS) technology have been developed.

[0003] As an example of such an electronic device, for example, a micro-relay is disclosed that has a semiconductor element, a base on which the semiconductor element is provided, a cap provided on the base, glass frit that bonds the base and the cap, wiring connected to the semiconductor element and having a portion that overlaps with the cap in a plan view, and a connection pad connected to the wiring and provided outside the cap. Patent Document 1 also discloses that the glass frit is annular in shape so as to surround the semiconductor element in a plan view, and the width of the glass frit is constant throughout. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2000-311961 A Summary of the Invention [Problem to be solved by the invention]

[0005] Here, in the region where the cap overlaps with the wiring in plan view, the bonding strength between the base and the cap is likely to decrease due to the presence of the wiring. Therefore, in order to increase the bonding strength in the region where the cap overlaps with the wiring, it is conceivable to increase the bonding area in this region. However, as in Patent Document 1, if the bonding area in other regions is increased in the same manner as in the region where the cap overlaps with the wiring, there is a problem that the microrelay becomes large. In addition, if the amount of glass frit applied to the region where the cap overlaps with the wiring is made larger than that of other regions, the cap will tilt when bonding to the base, resulting in a problem that there will be a portion where the bonding strength is insufficient.

[0006] The object of the present invention is to provide a method for simply and appropriately manufacturing an electronic device that can be miniaturized while maintaining the necessary bonding strength between the base and the lid, and to provide an electronic device that can be miniaturized while maintaining the necessary bonding strength between the base and the lid, and to provide electronic equipment and mobile objects that include such an electronic device. [Means for solving the problem]

[0007] Such an object can be achieved by the present invention described below. A method for manufacturing an electronic device according to the present invention includes the steps of providing a first member with a plurality of functional elements, a plurality of terminal groups each having a plurality of terminals, and a plurality of wiring groups each having a plurality of wirings connecting the plurality of functional elements and the plurality of terminals; a step of bonding a second member onto the first member via a bonding material to form a structure having a plurality of housing portions that are surrounded by the bonding material in a plan view seen from a direction in which the first member and the functional element overlap, and that house at least one of the functional elements; cutting the structure between two adjacent storage portions in the plan view to separate the structure, In the step of forming the structure, the second member is disposed such that the terminal group is located outside the second member in the plan view, The bonding material has a first portion that overlaps the wiring group in the planar view and is located between the terminal group and the accommodating portion, and an intermediate portion that is located between two adjacent accommodating portions, and in the singulation process, a second portion having a width smaller than that of the first portion is formed by cutting the intermediate portion in conjunction with cutting the structure in the planar view.

[0008] According to the method for manufacturing an electronic device of the present invention, the width of the first portion of the bonding material can be made relatively large, so that the decrease in the bonding strength between the first and second members in the region where the second member overlaps with the wiring group in a plan view (between the housing portion and the terminal group) can be reduced. In addition, by cutting the middle portion of the bonding material, the second portion having a width smaller than the first portion can be formed, so that the bonding area between the base obtained from the first member and the lid obtained from the second member can be made smaller than in the past. As a result, it is possible to manufacture an electronic device that can be made smaller while maintaining the necessary bonding strength between the base obtained from the first member and the lid obtained from the second member.

[0009] In the method for producing an electronic device of the present invention, it is preferable that, in the plan view, the width of the intermediate portion is 0.9 to 1.1 times the width of the first portion.

[0010] This allows the operation of providing the bonding material to be performed easily, and also allows the second portion, which has a width smaller than that of the first portion, to be formed easily and appropriately.

[0011] In the method for producing an electronic device of the present invention, in the step of forming the structure, the housing section has a first housing section that houses at least one of the functional elements and a second housing section that houses at least one of the functional elements, the bonding material has a third portion located between the first housing portion and the second housing portion in the plan view, In the singulation step, it is preferable that the width of the second portion is made smaller than the width of the third portion in the plan view by cutting the intermediate portion in conjunction with cutting the structure.

[0012] This makes it possible to manufacture an electronic device in which the airtightness of the first housing portion and the second housing portion is sufficiently maintained.

[0013] In the method for manufacturing an electronic device of the present invention, in the step of forming the structure, the bonding material is preferably applied to at least one of the first member and the second member by screen printing.

[0014] This allows the bonding material to be applied in a desired shape in a plan view more easily and quickly, and also allows the first portion to be easily and appropriately formed with an appropriate width that can sufficiently ensure the necessary bonding strength.

[0015] In the method for manufacturing an electronic device according to the present invention, it is preferable that the bonding material contains a low-melting point glass.

[0016] Although a bonding material containing such a low melting point glass tends to have a larger bonding area than designed in the process of applying it to the first member and the second member and bonding them, according to the present invention described above, the bonding area can be easily reduced even when such a bonding material is used. Furthermore, such a bonding material can sufficiently ensure the necessary bonding strength between the first member and the second member even if the first member and the second member are made of different materials.

[0017] The electronic device of the present invention comprises a substrate and A functional element provided on the substrate; a cover provided on the base and forming, together with the base, a housing portion for housing the functional element; A bonding material bonding the base body and the lid body; a terminal group provided on the base, the terminal group including a plurality of terminals located outside the lid in a plan view seen from a direction in which the functional element and the base overlap; a wiring group provided on the base and including a plurality of wirings connecting the functional element and a plurality of the terminals; the bonding material has, in the plan view, a first portion located between the accommodation portion and the terminal group and a second portion different from the first portion; In the plan view, the width of the first portion is larger than the width of the second portion.

[0018] According to such an electronic device of the present invention, since the width of the first portion of the bonding material is relatively large, it is possible to reduce the decrease in the bonding strength between the base and the lid in the area where the lid overlaps with the wiring group in a plan view (between the housing portion and the terminal group). Furthermore, since the bonding material has a second portion, it is possible to reduce the bonding area between the base and the lid compared to the conventional case. As a result, it is possible to realize an electronic device that can be miniaturized while maintaining the necessary bonding strength between the base and the lid.

[0019] In the electronic device of the present invention, the housing portion includes a first housing portion having at least one of the functional elements and a second housing portion having at least one of the functional elements, the bonding material has a third portion located between the first housing portion and the second housing portion in the plan view, In the plan view, it is preferable that the width of the third portion is greater than the width of the second portion.

[0020] With this, since the width of the third portion is larger than the width of the second portion, the airtightness of the first storage portion and the second storage portion can be sufficiently maintained in an independent state.

[0021] In the electronic device according to the present invention, it is preferable that the bonding material contains a low-melting point glass.

[0022] This makes it possible to sufficiently ensure the necessary bonding strength between the base and the lid even if the base and the lid are made of different materials.

[0023] The electronic device of the present invention is characterized by having the electronic device of the present invention. This provides an electronic device that can be made smaller while maintaining the necessary bonding strength between the base and the lid, and therefore allows for a high degree of freedom in arranging the electronic device, resulting in a highly reliable electronic device.

[0024] A mobile object of the present invention is characterized by having the electronic device of the present invention. As a result, the electronic device can be made smaller while maintaining the necessary bonding strength between the base and the lid, so that a highly reliable mobile body can be obtained with a high degree of freedom in arranging the electronic device. [Brief description of the drawings]

[0025] [Figure 1] 1 is a plan view showing an electronic device according to a first embodiment of the present invention. [Diagram 2] FIG. 2 is a cross-sectional view of the electronic device shown in FIG. [Diagram 3] FIG. 2 is a cross-sectional view of the electronic device shown in FIG. [Figure 4] 2 is a plan view of the electronic device shown in FIG. 1, with the lid not shown. [Diagram 5] 2 is a flowchart illustrating a method for manufacturing the electronic device shown in FIG. [Figure 6] 6 is a cross-sectional view illustrating a process of providing a group of wires and a group of terminals on the first member shown in FIG. 5. [Figure 7] 6 is a cross-sectional view illustrating a process of providing an angular velocity sensor element on the first member shown in FIG. 5. FIG. [Figure 8] 6 is a cross-sectional view illustrating a process of providing an angular velocity sensor element on the first member shown in FIG. 5. FIG. [Figure 9] 6A to 6C are cross-sectional views illustrating a process for forming the structure shown in FIG. 5. [Figure 10] 6A to 6C are cross-sectional views illustrating a process for forming the structure shown in FIG. 5. [Figure 11] 6A to 6C are cross-sectional views illustrating a process for forming the structure shown in FIG. 5. [Figure 12] 6 is a plan view illustrating a process for forming the structure shown in FIG. 5. FIG. [Figure 13] 6 is a cross-sectional view for explaining the singulation step shown in FIG. 5. FIG. [Figure 14] FIG. 6 is a plan view for explaining the singulation step shown in FIG. 5. [Figure 15] FIG. 4 is a plan view showing an electronic device according to a second embodiment of the present invention. [Figure 16] FIG. 16 is a cross-sectional view of the electronic device shown in FIG. [Figure 17] FIG. 16 is a plan view illustrating the acceleration sensor element shown in FIG. [Figure 18] 16 is a plan view illustrating a step of forming a structure in the method for manufacturing the electronic device shown in FIG. 15. FIG. [Figure 19] 16 is a plan view for illustrating a singulation step in the manufacturing method of the electronic device shown in FIG. 15. FIG. [Figure 20] FIG. 1 is a perspective view showing the configuration of a mobile (or notebook) personal computer to which the electronic device of the present invention is applied. [Figure 21] 1 is a perspective view showing a configuration of a mobile phone (including a smartphone, a PHS, etc.) to which the electronic device of the present invention is applied. [Figure 22] 1 is a perspective view showing a configuration of a digital still camera to which the electronic device of the present invention is applied; [Figure 23] 1 is a perspective view showing an automobile to which the moving body of the present invention is applied; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0026] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a method for manufacturing an electronic device, an electronic device, an electronic apparatus, and a mobile object according to the present invention will be described in detail with reference to embodiments shown in the accompanying drawings.

[0027] 1. Electronic device and method for manufacturing electronic device First Embodiment FIG. 1 is a plan view showing an electronic device according to a first embodiment of the present invention. FIG. 2 is a cross-sectional view of the electronic device shown in FIG. 1. FIG. 3 is a cross-sectional view of the electronic device shown in FIG. 1. FIG. 4 is a plan view of the electronic device shown in FIG. 1, with the cover omitted. In the following description, the three mutually orthogonal axes are the X-axis, the Y-axis, and the Z-axis. The direction along the X-axis is also referred to as the "X-axis direction", the direction along the Y-axis is also referred to as the "Y-axis direction", and the direction along the Z-axis is also referred to as the "Z-axis direction". In each drawing, the dimensions of each part are appropriately exaggerated as necessary for the convenience of description, and the dimensional ratio between each part does not necessarily match the actual dimensional ratio. In addition, in this specification, two parts (areas) being "equal" means that they are substantially equal, and the difference between them is within a range of approximately 10% or less.

[0028] [Electronic Devices] The electronic device 1 shown in FIG. 1 is an angular velocity sensor capable of detecting an angular velocity in the X-axis direction.

[0029] 2 and 3, the electronic device 1 includes a base 2, an angular velocity sensor element 4 as a functional element provided on the base 2, a lid 3 provided on the base 2 so as to cover the angular velocity sensor element 4, and a bonding material 7 that bonds the base 2 and the lid 3. Also, as shown in Fig. 1 and 4, the electronic device 1 includes a wiring group L4 including a plurality of wirings L41, L42, L43, L44, and L45, and a terminal group T4 including a plurality of terminals T41, T42, T43, T44, and T45.

[0030] Each component of the electronic device 1 will now be described in detail. (Base) The base 2 has a function of supporting the angular velocity sensor element 4 .

[0031] 1, the base 2 is a plate-like member having a quadrangle (rectangle in this embodiment) in plan view (hereinafter simply referred to as "plan view") seen from the direction in which the base 2 and the angular velocity sensor element 4 overlap. Also, as shown in Figs. 2 and 3, a recess 21 that opens upward is formed on an upper surface 22 (surface on the lid 3 side) of the base 2. Note that, in this embodiment, the shape of the recess 21 in plan view is quadrangle, but is not limited thereto.

[0032] The upper surface 22 of the base 2 has grooves 221, 222, 223, 224, and 225 that are open upward (see FIG. 4). The grooves 221 to 225 are provided outside the recess 21 and are formed to follow the outer periphery of the base 2. The grooves 221 to 225 have shapes corresponding to the wiring group L4 and the terminal group T4 in a plan view. Specifically, the groove 221 has a shape corresponding to the wiring L41 and the terminal T41, the groove 222 has a shape corresponding to the wiring L42 and the terminal T42, the groove 223 has a shape corresponding to the wiring L43 and the terminal T43, the groove 224 has a shape corresponding to the wiring L44 and the terminal T44, and the groove 225 has a shape corresponding to the wiring L45 and the terminal T45.

[0033] The material for forming the base 2 is not particularly limited, but may be, for example, various ceramic materials such as alumina, silica, titania, zirconia, etc., insulating materials such as glass, quartz, crystal, etc., various resin materials, etc., and among these, it is preferable to use a glass material containing alkali metal ions (mobile ions) (for example, borosilicate glass such as Pyrex glass (registered trademark)). By using a glass material, the base 2 having high shape accuracy can be manufactured more easily.

[0034] (Angular velocity sensor element) The angular velocity sensor element 4 shown in FIG. 4 has two structures 40 (40a, 40b) aligned in the Y-axis direction and two fixed detection electrodes 49.

[0035] Each structure 40 has a vibration section 41, a plurality of drive spring sections 42, a plurality of fixed sections 43, a plurality of movable drive electrodes 44, a plurality of fixed drive electrodes 45, 46, a detection flap plate 47, and a plurality of beam sections 48. The vibration section 41, the drive spring section 42, the fixed section 43, the movable drive electrode 44, the detection flap plate 47, and the beam sections 48 are integrally formed. The vibration section 41 forms a rectangular frame in a plan view.

[0036] Four fixing parts 43 are provided for one structure 40, and each fixing part 43 is fixed to the upper surface 22 of the base 2 described above. Each fixing part 43 is disposed outside the vibration part 41 in a plan view, and in this embodiment, is provided at a position corresponding to each corner of the vibration part 41. In the drawing, the fixing part 43 located on the -Y axis side of the structure 40a and the fixing part 43 located on the +Y axis side of the structure 40b are treated as a common fixing part.

[0037] Four drive spring parts 42 are provided for one structure 40, and each drive spring part 42 is provided corresponding to each corner of the vibration part 41, and connects the corresponding corner of the vibration part 41 to the fixed part 43. Further, the drive spring part 42 connects the vibration part 41 to the fixed part 43 in a displaceable manner, and in this embodiment, is configured to be able to displace the vibration part 41 in the Y-axis direction.

[0038] Four movable driving electrodes 44 are provided for one structure 40, and each movable driving electrode 44 is connected to the vibration section 41. Specifically, two movable driving electrodes 44 are located on the +X side of the vibration section 41, and the remaining two movable driving electrodes 44 are located on the -X side of the vibration section 41. Each movable driving electrode 44 has a comb-tooth shape.

[0039] Four fixed driving electrodes 45, 46 are provided for each structure 40, and each of the fixed driving electrodes 45, 46 is fixed to the upper surface 22 of the above-mentioned base 2. Each of the fixed driving electrodes 45, 46 has a comb-like shape corresponding to the movable driving electrode 44, and is provided with the movable driving electrode 44 sandwiched therebetween.

[0040] The detection flap (detection displacement plate) 47 is a plate-like member having a rectangular shape in a plan view, is disposed inside the vibration part 41, and is connected to the vibration part 41 by a beam part 48. The detection flap 47 is rotatable (displaceable) around a rotation axis J4.

[0041] The fixed detection electrode 49 is provided on the bottom surface of the recess 21 of the base 2 (see FIGS. 2 and 3). The fixed detection electrode 49 has a rectangular shape in a plan view, and faces the detection flap plate 47. The fixed detection electrode 49 is spaced apart from the detection flap plate 47.

[0042] In addition, the above-mentioned drive spring portion 42, fixed portion 43, movable drive electrode 44, one end of fixed drive electrode 45, one end of fixed drive electrode 46, detection flap plate 47 and beam portion 48 are provided above the recess 21 of the base 2 and are spaced apart from the base 2.

[0043] Such a structure 40 is formed in one go by patterning, by etching, a conductive silicon substrate doped with impurities such as phosphorus or boron.

[0044] Moreover, examples of materials that can be used to form the fixed detection electrodes 49 include aluminum, gold, platinum, ITO (Indium Tin Oxide), and ZnO (Zinc Oxide).

[0045] (Wiring and terminal groups) As shown in FIG. 4, the wiring group L4 and the terminal group T4 are provided on the base 2.

[0046] Specifically, wiring L41 and terminal T41 are provided in groove portion 221 of the above-mentioned base 2, wiring L42 and terminal T42 are provided in groove portion 222, wiring L43 and terminal T43 are provided in groove portion 223, wiring L44 and terminal T44 are provided in groove portion 224, and wiring L45 and terminal T45 are provided in groove portion 225.

[0047] The wiring L41 is electrically connected to the fixed portion 43 of the angular velocity sensor element 4 through the conductive bump B41. The wiring L42 is electrically connected to the fixed driving electrode 45 through a plurality of conductive bumps B42. The wiring L43 is electrically connected to the fixed driving electrode 46 through a plurality of conductive bumps B43. The wiring L44 is electrically connected to the fixed detection electrode 49 of the structure 40a, and the wiring L45 is electrically connected to the fixed detection electrode 49 of the structure 40b. In addition, one end of the wiring L41 is connected to the terminal T41, one end of the wiring L42 is connected to the terminal T42, one end of the wiring L43 is connected to the terminal T43, one end of the wiring L44 is connected to the terminal T44, and one end of the wiring L45 is connected to the terminal T45.

[0048] The wiring group L4 having such wirings L41 to L45 is provided outside the recess 21 and is provided along the outer periphery of the base 2. The terminal group T4 having the terminals T41 to T45 is disposed on the outer periphery of the upper surface 22 of the base 2, and in this embodiment, is disposed on one short side of the upper surface 22 (the lower side in FIG. 4). The terminals T41 to T45 are provided in a line along the X-axis direction. This makes it possible to reduce the length of the base 2 in the Y-axis direction, thereby making it possible to miniaturize the electronic device 1. Furthermore, the multiple terminals T41 to T45 are provided together on one side of the upper surface 22 of the base 2, which makes it possible to easily connect, for example, to an IC chip (not shown).

[0049] Furthermore, the constituent materials of the wirings L41 to L45, the terminals T41 to T45 and the conductive bumps B41 to B43 are not particularly limited as long as they are conductive, and examples thereof include oxides (transparent electrode materials) such as ITO, IZO (indium zinc oxide), In3O3, SnO2, Sb-containing SnO2, and Al-containing ZnO, Au, Pt, Ag, Cu, Al, and the like, or alloys containing these, and one or a combination of two or more of these may be used.

[0050] (Lid) The cover 3 has a function of protecting the angular velocity sensor element 4 described above. As shown in FIG. 1, the lid 3 is a plate-like member having a quadrangle (rectangle in this embodiment) in a plan view. As shown in FIGS. 2 and 3, a recess 31 is provided on its lower surface (surface facing the base 2). A portion (joint surface 32) of the lower surface of the lid 3 outside the recess 31 is joined to the upper surface 22 of the base 2 via a joining material 7. As a result, the recess 31 and the recess 21 form a storage space S for storing the angular velocity sensor element 4. This storage space S is an airtight space, and in this embodiment, it is possible to store the storage space S in a reduced pressure state (for example, 5×10 -2 ~5×10 -4 The pressure in the storage section S is about 100 psi (about 100 psi Pa). The reduced pressure in the storage section S can improve the detection accuracy of the angular velocity. The storage section S is formed with the recesses 21 and 31 each having a quadrangle (rectangle in this embodiment) in a plan view, and thus has a quadrangle (rectangle in this embodiment).

[0051] Further, a through hole 34 that communicates between the inside and outside of the recess 31 is formed in the upper part of the lid 3. The through hole 34 is filled with a sealing member 35 made of various metal materials or the like. For example, after performing evacuation or introducing an inert gas via the through hole 34, the through hole 34 can be sealed with the sealing member 35, so that the storage section S can be in a reduced pressure state as described above.

[0052] 1, the outer shape of the lid 3 is configured such that the length along the X-axis direction in a plan view is equal to that of the base 2, and the length along the Y-axis direction is shorter than that of the base 2. The lid 3 is disposed such that, in a plan view, three sides of its outer edge, excluding the side on the lower side in FIG. 1, coincide with the outer edge of the base 2. This allows the above-mentioned terminal group T4 to be disposed in an area on the upper surface of the base 2 where the lid 3 is not provided, thereby exposing the terminal group T4 to the outside of the lid 3.

[0053] Also, the portion outside the recess 31 on the underside of the lid 3, i.e., the joint surface 32 which is the surface joined to the base body 2, is in the shape of a quadrangular frame in plan view (see Figs. 1, 2 and 3). Specifically, as shown in Fig. 1, the joint surface 32 is composed of a pair of joint parts 321, 322 extending along the X-axis direction, and a pair of joint parts 323, 324 which connect the ends of the pair of joint parts 321, 322 and extend along the Y-axis direction. In this embodiment, the width of the joint part 321 (the joint part on the terminal group T4 side) is configured to be larger than each of the widths of the joint parts 322, 323, 324 (other joint parts). The widths of the joint parts 322, 323, 324 are configured to be equal.

[0054] Here, of the pair of joints 321, 322, the joint 321 located on the terminal group T4 side constitutes a "first joint," and the other joint 322 constitutes a "second joint" narrower in width than the first joint. Similarly to joint 322, joints 323, 324 also constitute a "second joint" narrower in width than the first joint.

[0055] A silicon material can be suitably used as the material for the lid 3. However, the material for the lid 3 is not limited to a silicon material, and for example, a glass material, a ceramic material, or the like can also be used.

[0056] (bonding material) 2 and 3, the bonding material 7 is disposed between the upper surface 22 of the base 2 and the bonding surface 32 of the lid 3 to bond them together. In this embodiment, the bonding material 7 is provided over the entire bonding surface 32, and has the same shape as the bonding surface 32 in a plan view. Therefore, the bonding material 7 is provided so as to surround the storage section S in a plan view, and has a rectangular frame shape in the drawings.

[0057] 1 and 4, the bonding material 7 is composed of a pair of portions 71, 72 extending along the X-axis direction and a pair of portions 73, 74 connecting the ends of the pair of portions 71, 72 and extending along the Y-axis direction. In this embodiment, the width W1 of the portion 71 (the portion on the terminal group T4 side) is configured to be larger than each width W2 of the portions 72, 73, 74 (other portions). Also, the widths W2 of the portions 72, 73, 74 are equal.

[0058] Here, of the pair of parts 71, 72, part 71 located on the terminal group T4 side constitutes a "first part", and the other part 72 constitutes a "second part" narrower in width than the first part. Similarly to part 72, parts 73 and 74 also constitute a "second part" narrower in width than the first part.

[0059] Furthermore, grooves 221-225 are provided in the region where the cover 3 overlaps with the wiring group L4 in a plan view of the base 2 (see FIG. 2). Therefore, without the bonding material 7, the inside and outside of the storage section S would be in communication with each other via the grooves 221-225. However, by disposing the bonding material 7 between the base 2 and the cover 3, the bonding material 7 can fill the grooves 221-225. The bonding material 7 is provided with a substantially uniform thickness over the entire area.

[0060] The material of the bonding material 7 is not particularly limited as long as it can bond the base 2 and the lid 3, and examples thereof include various resin materials such as epoxy resin, phenol resin, silicone resin, and acrylic resin, various glass materials such as low-melting glass (e.g., borate glass), Pt (platinum), Ag (silver), Pd (lead), Au (gold), and alloys containing these, and one or more of these can be used in combination. Among these, it is particularly preferable that the bonding material 7 contains low-melting glass. This makes it possible to ensure the necessary bonding strength between the base 2 and the lid 3 even if the base 2 and the lid 3 are made of different materials. For example, when the base 2 is made of a glass material and the lid 3 is made of a silicon material, the bonding strength between them can be particularly increased.

[0061] Specific examples of the bonding material 7 containing such constituent materials include glass frit, glass paste, glass seal, solder paste, conductive paste, and adhesives containing various resin materials such as epoxy resin.

[0062] The electronic device 1, which is an example of the electronic device of the present invention as described above, includes the base 2, the angular velocity sensor element 4 as a "functional element" provided on the base 2, the lid 3 provided on the base 2 and forming a storage section S for storing the angular velocity sensor element 4 together with the base 2, the bonding material 7 bonding the base 2 and the lid 3, the terminal group T4 provided on the base 2 and having a plurality of terminals T41 to T45 located outside the lid 3 in a plan view seen from the direction in which the angular velocity sensor element 4 and the base 2 overlap, and the wiring group L4 provided on the base 2 and having a plurality of wirings L41 to L45 connecting the angular velocity sensor element 4 and the plurality of terminals T41 to T45. The bonding material 7 includes a portion 71 as a "first portion" located between the storage section S and the terminal group T4 in a plan view, and portions 72, 73, and 74 as "second portions" different from the portion 71. In plan view, the width W1 of the portion 71 (first portion) is larger than the width W2 of each of the portions 72, 73, and 74 (second portions). In such an electronic device 1, since the width W1 of the portion 71 is relatively large, it is possible to reduce a decrease in the bonding strength between the base 2 and the lid 3 in a region where the lid 3 overlaps with the wiring group L4 in plan view (between the storage section S and the terminal group T4). Furthermore, since the bonding material 7 has the portions 72, 73, and 74, it is possible to reduce the bonding area between the base 2 and the lid 3 compared to the conventional case. As a result, it is possible to realize an electronic device 1 that can be miniaturized while maintaining the necessary bonding strength between the base 2 and the lid 3.

[0063] In particular, as in this embodiment, all of the portions 72, 73, and 74 other than the portion 71 of the bonding material 7 each constitute the "second portion," which makes it possible to particularly effectively reduce the size of the electronic device 1. Note that, although all of the portions 72, 73, and 74 constitute the "second portion" in this embodiment, only any one of these may constitute the "second portion."

[0064] Moreover, the width W1 and the width W2 preferably satisfy the relationship of 0.2≦W2 / W1≦0.6, more preferably satisfy the relationship of 0.25≦W2 / W1≦0.55, and further preferably satisfy the relationship of 0.3≦W2 / W1≦0.5, for example. This makes it possible to more significantly exert the effect of achieving miniaturization while maintaining the necessary bonding strength between the base body 2 and the lid body 3.

[0065] The above describes the configuration of the electronic device 1. The electronic device 1 configured as above can detect the angular velocity ωx in the following manner.

[0066] First, a drive voltage is applied between the movable drive electrode 44 and the fixed drive electrodes 45, 46 of the angular velocity sensor element 4, causing the two vibration parts 41 to vibrate in the Y-axis direction in opposite phases. In this state, when an angular velocity ωx is applied to the electronic device 1, a Coriolis force is generated, and the two detection flaps 47 are displaced in opposite phases around the rotation axis J4. As the detection flap 47 is displaced, the gap between the detection flap 47 and the fixed detection electrode 49 changes, and the capacitance between them changes accordingly. As a result, the angular velocity ωx can be detected based on the amount of change in this capacitance.

[0067] [Electronic device manufacturing method] Next, a method for manufacturing an electronic device of the present invention will be described. Note that, in the following, an example of the case of manufacturing the above-mentioned electronic device 1 will be described.

[0068] FIG. 5 is a flow chart for explaining a method for manufacturing the electronic device shown in FIG. 1. FIG. 6 is a cross-sectional view for explaining a process of providing a wiring group and a terminal group on the first member shown in FIG. 5. FIGS. 7 and 8 are cross-sectional views for explaining a process of providing an angular velocity sensor element on the first member shown in FIG. 5, respectively. FIGS. 9, 10, and 11 are cross-sectional views for explaining a process of forming the structure shown in FIG. 5, respectively. FIG. 12 is a plan view for explaining a process of forming the structure shown in FIG. 5. FIG. 13 is a cross-sectional view for explaining a process of singulating shown in FIG. 5. FIG. 14 is a plan view for explaining the process of singulating shown in FIG. 5. Note that in FIGS. 12 and 14, the through-hole 34 and the sealing member 35 are omitted.

[0069] 5, the method for manufacturing the electronic device 1 includes the steps of: [1] providing the first member 20 with a wiring group L4 and a terminal group T4 (step S11), [2] providing the first member 20 with an angular velocity sensor element 4 (step S12), [3] forming the structure 10a (step S13), and [4] singulating (step S14). Each step will be described below in order.

[0070] In the following, an example will be described in which the first member 20 that becomes the multiple base bodies 2 is made of a glass material containing alkali metal ions, the substrate 4a that becomes the multiple angular velocity sensor elements 4 is made of a silicon material, and the second member 30 that becomes the multiple lid bodies 3 is made of a silicon material. In the following, multiple electronic devices 1 are formed.

[0071] [1] Step of providing wiring group L4 and terminal group T4 on first member 20 (step S11) First, a first member 20 having a plurality of recesses 21 and a plurality of grooves 221-225 is prepared, and a wiring group L4 having a plurality of wirings L41-L45 and a terminal group T4 having a plurality of terminals T41-T45 are provided on this first member 20 (see FIG. 6).

[0072] The wires L41 to L45 and the terminals T41 to T45 are formed in the corresponding grooves 221 to 225, respectively.

[0073] The method for forming the wirings L41 to L45 and the terminals T41 to T45 (film formation method) is not particularly limited, but for example, they can be formed all at once by forming a film from the materials described above using a vapor phase film formation method such as sputtering or evaporation, and then patterning the film by photolithography and etching.

[0074] [2] Step of providing the angular velocity sensor element 4 on the first member 20 (step S12) Next, a plurality of angular velocity sensor elements 4 are provided on the first member 20 (see FIGS. 7 and 8).

[0075] Specifically, first, the substrate 4a is prepared and bonded onto the first member 20 by, for example, anodic bonding (see FIG. 7). Next, the substrate 4a is thinned by, for example, polishing, and then the thinned substrate 4a is patterned by photolithography and etching to form a plurality of angular velocity sensor elements 4 (see FIG. 8). Dry etching is particularly used for etching the substrate 4a. Furthermore, as a high-precision dry etching process, it is preferable to use the Bosch method, which alternates between etching and deposition (protective film deposition). Incidentally, the thinning of the substrate 4a may be omitted as appropriate.

[0076] [3] Step of forming the structure 10a (step S13) Next, the second member 30 is bonded onto the first member 20 via the bonding material 70, forming a structure 10a having a plurality of storage portions S (see FIGS. 9 to 12).

[0077] Specifically, first, for example, a second member 30 is prepared in which a plurality of recesses 31 and a plurality of through holes 34 are formed by performing anisotropic etching on a silicon wafer. Next, a bonding material 70 is applied to the surface of the second member 30 in which the recesses 31 are formed (specifically, the portion of this surface excluding the recesses 31). Next, as shown in FIG. 9, the second member 30 is placed on the first member 20 so that the bonding material 70 is located between the first member 20 and the second member 30. At this time, the second member 30 is placed so that one angular velocity sensor element 4 is located for one recess 31. Next, as shown in FIG. 10, the first member 20 and the second member 30 are bonded. Next, after vacuuming or introducing an inert gas through the through holes 34, the through holes 34 are sealed with a sealing member 35 as shown in FIG. 11. As a result, a structure 10a having a plurality of storage sections S spaced apart from each other is obtained (see FIGS. 11 and 12).

[0078] 12, the structure 10a has four regions C partitioned by dashed double-dashed lines 850, 860. The regions C are regions that will become the electronic devices 1 in a later process. In this embodiment, the multiple regions C and storage sections S are arranged in a matrix in plan view.

[0079] For example, a screen printing method can be suitably used as a method for applying the bonding material 70. However, the method for applying the bonding material 70 is not limited to the screen printing method, and various methods such as a spray coating method and an inkjet method can be used.

[0080] The bonding material 70 may be made of, for example, a material containing the materials listed as the bonding material 7 described above. In this embodiment, the bonding material 70 contains, for example, borate glass (B2O3) as a main component, and is heated and pressurized after being applied to bond the first member 20 and the second member 30 (see Figs. 9 and 10). Note that the bonding material 70 before bonding may be in a liquid or solid state.

[0081] 12, in this process, the bonding material 70 is provided to surround the accommodation portion S in a plan view. The bonding material 70 has a plurality of portions 71 that overlap the wiring group L4 and are located between the terminal group T4 and the accommodation portion S in a plan view, an intermediate portion 721 that is located between two adjacent accommodation portions S, and a plurality of boundary portions 722 that are located at the boundary between adjacent regions C in a plan view.

[0082] The bonding material 70 is applied so that the width of the applied bonding material 70 is uniform over the entire area. Therefore, the width W1 of the portion 71, the width W21 of the intermediate portion 721, and the width W22 of the boundary portion 722 are uniform.

[0083] Furthermore, sealing of the through-hole 34 with the sealing member 35 is performed by placing a solder ball of AuGe or the like in the through-hole 34 and then melting it with a processing laser such as a YAG laser or a CO2 laser.

[0084] [4] Dividing into individual pieces (step S14) Next, the structure 10a is divided into individual pieces by cutting between two adjacent storage portions S in a plan view (see FIGS. 13 and 14).

[0085] The structure 10a is cut using, for example, a dicing blade 80. In this embodiment, the structure 10a is divided into regions C by cutting at planned cutting locations 85 and 86 shown by hatching in Fig. 14. The planned cutting location 85 is a portion overlapping with the middle portion 721 in a plan view, and the planned cutting location 86 is a portion overlapping with the boundary portion 722 in a plan view.

[0086] As the structure 10a is cut, the intermediate portion 721 is cut to form the portions 73 and 74. Furthermore, the boundary portion 722 is cut to form the portion 72. Here, in this embodiment, as described above, the width W1, the width W21, and the width W22 are equal to each other, so that the portions 72, 73, and 74 having the width W2 smaller than the width W1 of the portion 71 can be easily formed by cutting the intermediate portion 721 and the boundary portion 722. Furthermore, the first member 20 is cut to form a plurality of base bodies 2, and the second member 30 is cut to form a plurality of lid bodies 3. In this manner, a plurality of electronic devices 1 as shown in FIG. 1 can be obtained at once.

[0087] As described above, the method for manufacturing the electronic device 1, which is one example of the method for manufacturing the electronic device of the present invention, includes the steps of: [1] providing the first member 20 with a wiring group L4 and a terminal group T4 (step S11); [2] providing the first member 20 with an angular velocity sensor element 4 (step S12); [3] forming the structure 10a (step S13); and [4] singulating (step S14). In other words, the method includes the steps of providing a first member 20 with a plurality of angular velocity sensor elements 4 as "functional elements", a plurality of terminal groups T4 having a plurality of terminals T41 to T45, and a plurality of wiring groups L4 having a plurality of wirings L41 to L45 connecting the plurality of angular velocity sensor elements 4 and the plurality of terminals T41 to T45; joining a second member 30 onto the first member 20 via a bonding material 70 to form a structure 10a that is surrounded by the bonding material 70 in a plan view seen from the direction in which the first member 20 and the angular velocity sensor elements 4 overlap, and has a plurality of storage sections S that store at least one angular velocity sensor element 4; and cutting the structure 10a between two adjacent storage sections S in a plan view to separate it into individual pieces. In the process of forming the structure 10a, the second member 30 is disposed so that the terminal group T4 is located outside the second member 30 in a plan view, and the bonding material 70 has a portion 71 as a first portion that overlaps with the wiring group L4 and is located between the terminal group T4 and the storage portion S in a plan view, and an intermediate portion 721 that is located between two adjacent storage portions S. In the process of singulating, the intermediate portion 721 is cut in conjunction with the cutting of the structure 10a in a plan view, thereby forming portions 73 and 74 as second portions having a width smaller than that of the portion 71 (first portion). In the present embodiment, the portion 72 as the second portion is also formed by cutting the boundary portion 722.

[0088] According to such a manufacturing method of the electronic device 1, the width W1 of the portion 71 can be formed relatively large, so that the decrease in the bonding strength between the first member 20 and the second member 30 in the region where the second member 30 overlaps with the wiring group L4 in a plan view (between the storage section S and the terminal group T4) can be reduced. Therefore, it is possible to manufacture an electronic device 1 in which the decrease in the bonding strength between the base body 2 and the lid body 3 is reduced. In addition, by cutting the middle portion 721 of the bonding material 70, it is possible to form the portions 73 and 74 having a width W2 smaller than the width W1 of the portion 71, so that it is possible to manufacture an electronic device 1 in which the bonding area between the base body 2 and the lid body 3 is smaller than that of the conventional electronic device. As a result, it is possible to manufacture an electronic device 1 that can be miniaturized while maintaining the necessary bonding strength between the base body 2 and the lid body 3. In addition, since the first member 20 and the second member 30 are cut together with the bonding material 70, chipping is less likely to occur compared to the case where the first member 20 and the second member 30 are cut without the bonding material 70 being interposed, which is preferable.

[0089] Furthermore, it is preferable that the width W1 of portion 71 and the widths W2 of portions 72, 73, and 74 satisfy the numerical ranges described above, and if it is desired to make width W2 smaller, it is preferable to use, for example, a dicing blade 80 having a relatively large width W80. This makes it possible to easily form portions 72, 73, and 74 having relatively small widths W2. In this way, it is preferable to set width W80 of dicing blade 80 according to the size of width W2 (the ratio to width W1) (see FIG. 13).

[0090] For example, the width W1 of portion 71 is set to 200 um, and the width W80 of dicing blade 80 is set to 40 um. As a result, the width W2 of each of portions 72, 73, and 74 is 80 um, and W2 / W1=0.4. In this way, the present invention can be realized by using a dicing blade having a width W80 smaller than the width W1 of portion 71.

[0091] In this embodiment, one angular velocity sensor element 4 is provided in one storage section S, but the storage section S may be provided with a plurality of functional elements.

[0092] In addition, in this embodiment, as described above, the bonding material 70 is provided so that the width W21 of the intermediate portion 721 is equal to the width W1 of the portion 71. Here, in this specification, the width W21 of the intermediate portion 721 and the width W1 of the portion 71 are "equal" to each other means that they are substantially equal to each other, that is, the difference between them satisfies a range of 10% or less. In other words, in a plan view, the width W21 of the intermediate portion 721 is 0.9 to 1.1 times the width W1 of the portion 71 as the "first portion". This makes it easy to provide the bonding material 70. Furthermore, by making the width W21 where the bonding material 70 is provided and the width W1 substantially equal to each other, when the first member 20 and the second member 30 are bonded, the inclination due to the variation of the bonding material 70 can be reduced. Furthermore, the portions 72, 73, and 74 having the width W2 smaller than the width W1 of the portion 71 can be easily and appropriately formed.

[0093] Moreover, the width W21 of the intermediate portion 721 is more preferably 0.92 to 1.08 times, and even more preferably 0.95 to 1.05 times, the width W1 of the portion 71. This makes it possible to significantly exhibit the above-mentioned effects.

[0094] As described above, in the step of forming the structure 10a, it is preferable to apply the bonding material 70 to at least one of the first member 20 and the second member 30 by screen printing. In this embodiment, the bonding material 70 is applied to the second member 30 as described above. By using screen printing, the bonding material 70 can be applied more easily and quickly in a desired shape in a plan view. In addition, the portion 71 having a width W1 of an appropriate size that can sufficiently ensure the necessary bonding strength can be easily and appropriately formed.

[0095] As described above, the bonding material 70 preferably contains low-melting glass. Examples of low-melting glass include boric acid, silicate, phosphoric acid, arsenic acid, germanate, vanadate, and telluride. The melting point of the low-melting glass is preferably 700° C. or less, and more preferably 500° C. or less. In this embodiment, the bonding material 70 containing boric acid glass (B2O3) as a main component is preferably used as the low-melting glass. The bonding material 70 containing such low-melting glass is likely to become larger than the designed bonding area in the process of applying and bonding the first member 20 or the second member 30, but according to the manufacturing method of the electronic device 1 described above, the bonding area can be easily reduced even if such a bonding material 70 is used. The bonding material 70 containing low-melting glass is preferable because it can sufficiently secure the necessary bonding strength between the first member 20 and the second member 30 even if the first member 20 and the second member 30 are made of different materials.

[0096] For example, the base 2 and the lid 3 were bonded together using a boric acid glass paste printed from a screen printing mask with uniform openings of 140 um as a bonding material. At this time, a load of about 100 kPa was applied to the lid 3 during bonding, so the width W1 of the portion 71 became 200 um. By applying a load to the bonding material 70 patterned by screen printing in this way and pressing it down, the width W1 of the portion 71 becomes larger than when it was printed, and good airtightness can be maintained. Furthermore, chipping can be suppressed when the width W2 of each of the portions 72, 73, and 74 is diced with a dicing blade.

[0097] <Second embodiment> Next, a second embodiment of the present invention will be described. Fig. 15 is a plan view showing an electronic device according to a second embodiment of the present invention. Fig. 16 is a cross-sectional view of the electronic device shown in Fig. 15. Fig. 17 is a plan view for explaining the acceleration sensor element shown in Fig. 15. Fig. 18 is a plan view for explaining a step of forming a structure in the method for manufacturing the electronic device shown in Fig. 15. Fig. 19 is a plan view for explaining a step of singulating in the method for manufacturing the electronic device shown in Fig. 15. Note that through holes 34 and sealing members 35 are omitted from illustration in Figs. 17 and 18.

[0098] In the following description, the present embodiment will be described focusing on the differences from the first embodiment described above, and the description of the similarities will be omitted. Also, in Figs. 15 to 19, the same reference numerals are used for the same configurations as those in the above-mentioned embodiment.

[0099] [Electronic Devices] An electronic device 1A shown in FIG. 15 is a composite sensor that has an angular velocity sensor element 4 and an acceleration sensor element 5 as functional elements and can detect angular velocity around the X-axis and acceleration in the X-axis direction.

[0100] As shown in Fig. 16, the electronic device 1A includes a base 2A, a cover 3A, an acceleration sensor element 5, and a bonding material 7A. Also, as shown in Fig. 15 and Fig. 17, the electronic device 1A includes a wiring group L5 including a plurality of wirings L51, L52, and L53, and a terminal group T5 including a plurality of terminals T51, T52, and T53.

[0101] (Base) The base 2A has a recess 23 and grooves 241, 242, and 243. The grooves 241 to 243 are each provided outside the recess 23. Furthermore, the grooves 241 to 243 have shapes corresponding to the wiring group L5 and the terminal group T5 in a plan view.

[0102] (Acceleration sensor element) 17, the acceleration sensor element 5 has supporting portions 51 and 52, a movable portion 53, connecting portions 54 and 55, a plurality of first fixed electrode portions 58, and a plurality of second fixed electrode portions 59. The supporting portions 51 and 52, the movable portion 53, and the connecting portions 54 and 55 are integrally formed.

[0103] The support portions 51 and 52 are fixed to the upper surface 22A of the base body 2A described above, and are disposed opposite each other in the Y-axis direction with the recess 23 interposed therebetween.

[0104] The movable part 53 is located between the support parts 51 and 52 in a plan view. The movable part 53 is connected to the support part 51 via a connecting part 54 on the -Y-axis side, and is connected to the support part 52 via a connecting part 55 on the +Y-axis side. This allows the movable part 53 to be displaced in the Y-axis direction relative to the support parts 51 and 52 while elastically deforming the connecting parts 54 and 55. The movable part 53 also has a base part 531 extending in the Y-axis direction, and a plurality of movable electrode parts 532 that protrude from the base part 531 in the X-axis direction and are arranged in the Y-axis direction. The plurality of movable electrode parts 532 are spaced apart from each other.

[0105] Further, the multiple first fixed electrode portions 58 and the multiple second fixed electrode portions 59 each extend in the X-axis direction and are provided corresponding to the movable electrode portion 532. The multiple first fixed electrode portions 58 are disposed on one side of the movable electrode portion 532 in the Y-axis direction and are provided at intervals from the corresponding movable electrode portion 532. On the other hand, the multiple second fixed electrode portions 59 are disposed on the other side of the movable electrode portion 532 in the Y-axis direction and are provided at intervals from the corresponding movable electrode portion 532.

[0106] Moreover, the movable portion 53, the connecting portions 54 and 55, one end of the first fixed electrode portion 58, and one end of the second fixed electrode portion 59 configured as described above are provided above the recess 23 of the base 2A and are spaced apart from the base 2A.

[0107] As the constituent material of the acceleration sensor element 5, the same materials as those of the angular velocity sensor element 4 described above can be used.

[0108] (Wiring and terminal groups) As shown in FIG. 17, the wiring group L5 and the terminal group T5 are provided on a base body 2A. Specifically, the wire L51 and the terminal T51 are provided in the groove 241 described above, the wire L52 and the terminal T52 are provided in the groove 242, and the wire L53 and the terminal T53 are provided in the groove 243.

[0109] Moreover, the wiring L51 is electrically connected to the support portion 51 of the acceleration sensor element 5 through the conductive bump B51. The wiring L52 is electrically connected to each of the first fixed electrode portions 58 through a plurality of conductive bumps B52. The wiring L53 is electrically connected to each of the second fixed electrode portions 59 through a plurality of conductive bumps B53. Moreover, one end of the wiring L51 is connected to the terminal T51, one end of the wiring L52 is connected to the terminal T52, and one end of the wiring L53 is connected to the terminal T53.

[0110] The wirings L51 to L53, the terminals T51 to T53, and the conductive bumps B51, B52, and B53 may each be made of the same materials as those used for the wirings L41 to L45.

[0111] Moreover, the wiring group L5 is provided outside the recess 23. Moreover, the terminal group T5 is provided on the outer periphery of the base 2A and located outside the cover 3A in a plan view. In this embodiment, as shown in Fig. 15, the terminal group T4 and the terminal group T5 are located on the -Y-axis side of the upper surface 22A of the base 2A and are arranged in a row along the X-axis direction.

[0112] (Lid) The cover 3A has a recess 31 corresponding to the recess 21 and a recess 33 corresponding to the recess 23. The recess 21 and the recess 31 form a first storage section S1, and the recess 23 and the recess 33 form a second storage section S2. Here, in this embodiment, the first storage section S1 and the second storage section S2 form a storage section S10.

[0113] The first housing section S1 and the second housing section S2 are independent of each other, with the angular velocity sensor element 4 housed in the first housing section S1 and the acceleration sensor element 5 housed in the second housing section S2. The second housing section S2 is formed with recesses 23 and 33 that are quadrangular (rectangular in this embodiment) in plan view, and thus has a quadrangular shape (rectangular in this embodiment) in plan view. The same is true for the first housing section S1. In this embodiment, the first housing section S1 and the second housing section S2 are provided so that their longitudinal directions are aligned with each other in the Y-axis direction and aligned in the X-axis direction.

[0114] Here, it is preferable that the second housing section S2 is filled with an inert gas such as nitrogen, helium, or argon, and is at approximately atmospheric pressure at the operating temperature (approximately -40°C to 80°C). By keeping the second housing section S2 at atmospheric pressure, viscous resistance increases, a damping effect is exhibited, and the vibration of the movable section 53 can be quickly converged (stopped). This improves the accuracy of detecting acceleration.

[0115] Further, the lid 3A is formed with a through hole 34 that communicates between the inside and outside of the recess 33. The through hole 34 is filled with a sealing member 35 made of various metal materials or the like.

[0116] 15, the joint surface 32A of the cover 3A has a frame shape in a plan view, is located between the first housing section S1 and the second housing section S2, and has a joint part 325 (third joint part) extending along the Y-axis direction. The width of the joint part 321 (the joint part on the terminal group T4, T5 side) and the width of the joint part 325 are configured to be larger than the widths of the joint parts 322, 323, and 324 (other joint parts). The widths of the joint parts 321 and 325 are configured to be equal.

[0117] (bonding material) 15, the bonding material 7A is provided so as to surround the storage portion S10 in a plan view, and has a frame shape in the drawing. The bonding material 7A is also provided so as to surround each of the first storage portion S1 and the second storage portion S2 in a plan view.

[0118] Specifically, the bonding material 7A has a frame shape in a plan view, is located between the first housing portion S1 and the second housing portion S2, and has a portion 75 extending along the Y-axis direction. The width W1 of portion 71 (the portion on the side of terminal groups T4, T5) and the width W3 of portion 75 are configured to be larger than the widths W2 of portions 72, 73, 74 (other portions). The width W1 of portion 71 and the width W3 of portion 75 are equal. Furthermore, portion 75 constitutes a "third portion."

[0119] In the electronic device 1A as described above, the housing section S10 has a first housing section S1 having an angular velocity sensor element 4 as at least one "functional element" and a second housing section S2 having an acceleration sensor element 5 as at least one "functional element". In addition, the bonding material 7A has a portion 75 as a "third portion" located between the first housing section S1 and the second housing section S2 in a plan view. In addition, in a plan view, the width W3 of the portion 75 is larger than each of the widths W2 of the portions 72, 73, and 74 as the "second portion". As a result, since the width W3 of the portion 75 is larger than each of the widths W2 of the portions 72, 73, and 74, the airtightness of the first housing section S1 and the second housing section S2 can be sufficiently maintained in an independent state.

[0120] For example, the width W1 of the portion 71 and the width W3 of the portion 75 are set to 200 um, and the width W80 of the dicing blade 80 is set to 40 um. As a result, the width W2 of each of the portions 72, 73, and 74 is 80 um, and the electronic device 1A is miniaturized. However, the first housing portion S1 and the second housing portion S2 remain at 200 um at the portion 75, so that the first housing portion S1 and the second housing portion S2 can maintain the atmosphere in an independent state without communicating with each other. Furthermore, the wirings L41 to L45 and the wirings L51 to L53 can be well secured in airtightness because the width W1 of the portion 71 is 200 um and is isolated from the outside. In this way, the present invention can be realized by using a dicing blade having a width W80 smaller than the width W1 of the portion 71 and the width W3 of the portion 75.

[0121] Also, for example, the base 2 and the lid 3 were bonded together using a boric acid glass paste printed from a screen printing mask with uniform openings of 140 um as a bonding material. At this time, a load of about 100 kPa was applied to the lid 3 during bonding, so the width W1 of the portion 71 and the width W3 of the portion 75 became 200 um. By applying a load to the bonding material 70 patterned by screen printing in this way and pressing it down, the widths W1 and W3 of the portion 71 are expanded from when printed, and good airtightness can be maintained. Furthermore, chipping can be suppressed when the widths W2 of the portions 72, 73, and 74 are diced with a dicing blade.

[0122] In this embodiment, one angular velocity sensor element 4 is provided in one first storage section S1, and one acceleration sensor element 5 is provided in one second storage section S2. However, each of the first storage section S1 and the second storage section S2 may be provided with multiple functional elements.

[0123] [Electronic device manufacturing method] The acceleration sensor element 5 can be formed by the same manufacturing method as the angular velocity sensor element 4, and the wiring group L5 and the terminal group T5 can be formed by the same manufacturing method as the wiring group L4 and the terminal group T4. The acceleration sensor element 5, the wiring group L5 and the terminal group T5 can be provided on the first member 20 by the same method as in the first embodiment.

[0124] [3] Step of forming structure 10aA (step S13) The second member 30A is bonded onto the first member 20A via a bonding material 70A. In this embodiment, the first member 20A and the second member 30A are bonded together such that one angular velocity sensor element 4 is positioned in one recess 31 and one acceleration sensor element 5 is positioned in one recess 33. Next, the first housing portion S1 and the second housing portion S2 are respectively filled with a desired atmosphere via the corresponding through holes 34, and the through holes 34 are sealed with a sealing member 35. This results in a structure 10aA having a plurality of housing portions S10 each having a first housing portion S1 and a second housing portion S2 (see FIG. 18).

[0125] In this process, the bonding material 70A is provided to surround the storage section S10 in a plan view. The bonding material 70A also surrounds each of the first storage section S1 and the second storage section S2 in a plan view. The bonding material 70A has a portion 75 located between the first storage section S1 and the second storage section S2 in a plan view. The width W1 of the portion 71, the width W21 of the middle portion 721, the width W22 of the boundary portion 722, and the width W3 of the portion 75 are all equal.

[0126] [4] Dividing into individual pieces (step S14) Next, the structure 10aA is divided into individual pieces by cutting between two adjacent storage sections S10 in a plan view (see FIG. 19). As a result, the intermediate section 721 is cut, and the sections 73 and 74 having a width W2 smaller than the sections 71 and 75 are formed. Here, in this embodiment, as described above, the widths W1, W21, W22, and W3 are equal to each other, so that by cutting the intermediate section 721 and the boundary section 722, the sections 72, 73, and 74 having a width W2 smaller than the widths W1 and W3 of the sections 71 and 75 can be easily formed.

[0127] In the manufacturing method of the electronic device 1A described above, in the step of forming the structure 10aA, the housing S10 has a first housing S1 housing an angular velocity sensor element 4 as at least one "functional element" and a second housing S2 housing an acceleration sensor element 5 as at least one "functional element". In addition, the bonding material 70A has a portion 75 as a "third portion" located between the first housing S1 and the second housing S2 in a plan view. In addition, in the step of singulating, the width W2 of the portions 73 and 74 as the "second portion" is formed smaller than the width W3 of the portion 75 by cutting the middle portion 721 in conjunction with cutting the structure 10aA in a plan view. This makes it possible to manufacture the electronic device 1A in which the airtightness of the first housing S1 and the second housing S2 is sufficiently maintained independently of each other.

[0128] In this embodiment, as described above, the bonding material 70A is provided so that the width W21 of the intermediate portion 721 is equal to the width W3 of the portion 75. Here, in this specification, the width W21 of the intermediate portion 721 and the width W3 of the portion 75 being "equal" means that the difference between them is within a range of 10% or less. In other words, in a plan view, the width W21 of the intermediate portion 721 is 0.9 to 1.1 times the width W3 of the portion 75 as the "third portion". This makes it possible to facilitate the work of providing the bonding material 70A, and also makes it possible to easily and appropriately form the portions 72, 73, and 74 having the width W2 smaller than the width W3 of the portion 75.

[0129] Moreover, the width W21 of the intermediate portion 721 is more preferably 0.92 to 1.08 times, and even more preferably 0.95 to 1.05 times, the width W3 of the portion 75. This makes it possible to significantly exhibit the above-mentioned effects.

[0130] 2.Electronic equipment Next, an electronic device according to the present invention will be described. 20 is a perspective view showing the configuration of a mobile (or notebook) personal computer to which the electronic device of the present invention is applied. In this figure, the personal computer 1100 is composed of a main body 1104 equipped with a keyboard 1102, and a display unit 1106 equipped with a display unit 1108, and the display unit 1106 is rotatably supported on the main body 1104 via a hinge structure. Such a personal computer 1100 has an electronic device 1 (or electronic device 1A) built in.

[0131] 21 is a perspective view showing the configuration of a mobile phone (including a smartphone, a PHS, etc.) to which the electronic device of the present invention is applied. In this figure, a mobile phone 1200 includes an antenna (not shown), a plurality of operation buttons 1202, an earpiece 1204, and a mouthpiece 1206, and a display unit 1208 is disposed between the operation buttons 1202 and the earpiece 1204. Such a mobile phone 1200 has an electronic device 1 (or electronic device 1A) built therein.

[0132] FIG. 22 is a perspective view showing the configuration of a digital still camera to which the electronic device of the present invention is applied. In this figure, a display unit 1310 is provided on the back of a case (body) 1302 in a digital still camera 1300, and is configured to perform display based on an imaging signal from a CCD, and the display unit 1310 functions as a finder that displays an object as an electronic image. In addition, a light receiving unit 1304 including an optical lens (imaging optical system) and a CCD is provided on the front side (back side in the figure) of the case 1302. Then, when a photographer checks the object image displayed on the display unit 1310 and presses a shutter button 1306, the imaging signal of the CCD at that time is transferred and stored in a memory 1308. Such a digital still camera 1300 has an electronic device 1 (or electronic device 1A) built in.

[0133] Such electronic equipment includes the electronic device 1 (or the electronic device 1A). Therefore, the electronic equipment can enjoy the functions and effects of the electronic device 1 (or the electronic device 1A) described above, has a high degree of freedom in its arrangement, and is highly reliable.

[0134] 3. Mobile Next, the moving body of the present invention will be described. 23 is a perspective view showing an automobile to which the moving body of the present invention is applied. In this figure, an automobile 1500 has an electronic device 1 built therein, and for example, the attitude of a vehicle body 1501 can be detected by the electronic device 1 (or electronic device 1A). A detection signal from the electronic device 1 (or electronic device 1A) is supplied to a vehicle body attitude control device 1502, which detects the attitude of the vehicle body 1501 based on the signal, and can control the hardness or softness of the suspension or control the brakes of each wheel 1503 according to the detection result.

[0135] Such a moving object includes the electronic device 1 (or the electronic device 1A). Therefore, the action and effect of the electronic device 1 (or the electronic device 1A) can be enjoyed, and the degree of freedom in its arrangement is high, and the reliability is high.

[0136] In addition, electronic device 1 (or electronic device 1A) can also be widely applied to electronic control units (ECUs) such as keyless entry, immobilizers, car navigation systems, car air conditioners, anti-lock braking systems (ABS), airbags, tire pressure monitoring systems (TPMS), engine controls, and battery monitors for hybrid and electric vehicles.

[0137] The electronic device manufacturing method, electronic device, electronic equipment, and mobile object of the present invention have been described above based on the illustrated embodiments, but the present invention is not limited thereto, and the configuration of each part can be replaced with any configuration having a similar function. In addition, any other configuration may be added to the present invention. In addition, each embodiment may be appropriately combined.

[0138] In the above-described embodiment, the configuration using the acceleration sensor element and the angular velocity sensor element as the functional element has been described, but the configuration of the acceleration sensor element and the angular velocity sensor element is not particularly limited. In addition, the functional element is not limited to the acceleration sensor element and the angular velocity sensor element, and may be, for example, a pressure sensor element or a vibration element used in an oscillator or the like. [Explanation of symbols]

[0139] 1...electronic device, 1A...electronic device, 2...base, 2A...base, 3...lid, 3A...lid, 4...angular velocity sensor element, 4a...substrate, 5...acceleration sensor element, 7...bonding material, 7A...bonding material, 10a...structure, 10aA...structure, 20...first member, 20A...first member, 21...recess, 22...upper surface, 22A...upper surface, 23...recess, 30...second member, 30A...second member, 31...recess, 32...bonding surface, 32A...bonding surface, 33...recess, 34...through hole, 35...sealing member, 40...structure, 40a...structure, 40b...structure, 41...vibration portion, 42...drive spring portion, 43...fixing portion, 4 4...movable driving electrode, 45...fixed driving electrode, 46...fixed driving electrode, 47...detection flap plate, 48...beam portion, 49...fixed detection electrode, 51...support portion, 52...support portion, 53...movable portion, 54...connecting portion, 55...connecting portion, 58...first fixed electrode portion, 59...second fixed electrode portion, 70...bonding material, 70A...bonding material, 71...portion, 72...portion, 73...portion, 74...portion, 75...portion, 80...dicing blade, 85...portion, 86...portion, 221...groove portion, 222...groove portion, 223...groove portion, 224...groove portion, 225...groove portion, 241...groove portion, 242...groove portion, 243...groove portion, 321...bonding portion, 322...connection portion, 323...connection portion, 324...connection portion, 325...connection portion, 531...base portion, 532...movable electrode portion, 721...middle portion, 722...boundary portion, 1100...personal computer, 1102...keyboard, 1104...main body portion, 1106...display unit, 1108...display portion, 1200...mobile phone, 1202...operation button, 1204...earpiece, 1206...mouthpiece, 1208...display portion, 1300...digital still camera, 1302...case, 1304...light receiving unit, 1306...shutter button, 1308...memory, 1310...display portion, 500... automobile, 1501... vehicle body, 1502... vehicle body attitude control device, 1503... wheel, B41... conductive bump, B42... conductive bump, B43... conductive bump, B51... conductive bump, B52... conductive bump, B53... conductive bump, J4... rotating shaft, L4... wiring group, L41... wiring, L42... wiring, L43... wiring, L44... wiring, L45... wiring, L5... wiring group, L51... wiring, L52... wiring, L53... wiring, S... housing section, S1... first housing section, S10... housing section, S2... second housing section, S11... step, S12... step, S13... step, S14... step,T4... terminal group, T41... terminal, T42... terminal, T43... terminal, T44... terminal, T45... terminal, T5... terminal group, T51... terminal, T52... terminal, T53... terminal, ωx... angular velocity, W1... width, W2... width, W3... width, W21... width, W22... width, W80... width, 850... line, 860... line, C... area,

Claims

1. When the three mutually orthogonal axes are the X-axis, the Y-axis, and the Z-axis, A base body having a rectangular shape when viewed in a plan view from the Z-axis direction along the Z-axis; A cover body having a rectangular shape in a plan view; An angular velocity sensor accommodated in a first accommodation portion disposed between the base body and the lid body. -element, Between the base body and the lid body, a an acceleration sensor element accommodated in a second accommodation portion; an upper surface of the base body and a lower surface of the lid body are joined together, and in the plan view, the first storage portion and the A bonding material surrounding the second housing portion; The upper surface of the base is provided with a side of the lid body on the negative side of the Y axis in the plan view. The region of the base body on the negative side of the Y axis is located on the outer side of the base body on the negative side of the Y axis. a terminal group including a plurality of terminals arranged side by side along a direction; the angular velocity sensor element and the acceleration sensor element provided on the upper surface of the base a wiring group including a plurality of wirings electrically connecting the terminals to the first and second terminals, respectively; Including, The bonding material is In the plan view, a first portion that is located along the X-axis direction and inside the negative side of the Y-axis of the lid and, The third side is located on the inner side of the three sides of the lid body except for the side on the negative side of the Y axis. Two parts, A Y-axis direction of the Y-axis is located between the first storage portion and the second storage portion. a third portion disposed on the first portion; Including, In the plan view, a width of the first portion is larger than a width of the second portion, Three sides of the outer edge of the cover, excluding the side on the negative side of the Y axis, are in the front in the plan view. An electronic device characterized by overlapping an outer edge of the substrate.

2. In claim 1, The side surfaces of the base and the cover corresponding to the three sides include cut surfaces by dicing. An electronic device comprising:

3. In claim 1 or 2, The electronic device, wherein the first housing portion is in a reduced pressure state.

4. In any one of claims 1 to 3, The lid body is A through hole filled with a sealing member is provided in a region overlapping with the first storage portion. An electronic device comprising:

5. In any one of claims 1 to 4, The electronic device, wherein the second container is at atmospheric pressure.

6. In any one of claims 1 to 5, The electronic device, wherein the second container is filled with an inert gas.

7. In any one of claims 1 to 6, The lid body is a first recess overlapping the first housing portion; a second recess overlapping the second housing portion; 1. An electronic device comprising:

8. In any one of claims 1 to 7, 13. An electronic device, comprising: a bonding material including a low-melting-point glass;

9. In any one of claims 1 to 7, The electronic device, wherein the bonding material includes an alloy.

10. In any one of claims 1 to 9, In the plan view, the width of the third portion is larger than the width of the second portion. Electronic devices.

11. In any one of claims 1 to 10, In the plan view, the width of the first portion is equal to the width of the third portion. device.

12. An electronic device comprising the electronic device according to any one of claims 1 to 11. vessel.

13. An electronic device according to any one of claims 1 to 11; an attitude control device that controls the attitude based on a detection signal output from the electronic device; 、 A moving object comprising:

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